Temperature-controllable bearing device for semiconductor device preparation

Abstract

The temperature-controllable bearing device for semiconductor device preparation comprises a supporting foot support, a temperature control part is fixed to the top of the supporting foot support, and the top of the temperature control part is fixed to the bottom of a bearing platform; a bearing platform containing groove for containing a bearing object is formed in the top of the bearing platform, rotation of the rotating block is driven by the limiting mechanism, the limiting mechanism is arranged in the bearing platform containing groove in a sliding mode, and limiting work treatment on the bearing object by one side of the limiting plate is achieved. According to the temperature control device disclosed by the invention, the limiting mechanism is arranged, and the limiting mechanism can be used for limiting a bearing object placed in the bearing platform placing groove, so that the phenomenon that a temperature control part deviates when temperature control treatment is carried out is avoided; and a bearing object in the bearing platform containing groove can be limited through the limiting plate, and the phenomenon of deviation in the later period is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field related to semiconductor device preparation, and in particular to a temperature-controllable carrying device for semiconductor device preparation. Background Art

[0002] In the semiconductor device fabrication process, temperature control has a decisive impact on the stability and device performance of key processes such as material growth, thin film deposition, and etching. As chip manufacturing processes evolve toward the nanoscale, the process places higher demands on temperature uniformity, dynamic response speed, and cross-scale adaptability.

[0003] The controllable temperature range of existing temperature-changing devices is generally small, and the heating flux is small, making it difficult to achieve uniform heating, and thus cannot meet experimental requirements; in addition, the existing temperature-changing devices are large in size, which makes it impossible to embed them into high-throughput device preparation and characterization platforms. In order to solve the above problems, the temperature control carrier device with application number 202421372667X expands the temperature control range and ensures the accuracy and uniformity of temperature change by setting a Peltier temperature-changing element, and uses a first heat-conducting component to better conduct the heat or cold generated by the Peltier temperature-changing element. Different receiving grooves can also be set on the first heat-conducting component to adapt to different vessels to be processed, thereby effectively increasing the application range of this device.

[0004] Although the above can perform precise and uniform control, in actual processes, due to the different load objects, when the load object is placed inside the load platform and the load object is temperature-controlled, the load object may be offset, which is not conducive to subsequent processing.

[0005] Therefore, we proposed a temperature-controllable carrier device for semiconductor device preparation that can well solve the above problems. Summary of the Invention

[0006] The purpose of the present invention is to provide a temperature-controllable carrying device for preparing semiconductor devices, so as to solve the problem of the differences in the carrying objects currently on the market raised in the above-mentioned background technology. At this time, when the carrying object is placed inside the carrying platform and the carrying object is temperature-controlled, the carrying object may be offset.

[0007] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a temperature-controllable carrying device for preparing semiconductor devices, comprising a supporting leg, a temperature control unit fixed at the top position of the supporting leg, and the top of the temperature control unit fixed to the bottom position of the carrying platform; a base placement groove for placing the carrying object is opened at the top position of the carrying platform, a rotating block is rotatably provided at the top center position of the carrying platform, and the rotation of the rotating block realizes the driving of a limiting mechanism, and the limiting mechanism is slidably arranged inside the base placement groove to realize the limiting processing of the carrying object by one side of the limiting plate.

[0008] As a preferred technical solution of the present application, four groups of the support placement grooves are arranged about the top center position of the carrying platform, and the bottoms of the four groups of the support placement grooves are in contact with the temperature control area of the temperature control unit.

[0009] As a preferred technical solution of the present application, the temperature control area includes a cooling pipe installed inside the temperature control part, and a heating pipe is further provided on one side of the cooling pipe, with a gap between the cooling pipe and the heating pipe.

[0010] As a preferred technical solution of the present application, the limiting mechanism includes a threaded rod fixed to the bottom of the rotating block, the bottom position of the threaded rod is threadedly connected to the bottom of the connecting sleeve, the bottom position of the connecting sleeve is fixed to the top of the piston block, the bottom of the piston block is slidingly set in the cavity inside the supporting platform, the bottom position of the cavity is connected to the two groups of connecting pipes through two groups of air pipes, and movable sleeves are slidingly provided inside both ends of the connecting pipes. The inner sides of the two groups of movable sleeves are connected by a reset spring, and the outer end of the movable sleeve is fixed at the center of the surface of the limiting plate.

[0011] As a preferred technical solution of the present application, the connecting sleeve forms a sliding structure between the threaded rod and the cavity inside the bearing platform, and the cavity of the piston block fits in contact with the inner wall of the bearing platform.

[0012] As a preferred technical solution of the present application, the limit plate forms a sliding structure between the movable sleeve and the interior of the connecting tube, and the movable sleeve is fixed with a piston disk at one end inside the connecting tube, and the outer side of the piston disk is attached to the inner wall of the connecting tube. The two groups of movable sleeves form a relative sliding structure with the interior of the connecting tube through a reset spring.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: the temperature-controllable carrier device for preparing semiconductor devices is provided with a limiting mechanism. The setting of the limiting mechanism can limit the carrying object placed inside the base placement groove, thereby avoiding the phenomenon of deviation during the temperature control process of the temperature control unit. The specific contents are shown below: 1. A threaded rod is provided, which drives the threaded connecting sleeve to move, thereby enabling the connecting sleeve to drive the piston block to move, thereby enabling the piston block to transport the gas inside the cavity to the inside of the gas pipe, thereby enabling the two sets of movable sleeves slidingly arranged inside the connecting pipe to move, and the bearing object inside the base placement groove can be limited by the limit plate to avoid the phenomenon of offset in the later stage.

[0014] 2. A temperature control unit is provided. Through the temperature control area provided inside the temperature control unit, the bearing object inside the pedestal placement groove is heated and cooled through the cooling pipe and the heating pipe, thereby facilitating temperature control of the temperature control area. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the main structure of the present invention; Figure 2 It is a schematic diagram of the top view of the structure of the present invention; Figure 3 This is a schematic diagram of the main structure of the threaded rod of the present invention; Figure 4 For the present invention Figure 2 A in the middle is an enlarged structural diagram; Figure 5 This is a schematic diagram of the main cross-sectional structure of the connecting pipe of the present invention; Figure 6 This is a bottom view of the temperature control unit of the present invention.

[0016] In the figure: 1. Support leg; 2. Temperature control unit; 21. Cooling pipe; 22. Heating pipe; 3. Load-bearing platform; 4. Base placement groove; 5. Rotating block; 6. Threaded rod; 7. Connecting sleeve; 8. Piston block; 9. Air pipe; 10. Connecting pipe; 11. Moving sleeve; 12. Reset spring; 13. Limit plate. DETAILED DESCRIPTION

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] See also Figures 1-6 , the present invention provides the following technical solution: a temperature-controllable carrying device for preparing semiconductor devices.

[0019] Example 1: In order to solve the problem of different load objects in the current market, when the load object is placed inside the load platform, the load object may be offset when the temperature is controlled. Figure 1 -Attached Figure 5 , a base placement slot 4 for placing the load-bearing object is opened at the top position of the load-bearing platform 3, a rotating block 5 is rotatably set at the top center position of the load-bearing platform 3, and the rotation of the rotating block 5 realizes the driving of the limiting mechanism, and the limiting mechanism is slidably set inside the base placement slot 4, so that one side of the limiting plate 13 can limit the load-bearing object; the limiting mechanism includes a threaded rod 6 fixed to the bottom of the rotating block 5, the bottom position of the threaded rod 6 is threadedly connected to the bottom of the connecting sleeve 7, the bottom position of the connecting sleeve 7 is fixed to the top of the piston block 8, and the bottom of the piston block 8 is slidably set in the cavity inside the load-bearing platform 3, and the bottom position of the cavity is connected to the two groups of connecting pipes 10 through two groups of gas pipes 9, and the connecting pipe 1 0 is fitted and slidably provided with moving sleeves 11 at both ends, the inner sides of the two groups of moving sleeves 11 are connected by a return spring 12, and the outer end of the moving sleeve 11 is fixed to the center position of the surface of the limit plate 13; the connecting sleeve 7 forms a sliding structure with the cavity inside the bearing platform 3 through the threaded rod 6, and the cavity of the piston block 8 fits with the inner wall of the bearing platform 3; the limit plate 13 forms a sliding structure with the interior of the connecting pipe 10 through the moving sleeve 11, and the moving sleeve 11 is fixed with a piston disk at one end inside the connecting pipe 10, and the outer side of the piston disk fits with the inner wall of the connecting pipe 10, and the two groups of moving sleeves 11 form a relative sliding structure with the interior of the connecting pipe 10 through the return spring 12.

[0020] When the load object is placed inside the support platform placement groove 4, the rotating block 5 is rotated so that the rotating block 5 can drive the threaded rod 6 to rotate, thereby making the connecting sleeve 7 threadedly connected to the bottom of the threaded rod 6 move, so that the connecting sleeve 7 drives the piston block 8 to slide stably in the cavity inside the load platform 3, so that the gas will be transported to the inside of the gas pipe 9, and then can be transported to the inside of the connecting pipe 10 through the gas pipe 9. Since the connecting pipe 10 is slidingly provided with movable sleeves 11 at both ends, when the gas is continuously transported, the gas will push the piston disk on one side of the movable sleeve 11, thereby driving the return spring 12 to move between the two sets of movable sleeves 11. At this time, the outer end position of the movable sleeve 11 will also drive the limit plate 13 to slide inside the support platform placement groove 4, thereby allowing one end of the limit plate 13 to limit the load object, thereby preventing the load object from offsetting during the temperature control process.

[0021] Example 2: In order to facilitate the temperature control of the load-bearing object inside the platform placement groove 4, please refer to the attached Figure 1 and attached Figure 6, including a supporting leg 1, a temperature control unit 2 is fixed at the top position of the supporting leg 1, and the top of the temperature control unit 2 is fixed to the bottom position of the carrying platform 3; four groups of supporting platform placement grooves 4 are provided about the top center position of the carrying platform 3, and the bottoms of the four groups of supporting platform placement grooves 4 are in contact with the temperature control area of the temperature control unit 2; the temperature control area includes a cooling pipe 21 installed inside the temperature control unit 2, and a heating pipe 22 is also provided on one side of the cooling pipe 21, and there is a gap between the cooling pipe 21 and the heating pipe 22.

[0022] When it is necessary to perform temperature control on the load-bearing object inside the pedestal placement groove 4, the cooling tube 21 and the heating tube 22 inside the temperature control unit 2 can be started, the temperature control area can be cooled by the cooling tube 21, and the temperature control area can be heated by the heating tube 22. Since the lower position of the pedestal placement groove 4 and the temperature control area are temperature controlled, the above settings can facilitate temperature control of the load-bearing object.

[0023] The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0024] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A temperature-controllable carrying device for preparing semiconductor devices, comprising a supporting leg (1), a temperature control unit (2) being fixed at the top of the supporting leg (1), and a top of the temperature control unit (2) being fixed at the bottom of a carrying platform (3); characterized in that: A support placement groove (4) for placing the supported object is provided at the top position of the support platform (3), and a rotating block (5) is rotatably provided at the center position of the top of the support platform (3). The rotation of the rotating block (5) drives a limiting mechanism, and the limiting mechanism is slidably provided inside the support placement groove (4), so that one side of the limiting plate (13) limits the supported object.

2. A temperature-controllable carrier for semiconductor device preparation according to claim 1, characterized in that: Four groups of the support platform placement grooves (4) are provided at the top center position of the carrying platform (3), and the bottoms of the four groups of the support platform placement grooves (4) are in contact with the temperature control area of the temperature control unit (2).

3. The temperature-controllable carrier device for semiconductor device preparation according to claim 2, characterized in that: The temperature control area includes a cooling pipe (21) installed inside the temperature control unit (2), and a heating pipe (22) is also provided on one side of the cooling pipe (21), with a gap between the cooling pipe (21) and the heating pipe (22).

4. The temperature-controllable carrier device for semiconductor device preparation according to claim 1, characterized in that: The limiting mechanism includes a threaded rod (6) fixed to the bottom of the rotating block (5), the bottom position of the threaded rod (6) is threadedly connected to the bottom of the connecting sleeve (7), the bottom position of the connecting sleeve (7) is fixed to the top of the piston block (8), the bottom position of the piston block (8) is slidably arranged in the cavity inside the bearing platform (3), the bottom position of the cavity is connected to the two groups of connecting pipes (10) through two groups of gas pipes (9), and the two ends of the connecting pipe (10) are fitted with a moving sleeve (11) for sliding. The inner sides of the two groups of the moving sleeves (11) are connected by a reset spring (12), and the outer end of the moving sleeve (11) is fixed to the center position of the surface of the limiting plate (13).

5. The temperature-controllable carrier device for semiconductor device preparation according to claim 4, characterized in that: The connecting sleeve (7) forms a sliding structure between the threaded rod (6) and the cavity inside the bearing platform (3), and the cavity of the piston block (8) fits in contact with the inner wall of the bearing platform (3).

6. The temperature-controllable carrier device for semiconductor device preparation according to claim 4, characterized in that: The limit plate (13) forms a sliding structure between the movable sleeve (11) and the interior of the connecting pipe (10), and a piston disc is fixed at one end of the movable sleeve (11) arranged inside the connecting pipe (10), and the outer side of the piston disc is in contact with the inner wall of the connecting pipe (10). The two groups of movable sleeves (11) form a relative sliding structure with the interior of the connecting pipe (10) through the return spring (12).

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