Optical machine and augmented reality device

Abstract

The invention discloses an optical machine and augmented reality equipment, and relates to the technical field of intelligent head-mounted equipment, the optical machine comprises an optical machine main body, a display panel and a heat dissipation module, and the display panel is connected with the optical machine main body; the heat dissipation module comprises a circulation pipeline, a circulation pump and a semiconductor chilling plate, the semiconductor chilling plate comprises a cold surface and a hot surface which are oppositely arranged, the circulation pipeline comprises a heat absorption section, a heat dissipation section and a communication section communicating the heat absorption section with the heat dissipation section, the heat absorption section is connected with the display panel, and the heat dissipation section is connected with the cold surface; the circulating pump is arranged on the circulating pipeline so that fluid in the circulating pipeline can flow through the heat absorption section and the heat dissipation section in sequence in a circulating and reciprocating mode. After the fluid in the heat absorption section exchanges heat with the display panel, the temperature rises, the circulating pump drives the fluid to flow to the heat dissipation section, and the fluid in the heat dissipation section exchanges heat with the cold surface, so that the temperature of the fluid in the heat dissipation section is reduced, and the heat dissipation efficiency and the heat dissipation effect of the display panel are effectively improved by repeating the steps.

Description

Technical Field

[0001] The present invention relates to the technical field of intelligent head-mounted devices, and in particular to an optical machine and an extended reality device. Background Art

[0002] With the emergence of the metaverse concept, AR (Augmented Reality), VR (Virtual Reality), and MR (Mixed Reality), as key interface devices within the metaverse, have experienced rapid development in recent years. Consequently, miniaturization and functional diversification of projector engines have become key performance parameters. However, this trend also translates to tighter heat dissipation and higher heat generation. With the continuous advancement of XR (Extended Reality) technology, high-power panel (display panel) products are becoming increasingly common. Currently, panels have low luminous efficiency, with the majority of their energy converted into heat. As panel power density and packaging density increase, this will lead to a series of issues, including decreased luminous efficiency and shortened service life. Therefore, effective heat dissipation solutions are essential when using high-power panel products. Furthermore, the main engine absorbs this heat, causing expansion and deformation, which can shift the optical lenses within the main engine, affecting the optical path. When the optical lenses deviate significantly, the projected image will become blurry and unclear, resulting in thermal defocus, and poor display quality. Summary of the Invention

[0003] The main purpose of the present invention is to provide an optical machine and an extended reality device, aiming to improve the heat dissipation efficiency of the display panel.

[0004] To achieve the above-mentioned object, the optical machine proposed in the present invention includes:

[0005] Optical machine body;

[0006] A display panel connected to the optical machine body;

[0007] A heat dissipation module, comprising a circulation pipeline, a circulation pump and a semiconductor refrigeration plate, wherein the semiconductor refrigeration plate comprises a cold surface and a hot surface arranged opposite to each other, the circulation pipeline comprises a heat absorption section, a heat dissipation section and a connecting section connecting the heat absorption section and the heat dissipation section, the heat absorption section is connected to the display panel, and the heat dissipation section is connected to the cold surface; the circulation pump is arranged in the circulation pipeline so that the fluid in the circulation pipeline can circulate back and forth through the heat absorption section and the heat dissipation section in sequence.

[0008] In one embodiment, there are multiple display panels, and the multiple display panels include a first panel and a second panel. The first panel and the second panel are respectively arranged on both sides of the optical machine body along the first direction, and the first panel and the second panel are both connected to the heat absorption section.

[0009] In one embodiment, the heat absorption section includes a first heat pipe section and a second heat pipe section, the heat dissipation section includes a first cold pipe section and a second cold pipe section, the connecting section includes a first connecting section and a second connecting section, the first heat pipe section is connected to the first cold pipe section through the first connecting section to form a first circulation channel, the second heat pipe section is connected to the second cold pipe section through the second connecting section to form a second circulation channel, the first heat pipe section is connected to the first panel, the second heat pipe section is connected to the second panel, the first cold pipe section and the second cold pipe section are both connected to the semiconductor refrigeration plate, the circulation pump includes a first pump and a second pump, the first pump is arranged in the first circulation channel to drive the fluid in the first circulation channel to circulate back and forth through the first heat pipe section and the first cold pipe section in sequence, the second pump is arranged in the second circulation channel to drive the fluid in the second circulation channel to circulate back and forth through the second heat pipe section and the second cold pipe section in sequence.

[0010] In one embodiment, the first heat pipe section is provided with a first inlet and a first outlet, and the first inlet and the first outlet are respectively connected to the liquid inlet and the liquid outlet of the first pump;

[0011] And / or, the second heat pipe section is provided with a second inlet and a second outlet, and the second inlet and the second outlet are respectively communicated with the liquid inlet and the liquid outlet of the second pump.

[0012] In one embodiment, the multiple display panels further include a third panel, the optical machine further includes a thermal insulation layer, one side of the third panel is connected to the optical machine body, the other side of the third panel is connected to the thermal insulation layer, and the side of the thermal insulation layer facing away from the third panel is connected to the side of the heat dissipation section facing away from the semiconductor refrigeration plate.

[0013] In one embodiment, the optical machine further includes a heat transfer layer, and a heat transfer area and a heat insulation area are provided on the side of the third panel facing away from the optical machine body, the heat insulation layer is provided in the heat insulation area, the heat transfer layer is provided in the heat transfer area, and the side of the heat transfer layer facing away from the heat transfer area is connected to the cold surface.

[0014] In one embodiment, the heat dissipation module further includes a flexible heat conductive member, the circulation pipeline is arranged in the flexible heat conductive member, the display panel and the cold surface are both connected to the flexible heat conductive member, the heat absorption section is located at the connection between the flexible heat conductive member and the display panel, and the heat dissipation section is located at the connection between the flexible heat conductive member and the cold surface.

[0015] In one embodiment, the heat dissipation module further includes a first heat-conducting layer, one side of the first heat-conducting layer is connected to the display panel, and the other side of the first heat-conducting layer is connected to the flexible heat-conducting member;

[0016] And / or, the heat dissipation module further includes a second heat-conducting layer, one side of the second heat-conducting layer is connected to the cold surface, and the other side of the second heat-conducting layer is connected to the flexible heat-conducting member.

[0017] In one embodiment, at least part of the pipeline of the heat absorption section is arranged in a zigzag manner;

[0018] And / or, at least part of the pipeline of the heat dissipation section is arranged in a tortuous manner.

[0019] In one embodiment, the heat dissipation module further includes a heat dissipation member, which includes a main body and heat dissipation fins connected to the main body, the main body is connected to the hot surface, and there are multiple heat dissipation fins, which are arranged at intervals.

[0020] In one embodiment, the main body is a heat dissipation shell, which is arranged on the periphery of the optical machine body. The heat dissipation shell is provided with an opening for the outgoing light of the optical machine body to pass through, and the inner wall and / or outer wall of the heat dissipation shell is provided with a plurality of the heat dissipation fins.

[0021] In one embodiment, each of the heat dissipation fins is disposed on an inner wall of the heat dissipation housing, and each of the heat dissipation fins is spaced apart from the circulation pipeline to form a gap, and a heat dissipation hole is provided on the top of the heat dissipation housing, and the heat dissipation hole is connected to the gap;

[0022] And / or, the heat dissipation module further includes a third heat-conducting layer, one side of the third heat-conducting layer is connected to the hot surface, and the other side of the third heat-conducting layer is connected to the inner wall of the heat dissipation shell;

[0023] And / or, the heat sink is made of metal material.

[0024] In one embodiment, the fluid flowing in the circulation pipeline is water, and the circulation pump is a water pump;

[0025] Alternatively, the fluid flowing in the circulation pipeline is liquid metal, and the circulation pump is an electromagnetic pump.

[0026] The present invention further provides an extended reality device, which includes a housing and the above-mentioned optical machine, wherein the optical machine body is connected to the housing.

[0027] The technical solution of the present invention uses a circulating pump to drive the fluid in the circulation pipeline to flow through the heat absorption section. The fluid in the heat absorption section exchanges heat with the display panel. The temperature of the fluid in the heat absorption section rises after absorbing the heat generated by the display panel. The circulating pump then drives this part of the fluid to flow to the heat dissipation section. The fluid in the heat dissipation section exchanges heat with the cold surface. The cold surface transfers the cold energy to the fluid in the heat dissipation section, thereby reducing the temperature of the fluid in the heat dissipation section. The fluid after the temperature drops is driven by the circulating pump to flow to the heat absorption section and exchange heat with the display panel. This cycle is repeated, effectively improving the heat dissipation efficiency and heat dissipation effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0029] Figure 1 A schematic structural diagram of an optical engine according to an embodiment of the present invention;

[0030] Figure 2 A schematic diagram of the exploded structure of an optical engine according to an embodiment of the present invention;

[0031] Figure 3 A schematic structural diagram of an embodiment of the optical-mechanical structure provided by the present invention;

[0032] Figure 4 A schematic structural diagram of another embodiment of the optical-mechanical structure provided by the present invention;

[0033] Figure 5 A schematic structural diagram of another embodiment of the optical-mechanical structure provided by the present invention;

[0034] Figure 6 A schematic structural diagram of another embodiment of the optical-mechanical structure provided by the present invention;

[0035] Figure 7 A schematic structural diagram of an embodiment of a first circulation channel provided by the present invention;

[0036] Figure 8 A schematic structural diagram of an embodiment of a second circulation channel provided by the present invention;

[0037] Figure 9A schematic structural diagram of an embodiment of the present invention wherein the circulation pipelines share a circulation pump;

[0038] Figure 10 A schematic cross-sectional view of an optical engine according to an embodiment of the present invention;

[0039] Figure 11 This is a schematic diagram of the exploded structure of another embodiment of the optical engine provided by the present invention.

[0040] Description of Figure Numbers:

[0041] 100. Optical engine; 1. Optical engine body; 2. Display panel; 21. First panel; 22. Second panel; 23. Third panel; 231. Insulation area; 232. Heat transfer area; 3. Heat dissipation module; 31. Circulation pipeline; 311. Heat absorption section; 3111. First heat pipe section; 31111. First inlet; 31112. First outlet; 3112. Second heat pipe section; 31121. Second inlet; 31122. Second outlet; 312. Heat dissipation section; 3121. First cooling pipe section; 3122. Second cooling pipe section; 313. Connecting section; 3131. First connecting section; 3132, second connecting section; 314, first circulation channel; 315, second circulation channel; 32, circulation pump; 321, first pump; 322, second pump; 33, semiconductor refrigeration plate; 331, hot surface; 332, cold surface; 34, first heat-conducting layer; 35, second heat-conducting layer; 36, flexible heat-conducting member; 361, first flexible heat-conducting portion; 362, second flexible heat-conducting portion; 37, heat sink; 371, main body; 371A, heat sink shell; 3711, opening; 3712, gap; 3713, heat dissipation hole; 372, heat sink fin; 4, thermal insulation layer; 5, heat transfer layer.

[0042] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0043] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0044] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0045] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0046] With the emergence of the metaverse concept, AR, VR, and MR, as key interface devices within the metaverse, have experienced rapid development in recent years. Consequently, miniaturization and functional diversification of projector engines have become key performance parameters. However, this trend also requires tighter heat dissipation arrangements and higher heat generation. With the continuous advancement of XR technology, high-power panel-based optical engines are becoming increasingly common. Currently, panels have low luminous efficiency, with the majority of their energy converted into heat. As panel power density and packaging density increase, this will lead to a series of issues, including decreased luminous efficiency and shortened service life. Therefore, effective heat dissipation solutions are essential when using high-power panel products. Furthermore, the optical engine body absorbs this heat, causing it to expand and deform, shifting the optical lenses within the engine body and affecting the optical path. When the optical lenses deviate significantly, the projected image will become blurry and unclear, resulting in thermal defocus and poor display quality.

[0047] The inventors have discovered that existing display panels generate a high amount of heat. Relying on traditional methods for heat dissipation, that is, directly exchanging heat generated by the display panel with the air, is obviously no longer able to meet the heat dissipation requirements of the display panel. The heat generated by the display panel is difficult to dissipate in time, which will cause the light efficiency of the display panel to decrease and the lifespan to be shortened. It will also cause the temperature of the optical machine body connected to the display panel to rise, affecting the normal use of the optical machine body.

[0048] The present invention provides an optical engine, aiming to improve the heat dissipation efficiency of a display panel.

[0049] See also Figure 1 、 Figure 2 and Figure 11In one embodiment of the present invention, the optical machine 100 includes an optical machine body 1, a display panel 2 and a heat dissipation module 3, wherein the display panel 2 is connected to the optical machine body 1; the heat dissipation module 3 includes a circulation pipeline 31, a circulation pump 32 and a semiconductor refrigeration plate 33, wherein the semiconductor refrigeration plate 33 includes a cold surface 332 and a hot surface 331 arranged opposite to each other; the circulation pipeline 31 includes a heat absorption section 311, a heat dissipation section 312 and a connecting section 313 connecting the heat absorption section 311 and the heat dissipation section 312; the heat absorption section 311 is connected to the display panel 2, and the heat dissipation section 312 is connected to the cold surface 332; the circulation pump 32 is arranged in the circulation pipeline 31 so that the fluid in the circulation pipeline 31 can circulate back and forth through the heat absorption section 311 and the heat dissipation section 312 in sequence.

[0050] The technical solution of the present invention is to use a circulation pump 32 to drive the fluid in the circulation pipeline 31 to flow through the heat absorption section 311. The fluid in the heat absorption section 311 exchanges heat with the display panel 2. After the fluid in the heat absorption section 311 absorbs the heat generated by the display panel 2, its temperature rises. After the heat exchange with the fluid in the heat absorption section 311, the temperature of the display panel 2 drops. The circulation pump 32 then drives this part of the fluid to flow to the heat dissipation section 312. The fluid in the heat dissipation section 312 exchanges heat with the cold surface 332. The cold surface 332 transfers the cold energy to the fluid in the heat dissipation section 312, thereby reducing the heat dissipation section 31. 2, the temperature of the fluid in the heat sink 311 is lowered, and the fluid, driven by the circulation pump 32, flows to the heat absorption section 311 and exchanges heat with the display panel 2 to lower the temperature of the display panel 2. This cycle is repeated, effectively improving the heat dissipation efficiency and heat dissipation effect of the display panel 2. The heat dissipation module 3 effectively reduces the temperature of the display panel 2, extending the service life of the display panel 2. At the same time, since the temperature of the display panel 2 is reduced, the occurrence of thermal defocus caused by the increase in the temperature of the optical machine body 1 due to the excessive temperature of the display panel 2 is avoided, thereby improving the display quality of the picture. The entire heat dissipation module 3 is small in size, low in energy consumption and has high reliability. Among them, the circulation pump 32 can be implemented by using an existing pump.

[0051] It should be noted that the semiconductor refrigeration chip 33 utilizes semiconductor refrigeration technology, a novel cooling method using direct current (DC). The operating principle of the semiconductor refrigeration chip 33 is as follows: when an N-type semiconductor material and a P-type semiconductor material are connected to form a galvanic pair, and a DC current is passed through this circuit, energy transfer occurs. The junction where the current flows from the N-type element to the P-type element absorbs heat, becoming the cold end. The junction where the current flows from the P-type element to the N-type element releases heat, becoming the hot end. The amount of heat absorbed and released is determined by the current and the number of pairs of N and P semiconductor elements. The interior of the semiconductor refrigeration chip 33 is composed of hundreds of pairs of galvanic couples forming a thermopile to achieve an enhanced cooling effect. The semiconductor refrigeration chip 33 has very low thermal inertia, resulting in rapid cooling and heating times. With good heat dissipation at the hot end and no load on the cold end, the refrigeration chip can reach its maximum temperature difference within less than one minute of power application. In this embodiment, a semiconductor refrigeration sheet 33 is provided to allow the cold surface 332 to exchange heat with the fluid in the heat dissipation section 312. The cold surface 332 transfers the cold energy to the fluid in the heat dissipation section 312 through heat exchange, thereby reducing the temperature of the fluid in the heat dissipation section 312 to be lower than the temperature of the display panel 2. When this part of the fluid flows to the heat absorption section 311 under the action of the circulation pump 32, since the fluid temperature is lower than the temperature of the display panel 2, the heat generated by the display panel 2 will naturally be transferred to the fluid in the heat absorption section 311, causing the temperature of the fluid in the heat absorption section 311 to increase and the temperature of the display panel 2 to decrease, thereby achieving In order to reduce the temperature of the display panel 2, the fluid with increased temperature will flow to the heat dissipation section 312 under the drive of the circulation pump 32, and exchange heat with the cold surface 332, thereby reducing the temperature of the fluid in the heat dissipation section 312 to a temperature lower than that of the display panel 2; this cycle is repeated, and heat is absorbed and transferred through the circulation of the fluid, thereby keeping the display panel 2 within the normal operating temperature range; among them, the circulation pump 32 is the core component of the entire heat dissipation module 3, which is responsible for driving the movement of the fluid in the circulation pipeline 31; the circulation pump 32 has the characteristics of small size and low power consumption, and is suitable for integration into relatively compact equipment.

[0052] See also Figure 2 and Figure 9 In one embodiment, there are multiple display panels 2, each comprising a first panel 21 and a second panel 22. The first panel 21 and the second panel 22 are disposed on either side of the optical machine body 1 along a first direction, and both the first panel 21 and the second panel 22 are connected to the heat absorption section 311. If there are two display panels 2, the two display panels 2 are the first panel 21 and the second panel 22, respectively. The two panels can share a single circulation pump 32 and a single set of circulation pipelines 31. In other words, the single circulation pump 32 and the single set of circulation pipelines 31 can cool both display panels 2.

[0053] The specific implementation form can be: the heat absorption section 311 is divided into two parts, hereinafter referred to as the first heat absorption section and the second heat absorption section, the heat dissipation section 312 is also divided into two parts, hereinafter referred to as the first heat dissipation section and the second heat dissipation section, the connecting section 313 is divided into four parts, hereinafter referred to as the first connecting section, the second connecting section, the third connecting section and the fourth connecting section; the circulation pipeline 31 includes the first heat absorption section, the first connecting section, the first heat dissipation section, the second connecting section, the second heat absorption section, the third connecting section, the second heat dissipation section, the fourth connecting section connected in sequence, and the end of the fourth connecting section away from the second heat dissipation section is connected to the end of the first heat absorption section away from the first connecting section; after the fluid in the first heat absorption section exchanges heat with the first panel 21, the fluid temperature rises and the temperature of the first panel 21 drops; the circulation pump 32 drives this part of the fluid to flow through the first connecting section to the first heat dissipation section, the first heat dissipation section exchanges heat with the cold surface 332, and the fluid temperature drops to below the display panel 2, and the fluid is then driven by the circulation pump 32 through the second The connecting section flows to the second heat absorbing section, and the fluid exchanges heat with the second panel 22, the fluid temperature rises again, and the temperature of the second panel 22 drops; the fluid is driven by the circulation pump 32 to flow to the second heat dissipation section through the third connecting section, and the fluid exchanges heat with the cold surface 332, and the fluid temperature drops again to a temperature lower than the temperature of the display panel 2. The fluid after the temperature drops is driven by the circulation pump 32 to flow to the first heat absorbing section through the fourth connecting section, and exchanges heat with the first panel 21 to reduce the temperature of the first panel 21. This cycle is repeated, and heat dissipation of the two display panels 2 is achieved with one circulation pump 32 and one set of circulation pipelines 31. The temperature of the first panel 21 does not have a significant impact on the temperature of the second panel 22. Similarly, the temperature of the second panel 22 does not have a significant impact on the temperature of the first panel 21. The temperature difference between the two display panels 2 is small, which avoids the phenomenon that the temperature of a single display panel 2 is too high and affects its service life. It should be noted that if the circulation pipeline 31 is set up to first exchange heat with the first panel 21, then exchange heat with the second panel 22, and then exchange heat with the cold surface 332, and then cycle back and forth, the temperature of the first panel 21 will seriously affect the temperature of the second panel 22, that is, after the fluid has exchanged heat with the first panel 21, the fluid temperature has risen. When the fluid flows to the second panel 22 again, the heat exchanged between the fluid and the second panel 22 is seriously reduced compared to the heat exchanged with the first panel 21, resulting in the heat of the second panel 22 being higher than the heat of the first panel 21, shortening the life of the second panel 22, and the optical machine body 1 in contact with it may also fail to obtain sufficient heat dissipation due to thermal defocusing.

[0054] See also Figure 2 、 Figure 7 and Figure 8In one embodiment, the heat absorbing section 311 includes a first heat pipe section 3111 and a second heat pipe section 3112. The heat dissipating section 312 includes a first cold pipe section 3121 and a second cold pipe section 3122. The connecting section 313 includes a first connecting section 3131 and a second connecting section 3132. The first heat pipe section 3111 is connected to the first cold pipe section 3121 via the first connecting section 3131 to form a first circulation channel 314. The second heat pipe section 3112 is connected to the second cold pipe section 3122 via the second connecting section 3132 to form a second circulation channel 315. The first heat pipe section 3111 is connected to the first panel 21. The second hot pipe section 3112 is connected to the second panel 22, the first cold pipe section 3121 and the second cold pipe section 3122 are both connected to the semiconductor refrigeration plate 33, and the circulation pump 32 includes a first pump 321 and a second pump 322. The first pump 321 is arranged in the first circulation channel 314 to drive the fluid in the first circulation channel 314 to circulate back and forth through the first hot pipe section 3111 and the first cold pipe section 3121 in sequence. The second pump 322 is arranged in the second circulation channel 315 to drive the fluid in the second circulation channel 315 to circulate back and forth through the second hot pipe section 3112 and the second cold pipe section 3122 in sequence. In this embodiment, the first panel 21 is independently cooled by the first pump 321 and the first circulation channel 314, and the second panel 22 is circulated and cooled by the second pump 322 and the second circulation channel 315, so that the temperatures of the first panel 21 and the second panel 22 do not have a significant impact on each other's heat dissipation, thereby achieving independent heat dissipation and independent adjustment of the first panel 21 and the second panel 22. The power of the first pump 321 and the second pump 322 can be adaptively adjusted according to the temperature conditions of the first panel 21 and the second panel 22 to meet the heat dissipation requirements of the first panel 21 and the second panel 22. The heat dissipation of the first panel 21 is described using the first pump 321 and the first circulation channel 314 as an example. The fluid in the first heat pipe section 3111 exchanges heat with the first panel 21. The temperature of the fluid in the first heat pipe section 3111 increases, and the temperature of the first panel 21 decreases. The first pump 321 drives the fluid in the first heat pipe section 3111 to flow through the first connecting section 3131 to the first cold pipe section 3121. The fluid in the first cold pipe section 3121 exchanges heat with the cold surface 332, and the temperature of the fluid in the first cold pipe section 3121 decreases. The first pump 321 then drives the fluid in the first cold pipe section 3121 to flow through the first connecting section 3131 to the first heat pipe section 3111. The fluid in the first heat pipe section 3111 then exchanges heat with the first panel 21. This reciprocating process achieves independent heat dissipation of the first panel 21. The second pump 322 drives the fluid to flow in the second circulation channel 315 to independently dissipate heat for the second panel 22 in a similar manner, and will not be further described here.

[0055] See also Figure 7In one embodiment, the first heat pipe section 3111 is provided with a first inlet 31111 and a first outlet 31112, and the first inlet 31111 and the first outlet 31112 are respectively connected to the liquid inlet and the liquid outlet of the first pump 321; wherein the fluid flows from the first inlet 31111 into the liquid inlet of the first pump 321, and the first pump 321 drives the fluid to flow out from the liquid outlet of the first pump 321 to the first outlet 31112, thereby realizing that the first pump 321 drives the fluid to flow in the first circulation channel 314.

[0056] See also Figure 8 In one embodiment, the second heat pipe section 3112 is provided with a second inlet 31121 and a second outlet 31122, which are respectively connected to the liquid inlet and liquid outlet of the second pump 322. Fluid flows from the second inlet 31121 into the liquid inlet of the second pump 322, and the second pump 322 drives the fluid to flow from the liquid outlet of the second pump 322 to the second outlet 31122, thereby enabling the second pump 322 to drive the fluid to flow within the second circulation channel 315.

[0057] See also Figures 4 to 6 In one embodiment, the multiple display panels 2 further include a third panel 23, and the optical engine 100 further includes a thermal insulation layer 4. One side of the third panel 23 is connected to the optical engine body 1, and the other side of the third panel 23 is connected to the thermal insulation layer 4. The side of the thermal insulation layer 4 facing away from the third panel 23 is connected to the side of the heat dissipation section 312 facing away from the semiconductor cooling plate 33. By arranging the thermal insulation layer 4 so that one side is attached to the third panel 23 and the other side is attached to the side of the heat dissipation section 312 facing away from the cold surface 332, the thermal insulation layer 4 blocks the heat generated by the third panel 23 to a certain extent, preventing it from directly affecting the heat dissipation section 312. This reduces the impact of the heat generated by the third panel 23 on the heat dissipation of the first and second panels 21, 22, and ensures the heat dissipation efficiency of the first and second panels 21, 22. It should be noted that the thermal insulation layer 4 can be made of a material such as silica aerogel.

[0058] See also Figures 3 to 5In one embodiment, the optical engine 100 further includes a heat transfer layer 5. A heat transfer region 232 and a heat insulation region 231 are provided on the side of the third panel 23 facing away from the optical engine body 1. The heat insulation layer 4 is provided in the heat insulation region 231, and the heat transfer layer 5 is provided in the heat transfer region 232. The side of the heat transfer layer 5 facing away from the heat transfer region 232 is connected to the cold surface 332. By providing the heat transfer layer 5, one side of the heat transfer layer 5 is attached to the third panel 23, and the other side of the heat transfer layer 5 is attached to the heat dissipation region, so that heat from the third panel 23 can be quickly exchanged with the cold surface 332 through the heat transfer layer 5, thereby reducing the temperature of the third panel 23 and preventing the third panel 23 from overheating and affecting its service life. It should be noted that the heat transfer region 232 and the heat insulation region 231 are provided independently of each other, and the heat insulation region 231 and the heat transfer region 232 are arranged in sequence along the vertical direction.

[0059] See also Figures 7 to 9 In one embodiment, the heat dissipation module 3 further includes a flexible thermally conductive member 36. The circulation pipeline 31 is disposed within the flexible thermally conductive member 36. The display panel 2 and the cold surface 332 are both connected to the flexible thermally conductive member 36. The heat absorbing section 311 is located at the connection between the flexible thermally conductive member 36 and the display panel 2, and the heat dissipating section 312 is located at the connection between the flexible thermally conductive member 36 and the cold surface 332. The formation of the circulation pipeline 31 within the flexible thermally conductive member 36 facilitates the production and processing of the circulation pipeline 31. Furthermore, the flexible thermally conductive member 36 allows for better contact with the display panel 2 and the cold surface 332, thereby effectively increasing the contact area with the display panel 2 and the cold surface 332 and improving heat dissipation efficiency. It should be noted that the flexible heat-conducting part 36 includes a first flexible heat-conducting part 361 and a second flexible heat-conducting part 362, the first circulation channel 314 is arranged in the first flexible heat-conducting part 361, and the second circulation channel 315 is arranged in the second flexible heat-conducting part 362, one end of the first flexible heat-conducting part 361 is connected to the first panel 21, and the other end of the first flexible heat-conducting part 361 is connected to the cold surface 332, one end of the second flexible heat-conducting part 362 is connected to the second panel 22, and the other end of the second flexible heat-conducting part 362 is connected to the cold surface 332.

[0060] See also Figure 2In one embodiment, the heat dissipation module 3 further includes a first heat-conducting layer 34, one side of the first heat-conducting layer 34 is connected to the display panel 2, and the other side of the first heat-conducting layer 34 is connected to the flexible heat-conducting member 36; by providing the first heat-conducting layer 34, the display panel 2 can be connected to the flexible heat-conducting member 36 through the first heat-conducting layer 34 more quickly for heat exchange; and thus more quickly for heat exchange with the fluid in the heat-absorbing section 311; the reason is that: when the display panel 2 is directly connected to the flexible heat-conducting member 36, due to the microstructure, when the two solid surfaces are in contact, the actual contact area is much smaller than the macroscopic surface area, and the contact surface area is There are many tiny gaps, which are filled with substances with high thermal resistance such as air, which affects the heat transfer efficiency. In this embodiment, a first thermal conductive layer 34 is added. Since one side of the first thermal conductive layer 34 is attached to the display panel 2, and the other side of the first thermal conductive layer 34 is attached to the flexible thermal conductive member 36, the added first thermal conductive layer 34 fills the gap between the display panel 2 and the flexible thermal conductive member 36. Moreover, since the first thermal conductive layer 34 has a high thermal conductivity coefficient, the display panel 2 can exchange heat with the fluid in the heat absorption section 311 located inside the flexible thermal conductive member 36 more quickly through the first thermal conductive layer 34.

[0061] See also Figure 2 In one embodiment, the heat dissipation module 3 further includes a second heat-conducting layer 35 , one side of which is connected to the cold surface 332 , and the other side of which is connected to the flexible heat-conducting member 36 . The provision of the second heat-conducting layer 35 allows the fluid in the heat dissipation section 312 within the flexible heat-conducting member 36 to exchange heat with the cold surface 332 more quickly, thereby improving the heat dissipation efficiency of the heat dissipation module 3 .

[0062] See also Figures 7 to 9 In one embodiment, at least part of the pipeline of the heat absorption section 311 is arranged in a zigzag manner. In this embodiment, by zigzagging at least part of the pipeline of the heat absorption section 311, the pipeline length of the heat absorption section 311 is increased, thereby increasing the amount of fluid that exchanges heat with the display panel 2 at the same time, thereby improving the heat dissipation efficiency of the heat dissipation module 3.

[0063] See also Figures 7 to 9 In one embodiment, at least a portion of the piping in the heat dissipation section 312 is arranged in a zigzag pattern. This embodiment increases the piping length of the heat dissipation section 312, thereby increasing the amount of fluid that can simultaneously exchange heat with the cold surface 332 and improving the heat dissipation efficiency of the heat dissipation module 3.

[0064] See also Figure 1 and Figure 10In one embodiment, the heat dissipation module 3 further includes a heat sink 37. The heat sink 37 includes a main body 371 and heat dissipation fins 372 connected to the main body 371. The main body 371 is connected to the hot surface 331. The heat sink 37 includes multiple heat dissipation fins 372, which are spaced apart. The contact between the heat sink 37 and the hot surface 331 assists in heat dissipation from the hot surface 331 of the semiconductor cooling fin 33, thereby ensuring that the semiconductor cooling fin 33 can function properly and that the cold surface 332 generates sufficient cooling energy. The provision of the heat dissipation fins 372 increases the contact area between the heat sink 37 and the air, thereby improving the heat dissipation effect of the heat sink 37.

[0065] See also Figure 10 In one embodiment, the main body 371 is a heat dissipation shell 371A, which is covered on the periphery of the optical machine body 1. The heat dissipation shell 371A is provided with an opening 3711 for the outgoing light of the optical machine body 1 to pass through, and the inner wall and / or outer wall of the heat dissipation shell 371A are provided with multiple heat dissipation fins 372. The main body 371 is configured as a heat sink 371A to better utilize the space within the optical engine body 1. Due to the trend toward miniaturization of existing headband display devices, the space available for installing the optical engine body 1 is limited. Once the optical engine body 1 is placed, the remaining space is relatively small. To improve the utilization of this remaining space, this embodiment configures the main body 371 as a heat sink 371A, which is positioned around the periphery of the optical engine body 1, to more closely fit the optical engine body 1. This reduces the space occupied by the heat sink 371A, and disposes the heat sink 372 within the heat sink 371A. This further utilizes the space between the heat sink 371A and the flexible heat conductor 36, further improving space utilization and effectively enhancing the heat dissipation performance of the heat sink 37. It should be noted that, if space permits, heat sink fins 372 may be provided both inside and outside the heat sink 371A to effectively enhance the heat dissipation performance of the heat sink 37, or may be provided only on the exterior of the heat sink 371A.

[0066] In one embodiment, each heat sink 372 is arranged on the inner wall of the heat sink 371A, and each heat sink 372 is spaced apart from the circulation pipeline 31 to form a gap 3712. A heat dissipation hole 3713 is provided on the top of the heat sink 371A, and the heat dissipation hole 3713 is connected to the gap 3712; the flexible thermal conductive member 36 will exchange heat with the air in the heat sink 371A, thereby causing the air temperature inside the heat sink 371A to be higher. Part of this air can reduce the temperature by heat exchange with the heat sink 371A and the heat dissipation fins 372, and part of the air can leave the gap 3712 through the heat dissipation holes 3713 located at the top of the heat sink 371A, avoiding heat accumulation inside the heat sink 371A, which is not conducive to the heat dissipation of the display panel 2; the outside air can enter the gap 3712 through the opening 3711 and then exchange heat with the flexible thermal conductive member 36, and so on. The airflow circulation path is used to assist the heat sink 37 in dissipating heat, thereby effectively improving the heat dissipation efficiency of the heat dissipation module 3.

[0067] In one embodiment, the heat dissipation module 3 further includes a third heat-conducting layer (not shown), one side of the third heat-conducting layer is connected to the hot surface 331, and the other side of the third heat-conducting layer is connected to the inner wall of the heat dissipation shell 371A; by providing the third heat-conducting layer, the heat dissipation shell 371A can exchange heat with the hot surface 331 more quickly, thereby improving the heat dissipation efficiency of the hot surface 331 and providing a guarantee for the normal operation of the semiconductor refrigeration plate 33.

[0068] In one embodiment, the heat sink 37 is made of metal. Metal has a high thermal conductivity, allowing the heat generated by the hot surface 331 to be dissipated more quickly through the heat sink 37. The heat sink 37 can be made of a highly thermally conductive metal such as Cu1100 or Al6063, without specific limitation.

[0069] See also Figure 1 and Figure 2In one embodiment, the fluid flowing in the circulation pipeline 31 is water, and the circulation pump 32 is a water pump; or, the fluid flowing in the circulation pipeline 31 is liquid metal, and the circulation pump 32 is an electromagnetic pump. If the fluid flowing in the circulation pipe is water, the circulation pump 32 that drives the fluid flow is a water pump. The fluid can be non-conductive pure water, which is easy to obtain and has low cost. The fluid in the circulation pipe can also be liquid metal. The pump that drives the liquid metal flow is an electromagnetic pump. The principle of the electromagnetic pump driving the liquid metal flow is that when current passes through the liquid metal and the liquid metal is located in a magnetic field, the liquid metal will begin to flow in the circulation pipe 31 under the action of the Ampere force, and circulate back and forth through the heat absorption section 311 and the heat dissipation section 312 in turn. Compared with water, liquid metal has a higher thermal conductivity. Taking gallium-based alloy as an example, the melting point of gallium-based alloy is 8°C, the solidification temperature is -4°C, and the thermal conductivity is 30w / (m·K). The thermal conductivity of gallium-based alloy is about 40 times that of water. Therefore, liquid metal can absorb and release heat faster, effectively improving the heat dissipation efficiency of the heat dissipation module 3. Among them, electromagnetic pumps have the characteristics of compact structure, high output pressure, no leakage, small size, and relatively low price. In addition, electromagnetic pumps do not contain any moving parts, are highly reliable, silent, and have a stable driving pressure head.

[0070] The present invention also provides an extended reality device, comprising a housing and the aforementioned optical engine 100, with the optical engine body 1 connected to the housing. The specific structure of the optical engine 100 is similar to that of the aforementioned embodiments. Since the extended reality device utilizes all the technical solutions of all the aforementioned embodiments, it at least has all the beneficial effects brought about by the technical solutions of the aforementioned embodiments, and thus will not be described in detail here. The extended reality device can be a VR device, an AR device, a MR device, or an XR device, without limitation.

[0071] The above description is merely an exemplary embodiment of the present invention and does not limit the scope of protection of the present invention. Any equivalent structural transformation made by using the contents of the present invention description and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields, is included in the scope of protection of the present invention.

Claims

1. An optical machine, characterized in that: include: Optical machine body; A display panel connected to the optical machine body; A heat dissipation module, comprising a circulation pipeline, a circulation pump and a semiconductor refrigeration plate, wherein the semiconductor refrigeration plate comprises a cold surface and a hot surface arranged opposite to each other, the circulation pipeline comprises a heat absorption section, a heat dissipation section and a connecting section connecting the heat absorption section and the heat dissipation section, the heat absorption section is connected to the display panel, and the heat dissipation section is connected to the cold surface; the circulation pump is arranged in the circulation pipeline so that the fluid in the circulation pipeline can circulate back and forth through the heat absorption section and the heat dissipation section in sequence.

2. The optical machine according to claim 1, wherein: There are multiple display panels, and the multiple display panels include a first panel and a second panel. The first panel and the second panel are respectively arranged on both sides of the optical machine body along the first direction, and the first panel and the second panel are both connected to the heat absorption section.

3. The optical machine according to claim 2, wherein: The heat absorption section includes a first heat pipe section and a second heat pipe section, the heat dissipation section includes a first cold pipe section and a second cold pipe section, the connecting section includes a first connecting section and a second connecting section, the first heat pipe section is connected to the first cold pipe section through the first connecting section to form a first circulation channel, the second heat pipe section is connected to the second cold pipe section through the second connecting section to form a second circulation channel, the first heat pipe section is connected to the first panel, the second heat pipe section is connected to the second panel, the first cold pipe section and the second cold pipe section are both connected to the semiconductor refrigeration plate, the circulating pump includes a first pump and a second pump, the first pump is arranged in the first circulation channel to drive the fluid in the first circulation channel to circulate back and forth through the first heat pipe section and the first cold pipe section in sequence, the second pump is arranged in the second circulation channel to drive the fluid in the second circulation channel to circulate back and forth through the second heat pipe section and the second cold pipe section in sequence.

4. The optical machine according to claim 3, wherein: The first heat pipe section is provided with a first inlet and a first outlet, and the first inlet and the first outlet are respectively connected to the liquid inlet and the liquid outlet of the first pump; And / or, the second heat pipe section is provided with a second inlet and a second outlet, and the second inlet and the second outlet are respectively communicated with the liquid inlet and the liquid outlet of the second pump.

5. The optical machine according to claim 2, wherein: The multiple display panels also include a third panel, and the optical machine also includes an insulation layer. One side of the third panel is connected to the optical machine body, and the other side of the third panel is connected to the insulation layer. The side of the insulation layer facing away from the third panel is connected to the side of the heat dissipation section facing away from the semiconductor refrigeration plate.

6. The optical machine according to claim 5, wherein: The optical machine also includes a heat transfer layer. A heat transfer area and a heat insulation area are provided on the side of the third panel facing away from the optical machine body. The heat insulation layer is provided in the heat insulation area, and the heat transfer layer is provided in the heat transfer area. The side of the heat transfer layer facing away from the heat transfer area is connected to the cold surface.

7. The optical machine according to any one of claims 1 to 6, wherein: The heat dissipation module also includes a flexible heat conductive member, the circulation pipeline is arranged in the flexible heat conductive member, the display panel and the cold surface are both connected to the flexible heat conductive member, the heat absorption section is located at the connection between the flexible heat conductive member and the display panel, and the heat dissipation section is located at the connection between the flexible heat conductive member and the cold surface.

8. The optical machine according to claim 7, wherein: The heat dissipation module further includes a first heat-conducting layer, one side of the first heat-conducting layer is connected to the display panel, and the other side of the first heat-conducting layer is connected to the flexible heat-conducting member; And / or, the heat dissipation module further includes a second heat-conducting layer, one side of the second heat-conducting layer is connected to the cold surface, and the other side of the second heat-conducting layer is connected to the flexible heat-conducting member.

9. The optical machine according to any one of claims 1 to 6, wherein: At least part of the pipeline of the heat absorption section is arranged in a zigzag manner; And / or, at least part of the pipeline of the heat dissipation section is arranged in a tortuous manner.

10. The optical machine according to any one of claims 1 to 6, wherein: The heat dissipation module further includes a heat dissipation member, which includes a main body and heat dissipation fins connected to the main body. The main body is connected to the thermal surface. There are multiple heat dissipation fins, which are arranged at intervals.

11. The optical machine according to claim 10, wherein: The main body is a heat dissipation shell, which is arranged on the periphery of the optical machine body. The heat dissipation shell is provided with an opening for the outgoing light of the optical machine body to pass through. The inner wall and / or outer wall of the heat dissipation shell is provided with multiple heat dissipation fins.

12. The optical machine according to claim 11, wherein: Each of the heat dissipation fins is arranged on the inner wall of the heat dissipation shell, and each of the heat dissipation fins is spaced apart from the circulation pipeline to form a gap. A heat dissipation hole is provided on the top of the heat dissipation shell, and the heat dissipation hole is connected to the gap. And / or, the heat dissipation module further includes a third heat-conducting layer, one side of the third heat-conducting layer is connected to the hot surface, and the other side of the third heat-conducting layer is connected to the inner wall of the heat dissipation shell; And / or, the heat sink is made of metal material.

13. The optical machine according to any one of claims 1 to 6, wherein: The fluid flowing in the circulation pipeline is water, and the circulation pump is a water pump; Alternatively, the fluid flowing in the circulation pipeline is liquid metal, and the circulation pump is an electromagnetic pump.

14. An extended reality device, characterized in that: The extended reality device includes a housing and an optical machine according to any one of claims 1 to 13, wherein the optical machine body is connected to the housing.

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