Conductive paste, ceramic product and preparation method thereof

Abstract

The invention relates to the technical field of ceramic and metal interface bonding, in particular to conductive paste, a ceramic product and a preparation method of the conductive paste, the adhesive capacity of the conductive paste on a ceramic substrate can be improved, and an electroplated metal layer can be formed on the surface of the ceramic substrate through electroplating by means of the conductivity of conductive metal powder in the conductive paste. Therefore, metallization treatment of the surface of the ceramic substrate is achieved, and the bonding capacity of the electroplated metal layer and the ceramic substrate is improved. The conductive paste comprises conductive metal powder, an inorganic binder, an organic binder and a solvent, wherein the inorganic binder is a glass welding material, the organic binder comprises a cellulose compound, and the cellulose compound comprises at least one of ethyl cellulose and cellulose nitrate.

Description

Technical Field

[0001] The present application relates to the technical field of ceramic-metal interface bonding, and in particular to a conductive slurry, a ceramic product, and a preparation method thereof. Background Art

[0002] Ceramic products are characterized by high hardness, a smooth texture, and a delicate feel. Crafted at high temperatures, they offer advantages such as heat resistance, durability, resistance to deformation, and a long service life. However, ceramics are susceptible to damage, and their surfaces are easily cracked by heavy impact. Metal, on the other hand, is drop-resistant and unbreakable. Therefore, coating a ceramic substrate with a metal layer can effectively improve its impact resistance.

[0003] At present, when using a metal layer to cover the surface of a ceramic substrate, a splicing method is adopted. There is a large gap between the metal layer and the ceramic substrate, which is easy to get dirty and has poor adhesion. It is easy to crack and fall off, which is not conducive to the surface metallization treatment of the ceramic substrate. Summary of the Invention

[0004] Based on this, some embodiments of the present application provide a conductive paste. After melting, the glass frit in the conductive paste can bond with the glass phase in the ceramic substrate through covalent bonds, thereby improving the adhesion of the conductive paste to the ceramic substrate. Utilizing the conductive properties of the conductive metal powder in the conductive paste, a plated metal layer can be formed on the surface of the ceramic substrate through electroplating, thereby achieving metallization of the ceramic substrate surface and improving the bonding ability between the plated metal layer and the ceramic substrate. Furthermore, other embodiments of the present application also provide methods for preparing ceramic products using the conductive paste and the resulting ceramic products.

[0005] In a first aspect, a conductive paste is provided, which includes: conductive metal powder, an inorganic binder, an organic binder and a solvent; wherein the inorganic binder is a glass frit, and the organic binder includes: a cellulose compound, and the cellulose compound includes: at least one of ethyl cellulose and nitrocellulose.

[0006] Optionally, the glass frit includes: 29% to 40% by mass of quartz, 9% to 19% by mass of aluminum oxide, 18% to 26% by mass of boron oxide, 6% to 10% by mass of copper oxide, 8% to 15% by mass of bismuth oxide, 3% to 6% by mass of potassium oxide, and 4% to 7% by mass of sodium oxide.

[0007] Optionally, the conductive metal powder satisfies at least one of the following conditions:

[0008] (1) The conductive metal powder includes: silver powder;

[0009] (2) The particle size of the conductive metal powder is 3 μm to 6 μm.

[0010] Optionally, the solvent includes at least one of terpineol and turpentine.

[0011] Optionally, based on 100 parts by weight of the conductive paste, the conductive metal powder is 71 to 81 parts, the inorganic binder is 5 to 12 parts, the organic binder is 3 to 11 parts, and the solvent is 4 to 13 parts.

[0012] In a second aspect, a ceramic product is provided, comprising:

[0013] Ceramic substrate;

[0014] a first conductive layer, the first conductive layer comprising a glass frit layer disposed on the ceramic substrate and conductive metal powder filled in the glass frit layer, the conductive metal powder being connected to form a conductive functional layer;

[0015] an electroplated metal layer, the electroplated metal layer being disposed on a surface of the first conductive layer facing away from the ceramic substrate;

[0016] Wherein, the conductive paste layer is prepared by using the conductive paste described in the first aspect.

[0017] Optionally, the ceramic product satisfies at least one of the following conditions:

[0018] (1) The thickness of the first conductive layer is 25 μm to 29 μm;

[0019] (2) The thickness of the electroplated metal layer is 23 μm to 27 μm.

[0020] In a third aspect, a method for preparing a ceramic product is provided, comprising:

[0021] Providing a ceramic substrate and the conductive paste according to the first aspect;

[0022] Applying the conductive paste on the ceramic substrate and drying and curing it to prepare a conductive paste layer;

[0023] Sintering the conductive paste layer so that the glass frit in the conductive paste layer fuses with the ceramic substrate to form a glass frit layer, and the conductive metal powder filled in the conductive paste layer connects to form a conductive functional layer in the glass frit layer to obtain a first conductive layer;

[0024] The ceramic substrate formed with the first conductive layer is used as a cathode, and an electroplated metal layer is prepared on the surface of the first conductive layer facing away from the ceramic substrate by electroplating.

[0025] Optionally, applying the conductive paste on the ceramic substrate and drying and curing it to prepare a conductive paste layer comprises:

[0026] The conductive paste is printed on the surface of the ceramic substrate by screen printing, and is dried and cured at 100° C. to 110° C. for 30 min to 40 min to prepare the conductive paste layer.

[0027] Optionally, the sintering temperature is 810° C. to 830° C., and the sintering time is 10 min to 20 min.

[0028] The conductive paste, ceramic product and preparation method thereof have the following beneficial effects:

[0029] Because the conductive paste includes conductive metal powder, an inorganic binder, an organic binder, and a solvent, and the inorganic binder is a glass frit, the glass frit in the conductive paste, after melting, can bond to the glass phase in the ceramic substrate through covalent bonds, thereby improving the adhesion of the conductive paste to the ceramic substrate. Utilizing the conductive properties of the conductive metal powder in the conductive paste, an electroplated metal layer can be formed on the surface of the ceramic substrate by electroplating, thereby achieving metallization of the ceramic substrate surface and improving the bonding between the electroplated metal layer and the ceramic substrate. This solves the technical problems of the related art, such as a large gap between the metal layer and the ceramic substrate, easy dirt accumulation, poor adhesion, and the susceptibility of the metal layer to cracking and shedding. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic cross-sectional view of a ceramic product provided in an embodiment of the present application;

[0031] Figure 2 A schematic flow chart of a method for preparing a ceramic product provided in an embodiment of the present application. DETAILED DESCRIPTION

[0032] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0033] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to." In the description of the specification, the terms "one embodiment," "some embodiments," "exemplary embodiments," "exemplarily," or "some examples" are intended to indicate that specific features, structures, materials, or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials, or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0034] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0035] Herein, terms such as "for example," "such as," "example," and "for instance" are used for descriptive purposes to indicate a connection between the preceding and following technical solutions. However, they should not be construed as limiting the preceding technical solution or the scope of protection herein. Unless otherwise specified, "A (such as B)" means that B is a non-limiting example of A, and it should be understood that A is not limited to B.

[0036] As used herein, "optionally," "optional," and "optional" mean optional or dispensable, meaning that the option is selected from either of two parallel options: "optional" or "optional." If a technical solution contains multiple "optional" clauses, each "optional" clause is considered independent unless otherwise specified and there are no conflicts or constraints.

[0037] Herein, descriptions such as “optionally contain” and “optionally include” mean “contain or not contain”. “Optional component X” means component X is present or not, or contains or not contains the component X.

[0038] In this document, the terms "first" and "second" in "the first aspect" and "the second aspect" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or quantity, nor can they be understood as implicitly indicating the importance or quantity of the indicated technical features.

[0039] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0041] In this article, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features.

[0042] In this document, "at least one" means more than one, such as one, two and more than two. "Multiple" or "several" means at least two, such as two, three, etc.

[0043] As used herein, when referring to a numerical interval (i.e., a numerical range), unless otherwise specified, the distribution of the optional numerical values within the numerical interval is deemed to be continuous and includes the two numerical endpoints of the numerical interval (i.e., the minimum and maximum values), as well as every numerical value between the two numerical endpoints. Unless otherwise specified, when a numerical interval refers only to integers within the numerical interval, it includes the two endpoint integers of the numerical range, as well as every integer between the two endpoints, which is equivalent to directly listing every integer. When multiple numerical ranges are provided to describe a feature or characteristic, these numerical ranges can be combined. In other words, unless otherwise specified, the numerical ranges disclosed herein should be understood to include any and all subranges included therein. The "numerical value" in the numerical interval can be any quantitative value, such as a number, percentage, ratio, etc. "Numerical interval" allows for a broad range of numerical interval types including percentage intervals, ratio intervals, and ratio intervals.

[0044] In this article, percentage concentrations, unless otherwise specified, refer to final concentrations, which are the percentage of an added ingredient in the system after the ingredient is added.

[0045] In this document, if a method flow involves multiple steps, unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be performed in an order other than the order described. Moreover, any step can include multiple sub-steps or multiple stages, and these sub-steps or stages do not necessarily need to be completed at the same time, but can be performed at different times, and their execution order does not necessarily need to be sequential, but can be performed in rotation, alternation, or simultaneously with other steps or parts of sub-steps or stages of other steps.

[0046] In view of the problems in the related art of large gap between the metal layer and the ceramic substrate, easy dirt accumulation and poor adhesion, prone to cracking and falling off, etc., which are not conducive to the surface metallization treatment of the ceramic substrate, the specific embodiments of the present application are described as follows:

[0047] In a first aspect, some embodiments of the present application provide a conductive paste comprising: conductive metal powder, an inorganic binder, an organic binder and a solvent; wherein the inorganic binder is a glass frit, and the organic binder comprises: a cellulose compound, and the cellulose compound comprises: at least one of ethyl cellulose and nitrocellulose.

[0048] Glass, in particular, functions as a thermosoftening adhesive. When heated, it softens, melts, and becomes fluid, allowing it to bond not only to itself but also to metals or ceramics.

[0049] Glass frit refers to glass material that can bond different materials such as metals and ceramics by melting and solidifying under heating. In addition to glass frit, the glass frit may also contain other additives such as fluxing agents, modifiers, etc.

[0050] In the conductive paste provided in the embodiment of the present application, since the conductive paste includes conductive metal powder, an inorganic binder, an organic binder, and a solvent, and the inorganic binder is a glass frit, the glass frit in the conductive paste can be covalently bonded to the glass phase in the ceramic substrate after melting, thereby improving the adhesion of the conductive paste to the ceramic substrate. Utilizing the conductive properties of the conductive metal powder in the conductive paste, an electroplated metal layer can be formed on the surface of the ceramic substrate by electroplating, thereby achieving metallization treatment of the ceramic substrate surface and improving the bonding ability between the electroplated metal layer and the ceramic substrate. This solves the technical problems in the related art such as a large gap between the metal layer and the ceramic substrate, easy dirt accumulation, poor adhesion, and easy cracking and shedding of the metal layer.

[0051] Similar to the inorganic binder, the organic binder also plays a role of bonding. At the same time, the organic binder also plays a role in uniformly dispersing the conductive metal powder and the inorganic binder in the conductive paste.

[0052] In some embodiments, the glass frit includes: 29% to 40% by mass of quartz, 9% to 19% by mass of aluminum oxide, 18% to 26% by mass of boron oxide, 6% to 10% by mass of copper oxide, 8% to 15% by mass of bismuth oxide, 3% to 6% by mass of potassium oxide, and 4% to 7% by mass of sodium oxide.

[0053] In these embodiments, the glass frit can impart good heat resistance and adhesion to the conductive paste, thereby improving bonding performance.

[0054] In some embodiments, the conductive metal powder includes silver powder.

[0055] In these embodiments, the conductive metal powder can improve the electrical conductivity, facilitating subsequent metallization treatment of the ceramic substrate by electroplating.

[0056] In some embodiments, the particle size of the conductive metal powder is 3 μm to 6 μm. In these embodiments, the particle size of the conductive metal powder is 3 μm to 6 μm, which can give the conductive paste good printing performance and is conducive to improving sintering density.

[0057] In some embodiments, the solvent includes at least one of turpentine and its derivatives.

[0058] Turpentine, also known as pinene, has two isomers: α-pinene and β-pinene. It is the main component of turpentine, which contains 58%~65% α-pinene and 30% β-pinene.

[0059] Turpentine derivatives may include terpineol, terpinene, and terpinolene.

[0060] Optionally, the solvent includes at least one of terpineol and turpentine.

[0061] In some embodiments, based on 100 parts by weight of the conductive paste, the conductive metal powder comprises 71 to 81 parts, the inorganic binder comprises 5 to 12 parts, the organic binder comprises 3 to 11 parts, and the solvent comprises 4 to 13 parts. For example, based on 100 parts by weight of the conductive paste, the conductive metal powder may comprise 71 parts by weight, in which case the inorganic binder may comprise 12 parts by weight, the organic binder may comprise 11 parts by weight, and the solvent may comprise 6 parts; alternatively, the conductive metal powder may comprise 81 parts by weight, in which case the inorganic binder may comprise 5 parts by weight, the organic binder may comprise 3 parts by weight, and the solvent may comprise 11 parts; alternatively, the conductive metal powder may comprise 75 parts by weight, in which case the inorganic binder may comprise 5 parts by weight, the organic binder may comprise 10 parts by weight, and the solvent may comprise 10 parts by weight.

[0062] In a second aspect, some embodiments of the present application provide a ceramic product, such as Figure 1 As shown, the ceramic product includes: a ceramic substrate 11, a first conductive layer 12 and an electroplated metal layer 13, wherein the first conductive layer 12 includes a glass frit layer 121 arranged on the ceramic substrate 11 and a conductive metal powder 122 filled in the glass frit layer 121, and the conductive metal powder 122 is connected to form a conductive functional layer; the electroplated metal layer 13 is arranged on the surface of the first conductive layer 12 away from the ceramic substrate 11; the first conductive layer is prepared using the conductive paste as described in the first aspect.

[0063] In the ceramic product provided in the embodiment of the present application, a first conductive layer 12 is provided on the surface of the ceramic substrate 11. Since the first conductive layer 12 includes a glass frit layer 121 provided on the ceramic substrate 11 and conductive metal powder 122 filled in the glass frit layer 121, the conductive metal powder 122 is connected to form a conductive functional layer. Therefore, on the one hand, the conductive functional layer can impart certain conductive properties to the first conductive layer 12. On the other hand, the first conductive layer 12 can be bonded to the glass phase in the ceramic substrate 11 through covalent bonds between the glass frit layer 121 and the glass phase, thereby improving the adhesion of the first conductive layer 12 to the ceramic substrate 11. By forming an electroplated metal layer 13 on the surface of the first conductive layer 12 facing away from the ceramic substrate 11, the surface of the ceramic substrate 11 can be metallized and the bonding between the electroplated metal layer 13 and the ceramic substrate 11 can be improved. This solves the problems in the related art such as the large gap between the metal layer and the ceramic substrate, easy dirt accumulation, poor adhesion, and easy cracking and shedding.

[0064] In some embodiments, the thickness of the first conductive layer 12 is 25 μm-29 μm.

[0065] In these embodiments, by controlling the thickness of the first conductive layer 12 to be 25 μm to 29 μm, the bonding strength between the electroplated metal layer 13 and the ceramic substrate 11 can be improved, and the conductivity between the first conductive layer 12 and the electroplated metal layer 13 can be improved.

[0066] In some embodiments, the thickness of the electroplated metal layer is 23 μm-27 μm.

[0067] In these embodiments, by controlling the thickness of the electroplated metal layer 13 to be 23 μm to 27 μm, the ceramic product can be endowed with good wear resistance and a bright metal appearance, and the surface of the ceramic product can be endowed with good electrical conductivity.

[0068] In some embodiments, the ceramic article can be any ceramic article having a ceramic substrate.

[0069] For example, the ceramic product may be a kitchen appliance, such as a ceramic basin, a ceramic toilet, etc.

[0070] In a third aspect, some embodiments of the present application provide a method for preparing a ceramic product, such as Figure 2 As shown, the preparation method includes the following steps S21) to S24):

[0071] S21), providing a ceramic substrate and the conductive paste as described in the first aspect;

[0072] S22), applying the conductive slurry on the ceramic substrate and drying and curing it to prepare a conductive slurry layer;

[0073] The conductive paste applied on the ceramic substrate can be fixed by drying and curing, thereby obtaining a conductive paste layer.

[0074] S23), sintering the conductive paste layer so that the glass frit in the conductive paste layer is fused with the ceramic substrate to form a glass frit layer, and the conductive metal powder filled in the conductive paste layer is connected in the glass frit layer to form a conductive functional layer, thereby obtaining a first conductive layer;

[0075] By sintering the conductive paste layer, under high-temperature sintering, the glass frit in the conductive paste layer is combined with the glass phase in the ceramic substrate in the form of covalent bonds, thereby forming a glass frit layer. At the same time, the organic binder and solvent in the conductive paste layer are sintered and removed, and the conductive metal powder is connected in the glass frit to form a conductive functional layer, thereby giving the first conductive layer certain conductive properties, which facilitates subsequent electroplating.

[0076] S24), using the ceramic substrate with the first conductive layer as a cathode, and preparing an electroplated metal layer on the surface of the first conductive layer facing away from the ceramic substrate by electroplating.

[0077] The ceramic substrate with the first conductive layer formed thereon is used as a cathode, and an electroplated metal layer can be prepared on the surface of the first conductive layer facing away from the ceramic substrate by electroplating.

[0078] In the method for preparing a ceramic product provided in an embodiment of the present application, the glass frit in the conductive paste, after melting, can be covalently bonded to the glass phase in the ceramic substrate, thereby forming a first conductive layer with strong adhesion on the ceramic substrate. Furthermore, the conductive properties of the conductive metal powder in the conductive paste can be utilized to form an electroplated metal layer on the surface of the ceramic substrate by electroplating, thereby achieving metallization of the ceramic substrate surface and improving the bonding ability between the electroplated metal layer and the ceramic substrate. This solves the technical problems in the related art such as large gaps between the metal layer and the ceramic substrate, easy dirt accumulation, poor adhesion, and the susceptibility to cracking and shedding of the metal layer.

[0079] In some embodiments, S22), applying a conductive paste on a ceramic substrate and drying and curing the conductive paste to prepare a conductive paste layer includes:

[0080] The conductive paste is printed on the surface of the ceramic substrate by screen printing, and is dried and cured at 100° C. to 110° C. for 30 min to 40 min to prepare the conductive paste layer.

[0081] In some embodiments, in the above S23), the sintering temperature is 810° C. to 830° C., and the sintering time is 10 min to 20 min.

[0082] In order to objectively evaluate the technical effects of the embodiments of the present application, the present application will be described in detail and exemplarily through the following examples and comparative examples.

[0083] In the following examples and comparative examples, all raw materials can be purchased commercially, and in order to maintain the reliability of the experiments, the raw materials used in the following examples and comparative examples have the same physical and chemical parameters or are prepared by the same processing method.

[0084] Example 1

[0085] Example 1 provides a metal-edged ceramic basin. The preparation method of the metal-edged ceramic basin is as follows:

[0086] (1) Preparation of conductive silver paste: comprising the following raw materials in parts by weight: silver powder, glass frit, ethyl cellulose and pineol are mixed evenly in 71 parts, 5 parts, 11 parts and 13 parts respectively to obtain a conductive paste, wherein the particle size of the silver powder is 3μm to 6μm, and the glass frit comprises: quartz with a mass proportion of 35%, aluminum oxide with a mass proportion of 15%, boron oxide with a mass proportion of 22%, copper oxide with a mass proportion of 8%, bismuth oxide with a mass proportion of 11%, potassium oxide with a mass proportion of 4% and sodium oxide with a mass proportion of 5%.

[0087] (2) The conductive silver paste obtained in step (1) was printed on the edge of the ceramic basin using a 325-mesh screen, and then dried in a blast drying oven at 100°C for 10 minutes to set.

[0088] (3) The ceramic sheet shaped in step (2) is placed in a box furnace for sintering to obtain a silver intermediate layer, wherein the sintering temperature is 810°C and the holding time is 20 minutes.

[0089] (4) Placing the ceramic basin with the silver intermediate layer into an electrolyte for surface electroplating, and plating a metal layer on the surface of the silver intermediate layer; wherein the electrolyte is a mixed solution containing zinc chloride, potassium chloride, sodium citrate and sodium benzoate, wherein the mass proportion of zinc chloride is 11%, the mass proportion of potassium chloride is 19%, the mass proportion of sodium citrate is 2.5%, the mass proportion of sodium benzoate is 0.01%, and the balance is water.

[0090] (5) The ceramic basin obtained in step (4) is cleaned and dried to obtain a metal-edged ceramic basin; wherein the drying temperature is 105° C. and the drying time is 35 min.

[0091] Example 2

[0092] The preparation method of the metal-rimmed ceramic basin provided in Example 2 is basically the same as the preparation method of the metal-rimmed ceramic basin provided in Example 1, except that:

[0093] The raw material composition of the conductive silver paste in step (1) is: 76 parts of silver powder, 12 parts of glass frit, 5 parts of ethyl cellulose, and 7 parts of terpineol. The glass frit includes: 29% by weight of quartz, 19% by weight of aluminum oxide, 18% by weight of boron oxide, 6% by weight of copper oxide, 15% by weight of bismuth oxide, 6% by weight of potassium oxide, and 7% by weight of sodium oxide.

[0094] The sintering temperature in step (3) is 820°C and the holding time is 15 minutes.

[0095] Example 3

[0096] The preparation method of the metal-rimmed ceramic basin provided in Example 3 is basically the same as the preparation method of the metal-rimmed ceramic basin provided in Example 1, except that:

[0097] The raw material composition of the conductive silver paste in step (1) is: 81 parts of silver powder, 12 parts of glass frit, 3 parts of ethyl cellulose, and 4 parts of terpineol. The glass frit comprises: 40% by weight of quartz, 9% by weight of aluminum oxide, 26% by weight of boron oxide, 10% by weight of copper oxide, 8% by weight of bismuth oxide, 3% by weight of potassium oxide, and 4% by weight of sodium oxide.

[0098] The sintering temperature in step (3) is 830°C and the holding time is 10 minutes.

[0099] Comparative Example 1

[0100] The preparation method of the metal-rimmed ceramic basin provided in Comparative Example 1 is basically the same as the preparation method of the metal-rimmed ceramic basin provided in Example 1, except that:

[0101] In step (1), no silver powder is added to the conductive silver paste.

[0102] Comparative Example 2

[0103] The preparation method of the metal-rimmed ceramic basin provided in Comparative Example 2 is basically the same as the preparation method of the metal-rimmed ceramic basin provided in Example 1, except that:

[0104] In step (1), no glass frit is added to the conductive silver paste.

[0105] Comparative Example 3

[0106] The preparation method of the metal-rimmed ceramic basin provided in Comparative Example 3 is basically the same as the preparation method of the metal-rimmed ceramic basin provided in Example 1, except that:

[0107] Remove step (4).

[0108] Test Case

[0109] 1. Comparison of Examples 1 to 3 with Comparative Examples 1 and 3 shows that Examples 1 to 3 are prepared with electroplated metal layers, and therefore all have a bright mirror effect. In Comparative Example 1, no electroplated metal layer can be formed without adding silver powder, and in Comparative Example 3, no bright metal appearance can be obtained without electroplating.

[0110] 2. The conductive pastes provided in Examples 1-3 and Comparative Examples 1-2 were all prepared into rectangular silver paste patterns with a length and width of 2 mm. After sintering, tin-plated copper leads with a diameter of 1 mm were soldered with tin-lead solder. The tensile strength of the solder joints was measured using a tensile testing machine. The test results are shown in Table 1 below.

[0111] Table 1

[0112]

[0113] As can be seen from Table 1, the conductive silver paste provided in Examples 1 to 3 greatly enhanced the bonding performance between the electroplated metal layer and the ceramic substrate, and the adhesion was relatively large. In Comparative Example 1, no silver powder was added, and the tinned copper lead could not be welded to the ceramic surface layer, and there was no adhesion. In Comparative Example 2, no glass frit was added, and the welding tensile force was relatively small, indicating that the adhesion of the electroplated metal layer on the ceramic substrate was relatively poor.

[0114] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0115] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A conductive paste, characterized in that: The conductive paste includes conductive metal powder, an inorganic binder, an organic binder and a solvent; wherein the inorganic binder is a glass frit, and the organic binder includes a cellulose compound, and the cellulose compound includes at least one of ethyl cellulose and nitrocellulose.

2. The conductive paste according to claim 1, characterized in that The glass frit includes: 29% to 40% by mass of quartz, 9% to 19% by mass of aluminum oxide, 18% to 26% by mass of boron oxide, 6% to 10% by mass of copper oxide, 8% to 15% by mass of bismuth oxide, 3% to 6% by mass of potassium oxide, and 4% to 7% by mass of sodium oxide.

3. The conductive paste according to claim 1, characterized in that The conductive metal powder satisfies at least one of the following conditions: (1) The conductive metal powder includes: silver powder; (2) The particle size of the conductive metal powder is 3 μm to 6 μm.

4. The conductive paste according to claim 1, characterized in that The solvent includes: at least one of turpentine oil and its derivatives; optionally, the solvent includes: at least one of terpineol and turpentine oil.

5. The conductive paste according to any one of claims 1 to 4, characterized in that: Based on 100 parts by weight of the conductive paste, the conductive metal powder is 71 to 81 parts, the inorganic binder is 5 to 12 parts, the organic binder is 3 to 11 parts, and the solvent is 4 to 13 parts.

6. A ceramic product, characterized in that: include: Ceramic substrate; a first conductive layer, the first conductive layer comprising a glass frit layer disposed on the ceramic substrate and conductive metal powder filled in the glass frit layer, the conductive metal powder being connected to form a conductive functional layer; an electroplated metal layer, the electroplated metal layer being disposed on a surface of the first conductive layer facing away from the ceramic substrate; Wherein, the first conductive layer is prepared by using the conductive paste according to any one of claims 1 to 5.

7. The ceramic product according to claim 6, characterized in that The ceramic product satisfies at least one of the following conditions: (1) The thickness of the first conductive layer is 25 μm to 29 μm; (2) The thickness of the electroplated metal layer is 23 μm to 27 μm.

8. A method for preparing a ceramic product, characterized in that: include: Providing a ceramic substrate and the conductive paste according to any one of claims 1 to 5; Applying the conductive paste on the ceramic substrate and drying and curing it to prepare a conductive paste layer; Sintering the conductive paste layer so that the glass frit in the conductive paste layer fuses with the ceramic substrate to form a glass frit layer, and the conductive metal powder filled in the conductive paste layer connects to form a conductive functional layer in the glass frit layer to obtain a first conductive layer; The ceramic substrate formed with the first conductive layer is used as a cathode, and an electroplated metal layer is prepared on the surface of the first conductive layer facing away from the ceramic substrate by electroplating.

9. The preparation method according to claim 8, characterized in that The conductive paste is applied on the ceramic substrate and dried and cured to prepare a conductive paste layer, comprising: The conductive paste is printed on the surface of the ceramic substrate by screen printing, and is dried and cured at 100° C. to 110° C. for 30 min to 40 min to prepare the conductive paste layer.

10. The preparation method according to claim 8 or 9, characterized in that: The sintering temperature is 810° C. to 830° C., and the sintering time is 10 min to 20 min.

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