Circuit board, circuit board copper foil pasting device and use method of circuit board copper foil pasting device

Abstract

The invention discloses a circuit board and a circuit board copper foil pasting device, and belongs to the technical field of circuit board manufacturing. In order to solve the problems of low material utilization rate and complex synchronous control of a multi-drive conveying system caused by the need of pre-cutting copper foil in the traditional process, the circuit board comprises a circuit board body which is composed of a bottom layer board, a hot melting connecting frame and a top layer board, a copper foil layer is laminated on the outer surface of the top layer board, and a through copper-plated through hole is formed in the top layer board; the pasting device adopts a single-drive conveying system, a moving plate is driven by a lead screw to achieve transverse conveying of a circuit board, and feeding and discharging are completed in cooperation with a vacuum suction cup. The automatic lifting mechanism drives the bearing disc to intermittently lift through hydraulic linkage, and the feeding process of stacked circuit boards is simplified; the pasting mechanism is integrated with an annular blade, synchronous cutting is conducted through gear and rack transmission when the copper foil is clamped by the abutting plate, and the cutting size is matched with the outline of a circuit board. And the gluing assembly realizes full-width uniform gluing by adopting the cooperation of a glue conveying roller and a coating roller. According to the device, the copper foil utilization rate and the production efficiency are improved through structure optimization, and the conveying system complexity and the positioning error are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production and manufacturing, and in particular to a circuit board, a circuit board copper foil pasting device and a use method thereof. Background Art

[0002] Copper foil is a conductive metal layer formed through a cathodic deposition process. It serves as the conductive carrier for printed circuit boards (PCBs). It is uniformly attached to the surface of the PCB substrate through electrolysis. This material exhibits excellent lamination properties, providing reliable adhesion to insulating substrates. It can also be coated with a solder mask for surface protection, and ultimately etched to form the desired circuit pattern.

[0003] The existing copper foil lamination process has the following technical bottlenecks:

[0004] 1. The traditional lamination process requires precise positioning of the PCB before copper foil cutting and lamination. The need to pre-cut the copper foil to a size that perfectly matches the PCB results in low material utilization and limited production efficiency.

[0005] 2. Existing conveyor systems often use a multi-drive collaborative structure to transport, load, and unload circuit boards. This solution increases the complexity of system synchronization control due to the increased number of drive units. The accumulated errors between multiple drive sources directly affect the positioning accuracy of the copper foil.

[0006] In response to the above problems, the present invention document proposes a circuit board, a circuit board copper foil pasting device and a method of using the same. Summary of the Invention

[0007] The purpose of the present invention is to solve the shortcomings of the existing circuit board, which requires the size of the copper foil to be cut in advance and the need to use multiple driving structures to cooperate with each other to complete the transportation, loading and unloading of the circuit board, and to propose a circuit board and a circuit board copper foil pasting device and a method of use.

[0008] In order to achieve the above object, the present invention adopts the following technical solutions:

[0009] A circuit board, the circuit board body includes a bottom plate and a top plate, with a grid-shaped hot melt connection frame between them

[0010] Copper foil layer, laminated to the outer surface of the top board;

[0011] A plurality of conductive through holes penetrate the bottom plate, the hot melt connection frame and the top plate, and a copper plating layer is provided in the holes.

[0012] As a further improvement of the above technical solution:

[0013] The sides of the bottom plate and the top plate that are close to each other are both provided with wiring patterns, and the sides of the bottom plate and the top plate that are away from each other are blank surfaces.

[0014] A circuit board copper foil pasting device, used for pasting copper foil on the circuit board as described above, comprising:

[0015] a base, on which a workbench is fixedly connected;

[0016] A carrier plate is slidably disposed on one side of the base and is configured to stack multiple circuit board bodies;

[0017] Conveying mechanism, including:

[0018] The lateral moving component is driven by the lead screw to slide the moving plate horizontally along the workbench

[0019] A vertical drive assembly includes a cylinder and a mounting plate, the bottom of which is provided with a vacuum adsorption assembly.

[0020] Pasting mechanism, including:

[0021] The positioning plate is set in the rectangular hole of the workbench and has a positioning groove on the top

[0022] The pressure plate is pivotally connected to the first frame above the workbench

[0023] The annular blade is arranged in a liftable manner in the first frame through a gear rack transmission assembly

[0024] Automatic lifting mechanism, including:

[0025] Hydraulic linkage assembly, consisting of a trapezoidal plate driven by a moving plate and a hydraulic rod

[0026] The one-way drive assembly includes a one-way bearing and a lifting screw, and is configured to convert hydraulic motion into intermittent lifting of the carrier plate.

[0027] As a further improvement of the above technical solution:

[0028] The transverse moving assembly comprises two supporting plates arranged in parallel, a moving block fixedly connected to the moving plate is provided on the top of each supporting plate, and a lead screw which is threadedly matched with the moving block is pivotally connected in one of the supporting plates.

[0029] The automatic lifting mechanism includes a hydraulic rod that slides sealed in a hydraulic cylinder, the end of the hydraulic rod is fixedly connected to a first rack that meshes with a first gear, the first gear cooperates with a rotating cylinder through a one-way bearing, and a lifting screw is threadedly connected to the rotating cylinder.

[0030] The pasting mechanism includes a fixed plate slidably sleeved on the fixed rod, the bottom of the fixed plate is connected to the pressure plate through a third spring, and both sides of the fixed plate are fixedly connected to the third rack meshing with the second gear.

[0031] The bottom of the positioning plate is fixed with multiple guide rods, and the guide rods are slidably sleeved with a push plate. Multiple groups of second springs are provided between the push plate and the positioning plate, and the top of the push plate is fixed with a second rack meshed with the second gear.

[0032] Also included is a glue coating assembly comprising:

[0033] The first glue box is fixed to the bottom of the first frame and has an inclined groove inside.

[0034] Rubber conveyor roller, bottom extends into the chute

[0035] The coating roller contacts the outer wall of the rubber conveying roller and is linked with the gear set.

[0036] A collecting box is provided at the bottom of the first frame, and an inclined scraper is provided on the top thereof to contact the bottom of the copper foil roll, and a collecting trough is formed in the collecting box and communicated with the inclined scraper;

[0037] The inner diameter of the annular blade is in clearance fit with the outer contour of the circuit board body, and the end of the annular blade's descending stroke forms a shear fit with the top surface of the positioning plate.

[0038] In this application, the method for using the circuit board copper foil pasting device includes the following steps:

[0039] S1: Conveying positioning

[0040] The motor drives the lead screw to rotate, which drives the moving plate and vacuum suction cup to move through the moving block. The vacuum suction cup absorbs the circuit board body and then transports it to the positioning slot to complete the loading. After the copper foil is pasted, the vacuum suction cup absorbs the circuit board body again when the moving plate is reset, and then transfers it to the conveyor belt to enter the next process.

[0041] S2: Trapezoidal linkage reset

[0042] When the movable plate is reset to the left, the trapezoidal plate is squeezed, driving the hydraulic rod in the hydraulic cylinder to push the first rack. The one-way bearing cooperates with the first gear to drive the rotating cylinder to rotate, and the lifting screw and the carrying plate move up to lift the circuit board body. After the extrusion is released, the trapezoidal plate is reset under the action of the first spring, the hydraulic rod and the first rack return to their original positions synchronously, and the one-way bearing is disengaged from the rotating cylinder.

[0043] S3: Copper foil coating

[0044] The winding roller pulls the copper foil roll to the top of the pressure plate and the positioning plate; the glue delivery roller and the coating roller are engaged through gears, and the glue delivery roller dips glue from the chute and applies it to the outer wall of the coating roller, achieving uniform glue coating on the entire width of the copper foil.

[0045] S4: Cut to fit

[0046] The hydraulic cylinder pushes the push plate, positioning plate and circuit board upward, and the circuit board body and the pressure plate clamp the copper foil roll to complete the pasting; when it continues to move upward, the second rack drives the second gear, driving the third rack and the annular blade to move downward, and cut the copper foil in contact with the outer wall of the circuit board; after resetting, the annular blade moves upward under the action of the third spring.

[0047] S5: Glue recycling

[0048] After cutting, the rewinding roller continues to rewind the copper foil, and the inclined scraper scrapes the residual glue in the uncut parts into the collection tank for recycling.

[0049] Beneficial effect: In the present invention, a trapezoidal plate is slidably connected in the hydraulic groove, a hydraulic rod is sealed and slidably connected in the hydraulic cylinder, one end of the hydraulic rod is fixed with a first rack, one end of the hydraulic cylinder is connected to the hydraulic groove through a hydraulic hose, the outer wall of the rotating cylinder is sleeved with a one-way bearing, the outer ring of the one-way bearing is fixed with a first gear; when the movable plate is reset, the trapezoidal plate is squeezed downward, thereby pushing the hydraulic rod and the first rack to move outward for the rotating cylinder to rotate, and the rotating cylinder drives the lifting screw rod and the carrying plate to move upward, thereby moving the circuit board body to the top of the base, so that the vacuum suction cup can be adsorbed again, and each time the movable plate is reset, the stacked circuit board body can be transported upward, so that the vacuum suction cup can load and unload the circuit board body in the later stage;

[0050] In the present invention, the bottom of the second frame is fixedly connected to the pressure plate via a fixing rod, the outer wall of the fixing rod is slidably connected to a ring blade via a fixing plate, third racks are fixed on both sides of the fixing plate, and second racks are fixed on both sides of the top of the pushing plate; when the pushing plate moves up and the circuit board body is attached to the copper foil roll, the ring blade is driven downward by the cooperation of the second rack, the third rack and the second gear to complete the cutting of the copper foil roll, thereby achieving the simultaneous cutting of the copper foil during the copper foil pasting process, thereby greatly improving the copper foil pasting efficiency;

[0051] In the present invention, a collecting box is fixed at the bottom of the first frame, and an inclined scraper is fixed to the bottom inner wall of the collecting trough; after cutting is completed, the winding roller above the conveyor belt continues to wind up and move the cut copper foil roll, and the inclined scraper can scrape the glue on the uncut part of the copper foil roll into the collecting trough for recycling and avoiding waste.

[0052] In the present invention, the loading and unloading of the circuit board body can be completed by the reciprocating movement of the movable plate, and when the movable plate is reset, the stacked circuit board bodies can be pushed upward one by one by the driving structure, which is convenient for the adsorption of the vacuum suction cup. In addition, in the later copper foil pasting process, the copper foil roll can be cut by the annular blade at the same time, and the cutting size matches the circuit board body, which greatly improves the copper foil pasting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 A schematic cross-sectional view of a circuit board provided in Example 1 of the present invention;

[0054] Figure 2 This is a schematic diagram of the three-dimensional structure of the circuit board copper foil pasting device provided in Example 1 of the present invention;

[0055] Figure 3 This is a schematic diagram of the three-dimensional cross-sectional structure of the circuit board copper foil pasting device provided in Example 1 of the present invention;

[0056] Figure 4 A schematic diagram of a three-dimensional exploded structure of a workbench, a carrying plate, and a trapezoidal plate of the circuit board copper foil pasting device provided in Example 1 of the present invention;

[0057] Figure 5 A schematic diagram of a partial three-dimensional exploded structure of the support plate, movable plate, and lead screw of the circuit board copper foil pasting device provided in Example 1 of the present invention;

[0058] Figure 6 A schematic diagram of a three-dimensional exploded structure of the first rack, rotating drum, and first gear of the circuit board copper foil pasting device provided in Example 1 of the present invention;

[0059] Figure 7 A schematic diagram of a three-dimensional exploded structure of a workbench, a push plate, and a positioning plate of the circuit board copper foil pasting device provided in Example 1 of the present invention;

[0060] Figure 8 A schematic diagram of a three-dimensional cross-sectional structure of a workbench and a positioning plate of the circuit board copper foil pasting device provided in Example 1 of the present invention;

[0061] Figure 9 A schematic three-dimensional cross-sectional view of the first frame, the second frame, and the fixing plate of the circuit board copper foil pasting device provided in Example 1 of the present invention;

[0062] Figure 10 A schematic three-dimensional cross-sectional view of the first frame and the first glue box of the circuit board copper foil pasting device provided in Example 1 of the present invention;

[0063] Figure 11 A schematic diagram of a three-dimensional exploded structure of the first glue box and the coating roller of the circuit board copper foil pasting device provided in Example 1 of the present invention;

[0064] Figure 12 This is a schematic three-dimensional cross-sectional structure diagram of the collecting box and inclined scraper of the circuit board copper foil pasting device provided in Example 2 of the present invention.

[0065] In the figure: 1. bottom plate; 2. top plate; 3. hot melt connection frame; 4. copper foil layer; 5. through hole; 6. copper layer; 7. base; 8. workbench; 9. support plate; 10. moving plate; 11. moving block; 12. lead screw; 13. cylinder; 14. mounting plate; 15. vacuum suction cup; 16. rotating cylinder; 17. one-way bearing; 18. first gear; 19. lifting screw; 20. hydraulic cylinder; 21. hydraulic rod; 22. first rack; 23. hydraulic groove; 24. trapezoidal plate; 25. first spring; 26. bearing plate; 27. rectangular hole; 28. hydraulic cylinder; 29. push plate ; 30. Guide rod; 31. Second spring; 32. Positioning plate; 33. Positioning slot; 34. Circuit board body; 35. Second rack; 36. First frame; 37. Second frame; 38. Fixed rod; 39. Pressure plate; 40. Fixed plate; 41. Third spring; 42. Second gear; 43. Third rack; 44. Winding roller; 45. Guide wheel; 46. Copper foil roll; 47. First glue box; 48. Coating roller; 49. Glue delivery roller; 50. Inclined chute; 51. Limit block; 52. Collecting box; 53. Collecting trough; 54. Inclined scraper; 55. Annular blade; 56. Conveyor belt. DETAILED DESCRIPTION

[0066] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0067] Example 1: Reference Figure 1 A circuit board, relating to the field of circuit board manufacturing technology, first prepares a bottom board 1 and a top board 2. Both boards are made of materials with excellent insulation properties and mechanical strength, such as epoxy resin board or fiberglass board. The size and shape of the bottom board 1 and the top board 2 are designed according to actual needs.

[0068] refer to Figure 1 Next, a wiring diagram is created on the inner surfaces of the bottom and top boards 1 and 2, which are close to each other. The wiring diagram is formed by etching or printing a conductive material (such as copper) on the board and is used to connect the various electronic components on the circuit board. The design of the wiring diagram should meet the functional requirements and electrical performance requirements of the circuit. The outer surfaces of the bottom and top boards 1 and 2, which are far away from each other, remain blank and are not provided with any conductive materials or components.

[0069] refer to Figure 1Next, a hot melt connection frame 3 is fabricated. The hot melt connection frame 3 is made of a thermoplastic material compatible with the bottom and top boards 1 and 2, such as polyethylene or polypropylene. The hot melt connection frame 3 is designed to be distributed in a grid pattern to increase the number of connection points between the bottom and top boards 1 and 2, thereby improving the stability of the connection. The grid shape can be adjusted to accommodate different circuit board sizes and layouts.

[0070] Next, stack the bottom panel 1, hot melt connection frame 3, and top panel 2 in order, ensuring that they are accurately aligned. Then, heat the hot melt connection frame 3 to soften it and adhere it to the bottom panel 1 and top panel 2. The heating temperature and time should be precisely controlled according to the material and thickness of the hot melt connection frame 3 to ensure that it is completely adhered and cured. A layer of copper foil 4 is adhered to the side of the top panel 2 away from the bottom panel 1, that is, the outer surface of the top panel 2. The copper foil layer 4 is made of copper foil material with good conductive properties and is used to provide additional conductive area and shielding effect. The copper foil layer 4 is tightly bonded to the top panel 2 by adhesive or lamination.

[0071] refer to Figure 1 , multiple through-holes 5 are made in the copper foil layer 4. Through-holes 5 are formed by laser drilling or mechanical drilling, and one end of each through-hole passes through the top board 2, the hot melt connection frame 3, and the bottom board 1 in sequence. The arrangement of through-holes 5 should meet the connection requirements of the circuit board, such as connecting wiring patterns on different layers or connecting external components.

[0072] refer to Figure 1 Finally, copper plating is performed on through-hole 5. An electroplating solution containing copper ions is injected into through-hole 5, and an electric current is applied to cause the copper ions to deposit on the inner wall of through-hole 5 to form a copper layer 6. This copper layer 6 not only increases the conductivity of through-hole 5 but also improves the overall electrical performance of the circuit board.

[0073] Through the above steps, a circuit board with excellent connection stability and electrical conductivity is obtained. This circuit board securely bonds the bottom board 1 and top board 2 together via a hot-melt connection frame 3, and provides reliable electrical connections via the copper foil layer 4 and through-holes 5. This circuit board is suitable for use in a variety of electronic devices and can meet the connection and electrical performance requirements of complex circuits.

[0074] Reference Figure 2 、 Figure 3 、 Figure 5 、 Figure 7 and Figure 9The device is primarily used for attaching copper foil to a circuit board 34. The device comprises a base 7, atop which is secured a workbench 8. A plurality of vacuum cups 15 are positioned above the workbench 8. These cups 15 are primarily used for loading and unloading the circuit board 34. A first frame 36 is also secured atop the workbench 8. Within this frame 36 is a pressing plate 39 for applying pressure to the circuit board 34 during the application of the copper foil.

[0075] Reference Figure 3 and Figure 5 In addition, a carrier plate 26 is slidably mounted on one side of the base 7. This carrier plate 26 is used to carry multiple circuit board bodies 34. A conveying mechanism is located between the base 7 and the workbench 8 to drive the vacuum suction cup 15 to transport the circuit board bodies 34. This conveying mechanism includes a movable plate 10 that slides on top of the workbench 8.

[0076] Reference Figure 3-Figure 6 Furthermore, the conveying mechanism includes two support plates 9 fixed to the top of the workbench 8. Both support plates 9 extend through the first frame 36. A movable block 11 is slidably connected to the top of each support plate 9 and fixed to the bottom of the movable plate 10. A cylinder 13 is fixedly inserted into the movable plate 10. The output shaft of the cylinder 13 is fixed to a mounting plate 14, and multiple vacuum suction cups 15 are fixed to the bottom of the mounting plate 14. In this way, the movable plate 10 can drive the vacuum suction cups 15 to convey the circuit board body 34 through the cooperation of the cylinder 13 and the mounting plate 14. A lead screw 12 is rotatably connected to one of the support plates 9. One end of the lead screw 12 is threaded through the adjacent movable block 11 to drive the movable plate 10. A rotating cylinder 16 is rotatably inserted into the top of one side of the base 7. A lifting screw 19 is threadedly inserted into the rotating cylinder 16. The top end of the lifting screw 19 is fixedly connected to the bottom of the carrier plate 26 to control the lifting of the carrier plate 26 to convey the circuit board body 34. A conveyor belt 56 is located on the top of the base 7, away from the rotating drum 16, for transporting the pasted PCB bodies 34 to the next process. Between the workbench 8 and the base 7, two drive mechanisms are installed to automatically drive the intermittent movement of the carrier plate 26. The movable plate 10 cooperates with the drive mechanisms to drive the carrier plate 26 to intermittently transport the PCB bodies 34 upward, facilitating material feeding by the vacuum suction cup 15.

[0077] Specifically, the motor drives the lead screw 12 to rotate, which in turn drives the movable plate 10 and the vacuum suction cup 15 to move via the movable block 11. The vacuum suction cup 15 can absorb the circuit board body 34 located below it, and then transport the circuit board body 34 to the positioning groove 33 to complete the loading. After the copper foil is attached, the movable plate 10 moves the vacuum suction cup 15 again to the top of the circuit board body 34. The cylinder 13 drives the vacuum suction cup 15 downward, and the vacuum suction cup 15 absorbs the circuit board body 34 again, and then transports the circuit board body 34 to the conveyor belt 56, thereby transporting the circuit board body 34 to the next process.

[0078] Reference Figure 4 and Figure 6 In addition, through the cooperation between the movable plate 10 and the driving structure, the circuit board body 34 can be transported upward through the carrying plate 26, which is convenient for the subsequent pasting of copper foil on the circuit board body 34. Specifically, the driving structure includes a hydraulic groove 23 provided on the top of the workbench 8, and a trapezoidal plate 24 cooperating with the movable plate 10 is slidably connected in the hydraulic groove 23. A first spring 25 is fixed to the bottom end of the trapezoidal plate 24, and the bottom end of the first spring 25 is fixedly connected to the bottom inner wall of the hydraulic groove 23. A hydraulic cylinder 20 is fixed to the top of one side of the base 7, and a hydraulic rod 21 is sealed and slidably connected in the hydraulic cylinder 20. One end of the hydraulic rod 21 extends to one side of the hydraulic cylinder 20 and is fixed with a first rack 22. The end of the hydraulic cylinder 20 away from the first rack 22 is connected to the bottom of the hydraulic groove 23 by a hydraulic hose. A one-way bearing 17 is mounted on the outer wall of the rotating drum 16. The inner ring of the one-way bearing 17 engages with the outer wall of the rotating drum 16. A first gear 18 is fixed to the outer ring of the one-way bearing 17. The first gear 18 meshes with the first rack 22. The cooperation between the first gear 18 and the one-way bearing 17 drives the rotating drum 16 to rotate in one direction.

[0079] Specifically, when the movable plate 10 resets to the left and absorbs the new circuit board body 34, the movable plate 10 will squeeze the trapezoidal plate 24 downward during the movement. After the trapezoidal plate 24 is squeezed, hydraulic oil is injected into the hydraulic cylinder 20, pushing the hydraulic rod 21 and the first rack 22 to move outward. The first rack 22 drives the first gear 18 to rotate, and the first gear 18 drives the rotating cylinder 16 to rotate with the cooperation of the one-way bearing 17. The rotating cylinder 16 drives the lifting screw 19 and the supporting plate 26 to move upward, thereby moving the circuit board body 34 to the top of the base 7 to facilitate the vacuum suction cup 15 to absorb again. When the movable plate 10 releases the pressure on the trapezoidal plate 24, the trapezoidal plate 24 is reset under the action of the first spring 25, and the hydraulic rod 21 and the first rack 22 are reset synchronously. The first rack 22 drives the first gear 18 to rotate in the opposite direction, but due to the characteristics of the one-way bearing 17, the one-way bearing 17 and the rotating cylinder 16 are in an active state at this time, so the rotating cylinder 16 will not rotate in the opposite direction.

[0080] Reference Figure 3 、 Figure 7 and Figure 9 A rectangular hole 27 is provided in the workbench 8, and a positioning plate 32 is provided in the rectangular hole 27. A plurality of limit blocks 51 for positioning the positioning plate 32 are fixed in the rectangular hole 27. A plurality of positioning grooves 33 are provided on the top of the positioning plate 32, and these positioning grooves 33 are used to position the circuit board body 34. At the same time, a pasting mechanism for pasting the copper foil on the circuit board body 34 is provided in the workbench 8 and the first frame 36. This pasting mechanism includes a copper foil roll 46 that is sleeved on the outer wall of the first frame 36, and an annular blade 55 that is provided in the first frame 36 and is used to cut the copper foil roll 46.

[0081] Reference Figure 3 and Figure 9 In the pasting mechanism, a second frame 37 is fixed to the top of the first frame 36, enhancing the stability of the overall structure. A fixing rod 38 is fixed to the bottom of the second frame 37. The bottom end of the fixing rod 38 is fixedly connected to the top of the pressure plate 39, ensuring the vertical stability of the pressure plate 39. A fixing plate 40 is slidably mounted on the outer wall of the fixing rod 38. This sliding design allows the fixing plate 40 to move up and down on the fixing rod 38, thereby adjusting its position. A third spring 41 is installed between the fixing plate 40 and the pressure plate 39 and is mounted on the outer wall of the fixing rod 38. This design not only provides an upward elastic force for the fixing plate 40, but also ensures that it can return to its original position when no external force is applied. The top of the annular blade 55 is fixedly connected to the bottom of the fixing plate 40, and the inner diameter of the annular blade 55 is adapted to the outer contour of the circuit board body 34, ensuring accurate and efficient cutting. To drive the vertical movement of the fixed plate 40 and the annular blade 55, third racks 43 are fixed to both sides of the fixed plate 40. Two second gears 42 are rotatably connected within the first frame 36, and the third racks 43 mesh with adjacent second gears 42. This rack-and-pinion transmission mechanism converts rotational motion into linear motion, thereby achieving precise movement of the fixed plate 40 and the annular blade 55.

[0082] Reference Figure 7 、 Figure 8 and Figure 9At the bottom of the positioning disk 32, a plurality of guide rods 30 are fixed, and the outer walls of these guide rods 30 are slidably sleeved with the same push plate 29. A plurality of second springs 31 are fixed between the push plate 29 and the positioning disk 32, and the second springs 31 are sleeved on the outer walls of the guide rods 30. This design not only provides an upward elastic force for the positioning disk 32, but also ensures that it can stay stably in a certain position when there is no external force. A second rack 35 is fixed on both sides of the top of the push plate 29, and the second rack 35 passes through the positioning disk 32 and engages with the second gear 42. In order to drive the lifting and lowering of the push plate 29 and the positioning disk 32, a hydraulic cylinder 28 is provided, whose output shaft is fixedly connected to the bottom of the push plate 29, and the hydraulic cylinder 28 is fixed in the base 7.

[0083] Specifically, when the output shaft of the hydraulic cylinder 28 pushes the push plate 29 upward, the top of the circuit board body 34 in the positioning groove 33 will first contact the bottom of the copper foil roll 46. At this time, the pressure plate 39 provides support for the copper foil roll 46, and the circuit board body 34 and the pressure plate 39 cooperate to complete the clamping of the copper foil roll 46, thereby attaching the copper foil roll 46 to the circuit board body 34. Then, when the hydraulic cylinder 28 continues to push the push plate 29 upward, the second spring 31 begins to compress, and the push plate 29 pushes the second rack 35 upward. Through the cooperation of the second rack 35, the third rack 43 and the second gear 42, the fixed plate 40 and the annular blade 55 are driven downward. Because the inner wall of the annular blade 55 cooperates with the outer wall of the circuit board body 34, the annular blade 55 can contact the outer wall of the circuit board body 34 when it moves downward to cut the copper foil roll 46.

[0084] Reference Figure 10 Furthermore, to guide and reel in the copper foil roll 46, reel rollers 44 are rotatably connected to both sides of the top of the first frame 36 via a base. Two guide wheels 45 are rotatably connected to both ends of the first frame 36. The copper foil roll 46 is wound around the outer walls of the two reel rollers 44. The motor drives the reel rollers 44 to rotate, allowing the copper foil roll 46 to be reeled in and unreeled.

[0085] Reference Figure 10 and Figure 11 A first glue box 47 is fixed to the bottom of the first frame 36, and the first glue box 47 is located on the side of the positioning plate 32 near the carrier plate 26. The top inner wall of the first glue box 47 is provided with an inclined groove 50 for storing glue. A glue delivery roller 49 is rotatably connected to the first glue box 47, and the bottom of the glue delivery roller 49 extends into the inclined groove 50 for attaching glue. At the same time, a coating roller 48 is also rotatably connected to the first glue box 47, which is in contact with the outer wall of the glue delivery roller 49 and is used to evenly apply glue to the outer wall of the coating roller 48. The length of the coating roller 48 and the glue delivery roller 49 are both greater than the width of the copper foil roll 46, ensuring that the bottom of the copper foil roll 46 can be evenly coated with glue.

[0086] The motor drives the glue feed roller 49 to rotate. The glue feed roller 49 and the coating roller 48 are meshed via gears. Therefore, the rotating glue feed roller 49 applies glue from the chute 50 to the outer wall of the coating roller 48. During the rotation process, the coating roller 48 can apply glue to the moving copper foil, making it easier to glue the copper foil to the circuit board body 34 later.

[0087] In this way, the circuit board copper foil pasting device provided by the present invention can realize automatic loading, copper foil pasting and unloading of the circuit board body 34, thereby greatly improving production efficiency.

[0088] Example 2: Reference Figure 10 and Figure 12 , an improvement based on Example 1: In order to collect the scraped glue, a collection box 52 is fixed to the bottom of the first frame 36 near the side of the conveyor belt 56. The top inner wall of the collection box 52 is provided with a collection groove 53 for collecting glue. An inclined scraper 54 is fixed to the bottom inner wall of the collection groove 53, and the top of the inclined scraper 54 touches the bottom of the copper foil roll 46. When the cutting is completed, when the winding roller 44 above the conveyor belt 56 continues to rewind the cut copper foil roll 46, the inclined scraper 54 can scrape the glue on the uncut part of the copper foil roll 46 into the collection groove 53 for recycling, thereby avoiding waste.

[0089] The method for using the circuit board copper foil pasting device includes the following steps:

[0090] S1. When conveying the circuit board body 34, the motor drives the lead screw 12 to rotate, and the lead screw 12 drives the movable plate 10 and the vacuum suction cup 15 to move through the movable block 11. The vacuum suction cup 15 can adsorb the circuit board body 34 located below it, and then convey the circuit board body 34 to the positioning groove 33 to complete the loading. After the copper foil is pasted, the movable plate 10 moves the vacuum suction cup 15 again to the top of the circuit board body 34, and the cylinder 13 drives the vacuum suction cup 15 to move downward. The vacuum suction cup 15 adsorbs the circuit board body 34 again, and then conveys the circuit board body 34 to the conveyor belt 56, and conveys the circuit board body 34 to the next process.

[0091] S2. When the movable plate 10 is reset to the left and is absorbing the new circuit board body 34, the movable plate 10 squeezes the trapezoidal plate 24 downward during the movement, and the trapezoidal plate 24 injects hydraulic oil into the hydraulic cylinder 20 and pushes the hydraulic rod 21 and the first rack 22 to move outward, and the first rack 22 drives the first gear 18 to rotate. The first gear 18 drives the rotating cylinder 16 to rotate with the cooperation of the one-way bearing 17, and the rotating cylinder 16 drives the lifting screw 19 and the carrying plate 26 to move upward, thereby moving the circuit board body 34 to the top of the base 7, so that the vacuum suction cup 15 can be adsorbed again. When the movable plate 10 releases the squeeze on the trapezoidal plate 24, the trapezoidal plate 24 is reset under the action of the first spring 25, and the hydraulic rod 21 and the first rack 22 are reset synchronously. The first rack 22 drives the first gear 18 to rotate in the opposite direction. The one-way bearing 17 and the rotating cylinder 16 are in an active state at this time;

[0092] S3. When copper foil needs to be pasted on the circuit board body 34, the motor drives the take-up roller 44 located above the conveyor belt 56 to rotate, and the take-up roller 44 pulls the intact copper foil to the right. The intact copper foil is just above the pressure plate 39 and the positioning plate 32. When the copper foil is pulled, the motor drives the glue feeding roller 49 to rotate. The glue feeding roller 49 and the coating roller 48 are engaged with each other through gears. Therefore, the rotating glue feeding roller 49 smears the glue contaminated from the chute 50 on the outer wall of the coating roller 48. During the rotation of the coating roller 48, the moving copper foil can be coated with glue, which is convenient for pasting the copper foil to the circuit board body 34 later. The length of the coating roller 48 and the glue feeding roller 49 is greater than that of the copper foil roll 46, so the coating roller 48 can evenly coat the glue on the bottom of the copper foil roll 46.

[0093] S4, when the output shaft of the hydraulic cylinder 28 pushes the push plate 29, the second spring 31 and the positioning plate 32 to move upward, the top of the circuit board body 34 in the positioning groove 33 first fits the bottom of the copper foil roll 46, and the pressure plate 39 supports the copper foil roll 46. The circuit board body 34 and the pressure plate 39 cooperate to complete the clamping of the copper foil roll 46, which is used to stick the copper foil roll 46 to the circuit board body 34. Then the hydraulic cylinder 28 continues to push the push plate 29 upward, the second spring 31 begins to compress, the push plate 29 pushes the second rack 35 upward, and the second rack 35 The cooperation between the third rack 43 and the second gear 42 drives the fixed plate 40 and the annular blade 55 to move downward, and the inner wall of the annular blade 55 cooperates with the outer wall of the circuit board body 34. Therefore, when the annular blade 55 moves downward, it can fit the outer wall of the circuit board body 34 to cut the copper foil roll 46, and the cutting size matches the circuit board body 34. After the cutting is completed, the hydraulic cylinder 28 drives the push plate 29, the positioning plate 32 and the circuit board body 34 to move downward and reset. The annular blade 55 moves upward and reset under the action of the third spring 41, which is convenient for further cutting later.

[0094] S5. After the cutting is completed, the reel 44 above the conveyor belt 56 continues to reel in the cut copper foil roll 46, and the inclined scraper 54 can scrape the glue on the uncut part of the copper foil roll 46 into the collection tank 53 for recycling to avoid waste.

[0095] However, as is well known to those skilled in the art, the working principles and wiring methods of the hydraulic cylinder 28, vacuum suction cup 15 and air cylinder 13 are commonplace, and are conventional means or common knowledge, and will not be elaborated here. Those skilled in the art can make any selections according to their needs or convenience.

[0096] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A circuit board, characterized in that: The circuit board body (34) includes a bottom plate (1) and a top plate (2), with a grid-shaped hot-melt connection frame (3) provided therebetween. A copper foil layer (4) is pressed onto the outer surface of the top plate (2); A plurality of conductive through holes (5) pass through the bottom plate (1), the hot melt connection frame (3) and the top plate (2), and a copper plating layer (6) is provided in the holes.

2. The circuit board according to claim 1, wherein: The sides of the bottom plate (1) and the top plate (2) that are close to each other are both provided with wiring patterns, and the sides of the bottom plate (1) and the top plate (2) that are away from each other are blank surfaces.

3. A circuit board copper foil pasting device for pasting copper foil on the circuit board as claimed in claim 2, characterized in that: include: A base (7) on which a workbench (8) is fixedly connected; A carrier plate (26) is slidably disposed on one side of the base (7) and is configured to stack a plurality of circuit board bodies (34); Conveying mechanism, including: The lateral moving assembly is driven by the lead screw (12) to move the moving plate (10) to slide laterally along the workbench (8) A vertical drive assembly comprises a cylinder (13) and a mounting plate (14), wherein a vacuum adsorption assembly (15) is provided at the bottom of the mounting plate (14) Pasting mechanism, including: A positioning plate (32) is arranged in the rectangular hole (27) of the workbench (8) and has a positioning groove (33) on the top. The pressure plate (39) is pivotally connected to the first frame (36) above the workbench (8) The annular blade (55) is arranged in an automatic lifting mechanism in the first frame (36) so as to be liftable via a gear rack transmission assembly, and comprises: The hydraulic linkage assembly is composed of a trapezoidal plate (24) driven by a moving plate (10) and a hydraulic rod (21). The one-way drive assembly includes a one-way bearing (17) and a lifting screw (19), and is configured to convert hydraulic motion into intermittent lifting of a carrier plate (26).

4. The circuit board copper foil pasting device according to claim 3, characterized in that: The transverse moving assembly comprises two support plates (9) arranged in parallel, each support plate (9) is provided with a moving block (11) fixedly connected to the moving plate (10) on the top, and a lead screw (12) is pivotally connected to one of the support plates (9) and is threadedly matched with the moving block (11).

5. The circuit board copper foil pasting device according to claim 4, characterized in that: The automatic lifting mechanism comprises a hydraulic rod (21) which is sealed and slides in a hydraulic cylinder (20); the end of the hydraulic rod (21) is fixedly connected to a first rack (22) which is meshed with a first gear (18); the first gear (18) is matched with a rotating cylinder (16) through a one-way bearing (17); and the internal thread of the rotating cylinder (16) is connected to a lifting screw (19).

6. The circuit board copper foil pasting device according to claim 5, characterized in that: The pasting mechanism comprises a fixed plate (40) slidably sleeved on a fixed rod (38); the bottom of the fixed plate (40) is connected to a pressing plate (39) via a third spring (41); and both sides of the fixed plate (40) are fixedly connected to third racks (43) meshing with a second gear (42).

7. The circuit board copper foil pasting device according to claim 6, characterized in that: The bottom of the positioning plate (32) is fixedly connected to a plurality of guide rods (30), and the guide rods (30) are slidably sleeved on a push plate (29). A plurality of groups of second springs (31) are provided between the push plate (29) and the positioning plate (32), and the top of the push plate (29) is fixedly connected to a second rack (35) meshing with a second gear (42).

8. The circuit board copper foil pasting device according to claim 7, characterized in that: Also included is a glue coating assembly comprising: The first glue box (47) is fixed to the bottom of the first frame (36) and has an inclined groove (50) inside. The rubber feeding roller (49) has its bottom extending into the chute (50) The coating roller (48) contacts the outer wall of the rubber feeding roller (49) and is linked to the coating roller (48) through a gear set.

9. The circuit board copper foil pasting device according to claim 8, characterized in that: A collecting box (52) is provided at the bottom of the first frame (36), and an inclined scraper (54) is provided at the top thereof for contacting the bottom of the copper foil roll (46). A collecting trough (53) communicating with the inclined scraper (54) is formed in the collecting box (52); The inner diameter of the annular blade (55) is clearance-matched with the outer contour of the circuit board body (34), and the end of the descending stroke of the annular blade (55) forms a shear fit with the top surface of the positioning plate (32).

10. A method for using a circuit board copper foil pasting device, applied to the circuit board copper foil pasting device according to claim 9, characterized in that: The following steps are involved: S1, conveying and positioning: the motor drives the lead screw (12) to rotate, and drives the movable plate (10) and the vacuum suction cup (15) to move through the movable block (11). The vacuum suction cup (15) adsorbs the circuit board body (34) and then transports it to the positioning groove (33) to complete the loading. After the copper foil is pasted, the vacuum suction cup (15) adsorbs the circuit board body (34) again when the movable plate (10) is reset, and the circuit board is transferred to the conveyor belt (56) to enter the next process. S2, trapezoidal linkage reset: when the moving plate (10) resets to the left, it squeezes the trapezoidal plate (24), drives the hydraulic rod (21) in the hydraulic cylinder (20) to push the first rack (22), and the one-way bearing (17) cooperates with the first gear (18) to drive the rotating cylinder (16) to rotate, and the lifting screw (19) and the bearing plate (26) move up to lift the circuit board body (34); after the squeezing is released, the trapezoidal plate (24) is reset under the action of the first spring (25), the hydraulic rod (21) and the first rack (22) return to their original positions synchronously, and the one-way bearing (17) and the rotating cylinder (16) are disengaged; S3, copper foil gluing: the reeling roller (44) pulls the copper foil roll (46) to the top of the pressure plate (39) and the positioning plate (32); the glue feeding roller (49) and the coating roller (48) are meshed through gears, and the glue feeding roller (49) dips glue from the chute (50) and applies it to the outer wall of the coating roller (48), so as to achieve uniform gluing of the entire width of the copper foil; S4, cutting and pasting: the hydraulic cylinder (28) pushes the push plate (29), the positioning plate (32) and the circuit board body (34) to move upward, and the circuit board body (34) and the pressing plate (39) clamp the copper foil roll (46) to complete pasting; When the second rack (35) continues to move upward, it drives the second gear (42), which drives the third rack (43) and the annular blade (55) to move downward, and cut the copper foil in contact with the outer wall of the circuit board body (34); after resetting, the annular blade (55) moves upward under the action of the third spring (41); S5. Glue recovery: After cutting, the rewinding roller (44) continuously rewinds the copper foil, and the inclined scraper (54) scrapes the glue remaining in the uncut parts into the collection tank (53) for recycling.

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