An IC carrier plate marking machine

Abstract

The application provides an IC carrier plate marking machine, which comprises a rack, a feeding mechanism, a marking mechanism, a transfer mechanism and a discharging mechanism. The feeding mechanism comprises a plurality of feeding bins, a feeding driver and feeding clamps. The feeding driver is installed on the rack, and the feeding clamps are installed on the output end of the feeding driver. The marking mechanism comprises a line scanning detector, a marking driver and a marker. The line scanning detector is installed on the rack, the marking driver is installed on the rack, and the marker is installed on the output end of the marking driver. The transfer mechanism comprises a transfer driver and two transfer platforms. The transfer driver is installed on the rack, and the two transfer platforms are installed on both sides of the transfer driver along a first direction. The discharging mechanism comprises a plurality of discharging bins, a discharging driver and discharging clamps. The discharging driver is installed on the rack, and the discharging clamps are installed on the output end of the discharging driver. The IC carrier plate marking machine provided by the application has high marking efficiency and can effectively protect the IC carrier plate.

Description

Technical Field

[0001] This application relates to the field of laser marking technology, and in particular to an IC substrate marking machine. Background Technology

[0002] IC substrates, as a type of high-end PCB board, are characterized by high density, high precision, miniaturization, and thinness, and are widely used in mobile terminals, communication equipment, service / storage and other application fields.

[0003] Due to the high complexity of IC substrate processing, some IC substrates may fail to meet quality standards during mass production. Currently, after IC substrate processing, it is generally necessary to inspect them, and laser marking technology is used to mark those that fail to meet quality standards. Laser marking is a marking method that uses a high-energy-density laser to locally irradiate the workpiece, causing the surface material to vaporize or undergo a chemical reaction that changes color, thereby leaving a permanent mark. Laser marking can produce various texts, symbols, and patterns, which is of particular significance for product anti-counterfeiting. However, in existing technologies, using laser marking machines to inspect and mark IC substrates suffers from low operating efficiency and the risk of damaging the IC substrates. Summary of the Invention

[0004] The purpose of this application is to provide an IC carrier marking machine to solve the technical problems of low operating efficiency and damage to IC carriers in the prior art.

[0005] To achieve the above objectives, the technical solution adopted in this application is: to provide an IC carrier board marking machine, comprising:

[0006] frame;

[0007] The feeding mechanism includes multiple feeding bins, a feeding driver, and feeding grippers. The multiple feeding bins are all mounted on the frame, the feeding driver is mounted on the frame, and the feeding grippers are mounted on the output end of the feeding driver and reciprocate between the multiple feeding bins under the drive of the feeding driver.

[0008] A marking mechanism, comprising a line scan detector, a marking driver, and a marking device, wherein the line scan detector is mounted on the frame, the marking driver is mounted on the frame, and the marking device is mounted on the output end of the marking driver and moves along a first direction under the drive of the marking driver;

[0009] The transfer mechanism includes a transfer driver and two transfer platforms. The transfer driver is mounted on the frame, and the two transfer platforms are mounted on both sides of the transfer driver along a first direction and move along a second direction under the drive of the transfer driver, and are staggered along a third direction.

[0010] The unloading mechanism includes multiple unloading bins, an unloading driver, and unloading grippers. The multiple unloading bins are all mounted on the frame, the unloading driver is mounted on the frame, and the unloading grippers are mounted on the output end of the unloading driver and reciprocate between the multiple unloading bins under the drive of the unloading driver.

[0011] Optionally, the transfer platform includes a first transfer platform;

[0012] The first transfer platform includes a first mounting platform, a first adsorption platform, a first positioning bar, a second positioning bar, a first positioning pusher, and a second positioning pusher. The first mounting platform is mounted on the output end of the transfer driver. The first adsorption platform is mounted on the first mounting platform. The first positioning bar and the second positioning bar are both mounted on the first adsorption platform and are perpendicular to each other. The first positioning pusher is mounted on the first adsorption platform and is configured to drive the IC carrier board to move toward the first positioning bar. The second positioning pusher is mounted on the first adsorption platform and is configured to drive the IC carrier board to move toward the second positioning bar.

[0013] Optionally, the first transfer platform further includes two guide blocks, both of which are installed on the first adsorption platform and are located at both ends of the first positioning strip.

[0014] The first positioning pusher includes two first positioning drivers, two first guide rods, and a first push rod. The two first positioning drivers are installed on the first adsorption platform and are configured to correspond one-to-one with the two guide blocks. The two first guide rods are installed at the output ends of the two first positioning drivers and are configured one-to-one with the two first positioning drivers. The first guide rods pass through the guide blocks and are configured to move relative to the guide blocks under the drive of the first positioning drivers. The first push rod is installed between the two first guide rods and moves toward or away from the first positioning bar along with the two first guide rods.

[0015] The second positioning pusher includes a second positioning driver, a second guide rod, and a second push rod. The second positioning driver is mounted on the first adsorption platform. The second guide rod is mounted on the output end of the second positioning driver and passes through one of the guide blocks. It is also configured to move relative to the guide block under the drive of the second positioning driver. The second push rod is mounted on the second guide rod and moves toward or away from the second positioning bar following the second guide rod.

[0016] Optionally, the first adsorption platform is provided with a plurality of first chutes and at least one second chutes, the plurality of first chutes are spaced apart, and the first chutes and the second chutes are perpendicular to each other;

[0017] The first push rod includes a first rod body and a plurality of first protruding rings. The plurality of first protruding rings are all sleeved on the first rod body and slidably engaged in the plurality of first sliding grooves, and are arranged in a one-to-one correspondence with the plurality of first sliding grooves.

[0018] The second push rod includes a second rod body and at least one second protruding ring. At least one first protruding ring is sleeved on the second rod body and slidably engaged in at least one second sliding groove, and is configured to correspond one-to-one with at least one second sliding groove.

[0019] Optionally, the transfer platform further includes a second transfer platform;

[0020] The second transfer platform includes a second mounting platform, a first positioning plate, a second positioning plate, a third positioning driver, a fourth positioning driver, a fifth positioning driver, and a second adsorption platform. The second mounting platform is mounted on the output end of the transfer driver. The first positioning plate and the second positioning plate are both mounted on the second mounting platform and are perpendicular to each other. The third positioning driver is mounted on the second mounting platform. The fourth positioning driver is mounted on the output end of the third positioning driver and moves toward or away from the first positioning plate under the drive of the third positioning driver. The fifth positioning driver is mounted on the output end of the fourth positioning driver and moves toward or away from the second positioning plate under the drive of the fourth positioning driver. The second adsorption platform is mounted on the output end of the fifth positioning driver and rotates relative to the first positioning plate and the second positioning plate under the drive of the fifth positioning driver.

[0021] Optionally, the feeding mechanism further includes a feeding paper separator, which is mounted on the frame.

[0022] Optionally, the marking mechanism further includes a light source frame, a first line scan light source, and a second line scan light source. The light source frame is mounted on the frame, and the first line scan light source and the second line scan light source are both hinged to the light source frame and arranged at intervals along a second direction and a third direction.

[0023] Optionally, the marking mechanism further includes a dust collector mounted on the frame and configured to remove dust when the marker marks the IC carrier board.

[0024] Optionally, the unloading mechanism further includes a flipper, which is mounted on the frame and configured to flip the IC carrier board;

[0025] The unloading gripper is configured as two, both of which are installed at the output end of the unloading driver and are spaced apart along the first direction. One of the unloading grippers is configured to reciprocate between the transfer platform and the flipper under the drive of the unloading driver, and the other unloading gripper is configured to reciprocate between the flipper and the unloading bin under the drive of the unloading driver.

[0026] Optionally, the feeding mechanism further includes a feeding divider, which is mounted on the frame.

[0027] The beneficial effects of the IC carrier marking machine provided in this application are as follows:

[0028] This application provides an IC carrier marking machine with multiple loading bins. When the loading driver grips an IC carrier in one bin, the operator can move the IC carrier to another bin without stopping the machine, thus improving loading efficiency and marking efficiency. Two transfer platforms are also provided, allowing for the simultaneous transfer of two IC carriers. This enables any two steps—loading, line scanning, marking, and unloading—to be performed concurrently, further improving transfer and marking efficiency. Furthermore, the two transfer platforms are staggered along a third direction, preventing interference and immobility when they move along a second direction. Multiple unloading bins are also provided. When the unloading driver grips an IC carrier in one bin, the operator can remove it from another bin without stopping the machine, improving unloading efficiency and marking efficiency. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 A first-view perspective perspective view of an IC substrate marking machine provided in Embodiment 1 of this application;

[0031] Figure 2 A second-view perspective perspective view of an IC substrate marking machine provided in Embodiment 1 of this application;

[0032] Figure 3 for Figure 1 A magnified view of a section at point A in the middle;

[0033] Figure 4 for Figure 2 A magnified view of a section at point B in the middle;

[0034] Figure 5 A perspective view of the first transfer table of an IC carrier marking machine provided in Embodiment 1 of this application;

[0035] Figure 6 A perspective view of the first transfer table of an IC carrier marking machine provided in Embodiment 1 of this application, excluding the first mounting platform;

[0036] Figure 7 for Figure 6 A magnified view of a section at point C;

[0037] Figure 8 for Figure 6 A magnified view of a section at point D;

[0038] Figure 9 for Figure 2 A magnified view of a section at point E in the middle;

[0039] Figure 10 for Figure 2 A magnified view of a section at point F in the middle;

[0040] Figure 11 This is a first-view perspective perspective view of the second transfer table of an IC carrier marking machine provided in Embodiment 2 of this application;

[0041] Figure 12 This is a second perspective view of the second transfer table of an IC carrier marking machine provided in Embodiment 2 of this application.

[0042] The following are the labeling elements in the figure:

[0043] 1. Rack;

[0044] 2. Feeding mechanism; 21. Feeding bin; 22. Feeding drive; 23. Feeding gripper;

[0045] 3. Marking mechanism; 31. Line scan detector; 32. Marking driver; 33. Marker; 34. Light source holder; 35. First line scan light source; 36. Second line scan light source; 37. Dust collector;

[0046] 4. Transfer mechanism; 41. Transfer driver; 42. Transfer platform; 43. First transfer platform; 431. First mounting platform; 432. First adsorption platform; 433. First positioning bar; 434. Second positioning bar; 435. First positioning pusher; 4351. First positioning driver; 4352. First guide rod; 4353. First push rod; 43531. First rod body; 43532. First convex ring; 43533. First clamping arm; 436. Second positioning pusher; 4361. Second positioning... Position driver; 4362, second guide rod; 4363, second push rod; 43631, second rod body; 43632, second convex ring; 43633, second clamping arm; 437, guide block; 438, first slide groove; 439, second slide groove; 44, second transfer table; 441, second mounting platform; 442, first positioning plate; 443, second positioning plate; 444, third positioning driver; 445, fourth positioning driver; 446, fifth positioning driver; 447, second adsorption platform;

[0047] 5. Feeding mechanism; 51. Feeding bin; 52. Feeding driver; 53. Feeding gripper; 54. Tilter; 55. Feeding paper separator bin. Detailed Implementation

[0048] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0049] It should be noted that when a component is referred to as being "mounted to," "fixed to," or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0050] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0051] Example 1

[0052] like Figures 1 to 4 As shown, this application provides an IC carrier marking machine, including a frame 1, a feeding mechanism 2, a marking mechanism 3, a transfer mechanism 4, and a discharging mechanism 5. The feeding mechanism 2 includes multiple feeding bins 21, a feeding driver 22, and feeding grippers 23. The multiple feeding bins 21 are all mounted on the frame 1, the feeding driver 22 is mounted on the frame 1, and the feeding grippers 23 are mounted on the output end of the feeding driver 22 and reciprocate between the multiple feeding bins 21 under the drive of the feeding driver 22. The marking mechanism 3 includes a line scan detector 31, a marking driver 32, and a marking device 33. The line scan detector 31 is mounted on the frame 1, the marking driver 32 is mounted on the frame 1, and the marking device 33 is mounted on the output end of the marking driver 32 and moves along a first direction under the drive of the marking driver 32. The transfer mechanism 4 includes a transfer driver 41 and two transfer platforms 42. The transfer driver 41 is mounted on the frame 1. The two transfer platforms 42 are mounted on both sides of the transfer driver 41 along a first direction and move along a second direction under the drive of the transfer driver 41, and are staggered along a third direction. The unloading mechanism 5 includes multiple unloading bins 51, an unloading driver 52, and unloading grippers 53. The multiple unloading bins 51 are mounted on the frame 1. The unloading driver 52 is mounted on the frame 1. The unloading grippers 53 are mounted on the output end of the unloading driver 52 and reciprocate between the multiple unloading bins 51 under the drive of the unloading driver 52.

[0053] It should be noted that the first direction, "above" and "below," refers to the bidirectional direction of the shortest connecting line between the feeding mechanism 2 and the unloading mechanism 5, as detailed below. Figure 1 The X-axis is shown in the diagram. The second direction, above and below, refers to the bidirectional direction along its axis, specifically as shown in the diagram. Figure 1 The Y-axis as described above. The third direction above and below refers to the bidirectional direction of the shortest connection between the marking device 33 and the transfer driver 41, specifically as follows: Figure 1 The Z-axis is shown in the figure.

[0054] This application provides an IC carrier marking machine with multiple feeding bins 21. When the feeding driver 22 picks up an IC carrier in one feeding bin 21 using the feeding gripper 23, the operator can move the IC carrier to another feeding bin 21 without stopping the machine for loading, which helps improve feeding efficiency and thus marking efficiency. Two transfer platforms 42 are configured, and the transfer mechanism 4 can transfer two IC carriers simultaneously, allowing any two of the steps of loading, line scanning, marking, and unloading to be performed concurrently, further improving transfer and marking efficiency. Furthermore, the two transfer platforms 42 are staggered along a third direction, preventing interference between them when they move along a second direction, thus avoiding situations where the two transfer platforms 42 cannot move. By setting multiple unloading bins 51, when the unloading driver 52 clamps the IC carrier board into one of the unloading bins 51 through the unloading claw 53, the operator can remove the IC carrier board from the other unloading bin 51 without stopping the machine to unload, which helps to improve unloading efficiency and thus helps to improve marking efficiency.

[0055] Optionally, the loading driver 22, marking driver 32, transfer driver 41 and unloading driver 52 are all configured as linear modules.

[0056] In one embodiment of this application, please refer to Figure 2 , Figure 5 and Figure 6 The transfer platform 42 includes a first transfer platform 43. The first transfer platform 43 includes a first mounting platform 431, a first adsorption platform 432, a first positioning bar 433, a second positioning bar 434, a first positioning pusher 435, and a second positioning pusher 436. The first mounting platform 431 is mounted on the output end of the transfer driver 41. The first adsorption platform 432 is mounted on the first mounting platform 431. The first positioning bar 433 and the second positioning bar 434 are both mounted on the first adsorption platform 432 and are perpendicular to each other. The first positioning pusher 435 is mounted on the first adsorption platform 432 and is configured to drive the IC carrier board to move toward the first positioning bar 433. The second positioning pusher 436 is mounted on the first adsorption platform 432 and is configured to drive the IC carrier board to move toward the second positioning bar 434.

[0057] This configuration allows the IC carrier to be positioned along a first direction under the action of the first positioning bar 433 and the first positioning pusher 435. Under the action of the second positioning bar 434 and the second positioning pusher 436, the IC carrier can be positioned along a second direction. In summary, by positioning the IC carrier from two different directions, its posture can be kept uniform when it enters the line scanning and marking stations, which helps improve the quality of line scanning and marking. After positioning the IC carrier, the first adsorption platform 432 can stably fix the IC carrier to its surface, thus preventing the IC carrier from moving during line scanning and marking, which would affect the quality of line scanning and marking.

[0058] In one embodiment of this application, please refer to the following: Figure 5 and Figure 6 The first transfer platform 43 further includes two guide blocks 437, both of which are installed on the first adsorption platform 432 and located at both ends of the first positioning strip 433. The first positioning pusher 435 includes two first positioning drivers 4351, two first guide rods 4352, and a first push rod 4353. The two first positioning drivers 4351 are installed on the first adsorption platform 432 and are configured to correspond one-to-one with the two guide blocks 437. The two first guide rods 4352 are installed at the output ends of the two first positioning drivers 4351 and are configured to correspond one-to-one with the two first positioning drivers 4351. The first guide rods 4352 pass through the guide blocks 437 and are configured to move relative to the guide blocks 437 under the drive of the first positioning drivers 4351. The first push rod 4353 is installed between the two first guide rods 4352 and moves toward or away from the first positioning strip 433 following the two first guide rods 4352. The second positioning pusher 436 includes a second positioning driver 4361, a second guide rod 4362, and a second push rod 4363. The second positioning driver 4361 is mounted on the first adsorption platform 432. The second guide rod 4362 is mounted on the output end of the second positioning driver 4361 and passes through one of the guide blocks 437. It is also configured to move relative to the guide block 437 under the drive of the second positioning driver 4361. The second push rod 4363 is mounted on the second guide rod 4362 and moves toward or away from the second positioning bar 434 following the second guide rod 4362.

[0059] With this configuration, the first positioning driver 4351, via the first guide rod 4352, can drive the first push rod 4353 to move towards the first positioning strip 433, thereby positioning the IC carrier board along the first direction. The second positioning driver 4361, via the second guide rod 4362, can drive the second push rod 4363 to move towards the second positioning strip 434, thereby positioning the IC carrier board along the second direction. Under the action of the guide block 437 and the first guide rod 4352, the first push rod 4353 is guided, which helps improve the movement stability of the first push rod 4353 in the first direction, thus helping to improve the positioning accuracy of the first push rod 4353. Under the action of the guide block 437 and the second guide rod 4362, the second push rod 4363 is guided, which helps improve the movement stability of the second push rod 4363 in the second direction, thus helping to improve the positioning accuracy of the second push rod 4363.

[0060] Optionally, both the first positioning driver 4351 and the second positioning driver 4361 are configured as cylinders.

[0061] In one embodiment of this application, see reference Figures 6 to 8 The first adsorption platform 432 has multiple first sliding grooves 438 and at least one second sliding groove 439. The multiple first sliding grooves 438 are spaced apart, and the first sliding grooves 438 and the second sliding grooves 439 are perpendicular to each other. The first push rod 4353 includes a first rod body 43531 and multiple first protruding rings 43532. The multiple first protruding rings 43532 are all sleeved on the first rod body 43531 and slidably engaged in the multiple first sliding grooves 438, and are arranged one-to-one with the multiple first sliding grooves 438. The second push rod 4363 includes a second rod body 43631 and at least one second protruding ring 43632. The at least one first protruding ring 43532 is sleeved on the second rod body 43631 and slidably engaged in the at least one second sliding groove 439, and is arranged one-to-one with the at least one second sliding groove 439.

[0062] This configuration, under the action of the first sliding groove 438 and the first protruding ring 43532, compared to the first rod 43531 directly pushing the IC carrier, can prevent the IC carrier from getting stuck in the gap between the first rod 43531 and the first adsorption platform 432, effectively protecting the IC carrier. Similarly, under the action of the second sliding groove 439 and the second protruding ring 43632, compared to the second rod 43631 directly pushing the IC carrier, it can prevent the IC carrier from getting stuck in the gap between the second rod 43631 and the first adsorption platform 432, effectively protecting the IC carrier.

[0063] In one embodiment of this application, please refer to Figure 1 The feeding mechanism 2 also includes a feeding paper separator (not shown in the figure), which is installed on the frame 1.

[0064] This setup, via the feeding paper separator bin, can collect the paper separators between IC carrier boards within the feeding bin 21. It features a high degree of automation, facilitates paper separator recycling and disposal by staff, and effectively improves ease of use.

[0065] In one embodiment of this application, please refer to the following: Figure 1 and Figure 4 The marking mechanism 3 also includes a light source frame 34, a first line scan light source 35 and a second line scan light source 36. The light source frame 34 is mounted on the frame 1. The first line scan light source 35 and the second line scan light source 36 are both hinged to the light source frame 34 and arranged at intervals along the second direction and the third direction.

[0066] This configuration, with the first line scan light source 35 and the second line scan light source 36 acting as a light source, provides illumination for the line scan inspection instrument 31 during line scanning of the IC substrate, thus improving the quality of line scan inspection. Furthermore, the first line scan light source 35 and the second line scan light source 36 are arranged at intervals along the second and third directions, allowing them to illuminate the IC substrate from two different directions. Compared to using only one light source, this provides a more comprehensive light range and angle, further enhancing the quality of line scan inspection. In addition, both the first line scan light source 35 and the second line scan light source 36 are hinged to the light source frame 34, allowing operators to adjust their illumination angles according to actual working conditions, thus adapting to different situations and expanding the applicability of the line scan inspection instrument 31.

[0067] In one embodiment of this application, please refer to the following: Figure 1 and Figure 3 The marking mechanism 3 also includes a dust collector 37, which is mounted on the frame 1 and configured to remove dust when the marking machine 33 marks the IC carrier board.

[0068] With this setup, the dust collector 37 can absorb the smoke and dust generated during the marking process, effectively protecting the staff and preventing the smoke and dust from affecting the service life of the IC substrate marking machine.

[0069] In one embodiment of this application, see reference Figure 2 and Figure 9 The unloading mechanism 5 also includes a flipper 54, which is mounted on the frame 1 and configured to flip the IC carrier board. Two unloading grippers 53 are provided, both mounted on the output end of the unloading driver 52 and spaced apart along a first direction. One unloading gripper 53 is configured to reciprocate between the transfer platform 42 and the flipper 54 under the drive of the unloading driver 52, and the other unloading gripper 53 is configured to reciprocate between the flipper 54 and the unloading bin 51 under the drive of the unloading driver 52.

[0070] With this configuration, the flipper 54 can flip the IC carrier board, allowing the IC carrier board marking machine to inspect both sides of the IC carrier board, resulting in good inspection quality and a high degree of automation. The two unloading grippers 53, compared to a single gripper 53, help improve both flipping and unloading efficiency.

[0071] In one embodiment of this application, please refer to Figure 2 and Figure 10 The feeding mechanism 5 also includes a feeding paper separator 55, which is installed on the frame 1.

[0072] With this configuration, the unloading separator compartment 55 can be used to store separator paper. After the IC carrier board is placed in the unloading compartment 51, the unloading gripper 53 can place the separator paper on the surface of the IC carrier board, which can prevent the IC carrier boards from contacting each other and causing damage to the IC carrier boards, thereby effectively protecting the IC carrier boards.

[0073] The working principle of the IC carrier marking machine provided in this embodiment is as follows:

[0074] Loading: The loading driver 22 drives the loading gripper 23 to move along the first direction to above the loading bin 21. The loading gripper 23 moves towards the loading bin 21 along the third direction until the loading gripper 23 contacts the IC carrier. The loading gripper 23 picks up the IC carrier and drives the IC carrier to move along the third direction to remove the IC carrier from the loading bin 21. The loading gripper 23 then drives the IC carrier to move along the first direction to above the transfer table 42. The loading gripper 23 then drives the IC carrier to move along the third direction to place the IC carrier on the surface of the transfer table 42. Similarly, the paper separator is clamped into the paper separator bin.

[0075] Positioning: The loading gripper 23 places the IC carrier board on the surface of the transfer stage 42. The first positioning driver 4351 pushes the IC carrier board toward the first positioning bar 433 along a first direction via the first guide rod 4352 and the first rod body 43531 until the IC carrier board and the first positioning bar 433 contact. The second positioning driver 4361 pushes the IC carrier board toward the second positioning bar 434 along a second direction via the second guide rod 4362 and the second rod body 43631 until the IC carrier board and the second positioning bar 434 contact.

[0076] Line scanning: After positioning, the first adsorption platform 432 adsorbs the IC carrier to fix the IC carrier to the surface of the first adsorption platform 432. The transfer driver 41 drives the first adsorption platform 432 to move along the second direction to below the line scanning detector 31. The line scanning detector 31 detects the IC carrier to determine the location of the substandard parts on the IC carrier.

[0077] Marking: After inspection, the transfer driver 41 drives the first adsorption platform 432 to move along the second direction to below the marking device 33, where the marking device 33 marks the areas of the IC carrier board that do not meet the quality standards. The transfer driver 41 then drives the first adsorption platform 432 to move along the second direction toward the unloading mechanism 5.

[0078] Unloading: After marking is completed, the unloading claw 53 moves along the first direction to above the first adsorption platform 432, and then moves along the third direction until it contacts the IC carrier. At this time, the first adsorption platform 432 releases its adsorption on the IC carrier, and the unloading claw 53 adsorbs the IC carrier. The unloading claw 53 moves along the third direction to separate the IC carrier from the first adsorption platform 432. The unloading claw 53 moves along the first direction to above the unloading bin 51, and then moves along the third direction to place the IC carrier into the unloading bin 51.

[0079] In summary, the single-sided marking process for IC substrates is as follows: loading, line scanning, marking, and unloading. The double-sided marking process for IC substrates is as follows: loading, positioning, front line scanning, front marking, flipping, positioning, back line scanning, back marking, and unloading.

[0080] Example 2

[0081] This embodiment is basically the same as Embodiment 1, except that: Figure 1 , Figure 11 and Figure 12 As shown, the transfer platform 42 also includes a second transfer platform 44. The second transfer platform 44 includes a second mounting platform 441, a first positioning plate 442, a second positioning plate 443, a third positioning driver 444, a fourth positioning driver 445, a fifth positioning driver 446, and a second adsorption platform 447. The second mounting platform 441 is mounted on the output end of the transfer driver 41. The first positioning plate 442 and the second positioning plate 443 are both mounted on the second mounting platform 441 and are perpendicular to each other. The third positioning driver 444 is mounted on the second mounting platform 441. The fourth positioning driver 445 is mounted on the output end of the third positioning driver 444 and moves toward or away from the first positioning plate 442 under the drive of the third positioning driver 444. The fifth positioning driver 446 is mounted on the output end of the fourth positioning driver 445 and moves toward or away from the second positioning plate 443 under the drive of the fourth positioning driver 445. The second adsorption platform 447 is mounted on the output end of the fifth positioning driver 446 and rotates relative to the first positioning plate 442 and the second positioning plate 443 under the drive of the fifth positioning driver 446.

[0082] It should be noted that during the positioning of the IC carrier, the first rod 43531 and the second rod 43631 position the IC carrier by pushing it. When moving the IC carrier, it slides on the surface of the first adsorption platform 432, which can easily lead to damage to the IC carrier.

[0083] The working principle of Embodiment 2 of this application is as follows: After the loading gripper 23 places the IC carrier plate on the surface of the second adsorption platform 447, the second adsorption platform 447 adsorbs the IC carrier plate to fix it to the surface of the second adsorption platform 447. The fifth positioning driver 446 drives the IC carrier plate to rotate around a third direction so that the side of the IC carrier plate and the first positioning plate 442 remain parallel. After the rotation is completed, the third positioning driver 444 drives the IC carrier plate to move along the first direction until the IC carrier plate and the first positioning plate 442 contact each other, and the fourth positioning driver 445 drives the IC carrier plate to move along the second direction until the IC carrier plate and the second positioning plate 443 contact each other, at which point the positioning is completed.

[0084] With this configuration, under the action of the first positioning plate 442, the second positioning plate 443, the third positioning driver 444, the fourth positioning driver 445, the fifth positioning driver 446, and the second adsorption platform 447, compared with the related technology of positioning first and then fixing, the method of fixing first and then positioning effectively protects the IC carrier board and has a better positioning effect.

[0085] Optionally, both the third positioning driver 444 and the fourth positioning driver 445 are configured as linear modules.

[0086] One or more embodiments in this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of this application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this application should be included within the protection scope of this application.

Claims

1. An IC carrier board marking machine, characterized in that, include: Rack (1); The feeding mechanism (2) includes multiple feeding bins (21), a feeding driver (22), and a feeding gripper (23). The multiple feeding bins (21) are all installed on the frame (1). The feeding driver (22) is installed on the frame (1). The feeding gripper (23) is installed at the output end of the feeding driver (22) and moves back and forth between the multiple feeding bins (21) under the drive of the feeding driver (22). The marking mechanism (3) includes a line scan detector (31), a marking driver (32), and a marking device (33). The line scan detector (31) is mounted on the frame (1), the marking driver (32) is mounted on the frame (1), and the marking device (33) is mounted on the output end of the marking driver (32) and moves along the first direction under the drive of the marking driver (32). The transfer mechanism (4) includes a transfer driver (41) and two transfer platforms (42). The transfer driver (41) is mounted on the frame (1). The two transfer platforms (42) are mounted on both sides of the transfer driver (41) along the first direction and move along the second direction under the drive of the transfer driver (41), and are staggered along the third direction. The unloading mechanism (5) includes multiple unloading bins (51), an unloading driver (52), and an unloading gripper (53). The multiple unloading bins (51) are all installed on the frame (1). The unloading driver (52) is installed on the frame (1). The unloading gripper (53) is installed at the output end of the unloading driver (52) and moves back and forth between the multiple unloading bins (51) under the drive of the unloading driver (52). The transfer platform (42) includes a second transfer platform (44). The second transfer platform (44) includes a second mounting platform (441), a first positioning plate (442), a second positioning plate (443), a third positioning driver (444), a fourth positioning driver (445), a fifth positioning driver (446), and a second adsorption platform (447). The second mounting platform (441) is mounted on the output end of the transfer driver (441). The first positioning plate (442) and the second positioning plate (443) are both mounted on the second mounting platform (441) and are perpendicular to each other. The third positioning driver (444) is mounted on the second mounting platform (441), and the fourth positioning driver (445) is mounted on the second mounting platform (446). The third positioning driver (444) is installed at the output end of the third positioning driver (444) and moves toward or away from the first positioning plate (442) under the drive of the third positioning driver (444). The fifth positioning driver (446) is installed at the output end of the fourth positioning driver (445) and moves toward or away from the second positioning plate (443) under the drive of the fourth positioning driver (445). The second adsorption platform (447) is installed at the output end of the fifth positioning driver (446) and rotates relative to the first positioning plate (442) and the second positioning plate (443) under the drive of the fifth positioning driver (446).

2. The IC carrier board marking machine as described in claim 1, characterized in that, The transfer platform (42) includes a first transfer platform (43); The first transfer platform (43) includes a first mounting platform (431), a first adsorption platform (432), a first positioning bar (433), a second positioning bar (434), a first positioning pusher (435), and a second positioning pusher (436). The first mounting platform (431) is mounted on the output end of the transfer driver (41). The first adsorption platform (432) is mounted on the first mounting platform (431). The first positioning bar (433) and the second positioning bar (434) are both mounted on the first adsorption platform (432) and are perpendicular to each other. The first positioning pusher (435) is mounted on the first adsorption platform (432) and is configured to drive the IC carrier board to move toward the first positioning bar (433). The second positioning pusher (436) is mounted on the first adsorption platform (432) and is configured to drive the IC carrier board to move toward the second positioning bar (434).

3. The IC carrier board marking machine as described in claim 2, characterized in that, The first transfer platform (43) also includes two guide blocks (437), which are both installed on the first adsorption platform (432) and are located at both ends of the first positioning strip (433); The first positioning pusher (435) includes two first positioning drivers (4351), two first guide rods (4352), and a first push rod (4353). The two first positioning drivers (4351) are installed on the first adsorption platform (432) and are configured to correspond one-to-one with the two guide blocks (437). The two first guide rods (4352) are installed at the output ends of the two first positioning drivers (4351) and are configured to correspond one-to-one with the two first positioning drivers (4351). The first guide rods (4352) pass through the guide blocks (437) and are configured to move relative to the guide blocks (437) under the drive of the first positioning drivers (4351). The first push rod (4353) is installed between the two first guide rods (4352) and moves toward or away from the first positioning bar (433) following the two first guide rods (4352). The second positioning pusher (436) includes a second positioning driver (4361), a second guide rod (4362), and a second push rod (4363). The second positioning driver (4361) is mounted on the first adsorption platform (432). The second guide rod (4362) is mounted on the output end of the second positioning driver (4361) and passes through one of the guide blocks (437). It is also configured to move relative to the guide block (437) under the drive of the second positioning driver (4361). The second push rod (4363) is mounted on the second guide rod (4362) and moves toward or away from the second positioning bar (434) following the second guide rod (4362).

4. The IC carrier board marking machine as described in claim 3, characterized in that, The first adsorption platform (432) is provided with a plurality of first grooves (438) and at least one second groove (439), the plurality of first grooves (438) are spaced apart, and the first grooves (438) and the second grooves (439) are perpendicular to each other; The first push rod (4353) includes a first rod body (43531) and a plurality of first protruding rings (43532). The plurality of first protruding rings (43532) are all sleeved on the first rod body (43531) and slidably engaged in the plurality of first sliding grooves (438), and are arranged in a one-to-one correspondence with the plurality of first sliding grooves (438). The second push rod (4363) includes a second rod body (43631) and at least one second protruding ring (43632). At least one first protruding ring (43532) is sleeved on the second rod body (43631) and slidably engaged in at least one second sliding groove (439), and is configured to correspond one-to-one with at least one second sliding groove (439).

5. The IC carrier board marking machine as described in claim 1, characterized in that, The feeding mechanism (2) also includes a feeding paper separator, which is installed on the frame (1).

6. The IC carrier board marking machine as described in claim 1, characterized in that, The marking mechanism (3) further includes a light source frame (34), a first line scan light source (35) and a second line scan light source (36). The light source frame (34) is mounted on the frame (1). The first line scan light source (35) and the second line scan light source (36) are both hinged to the light source frame (34) and arranged at intervals along the second direction and the third direction.

7. The IC carrier board marking machine as described in claim 1, characterized in that, The marking mechanism (3) also includes a dust collector (37), which is mounted on the frame (1) and configured to remove dust when the marking device (33) marks the IC carrier board.

8. The IC carrier board marking machine as described in claim 1, characterized in that, The feeding mechanism (5) also includes a flipper (54), which is mounted on the frame (1) and configured to flip the IC carrier board; The unloading gripper (53) is configured as two, both of which are installed at the output end of the unloading driver (52) and are spaced apart along the first direction. One of the unloading grippers (53) is configured to reciprocate between the transfer platform (42) and the flipper (54) under the drive of the unloading driver (52), and the other unloading gripper (53) is configured to reciprocate between the flipper (54) and the unloading bin (51) under the drive of the unloading driver (52).

9. The IC carrier board marking machine as described in claim 1, characterized in that, The feeding mechanism (5) further includes a feeding paper separator (55), which is installed on the frame (1).

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