Lining structure for radio frequency electrode cavity and use method of lining structure

By using a lining structure in the RF electrode cavity, the winding path consistency is ensured, and the problem of dense paths of electrostatic chuck winding lines is solved, and the uniformity and yield of wafer processing are improved.

CN120473424AActive Publication Date: 2025-08-12SHANGHAI JIYI TECH CO LTD
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Patent Information

Application Number
CN202510562798.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-30
Publication Date
2025-08-12
Estimated Expiration
2045-04-30

AI Technical Summary

Technical Problem

In the prior art, different electrostatic chuck winding paths lead to dense winding paths, increasing manufacturing and maintenance difficulties, and affecting the uniformity and yield of wafer processing.

Method used

The inner lining structure for the RF electrode cavity is adopted, including several inner lining bodies and wiring ducts, to ensure the same winding path, fixed through threaded holes and wire mounts, and non-metallic materials are used to maintain a safe distance.

Benefits of technology

Reduce the density of winding paths, maintain the uniformity and yield of wafer processing, facilitate maintenance, and avoid arbitrary manual operation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a lining structure for a radio frequency electrode cavity and a use method thereof, and the lining structure comprises a plurality of lining bodies which are arranged in the radio frequency electrode cavity, the adjacent lining bodies are in contact with each other, a wire inlet gap is formed between the last lining body and the first lining body, and a wire outlet gap is formed between the last lining body and the first lining body. Each lining body is connected with the inner top surface of the radio frequency electrode cavity; the multiple layers of wiring grooves are used for installing cables or pipelines, are formed in the inner wall of the lining body and are distributed in the height direction of the lining body; the cables are clamped and matched with the corresponding wiring grooves, one ends of the cables are located outside the lining structure, and the other ends of the cables are located in a cavity defined by the lining structure and extend towards the electrostatic chuck. The pipelines are clamped and matched with the corresponding wiring grooves, one ends of the pipelines are located outside the lining structure, and the other ends of the pipelines are located in a cavity defined by the lining structure and extend towards the electrostatic chuck. According to the invention, the winding paths in the radio frequency electrode cavity are the same, so that the density is reduced, and the wafer processing uniformity and yield are maintained.
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Description

Technical Field

[0001] The present invention belongs to the field of wafer manufacturing equipment, and in particular relates to a lining structure for a radio frequency electrode cavity and a method of using the same. Background Art

[0002] Electrostatic chucks are key devices used to hold and handle wafers during semiconductor manufacturing. By applying voltage to the chuck surface, an electrostatic force is created between the chuck and the wafer, causing the wafer to adhere tightly to the chuck.

[0003] The electrostatic chuck has the following functions: Built-in multi-zone heating electrodes and circulating cooling loops to maintain a stable wafer temperature; Electrostatic electrodes are used to generate an electric field of electrostatic force to adsorb the wafer; Helium flow channel on the back of the wafer enhances wafer heat dissipation and provides feedback on wafer adsorption status; The through hole is reserved for ejector pins, which are used for wafer transfer; Radiofrequency electrodes.

[0004] like Figure 1 As shown in the figure, multiple interfaces are reserved on the back of the electrostatic chuck to meet different functional requirements, including: heating electrode power supply interface, heating electrode temperature measurement interface, circulating cooling circuit inlet and outlet interface, DC high voltage input interface, helium interface, ejector pin reserved through hole, RF feed interface, etc.

[0005] However, existing technologies present the following challenges: 1) Given the fixed dimensions of the electrostatic chuck, varying cable routing increases the density of cable and conduit connections on the back of the chuck, complicating wiring and conduit routing during manufacturing and maintenance. 2) Varying cable routing can lead to variations in electrostatic chuck performance, impacting wafer processing uniformity and yield. Summary of the Invention

[0006] The purpose of the present invention is to provide a lining structure for a radio frequency electrode cavity and a method for using the same. The lining structure allows the winding paths within the radio frequency electrode cavity to be uniform, thereby reducing the density and maintaining the uniformity and yield of wafer processing. The technical solution adopted is: A lining structure for a radio frequency electrode cavity, comprising: A plurality of lining bodies are placed in the RF electrode cavity, adjacent lining bodies are in contact with each other, a wire entry gap is formed between the last lining body and the first lining body, and each lining body is connected to the inner top surface of the RF electrode cavity; all lining bodies form a lining structure; Several layers of wiring troughs are used to install cables or pipes, which are opened on the inner wall of the lining body and distributed along the height direction of the lining body; The cable is fitted with a corresponding wiring trough, one end of which is located outside the lining structure, and the other end is located in the cavity surrounded by the lining structure and extends toward the electrostatic chuck; the pipeline is fitted with a corresponding wiring trough, one end of which is located outside the lining structure, and the other end is located in the cavity surrounded by the lining structure and extends toward the electrostatic chuck.

[0007] Preferably, the wiring trough does not penetrate the lining body.

[0008] Preferably, a plurality of threaded hole layers are provided on the inner wall of the lining body along the height direction of the lining body; The threaded hole layer includes a plurality of threaded holes, and each threaded hole is connected to a wire binding seat through a fastener.

[0009] Preferably, the threaded hole does not penetrate the lining body.

[0010] Preferably, the lining structure is made of non-metallic material.

[0011] A method for using a lining structure for a radio frequency electrode cavity comprises the following steps: Step 1: Install the lining structure in the RF electrode cavity: Push all the lining bodies into the groove formed by the inner wall of the RF electrode cavity in sequence, and make Each lining body is placed in contact with the inner wall of the radio frequency electrode cavity; Then, each lining body is fixed to the inner top surface of the radio frequency electrode cavity in sequence by fasteners; Step 2: Winding: Cables and pipes enter the lining structure through the cable entry notch and match the wiring trough; A cable or pipe, one end of which is located outside the lining structure and extends from the cable inlet window on the RF electrode cavity to the outside of the RF electrode cavity, and the other end is located in the cavity surrounded by the lining structure and extends toward the electrostatic chuck; Step 3: Pass one end of the cable or pipe in the RF electrode cavity through the docking plate and the electrostatic chuck in sequence; Step 4: Install the RF electrode cavity on the docking plate.

[0012] Compared with the prior art, the advantages of the present invention are: 1. The same winding path maintains wafer processing uniformity and yield. Specifically, the winding path is defined as follows: the cable (pipe) is fitted with a corresponding wiring slot, with one end located outside the lining structure and the other end located within the cavity enclosed by the lining structure and extending toward the electrostatic chuck. Operators can route the wires according to this winding path, eliminating the arbitrariness and uncertainty of manual operation. As a result, the corresponding winding path is identical for wafers in different process chambers, maintaining wafer processing uniformity and yield.

[0013] 2. The winding path is the same, which can reduce density and facilitate maintenance.

[0014] 3. The material, threaded holes and wiring grooves of the lining structure all ensure that a safe distance is maintained between the RF electrode and the inner wall of the RF electrode cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of wiring and piping on the back of an electrostatic chuck in the prior art; Figure 2 Schematic diagram of the lining structure of the radio frequency electrode cavity; Figure 3 This is a schematic diagram of the wiring (wiring and piping) of the lining structure; Figure 4 This is a schematic diagram of the wiring and piping inside the RF electrode cavity without the inner lining installed; Figure 5 This is a schematic diagram of the wiring and piping inside the RF electrode cavity where the liner has been installed; Figure 6 This is a schematic diagram of the installation position of the cable holder. DETAILED DESCRIPTION

[0016] The following schematic diagrams provide a more detailed description of the radio frequency electrode cavity lining structure and its method of use. These schematic diagrams illustrate preferred embodiments of the present invention. It should be understood that those skilled in the art may modify the present invention described herein while still achieving its advantageous effects. Therefore, the following description should be understood as a general guideline for those skilled in the art and not as a limitation of the present invention.

[0017] A lining structure for a radio frequency electrode cavity, comprising: A plurality of lining bodies are placed in the RF electrode cavity, adjacent lining bodies are in contact with each other, a wire entry gap is formed between the last lining body and the first lining body, and each lining body is connected to the inner top surface of the RF electrode cavity; Several layers of wiring troughs are used to install cables or pipes, which are opened on the inner wall of the lining body and distributed along the height direction of the lining body; That is, the winding path is: the cable (pipeline) is fitted with the corresponding wiring slot, one end of which is located outside the lining structure, and the other end is located in the cavity surrounded by the lining structure and extends toward the electrostatic chuck.

[0018] The lining mechanism adopts a multi-piece structure, which is easy to install and remove.

[0019] Therefore, since the same semiconductor equipment has multiple process chambers, operators can route the wires according to the aforementioned routing, eliminating the arbitrariness and uncertainty of manual operation. Therefore, if the same routing paths are used for wafers in different process chambers, wafer processing uniformity and yield can be maintained.

[0020] In this embodiment, the “wire” in “inlet wire”, “winding wire” and “wiring trough” refers to cables or pipes.

[0021] In this embodiment, the wiring groove does not penetrate the lining body. Its function is to isolate the inner wall of the RF electrode cavity from the cables and pipelines to prevent the inner wall of the RF electrode cavity from being affected by the radio frequency of the cables and the cooling of the pipelines.

[0022] Furthermore, if Figure 5 As shown, the wire inlet notch is arranged opposite to the wire inlet window on the radio frequency electrode cavity.

[0023] In order to prevent the cables or pipes from slipping off the lining body and causing the winding path to change, threaded holes for installing the cable tie seat are opened on the lining body. Several layers of threaded holes are opened on the inner wall of the lining body along the height direction of the lining body.

[0024] The threaded hole layer includes several threaded holes, each of which is fixed with a wire tie seat by a fastener, such as Figure 6 As shown, the wire tie seat is used to fix the winding path.

[0025] The multi-layer layout of threaded holes can further optimize wiring and piping, and separate electrical, gas, and optical fiber pipelines.

[0026] In this embodiment, the threaded hole does not penetrate the lining body, and its function is to isolate the inner wall of the RF electrode cavity from the cables and pipelines to prevent the inner wall of the RF electrode cavity from being affected by the radio frequency of the cables and the cooling of the pipelines.

[0027] In this embodiment, the lining structure is a cylindrical barrel-shaped structure with a certain wall thickness, and the lining body extends along the inner wall of the RF electrode cavity and cooperates with the inner wall of the RF electrode cavity.

[0028] For an electrostatic chuck without a radio frequency electrode, the discharge safety of the lining does not need to be considered, that is, the lining thickness can be thinner, the lining can be made into a narrow strip, and does not need to completely cover the inner wall of the cavity.

[0029] Due to the charged nature of the RF electrode, the electrostatic chuck and the metal parts connected to the electrostatic chuck need to maintain a safe distance from the surrounding metal parts to avoid short circuits and RF discharges, which in turn affect equipment safety and device life.

[0030] In this embodiment, the lining structure is made of non-metallic material, such as PTFE and PEEK, which has the characteristics of insulation, heat resistance and excellent structural strength.

[0031] Therefore, the lining structure is made of non-metallic materials, so that a safe distance is maintained between the electrostatic chuck and the inner wall of the RF electrode cavity. Figure 1 In the invention, the RF electrode cavity, the ejector pin lifting mechanism, the RF feed (rod), and the docking plate are all made of metal materials.

[0032] In addition, if Figure 1 As shown, the rectangular frame in the figure is a partition structure, that is, the RF feed (pole) and other water, electricity and gas pipes are routed in separate channels.

[0033] A method for using a lining structure for a radio frequency electrode cavity comprises the following steps: Step 1: Install the lining structure in the RF electrode cavity.

[0034] Push all the lining bodies into the groove formed by the inner wall of the RF electrode cavity in sequence, and make Each lining body is placed in contact with the inner wall of the radio frequency electrode cavity; Then, each lining body is fixed to the inner top surface of the radio frequency electrode cavity in sequence by fasteners.

[0035] like Figure 6 In the figure, the threaded holes on the liner body are not shown.

[0036] Therefore, the lining mechanism adopts a multi-piece structure, which is easy to install and remove.

[0037] Step 2: Winding.

[0038] Cables and pipes enter the lining structure through the wire entry notch and cooperate with the wiring trough.

[0039] The cable or pipe has one end located outside the lining structure and extends from the line inlet window on the RF electrode cavity to the outside of the RF electrode cavity, and the other end is located in the cavity surrounded by the lining structure and extends toward the electrostatic chuck.

[0040] Among them, some cables and pipes enter through the wire entry gap and are wound clockwise, while other cables and pipes enter through the wire entry gap and are wound counterclockwise, so as to further reduce the density on the back of the electrostatic chuck.

[0041] The objects (cables and pipes) to be wound clockwise and the objects (cables and pipes) to be wound counterclockwise are all selected manually in advance.

[0042] Step 3: Pass one end of the cable or pipe in the RF electrode cavity through the docking plate and the electrostatic chuck in sequence; Step 4: Install the RF electrode cavity on the docking plate.

[0043] like Figures 4 and 5 Because only one winding path is used during the winding process, winding density is reduced, facilitating subsequent maintenance. Furthermore, within the same process chamber, operators can route wires according to the aforementioned winding path, eliminating the arbitrariness and uncertainty of manual operation. As a result, wafers in different process chambers use the same winding path, maintaining wafer processing uniformity and yield.

[0044] The above description is merely a preferred embodiment of the present invention and does not limit the present invention in any way. Any person skilled in the art who, without departing from the scope of the present invention, makes any equivalent substitution, modification, or other changes to the technical solution and technical content disclosed in the present invention shall be deemed to be within the scope of the present invention and still fall within the scope of protection of the present invention.

Claims

1. A lining structure for a radio frequency electrode cavity, characterized in that: include: A plurality of lining bodies are placed in the RF electrode cavity, with adjacent lining bodies in contact with each other, a wire entry gap formed between the last lining body and the first lining body, and all lining bodies forming a lining structure; each lining body is connected to the inner top surface of the RF electrode cavity; Several layers of wiring troughs are used to install cables or pipes, which are opened on the inner wall of the lining body and distributed along the height direction of the lining body; The cable is fitted with a corresponding wiring trough, one end of which is located outside the lining structure, and the other end is located in the cavity surrounded by the lining structure and extends toward the electrostatic chuck; the pipeline is fitted with a corresponding wiring trough, one end of which is located outside the lining structure, and the other end is located in the cavity surrounded by the lining structure and extends toward the electrostatic chuck.

2. The lining structure for a radio frequency electrode cavity according to claim 1, characterized in that: The wiring groove does not penetrate the lining body.

3. The lining structure for a radio frequency electrode cavity according to claim 1, characterized in that: A plurality of threaded hole layers are provided on the inner wall of the lining body along the height direction of the lining body; The threaded hole layer includes a plurality of threaded holes, and each threaded hole is connected to a wire binding seat through a fastener.

4. The lining structure for a radio frequency electrode cavity according to claim 3, characterized in that: The threaded hole does not penetrate the lining body.

5. The lining structure for a radio frequency electrode cavity according to claim 1, characterized in that: The lining body is made of non-metallic material.

6. A method for using a lining structure for a radio frequency electrode cavity, characterized in that: The following steps are involved: Step 1: Install the lining structure in the RF electrode cavity: Push all the lining bodies into the groove formed by the inner wall of the RF electrode cavity in sequence, and make Each lining body is placed in contact with the inner wall of the radio frequency electrode cavity; Then, each lining body is fixed to the inner top surface of the radio frequency electrode cavity in sequence by fasteners; Step 2: Winding: Cables and pipes enter the lining structure through the cable entry notch and match the wiring trough; A cable or pipe, one end of which is located outside the lining structure and extends from the cable inlet window on the RF electrode cavity to the outside of the RF electrode cavity, and the other end is located in the cavity surrounded by the lining structure and extends toward the electrostatic chuck; Step 3: Pass one end of the cable or pipe in the RF electrode cavity through the docking plate and the electrostatic chuck in sequence; Step 4: Install the RF electrode cavity on the docking plate.

Citation Information

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