Intelligent flexible regulation and control terminal heat dissipation control method and device

Abstract

The invention provides an intelligent flexible regulation and control terminal heat dissipation control method and device, and belongs to the technical field of power grid system equipment control. The method comprises the following steps: determining a heat conduction path for transferring heat from the interior of a chip to an external environment based on physical structure parameters of chip packaging; defining a thermal resistance element based on the thermal conduction path; the position parameters of a heating source in the chip are obtained, a heat conduction path is divided into a plurality of areas, and each area corresponds to one thermal resistance element; determining a heat transfer mode based on the heat conduction path, and determining a thermal resistance value of the thermal resistance element based on the heat transfer mode; and the thermal resistance elements are combined in series or in parallel, and the total thermal resistance value of the combined thermal resistance elements is solved. According to the heat dissipation control method of the intelligent flexible regulation and control terminal provided by the invention, the chip temperature can be effectively reduced, and stable operation of equipment in a high-load and high-temperature environment is ensured.

Description

Technical Field

[0001] The present application belongs to the technical field of power grid system equipment control, and specifically relates to a method and device for controlling heat dissipation of an intelligent flexible control terminal. Background Art

[0002] With the rapid development of electronic technology, intelligent flexible control terminals have been widely used in daily life and industrial applications, especially in smart grid systems.

[0003] These devices typically integrate multiple functional components, including high-performance processors, sensors, and communication modules, enabling complex computing, data processing, and real-time communication tasks. However, as device performance improves, power consumption also increases, generating significant heat within the chip. If heat isn't effectively dissipated, excessive chip temperatures can impact device performance, reliability, and lifespan, potentially even causing failure or damage. Summary of the Invention

[0004] In order to solve at least one technical problem existing in the background technology, the present application provides an intelligent and flexible terminal heat dissipation control method, which can effectively reduce the chip temperature and ensure the stable operation of the device under high load and high temperature environment.

[0005] The second embodiment of the present application provides an intelligent and flexible terminal heat dissipation control device.

[0006] The technical solutions adopted in this application are:

[0007] The first embodiment of the present application provides a method for controlling heat dissipation of an intelligent and flexible terminal, comprising:

[0008] Based on the physical structural parameters of the chip package, determine the heat conduction path from the inside of the chip to the external environment;

[0009] defining a thermal resistance element based on the heat conduction path;

[0010] Obtaining the position parameters of the heat source inside the chip, and dividing the heat conduction path into a plurality of regions, each region corresponding to one of the thermal resistance elements;

[0011] determining a heat transfer mode based on the heat conduction path, and determining a thermal resistance value of the thermal resistance element based on the heat transfer mode;

[0012] The thermal resistance elements are combined in series or in parallel to calculate the total thermal resistance value of the combined thermal resistance elements.

[0013] According to the intelligent flexible control terminal heat dissipation control method provided by the embodiment of the first aspect of the present application, first, based on the physical structure parameters of the chip package, the thermal conduction path for heat to be transferred from the inside of the chip to the external environment is determined, that is, by performing a detailed analysis of the physical structure of the chip package, the specific path for heat to be transferred from the inside of the chip to the external environment is determined. This step is the basis of the entire heat dissipation control method, because it determines the definition and combination of subsequent thermal resistance elements. Through detailed physical structure analysis, each path of heat transfer can be accurately identified, avoiding the rough estimation of the heat conduction path in traditional heat dissipation design, thereby providing a solid foundation for the subsequent definition of thermal resistance elements; thermal resistance elements are defined based on the heat conduction path, and each thermal resistance element represents a specific area in the heat conduction path, which is used to describe the thermal conduction resistance of the area. This step decomposes the complex heat conduction problem into multiple quantifiable The third step is to obtain the location parameters of the heat source inside the chip and divide the heat conduction path into several regions, each corresponding to a thermal resistance element. By accurately obtaining the location and power density distribution of the heat source, the heat dissipation design can be optimized in a targeted manner, avoiding the blind addition of heat dissipation materials or design redundancy, and improving heat dissipation efficiency. The fourth step is to determine the heat transfer method based on the heat conduction path and the thermal resistance value of the thermal resistance element based on the heat transfer method. By calculating the thermal resistance value based on different heat transfer methods, the thermal resistance value of each thermal resistance element is ensured to be accurate, avoiding the rough estimation of thermal resistance value in traditional heat dissipation design and improving the reliability of the heat dissipation system. Finally, the thermal resistance elements are combined in series or parallel to calculate the total thermal resistance value of the combined thermal resistance elements. Through the reasonable combination of thermal resistance elements, the total thermal resistance value can be effectively reduced, thereby improving heat dissipation efficiency. Especially in complex heat conduction paths, a reasonable combination can significantly reduce the resistance to heat transfer, ensuring that the chip temperature always remains within a safe range. In summary, the intelligent flexible terminal heat dissipation control method provided in the embodiment of the first aspect of the present application can effectively reduce the chip temperature and ensure stable operation of the device under high load and high temperature environment.

[0014] According to one embodiment of the present application, the heat conduction path includes chip-substrate type heat conduction, substrate-heat sink type heat conduction, heat sink-air type heat conduction and chip-PCB type heat conduction.

[0015] According to one embodiment of the present application, the thermal resistance element is defined based on the heat conduction path, specifically:

[0016] Obtain the thermal conductivity and thickness parameters of the chip substrate and solder layer respectively;

[0017] Determine the material type of the substrate and the connection method between the substrate and the chip, and obtain the thickness and area of the substrate;

[0018] Obtaining the material type of the heat sink and the interface material between the heat sink and the substrate, and obtaining the size, shape, and heat dissipation surface area of the heat sink;

[0019] Get the copper thickness and thermal via diameter on the PCB.

[0020] According to an embodiment of the present application, the heat source position parameters inside the chip are obtained, and the heat conduction path is divided into several regions, each region corresponding to one thermal resistance element, specifically:

[0021] Determining the power density distribution of the heat source based on the temperature distribution of the chip under different workloads;

[0022] Based on the power density distribution, the heat conduction path is divided into a heat source region, a heat source-substrate transition region, a substrate-heat sink region, and a heat sink-air region;

[0023] Among them, the thermal resistance element corresponding to the heat source area is heat conduction thermal resistance, the thermal resistance elements corresponding to the heat source-substrate transition area and the substrate-heat sink area are interface thermal resistance, and the thermal resistance element corresponding to the heat sink-air area is convection thermal resistance.

[0024] According to one embodiment of the present application, the heat transfer mode is determined based on the heat conduction path, and the thermal resistance value of the thermal resistance element is determined based on the heat transfer mode, specifically:

[0025] The heat transfer methods include conduction, convection and radiation;

[0026] When the heat transfer mode is conduction, the thermal resistance value R of the thermal resistance element is con d is:

[0027] R cond =kAL

[0028] Where L is the thickness of the substrate in m, k is the thermal conductivity of the substrate material in W / m·K, and A is the heat transfer area in m 2 ;

[0029] When the heat transfer mode is convection, the thermal resistance value R of the thermal resistance element is conv for:

[0030] R conv =1 / hA

[0031] Where h is the convective heat transfer coefficient, in W / m 2 K, A is the heat transfer area, unit is m 2 ;

[0032] When the heat transfer mode is radiation, the thermal resistance value R ra d is:

[0033]

[0034] Where ∈ is the emissivity of the object surface, 0≤∈≤1, and σ is the Stefan-Boltzmann constant, σ=5.67×10 -8 W / m 2 ·K 4 , A is the heat transfer area, unit is m 2 , T1 and T2 are the absolute temperatures of the object surface and the environment respectively, in K.

[0035] According to one embodiment of the present application, the thermal resistance elements are combined in series or in parallel to calculate the total thermal resistance value of the combined thermal resistance elements, specifically:

[0036] For n series connected thermal resistance elements R1, R2, ..., R n , total thermal resistance R total for:

[0037] R total =R1+R2+……+R n ;

[0038] For n parallel thermal resistance elements R1, R2, ..., R n , total thermal resistance R tota l is:

[0039]

[0040] According to one embodiment of the present application, the method further includes:

[0041] Calculating the maximum temperature rise of the chip junction based on the total thermal resistance value;

[0042] A load condition of the heat dissipation system is determined based on the maximum temperature rise value.

[0043] A second embodiment of the present application provides an intelligent and flexible terminal heat dissipation control device, comprising:

[0044] A first determining module is used to determine a heat conduction path for heat to be transferred from the inside of the chip to the external environment based on the physical structural parameters of the chip package;

[0045] a definition module, configured to define a thermal resistance element based on the heat conduction path;

[0046] an acquisition module, configured to acquire position parameters of a heat source inside the chip and divide the heat conduction path into a plurality of regions, each region corresponding to one of the thermal resistance elements;

[0047] a second determining module, configured to determine a heat transfer mode based on the heat conduction path, and determine a thermal resistance value of the thermal resistance element based on the heat transfer mode;

[0048] The calculation module is used to combine the thermal resistance elements in series or in parallel to calculate the total thermal resistance value of the combined thermal resistance elements.

[0049] An embodiment of the third aspect of the present application provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, the intelligent flexible control terminal heat dissipation control method described in any embodiment of the first aspect as described above is implemented.

[0050] The fourth aspect of the present application provides a non-volatile computer storage medium storing computer executable instructions. When the computer executes the executable instructions, it implements the intelligent flexible control terminal heat dissipation control method in any embodiment of the first aspect described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0052] Figure 1 A flow chart of a method for controlling heat dissipation of a terminal with intelligent and flexible control provided in an embodiment of the present application;

[0053] Figure 2 A schematic diagram of the structure of the intelligent flexible control terminal heat dissipation control device provided in an embodiment of the present application;

[0054] Figure 3 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

[0055] Reference numerals:

[0056] 110, first determination module; 120, definition module; 130, acquisition module; 140, second determination module; 150, calculation module;

[0057] 810 , processor; 820 , communication interface; 830 , memory; 840 , communication bus. DETAILED DESCRIPTION

[0058] In order to more clearly illustrate the overall concept of the present application, a detailed description is given below in an illustrative manner in conjunction with the accompanying drawings.

[0059] The following description sets forth many specific details to facilitate a thorough understanding of the present application. However, the present application may also be implemented in other ways than those described herein, and therefore, the scope of protection of the present application is not limited by the specific embodiments disclosed below. It should be noted that the embodiments of the present application and the features of each embodiment may be combined with each other unless there is a conflict.

[0060] In this application, unless otherwise expressly specified and limited, a first feature "above" or "below" a second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more embodiments or examples.

[0061] like Figure 1 As shown, the first embodiment of the present application provides an intelligent and flexible terminal heat dissipation control method, including:

[0062] Step 100: Determine a heat conduction path for transferring heat from the inside of the chip to the external environment based on the physical structural parameters of the chip package.

[0063] Step 200: Define a thermal resistance element based on a heat conduction path.

[0064] Step 300: Obtain the position parameters of the heat source inside the chip, and divide the heat conduction path into several areas, each area corresponding to a thermal resistance element.

[0065] Step 400: Determine a heat transfer mode based on the heat conduction path, and determine a thermal resistance value of a thermal resistance element based on the heat transfer mode.

[0066] Step 500: Combine thermal resistance elements in series or in parallel, and calculate the total thermal resistance value of the combined thermal resistance elements.

[0067] In step 100, obtaining detailed physical structural parameters of the chip package is the basis for determining the heat conduction path. These parameters include but are not limited to:

[0068] Chip size and shape: The length, width, height and geometric shape of the chip affect the distribution and transfer path of heat inside the chip.

[0069] Material properties: The material type and thermophysical properties of components such as the chip substrate, solder layer, baseplate, heat sink, and PCB, as well as their thermal conductivity (k), density, and specific heat capacity. Thermal conductivity varies significantly between materials, directly impacting the efficiency of heat transfer.

[0070] Thickness and number of layers: The thickness of each layer of material (such as chip substrate, solder layer, baseboard, etc.) and the number of layers (such as multi-layer PCB) determine the distance and path complexity of heat transfer.

[0071] Connection method: The connection method between the chip and the substrate (such as welding, bonding, pressing, etc.), as well as the interface material between the substrate and the heat sink (such as thermal grease, thermal pad, etc.) affect the interface thermal resistance.

[0072] Radiator design: The shape, size, number and arrangement of fins, heat dissipation surface area, etc. of the radiator determine the effect of convection heat transfer.

[0073] PCB design: The thickness of the copper layer on the PCB, the diameter and distribution of the heat dissipation holes, the number and location of vias, etc., affect the efficiency of heat transfer from the chip to the PCB.

[0074] By analyzing the physical structure of the chip package, we can identify the specific path by which heat is transferred from the chip to the external environment. This step is the foundation of the entire heat dissipation control method because it determines the definition and combination of subsequent thermal resistance components. Specific methods include the following:

[0075] Internal heat conduction within the chip: Heat is first transferred from the chip junction to the chip surface, usually through the chip substrate material. The heat conduction path within the chip depends on the chip's geometry and material properties.

[0076] Chip-to-substrate heat conduction: Heat is transferred from the chip surface to the substrate through the solder layer. The thickness and material properties of the solder layer have a significant impact on the heat conduction efficiency.

[0077] Substrate-to-heat sink heat conduction: Heat is transferred from the substrate to the heat sink, typically through an interface material such as thermal grease or a thermal pad. The contact area between the substrate and the heat sink and the choice of interface material determine the interfacial thermal resistance.

[0078] Radiator-to-air heat transfer: Heat is transferred from the radiator to the air through natural or forced convection. Radiator design parameters such as shape, size, number of fins, and arrangement have a significant impact on the effectiveness of convective heat transfer.

[0079] Chip-to-PCB heat conduction: Heat is transferred from the chip through pads and vias to the copper layer or other heat dissipation structures on the PCB. Design parameters such as the thickness of the copper layer on the PCB and the aperture and distribution of the heat dissipation holes affect the heat transfer efficiency.

[0080] Furthermore, through detailed analysis of the heat conduction path, possible bottlenecks and optimization space can be identified, and targeted improvement measures can be proposed. For example:

[0081] Reducing interface thermal resistance: The interface thermal resistance can be effectively reduced by using high-efficiency thermal conductive materials (such as thermal grease, thermal pads) or optimizing the interface contact method (such as increasing the contact area and reducing the gap).

[0082] Increase the surface area of the heat sink: The efficiency of convective heat transfer can be improved by increasing the number of fins on the heat sink, optimizing the fin arrangement, or increasing the overall size of the heat sink.

[0083] Improve PCB design: By increasing the thickness of the copper layer on the PCB, optimizing the distribution and number of heat dissipation holes, and properly designing the via locations, the efficiency of heat transfer from the chip to the PCB can be improved.

[0084] Introduce forced convection: When natural convection is not effective, you can introduce fans or other forced convection devices to increase air flow speed and further improve the heat dissipation effect.

[0085] Step 100 determines the heat conduction path from the inside of the chip to the external environment based on the physical structural parameters of the chip package, which is the basis of the entire intelligent flexible control terminal heat dissipation control method. This step can not only accurately model and improve the accuracy of the heat dissipation design, but also optimize the heat dissipation path, improve the adaptability and flexibility of the heat dissipation system, reduce manufacturing costs, and provide important basic data for intelligent heat dissipation control. Through this key step, it can ensure that the intelligent flexible control terminal operates stably under high load and high temperature environments, meeting users' needs for high performance, long battery life and reliability.

[0086] In step 200, the thermal resistance element is a quantitative model that describes the resistance during heat transfer. By defining the thermal resistance element, the complex heat conduction problem can be decomposed into multiple quantifiable parts, facilitating subsequent calculations and optimization.

[0087] Step 200 defines thermal resistance elements based on the heat conduction path, breaking down the complex heat conduction problem into multiple quantifiable components, making the heat transfer process clearer and more intuitive. This step not only quantifies thermal resistance and improves the accuracy of heat dissipation design, but also enables modular design, enhancing the flexibility of the heat dissipation system, reducing design complexity, simplifying subsequent calculations, and providing important data support for intelligent heat dissipation control.

[0088] In step 300, determining the location of the heat source and the power density distribution within the chip is key to optimizing the heat dissipation design. The location and power density of the heat source directly affect the path and efficiency of heat transfer, so these parameters must be accurately obtained. The acquisition methods include the following:

[0089] Measuring temperature distribution: Use an infrared thermal imager, thermocouple, or other temperature sensor to measure the temperature distribution on the chip surface under actual operating conditions. By analyzing the temperature distribution data, you can identify the area with the highest temperature on the chip surface, known as the hot spot, and thus determine the geometric center of the heat source.

[0090] Thermal simulation: Use thermal simulation software (such as Ansys and Flotherm) to simulate the temperature distribution of the chip under different workloads. Thermal simulation can predict the location of heat sources and power density distribution based on the chip's operating conditions (such as different frequencies and power consumption modes), providing more detailed thermal analysis results.

[0091] Power density distribution: By analyzing the chip's operating principles and circuit design, we determine the power consumption of each functional module. Typically, high-power components such as the CPU, GPU, and power management module are the main sources of heat.

[0092] Based on the location of the heat source and the power density distribution, the heat conduction path is divided into several regions, each corresponding to a thermal resistance element. This regional division helps to more accurately describe the heat transfer process and provides a basis for subsequent thermal resistance value calculation and combination.

[0093] The principles of regional division generally include the following aspects:

[0094] Based on power density distribution: The heat conduction path is divided into different zones based on the power density distribution of the heat source. Areas with higher power density should be optimized to ensure that heat can be transferred quickly and efficiently. For example, areas where high-power modules such as the CPU and GPU are located should prioritize heat dissipation design.

[0095] Based on the physical properties of the heat conduction path: The entire cooling system is divided into multiple regions based on the physical properties of the heat conduction path, with each region corresponding to a thermal resistance element. For example, heat conduction within the chip, the interface between the chip and the substrate, the interface between the substrate and the heat sink, and convection between the heat sink and the air can all be analyzed as independent regions.

[0096] Heat sink-based design: Divide the heat sink into multiple regions based on its shape, size, number of fins, and arrangement. For example, the center and edge regions of a heat sink may have different convective heat transfer efficiencies and therefore require separate analysis and optimization.

[0097] Based on PCB design: Divide the PCB into multiple areas based on the copper thickness, diameter, and distribution of thermal vias. For example, areas near the chip should have thicker copper and more thermal vias to improve heat dissipation efficiency.

[0098] Step 300 achieves refined management of the heat transfer process by obtaining the location parameters of the heat source within the chip and dividing the heat conduction path into several regions, each corresponding to a thermal resistance element. This step not only accurately locates the heat source and optimizes the heat dissipation design, but also refines the management of thermal resistance elements, improving design accuracy, reducing design complexity, simplifying subsequent calculations, and providing important data support for intelligent heat dissipation control.

[0099] In step 400, the heat transfer method is determined based on the different parts of the heat conduction path. Heat transfer occurs primarily through three methods: conduction, convection, and radiation. Different heat transfer methods determine the type of thermal resistance element and the calculation method. Therefore, accurately identifying the heat transfer method is a prerequisite for calculating the thermal resistance value.

[0100] Conductive heat transfer: When heat is transferred through a solid material, it's called conductive heat transfer. This occurs primarily within solid materials like chip substrates, solder layers, and baseplates. The efficiency of conductive heat transfer depends on the material's thermal conductivity, thickness, and heat transfer area.

[0101] Convective heat transfer: When heat is transferred through a fluid, such as air, it's called convection heat transfer. Convective heat transfer primarily occurs between the heat sink surface and the air. The efficiency of convection heat transfer depends on the convection heat transfer coefficient, the heat transfer area, and the air velocity and temperature difference.

[0102] Radiative heat transfer: When heat is transferred via electromagnetic waves, it is called radiative heat transfer. Radiative heat transfer primarily occurs between a hot surface and its surroundings. The efficiency of radiative heat transfer depends on the surface's emissivity, the Stefan-Boltzmann constant, and the absolute temperature difference between the surface and the surroundings.

[0103] Step 400 accurately models and quantifies the heat transfer process by determining the heat transfer method based on the heat conduction path and the thermal resistance of the thermal resistor based on the heat transfer method. This step not only improves the accuracy of thermal resistance calculations and optimizes the thermal resistance characteristics of the cooling system, but also supports intelligent heat dissipation control, improving the reliability and stability of the cooling system.

[0104] In step 500, the total thermal resistance value of the combined thermal resistance elements is calculated by combining them in a reasonable manner. This is a core step in the entire heat dissipation control method, as it directly determines the overall performance of the heat dissipation system. Depending on the path and method of heat transfer, the thermal resistance elements can be combined in series or in parallel, or a complex combination of the two.

[0105] Series combination: When heat passes through multiple thermal resistors sequentially, the components are connected in series. Series combination is suitable when heat is transferred along a single path, such as from a chip to a substrate and then to a heat sink.

[0106] Parallel combination: When heat can be transferred to the same destination via multiple paths, the components are in parallel. Parallel combination is suitable for situations where heat can be transferred simultaneously via multiple paths, such as convection and radiation on the surface of a heat sink.

[0107] Mixed combination: In actual applications, heat transfer is often not a single series or parallel connection, but a mixture of the two. For example, heat transfer from the chip to the substrate is in series, while heat transfer from the substrate to the heat sink and PCB is in parallel.

[0108] In the embodiment of the present application, the smaller the total thermal resistance value is, the better the heat dissipation effect is.

[0109] Step 500 optimizes the overall cooling system by combining thermal resistors in series or parallel and calculating the total thermal resistance of the combined thermal resistors. This step not only optimizes the total thermal resistance and improves cooling efficiency, but also increases design flexibility, adapting to various application scenarios, and supporting intelligent cooling control, reducing manufacturing costs and improving economic benefits.

[0110] According to the intelligent flexible control terminal heat dissipation control method provided by the embodiment of the first aspect of the present application, first, based on the physical structure parameters of the chip package, the thermal conduction path for heat to be transferred from the inside of the chip to the external environment is determined, that is, by performing a detailed analysis of the physical structure of the chip package, the specific path for heat to be transferred from the inside of the chip to the external environment is determined. This step is the basis of the entire heat dissipation control method, because it determines the definition and combination of subsequent thermal resistance elements. Through detailed physical structure analysis, each path of heat transfer can be accurately identified, avoiding the rough estimation of the heat conduction path in traditional heat dissipation design, thereby providing a solid foundation for the subsequent definition of thermal resistance elements; thermal resistance elements are defined based on the heat conduction path, and each thermal resistance element represents a specific area in the heat conduction path, which is used to describe the thermal conduction resistance of the area. This step decomposes the complex heat conduction problem into multiple quantifiable The third step is to obtain the location parameters of the heat source inside the chip and divide the heat conduction path into several regions, each corresponding to a thermal resistance element. By accurately obtaining the location and power density distribution of the heat source, the heat dissipation design can be optimized in a targeted manner, avoiding the blind addition of heat dissipation materials or design redundancy, and improving heat dissipation efficiency. The fourth step is to determine the heat transfer method based on the heat conduction path and the thermal resistance value of the thermal resistance element based on the heat transfer method. By calculating the thermal resistance value based on different heat transfer methods, the thermal resistance value of each thermal resistance element is ensured to be accurate, avoiding the rough estimation of thermal resistance value in traditional heat dissipation design and improving the reliability of the heat dissipation system. Finally, the thermal resistance elements are combined in series or parallel to calculate the total thermal resistance value of the combined thermal resistance elements. Through the reasonable combination of thermal resistance elements, the total thermal resistance value can be effectively reduced, thereby improving heat dissipation efficiency. Especially in complex heat conduction paths, a reasonable combination can significantly reduce the resistance to heat transfer, ensuring that the chip temperature always remains within a safe range. In summary, the intelligent flexible terminal heat dissipation control method provided in the embodiment of the first aspect of the present application can effectively reduce the chip temperature and ensure stable operation of the device under high load and high temperature environment.

[0111] In some embodiments of the present application, the heat conduction path includes chip-substrate heat conduction, substrate-heat sink heat conduction, heat sink-air heat conduction, and chip-PCB heat conduction.

[0112] Specifically, chip-to-substrate heat conduction refers to the transfer of heat from the inside of the chip to the substrate, substrate-to-heat sink heat conduction refers to the transfer of heat from the substrate to the heat sink, heat sink-to-air heat conduction refers to the transfer of heat from the heat sink to the air, and chip-to-PCB heat conduction refers to the transfer of heat from the chip through pads and vias to the copper clad layer or other heat dissipation structures on the PCB.

[0113] By breaking down the heat transfer path into four main components (chip-substrate, substrate-heat sink, heat sink-air, and chip-PCB), we can more comprehensively describe the entire process of heat transfer from the chip interior to the external environment. This refined modeling approach avoids the crude estimation of the heat transfer path in traditional thermal design, ensuring the scientific and reliable thermal design.

[0114] Each heat transfer path has its own unique characteristics and influencing factors. For example, chip-to-substrate heat transfer is primarily influenced by the solder layer and interface material; substrate-to-heat sink heat transfer depends on the choice of thermal grease or thermal pad; heat sink-to-air heat transfer is closely related to heat sink design and air flow conditions; and chip-to-PCB heat transfer depends on the copper thickness and via distribution on the PCB. By optimizing each link, heat dissipation efficiency can be significantly improved.

[0115] In some embodiments of the present application, a thermal resistance element is defined based on a heat conduction path, specifically:

[0116] Obtain the thermal conductivity and thickness parameters of the chip substrate and solder layer respectively;

[0117] Determine the material type of the substrate and the connection method between the substrate and the chip, and obtain the thickness and area of the substrate;

[0118] Obtain the material type of the heat sink and the interface material between the heat sink and the substrate, and obtain the size, shape and heat dissipation surface area of the heat sink;

[0119] Get the copper thickness and thermal via diameter on the PCB.

[0120] Specifically, the chip substrate and solder layer are key components in transferring heat from the chip to the substrate. By determining the thermal conductivity and thickness parameters of these materials, the thermal resistance of the chip-to-substrate heat transfer can be accurately calculated. The chip substrate is typically made of silicon (Si), gallium arsenide (GaAs), or other semiconductor materials. The thermal conductivity of different materials varies significantly, directly affecting the efficiency of heat transfer. The solder layer secures the chip to the substrate. Common solder materials include tin-silver-copper (SnAgCu) and tin-lead (SnPb). The thickness of the solder layer typically ranges from tens to hundreds of microns, and its thermal conductivity also affects the efficiency of heat transfer. The substrate is a crucial intermediary for transferring heat from the chip to the heat sink. The substrate's material type, thickness, area, and connection method to the chip all affect the efficiency of heat transfer. Therefore, determining these parameters is crucial for optimizing substrate-to-heat sink heat transfer. Common substrate materials include ceramic substrates (such as alumina and aluminum nitride), metal substrates (such as copper and aluminum), and organic substrates (such as FR-4). The thermal conductivity of different materials varies significantly, directly affecting the efficiency of heat transfer. The connection between the substrate and the chip is typically achieved through welding, bonding, or press-fitting. Different connection methods affect the interfacial thermal resistance. For example, welding generally offers lower interfacial thermal resistance, while bonding can introduce higher interfacial resistance. The thickness and area of the substrate determine the distance and path of heat transfer. A thicker substrate increases thermal resistance, while a larger area helps disperse heat and reduce local temperatures. The heat sink is a key component in transferring heat from the substrate to the air. The heat sink's material type, size, shape, and the interface material with the substrate all affect the efficiency of convective and radiative heat transfer. Common heat sink materials include aluminum, copper, and aluminum alloys. The thermal conductivity of different materials varies significantly, directly impacting the efficiency of heat transfer. The interface material between the heat sink and the substrate is typically thermal grease, thermal pads, or phase change materials. The thermal conductivity and thickness of these materials affect the interfacial thermal resistance. The size and shape of the heat sink determine its heat dissipation surface area and convective heat transfer efficiency. Common heat sink shapes include flat plates, fins, and pins. A larger heat dissipation surface area and optimized fin design can significantly improve the efficiency of convective heat transfer. The larger the surface area of the heat sink, the higher the convective heat transfer efficiency. By increasing the surface area of the heat sink (such as increasing the number of fins or optimizing the fin arrangement), the convective thermal resistance can be effectively reduced. The thickness of the copper clad layer on the PCB is usually between a few microns and tens of microns. A thicker copper clad layer can improve thermal conductivity and reduce thermal resistance. Common copper clad layer thicknesses range from 35μm to 105μm. The aperture value of the heat dissipation hole determines the path and efficiency of heat transfer. A larger aperture can increase the area of heat transfer and reduce thermal resistance. Common heat dissipation hole diameters range from 0.3mm to 0.8mm.

[0121] By obtaining detailed parameters for each link, the thermal resistance value can be accurately calculated to ensure the accuracy of the heat dissipation design. Depending on the needs of different application scenarios, materials with higher thermal conductivity can be selected to reduce thermal resistance and improve heat dissipation efficiency. By selecting efficient thermal interface materials, the interface thermal resistance can be effectively reduced and the efficiency of heat transfer can be improved. By rationally designing the size, shape, and structure of the substrate, heat sink, and PCB, the heat dissipation performance can be significantly improved and the overall thermal resistance can be reduced. By optimizing material selection and design, space and cost can be saved while ensuring effective heat dissipation, thereby improving economic benefits.

[0122] In some embodiments of the present application, the position parameters of the heat source inside the chip are obtained, and the heat conduction path is divided into several regions, each of which corresponds to a thermal resistance element, specifically:

[0123] Determine the power density distribution of the heat source based on the temperature distribution of the chip under different workloads;

[0124] Based on the power density distribution, the heat conduction path is divided into the heat source area, the heat source-substrate transition area, the substrate-heat sink area, and the heat sink-air area;

[0125] Among them, the thermal resistance element corresponding to the heat source area is the heat conduction thermal resistance, the thermal resistance elements corresponding to the heat source-substrate transition area and the substrate-heat sink area are the interface thermal resistance, and the thermal resistance element corresponding to the heat sink-air area is the convection thermal resistance.

[0126] Specifically, by accurately obtaining the location and power density distribution of the heat source, the heat dissipation design can be optimized in a targeted manner to avoid blindly adding heat dissipation materials or design redundancy. For example, more heat dissipation fins can be added near the heat source or high-efficiency thermal conductive materials can be used to ensure that heat can be transferred quickly and effectively. Through detailed analysis of the heat source, the heat transfer process can be described more accurately, avoiding the rough estimation of the heat source location in traditional heat dissipation design. This refined management helps to optimize the heat dissipation performance of each area and improve the overall heat dissipation efficiency.

[0127] Based on the location of the heat source and the power density distribution, the heat conduction path is divided into multiple regions, each corresponding to a thermal resistance element. This regional division helps to more accurately describe the heat transfer process and provides a basis for subsequent thermal resistance value calculation and combination.

[0128] Specifically include:

[0129] Heat source region: This is the high-power density area within the chip. The corresponding thermal resistance element is the thermal conduction resistor. The thermal resistance value of this area depends on the material properties and thickness of the chip substrate. The heat source region is typically where the chip's core computing units or high-power modules are located.

[0130] Heat source-substrate transition region: The transition zone from the chip to the substrate corresponds to the interfacial thermal resistance. The thermal resistance in this region depends on the material properties and thickness of the solder layer. The heat source-substrate transition region is the key link in heat transfer from the chip to the substrate, and the interfacial thermal resistance has a significant impact on heat dissipation.

[0131] Substrate-to-heat sink region: The thermal resistance element in the region from the substrate to the heat sink is the interfacial thermal resistance. The thermal resistance in this region depends on the material properties and thickness of the thermal grease or thermal pad. The substrate-to-heat sink region is a critical link in heat transfer from the substrate to the heat sink. Optimizing the interfacial thermal resistance can significantly improve heat dissipation efficiency.

[0132] Radiator-to-air region: The area between the radiator and the air, where the corresponding thermal resistance is the convective thermal resistance. The thermal resistance of this region depends on the radiator's shape, size, number and arrangement of fins, and the convective heat transfer coefficient. The radiator-to-air region is the key link in the final dissipation of heat to the environment, and the efficiency of convective heat transfer determines the overall performance of the cooling system.

[0133] The thermal resistance element corresponding to the heat source region is the thermal conduction resistance. The thermal resistance value of this region depends on the material properties and thickness of the chip substrate. The heat source region is the starting point of heat transfer, and its thermal resistance value directly affects the performance of the entire cooling system.

[0134] The thermal resistance element corresponding to the heat source-substrate transition region is the interfacial thermal resistance. The thermal resistance in this region depends on the material properties and thickness of the solder layer. The heat source-substrate transition region is a critical link in the transfer of heat from the chip to the substrate, and the interfacial thermal resistance has a significant impact on the heat dissipation effect.

[0135] The thermal resistance component corresponding to the substrate-heat sink region is the interfacial thermal resistance. The thermal resistance of this region depends on the material properties and thickness of the thermal grease or thermal pad. The substrate-heat sink region is the critical link in heat transfer from the substrate to the heat sink. Optimizing the interfacial thermal resistance can significantly improve heat dissipation efficiency.

[0136] The thermal resistance element corresponding to the heat sink-to-air region is the convection resistance. The thermal resistance of this region depends on the heat sink's shape, size, number and arrangement of fins, and the convection heat transfer coefficient. The heat sink-to-air region is the critical link in dissipating heat to the environment, and the efficiency of convection heat transfer determines the overall performance of the cooling system.

[0137] By accurately obtaining the location and power density distribution of the heat source, the heat dissipation design can be optimized in a targeted manner to avoid blindly increasing heat dissipation materials or designing redundancies. Through detailed analysis of the heat source, the heat transfer process can be described more accurately, avoiding the rough estimation of the location of the heat source in traditional heat dissipation design. This refined management helps to optimize the heat dissipation performance of each area and improve the overall heat dissipation efficiency. The heat conduction path is divided into multiple areas, each corresponding to a thermal resistance element, which facilitates the subsequent calculation and combination of thermal resistance values. This regional management method makes the heat dissipation design more refined, and different heat dissipation measures can be taken for different areas to further improve the heat dissipation effect.

[0138] In actual applications, equipment workloads and environmental conditions may vary. By regionalizing the heat conduction path, we can dynamically adjust the cooling strategy to adapt to different working scenarios and ensure stable operation of the equipment in various complex environments.

[0139] By defining the thermal resistance elements in each zone in detail, we can determine the total thermal resistance of the entire cooling system, providing crucial fundamental data for the intelligent cooling control system. This system can dynamically adjust cooling strategies based on real-time temperature monitoring to ensure optimal equipment operation.

[0140] In some embodiments of the present application, a heat transfer mode is determined based on a heat conduction path, and a thermal resistance value of a thermal resistance element is determined based on the heat transfer mode, specifically:

[0141] Heat transfer methods include conduction, convection and radiation;

[0142] When the heat transfer method is conduction, the thermal resistance value R con d is:

[0143] R cond =kAL

[0144] Where L is the thickness of the substrate in m, k is the thermal conductivity of the substrate material in W / m·K, and A is the heat transfer area in m 2 ;

[0145] When the heat transfer method is convection, the thermal resistance value R conv for:

[0146] R conv =1 / hA

[0147] Where h is the convective heat transfer coefficient, in W / m 2 K, A is the heat transfer area, unit is m 2 ;

[0148] When the heat transfer method is radiation, the thermal resistance value R rad for:

[0149]

[0150] Where ∈ is the emissivity of the object surface, 0≤∈≤1, and σ is the Stefan-Boltzmann constant, σ=5.67×10 -8 W / m2·K 4 , A is the heat transfer area, unit is m 2 , T1 and T2 are the absolute temperatures of the object surface and the environment respectively, in K.

[0151] Specifically, when heat is transferred through a solid material, it is called conductive heat transfer. Conductive heat transfer primarily occurs within solid materials such as chip substrates, solder layers, and baseplates. The efficiency of conductive heat transfer depends on the material's thermal conductivity, thickness, and heat transfer area. Examples of application scenarios include:

[0152] Chip-to-substrate heat conduction: Heat is transferred from the inside of the chip to the substrate, involving heat conduction between the chip substrate and the solder layer.

[0153] Substrate-to-heat sink heat transfer: Heat is transferred from the substrate to the heat sink, involving heat conduction through the interface material between the substrate and the heat sink.

[0154] Heat conduction inside the radiator: Heat is transferred inside the radiator, which involves the heat conduction of the radiator material.

[0155] When heat is transferred through a fluid (such as air), it is called convective heat transfer. Convective heat transfer occurs primarily between the heat sink surface and the air. The efficiency of convective heat transfer depends on the convective heat transfer coefficient, the heat transfer area, and the air flow velocity and temperature difference. Application scenarios include:

[0156] Radiator-to-air heat conduction: Heat is transferred from the radiator surface to the air, which involves the radiator's surface area, fin design, and air flow conditions.

[0157] Forced Convection: When fans or other active cooling devices are used, the convection heat transfer coefficient increases significantly, thereby reducing the convection thermal resistance.

[0158] Natural convection: In the absence of active cooling equipment, the convection heat transfer coefficient is low and the heat dissipation efficiency is relatively poor.

[0159] When heat is transferred via electromagnetic waves, it's called radiative heat transfer. Radiative heat transfer primarily occurs between a hot surface and its surroundings. The efficiency of radiative heat transfer depends on the surface's emissivity, the Stefan-Boltzmann constant, and the absolute temperature difference between the surface and the surroundings. Application scenarios include:

[0160] Radiator-to-air heat conduction: In high-temperature environments, the radiation heat transfer on the radiator surface becomes significant. Especially when the radiator surface temperature is high, the influence of radiation thermal resistance needs to be considered.

[0161] Heat dissipation in high-temperature environments: In high-temperature environments, radiation heat transfer may be one of the main methods of heat transfer. In this case, choosing a heat sink surface material with high emissivity (such as black coating) can effectively improve the radiation heat transfer efficiency and reduce the radiation thermal resistance.

[0162] By using thermal resistance formulas for different heat transfer methods, the thermal resistance value of each thermal resistance element can be accurately calculated to ensure the accuracy of the heat dissipation design. According to the needs of different application scenarios, materials with higher thermal conductivity or thinner materials can be selected to reduce the thermal resistance value and improve heat dissipation efficiency. By increasing the surface area of the radiator, optimizing the fin design, or introducing forced convection (such as a fan), the convective heat transfer efficiency can be significantly improved and the convective thermal resistance can be reduced. In high temperature environments, radiation heat transfer may become one of the main heat transfer methods. By considering the influence of radiation thermal resistance, the heat transfer process can be more accurately described to ensure the scientific nature and reliability of the heat dissipation design. In actual applications, the workload and environmental conditions of the equipment may change. By real-time monitoring of the convective heat transfer coefficient, the heat dissipation strategy can be dynamically adjusted to adapt to different working scenarios and ensure the stable operation of the equipment in various complex environments.

[0163] In some embodiments of the present application, thermal resistance elements are combined in series or in parallel, and the total thermal resistance value of the combined thermal resistance elements is calculated, specifically:

[0164] For n series connected thermal resistance elements R1, R2, ..., R n , total thermal resistance R total for:

[0165] R total =R1+R2+…+R n ;

[0166] For n parallel thermal resistance elements R1, R2, ..., R n , total thermal resistance R total for:

[0167]

[0168] Specifically, when heat passes through multiple thermal resistance elements in sequence, these elements are connected in series. The series combination is applicable to situations where heat is transferred along a single path, such as the process from chip to substrate and then to radiator. The process of heat transfer from chip to substrate and then from substrate to radiator is a typical series combination. The thermal resistance value of each link (such as chip substrate thermal resistance, interface thermal resistance, substrate thermal resistance, etc.) is added together to obtain the total thermal resistance value. When heat is transferred through multiple layers of materials (such as chip substrate, solder layer, substrate, etc.), the thermal resistance value of each layer of material is also connected in series.

[0169] When heat can be transferred to the same destination via multiple paths, these components are in parallel. Parallel combinations are used when heat can be transferred via multiple paths simultaneously, such as convection and radiation from the heat sink surface. Heat from the heat sink surface can be transferred to the air via both convection and radiation, and these two paths are in parallel. The total heat sink-to-air thermal resistance can be solved by combining the convection and radiation resistances in parallel. When heat can be transferred via multiple heat dissipation paths, such as from the baseplate to the heat sink and PCB, these two paths are in parallel. The total baseplate heat dissipation thermal resistance can be solved by combining the baseplate-to-heat sink thermal resistance and the baseplate-to-PCB thermal resistance in parallel.

[0170] In practical applications, heat transfer often involves a mixture of series and parallel connections. In this case, it is necessary to first calculate the total thermal resistance of the series and parallel connections separately, and then combine them to determine the final total thermal resistance.

[0171] The specific steps are as follows:

[0172] Calculate the series part first: For thermal resistance elements connected in series, use the series combination formula to solve for the total thermal resistance value.

[0173] Then calculate the parallel part: For parallel thermal resistance elements, use the parallel combination formula to solve the total thermal resistance value.

[0174] Final combination: Combine the total thermal resistance values of the series part and the parallel part to solve the final total thermal resistance value.

[0175] Application scenarios include:

[0176] Complex cooling systems: For example, heat transfer from the chip to the substrate occurs in series, while heat transfer from the substrate to the heat sink and PCB occurs in parallel. In this case, it is necessary to first calculate the parallel thermal resistance of the substrate-heat sink and substrate-PCB, then combine this parallel thermal resistance with the series thermal resistance of the chip-substrate to determine the final total thermal resistance.

[0177] The total thermal resistance of a series combination is equal to the sum of the thermal resistances of each thermal resistance element, making calculation simple and intuitive. The total thermal resistance of a parallel combination can be calculated by taking the reciprocal of the sum of the reciprocals, making it suitable for multi-path heat dissipation scenarios. The series combination clearly describes the order of heat transfer, making it easier to analyze the impact of each link on the total thermal resistance. The parallel combination describes the simultaneous transfer of heat through multiple paths, helping to optimize heat dissipation design. The total thermal resistance of a parallel combination is usually smaller than that of a single thermal resistance element, because the simultaneous transfer of heat through multiple paths can effectively disperse the thermal resistance and reduce the total thermal resistance. By adding parallel heat dissipation paths, the total thermal resistance can be further reduced, thereby improving heat dissipation efficiency, without increasing the volume of the radiator. Through reasonable mixed combinations, complex heat dissipation systems can be described more accurately, ensuring the scientific nature and reliability of heat dissipation design.

[0178] In some embodiments of the present application, the method further comprises:

[0179] Based on the total thermal resistance, calculate the maximum temperature rise of the chip junction;

[0180] Determine the load condition of the cooling system based on the maximum temperature rise value.

[0181] Specifically, by calculating the maximum temperature rise at the chip's junction (the hottest point within the chip), the cooling system's performance under different operating conditions can be evaluated. Maximum temperature rise refers to the difference between the chip's junction temperature and the ambient temperature, which directly impacts the chip's operating stability and lifespan. By analyzing the maximum temperature rise, the cooling system's performance under different load conditions can be determined. This step helps evaluate the cooling system's performance and provides a basis for subsequent cooling design optimization.

[0182] According to the working mode of the equipment, the load conditions can be divided into multiple levels, such as:

[0183] Light load condition: low power consumption mode, low chip power consumption and small temperature rise.

[0184] Medium load condition: normal operating mode, moderate chip power consumption and moderate temperature rise.

[0185] Heavy-load condition: In high power consumption mode, the chip consumes high power and has a large temperature rise.

[0186] Extreme operating conditions: Maximum power consumption mode, chip power consumption reaches its peak and temperature rise is maximum.

[0187] By analyzing the maximum temperature rise under different load conditions, the overall performance of the cooling system can be evaluated. If the temperature rise is too large under certain conditions, further optimization of the cooling design may be required, such as increasing the heat sink surface area, optimizing the fin design, or introducing forced convection (such as a fan).

[0188] By calculating the maximum temperature rise of the chip junction, we can ensure that the chip temperature remains within a safe range, avoiding performance degradation or failure due to overheating. Detailed analysis of the maximum temperature rise allows targeted optimization of the heat dissipation design, reducing thermal resistance and improving heat dissipation efficiency. For example, increasing the heat sink surface area, optimizing the fin design, or introducing forced convection (such as with a fan) can effectively reduce the maximum temperature rise. In actual applications, the device's workload and environmental conditions may vary. Real-time monitoring of the maximum temperature rise allows dynamic adjustment of the heat dissipation strategy to adapt to different operating scenarios and ensure stable operation of the device in various complex environments. By analyzing the maximum temperature rise under different load conditions, we can optimize the heat dissipation design to ensure that the cooling system maintains excellent heat dissipation performance under various operating conditions. By ensuring that the chip junction temperature remains within a safe range, we can extend the device's service life and improve its reliability and stability. By real-time monitoring of the maximum temperature rise under different load conditions, the intelligent heat dissipation control system can dynamically adjust the heat dissipation strategy based on the current workload, ensuring that the device is always in optimal working condition and improving the user experience.

[0189] like Figure 2 As shown, the second embodiment of the present application provides an intelligent flexible control terminal heat dissipation control device, including:

[0190] A first determining module 110 is configured to determine a heat conduction path for heat to be transferred from the inside of the chip to the external environment based on physical structural parameters of the chip package;

[0191] A definition module 120, configured to define a thermal resistance element based on a heat conduction path;

[0192] An acquisition module 130 is used to obtain the position parameters of the heat source inside the chip and divide the heat conduction path into several regions, each region corresponding to a thermal resistance element;

[0193] A second determining module 140 is configured to determine a heat transfer mode based on the heat conduction path, and determine a thermal resistance value of the thermal resistance element based on the heat transfer mode;

[0194] The calculation module 150 is used to combine the thermal resistance elements in series or in parallel to calculate the total thermal resistance value of the combined thermal resistance elements.

[0195] The intelligent flexible control terminal heat dissipation control device provided in the second aspect embodiment of this application can implement the intelligent flexible control terminal heat dissipation control method in any embodiment of the first aspect above, and thus can achieve any technical effect in the above intelligent flexible control terminal heat dissipation control method, which will not be repeated here.

[0196] like Figure 3As shown, the third aspect of the present application provides an electronic device, including a memory, a processor, and a computer program stored on the memory and runnable on the processor. When the processor executes the program, the intelligent flexible control terminal heat dissipation control method in any of the above embodiments is implemented.

[0197] Figure 3 An example of a physical structure diagram of an electronic device is shown below. Figure 3 As shown, the electronic device may include: a processor 810, a communication interface 820, a memory 830, and a communication bus 840, wherein the processor 810, the communication interface 820, and the memory 830 communicate with each other via the communication bus 840. The processor 810 may call the logic instructions in the memory 830 to execute the intelligent flexible control terminal heat dissipation control method in any of the above embodiments, which may specifically include:

[0198] Step 100: Determine a heat conduction path for transferring heat from the inside of the chip to the external environment based on the physical structural parameters of the chip package.

[0199] Step 200: Define a thermal resistance element based on a heat conduction path.

[0200] Step 300: Obtain the position parameters of the heat source inside the chip, and divide the heat conduction path into several areas, each area corresponding to a thermal resistance element.

[0201] Step 400: Determine a heat transfer mode based on the heat conduction path, and determine a thermal resistance value of a thermal resistance element based on the heat transfer mode.

[0202] Step 500: Combine thermal resistance elements in series or in parallel, and calculate the total thermal resistance value of the combined thermal resistance elements.

[0203] In addition, the logic instructions in the above-mentioned memory 830 can be implemented in the form of a software functional unit and can be stored in a computer-readable storage medium when sold or used as an independent product. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0204] In another aspect, the present invention further provides a non-volatile computer storage medium storing computer-executable instructions. When a computer executes the executable instructions, it is implemented to perform the intelligent flexible control terminal heat dissipation control method in any of the above embodiments. The method may specifically include:

[0205] Step 100: Determine a heat conduction path for transferring heat from the inside of the chip to the external environment based on the physical structural parameters of the chip package.

[0206] Step 200: Define a thermal resistance element based on a heat conduction path.

[0207] Step 300: Obtain the position parameters of the heat source inside the chip, and divide the heat conduction path into several areas, each area corresponding to a thermal resistance element.

[0208] Step 400: Determine a heat transfer mode based on the heat conduction path, and determine a thermal resistance value of a thermal resistance element based on the heat transfer mode.

[0209] Step 500: Combine the thermal resistance elements in series or in parallel to calculate the total thermal resistance of the combined thermal resistance elements. Anything not described in this application can be accomplished by using or drawing on existing technologies.

[0210] The various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments.

[0211] The foregoing is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included in the protection scope of the present application.

Claims

1. An intelligent and flexible control method for terminal heat dissipation control, characterized in that: include: Based on the physical structural parameters of the chip package, determine the heat conduction path from the inside of the chip to the external environment; defining a thermal resistance element based on the heat conduction path; Obtaining the position parameters of the heat source inside the chip, and dividing the heat conduction path into a plurality of regions, each region corresponding to one of the thermal resistance elements; determining a heat transfer mode based on the heat conduction path, and determining a thermal resistance value of the thermal resistance element based on the heat transfer mode; The thermal resistance elements are combined in series or in parallel to calculate the total thermal resistance value of the combined thermal resistance elements.

2. The intelligent flexible control terminal heat dissipation control method according to claim 1 is characterized in that: The heat conduction paths include chip-substrate type heat conduction, substrate-heat sink type heat conduction, heat sink-air type heat conduction and chip-PCB type heat conduction.

3. The intelligent flexible control terminal heat dissipation control method according to claim 2, characterized in that: The thermal resistance element is defined based on the heat conduction path, specifically: Obtain the thermal conductivity and thickness parameters of the chip substrate and solder layer respectively; Determine the material type of the substrate and the connection method between the substrate and the chip, and obtain the thickness and area of the substrate; Obtaining the material type of the heat sink and the interface material between the heat sink and the substrate, and obtaining the size, shape, and heat dissipation surface area of the heat sink; Get the copper thickness and thermal via diameter on the PCB.

4. The intelligent flexible control terminal heat dissipation control method according to claim 2, characterized in that: The heat source position parameters inside the chip are obtained, and the heat conduction path is divided into several regions, each region corresponding to one thermal resistance element, specifically: Determining the power density distribution of the heat source based on the temperature distribution of the chip under different workloads; Based on the power density distribution, the heat conduction path is divided into a heat source region, a heat source-substrate transition region, a substrate-heat sink region, and a heat sink-air region; Among them, the thermal resistance element corresponding to the heat source area is heat conduction thermal resistance, the thermal resistance elements corresponding to the heat source-substrate transition area and the substrate-heat sink area are interface thermal resistance, and the thermal resistance element corresponding to the heat sink-air area is convection thermal resistance.

5. The intelligent flexible control terminal heat dissipation control method according to claim 2, characterized in that: The heat transfer mode is determined based on the heat conduction path, and the thermal resistance value of the thermal resistance element is determined based on the heat transfer mode, specifically: The heat transfer methods include conduction, convection and radiation; When the heat transfer mode is conduction, the thermal resistance value R of the thermal resistance element is con d is: <h2 style=";text-align:left;direction:ltr">R<h2 style=";text-align:left;direction:ltr"> con <h2 style=";text-align:left;direction:ltr"> d<h2 style=";text-align:left;direction:ltr"> ＝ <h2 style=";text-align:left;direction:ltr"> kAL Where L is the thickness of the substrate in m, k is the thermal conductivity of the substrate material in W / m·K, and A is the heat transfer area in m 2 ; When the heat transfer mode is convection, the thermal resistance value R of the thermal resistance element is conv for: R conv＝ 1 / hA Where h is the convective heat transfer coefficient, in W / m 2 K, A is the heat transfer area, unit is m 2 ; When the heat transfer mode is radiation, the thermal resistance value R rad for: Where ∈ is the emissivity of the object surface, 0≤∈≤1, and σ is the Stefan-Boltzmann constant, σ=5.67×10 -8 W / m 2 ·K 4 , A is the heat transfer area, unit is m 2 , T1 and T2 are the absolute temperatures of the object surface and the environment respectively, in K.

6. The intelligent flexible control terminal heat dissipation control method according to claim 1, characterized in that: The thermal resistance elements are combined in series or in parallel to calculate the total thermal resistance value of the combined thermal resistance elements, specifically: For n series connected thermal resistance elements R1, R2, ..., R n , total thermal resistance R total for: R total =R1+R2+…+R n ; For n parallel thermal resistance elements R1, R2, ..., R n , total thermal resistance R tota l is:

7. The intelligent flexible control terminal heat dissipation control method according to any one of claims 1 to 6, characterized in that: The method also includes: Calculating the maximum temperature rise of the chip junction based on the total thermal resistance value; A load condition of the heat dissipation system is determined based on the maximum temperature rise value.

8. An intelligent flexible control terminal heat dissipation control device, characterized in that: include: A first determining module is used to determine a heat conduction path for heat to be transferred from the inside of the chip to the external environment based on the physical structural parameters of the chip package; a definition module, configured to define a thermal resistance element based on the heat conduction path; an acquisition module, configured to acquire position parameters of a heat source inside the chip and divide the heat conduction path into a plurality of regions, each region corresponding to one of the thermal resistance elements; a second determining module, configured to determine a heat transfer mode based on the heat conduction path, and determine a thermal resistance value of the thermal resistance element based on the heat transfer mode; The calculation module is used to combine the thermal resistance elements in series or in parallel to calculate the total thermal resistance value of the combined thermal resistance elements.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the program, the intelligent flexible control terminal heat dissipation control method as described in any one of claims 1 to 7 is implemented.

10. A non-volatile computer storage medium storing computer executable instructions, characterized in that: When executing the executable instructions, the computer implements the intelligent flexible control terminal heat dissipation control method as described in any one of claims 1 to 7.

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