Device for high-temperature accelerated aging of semiconductor laser chip or module

Abstract

The invention relates to a device for high-temperature accelerated aging of a semiconductor laser chip or module, and relates to the technical field of semiconductor chip test.The device comprises a device shell, a liquid cavity is formed in the device shell, a liquid inlet and a liquid outlet are formed in the device shell, a hose is connected to the liquid outlet through a connector, and a placement area is arranged on the top face of the device shell; two heating rods are detachably arranged in the device shell, the end parts of the two heating rods are opposite to each other, and the winding densities of resistance wires in the heating rods in the length direction are different. The heating rod adopts a special design, and different heating wire densities are designed to be used in different areas according to the junction temperatures of different aging positions; the temperature difference caused by thermal crosstalk of the chip or the module is counteracted by customizing the temperatures of different heating areas; the temperature control is accurate when the semiconductor laser chip or module is aged, and the aging junction temperature consistency between products is good, so that the high-temperature aging detection result is more accurate.

Description

Technical Field

[0001] The present application relates to the field of semiconductor chip testing technology, and in particular to a device for high-temperature accelerated aging of semiconductor laser chips or modules. Background Art

[0002] High-temperature accelerated aging of semiconductor laser chips or modules is an experimental method that accelerates the aging process of the device by increasing the ambient temperature. This method is often used to evaluate the reliability and lifespan of semiconductor devices in high-temperature environments. High-temperature accelerated aging can simulate the effects of long-term operation under normal operating conditions in a relatively short period of time, thereby quickly obtaining performance degradation data.

[0003] To save cost and space in burn-in fixtures, semiconductor laser chips or modules are typically burned in series. This involves heating the coolant (such as pure water or thermal oil) inside the burn-in fixture to achieve high-temperature burn-in. Thermal crosstalk between multiple series-connected chips or modules can lead to inconsistent, and sometimes significant, junction temperatures at each location during high-temperature burn-in.

[0004] Existing heating devices are all guided by uniform heating. Therefore, after heating, the junction temperatures of chips or modules at different positions are still inconsistent, resulting in large errors during aging tests, which needs to be improved. Summary of the Invention

[0005] The present application provides a device for high-temperature accelerated aging of semiconductor laser chips or modules. The heating amplitude at different locations varies, and the temperature of different heating areas can be customized to offset the temperature difference caused by thermal crosstalk of the chip or module itself, making the junction temperature tend to be consistent, thereby improving the accuracy of the test.

[0006] This application provides a device for high-temperature accelerated aging of semiconductor laser chips or modules, which adopts the following technical solutions: A device for high-temperature accelerated aging of semiconductor laser chips or modules, comprising a device housing, a liquid chamber provided therein, a liquid inlet and a liquid outlet provided therein, a hose connected to the liquid outlet via a joint, a placement area provided on the top surface of the device housing, two detachable heating rods provided in the device housing, the ends of the two heating rods facing each other, and resistance wires within the heating rods having different winding densities along their lengths.

[0007] By employing this technical solution, the two heating rods can each adjust their power to provide different temperatures. The coolant's superior thermal conductivity transfers heat from the heating rods to the outer wall of the device housing, and then to the placement area. The density of the resistance wire within the heating rods varies to adjust where heat is concentrated. Different resistance wire densities are designed to be used in different areas, depending on the junction temperature at different aging locations.

[0008] Optionally, the liquid inlet is located in the middle of the device shell and directly opposite to the position between the two heating rods, and two liquid outlets are provided, and the two liquid outlets are respectively located at both ends of the device shell.

[0009] By adopting the above technical solution and the design of liquid outlet on both sides, the heat interference between the two heating rods is reduced.

[0010] Optionally, an insert block is fixed to one end of the heating rod, a support frame is fixed in the device shell, and a slot for inserting the insert block is provided on the support frame.

[0011] By adopting the above technical solution, one end of the heating rod is positioned through the slot.

[0012] Optionally, the end of the heating rod away from the plug is threadedly connected to a hollow frame, the circumferential side wall of the hollow frame is provided with multiple hollow holes, the end of the hollow frame is located in the liquid outlet, and the hollow frame and the heating rod enter and exit the device shell through the liquid outlet.

[0013] By adopting the above technical solution, the outer diameter of the hollow frame is adapted to the inner diameter of the liquid outlet, so that the hollow frame is confined in the liquid outlet, and the coolant in the device shell enters the liquid outlet through the hollow hole and then leads to the hose.

[0014] Optionally, the connector is rotatably connected to the hose, a threaded pipe is fixed to the outer wall of the device housing, and the connector is threadably connected to the threaded pipe.

[0015] By adopting the above technical solution, the hose and the device housing can be disassembled and assembled by rotating the joint, and the hose does not rotate during the disassembly and assembly process.

[0016] Optionally, a sealing ring is fixed to the end of the hose, and the sealing ring abuts against the ends of the threaded tube and the hollow frame at the same time.

[0017] By adopting the above technical solution, the end of the hollow frame is limited by the sealing ring, so that the heating rod is firmly installed in the device shell, and the sealing ring is used to seal between the hose and the threaded pipe to avoid leakage.

[0018] Optionally, the hose is fixed with an intermediate ring, a power supply line is passed through and fixed to the intermediate ring, the power supply line passes through the end of the hose, and the two ends of the heating rod are respectively connected to power lines, and the power supply lines are electrically connected through a plug structure.

[0019] By adopting the above technical solution, the middle ring is used as the introduction position of the power supply line, and the middle ring and the power supply line are fixed to avoid leakage and avoid opening a hole in the device shell for the power supply line to pass through. The plug structure facilitates the docking of the power supply line and the power cord, and the sealing is completed after the docking is completed.

[0020] Optionally, the power cord and the plug structure are arranged away from the heating rod, and the plug structure can pass through the hollow hole.

[0021] By adopting the above technical solution, the high heat at the outer wall of the heating rod is prevented from adversely affecting the power cord, and the plug structure can pass through the hollow hole. By placing the plug structure in the hollow frame, the plug structure can enter and exit the liquid outlet.

[0022] Optionally, the resistance wire in the heating rod has a structure that is sparse in the middle and dense at both ends.

[0023] By adopting the above technical solution, the temperature at the position corresponding to the middle of the heating rod is avoided to be too high. Different resistance wire densities are designed to be used in different areas according to the junction temperatures at different aging positions.

[0024] Optionally, a plurality of heat conducting plates are fixed to the placement area, and the heat conducting plates are distributed along the length direction of the heating rod. Positioning grooves for placing chips or modules are provided on the heat conducting plates.

[0025] By adopting the above technical solution, the heat conducting plate enables the heat borne by a single test piece to be more uniform.

[0026] In summary, this application includes at least one of the following beneficial technical effects: 1. The heating rod adopts a special design. According to the junction temperature of different aging positions, different heating wire densities are used in different areas. By customizing the temperature of different heating areas, the temperature difference caused by thermal crosstalk of the chip or module itself is offset. 2. The temperature of semiconductor laser chips or modules is precisely controlled during aging, and the aging junction temperature consistency between products is good, making the high-temperature aging test results more accurate; 3. By using the liquid outlet of the connecting hose as the opening for the heating rod to enter and exit the device shell, the number of openings in the device shell is reduced while facilitating the replacement of the heating rod. The width and height of the device shell can also be reduced, and the device shell can be designed to be slender. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a perspective view of a device for high-temperature accelerated aging of a semiconductor laser chip or module according to an embodiment; Figure 2 is a front cross-sectional view of an embodiment; Figure 3 yes Figure 2 A magnified view of point A; Figure 4 It is a partial exploded view of the embodiment.

[0028] Explanation of the accompanying symbols: 1. Device housing; 11. Liquid inlet; 12. Liquid outlet; 2. Connector; 3. Hose; 13. Placement area; 4. Heating rod; 41. Insert block; 14. Support frame; 15. Slot; 5. Hollow frame; 51. Hollow hole; 16. Threaded pipe; 21. Sealing ring; 31. Intermediate ring; 32. Power supply line; 42. Power supply line; 43. Plug structure; 17. Exhaust valve; 6. Heat conduction plate; 61. Positioning groove; 7. Temperature sensing line. DETAILED DESCRIPTION

[0029] The present application is further described in detail below with reference to the accompanying drawings.

[0030] Reference Figure 1 and Figure 2 This embodiment discloses a device for high-temperature accelerated aging of a semiconductor laser chip or module, comprising a device housing 1, a liquid chamber being provided in the device housing 1, a liquid inlet 11 and a liquid outlet 12 being provided in the device housing 1, a hose 3 being connected to the liquid outlet 12 via a joint 2, a placement area 13 being provided on the top surface of the device housing 1, two heating rods 4 being detachably provided in the device housing 1, and the ends of the two heating rods 4 being facing each other.

[0031] The liquid inlet 11 is located in the middle of the device housing 1 and directly opposite the position between the two heating rods 4. There are two liquid outlets 12, which are respectively located at the two ends of the device housing 1. The coolant in the device housing 1 adopts a design of liquid inlet in the middle and liquid outlet on both sides to reduce the heat interference between the two heating rods 4. It should be noted that valves are installed on the pipes and hoses 3 connected to the liquid inlet 11 to control the on-off of the corresponding pipes. The device forms a circulation system through a pump and a liquid tank. The coolant discharged from the hose 3 enters the liquid tank for storage, and the coolant in the liquid tank is pumped into the liquid inlet 11.

[0032] The resistance wire inside the heating rod 4 has varying winding densities along its length. Specifically, the resistance wire is sparse in the middle and dense at both ends. The heating rod 4 is replaceable, and the density of the resistance wire inside the replacement heating rod 4 varies, thereby adjusting the location of heat concentration. Based on the junction temperature at different aging locations, different resistance wire densities are designed to be used in different areas.

[0033] Reference Figure 2 One end of the heating rod 4 is fixed with an insert block 41, and a support frame 14 is fixed in the device housing 1. The support frame 14 is provided with a slot 15 for inserting the insert block 41. The support frame 14 is located in the middle of the device housing 1, and one end of the heating rod 4 is positioned through the slot 15.

[0034] Reference Figures 2 to 4 The end of the heating rod 4 away from the plug 41 is threadedly connected to the hollow frame 5. The circumferential side wall of the hollow frame 5 is provided with a plurality of hollow holes 51. The end of the hollow frame 5 is located in the liquid outlet 12. The hollow frame 5 and the heating rod 4 enter and exit the device housing 1 through the liquid outlet 12. The joint 2 is rotatably connected to the hose 3. The outer wall of the device housing 1 is fixed with a threaded tube 16, and the joint 2 is threadedly connected to the threaded tube 16. A sealing ring 21 is fixed to the end of the hose 3, and the sealing ring 21 is in contact with the threaded tube 16 and the end of the hollow frame 5 at the same time. The hose 3 and the device housing 1 can be disassembled and assembled by rotating the joint 2, and sealed by the sealing ring 21. The hose 3 does not rotate during the disassembly and assembly process.

[0035] The outer diameter of the hollow frame 5 matches the inner diameter of the liquid outlet 12, thereby confining the hollow frame 5 within the liquid outlet 12. The sealing ring 21 restrains the end of the hollow frame 5, thereby firmly securing the heater rod 4 within the device housing 1. Coolant within the device housing 1 enters the liquid outlet 12 through the hollow hole 51 and then flows to the hose 3. After disconnecting the connector 2 from the threaded tube 16, the heater rod 4 can be removed from the device housing 1 by pulling the hollow frame 5 outward, allowing it to be replaced.

[0036] Reference Figure 2 The hose 3 is fixed with an intermediate ring 31. The hose 3 is disconnected at the intermediate ring 31. The disconnected hose 3 is connected through the intermediate ring 31. The hose 3 passes through the intermediate ring 31 and is in close contact with the inner wall of the intermediate ring 31 to form a seal. The intermediate ring 31 is passed through and fixed with a power supply line 32. The power supply line 32 passes through the end of the hose 3. The two ends of the heating rod 4 are respectively connected to a power line 42. The power supply line 32 and the power line 42 are electrically connected through a plug structure 43. It should be noted that although there is only one power supply line 32, it contains two wires inside to form a loop. The power supply line 32 and the power line 42 are both plastic-sheathed wires. After the plug structure 43 is plugged in, a seal is formed to prevent leakage.

[0037] The power cord 42 and plug structure 43 are positioned away from the heating rod 4 to prevent the high heat on the outer wall of the heating rod 4 from adversely affecting the power cord 42. The plug structure 43 can pass through the hollow hole 51. By placing the plug structure 43 within the hollow frame 5, the plug structure 43 can enter and exit the liquid outlet 12. It should be noted that the hollow hole 51 extends toward the heating rod 4 to the end of the hollow frame 5. This arrangement allows the power cord 42 to pass through the hollow frame 5 from the end face of the hollow frame 5, thereby preventing the power cord 42 from getting stuck when entering and exiting the liquid outlet 12.

[0038] Reference Figure 1 The top surface of the device housing 1 is provided with an exhaust valve 17. When coolant is input into the device housing 1, the exhaust valve 17 is used to exhaust the air in the device housing 1. A plurality of heat conducting plates 6 are fixed to the placement area 13. The heat conducting plates 6 are distributed along the length direction of the heating rod 4. The heat conducting plates 6 are provided with positioning grooves 61 for placing chips or modules. The heat conducting plates 6 are made of materials with good thermal conductivity, such as indium sheets, so that the heat borne by a single test piece is more uniform. A plurality of temperature sensing wires 7 are mounted on the top surface of the placement area 13. The detection end of the temperature sensing wire 7 is set close to the heat conducting plate 6. The temperature sensing wire 7 is part of the temperature sensor. The temperature of the test piece during the aging process is detected in real time by the temperature sensor and its temperature sensing wire 7, so as to dynamically adjust the heating power of the heating rod 4. The number and position of the temperature sensing wires 7 can be adjusted.

[0039] The implementation principle of a device for high-temperature accelerated aging of semiconductor laser chips or modules in an embodiment of the present application is as follows: chips or modules to be tested are placed in the positioning grooves 61 of multiple heat-conducting plates 6 respectively, and then they are connected in series through a circuit. The heat-conducting medium in the device housing 1 is a coolant, and the heat emitted by the heating rod 4 is transferred to the outer wall of the device housing 1 through the better thermal conductivity of the coolant. When the heating rod 4 is working, the temperature is high at the position close to the heating rod 4, and the temperature is relatively low at the position away from the heating rod 4. The temperature distribution is also related to the density of the resistance wire in the heating rod 4. The sparser the resistance wire is wound, the lower the temperature is at the corresponding position. The temperature distribution after the heating rod 4 is working can be intuitively understood using a thermal imager, which will not be elaborated here.

[0040] During chip or module burn-in testing, the coolant within device housing 1 is stagnant or flows slowly, resulting in a relatively stable temperature distribution on the surface of placement area 13. This temperature distribution complements the operating temperature of the test piece itself, ensuring that the junction temperature of each test piece is consistent, improving test accuracy. If the temperature distribution on the top surface of placement area 13 needs to be changed, it can be adjusted by replacing the corresponding heating rod 4.

[0041] When the heating rod 4 needs to be replaced, the coolant in the device housing 1 is first drained through the liquid outlet 12 and the hose 3. The device housing 1 is then tilted to allow more coolant to drain from the hose 3, so that the coolant level in the device housing 1 is lower than the heating rod 4. The connector 2 is then rotated to remove it, and the power cord 32 is pulled so that the plug structure 43 enters the hollow frame 5 through the hollow hole 51. The heating rod 4 and its power cord 42 can then be withdrawn.

[0042] By using the liquid outlet 12 used for the connecting hose 3 as the opening for the heating rod 4 to enter and exit the device housing 1, the number of openings in the device housing 1 is reduced while facilitating the replacement of the heating rod 4. On the other hand, the axis of the heating rod 4 coincides with the axis of the liquid outlet 12, which can reduce the structure's occupancy in the width and height of the device housing 1. The device housing 1 can be designed into a slender shape, reducing the amount of coolant used and increasing the speed of thermal response.

[0043] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A device for high-temperature accelerated aging of semiconductor laser chips or modules, characterized by: The invention comprises a device shell (1), wherein a liquid cavity is provided in the device shell (1), the device shell (1) is provided with a liquid inlet (11) and a liquid outlet (12), the liquid outlet (12) is connected to a hose (3) via a joint (2), a placement area (13) is provided on the top surface of the device shell (1), and two heating rods (4) are detachably provided in the device shell (1), the ends of the two heating rods (4) are opposite to each other, and the winding density of the resistance wire in the heating rod (4) is different along its length direction.

2. The device for high-temperature accelerated aging of semiconductor laser chips or modules according to claim 1, characterized in that: The liquid inlet (11) is located in the middle of the device housing (1) and directly opposite the position between the two heating rods (4). Two liquid outlets (12) are provided, and the two liquid outlets (12) are respectively located at two ends of the device housing (1).

3. The device for high-temperature accelerated aging of semiconductor laser chips or modules according to claim 1, characterized in that: An insert block (41) is fixed to one end of the heating rod (4), a support frame (14) is fixed inside the device housing (1), and a slot (15) for inserting the insert block (41) is provided on the support frame (14).

4. The device for high-temperature accelerated aging of semiconductor laser chips or modules according to claim 3, characterized in that: The end of the heating rod (4) away from the plug (41) is threadedly connected to a hollow frame (5), and a plurality of hollow holes (51) are opened on the circumferential side wall of the hollow frame (5). The end of the hollow frame (5) is located in the liquid outlet (12), and the hollow frame (5) and the heating rod (4) enter and exit the device housing (1) through the liquid outlet (12).

5. The device for high-temperature accelerated aging of semiconductor laser chips or modules according to claim 4, characterized in that: The connector (2) is rotatably connected to the hose (3); a threaded tube (16) is fixed to the outer wall of the device housing (1); and the connector (2) is threadably connected to the threaded tube (16).

6. The device for high-temperature accelerated aging of semiconductor laser chips or modules according to claim 5, characterized in that: A sealing ring (21) is fixed to the end of the hose (3), and the sealing ring (21) abuts against the ends of the threaded tube (16) and the hollow frame (5) at the same time.

7. The device for high-temperature accelerated aging of semiconductor laser chips or modules according to claim 4, characterized in that: The hose (3) is fixed with an intermediate ring (31), and a power supply line (32) is passed through and fixed to the intermediate ring (31). The power supply line (32) passes through the end of the hose (3). Both ends of the heating rod (4) are respectively connected to power supply lines (42), and the power supply lines (32) and the power supply lines (42) are electrically connected via a plug structure (43).

8. The device for high-temperature accelerated aging of semiconductor laser chips or modules according to claim 7, characterized in that: The power line (42) and the plug structure (43) are arranged away from the heating rod (4), and the plug structure (43) can pass through the hollow hole (51).

9. The device for high-temperature accelerated aging of semiconductor laser chips or modules according to claim 1, characterized in that: The resistance wire in the heating rod (4) has a structure that is sparse in the middle and dense at both ends.

10. The device for high-temperature accelerated aging of semiconductor laser chips or modules according to claim 1, characterized in that: A plurality of heat conducting plates (6) are fixed to the placement area (13), and the heat conducting plates (6) are distributed along the length direction of the heating rod (4). The heat conducting plates (6) are provided with positioning grooves (61) for placing chips or modules.

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