Whole cabinet server

Abstract

The embodiment of the invention provides a whole cabinet server. The whole cabinet server comprises a cabinet body, a plurality of nodes and a power supply assembly. The nodes are located in the cabinet body and arranged in the height direction of the cabinet body. The power supply assembly is located in the cabinet body. The power supply assembly comprises a first power supply part and a second power supply part which are opposite in polarity, the first power supply part and the second power supply part extend in the height direction of the cabinet body, each of the first power supply part and the second power supply part comprises a diversion part and a leading-out part, each diversion part comprises a diversion part body, and a plurality of ribs are arranged on the outer surface of each diversion part body; and the leading-out part is connected with the flow guide part body and the plurality of nodes. According to the whole cabinet server provided by the embodiment of the invention, the heat dissipation efficiency of the power supply assembly is relatively high, so that heat in the power supply assembly can be dissipated in time.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of server technology, and in particular to a whole-cabinet server. Background Art

[0002] Whole-cabinet servers are widely used in cloud computing, big data, artificial intelligence and other fields due to their advantages such as high space utilization and high power efficiency.

[0003] A server cabinet consists of a cabinet, power busbars, and multiple nodes. The nodes are arranged along the cabinet's height. The power busbars extend along the cabinet's height and connect to the nodes, providing power to them. Because a single node requires a high current, the power busbars require a high current carrying capacity to power multiple nodes. A high current carrying capacity also results in greater heat dissipation.

[0004] In the related art, it is difficult to dissipate the heat of the power supply copper busbar in a timely manner. Summary of the Invention

[0005] An embodiment of the present application provides a whole-cabinet server, in which the heat dissipation efficiency of the power supply components is high, so that the heat in the power supply components can be dissipated in a timely manner.

[0006] In the first aspect, an embodiment of the present application provides a whole cabinet server, comprising: a cabinet body, multiple nodes and a power supply assembly, wherein the multiple nodes are located in the cabinet body and arranged along the height direction of the cabinet body; the power supply assembly is located in the cabinet body; the power supply assembly comprises a first power supply member and a second power supply member with opposite polarities, the first power supply member and the second power supply member extend along the height direction of the cabinet body, the first power supply member and the second power supply member both comprise a guide portion and a lead-out portion, the guide portion comprises a guide portion body, and the outer surface of the guide portion body is provided with multiple ribs; the lead-out portion is connected to the guide portion body, and the lead-out portion is connected to the multiple nodes.

[0007] The whole cabinet server provided by the embodiment of the present application is provided with a power supply, which includes a first power supply and a second power supply with opposite polarities. The first power supply and the second power supply both include a guide part and an outlet part. The guide part includes a guide part body. The outer surface of the guide part body is provided with a plurality of ribs, which can increase the area of contact between the guide part and the air, thereby improving the heat dissipation efficiency of the power supply. The temperature in the power supply is low, so that the resistance in the power supply is also small, so that the guide part body can meet the demand for a larger flow rate through a smaller cross-sectional area. The rib part can be used to transmit part of the current while dissipating heat, so that the cross-sectional area of the guide part body can be set smaller, thereby being more conducive to the heat dissipation of the guide part body, thereby forming a virtuous circle, so that the heat dissipation efficiency of the power supply component is high and the cross-sectional area of the power supply component is small. Part of the heat of the guide part can also be dissipated through the outlet part, further improving the heat dissipation efficiency of the power supply component.

[0008] In one possible implementation, in the rack-mount server provided in the embodiments of the present application, multiple ribs are arranged side by side on the air guide body, with adjacent ribs forming a first heat dissipation channel. In addition to heat generated by the air guide being conducted to the air via the three contact surfaces of the ribs, the hot air generated by the heat has a faster flow rate in the first heat dissipation channel, thereby improving the heat dissipation efficiency of the air guide.

[0009] In one possible implementation, the rack-mount server provided in the embodiments of the present application includes multiple rib segments spaced apart along at least a portion of the rib's length along its extension direction. The rib segments increase the contact area between the rib and the air, thereby further increasing the contact area between the air guide and the air, thereby further improving the heat dissipation efficiency of the air guide.

[0010] In one possible embodiment, the whole cabinet server provided by the embodiment of the present application has a spacer between adjacent rib segments of the same rib, and the spacers on adjacent ribs are aligned one by one. Thus, the spacers on multiple ribs can be aligned and form a second heat dissipation channel, and the hot air generated by the heat flows faster in the second heat dissipation channel, which can improve the heat dissipation efficiency of the guide part. In addition, the second heat dissipation channel is also connected to the first heat dissipation channel, and the hot air in the higher temperature area can flow more quickly between the second heat dissipation channel and the first heat dissipation channel to the lower temperature area, making the temperature on the guide part more uniform, avoiding excessive local temperature and excessive local resistance on the guide part.

[0011] In one possible implementation, the angle between the ribs and the surface of the air guide body of the whole cabinet server provided by the embodiment of the present application is greater than or equal to 30 degrees. This can solve the problem of the ribs reducing the heat dissipation rate of the air guide and the problem of difficult rib processing.

[0012] In a possible embodiment, in the whole cabinet server provided in the embodiment of the present application, the dimension H of the rib protruding from the guide body and the dimension D of the guide body satisfy the following relationship: 1 / 10D≤H≤1 / 5D. Thus, the heat dissipation of the power supply component can be increased while the current flow rate of the power supply component is less affected.

[0013] In one possible implementation, the whole-cabinet server provided in the embodiment of the present application further comprises an insulating member disposed between the first and second power supplies. The insulating member is provided with a receiving groove on one side facing the first and second power supplies, with the first and second power supplies partially located within the receiving groove. The groove depth of the receiving groove is the same as the thickness of the lead-out portion, so that the side of the lead-out portion facing away from the receiving groove is flush with the surface of the insulating member. This further reduces the overall volume of the power supply assembly and facilitates the connection between the power supply assembly and the adapter.

[0014] In one possible implementation, in the rack-mount server provided in the embodiments of the present application, ribs are provided on the surfaces of the air guide portion of the first power supply member and the air guide portion of the second power supply member facing away from the insulating member. This improves the heat dissipation rate of the power supply assembly, facilitates assembly of the first power supply member, the insulating member, and the second power supply member, and makes the power supply assembly structure more compact.

[0015] In one possible embodiment, the whole cabinet server provided in the embodiment of the present application further includes a connecting assembly, wherein a first through hole is provided on the first power supply member, a second through hole is provided on the second power supply member, and a third through hole is provided on the insulating member. The connecting assembly is inserted through the first through hole, the second through hole, and the third through hole to connect the first power supply member, the insulating member, and the second power supply member. Due to the provision of ribs, the cross-sectional area of the guide body can be set smaller, so that the size of the guide portion along the first direction is also smaller. Therefore, by inserting the connecting assembly through the first through hole, the second through hole, and the third through hole, the first power supply member, the insulating member, and the second power supply member can be reliably connected, avoiding the provision of other more complex connection devices in the power supply assembly, making the structure of the power supply assembly relatively simple.

[0016] In one possible implementation, the whole cabinet server provided in the embodiment of the present application further includes a protective cover, which is arranged on the outside of the first power supply and the second power supply. The protective cover can protect the first power supply and the second power supply to prevent the operator from accidentally touching the first power supply and the second power supply. A plurality of air holes are provided on the protective cover, and the plurality of air holes are arranged at positions corresponding to the protective cover and the air guide portion. The heat emitted by the air guide portion of the first power supply and the air guide portion of the second power supply can be transmitted to the air in a timely manner through the air holes, so as to prevent the protective cover from affecting the heat dissipation of the first power supply and the second power supply.

[0017] In one possible embodiment, the entire cabinet server provided in the embodiment of the present application has a first coating provided on the outer surface of the lead-out part to protect the lead-out part; a second coating provided on the outer surface of the guide part to protect the guide part; the conductivity of the first coating is greater than the conductivity of the second coating, which can improve the conductivity of the lead-out part adapter connection while protecting the lead-out part. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the structure of a data center provided in an embodiment of the present application;

[0019] Figure 2 A schematic diagram of the structure of a whole cabinet server provided in an embodiment of the present application;

[0020] Figure 3 for Figure 2 Side view of

[0021] Figure 4 A schematic diagram of the structure of the power supply component in the whole cabinet server provided in an embodiment of the present application;

[0022] Figure 5 for Figure 4 Enlarged view of point A in the middle;

[0023] Figure 6 for Figure 5 Another angle of view;

[0024] Figure 7 A schematic structural diagram of a power supply component in a power supply assembly provided in an embodiment of the present application;

[0025] Figure 8 for Figure 7 Enlarged view of point B in the middle;

[0026] Figure 9 for Figure 7 Another angle of view;

[0027] Figure 10 for Figure 9 Enlarged view of point C in the middle;

[0028] Figure 11 for Figure 5 A view from another angle;

[0029] Figure 12 Another structural diagram of the power supply component in the whole cabinet server provided in an embodiment of the present application;

[0030] Figure 13 for Figure 12 Enlarged view of point D in the middle;

[0031] Figure 14 for Figure 12 Explosion diagram of

[0032] Figure 15 for Figure 14 A structural diagram from another angle;

[0033] Figure 16 A schematic diagram of the connection between the power supply component and the adapter in the whole cabinet server is provided for the embodiment of the present application;

[0034] Figure 17 Another structural diagram of the power supply component in the whole cabinet server provided in an embodiment of the present application;

[0035] Figure 18 for Figure 17 Explosion diagram.

[0036] Description of reference numerals:

[0037] 10. Whole cabinet server;

[0038] 100. Power supply components;

[0039] 110, power supply element; 110a, first power supply element; 110b, second power supply element;

[0040] 111, air guide; 1111, air guide body; 1112, rib; 1112a, first contact surface; 1112b, second contact surface; 1112c, third contact surface; 1112d, fourth contact surface; 1112e, fifth contact surface; 1113, first heat dissipation channel; 1114, rib segment; 1115, spacer; 1116, second heat dissipation channel;

[0041] 112. Lead-out section;

[0042] 113. First through hole;

[0043] 114, second through hole;

[0044] 120, insulating member; 120a, first surface; 120b, second surface;

[0045] 121, third through hole; 122, receiving groove; 122a, first receiving groove; 122b, second receiving groove;

[0046] 130. Connecting assembly; 131. Stud; 132. Nut; 133. Insulating sleeve;

[0047] 140, protective cover; 141, vent hole; 142, mounting portion; 143, fourth through hole;

[0048] 200, nodes;

[0049] 300, cabinet;

[0050] 400, power supply frame;

[0051] 410, housing;

[0052] 420, power module;

[0053] 500, adapter; 510, first pole; 520, second pole;

[0054] 20. Computer room;

[0055] 1000, data center;

[0056] D, body size; D1, first thickness; D2, second thickness; H, rib height; H1, first groove depth; H2, second groove depth;

[0057] W, rib thickness;

[0058] L, rib segment length;

[0059] X, first direction;

[0060] Y, second direction;

[0061] Z. Third direction. DETAILED DESCRIPTION

[0062] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0063] Whole-cabinet servers are widely used in cloud computing, big data, and artificial intelligence due to their advantages such as high space utilization and high power efficiency. A whole-cabinet server includes a cabinet, a power busbar, and multiple nodes. The multiple nodes are arranged in the cabinet along the height direction of the cabinet. The power busbar extends along the height direction of the cabinet and is connected to the multiple nodes to supply power to the multiple nodes. The current required by a single node is large, so the power busbar needs a large current carrying capacity to meet the demand of powering multiple nodes. When the current carrying capacity of the power busbar is large, the heat dissipation of the power busbar is large. In the related art, the heat of the power busbar is difficult to dissipate in time, resulting in a high temperature of the power busbar. Therefore, the cross-sectional area of the power busbar needs to be set larger to meet the power supply needs of the nodes. The increase in cross-sectional area makes it more difficult for the heat of the power busbar to dissipate, thus forming a vicious cycle. In addition, the large cross-sectional area of the power busbar means that the power busbar occupies a large volume in the cabinet, which is not conducive to the miniaturization of the whole-cabinet server.

[0064] Based on this, an embodiment of the present application provides a whole-cabinet server, in which the heat dissipation efficiency of the power supply components is high, so that the heat in the power supply components can be dissipated in a timely manner.

[0065] Figure 1 A schematic diagram of the structure of a data center provided in an embodiment of the present application.

[0066] See also Figure 1 As shown, data center 1000 is used to transmit, accelerate, display, calculate, and store data information. The data center 1000 provided in the embodiment of the present application may include servers, which may be located in computer room 20. There are various types of servers, such as whole-rack servers and high-density servers. Whole-rack servers are widely used in fields such as cloud computing, big data, and artificial intelligence due to their advantages such as high space utilization and high power efficiency. The following description uses whole-rack server 10 as an example.

[0067] The whole cabinet server 10 is arranged in an array in the computer room to effectively utilize the space in the computer room 20. Figure 1In the illustrated embodiment, the rack servers 10 are arranged in rows and columns in the computer room 20 .

[0068] Figure 2 A schematic diagram of the structure of a whole cabinet server provided in an embodiment of the present application; Figure 3 for Figure 2 side view.

[0069] See also Figure 2 and Figure 3 As shown, the whole cabinet server 10 includes a power supply component 100, multiple nodes 200 and a cabinet 300. The multiple nodes 200 and the power supply component 100 are all arranged in the cabinet 300. The multiple nodes 200 are arranged along the height direction of the cabinet 300. The power supply component 100 extends along the height direction of the cabinet 300 and is connected to the multiple nodes 200 to provide power to the multiple nodes 200.

[0070] The cabinet 300 may be a rectangular parallelepiped structure. Figure 2 The first direction X, the second direction Y, and the third direction Z are shown. The first direction X represents the length of the cabinet 300, the second direction Y represents the width of the cabinet 300, and the third direction Z represents the height of the cabinet 300. The cabinet 300 is used to support and accommodate nodes 200. The whole-rack server 10 includes multiple nodes 200, which are arranged in the cabinet 300 along the third direction Z. The nodes 200 can be computing nodes, such as servers, or switching nodes, such as switches.

[0071] The full-rack server 10 also includes a power supply box 400, which may include a housing 410 and a power module 420. Since the number of nodes 200 in the full-rack server 10 is relatively large, multiple power modules 420 may be provided to meet the power supply requirements for multiple nodes 200. Multiple power modules 420 may be arranged in rows and columns within the housing 410.

[0072] The input end of the power module 420 is connected to the power supply in the computer room 20, and the output end of the power module 420 is connected to the computing node 200. The power module 420 converts the power provided by the power supply in the computer room 20 into power suitable for the node 200. The current output by multiple power modules 420 is aggregated in the power supply component 100 for transmission. The power supply component 100 is connected to different nodes 200 at different positions along the third direction Z to supply power to the node 200.

[0073] The power supply box 400 can be located at the top, bottom or middle of the cabinet 300. Figure 2 and Figure 3In the illustrated embodiment, the power supply frame 400 is disposed at the top of the cabinet 300. The power supply assembly 100 extends from the top to the bottom along the third direction Z to facilitate connection with the nodes 200 arranged along the third direction Z. The whole-rack server 10 may further include an adapter 500, which may be a cable or a copper busbar, through which the power supply assembly 100 can be connected to the nodes 200.

[0074] Figure 4 A schematic diagram of the structure of the power supply component in the whole cabinet server provided in an embodiment of the present application; Figure 5 for Figure 4 Enlarged view of point A in the middle; Figure 6 for Figure 5 Another angle view.

[0075] See also Figures 4 to 6 As shown, the power supply assembly 100 provided in the embodiment of the present application includes a power supply 110, and the power supply 110 includes a first power supply 110a and a second power supply 110b with opposite polarities. The first power supply 110a and the second power supply 110b both include a guide portion 111 and a lead-out portion 112. The guide portion 111 includes a guide portion body 1111, and a plurality of ribs 1112 are provided on the outer surface of the guide portion body 1111; the lead-out portion 112 is connected to the guide portion body 111, and the lead-out portion 112 is used to connect to the node 200.

[0076] The power supply 110 can be made of a material with high conductivity, such as copper or aluminum. A first power supply 110a and a second power supply 110b, one of the first power supply 110a and the second power supply 110b can be used as a positive electrode, and the other can be used as a negative electrode. The first power supply 110a and the second power supply 110b can be fixed on the cabinet 300, and the first power supply 110a and the second power supply 110b can also be connected to the adapter structure to be connected to the cabinet 300 through the adapter structure. The first power supply 110a and the second power supply 110b can be spaced apart so that the first power supply 110a and the second power supply 110b are insulated from each other.

[0077] It should be noted that the cross-sectional areas of the first power supply 110a and the second power supply 110b can be substantially the same, and their cross-sectional shapes can be the same or different. Figure 4 In the embodiment, the cross-sectional areas of the first power supply member 110a and the second power supply member 110b are the same. Figure 5 and Figure 6 In the description, one power supply unit 110 is used as an example.

[0078] Please continue to see Figure 5 and Figure 6As shown, the power supply 110 includes a current guide portion 111 and an outlet portion 112 arranged along the second direction Y. The current generated by the power module 420 is collected in the current guide portion 111 and flows along the current guide portion 111. When it reaches the position corresponding to the node 200, it is connected to the node 200 through the outlet portion 112. For example, the outlet portion 112 can be connected to the node 200 through the adapter 500. The absence of ribs on the outlet portion 112 can increase the contact area between the outlet portion 112 and the adapter 500, so that the flow rate at the connection between the outlet portion 112 and the adapter 500 can meet the requirements.

[0079] The specific structure of the guide portion 111 is described below. The structure of the guide portion 111 that is primarily used to conduct current is the guide portion body 1111. A plurality of ribs 1112 extend from the surface of the guide portion body 1111. These ribs 1112 can increase the area of contact between the guide portion 111 and the air, thereby improving the efficiency of heat transfer from the guide portion 111 to the air when the heat in the guide portion 111 is high. For example, the cross-section of the rib 1112 can be conical or rectangular. The rib 1112 can be extruded integrally with the guide portion body 1111, or grooves can be machined on the surface of the guide portion 111 to form the rib 1112.

[0080] The surface of the rib 1112 can be a smooth surface or a relatively rough surface with multiple small protrusions. The smooth surface is easy to process, and the rough surface can further increase the contact area between the rib 1112 and the air. Figure 5 and Figure 6 In the illustrated embodiment, the cross-section of the rib 1112 is rectangular, and the surface of the rib 1112 is smooth. The rib 1112 has three contact surfaces with the air: a first contact surface 1112a, a second contact surface 1112b, and a third contact surface 1112c. This increases the area of contact between the air guide 111 and the air, compared to the single contact surface in the related art where no ribs are provided. For example, the distance between the rib 1112 and the surface of the air guide body 1111 is the rib height H, which can range from 2.5 mm to 3.5 mm. The distance between the first contact surface 1112a and the third contact surface 1112c of the rib 1112 is the rib thickness W, which can range from 1.5 mm to 2.5 mm. The product of the rib height H and the dimension of the rib 1112 along the third direction Z is the surface area of the first contact surface 1112a or the third contact surface 1112c, and the product of the rib thickness W and the dimension of the rib 1112 along the third direction Z is the surface area of the second contact surface 1112b.

[0081] The heat generated by the air guide 111 can be promptly transferred to the air through the three contact surfaces of the ribs 1112, thereby improving the heat dissipation efficiency of the power supply 110. With the improved heat dissipation efficiency of the power supply 110, the temperature in the power supply 110 is reduced, resulting in a lower resistance in the power supply 110. As a result, a smaller cross-sectional area of the power supply 110 can meet the demand for a larger flow rate.

[0082] It should be noted that the ribs 1112 are connected to the guide body 1111. Therefore, the ribs 1112 are not only used to improve the heat dissipation rate, but the ribs 1112 can also transmit part of the current, so that the cross-sectional area of the guide body 1111 can be set smaller, which is more conducive to the heat dissipation of the guide body 1111. Thus, a virtuous circle is formed, so that the heat dissipation efficiency of the power supply component 100 is higher and the cross-sectional area of the power supply component 100 is smaller.

[0083] The lead portion 112 is connected to the node 200 through the adapter 500. Specifically, the first power supply 110a can be used as a positive electrode, and the second power supply 110b can be used as a negative electrode. The adapter 500 also includes a first pole 510 and a second pole 520 (in Figure 16 ), the first electrode 510 can be, for example, a positive electrode, and the second electrode 520 can be, for example, a negative electrode. The lead portion 112 of the first power supply member 110a is connected to the first electrode 510 of the adapter 500, and the lead portion 112 of the second power supply member 110b is connected to the second electrode 520 of the adapter 500. Thus, the power supply assembly 100 and each node 200 form a power supply loop.

[0084] Lead portion 112 is closer to node 200, so the current in lead portion 112 is smaller than the current in guide portion 111, and the heat dissipated by lead portion 112 is smaller than that of guide portion 111. In addition, the absence of ribs on lead portion 112 can increase the contact area between lead portion 112 and the first or second pole of adapter 500, thereby reducing the heat dissipation at the connection between lead portion 112 and adapter 500. As a result, the temperature of guide portion 111 is lower than that of lead portion 112, and some of the heat from guide portion 111 can be dissipated through lead portion 112, further improving the heat dissipation efficiency of power supply assembly 100.

[0085] In a possible implementation, a plurality of ribs 1112 are arranged side by side on the air guide body 1111 , and first heat dissipation channels 1113 are formed between adjacent ribs 1112 .

[0086] The ribs 1112 can be arranged side by side on the guide body 1111 along the first direction X, the second direction Y, or the third direction Z. The ribs 1112 can also be arranged side by side along a direction that has an angle with the first direction X, the second direction Y, and the third direction Z. Figures 4 to 6In the illustrated embodiment, a plurality of ribs 1112 are arranged side by side along the first direction X or the second direction Y on the guide body 1111 .

[0087] The ribs 1112 are arranged side by side, so that a first heat dissipation channel 1113 can be formed between adjacent ribs 1112. In addition to being conducted into the air through the three contact surfaces of the ribs 1112, the heat generated by the guide part 111 also has a faster flow rate in the first heat dissipation channel 1113, which can improve the heat dissipation efficiency of the guide part 111.

[0088] In addition, in some possible implementations, a fan may be provided in the entire cabinet server 10, and the air path of the fan may be consistent with the extension direction of the first heat dissipation channel 1113. The fan may further accelerate the flow rate of the air in the first heat dissipation channel 1113, thereby further improving the heat dissipation rate of the guide portion 111.

[0089] Figure 7 A schematic structural diagram of a power supply component in a power supply assembly provided in an embodiment of the present application; Figure 8 for Figure 7 Enlarged view of point B in the middle; Figure 9 for Figure 7 Another angle of view; Figure 10 for Figure 9 Enlarged view of point C in the middle.

[0090] See also Figures 7 to 10 As shown, in a possible embodiment, along the extension direction of the rib 1112 , at least a portion of the length of the rib 1112 includes a plurality of rib segments 1114 arranged at intervals.

[0091] exist Figures 7 to 10 In the embodiment, rib 1112 extends along a third direction Z. Rib 1112 has multiple spaced-apart rib segments 1114 at one end along the third direction Z. Rib segments 1114 increase the contact area between rib 1112 and the air. For example, in addition to the three contact surfaces of rib 1112, rib segment 1114 also includes a fourth contact surface 1112d and a fifth contact surface 1112e. This further increases the contact area between air guide 111 and the air, thereby further improving the heat dissipation rate of air guide 111. The distance between fourth contact surface 1112d and fifth contact surface 1112e is the rib segment length L, which can range from 1.5 mm to 2.5 mm.

[0092] It should be noted that the rib segment 1114 may be provided on a partial length of the rib 1112 or on the entire length of the rib 1112 , and the specific arrangement may be based on the actual heat dissipation requirements of the air guide portion 111 .

[0093] In addition, the rib segments 1114 may be provided on all the ribs 1112 or on part of the ribs 1112 .

[0094] In addition, rib segments 1114 may be provided on the ribs 1112 of the first power supply member 110a and the second power supply member 110b, or on the ribs 1112 of one of the first power supply member 110a and the second power supply member 110b.

[0095] Please continue to see Figure 8 and Figure 10 As shown, there is a spacer 1115 between adjacent rib segments 1114 of the same rib 1112, and the spacers 1115 on adjacent ribs 1112 are aligned one by one.

[0096] In addition to being conducted into the air through the five contact surfaces of the rib segments 1114 , the heat generated by the air guide 111 also flows faster in the spacer 1115 , thereby improving the heat dissipation efficiency of the air guide 111 .

[0097] exist Figure 8 and Figure 10 In the illustrated embodiment, the spacers 1115 on adjacent ribs 1112 are aligned one-to-one. As a result, the spacers 1115 on the multiple ribs 1112 can align and form a second heat dissipation channel 1116. The hot air generated by the heat flows faster in the second heat dissipation channel 1116, thereby improving the heat dissipation efficiency of the air guide 111. Furthermore, the second heat dissipation channel 1116 is also connected to the first heat dissipation channel 1113. Hot air from higher temperature areas can flow quickly between the second heat dissipation channel 1116 and the first heat dissipation channel 1113 to lower temperature areas, making the temperature on the air guide 111 more uniform and preventing localized excessive temperatures from causing excessive resistance on the air guide 111.

[0098] Figure 11 for Figure 5 Another angle of view.

[0099] See also Figure 11 As shown, the angle α between the rib 1112 and the surface of the guide body 1111 is greater than or equal to 30°.

[0100] The angle α between the rib 1112 and the surface of the guide body 1111 refers to the protruding direction of the rib 1112 when the rib 1112 protrudes from the surface of the guide body 1111. If the angle α is too small, the distance between the contact surface of the rib 1112 facing the guide body 1111 and the guide body 1111 is too small, and the heat of the contact surface will be transferred to the surface of the guide body 1111, thereby reducing the heat dissipation rate of the guide 111. In addition, if the angle α is too small, the processing of the rib 1112 is also more difficult. Therefore, in the embodiment of the present application, the angle is made greater than or equal to 30°, so as to solve the problem that the rib 1112 reduces the heat dissipation rate of the guide 111 and the problem that the rib 1112 is difficult to process.

[0101] It should be noted that the maximum value of the angle α between the rib 1112 and the surface of the guide body 1111 is 90°. For example, the angle α can be 30°, 40°, 50°, 60°, 70°, 80°, or 90°.

[0102] Please continue to see Figure 6 As shown, in a possible embodiment, the dimension H of the rib 1112 protruding from the guide body 1111 and the dimension D of the guide body 1111 satisfy the following relationship: 1 / 10D≤H≤1 / 5D.

[0103] The size of the guide body 1111 is shown as the body size D, which can be the size of the guide body 1111 along the first direction X or the size of the guide body 1111 along the second direction Y. Figure 6 In the illustrated embodiment, the dimension of the air guide body 1111 along the first direction X is smaller than the dimension of the air guide body 1111 along the second direction Y. The body dimension D is shown as the dimension of the air guide body 1111 along the first direction X.

[0104] When the rib height H is small, the surface areas of the first contact surface 1112a and the third contact surface 1112c are small, resulting in a smaller amount of heat dissipation due to the addition of the power supply element 110 due to the provision of the rib 1112. When the rib height H is large, given the overall dimensions of the power supply assembly 100, the main body dimension D is small. This smaller main body dimension results in a smaller amount of current flowing through the main body of the guide portion.

[0105] Therefore, in an embodiment of the present application, the rib height H can be set to be greater than or equal to 1 / 10 of the main body size D and less than or equal to 1 / 5 of the main body size D, thereby increasing the heat dissipation of the power supply component 110 while having little impact on the current flow of the power supply component 110.

[0106] Figure 12 Another structural diagram of the power supply component in the whole cabinet server provided in an embodiment of the present application; Figure 13for Figure 12 Enlarged view of point D in the middle; Figure 14 for Figure 12 Explosion diagram of Figure 15 for Figure 14 A structural diagram from another angle.

[0107] See also Figures 12 to 15 As shown, the power supply assembly 100 also includes an insulating member 120, which is arranged between the first power supply member 110a and the second power supply member 110b. The insulating member 120 is provided with a receiving groove 122 on the side facing the first power supply member 110a and the second power supply member 110b. The first power supply member 110a and the second power supply member 110b are partially located in the receiving groove 122. The groove depth of the receiving groove 122 is the same as the thickness of the lead-out portion 112, so that the side of the lead-out portion 112 facing away from the receiving groove 122 is flush with the surface of the insulating member 120.

[0108] When assembling the power supply assembly 100, the insulating member 120 can be installed between the first power supply member 110a and the second power supply member 110b. The insulating member 120 can prevent a short circuit between the first power supply member 110a and the second power supply member 110b. As a result, the distance between the first power supply member 110a and the second power supply member 110b can be set to be smaller, thereby reducing the overall volume of the power supply assembly 100.

[0109] The surface of the insulating member 120 facing the first power supply member 110a is the first surface 120a, and the receiving groove 122 recessed from the first surface 120a is the first receiving groove 122a. The first power supply member 110a is partially located in the first receiving groove 122a, wherein the groove depth of the first receiving groove 122a is a first groove depth H1. The dimension of the lead portion 112 of the first power supply member 110a along the first direction X is a first thickness D1, and the first groove depth H1 is equal to the first thickness D1. Therefore, when the first power supply member 110a is located in the first receiving groove 122a, the bottom wall of the first receiving groove 122a is in contact with the first power supply member 110a. At this time, the side of the lead portion 112 of the first power supply member 110a facing away from the first receiving groove 122a is flush with the first surface 120a.

[0110] The surface of the insulating member 120 facing the second power supply member 110b is the second surface 120b, and the receiving groove 122 recessed from the second surface 120b is the second receiving groove 122b. The second power supply member 110b is partially located in the second receiving groove 122b, wherein the groove depth of the second receiving groove 122b is a second groove depth H2. The dimension of the lead portion 112 of the second power supply member 110b along the first direction X is a second thickness D2, and the second groove depth H2 is equal to the second thickness D2. Therefore, when the second power supply member 110b is located in the second receiving groove 122b, the bottom wall of the second receiving groove 122b is in contact with the second power supply member 110b. At this time, the side of the lead portion 112 of the second power supply member 110b facing away from the second receiving groove 122b is flush with the second surface 120b.

[0111] Such a configuration can further reduce the overall volume of the power supply assembly 100 .

[0112] Figure 16 A schematic diagram of the connection between the power supply component and the adapter in the whole cabinet server is provided for the embodiment of the present application.

[0113] See also Figure 16 As shown, the power supply assembly 100 is plugged into the adapter 500. The power supply assembly 100 can be inserted between the first pole 510 and the second pole 520 of the adapter 500. The first pole 510 contacts the first power supply member 110a, and the second pole 520 contacts the second power supply member 110b. The side of the lead-out portion 112 of the first power supply member 110a facing away from the first receiving groove 122a is flush with the first surface 120a, and the side of the lead-out portion 112 of the second power supply member 110b facing away from the second receiving groove 122b is flush with the second surface 120b. This makes the side of the power supply assembly 100 facing the first pole 510 and the side of the power supply assembly 100 facing the second pole 520 both flat. This facilitates the plugging of the power supply assembly 100 into the adapter 500. In addition, the end of the insulating member 120 that plugs into the adapter 500 can be pointed, which is more conducive to the plugging of the power supply assembly 100 into the adapter 500.

[0114] Please continue to see Figures 12 to 14 As shown, ribs 1112 are provided on the surfaces of the guide portion 111 of the first power supply member 110 a and the guide portion 111 of the second power supply member 110 b facing away from the insulating member 120 .

[0115] When ribs 1112 are provided on the surface of the guide portion 111 of the first power supply component 110a facing the insulating component 120, the ribs 1112 face the insulating component 120, and the hot air is blocked by the insulating component 120, resulting in a lower heat dissipation rate. In addition, the ribs 1112 increase the difficulty of assembling the first power supply component 110a and the insulating component 120.

[0116] When ribs 1112 are provided on the surface of the guide portion 111 of the second power supply component 110b facing the insulating component 120, the ribs 1112 face the insulating component 120, and the hot air is blocked by the insulating component 120, resulting in a lower heat dissipation rate. In addition, the ribs 1112 increase the difficulty of assembling the second power supply component 110b and the insulating component 120.

[0117] Therefore, in the embodiment of the present application, ribs 1112 can be provided on the surface of the guide portion 111 of the first power supply member 110a and the guide portion 111 of the second power supply member 110b facing away from the insulating member 120. This can improve the heat dissipation rate of the power supply assembly 100 while facilitating the assembly of the first power supply member 110a, the insulating member 120, and the second power supply member 110b, and can make the structure of the power supply assembly 100 more compact. The compact structure of the power supply assembly 100 can reduce the volume occupied by the power supply assembly 100 in the cabinet 300, so that the cabinet 300 can have more space to accommodate other components (such as liquid cooling pipes and communication cables).

[0118] Please continue to see Figure 13 and Figure 14 As shown, the power supply component 100 also includes a connecting component 130, a first through hole 113 is provided on the first power supply component 110a, a second through hole 114 is provided on the second power supply component 110b, and a third through hole 121 is provided on the insulating component 120. The connecting component 130 is passed through the first through hole 113, the second through hole 114 and the third through hole 121 to connect the first power supply component 110a, the insulating component 120 and the second power supply component 110b.

[0119] A first through hole 113 may be provided on the first power supply member 110a, a plurality of second through holes 114 may be provided on the second power supply member 110b, and a plurality of third through holes 121 may be provided on the insulating member 120. The insulating member 120 is clamped between the first power supply member 110a and the second power supply member 110b so that the first through hole 113, the third through hole 121 and the second through hole 114 are aligned one by one. The connecting component 130 is inserted into the first through hole 113, the third through hole 121 and the second through hole 114 to connect the first power supply member 110a, the insulating member 120 and the second power supply member 110b.

[0120] Due to the provision of the ribs 1112, the cross-sectional area of the guide body 111 can be set smaller, so that the size of the guide 111 along the first direction X is also smaller. Therefore, by passing the connecting component 130 through the first through hole 113, the second through hole 114 and the third through hole 121, the first power supply component 110a, the insulating component 120 and the second power supply component 110b can be reliably connected, avoiding the provision of other more complex connecting devices in the power supply component 100, so that the structure of the power supply component 100 is relatively simple.

[0121] It should be noted that the connection assembly 130 may include a stud 131 and a nut 132. The stud 131 is inserted from one end into the first through-hole 113, the third through-hole 121, and the second through-hole 114, and the nut 132 is threadedly connected to the stud 131 from the other end. An insulating sleeve 133 is also provided on the stud 131 at the position corresponding to the first through-hole 113 and the second through-hole 114, thereby preventing the connection assembly 130 from causing a short circuit between the first power supply 110 and the second power supply 110b.

[0122] Figure 17 Another structural diagram of the power supply component in the whole cabinet server provided in an embodiment of the present application; Figure 18 for Figure 17 Explosion diagram.

[0123] See also Figure 17 and Figure 18 As shown, the power supply assembly 100 also includes a protective cover 140, which is arranged on the outside of the first power supply component 110a and the second power supply component 110b. The protective cover 140 is provided with a plurality of air holes 141, and the plurality of air holes 141 are arranged at positions corresponding to the protective cover 140 and the guide part 111.

[0124] The protective cover 140 can protect the first power supply component 110 a and the second power supply component 110 b to prevent an operator from accidentally touching the first power supply component 110 a and the second power supply component 110 b .

[0125] In the embodiment of the present application, the protective cover 140 has a plurality of ventilation holes 141. The protective cover 140 can be arranged at a position corresponding to the guide portion 111 of the first power supply 110a, and the protective cover 140 can be arranged at a position corresponding to the guide portion 111 of the second power supply 110b. The heat emitted by the guide portion 111 of the first power supply 110a and the guide portion 111 of the second power supply 110b can be promptly transferred to the air through the ventilation holes 141, thereby preventing the protective cover 140 from affecting the heat dissipation of the first power supply 110a and the second power supply 110b. The aperture and arrangement density of the ventilation holes 141 can be set according to the specific heat dissipation. Please refer to Figure 17 and Figure 18 As shown, the protective cover 140 further includes a mounting portion 142 , and the protective cover 140 can be connected to the cabinet 300 through the mounting portion 142 .

[0126] In addition, a fourth through hole 143 is provided on the protective cover 140, and the first through hole 113, the third through hole 121, the second through hole 114 and the fourth through hole 143 are aligned one by one, and the connecting component 130 is inserted into the first through hole 113, the third through hole 121, the second through hole 114 and the fourth through hole 143 to connect the protective cover 140 with the first power supply member 110a, the insulating member 120 and the second power supply member 110b.

[0127] The outer surface of the lead-out portion 112 is provided with a first plating layer to protect the lead-out portion 112; the outer surface of the guide portion 111 is provided with a second plating layer to protect the guide portion 111; the conductivity of the first plating layer is greater than the conductivity of the second plating layer.

[0128] The base material of the first power supply component 110a and the second power supply component 110b can be a metal with high electrical conductivity (such as metallic copper). Metallic copper is easily oxidized. Therefore, an anti-oxidation coating can be provided on the outer surface of the first power supply component 110a and the second power supply component 110b to protect the first power supply component 110a and the second power supply component 110b.

[0129] The outer surface of the lead-out portion 112 may be provided with a first plating layer, which may be a metal with low activity and high conductivity (e.g., silver). This protects the lead-out portion 112 while improving the conductivity of the connection between the lead-out portion 112 and the adapter 500. The outer surface of the guide portion 111 may be provided with a second plating layer, which may be a layer of a material with low activity and low cost (e.g., nickel). This reduces the overall cost of the power supply assembly 100.

[0130] The power supply assembly 100 provided in the embodiment of the present application is provided with a power supply member 110, which includes a first power supply member 110a and a second power supply member 110b with opposite polarities. The first power supply member 110a and the second power supply member 110b both include a guide portion 111 and a lead-out portion 112. The guide portion 111 includes a guide portion body 1111. The outer surface of the guide portion body 1111 is provided with a plurality of ribs 1112, which can increase the area of contact between the guide portion 111 and the air, thereby improving the heat dissipation efficiency of the power supply member 110. The temperature in the power supply member 110 is relatively low, so that the resistance in the power supply member 110 is also relatively low, so that the smaller cross-sectional area of the guide portion body 1111 can meet the demand for a larger flow rate. The rib portion 1112 can be used to transmit part of the current while dissipating heat, so that the cross-sectional area of the guide portion body 1111 can be set smaller, thereby being more conducive to the heat dissipation of the guide portion body 1111, thereby forming a virtuous circle, so that the heat dissipation efficiency of the power supply component 100 is higher and the cross-sectional area of the power supply component 100 is smaller, and part of the heat of the guide portion 111 can also be dissipated through the lead-out portion 112, further improving the heat dissipation efficiency of the power supply component 100.

[0131] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0132] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A whole cabinet server, characterized in that: include: Cabinet; A plurality of nodes, wherein the plurality of nodes are located in the cabinet and arranged along the height direction of the cabinet; A power supply component, the power supply component is located in the cabinet; The power supply assembly includes a first power supply member and a second power supply member with opposite polarities, and the first power supply member and the second power supply member extend along the height direction of the cabinet. The first power supply member and the second power supply member both include a guide part and a lead-out part, and the guide part includes a guide part body, and the outer surface of the guide part body is provided with multiple ribs; the lead-out part is connected to the guide part body, and the lead-out part is connected to the multiple nodes.

2. The whole cabinet server according to claim 1, characterized in that: A plurality of the ribs are arranged side by side on the air guide body, and a first heat dissipation channel is formed between adjacent ribs.

3. The whole cabinet server according to claim 2, characterized in that: Along the extending direction of the rib, at least a portion of the length of the rib comprises a plurality of rib segments arranged at intervals.

4. The whole cabinet server according to claim 3, characterized in that: There are spacers between adjacent rib segments of the same rib, and the spacers on adjacent ribs are aligned one by one.

5. The whole cabinet server according to claim 1, characterized in that: An included angle between the rib and the surface of the guide body is greater than or equal to 30°.

6. The whole cabinet server according to claim 1, characterized in that: The dimension H of the rib protruding from the guide body and the dimension D of the guide body satisfy the following relationship: 1 / 10D≤H≤1 / 5D.

7. The whole cabinet server according to any one of claims 1 to 6, characterized in that: The power supply assembly also includes an insulating member, which is arranged between the first power supply member and the second power supply member; the insulating member is provided with a receiving groove on one side facing the first power supply member and the second power supply member, and the first power supply member and the second power supply member are partially located in the receiving groove. The groove depth of the receiving groove is the same as the thickness of the lead-out portion, so that the side of the lead-out portion facing away from the receiving groove is flush with the surface of the insulating member.

8. The whole cabinet server according to claim 7, characterized in that: The ribs are provided on a surface of the guide portion of the first power supply member and a surface of the guide portion of the second power supply member facing away from the insulating member.

9. The whole cabinet server according to claim 7, characterized in that: It also includes a protective cover, which is arranged on the outside of the first power supply component and the second power supply component. The protective cover is provided with a plurality of air holes, and the plurality of air holes are arranged at positions corresponding to the protective cover and the guide part.

10. The whole cabinet server according to any one of claims 1 to 6, characterized in that: The outer surface of the lead-out portion is provided with a first plating layer to protect the lead-out portion; The outer surface of the guide portion is provided with a second coating to protect the guide portion; The conductivity of the first plating layer is greater than the conductivity of the second plating layer.

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