Secondary rubber coating forming assembly line for kitchen chopping board

Abstract

The invention relates to the technical field of automatic injection molding production lines, in particular to a kitchen chopping board secondary rubber coating molding assembly line which comprises a primary molding injection molding machine, a rubber coating injection molding machine, a primary molding robot assembly, a rubber coating mechanical assembly, an out-of-mold cooling assembly, a thermal shrinkage film packaging machine and a conveying assembly. The one-time forming injection molding machine and the rubber coating injection molding machine are arranged adjacently; the one-time forming robot assembly is arranged on the side edge of the one-time forming injection molding machine and used for taking out a formed product in the one-time forming injection molding machine and transferring the formed product to the out-mold cooling assembly. By means of the double-station design of the out-of-mold cooling assembly and roundabout circulating cooling of a cooling water pipe, the one-time molding injection molding efficiency is effectively improved, the takt synchronization with a secondary rubber coating procedure is achieved, the production bottleneck is eliminated, the production cost is reduced, and the production efficiency is improved. And the overall productivity is improved.

Description

Technical Field

[0001] The invention relates to the technical field of automated injection molding production lines, in particular to a secondary encapsulation molding production line for kitchen chopping boards. Background Art

[0002] In the existing kitchen chopping board production process, after the primary injection molding machine completes product injection molding, the semi-finished product needs to be manually transferred to the secondary overmolding molding machine for overmolding processing, and then transported to the heat shrink packaging workshop for final packaging.

[0003] This process has significant flaws: First, the primary injection molding cycle is as long as 90 seconds, mainly due to the excessive cooling time, resulting in low overall production efficiency. Second, due to the mold structure, the secondary encapsulation cannot be automated using a two-shot injection molding machine and must be manually operated, which not only increases labor costs but also leads to poor product consistency due to insufficient manual placement precision. In addition, semi-finished products are easily contaminated by environmental dust during transportation and storage, further increasing the product defect rate.

[0004] These problems seriously restrict the efficiency, cost and quality of cutting board production, and there is an urgent need to achieve automation and process optimization through technological improvements.

[0005] Therefore, a kitchen chopping board secondary encapsulation molding production line is needed to improve the above problems. Summary of the Invention

[0006] The purpose of the present invention is to provide a secondary encapsulation molding production line for kitchen cutting boards to solve the problems raised in the above background technology.

[0007] To achieve the above object, the present invention provides the following technical solutions: A kitchen chopping board secondary overmolding production line, comprising a primary molding injection molding machine, an overmolding injection molding machine, a primary molding robot assembly, an overmolding mechanical assembly, an out-of-mold cooling assembly, a heat shrink film packaging machine, and a conveying assembly; The one-shot injection molding machine is arranged adjacent to the overmolding injection molding machine; The one-shot molding robot assembly is arranged on the side of the one-shot molding injection molding machine, and is used to take out the molded product in the one-shot molding injection molding machine and transfer it to the outside mold cooling assembly; The out-of-mold cooling assembly is located on the side of the primary molding robot assembly and is used to cool the molded product; The conveying assembly is arranged between the out-of-mold cooling assembly and the encapsulation mechanical assembly, and is used to convey the cooled product to the encapsulation mechanical assembly; The encapsulation mechanical component is located on the side of the encapsulation injection molding machine and is used to place the product into the encapsulation injection molding machine for secondary encapsulation; The heat shrink film packaging machine is located on one side of the glue encapsulating mechanical component and is used to perform heat shrink film packaging on the glue encapsulated products.

[0008] As a preferred solution of the present invention, the out-of-mold cooling assembly includes a base frame and a supporting frame mounted on the base frame, and the upper and lower ends of the supporting frame are respectively provided with a liftable upper cooling assembly and a lower cooling assembly: The upper cooling assembly includes an upper cooling plate driven by an upper driving motor, and the lower cooling assembly includes a lower cooling plate driven by a lower driving motor.

[0009] As a preferred solution of the present invention, cooling water pipes are provided in the middle of the upper cooling plate and the lower cooling plate, and the cooling water pipes are externally connected to a circulation pipeline to form a cooling circuit.

[0010] As a preferred solution of the present invention, the supporting frame includes a plurality of lower connecting rods and an upper cooling station fixedly connected to the lower connecting rods, and an upper mounting plate is connected above the upper cooling station via the plurality of upper connecting rods; The upper cooling plate is slidably connected to the upper connecting rod and is driven to rise and fall by the upper driving motor; The lower cooling plate is slidably connected to the base frame and is driven to rise and fall by the lower driving motor.

[0011] As a preferred solution of the present invention, the conveying assembly includes a mounting frame and a conveyor belt arranged on the mounting frame, and the two ends of the conveyor belt are respectively connected to the out-of-mold cooling assembly and the rubber-coating mechanical assembly; A driving member is provided at the driving end of the conveyor belt, and product detection sensors are installed at both ends of the conveyor belt.

[0012] As a preferred solution of the present invention, the output end of the one-shot molding robot component is connected to a double-station material picking fixture, and the output end of the rubber coating mechanical component is connected to a single-station rubber coating fixture; The material taking fixture and the rubber encapsulating fixture are both provided with a vacuum adsorption device for taking and placing products by negative pressure adsorption.

[0013] As a preferred solution of the present invention, the cooling water pipes are arranged in a circuitous manner within the upper cooling plate, the lower cooling plate and the upper cooling station to cover the cooling area of the product.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention effectively improves the efficiency of primary molding injection molding through the dual-station design of the out-of-mold cooling component and the circuitous circulation cooling of the cooling water pipe, achieves synchronization with the beat of the secondary encapsulation process, eliminates production bottlenecks, and improves overall production capacity; 2. The present invention adopts a full-process automation design to replace manual transportation and operation, which reduces labor costs and labor intensity. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a first perspective stereogram of the present invention; Figure 2 is a second perspective stereogram of the present invention; Figure 3 A first perspective perspective view of the cooling assembly of the present invention; Figure 4 A second perspective view of the cooling assembly of the present invention; Figure 5 Schematic diagram of the conveying component in the present invention.

[0016] In the figure: one-shot injection molding machine 1, overmolding injection molding machine 2, one-shot molding robot assembly 3, overmolding mechanical assembly 4, out-of-mold cooling assembly 5, base frame 51, lower drive motor 52, upper drive motor 53, upper mounting plate 54, upper cooling plate 55, lower connecting rod 56, upper cooling station 57, upper connecting rod 58, lower cooling plate 59, cooling water pipe 510, heat shrink film packaging machine 6, double-station material picking fixture 7, single-station overmolding fixture 8, conveying assembly 9, mounting frame 10. DETAILED DESCRIPTION

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0018] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to related embodiments. Several embodiments of the present invention are provided. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0019] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0021] See also Figure 1-5 , the present invention provides a technical solution: For example, please refer to Figure 1 、 2 , 3, 4 and 5, a secondary overmolding assembly line for kitchen chopping boards, comprising a primary molding injection molding machine 1, an overmolding injection molding machine 2, a primary molding robot assembly 3, an overmolding mechanical assembly 4, an off-mold cooling assembly 5, a heat shrink film packaging machine 6 and a conveying assembly; the primary molding injection molding machine 1 is adjacent to the overmolding injection molding machine 2; the primary molding robot assembly 3 is arranged on the side of the primary molding injection molding machine 1, for taking out the molded product in the primary molding injection molding machine 1 and transferring it to the off-mold cooling assembly 5; the off-mold cooling assembly 5 is located on the side of the primary molding robot assembly 3, for cooling the molded product; the conveying assembly is arranged between the off-mold cooling assembly 5 and the overmolding mechanical assembly 4, for conveying the cooled product to the overmolding mechanical assembly 4; the overmolding mechanical assembly 4 is located on the side of the overmolding injection molding machine 2, for placing the product into the overmolding injection molding machine 2 for secondary overmolding; the heat shrink film packaging machine 6 is located on one side of the overmolding mechanical assembly 4, for performing heat shrink film packaging on the overmolded product.

[0022] The initial injection molding of the anvil base is completed by the one-time molding injection molding machine 1, and the glue-coating injection molding machine 2 performs secondary glue-coating on the cooled base. The one-time molding robot component 3 takes out the molded product from the one-time molding injection molding machine and transfers it to the out-of-mold cooling component 5. The out-of-mold cooling component 5 quickly cools the product through the double-station liftable cooling plate to shorten the molding cycle. The conveying component conveys the cooled product to the glue-coating mechanical component 4, and accurately places the product into the mold cavity of the glue-coating injection molding machine 2 for secondary glue-coating. The heat shrink film packaging machine 6 automatically performs heat shrink film packaging on the finished product after glue-coating.

[0023] Please refer to Figure 1 、 2, 3, 4 and 5, the out-of-mold cooling assembly 5 includes a base frame 51 and a supporting frame installed on the base frame 51, and the upper and lower ends of the supporting frame are respectively provided with a liftable upper cooling assembly and a lower cooling assembly: the upper cooling assembly includes an upper cooling plate 55 driven by an upper drive motor 53, and the lower cooling assembly includes a lower cooling plate 59 driven by a lower drive motor 52. Cooling water pipes 510 are provided in the middle of the upper cooling plate 55 and the lower cooling plate 59. The cooling water pipes 510 are externally connected to a circulation pipeline to form a cooling circuit. The cooling water pipes 510 are arranged in a circuitous manner in the upper cooling plate 55, the lower cooling plate 59 and the upper cooling station 57 to cover the cooling area of the product.

[0024] The cooling station is divided into two layers, the upper cooling plate 55 and the lower cooling plate 59 are controlled to rise and fall by the upper drive motor 53 and the lower drive motor 52 respectively, and the product is alternately pressure-maintained, shaped and cooled. The cooling water pipe 510 is arranged in a circuitous manner in the cooling plate, covering the product contact surface. The external circulation pipeline realizes continuous cooling water flow, which significantly improves the heat dissipation efficiency. When the one-time forming robot 3 places the product on the upper cooling station 57, the upper cooling plate 55 descends and presses the product, and at the same time the lower cooling plate 59 rises to cool the product of the other station, realizing double-station alternating operation, and the cooling cycle is shortened to 40 seconds.

[0025] The double-station alternating operation and rapid cooling of the out-of-mold cooling component 5 shortens the primary molding cycle from 90 seconds to 40 seconds, synchronizing with the secondary encapsulation cycle and eliminating production bottlenecks.

[0026] Please refer to Figure 1 、 2 , 3, 4 and 5, the supporting frame includes a plurality of lower connecting rods 56 and an upper cooling station 57 fixedly connected to the lower connecting rods 56, and an upper mounting plate 54 is connected to the upper cooling station 57 through a plurality of upper connecting rods 58; the upper cooling plate 55 is slidably connected to the upper connecting rods 58, and is driven to rise and fall by the upper drive motor 53; the lower cooling plate 59 is slidably connected to the base frame 51, and is driven to rise and fall by the lower drive motor 52.

[0027] The conveying assembly includes a mounting frame 10 and a conveyor belt 9 arranged on the mounting frame 10. The two ends of the conveyor belt 9 are respectively connected to the out-of-mold cooling assembly 5 and the rubber-coated mechanical assembly 4. The driving end of the conveyor belt 9 is provided with a driving part, and product detection sensors are installed at both ends of the conveyor belt 9.

[0028] The output end of the one-time molding robot component 3 is connected to a double-station material picking fixture 7, and the output end of the rubber coating mechanical component 4 is connected to a single-station rubber coating fixture 8; both the material picking fixture 7 and the rubber coating fixture 8 are provided with a vacuum adsorption device for picking up and placing products through negative pressure adsorption.

[0029] Sensors are installed at both ends of the conveyor belt 9. When it is detected that the product has reached the specified position, the encapsulation mechanical component 4 is triggered to grab the product. The double-station material picking fixture 7 and the single-station encapsulation fixture 8 use negative pressure adsorption to stably pick up and place the product, avoiding deviation or contamination caused by manual operation.

[0030] Workflow: 1. Primary forming and material removal stage After the primary molding injection molding machine 1 completes the injection molding of the anvil base, the primary molding robot assembly 3 takes out the product by suction through the double-station material removal fixture 7; The robot transfers the product to the upper cooling station 57 of the out-of-mold cooling assembly 5. At this time, the upper cooling plate 55 descends to press the product, and the lower cooling plate 59 rises to cool the product at another station.

[0031] 2. Out-of-mold cooling stage The cooling water pipe 510 quickly dissipates heat from the product through circulating cooling water. After cooling is completed, the upper cooling plate 55 rises and the robot transfers the cooled product to the input end of the conveyor belt 9.

[0032] 3. Conveying and secondary encapsulation stage The conveyor belt 9 transports the product to the side of the rubber-coating mechanical component 4, and the product detection sensor triggers the rubber-coating mechanical component 4 to move.

[0033] The single-station encapsulation fixture 8 absorbs the product and accurately places it in the mold cavity of the encapsulation injection molding machine 2 to complete the secondary encapsulation.

[0034] 4. Heat shrink packaging stage After the encapsulation injection molding machine 2 completes the processing, the encapsulation mechanical component 4 takes out the finished product and places it at the entrance of the heat shrink film packaging machine 6. The heat shrink film packaging machine 6 automatically completes the packaging process, and the finished product is output to the receiving area via the conveyor belt.

[0035] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A secondary encapsulation molding line for kitchen chopping boards, characterized in that: include: One-shot molding injection molding machine (1), overmolding injection molding machine (2), one-shot molding robot assembly (3), overmolding mechanical assembly (4), out-of-mold cooling assembly (5), heat shrink film packaging machine (6) and conveying assembly; The one-shot injection molding machine (1) and the overmolding injection molding machine (2) are arranged adjacent to each other; The one-shot molding robot assembly (3) is arranged on the side of the one-shot molding injection molding machine (1) and is used to take out the molded product in the one-shot molding injection molding machine (1) and transfer it to the outside mold cooling assembly (5); The out-of-mold cooling component (5) is located on the side of the one-shot molding robot component (3) and is used to cool the molded product; The conveying assembly is arranged between the outside mold cooling assembly (5) and the encapsulating mechanical assembly (4), and is used to convey the cooled product to the encapsulating mechanical assembly (4); The encapsulating mechanical component (4) is located on the side of the encapsulating injection molding machine (2) and is used to place the product into the encapsulating injection molding machine (2) for secondary encapsulation; The heat shrink film packaging machine (6) is located on one side of the encapsulating mechanical component (4) and is used to perform heat shrink film packaging on the encapsulated product.

2. The kitchen cutting board secondary encapsulation molding production line according to claim 1, characterized in that: The out-of-mold cooling assembly (5) comprises a base frame (51) and a supporting frame mounted on the base frame (51), wherein an upper cooling assembly and a lower cooling assembly that can be lifted and lowered are respectively provided at the upper and lower ends of the supporting frame: The upper cooling assembly includes an upper cooling plate (55) driven by an upper drive motor (53), and the lower cooling assembly includes a lower cooling plate (59) driven by a lower drive motor (52).

3. The kitchen cutting board secondary encapsulation molding production line according to claim 2, characterized in that: A cooling water pipe (510) is provided in the middle of each of the upper cooling plate (55) and the lower cooling plate (59), and the cooling water pipe (510) is externally connected to a circulation pipeline to form a cooling circuit.

4. The kitchen cutting board secondary encapsulation molding production line according to claim 3 is characterized by: The supporting frame includes a plurality of lower connecting rods (56) and an upper cooling station (57) fixedly connected to the lower connecting rods (56), and an upper mounting plate (54) is connected above the upper cooling station (57) via a plurality of upper connecting rods (58); The upper cooling plate (55) is slidably connected to the upper connecting rod (58), and is driven to rise and fall by the upper driving motor (53); The lower cooling plate (59) is slidably connected to the base frame (51) and is driven to rise and fall by the lower driving motor (52).

5. The secondary encapsulation molding production line for kitchen cutting boards according to any one of claims 1 to 4, characterized in that: The conveying assembly comprises a mounting frame (10) and a conveying belt (9) arranged on the mounting frame (10), and two ends of the conveying belt (9) are respectively connected to the out-of-mold cooling assembly (5) and the rubber encapsulation mechanical assembly (4); A driving member is provided at the driving end of the conveyor belt (9), and product detection sensors are installed at both ends of the conveyor belt (9).

6. The kitchen cutting board secondary encapsulation molding production line according to claim 5, characterized in that: The output end of the one-shot molding robot component (3) is connected to a double-station material picking fixture (7), and the output end of the rubber coating mechanical component (4) is connected to a single-station rubber coating fixture (8); The material taking fixture (7) and the rubber coating fixture (8) are both provided with a vacuum adsorption device for taking and placing products by negative pressure adsorption.

7. The secondary encapsulation molding production line for kitchen cutting boards according to claim 2 or 3, characterized in that: The cooling water pipe (510) is arranged in a circuitous manner within the upper cooling plate (55), the lower cooling plate (59) and the upper cooling station (57) to cover the cooling area of the product.

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