Diamond heat dissipation element

Abstract

The invention discloses a diamond heat dissipation element, and particularly relates to the field of electronic components, the diamond heat dissipation element comprises a heat dissipation element body composed of a heat dissipation substrate and diamond particles, the heat dissipation element body is loaded on the top of an element to be subjected to heat dissipation, and the diamond particles are fixed on the heat dissipation substrate through a fixed welding layer. The diamond particles are orderly arranged on the radiating surface, close to the element to be radiated, of the radiating substrate. The vacuum brazing orderly-arranged diamond heat dissipation element is manufactured through a vacuum brazing method, the diamond heat dissipation element with disorderly-arranged diamond particles in a traditional heat dissipation element is replaced when the vacuum brazing orderly-arranged diamond heat dissipation element is used for an electronic system, and the diamond heat dissipation element with the orderly-arranged diamond particles can be tightly connected with a heat source object; other crystal faces except for the exposed heat dissipation face of the diamond face are completely immersed in heat conduction metal, heat is evenly absorbed and effectively and rapidly dissipated, the risks of electronic system jamming, failure and the like caused by overheating are avoided, and the electronic system keeps running normally.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and more particularly to a diamond heat dissipation element. Background Art

[0002] As electronic devices (such as high-power chips, 5G communication equipment, and lasers) evolve toward miniaturization, high integration, and high frequency, their power density is increasing dramatically, leading to increasingly prominent thermal management issues. Excessive temperatures can degrade device performance, shorten lifespan, and even cause failures, making efficient heat dissipation technologies a key challenge.

[0003] Currently commonly used heat dissipation materials include:

[0004] Metal materials (such as copper and aluminum): have high thermal conductivity, but large thermal expansion coefficient, are easily mismatched with semiconductor materials, and have high density;

[0005] Ceramic materials (such as AlN, SiC): good insulation, but low thermal conductivity and high processing cost;

[0006] Graphene / carbon nanotubes: Excellent in-plane thermal conductivity, but poor vertical thermal conductivity and difficult to prepare on a large scale;

[0007] These materials struggle to meet the combined demands of ultra-high thermal conductivity, lightweight design, and chemical stability for next-generation electronic devices. Diamond, due to its unique physical properties, is an ideal heat dissipation material. However, the diamond particles in commercially available diamond heat dissipation components are disordered, resulting in uneven distribution of the diamond particles as heat dissipation materials for electronic systems. This increases thermal resistance and reduces cooling speed. In critical applications requiring high heat dissipation, particularly high-power, continuously operating electronic systems, where continuous and rapid cooling is essential, existing diamond heat dissipation components clearly cannot achieve this. Summary of the Invention

[0008] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a diamond heat dissipation element. The technical problem to be solved by the present invention is: how to arrange diamonds in an orderly manner to avoid thermal damage and thermal interference and improve the reliability of the electronic system.

[0009] To achieve the above objectives, the present invention provides the following technical solution: a diamond heat dissipation element, comprising a heat dissipation element body composed of a heat dissipation substrate and diamond particles, the heat dissipation element body being mounted on top of a component to be cooled, wherein the diamond particles are fixed to the heat dissipation substrate via a fixing welding layer, and the diamond particles are orderly arranged on the heat dissipation surface of the heat dissipation substrate close to the component to be cooled;

[0010] The diamond particles are arranged in a staggered manner to form staggered tracks, and the diamond particles are arranged along the components to be cooled to form customized circuit heat dissipation tracks.

[0011] In a preferred embodiment, the fixed welding layer is provided with copper or silver-based composite vacuum brazing metal powder;

[0012] The copper-based composite powder comprises, by weight percentage, 92-96 wt% of copper powder with a purity of not less than 99.9%, 2-5 wt% of Cr (a strong carbide-forming element), and 1-3 wt% of Ti powder. The particle size of the copper powder is 400 mesh, and the particle sizes of the Cr and Ti powders (strong carbide-forming elements) are both 200-300 mesh.

[0013] The silver-based composite powder comprises, by weight percentage, 40-70 wt% of silver powder, 20-30 wt% of copper powder and 10-15 wt% of Ti powder, and the particle size of the powders is 200-400 meshes;

[0014] Copper solder powder and silver solder powder are added with strong carbide-forming elements such as Ti and Cr. These powders can promote the bonding between diamond particles and heat dissipation substrates.

[0015] In a preferred embodiment, the diamond particles are selected from type II diamond, boron-doped diamond or hexaoctahedral diamond with a particle outer diameter of 200-800 μm, and the diamond particles are staggered in a hexagonal close-packed (HCP) structure with adjacent layers rotated 15°.

[0016] In a preferred embodiment, the diamond particles are set as heat dissipation materials, and the preparation process of the heat dissipation element body adjusts the particle size and dosage of the diamond particles and arranges customized circuit heat dissipation tracks according to the heat dissipation requirements, preferably specifying a particle size range of 200-800 μm or an arrangement of HCP structures.

[0017] The present invention also includes a method for preparing a diamond heat dissipation element, the specific steps of which are as follows:

[0018] S1. Composite vacuum brazing metal powder composite configuration: prepare copper-based composite powder and silver-based composite powder raw materials in proportion and mix them using a planetary ball mill to obtain a homogeneous composite powder;

[0019] S2, cold pressing: drying the mixed powder after ball milling in step S1, pressing with an automatic cold press at a molding pressure of 200-400 MPa, setting the holding time to 3-5 minutes, and adopting a stepwise pressure reduction mode for the holding curve to avoid delamination caused by elastic aftereffect, to obtain a pressed material;

[0020] S3, pre-sintering: sintering the pressed material obtained in step S2 in a protective gas environment according to a three-stage temperature gradient to obtain a composite vacuum brazing metal powder;

[0021] S4, dispensing orderly arranged diamonds: using a high-precision CNC dispensing machine to dispense PVA glue on the heat dissipation substrate (4) according to a preset hexagonal close-packed (HCP) or other orderly array pattern, and controlling the interlayer misalignment angle to rotate 15° between adjacent layers;

[0022] S4.1: Diamond particles are precisely placed one by one at the glue point using a vision positioning system to achieve a hexagonal close-packed (HCP) structure, ensuring uniform spacing and angles (e.g., spacing between adjacent diamonds is 0.8-2.5 times the particle size). The spacing range is optimized based on experiments to balance close packing and thermal conductivity.

[0023] S4.2: Curing the adhesive using infrared curing to temporarily fix the position of the diamond particles;

[0024] S4.3: Evenly spread the copper or silver-based brazing powder prepared in step S3 on the surface of the heat dissipation substrate to which the diamond particles have been fixed; vibrate or scrape the brazing powder to fill the gaps between the diamond particles to ensure uniform coverage;

[0025] The thickness of the interface reaction layer was confirmed by SEM-EDS detection: the copper-based system formed a 1-2mm Cr3C2 transition layer, and the silver-based system formed a 0.5-1μm TiC layer. The interface bonding strength test: the shear strength measured by the ball pushing method was >85MPa (ASTMC633 standard);

[0026] S5. Vacuum brazing:

[0027] S5.1: Place the heat dissipation substrate, diamond particles, and brazing powder assembled in step S4.3 into a vacuum brazing furnace;

[0028] S5.2: Evacuate the vacuum brazing furnace to a basic vacuum degree of ≤5×10 -3 Pa, and then high-purity argon inert gas is introduced to maintain a dynamic vacuum degree of 1-5 Pa;

[0029] S5.3: Heating according to the set temperature curve;

[0030] Copper-based solder: 1070-1110°C (20-50°C above the melting point of copper to establish capillary flow);

[0031] Silver-based solder: 960-980°C (Ag-Cu-Ti system liquidus + 15-30°C);

[0032] Insulation time gradient: adjust the insulation time according to the particle size of diamond particles. The insulation time of 30 / 35 mesh is set to 20-25 minutes; the insulation time of 80 / 100 mesh is set to 5-18 minutes.

[0033] Temperature uniformity control: through three-zone independent temperature control compensation, the furnace temperature uniformity is ≤±3℃;

[0034] S5.4: After the solder melts, it fills the gaps between the diamond particles and the heat dissipation substrate through capillary action, forming a metallurgically bonded fixed solder layer;

[0035] S5.5: Control the cooling rate: For temperatures above 800°C, perform a rapid cooling phase at a rate of 50°C / min or higher. For temperatures between 800°C and 400°C, perform a slow cooling phase at a rate of 10°C / min or lower. Cool the sheet welded in step S5.4 at a rate of 10°C / min or lower. Rapid cooling above 800°C prevents grain coarsening, while slow cooling below 800°C reduces stress. The blank for the heat sink component is obtained, and the finished product is obtained after surface cleaning and grinding.

[0036] S6: Compare experimental data through thermal cycle test and high temperature and high humidity test.

[0037] In a preferred embodiment, in step S1, the planetary ball mill adopts a wet grinding process for mixing, the ball-to-material ratio is set to 5:1, and alcohol is selected as the ball milling medium, wherein the amount of alcohol added is preferably enough to cover the mixed material, the ball milling speed is 200-300 rpm, 30 minutes of forward rotation and 30 minutes of reverse rotation, and the ball milling time is 8-12 hours, and finally a homogeneous composite powder with a laser particle size D50 = 5-10 μm is obtained.

[0038] In a preferred embodiment, the three-stage temperature increase gradient in step S3 is set as: room temperature → 450°C, heating rate 10°C / min; 450°C → 750°C, heating rate 5°C / min; 750°C → operating temperature, cooling rate 3°C / min;

[0039] The protective gas environment includes 75% H2 (shielding gas) and 25% N2 (ammonia decomposition gas) by volume percentage. The dynamic flow rate is set to 2-3 L / min for sintering density control. The linear shrinkage of the composite vacuum brazing metal powder measured with a vernier caliper is between 2-6%.

[0040] In a preferred embodiment, in step S5.2: vacuuming stage: vacuuming is performed by using a three-stage pump group consisting of a mechanical pump → a roots pump → a diffusion pump, and the basic vacuum degree is ≤ 5×10 -3 Pa;

[0041] Dynamic balance during the brazing stage: high-purity argon gas with a purity of 99.999% was introduced to maintain a working vacuum of 1-5 Pa (measured oxygen content <20 ppm).

[0042] Technical effects and advantages of the present invention:

[0043] The present invention uses a vacuum brazing method to manufacture a vacuum brazed diamond heat dissipation element with orderly arranged diamond particles. When used in electronic systems, the diamond heat dissipation element replaces the diamond heat dissipation element with disordered diamond particles in traditional heat dissipation elements, thereby solving the problems of unequal distances between crystal planes of diamonds, increased thermal resistance caused by diamond superposition, and uneven heat transfer. The diamond heat dissipation element with orderly arranged diamond particles is used in a similar manner to a conventional heat sink. It is attached to the element to be dissipated, cooled, and tightly connected to the heat source. Except for the exposed heat dissipation surface, the other crystal surfaces of the diamond are completely immersed in heat-conducting metal, which evenly absorbs heat and dissipates it effectively and quickly, avoiding the risk of electronic system jamming and failure due to overheating, so that the electronic system remains in normal operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 This is a diagram showing the connection relationship between the vacuum brazing diamond particles orderly arranged heat dissipation element and the target object of the present invention.

[0045] Figure 2 This is a schematic structural diagram of a heat dissipation element with orderly arranged diamond particles according to the present invention.

[0046] Figure 3 Schematic diagram of the diamond arrangement trajectory of the present invention.

[0047] The reference numerals are: 1 element to be cooled, 2 fixed welding layer, 3 diamond particles, 4 cooling substrate, 5 arranged staggered tracks, 6 arranged customized circuit cooling tracks. DETAILED DESCRIPTION

[0048] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0049] Example 1:

[0050] The present invention provides Figures 1 to 3 As shown, a diamond heat dissipation element includes a heat dissipation element body composed of a heat dissipation substrate 4 and diamond particles 3. The heat dissipation element body is mounted on top of the element to be dissipated 1. The diamond particles 3 are fixed to the heat dissipation substrate 4 by a fixing welding layer 2. The diamond particles 3 are orderly arranged on the heat dissipation surface of the heat dissipation substrate 4 close to the element to be dissipated 1.

[0051] Diamond is the material with the highest thermal conductivity among commonly used heat dissipation component materials, see Table 1 below

[0052] Table 1

[0053]

[0054] The diamond particles 3 are arranged in a staggered manner to form a staggered track 5. The staggered arrangement of the diamond particles 3 is set to a hexagonal close-packed (HCP) structure with adjacent layers rotated 15 degrees. The diamond particles 3 are arranged along the heat dissipation element 1 to form a customized circuit heat dissipation track 6. The diamond particles 3 are selected from type II diamond, boron-doped diamond, or hexaoctahedral diamond with a particle outer diameter of 200-800 μm. The diamond particles 3 are set as a heat dissipation material. The particle size and amount of the diamond particles 3 and the arrangement of the customized circuit heat dissipation track 6 are adjusted according to the heat dissipation requirements during the preparation process of the heat dissipation element body. Preferably, a particle size range of 200-800 μm or an HCP structure arrangement is specified.

[0055] The fixed welding layer 2 is set as copper or silver-based composite vacuum brazing metal powder;

[0056] The copper-based composite powder comprises, by weight percentage, 92-96 wt% copper powder with a purity of not less than 99.9%, 2-5 wt% Cr (strong carbide-forming element), and 1-3 wt% Ti powder. The copper powder has a particle size of 400 mesh, and the Cr and Ti powders, both strong carbide-forming elements, have a particle size of 200-300 mesh. The silver-based composite powder comprises, by weight percentage, 40-70 wt% silver powder, 20-30 wt% copper powder, and 10-15 wt% Ti powder. The powder particle size is 200-400 mesh. The copper solder powder and silver solder powder contain strong carbide-forming elements such as Ti and Cr. These powders can promote the bonding between the diamond particles and the heat dissipation substrate.

[0057] The present invention also includes a method for preparing a diamond heat dissipation element, the specific steps of which are as follows:

[0058] S1. Preparation of composite vacuum brazing metal powder composite: Prepare copper-based composite powder and silver-based composite powder raw materials in proportion, mix them using a planetary ball mill using a wet grinding process, set the ball-to-material ratio to 5:1, and use alcohol as the ball milling medium. The amount of alcohol added should preferably cover the mixed material. The ball milling speed is 200-300 rpm, with a forward rotation of 30 minutes and a reverse rotation of 30 minutes, and the ball milling time is 8-12 hours, finally obtaining a homogeneous composite powder with a laser particle size D50 = 5-10 μm;

[0059] S2, cold pressing: drying the mixed powder after ball milling in step S1 above, pressing with an automatic cold press at a pressure of 200-400 MPa. Gradient experiments show that the green density reaches 75-78% of the theoretical density at 300 MPa. The holding time is set to 3-5 minutes. The holding curve adopts a step-by-step pressure reduction mode to avoid delamination caused by elastic aftereffect, thereby obtaining a pressed material.

[0060] S3. Pre-sintering: The pressed material obtained in step S2 is sintered in a protective gas environment in a three-stage temperature gradient manner: room temperature → 450°C, heating rate 10°C / min; 450°C → 750°C, heating rate 5°C / min; 750°C → operating temperature, cooling rate 3°C / min, to obtain a composite vacuum brazing metal powder. The protective gas environment comprises, by volume percentage, 75% H2 (shielding gas) and 25% N2 (ammonia decomposition gas). The dynamic flow rate is set to 2-3 L / min for sintering density control. The linear shrinkage of the composite vacuum brazing metal powder is measured with a vernier caliper and is between 2-6%.

[0061] S4. Dispensing orderly arranged diamonds: Use a high-precision CNC dispensing machine to dispense temporary adhesive (such as PVA glue) on the heat dissipation substrate 4 according to a preset hexagonal close-packed (HCP) or other orderly array pattern. The PVA glue will completely evaporate under the brazing vacuum sintering, and there will be no residue to affect the brazing. The interlayer misalignment angle is controlled to rotate 15° between adjacent layers (FEA simulation verifies that the heat flux density distribution is optimal at this angle);

[0062] S4.1: Use a vision positioning system to precisely place diamond particles 3 at the glue point one by one to achieve a hexagonal close-packed (HCP) structure, ensuring uniform spacing and angles (e.g., the spacing between adjacent diamonds is 0.8-2.5 times the particle size);

[0063] S4.2: Curing the adhesive using infrared curing to temporarily fix the position of the diamond particles 3;

[0064] S4.3: Evenly spread copper or silver-based brazing powder with a particle size of less than 300 mesh prepared in step S3 on the surface of the heat dissipation substrate 4, where the diamond particles 3 have been fixed. Vibrate or scrape the brazing powder to fill the gaps between the diamond particles 3, ensuring uniform coverage. Confirm the thickness of the interface reaction layer by SEM-EDS analysis: a 1-2 mm Cr3C2 transition layer is formed for copper-based systems, and a 0.5-1 μm TiC layer is formed for silver-based systems. Interface bonding strength test: Shear strength measured by the ball pushing method is >85 MPa (ASTM C633 standard).

[0065] S5. Vacuum brazing:

[0066] S5.1: Place the heat dissipation substrate 4, diamond particles 3 and brazing powder assembled in step S4.3 into a vacuum brazing furnace;

[0067] S5.2: The vacuum brazing furnace is vacuumed by using a three-stage pump group consisting of a mechanical pump, a roots pump, and a diffusion pump. The basic vacuum degree is ≤5×10 -3 Pa, and then introduce 99.999% high-purity argon gas to maintain the working vacuum degree of 1-5 Pa (measured oxygen content <20ppm);

[0068] S5.3: Heating according to the set temperature curve;

[0069] Copper-based solder: 1070-1110°C (20-50°C above the melting point of copper to establish capillary flow);

[0070] Silver-based solder: 960-980°C (Ag-Cu-Ti system liquidus + 15-30°C);

[0071] Insulation time gradient: adjust the insulation time according to the particle size of diamond particles. The insulation time of 30 / 35 mesh is set to 20-25 minutes; the insulation time of 80 / 100 mesh is set to 5-18 minutes.

[0072] Temperature uniformity control: through three-zone independent temperature control compensation, the furnace temperature uniformity is ≤±3℃;

[0073] S5.4: After the solder melts, it fills the gaps between the diamond particles 3 and the heat dissipation substrate 4 through capillary action, forming a metallurgically bonded fixed solder layer 2;

[0074] S5.5: Control the cooling rate: For temperatures above 800°C, perform a rapid cooling phase at a rate of 50°C / min or higher. For temperatures between 800°C and 400°C, perform a slow cooling phase at a rate of 10°C / min or lower. Cool the sheet welded in step S5.4 at a rate of 10°C / min or lower. Rapid cooling above 800°C prevents grain coarsening, while slow cooling below 800°C reduces stress. The blank for the heat sink component is obtained, and the finished product is obtained after surface cleaning and grinding.

[0075] S6: Compare experimental data through thermal cycle test and high temperature and high humidity test;

[0076] Thermal performance comparison

[0077]

[0078] Specifically in this embodiment: a copper sheet is selected as the heat dissipation substrate 4, hexahedral diamond particles are selected as the diamond particles 3 and are arranged in an orderly manner on the heat dissipation substrate 4, and then a copper-based composite vacuum brazing metal powder is arranged into a vacuum brazing furnace to complete the vacuum brazing process to form a blank of a heat dissipation element with orderly arranged diamonds by vacuum brazing. The finished product is obtained after surface cleaning and grinding.

[0079] Example 2:

[0080] Specifically in this embodiment: a copper sheet is selected as the heat dissipation substrate 4, type II diamond or boron-doped diamond particles are selected as diamond particles 3 and are arranged in an orderly manner on the heat dissipation substrate 4, and then a copper-based composite vacuum brazing metal powder is arranged into a vacuum brazing furnace to complete the vacuum brazing process to form a blank of a heat dissipation element with orderly arranged diamonds by vacuum brazing. The finished product is obtained after surface cleaning and grinding.

[0081] Example 3:

[0082] Specifically in this embodiment: a copper sheet is selected as the heat dissipation substrate 4, hexahedral diamond particles are selected as the diamond particles 3 and are arranged in an orderly manner on the heat dissipation substrate 4, and then a silver-based composite vacuum brazing metal powder is arranged into a vacuum brazing furnace to complete the vacuum brazing process to obtain a blank of a heat dissipation element with orderly arranged diamonds by vacuum brazing. The finished product is obtained after surface cleaning and grinding.

[0083] Example 4:

[0084] Specifically in this embodiment: a copper sheet is selected as the heat dissipation substrate 4, type II diamond or boron-doped diamond particles are selected as diamond particles 3 and are arranged in an orderly manner on the heat dissipation substrate 4, and then a silver-based composite vacuum brazing metal powder is arranged into a vacuum brazing furnace to complete the vacuum brazing process to obtain a blank of a heat dissipation element with orderly arranged diamonds by vacuum brazing. The finished product is obtained after surface cleaning and grinding.

[0085] The heat dissipation element body is put into the vacuum brazing furnace together with the orderly arranged diamond particles 3 and the brazing metal powder at the same time. After being heated and brazed under vacuum conditions, diamond particles arranged in an orderly manner are brazed on the surface of the heat dissipation element. Since diamond has the best thermal conductivity among the current materials, it quickly absorbs the heat of the heating element and dissipates it to reduce the temperature of the heating element and keep the electronic system running normally. It can be used for cooling and dissipating the heat of the heating elements in modern electronic systems, that is, connecting the target object. Once the electronic system starts running, the temperature of the target object rises, and the heat is absorbed and quickly dissipated by the vacuum brazed orderly arranged diamond heat dissipation element to cool the target object and keep it below a safe temperature. The target object can be a CPU, chip, integrated circuit, microwave transmitter, optoelectronic device, quantum order laser or lithium ion battery system, etc.; no specific limitation is made here, and it depends on the actual situation.

[0086] Specific vacuum brazed orderly arranged diamond heat dissipation components include:

[0087] A heat sink 4 is hot-pressed from a copper sheet, and diamond particles 3 are arranged in an orderly manner. Brazing metal powder serves as the bonding layer between the diamond particles 3 and the heat sink 4. This can be copper or silver vacuum brazing powder. There are no specific restrictions here, as long as the heat conduction and bonding properties are met.

[0088] The bottom surface of the corresponding heat dissipation substrate 4 is cleaned and polished to be in close contact with the heating element;

[0089] In the prior art, diamonds in diamond heat dissipation elements are randomly arranged, resulting in uneven distribution of diamonds and increased thermal resistance. Heat dissipation is also uneven, slowing down the heat dissipation rate. For example, in high-power heating elements or after frequency acceleration, disordered diamonds are difficult to quickly slow down the temperature rise. This poses the risk of electronic system freezing and abnormal operation. The disordered arrangement of diamonds often leads to accumulation of diamond particles. Furthermore, the amount of diamonds used is high, which increases the cost and hinders their widespread application.

[0090] Therefore, in order to improve the heat dissipation effect, the heat dissipation element is fixed with orderly arranged diamond particles 3 through vacuum brazing, so that the diamond particles 3 are evenly distributed, which can increase the heat dissipation surface area; and reduce the amount of diamond used, reducing the cost of the heat dissipation element; the vacuum brazing orderly arranged diamond heat dissipation element dissipates heat evenly and quickly, slowing down the rise of the heating element, which is conducive to the normal operation of the electronic system;

[0091] Table 2 Comparison of thermal properties of conventional disordered diamond and ordered diamond

[0092] parameter Traditional random arrangement Ordered structure of the present invention Thermal conductivity (W / mK) 420-480 620-680 Thermal resistance (K / W) 0.18-0.22 0.08-0.12 Temperature uniformity (ΔT) 15-20℃ 3-5℃

[0093] In summary, vacuum-brazed heat sinks with orderly arrays of diamond particles utilize Type II diamond, boron-doped diamond, or hexaoctahedral diamond, all with extremely low thermal resistance. These diamond particles are arranged in an orderly fashion to increase the heat dissipation surface area. Heat dissipation from heat-generating objects is evenly and rapidly dissipated through the orderly array of diamond particles. Furthermore, diamond, being carbon, is environmentally friendly. Diamond usage is reduced and controllable, reducing costs and contributing to stable electronic system operation.

[0094] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A diamond heat dissipation element, characterized in that: The invention comprises a heat dissipation element body composed of a heat dissipation substrate (4) and diamond particles (3), wherein the heat dissipation element body is mounted on the top of the element to be dissipated (1), wherein the diamond particles (3) are fixed to the heat dissipation substrate (4) via a fixed welding layer (2), and the diamond particles (3) are arranged in an orderly manner on the heat dissipation surface of the heat dissipation substrate (4) close to the element to be dissipated (1); The diamond particles (3) are arranged in a staggered manner to form staggered tracks (5), and the diamond particles (3) are arranged along the element to be dissipated (1) to form a customized circuit heat dissipation track (6).

2. The diamond heat dissipation element according to claim 1, characterized in that: The fixed welding layer (2) is configured as copper or silver-based composite vacuum brazing metal powder; The copper-based composite powder comprises, by weight percentage, 92-96 wt% of copper powder, 2-5 wt% of Cr (strong carbide-forming element), and 1-3 wt% of Ti powder. The particle size of the copper powder is 400 mesh, and the particle sizes of the Cr and Ti powders (strong carbide-forming element) are both 200-300 mesh. The silver-based composite powder comprises, by weight percentage, 40-70 wt% of silver powder, 20-30 wt% of copper powder and 10-15 wt% of Ti powder, and the particle size of the powders is 200-400 meshes.

3. The diamond heat dissipation element according to claim 1, characterized in that: The diamond particles (3) are selected from type II diamond, boron-doped diamond or hexaoctahedral diamond with a particle outer diameter of 200-800 μm. The diamond particles (3) are arranged in a staggered manner in a hexagonal close-packed structure with adjacent layers rotated 15°.

4. The diamond heat dissipation element according to claim 3, characterized in that: The diamond particles (3) are set as heat dissipation materials. The preparation process of the heat dissipation element body adjusts the particle size and amount of the diamond particles (3) and arranges the customized circuit heat dissipation track (6) according to the heat dissipation requirements, preferably specifying a particle size range of 200-800 μm or an arrangement of HCP structure.

5. A method for preparing a diamond heat dissipation element, applicable to the diamond heat dissipation element according to any one of claims 1 to 4, characterized in that: The specific steps are as follows: S1. Composite vacuum brazing metal powder composite configuration: prepare copper-based composite powder and silver-based composite powder raw materials in proportion and mix them using a planetary ball mill to obtain a homogeneous composite powder; S2, cold pressing: drying the mixed powder after ball milling in step S1, pressing with an automatic cold press at a molding pressure of 200-400 MPa, with a holding time of 3-5 min, to obtain a pressed material; S3, pre-sintering: sintering the pressed material obtained in step S2 in a protective gas environment according to a three-stage temperature gradient to obtain a composite vacuum brazing metal powder; S4. Dispensing diamonds in an orderly manner: using a high-precision CNC dispensing machine, a temporary adhesive is dispensed on the heat dissipation substrate (4) in a preset hexagonal close-packed or other orderly array pattern, and the interlayer misalignment angle is controlled to rotate 15° between adjacent layers; S4.1: Using a visual positioning system, the diamond particles (3) are accurately placed one by one at the glue point position to achieve a hexagonal close-packed structure and ensure uniform spacing and angles; S4.2: curing the adhesive to temporarily fix the position of the diamond particles (3); S4.3: evenly spreading the copper or silver-based brazing powder prepared in step S3 on the surface of the heat dissipation substrate (4) on which the diamond particles (3) are fixed; the brazing powder is filled into the gaps between the diamond particles (3) by vibration or scraping to ensure even coverage; S5. Vacuum brazing: S5.1: placing the heat dissipation substrate (4), diamond particles (3) and brazing powder assembled in step S4.3 into a vacuum brazing furnace; S5.2: Evacuate the vacuum brazing furnace to a basic vacuum degree of ≤5×10 -3 Pa, and then inert gas is introduced to maintain dynamic vacuum; S5.3: Heating according to the set temperature curve; Copper-based solder: 1070-1110℃; Silver-based solder: 960-980℃; Holding time gradient: adjust the holding time according to the particle size of the diamond particles (3); Temperature uniformity control: furnace temperature uniformity ≤±3℃; S5.4: After the solder is melted, the gap between the diamond particles (3) and the heat dissipation substrate (4) is filled by capillary action to form a metallurgically bonded fixed solder layer (2); S5.5: Control the cooling rate: ≥50°C / min in the rapid cooling stage and ≤10°C / min in the slow cooling stage. Cool the plate welded in step S5.4 to obtain a heat dissipation component blank. Surface cleaning and grinding are then performed to obtain the finished product. S6: Compare experimental data through thermal cycle test and high temperature and high humidity test.

6. The method for preparing a diamond heat dissipation element according to claim 5, characterized in that: In step S1, the planetary ball mill adopts a wet grinding process for mixing, the ball-to-material ratio is set to 5:1, alcohol is selected as the ball milling medium, the ball milling speed is 200-300 rpm, and the ball milling time is 8-12 hours to obtain a homogeneous composite powder.

7. The method for preparing a diamond heat dissipation element according to claim 5, characterized in that: The three-stage temperature increase gradient in step S3 is set as follows: room temperature → 450°C, heating rate 10°C / min; 450°C → 750°C, heating rate 5°C / min; 750°C → operating temperature, cooling rate 3°C / min; The protective gas environment includes 75% H2 and 25% N2 by volume. The dynamic flow rate is set to 2-3 L / min for sintering density control. The linear shrinkage of the composite vacuum brazing metal powder measured with a vernier caliper is between 2-6%.

8. The method for preparing a diamond heat dissipation element according to claim 5, characterized in that: In step S5.2: vacuuming stage: vacuuming is performed using a three-stage pump group consisting of a mechanical pump → a roots pump → a diffusion pump, with a basic vacuum degree of ≤5×10 -3 Pa; Dynamic balance during the brazing stage: high-purity argon gas is introduced to maintain the working vacuum degree of 1-5Pa.

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