Electronic device

Abstract

The invention relates to electronic equipment, relates to the technical field of electronic equipment, and can reduce the problem of poor electric connection of the electronic equipment caused by light and thin design of the electronic equipment and improve the reliability of the light and thin electronic equipment. The electronic device may include a circuit board, a main body component, and a mounting bracket. The circuit board comprises a board body and a mainboard support fixed on the board body. The main body part is fixed on the plate body; the main body part comprises a first conductive part and a first stress part which are oppositely arranged; the installation support is located on the side, close to the main board support, of the board body and located on the periphery of the main body component. Interference exists between the main board support and the installation support in the direction perpendicular to the board body. The mounting bracket comprises a second conductive part and a second stress part which are oppositely arranged, a first interaction force is formed between the second stress part and the first stress part, and a second interaction force is formed between the first conductive part and the second conductive part, so that a conductive path is formed between the first conductive part and the second conductive part.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] Due to consumers' demand for portable electronic devices, making them lighter and thinner has become a key goal for electronic device manufacturers. To achieve this, a key improvement direction is to reduce the size of electronic devices. However, reducing the size of electronic devices inevitably increases the pressure on the internal space of electronic devices.

[0003] Reducing the size of electronic devices involves modifying some of their internal structures to reduce the space they occupy, thereby helping to reduce the size of the electronic device. However, these structural modifications may make the original electrical connection design unsuitable for the modified structure, resulting in poor electrical connections in the electronic device. Summary of the Invention

[0004] The embodiments of the present application provide an electronic device that can reduce problems of electronic device failure caused by the lightweight and thin design of the electronic device and improve the reliability of the lightweight and thin electronic device.

[0005] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions: In a first aspect, an electronic device is provided. The electronic device may include a circuit board, a main body component and a mounting bracket. The circuit board includes a plate body and a main board bracket fixed to the plate body. The main body component is fixed to the plate body; in a direction parallel to the plate body, the main body component includes a first conductive portion and a first force-bearing portion that are relatively arranged. The mounting bracket is located on a side of the plate body close to the main board bracket and is located on the periphery of the main body component. In a direction perpendicular to the plate body, there is interference between the main board bracket and the mounting bracket. In a direction parallel to the plate body, the mounting bracket includes a second conductive portion and a second force-bearing portion that are relatively arranged, a first interaction force is formed between the second force-bearing portion and the first force-bearing portion, and a second interaction force is formed between the first conductive portion and the second conductive portion, so that a conductive path is formed between the first conductive portion and the second conductive portion.

[0006] In the following description, the main component is referred to as a camera and the mounting bracket is referred to as a camera bracket, but this is not intended to limit the main component and the mounting bracket.

[0007] Interference between the motherboard bracket and the mounting bracket in a direction perpendicular to the board means that the height range of the motherboard bracket and the mounting bracket overlap in the height direction perpendicular to the board. It can be understood that both the motherboard bracket and the mounting bracket exist in a plane parallel to the board.

[0008] For example, the motherboard bracket may include a spring clip. The spring clip may be welded to a solder point on the bracket body. The spring clip is used to electrically connect to decorative metal in the electronic device, thereby providing electrical continuity between the decorative metal and the ground point. The spring clip may extend downward, and a notch in the camera bracket may be positioned below the spring clip, allowing the mounting bracket to pass through the notch to avoid the spring clip. This allows the notch to avoid the spring clip above without affecting its functionality. Furthermore, if there is interference between the camera bracket and the spring clip in the height direction of the electronic device, the height of the motherboard bracket can be avoided to avoid the spring clip, thereby reducing the thickness of the electronic device.

[0009] A first interaction force is formed between the second force-bearing portion and the first force-bearing portion, indicating that the second force-bearing portion and the first force-bearing portion can be in stable contact. Similarly, a second interaction force is formed between the first conductive portion and the second conductive portion, indicating that the second conductive portion and the first conductive portion can be in stable contact.

[0010] In this application, by modifying the mounting bracket and the motherboard bracket on the circuit board, they are designed to interfere with each other perpendicular to the circuit board after assembly, thereby reducing the space occupied by the mounting bracket and the motherboard bracket. Furthermore, the conductors on the outer surface of the main body component can maintain stable contact with the conductors of the mounting bracket, reducing or even eliminating the interference of the third harmonic generated between the two conductors on the electronic device's internal electronic components.

[0011] In some feasible implementations of the first aspect, the mounting bracket is provided with a notch, the mainboard bracket includes an extension portion, and at least a portion of the extension portion is located in the notch.

[0012] In some examples, the number of extensions can be equal to the number of notches defined in the camera support. Each extension is accommodated in a notch in a one-to-one correspondence. In other examples, the number of extensions can be greater than the number of notches defined in the camera support. Multiple extensions can be located in one notch.

[0013] The motherboard bracket is accommodated within the notch via the extension, which prevents the camera bracket from moving in both the length and width directions of the electronic device. Furthermore, the extension abuts the bottom wall of the notch, allowing the camera bracket to support the motherboard bracket via the extension. Furthermore, the motherboard bracket uses the extension to apply downward pressure to the camera bracket, thereby limiting its height relative to the electronic device. In this way, the motherboard bracket securely secures the camera bracket to the board.

[0014] Because the extension is accommodated within the notch, there is interference between the camera bracket and the motherboard bracket in the height direction of the electronic device. Compared to a case where the extension abuts the top of the camera bracket without the notch, the space occupied by the camera bracket and the motherboard bracket in the height direction of the electronic device can be reduced.

[0015] In some feasible implementations of the first aspect, the cross-section of the mounting bracket is in the shape of a rectangular frame, at least part of the notch is located at a corner of the rectangular frame, and the cross-section is parallel to the plate body.

[0016] The camera support may include a first frame edge, a second frame edge, a third frame edge, and a fourth frame edge connected end to end. The notch may be located at a corner of any two connected frame edges.

[0017] For example, the camera bracket has a notch, which can be located at the corner where the first frame edge and the second frame edge meet. It is understood that the notch includes both a depression extending parallel to the length of the electronic device and a depression extending parallel to the width of the electronic device. When viewed from above, the notch can be L-shaped.

[0018] In this way, the mainboard bracket is accommodated in the notch through the extension portion, and one or more (two or more) notches can be used to help limit the position of the camera bracket in the length and width directions of the electronic device so that it cannot move.

[0019] In some feasible implementations of the first aspect, the first conductive portion includes a first main body portion and a first rib protruding from the first main body portion toward the second conductive portion, and a second interaction force is formed between the second conductive portion and the first rib.

[0020] The length direction of the first rib can be parallel to the height direction of the electronic device, the height direction of the first rib can be parallel to the width direction of the electronic device, and the extension height of the first rib can be greater than the distance between the first main body and the frame edge.

[0021] It can be understood that the first rib forms an interference fit with the camera bracket frame, generating a second interaction force. This second interaction force includes the pressure (action force) exerted by the frame edge on the first rib, as well as the pressure (reaction force) exerted by the first rib on the frame edge to maintain its shape and position. The greater the interference between the first rib and the frame edge, the greater the second interaction force between the first rib and the second frame edge.

[0022] Because the first rib is long in the direction parallel to the height of the electronic device, even if the notch is located on the edge of the frame, the top edge of the frame edge sinks, and the top edge of the first rib in contact with the frame edge can sink synchronously with the top edge of the frame edge. After the top edge sinks, the extended length of the first rib still ensures an interference fit with the frame edge, generating a second interaction force.

[0023] In this embodiment, since an interference fit is formed between the first rib and the frame edge, the camera and the frame edge can also be made of an alloy with low surface treatment requirements. Low surface treatment requirements can refer to the formation of surface films such as oxide films and membranes on the surface of the alloy. For example, the camera and the frame edge can be made of a suitable alloy such as magnesium alloy, aluminum alloy, stainless steel, etc. Because the first rib and the frame edge form an interference fit, during the process of assembling the camera to the camera bracket, the mutual friction between the first rib and the frame edge is relatively large, which can destroy the surface films such as oxide films formed on the surface of the alloy, so that the surface films do not affect the stable contact between the first rib and the frame edge to form a conductive path.

[0024] In this embodiment, the second interaction force between the frame edge and the first rib ensures stable contact between the frame edge and the first rib, thereby avoiding the phenomenon of the frame edge and the first rib appearing to be in contact but not in contact, and reducing or even eliminating the interference of the third harmonic generated between the camera and the frame edge on the internal electronic components of the smartphone.

[0025] In some feasible implementations of the first aspect, the second conductive portion includes a second main body portion and a second rib protruding from the second main body portion toward the first conductive portion, and a second interaction force is generated between the first conductive portion and the second rib.

[0026] The effect of forming a second interaction force between the second rib and the camera can refer to the effect of forming a second interaction force between the first rib and the frame edge, and will not be repeated here.

[0027] In some feasible implementations of the first aspect, the electronic device further includes an elastic member. The elastic member is located between the first force-bearing portion and the second force-bearing portion. The first interaction force includes pressure exerted by the second force-bearing portion on the elastic member and pressure exerted by the elastic member on the first force-bearing portion.

[0028] The elastic member may be made of a composite material with elastic deformation capability, such as rubber, plastic, silicone, spring steel, etc., and this application does not limit this.

[0029] The first force-bearing portion abuts the second force-bearing portion through the elastic member, generating a first interaction force. This first interaction force includes the pressure (action force) applied by the first force-bearing portion to the elastic member, the pressure (reaction force) applied by the elastic member to the first force-bearing portion to maintain its shape and position, the pressure (action force) applied by the second force-bearing portion to the elastic member, and the pressure (reaction force) applied by the elastic member 53 to the second force-bearing portion to maintain its shape and position.

[0030] The pressure exerted by the elastic member on the first force-bearing portion is actually the pressure exerted by the elastic member on the camera. The pressure exerted on the camera creates a kinetic force toward the second conductive portion, thereby squeezing the second conductive portion. The squeezing of the camera against the second conductive portion creates a second interaction force between the first and second conductive portions of the camera. The magnitude of this second interaction force depends on the pressure exerted by the elastic member on the second force-bearing portion. The greater the pressure exerted by the elastic member on the second force-bearing portion, the greater the second interaction force.

[0031] In this way, the second interaction force between the first conductive part and the second conductive part will ensure stable contact between the first conductive part and the second conductive part, avoid the phenomenon of the first conductive part and the second conductive part appearing to be in contact but not in contact, and reduce or even eliminate the interference of the third harmonic generated between the first conductive part and the second conductive part on the internal electronic components of the smartphone.

[0032] In some feasible implementations of the first aspect, the first force-bearing portion defines a first groove, in which a portion of the elastic member is located, and / or the second force-bearing portion defines a second groove, in which a portion of the elastic member is located.

[0033] By accommodating a portion of the elastic member within the first and second grooves, the problem of insufficient space between the first and second force-bearing portions to accommodate the elastic member due to internal space constraints in electronic devices can be overcome. This allows the elastic member to apply pressure to the camera, thereby generating a second interaction force between the first and second conductive portions. This ensures stable contact between the first and second conductive portions, avoids the phenomenon of seemingly contacting the first and second conductive portions, and reduces or even eliminates interference with the smartphone's internal electronic components caused by the third harmonic generated between the first and second conductive portions.

[0034] In some feasible implementations of the first aspect, the elastic member includes an elastic main portion and N elastic protrusions protruding outward from the elastic main portion; each elastic protrusion provides pressure to the first force-bearing portion, where N is a positive integer.

[0035] The elastic part contacts the camera through multiple elastic protrusions, which can make the camera bear the force more evenly, prevent the camera from having problems such as eccentricity, centrifugation and rotation, ensure the reliability of the assembly of the camera and the camera bracket, and improve the yield rate of the electronic equipment.

[0036] In some feasible implementations of the first aspect, the second conductive portion includes N second ribs. In a direction perpendicular to the extension of the elastic main portion, one second rib and one elastic protrusion are located on the same straight line, and different second ribs correspond to different elastic protrusions.

[0037] The elastic member includes an elastic main portion and two elastic protrusions. The frame edge may include a main portion and two second ribs. One second rib may be located on a straight line extending in the height direction of one elastic protrusion, and the other second rib may be located on a straight line extending in the height direction of another elastic protrusion.

[0038] In this way, the pressure exerted by one elastic protrusion on the first force-bearing portion can be aligned with the second interaction force between the first conductive portion and one second rib. The pressure exerted by another elastic protrusion on the first force-bearing portion can be aligned with the second interaction force between the first conductive portion and another second rib.

[0039] In this way, the pressure provided by the elastic protrusion to the camera is more efficient in increasing the second interaction force between the first conductive part and the second rib, thereby improving the contact stability between the first conductive part and the second rib.

[0040] In some feasible implementations of the first aspect, the end of the elastic protrusion close to the plate is sloped, wherein the bottom of the slope has the smallest dimension in the width direction of the electronic device, and the top of the slope has the largest dimension in the width direction of the electronic device.

[0041] In this way, during the assembly of the camera and the camera bracket, the camera can be assembled into the camera bracket along the slope. When the camera is first assembled into the camera bracket, the pressure between the camera and the elastic protrusion is relatively small, thereby facilitating the entry of the camera into the camera bracket and improving the assembly efficiency of the electronic device.

[0042] In some feasible implementations of the first aspect, the electronic device further includes an elastic conductor. The elastic conductor is located between the first conductive portion and the second conductive portion. The first conductive portion, the elastic conductor, and the second conductive portion together form a conductive path. The second interaction force includes pressure exerted by the second conductive portion on the elastic conductor and pressure exerted by the elastic conductor on the first conductive portion.

[0043] The elastic conductor may include an elastic material and a conductive layer covering the entire outer surface of the elastic material. The conductive layer may be obtained by metallizing the surface of the elastic material. The elastic material may include a composite material having elastic deformation capabilities, such as rubber, plastic, silicone, spring steel, etc. The conductive layer may include a metal coating such as nickel plating, gold plating, or tungsten plating, which has excellent electrical conductivity. The embodiments of the present application do not limit the specific materials of the elastic material and the conductive layer.

[0044] When the elastic conductor forms an interference fit with both the first and second conductive parts, it applies pressure to the camera, forcing the camera toward the second force-bearing part. This creates a first interaction force between the first force-bearing part of the camera and the second force-bearing part of the camera holder. This first interaction force consists of the pressure exerted by the first force-bearing part on the second force-bearing part (the action force) and the pressure exerted by the second force-bearing part on the first force-bearing part (the reaction force) to maintain its shape and position.

[0045] The first conductive portion can form a second interaction force with the second conductive portion through the elastic conductor. This second interaction force includes pressure (action force) exerted by the first conductive portion on the elastic conductor, pressure (reaction force) exerted by the elastic conductor on the first conductive portion to maintain its shape and position, pressure (action force) exerted by the elastic conductor on the second conductive portion, and pressure (reaction force) exerted by the second conductive portion on the elastic conductor to maintain its shape and position.

[0046] Because the elastic conductor is long in the direction parallel to the Z-axis, even when the notch is located in the second conductive portion, the top edge of the second conductive portion sinks, allowing the top edge of the elastic conductor to sink synchronously with the top edge of the second conductive portion. After the top edge sinks, the extended length of the elastic conductor still ensures an interference fit with the first and second conductive portions, generating a second interaction force.

[0047] In this way, the first conductive portion maintains stable contact with the elastic conductor, forming a conductive path with the conductive layer on the elastic conductor. The second conductive portion also maintains stable contact with the elastic conductor, forming a conductive path with the conductive layer on the elastic conductor. Furthermore, the first conductive portion, the elastic conductor, and the second conductive portion collectively form a conductive path.

[0048] In some feasible implementations of the first aspect, the main body component includes a camera, and the mounting bracket includes a camera bracket. In some feasible implementations of the first aspect, the main body component includes a speaker unit, and the mounting bracket includes a speaker bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1Schematic diagram of the local three-dimensional structure of two metal conductors; Figure 2 It is a front view of two metal conductors in contact; Figure 3 A schematic diagram of the three-dimensional structure of a smartphone provided in some embodiments of the present application; Figure 4 for Figure 3 An exploded perspective view of the smartphone shown; Figure 5 for Figure 4 Schematic diagram of the three-dimensional structure of the camera module; Figure 6 for Figure 5 A three-dimensional exploded diagram of the camera module; Figure 7 A structural diagram of a camera bracket; Figure 8 for Figure 4 A three-dimensional exploded diagram of the main circuit board, camera bracket and camera; Figure 9 A top view of a camera module in some embodiments of the present application; Figure 10 for Figure 9 Schematic diagram of the three-dimensional connection between the second wall and the second frame edge; Figure 11 Another top view of the camera module in some embodiments of the present application; Figure 12 This is another top view of the camera module in some embodiments of the present application; Figure 13 A top view of a camera module in some other embodiments of the present application; Figure 14 for Figure 13 Schematic diagram of two forms of the elastic protrusion; Figure 15 Another top view of the camera module in some other embodiments of the present application; Figure 16 This is another top view of the camera module in some other embodiments of the present application; Figure 17 A top view of a camera module in some other embodiments of the present application; Figure 18 Another top view of the camera module in some other embodiments of the present application; Figure 19 is another top view of the camera module in some other embodiments of the present application; Figure 20 for Figures 13 to 19A schematic diagram of the three-dimensional structure of the elastic member in the embodiment shown; Figure 21 A top view of a camera module in some further embodiments of the present application; Figure 22 Another top view of the camera module in some other embodiments of the present application; Figure 23 A schematic diagram of a three-dimensional structure of a camera bracket in various embodiments of the present application; Figure 24 This is another three-dimensional structural schematic diagram of the camera bracket in each embodiment of the present application. DETAILED DESCRIPTION

[0050] The following will describe the technical solutions in the embodiments of the present application in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments provided in this application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0051] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of this application, unless otherwise specified, "plurality" means two or more.

[0052] In addition, in this application, directional terms such as "up", "down", "left", and "right" may be defined including but not limited to the orientation relative to the schematic placement of the components in the drawings. It should be understood that these directional terms may be relative concepts. They are used for relative descriptions and clarifications, and they may change accordingly according to changes in the orientation of the components in the drawings.

[0053] When describing some embodiments, the terms "connected," "connected," and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct or indirect physical contact with each other. For example, "A and B are connected" may mean that A and B are connected directly, or that A and B are connected through other components. In addition, the term "coupled" may refer to a method of electrical connection for signal transmission, and coupling may refer to direct coupling or indirect coupling.

[0054] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0055] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0056] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and errors associated with measurement of the particular quantity (i.e., limitations of the measurement system).

[0057] For ease of understanding, the technical terms involved in this application are explained and described below.

[0058] 1. Electrostatic discharge (ESD) ESD is a technology used to study the generation, hazards, and protection against static electricity. In industries such as electronics, semiconductors, and optoelectronics, ESD can damage electronic components, degrade performance, or even cause failure, reducing product reliability.

[0059] To this end, anti-static structures are usually installed in products to suppress and eliminate static electricity accumulation, significantly reducing the product defect rate caused by static electricity and improving product quality.

[0060] 2. Electromagnetic compatibility (EMC) EMC consists of two parts: electromagnetic interference (EMI) and electromagnetic interference susceptibility (EMS).

[0061] The main contents of EMI testing may include: radiated emission (RE) test, conducted emission (CE) test, harmonic current test, voltage variation and flicker test, etc.

[0062] The main contents of EMS testing may include: radiated susceptibility (RS) test, conducted susceptibility (CS) test, ESD immunity test, electrical fast transient (EFT) test, surge immunity test and power frequency magnetic susceptibility (PMS) test.

[0063] 3. Radiated spurious emission (RSE) RSE testing is part of electromagnetic compatibility (EMC) testing and is used to evaluate the negative electromagnetic radiation generated by wireless communication equipment or transmitting equipment outside its operating frequency range.

[0064] Figure 1 shows a schematic diagram of a partial three-dimensional structure of two metal conductors; Figure 2 A front view showing two metallic conductors in contact.

[0065] At present, some functional modules inside electronic devices (such as display screens, cameras, speakers, etc.) need to discharge static electricity to the outside. The commonly used methods are: Figure 1 and Figure 2 As shown, the metal conductor 01 on the outer surface of the functional module is brought into contact with the external metal conductor 02 connected to the grounding point, so that the static electricity at the functional module is transferred to the grounding point through the metal conductor 01 on the outer surface and the external metal conductor 02. For example, the metal conductor 01 on the outer surface of the functional module is in contact with the first end of the external metal conductor 02, and the second end of the external metal conductor 02 can be connected to the grounding point on the metal middle frame or the grounding point on the motherboard. In this way, the static electricity at the functional module can be transferred to the grounding point through the metal conductor 01 on the outer surface and the external metal conductor 02, thereby achieving static discharge of the functional module.

[0066] However, the contact between the metal conductor 01 on the outer surface of the functional module and the external metal conductor 02 (which can be understood as the metal surface of the functional module and the surface of the external metal conductor) is easily unstable, resulting in a phenomenon of seemingly contactless contact. This can easily trigger a tunneling effect between the two metal surfaces, generating a large amount of third harmonics, which can interfere with the electronic components within the electronic device.

[0067] The nonlinear equation for the third harmonic current is: Formula (1).

[0068] in, is the comprehensive constant; is the contact resistance between two metal surfaces; is the contact pressure between two metal surfaces; is the pressure coefficient, The value depends on the shapes of the two metal surfaces. For example, if either metal surface has a convex hull =1 / 2, for example, if any metal surface has a spherical surface =1 / 3; is the fundamental current.

[0069] It can be seen from formula (1) that the greater the contact pressure between two metal surfaces, the smaller the third harmonic current; the smaller the contact resistance between two metal surfaces, the smaller the third harmonic current.

[0070] At present, in order to avoid the phenomenon of seemingly contacting but not contacting between two metal surfaces in electronic devices, the two metal surfaces are kept in stable contact. For example, when the two metal conductors are separable, conductive components such as conductive foam and metal shrapnel can be used to contact the two metal conductors at the same time, and the conductive components are in a compressed state, so that there is a force between the conductive components and the two metal conductors. In this way, each metal conductor is in stable contact with the conductive component, which can ensure that the third harmonic generated by the two metal surfaces is within the permitted range corresponding to the RSE test, and the degree of interference with the electronic devices inside the electronic device is low. In addition, by using the conductive component in contact with the metal conductor, it is possible to ensure stable contact between the conductive component and the metal conductor when the two metal conductors are subjected to impact or dynamic tolerance of the installation.

[0071] As another example, when the two metal conductors are inseparable, they can be fixed by screwing, gluing, or welding to ensure stable contact between the two metal conductors, thereby ensuring that the third harmonic generated between the two metal conductors is within the permitted range corresponding to the RSE test, and the degree of interference to the electronic components inside the electronic equipment is low.

[0072] However, as thinner and lighter electronic devices become mainstream, available space inside these devices is becoming increasingly limited. Consequently, some structures are being modified to reduce their internal footprint. However, these modifications may result in the aforementioned two methods for ensuring stable contact between two metal surfaces no longer being applicable to the modified structure. Consequently, the modified structure within some functional modules may no longer ensure stable contact between the metal conductors on the functional module's outer surface and external metal conductors.

[0073] Based on this, an embodiment of the present application provides an electronic device. The electronic device includes a main body component, a mounting bracket, and a circuit board. In the embodiment of the present application, by modifying the mounting bracket and the mainboard bracket on the circuit board, after the mounting bracket and the mainboard bracket are assembled, there is interference between the mounting bracket and the mainboard bracket in a direction perpendicular to the circuit board, thereby reducing the space occupied by the mounting bracket and the mainboard bracket. Furthermore, the conductors on the outer surface of the main body component can maintain stable contact with the conductors of the mounting bracket, reducing or even eliminating the interference of the third harmonic generated between the two conductors on the electronic devices within the electronic device.

[0074] The electronic devices provided in the embodiments of this application may include, but are not limited to, smartphones, tablet computers, laptop computers, handheld computers, netbooks, personal digital assistants (PDAs), wearable electronic devices (smart watches, smart bracelets, smart rings, etc.), virtual reality devices, etc., and the embodiments of this application are not limited thereto. The following description uses smartphones as an example of an electronic device, but this is not limited to smartphones.

[0075] See also Figure 3 , Figure 3 The following is a schematic diagram of the three-dimensional structure of a smartphone provided by some embodiments of the present application. The smartphone 100 may be in an approximately rectangular plate-shaped structure.

[0076] For ease of description below, an XYZ coordinate system is established, defining the width of smartphone 100 as the X-axis, the length of smartphone 100 as the Y-axis, and the thickness of smartphone 100 as the Z-axis. The plane parallel to the X-axis and Y-axis will be referred to as the XY plane.

[0077] It is understandable that Figure 3 Only some components of the smartphone 100 are shown schematically, and the actual shapes, sizes, positions, and configurations of these components are not affected by the present disclosure. Figure 3 restrictions.

[0078] See also Figure 4 , Figure 4 Shown Figure 3 The smartphone 100 may include a screen 10, a back cover 20, a middle frame 30, a circuit board 40, a camera module 50, and a speaker module 60. In the embodiments of the present application, the direction from the screen 10 to the back cover 20 is defined as "top to bottom."

[0079] Screen 10 can be used to display images, videos, and the like. It includes a translucent cover plate 11 and a display screen 12. Along the Z-axis, the translucent cover plate 11 and display screen 12 are stacked. The translucent cover plate 11 primarily protects and protects display screen 12 from dust. Materials for the translucent cover plate 11 include, but are not limited to, glass. Display screen 12 can be either flexible or rigid.

[0080] For example, the display screen 12 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, a liquid crystal display (LCD), etc., without limitation herein.

[0081] The back cover 20 can be used to protect the internal electronic components of the smartphone 100 and can be located on the side of the display screen 12 away from the light-transmitting cover plate 11. The back cover 20 can have a light-transmitting opening 21 extending through the back cover 20. The shape of the light-transmitting opening 21 can be circular, rectangular, etc., and is not limited here.

[0082] The middle frame 30 may include a frame 31 and a middle plate 32 that are connected to each other. The frame 31 may be located between the back cover 20 and the light-transmitting cover plate 11, and the frame 31 may be connected to the back cover 20. For example, the frame 31 may be bonded to the back cover 20 by adhesive. The light-transmitting cover plate 11 may also be bonded to the frame 31 by adhesive. The middle plate 32 is connected to the inner surface of the frame 31 to achieve the installation and fixation of the middle plate 32. For example, the edge of the middle plate 32 may be fixed to the frame 31 by adhesive; for another example, the middle plate 32 may be an integrally formed structure with the frame 31, that is, the middle plate 32 and the frame 31 are a structural component as a whole.

[0083] like Figure 4 As shown, the middle plate 32 may include a main plate 321 and a sub-plate 322. The main plate 321 and the sub-plate 322 may be two independent plates. The main plate 321 and the sub-plate 322 may be spaced apart along the Y-axis direction.

[0084] The circuit board 40 can be located on the midplane 32. The circuit board 40 can be used to house electronic components and to provide electrical connections between them. In some examples, the circuit board 40 can include a main circuit board 41 and a secondary circuit board 42. The main circuit board 41 can be fixed to the main board 321, and the secondary circuit board 42 can be fixed to the secondary board 322.

[0085] The main circuit board 41 may be equipped with a control chip. Examples of the control chip include a system-on-chip (SOC), an application processor (AP), double data rate synchronous dynamic random access memory (DDR), and universal flash storage (UFS). In some embodiments, the main circuit board 41 is electrically connected to the display screen 12 and is used to control the display screen 12 to display images or videos.

[0086] The auxiliary circuit board 42 is used to arrange electronic components such as the antenna (such as a 5G antenna), the radio frequency front end, the universal serial bus (USB) device, and the vibration motor.

[0087] The circuit board 40 may further include a connection structure 43. The connection structure 43 may be electrically connected to the main circuit board 41 and the auxiliary circuit board 42 to facilitate data and signal transmission between the auxiliary circuit board 42 and the main circuit board 41. The connection structure 43 may include, but is not limited to, a flexible printed circuit (FPC), a conductor, an enameled wire, or a structure formed by braiding a conductor and a flexible material.

[0088] The camera module 50 can be located on the main circuit board 41. There can be multiple camera modules 50, which can be arranged sequentially on the main circuit board 41. Each camera module 50 can include a camera and a camera bracket. The camera bracket is fixed to the main circuit board 41, and the camera is assembled within the camera bracket, so that the camera bracket can restrict the camera from moving in the X-axis and Y-axis directions.

[0089] In some examples, the camera bracket can be a metal bracket. The camera bracket can be electrically connected to the ground point of the main circuit board 41, so that static electricity at the camera bracket can be conducted to the ground point of the main circuit board 41, thereby achieving static discharge at the camera bracket.

[0090] The speaker modules 60 can be located on the auxiliary circuit board 42. Each speaker module 60 can include a speaker unit and a speaker bracket. The speaker bracket is fixed to the auxiliary circuit board 42, and the speaker unit is assembled inside the speaker bracket, so that the speaker bracket can restrict the speaker unit from moving in the X-axis and Y-axis directions.

[0091] In some examples, the speaker bracket can be a metal bracket. The speaker bracket can be electrically connected to the ground point of the auxiliary circuit board, so that static electricity at the speaker bracket can be conducted to the ground point of the auxiliary circuit board 42, thereby achieving static discharge at the speaker bracket.

[0092] The following details the design of the connection scheme between the camera module 50 and the main circuit board 41 in the embodiments of the present application, in order to achieve a lightweight and thin electronic device. It should be noted that the following description only uses the connection between the camera module 50 and the main circuit board 41 as an example. In practice, the connection between the speaker module 60 and the auxiliary circuit board 42 can also adopt a similar structural design to achieve a lightweight and thin electronic device. In addition, other suitable functional modules can also adopt a similar structural design.

[0093] Figure 5 Shown Figure 4 Schematic diagram of the three-dimensional structure of the camera module; Figure 6 Shown Figure 5 A three-dimensional exploded diagram of the camera module; Figure 7 A structural schematic diagram of a camera bracket is shown. Figure 5 The positional relationship between the camera 51 and the camera bracket 52 can be seen in FIG. Figure 5 and Figure 6 As shown, the outer contour of the camera 51 on the XY plane can be roughly rectangular. A connector can be provided at the bottom of the camera 51 for connecting to a board-to-board (BTB) on the main circuit board 41, thereby providing image signals to the control chip on the main circuit board 41.

[0094] In the XY plane, the camera bracket 52 can be located outside the camera 51. For example, the cross-section perpendicular to the Z-axis (XY plane) can be shaped like a rectangular frame. It is understood that in the XY plane, the camera 51 is located inside the rectangular frame of the camera bracket 52. The camera 51 and the camera bracket 52 are assembled by pushing the camera 51 upward from the bottom of the camera bracket 52, thereby completing the assembly of the camera 51 and the camera bracket 52. The camera 51 and the camera bracket 52 are disassembled by pressing the camera 51 downward from the top, causing the camera 51 to move downward from the camera bracket 52, thereby completing the disassembly of the camera 51 and the camera bracket 52.

[0095] The camera bracket 52 may include a first frame edge 521, a second frame edge 522, a third frame edge 523, and a fourth frame edge 524. The first frame edge 521 and the third frame edge 523 may extend parallel to the X-axis, while the second frame edge 522 and the fourth frame edge 524 may extend parallel to the Y-axis. The first frame edge 521, the second frame edge 522, the third frame edge 523, and the fourth frame edge 524 are connected end to end to form the camera bracket 52.

[0096] The camera 51 may include a first wall 511, a second wall 512, a third wall 513, and a fourth wall 514. The first wall 511 and the third wall 513 may extend parallel to the X-axis, while the second wall 512 and the fourth wall 514 may extend parallel to the Y-axis. The first wall 511, the second wall 512, the third wall 513, and the fourth wall 514 are connected end to end.

[0097] The camera support 52 may also be provided with at least one notch. The notch may be located at the top of at least one frame edge, with the opening facing upwards.

[0098] In some examples, the camera bracket 52 has two notches, one notch can be opened on the first frame edge 521, and the other notch can be opened on the second frame edge 522. It can be understood that the extension direction of one notch is parallel to the X-axis direction, and the extension direction of the other notch is parallel to the Y-axis direction.

[0099] In other examples, such as Figure 5 and Figure 6 As shown, the camera bracket 52 has a notch. The notch Q can be located at the corner where the first frame edge 521 and the second frame edge 522 meet. It can be understood that the notch Q includes both a depression extending parallel to the X-axis and a depression extending parallel to the Y-axis. When viewed from above, the notch Q can be L-shaped.

[0100] In some other examples, such as Figure 7 As shown, the camera bracket 52 has two notches, one notch Q1 can be opened at the connecting corner of the first frame side 521 and the fourth frame side 524, and the other notch Q2 can be opened at the connecting corner of the second frame side 522 and the third frame side 523. It can be understood that both notches Q1 and Q2 include both a depression extending in a direction parallel to the X-axis direction and a depression extending in a direction parallel to the Y-axis direction. From a top-down perspective, it can be seen that both notches Q1 and Q2 can be "L"-shaped.

[0101] It should be noted that, in the “L”-shaped notch, the size of the depression parallel to the Y-axis in the Y-axis direction may be equal to or different from the size of the depression parallel to the X-axis in the X-axis direction.

[0102] See also Figure 8 , Figure 8 Shown Figure 4 A 3D exploded diagram of the main circuit board, camera bracket, and camera.

[0103] The main circuit board 41 may include a board body 411 and a mainboard bracket 412. A plurality of control chips may be arranged on a side surface of the board body 411 close to the screen 10. The mainboard bracket 412 may also be fixed to a side surface of the board body 411 close to the screen 10.

[0104] The motherboard bracket 412 may include a bracket body 4121 and a plurality of connecting portions 4122. The connecting portions 4122 may extend along the Z-axis. The bottom ends of the connecting portions 4122 may be fixed to the board 411, and the top ends of the connecting portions may be connected to the bracket body 4121. In this way, the plurality of connecting portions 4122 may support the bracket body 4121 above the board 411. It will be understood that the bracket body 4121 is spaced apart from the board 411 in the Z-axis direction.

[0105] The motherboard bracket 412 may further include an extension portion 4123. The extension portion 4123 extends from the bracket body 4121 toward the direction close to the camera bracket 52. It can be understood that the extension portion 4123 protrudes relative to the bracket body 4121 toward the direction close to the camera bracket 52.

[0106] In some examples, the number of extensions 4123 can be equal to the number of notches provided on the camera support 52. Each extension 4123 is accommodated in a notch in a one-to-one correspondence. In other examples, the number of extensions 4123 can be greater than the number of notches provided on the camera support 52. Multiple extensions 4123 can be located in one notch.

[0107] In the embodiment of the present application, the motherboard bracket 412 is accommodated within the notch via the extension 4123, which restricts the camera bracket 52 from moving in the X- and Y-axis directions. Furthermore, the extension 4123 abuts the bottom wall of the notch, allowing the camera bracket 52 to support the motherboard bracket 412 via the extension 4123. Furthermore, the motherboard bracket 412 uses the extension 4123 to apply downward pressure to the camera bracket 52, thereby restricting its position in the Z-axis direction. In this way, the motherboard bracket 412 securely secures the camera bracket 52 to the plate 411.

[0108] Because the extension 4123 is accommodated in the notch, there is interference in the Z-axis direction between the camera bracket 52 and the motherboard bracket 412. Compared to when the camera bracket 52 does not have a notch and the extension 4123 abuts the top of the camera bracket 52, the space occupied by the camera bracket 52 and the motherboard bracket 412 in the Z-axis direction can be reduced.

[0109] In addition, compared with the prior art, in which special components are used to connect the board 411 and the camera bracket 52 respectively to fix the camera bracket 52 to the board 411, the embodiment of the present application can eliminate the special components and achieve the function of fixing the camera bracket 52 to the board 411 by modifying the camera bracket 52 (opening a notch) and the mainboard bracket 412 (providing an extension portion 4123), thereby saving the space occupied by the special components for the electronic device, thereby facilitating the lightweight design of the electronic device.

[0110] On the other hand, the motherboard bracket 412 may further include a spring 4124. The spring 4124 may be welded to a welding point of the bracket body 4121. The spring 4124 is used to electrically connect to the decorative metal in the smartphone 100 to connect the decorative metal to the ground point.

[0111] The spring clip 4124 can extend downward, and the notch Q of the camera bracket 52 can be located below the spring clip, allowing the camera bracket 52 to avoid the spring clip 4124 through the notch Q. This avoidance of the spring clip 4124 above the notch does not affect the function of the spring clip 4124. Furthermore, if there is interference between the camera bracket 52 and the spring clip 4124 in the height direction of the smartphone 100, the height of the motherboard bracket 412 can be avoided to avoid the spring clip 4124, thereby reducing the thickness of the smartphone 100.

[0112] In the embodiment of the present application, there is no limitation on the position of the notch Q. It is understandable that the notch Q can be located at any one or more of the first wall 511 , the second wall 512 , the third wall 513 and the fourth wall 514 .

[0113] However, the notch in camera bracket 52 can easily lead to unstable contact between camera 51 and camera bracket 52. This is because the height (Z-axis) of the notch varies depending on actual needs, and conductive foam and metal dome cannot adjust to the height of the notch. Therefore, conductive foam and metal dome cannot be used in camera bracket 52.

[0114] Furthermore, the components within the camera bracket 52 that electrically connect the camera 51 to the camera bracket 52 not only need to establish an electrical connection between the camera 51 and the camera bracket 52 but also need to provide stable support to the camera 51 to accurately position the camera 51 in its installation position without causing eccentricity or other issues. This also facilitates assembly and disassembly of the camera 51 and the camera bracket 52. If conductive foam is installed within the camera bracket 52, the elastic force of the conductive foam may weaken after repeated assembly and disassembly between the camera 51 and the camera bracket 52, resulting in a loss of electrical connection. Alternatively, the adhesive between the conductive foam and the camera bracket 52 may become insufficiently adhesive, causing the conductive foam to separate from the camera bracket 52. If a metal spring is installed within the camera bracket 52, the relative position of the camera 51 and the camera bracket 52 may change during assembly and disassembly, increasing friction between the metal spring and the camera bracket 52. This could cause the metal spring to damage the metal surface of the camera 51 or wear away the metal coating, weakening or even eliminating the electrical connection between the camera 51 and the camera bracket 52.

[0115] Therefore, conductive foam or metal shrapnel is not suitable for the modified camera bracket 52.

[0116] The specific structure of the camera module 50 is introduced in detail below to illustrate how to achieve stable contact between the camera 51 and the camera bracket 52 in the camera module 50, so that the third harmonic generated between the camera 51 and the camera bracket 52 is within the permitted range corresponding to the RSE test, thereby reducing or even eliminating the interference of the third harmonic generated between the camera 51 and the camera bracket 52 on the electronic devices inside the electronic device.

[0117] It should be noted that the following description uses the connection between the camera 51 and the camera bracket 52 in the camera module 50 as an example. The connection between the speaker unit and the speaker bracket in the actual speaker module can also refer to the connection between the camera 51 and the camera bracket 52. In addition, the connection between the camera 51 and the camera bracket 52 can also be referred to in other suitable functional modules.

[0118] Figure 9 A top view of a camera module in some embodiments of the present application is shown; Figure 10 Shown Figure 9 Schematic diagram of the three-dimensional connection between the second wall and the second frame edge. Figure 9 and Figure 10 As shown, the camera module 50 may include a camera 51 and a camera bracket 52. On the XY plane, the camera 51 is assembled inside the camera bracket 52.

[0119] like Figure 9As shown, the first wall 511, the second wall 512, the third wall 513 and the fourth wall 514 of the camera 51 form an integral structure. It can be understood that when the fourth wall 514 moves under pressure, the second wall 512 will move synchronously with the fourth wall 514.

[0120] The fourth wall 514 may include a plastic material or a metal material, which is not limited in the embodiment of the present application.

[0121] The fourth frame edge 524 of the camera support 52 can contact the fourth wall 514 to form a first interaction force. The second frame edge 522 of the camera support 52 can contact the second wall 512 to form a conductive path.

[0122] The fourth frame edge 524 can contact the fourth wall 514, generating a first interaction force. This first interaction force includes the pressure (action force) exerted by the fourth wall 514 on the fourth frame edge 524, as well as the pressure (reaction force) exerted by the fourth frame edge 524 on the fourth wall 514 to maintain its shape and position. Because both the fourth frame edge 524 and the fourth wall 514 are subject to force, the fourth wall 514 can be referred to as the first force-bearing portion, and the fourth frame edge 524 can be referred to as the second force-bearing portion.

[0123] The second frame edge 522 of the camera bracket 52 can contact the second wall 512 to form a conductive path. It can be understood that the second frame edge 522 and the second wall 512 are both conductive components. Therefore, the second wall 512 can be referred to as the first conductive portion, and the second frame edge 522 can be referred to as the second conductive portion.

[0124] Exemplarily, the second wall 512 and the second frame edge 522 both include conductive metals, such as nickel, gold, tungsten, and other metals with good conductive properties.

[0125] The second wall 512 may include a first main body 5121 and a first rib 5122. The first rib 5122 extends from the first main body 5121 toward the second frame edge 522. The second frame edge 522 of the camera bracket 52 contacts the first rib 5122.

[0126] Among them, Figure 10 As shown, the length direction of the first rib 5122 can be parallel to the Z axis direction, and the height direction of the first rib 5122 can be parallel to the X axis direction. The extension height of the first rib 5122 can be greater than the distance between the first main body 5121 and the second frame edge 522. For example, Figure 9 As shown, in the X-axis direction, the size of the first rib 5122 is slightly larger than the spacing distance between the first main body portion 5121 and the second frame edge 522 .

[0127] It can be understood that the first rib 5122 forms an interference fit with the second frame edge 522 of the camera bracket 52, generating a second interaction force. This second interaction force includes the pressure (action force) exerted by the second frame edge 522 on the first rib 5122, as well as the pressure (reaction force) exerted by the first rib 5122 on the second frame edge 522 to maintain its shape and position. The greater the interference between the first rib 5122 and the second frame edge 522, the greater the second interaction force between the first rib 5122 and the second frame edge 522.

[0128] Because the first rib 5122 is long in the direction parallel to the Z-axis, even when the notch Q is located on the second frame side 522, the top edge of the second frame side 522 sinks, and the top edge of the first rib 5122 in contact with the second frame side 522 can sink synchronously with the top edge of the second frame side 522. After the top edge sinks, the extended length of the first rib 5122 can still ensure an interference fit with the second frame side 522, thereby generating a second interaction force.

[0129] In this embodiment, since an interference fit is formed between the first rib 5122 and the second frame edge 522 of the camera bracket 52, the second wall 512 and the second frame edge 522 may also include an alloy with lower surface treatment requirements. Lower surface treatment requirements may refer to the formation of surface film layers such as an oxide film and a skin film on the surface of the alloy. For example, the second wall 512 and the second frame edge 522 may include a suitable alloy such as a magnesium alloy, an aluminum alloy, or stainless steel. Because an interference fit is formed between the first rib 5122 and the second frame edge 522, during the process of assembling the camera 51 to the camera bracket 52, the friction between the first rib 5122 and the second frame edge 522 is relatively large, which can destroy the surface film layers such as the oxide film formed on the surface of the alloy, so that the surface film layers do not affect the stable contact between the first rib 5122 and the second frame edge 522 to form a conductive path.

[0130] In this way, the second interaction force between the second frame edge 522 and the first rib 5122 will ensure stable contact between the second frame edge 522 and the first rib 5122, thereby avoiding the phenomenon that the second frame edge 522 and the first rib 5122 appear to be in contact but not in contact, and reducing or even eliminating the interference of the third harmonic generated between the second wall 512 and the second frame edge 522 on the internal electronic components of the smartphone.

[0131] For example, because the first rib 5122 increases the contact pressure between the second wall 512 and the second frame edge 522, according to formula (1), the greater the contact pressure between the second wall 512 and the second frame edge 522, the smaller the third harmonic generated between the second wall 512 and the second frame edge 522. Therefore, the first rib 5122 can reduce or even eliminate the interference of the third harmonic generated between the second wall 512 and the second frame edge 522 on the internal electronic components of the smartphone.

[0132] Secondly, the second wall 512 is provided with the first rib 5122 in contact with the second frame edge 522, which can reduce the contact area between the second wall 512 and the second frame edge 522, thereby reducing the friction between the second wall 512 and the second frame edge 522 during assembly or disassembly. In this way, assembly and disassembly between the camera 51 and the camera bracket 52 can be facilitated.

[0133] For example, the width of the first rib 5122 in the Y-axis direction may be greater than or equal to 1.2 mm and less than or equal to 1.8 mm. For example, the width of the first rib 5122 in the Y-axis direction may be equal to 1.2 mm, 1.4 mm, 1.5 mm, 1.6 mm, or 1.8 mm.

[0134] The second frame edge 522 has an interference fit with the first rib 5122, which can also absorb assembly tolerances between the camera 51 and the camera bracket 52, thereby enhancing assembly reliability between the camera 51 and the camera bracket 52. For example, the ideal tolerance distance between the second frame edge 522 and the second wall 512 in the X-axis direction after assembly of the camera 51 and the camera bracket 52 should be 1.5 mm, and the size of the first rib 5122 should be 1.8 mm. However, due to assembly tolerances, the actual distance between the second frame edge 522 and the second wall 512 in the X-axis direction after actual assembly of the camera 51 and the camera bracket 52 is 1.6 mm. In this case, the first rib 5122 still has an interference fit with the second frame edge 522, thereby preventing assembly tolerances between the camera 51 and the camera bracket 52 from disrupting the stable contact between the second frame edge 522 and the second wall 512, thereby enhancing assembly reliability between the camera 51 and the camera bracket 52.

[0135] Similarly, the second frame edge 522 and the first rib 5122 have an interference fit, which can also absorb the structural tolerance of the camera 51 and / or the structural tolerance of the camera bracket 52, making the assembly reliability between the camera 51 and the camera bracket 52 higher. For example, the ideal structural dimension of the camera 51 in the X-axis direction is 8.5mm, and the tolerance distance between the second frame edge 522 and the first main body 5121 should be 1.5mm. However, due to the structural tolerance of the camera 51, the actual structural dimension of the camera 51 in the X-axis direction is 8.44mm, resulting in an actual tolerance distance of 1.56mm between the second frame edge 522 and the first main body 5121. At this time, the first rib 5122 can still have an interference fit with the second frame edge 522, thereby preventing the assembly tolerance between the camera 51 and the camera bracket 52 from destroying the stable contact between the second wall 512 and the second frame edge 522, thereby improving the reliability of the assembly between the camera 51 and the camera bracket 52.

[0136] Figure 11 Another top view of the camera module in some embodiments of the present application is shown.

[0137] Figure 11 The embodiment shown is Figure 9 and Figure 10 The difference between the embodiments shown is that Figure 11 In the illustrated embodiment, the second wall 512 does not include the first rib 5122, and the second frame edge 522 includes a second main portion 5221 and a second rib 5222. The second rib 5222 extends from the second main portion 5221 toward the second wall 512. The second wall 512 of the camera 51 contacts the second rib 5222, forming an interference fit.

[0138] Figure 11 The structure and function of the second rib 5222 in the embodiment shown can be Figure 9 The structure and function of the first rib 5122 in the illustrated embodiment are similar; and Figure 11 The principle of forming the second interaction force between the second frame edge 522 and the second wall 512 in the embodiment shown is similar to Figure 9 The principle of the interaction force between the second frame edge 522 and the second wall 512 in the embodiment shown is the same and will not be described again here. Figure 11 The embodiment shown has Figure 9 The embodiment shown has the beneficial effects.

[0139] Because the second rib 5222 is long in the direction parallel to the Z-axis, even when the notch Q is located on the second frame edge 522, the top edge of the second frame edge 522 sinks, causing the top edge of the second rib 5222 to sink synchronously with the top edge of the second frame edge 522. After the top edge sinks, the extended length of the second rib 5222 can still ensure an interference fit with the second wall 512, thereby generating a second interaction force.

[0140] Figure 12 Another top view of the camera module in some embodiments of the present application is shown. Figure 12 The embodiment shown is Figure 9 and Figure 11 The difference between the embodiments shown is that Figure 12 In the illustrated embodiment, the second wall 512 includes a first main portion 5121 and a first rib 5122, and the second frame edge 522 includes a second main portion 5221 and a second rib 5222. The first rib 5122 and the second rib 5222 are staggered in the Y-axis direction.

[0141] Figure 12 The structure and function of the first rib 5122 in the embodiment shown can be Figure 9 In the illustrated embodiment, the structure and function of the first rib 5122 are the same; Figure 12 The structure and function of the second rib 5222 in the embodiment shown can be Figure 11 The structure and function of the second rib 5222 in the illustrated embodiment are the same and will not be described again here. Figure 12 The principle of forming the second interaction force between the second frame edge 522 and the second wall 512 in the embodiment shown can be referred to Figure 9 and Figure 11 In the embodiment shown, the second frame edge 522 and the second wall 512 form a second interaction force. Figure 12 The embodiment shown has Figure 9 and Figure 11 The embodiment shown has the beneficial effects.

[0142] In other embodiments, Figure 9 、 Figure 11 and Figure 12 As shown, the first frame edge 521 of the camera bracket 52 can contact the first wall 511 and form a third interaction force. Moreover, the manner in which the first frame edge 521 and the first wall 511 form the third interaction force can be the same as the principle of the first interaction force formed between the fourth frame edge 524 and the fourth wall 514. Since both the first wall 511 and the first frame edge 521 are subjected to force, the first wall 511 can be referred to as the third force-bearing portion, and the first frame edge 521 can be referred to as the fourth force-bearing portion.

[0143] The third frame edge 523 of the camera bracket 52 can contact the third wall 513 and form a fourth interaction force. In addition, the manner in which the third frame edge 523 and the third wall 513 form the fourth interaction force can be the same as the manner in which the second frame edge 522 and the second wall 512 form the second interaction force. Correspondingly, the third frame edge 523 and the third wall 513 can also stably contact to form a conductive path. It can be understood that the third frame edge 523 and the third wall 513 are both conductive components. Therefore, the third wall 513 can be referred to as the third conductive portion, and the third frame edge 523 can be referred to as the fourth conductive portion.

[0144] so, Figure 9 、 Figure 11 and Figure 12 In the embodiment shown, when the camera 51 is assembled inside the camera bracket 52, the second frame edge 522 is in stable contact with the second wall 512 to form a conductive path, and the third frame edge 523 is in stable contact with the third wall 513 to form a conductive path.

[0145] Figure 13 A top view of the camera module in some other embodiments of the present application is shown. Figure 13 The embodiment shown is Figure 12 The difference between the embodiments shown is that Figure 13 In the illustrated embodiment, the second wall 512 does not include the first rib 5122 , and the second frame edge 522 does not include the second rib 5222 . Figure 13 In the embodiment shown, the camera module 50 further includes an elastic member 53. The elastic member 53 may be located between the fourth wall 514 and the fourth frame edge 524.

[0146] The elastic member 53 may be made of a composite material with elastic deformation capability, such as rubber, plastic, silicone, spring steel, etc., and the embodiments of the present application are not limited thereto.

[0147] The fourth wall 514 abuts against the fourth frame edge 524 via the elastic member 53, forming a first interaction force. This first interaction force includes the pressure (action force) exerted by the fourth wall 514 on the elastic member 53, the pressure (reaction force) exerted by the elastic member 53 on the fourth wall 514 to maintain its shape and position, the pressure (action force) exerted by the fourth frame edge 524 on the elastic member 53, and the pressure (reaction force) exerted by the elastic member 53 on the fourth frame edge 524 to maintain its shape and position.

[0148] The pressure provided by the elastic member 53 on the fourth wall 514 is actually the pressure provided by the elastic member 53 on the camera 51. When the camera 51 is subjected to the pressure, it will form a momentum to approach the second frame edge 522, thereby squeezing the second frame edge 522. The squeezing of the camera 51 on the second frame edge 522 will form a second interaction force between the second wall 512 of the camera 51 and the second frame edge 522. This second interaction force includes the pressure (action force) of the second wall 512 on the second frame edge 522, and the pressure (reaction force) provided by the second frame edge 522 on the second wall 512 to maintain its own shape and position. The magnitude of the second interaction force depends on the pressure provided by the elastic member 53 on the fourth wall 514. The greater the pressure provided by the elastic member 53 on the fourth wall 514, the greater the second interaction force.

[0149] For example, the pressure exerted by the elastic member 53 on the camera 51 increases the contact pressure between the second wall 512 and the second frame edge 522. According to formula (1), the greater the contact pressure between the second wall 512 and the second frame edge 522, the smaller the third harmonic generated between the second wall 512 and the second frame edge 522. Therefore, the elastic member 53 can reduce or even eliminate the interference of the third harmonic generated between the second wall 512 and the second frame edge 522 on the internal electronic components of the smartphone.

[0150] In this way, the second interaction force between the second frame edge 522 and the second wall 512 will ensure stable contact between the second frame edge 522 and the second wall 512, thereby avoiding the phenomenon that the second frame edge 522 and the second wall 512 appear to be in contact but not in contact, and reducing or even eliminating the interference of the third harmonic generated between the second wall 512 and the second frame edge 522 on the internal electronic components of the smartphone.

[0151] In some embodiments, the elastic member 53 may include an elastic body portion 531 and an elastic protrusion portion 532. The elastic protrusion portion 532 may extend outward from the elastic body portion 531.

[0152] The elastic protrusion 532 may extend in a length direction parallel to the Z axis, and in a height direction parallel to the X axis. The height of the elastic protrusion 532 may be greater than the distance between the elastic body 531 and the fourth wall 514 .

[0153] In some examples, such as Figure 13 As shown, the elastic main body 531 can be located on the surface of the fourth frame edge 524 on the side close to the fourth wall 514, and the elastic protrusion 532 extends in a direction close to the fourth wall 514. The extended end of the elastic protrusion 532 in the X-axis direction contacts the fourth wall 514 and forms an interference fit.

[0154] The elastic protrusion 532 contacts the fourth wall 514 and forms an interference fit, which can be referred to Figure 14 As shown, Figure 14 (a) is a schematic diagram showing the elastic protrusion 532 not contacting the fourth wall 514; Figure 14 (b) is a schematic diagram showing the elastic protrusion 532 contacting the fourth wall 514 to form an interference fit. Figure 14 As can be seen from (b) in FIG. 5 , the fourth wall 514 provides pressure to the elastic protrusion 532 , causing the elastic protrusion 532 to deform and compress. The elastic protrusion 532 provides pressure to the fourth wall 514 .

[0155] For example, the interference between the elastic protrusion 532 and the fourth wall 514 can be greater than or equal to 0.03 mm and less than or equal to 0.1 mm. For example, the interference between the elastic protrusion 532 and the fourth wall 514 can be equal to 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, or 0.1 mm.

[0156] When the interference between the elastic protrusion 532 and the fourth wall 514 is small, the first interaction force between the fourth wall 514 and the fourth frame edge 524 is likely to be small, which is not conducive to the stable contact between the second frame edge 522 and the second wall 512. When the interference between the elastic protrusion 532 and the fourth wall 514 is large, the second interaction force between the fourth wall 514 and the fourth frame edge 524 is small, which is likely to damage the camera bracket 52.

[0157] Because the elastic protrusion 532 is long in the direction parallel to the Z-axis, even when the notch Q is located on the fourth frame side 524, the top edge of the fourth frame side 524 sinks, causing the top edge of the elastic protrusion 532 to sink synchronously with the top edge of the fourth frame side 524. After the top edge sinks, the extended length of the elastic protrusion 532 can still ensure an interference fit with the fourth frame side 524, thereby generating a first interaction force.

[0158] The elastic protrusion 532 may be in a shape of a hemisphere, a truncated cone, a polygonal prism, a trapezoid or other suitable three-dimensional shapes, which is not limited in the embodiments of the present application.

[0159] In some examples, such as Figure 13 As shown, the fourth frame edge 524 may be provided with a first groove K1. The opening of the first groove K1 faces the fourth wall 514. The elastic main body 531 may be partially or completely received in the first groove K1.

[0160] By accommodating a portion of the elastic member 53 within the first groove K1, the problem of insufficient space between the fourth wall 514 and the fourth frame edge 524 to accommodate the elastic member 53 due to the internal space constraints of the smartphone 100 can be overcome. This allows the elastic member 53 to apply pressure to the camera 51, thereby forming a second interaction force between the second frame edge 522 and the second wall 512, ensuring stable contact between the second frame edge 522 and the second wall 512, avoiding the phenomenon of the second frame edge 522 and the second wall 512 appearing to be in contact, and reducing or even eliminating the interference of the third harmonic generated between the second wall 512 and the second frame edge 522 on the internal electronic components of the smartphone.

[0161] In addition, the elastic protrusion 532 has an interference fit with the fourth wall 514, which can also absorb assembly tolerances between the camera 51 and the camera bracket 52, thereby increasing the assembly reliability of the camera 51 and the camera bracket 52. Similarly, the elastic protrusion 532 has an interference fit with the fourth wall 514, which can also absorb structural tolerances of the camera 51 and / or the camera bracket 52, thereby increasing the assembly reliability of the camera 51 and the camera bracket 52. The principles of how the elastic protrusion 532 absorbs assembly tolerances between the camera 51 and the camera bracket 52, and how the elastic protrusion 532 absorbs structural tolerances of the camera 51 and / or the camera bracket 52, can be referred to as the principles of how the first rib 5122 absorbs assembly tolerances between the camera 51 and the camera bracket 52, and how the elastic protrusion 532 absorbs structural tolerances of the camera 51 and / or the camera bracket 52, and will not be further elaborated here.

[0162] Figure 15 Another top view of the camera module in some other embodiments of the present application is shown.

[0163] Figure 15 The embodiment shown is Figure 13 The difference between the embodiments shown is that Figure 15 In the illustrated embodiment, the elastic main portion 531 may be located on the surface of the fourth wall 514 on the side close to the fourth frame edge 524, but not on the surface of the fourth frame edge 524 on the side close to the fourth wall 514. The elastic protrusion 532 extends toward the fourth frame edge 524. The distal end of the elastic protrusion 532 extending in the X-axis direction contacts the fourth frame edge 524, forming an interference fit.

[0164] In some examples, the fourth wall 514 may define a second groove K2, with the opening of the second groove K2 facing the fourth frame edge 524. The elastic body 531 may be partially or completely received in the second groove K2.

[0165] Figure 15The principle of forming the first interaction force between the fourth frame edge 524 and the fourth wall 514 in the embodiment shown is similar to Figure 13 The principle of forming the first interaction force between the fourth frame edge 524 and the fourth wall 514 in the embodiment shown is the same, and will also cause the second interaction force to be formed between the second wall 512 and the second frame edge 522 of the camera 51, which will not be repeated here. Figure 15 The embodiment shown has Figure 13 The embodiment shown has the beneficial effects.

[0166] Figure 16 Another top view of the camera module in other embodiments of the present application is shown.

[0167] In other embodiments, Figure 16 As shown, the first frame edge 521 of the camera bracket 52 can contact the first wall 511 and form a third interaction force. Moreover, the manner in which the first frame edge 521 and the first wall 511 form the third interaction force can be the same as the manner in which the fourth frame edge 524 and the fourth wall 514 form the first interaction force.

[0168] The third frame edge 523 of the camera bracket 52 can contact the third wall 513 to form a fourth interaction force. Furthermore, the third frame edge 523 and the third wall 513 can form the fourth interaction force in the same manner as the second frame edge 522 and the second wall 512 form the second interaction force. Accordingly, the third frame edge 523 and the third wall 513 can also form a stable contact to form a conductive path.

[0169] so, Figure 16 In the embodiment shown, when the camera 51 is assembled inside the camera bracket 52, the second frame edge 522 is in stable contact with the second wall 512 to form a conductive path, and the third frame edge 523 is in stable contact with the third wall 513 to form a conductive path.

[0170] Figure 17 A top view of the camera module in some other embodiments of the present application is shown. Figure 17 The embodiment shown is Figure 16 The difference between the embodiments shown is that the camera module 50 includes an elastic member 53. While the elastic member 53 provides pressure to the camera 51, the second wall 512 contacts the second frame edge 522 using the first rib or the second frame edge 522 contacts the second wall 512 using the second rib, and an interference fit is formed.

[0171] Understandably, Figure 17 The embodiment shown can be Figure 16 The embodiment shown and Figure 9 The illustrated embodiments are combined with one another.

[0172] In some examples, such as Figure 17 As shown, the elastic member 53 includes an elastic main body 531 and two elastic protrusions 532a and 532b. The fourth frame 524 may define a first groove K1, and the elastic main body 531 may be partially or fully received in the first groove K1. The elastic protrusion 532a has an interference fit with the camera 51, applying a first pressure to the fourth wall 514 of the camera 51. The elastic protrusion 532b also has an interference fit with the camera 51, applying a second pressure to the fourth wall 514 of the camera 51.

[0173] The second wall 512 may include a first main body 5121 and a first rib 5122. The first rib 5122 extends from the first main body 5121 toward the second frame edge 522. The second frame edge 522 of the camera bracket 52 contacts the first rib 5122 to form an interference fit.

[0174] The first pressure exerted by the elastic protrusion 532a on the camera 51 and the second pressure exerted by the elastic protrusion 532b on the camera 51 increase the second interaction force between the second frame edge 522 and the first rib 5122, thereby improving the contact stability between the second frame edge 522 and the first rib 5122. This prevents the second frame edge 522 from appearing to be in contact with the second wall 512, and reduces or even eliminates interference with the internal electronic components of the smartphone caused by the third harmonic generated between the second wall 512 and the second frame edge 522.

[0175] Figure 18 Another top view of the camera module in some other embodiments of the present application is shown.

[0176] In other examples, such as Figure 18 As shown, the elastic member 53 includes an elastic main portion 531 and two elastic protrusions 532a and 532b. The second frame edge 522 may include a second main portion 5221 and two second ribs 5222a and 5222b. The second rib 5222a may be located on a straight line extending in the height direction of the elastic protrusion 532a, and the second rib 5222b may be located on a straight line extending in the height direction of the elastic protrusion 532b.

[0177] In this way, the pressure exerted by the elastic protrusion 532a on the fourth wall 514 can be aligned with the second interaction force between the second wall 512 and the second rib 5222a. Thus, the pressure exerted by the elastic protrusion 532a on the fourth wall 514 is more efficient in increasing the second interaction force between the second wall 512 and the second rib 5222a, thereby improving the contact stability between the second wall 512 and the second rib 5222a.

[0178] Similarly, the pressure provided by the elastic protrusion 532b to the fourth wall 514 can be aligned with the second interaction force between the second wall 512 and the second rib 5222b, thereby improving the contact stability between the second wall 512 and the second rib 5222b.

[0179] so, Figure 18 In the example shown, the contact stability between the second wall 512 and the second rib 5222a is high, and the contact stability between the second wall 512 and the second rib 5222b is also high. This prevents the second frame edge 522 from appearing to be in contact with the second wall 512, and reduces or even eliminates the interference of the third harmonic generated between the second wall 512 and the second frame edge 522 on the internal electronic components of the smartphone.

[0180] In addition, the elastic member 53 contacts the camera 51 through two elastic protrusions 532a and 532b, and the second frame edge 522 also contacts the camera 51 through two second ribs 5222a and 5222b, so that the force on the camera 51 is more evenly distributed, which can prevent the camera 51 from having problems such as eccentricity, centrifugation and rotation, ensure the reliability of the assembly of the camera 51 and the camera bracket 52, and improve the yield rate of the smart phone 100.

[0181] In other embodiments, Figure 18 As shown, the first frame edge 521 of the camera bracket 52 can contact the first wall 511 and form a third interaction force. Moreover, the manner in which the first frame edge 521 and the first wall 511 form the third interaction force can be the same as the manner in which the fourth frame edge 524 and the fourth wall 514 form the first interaction force.

[0182] The third frame edge 523 of the camera bracket 52 can contact the third wall 513 to form a fourth interaction force. Furthermore, the third frame edge 523 and the third wall 513 can form the fourth interaction force in the same manner as the second frame edge 522 and the second wall 512 form the second interaction force. Accordingly, the third frame edge 523 and the third wall 513 can also form a stable contact to form a conductive path.

[0183] so, Figure 18 In the embodiment shown, when the camera 51 is assembled inside the camera bracket 52, the second frame edge 522 is in stable contact with the second wall 512 to form a conductive path, and the third frame edge 523 is in stable contact with the third wall 513 to form a conductive path.

[0184] Figure 19 Another top view of the camera module in some other embodiments of the present application is shown.

[0185] Figure 19 The embodiment shown is Figure 18 The embodiment shown differs in that the elastic member between the first wall 511 and the first frame edge 521 and the elastic member between the fourth wall 514 and the fourth frame edge 524 are interconnected to form an integrated structure. This integrated structure may include a plurality of elastic protrusions 532c, 532d, and 532e. The elastic protrusion 532c may extend in a direction parallel to the X-axis, contacting the fourth wall 514 and forming an interference fit. The elastic protrusion 532e may extend in a direction parallel to the Y-axis, contacting the first wall 511 and forming an interference fit.

[0186] The extended height direction of the elastic protrusion 532d can form an angle α with the X-axis. This angle α can be greater than 30° and less than 60°. For example, the angle α is 30°, 40°, 45°, 50°, or 60°. The extended end of the elastic protrusion 532d contacts the connection between the first wall 511 and the fourth wall 514, forming an interference fit.

[0187] The elastic protrusion 532d can apply pressure F to the camera 51. The pressure F can include a first force component Fx parallel to the X-axis and a second force component Fy parallel to the Y-axis. The first force component Fx squeezes the camera 51, which can increase the second interaction force between the second wall 512 and the second frame edge 522. The second force component Fy squeezes the camera 51, which can increase the fourth interaction force between the third wall 513 and the third frame edge 523.

[0188] Because the first force component Fx or the force component Fy is smaller than the pressure F exerted by the elastic protrusion 532d on the camera 51, the interference between the elastic protrusion 532d and the camera 51 can be greater than the interference between the elastic protrusion 532c or 532e and the camera 51. In this way, the first force component Fx exerting pressure on the camera 51 by the elastic protrusion 532d can approach the pressure exerted on the camera 51 by the elastic protrusion 532c; alternatively, the second force component Fy exerting pressure on the camera 51 by the elastic protrusion 532d can approach the pressure exerted on the camera 51 by the elastic protrusion 532e.

[0189] so, Figure 19 In the embodiment shown, when the camera 51 is assembled inside the camera bracket 52, the second frame edge 522 is in stable contact with the second wall 512 to form a conductive path, and the third frame edge 523 is in stable contact with the third wall 513 to form a conductive path.

[0190] Figure 20 Shown Figures 13 to 19 A schematic diagram of the three-dimensional structure of the elastic member in the embodiment shown.

[0191] like Figure 20 As shown, the bottom of the elastic protrusion 532 can be sloped. The bottom of the slope is smallest in the X-axis direction, and the top of the slope is largest in the X-axis direction. The bottom of the slope is the end of the slope close to the rear cover 20, and the top of the slope is the end of the slope close to the screen 10.

[0192] In this way, during the assembly process of the camera 51 and the camera bracket 52, the camera 51 can be assembled into the interior of the camera bracket 52 along the slope. When the camera 51 is first assembled into the camera bracket 52, the pressure between the camera 51 and the elastic protrusion 532 is relatively small, thereby facilitating the entry of the camera 51 into the camera bracket 52 and improving the assembly efficiency of the smartphone 100.

[0193] Figure 21 A top view of a camera module in some further embodiments of the present application is shown. Figure 21 The embodiment shown is Figure 12 The difference between the embodiments shown is that Figure 21 In the illustrated embodiment, the second wall 512 does not include the first rib 5122 , and the second frame edge 522 does not include the second rib 5222 . Figure 21 In the embodiment shown, the camera module 50 further includes an elastic conductor 54 . The elastic conductor 54 may be located between the second wall 512 and the second frame edge 522 .

[0194] The elastic conductor 54 may include an elastic material and a conductive layer covering the entire outer surface of the elastic material. The conductive layer may be obtained by metallizing the surface of the elastic material. The elastic material may include elastically deformable composite materials such as rubber (e.g., silicone rubber), plastic, silicone, and spring steel. The conductive layer may include a metal coating such as nickel plating, gold plating, or tungsten plating, which exhibits excellent electrical conductivity. The embodiments of the present application do not limit the specific materials of the elastic material and the conductive layer.

[0195] For example, if the elastic material is rubber, the hardness of the rubber can be greater than or equal to 68 HA and less than or equal to 92 HA; the expansion resistance of the rubber can be greater than or equal to 60 lbs and less than or equal to 75 lbs; and the rebound force of the rubber can be greater than or equal to 0.2 N and less than or equal to 0.8 N. For example, the rubber hardness can be 68 HA, 70 HA, 75 HA, 80 HA, 85 HA, 90 HA, or 92 HA. For another example, the expansion resistance of the rubber can be 60 lbs, 63 lbs, 65 lbs, 67 lbs, 68 lbs, 70 lbs, 74 lbs, or 75 lbs. For another example, the rebound force of the rubber can be 0.2 N, 0.3 N, 0.4 N, 0.5 N, 0.6 N, 0.7 N, or 0.8 N.

[0196] The elastic conductor 54 may extend in a length direction parallel to the Z axis, and in a height direction parallel to the X axis. The height of the elastic conductor 54 may be greater than the distance between the second wall 512 and the second frame edge 522 .

[0197] The elastic conductor 54 can simultaneously have an interference fit with the second wall 512 and the second frame edge 522. For example, when the camera 51 is assembled to the camera bracket 52, the second wall 512 of the camera 51 and the second frame edge 522 of the camera bracket 52 are spaced 0.8 mm apart. The dimension of the elastic conductor 54 in the X-axis direction is 1.5 mm. By arranging the elastic conductor 54 between the second wall 512 and the second frame edge 522, the elastic conductor 54 can simultaneously have an interference fit with the second wall 512 and the second frame edge 522.

[0198] When the elastic conductor 54 is in interference fit with both the second wall 512 and the second frame edge 522, the elastic conductor 54 applies pressure to the camera 51, forcing the camera 51 toward the fourth frame edge 524. This creates a first interaction force between the fourth wall 514 of the camera 51 and the fourth frame edge 524 of the camera bracket 52. This first interaction force comprises the pressure (action force) exerted by the fourth wall 514 on the fourth frame edge 524, and the pressure (reaction force) exerted by the fourth frame edge 524 on the fourth wall 514 to maintain its shape and position.

[0199] The second wall 512 can form a second interaction force with the second frame edge 522 through the elastic conductor 54. The second interaction force includes the pressure (action force) exerted by the second wall 512 on the elastic conductor 54, the pressure (reaction force) exerted by the elastic conductor 54 on the second wall 512 to maintain its own shape and position, the pressure (action force) exerted by the elastic conductor 54 on the second frame edge 522, and the pressure (reaction force) exerted by the second frame edge 522 on the elastic conductor 54 to maintain its own shape and position.

[0200] Because the elastic conductor 54 is long in the direction parallel to the Z-axis, even when the notch Q is located on the second frame edge 522, the top edge of the second frame edge 522 sinks, causing the top edge of the elastic conductor 54 to sink synchronously with the top edge of the second frame edge 522. After the top edge sinks, the extended length of the elastic conductor 54 can still ensure an interference fit with the second wall 512 and the second frame edge 522, thereby generating a second interaction force.

[0201] In this way, the second wall 512 and the elastic conductor 54 can be in stable contact with each other, and a conductive path is formed between the second wall 512 and the conductive layer on the elastic conductor 54. The second frame edge 522 can also be in stable contact with the elastic conductor 54, and a conductive path is formed between the second frame edge 522 and the conductive layer on the elastic conductor 54. Furthermore, the second wall 512, the elastic conductor 54, and the second frame edge 522 together form a conductive path.

[0202] It should be noted that there can be one or more elastic conductors 54. The structures of each elastic conductor 54 are substantially the same.

[0203] In some examples, the elastic conductor 54 may include a conductive body portion 541 and a conductive protrusion portion 542. The conductive protrusion portion 542 may extend outward from the conductive body portion 541.

[0204] In some embodiments, as Figure 21 As shown, the conductive main body 541 can be located on the surface of the second frame edge 522 on the side close to the second wall 512, and the conductive protrusion 542 extends toward the second wall 512. The extended end of the conductive protrusion 542 in the X-axis direction contacts the second wall 512 and forms an interference fit.

[0205] The conductive protrusion 542 may be in a shape of a hemisphere, a truncated cone, a polygonal prism, a trapezoid, or other suitable three-dimensional shapes, which is not limited in the embodiments of the present application.

[0206] In some examples, such as Figure 21 As shown, the second frame edge 522 may be provided with a third groove K3. The opening of the third groove K3 faces the second wall 512. The conductive body portion 541 may be partially or completely received in the third groove K3.

[0207] By accommodating a portion of the elastic conductor 54 within the third groove K3, the problem of insufficient space between the second wall 512 and the second frame edge 522 to accommodate the elastic conductor 54 due to the internal space constraints of the smartphone 100 can be overcome. This allows the elastic conductor 54 to apply pressure to the camera 51, thereby forming a second interaction force between the second frame edge 522 and the second wall 512, ensuring stable contact between the second frame edge 522, the elastic conductor 54, and the second wall 512, avoiding the phenomenon of seemingly contact between the second frame edge 522 and the second wall 512, and reducing or even eliminating the interference of the third harmonic generated between the second wall 512 and the second frame edge 522 on the internal electronic components of the smartphone.

[0208] In addition, the elastic conductor 54 is simultaneously interference-fitted with the second wall 512 and the second frame edge 522, and can also absorb the assembly tolerance between the camera 51 and the camera bracket 52, thereby increasing the assembly reliability between the camera 51 and the camera bracket 52. Similarly, the elastic conductor 54 is simultaneously interference-fitted with the second wall 512 and the second frame edge 522, and can also absorb the structural tolerance of the camera 51 and / or the structural tolerance of the camera bracket 52, thereby increasing the assembly reliability between the camera 51 and the camera bracket 52. The principles of the elastic conductor 54 absorbing the assembly tolerance between the camera 51 and the camera bracket 52, and the elastic protrusion 532 absorbing the structural tolerance of the camera 51 and / or the structural tolerance of the camera bracket 52, can be referred to as the principles of the first rib 5122 absorbing the assembly tolerance between the camera 51 and the camera bracket 52, and the elastic protrusion 532 absorbing the structural tolerance of the camera 51 and / or the structural tolerance of the camera bracket 52, and will not be further elaborated here.

[0209] In other embodiments, the conductive body 541 of the elastic conductor 54 may be located on the surface of the second wall 512 near the second frame edge 522, and the conductive protrusion 542 may extend toward the second frame edge 522. The distal end of the conductive protrusion 542 extending in the X-axis direction contacts the second frame edge 522, forming an interference fit.

[0210] Figure 22 Another top view of the camera module in some further embodiments of the present application is shown.

[0211] In some other examples, such as Figure 22 As shown, the smartphone further includes an external grounding member 70. The external grounding member 70 can be located on a side of the second frame edge 522 away from the second wall 512. The external grounding member 70 can be electrically connected to a grounding point on the main circuit board 41. The elastic conductor 54 can include a conductive main body 541 and two conductive protrusions 542a and 542b. The two conductive protrusions can extend outward from the conductive main body 541, and the two conductive protrusions 542a and 542b are respectively arranged on both sides of the conductive main body 541 in the X-axis direction.

[0212] The conductive body 541 can be embedded within the second frame edge 522. The conductive protrusion 542a extends from the second frame edge 522 toward the second wall 512 and forms an interference fit with the second wall 512. The conductive protrusion 542b extends from the second frame edge 522 toward the external grounding member 70 and forms an interference fit with the external grounding member 70. Because the conductive body 541 can be embedded within the second frame edge 522, the conductive protrusion 542a forms an interference fit with the second wall 512, generating a second interaction force between the second frame edge 522 and the second wall 512, and a fifth interaction force between the second frame edge 522 and the external grounding member 70. The elastic conductor 54 ensures stable contact between the second wall 512 and the external grounding member 70.

[0213] Figure 22 In the embodiment shown, the elastic conductor 54 can form a conductive path between the second wall 512 inside the camera bracket 52 and the external grounding member 70 outside the camera bracket 52, thereby reducing or even eliminating the interference of the third harmonic generated between the second wall 512, the second frame edge 522 and the external grounding member 70 on the internal electronic components of the smartphone.

[0214] Figure 23 A schematic diagram of a three-dimensional structure of a camera bracket in various embodiments of the present application is shown; Figure 24 Another three-dimensional structural schematic diagram of the camera bracket in each embodiment of the present application is shown.

[0215] like Figure 23 and Figure 24 As shown, the camera support 52 includes a first frame edge 521, a second frame edge 522, a third frame edge 523, and a fourth frame edge 524, and further includes a grounding component 525. One end of the grounding component 525 can be connected to the target frame edge, and the other end of the grounding component 525 can be connected to an external grounding point. The target frame edge can refer to any one of the first frame edge 521, the second frame edge 522, the third frame edge 523, and the fourth frame edge 524.

[0216] The external grounding point may include a grounding point of the board 411 , a grounding point on the middle frame (metal middle frame) 30 , or a grounding point on some decorative metal, which is not limited in the embodiments of the present application.

[0217] like Figure 23 As shown, one end of the grounding component 525 can be connected to the outer surface of the first frame edge 521, and the extending direction of the grounding component 525 can be parallel to the Y-axis direction. Figure 24 As shown, one end of the grounding component 525 may be connected to the outer surface of the first frame edge 521 , and the extending direction of the grounding component 525 may be parallel to the X-axis direction.

[0218] In some other embodiments, one end of the grounding component 525 may also be connected to the inner surface of the first frame edge 521. The embodiments of the present application are not limited to this.

[0219] It should be noted that the first interaction force and the second interaction force between the camera 51 and the camera support 52 can exist simultaneously. The first interaction force and the second interaction force are positively correlated. It is understood that the greater the first interaction force, the greater the second interaction force. This allows for stable contact between the first conductive portion and the second conductive portion, reducing or even eliminating interference from the third harmonic generated between the camera 51 and the camera support 52 on the internal electronic components of the smartphone.

[0220] The above is only a specific embodiment of the present application, but the scope of protection of this application is not limited to this. Any changes or substitutions within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that: include: A circuit board, comprising a board body and a mainboard bracket fixed on the board body; A main body component, fixed on the plate body; In a direction parallel to the plate body, the main body component includes a first conductive portion and a first force-bearing portion that are oppositely arranged; The mounting bracket is located on a side of the plate body close to the mainboard bracket and is located on the periphery of the main body component; in a direction perpendicular to the plate body, the mainboard bracket and the mounting bracket interfere with each other; in a direction parallel to the plate body, the mounting bracket includes a second conductive portion and a second force-bearing portion arranged opposite to each other, a first interaction force is formed between the second force-bearing portion and the first force-bearing portion, and a second interaction force is formed between the first conductive portion and the second conductive portion, so that a conductive path is formed between the first conductive portion and the second conductive portion.

2. The electronic device according to claim 1, wherein The mounting bracket is provided with a notch, and the mainboard bracket includes an extension portion, at least a portion of the extension portion is located in the notch.

3. The electronic device according to claim 2, wherein: The cross section of the mounting bracket is in the shape of a rectangular frame, and at least part of the notch is located at a corner of the rectangular frame; the cross section is parallel to the plate body.

4. The electronic device according to any one of claims 1 to 3, characterized in that: The first conductive portion includes a first main body portion and a first rib protruding from the first main body portion toward the second conductive portion; a second interaction force is formed between the second conductive portion and the first rib; and / or, The second conductive portion includes a second main body portion and a second convex rib protruding from the second main body portion toward the first conductive portion; a second interaction force is formed between the first conductive portion and the second convex rib.

5. The electronic device according to any one of claims 1 to 3, characterized in that: The electronic device also includes an elastic member; the elastic member is located between the first force-bearing portion and the second force-bearing portion; the first interaction force includes the pressure exerted on the elastic member by the second force-bearing portion, and the pressure provided by the elastic member to the first force-bearing portion.

6. The electronic device according to claim 5, characterized in that The first force-bearing portion is provided with a first groove, and part of the elastic member is located in the first groove; and / or, The second force-bearing portion is provided with a second groove, and part of the elastic member is located in the second groove.

7. The electronic device according to claim 5, wherein: The elastic member includes an elastic main body and N elastic protrusions protruding outward from the elastic main body; each elastic protrusion provides pressure to the first force-bearing part; and N is a positive integer.

8. The electronic device according to claim 7, wherein: The second conductive portion includes N second ribs; in an extension direction perpendicular to the elastic main portion, one second rib and one elastic protrusion are located on the same straight line, and different second ribs correspond to different elastic protrusions.

9. The electronic device according to claim 7 or 8, characterized in that: The end of the elastic protrusion close to the plate body is sloped.

10. The electronic device according to any one of claims 1 to 3, characterized in that: The electronic device also includes an elastic conductor; the elastic conductor is located between the first conductive part and the second conductive part, and the first conductive part, the elastic conductor and the second conductive part together form a conductive path; the second interaction force includes the pressure exerted on the elastic conductor by the second conductive part, and the pressure provided by the elastic conductor to the first conductive part.

11. The electronic device according to any one of claims 1 to 3, characterized in that: The main body component includes a camera, and the mounting bracket includes a camera bracket; or, The main body component includes a speaker unit, and the mounting bracket includes a speaker bracket.

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