Non-contact metal card and manufacturing method thereof

Abstract

The present invention relates to a metal card for implementing radio frequency (RF) performance using a COM chip module, comprising: an antenna for transmitting and receiving information to and from the outside; the metal main body comprises a space, an opening part and a slit part, the space is used for accommodating the antenna, the opening part is subjected to insert molding processing through synthetic resin and is used for accommodating a part of the COM chip module, and the slit part extends to the tail end of the metal card from the opening part; a back sheet made in a shape corresponding to the metal body and laminated on the back surface of the metal body; and a front sheet corresponding to the back sheet and laminated and combined on the front surface of the metal main body, the metal main body, the back sheet and the front sheet are respectively laminated and combined with each other, after chamfering processing, a pocket milling part is formed on the front sheet corresponding to the shape of the COM chip module, and the pocket milling part is formed on the metal main body corresponding to the shape of the COM chip module. And the COM chip module is combined with the pocket milling part.

Description

Technical Field

[0001] The present invention relates to a metal card for making payments and a method for manufacturing the same, and more particularly, to a contactless metal card for making payments in a contactless manner to improve durability and a method for manufacturing the same. Background Art

[0002] Generally, cards can be divided into magnetic cards using magnetic stripes, smart cards using integrated circuit (IC) chips, and composite cards that combine the two based on their recording methods. Smart cards can be divided into contact and contactless types based on their reading methods. Among them, contactless cards are further divided into near-field communication (NFC) cards that can be read within only a few centimeters (cm) to tens of centimeters, and radio frequency (RF) cards that can be read at greater distances. Usually, these methods are often used simultaneously.

[0003] Meanwhile, with the widespread adoption of contactless payment terminal infrastructure, offline payments using smart cards are shifting to contactless cards. Hybrid cards, combining a contactless chip-on-board (COB) and a contactless chip, have been the mainstream. However, due to their limited storage capacity, contactless chips are currently limited to transportation card functions.

[0004] When using a composite chip, it can incorporate international contactless credit card standards, enabling both contactless and contactless payments with a single chip. Contactless payment standards include Visa's "Visa Tap to Pay," Mastercard's "Just Tap & Go," American Express's "American Express Contactless," UnionPay's "QuickPass," and JCB's "JCB Contactless."

[0005] Although various technologies exist for connecting the composite COB and coil antenna contacts, there have always been issues with durability and resistance to external stress.

[0006] To this end, a coil integrated module (COM) packaging technology has emerged that uses COB to form an antenna coil. This technology can achieve contactless payment functions without the need for physical contact connection between the chip and the coil antenna, thus solving the durability limitations of the physical contact method.

[0007] However, when applying contactless COM, coil antenna design technology is still required to maintain the stability of existing contact-type RF.

[0008] Existing physical contact structures based on antennas and COBs are processed at the sheet level. After final assembly and punching to card size, impact can damage the chip or cause antenna contacts to fall off, resulting in a high rate of defects. In such cases, if defects occur, the metal body, chip, and antenna are difficult to reuse, increasing manufacturing costs.

[0009] Prior art literature

[0010] Patent Literature

[0011] Patent Document 0001: Korean Patent No. 10-1754985 Summary of the Invention

[0012] Technical issues

[0013] Therefore, the present invention is proposed to solve the above-mentioned problem. The purpose of the present invention is to provide a contactless metal card and a manufacturing method thereof. That is, since the COM (Coil-On Module) chip assembly process is performed as the last step, the possibility of chip damage during the manufacturing process is fundamentally eliminated.

[0014] Another object of the present invention is to provide a contactless metal card and a method for manufacturing the same, that is, because the card layer structure is uniform, the possibility of chip falling off due to external stress can be reduced.

[0015] However, the technical problems to be solved by the present invention are not limited to the technical problems mentioned above, and ordinary technicians in the technical field to which the present invention belongs can clearly understand other technical problems not mentioned from the following description.

[0016] Technical Solution

[0017] The present invention is proposed to solve the problems of the prior art. The present invention is a metal card that uses a COM chip module to achieve RF performance, which may include: an antenna for sending and receiving information with the outside; a metal body, including a space, an opening, and a slit, the space is used to accommodate the antenna, the opening is formed by insert molding with synthetic resin, and is used to accommodate a part of the COM chip module, and the slit extends from the opening to the end of the metal card; a back sheet is made in a shape corresponding to the metal body and laminated on the back of the metal body; and a front sheet corresponds to the back sheet and is laminated on the front of the metal body, the metal body, the back sheet and the front sheet are respectively laminated and combined with each other, and after chamfering, a pocket milling portion is formed on the front sheet corresponding to the shape of the COM chip module, and the COM chip module is combined in the pocket milling portion.

[0018] Furthermore, in one embodiment, the metal body may include a main body, which forms an outer shape; a milling portion, which is formed in a part of the main body and is used to accommodate the antenna; and an opening portion, which is insert-molded with synthetic resin or filled with a filler made of synthetic resin material, so that a part of the COM chip module is combined with a part of the milling portion, and the slit portion extends to the end of the main body through the opening portion and the milling portion.

[0019] Furthermore, in one embodiment, the pocket milling portion may be included in the opening portion, corresponding to the shape of a portion of the COM chip module, to achieve the combination of the COM chip module.

[0020] Furthermore, in one embodiment, the COM chip module may include: a chip molding portion for bonding the COM chip after molding; and a lead frame portion for supporting the chip molding portion from the bottom and bonding to the pocket milling portion of the front panel and the opening portion.

[0021] Furthermore, in one embodiment, the pocket milling portion may be included in the front sheet, corresponding to the lead frame portion and the chip molding portion of the COM chip module, to achieve the combination of the COM chip module.

[0022] Furthermore, in one embodiment, the antenna may include: a primary coil portion, which first receives current from the COM chip module through electromagnetic induction; a secondary coil portion, which extends from the primary coil and forms a closed-loop coil pattern; and a capacitor pattern portion, which is composed of a top pattern and a bottom pattern arranged in parallel at both ends of the primary coil portion and the secondary coil portion.

[0023] Furthermore, in one embodiment, the back sheet may be formed by laminating a back printing sheet, a cover film, and a silane-modified polyether (MS) tape film layer.

[0024] Furthermore, in one embodiment, the front sheet may be formed by laminating a front printed sheet and a covering film layer.

[0025] Furthermore, in one embodiment, the present invention may include: a metal sheet, which is formed with a plurality of the metal bodies; a back sheet of paper, which is made in a shape corresponding to the metal sheet and is laminated on the back of the metal sheet; and a front sheet of paper, which corresponds to the back sheet of paper and is laminated on the front of the metal sheet, the metal sheet is separated into individual metal bodies after punching, a pocket milling part is formed on the metal body, and the COM chip module is combined in the pocket milling part.

[0026] In the manufacturing method of the contactless metal card of the present invention, in order to apply the COM chip module to realize RF performance, it may include: an antenna for transmitting and receiving information with the outside; a metal body including a space, an opening, and a slit, the space being used to accommodate the antenna, the opening being insert-molded by synthetic resin and being used to accommodate a part of the COM chip module, the slit extending from the opening to the end of the metal card; a back sheet made in a shape corresponding to the metal body and laminated and bonded to the back of the metal body; and a front sheet corresponding to the back sheet and laminated and bonded to the front of the metal body, the metal body, the back sheet and the front sheet are laminated and bonded to each other, and after chamfering, a pocket milling portion is formed on the front sheet corresponding to the shape of the COM chip module, and the COM chip module is bonded to the pocket milling portion, the metal body including: a main body forming an outer shape; a milling portion formed in a part of the main body for accommodating the antenna; and an opening being insert-molded by synthetic resin or filled with a filler of synthetic resin material so that the A portion of the COM chip module is combined with a portion of the milling portion, and the slit portion extends to the end of the main body through the opening portion and the milling portion. The pocket milling portion is included in the opening portion, corresponding to the shape of a portion of the COM chip module, to achieve the combination of the COM chip module. The manufacturing method of the contactless metal card includes: a metal body making step, making the metal body; a back sheet laminating step, after the metal body making step, laminating the back sheet on the back of the metal body; a front sheet laminating step, after the back sheet laminating step, laminating the metal body stacked with the back sheet and the front sheet; a chamfering step, after the lamination step, chamfering the metal card; a pocket milling portion forming step, after the chamfering step, forming the pocket milling portion on the metal card; and a COM chip module combining step, after the pocket milling portion forming step, combining the COM chip module corresponding to the pocket milling portion.

[0027] Furthermore, in one embodiment, the manufacturing method of the contactless metal card of the present invention may include: a metal sheet manufacturing step, manufacturing a metal sheet having a plurality of metal bodies; a back sheet laminating step, after the metal sheet manufacturing step, manufacturing a back sheet corresponding to the metal sheet, and laminating the back sheet on the back of the metal sheet; a front sheet laminating step, after the back sheet laminating step, manufacturing a front sheet corresponding to the back sheet, and laminating the front sheet on the front of the metal sheet; a laminating step, after the front sheet laminating step , laminating the metal sheet stacked with the back sheet and the front sheet; a metal sheet punching step, after the lamination step, punching the metal sheet to separate it into individual pieces; a chamfering step, after the metal sheet punching step, chamfering the metal card; a pocket milling portion forming step, after the chamfering step, forming the pocket milling portion on the metal card; and a COM chip module combining step, after the pocket milling portion forming step, combining the COM chip module corresponding to the pocket milling portion.

[0028] Effects of the Invention

[0029] According to an embodiment of the present invention, since the COM chip is assembled in the final process after the metal body, the back sheet, and the front sheet are laminated, the possibility of chip damage during the process can be completely eliminated.

[0030] Furthermore, due to the use of a contactless approach with no physical contact between the antenna and the COM chip, the possibility of progressive RF defects can be fundamentally eliminated.

[0031] Furthermore, since the entire COM chip is bonded to the insert molding portion, the possibility of the COM chip falling off due to external stress can be significantly reduced.

[0032] And, because pocket milling can be performed using existing plastic contact card equipment, there is no need to invest in separate additional equipment, saving time and costs.

[0033] However, the effects that can be obtained by the present invention are not limited to the effects mentioned above, and ordinary technicians in the technical field to which the present invention belongs can clearly understand other effects not mentioned from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The following drawings attached to this specification are used to illustrate preferred embodiments of the present invention and, together with the detailed description of the invention described below, are used to further understand the technical concept of the present invention. Therefore, the present invention cannot be limited to the matters shown in the drawings.

[0035] Figure 1This is an exploded perspective view of a contactless metal card according to an embodiment of the present invention.

[0036] Figure 2 A cross-sectional view of the components of a contactless metal card.

[0037] Figure 3 Diagram showing the processes of lamination (part (a)), pocket milling (part (b)), and implantation of a COM chip (part (c)) of a contactless metal card.

[0038] Figure 4 A conceptual diagram showing the antenna structure.

[0039] Figure 5 A diagram showing a metal sheet formed with a plurality of metal bodies.

[0040] Figure 6 This figure shows the state where the back sheet and the front sheet are laminated and bonded to the metal sheet.

[0041] Figure 7 FIG. 1 is a flow chart illustrating a method for manufacturing a contactless metal card according to an embodiment of the present invention.

[0042] Figure 8 FIG. 1 is a flow chart illustrating a method for batch manufacturing of contactless metal cards according to an embodiment of the present invention. DETAILED DESCRIPTION

[0043] Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. However, the descriptions related to the present invention are only for illustrating embodiments of the structure or function, and the scope of protection of the present invention cannot be limited and interpreted by the embodiments described herein. That is, the embodiments can be modified in various ways and can have various forms, and the scope of protection of the present invention should be interpreted as including equivalent technical solutions that can realize the technical ideas. Furthermore, the purpose or effect disclosed in the present invention does not mean that a specific embodiment includes all of them or only includes such effects, and the scope of protection of the present invention cannot be limited and interpreted by these contents.

[0044] The meanings of the terms used in this specification should be construed as follows.

[0045] Terms such as "first" and "second" are used to distinguish one structural element from other structural elements, and the scope of protection of the present invention is not limited to these terms. For example, the first structural element can be named the second structural element, and similarly, the second structural element can also be named the first structural element. When it is mentioned that a structural element is "connected" to other structural elements, it can be directly connected to the other structural elements, or it can be understood that there are other structural elements in the middle. On the contrary, when it is mentioned that a structural element is "directly connected" to other structural elements, it should be understood that there are no other structural elements in the middle. On the other hand, other expressions that describe the relationship between structural elements, that is, "between" and "directly between" or "adjacent to" and "directly adjacent to", etc., should also be interpreted in the same way.

[0046] Unless otherwise clearly indicated in the context, it should be understood that singular expressions include plural expressions, and terms such as "including" or "having" are used to specify the existence of the features, numbers, steps, actions, structural elements, parts or these combinations, and should be understood as not excluding in advance the existence or additional possibilities of one or more other features, numbers, steps, actions, structural elements, parts or these combinations.

[0047] Unless otherwise defined, all terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present invention pertains. Terms defined in commonly used dictionaries have the same meanings as those in the context of the relevant technology and, unless expressly defined herein, are not to be interpreted as having ideal or overly formal meanings.

[0048] Figure 1 This is an exploded perspective view of a contactless metal card according to an embodiment of the present invention. Figure 2 This is a cross-sectional view of the components of a contactless metal card. Figure 3 Figure 1 shows the process of lamination (part (a)), pocket milling (part (b)) and implantation of COM chip (part (c)) of contactless metal card. Figure 4 A conceptual diagram showing the antenna structure is shown below. Figure 5 A diagram showing a metal sheet formed with a plurality of metal bodies, Figure 6 This figure shows the state where the back sheet and the front sheet are laminated and bonded to the metal sheet.

[0049] like Figures 1 to 6 As shown, the present invention is a metal card that uses a COM chip to achieve RF performance. The present invention may include an antenna 100 , a metal body 200 , a back sheet 300 , a front sheet 400 and a COM chip module 500 .

[0050] COM chips, as hardware platforms for embedded system development, are designed to enable system developers to easily connect multiple hardware and software components and simplify the complex system development process. RF, short for Radio Frequency, is a technology that uses electromagnetic waves to transmit information. Operating in the high-frequency range (3kHz to 300GHz), it can be used to wirelessly transmit and receive data, providing high-speed data transmission, long-distance communication, multiple connections, and other functions.

[0051] Antenna 100 can be used to transmit and receive information with the outside world. Composed of a flexible printed circuit board (FPCB), antenna 100 forms a ring-shaped structure with a top pattern 140 and a bottom pattern 150. Antenna 100 includes: a primary coil portion 110, which initially receives current from the COM chip module 500 via electromagnetic induction; a secondary coil portion 120, which extends from primary coil portion 110 and forms a closed-loop coil pattern; and a capacitor pattern portion 130, which is formed by the top pattern 140 and the bottom pattern 150 of the FPCB, arranged in parallel at both ends of primary coil portion 110 and secondary coil portion 120, for resonant frequency tuning.

[0052] Specifically, unlike existing wire antennas, the FPCB antenna uses etching to create antenna circuits on a flexible circuit board, thereby reducing the size of the antenna 100, simplifying the setup and assembly process, and having advantages such as reduced power consumption. The FPCB antenna can also ensure stable performance at high frequency bandwidths.

[0053] The capacitor pattern portion 110 can tune the resonant frequency. Specifically, capacitance (capacitance) is a physical quantity that represents the proportional relationship between the amount of electrical charge accumulated and the voltage difference, and represents the electrical capacity between two dielectrics.

[0054] The metal body 200 may include a space for accommodating the antenna 100; an opening 230 formed by insert molding with synthetic resin to accommodate a portion of the COM chip module 500; and a slit 240 extending from the opening 230 to the end of the metal card. Specifically, the metal body 200 may include a main body 210, a milling portion 220, and the opening 230. The main body 210 may be formed into an outer shape. The milling portion 220 may be formed in a portion of the main body 210 to accommodate the antenna 100.

[0055] Specifically, milling is the process of cutting a workpiece surface using a rotating cutting tool. A high-speed rotating body (tool) cuts the workpiece surface to form a shape. Milling can produce a variety of workpiece shapes using a variety of cutting tool types, rotation speeds, and automated control technologies. Milling operations are automated using Computer Numerical Control (CNC) technology and are primarily used in metalworking, woodworking, plastics processing, and other fields.

[0056] The opening portion 230 is formed in an open state so that a portion of the COM chip module 500 is coupled to a portion of the milling portion 220. The opening portion 230 may be insert-molded with a synthetic resin material or filled with a synthetic resin filler. The opening portion 230 may be filled with a synthetic resin so that a portion of the COM chip module 500 is coupled to a portion of the milling portion 220.

[0057] The slit portion 240 may extend to a distal end of the main body 210 via the opening portion 230 and the milling portion 220 .

[0058] The back sheet 300 can be made in a shape corresponding to the metal body 200 and laminated on the back of the metal body 200. The back sheet 300 can be laminated by a back printing sheet, a cover film, and an MS tape film layer.

[0059] The front sheet 400 can correspond to the back sheet 300 and be laminated on the front surface of the metal body 200. The front sheet 400 can be formed by laminating a front printed sheet and a cover film layer.

[0060] Specifically, the back sheet 300 and the front sheet 400 may be made of a synthetic resin having excellent durability and elasticity, such as phenolic resin, polyurethane resin, polyamide resin, acrylic resin, urea / melamine resin, and silicone resin.

[0061] Furthermore, a back sheet 300 including an M / S tape may be assembled on the back surface of the metal body 200 , and a front sheet 400 may be assembled on the front surface.

[0062] The metal body 200 , the back sheet 300 , and the front sheet 400 are laminated and bonded to each other. After chamfering, a pocket milling portion 410 is formed on the front sheet 400 corresponding to the shape of the COM chip module 500 . The COM chip module 500 can be bonded to the pocket milling portion 410 .

[0063] The pocket milling portion 410 may be included in the opening portion 230 , corresponding to the shape of a portion of the COM chip module 500 , to enable coupling of the COM chip module 500 .

[0064] Lamination is performed under high temperature and high pressure conditions using a laminating machine such as a hot press, which can laminate two or more layers, compress them, and then apply a film to improve durability, and perform a waterproof and dustproof treatment on the surface to maintain the surface gloss.

[0065] The COM chip module 500 may include a chip molding portion 510 and a lead frame portion 520. The chip molding portion 510 allows for the COM chip to be bonded after molding. The lead frame portion 520 supports the chip molding portion 510 from the bottom and is bonded to the pocket milling portion 410 of the front sheet 400 and the opening 230. The pocket milling portion 410 may be included in the front sheet 400, corresponding to the lead frame portion 520 and the chip molding portion 510 of the COM chip module 500, to enable bonding of the COM chip module 500.

[0066] A contactless metal card according to an embodiment of the present invention may include a metal sheet 202, a back sheet 302, and a front sheet 402. The metal sheet 202 may be formed with multiple metal bodies 200. The back sheet 302 may be formed in a shape corresponding to the metal sheet 202 and laminated to the back of the metal sheet 202. The front sheet 402 may correspond to the back sheet 302 and be laminated to the front of the metal sheet 202. The metal sheet 202 may be separated into individual metal bodies 200 after punching. A pocket milling portion 410 may be formed in the metal body 200, and the COM chip module 500 may be attached to the pocket milling portion 410.

[0067] Figure 7 FIG. 1 is a flow chart illustrating a method for manufacturing a contactless metal card according to an embodiment of the present invention.

[0068] like Figure 7As shown, in the manufacturing method of the contactless metal card of the present invention, in order to apply the COM chip module 500 to achieve RF performance, it may include: an antenna 100 for transmitting and receiving information with the outside; a metal body 200, including a space, an opening, and a slit, the space is used to accommodate the antenna 100, the opening 230 is formed by insert molding of synthetic resin, and is used to accommodate a part of the COM chip module 500, and the slit 240 extends from the opening 230 to the end of the metal card; a back sheet 300, made in a shape corresponding to the metal body 200, and laminated and bonded to the back of the metal body 200; and a front sheet, corresponding to the back sheet 300 and laminated and bonded to the front of the metal body 200, the metal body 200, the back sheet 300 and the front sheet 400 are laminated and bonded to each other, and after chamfering, a pocket milling portion 410 is formed corresponding to the shape of the COM chip module 500, and the COM chip module 500 is bonded to the pocket The milling part 410, the metal body 200 includes: a main body 210, forming an outer shape; a milling processing part 220, formed on a part of the main body 210, for accommodating the antenna 100; and an opening part 230, which is insert-molded by synthetic resin or filled with a filler of synthetic resin material, so that a part of the COM chip module 500 is combined with a part of the milling processing part 220, and the slit part 240 extends to the end of the main body 210 through the opening part 230 and the milling processing part 220. The pocket milling part 410 is included in the opening part 230, corresponding to the shape of a part of the COM chip module 500, to realize the combination of the COM chip module 500. The manufacturing method of the contactless metal card of the present invention may include a metal body production step S100, a back sheet stacking step S110, a front sheet stacking step S120, a lamination step S130, a chamfering step S140, a pocket milling part forming step S150 and a COM chip module combining step S160.

[0069] The metal body manufacturing step S100 is a step of manufacturing the metal body 200 of a predetermined shape.

[0070] The back sheet laminating step S110 is a step of laminating the back sheet 300 on the back surface of the metal body 200 after the metal body manufacturing step S100 .

[0071] The front sheet laminating step S120 is a step of laminating the front sheet 400 on the front surface of the metal body 200 after the back sheet laminating step S110 .

[0072] The laminating step S130 is a step of laminating the metal body 200 on which the back sheet 300 and the front sheet 400 are laminated after the front sheet laminating step S120 .

[0073] More specifically, the lamination step S130 includes forming an adhesive layer between the front sheet 400 and the metal body 200, and between the back sheet 300 and the metal body 200, wherein the adhesive layer can be made of a fabric that has been pre-bonded on the front sheet 400 and the back sheet 300, or after forming an adhesive layer on the front and back sides of the metal body 200 using an acrylic adhesive or hot melt tape, the front sheet 400 and the back sheet 300 are stacked, and then laminated using a hot lamination device.

[0074] The chamfering step S140 is performed on the metal card 10 after the lamination step S130. Specifically, the chamfering step S140 chamfers the side surfaces of the laminated metal card after the lamination step S130. Chamfering is primarily performed on the surfaces of various materials, such as metal, plastic, and wood, to achieve precise size, shape, and surface finish. This process is primarily performed using CNC machine tools. CNC machine tools are controlled by computer programs and can produce components of desired shapes.

[0075] The pocket milling portion forming step S150 is a step of forming the pocket milling portion 410 on the metal card 600 after the chamfering step S140 .

[0076] The COM chip module assembly step S160 is a step for assembling the COM chip module 500 after the pocket milling portion forming step S150, corresponding to the shape of the pocket milling portion 410. Specifically, by performing pocket milling on the mounting portion of the COM chip module 500 to form the pocket milling portion 410, the assembly process of the COM chip module 500 is finally completed.

[0077] The COM chip module bonding step S160 includes a step of pre-forming an adhesive layer on the lead frame portion 520 of the COM chip module 500 . The adhesive layer may be mainly formed using a hot melt adhesive tape.

[0078] Figure 8 FIG. 1 is a flow chart illustrating a method for batch manufacturing of contactless metal cards according to an embodiment of the present invention.

[0079] like Figure 8 As shown, the present invention may include a metal sheet making step S200, a back sheet paper laminating step S210, a front sheet paper laminating step S220, a laminating step S230, a metal sheet punching step S240, a chamfering step S250, a pocket milling portion forming step S260, and a COM chip module combining step S270.

[0080] The metal sheet manufacturing step S200 is a step of manufacturing a metal sheet 202 formed with a plurality of metal bodies 200 .

[0081] The back sheet laminating step S210 is a step of making a back sheet 302 corresponding to the metal sheet 202 after the metal sheet making step S200 , and laminating the back sheet 302 on the back side of the metal sheet 202 .

[0082] The front sheet laminating step S220 is a step of preparing a front sheet 402 corresponding to the back sheet 302 after the back sheet laminating step S210 and laminating the front sheet 402 on the front side of the metal sheet 202 .

[0083] The laminating step S230 is a step of laminating the metal sheet 202 on which the back sheet 302 and the front sheet 402 are laminated after the front sheet laminating step S220.

[0084] More specifically, the lamination step S230 includes the step of forming an adhesive layer between the front sheet 302 and the metal sheet 202, and between the back sheet 402 and the metal sheet 202, which is specifically the following steps, namely, the adhesive layer can use a fabric that has been pre-adhesively treated on the front sheet and the back sheet, or after forming an adhesive layer on the front and back sides of the metal sheet 202 using an acrylic adhesive or hot melt tape, the front sheet 302 and the back sheet 402 are stacked, and then laminated using a hot lamination device.

[0085] The metal sheet punching step S240 is a step of punching the metal sheet 202 to separate it into individual pieces after the lamination step S230 .

[0086] The chamfering step S250 is a step of chamfering the metal card 10 after the metal sheet punching step S240 .

[0087] The pocket milling portion forming step S260 is a step of forming the pocket milling portion 410 on the metal card 600 after the chamfering step S250 .

[0088] The COM chip module combining step S270 is a step of combining the COM chip module 500 in accordance with the shape of the pocket milling portion 410 after the pocket milling portion forming step S260 .

[0089] The COM chip module combining step S270 includes a step of pre-forming an adhesive layer on the lead frame portion 520 of the COM chip module 500 . The adhesive layer may be mainly formed using a hot melt adhesive tape.

[0090] The following detailed description of the structural elements is consistent with the above-mentioned content of the invention of the contactless metal card.

[0091] According to an embodiment of the present invention, since the COM chip 30 is assembled in the final process after the metal body 200 , the back sheet 300 and the front sheet 400 are laminated, the possibility of the chip being damaged during the process can be completely eliminated.

[0092] Furthermore, due to the use of a contactless approach in which there is no physical contact between the antenna 100 and the COM chip 30 , the possibility of progressive RF failure can be fundamentally eliminated.

[0093] Furthermore, since the entire COM chip 30 is bonded to the insert molding portion, the possibility of the COM chip 30 being detached due to external stress can be significantly reduced.

[0094] And, because pocket milling can be performed using existing plastic contact card equipment, there is no need to invest in separate additional equipment, saving time and costs.

[0095] The detailed description of the preferred embodiments of the present invention as described above is provided so that a person skilled in the art to which the present invention belongs can realize and implement the present invention. The above description is made with reference to the preferred embodiments of the present invention, and a person skilled in the relevant art can make various modifications and changes to the present invention within the scope of the present invention. For example, a person skilled in the art to which the present invention belongs can utilize the various structures described in the embodiments by combining them with each other. Therefore, the present invention is not limited to the embodiments disclosed herein, but is given the widest scope equivalent to the principles and new features disclosed herein.

[0096] The present invention can be embodied into other specific embodiments within the scope of the ideas and essential features of the present invention. Therefore, the detailed description cannot be interpreted as limiting in all aspects, but is an illustrative description. The scope of the present invention is determined by a reasonable interpretation of the scope of the attached invention claims, and all changes within the equivalent scope of the present invention are included in the scope of the present invention. The present invention is not limited to the embodiments disclosed herein, but is given the widest scope that is the same as the principles and new features disclosed herein. In addition, claims that do not have a clear reference relationship in the scope of the invention claims can be combined to form an embodiment or incorporated as a new claim through modification after application.

[0097] Description of Reference Signs

[0098] 100: Antenna

[0099] 110: Capacitor pattern part

[0100] 120: Primary coil

[0101] 130: Secondary coil

[0102] 140: Top pattern

[0103] 150: Bottom pattern

[0104] 200: Metal body

[0105] 202: Metal sheet

[0106] 210: Subject ontology

[0107] 220: Milling Department

[0108] 230: Opening

[0109] 240: Slit

[0110] 300: Back sheet

[0111] 302: Back sheet

[0112] 400: Frontal film

[0113] 402: Front sheet

[0114] 410: Pocket milling department

[0115] 500: COM chip module

[0116] 510: Chip molding department

[0117] 520: Lead frame department

[0118] 600: Metal card with chamfering

[0119] Industrial applicability

[0120] According to a method for manufacturing a contactless metal card according to an embodiment of the present invention,

[0121] After the main body, back sheet and front sheet are laminated, the COM chip is assembled in the final process.

[0122] Therefore, the possibility of chip damage during the process can be completely eliminated, thus having industrial applications.

[0123] Utilization.

Claims

1. A contactless metal card, as a metal card that uses a coil integrated module (COM) chip module to achieve radio frequency performance, characterized in that: include: Antenna, used for sending and receiving information with the outside world; The metal body includes a space, an opening, and a slit, wherein the space is used to accommodate the antenna, the opening is formed by insert molding of synthetic resin and is used to accommodate a portion of the COM chip module, and the slit extends from the opening to the end of the metal card; a back sheet, formed in a shape corresponding to the metal body and laminated and bonded to the back of the metal body; and A front sheet, corresponding to the back sheet and laminated to the front of the metal body, The metal body, the back sheet and the front sheet are laminated and bonded to each other, and after chamfering, a pocket milling portion is formed on the front sheet corresponding to the shape of the COM chip module. The COM chip module is combined with the pocket milling part.

2. The contactless metal card according to claim 1, wherein: The metal body comprises: The main body forms the outer shape; a milling portion formed on a portion of the main body for accommodating the antenna; and The opening is insert-molded with synthetic resin or filled with a filler made of synthetic resin so that a portion of the COM chip module is combined with a portion of the milling portion. The slit portion extends to a distal end of the main body via the opening portion and the milling portion.

3. The contactless metal card according to claim 2, wherein: The pocket milling portion is included in the opening portion and corresponds to the shape of a portion of the COM chip module to enable the combination of the COM chip module.

4. The contactless metal card according to claim 3, characterized in that: The COM chip module includes: A chip forming unit for forming and combining the COM chips; and The lead frame portion supports the chip molding portion from the bottom and is coupled to the pocket milling portion of the front sheet and the opening portion.

5. The contactless metal card according to claim 4, characterized in that: The pocket milling portion is included in the front sheet, corresponding to the lead frame portion and the chip molding portion of the COM chip module, so as to enable the combination of the COM chip module.

6. The contactless metal card according to claim 1, wherein: The antenna comprises: The primary coil part first receives current from the COM chip module through electromagnetic induction; a secondary coil portion extending from the primary coil and forming a closed-loop coil pattern; and The capacitor pattern portion is composed of a top pattern and a bottom pattern provided in parallel at both ends of the primary coil portion and the secondary coil portion.

7. The contactless metal card according to claim 1, wherein: The back sheet is formed by laminating a back printing sheet, a cover film and a silane-modified polyether MS tape film layer.

8. The contactless metal card according to claim 1, wherein: The front sheet is formed by laminating a front printing sheet and a covering film layer.

9. The contactless metal card according to any one of claims 1 to 8, characterized in that: include: a metal sheet formed with a plurality of the metal bodies; a back sheet of paper, made in a shape corresponding to the metal sheet and laminated and bonded to the back of the metal sheet; and A front sheet of paper, corresponding to the back sheet of paper and laminated on the front side of the metal sheet, The metal sheet is separated into individual metal bodies after punching. A pocket milling portion is formed on the metal body, and the COM chip module is coupled to the pocket milling portion.

10. A method for manufacturing a contactless metal card according to any one of claims 1 to 9, wherein the contactless metal card comprises: An antenna for transmitting and receiving information with the outside world; a metal body comprising a space, an opening, and a slit; the space being for accommodating the antenna; the opening being insert-molded with synthetic resin and accommodating a portion of the COM chip module; and the slit extending from the opening to the end of the metal card; a back sheet being formed in a shape corresponding to the metal body and laminated to the back of the metal body; and a front sheet corresponding to the back sheet and laminated and bonded to the front of the metal body. The metal body, the back sheet and the front sheet are laminated and bonded to each other respectively. After chamfering, a pocket milling portion is formed on the front sheet corresponding to the shape of the COM chip module, and the COM chip module is bonded to the pocket milling portion. The metal body includes: a main body, forming an outer shape; a milling portion, formed in a part of the main body for accommodating the antenna; and an opening, which is insert-molded with synthetic resin or filled with a filler of synthetic resin material, so that a part of the COM chip module is bonded to a part of the milling portion. The slit portion extends to the end of the main body via the opening and the milling portion. The pocket milling portion is contained in the opening, corresponding to the shape of a part of the COM chip module, to achieve the bonding of the COM chip module. The manufacturing method of the contactless metal card is characterized in that it includes: a metal body manufacturing step, manufacturing the metal body; a back sheet laminating step, after the metal body manufacturing step, laminating the back sheet on the back side of the metal body; a front sheet laminating step, after the back sheet laminating step, laminating the front sheet on the front surface of the metal body; a laminating step of laminating the metal body laminated with the back sheet and the front sheet after the front sheet laminating step; a chamfering step of chamfering the metal card after the lamination step; a pocket milling portion forming step, forming the pocket milling portion on the metal card after the chamfering step; and The COM chip module combining step comprises combining the COM chip module corresponding to the pocket milling portion after the pocket milling portion forming step.

11. The method for manufacturing a contactless metal card according to claim 9, wherein: include: a metal sheet manufacturing step of manufacturing a metal sheet having a plurality of the metal bodies; a back sheet laminating step, after the metal sheet making step, making a back sheet corresponding to the metal sheet, and laminating the back sheet on the back of the metal sheet; a front sheet laminating step of making a front sheet corresponding to the back sheet after the back sheet laminating step, and laminating the front sheet on the front side of the metal sheet; a laminating step of laminating the metal sheet laminated with the back sheet and the front sheet after the front sheet laminating step; a metal sheet punching step, after the lamination step, punching the metal sheet to separate it into individual pieces; a chamfering step of chamfering the metal card after the metal sheet punching step; a pocket milling portion forming step, forming the pocket milling portion on the metal card after the chamfering step; and The COM chip module combining step comprises combining the COM chip module corresponding to the pocket milling portion after the pocket milling portion forming step.

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