TR assembly, signal transmitting and receiving device, phased-array antenna and communication equipment

Abstract

The invention provides a TR assembly, a signal transmitting and receiving device, a phased-array antenna and communication equipment, and the TR assembly comprises a device main body which is internally provided with a power element; the heat conduction part is arranged on the device main body, the heat conduction part protrudes relative to the surface of the device main body, and at least part of the heat conduction part is attached to the power element, so that heat of the power element is conducted into the heat conduction part and dissipated through the heat conduction part. The problem of low heat dissipation efficiency of the TR assembly in the prior art is solved.

Description

Technical Field

[0001] The present invention relates to the field of antenna unit heat dissipation technology, and in particular to a TR component, a signal transceiver, a phased array antenna unit, and communication equipment. Background Art

[0002] Currently, active phased array radars are playing an increasingly important role in the development of phased array technology. Regardless of the frequency band, active phased array radars are primarily composed of transmitter and receiver (TR) components. TR components are the core units of active phased array radars, and their performance is crucial to achieving and ensuring the overall performance of the radar. An active phased array radar can contain hundreds or even thousands of TR components. The heat dissipation of TR components directly affects their performance and lifespan.

[0003] Currently, the antenna array adopts a shingled configuration, which brings certain difficulties to the heat dissipation problem of TR components. The patch antenna (and radome) on one side of the printed circuit board cannot conduct heat dissipation and can only perform very inefficient radiation heat dissipation. The power devices are all surface-mounted on the other side of the printed circuit board. Even if a conductive cooling plate (water cooling or air cooling) is provided, it is inconvenient to directly contact the cold plate due to device packaging issues, making it difficult to conduct heat from the printed circuit board to the cooling plate in a targeted manner. The double-sided surface-mount TR device is sandwiched in the middle of the PCB, and the PCB has high thermal resistance, which cannot meet the device's rapid heat dissipation requirements. Summary of the Invention

[0004] The main purpose of the present invention is to provide a TR component, a signal transceiver, a phased array antenna and a communication device to solve the problem of low heat dissipation efficiency of the TR component in the prior art.

[0005] To achieve the above-mentioned object, according to one aspect of the present invention, there is provided a TR assembly, comprising: a device body, in which a power element is disposed; a heat conducting portion, disposed on the device body, the heat conducting portion protruding relative to a surface of the device body, at least a portion of the heat conducting portion being in contact with the power element, so that heat of the power element is conducted into the heat conducting portion and dissipated through the heat conducting portion.

[0006] Furthermore, a mounting groove is provided on the device body, and the heat-conducting part includes: a heat-conducting body, which is provided on the device body and opposite to the mounting groove, the heat-conducting body protrudes relative to the surface of the device body, and an installation cavity for installing a power element is provided between the heat-conducting body and the mounting groove; the power element is fitted with the heat-conducting body.

[0007] Furthermore, the heat-conducting body is made of metal; and / or the cross-section of the heat-conducting body is polygonal, elliptical or circular.

[0008] Furthermore, the TR assembly further includes: a connecting contact, which is provided on the surface of the device body, the connecting contact protruding relative to the surface of the device body, and the protruding height of the connecting contact is smaller than the protruding height of the heat conducting portion.

[0009] Furthermore, there are a plurality of connecting contacts, which are arranged at intervals on the surface of the device body.

[0010] Furthermore, the device body includes a first surface and a second surface that are opposite to each other, and a plurality of connection contacts are respectively provided on the first surface and the second surface.

[0011] According to a second aspect of the present application, a signal transceiver device is provided, comprising: a TR component, the TR component comprising a device body, a heat conducting portion being provided on the device body, the heat conducting portion protruding relative to the surface of the device body, and a power element in the device body being in contact with the heat conducting portion; a first circuit board connected to the device body, the first circuit board being provided with a avoidance portion; a heat dissipation structure being provided on a side of the first circuit board away from the TR component, the heat conducting portion passing through the avoidance portion and connected to the heat dissipation structure, and heat in the power element being conducted to the heat dissipation structure through the heat conducting portion for dissipation.

[0012] Furthermore, the avoidance portion includes: a avoidance opening, which is provided on the first circuit board, and the heat conducting portion passes through the avoidance opening and is connected to the heat dissipation structure.

[0013] Furthermore, the heat dissipation structure includes: a conduction component; a heat dissipation plate, wherein the conduction component is arranged on the heat dissipation plate, and the heat conduction part is attached to the conduction component after passing through the avoidance part, so that the heat in the heat conduction part is conducted to the heat dissipation plate through the conduction component; wherein, a plurality of heat dissipation fins are arranged on the heat dissipation plate, and the plurality of heat dissipation fins are arranged at intervals along the extension direction of the heat dissipation plate.

[0014] Furthermore, a connecting contact is provided on the device body, which protrudes relative to the surface of the device body, and the protruding height of the connecting contact is smaller than the protruding height of the heat conducting part; a connecting point is provided on the first circuit board, and the connecting contact is connected to the connecting point.

[0015] Furthermore, there are multiple connecting contacts and multiple connecting points, and the multiple connecting contacts are arranged in a one-to-one correspondence with the multiple connecting points.

[0016] Furthermore, the device body includes a first surface and a second surface arranged opposite to each other, and the signal transceiver device also includes: a second circuit board, the first circuit board is arranged opposite to the first surface, the second circuit board is arranged opposite to the second surface, there is a first gap between the first surface and the first circuit board, and there is a second gap between the second surface and the second circuit board.

[0017] Furthermore, a plurality of first connection contacts are provided on the first surface, and each first connection contact protrudes relative to the first surface; a plurality of first connection points are provided on the first circuit board, and each first connection contact is connected to each first connection point in a one-to-one correspondence.

[0018] Furthermore, a plurality of second connection contacts are provided on the second surface, and each second connection contact protrudes relative to the second surface; a plurality of second connection points are provided on the second circuit board, and each second connection contact is connected to each second connection point in a one-to-one correspondence.

[0019] Furthermore, the signal transceiver device also includes: a support column, which is arranged between the first circuit board and the second circuit board, with both ends of the support column respectively between the first circuit board and the second circuit board; there are multiple support columns, and the multiple support columns are arranged at intervals along the circumference of the first circuit board to support the first circuit board and the second circuit board.

[0020] According to a third aspect of the present application, a phased array antenna is provided, comprising an antenna unit body and a signal transceiver. The signal transceiver is arranged in the antenna unit body, and the signal transceiver is the above-mentioned signal transceiver.

[0021] According to a fourth aspect of the present application, a communication device is provided, comprising a device body and a signal transceiver device, wherein the signal transceiver device is arranged in the device body, and the signal transceiver device is the above-mentioned signal transceiver device.

[0022] Applying the technical solution of the present invention, the TR assembly includes a device body and a heat-conducting portion, wherein a power element is arranged in the device body; the heat-conducting portion is arranged on the device body, the heat-conducting portion protrudes relative to the surface of the device body, and at least a portion of the heat-conducting portion is in contact with the power element, so that the heat of the power element is transferred to the heat-conducting portion and dissipated through the heat-conducting portion. By providing a close contact between the heat-conducting portion and the power element, the heat conduction efficiency can be significantly improved, so that the heat generated by the power element can be quickly transferred to the heat-conducting portion and then dissipated through the heat-conducting portion. Compared with traditional heat dissipation methods, this design can more directly and effectively extract heat from the heat source, avoid the increase of thermal resistance, and improve the overall heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which constitute part of this application, are intended to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings:

[0024] Figure 1 shows a schematic structural diagram of an embodiment of a TR assembly according to the present invention;

[0025] Figure 2A schematic diagram showing a second surface of a device body in a TR assembly according to the present invention;

[0026] Figure 3 It shows a schematic structural diagram of the installation cavity in the TR assembly according to the present invention;

[0027] Figure 4 shows a cross-sectional view of a device body in a TR assembly according to the present invention;

[0028] Figure 5 A structural diagram of a signal transceiver according to the present invention is shown;

[0029] Figure 6 It shows a structural split diagram of the first circuit board, the second circuit board and the TR component in the signal transceiver device according to the present invention;

[0030] Figure 7 A schematic structural diagram of a first circuit board in a signal transceiver device according to the present invention is shown;

[0031] Figure 8 An assembly diagram of a TR component, a first circuit board, and a second circuit board in a signal transceiver device according to the present invention is shown;

[0032] Figure 9 shows the temperature of the thermal simulation device in the signal transceiver according to the present invention;

[0033] Figure 10 FIG. 2 shows the device temperature of thermal simulation in the prior art.

[0034] The above drawings include the following reference numerals:

[0035] 100, TR assembly; 110, device body; 111, power element; 120, heat conduction portion; 112, mounting slot; 121, heat conduction body; 130, connection contact; 131, first connection contact; 132, second connection contact; 113, mounting cavity; 114, first surface; 115, second surface;

[0036] 200, signal transceiver; 210, first circuit board; 211, avoidance portion; 220, heat dissipation structure; 212, avoidance opening; 221, conduction component; 222, heat dissipation plate; 223, heat dissipation fin; 213, connection point; 230, second circuit board; 214, first connection point; 240, support column. DETAILED DESCRIPTION

[0037] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0038] Please refer to Figures 1 to 4 The present application provides a TR component, including: a device body 110, in which a power element 111 is disposed; a heat conducting portion 120, which is disposed on the device body 110 and protrudes relative to the surface of the device body 110. At least a portion of the heat conducting portion 120 is in contact with the power element 111, so that the heat of the power element 111 is conducted into the heat conducting portion 120 and dissipated through the heat conducting portion 120.

[0039] According to the TR assembly provided in the present application, it includes a device body 110 and a heat-conducting portion 120, wherein a power element 111 is arranged in the device body 110; the heat-conducting portion 120 is arranged on the device body 110, and the heat-conducting portion 120 protrudes relative to the surface of the device body 110, and at least a portion of the heat-conducting portion 120 is in contact with the power element 111, so that the heat of the power element 111 is conducted into the heat-conducting portion 120 and dissipated through the heat-conducting portion 120. By arranging the heat-conducting portion 120 to be in close contact with the power element 111, the heat conduction efficiency can be significantly improved, so that the heat generated by the power element 111 can be quickly transferred to the heat-conducting portion 120, and then dissipated through the heat-conducting portion 120. Compared with traditional heat dissipation methods, this design can more directly and effectively extract heat from the heat source, avoid the increase of thermal resistance, and improve the overall heat dissipation performance.

[0040] The protruding heat conducting portion 120 not only facilitates heat exchange but also optimizes the internal structure of the TR assembly. This structural design optimizes the layout of the device body 110 and power elements 111, enabling further miniaturization and lightweighting of the device. By optimizing the layout on the other side of the device body 110, signal transmission lines can be prevented from intersecting with heat dissipation paths, reducing signal interference and transmission loss. In phased array antenna systems, this design helps improve signal purity and transmission efficiency.

[0041] Specifically, if Figure 4 As shown, the device body 110 is provided with a mounting groove 112. The heat conducting portion 120 includes a heat conducting body 121, which is provided on the device body 110 and opposite the mounting groove 112. The heat conducting body 121 protrudes from the surface of the device body 110. A mounting cavity 113 for mounting a power component 111 is provided between the heat conducting body 121 and the mounting groove 112. The power component 111 is fitted with the heat conducting body 121. The mounting cavity design between the heat conducting body and the mounting groove allows the heat sink corresponding to the back of the power component to directly contact the heat conducting body, eliminating the need for an additional intermediate layer, further improving heat dissipation efficiency.

[0042] The design of the mounting slot not only provides physical installation space for power components, but also protects the components from external impact and pressure during assembly or use.

[0043] In the embodiments provided herein, the heat-conducting body 121 is made of metal; and / or the cross-section of the heat-conducting body 121 is polygonal, elliptical, or circular. Metal materials, such as copper, aluminum, or alloys, have high thermal conductivity and can quickly transfer heat generated by electronic devices to the heat sink, effectively improving heat dissipation efficiency. The different cross-sectional shapes allow the heat-conducting body 121 to better adapt to different heat sinks and assembly requirements, increasing design flexibility and facilitating optimized manufacturing processes.

[0044] To facilitate electrical connection between the device body 110 and the circuit board, the TR assembly further includes: a connecting contact 130, which is disposed on the surface of the device body 110. The connecting contact 130 protrudes relative to the surface of the device body 110, and the protruding height of the connecting contact 130 is less than the protruding height of the heat conducting portion 120. Preferably, the connecting contact 130 is made of metal. The protruding design of the connecting contact 130 helps to form a stable electrical connection with an external circuit board or connector, ensuring high-quality signal transmission, reducing signal attenuation and distortion, and improving the performance of the entire TR assembly and even the phased array antenna system. When the TR assembly is mated with the circuit board, the protruding connecting contact 130 can ensure a certain distance between the device body 110 and the circuit board, thereby providing a larger heat dissipation space for the heat conducting portion 120.

[0045] Preferably, multiple connecting contacts 130 are provided, spaced apart on the surface of the device body 110. This design significantly improves the reliability of the connection between the device and the circuit board. Even if some contacts degrade due to manufacturing defects, wear, or contamination, the remaining contacts can still maintain normal device operation, reducing the risk of single-point failure.

[0046] In the specific implementation process, Figure 3 and Figure 4 As shown, the device body 110 includes a first surface 114 and a second surface 115 disposed opposite each other, each of which is provided with a plurality of connection contacts 130. In conventional single-sided soldered TR device designs, all electronic components are concentrated on one side of the circuit board, which limits the layout and design of signal transmission lines. The double-sided soldering design allows signal transmission lines, control circuits, and power components to be distributed on both sides of the circuit board, thereby achieving more efficient data transmission paths and a more optimized circuit layout.

[0047] Double-sided soldering allows the control circuit to be placed on one side of the circuit board, while the power components (such as power amplifiers and low-noise amplifiers) are placed on the other side. This can avoid interference between the control and power signals, improving control accuracy and signal transmission efficiency. In addition, this facilitates the centralized layout of power components, which can be directly encapsulated by the heat-conducting body 121, optimizing heat dissipation efficiency.

[0048] like Figures 5 to 8 As shown, the present application also provides a signal transceiver device, including: a TR component 100, the TR component 100 includes a device body 110, a heat conducting portion 120 is provided on the device body 110, the heat conducting portion 120 protrudes relative to the surface of the device body 110, and the power element 111 in the device body 110 is in contact with the heat conducting portion 120; a first circuit board 210, connected to the device body 110, and a avoidance portion 211 is provided on the first circuit board 210; a heat dissipation structure 220, arranged on a side of the first circuit board 210 away from the TR component 100, the heat conducting portion 120 passes through the avoidance portion 211 and is connected to the heat dissipation structure 220, and the heat in the power element 111 is conducted to the heat dissipation structure 220 through the heat conducting portion 120 for dissipation.

[0049] According to the signal transceiver device provided in this application, by providing a heat conducting portion 120 on the device body 110 of the TR assembly 100, the power element 111 within the device body 110 is directly attached to the heat conducting portion 120 and directly connected to the heat dissipation structure 220 via the avoidance portion 211 on the first circuit board 210. This design achieves a straight heat dissipation path from the power element 111 to the heat conducting portion 120 and then to the heat dissipation structure 220, reducing the thermal resistance during heat conduction and thereby improving heat dissipation efficiency. The heat generated by the power element 111 during high-power operation can be dissipated more quickly, avoiding performance degradation or device damage caused by overheating.

[0050] Specifically, if Figure 7 As shown, the relief portion 211 includes a relief opening 212 provided on the first circuit board 210. The heat conducting portion 120 passes through the relief opening 212 and connects to the heat dissipation structure 220. The presence of the relief opening 212 allows the heat conducting portion 120 to directly penetrate the first circuit board 210, achieving a seamless connection with the heat dissipation structure 220. This direct contact reduces thermal resistance during heat transfer, accelerates heat transfer from the device body to the heat dissipation structure, and significantly improves heat dissipation efficiency.

[0051] The design of the avoidance opening 212 allows the use of thinner circuit board materials because it does not require the addition of additional heat conduction layers or intermediate structures between the device body and the heat dissipation structure. This not only reduces the overall weight but also makes the TR component design more compact, which is conducive to the miniaturization and high integration of the device.

[0052] The design of the avoidance opening simplifies the assembly process of the TR component. The device body 110 can be directly placed at a specific position of the circuit board, and the heat conduction part 120 is connected to the heat dissipation structure through the avoidance opening without the need for a complex positioning device.

[0053] like Figure 5 As shown, the heat dissipation structure 220 includes a conductive component 221 and a heat dissipation plate 222. The conductive component 221 is mounted on the heat dissipation plate 222. The heat conductive portion 120 passes through the avoidance portion 211 and abuts against the conductive component 221, allowing heat within the heat conductive portion 120 to be transferred to the heat dissipation plate 222 via the conductive component 221. The heat dissipation plate 222 is provided with a plurality of heat dissipation fins 223 spaced along the extension direction of the heat dissipation plate 222. The conductive component 221 directly abuts against the heat conductive portion 120 of the TR assembly, rapidly absorbing and conducting heat generated by the component, reducing thermal resistance and improving heat conduction efficiency. This design allows heat to form a direct and efficient conduction path between the component and the heat dissipation system, reducing heat accumulation within the TR assembly.

[0054] The multiple fins 223 provided on the heat sink plate 222 increase the heat dissipation surface area, thereby improving heat dissipation efficiency. The design of the fins 223 can accelerate the heat exchange process, especially in cooling systems with forced air flow. The spacing and layout of the fins can optimize air flow and further improve heat dissipation.

[0055] Since the heat conducting portion 120 of the TR assembly is in direct contact with the conductive component 221 of the heat dissipation structure 220, heat can be more evenly distributed over the entire surface of the heat dissipation plate 222, avoiding local overheating, reducing the formation of hot spots, and improving the thermal stability and reliability of the entire system.

[0056] Furthermore, the device body 110 is provided with a connection contact 130, which protrudes from the surface of the device body 110. The protrusion height of the connection contact 130 is less than the protrusion height of the heat conducting portion 120. The first circuit board 210 is provided with a connection point 213, and the connection contact 130 is connected to the connection point 213. The protruding design of the connection contact 130 ensures a stable contact with the connection point 213 on the first circuit board 210.

[0057] Since the protruding height of the connecting contact 130 is smaller than that of the heat conducting portion 120 , the heat conducting portion 120 can contact the heat dissipation structure more directly and closely, avoiding obstruction of the connecting contact in the heat dissipation path, thereby optimizing the heat dissipation efficiency, reducing the temperature of the device body 110 during high-power operation, and extending the service life of the device.

[0058] In this embodiment, there are a plurality of connecting contacts 130 and a plurality of connecting points 213 , and the plurality of connecting contacts 130 and the plurality of connecting points 213 are disposed in a one-to-one correspondence.

[0059] The design of multiple connection contacts and connection points can significantly improve the connection reliability of the device. Even if the performance of some contacts degrades due to wear, contamination or failure, there are still other contacts to maintain normal electrical connection, reducing the possibility of single point failure and improving the stability and reliability of the entire system.

[0060] The multiple connection contacts are in direct contact with the multiple connection points of the heat dissipation structure, which can form multiple effective heat conduction paths, thereby improving the heat conduction efficiency and ensuring that the device can quickly dissipate heat when operating at high power, avoiding performance degradation or damage caused by overheating.

[0061] In a specific implementation, the device body 110 includes a first surface 114 and a second surface 115 disposed opposite each other. The signal transceiver device further includes a second circuit board 230. The first circuit board 210 is disposed opposite the first surface 114, and the second circuit board 230 is disposed opposite the second surface 115. A first gap is defined between the first surface 114 and the first circuit board 210, and a second gap is defined between the second surface 115 and the second circuit board 230. The provision of the first and second gaps provides additional space, allowing heat from the device body 110 to be dissipated through the first and second gaps. In particular, for the heat-conducting body 121 located relatively within the first gap, a larger heat dissipation range is provided for the heat-conducting body 121.

[0062] Furthermore, a plurality of first connection contacts 131 are provided on the first surface 114 , and each first connection contact 131 protrudes relative to the first surface 114 ; a plurality of first connection points 214 are provided on the first circuit board 210 , and each first connection contact 131 is connected to each first connection point 214 in a one-to-one correspondence.

[0063] The protruding first connection contacts 131 make close contact with the connection points on the first circuit board 210, forming a stable electrical connection. This reduces the possibility of poor contact or looseness, ensuring long-term operational stability and reliable data transmission. The direct contact between the first connection contacts 131 and the first connection points 214 not only ensures an electrical connection but also provides an additional heat dissipation path. Heat is transferred from the device body to the circuit board through the contacts and then dissipated through the circuit board's heat dissipation path, increasing the heat dissipation area and efficiency.

[0064] A plurality of second connection contacts 132 are provided on the second surface 115, each of which protrudes relative to the second surface 115. A plurality of second connection points are provided on the second circuit board 230, each of which is connected to a corresponding second connection point. Direct contact between each first connection contact 131 and a first connection point 214 on the first circuit board ensures the robustness of the circuit connection and the stability of the electrical performance. This design reduces contact resistance during the connection, improves signal transmission efficiency, and reduces signal delay and attenuation. The protruding design of each first connection contact 131 not only strengthens the electrical connection but also, to a certain extent, acts as a tiny heat conduction channel, assisting in heat dissipation from the device body. While the primary heat dissipation path may pass through the heat conducting portion 120, the additional heat conduction path provided by the first connection contacts 131 can further improve the thermal management efficiency of the entire system.

[0065] In the present application, the signal transceiver device further includes: a support column 240, which is disposed between the first circuit board 210 and the second circuit board 230, with both ends of the support column 240 respectively between the first circuit board 210 and the second circuit board 230; there are multiple support columns 240, and the multiple support columns 240 are spaced apart along the circumference of the first circuit board 210 to support the first circuit board 210 and the second circuit board 230. The support columns 240 can evenly distribute the pressure between the first circuit board 210 and the second circuit board 230, preventing excessive local pressure from causing bending or breaking of the circuit boards, especially under mechanical stress during assembly and operation of the device. This design can ensure a stable gap between the circuit boards and avoid poor electrical contact. When a double-layer PCB is soldered to a device, it prevents stress on the pads and the device.

[0066] The present application also provides a phased array antenna, including an antenna unit body and a signal transceiver 200. The signal transceiver 200 is arranged in the antenna unit body, and the signal transceiver 200 is the signal transceiver 200 of the above embodiment.

[0067] The double-sided surface-mount TR device structure and optimized heat dissipation solution of the signal transceiver 200 significantly improve the thermal management efficiency and signal transmission quality of the TR component. This directly translates into improved performance of the phased array antenna, including more stable signal transmission and reception, and higher power handling capability.

[0068] By providing support columns between the first circuit board 210 and the second circuit board 230, structural stability and device safety are ensured, reducing performance degradation or failures caused by mechanical stress or vibration, thereby improving the reliability of the entire phased array antenna system.

[0069] The present application also provides a communication device, including a device body and a signal transceiver 200. The signal transceiver 200 is arranged in the device body, and the signal transceiver 200 is the signal transceiver 200 of the above embodiment.

[0070] like Figure 9 and Figure 10 As shown, through the structural design of the present application, the double-sided label can reduce the middle routing layer and reduce the thickness of the circuit board. At the same time, an avoidance opening is opened on the circuit board, which effectively reduces the overall weight of the signal transceiver 200, ensures data transmission, and concentrates heat to connect to the heat sink for rapid heat dissipation. The data can be referred to the simulation comparison diagram. At the same time, the support parts ensure the structural stability and safety of the internal components.

[0071] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0072] According to the TR assembly provided in the present application, it includes a device body 110 and a heat-conducting portion 120, wherein a power element 111 is arranged in the device body 110; the heat-conducting portion 120 is arranged on the device body 110, and the heat-conducting portion 120 protrudes relative to the surface of the device body 110, and at least a portion of the heat-conducting portion 120 is in contact with the power element 111, so that the heat of the power element 111 is conducted into the heat-conducting portion 120 and dissipated through the heat-conducting portion 120. By arranging the heat-conducting portion 120 to be in close contact with the power element 111, the heat conduction efficiency can be significantly improved, so that the heat generated by the power element 111 can be quickly transferred to the heat-conducting portion 120, and then dissipated through the heat-conducting portion 120. Compared with traditional heat dissipation methods, this design can more directly and effectively extract heat from the heat source, avoid the increase of thermal resistance, and improve the overall heat dissipation performance.

[0073] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0074] Unless otherwise specified, the relative arrangement of the parts and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to actual proportional relationships. Technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar numbers and letters represent similar items in the following drawings, and therefore, once an item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0075] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0076] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, tasks, devices, components and / or combinations thereof.

[0077] It should be noted that the terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0078] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A TR component, characterized in that: include: A device body (110), wherein a power element (111) is disposed in the device body (110); A heat conducting portion (120) is provided on the device body (110), the heat conducting portion (120) protruding relative to the surface of the device body (110), and at least a portion of the heat conducting portion (120) is in contact with the power element (111), so that heat from the power element (111) is conducted into the heat conducting portion (120) and dissipated through the heat conducting portion (120).

2. The TR assembly according to claim 1, characterized in that The device body (110) is provided with a mounting slot (112), and the heat conducting portion (120) comprises: a heat-conducting body (121) disposed on the device body (110) and opposite to the mounting groove (112); the heat-conducting body (121) protrudes relative to the surface of the device body (110); and a mounting cavity (113) for mounting the power element (111) is provided between the heat-conducting body (121) and the mounting groove (112); The power element (111) is fitted to the heat-conducting body (121).

3. The TR assembly according to claim 2, characterized in that The heat-conducting body (121) is made of metal; and / or, The cross section of the heat-conducting body (121) is polygonal, elliptical or circular.

4. The TR assembly according to claim 1, characterized in that The TR component also includes: A connecting contact (130) is provided on the surface of the device body (110), the connecting contact (130) protrudes relative to the surface of the device body (110), and the protruding height of the connecting contact (130) is smaller than the protruding height of the heat conducting portion (120).

5. The TR assembly according to claim 4, characterized in that There are a plurality of connecting contacts (130), and the plurality of connecting contacts (130) are arranged at intervals on the surface of the device body (110).

6. The TR assembly according to claim 4, characterized in that The device body (110) comprises a first surface (114) and a second surface (115) that are arranged opposite to each other, and a plurality of connecting contacts (130) are respectively arranged on the first surface (114) and the second surface (115).

7. A signal transceiver device, characterized in that: include: A TR assembly (100), comprising a device body (110), a heat conducting portion (120) provided on the device body (110), the heat conducting portion (120) protruding relative to a surface of the device body (110), and a power element (111) in the device body (110) being in contact with the heat conducting portion (120); a first circuit board (210) connected to the device body (110), wherein the first circuit board (210) is provided with a relief portion (211); A heat dissipation structure (220) is provided on a side of the first circuit board (210) away from the TR assembly (100); the heat conduction portion (120) passes through the avoidance portion (211) and is connected to the heat dissipation structure (220); heat in the power element (111) is conducted to the heat dissipation structure (220) through the heat conduction portion (120) for heat dissipation.

8. The signal transceiver according to claim 7, characterized in that: The avoidance portion (211) includes: The avoidance opening (212) is provided on the first circuit board (210); the heat conducting portion (120) passes through the avoidance opening (212) and is connected to the heat dissipation structure (220).

9. The signal transceiver according to claim 7, characterized in that: The heat dissipation structure (220) comprises: Conductive component (221); a heat dissipation plate (222), the conductive component (221) being arranged on the heat dissipation plate (222), the heat conduction portion (120) passing through the avoidance portion (211) and then being attached to the conductive component (221), so that the heat in the heat conduction portion (120) is conducted to the heat dissipation plate (222) through the conductive component (221); Wherein, a plurality of heat dissipation fins (223) are provided on the heat dissipation plate (222), and the plurality of heat dissipation fins (223) are arranged at intervals along the extension direction of the heat dissipation plate (222).

10. The signal transceiver device according to claim 7, characterized in that: A connecting contact (130) is provided on the device body (110), the connecting contact (130) protrudes relative to the surface of the device body (110), and the protruding height of the connecting contact (130) is smaller than the protruding height of the heat conducting portion (120); A connection point (213) is provided on the first circuit board (210), and the connection contact (130) is connected to the connection point (213).

11. The signal transceiver device according to claim 10, characterized in that: There are a plurality of connection contacts (130), a plurality of connection points (213), and the plurality of connection contacts (130) and the plurality of connection points (213) are arranged in a one-to-one correspondence.

12. The signal transceiver device according to claim 7, characterized in that: The device body (110) comprises a first surface (114) and a second surface (115) arranged opposite to each other, and the signal transceiver device further comprises: A second circuit board (230), wherein the first circuit board (210) is arranged opposite to the first surface (114), the second circuit board (230) is arranged opposite to the second surface (115), a first interval is provided between the first surface (114) and the first circuit board (210), and a second interval is provided between the second surface (115) and the second circuit board (230).

13. The signal transceiver device according to claim 12, characterized in that: A plurality of first connecting contacts (131) are provided on the first surface (114), and each of the first connecting contacts (131) protrudes relative to the first surface (114); A plurality of first connection points (214) are provided on the first circuit board (210), and each of the first connection contacts (131) is connected to each of the first connection points (214) in a one-to-one correspondence.

14. The signal transceiver device according to claim 13, wherein: A plurality of second connecting contacts (132) are provided on the second surface (115), and each second connecting contact (132) protrudes relative to the second surface (115); A plurality of second connection points are provided on the second circuit board (230), and each of the second connection contacts (132) is connected to each of the second connection points in a one-to-one correspondence.

15. The signal transceiver device according to claim 12, wherein: The signal transceiver device further includes: A support column (240) is provided between the first circuit board (210) and the second circuit board (230), with two ends of the support column (240) respectively located between the first circuit board (210) and the second circuit board (230); There are a plurality of support columns (240), and the plurality of support columns (240) are arranged at intervals along the circumference of the first circuit board (210) to support the first circuit board (210) and the second circuit board (230).

16. A phased array antenna, comprising an antenna unit body and a signal transceiver (200), wherein the signal transceiver (200) is arranged in the antenna unit body, and the signal transceiver (200) is the signal transceiver (200) according to any one of claims 7 to 15.

17. A communication device, comprising a device body and a signal transceiver (200), wherein the signal transceiver (200) is arranged in the device body, and the signal transceiver (200) is the signal transceiver (200) according to any one of claims 7 to 15.

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