Integrated light source with good compatibility

Abstract

The invention relates to an integrated light source with good compatibility, which comprises a substrate and a plurality of chip sets arranged on the substrate, the substrate is provided with a power supply positive electrode bonding pad, a power supply negative electrode bonding pad, an LED bonding pad, a positive electrode connecting wire and a negative electrode connecting wire, and the LED bonding pad is composed of a main bonding pad and an extension bonding pad; the positive electrode and the negative electrode of each LED chip are respectively connected with one main bonding pad, and the adjacent extension bonding pads of the adjacent LED chips are connected through jumpers; the first LED chip of the chip set is connected with the positive electrode connecting line through a one-side extending bonding pad matched with a jumper wire, and the last LED chip of the chip set is connected with the negative electrode connecting line through a one-side extending bonding pad matched with a jumper wire. The number of the LED chips in the chipset can be flexibly defined, light sources of different series-parallel structures can be constructed, various driving voltages are compatible, substrates do not need to be independently manufactured according to different driving voltages, the product development period is greatly shortened, the substrates can be universally used for light sources of different models, the cost of purchase, production and manufacturing, logistics transportation and the like is reduced, and the production efficiency is improved. And the product has more competitive advantages.

Description

Technical Field

[0001] The present invention relates to the technical field of LED light sources, and in particular to an integrated light source with good compatibility. Background Art

[0002] COB packaging technology is divided into two types: upright and flip-chip, each with its own unique features. Upright COB packaging, where the LED chip is packaged in a normal position, features a relatively mature process and is relatively low-cost. Flip-chip COB packaging, on the other hand, is a more advanced packaging method that overcomes the limitations of traditional upright COB. Through a specific process design, the LED chip can be directly bonded to the PCB in an inverted position.

[0003] Although flip-chip COB has many advantages over regular COB, since flip-chip chips are electrically connected to the substrate through solder paste or other flux, electrode pads and connecting lines need to be made on the substrate through an etching process. Therefore, different substrates need to be matched for different driving power supplies and different circuit structure requirements. This will inevitably lead to complex and diverse substrate types, long production cycles, and high management costs. Summary of the Invention

[0004] In view of the above problems, the present invention discloses an integrated light source with good compatibility, which solves the problem in the prior art that flip-chip integrated light source substrates cannot be used universally.

[0005] The specific technical solutions are as follows:

[0006] An integrated light source with good compatibility comprises a substrate and several chip groups arranged on the substrate, wherein the substrate is provided with a dam, a positive power supply pad, a negative power supply pad, an LED pad, a positive connection line, and a negative connection line, wherein the positive connection line is connected to the positive power supply pad, and the negative connection line is connected to the negative power supply pad; the number of LED pads is several and evenly distributed within the dam, and each LED pad is composed of a main pad and an extended pad extending through a wire; LED chips are connected in series via jumpers to form several chip groups, the number of LED chips in each chip group is the same, the positive and negative poles of each LED chip are respectively connected to a main pad, and adjacent LED chips in each chip group are connected by jumpers to form a series connection by connecting two adjacent extended pads; the first LED chip in each chip group is connected to the positive connection line via an extended pad on one side thereof in combination with a jumper, and the last LED chip in each chip group is connected to the negative connection line via an extended pad on one side thereof in combination with a jumper.

[0007] Furthermore, the substrate is an aluminum substrate or a copper substrate.

[0008] Furthermore, the LED chip is a flip chip, and its positive and negative electrode pads are respectively located at two ends of the bottom of the LED chip and correspond to the positions of two main pads.

[0009] Furthermore, the plurality of LED pads are evenly distributed into a plurality of rows, and each row has a plurality of LED pads.

[0010] Furthermore, the number of extended pads in each of the LED pads is one or two, wherein the number of extended pads in the two outermost rows of LED pads is one and is distributed on one side of the main pad; the number of extended pads in the LED pads between the two outermost rows is two and is distributed on both sides of the main pad.

[0011] Furthermore, the main pad has a rectangular structure, and the extended pad has a circular structure.

[0012] Furthermore, the positive and negative connecting lines are arc-shaped and are arranged on both sides of the dam. Several positive extension lines and negative extension lines are respectively arranged horizontally on the positive and negative connecting lines. Each positive extension line and negative extension line is respectively located between two adjacent rows of LED pads, so that the first LED chip of each chip group is connected to the nearest positive extension line through an extension pad on one side thereof in combination with a jumper, and the last LED chip of each chip group is connected to the nearest negative connecting line through an extension pad on one side thereof in combination with a jumper.

[0013] Furthermore, the dam is filled with packaging glue and covers the LED chip, jumper, positive electrode connection line, positive electrode extension line, negative electrode connection line and negative electrode extension line. The packaging glue is silica gel, or a mixture of silica gel and phosphor.

[0014] Compared with the prior art, the above technical solutions adopted in this application have the following technical effects:

[0015] 1. This application can flexibly define the number of LED chips in the chipset, construct light sources with different series and parallel structures, and be compatible with various driving voltages. There is no need to produce separate substrates according to different driving voltages, which greatly shortens the product development cycle.

[0016] 2. This application can realize the universal substrate of different types of light sources, reduce the costs of procurement, production, manufacturing, logistics and transportation, and make the product more competitive. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural diagram of embodiment 1 of the present invention.

[0018] Figure 2 It is a structural schematic diagram of the substrate in the present invention.

[0019] Figure 3It is a structural diagram of embodiment 2 of the present invention.

[0020] Figure 4 It is a structural diagram of embodiment 3 of the present invention.

[0021] Explanation of the accompanying numbers: 1-substrate, 2-LED chip, 3-jumper, 4-dam, 5-packaging glue, 6-positive power pad, 7-negative power pad, 8-positive connecting wire, 81-positive extension wire, 9-negative connecting wire, 91-negative extension wire, 10-LED pad, 101-main pad, 102-extension pad. DETAILED DESCRIPTION

[0022] To make the technical solution of the present invention more clear and specific, the present invention is further described below with reference to the accompanying drawings. Any equivalent replacement of the technical features of the technical solution of the present invention and any solution derived from conventional reasoning shall fall within the scope of protection of the present invention. The fixed connection and fixed setting mentioned in the present invention are all common connection methods in the mechanical field, including welding, bolt and nut connection, and screw connection.

[0023] In the description of the present invention, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0024] Example 1

[0025] Please see the attached Figure 1-2 This embodiment provides an integrated light source with excellent compatibility, comprising a substrate 1 and several chipsets disposed on the substrate 1. A positive power pad 6 and a negative power pad 7 are provided at two diagonally opposite corners of the substrate 1, respectively. A dam 4 is provided in the middle of the substrate 1, within which are disposed LED pads 10, a positive connection line 8, and a negative connection line 9. One end of the positive connection line 8 extends outward and connects to the positive power pad 6, while one end of the negative connection line 9 extends outward and connects to the negative power pad 7. There are a plurality of evenly distributed LED pads 10, each consisting of a rectangular main pad 101 and a circular extension pad 102 extending from a conductive line.

[0026] The LED chips 2 are connected in series via jumpers 3 to form four chip groups. Each chip group contains ten LED chips. The positive and negative electrodes of each LED chip 2 are each connected to a main solder pad 101. The positive and negative electrodes of adjacent LED chips within each chip group are connected via jumpers 3 to connect two adjacent extended solder pads 102, thereby connecting the positive and negative electrodes of the two adjacent LED chips, thereby forming a series connection. Specifically, the positive electrode of the first LED chip 2 in each chip group is connected to the positive connection line 8 via an extended solder pad 102 on one side of the chip 2 in conjunction with a jumper 3. The extended solder pad 102 on the negative side of the first LED chip 2 is connected to the extended solder pad 102 on the positive side of the second LED chip 2 via a jumper 3. This continues until the negative electrode of the tenth LED chip 2 is connected to the negative connection line 9 via an extended solder pad 102 on one side of the chip 2 in conjunction with a jumper 3.

[0027] In this embodiment, the number of LED chips in each chipset is 10, and the operating voltage of a single blue LED chip is about 3.0V. Therefore, the voltage drop of the chipset is about 30.0V, which is suitable for a 30V driving voltage scenario.

[0028] In this embodiment, the substrate 1 is an aluminum substrate or a copper substrate, and the LED chip 2 is a blue flip chip, whose positive and negative electrode pads are respectively located at the two ends of the bottom of the LED chip 2 and correspond to the positions of two main pads 101.

[0029] In this embodiment, the LED pads 10 are evenly distributed in six rows, with 16, 14, and 10 LED pads 10 in each row, respectively. The number of LED pads 10 decreases from the center to the edge, for a total of 80. Each LED pad 10 has one or two extended pads 102. The two outermost rows of LED pads 10 each have one extended pad 102 located on one side of the main pad 101. The LED pads 10 located between the two outermost rows each have two extended pads 102 located on either side of the main pad 101.

[0030] In this embodiment, the positive and negative connecting wires 8 and 9 are arc-shaped and arranged on both sides of the dam 4. A plurality of positive extension wires 81 and negative extension wires 91 are transversely provided on the positive and negative connecting wires 8 and 9, respectively. Each positive extension wire 81 and negative extension wire 91 is located between two adjacent rows of LED solder pads 10, so that the first LED chip 2 in each chipset is connected to the nearest positive extension wire 81 via its side extension solder pad 102 in conjunction with a jumper wire 3, and the last LED chip 2 in each chipset is connected to the nearest negative connecting wire 9 via its side extension solder pad 102 in conjunction with a jumper wire 3. The jumper wire 3 can be a metal wire, a metal conductor, a 0-ohm resistor, or other conductive material.

[0031] In this embodiment, the dam 4 is filled with encapsulant 5 and covers the LED chip 2, jumper wire 3, positive electrode connection wire 8, positive electrode extension wire 81, negative electrode connection wire 9, and negative electrode extension wire 91. The encapsulant 5 is silicone or a mixture of silicone and phosphor.

[0032] Example 2

[0033] Please see the attached Figure 2 、 3 This embodiment differs from the first embodiment in that the number of LED chips in a single chipset is 12, and the number of chip groups is 3. The extended solder pad 102 on the anode side of the first LED chip 2 in each chipset is connected to the anode electrode line via a jumper wire 3. The extended solder pad 102 on the cathode side of the first LED chip 2 is connected to the extended solder pad 102 on the anode side of the second LED chip 2 via a jumper wire 3. This continues in this manner until the extended solder pad 102 on the cathode side of the twelfth LED chip 2 is connected to the cathode electrode line via a jumper wire 3.

[0034] In this embodiment, each chipset has 12 LED chips, so the voltage drop of the chipset is approximately 36V, which is suitable for a 36V driving voltage scenario.

[0035] Example 3

[0036] Please see the attached Figure 2 、 4 This embodiment differs from the first embodiment in that the number of LED chips in a single chipset is 8, and the number of chip groups is 5. The extended solder pad 102 on the anode side of the first LED chip 2 in each chipset is connected to the anode electrode line via a jumper wire 3. The extended solder pad 102 on the cathode side of the first LED chip 2 is connected to the extended solder pad 102 on the anode side of the second LED chip 2 via a jumper wire 3. This continues in this manner until the extended solder pad 102 on the cathode side of the eighth LED chip 2 is connected to the cathode electrode line via a jumper wire 3.

[0037] In this embodiment, each chipset has 8 LED chips, so the voltage drop of the chipset is approximately 24V, which is suitable for a 24V driving voltage scenario.

[0038] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. An integrated light source with good compatibility, characterized in that: The invention comprises a substrate (1) and a plurality of chip groups arranged on the substrate (1); the substrate (1) is provided with a dam (4), a positive power supply pad (6), a negative power supply pad (7), an LED pad (10), a positive connection line (8), and a negative connection line (9); the positive connection line (8) is connected to the positive power supply pad (6), and the negative connection line (9) is connected to the negative power supply pad (7); the LED pads (10) are in plurality and evenly distributed in the dam (4); each LED pad is composed of a main pad (101) and an extended pad (102) extending through a wire; the LED chips are connected in series via jumpers (3) Several chip groups are formed, the number of LED chips (2) in each chip group is the same, the positive electrode and the negative electrode of each LED chip (2) are respectively connected to a main soldering pad (101), and two adjacent extended soldering pads (102) are connected between adjacent LED chips (2) in each chip group via a jumper (3), thereby forming a series connection; the first LED chip (2) in each chip group is connected to the positive electrode connection line (8) via the extended soldering pad (102) on one side thereof in conjunction with the jumper (3), and the last LED chip (2) in each chip group is connected to the negative electrode connection line (9) via the extended soldering pad (102) on one side thereof in conjunction with the jumper (3).

2. The integrated light source with good compatibility as claimed in claim 1, characterized in that: The substrate (1) is an aluminum substrate or a copper substrate.

3. The integrated light source with good compatibility as claimed in claim 1, characterized in that: The LED chip (2) is a flip chip, and its positive and negative electrode pads are respectively located at the two ends of the bottom of the LED chip (2) and correspond to the positions of two main pads (101) therein.

4. The integrated light source with good compatibility as claimed in claim 1, characterized in that: The plurality of LED soldering pads (10) are evenly distributed in a plurality of rows, and each row has a plurality of LED soldering pads (10).

5. The integrated light source with good compatibility as claimed in claim 4, characterized in that: The number of the extended solder pads (102) in each of the LED solder pads (10) is one or two, wherein the number of the extended solder pads (102) in the two outermost rows of LED solder pads (10) is one and is distributed on one side of the main solder pad (101); and the number of the extended solder pads (102) in the LED solder pads (10) between the two outermost rows is two and is distributed on both sides of the main solder pad (101).

6. The integrated light source with good compatibility as claimed in claim 5, characterized in that: The main pad (101) has a rectangular structure, and the extended pad (102) has a circular structure.

7. The integrated light source with good compatibility as claimed in claim 4, characterized in that: The positive electrode connection line (8) and the negative electrode connection line (9) are arc-shaped and are arranged on both sides of the dam (4). A plurality of positive electrode extension lines (81) and negative electrode extension lines (91) are respectively arranged transversely on the positive electrode connection line (8) and the negative electrode connection line (9). Each positive electrode extension line (81) and each negative electrode extension line (91) are respectively located between two adjacent rows of LED solder pads (10), so that the first LED chip (2) of each chip group is connected to the nearest positive electrode extension line (81) through the extension solder pad (102) on one side thereof in conjunction with the jumper (3), and the last LED chip (2) of each chip group is connected to the nearest negative electrode connection line (9) through the extension solder pad (102) on one side thereof in conjunction with the jumper (3).

8. The integrated light source with good compatibility as claimed in claim 7, characterized in that: The dam (4) is filled with packaging glue (5) and covers the LED chip (2), the jumper (3), the positive electrode connecting wire (8), the positive electrode extension wire (81), the negative electrode connecting wire (9) and the negative electrode extension wire (91); the packaging glue (5) is silica gel, or a mixture of silica gel and phosphor.

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