Magnetic integration device and electronic equipment

Abstract

The invention provides a magnetic integration device and electronic equipment, the magnetic integration device at least comprises a main circuit board and two paths of power conversion groups, the two paths of power conversion groups are arranged side by side, and any power conversion group comprises a first circuit board, a second circuit board and a magnetic integration module; wherein the first circuit board and the second circuit board are arranged on the main circuit board in a spaced mode in the first direction, and the magnetic integration module is fixed to the main circuit board through the first circuit board and the second circuit board; and the magnetic integration module is connected with devices on the first circuit board and the second circuit board. By means of the mode, the magnetic integration module and the circuit board are integrally arranged to optimize the size, and by means of the interval arrangement mode, an air channel is optimized, heat dissipation is improved, and the efficiency of the device is improved.

Description

Technical Field

[0001] The present application mainly relates to the field of power supply technology, and in particular to magnetic integrated devices and electronic equipment. Background Art

[0002] Integrated magnetics and the circuit carriers they use are key components in power converters, enabling electrical isolation and energy transmission, and directly impacting overall power supply efficiency. They are widely used in server power supplies, charging stations, and automotive power supplies. Currently, widely used DC-DC modules each have their own advantages and disadvantages. Traditional magnetic components are typically large and heavy, hindering device miniaturization and lightweighting. They also exhibit significant losses at high frequencies, impacting device efficiency. Furthermore, traditional magnetic components are often discrete in design, resulting in a large number of components and complex wiring within the system. Summary of the Invention

[0003] The main purpose of this application is to provide a magnetic integrated device and electronic equipment to solve the problems of low transformer integration, large size, low efficiency, and poor heat dissipation, so as to reduce the size of the transformer, improve efficiency, obtain good heat dissipation, maintain parameter consistency, and improve the assembly integration of the device.

[0004] To solve the above problems, the present application provides a magnetic integration device and an electronic device, which includes at least: a main circuit board and two power conversion groups, the two power conversion groups are arranged side by side, and any power conversion group includes: a first circuit board, a second circuit board and a magnetic integration module; wherein the first circuit board and the second circuit board are arranged on the main circuit board at intervals along a first direction, and the first circuit board and the second circuit board fix the magnetic integration module on the main circuit board; the magnetic integration module is connected to the devices on the first circuit board and the second circuit board.

[0005] In one embodiment, the first circuit board and the second circuit are both provided with a first protrusion along the second direction; the first protrusion at least partially passes through the hollow area on the magnetic integration module to fix the magnetic integration module on the main circuit board; wherein the second direction is toward the main circuit board.

[0006] In one embodiment, the magnetic integrated device further includes a coupling component, wherein a first portion of the coupling component is disposed at one end of the first circuit board and the second circuit board away from the main circuit board, and is electrically connected to the first circuit board and the second circuit board; a second portion of the coupling component is disposed toward the main circuit board and between the two power conversion groups; wherein the coupling component is used to couple the negative pole of the power supply.

[0007] In one embodiment, the third portion of the coupling component is disposed on the main circuit board and extends in a direction away from the power conversion group.

[0008] In one embodiment, the magnetic integrated device further includes a capacitor module, which is disposed on the main circuit board along a third direction, wherein the third direction is a length direction of the main circuit board.

[0009] In one embodiment, the magnetic integration module includes at least a first magnetic core and a second magnetic core; the first magnetic core and the second magnetic core are arranged side by side in the third direction, and a gap is provided between the first magnetic core and the second magnetic core.

[0010] In one embodiment, any magnetic core includes: a first base plate, a second base plate, a first side column, a second side column and a winding column; one end of the first side column is connected to the first base plate, and the other end is connected to the second base plate, one end of the second side column is connected to the first base plate, and the other end is connected to the second base plate, forming a ring; multiple winding columns are arranged in the ring, one end of each winding column is connected to the first base plate, and the other end is connected to the second base plate.

[0011] In one embodiment, the first base plate includes a first sub-base plate and a second sub-base plate, and a first magnetic resistance is arranged between the first sub-base plate and the second sub-base plate; the second base plate includes a third sub-base plate and a fourth sub-base plate, and a first magnetic resistance is arranged between the third sub-base plate and the fourth sub-base plate; the first side column includes a first sub-side column and a second sub-side column, and a second magnetic resistance is arranged between the first sub-side column and the second sub-side column; the second side column includes a third sub-side column and a fourth sub-side column, and a second magnetic resistance is arranged between the third sub-side column and the fourth sub-side column.

[0012] In one embodiment, the first magnetic core and the second magnetic core are coupled, and the first magnetic core and the second magnetic core share a side column.

[0013] In one embodiment, the first magnetic core and the second magnetic core are coupled, and no side column exists between the first magnetic core and the second magnetic core.

[0014] To solve the above problems, the present application also provides an electronic device, which includes: a power supply; a magnetic integrated device, the magnetic integrated device is coupled to the power supply to transform the output power of the power supply, and the magnetic integrated device is a magnetic integrated device as described in any one of the above embodiments.

[0015] The magnetic integrated device and electronic device provided in the present application integrate the circuit board and the magnetic integrated module to optimize the volume, and optimize the air duct through the interval setting, improve the heat dissipation, and enhance the efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without inventive efforts. Among them:

[0017] Figure 1 is a structural schematic diagram of the first embodiment of the magnetic integration device provided by the present application;

[0018] Figure 2 This is a schematic structural diagram of a first embodiment of the first circuit board / second circuit board provided by the present application;

[0019] Figure 3 This is a schematic structural diagram of a second embodiment of the first circuit board / second circuit board provided by the present application;

[0020] Figure 4 This is a schematic structural diagram of the first embodiment of the magnetic integration module provided by the present application;

[0021] Figure 5 is a structural schematic diagram of a second embodiment of a magnetic integration device provided by the present application;

[0022] Figure 6 is a structural schematic diagram of the third embodiment of the magnetic integration device provided by the present application;

[0023] Figure 7 It is a structural diagram of an embodiment of a coupling component provided by the present application;

[0024] Figure 8 is a structural schematic diagram of a fourth embodiment of a magnetic integration device provided by the present application;

[0025] Figure 9 is a structural diagram of the second embodiment of the magnetic integration module provided by this application;

[0026] Figure 10 is a structural diagram of the third embodiment of the magnetic integration module provided by this application;

[0027] Figure 11 is a structural diagram of a fourth embodiment of a magnetic integration module provided by the present application;

[0028] Figure 12 is a structural diagram of the fifth embodiment of the magnetic integration module provided by the present application;

[0029] Figure 13 is a structural diagram of a sixth embodiment of a magnetic integration module provided by the present application;

[0030] Figure 14 This is a structural diagram of an embodiment of an electronic device provided by the present application;

[0031] Figure 15 This is a schematic diagram of the primary and secondary winding distribution structure of an embodiment of a power supply circuit provided by the present application;

[0032] Figure 16This is a schematic diagram of the primary circuit structure of an embodiment of a power supply circuit provided by the present application;

[0033] Figure 17 This is a schematic diagram of the secondary circuit structure of an embodiment of the power supply circuit provided by the present application.

[0034] Figure Number:

[0035] 100, magnetic integrated device; 10, main circuit board; 20, power conversion group; 21, first circuit board; 211, first protrusion; 212, second protrusion; 213, hollow area; 214, through hole; 22, second circuit board; 23, magnetic integrated module; 231, first magnetic core; 232, second magnetic core; 234, first bottom plate; 235, second bottom plate; 236, first side column; 237, second side column; 238, winding column; 24, device ;25. Coupling component;251. First part;252. Second part;253. Third part;26. Capacitor module;240. First sub-base plate;241. Second sub-base plate;242. Third sub-base plate;243. Fourth sub-base plate;244. First sub-side column;245. Second sub-side column;246. Third sub-side column;247. Fourth sub-side column;248. First magnetic resistance;249. Second magnetic resistance;300. Electronic device;400. Power supply. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It will be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some, rather than all, structures related to the present application are shown in the drawings. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0037] The terms "first," "second," and the like in this application are used to distinguish between different objects, not to describe a particular order. Furthermore, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements, but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0038] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0039] Traditional magnetic devices typically use discrete wound magnetic components and corresponding power conversion circuits. For example, the primary side of a transformer uses Litz wire wound in series on two legs, while the secondary side uses copper sheet windings with parallel outputs. However, this approach often presents several issues, including bulk: the primary side's wire-wound coils, bobbins, and other components occupy a significant portion of the space, resulting in low overall system efficiency. Low efficiency: the transformer's high-frequency power circuit is large (the coils are far from the MOS tubes, filter capacitors, etc.), resulting in significant losses caused by high-frequency currents in the coils, making further efficiency improvements difficult. Poor heat dissipation: the primary side's multi-strand insulation accounts for a significant portion of the core, and the multi-layer coil winding almost completely fills the core window, blocking the airflow and resulting in poor heat dissipation. Adding cooling ducts would require further expansion. Poor parameter consistency: coil winding and assembly are significantly affected by the process, making it difficult to accurately control parameters such as parasitic capacitance and leakage inductance of the magnetic components, leading to significant performance fluctuations in high-frequency applications. Low automation: wound magnetic components are generally not easily automated, resulting in poor performance consistency.

[0040] Therefore, the present application provides a magnetic integration device 100 and an electronic device to solve the above problems.

[0041] See Figure 1 As shown, Figure 1 It is a structural schematic diagram of the first embodiment of the magnetic integration device provided in the present application; wherein, the magnetic integration device 100 includes at least: a main circuit board 10 and two power conversion groups 20, the two power conversion groups 20 are arranged side by side, and any power conversion group 20 includes: a first circuit board 21, a second circuit board 22 and a magnetic integration module 23; wherein, the first circuit board 21 and the second circuit board 22 are arranged on the main circuit board 10 at intervals along the first direction, and the first circuit board 21 and the second circuit board 22 fix the magnetic integration module 23 on the main circuit board 10; the magnetic integration module 23 is connected to the devices 24 on the first circuit board 21 and the second circuit board 22.

[0042] In the above manner, the circuit board and the magnetic integration module 23 are integrated to optimize the volume, and the air duct is optimized by setting them at intervals, improving heat dissipation and enhancing device efficiency.

[0043] In a specific embodiment, the first circuit board 21 and the second circuit board 22 are spaced apart and arranged on both sides of the magnetic integration module 23. Figure 1As shown, a spaced assembly method is used to leave an internal air duct for the magnetic integrated device 100 to ensure heat conversion efficiency during heat dissipation, effectively improving the heat dissipation of the magnetic integrated device 100. In addition, in traditional magnetic devices 24, the air gap between the magnetic core winding posts 238 is set inside the coil, which makes it difficult to increase the avoidance distance and results in large eddy current losses. In the solution of the present application, by arranging the first circuit board 21 and / or the second circuit board 22 on both sides of the magnetic integrated module 23, the air gap avoidance distance is large, the eddy current losses are reduced, and this is conducive to improving efficiency.

[0044] In other embodiments, some components 24 on the primary side or the secondary side of the transformer (ie, the magnetic integrated device 100 ) are arranged on the first circuit board 21 and / or the second circuit board 22 .

[0045] In one embodiment, taking the first circuit board 21 as an example, Figure 2 As shown, Figure 2 This is a schematic structural diagram of the first embodiment of the first circuit board / second circuit board provided in the present application; the first circuit board 21 and the second circuit are both provided with a first protrusion 211 along the second direction; the first protrusion 211 at least partially passes through the hollow area 213 on the magnetic integration module 23, fixing the magnetic integration module 23 on the main circuit board 10; wherein, the second direction is toward the main circuit board 10.

[0046] For further information, see Figure 3 and Figure 4 As shown, Figure 3 This is a schematic structural diagram of a second embodiment of the first circuit board / second circuit board provided by the present application; Figure 4 : is a structural diagram of the first embodiment of the magnetic integration module provided by this application; Figure 3 As shown, the first protrusion includes a through hole 214 structure; on this basis, combined Figure 4 As shown, Figure 4 The magnetic integration module 23 in FIG is only one set of structures, and the actual structure is two sets of structures arranged side by side. Figure 4 It can be seen that Figure 4 The magnetic integration module 23 further includes a winding post 238 in the hollow area 213, wherein the winding post 238 passes through Figure 3 The through hole 214 in the first protrusion is coupled and fixed to the magnetic integration module 23 .

[0047] In one embodiment, if Figure 5 As shown, Figure 5It is a structural schematic diagram of the second embodiment of the magnetic integration device provided in the present application; the magnetic integration device 100 also includes a coupling component 25, the first part 251 of the coupling component 25 is arranged on the first circuit board 21 and the second circuit board 22 away from the end of the main circuit board 10, and is electrically connected to the first circuit board 21 and the second circuit board 22; the second part 252 of the coupling component 25 is arranged between the two power conversion groups 20 toward the main circuit board 10; wherein, the coupling component 25 is used to couple the negative pole of the power supply.

[0048] Combine Figure 3 and Figure 5 As shown, the first circuit board 21 and the second circuit board 22 are provided with a second protrusion 212 in the second direction away from the second direction, and the coupling component 25 couples the first circuit board 21 and the second circuit board 22 together through the second protrusion 212; it can be understood that in another embodiment, the first circuit board 21 and the second circuit board 22 of the two-way power conversion group 20 are also coupled together in this way.

[0049] In one embodiment, if Figure 6 As shown, Figure 6 2 is a schematic structural diagram of the third embodiment of the magnetic integration device provided in the present application; the third portion 253 of the coupling component 25 is provided on the main circuit board 10 and extends in a direction away from the power conversion group 20 .

[0050] Combine Figure 5 and Figure 6 As shown, the coupling component 25 includes a plurality of first portions 251 , and each first portion 251 couples the first circuit board 21 and the second circuit board 22 together through the second protrusion 212 .

[0051] Specifically, if Figure 7 As shown, Figure 7 This is a schematic diagram of the structure of an embodiment of the coupling component provided by this application; Figure 7 As can be seen, in this embodiment, the first part 251, the second part 252 and the third part 253 of the coupling component 25 are coupled together by the second part 252; in another embodiment, the second part 252 and the third part 253 are integrally formed.

[0052] It can be understood that the secondary output pins of the magnetic integrated device 100 face upwards to facilitate connection with the coupling component 25 , and the MOS tube has a better air duct for heat dissipation.

[0053] like Figure 7 As shown, the third portion 253 of the coupling component 25 is also provided with a protruding portion along the second direction to achieve interlocking coupling with the main circuit board 10 .

[0054] It is understood that in the above embodiment, the coupling component 25 (copper busbar) can be used to transfer the high-throughput current to the output port. This method involves low impedance, good heat dissipation performance, and low power loss. In other embodiments, the magnetic integrated module 23 and the corresponding first circuit board 21 and / or second circuit board 22 are installed in reverse, that is, the output pins of the secondary side are inserted into the main circuit board 10 along the second direction and transferred to the output port through the main circuit board 10, thereby eliminating the coupling component 25.

[0055] In one embodiment, if Figure 6 and Figure 8 As shown, Figure 8 FIG2 is a schematic structural diagram of a fourth embodiment of a magnetic integration device provided by the present application; the magnetic integration device 100 further includes a capacitor module 26, which is disposed on the main circuit board 10 along a third direction, where the third direction is the length of the main circuit board 10. The capacitor module 26 is primarily used for filtering, coupling, decoupling, and energy storage.

[0056] It is understandable that in the traditional transformer (magnetic integrated device 100) solution, the transformer high-frequency power loop is large (the coil is far from the MOS tube, filter capacitor, etc.), and the loss caused by the high-frequency current of the coil is large, making it difficult to further improve the efficiency. The device 24, in one embodiment, can include: a rectifier MOS tube, a filter capacitor, etc. Specifically, the secondary side of the transformer (PCB copper foil, i.e., the copper foil integrated on the first circuit board 21 or the second circuit board 22) is directly connected to the device 24. This connection conduction mode can be high-frequency current, short path, and low loss, so higher efficiency can be achieved. The PCB copper foil has a low thermal resistance compared to many strands of wire. At the same time, the dual PCBs (circuit boards, i.e., the first circuit board 21 and the second circuit board 22) are assembled on both sides separately, with good air ducts in the middle and on both sides, and the magnetic core, PCB and the device 24 arranged thereon all obtain good heat dissipation. Among them, the insulation of the copper foil accounts for a small proportion, and the heat dissipation is good. In other embodiments, the current density can be appropriately increased, and the overall volume of the coil is small.

[0057] In one embodiment, the coupling component 25 is a copper busbar structure. Specifically, in another embodiment, Figure 5 The second portion 252 is centrally assembled and arranged to have good current distribution. In other embodiments, the copper busbar of the coupling component 25 may be arranged in a non-central manner, that is, respectively arranged on both sides of the two power conversion groups 20; or, all of them may be arranged on either side of the two power conversion groups 20, that is, Figure 5 to the left or right of the .

[0058] Through the above-described method, the copper foil on the first circuit board 21 and / or the second circuit board 22 can be designed with a higher current density, reducing the space occupied by the winding. At the same time, the primary and secondary MOS, filter capacitors, and control chips can be arranged nearby on the first circuit board 21 and / or the second circuit board 22, reducing the overall volume of the power conversion part by more than 30%. In addition, the large copper foil on the first circuit board 21 and / or the second circuit board 22 has a low thermal resistance due to the large number of strands. At the same time, the first circuit board 21 and the second circuit board 22 are assembled on both sides separately, with good air ducts in the middle and on both sides, so that the magnetic core, the first circuit board 21 and the second circuit board 22, and the devices 24 thereon all obtain good heat dissipation. In addition, the processing on the first circuit board 21 and / or the second circuit board 22 has smaller dimensional tolerances than traditional wire winding, and the automatic processing parameters are more consistent. For high-frequency applications, the circuit stability is good, the magnetic component structure is simple, and it is easy to use automated assembly, improving processing efficiency and performance consistency.

[0059] Furthermore, in the cascaded form of two transformers (i.e., the two-way power conversion group 20), the secondary coil output is rectified and connected in parallel, and the total current is divided into each secondary winding. At the same time, the coil, the rectifier MOS and the filter capacitor form a minimum high-frequency power loop, thereby greatly reducing the total loss of the secondary coil. The magnetic core is symmetrically mounted on the first circuit board 21 and the second circuit board 22 on one side, and the air duct is reserved in the middle to enhance the overall heat dissipation, which can improve the efficiency of cooling. The magnetic core is symmetrically mounted on the first circuit board 21 and the second circuit board 22 on one side, with the main air gap opened in the middle. The winding avoids the air gap by 3 to 5 times the distance, reducing eddy current loss. The two conversion modules have a phase difference of 90 degrees and the output is connected in parallel, which reduces the ripple current and reduces the loss by more than 20%.

[0060] In one embodiment, if Figure 9 As shown, Figure 9 It is a structural schematic diagram of the second embodiment of the magnetic integration module provided in this application; the magnetic integration module 23 includes at least a first magnetic core 231 and a second magnetic core 232; the first magnetic core 231 and the second magnetic core 232 are arranged side by side in the third direction, and a gap is provided between the first magnetic core 231 and the second magnetic core 232.

[0061] Understandably, combined Figure 8 and Figure 9 As shown, the magnetic integration module 23 is arranged on the main circuit board 10 in a sunken assembly manner, adopts local support, and fully utilizes the space to improve the power density of the power supply.

[0062] In one embodiment, if Figure 10 As shown, Figure 10It is a structural schematic diagram of the third embodiment of the magnetic integrated module provided in the present application; any magnetic core includes at least: a first base plate 234, a second base plate 235, a first side column 236, a second side column 237 and a winding column 238; one end of the first side column 236 is connected to the first base plate 234, and the other end is connected to the second base plate 235, one end of the second side column 237 is connected to the first base plate 234, and the other end is connected to the second base plate 235, forming a ring; a plurality of winding columns 238 are arranged in the ring, and one end of each winding column 238 is connected to the first base plate 234, and the other end is connected to the second base plate 235.

[0063] In one embodiment, if Figure 11 As shown, Figure 11 It is a structural schematic diagram of the fourth embodiment of the magnetic integration module provided in the present application; the first base plate 234 includes a first sub-base plate 240 and a second sub-base plate 241, and a first magnetic resistance 248 is arranged between the first sub-base plate 240 and the second sub-base plate 241; the second base plate 235 includes a third sub-base plate 242 and a fourth sub-base plate 243, and a first magnetic resistance 248 is arranged between the third sub-base plate 242 and the fourth sub-base plate 243; the first side column 236 includes a first sub-side column 244 and a second sub-side column 245, and a second magnetic resistance 249 is arranged between the first sub-side column 244 and the second sub-side column 245; the second side column 237 includes a third sub-side column 246 and a fourth sub-side column 247, and a second magnetic resistance 249 is arranged between the third sub-side column 246 and the fourth sub-side column 247.

[0064] The first magnetic resistor 248 and the second magnetic resistor 249 may include but are not limited to a bonded air gap, or may be bonded or filled with any material smaller than the μr (relative magnetic permeability) of the main magnetic core, for example, glass bead glue bonding to produce an air gap or lower μr magnetic core composite bonding or magnetic powder glue bonding, magnetic conductive ink filling, etc., and may also be divided into multi-stage bonding forms.

[0065] In addition, in one embodiment, the first bottom plate 234 and the second bottom plate 235 are arranged in parallel, and the first moderator and the second side column 237 are arranged in parallel; in another embodiment, the first bottom plate 234 is arranged perpendicular to the first side column 236, and similarly, it is also arranged perpendicular to the second side column 237; the second bottom plate 235 is arranged in the same manner as the first bottom plate 234.

[0066] In one embodiment, if Figure 12 As shown, Figure 12 It is a structural diagram of the fifth embodiment of the magnetic integration module provided in the present application; the first magnetic core 231 and the second magnetic core 232 are coupled, and the first magnetic core and the second magnetic core 232 share a side column.

[0067] The first magnetic core 231 and the second magnetic core 232 share a side column, and the left and right parts of the first magnetic core 231 and the second magnetic core 232 can be bonded together. The specific method can be achieved by coupling the first magnetic resistor 248 used above. Figure 12 As shown, Figure 12 The first magnetic resistor 248 is used to realize the coupling between the first magnetic core 231 and the first base plate 234 of the second magnetic core 232, and the second base plate 235 is also used; wherein, for the side column, the same can be done as Figure 12 The two sub-side poles are shown coupled via the second magnetic resistor 249. In other embodiments, a single side pole may be provided. In another embodiment, the first magnetic core 231 and the second magnetic core 232 share a side pole, and the bottom plate of the two magnetic cores and the shared side pole may be an integral structure.

[0068] In one embodiment, if Figure 13 As shown, Figure 13 This is a schematic diagram of the structure of the sixth embodiment of the magnetic integration module provided by the present application; the first magnetic core 231 and the second magnetic core 232 are coupled, and there is no side column between the first magnetic core 231 and the second magnetic core 232. The bottom plate between the first magnetic core 231 and the second magnetic core 232 can be coupled by setting a first magnetic resistor 248. The implementation method of the first magnetic resistor 248 of the coupling part is the same as that in the above embodiment, and will not be described in detail here. For example Figure 13 As shown, Figure 13 In the embodiment, the two are coupled, wherein the coupled portion is coupled using the first magnetic resistor 248. In another embodiment, the bottom plate between the first magnetic core 231 and the second magnetic core 232 may also be an integral structure.

[0069] It is understood that, for the magnetic integration module 23 of each embodiment described above, the direction of the magnetic flux of each winding post 238 generated by coil excitation can be adjusted according to the actual usage and scenario, that is, to meet the usage requirements. The direction of the magnetic flux can also be reversed as a whole.

[0070] To solve the above problems, the present application also provides an electronic device 300, such as Figure 14 As shown, Figure 14 1 is a structural diagram of an embodiment of an electronic device provided in the present application; the electronic device 300 includes: a power supply 400; a magnetic integrated device 100, the magnetic integrated device 100 is coupled to the power supply 400 to convert the output power of the power supply 400, and the magnetic integrated device 100 is the magnetic integrated device 100 described in any one of the above embodiments.

[0071] In order to solve the above problems, the present application also provides a power supply circuit, such as Figure 15 、 Figure 16 and Figure 17 As shown, Figure 15 This is a schematic diagram of the primary and secondary winding distribution structure of an embodiment of a power supply circuit provided by the present application; Figure 16 This is a schematic diagram of the primary circuit structure of an embodiment of a power supply circuit provided by the present application; Figure 17 This is a schematic diagram of the secondary circuit structure of an embodiment of the power supply circuit provided by this application; it can be understood that the power supply circuit adopts a primary full-bridge LLC, a secondary side center-tapped full-wave rectifier, and a secondary side output parallel connection. Figure 17 As shown, Figure 17 Only one secondary output is rectified. Figure 17 The three ports on the left correspond to the connections Figure 15 In any three-terminal interface, that is, Figure 15 The corresponding ports 5, 6, 7, or 8, 9, 10, or 11, 12, 13, etc., all the way to 26, 27, 28 are connected, that is, the power circuit should include at least 8 Figure 17 The circuit structure shown.

[0072] In other embodiments, the power supply circuit corresponds to one of the power conversion paths, and may actually be two paths staggered in parallel by 90 degrees, or three paths or more paths may be connected in parallel.

[0073] Furthermore, in other embodiments, the topology, number of transformer turns (number of coil turns on winding post 238), rectification method, and secondary output connection method can be flexibly adjusted according to the application. Specifically, they include but are not limited to: primary full-bridge and half-bridge topologies, secondary bridge or center-tapped rectification, and secondary output parallel, partial series, or full series connection.

[0074] The present application provides a magnetic integration device 100 and an electronic device 300. The magnetic integration device 100 utilizes a structural assembly method comprising a main circuit board 10, a first circuit board 21, a second circuit board 22, and a magnetic integration module 23 to improve the integration level of the magnetic integration device 100, thereby reducing its size and improving heat dissipation. Furthermore, a two-way power conversion group 20 is employed to symmetrically mount the magnetic core on one side, thereby increasing the air gap distance, reducing eddy current losses, and improving the efficiency of the power supply 400. Furthermore, the structure of the present application allows for smaller dimensional tolerances in circuit board processing, better consistency in processing parameters, and ease of automated assembly, thereby improving production efficiency.

[0075] The above is a detailed introduction to the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of the present application. At the same time, for those skilled in the art, based on the ideas of the present application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A magnetic integrated device, characterized in that: The magnetic integration device at least comprises: A main circuit board and two power conversion groups, the two power conversion groups are arranged side by side, and any of the power conversion groups includes: a first circuit board, a second circuit board and a magnetic integration module; The first circuit board and the second circuit board are arranged on the main circuit board at intervals along a first direction, and the first circuit board and the second circuit board fix the magnetic integration module on the main circuit board; the magnetic integration module is connected to the devices on the first circuit board and the second circuit board.

2. The magnetic integration device according to claim 1, characterized in that The first circuit board and the second circuit are both provided with a first protrusion along the second direction; the first protrusion at least partially passes through the hollow area on the magnetic integration module to fix the magnetic integration module on the main circuit board; wherein, the second direction is toward the main circuit board.

3. The magnetic integration device according to claim 1, characterized in that The magnetic integration device further includes a coupling component, wherein a first portion of the coupling component is disposed at an end of the first circuit board and the second circuit board away from the main circuit board and is electrically connected to the first circuit board and the second circuit board; The second portion of the coupling component is disposed between the two power conversion groups toward the main circuit board; Wherein, the coupling component is used to couple the negative pole of the power supply.

4. The magnetic integration device according to claim 3, characterized in that The third portion of the coupling component is disposed on the main circuit board and extends in a direction away from the power conversion group.

5. The magnetic integration device according to claim 1, characterized in that The magnetic integration device further includes a capacitor module, which is arranged on the main circuit board along a third direction, wherein the third direction is a length direction of the main circuit board.

6. The magnetic integration device according to claim 1, characterized in that The magnetic integration module includes at least a first magnetic core and a second magnetic core; the first magnetic core and the second magnetic core are arranged side by side in a third direction, and a gap is provided between the first magnetic core and the second magnetic core.

7. The magnetic integration device according to claim 6, characterized in that: Any of the magnetic cores comprises: a first bottom plate, a second bottom plate, a first side column, a second side column, and a winding column; One end of the first side column is connected to the first bottom plate, and the other end is connected to the second bottom plate; one end of the second side column is connected to the first bottom plate, and the other end is connected to the second bottom plate, forming a ring; A plurality of winding posts are arranged in the ring, and one end of each winding post is connected to the first bottom plate, and the other end is connected to the second bottom plate.

8. The magnetic integration device according to claim 7, characterized in that: The first base plate includes a first sub-base plate and a second sub-base plate, and a first magnetic resistor is provided between the first sub-base plate and the second sub-base plate; The second base plate includes a third sub-base plate and a fourth sub-base plate, and a first magnetic resistor is provided between the third sub-base plate and the fourth sub-base plate; The first side column includes a first sub-side column and a second sub-side column, and a second magnetic resistance is provided between the first sub-side column and the second sub-side column; The second side column includes a third sub-side column and a fourth sub-side column, and a second magnetic resistance is provided between the third sub-side column and the fourth sub-side column.

9. The magnetic integration device according to claim 6, characterized in that: The first magnetic core and the second magnetic core are coupled, and the first magnetic core and the second magnetic core share a side column.

10. The magnetic integration device according to claim 6, characterized in that: The first magnetic core and the second magnetic core are coupled, and no side column exists between the first magnetic core and the second magnetic core.

11. An electronic device, characterized in that: The electronic device comprises: power supply; A magnetic integrated device is coupled to the power supply to transform the output power of the power supply, and the magnetic integrated device is the magnetic integrated device according to any one of claims 1 to 10.

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