Display module

Abstract

The invention discloses a display module which comprises a backlight module, a display panel, a chip and a heat conduction layer, the display panel comprises a first substrate and a second substrate which are stacked on the light emitting side of the backlight module, and the edge of one side of the first substrate protrudes out of the second substrate; the chip is bound on the part, protruding out of the second substrate, of the first substrate and located on the side, away from the backlight module, of the first substrate; the heat conduction layer is at least arranged on the surface, away from the backlight module, of the chip, and the heat conductivity coefficient of the heat conduction layer is larger than 10 watts per meter per Kelvin. The maximum temperature rise of the display module can be reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module. Background Art

[0002] In the related art, in a structure where a chip is bound to a display panel, for a low refresh rate display module with a refresh rate of 60 Hz, the structure can meet the requirement that the maximum temperature rise of the module is 40 degrees Celsius.

[0003] However, for high refresh rate display modules with a refresh rate of more than 120 Hz, the measured maximum temperature rise exceeds 40 degrees Celsius. This maximum temperature rise is related to the temperature of the chip surface. A maximum temperature rise of more than 40 degrees Celsius will affect product performance and cannot meet user needs.

[0004] Therefore, it is necessary to propose a new technical solution to solve the above technical problems. Summary of the Invention

[0005] The purpose of this application is to provide a display module that can reduce the maximum temperature rise of the display module.

[0006] To solve the above problems, the technical solutions of this application are as follows:

[0007] This application proposes a display module, comprising:

[0008] Backlight module;

[0009] The display panel includes a first substrate and a second substrate stacked on the light-emitting side of the backlight module, wherein one side edge of the first substrate protrudes from the second substrate;

[0010] a chip, bonded to a portion of the first substrate protruding from the second substrate, and located on a side of the first substrate away from the backlight module; and

[0011] The heat-conducting layer is at least arranged on a side of the chip away from the backlight module, and the thermal conductivity of the heat-conducting layer is greater than 10 watts per meter per Kelvin.

[0012] In one embodiment of the present application, the display module further includes an edge tape, and the edge tape includes:

[0013] an edge layer, the edge layer covering the periphery of the second substrate and the backlight module, one end of the edge layer being connected to a side of the second substrate away from the first substrate, and the other end of the edge layer extending to a side of the backlight module away from the display panel and connected to the backlight module; and

[0014] The heat-conducting layer is stacked on the side of the edging layer close to the chip, one end of the heat-conducting layer covers the side of the chip away from the backlight module, and the other end of the heat-conducting layer extends to connect with the backlight module, and the thermal conductivity of the heat-conducting layer is greater than the thermal conductivity of the edging layer.

[0015] In one embodiment of the present application, the thermal conductivity of the thermally conductive layer is greater than or equal to 450 watts per meter per Kelvin;

[0016] The thermal conductivity of the edge layer is less than 450 watts per meter per Kelvin.

[0017] In one embodiment of the present application, the material of the heat-conducting layer includes graphene, and the material of the edge layer includes metal.

[0018] In one embodiment of the present application, the edge tape further includes an insulating layer, which is stacked on a side of the heat-conducting layer away from the edge layer, and the thermal conductivity of the insulating layer is smaller than the thermal conductivity of the heat-conducting layer;

[0019] Among them, the end of the thermal conductive layer close to the first substrate protrudes from the end of the insulating layer and covers the side of the chip away from the backlight module. The end of the thermal conductive layer close to the backlight module protrudes from the end of the insulating layer and is connected to the side of the backlight module away from the first substrate.

[0020] In one embodiment of the present application, the backlight module includes:

[0021] a back plate, disposed opposite to the first substrate; and

[0022] a side plate, arranged around the edge of the back plate and located on a side of the back plate close to the first substrate;

[0023] Wherein, one end of the heat conducting layer away from the first substrate is connected to a side of the back plate away from the first substrate;

[0024] The edge layer comprises:

[0025] a metal layer comprising a first sub-portion and a second sub-portion connected to each other, wherein the first sub-portion is stacked on a side of the heat-conducting layer away from the chip, and the second sub-portion is protruding from the heat-conducting layer and located on a side of the backplane away from the first substrate; and

[0026] The first adhesive layer includes a first sub-segment and a second sub-segment connected to each other, the first sub-segment is located between the first sub-section and the thermal conductive layer, and connects the metal layer and the thermal conductive layer, and the second sub-segment is located between the second sub-section and the back plate, and connects the second sub-section and the back plate.

[0027] In one embodiment of the present application, the material of the heat-conducting layer includes photosensitive adhesive and wave-absorbing particles doped in the photosensitive adhesive, and the material of the wave-absorbing particles includes at least one of metal and silicon.

[0028] In one embodiment of the present application, the heat conductive layer covers a surface of the chip away from the backlight module and a side surface of the chip;

[0029] The display module further includes an edge tape, and the edge tape includes:

[0030] an edge layer, the edge layer covering the periphery of the second substrate and the backlight module, the edge layer being connected to the heat-conducting layer, one end of the edge layer being connected to a side of the second substrate away from the first substrate, and the other end of the edge layer extending to a side of the backlight module away from the display panel and being connected to the backlight module; and

[0031] An insulating layer is stacked on a side of the edge layer close to the second substrate and the backlight module, and two ends of the edge layer are protruded from the insulating layer.

[0032] In one embodiment of the present application, the heat conducting layer includes:

[0033] a first coating layer, covering a side of the chip away from the backlight module and connecting the chip and the edge layer;

[0034] a second coating layer connected to the first coating layer and covering the side surfaces of the chip; and

[0035] The third coating layer is connected to the second coating layer, and the third coating layer is provided on a portion of the first substrate protruding from the second substrate.

[0036] In one embodiment of the present application, the display module further includes a heat dissipation layer, which is provided on a portion of the first substrate protruding from the second substrate and located on a side of the first substrate away from the backlight module, and covers at least a portion of a side surface of the chip;

[0037] Wherein, the thermal conductivity of the heat dissipation layer is greater than 10 watts per meter per Kelvin.

[0038] In one embodiment of the present application, the heat dissipation layer is made of heat dissipation silicone rubber;

[0039] The heat-conducting layer is connected to a side of the heat-dissipating layer away from the backlight module.

[0040] In one embodiment of the present application, the display module further includes:

[0041] A support plate connected to a side surface of the backlight module;

[0042] A printed circuit board is located on the side of the backlight module and is arranged on the support plate;

[0043] a flexible circuit board, one end of which is bound to a portion of the first substrate protruding from the second substrate and located on a side of the chip away from the second substrate, and the other end of which is bound to the printed circuit board; and

[0044] The heat dissipation adhesive layer is provided on the side of the first substrate protruding from the second substrate and is connected to a side of the flexible circuit board close to the backlight module.

[0045] In this application, a heat-conducting layer is provided on the side of the chip away from the backlight module, and the thermal conductivity of the heat-conducting layer is greater than 10 watts per meter per Kelvin. The heat generated by the chip is promptly discharged, thereby reducing the heat accumulated on the chip surface, avoiding overheating of the chip of the high refresh rate display module, and reducing its maximum temperature rise to below 40 degrees Celsius, thereby achieving the effect of reducing the maximum temperature rise of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 is a schematic diagram of a first embodiment of the display module of the present application;

[0047] Figure 2 yes Figure 1 Enlarged view of point A in the middle;

[0048] Figure 3 yes Figure 1 Enlarged view of point B in the middle;

[0049] Figure 4 is another schematic diagram of the first embodiment of the display module of the present application;

[0050] Figure 5 This is another schematic diagram of the first embodiment of the display module of the present application;

[0051] Figure 6 is a schematic diagram of a second embodiment of the display module of the present application;

[0052] Figure 7 This is another schematic diagram of the second embodiment of the display module of the present application. DETAILED DESCRIPTION

[0053] The meanings of the terms used in this specification and claims correspond to those commonly understood by persons of ordinary skill in the art to which this application belongs. The terms used in this specification and claims are intended solely to facilitate the description and understanding of this application and are not intended to limit this application to the narrow interpretations of the specific terms used in the specification and claims.

[0054] In related technologies, a photosensitive adhesive is coated on the chip surface and cured. The cured adhesive then coats the chip surface. The photosensitive adhesive can be an ultraviolet (UV) curable adhesive, also known as a UV adhesive. Generally speaking, the thermal conductivity of UV-curable adhesive after curing is relatively low, generally ranging from 0.2 watts per meter per Kelvin to 0.5 watts per meter per Kelvin. The specific value varies depending on the formulation and application scenario.

[0055] Due to the low thermal conductivity of UV light-curing adhesive after curing, in high refresh rate display modules with a refresh rate of more than 120 Hz, the chip generates a lot of heat, causing heat to accumulate on the chip surface, causing the chip of the high refresh rate display module to overheat, resulting in its maximum temperature rise exceeding 40 degrees Celsius, unable to meet the temperature rise specifications of the high refresh rate display module, affecting product performance and failing to meet user needs.

[0056] This application provides a display device. The display device can be a tablet computer, an e-reader, an electronic display screen, a laptop computer, a mobile phone, an augmented reality (AR) or virtual reality (VR) device, a media player, a wearable device, a digital camera, an in-car navigation system, etc. The display device includes a display module 100. The display module 100 can be a liquid crystal display module 100.

[0057] See also Figure 1 The display module 100 includes a backlight module 10 , a display panel 20 , a chip 30 and a heat conducting layer 40 .

[0058] The display panel 20 includes a first substrate 21 and a second substrate 22 stacked on the light-emitting side of the backlight module 10. One side edge of the first substrate 21 protrudes from the second substrate 22. The display panel 20 is a liquid crystal display panel 20. A liquid crystal layer is disposed between the first substrate 21 and the second substrate 22. The first substrate 21 may be an array substrate, and the second substrate 22 may be a color filter substrate. Alternatively, the first substrate 21 may be a color filter substrate, and the second substrate 22 may be an array substrate. These are not limited herein.

[0059] The chip 30 is bonded to the portion of the first substrate 21 that protrudes from the second substrate 22 and is located on the side of the first substrate 21 away from the backlight module 10. A thermal conductive layer 40 is disposed on at least one side of the chip 30 away from the backlight module 10. The thermal conductivity of the thermal conductive layer 40 is greater than 10 watts per meter per kelvin.

[0060] In the present application, a heat-conducting layer 40 is provided on the side of the chip 30 away from the backlight module 10, and the thermal conductivity of the heat-conducting layer 40 is greater than 10 watts per meter per Kelvin. The heat generated by the chip 30 is promptly discharged, thereby reducing the heat accumulated on the surface of the chip 30, avoiding overheating of the chip 30 of the high refresh rate display module 100, and reducing its maximum temperature rise to below 40 degrees Celsius, thereby achieving the effect of reducing the maximum temperature rise of the display module 100.

[0061] Optionally, the display module 100 further includes a support plate 60 , a printed circuit board (PCB) 70 , and a flexible printed circuit (FPC) 80 .

[0062] The support plate 60 is connected to the side surface of the backlight module 10 .

[0063] The printed circuit board 70 is located on a side surface of the backlight module 10 and is disposed on the support plate 60 .

[0064] One end of the flexible circuit board 80 is bonded to the portion of the first substrate 21 protruding from the second substrate 22 and is located on the side of the chip 30 away from the second substrate 22. The other end of the flexible circuit board 80 is bonded to the printed circuit board 70.

[0065] The heat dissipation adhesive layer 92 is disposed on the side of the first substrate 21 protruding from the second substrate 22 and is connected to a side of the flexible circuit board 80 close to the backlight module 10 .

[0066] In this embodiment, the support plate 60 is used to support and secure the printed circuit board 70. The flexible printed circuit board 80 is bonded to the first substrate 21. The first substrate 21 includes traces connecting the flexible printed circuit board 80 and the chip 30, achieving electrical connection between the chip 30 and the printed circuit board 70. A heat dissipation adhesive layer 92 is provided on the side of the first substrate 21 that protrudes from the second substrate 22. This layer provides a buffer for the flexible printed circuit board 80 while improving the heat dissipation efficiency of the flexible printed circuit board 80 surface, thereby reducing the maximum temperature rise of the display module 100. The material of this heat dissipation adhesive layer 92 can be heat dissipation silicone.

[0067] Optionally, the backlight module 10 includes a back plate 11 and side plates 12. The back plate 11 is disposed opposite to the first substrate 21. The side plates 12 are disposed around the edge of the back plate 11 and are located on a side of the back plate 11 close to the first substrate 21.

[0068] In this embodiment, the housing of the backlight module 10 is composed of a back plate 11 and side plates 12. The back plate 11 and the side plates 12 form a receiving cavity for accommodating components such as the backlight source, light guide plate, diffuser, optical film, and reflector in the backlight module 10.

[0069] In the first embodiment of the present application:

[0070] See also Figure 2 Optionally, the display module 100 further includes an edge tape 50 . The edge tape 50 includes an edge layer 51 and a heat conducting layer 40 .

[0071] The edging layer 51 wraps around the second substrate 22 and the backlight module 10. One end of the edging layer 51 is connected to the side of the second substrate 22 away from the first substrate 21. The other end of the edging layer 51 extends to the side of the backlight module 10 away from the display panel 20 and is connected to the backlight module 10.

[0072] The thermal conductive layer 40 is laminated on the side of the edge layer 51 that is closer to the chip 30. One end of the thermal conductive layer 40 covers the side of the chip 30 that is away from the backlight module 10. The other end of the thermal conductive layer 40 extends to connect to the backlight module 10. The thermal conductivity of the thermal conductive layer 40 is greater than that of the edge layer 51.

[0073] In this embodiment, a new heat-conducting layer 40 is added to the edge tape 50 and disposed on the inner side of the edge layer 51, so that the heat-conducting layer 40 covers the side of the chip 30 away from the backlight module 10. Since the heat-conducting layer 40 is directly attached to the surface of the chip 30 and the surface of the back plate 11 of the backlight module 10, and the thermal conductivity of the heat-conducting layer 40 is greater than that of the edge layer 51, the heat-conducting layer 40 can quickly conduct the heat generated by the chip 30 to the back side of the backlight module 10, thereby reducing the heat accumulated on the surface of the chip 30, achieving the effect of dissipating heat for the display module 100, preventing the chip 30 of the high refresh rate display module 100 from overheating, and reducing its maximum temperature rise to below 40 degrees Celsius, thereby achieving the effect of reducing the maximum temperature rise of the display module 100.

[0074] Optionally, the thermal conductivity of the heat-conducting layer 40 is greater than or equal to 450 watts per meter per Kelvin.

[0075] The thermal conductivity of the heat conducting layer 40 may be 450 watts per meter per Kelvin, 500 watts per meter per Kelvin, 550 watts per meter per Kelvin, 600 watts per meter per Kelvin, 650 watts per meter per Kelvin, 700 watts per meter per Kelvin, 750 watts per meter per Kelvin, 800 watts per meter per Kelvin, 850 watts per meter per Kelvin, 900 Watts per meter per Kelvin, 950 Watts per meter per Kelvin, 1000 Watts per meter per Kelvin, 1050 Watts per meter per Kelvin, 1100 Watts per meter per Kelvin, 1150 Watts per meter per Kelvin, 1200 Watts per meter per Kelvin, 1250 Watts per meter per Kelvin, 1300 Watts per meter per Kelvin, 1350 Watts per meter per Kelvin Kelvin, 1400 Watts per meter per Kelvin, 1450 Watts per meter per Kelvin, 1500 Watts per meter per Kelvin, 1550 Watts per meter per Kelvin, 1600 Watts per meter per Kelvin, 1650 Watts per meter per Kelvin, 1700 Watts per meter per Kelvin, 1750 Watts per meter per Kelvin, 1800 Watts per meter per Kelvin, 185 0 Watts per meter per Kelvin, 1900 Watts per meter per Kelvin, 1950 Watts per meter per Kelvin, 2000 Watts per meter per Kelvin, 2050 Watts per meter per Kelvin, 2100 Watts per meter per Kelvin, 2150 Watts per meter per Kelvin, 2200 Watts per meter per Kelvin, 2250 Watts per meter per Kelvin, 2300 Watts per meter per Kelvin Watts per meter per Kelvin, 2350 Watts per meter per Kelvin, 2400 Watts per meter per Kelvin, 2450 Watts per meter per Kelvin, 2500 Watts per meter per Kelvin, 2550 Watts per meter per Kelvin, 2600 Watts per meter per Kelvin, 2650 Watts per meter per Kelvin, 2700 Watts per meter per Kelvin, 2750 Watts per meter per Kelvin, 2800 Watts per meter per Kelvin, Watts per meter per Kelvin, 2850 Watts per meter per Kelvin, 2900 Watts per meter per Kelvin, 2950 Watts per meter per Kelvin, 3000 Watts per meter per Kelvin, 3050 Watts per meter per Kelvin, 3100 Watts per meter per Kelvin, 3150 Watts per meter per Kelvin, 3200 Watts per meter per Kelvin, 3250 Watts per meter per Kelvin Watts per meter per Kelvin, 3300 Watts per meter per Kelvin, 3350 Watts per meter per Kelvin, 3400 Watts per meter per Kelvin, 3450 Watts per meter per Kelvin, 3500 Watts per meter per Kelvin, 3550 Watts per meter per Kelvin, 3600 Watts per meter per Kelvin, 3650 Watts per meter per Kelvin, 3700 Watts per meter per Kelvin, 3750 Watts per meter per Kelvin Watts per meter per Kelvin, 3800 Watts per meter per Kelvin, 3850 Watts per meter per Kelvin, 3900 Watts per meter per Kelvin, 3950 Watts per meter per Kelvin, 4000 Watts per meter per Kelvin, 4050 Watts per meter per Kelvin, 4100 Watts per meter per Kelvin, 4150 Watts per meter per Kelvin, 4200 Watts per meter per Kelvin,4250 Watts per meter per Kelvin, 4300 Watts per meter per Kelvin, 4350 Watts per meter per Kelvin, 4400 Watts per meter per Kelvin, 4450 Watts per meter per Kelvin, 4500 Watts per meter per Kelvin, 4550 Watts per meter per Kelvin, 4600 Watts per meter per Kelvin, 4650 Watts per meter per Kelvin, 4700 Watts per meter per Kelvin, 4750 Watts per meter per Kelvin, 4800 Watts per meter per Kelvin, 4850 Watts per meter per Kelvin, 4900 Watts per meter per Kelvin, 4950 Watts per meter per Kelvin, 5000 Watts per meter per Kelvin, etc.

[0076] Optionally, the thermal conductivity of the edge layer 51 is less than 450 watts per meter per Kelvin.

[0077] In this embodiment, since the thermal conductivity of the thermal conductive layer 40 is greater than the thermal conductivity of the edging layer 51, compared with the solution in which the edging layer 51 is directly attached to the surface of the chip 30 and the surface of the backplane 11, the solution of this embodiment uses a thermal conductive layer 40 with a thermal conductivity greater than or equal to 450 watts per meter per Kelvin, which has the ability to more quickly export the heat generated by the chip 30 to the back of the backlight module 10, thereby reducing the heat accumulated on the surface of the chip 30, achieving the effect of dissipating heat for the display module 100, avoiding overheating of the chip 30 of the high refresh rate display module 100, and reducing its maximum temperature rise to below 40 degrees Celsius, thereby achieving the effect of reducing the maximum temperature rise of the display module 100.

[0078] Optionally, the material of the edge layer 51 includes metal.

[0079] Optionally, when the edge layer 51 is an aluminum foil tape, the material of the edge layer 51 includes aluminum. The thermal conductivity of aluminum is in the range of 200 watts per meter per Kelvin to 237 watts per meter per Kelvin.

[0080] Optionally, the material of the edge layer 51 includes copper. The thermal conductivity of copper is approximately 401 watts per meter per Kelvin.

[0081] Optionally, the material of the edge layer 51 includes silver. When the ambient temperature is below 100 degrees, the thermal conductivity of silver is in the range of 414 watts per meter per Kelvin to 429 watts per meter per Kelvin. When the ambient temperature is above 100 degrees, the thermal conductivity of silver will decrease accordingly.

[0082] Optionally, the material of the heat conducting layer 40 includes graphene.

[0083] In this embodiment, graphene is a good thermal conductive material with a high in-plane thermal conductivity.

[0084] Optionally, the heat conducting layer 40 is a double-layer graphene. In this case, the thickness of the double-layer graphene can be 0.08 mm, and its thermal conductivity is generally as high as 1700 watts per meter per Kelvin.

[0085] Optionally, the heat conducting layer 40 is a single-layer graphene. In this case, the thickness of the single-layer graphene can be 0.05 mm, and its thermal conductivity is slightly lower than that of the double-layer graphene, but much higher than 450 watts per meter per Kelvin.

[0086] Optionally, the ratio of the thickness of the heat-conducting layer 40 to the overall thickness of the display module 100 is in the range of 0.02 to 0.05.

[0087] In this embodiment, when the thermally conductive layer 40 is made of graphene, the overall thermal conductivity of the graphene is related to its thickness; the thicker the graphene, the higher the overall thermal conductivity. However, due to the high material cost of graphene, the thickness of the graphene is limited in practice to achieve a more cost-effective solution between material cost and overall thermal conductivity.

[0088] In one embodiment, when the overall thickness of the display module 100 is 2.4 mm, the thickness of the heat-conducting layer 40 is 0.08 mm. In this case, the ratio of the thickness of the heat-conducting layer 40 to the overall thickness of the display module 100 is 0.033.

[0089] In another embodiment, when the overall thickness of the display module 100 is 2.2 mm, the thickness of the graphene is 0.05 mm. In this case, the ratio of the thickness of the heat-conducting layer 40 to the overall thickness of the display module 100 is 0.028.

[0090] It should be understood that the display module 100 includes a stacked backlight module 10, a lower polarizer, a first substrate 21, a liquid crystal layer, a second substrate 22, and an upper polarizer. The overall thickness of the display module 100 refers to the distance from the side of the backlight module 10 away from the upper polarizer to the side of the upper polarizer away from the backlight module 10.

[0091] Optionally, the edge tape 50 further includes an insulating layer 52. The insulating layer 52 is stacked on a side of the heat-conducting layer 40 away from the edge layer 51. The thermal conductivity of the insulating layer 52 is smaller than that of the heat-conducting layer 40.

[0092] Among them, see Figure 2 The end of the heat conducting layer 40 close to the first substrate 21 is protruded from the end of the insulating layer 52 and covers the side of the chip 30 away from the backlight module 10. Figure 3 One end of the heat-conducting layer 40 close to the backlight module 10 is protruded from the end of the insulating layer 52 and is connected to the side of the backlight module 10 away from the first substrate 21 .

[0093] In this embodiment, the material of the insulating layer 52 can be polyethylene terephthalate (PET). The insulating layer 52 is used to protect the flexible circuit board 80 and the printed circuit board 70. When the material of the insulating layer 52 is polyethylene terephthalate, its thermal conductivity is generally in the range of 0.19 watts per meter per Kelvin to 0.24 watts per meter per Kelvin. Because the thermal conductivity of the insulating layer 52 is extremely low, in order to prevent the insulating layer 52 from blocking the attachment between the thermally conductive layer 40 and the chip 30, in this embodiment, the side of the thermally conductive layer 40 near the first substrate 21 is arranged to protrude from the end of the insulating layer 52. This allows the thermally conductive layer 40 to be directly attached to the surface of the chip 30 while not affecting the protection provided by the insulating layer 52 to the flexible circuit board 80 and the printed circuit board 70. At the same time, this embodiment also arranges one end of the heat-conducting layer 40 near the backlight module 10 to protrude from the end of the insulating layer 52, so that this end can be directly connected to the backplate 11 of the backlight module 10. This allows the heat conducted from the chip 30 by the heat-conducting layer 40 to be transferred to the backplate 11, thereby achieving the effect of dissipating heat from the chip 30. This reduces the heat accumulated on the surface of the chip 30, prevents the chip 30 of the high refresh rate display module 100 from overheating, and reduces its maximum temperature rise to below 40 degrees Celsius, thereby achieving the effect of reducing the maximum temperature rise of the display module 100.

[0094] Optionally, one end of the heat conducting layer 40 away from the first substrate 21 is connected to a side of the back plate 11 away from the first substrate 21 .

[0095] In this embodiment, when the end of the thermal conductive layer 40 away from the first substrate 21 is connected to the bottom of the back plate 11, the contact area between the thermal conductive layer 40 and the back plate 11 is relatively large, so that the heat extracted from the chip 30 by the thermal conductive layer 40 can be transferred to the back plate 11 more quickly, thereby achieving the effect of dissipating heat from the chip 30. This reduces the heat accumulated on the surface of the chip 30, prevents the chip 30 of the high refresh rate display module 100 from overheating, and reduces its maximum temperature rise to below 40 degrees Celsius, thereby achieving the effect of reducing the maximum temperature rise of the display module 100.

[0096] Optionally, the edge layer 51 includes a metal layer 511 and a first adhesive layer 512 .

[0097] The metal layer 511 includes a first sub-portion 511a and a second sub-portion 511b. The first sub-portion 511a is stacked on the side of the heat conducting layer 40 away from the chip 30. The second sub-portion 511b protrudes from the heat conducting layer 40 and is located on the side of the back plate 11 away from the first substrate 21.

[0098] The first adhesive layer 512 includes a first sub-segment 512a and a second sub-segment 512b. The first sub-segment 512a is located between the first sub-section 511a and the thermally conductive layer 40, and connects the metal layer 511 and the thermally conductive layer 40. The second sub-segment 512b is located between the second sub-section 511b and the back plate 11, and connects the second sub-section 511b and the back plate 11.

[0099] In this embodiment, the material of the thermal conductive layer 40 is graphene. Graphene is not sticky and cannot adhere to the back plate 11. If a layer of glue is provided between the thermal conductive layer 40 and the back plate 11, the thermal conductivity of the glue is extremely low, which will affect the heat transfer between the thermal conductive layer 40 and the back plate 11. Therefore, this embodiment utilizes a structure in which the edging layer 51 includes a first glue layer 512, and uses the first glue layer 512 to fix the thermal conductive layer 40 and the back plate 11, thereby eliminating the need to provide a layer of glue between the thermal conductive layer 40 and the back plate 11. As a result, the heat extracted from the chip 30 by the thermal conductive layer 40 can be transferred to the back plate 11 more quickly, achieving the effect of dissipating heat for the chip 30. This reduces the heat accumulated on the surface of the chip 30, prevents the chip 30 of the high refresh rate display module 100 from overheating, and reduces its maximum temperature rise to below 40 degrees Celsius, thereby achieving the effect of reducing the maximum temperature rise of the display module 100.

[0100] Optionally, the edging layer 51 includes a light-shielding layer, a polyester film, a metal layer 511, and a first adhesive layer 512 that are stacked. The light-shielding layer can be a black printed coating for shading. The polyester film is located between the light-shielding layer and the metal layer 511, and has high strength, heat resistance, chemical resistance, and light resistance, and serves to isolate oxygen and water in the environment from penetrating into the interior of the module. The material of the metal layer 511 can be aluminum foil, or copper, silver, titanium, or other metals, and the specific type of metal is not limited here. The first adhesive layer 512 can be a pressure-sensitive adhesive. The pressure-sensitive adhesive can be a conductive acrylic pressure-sensitive adhesive.

[0101] Optionally, an absorbing layer is provided in the edge tape 50. The absorbing layer is made of an absorbing material and is positioned corresponding to the location of the chip 30. The absorbing layer is combined with the edge tape 51 to address electromagnetic shielding issues. The absorbing layer is also called an electromagnetic noise suppression sheet.

[0102] Optionally, the display module 100 further includes a heat dissipation layer 91. The heat dissipation layer 91 is disposed on the portion of the first substrate 21 that protrudes from the second substrate 22 and is located on a side of the first substrate 21 away from the backlight module 10. The heat dissipation layer 91 covers at least a portion of the side surface of the chip 30. The thermal conductivity of the heat dissipation layer 91 is greater than 10 watts per meter per kelvin.

[0103] In this embodiment, since the thermal conductive layer 40 is part of the edge tape 50, and the edge tape 50 is attached to the side of the second substrate 22 away from the first substrate 21, the thermal conductive layer 40 cannot be directly attached to the side of the chip 30. In order to further improve the heat dissipation effect of the chip 30, this embodiment provides a heat dissipation layer 91 on the side of the first substrate 21 that protrudes from the second substrate 22, and the heat dissipation layer 91 covers at least part of the side of the chip 30. The heat dissipation layer 91 can promptly dissipate the heat generated by the side of the chip 30, thereby reducing the heat accumulated on the side of the chip 30, preventing the chip 30 of the high refresh rate display module 100 from overheating, and reducing its maximum temperature rise to below 40 degrees Celsius, thereby achieving the effect of reducing the maximum temperature rise of the display module 100.

[0104] Optionally, the heat dissipation layer 91 is made of heat dissipation silicone.

[0105] The thermal conductivity of heat-dissipating silicone is within the range of 1 watt per meter per Kelvin to 20 watts per meter per Kelvin. Compared to the related art solution of using UV-curing adhesive to cover the sides of the chip, this embodiment uses heat-dissipating silicone in place of UV-curing adhesive. This can promptly dissipate heat generated by the sides of the chip 30, thereby reducing heat accumulation on the sides of the chip 30, preventing overheating of the chip 30 in the high refresh rate display module 100, and reducing its maximum temperature rise to below 40 degrees Celsius, thereby effectively reducing the maximum temperature rise of the display module 100.

[0106] Optionally, the heat dissipation layer 91 is doped with wave-absorbing particles. When the heat dissipation silica gel is doped with wave-absorbing particles, the thermal conductivity of the heat dissipation layer 91 can be correspondingly improved.

[0107] Optionally, the heat-conducting layer 40 is connected to a side of the heat-dissipating layer 91 away from the backlight module 10 .

[0108] In this embodiment, because the thermal conductive layer 40 is connected to the side of the heat dissipation layer 91 away from the backlight module 10, after the heat dissipation layer 91 dissipates the heat from the side of the chip 30, heat accumulation within the heat dissipation layer 91 is prevented. The heat within the heat dissipation layer 91 is transferred to the thermal conductive layer 40, and then transferred to the backplate 11 through the thermal conductive layer 40, thereby achieving the effect of cooling the chip 30. This reduces the heat accumulated on the surface of the chip 30, prevents the chip 30 of the high refresh rate display module 100 from overheating, and reduces its maximum temperature rise to below 40 degrees Celsius, thereby reducing the maximum temperature rise of the display module 100.

[0109] Optional, see Figure 4 The printed circuit board 70 includes a circuit board body 71 and an electronic component 72 disposed on the circuit board body 71. The electronic component 72 can be a capacitor, a resistor, an inductor, or a chip 30. When the electronic component 72 is working, it generates heat, which also causes the maximum temperature rise of the display module 100 to increase.

[0110] Optionally, the insulating layer 52 is provided with a heat conducting hole, and the heat conducting hole exposes the heat conducting layer 40. The electronic component 72 provided on the circuit board body 71 can be connected to the heat conducting layer 40 through the heat conducting hole.

[0111] Optional, see Figure 4 , the electronic components 72 on the circuit board body 71 are in direct contact with and attached to the heat-conducting layer 40. At this point, the heat generated by the electronic components 72 can be promptly transferred to the backplate 11 of the backlight module 10. Because heat transfer occurs from high temperatures to low temperatures, the heat generated by both the chip 30 and the electronic components 72 is transferred to the backplate 11.

[0112] Optional, see Figure 5 The surface of the electronic component 72 disposed on the circuit board body 71 is covered with a second heat dissipation layer 73. The second heat dissipation layer 73 is made of heat dissipation silicone. The electronic component 72 is connected to the heat conductive layer 40 through the second heat dissipation layer 73. The heat generated by the electronic component 72 can be transferred to the back plate 11 through the second heat dissipation layer 73 and the heat conductive layer 40.

[0113] In the second embodiment of the present application:

[0114] See also Figure 6 Optionally, the material of the heat-conducting layer 40 includes photosensitive adhesive and wave-absorbing particles doped in the photosensitive adhesive, and the material of the wave-absorbing particles includes at least one of metal and silicon.

[0115] In this embodiment, compared to the related art solution of simply curing a photosensitive adhesive on the chip surface, this embodiment dopes the photosensitive adhesive with absorbing particles, and after curing, forms a thermally conductive layer 40. The thermally conductive layer 40 doped with absorbing particles has a greater thermal conductivity than a cured photosensitive adhesive layer without absorbing particles.

[0116] In any photosensitive adhesive, after the heat conducting layer 40 is formed by doping with absorbing particles and curing, the thermal conductivity of the heat conducting layer 40 doped with absorbing particles is greater than that of the cured photosensitive adhesive layer not doped with absorbing particles.

[0117] Compared with the first embodiment, in the second embodiment, the photosensitive adhesive is not only coated on the side of the chip 30, but also on the side of the chip 30 away from the backlight module 10. Because the display module 100 has high requirements on the sealing performance of the chip 30, it is necessary to use photosensitive adhesive to completely encapsulate the chip 30 to reduce the contact of the chip 30 with external water and oxygen. At this time, the edge tape 50 cannot directly contact the chip 30. The second embodiment forms a heat-conducting layer 40 by doping absorbing particles in the photosensitive adhesive. At this time, the thermal conductivity of the heat-conducting layer 40 is greater than the thermal conductivity of the photosensitive adhesive without doping absorbing particles. The heat-conducting layer 40 can promptly conduct the heat generated by the chip 30, thereby reducing the heat accumulated on the surface of the chip 30, avoiding overheating of the chip 30 of the high refresh rate display module 100, and reducing its maximum temperature rise to below 40 degrees Celsius, thereby achieving the effect of reducing the maximum temperature rise of the display module 100.

[0118] Optionally, the absorbing particles are metal, such as iron, aluminum, copper, titanium, or silver. Alternatively, the absorbing particles are non-metallic, such as silicon. Because these absorbing particles have excellent thermal conductivity, the thermal conductivity of a photosensitive adhesive doped with them can be significantly improved.

[0119] Because the second embodiment of the present application incorporates absorbing particles into the photosensitive adhesive, the photosensitive adhesive doped with absorbing particles forms the heat-conducting layer 40 of the second embodiment after curing. In this case, the absorbing particles in the heat-conducting layer 40 can provide electromagnetic shielding for the chip 30. Therefore, it is not necessary to provide an absorbing layer in the edge tape 50, which can reduce production costs. Furthermore, in the related art, the absorbing layer is manually attached to the edge tape, resulting in assembly tolerances. This embodiment eliminates the absorbing layer in the edge tape 50, reducing the assembly tolerances of the edge tape 50. Furthermore, absorbing particles are incorporated into the photosensitive adhesive, which is then coated on the surface of the chip 30 and cured. In this case, the absorbing particles can be uniformly present in the heat-conducting layer 40, eliminating assembly tolerances.

[0120] Optionally, the thermal conductivity of the thermally conductive layer 40 is greater than 10 watts per meter per Kelvin. The thermal conductivity of the thermally conductive layer 40 may be 11 watts per meter per Kelvin, 12 watts per meter per Kelvin, 13 watts per meter per Kelvin, 14 watts per meter per Kelvin, 15 watts per meter per Kelvin, 16 watts per meter per Kelvin, 17 watts per meter per Kelvin, 18 watts per meter per Kelvin, 19 watts per meter per Kelvin, 20 watts per meter per Kelvin, etc. In this embodiment, the higher the thermal conductivity of the thermally conductive layer 40, the more efficient the thermally conductive layer 40 is in transferring heat.

[0121] Optionally, the average particle size of the absorbing particles is in the range of 20 nm to 100 nm to meet high-frequency and broadband (1 MHz to 6 GHz) absorption requirements. The average particle size of the absorbing particles can be 20 nm, 25 nm, 30 nm, 35 nm, 40 nm, 45 nm, 50 nm, 55 nm, 60 nm, 65 nm, 70 nm, 75 nm, 80 nm, 85 nm, 90 nm, 95 nm, 100 nm, etc.

[0122] Optionally, the density of the absorbing particles per unit volume is in the range of 5 grams per cubic centimeter to 8 grams per cubic centimeter. When the density of the absorbing particles per unit volume is within this range, the thermal conductivity of the photosensitive adhesive doped with the absorbing particles can be increased after curing, and the phenomenon of heat accumulation caused by the high density of the absorbing particles can be avoided. The density of the absorbing particles per unit volume can be 5 grams per cubic centimeter, 5.1 grams per cubic centimeter, 5.2 grams per cubic centimeter, 5.3 grams per cubic centimeter, 5.4 grams per cubic centimeter, 5.5 grams per cubic centimeter, 5.6 grams per cubic centimeter, 5.7 grams per cubic centimeter, 5.8 grams per cubic centimeter, 5.9 grams per cubic centimeter, 6.0 grams per cubic centimeter, 6.1 grams per cubic centimeter, 6.2 grams per cubic centimeter, 6.3 grams per cubic centimeter, 6.4 grams per cubic centimeter. cm3, 6.5 grams per cubic centimeter, 6.6 grams per cubic centimeter, 6.7 grams per cubic centimeter, 6.8 grams per cubic centimeter, 6.9 grams per cubic centimeter, 7.0 grams per cubic centimeter, 7.1 grams per cubic centimeter, 7.2 grams per cubic centimeter, 7.3 grams per cubic centimeter, 7.4 grams per cubic centimeter, 7.5 grams per cubic centimeter, 7.6 grams per cubic centimeter, 7.7 grams per cubic centimeter, 7.8 grams per cubic centimeter, 7.9 grams per cubic centimeter, 8.0 grams per cubic centimeter, etc.

[0123] Optionally, the ratio of the volume of the absorbing particle-filled portion of the photosensitive adhesive to the overall volume of the photosensitive adhesive is within a range of 20% to 50%. This ratio increases the thermal conductivity of the photosensitive adhesive doped with absorbing particles after curing and prevents heat accumulation caused by excessive density of the absorbing particles. Examples of this ratio include 20%, 25%, 30%, 35%, 40%, 45%, and 50%.

[0124] Optionally, the heat conducting layer 40 covers a surface of the chip 30 away from the backlight module 10 and a side surface of the chip 30 .

[0125] Because the thermally conductive layer 40 is formed by curing a photosensitive adhesive doped with absorbing particles, when applying the photosensitive adhesive, it can be applied not only on the side of the chip 30 facing away from the backlight module 10, but also on the side of the chip 30. During curing, the side of the chip 30 facing away from the backlight module 10 and the photosensitive adhesive on the side of the chip 30 form the thermally conductive layer 40. The thermally conductive layer 40 located on the side of the chip 30 can promptly dissipate heat generated on the side of the chip 30, thereby reducing the heat accumulated on the side of the chip 30, preventing the chip 30 of the high refresh rate display module 100 from overheating, and reducing its maximum temperature rise to below 40 degrees Celsius, thereby achieving the effect of reducing the maximum temperature rise of the display module 100.

[0126] Optionally, the display module 100 further includes an edge tape 50 , and the edge tape 50 includes an edge layer 51 and an insulating layer 52 .

[0127] The edging layer 51 wraps around the second substrate 22 and the backlight module 10. The edging layer 51 is connected to the thermally conductive layer 40. One end of the edging layer 51 is connected to the side of the second substrate 22 away from the first substrate 21. The other end of the edging layer 51 extends to the side of the backlight module 10 away from the display panel 20 and is connected to the backlight module 10.

[0128] The insulating layer 52 is stacked on a side of the edge layer 51 close to the second substrate 22 and the backlight module 10. Both ends of the edge layer 51 are protruding from the insulating layer 52.

[0129] In this embodiment, the edge tape 50 includes an edge layer 51 and an insulating layer 52 , but does not include an absorbing layer and an additional heat-conducting film layer, thereby reducing production costs.

[0130] See also Figure 6 Optionally, the thermal conductive layer 40 includes a first coating layer 41, a second coating layer 42, and a third coating layer 43. The first coating layer 41 covers the side of the chip 30 away from the backlight module 10 and connects the chip 30 to the edge layer 51. The second coating layer 42 is connected to the first coating layer 41 and covers the side of the chip 30. The third coating layer 43 is connected to the second coating layer 42 and is provided on the portion of the first substrate 21 that protrudes from the second substrate 22.

[0131] In this embodiment, the heat-conducting layer 40 may also be coated on the portion of the first substrate 21 protruding from the second substrate 22 to form a third coating layer 43. The formation of the third coating layer 43 facilitates the curing and forming of the heat-conducting layer 40.

[0132] See also Figure 7 Optionally, the second coating layer 42 connects the chip 30 and the edge layer 51 .

[0133] In this embodiment, after the second coating layer 42 dissipates heat from the sides of the chip 30, it prevents heat accumulation within the second coating layer 42. Instead, the heat within the second coating layer 42 is transferred to the edge layer 51, and then to the backplane 11 through the edge layer 51, achieving the effect of dissipating heat from the chip 30. This reduces heat accumulation on the surface of the chip 30, preventing overheating of the chip 30 in the high refresh rate display module 100 and lowering its maximum temperature rise to below 40 degrees Celsius, thereby reducing the maximum temperature rise of the display module 100.

[0134] See also Figure 7 Optionally, the third coating layer 43 is connected to the edge layer 51 .

[0135] In this embodiment, after the third coating layer 43 dissipates heat from the sides of the chip 30, heat accumulation within the third coating layer 43 is prevented. Instead, the heat within the third coating layer 43 is transferred to the edge layer 51, and then to the backplane 11 through the edge layer 51, thereby dissipating heat from the chip 30. This reduces heat accumulation on the surface of the chip 30, preventing overheating of the chip 30 in the high refresh rate display module 100 and lowering its maximum temperature rise to below 40 degrees Celsius, thereby reducing the maximum temperature rise of the display module 100.

[0136] The above describes in detail the specific embodiments of the present application. The above embodiments disclosed in this application are merely preferred embodiments of the present application. Those skilled in the art will appreciate that many variations and improvements can be made without departing from the spirit of the present application. These variations and improvements fall within the scope of protection defined by the claims of this application.

Claims

1. A display module, characterized in that: include: Backlight module; The display panel includes a first substrate and a second substrate stacked on the light-emitting side of the backlight module, wherein one side edge of the first substrate protrudes from the second substrate; a chip, bound to a portion of the first substrate protruding from the second substrate, and located on a side of the first substrate away from the backlight module; as well as The heat-conducting layer is at least arranged on a side of the chip away from the backlight module, and the thermal conductivity of the heat-conducting layer is greater than 10 watts per meter per Kelvin.

2. The display module according to claim 1, wherein: The display module further includes an edge tape, and the edge tape includes: an edge layer, the edge layer covering the periphery of the second substrate and the backlight module, one end of the edge layer being connected to a side of the second substrate away from the first substrate, and the other end of the edge layer extending to a side of the backlight module away from the display panel and connected to the backlight module; and The heat-conducting layer is stacked on the side of the edging layer close to the chip, one end of the heat-conducting layer covers the side of the chip away from the backlight module, and the other end of the heat-conducting layer extends to connect with the backlight module, and the thermal conductivity of the heat-conducting layer is greater than the thermal conductivity of the edging layer.

3. The display module according to claim 2, wherein: The thermal conductivity of the thermally conductive layer is greater than or equal to 450 watts per meter per Kelvin; The thermal conductivity of the edge layer is less than 450 watts per meter per Kelvin.

4. The display module according to claim 2, wherein: The material of the heat-conducting layer includes graphene, and the material of the edge layer includes metal.

5. The display module according to claim 2, wherein: The edge tape further includes an insulating layer, which is stacked on a side of the heat-conducting layer away from the edge layer, and the thermal conductivity of the insulating layer is smaller than the thermal conductivity of the heat-conducting layer; Among them, the end of the thermal conductive layer close to the first substrate protrudes from the end of the insulating layer and covers the side of the chip away from the backlight module. The end of the thermal conductive layer close to the backlight module protrudes from the end of the insulating layer and is connected to the side of the backlight module away from the first substrate.

6. The display module according to claim 2, wherein: The backlight module includes: a back plate, disposed opposite to the first substrate; and a side plate, arranged around the edge of the back plate and located on a side of the back plate close to the first substrate; Wherein, one end of the heat conducting layer away from the first substrate is connected to a side of the back plate away from the first substrate; The edge layer comprises: a metal layer comprising a first sub-portion and a second sub-portion connected to each other, wherein the first sub-portion is stacked on a side of the heat-conducting layer away from the chip, and the second sub-portion is protruding from the heat-conducting layer and located on a side of the backplane away from the first substrate; and The first adhesive layer includes a first sub-segment and a second sub-segment connected to each other, the first sub-segment is located between the first sub-section and the thermal conductive layer, and connects the metal layer and the thermal conductive layer, and the second sub-segment is located between the second sub-section and the back plate, and connects the second sub-section and the back plate.

7. The display module according to claim 1, wherein: The material of the heat-conducting layer includes photosensitive adhesive and wave-absorbing particles doped in the photosensitive adhesive, and the material of the wave-absorbing particles includes at least one of metal and silicon.

8. The display module according to claim 7, wherein: The heat-conducting layer covers a side of the chip away from the backlight module and a side surface of the chip; The display module further includes an edge tape, and the edge tape includes: an edge layer, the edge layer covering the periphery of the second substrate and the backlight module, the edge layer being connected to the heat-conducting layer, one end of the edge layer being connected to a side of the second substrate away from the first substrate, and the other end of the edge layer extending to a side of the backlight module away from the display panel and being connected to the backlight module; and An insulating layer is stacked on a side of the edge layer close to the second substrate and the backlight module, and two ends of the edge layer are protruded from the insulating layer.

9. The display module according to claim 8, wherein: The heat conducting layer comprises: a first coating layer, covering a side of the chip away from the backlight module and connecting the chip and the edge layer; a second coating layer connected to the first coating layer and covering the side surfaces of the chip; and The third coating layer is connected to the second coating layer, and the third coating layer is provided on a portion of the first substrate protruding from the second substrate.

10. The display module according to any one of claims 1 to 6, wherein: The display module further includes a heat dissipation layer, which is provided on a portion of the first substrate protruding from the second substrate and located on a side of the first substrate away from the backlight module, and covers at least a portion of a side surface of the chip; Wherein, the thermal conductivity of the heat dissipation layer is greater than 10 watts per meter per Kelvin.

11. The display module according to claim 10, wherein: The material of the heat dissipation layer is heat dissipation silica gel; The heat-conducting layer is connected to a side of the heat-dissipating layer away from the backlight module.

12. The display module according to any one of claims 1 to 9, wherein: The display module further includes: A support plate connected to a side surface of the backlight module; A printed circuit board is located on the side of the backlight module and is arranged on the support plate; a flexible circuit board, one end of which is bound to a portion of the first substrate protruding from the second substrate and located on a side of the chip away from the second substrate, and the other end of which is bound to the printed circuit board; and The heat dissipation adhesive layer is provided on the side of the first substrate protruding from the second substrate and is connected to a side of the flexible circuit board close to the backlight module.

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