Single-side plate stacking method
Through the single-sided stacking method, the dielectric adhesive layer has no gap connection and curing steps, the problem of low pass rate in the existing stacking method is solved, and efficient production and low-cost multi-layer glass pressed-ply plate manufacturing is achieved.
Patent Information
- Application Number
- CN202410177694.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-08
- Publication Date
- 2025-08-12
AI Technical Summary
When the existing stacking method has a poor pass rate during the pressing process, the entire set of pressing plates must be discarded, resulting in low production efficiency and increased costs.
By adopting the single-sided stacking method, by providing two single-sided joint wiring boards and a glass wiring board, the dielectric adhesive layer is used to connect without gaps, and the series conductor and metal circuits are electrically coupled, and fixed through the curing step to form a multi-layer glass pressed panel.
Improves production efficiency, reduces costs, reduces the risk of broken or cracks in transportation, and improves fault tolerance and configuration flexibility.
Smart Images
Figure CN120475635A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a plate stacking method, in particular to a single-side plate stacking method. Background Art
[0002] Conventional laminate methods utilize a layer-by-layer lamination process. Specifically, a first metal circuit is formed on a glass substrate, and a first dielectric layer is laminated onto the glass substrate to embed the first metal circuit within the first dielectric layer. A second metal circuit is then formed on the first dielectric layer, and a second dielectric layer is laminated onto the first dielectric layer to embed the second metal circuit within the second dielectric layer. This process continues to form a laminate. However, if a poor yield is observed during one of the lamination steps, the entire laminate must be discarded, reducing production efficiency and increasing costs.
[0003] Therefore, the inventors believed that the above defects could be improved, and through intensive research and application of scientific principles, they finally proposed the present invention which has a reasonable design and effectively improves the above defects. Summary of the Invention
[0004] An embodiment of the present invention provides a single-sided plate stacking method, which can effectively improve the defects that may occur in existing plate stacking methods.
[0005] The embodiment of the present invention discloses a single-sided lamination method, which includes: a preparation step: providing two single-sided bonding wiring boards and a glass wiring board; wherein the glass wiring board includes a glass substrate and a metal circuit configured on the glass substrate; wherein each single-sided bonding wiring board includes: a build-up glass substrate; a dielectric adhesive layer formed on one side of the build-up glass substrate; a layout circuit configured on the build-up glass substrate and at least a portion of the layout circuit is buried in the dielectric adhesive layer; a series conductor buried in the dielectric adhesive layer and having a metal circuit exposed on the glass substrate; a connection end on the outside of the dielectric adhesive layer; and a laminating step: simultaneously pressing the dielectric adhesive layers of the two single-sided bonded wiring boards in a thickness direction and connecting them to opposite sides of the glass wiring board without gaps, so that the series conductors of the two single-sided bonded wiring boards are connected to the metal circuit, and the two build-up glass substrates are parallel to the glass substrate; wherein the two single-sided bonded wiring boards are electrically coupled to each other through the two series conductors and the metal circuit; and a curing step: curing the two dielectric adhesive layers to bond and fix the two single-sided bonded wiring boards to the glass wiring board.
[0006] Preferably, in each single-sided bonding wiring board in the preparation step, the dielectric adhesive layer is semi-cured and a blind hole is formed by laser burning, the layout circuit is partially exposed through the through hole, and the series conductor is a conductive paste and the conductive paste is filled in the blind hole.
[0007] Preferably, in the preparation step, the connection end of each series conductor protrudes from the corresponding blind hole.
[0008] Preferably, in the preparation step, the glass substrate has a through hole through which the metal circuit extends, and each build-up glass substrate has a through hole through which the layout circuit extends; in the stacking step, the through hole of the glass substrate and the through holes of the two build-up glass substrates are staggered.
[0009] Preferably, in the preparation step, the metal circuit of the glass wiring board is surrounded by a filling hole in the through hole, and each series conductor is a conductive paste; in the overlapping step, the conductive paste of the two single-sided wiring boards extends from opposite sides of the filling hole to fill the interior of the filling hole.
[0010] Preferably, in each single-sided bonding wiring board in the preparation step, the layout circuit forms a channel surrounding the inside of the through hole, and the dielectric glue layer fills at least a portion of the channel.
[0011] Preferably, in the preparation step, the metal circuit of the glass wiring board is surrounded by a filling hole in the through hole, and the glass wiring board includes a conductive material filled in the filling hole and having a material different from that of the metal circuit.
[0012] Preferably, in each single-sided bonding wiring board in the preparation step, the layout circuit forms a channel inside the through hole, and the single-sided bonding wiring board includes a conductive material filled in the channel and having a material different from that of the layout circuit.
[0013] Preferably, the lamination step is performed only once. In the lamination step, the total number of laminated glass substrates and build-up glass substrates is between 3 and 20 layers, so that a multi-layer glass laminate is formed after the curing step is performed.
[0014] An embodiment of the present invention also discloses a single-sided lamination method, which includes: a preparation step of providing a single-sided bonded wiring board and a glass wiring board; wherein the glass wiring board includes a glass substrate and a metal circuit configured on the glass substrate; wherein the single-sided bonded wiring board includes: a build-up glass substrate; a dielectric adhesive layer formed on one side of the build-up glass substrate; a layout circuit configured on the build-up glass substrate and at least a portion of the layout circuit embedded in the dielectric adhesive layer; a series conductor embedded in the dielectric adhesive layer and having a connection end exposed to the outside of the dielectric adhesive layer; and a lamination step of pressing the dielectric adhesive layer of the single-sided bonded wiring board along a thickness direction and connecting it to one side of the glass wiring board without a gap, so that the series conductor of the single-sided bonded wiring board is connected to the metal circuit and the build-up glass substrate is parallel to the glass substrate; and a curing step of curing the dielectric adhesive layer to bond and fix the single-sided bonded wiring board to the glass wiring board.
[0015] In summary, the single-sided lamination method disclosed in the embodiment of the present invention can laminate the dielectric adhesive layers of the two single-sided bonded wiring boards and connect them to the opposite sides of the glass wiring board without gaps through the lamination step, so that the two layered glass substrates are parallel to the glass substrate and have better flatness. Furthermore, the single-sided lamination method can shorten the process and increase production efficiency and reduce costs through the lamination step, and can shorten the time the glass is on the production line and reduce the risk of breakage or cracks during transportation, and can replace wiring boards with poor pass rates at any time before the lamination step to improve fault tolerance. In addition, the single-sided lamination method improves the configuration flexibility of the entire architecture by adopting the single-sided bonded wiring board.
[0016] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 Schematic diagram of the process of the single-sided plate stacking method according to the first embodiment of the present invention.
[0018] Figure 2 for Figure 1 Schematic diagram of the preparation steps.
[0019] Figure 3 for Figure 1 Schematic diagram of the lamination step and the curing step.
[0020] Figure 4 for Figure 2 Magnified view of region IV.
[0021] Figure 5This is a schematic diagram of the preparation steps of the second embodiment of the present invention.
[0022] Figure 6 Schematic diagram of the lamination step and the curing step of the second embodiment of the present invention.
[0023] Figure 7 This is a partial schematic diagram of the preparation steps of Example 3 of the present invention.
[0024] Figure 8 It is a partial schematic diagram of the lamination step and the curing step of the third embodiment of the present invention.
[0025] Figure 9 This is a schematic diagram of the preparation steps of Example 4 of the present invention.
[0026] Figure 10 It is a partial schematic diagram of the lamination step and the curing step of the fourth embodiment of the present invention. DETAILED DESCRIPTION
[0027] The following is an explanation of the implementation of the "single-sided plate stacking method" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, it is stated in advance that the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. The following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.
[0028] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term "or" as used herein may include any one or more combinations of the associated listed items, as appropriate.
[0029] Example 1
[0030] See also Figures 1 to 4, which is Embodiment 1 of the present invention. This embodiment discloses a single-sided lamination method S100, which can be implemented to form a multi-layer glass laminate 100. In practical applications, the single-sided lamination method S100 can laminate and cure multiple layers of glass substrates (e.g., 10 layers of glass substrates) in a single pass. To facilitate understanding of this embodiment, the following description will be based on 2 to 4 layers of glass substrates. In this embodiment, the single-sided lamination method S100 includes (or is implemented sequentially) a preparation step S102, a lamination step S104, and a curing step S106.
[0031] To facilitate understanding of this embodiment, the respective contents of the preparation step S102, the stacking step S104 and the curing step S106 will be described below, and the corresponding component structures in the single-sided stacking method S100 will be introduced in due course, but the present invention is not limited thereto.
[0032] The preparation step S102: Figures 1 to 3 As shown, a glass wiring board 1 and two single-sided bonding wiring boards 2 are provided. In this embodiment, the two single-sided bonding wiring boards 2 can be located on opposite sides of the glass wiring board 1 along a thickness direction H, so as to facilitate the subsequent lamination step S104.
[0033] The glass wiring board 1 includes a glass substrate 11 and a metal circuit 12 disposed on the glass substrate 11. The glass substrate 11 has a through hole 113 through which the metal circuit 12 extends. In this embodiment, the glass substrate 11 is a through-glass via (TGV) glass substrate, but the present invention is not limited thereto.
[0034] The metal trace 12 is used to transmit a signal and, in this embodiment, includes a first trace segment 121, a connecting trace segment 122 electrically coupled to the first trace segment 121, and a second trace segment 123 electrically coupled to the connecting trace segment 122. The first trace segment 121 is formed on one side 111 of the glass substrate 11 facing one of the single-sided wiring boards 2, the connecting trace segment 122 is formed within the through-hole 113, and the second trace segment 123 is formed on the other side 112 of the glass substrate 11 facing the other single-sided wiring board 2. It should be noted that the trace patterns of the first trace segment 121 and the second trace segment 123 can be adjusted and varied based on design requirements and are not limited to those shown in the accompanying drawings.
[0035] As described above, the metal line 12 can transmit the signal from the first line segment 121 to the second line segment 123, or transmit the signal from the second line segment 123 to the first line segment 121, via the connecting line segment 122. Furthermore, the first line segment 121, the connecting line segment 122, and the second line segment 123 are integrally connected to form a single-piece structure, but the present invention is not limited thereto.
[0036] Refer again Figure 2 and Figure 3 In this embodiment, the two single-sided bonding wiring boards 2 can have substantially the same structure. Therefore, for ease of understanding, the following description will be based on a single single-sided bonding wiring board 2. However, the present invention is not limited thereto. For example, the structures of the two single-sided bonding wiring boards 2 can also be slightly different (e.g., the circuit patterns on the single-sided bonding wiring boards 2 can be adjusted based on design requirements).
[0037] In this embodiment, the single-sided bonded wiring board 2 includes a build-up glass substrate 21, a layout circuit 22 disposed on the build-up glass substrate 21, a dielectric layer 23 formed on one side of the build-up glass substrate 21, and a series conductor 24 embedded in the dielectric layer 23. Each build-up glass substrate 21 has a through-hole 211 through which the layout circuit 22 can extend. In this embodiment, the build-up glass substrate 21 is a through-glass via (TGV) glass substrate, but the present invention is not limited thereto.
[0038] At least a portion of the layout circuit 22 is embedded within the dielectric layer 23. In this embodiment, the layout circuit 22 includes an inner circuit segment 221, an intermediate circuit segment 222 electrically coupled to the inner circuit segment 221, and an outer circuit segment 223 electrically coupled to the intermediate circuit segment 222. The intermediate circuit segment 222 is embedded within the build-up glass substrate 21, and the inner circuit segment 221 and the outer circuit segment 223 are formed on two side surfaces 212 and 213 of the build-up glass substrate 21, respectively.
[0039] More specifically, the internal circuit segment 221 is located on the side surface 212 of the build-up glass substrate 21 and is adjacent to the glass wiring board 1. Furthermore, the internal circuit segment 221 is enclosed within the dielectric adhesive layer 23. This allows the single-sided bonded wiring board 2 (or the layout circuit 22) to be protected by the dielectric adhesive layer 23 during transportation during the manufacturing process, thereby reducing the risk of breakage or cracking during transportation.
[0040] Specifically, the layout circuit 22 is used to transmit signals from one side of the build-up glass substrate 21 (e.g., the side surface 212) to the other side of the build-up glass substrate 21 (e.g., the side surface 213). It should be noted that the circuit patterns of the inner circuit segment 221 and the outer circuit segment 223 of the layout circuit 22 are not limited to those shown in the drawings and can be adjusted based on design requirements.
[0041] The dielectric layer 23 has an insulating effect and is located on one side (e.g., the side surface 212) of the build-up glass substrate 21, serving as an insulating isolation layer and adhesive layer for the build-up glass substrate 21. The dielectric layer 23 can be made of a polyimide film (PI film), an insulating film (PP), or other insulating materials.
[0042] More specifically, the dielectric layer 23 is in a semi-cured state (B-stage) in this embodiment and is laser-burned to form a blind hole 231. The layout circuit 22 is partially exposed through the blind hole. The series conductor 24 is a conductive paste that is filled in the blind hole 231.
[0043] Furthermore, the series conductor 24 has a connection end 241 exposed outside the dielectric layer 23. Specifically, the connection end 241 of the series conductor 24 protrudes from the corresponding blind hole 231 to facilitate electrical coupling of the single-sided bonding wiring board 2 with the glass wiring board 1 via the series conductor 24, but the present invention is not limited thereto.
[0044] As described above, the single-sided stacking method S100 of this embodiment provides two of the single-sided bonded wiring boards 2 and the glass wiring board 1 before the stacking step S104, so that the two single-sided bonded wiring boards 2 and the glass wiring board 1 can be inspected separately before the stacking step S104 (for example, flatness and pass rate inspection), thereby facilitating the replacement of glass wiring boards with poor flatness or pass rate (such as the single-sided bonded wiring board 2 or the glass wiring board 1) at any time before the stacking step S104 to improve the fault tolerance rate.
[0045] It should be additionally explained that the single-sided stacking method S100 uses multiple single-sided bonded wiring boards 2 as the single-sided stacking structure basis for the implementation process of the entire method, so as to facilitate stable stacking and curing with other glass substrates (such as the glass substrate 11), and the single-sided stacking method S100 adopts the single-sided bonded wiring board 2 to improve the configuration flexibility of the entire architecture; that is, the single-sided stacking method S100 in this embodiment excludes any stacking method that does not use the single-sided bonded wiring board 2.
[0046] The overlapping step S104: Figures 1 to 3 As shown, the dielectric adhesive layers 23 of the two single-sided bonded wiring boards 2 are simultaneously pressed together along the thickness direction H and connected seamlessly to opposite sides of the glass wiring board 1, so that the series conductors 24 of the two single-sided bonded wiring boards 2 are connected to the metal lines 12 (e.g., the first line segment 121 and the second line segment 123), and the two build-up glass substrates 21 are parallel to the glass substrate 11. The two single-sided bonded wiring boards 2 are electrically coupled to each other via the two series conductors 24 and the metal lines 12.
[0047] It should be additionally explained that, in other embodiments not shown in the present invention, the specific number of the glass wiring board 1 and the single-sided bonded wiring board 2 in the stacking step S104 can be adjusted and varied according to design requirements. In other words, the single-sided stacking method S100 is preferably performed by only implementing the stacking step S104 once to stack the glass wiring board 1 and the single-sided bonded wiring board 2 in the number that meets the design requirements (e.g., the total number of layers of the glass substrate 11 and the added-layer glass substrate 21 can be between 3 and 20 layers). To put it another way, the single-sided stacking method S100 is preferably to limit the circuit to be formed only on the glass substrate, so that the overall structure of the multi-layer glass laminate 100 can be completed by only implementing the stacking step S104 once.
[0048] Furthermore, through the implementation of the overlapping step S104, the two single-sided bonded wiring boards 2 can be electrically coupled to each other through the layout line 22, the two series conductors 24 and the metal line 12, so that the two single-sided bonded wiring boards 2 can transmit signals to each other through the glass wiring board 1.
[0049] Furthermore, through the implementation of the lamination step S104, the first circuit segment 121 and the second circuit segment 123 of the glass wiring board 1 are respectively embedded within the corresponding dielectric adhesive layers 23 of the two single-sided bonded wiring boards 2, and the two build-up glass substrates 21 are parallel to the glass substrate 11. Consequently, both outer layers of the multi-layer glass laminate 100 are glass substrates, resulting in superior flatness. Furthermore, the circuits of the multi-layer glass laminate 100 are constructed on glass substrates with superior flatness and minimal deformation, thereby providing superior signal transmission quality.
[0050] As described above, the single-sided lamination method S100 disclosed in this embodiment can (single-time) laminate the two single-sided bonded wiring boards 2 on both sides of the glass wiring board 1 through the lamination step S104, thereby increasing production efficiency and reducing costs, and can shorten the time the glass is on the production line and reduce the risk of breakage or cracks during transportation.
[0051] The curing step S106: Figures 1 to 3 As shown, the two dielectric adhesive layers 23 (and the two series conductors 24) are cured to bond and secure the two single-sided bonded wiring boards 2 to the glass wiring board 1. In this embodiment, since the dielectric adhesive layers 23 are cured by continuous heating, after the lamination step S104, the two dielectric adhesive layers 23 are respectively positioned between the two build-up glass substrates 21 and the glass wiring board 1. In the curing step S106, the two dielectric adhesive layers 23 are heat-pressed to gradually cure, thereby bonding and securing the two single-sided bonded wiring boards 2 to the glass wiring board 1.
[0052] See Figure 4 As shown, in this embodiment, the series conductor 24 of the single-sided bonded wiring board 2 can be located in the same thickness direction H as the connecting line segment 122 of the glass wiring board 1. During the lamination step S104 and the curing step S106, the series conductor 24 can be fixedly bonded to the connecting line segment 122, thereby electrically coupling the layout line 22 of the single-sided bonded wiring board 2 and the metal line 12 of the glass wiring board 1.
[0053] Example 2
[0054] See Figure 5 and Figure 6 As shown, this is the second embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated here. The differences between this embodiment and the above-mentioned first embodiment are roughly described as follows:
[0055] In this embodiment, in the preparation step S102, only one single-sided bonded wiring board 2 and one glass wiring board 1 are provided. In the lamination step S104, the dielectric adhesive layer 23 of the single-sided bonded wiring board 2 is pressed and seamlessly connected to one side (e.g., the side surface 112) of the glass wiring board 1 along the thickness direction H, so that the series conductor 24 of the single-sided bonded wiring board 2 is connected to the metal line 12 and the build-up glass substrate 21 is parallel to the glass substrate 11. Finally, in the curing step S106, the dielectric adhesive layer 23 is cured to secure the single-sided bonded wiring board 2 to the glass wiring board 1.
[0056] It should be noted that the present invention is not limited to pressing the dielectric adhesive layer 23 of a single one-sided bonding wiring board 2 along the thickness direction H and connecting it to one side of the glass wiring board 1 without gaps. For example, in other embodiments not shown in the present invention, a plurality of the one-sided bonding wiring boards 2 are located on one side of the glass wiring board 1, and a plurality of the one-sided bonding wiring boards 2 are arranged in sequence along the thickness direction H. After superposition and curing, the dielectric adhesive layer 23 of the one-sided bonding wiring board 2 of the adjacent glass wiring board 1 is pressed and connected to one side of the glass wiring board 1 (such as the side surface 112) without gaps, and the dielectric adhesive layer 23 of each of the other one-sided bonding wiring boards 2 is pressed and connected to one side of the adjacent one-sided bonding wiring board 2 (such as the side surface 213) without gaps.
[0057] Example 3
[0058] See Figure 7 and Figure 8 As shown, this is the third embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between this embodiment and the above-mentioned first embodiment will not be described in detail. The differences between this embodiment and the above-mentioned first embodiment are roughly described as follows:
[0059] In the preparation step S102 (such as Figure 7 As shown in FIG. 1 , the metal line 12 of the glass wiring board 1 is surrounded by a filling hole 1221 in the through hole 113. Specifically, the connecting line segment 122 is surrounded by the filling hole 1221, and the filling hole 1221 is filled with a conductive paste CP1 in the preparation step S102. The conductive paste CP1 in the filling hole 1221 is preferably made of a conductive material different from that of the metal line 12. In the overlapping step S104 (as shown in FIG. 1 ), the metal line 12 of the glass wiring board 1 is surrounded by a filling hole 1221. In the overlapping step S104 (as shown in FIG. 1 ), the metal line 12 of the glass wiring board 1 is surrounded by a filling hole 1221. In the filling hole 1221, the conductive paste CP1 is preferably made of a conductive material different from that of the metal line 12. Figure 8 As shown, the through holes 113 of the glass substrate 11 and the through holes 211 of the build-up glass substrate 21 are staggered, but the present invention is not limited thereto. For example, in other embodiments not shown, the through holes 113 of the glass substrate 11 and the through holes 211 of the build-up glass substrate 21 can both be located in the thickness direction H.
[0060] It should be noted that in the preparation step S102 , the layout circuit 22 of the single-sided bonding wiring board 2 is formed within the through-hole 211 to form a channel 224. The filling hole 1221 of the glass substrate 11 and the channel 224 of the layout circuit 22 are staggered, but the present invention is not limited thereto. For example, in other embodiments not shown, the filling hole 1221 of the connecting circuit segment 122 within the through-hole 113 of the glass substrate 11 and the channel 224 of the layout circuit 22 within the through-hole 211 can both be located in the thickness direction H (i.e., the through-hole 113 and the through-hole 211 are arranged in a stacked arrangement).
[0061] It is worth noting that the single-sided bonding wiring board 2 includes a conductive material filled in the channel 224 and having a material different from that of the layout line 22 ; for example, the channel 224 is also filled with a conductive paste CP2 in the preparation step S102 .
[0062] Example 4
[0063] See Figure 9 and Figure 10 As shown, this is the fourth embodiment of the present invention. Since this embodiment is similar to the third embodiment, the similarities between the two embodiments will not be described in detail. The differences between this embodiment and the third embodiment are roughly described as follows:
[0064] In the preparation step S102 (such as Figure 9 As shown, the series conductors 24 within the dielectric adhesive layer 23 on the build-up glass substrate 21 and the filling holes 1221 of the connecting line segments 122 within the through-holes 113 are located in the same thickness direction H. Since each series conductor 24 is conductive paste, during the lamination step S104, each conductive paste extends to fill the corresponding portion of the filling hole 1221 of the glass wiring board 1. In this embodiment, during the lamination step S104, each conductive paste can extend to fill 30-80% of the filling hole 1221, but this is not limited to this.
[0065] It should be noted that, in the preparation step S102, the layout circuit 22 of the single-sided bonding wiring board 2 forms the channel 224 within the through-hole 211, and the through-hole 113 of the glass wiring board 1 and the through-hole 211 of the single-sided bonding wiring board 2 are preferably offset from each other. After the lamination step S104 and the curing step S106, the two dielectric adhesive layers 23 fill at least a portion of the channel 224, but the present invention is not limited thereto. For example, in other embodiments not shown, the channel 224 may not be filled with the dielectric adhesive layer 23.
[0066] Technical effects of the embodiments of the present invention
[0067] In summary, the single-sided stacking method disclosed in the embodiment of the present invention can stack the dielectric adhesive layers of the two single-sided bonded wiring boards and connect them to the opposite sides of the glass wiring board without gaps through the stacking step, so that the two layered glass substrates are parallel to the glass substrate and have better flatness. Furthermore, the single-sided stacking method can shorten the process and increase production efficiency and reduce costs through the stacking step, and can shorten the time the glass is on the production line and reduce the risk of breakage or cracks during transportation, and can replace glass wiring boards with poor pass rates at any time before the stacking step to improve fault tolerance. In addition, the single-sided stacking method improves the configuration flexibility of the entire architecture by adopting the single-sided bonded wiring board.
[0068] Furthermore, the single-sided lamination method disclosed in the embodiment of the present invention can, through the lamination step and the curing step, laminate the dielectric adhesive layers of the two single-sided bonded wiring boards at a time and connect them to the opposite sides of the glass wiring board without gaps and perform curing, thereby reducing the risk of breakage or cracking of the glass caused by multiple thermal pressing, and reducing the expansion and contraction alignment problems caused by multiple thermal processes and wet processes.
[0069] The contents disclosed above are only preferred feasible embodiments of the present invention and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the patent scope of the present invention.
Claims
1. A single-side plate stacking method, characterized in that: The single-side stacking method includes: A preparation step includes providing two single-sided bonding wiring boards and a glass wiring board; wherein the glass wiring board includes a glass substrate and a metal circuit disposed on the glass substrate; wherein each of the single-sided bonding wiring boards includes: a build-up glass substrate; a dielectric adhesive layer formed on one side of the build-up glass substrate; a layout circuit, disposed on the build-up glass substrate and at least a portion of the layout circuit is embedded in the dielectric layer; a series conductor embedded in the dielectric layer and having a connection end exposed outside the dielectric layer; and a laminating step of simultaneously pressing the dielectric adhesive layers of the two single-sided bonded wiring boards together along a thickness direction and connecting them to opposite sides of the glass wiring board without gaps, so that the series conductors of the two single-sided bonded wiring boards are connected to the metal circuits, and the two build-up glass substrates are parallel to the glass substrate; wherein the two single-sided bonded wiring boards are electrically coupled to each other via the two series conductors and the metal circuits; and A curing step: curing the two dielectric adhesive layers to allow the two single-sided bonding wiring boards to be bonded and fixed to the glass wiring board.
2. The single-side plate stacking method according to claim 1, characterized in that: In each of the single-sided bonding wiring boards in the preparation step, the dielectric adhesive layer is semi-cured and a blind hole is formed by laser burning, the layout circuit is partially exposed through the blind hole, and the series conductor is a conductive paste and the conductive paste is filled in the blind hole.
3. The single-side plate stacking method according to claim 2, characterized in that: In the preparation step, the connection end of each of the series conductors protrudes from the corresponding blind hole.
4. The single-side plate stacking method according to claim 1, characterized in that: In the preparation step, the glass substrate has a through hole through which the metal circuit extends, and each of the build-up glass substrates has a through hole through which the layout circuit extends; During the laminating step, the through hole of the glass substrate and the through holes of the two build-up glass substrates are staggered with each other.
5. The single-side plate stacking method according to claim 4, characterized in that: During the preparation step, the metal circuit of the glass wiring board is surrounded by a filling hole in the through hole, and each of the series conductors is a conductive paste; during the stacking step, the conductive paste of the two single-sided bonding wiring boards extends from opposite sides of the filling hole to fill the interior of the filling hole.
6. The single-side plate stacking method according to claim 4, characterized in that: In each of the single-sided bonding wiring boards in the preparation step, the layout circuit forms a channel surrounded by the through hole, and the dielectric glue layer fills at least a portion of the channel.
7. The single-side plate stacking method according to claim 4, characterized in that: In the preparation step, the metal circuit of the glass wiring board is surrounded by a filling hole in the through hole, and the glass wiring board includes a conductive material filled in the filling hole and having a material different from that of the metal circuit.
8. The single-side plate stacking method according to claim 4, characterized in that: In each of the single-sided bonding wiring boards in the preparation step, the layout circuit forms a channel surrounded by the through hole, and the single-sided bonding wiring board includes a conductive material filled in the channel and having a material different from that of the layout circuit.
9. The single-side plate stacking method according to claim 1, characterized in that: The laminating step is performed only once. In the laminating step, the total number of layers of the laminated glass substrate and the build-up glass substrate is between 3 and 20 layers, so that a multi-layer glass laminate is formed after the curing step is performed.
10. A single-side plate stacking method, characterized in that: The single-side stacking method includes: A preparation step includes providing a single-sided bonding wiring board and a glass wiring board; wherein the glass wiring board includes a glass substrate and a metal circuit disposed on the glass substrate; wherein the single-sided bonding wiring board includes: a build-up glass substrate; a dielectric adhesive layer formed on one side of the build-up glass substrate; a layout circuit, disposed on the build-up glass substrate and at least a portion of the layout circuit is embedded in the dielectric layer; a series conductor embedded in the dielectric layer and having a connection end exposed outside the dielectric layer; and a laminating step of laminating the dielectric adhesive layer of the single-sided bonded wiring board to one side of the glass wiring board in a thickness direction and without gap, so that the series conductor of the single-sided bonded wiring board is connected to the metal line and the build-up glass substrate is parallel to the glass substrate; and A curing step: curing the dielectric adhesive layer to allow the single-sided bonding wiring board to be bonded and fixed to the glass wiring board.