Temperature control device of molecular interaction analyzer

Abstract

The invention discloses a temperature control device of a molecular interaction analyzer, which belongs to the technical field of detection and comprises a sample bin and a buffer bin, and heating mechanisms and first temperature sensors are arranged on the inner bin walls of the sample bin and the buffer bin; semiconductor temperature control dehumidifiers are arranged on the sides, away from the bin door, of the sample bin and the buffer bin; a semiconductor temperature control assembly and a second temperature sensor are arranged at the bottom of the detection bin; the microcontroller is connected with the heating mechanism, the semiconductor temperature control dehumidifier, the semiconductor temperature control assembly, the first temperature sensor and the second temperature sensor. The precision of temperature control in the device is improved.

Description

Technical Field

[0001] The invention belongs to the field of detection technology, and particularly relates to a temperature control device of a molecular interaction analyzer. Background Art

[0002] Discovering and characterizing interactions between different molecules has long been a crucial research topic in modern life sciences and pharmaceuticals. Direct optical biosensors, developed using the surface plasmon resonance (SPR) principle, have become one of the leading instruments for studying intermolecular interactions. SPR can be used to characterize the specific binding between an analyte and a ligand immobilized on a chip, providing affinity, kinetic, and thermodynamic data. The basic principle is that when a beam of p-polarized light is incident on a prism coated with a gold film at a specific angle, the incident light generates an evanescent wave and a surface plasmon wave on the gold film surface. When these two waves resonate, the intensity of the reflected light from total internal reflection decreases. The angle at which the reflected light intensity is minimized is called the SPR resonance angle (SPR-dip). The SPR-dip is proportional to the mass of the biomolecule on the gold film surface. Therefore, the dynamic changes in the SPR-dip during a biological reaction can be used to capture specific signals of biomolecular interactions.

[0003] In conventional SPR instruments, the excitation light typically uses a fan-shaped beam to simultaneously incident light at multiple different angles. The excitation light at these different angles is focused by a lens onto the SPR chip mounted on a prism. After total internal reflection, the reflected light passes through the lens and reaches an array of photosensors (such as a linear CCD) for detection. The result is then calculated by a computer and the SPR-dip is obtained. Compared to conventional quantitative assays such as enzyme-linked immunosorbent assays (ELISA), chemiluminescent immunoassays (CLIA), and fluorescent immunoassays, which typically employ a "double antibody sandwich" approach, SPR analyzers require only a capture antibody immobilized on the SPR chip surface for a single antigen-antibody reaction with the analyte. This significantly reduces the difficulty of detecting new analytes (no antibody ligand or labeling is required), shortens detection time, and improves efficiency. These advantages of SPR have quickly led to the emergence of SPR-based assays for the detection of novel coronavirus antigens. Thanks to these advantages, SPR instruments have become an indispensable component of high-end experimental platforms in fields such as life sciences, pharmacy, and medicine. Currently, the SPR instruments commonly used by domestic research institutes and pharmaceutical companies are all imported. Common brands include the US Cytiva SPR instrument, the US Reichert SPR instrument, and the Canadian Nicoya OpenSPR instrument. However, while SPR instruments offer advantages such as high sensitivity, accuracy, and reproducibility, their detection throughput is insufficient to meet current demands. In particular, while existing microfluidics and sample chambers have temperature control systems, the accuracy of this control is low.

[0004] Therefore, there is an urgent need to design a molecular interaction instrument with high temperature control precision. Summary of the Invention

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A temperature control device for a molecular interaction analyzer comprises a molecular interaction analyzer, wherein the inner cavity of the molecular interaction analyzer is provided with a sample storage cavity, a compartment door is provided on a side wall of the molecular interaction analyzer near the sample storage cavity, a detection compartment is provided on the top of the molecular interaction analyzer, and the sample storage cavity is divided into a waste liquid compartment, a buffer compartment, and a sample compartment by a partition; a heating mechanism and a first temperature sensor are provided on the inner compartment walls of the sample compartment and the buffer compartment; and a semiconductor temperature-controlled dehumidifier is provided on the side of the sample compartment and the buffer compartment away from the compartment door.

[0007] A semiconductor temperature control component and a second temperature sensor are provided at the bottom of the detection chamber;

[0008] A microcontroller is connected to the heating mechanism, the semiconductor temperature-controlled dehumidifier, the semiconductor temperature-controlled component, the first temperature sensor, and the second temperature sensor respectively.

[0009] Furthermore, the inner walls of the sample chamber and the buffer chamber are made of high thermal conductivity material, and the outer walls of the sample chamber and the buffer chamber are covered with vacuum insulation material; the heating mechanism is arranged between the inner wall and the outer wall of the sample chamber and the buffer chamber;

[0010] The partition is composed of a high thermal conductivity material layer and a vacuum thermal insulation layer, and the heating mechanism is arranged between the thermal conductivity material layer and the vacuum thermal insulation layer.

[0011] Furthermore, the heating mechanism is a high-power density thin film heater, and the high-power density thin film heater is arranged on the outer wall of the sample chamber and the vacuum insulation layer of the partition;

[0012] The high power density thin film heater is connected to the microcontroller.

[0013] Furthermore, the semiconductor temperature-controlled dehumidifier includes a semiconductor refrigeration chip, a cooling block, a cooling plate, a cooling plate fan, a heat dissipation plate, a cooling fan, a dehumidification mechanism and a temperature controller;

[0014] The semiconductor refrigeration chip is connected to the refrigeration plate and the refrigeration plate fan via the cooling block at one end thereof, which is the cold end of the semiconductor refrigeration chip, and is connected to the heat dissipation plate and the cooling fan at the other end thereof, which is the hot end of the semiconductor refrigeration chip; and the semiconductor refrigeration chip is connected to the temperature controller; wherein, the cooling plate fan is located on the inner wall of the sample chamber and the buffer chamber, and the cooling fan is located on the outer wall of the sample chamber / the buffer chamber;

[0015] The outer periphery of the cooling block is wrapped with a heat-insulating material layer; the dehumidification mechanism is arranged on the heat-insulating material layer;

[0016] The cooling plate fan, the cooling fan and the semiconductor refrigeration chip are respectively connected to the temperature controller; and the temperature controller is connected to the microcontroller.

[0017] Furthermore, the dehumidification mechanism includes a condensate adsorption material layer, a condensate adsorption material fixing plate, a return air deflector, and a condensate collecting tank; the condensate collecting tank passes through the heat insulation material layer and the heat dissipation plate, and is attached to the side of the condensate adsorption material layer; and the return air deflector and the lower part of the refrigeration plate form an outer notch of the condensate collecting tank; the outer side surface of the condensate adsorption material layer is embedded with a condensate adsorption material fixing plate.

[0018] Furthermore, the semiconductor temperature control component includes a semiconductor refrigeration chip, which is located at the bottom of the detection chamber and is electrically connected to the controller; the microcontroller receives the electrical signal from the second temperature sensor to drive the semiconductor refrigeration chip to cool or heat.

[0019] Furthermore, the microcontroller includes:

[0020] A detection chamber control unit connected to the semiconductor temperature control component and the second temperature sensor;

[0021] A sample chamber control unit connected to the first temperature sensor, the heating mechanism, and the semiconductor temperature-controlled dehumidifier of the sample chamber;

[0022] A buffer bin control unit connected to the first temperature sensor, the heating mechanism, and the semiconductor temperature-controlled dehumidifier of the buffer bin;

[0023] The sample bin control unit and the buffer bin control unit have the same structure.

[0024] Furthermore, the sample bin control unit / the buffer bin control unit includes:

[0025] A temperature acquisition module, connected to the first temperature sensor, for acquiring temperature data of the sample bin / buffer bin in real time and converting it into a digital signal;

[0026] A control module is connected to the temperature acquisition module, and the control module has built-in fuzzy PID control algorithm and temperature model predictive control algorithm, and generates a control signal according to the digital signal transmitted by the temperature acquisition module and the preset temperature target value; wherein, the control algorithm is selected according to the operating status of the semiconductor temperature-controlled dehumidifier and the heating mechanism of the sample chamber / buffer chamber; during the startup phase of the semiconductor temperature-controlled dehumidifier and the heating mechanism or when the temperature in the sample chamber / buffer chamber deviates greatly from the preset temperature, the fuzzy PID control algorithm is adopted, and its fast response characteristic is utilized to quickly reduce the temperature deviation; when the temperature in the sample chamber / buffer chamber is close to the preset temperature and the system enters the steady-state phase, the control algorithm is switched to the temperature model predictive control algorithm, and its precise prediction and optimization capabilities are utilized to improve the control accuracy and suppress the fluctuation of the system;

[0027] an execution module connected to the semiconductor temperature-controlled dehumidifier and the heating mechanism, and adjusting the power of the semiconductor temperature-controlled dehumidifier and the heating mechanism according to a control signal output by the control module;

[0028] A remote monitoring terminal is connected to the control module via a communication module, and the communication module realizes data transmission between the control module and the remote monitoring terminal.

[0029] Furthermore, the fuzzy PID control algorithm includes:

[0030] Taking temperature deviation and temperature deviation change rate as input variables;

[0031] Perform fuzzification on the input variables and map their exact values to the corresponding fuzzy sets;

[0032] Establish a fuzzy rule base based on control experience and expert knowledge;

[0033] The Mamdani reasoning method is used for fuzzy reasoning to obtain the fuzzy value of the PID parameter adjustment amount;

[0034] The center of gravity method is used for defuzzification to obtain the actual parameters used for the PID microcontroller.

[0035] Furthermore, the temperature model predictive control algorithm includes:

[0036] System modeling, using state space model to describe the dynamic characteristics of sample chamber temperature;

[0037] The prediction model, based on the system model, predicts the temperature output at several future moments. Assuming the prediction time domain is Np and the control time domain is Nc, at each sampling moment, based on the current system state and the control input at the next Nc moments, the temperature value at the next Np moments is predicted.

[0038] Rolling optimization uses the minimum deviation between the predicted temperature and the target temperature as the optimization goal to construct the objective function. It also considers the control input constraints and the maximum power limit of the heating or cooling equipment. It uses optimization algorithms and quadratic programming algorithms to solve the optimal control input sequence at the current sampling time.

[0039] Beneficial effects:

[0040] The present invention can quickly adjust the temperature in the sample chamber / buffer chamber to a preset temperature by providing a heating mechanism and a semiconductor temperature-controlled dehumidifier. At the same time, a fuzzy PID control algorithm and a temperature model predictive control algorithm are provided in the microcontroller, and the fuzzy PID control algorithm and the temperature model predictive control algorithm are combined to give full play to the advantages of the two algorithms; the fuzzy PID control algorithm can quickly reduce the temperature deviation in the dynamic response stage of the system, while the temperature model predictive control algorithm can improve the control accuracy in the steady-state stage and suppress the fluctuation of the system, so that the microcontroller has better control performance and improves the accuracy of temperature control in the device to ±0.01°C. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 Schematic diagram of the structure of the temperature control device of the molecular interaction analyzer of the present invention;

[0042] Figure 2 It is a structural schematic diagram of the semiconductor temperature-controlled dehumidifier of the present invention;

[0043] Figure 3 It is a schematic diagram of the temperature controller of the present invention;

[0044] Figure 4 It is a structural schematic diagram of the first separator of the present invention;

[0045] Figure 5 Schematic diagram of the structure of the second separator of the present invention;

[0046] Explanation of the accompanying drawings: 1. Detection chamber; 2. Sample chamber; 3. Buffer chamber; 4. Waste liquid chamber; 5. Semiconductor temperature-controlled dehumidifier; 51. Cooling fan; 52. Heat sink; 53. Back cover; 54. Thermal insulation material layer; 55. Semiconductor refrigeration chip; 56. Cooling block; 57. Semiconductor refrigeration chip sealing ring; 58. Condensate adsorption material layer; 59. Condensate material adsorption material fixing plate; 510. Return air deflector; 511. Condensate collecting tank; 512. Combination screw; 513. Refrigeration plate fan; 514. Refrigeration plate; 6. First partition; 61. High power density thin film heating plate; 62. High thermal conductivity material layer of the first partition; 63. Vacuum insulation layer of the first partition; 7. Second partition; 71. High thermal conductivity material layer of the second partition; 72. Vacuum insulation layer of the second partition. DETAILED DESCRIPTION

[0047] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it should not be understood as a limitation on the scope of protection of the present invention.

[0048] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0049] In the description of the present invention, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0050] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0051] Example 1

[0052] refer to Figure 1-Figure 3 A temperature control device for a molecular interaction analyzer includes a molecular interaction analyzer, wherein the inner cavity of the molecular interaction analyzer is provided with a sample storage cavity, a compartment door is provided on the side wall of the molecular interaction analyzer near the sample storage cavity, a detection compartment 1 is provided on the top of the molecular interaction analyzer, and the sample storage cavity is divided into a waste liquid compartment 4, a buffer compartment 3 and a sample compartment 2 by a partition; a heating mechanism and a first temperature sensor are provided on the inner compartment walls of the sample compartment 2 and the buffer compartment 3; a semiconductor temperature-controlled dehumidifier 5 is provided on the side of the sample compartment 2 and the buffer compartment 3 away from the compartment door;

[0053] A semiconductor temperature control component and a second temperature sensor are provided at the bottom of the detection chamber 1;

[0054] The microcontroller is respectively connected with the heating mechanism, the semiconductor temperature-controlled dehumidifier, the semiconductor temperature-controlled component, the first temperature sensor and the second temperature sensor.

[0055] Preferably, the inner walls of the sample chamber 2 and the buffer chamber 3 are made of high thermal conductivity material, and the outer walls of the sample chamber 2 and the buffer chamber 3 are covered with vacuum insulation material; the heating mechanism is arranged between the inner wall and the outer wall of the sample chamber 2 and the buffer chamber 3;

[0056] The partition is composed of a high thermal conductivity material layer and a vacuum thermal insulation layer, and the heating mechanism is arranged between the thermal conductivity material layer and the vacuum thermal insulation layer.

[0057] In this embodiment, the partition is provided with a first partition 6 and a second partition 7 ; the first partition 6 is provided between the buffer chamber 3 and the sample chamber 2 ; the second partition 7 is provided between the buffer chamber 3 and the waste liquid chamber 4 .

[0058] The outer surface of the first partition 6 is provided with a high thermal conductivity material layer 62 of the first partition, and the high thermal conductivity material covers the vacuum insulation layer 63 of the first partition. The heating mechanism is provided between the high thermal conductivity material layer 62 of the first partition and the vacuum insulation layer 63.

[0059] One side of the second partition close to the buffer bin is set as the high thermal conductivity material layer 71 of the second partition, and the other side is the vacuum insulation layer 72 of the second partition; the heating mechanism is set between the high thermal conductivity material layer 71 and the vacuum insulation layer 72 of the second partition.

[0060] Preferably, the heating mechanism is a high power density thin film heating sheet 61, which is arranged on the outer wall of the sample chamber and the vacuum insulation layer of the partition;

[0061] The high power density thin film heater 61 is connected to the microcontroller.

[0062] Preferably, the semiconductor temperature-controlled dehumidifier includes a semiconductor refrigeration chip 55, a cooling block 56, a cooling plate 514, a cooling plate fan 513, a heat sink 52, a cooling fan 51, a dehumidification mechanism and a temperature controller;

[0063] The semiconductor cooling chip 55 is connected to the cooling plate 514 and the cooling plate fan 513 via the cooling block 56. The end of the semiconductor cooling chip 55 is connected to the heat sink 52 and the cooling fan 51. The end of the semiconductor cooling chip 55 is connected to the heat sink 52 and the cooling fan 51. The semiconductor cooling chip 55 is connected to the temperature controller. The cooling plate fan 513 is located on the inner walls of the sample chamber 2 and the buffer chamber 3, and the cooling fan 51 is located on the outer walls of the sample chamber 2 and the buffer chamber 3.

[0064] The outer periphery of the cooling block 56 is wrapped with a heat-insulating material layer 54; the dehumidification mechanism is arranged on the heat-insulating material layer 54;

[0065] The cooling plate fan 513, the cooling fan 51 and the semiconductor cooling chip 55 are respectively connected to the temperature controller; and the temperature controller is connected to the microcontroller.

[0066] Preferably, the dehumidification mechanism includes a condensate adsorption material layer 58, a condensate adsorption material fixing plate 59, a return air deflector 510, and a condensate collecting tank 511; the condensate collecting tank 511 passes through the heat insulation material layer 54 and the heat dissipation plate 52, and is attached to the side of the condensate adsorption material layer 58; and the return air deflector 510 and the lower part of the refrigeration plate 514 form an outer notch of the condensate collecting tank 511; the outer side surface of the condensate adsorption material layer 58 is embedded with the condensate adsorption material fixing plate 59.

[0067] In this embodiment, a semiconductor refrigeration chip sealing ring 57 is provided on the outer periphery of the semiconductor refrigeration chip 55; a rear cover 53 is provided between the heat insulation material layer 54 and the heat dissipation plate 52; the return air guide cover 510 and the rear cover 53 are connected and fixed by a combination screw 512.

[0068] Preferably, the semiconductor temperature control component includes a semiconductor refrigeration chip, which is located at the bottom of the detection chamber and is electrically connected to the controller; the microcontroller receives the electrical signal from the second temperature sensor to drive the semiconductor refrigeration chip to cool or heat.

[0069] In this embodiment, the first temperature sensor and the second temperature sensor are both PT100 platinum resistance temperature sensors, which collect temperature data in real time.

[0070] Example 2

[0071] This embodiment is further configured on the basis of the embodiment 1.

[0072] Preferably, the microcontroller comprises:

[0073] A detection chamber control unit connected to the semiconductor temperature control component and the second temperature sensor;

[0074] A sample chamber control unit connected to the first temperature sensor, the heating mechanism, and the semiconductor temperature-controlled dehumidifier of the sample chamber;

[0075] A buffer bin control unit connected to the first temperature sensor, the heating mechanism, and the semiconductor temperature-controlled dehumidifier of the buffer bin;

[0076] The sample bin control unit and the buffer bin control unit have the same structure.

[0077] Preferably, the sample chamber control unit / buffer chamber control unit includes:

[0078] A temperature acquisition module, connected to the first temperature sensor, for collecting temperature data of the sample bin / buffer bin in real time and converting it into a digital signal;

[0079] The control module is connected to the temperature acquisition module. The control module has built-in fuzzy PID control algorithm and temperature model predictive control algorithm. It generates a control signal based on the digital signal transmitted by the temperature acquisition module and the preset temperature target value. The control algorithm is selected according to the operating status of the semiconductor temperature-controlled dehumidifier and heating mechanism of the sample chamber / buffer chamber. During the startup phase of the semiconductor temperature-controlled dehumidifier and heating mechanism or when the temperature in the sample chamber / buffer chamber deviates greatly from the preset temperature, the fuzzy PID control algorithm is adopted to quickly reduce the temperature deviation by utilizing its fast response characteristics. When the temperature in the sample chamber / buffer chamber approaches the preset temperature and the system enters a steady-state phase, the control algorithm is switched to the temperature model predictive control algorithm, utilizing its precise prediction and optimization capabilities to improve control accuracy and suppress system fluctuations.

[0080] An execution module is connected to the semiconductor temperature-controlled dehumidifier and the heating mechanism, and adjusts the power of the semiconductor temperature-controlled dehumidifier and the heating mechanism according to the control signal output by the control module;

[0081] The remote monitoring terminal is connected to the control module through the communication module, and the communication module realizes data transmission between the control module and the remote monitoring terminal.

[0082] Preferably, the fuzzy PID control algorithm includes:

[0083] Taking temperature deviation and temperature deviation change rate as input variables;

[0084] Perform fuzzification on the input variables and map their exact values to the corresponding fuzzy sets;

[0085] Establish a fuzzy rule base based on control experience and expert knowledge;

[0086] The Mamdani reasoning method is used for fuzzy reasoning to obtain the fuzzy value of the PID parameter adjustment amount;

[0087] The center of gravity method is used for defuzzification to obtain the actual parameters used for the PID microcontroller.

[0088] Preferably, the temperature model predictive control algorithm includes:

[0089] System modeling, using state space model to describe the dynamic characteristics of sample chamber temperature;

[0090] The prediction model, based on the system model, predicts the temperature output at several future moments. Assuming the prediction time domain is Np and the control time domain is Nc, at each sampling moment, based on the current system state and the control input at the next Nc moments, the temperature value at the next Np moments is predicted.

[0091] Rolling optimization uses the minimum deviation between the predicted temperature and the target temperature as the optimization goal to construct the objective function. It also considers the control input constraints and the maximum power limit of the heating or cooling equipment. It uses optimization algorithms and quadratic programming algorithms to solve the optimal control input sequence at the current sampling time.

[0092] In this embodiment, the remote monitoring terminal can be a computer, on which the experimenter can view the temperature curve, system operation status and other information in real time, and set the temperature target value, start or stop the system, switch the control mode, etc. through the control buttons on the operation interface.

[0093] In other embodiments, the remote monitoring terminal may be a liquid crystal panel.

[0094] In this embodiment, the detection chamber control unit includes a VCC terminal, a DAT terminal, a first output terminal, a second output terminal, a third output terminal, a fourth output terminal, a first input terminal, and a second input terminal;

[0095] The second temperature sensor is connected to the VCC terminal and the DAT terminal of the driver chip; the first input terminal and the second input terminal are connected to the external interface to receive electrical signals; the input terminal of the negative relay is connected to the third output terminal and the fourth output terminal respectively, and the output terminal is connected to the negative pole of the semiconductor refrigeration chip; the input terminal of the positive relay is connected to the first output terminal and the second output terminal respectively, and the output terminal is connected to the positive pole of the semiconductor refrigeration chip.

[0096] The above description is merely a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A temperature control device for a molecular interaction analyzer, comprising a molecular interaction analyzer, wherein the inner cavity of the molecular interaction analyzer is provided with a sample storage cavity, a compartment door is provided on the side wall of the molecular interaction analyzer near the sample storage cavity, and a detection compartment is provided on the top of the molecular interaction analyzer, characterized in that: The sample storage chamber is divided into a waste liquid compartment, a buffer compartment, and a sample compartment by a partition; a heating mechanism and a first temperature sensor are provided on the inner compartment walls of the sample compartment and the buffer compartment; a semiconductor temperature-controlled dehumidifier is provided on the side of the sample compartment and the buffer compartment away from the compartment door; A semiconductor temperature control component and a second temperature sensor are provided at the bottom of the detection chamber; A microcontroller is connected to the heating mechanism, the semiconductor temperature-controlled dehumidifier, the semiconductor temperature-controlled component, the first temperature sensor, and the second temperature sensor respectively.

2. The temperature control device of a molecular interaction analyzer according to claim 1, characterized in that: The inner walls of the sample chamber and the buffer chamber are made of high thermal conductivity material, and the outer walls of the sample chamber and the buffer chamber are covered with vacuum insulation material; the heating mechanism is arranged between the inner wall and the outer wall of the sample chamber and the buffer chamber; The partition is composed of a high thermal conductivity material layer and a vacuum thermal insulation layer, and the heating mechanism is arranged between the thermal conductivity material layer and the vacuum thermal insulation layer.

3. The temperature control device of a molecular interaction analyzer according to claim 2, characterized in that: The heating mechanism is a high-power density thin film heater, which is arranged on the outer wall of the sample chamber and the vacuum insulation layer of the partition; The high power density thin film heater is connected to the microcontroller.

4. The temperature control device of a molecular interaction analyzer according to claim 3, characterized in that: The semiconductor temperature-controlled dehumidifier includes a semiconductor refrigeration chip, a cooling block, a cooling plate, a cooling plate fan, a heat dissipation plate, a cooling fan, a dehumidification mechanism and a temperature controller; The semiconductor refrigeration chip is connected to the refrigeration plate and the refrigeration plate fan via the cooling block at one end thereof, which is the cold end of the semiconductor refrigeration chip, and is connected to the heat dissipation plate and the cooling fan at the other end thereof, which is the hot end of the semiconductor refrigeration chip; and the semiconductor refrigeration chip is connected to the temperature controller; wherein, the cooling plate fan is located on the inner wall of the sample chamber and the buffer chamber, and the cooling fan is located on the outer wall of the sample chamber / the buffer chamber; The outer periphery of the cooling block is wrapped with a heat-insulating material layer; the dehumidification mechanism is arranged on the heat-insulating material layer; The cooling plate fan, the cooling fan and the semiconductor refrigeration chip are respectively connected to the temperature controller; and the temperature controller is connected to the microcontroller.

5. The temperature control device of a molecular interaction analyzer according to claim 4, characterized in that: The dehumidification mechanism includes a condensed water adsorption material layer, a condensed water adsorption material fixing plate, a return air deflector, and a condensed water collecting tank; the condensed water collecting tank passes through the heat insulation material layer and the heat dissipation plate, and is attached to the side of the condensed water adsorption material layer; and the return air deflector and the lower part of the refrigeration plate form an outer notch of the condensed water collecting tank; the outer side surface of the condensed water adsorption material layer is embedded with a condensed water adsorption material fixing plate.

6. The temperature control device of a molecular interaction analyzer according to claim 1, characterized in that: The semiconductor temperature control component includes a semiconductor refrigeration chip, which is located at the bottom of the detection chamber and is electrically connected to the controller; the microcontroller receives the electrical signal from the second temperature sensor to drive the semiconductor refrigeration chip to cool or heat.

7. A temperature control device for a molecular interaction analyzer according to any one of claims 1 to 6, characterized in that: The microcontroller comprises: A detection chamber control unit connected to the semiconductor temperature control component and the second temperature sensor; A sample chamber control unit connected to the first temperature sensor, the heating mechanism, and the semiconductor temperature-controlled dehumidifier of the sample chamber; A buffer bin control unit connected to the first temperature sensor, the heating mechanism, and the semiconductor temperature-controlled dehumidifier of the buffer bin; The sample bin control unit and the buffer bin control unit have the same structure.

8. The temperature control device of a molecular interaction analyzer according to claim 7, characterized in that: The sample bin control unit / the buffer bin control unit includes: A temperature acquisition module, connected to the first temperature sensor, for acquiring temperature data of the sample bin / buffer bin in real time and converting it into a digital signal; A control module is connected to the temperature acquisition module, and the control module has built-in fuzzy PID control algorithm and temperature model predictive control algorithm, and generates a control signal according to the digital signal transmitted by the temperature acquisition module and the preset temperature target value; wherein, the control algorithm is selected according to the operating status of the semiconductor temperature-controlled dehumidifier and the heating mechanism of the sample chamber / buffer chamber; during the startup phase of the semiconductor temperature-controlled dehumidifier and the heating mechanism or when the temperature in the sample chamber / buffer chamber deviates greatly from the preset temperature, the fuzzy PID control algorithm is adopted, and its fast response characteristic is utilized to quickly reduce the temperature deviation; when the temperature in the sample chamber / buffer chamber is close to the preset temperature and the system enters the steady-state phase, the control algorithm is switched to the temperature model predictive control algorithm, and its precise prediction and optimization capabilities are utilized to improve the control accuracy and suppress the fluctuation of the system; an execution module connected to the semiconductor temperature-controlled dehumidifier and the heating mechanism, and adjusting the power of the semiconductor temperature-controlled dehumidifier and the heating mechanism according to a control signal output by the control module; A remote monitoring terminal is connected to the control module via a communication module, and the communication module realizes data transmission between the control module and the remote monitoring terminal.

9. The temperature control device of a molecular interaction analyzer according to claim 7, characterized in that: The fuzzy PID control algorithm includes: Taking temperature deviation and temperature deviation change rate as input variables; Perform fuzzification on the input variables and map their exact values to the corresponding fuzzy sets; Establish a fuzzy rule base based on control experience and expert knowledge; The Mamdani reasoning method is used for fuzzy reasoning to obtain the fuzzy value of the PID parameter adjustment amount; The center of gravity method is used for defuzzification to obtain the actual parameters used for the PID microcontroller.

10. The temperature control device of a molecular interaction analyzer according to claim 9, characterized in that: The temperature model predictive control algorithm includes: System modeling, using state space model to describe the dynamic characteristics of sample chamber temperature; The prediction model, based on the system model, predicts the temperature output at several future moments. Assuming the prediction time domain is Np and the control time domain is Nc, at each sampling moment, based on the current system state and the control input at the next Nc moments, the temperature value at the next Np moments is predicted. Rolling optimization uses the minimum deviation between the predicted temperature and the target temperature as the optimization goal to construct the objective function. It also considers the control input constraints and the maximum power limit of the heating or cooling equipment. It uses optimization algorithms and quadratic programming algorithms to solve the optimal control input sequence at the current sampling time.

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