Broken bridge aluminum door and window heat insulation strip and preparation method thereof

Abstract

The invention relates to the field of door and window materials, and particularly discloses a broken bridge aluminum door and window heat insulation strip and a preparation method thereof, and the broken bridge aluminum door and window heat insulation strip comprises the following raw materials: PA510 particles, PA10T, an antioxidant, an ultraviolet light absorber, glass fibers, a silane coupling agent and a heat-resistant modifier; wherein the heat-resistant modifier comprises silicon dioxide aerogel and a Peek-silicon dioxide composite modifier; the preparation method comprises the following steps: dissolving a silane coupling agent in an ethanol solution, adding glass fibers, dipping and drying to obtain pretreated glass fibers; pA510 particles and PA10T are mixed and stirred, an antioxidant, an ultraviolet light absorber, pretreated glass fibers and a heat-resistant modifier are sequentially added, a mixture is prepared after mixing and stirring, then the mixture is subjected to melt extrusion and then cooled and shaped, and the bridge-cutoff aluminum door and window heat insulation strip is prepared. The preparation method has the characteristics that the bio-based polyamide is used as the raw material to prepare the bridge-cutoff aluminum door and window heat insulation strip, the heat resistance is further improved, and meanwhile, the mechanical property is improved.

Description

Technical Field

[0001] The present application relates to the field of door and window materials, and more specifically, to a thermal insulation strip for a thermally broken aluminum door and window and a preparation method thereof. Background Art

[0002] With the continuous advancement of building energy-saving policies and people's increasing demand for living comfort, the thermal insulation performance of building doors and windows, as one of the most serious heat loss components of the building envelope, has become a key indicator of building energy efficiency. Aluminum alloy is widely used in the manufacture of door and window profiles due to its excellent strength, corrosion resistance, and processability. However, traditional aluminum alloy profiles have a high thermal conductivity (approximately 180 W / (m·K)). When there is a large temperature difference between indoor and outdoor, a significant thermal bridge effect is easily formed. This leads to rapid heat conduction, resulting in indoor energy loss and affecting the overall energy efficiency of the building.

[0003] To address these issues, "broken bridge aluminum" technology has been widely adopted in recent years. This technology involves placing a thermal insulation strip between aluminum alloy profiles, separating the indoor and outdoor metal profiles. This effectively blocks the heat conduction path and reduces the heat transfer coefficient. As a key component of the door and window system, the performance of the thermal insulation strip directly affects the thermal insulation, mechanical properties, and durability of the doors and windows.

[0004] Currently, commonly used insulation strip materials include PA66GF25 (a composite material of polyamide (PA66) and glass fiber). It has low thermal conductivity, good mechanical strength and aging resistance, and can meet the structural stability and service life requirements under normal use conditions. However, PA66GF25 is difficult to degrade and relies primarily on non-renewable resources such as petroleum. As global petroleum resources gradually deplete, there is a need to find renewable alternatives. Currently, some research and development has been carried out on bio-based polyamides. Their raw materials are partially or entirely derived from renewable resources, reducing dependence on petroleum and meeting the requirements of green building and sustainable development. As an environmentally friendly material, it shows broad application prospects in the field of insulation strips.

[0005] However, traditional bio-based polyamide insulation strips suffer from insufficient heat resistance and limited mechanical properties, making them unable to meet the comprehensive requirements of thermal insulation, structural strength, and environmental friendliness for high-end door and window systems. Therefore, developing a bio-based polyamide insulation strip that combines high heat resistance with excellent mechanical properties has become a current research hotspot. Summary of the Invention

[0006] In order to prepare thermal insulation strips for thermally broken aluminum doors and windows using bio-based polyamide as raw material, and further improve the heat resistance while improving its mechanical properties, the present application provides a thermal insulation strip for thermally broken aluminum doors and windows and a preparation method thereof.

[0007] In the first aspect, the present application provides a thermal insulation strip for thermally broken aluminum doors and windows, which adopts the following technical solution: A thermal insulation strip for thermally broken aluminum doors and windows, comprising the following raw materials in parts by weight: 50-60 parts of PA510 particles, 15-30 parts of PA10T, 0.1-0.5 parts of antioxidant, 0.5-1.5 parts of UV absorber, 10-20 parts of glass fiber, 3-5 parts of silane coupling agent and 3-8 parts of heat-resistant modifier; The heat-resistant modifier includes silica aerogel and Peek-silica composite modifier in a mass ratio of 1:(1.4-1.6). The Peek-silica composite modifier uses silica loaded with Peek powder as the core material and a polymer layer formed by polymerization of ‌ N-hydroxyethyl acrylamide, acrylic acid, and methacrylate monomers as the shell layer.

[0008] By adopting the above technical solution, PA510 and PA10T are used as bio-based polyamide materials in this application. PA510 has good toughness and low water absorption, and PA10T has excellent heat resistance, dimensional stability and chemical corrosion resistance. The combination of the two takes into account both heat resistance and mechanical properties. The antioxidant prevents the oxidative degradation of polyamide during processing and use. The addition of ultraviolet absorbers can absorb ultraviolet rays and protect the polyamide from aging caused by ultraviolet radiation.

[0009] On this basis, the present application adds silica aerogel as a heat-resistant modifier. Silica aerogel has a low thermal conductivity, which effectively improves the thermal insulation performance of the insulation strip and significantly improves the heat resistance of the insulation strip. The addition of Peek-silica composite modifier utilizes the excellent heat resistance, mechanical strength and chemical stability of polyetheretherketone Peek. Using it as a heat-resistant modifier significantly improves its heat resistance and mechanical properties, especially its improvement of the brittleness and low strength of silica aerogel. After the Peek powder is loaded on silica as the core material, it is in situ polymerized to form a core-shell structure of the polymer layer, which significantly improves the compatibility and interfacial bonding between the composite modifier and the polyamide matrix. Finally, silica aerogel and Peek-silica composite modifiers were selected as heat-resistant modifiers in this application. Silica aerogel improves the thermal insulation performance, and the Peek-silica composite modifier significantly improves its heat resistance and mechanical properties through the joint action of the core material. The shell material significantly improves its compatibility with the polyamide matrix. Combined with the addition of silane coupling agent, the compatibility and interfacial bonding between the heat-resistant modifier and the matrix are further improved, while also improving the interfacial bonding between the glass fiber and the matrix, ultimately improving the heat resistance and mechanical properties of the thermal insulation strip, especially maintaining excellent mechanical properties under long-term high temperature conditions, thereby improving the durability of the thermal insulation strip.

[0010] Optionally, the Peek-silica composite modifier is prepared by the following method: 1) Mix Peek powder and diphenyl sulfone, heat to 200-220°C, stir and mix to obtain an impregnation solution, then add silica and perform pressure impregnation treatment, then cool and filter to obtain Peek-loaded silica; The loaded silica is mixed with hydroxyethyl cellulose and water to prepare a mixed solution, vinyl triethoxysilane is added to the mixed solution, the pH is adjusted to acidic, the immersion treatment is continued for 30-40 minutes, and then the solution is filtered and dried to prepare pretreated silica; 2) Mix N-hydroxyethyl acrylamide, acrylic acid and methacrylate monomers and dissolve them in an ethanol aqueous solution. Then add an initiator and then add the pretreated silica prepared in step 1). Heat to 55-65° C. and react for 2-3 hours. Then cool, filter and dry to obtain a Peek-silica composite modifier.

[0011] By adopting the above technical solution, in the present application, Peek and diphenyl sulfone are first mixed at high temperature to achieve the dissolution of Peek powder, and then silica is added and impregnated under pressure to achieve the loading of Peek powder in the pore structure of silica. Then, vinyl triethoxy silane is added to the silica loaded with Peek in a solution containing hydroxyethyl cellulose. Hydroxyethyl cellulose, as an anti-settling agent, helps to suspend the loaded silica in water. After adding vinyl triethoxy silane and adjusting the pH to acidic, vinyl triethoxy silane is hydrolyzed under acidic conditions to form chemical bonds with the hydroxyl groups on the surface of silica and the hydroxyl groups on the end faces of Peek powder, introducing carbon-carbon double bonds to provide reaction sites for subsequent in situ polymerization, thereby preparing pretreated silica. Then it is added to the monomer solution, and the N-hydroxyethyl acrylamide, acrylic acid and methacrylate monomers react through unsaturated double bonds and polymerize with the vinyl groups on the surface of the pretreated silica, thereby realizing in situ polymerization. In addition, the hydroxyl groups on the surface of the silica can also react with the carboxyl groups in monomers such as acrylic acid, thereby guiding the polymerization of the monomers, realizing in situ polymerization, and introducing amide groups and functional groups such as carboxyl groups into the polymer layer. The amide groups and carboxyl groups and other functional groups interact with polyamide through hydrogen bonds and other effects, which significantly improve the compatibility and interfacial bonding strength with the polyamide matrix, thereby achieving uniform distribution of the composite modifier in the polyamide matrix, thereby achieving better improvement in heat resistance and mechanical properties.

[0012] Optionally, when preparing the Peek-silica composite modifier, the mass ratio of Peek powder to silica in step 1) is 1:(1.5-1.8), the amount of hydroxyethyl cellulose added is 1-3wt% of the silica, and the amount of vinyltriethoxysilane added is 5-10wt% of the loaded silica; In step 2), the addition mass ratio of N-hydroxyethyl acrylamide, acrylic acid and methacrylate is 1: (0.5-0.8): (0.6-0.8), and the addition mass ratio of the sum of N-hydroxyethyl acrylamide, acrylic acid and methacrylate monomers to pretreated silica is 1: (1.1-1.3), and the addition amount of the initiator is 1-3wt% of the sum of N-hydroxyethyl acrylamide, acrylic acid and methacrylate monomers.

[0013] By adopting the above technical solution and selecting the above ratio to prepare the composite modifier for use in the preparation of thermal insulation strips, the comprehensive performance of the thermal insulation strips is ultimately better.

[0014] Optionally, when preparing the Peek-silica composite modifier, the pressure impregnation parameters in step 1) are: impregnation pressure of 0.5-0.8 MPa, and impregnation time of 1-2 h.

[0015] By adopting the above technical solution, when high-pressure impregnation is used for the impregnation treatment, it helps to promote the diffusion of Peek into the pores of silica, thereby helping to increase the loading effect of Peek powder and achieve better heat resistance and mechanical properties.

[0016] Optionally, when preparing the Peek-silica composite modifier, in step 1), the Peek powder in step 1) is added after being treated with oxygen plasma, and PAMAM, genipin and γ-aminopropyltrimethoxysilane are also added at the same time as vinyltriethoxysilane is added in step 1).

[0017] Optionally, the addition mass ratio of γ-aminopropyltrimethoxysilane to vinyltriethoxysilane is 1:(2-3), the addition amount of genipin is 0.3-0.8wt% of silica, and the addition amount of PAMAM is 1-3wt% of silica.

[0018] By adopting the above technical solution, the Peek powder is treated with oxygen plasma and then activated to a certain extent, and oxygen-containing active groups such as carboxyl groups are introduced. At the same time, when PAMAM, genipin and γ-aminopropyltrimethoxysilane are added, under acidic and elevated temperature conditions, the amino group in PAMAM can form a chemical bond with the carboxyl oxygen-containing functional group on the Peek powder, and γ-aminopropyltrimethoxysilane forms a chemical bond with silica as a silane coupling agent. Genipin can also cross-link the above-mentioned introduced amino or amide functional groups, thereby improving the chemical bonding between the Peek powder and silica, improving the load fastness, and preventing losses during subsequent in-situ polymerization.

[0019] Optionally, the plasma parameters are as follows: treating the Peek powder at a power of 120-150 W and an oxygen flow rate of 50-80 sccm for 1-3 minutes.

[0020] Optionally, the silica aerogel is added after being modified, and the modification process is specifically as follows: the silica aerogel is first immersed in an ethanol aqueous solution of vinyltriethoxysilane, and then maleic anhydride-styrene copolymer is added, reacted at 55-70° C. for 30-40 minutes, and then filtered and dried.

[0021] By adopting the above technical solution, vinyl triethoxysilane is hydrolyzed and reacts with the hydroxyl groups on the surface of the silica aerogel, introducing vinyl groups into the surface of the silica aerogel. On the one hand, its hydrophobicity is improved, and it forms van der Waals forces with the alkyl chains in the polyamide matrix, thereby enhancing the interfacial bonding strength. Moreover, its free rotation specifically adapts it to the high-temperature molecular chain movement of the polyamide matrix, reduces interfacial stress concentration, and improves its heat resistance. In addition, it may also form chemical bonds with the unreacted groups in the Peek-silica composite modifier, so that the heat-resistant modifier forms a macromolecular chain structure, further improving its heat resistance. Then, after adding the maleic anhydride-styrene copolymer, the maleic anhydride unit can react with the hydroxyl groups on the surface of the silica aerogel to form a chemical polymerization, and can also form a chemical bond with the amino group at the end of the polyamide matrix. At the same time, the styrene chain segment can have good compatibility with the non-polar parts of PA510 and PA10T, forming a good interface transition layer between the silica aerogel and the polyamide matrix, reducing interface defects, and enabling the silica aerogel to form a good interface bonding with the polyamide matrix, thereby improving compatibility, thereby improving dispersion uniformity, and playing a good role in thermal insulation modification.

[0022] Optionally, during the modification treatment of the silica aerogel, the amount of vinyltriethoxysilane added is 3-5 wt % of the silica aerogel, and the amount of maleic anhydride-styrene copolymer added is 5-10 wt % of the silica aerogel.

[0023] In a second aspect, the present application provides a method for preparing thermal insulation strips for thermally broken aluminum doors and windows, using the following technical solution: A method for preparing a thermal insulation strip for a thermally broken aluminum door or window comprises the following steps: The silane coupling agent is dissolved in 2-3 times the mass of an ethanol solution, and then added to the glass fiber, immersed for 30-60 minutes, and then dried to prepare a pretreated glass fiber; PA510 particles and PA10T are mixed and stirred, and then antioxidants, ultraviolet absorbers, pretreated glass fibers and heat-resistant modifiers are added in sequence, and mixed and stirred to obtain a mixture. The mixture is then melt-extruded and cooled to form a thermal insulation strip for thermally broken aluminum doors and windows.

[0024] By adopting the above technical solution, the above method is selected to prepare the thermal insulation strip, which is simple, convenient and easy to realize industrialization.

[0025] In summary, this application has the following beneficial effects: 1. Silica aerogel is added as a heat-resistant modifier in this application. Silica aerogel has a low thermal conductivity, which effectively improves the thermal insulation performance of the insulation strip and significantly improves the heat resistance of the insulation strip. The addition of the Peek-silica composite modifier utilizes the excellent heat resistance, mechanical strength and chemical stability of polyetheretherketone Peek. Its use as a heat-resistant modifier significantly improves its heat resistance and mechanical properties, especially the brittleness and low strength of the silica aerogel. Peek powder is loaded on silica as a core material and then in-situ polymerized to form a core-shell structure of the polymer layer, which significantly improves the compatibility and interfacial bonding between the composite modifier and the polyamide matrix. 2. In this application, silica aerogel and Peek-silica composite modifier are selected as heat-resistant modifiers. Silica aerogel improves the thermal insulation performance, and the Peek-silica composite modifier significantly improves its heat resistance and mechanical properties through the joint action of the core material. The shell material significantly improves its compatibility with the polyamide matrix. Combined with the addition of silane coupling agent, the compatibility and interfacial bonding between the heat-resistant modifier and the matrix are further improved, while the interfacial bonding between the glass fiber and the matrix can also be improved, ultimately improving the heat resistance and mechanical properties of the thermal insulation strip, especially maintaining excellent mechanical properties under long-term high temperature conditions, thereby improving the durability of the thermal insulation strip. DETAILED DESCRIPTION

[0026] The present application is further described in detail below with reference to the examples. It is particularly noted that if no specific conditions are specified in the following examples, the reactions are carried out according to conventional conditions or the conditions recommended by the manufacturer. Unless otherwise specified, the raw materials used in the following examples can be obtained from common commercial sources.

[0027] In the following examples, PA510 particles were selected from bio-based nylon 510 from Shanghai Likas Industrial Co., Ltd. PA10T uses Evonik Htplus M3035 environmentally friendly PA10T with model M3035 from Dongguan Tianzhihong Plastic Chemical Co., Ltd. The silica aerogel used was Cabot ENOVA IC3100 silica aerogel from Yinhuang (Shanghai) Industrial Co., Ltd. The maleic anhydride-styrene copolymer is a maleic anhydride-styrene copolymer produced by Hubei Huada Fine Chemical Co., Ltd., with a CAS number of 9011-13-6.

[0028] The silica used in the following preparation examples is macroporous silica with a pore size of >50 nm. More specifically, the silica is 120A macroporous silica from Rizhao Kepnuo New Materials Co., Ltd., with a particle size of 80-150 mesh. Peek powder is made of ultrafine Peek powder with a particle size of 10-15 microns produced by Dongguan Kadar Plastic Raw Materials Co., Ltd.

[0029] The following preparation example is the preparation example of Peek-silica composite modifier Preparation Example 1 A method for preparing a Peek-silicon dioxide composite modifier comprises the following steps: 1) Using 10 kg of silica as the treatment basis, Peek powder and diphenyl sulfone were mixed in a mass ratio of 1:7, heated to 210°C, stirred and mixed to prepare an impregnation solution, and then silica was added and pressurized for 1.5 hours. The impregnation pressure was 0.6 MPa, and the added mass ratio of Peek powder to silica was 1:1.6. Then, the mixture was cooled and filtered to obtain Peek-loaded silica. The loaded silica was mixed with hydroxyethyl cellulose and water to prepare a mixed solution, vinyl triethoxysilane was added to the mixed solution, the pH was adjusted to 4.5, and the solution was immersed at 50° C. and normal pressure for 35 minutes, and then filtered and dried to prepare pretreated silica; The amount of hydroxyethyl cellulose added is 2 wt % of the loaded silica, the amount of water added is 3.5 times the mass of silica, and the amount of vinyl triethoxysilane added is 8 wt % of the loaded silica. 2) N-hydroxyethyl acrylamide, acrylic acid, and methacrylate monomers were mixed in a mass ratio of 1:0.6:0.7 to prepare a mixed monomer, which was then dissolved in a 35% ethanol aqueous solution, and then ammonium persulfate as an initiator was added, followed by the addition of the pretreated silica prepared in step 1), and the mixture was heated to 60° C. for reaction for 2.5 hours, and then cooled, filtered, and dried to prepare a Peek-silica composite modifier; The mass ratio of the mixed monomer to the pretreated silica was 1:1.2, and the amount of the initiator added was 2 wt % of the mixed monomer.

[0030] Preparation Example 2 A method for preparing a Peek-silicon dioxide composite modifier comprises the following steps: 1) Peek powder and diphenyl sulfone were mixed in a mass ratio of 1:6, heated to 200°C, stirred and mixed to obtain an impregnation solution, and then silica was added and pressurized for 1 hour. The impregnation pressure was 0.5 MPa, and the mass ratio of Peek powder to silica was 1:1.5. The mixture was then cooled and filtered to obtain Peek-loaded silica. The loaded silica was mixed with hydroxyethyl cellulose and water to prepare a mixed solution, vinyl triethoxysilane was added to the mixed solution, the pH was adjusted to 4, and the solution was immersed at 55° C. and normal pressure for 30 minutes, and then filtered and dried to prepare pretreated silica; The amount of hydroxyethyl cellulose added is 1wt% of the loaded silica, the amount of water added is 3 times the mass of silica, and the amount of vinyl triethoxysilane added is 5wt% of the loaded silica. 2) N-hydroxyethyl acrylamide, acrylic acid, and methacrylate monomers were mixed in a mass ratio of 1:0.5:0.6 to prepare a mixed monomer, which was then dissolved in a 30% ethanol aqueous solution, and then ammonium persulfate as an initiator was added, followed by the addition of the pretreated silica prepared in step 1), and the mixture was heated to 55° C. for reaction for 3 h, and then cooled, filtered, and dried to prepare a Peek-silica composite modifier; The mass ratio of the mixed monomer to the pretreated silica was 1:1.1, and the amount of the initiator added was 1 wt % of the mixed monomer.

[0031] Preparation Example 3 A method for preparing a Peek-silicon dioxide composite modifier comprises the following steps: 1) Using 10 kg of silica as the treatment basis, Peek powder and diphenyl sulfone were mixed in a mass ratio of 1:8, heated to 220°C, stirred and mixed to prepare an impregnation solution, and then silica was added and pressurized for 2 hours. The impregnation pressure was 0.8 MPa, and the added mass ratio of Peek powder to silica was 1:1.8. Then, the solution was cooled and filtered to obtain Peek-loaded silica. The loaded silica was mixed with hydroxyethyl cellulose and water to prepare a mixed solution, vinyl triethoxysilane was added to the mixed solution, the pH was adjusted to 5, and the mixture was immersed in the solution at 45°C and normal pressure for 40 minutes, and then filtered and dried to prepare pretreated silica; The amount of hydroxyethyl cellulose added is 3wt% of the loaded silica, the amount of water added is 4 times the mass of silica, and the amount of vinyl triethoxysilane added is 10wt% of the loaded silica. 2) N-hydroxyethyl acrylamide, acrylic acid, and methacrylate monomers were mixed in a mass ratio of 1:0.8:0.8 to prepare a mixed monomer, and the mixed monomer was dissolved in a 40% ethanol aqueous solution, and then an initiator, ammonium persulfate, was added, and then the pretreated silica prepared in step 1) was added, and the temperature was raised to 65° C. to react for 2 hours, and then cooled, filtered, and dried to prepare a Peek-silica composite modifier; The mass ratio of the mixed monomer to the pretreated silica was 1:1.3, and the amount of the initiator added was 3 wt % of the mixed monomer.

[0032] Preparation Example 4 A method for preparing a Peek-silica composite modifier is carried out according to the method in Preparation Example 1, except that in step 1), the Peek powder is treated with oxygen plasma at a power of 140 W and an oxygen flow rate of 60 sccm for 2 minutes before being added; In step 1), PAMAM, genipin and γ-aminopropyltrimethoxysilane are added at the same time as vinyltriethoxysilane. The mass ratio of γ-aminopropyltrimethoxysilane to vinyltriethoxysilane is 1:2.5, the amount of genipin added is 0.5wt% of silica, and the amount of PAMAM added is 2wt% of silica.

[0033] Preparation Example 5 A method for preparing a Peek-silica composite modifier is carried out according to the method of Preparation Example 1, except that in step 1), the Peek powder is treated with oxygen plasma at a power of 120 W and an oxygen flow rate of 50 sccm for 3 minutes before being added; In step 1), PAMAM, genipin and γ-aminopropyltrimethoxysilane are added at the same time as vinyltriethoxysilane. The mass ratio of γ-aminopropyltrimethoxysilane to vinyltriethoxysilane is 1:2, the amount of genipin added is 0.3wt% of silica, and the amount of PAMAM added is 1wt% of silica.

[0034] Preparation Example 6 A method for preparing a Peek-silica composite modifier is carried out according to the method of Preparation Example 1, except that in step 1), the Peek powder is treated with oxygen plasma at a power of 150 W and an oxygen flow rate of 80 sccm for 1 minute before being added; In step 1), PAMAM, genipin and γ-aminopropyltrimethoxysilane are added at the same time as vinyltriethoxysilane. The mass ratio of γ-aminopropyltrimethoxysilane to vinyltriethoxysilane is 1:3, the amount of genipin added is 0.8wt% of silica, and the amount of PAMAM added is 3wt% of silica.

[0035] Preparation Example 7 A method for preparing a Peek-silica composite modifier is carried out according to the method in Preparation Example 4, except that PAMAM is not added.

[0036] Preparation Example 8 A method for preparing a Peek-silica composite modifier is carried out according to the method of Preparation Example 4, except that in step 1), the Peek powder is treated with oxygen plasma at a power of 140 W and an oxygen flow rate of 60 sccm for 2 minutes before being added. PAMAM, genipin, and γ-aminopropyltrimethoxysilane are not added.

[0037] Comparative Preparation Example 1 A method for preparing a Peek-silica composite modifier is carried out according to the method in Preparation Example 4, except that step 2) is not performed, and an equal amount of vinyltriethoxysilane in step 1) is replaced by KH-550.

[0038] Comparative Preparation Example 2 A method for preparing a Peek-silica composite modifier is carried out according to the method in Preparation Example 4, except that N-hydroxyethyl acrylamide is not added to the mixed monomers in step 2).

[0039] Example 1

[0040] A method for preparing a thermal insulation strip for a thermally broken aluminum door or window comprises the following steps: S1, 4kg of silane coupling agent KH-550 was dissolved in 2.5 times the mass concentration of 45% ethanol solution, the pH was adjusted to 4, and then 15kg of glass fiber was added and immersed for 40min, and then filtered and dried to obtain pretreated glass fiber; S2. Place 55kg of PA510 particles and 22kg of PA10T in a high-speed mixer and stir at a speed of 1000 r / min for 8 minutes. Then, add 0.3kg of antioxidant 1010, 1kg of ultraviolet absorber (specifically, ultraviolet absorber UV-234), the pretreated glass fiber prepared in S1, and 5kg of heat-resistant modifier to the high-speed mixer in sequence. Continue mixing and stirring for 12 minutes to obtain a mixture. Then, add the mixture into a screw extruder for melt extrusion, and then cool and shape it to obtain thermal insulation strips for broken bridge aluminum doors and windows.

[0041] Among them, the temperature of each zone of the screw extruder is: 190℃ in zone 1, 220℃ in zone 2, 240℃ in zone 3, and 250℃ in the die head.

[0042] The heat-resistant modifier includes a mixture of silica aerogel and Peek-silica composite modifier in a mass ratio of 1:1.5, and the Peek-silica composite modifier is the Peek-silica composite modifier prepared in Preparation Example 1.

[0043] Example 2

[0044] A method for preparing a thermal insulation strip for a thermally broken aluminum door or window comprises the following steps: S1, 3kg of silane coupling agent KH-550 was dissolved in 2 times the mass concentration of 40% ethanol solution, the pH was adjusted to 4, and then 10kg of glass fiber was added and immersed for 30min, and then filtered and dried to obtain pretreated glass fiber; S2. Place 50kg of PA510 particles and 15kg of PA10T in a high-speed mixer and stir at a speed of 800 r / min for 10 minutes. Then, add 0.1kg of antioxidant 1010, 0.5kg of ultraviolet absorber (specifically, ultraviolet absorber UV-234), the pretreated glass fiber prepared in S1, and 3kg of heat-resistant modifier to the high-speed mixer in sequence. Continue mixing and stirring for 10 minutes to obtain a mixture. Then, add the mixture into a screw extruder for melt extrusion, and then cool and shape it to obtain thermal insulation strips for broken bridge aluminum doors and windows.

[0045] Among them, the temperature of each zone of the screw extruder is: 180℃ in zone 1, 210℃ in zone 2, 230℃ in zone 3, and 240℃ in the die head.

[0046] The heat-resistant modifier includes a mixture of silica aerogel and Peek-silica composite modifier in a mass ratio of 1:1.4, and the Peek-silica composite modifier is the Peek-silica composite modifier prepared in Preparation Example 2.

[0047] Example 3

[0048] A method for preparing a thermal insulation strip for a thermally broken aluminum door or window comprises the following steps: S1, 5kg of silane coupling agent KH-550 was dissolved in 3 times the mass concentration of 50% ethanol solution, the pH was adjusted to 5, and then 20kg of glass fiber was added and immersed for 60min, and then filtered and dried to obtain pretreated glass fiber; S2. Place 60kg of PA510 particles and 30kg of PA10T in a high-speed mixer and stir at a speed of 1200 r / min for 5 minutes. Then, add 0.5kg of antioxidant 1010, 1.5kg of ultraviolet absorber (specifically ultraviolet absorber UV-234), the pretreated glass fiber prepared in S1, and 8kg of heat-resistant modifier to the high-speed mixer in sequence. Continue mixing and stirring for 15 minutes to obtain a mixture. Then, add the mixture into a screw extruder for melt extrusion, and then cool and shape it to obtain thermal insulation strips for broken bridge aluminum doors and windows.

[0049] Among them, the temperature of each zone of the screw extruder is: 200℃ in zone 1, 230℃ in zone 2, 250℃ in zone 3, and 260℃ in the die head.

[0050] The heat-resistant modifier includes a mixture of silica aerogel and Peek-silica composite modifier in a mass ratio of 1:1.6, and the Peek-silica composite modifier is the Peek-silica composite modifier prepared in Preparation Example 3.

[0051] Examples 4-8 A method for preparing a thermal insulation strip for a thermally broken aluminum door and window is carried out according to the method in Example 1, except that the Peek-silicon dioxide composite modifier in step S2 is the Peek-silicon dioxide composite modifier prepared in Preparation Examples 4-8, respectively.

[0052] Example 9

[0053] A method for preparing a thermal insulation strip for a broken-bridge aluminum door and window is carried out according to the method in Example 1, except that the silica aerogel in the heat-resistant modifier in step S2 is added after modification. The specific operation is as follows: vinyl triethoxysilane and a 30% ethanol solution are mixed in a mass ratio of 1:4, and the silica aerogel is added for impregnation. After the impregnation treatment for 25 minutes, maleic anhydride-styrene copolymer is added, reacted at 60°C for 35 minutes, and then filtered and dried to prepare the modified silica aerogel, which is added according to the method in Example 1.

[0054] The amount of vinyl triethoxysilane added is 4 wt % of the silica aerogel, and the amount of maleic anhydride-styrene copolymer added is 8 wt % of the silica aerogel.

[0055] Example 10

[0056] A method for preparing a thermal insulation strip for a thermally broken aluminum door and window is carried out according to the method in Example 1, except that the silica aerogel in the heat-resistant modifier in step S2 is added after modification. The specific operation is as follows: vinyl triethoxysilane and a 30% ethanol solution are mixed in a mass ratio of 1:4, and the silica aerogel is added for impregnation. After the impregnation treatment for 20 minutes, maleic anhydride-styrene copolymer is added, and the mixture is reacted at 55°C for 40 minutes, filtered and dried, and the modified silica aerogel is added according to the method in Example 1.

[0057] The amount of vinyl triethoxysilane added is 3 wt % of the silica aerogel, and the amount of maleic anhydride-styrene copolymer added is 5 wt % of the silica aerogel.

[0058] Example 11

[0059] A method for preparing a thermal insulation strip for a broken-bridge aluminum door and window is carried out according to the method in Example 1, except that the silica aerogel in the heat-resistant modifier in step S2 is added after modification. The specific operation is as follows: vinyl triethoxysilane and a 30% ethanol solution are mixed in a mass ratio of 1:4, and the silica aerogel is added for impregnation. After the impregnation treatment for 30 minutes, maleic anhydride-styrene copolymer is added, and the mixture is reacted at 70°C for 30 minutes, filtered and dried, and the modified silica aerogel is added according to the method in Example 1.

[0060] The amount of vinyltriethoxysilane added is 5 wt % of the silica aerogel, and the amount of maleic anhydride-styrene copolymer added is 10 wt % of the silica aerogel.

[0061] Example 12

[0062] A method for preparing thermal insulation strips for thermally broken aluminum doors and windows is carried out according to the method in Example 9, except that no maleic anhydride-styrene copolymer is added during the modification treatment of the silica aerogel, and an equal amount of vinyltriethoxysilane is replaced with KH-550, specifically: KH-550 was mixed with a 30% ethanol solution in a mass ratio of 1:4, and then the silica aerogel was added for impregnation. After impregnation for 60 minutes, the mixture was filtered and dried to prepare modified silica aerogel. The modified silica aerogel was added according to the method in Example 1, wherein the amount of KH-550 added was 4 wt% of the silica aerogel.

[0063] Comparative Example 1-2 A method for preparing a thermal insulation strip for a thermally broken aluminum door and window is carried out according to the method in Example 1, except that the Peek-silicon dioxide composite modifier in step S2 is the Peek-silicon dioxide composite modifier prepared in Comparative Preparation Examples 1-2.

[0064] Comparative Example 3 A method for preparing a thermal insulation strip for a thermally broken aluminum door and window is carried out according to the method in Example 1, except that in step S2, an equal amount of Peek-silicon dioxide composite modifier is replaced by Peek powder.

[0065] Comparative Example 4 A method for preparing a thermal insulation strip for a thermally broken aluminum door and window is carried out according to the method in Example 1, except that the Peek-silicon dioxide composite modifier in step S2 is replaced by an equal amount of a mixture of Peek powder and silicon dioxide, and the added mass ratio of Peek powder to silicon dioxide is 1:1.6.

[0066] Comparative Example 5 A method for preparing a thermal insulation strip for a thermally broken aluminum door and window is carried out according to the method in Example 1, except that the heat-resistant modifier in step S2 is silica aerogel.

[0067] Comparative Example 6 A method for preparing thermal insulation strips for thermally broken aluminum doors and windows is carried out according to the method in Example 1, except that the Peek-silica composite modifier in step S2 is replaced by a silica modifier in equal amounts, the silica modifier is prepared according to the method in Preparation Example 1, and the loaded silica in step 1) is replaced by silica in equal amounts.

[0068] Performance testing The thermal insulation strips prepared in the above examples and comparative examples were tested for tensile strength according to GB / T 1040.2-2006 "Test Method for Tensile Properties of Plastics" at a tensile rate of 50 mm / min; and for flexural strength according to GB / T 9341-2008 "Determination of Flexural Properties of Plastics" at a flexural strength test rate of 20 mm / min. The test results are shown in Table 1.

[0069] In addition, the thermal insulation strips prepared in the above embodiments and comparative examples were placed in a heat aging test chamber and subjected to accelerated aging test at 150°C for 500 hours. The mechanical property retention rate before and after heat aging was tested to detect its heat resistance. The test results are shown in Table 1 below.

[0070] Table 1:

[0071] Combined with the test results in Table 1 above, in the embodiment of the present application, Peek is loaded on silica and then in situ polymerized to form a core-shell structure. The thermal insulation strip prepared by using silica aerogel as a heat-resistant modifier has excellent mechanical properties, and the mechanical properties remain excellent after heat aging treatment. It has good heat resistance and maintains excellent mechanical properties under long-term high temperature conditions to meet the comprehensive needs of high-end door and window systems.

[0072] Referring to the test results of Example 1 and Examples 4-6, it can be seen that when Peek is loaded on silica, Peek is introduced with active groups after plasma treatment, and when its surface is modified, aminosilane coupling agent, PAMAM and genipin are also introduced. The introduction of the above substances can introduce functional groups such as amino groups on the surface of silica, and then further in situ polymerize with subsequent monomers and form a cross-linked structure through genipin, which can further significantly improve the mechanical properties and heat resistance of the thermal insulation strip; combined with the test results of Example 7 and Example 8, when Peek is loaded on silica without adding PAMAM, its mechanical properties are reduced and its heat resistance is also reduced. The addition of PAMAM can introduce macromolecular amino groups, and when cross-linked with amide through genipin, a three-dimensional macromolecular network structure can be formed, further improving its performance. In Example 8, when Peek was only plasma treated to introduce active functional groups without introducing macromolecular amino molecules and other structures, its mechanical properties and heat resistance were reduced.

[0073] Combining the test results of Example 1 with those of Examples 9-11, it can be seen that the mechanical properties and heat resistance of the thermal insulation strip can be further improved after the silica aerogel is modified. Combining the test results of Example 12, when the silica aerogel is treated only with an aminosilane coupling agent, its mechanical properties and heat resistance are reduced compared to Example 9. Combining the test results of Example 1 with those of Comparative Examples 1-2, in Comparative Example 1, when Peek powder is loaded on silica and treated with a common silane coupling agent without in-situ polymerization, its heat resistance and mechanical properties are reduced. The formation of a core-shell structure significantly improves its compatibility with the polyamide system. Combining the performance of Comparative Example 2 when no N-hydroxyethyl acrylamide is added to the mixed monomer, it is also reduced. The introduction of amide groups significantly improves its desirability and thus improves its mechanical properties and heat resistance.

[0074] Combined with the test results of Example 1 and Comparative Example 3, it can be seen that when silica aerogel and Peek powder are used as heat-resistant modifiers, when Peek powder is directly added, the agglomeration of Peek powder and compatibility with polyamide lead to a significant decrease in its heat resistance and mechanical properties; when Peek powder and silica are directly mixed and added in Comparative Example 4, its mechanical properties and heat resistance are also significantly reduced. Combined with the use of only silica aerogel as a heat-resistant modifier in Comparative Example 5, its performance is significantly reduced. When silica aerogel and Peek-silica composite modifier are combined, its mechanical properties and heat resistance are significantly improved. Combined with the test results of Comparative Example 6, when silica is in situ polymerized to form a core-shell structure and unloaded Peek is added, its performance is also significantly reduced. In this application, Peek-silica composite modifier and modified silica aerogel are used as heat-resistant modifiers to significantly improve the mechanical properties and heat resistance of the thermal insulation strips of broken bridge aluminum doors and windows.

[0075] This specific embodiment is merely an explanation of the present application and is not a limitation of the present application. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but as long as they are within the scope of the claims of the present application, they are protected by the patent law.

Claims

1. A thermal insulation strip for thermally broken aluminum doors and windows, characterized in that: It includes the following raw materials in parts by weight: 50-60 parts of PA510 particles, 15-30 parts of PA10T, 0.1-0.5 parts of antioxidant, 0.5-1.5 parts of UV absorber, 10-20 parts of glass fiber, 3-5 parts of silane coupling agent and 3-8 parts of heat-resistant modifier; The heat-resistant modifier includes silica aerogel and Peek-silica composite modifier in a mass ratio of 1:(1.4-1.6). The Peek-silica composite modifier uses silica loaded with Peek powder as the core material and a polymer layer formed by polymerization of ‌ N-hydroxyethyl acrylamide, acrylic acid, and methacrylate monomers as the shell layer.

2. The thermal insulation strip for thermally broken aluminum doors and windows according to claim 1, characterized in that: The Peek-silicon dioxide composite modifier is prepared by the following method: 1) Mix Peek powder and diphenyl sulfone, heat to 200-220°C, stir and mix to obtain an impregnation solution, then add silica and perform pressure impregnation treatment, then cool and filter to obtain Peek-loaded silica; The loaded silica is mixed with hydroxyethyl cellulose and water to prepare a mixed solution, vinyl triethoxysilane is added to the mixed solution, the pH is adjusted to acidic, the immersion treatment is continued for 30-40 minutes, and then the solution is filtered and dried to prepare pretreated silica; 2) Mix N-hydroxyethyl acrylamide, acrylic acid and methacrylate monomers and dissolve them in an ethanol aqueous solution. Then add an initiator and then add the pretreated silica prepared in step 1). Heat to 55-65° C. and react for 2-3 hours. Then cool, filter and dry to obtain a Peek-silica composite modifier.

3. The thermal insulation strip for thermally broken aluminum doors and windows according to claim 2, characterized in that: When preparing the Peek-silica composite modifier, the mass ratio of Peek powder to silica added in step 1) is 1:(1.5-1.8), the amount of hydroxyethyl cellulose added is 1-3wt% of the loaded silica, and the amount of vinyltriethoxysilane added is 5-10wt% of the loaded silica; In step 2), the addition mass ratio of N-hydroxyethyl acrylamide, acrylic acid and methacrylate is 1: (0.5-0.8): (0.6-0.8), and the addition mass ratio of the sum of N-hydroxyethyl acrylamide, acrylic acid and methacrylate monomers to pretreated silica is 1: (1.1-1.3), and the addition amount of the initiator is 1-3wt% of the sum of N-hydroxyethyl acrylamide, acrylic acid and methacrylate monomers.

4. The thermal insulation strip for thermally broken aluminum doors and windows according to claim 2, characterized in that: When preparing the Peek-silica composite modifier, the pressurized impregnation parameters in step 1) are: impregnation pressure of 0.5-0.8 MPa, and impregnation time of 1-2 h.

5. The thermal insulation strip for thermally broken aluminum doors and windows according to claim 2, characterized in that: When the Peek-silica composite modifier is prepared, in step 1), the Peek powder in step 1) is added after being treated with oxygen plasma, and in step 1), PAMAM, genipin and γ-aminopropyltrimethoxysilane are also added at the same time as vinyltriethoxysilane is added.

6. The thermal insulation strip for thermally broken aluminum doors and windows according to claim 5, characterized in that: The plasma parameters are as follows: the addition mass ratio of γ-aminopropyltrimethoxysilane to vinyltriethoxysilane is 1:(2-3), the addition amount of genipin is 0.3-0.8wt% of silica, and the addition amount of PAMAM is 1-3wt% of silica.

7. The thermal insulation strip for thermally broken aluminum doors and windows according to claim 5, characterized in that: The plasma parameters are as follows: Peek powder is treated at a power of 120-150 W and an oxygen flow rate of 50-80 sccm for 1-3 minutes.

8. The thermal insulation strip for thermally broken aluminum doors and windows according to claim 1, characterized in that: The silica aerogel is added after being modified. The specific operation of the modification is: the silica aerogel is first immersed in an ethanol aqueous solution of vinyltriethoxysilane, and then maleic anhydride-styrene copolymer is added, reacted at 55-70° C. for 30-40 minutes, and then filtered and dried.

9. The thermal insulation strip for thermally broken aluminum doors and windows according to claim 8, characterized in that: During the modification treatment of silica aerogel, the amount of vinyl triethoxysilane added is 3-5 wt % of the silica aerogel, and the amount of maleic anhydride-styrene copolymer added is 5-10 wt % of the silica aerogel.

10. A method for preparing a thermal insulation strip for thermally broken aluminum doors and windows according to any one of claims 1 to 9, characterized in that: The following steps are involved: The silane coupling agent is dissolved in 2-3 times the mass of an ethanol solution, and then added to the glass fiber, immersed for 30-60 minutes, and then dried to prepare a pretreated glass fiber; PA510 particles and PA10T are mixed and stirred, and then antioxidants, ultraviolet absorbers, pretreated glass fibers and heat-resistant modifiers are added in sequence, and mixed and stirred to obtain a mixture. The mixture is then melt-extruded and cooled to form a thermal insulation strip for thermally broken aluminum doors and windows.

Images