A positioning device and method of use thereof

Abstract

The application relates to the technical field of mechanical positioning, and particularly discloses a positioning device and a use method thereof. The positioning device comprises a mounting base, a first detection assembly, a pressure connection assembly, a driving assembly and a positioning assembly. The mounting base is provided with a positioning station, and a suction disc can suck a wafer body to the positioning station. The first detection assembly is arranged on the mounting base. The pressure connection assembly, the driving assembly and the positioning assembly are arranged on the mounting base. The pressure connection assembly, the driving assembly and the positioning assembly are distributed in a triangular shape, and the wafer body can be located between the pressure connection assembly, the driving assembly and the positioning assembly. The positioning device can determine the positioning position of a notch of the wafer body and the opening direction of the notch, so as to realize accurate positioning of the notch of the wafer body. The positioning device is accurate in positioning the notch, and the position of the wafer body is not different from the required position, so that the subsequent process is not affected.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of mechanical positioning, in particular to a positioning device and a method thereof. BACKGROUND

[0002] Wafer is a basic material for manufacturing semiconductor devices, which is made by slicing, and the crystal orientation of wafer is very important for the performance and processing technology of semiconductor devices. The wafer surface with different crystal orientations has different physical and chemical properties, which will have different effects on the electrical properties of the device and the etching process. Therefore, it is necessary to ensure the correct identification of the crystal orientation during the processing. At present, the specific crystal orientation of the wafer is generally determined quickly through the flat edge or notch of the wafer, so as to guide the subsequent wafer processing operation, and the flat edge or notch of the wafer can also facilitate the mechanical positioning of the wafer during the manufacturing process.

[0003] Due to the comprehensive needs of large-size wafers for production efficiency, material utilization rate and process precision, the wafer is generally positioned through the notch of the wafer. In the prior art, when the notch of the wafer is positioned by the positioning device, an optical sensor is used to identify the notch of the wafer. However, due to the small size of the wafer notch, the optical sensor cannot achieve accurate positioning, resulting in a difference between the position of the wafer and the required position, which further affects the subsequent process. SUMMARY

[0004] The purpose of the present application is to provide a positioning device and a method thereof, to solve the problem that in the prior art, the notch of the wafer is identified by an optical sensor, but due to the small size of the wafer notch, the optical sensor cannot achieve accurate positioning, resulting in a difference between the position of the wafer and the required position, which further affects the subsequent process.

[0005] To achieve the above purpose, the present application adopts the following technical solutions:

[0006] On the one hand, the present application provides a positioning device for positioning the notch of a wafer body sucked by a suction cup, the positioning device comprising:

[0007] a mounting base, the mounting base having a positioning station, the suction cup being capable of sucking the wafer body to the positioning station;

[0008] a first detection assembly, the first detection assembly being provided on the mounting base and being used for detecting the notch of the wafer body;

[0009] The pressing assembly, the driving assembly and the positioning assembly are arranged on the mounting base; the pressing assembly, the driving assembly and the positioning assembly are distributed in a triangular shape, and the wafer body can be located between the pressing assembly, the driving assembly and the positioning assembly; the pressing assembly is used for pressing the wafer body towards a side close to the driving assembly and the positioning assembly; the driving assembly is used for driving the wafer body to rotate, so that the positioning assembly can be embedded in the notch of the wafer body.

[0010] As an optional solution of the positioning device, the pressing assembly comprises a pressing motor, a swing rod and a roller, the pressing motor is arranged on the mounting base, one end of the swing rod is connected to the driving end of the pressing motor, and the other end of the swing rod is rotatably connected with the roller; the pressing motor is used for driving the swing rod to swing, so that the roller is pressed on the wafer body.

[0011] As an optional solution of the positioning device, the positioning assembly comprises a supporting seat and a positioning rotating shaft rotatably arranged on the supporting seat, the supporting seat is arranged on the mounting base, and the positioning rotating shaft can be embedded in the notch of the wafer body.

[0012] As an optional solution of the positioning device, the driving assembly comprises a driving motor and a driving wheel fixedly arranged on the driving end of the driving motor, the driving motor is arranged on the mounting base, and is used for driving the driving wheel to drive the wafer body to rotate.

[0013] As an optional solution of the positioning device, the driving wheel is a rubber wheel.

[0014] As an optional solution of the positioning device, the first detection assembly comprises a first support and a first detection head, the first support is rotatably arranged on the mounting base, and the first detection head is movably arranged on the first support along the extension direction of the first support.

[0015] As an optional solution of the positioning device, when the pressing assembly, the driving assembly and the positioning assembly abut against the edge of the wafer body, the contact point of the pressing assembly and the wafer body, the contact point of the driving assembly and the wafer body, and the contact point of the positioning assembly and the wafer body are distributed in an acute angle triangle shape.

[0016] As an optional solution of the positioning device, the positioning device further comprises a second detection assembly, the second detection assembly is arranged on the mounting base, and is used for detecting whether the positioning assembly is embedded in the notch of the wafer body.

[0017] As an optional solution of the positioning device, the mounting base comprises a first base, a second base and a connecting seat, one end of the connecting seat is connected to the first base, and the other end of the connecting seat is connected to the second base; the first detection assembly and the pressing assembly are arranged on the first base, and the driving assembly and the positioning assembly are arranged on the second base.

[0018] In another aspect, the application provides a method for using the positioning device, the method for using the positioning device comprises the following steps:

[0019] The wafer body is rotated at the positioning station by the rotation of the suction disc, and the gap of the wafer body is preliminarily positioned by the first detection assembly;

[0020] The wafer body is rotated at the positioning station by the rotation of the suction disc, and the gap is adjusted to be close to the positioning assembly according to the positioning data of the first detection assembly;

[0021] The wafer body is pressed by the pressing assembly, so that the pressing assembly, the driving assembly and the positioning assembly are all abutted to the edge of the wafer body;

[0022] The wafer body is rotated by the driving assembly, and the wafer body is pressed by the pressing assembly at the same time, so that the positioning assembly can be embedded in the gap.

[0023] The application has the following beneficial effects:

[0024] The positioning device comprises a mounting base, a first detection assembly, a pressing assembly, a driving assembly and a positioning assembly. The mounting base has a positioning station, and a suction cup can suck a wafer body to the positioning station to facilitate subsequent positioning of a notch of the wafer body at the positioning station. The first detection assembly is arranged on the mounting base and is used for detecting the notch of the wafer body, so that the notch of the wafer body can be preliminarily positioned by the first detection assembly after the suction cup rotates the wafer body. In this process, the use of the first detection assembly can improve the positioning efficiency of the positioning device for the notch and reduce the time required for subsequent accurate positioning. The pressing assembly, the driving assembly and the positioning assembly are all arranged on the mounting base, and the pressing assembly, the driving assembly and the positioning assembly are distributed in a triangular shape. The wafer body can be located between the pressing assembly, the driving assembly and the positioning assembly, and the pressing assembly is used to press the wafer body towards the side close to the driving assembly and the positioning assembly, so that the edge of the wafer body can abut against the driving assembly and the positioning assembly under the abutment of the pressing assembly, and the pressing assembly, the driving assembly and the positioning assembly can perform three-point positioning on the wafer body to improve the positioning accuracy of the wafer body. At the same time, the driving assembly is used to drive the wafer body to rotate, so that the positioning assembly can be embedded in the notch of the wafer body, that is, in the process of driving the wafer body to rotate by the driving assembly, the relative position of the wafer body relative to the mounting base does not change, only the position of the notch rotates, and in the process of continuous pressing of the pressing assembly, when the wafer body rotates to the position of the notch corresponding to the positioning assembly, the wafer body is displaced, so that the positioning assembly is embedded in the notch, and the positioning position and the opening direction of the notch are determined, so as to realize accurate positioning of the notch of the wafer body. The positioning device has accurate positioning of the notch, and the position of the wafer body does not differ from the required position, so it does not affect the subsequent process.

[0025] The use method of the positioning device provided by the present application uses the positioning device as described above. The use method of the positioning device is simple and convenient to operate. The notch of the wafer body is preliminarily positioned by the first detection assembly to improve the overall positioning efficiency. The wafer body is three-point positioned by the pressing assembly, the driving assembly and the positioning assembly to position the wafer body. The positioning assembly is embedded in the notch to accurately position the position and the opening direction of the notch of the wafer body. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 The first structural diagram of the positioning device provided by the embodiment of the present application;

[0027] Figure 2 The second structural diagram of the positioning device provided by the embodiment of the present application;

[0028] Figure 3A first structural schematic diagram of a wafer body positioned by the positioning device provided in the embodiments of the present application;

[0029] Figure 4 A second structural schematic diagram of a wafer body positioned by the positioning device provided in the embodiments of the present application;

[0030] Figure 5 A flowchart of a method for using the positioning device provided in the embodiments of the present application.

[0031] In the drawings:

[0032] 1, mounting base; 11, first base; 12, second base; 13, connecting seat; 2, first detection assembly; 21, first support; 22, first detection head; 3, crimping assembly; 31, crimping motor; 32, swing rod; 33, roller; 4, driving assembly; 41, driving motor; 42, driving wheel; 5, positioning assembly; 51, supporting seat; 52, positioning rotating shaft; 6, second detection assembly; 61, second support; 62, second detection head; 7, wafer body; 71, notch. DETAILED DESCRIPTION

[0033] The technical solutions of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0034] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and moreover, the "above", "over" and "on" of the first feature to the second feature include the first feature directly above and obliquely above the second feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The "below", "under" and "under" of the first feature to the second feature include the first feature directly below and obliquely below the second feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0035] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "linking" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0036] The embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0037] Embodiment one

[0038] As shown in the drawings, the present embodiment provides a positioning device for positioning the notch 71 of the wafer body 7 sucked by the suction cup. Figures 1-4

[0039] The positioning device comprises a mounting base 1, a first detection assembly 2, a pressing assembly 3, a driving assembly 4 and a positioning assembly 5. The mounting base 1 has a positioning station, and the suction cup can suck the wafer body 7 to the positioning station to facilitate subsequent positioning of the notch 71 of the wafer body 7 at the positioning station. Specifically, the suction cup can be lifted and rotated to adjust the height of the wafer body 7 and the position of the notch 71.

[0040] The first detection assembly 2 is arranged on the mounting base 1 and is used to detect the notch 71 of the wafer body 7, so that after the suction cup rotates the wafer body 7, the first detection assembly 2 can preliminarily position the notch 71 of the wafer body 7. Through the use of the first detection assembly 2 in this process, the efficiency of positioning the notch 71 by the positioning device can be improved, and the time required for subsequent accurate positioning can be reduced. Moreover, after the preliminary positioning of the notch 71, the position of the notch 71 relative to the mounting base 1 can be adjusted according to the needs of subsequent accurate positioning. Specifically, the first detection assembly 2 comprises a first bracket 21 and a first detection head 22. The first bracket 21 is rotatably arranged on the mounting base 1, and the first detection head 22 is movably arranged on the first bracket 21 along the extension direction of the first bracket 21. Thus, by adjusting the rotation angle of the first bracket 21 and the position of the first detection head 22 on the first bracket 21, the position of the first detection head 22 relative to the mounting base 1 can be adjusted, so as to meet the preliminary positioning of the notch 71 of the wafer body 7 by the first detection head 22, i.e. the signal feedback generated by the first detection head 22 at the notch 71 will be lost during the rotation of the wafer body 7.

[0041] ​The pressing assembly 3, the driving assembly 4 and the positioning assembly 5 are arranged on the mounting base 1, the pressing assembly 3, the driving assembly 4 and the positioning assembly 5 are distributed in a triangular shape, the wafer body 7 can be located between the pressing assembly 3, the driving assembly 4 and the positioning assembly 5, and the pressing assembly 3 is used for pressing the wafer body 7 towards the side close to the driving assembly 4 and the positioning assembly 5, so that the edge of the wafer body 7 can abut against the driving assembly 4 and the positioning assembly 5 under the abutment of the pressing assembly 3, and the wafer body 7 is three-point positioned by the pressing assembly 3, the driving assembly 4 and the positioning assembly 5, so as to improve the position positioning accuracy of the wafer body 7, and the driving assembly 4 is used for driving the wafer body 7 to rotate, so that the positioning assembly 5 can be embedded in the notch 71 of the wafer body 7, that is, during the process that the driving assembly 4 drives the wafer body 7 to rotate, the relative position of the wafer body 7 relative to the mounting base 1 does not change, only the position of the notch 71 rotates, and during the continuous pressing process of the pressing assembly 3, when the wafer body 7 rotates to the position that the notch 71 corresponds to the positioning assembly 5, the wafer body 7 is displaced, so that the positioning assembly 5 is embedded in the notch 71, the positioning position of the notch 71 and the opening direction of the notch 71 are determined, so as to realize the accurate positioning of the notch 71 of the wafer body 7, the positioning assembly 5 accurately positions the notch 71, and the position of the wafer body 7 does not differ from the required position, so as not to affect the subsequent process.

[0042] Specifically, the mounting base 1 comprises a first base 11, a second base 12 and a connecting seat 13, one end of the connecting seat 13 is connected to the first base 11, the other end of the connecting seat 13 is connected to the second base 12, the first detection assembly 2 and the pressing assembly 3 are arranged on the first base 11, and the driving assembly 4 and the positioning assembly 5 are arranged on the second base 12, so that the mounting base 1 is divided into three parts, the production and manufacturing of the mounting base 1 are facilitated, and the difficulty of assembling the positioning assembly is reduced.

[0043] Further, the pressing assembly 3 comprises a pressing motor 31, a swing rod 32 and a roller 33, the pressing motor 31 is arranged on the mounting base 1, one end of the swing rod 32 is connected to the driving end of the pressing motor 31, the other end of the swing rod 32 is rotatably connected with the roller 33, and the pressing motor 31 is used for driving the swing rod 32 to swing, so that the roller 33 presses the wafer body 7, the position and the force direction of the roller 33 are adjusted by driving the swing rod 32 to swing by the pressing motor 31, so that the roller 33 applies force to the wafer body 7 towards the side close to the driving assembly 4 and the positioning assembly 5, so as to realize three-point positioning, and the roller 33 is in contact with the wafer body 7 by the rotation of the roller 33 on the swing rod 32, so as to reduce the rotation difficulty of the wafer body 7, reduce the friction of the wafer body 7 during rotation, and further reduce the wear of the wafer body 7.

[0044] Further, the positioning assembly 5 comprises a supporting seat 51 and a positioning rotating shaft 52 rotatably arranged on the supporting seat 51, the supporting seat 51 is arranged on the mounting base 1, and the positioning rotating shaft 52 can be embedded in the gap 71 of the wafer body 7, so that the roller 33 can be in contact with the wafer body 7 by rotating the positioning rotating shaft 52 on the supporting seat 51, which reduces the rotation difficulty of the wafer body 7, and when the positioning rotating shaft 52 is embedded in the gap 71, the rolling positioning rotating shaft 52 can effectively avoid collision damage to the wafer body 7 by optimizing the distribution of impact energy and reducing local stress.

[0045] Further, the driving assembly 4 comprises a driving motor 41 and a driving wheel 42 fixedly arranged on the driving end of the driving motor 41, and the driving motor 41 is arranged on the mounting base 1 and used to drive the driving wheel 42 to rotate the wafer body 7, so that the wafer body 7 is forced by the rotation of the driving wheel 42, which can ensure the stability of the wafer body 7 when the pressing assembly 3, the driving assembly 4 and the positioning assembly 5 are used to position the wafer body 7 at three points, and avoid the wafer body 7 from being misaligned during rotation to affect the positioning accuracy of the gap 71. Optionally, the driving wheel 42 is a rubber wheel, which has excellent friction performance, excellent wear resistance, good oil resistance, excellent anti-aging performance and the like, can meet the driving requirements of the wafer body 7, prevent slipping, and has a long service life.

[0046] Further, when the pressing assembly 3, the driving assembly 4 and the positioning assembly 5 are all abutted to the edge of the wafer body 7, the contact points of the pressing assembly 3, the driving assembly 4 and the positioning assembly 5 with the wafer body 7 are in an acute triangle distribution, so as to reasonably control the contact position and contact angle of the pressing assembly 3, the driving assembly 4 and the positioning assembly 5 with the wafer body 7, and ensure that the wafer body 7 can be positioned at three points by the pressing assembly 3, the driving assembly 4 and the positioning assembly 5. Optionally, when the pressing assembly 3, the driving assembly 4 and the positioning assembly 5 are all abutted to the edge of the wafer body 7, the contact points of the pressing assembly 3, the driving assembly 4 and the positioning assembly 5 with the wafer body 7 are in an equilateral triangle distribution.

[0047] Further, the positioning device further comprises a second detection assembly 6, which is arranged on the mounting base 1 and used to detect whether the positioning assembly 5 is embedded in the gap 71 of the wafer body 7, so as to ensure that the positioning device can position the gap 71 of the wafer body 7 and prevent the gap 71 of the wafer body 7 from directly entering the next process without positioning, which affects production. Specifically, the second detection assembly 6 comprises a second bracket 61 and a second detection head 62, the second bracket 61 is arranged on the mounting base 1, and the second detection head 62 is arranged on the first bracket 21. Optionally, the first detection head 22 and the second detection head 62 are both laser detection heads.

[0048] Embodiment two

[0049] The application also provides a method for using the positioning device.

[0050] As shown in Figure 5 the method for using the positioning device comprises the following steps:

[0051] The wafer body 7 is rotated at the positioning station by rotating the suction disc, and the notch 71 of the wafer body 7 is preliminarily positioned by the first detection assembly 2;

[0052] The wafer body 7 is rotated at the positioning station by rotating the suction disc, and the notch 71 is adjusted to a position close to the positioning assembly 5 according to the positioning data of the first detection assembly 2;

[0053] The wafer body 7 is pressed by the pressing assembly 3, so that the pressing assembly 3, the driving assembly 4 and the positioning assembly 5 all abut against the edge of the wafer body 7;

[0054] The wafer body 7 is driven to rotate by the driving assembly 4, and the wafer body 7 is pressed by the pressing assembly 3, so that the positioning assembly 5 can be embedded in the notch 71.

[0055] The method for using the positioning device is simple, convenient and fast. The notch 71 of the wafer body 7 is preliminarily positioned by the first detection assembly 2, so as to improve the overall positioning efficiency. The wafer body 7 is three-point positioned by the pressing assembly 3, the driving assembly 4 and the positioning assembly 5, so that the position of the wafer body 7 is positioned. The positioning assembly 5 is embedded in the notch 71, so as to realize the precise positioning of the position and opening direction of the notch 71 of the wafer body 7.

[0056] Further, after the wafer body 7 is pressed by the pressing assembly 3, before the positioning assembly 5 is embedded in the notch 71, it further comprises judging whether the positioning assembly 5 is embedded in the notch 71 of the wafer body 7 by the second detection assembly 6. When the notch 71 of the wafer body 7 is aligned with the positioning assembly 5, the pressing assembly 3 can push the wafer body 7 to move as a whole, so that the positioning assembly 5 is embedded in the notch 71 of the wafer body 7. At this time, due to the overall movement of the wafer body 7, the second detection assembly 6 can detect the signal feedback generated by the overall movement of the wafer body 7, so as to judge that the positioning assembly 5 is embedded in the notch 71 of the wafer body 7. At the same time, the second detection assembly 6 is communicatively connected to the driving assembly 4. When the positioning assembly 5 is embedded in the notch 71 of the wafer body 7, the second detection assembly 6 feeds back a signal to the driving assembly 4 to control the driving assembly 4 to stop working.

[0057] Obviously, the above embodiments of the present application are merely example for clearly explaining the present application, and are not intended to limit the embodiments of the present application. Based on the above description, other different forms of changes or variations can be made by those skilled in the art. Here, it is not necessary and also impossible to enumerate all the embodiments. Any modification, equivalent replacement and improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A positioning device for positioning a notch (71) of a wafer body (7) sucked by a suction chuck, characterized in that, The positioning device comprises: a mounting base (1) having a positioning station, the suction disc being capable of sucking the wafer body (7) to the positioning station; a first detection assembly (2) arranged on the mounting base (1) and used for detecting the notch (71) of the wafer body (7) to preliminarily position the notch (71); a pressing assembly (3), a driving assembly (4) and a positioning assembly (5) arranged on the mounting base (1); the pressing assembly (3), the driving assembly (4) and the positioning assembly (5) are distributed in a triangular shape, and the wafer body (7) can be located between the pressing assembly (3), the driving assembly (4) and the positioning assembly (5); the pressing assembly (3) is used for pressing the wafer body (7) towards a side close to the driving assembly (4) and the positioning assembly (5) so that the edge of the wafer body (7) can abut against the driving assembly (4) and the positioning assembly (5) and the pressing assembly (3), the driving assembly (4) and the positioning assembly (5) can three-point position the wafer body (7); the driving assembly (4) is used for driving the wafer body (7) to rotate so that the positioning assembly (5) can be embedded in the notch (71) of the wafer body (7); when the driving assembly (4) drives the wafer body (7) to rotate, the notch (71) can rotate and the relative position of the wafer body (7) relative to the mounting base (1) will not change; when the wafer body (7) rotates to the position that the notch (71) corresponds to the positioning assembly (5) under the continuous pressing of the pressing assembly (3), the wafer body (7) can displace so that the positioning assembly (5) is embedded in the notch (71) and the positioning position of the notch (71) and the opening direction of the notch (71) are determined. The pressing assembly (3) comprises a pressing motor (31), a swing rod (32) and a roller (33); the pressing motor (31) is arranged on the mounting base (1); one end of the swing rod (32) is connected to the driving end of the pressing motor (31); the other end of the swing rod (32) is rotatably connected with the roller (33); the pressing motor (31) is used for driving the swing rod (32) to swing so that the roller (33) presses the wafer body (7).

2. The positioning device of claim 1, wherein, The positioning assembly (5) comprises a supporting seat (51) and a positioning rotating shaft (52) rotatably arranged on the supporting seat (51); the supporting seat (51) is arranged on the mounting base (1); the positioning rotating shaft (52) can be embedded in the notch (71) of the wafer body (7).

3. The positioning device of claim 1, wherein, The driving assembly (4) comprises a driving motor (41) and a driving wheel (42) fixedly arranged at the driving end of the driving motor (41), and the driving motor (41) is arranged on the mounting base (1) and used to drive the driving wheel (42) to rotate the wafer body (7).

4. The positioning device of claim 3, wherein, The driving wheel (42) is a rubber wheel.

5. The positioning device of claim 1, wherein, The first detection assembly (2) comprises a first support (21) and a first detection head (22), the first support (21) is rotatably arranged on the mounting base (1), and the first detection head (22) is movably arranged on the first support (21) along the extension direction of the first support (21).

6. The positioning device of claim 1, wherein, When the pressing assembly (3), the driving assembly (4) and the positioning assembly (5) abut against the edge of the wafer body (7), the contact point of the pressing assembly (3) and the wafer body (7), the contact point of the driving assembly (4) and the wafer body (7), and the contact point of the positioning assembly (5) and the wafer body (7) form an acute angle triangle.

7. The positioning device of claim 1, wherein, The positioning device further comprises a second detection assembly (6) arranged on the mounting base (1) and used to detect whether the positioning assembly (5) is embedded in the notch (71) of the wafer body (7).

8. The positioning device according to any one of claims 1 to 7, characterized in that The mounting base (1) comprises a first base (11), a second base (12) and a connecting seat (13), one end of the connecting seat (13) is connected to the first base (11), and the other end of the connecting seat (13) is connected to the second base (12); the first detection assembly (2) and the pressing assembly (3) are arranged on the first base (11), and the driving assembly (4) and the positioning assembly (5) are arranged on the second base (12).

9. A method of using a positioning device, characterized by, The use method of the positioning device according to any one of claims 1-8 comprises the following steps: The wafer body (7) is rotated at the positioning station by the suction cup, and the notch (71) of the wafer body (7) is preliminarily positioned by the first detection assembly (2); The wafer body (7) is rotated at the positioning station by the suction cup, and the notch (71) is adjusted to a position close to the positioning assembly (5) according to the positioning data of the first detection assembly (2); The wafer body (7) is pressed by the pressing assembly (3), so that the pressing assembly (3), the driving assembly (4) and the positioning assembly (5) abut against the edge of the wafer body (7); The wafer body (7) is rotated by the driving assembly (4), and the wafer body (7) is pressed by the pressing assembly (3), so that the positioning assembly (5) can be embedded in the notch (71).

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