Tray for large-size semiconductor integrated circuit

Abstract

A tray 1 for large-sized semiconductor integrated circuits is provided, comprising one or more pockets 2 for accommodating large-sized semiconductor integrated circuits. On the inner bottom surface 4 of each of the one or more pockets, a curved recess 10 having a circular profile 8 is formed. The circular profile 8 is substantially concentric with the center of each of the one or more pockets. A curved recess 10 formed on the inner bottom surface 4 of the pocket 2 prevents the inner bottom surface 4 from contacting a terminal on the bottom surface of the semiconductor integrated circuit to be placed in the pocket.

Description

Technical Field

[0001] The present invention relates to a tray for a substrate of a semiconductor integrated circuit such as an IC, and more particularly, to a tray suitable for accommodating a very large-sized semiconductor integrated circuit (including a semiconductor package) having a plurality of terminals on its bottom surface. Background Art

[0002] A tray for semiconductor integrated circuits (hereinafter also simply referred to as a "tray") is provided with one or more pockets for accommodating substrates of semiconductor integrated circuits. Furthermore, the tray for semiconductor integrated circuits is provided with support steps extending horizontally along the pockets of the tray so that the support steps support the semiconductor integrated circuits and prevent the inner bottom surface of the pockets from contacting terminals on the bottom surface of the semiconductor integrated circuits, even when a grid array type (e.g., PGA type, BGA type, etc.) semiconductor integrated circuit is placed in the pockets.

[0003] Trays that conform to the JEDEC (Electronic Devices Engineering Council) standard have horizontal and vertical dimensions ([horizontal dimension] X [vertical dimension]) of [315.0mm-322.6mm (approximately 12.4 inches-12.7 inches)]X[135.9mm (approximately 5.35 inches)] and can be handled by conventional automated machinery for JEDEC standard trays.

[0004] However, some large-scale semiconductor integrated circuit substrates may have some deformation caused by manufacturing errors. Or, when the semiconductor integrated circuit substrate is accidentally flexed, the terminals on the bottom surface of the semiconductor integrated circuit may contact the inner bottom surface of the tray pocket.

[0005] Japanese Patent Application Publication No. 2022-142375 discloses a recess on the inner bottom surface of a pocket of a tray, the recess having a flat surface approximately similar to the bottom surface of a semiconductor integrated circuit and having a depth longer than the height of terminals provided on the bottom surface of the semiconductor integrated circuit.

[0006] When a tray for large-scale semiconductor integrated circuits, which is as large as the upper limit of the JEDEC standard size, is flexed, the inner bottom surfaces of the pockets on the tray may contact the terminals on the bottom surface of the semiconductor integrated circuits to be placed in the pockets. In addition, it is difficult for conventional automated machines to handle trays for large-scale semiconductor integrated circuits with horizontal and vertical dimensions of 120×120 mm (approximately 4.72×4.72 inches) or more in plan view. Summary of the Invention

[0007] A tray for large-scale semiconductor integrated circuits is provided, comprising one or more pockets for accommodating the large-scale semiconductor integrated circuits, wherein a curved concave portion having a circular contour is formed on an inner bottom surface of each of the one or more pockets.

[0008] In one embodiment, the circular profile is generally concentric with a center of each of the one or more pockets.

[0009] In one embodiment, the curved recessed portions having a circular profile are formed on opposite sides of an inner bottom surface of each of the one or more pockets.

[0010] In one embodiment, the circular profile on the opposing side is generally concentric with a center of each of the one or more pockets.

[0011] In one embodiment, the curved concave portion is formed by a spherical dome having a predetermined radius of curvature.

[0012] In one embodiment, the tray has a plurality of projections extending laterally from the longitudinal side walls of the tray.

[0013] In one embodiment, each of the plurality of protrusions has a generally rectangular shape.

[0014] In another embodiment, each of the plurality of protrusions has a generally trapezoidal shape.

[0015] In yet another embodiment, each of the plurality of protruding portions has a generally arcuate shape.

[0016] In one embodiment, the plurality of protruding portions are arranged at positions a predetermined distance away from longitudinal side ends of the tray. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a plan view showing an example of a tray for a semiconductor integrated circuit according to the present invention.

[0018] Figure 2 yes Figure 1 An enlarged plan view of a pocket in a tray for a semiconductor integrated circuit.

[0019] Figure 3 A tray is shown having a curved recess formed on the interior bottom surface of a pocket of the tray.

[0020] Figure 4 A tray is shown having curved recesses formed on opposite sides of the interior bottom surface of the pockets of the tray.

[0021] Figure 5A tray is shown having curved recesses formed on the interior bottom surface of a pocket of the tray and on opposing sides of the interior bottom surface.

[0022] Figure 6 is a cross-sectional view showing an arched curved concave portion formed on the inner bottom surface of the pocket of the tray.

[0023] Figure 7 is a cross-sectional view showing arched curved concave portions formed on opposite sides of the inner bottom surface of the pocket of the tray.

[0024] Figure 8 is a cross-sectional view showing an inner bottom surface of a pocket of a tray and an arched curved concave portion formed on the opposite side of the inner bottom surface.

[0025] Figure 9 A tray provided with a protruding portion having a rectangular shape is shown.

[0026] Figure 10 A tray provided with a protruding portion having a trapezoidal shape is shown.

[0027] Figure 11 A tray provided with a protruding portion having an arc shape is shown. DETAILED DESCRIPTION

[0028] Hereinafter, an exemplary tray for a large-scale semiconductor integrated circuit according to the present invention will be described in detail based on the embodiments shown in the accompanying drawings.

[0029] Figure 1 This is a perspective view of an example tray 1 for semiconductor integrated circuits. One or more pockets 2 are provided on the upper surface of tray 1, depending on the shape and size of the semiconductor integrated circuit to be placed in pockets 2 of tray 1. Pockets 2 are also provided with a plurality of support steps 6 that extend horizontally along the inner sidewalls of pockets 2 to support the edges of the semiconductor integrated circuits and prevent the inner bottom surface 4 of pockets 2 from contacting terminals 7 on the bottom surface 4 of the semiconductor integrated circuits.

[0030] like Figure 1 As shown, a curved recess 10 having a circular contour 8 is formed on the inner bottom surface of each of the two pockets 2 on the upper surface of the tray 1 .

[0031] Figure 2 (a) is along Figure 1 A cross-sectional view taken along line AA in FIG.

[0032] Figure 2 (b) The tray 1 is shown exaggeratedly to clarify the curved concave portion 10, although the actual curved concave portion 10 is very slightly curved to the naked eye. Figure 2As shown in (b), a curved concave portion 10 may be formed on the inner bottom surface 4 of the pocket 2 of the tray 1 .

[0033] Figure 2 (c) is a perspective view showing that the curved concave portion 10 is composed of an inverted spherical dome (a spherical portion taken along the inner bottom surface 4). Figure 2 (c) The tray 1 is shown exaggeratedly so that the curved surface of the spherical dome can be clearly seen. As shown, the curved recess 10 formed on the inner bottom surface 4 of the pocket 2 prevents the inner bottom surface 4 from contacting the terminals on the bottom surface of the semiconductor integrated circuit to be placed in the pocket 2 (particularly the terminals around the center of the substrate). Figure 2 The dot-dash lines in (a)-(c) indicate points corresponding to each other.

[0034] Figure 3 An example tray 1 is shown. Figure 3 (a) is along Figure 1 A cross-sectional view taken along line AA in FIG. Figure 3 (b) shows the curved recessed portion 10 formed on the inner bottom surface 4 of the pocket 2 of the tray 1 . Figure 3 (b) also shows the circular outline 8 of the curved recess 10 in the pocket 2, wherein the circular outline 8 is approximately concentric with the center of the pocket 2 (i.e., two diagonals to opposite corners of the pocket 2 intersect each other at the center of the circular outline). In one embodiment, the circular outline 8 has a radius as shown, while in another embodiment, the circular outline 8 can have a different radius. In some embodiments, the curved recess 10 is formed by a spherical dome (a spherical portion taken along the inner bottom surface 4) having a predetermined radius of curvature ranging from 1000 mm to 5000 mm (from about 39.37 inches to about 196.9 inches). For example, the predetermined radius of curvature is 3000 mm (about 118.1 inches).

[0035] Figure 4 Another example tray 1 is shown. Figure 4 (a) is along Figure 1 The cross-sectional view taken along line AA in FIG. Figure 4 As shown in (b), a curved concave portion 10 is formed on the opposite side of the inner bottom surface of the pocket 2 of the tray 1. Figure 4 (b) also shows the circular outline 8 of the curved recess 10, wherein the circular outline 8 is substantially concentric with the center of the pocket 2. In some embodiments, the curved recess 10 is formed by a spherical dome (a spherical portion taken along the underside of the tray 1) having a predetermined radius of curvature.

[0036] Figure 5 Yet another example tray 1 is shown. Figure 5 (a) is along Figure 1In this example, the curved concave portion 10 is formed on the upper and lower surfaces of the tray 1, as shown in FIG. Figure 5 As shown in (b)-(c). Figure 5 (b) shows the curved recess 10 formed on the inner bottom surface 4 of the pocket 2 of the tray 1, Figure 5 (c) shows the curved recessed portion 10 formed on the opposite side of the inner bottom surface 4 of the pocket 2 . Figure 5 (b)-(c) also show the circular outline 8 of the curved concave portion 10, which is approximately concentric with the center of the pocket 2. With this structure, the tray 1 can resist forces in the bending direction of the tray 1 regardless of its thickness, and when a large-scale semiconductor integrated circuit 6 is packaged in the tray 1, deformation (warping, deflection, etc.) of the substrate of the tray 1 is avoided.

[0037] Figure 6 A first embodiment of the present invention is shown. Figure 6 (a) is along Figure 1 A cross-sectional view taken along line AA. Figure 6 (b) is a cross-sectional view showing, in an exaggerated manner, an arched curved recess 10 formed on the inner bottom surface 4 of the pocket 2 of the tray 1. This curved recess 10 formed on the inner bottom surface 4 of the pocket 2 prevents the inner bottom surface 4 from contacting the terminals (particularly the terminals around the center of the substrate) on the bottom surface of the semiconductor integrated circuit to be placed in the pocket 2.

[0038] Figure 7 A second embodiment of the present invention is shown. Figure 7 (a) is along Figure 1 A cross-sectional view taken along line AA in FIG. Figure 7 (b) is a cross-sectional view 12 showing, in an exaggerated manner, the arched curved recess 10 on the opposite side of the inner bottom surface 4 of the pocket 2 of the tray 1. Despite its thinness, the weight of the substrate of the semiconductor integrated circuit is received by the bridge structure of the curved recess 10 on the underside of the tray 1, so the tray 1 is rigid and difficult to break.

[0039] Figure 8 A third embodiment of the present invention is shown. Figure 8 (a) is along Figure 1 A cross section taken along line AA in FIG12 . Figure 8 (b) is a cross-sectional view 12 showing the arched curved recess 10 on the inner bottom surface 4 of the pocket 2 of the tray 1 . Figure 8 (c) is a cross-sectional view 12 showing the arcuate curved recessed portion 10 on the opposite side of the inner bottom surface 4 of the pocket 2 . Figure 8 (b)-(c) show the pallet 1 in an exaggerated manner so that the bridging structure (arch configuration) can be clearly seen.

[0040] Figure 9-11 The illustrated tray 1 has a protrusion 14. The protrusion 14 enables the pockets 2 of the tray 1 to accommodate semiconductor integrated circuits having horizontal and vertical dimensions of 120×120 mm (approximately 4.72×4.72 inches) or greater in plan view. The shape and size of the protrusion 14 can be designed depending on the size, weight, etc. of the semiconductor integrated circuit to be placed in the pockets 2 of the tray 1. The protrusion 14 can extend laterally from the longitudinal sidewalls 16 of the tray 1.

[0041] Figure 9 A plurality of protruding portions 14 are shown in the first embodiment, each protrusion having a generally rectangular shape. Figure 9 Also shown are locations 18, beyond which projections 14 extend transversely from longitudinal sidewalls 16 of tray 1, forming a cross-shaped profile as shown. These locations 18 are positioned a predetermined distance from the longitudinal side ends (i.e., corner edges) of tray 1. Locations 18 should be positioned 20-70 mm (approximately 0.79-2.76 inches) from the longitudinal side ends of tray 1. This allows conventional automated machinery used for JEDEC standard trays to handle trays 1 having these projections 14, even though trays 1 having these projections 14 do not technically conform to the JEDEC standard.

[0042] Figure 10 A plurality of protruding portions 14 are shown in the second embodiment, each protrusion having a generally trapezoidal shape.

[0043] Figure 11 A plurality of projections 14 in the third embodiment are shown, each having a generally arcuate shape outlined by an arc (whose central angle is less than 180 degrees) and a chord connecting both ends of the arc. Reference Signs List

[0044] 1 pallet 2 pockets 4Inner bottom surface 6 support steps 8 circular outlines 10 curved concave part 12 Arched cross section 14 protrusion 16 longitudinal side walls 18 A position at a predetermined distance away from the corner

Claims

1. A tray for a large-scale semiconductor integrated circuit, comprising: One or more pockets for accommodating large-scale semiconductor integrated circuits; Wherein, a curved concave portion having a circular contour is formed on an inner bottom surface of each of the one or more pockets.

2. The tray for a large-scale semiconductor integrated circuit according to claim 1, wherein the circular profile is substantially concentric with a center of each of the one or more pockets.

3. The tray for a large-scale semiconductor integrated circuit according to claim 2, in, The curved recessed portions having a circular contour are formed on opposite sides of the inner bottom surface of each of the one or more pockets.

4. The tray for a large-scale semiconductor integrated circuit according to claim 3, in, The circular profile on the opposite side is generally concentric with a center of each of the one or more pockets.

5. The tray for a large-scale semiconductor integrated circuit according to claim 1, in, The curved concave portion is formed of a spherical dome having a predetermined curvature radius.

6. The tray for a large-scale semiconductor integrated circuit according to claim 1, in, The tray has a plurality of projections extending laterally from longitudinal side walls of the tray.

7. The tray for a large-scale semiconductor integrated circuit according to claim 6, in, Each of the plurality of protruding portions has a substantially rectangular shape.

8. The tray for a large-scale semiconductor integrated circuit according to claim 6, in, Each of the plurality of protruding portions has a substantially trapezoidal shape.

9. The tray for a large-scale semiconductor integrated circuit according to claim 6, in, Each of the plurality of protruding portions has a substantially arc shape.

10. The tray for a large-scale semiconductor integrated circuit according to any one of claims 7 to 9, in, The plurality of protruding portions are arranged at positions away from longitudinal side ends of the tray by a predetermined distance.

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