Composite refining preparation method of manganese-copper alloy with high conductivity
Through the construction of the dual-phase structure and interface optimization, the problem of insufficient conductivity of manganese copper alloy is solved, and a high conductivity and high strength manganese copper alloy is realized, which is suitable for existing copper alloy production lines.
Patent Information
- Application Number
- CN202510992213.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-18
- Publication Date
- 2025-08-15
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The conductivity of manganese copper alloys is low, limiting their application in highly conductive devices, and the existing processes further damage the conductivity when increasing strength.
The construction is made of a two-phase structure. Through directional solidification and heat treatment, manganese is depolymerized to the β phase, so as to reduce the solute concentration in the α phase, form a continuous electron transport channel, and introduce a Cu-rich transition layer at the α/β phase interface, and rare earth Ce adsorbs impurities, and optimize the interface resistance.
The conductivity of manganese copper alloy is increased by 70%, and its strength is increased by 50%. The process is compatible with existing copper alloy production lines. The electronic transmission path is unblocked, the dislocation movement is blocked, and the interface resistance is reduced by 40%.
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Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of alloy refining, and in particular to a composite refining preparation method of a manganese-copper alloy with high conductivity. Background Art
[0002] Manganese-copper alloys are copper-based alloys with manganese (Mn) as the primary alloying element and possibly small amounts of nickel (Ni), iron (Fe), aluminum (Al), and other elements. The solid solution strengthening of manganese and the precipitation of intermetallic compounds significantly enhance the strength (tensile strength can reach 500-800 MPa) and provide a certain degree of resistance to oxidizing and corrosive environments. Manganese-copper alloys are primarily used in precision resistors, electromagnetic devices, structural materials, and sensors.
[0003] Although manganese-copper alloys excel in strength and functionality, their electrical conductivity is generally low, typically only 20%-50% of pure copper, or about 10-40% IACS. This is mainly limited by the following factors: the atomic radius of manganese (0.127nm) is larger than that of copper (0.128nm), which causes lattice distortion after solid solution, significantly increases electron scattering, and reduces conductivity. For every 1wt.% Mn added, the conductivity decreases by about 3-5% IACS; manganese easily forms intermetallic compounds with copper, nickel, etc. The resistivity of these phases is much higher than that of the copper matrix, and the grain boundary density in the multiphase structure increases, hindering the long-range migration of electrons; in traditional processes, increasing the manganese content or introducing strengthening phases (such as nano-precipitated phases) to improve strength, but this will aggravate the loss of conductivity.
[0004] Manganese copper alloy is irreplaceable in functional areas such as strength and heat resistance, but its low conductivity limits its application in high-conductivity devices. Summary of the Invention
[0005] The object of the present invention is to provide a composite refining preparation method of a manganese-copper alloy with high conductivity, so as to partially solve the above problems.
[0006] To achieve the above object, the present invention provides the following technical solution: a composite refining method for preparing a manganese-copper alloy with high conductivity, comprising the following steps: First, copper is placed in a vacuum furnace for refining, and then manganese, iron, and nickel are added to the vacuum furnace in sequence and electromagnetically stirred; Then, aluminum and cerium are added into a vacuum furnace and ultrasonically shaken under a protective gas atmosphere to obtain a mixed material; The mixed material is placed in a directional solidification furnace, and induced separation is performed under the conditions of a temperature gradient of 28-32°C / mm and a pulling rate of 4.8-5.2mm / min to obtain a rough blank; The rough billet is heat treated and then cold rolled.
[0007] Further, the method includes providing ingredients, wherein the ingredients include the following raw materials in parts by weight: 88-92 parts of copper, 7-9 parts of manganese, 2-4 parts of iron, 1-3 parts of nickel, 0.5-2 parts of aluminum and greater than 0 and less than 0.06 parts of cerium.
[0008] Further, the method includes providing ingredients, wherein the ingredients include the following raw materials in parts by weight: 89-91 parts of copper, 7.8-8.1 parts of manganese, 2.9-3.1 parts of iron, 1.9-2.1 parts of nickel, 0.8-1.2 parts of aluminum and greater than 0 and less than 0.06 parts of cerium.
[0009] Furthermore, the copper is placed in a vacuum furnace at 1600±100℃ and vacuum degree ≤10 -3 Pure copper is smelted under Pa conditions.
[0010] Furthermore, after the pure copper is smelted, manganese, iron and nickel are added in sequence, and electromagnetic stirring is performed at 1450° C. and 50 Hz for 25-35 minutes.
[0011] Furthermore, aluminum and cerium were added and ultrasonic vibration was carried out at a power of 5 kW and a frequency of 20 kHz for 10 min under argon protection.
[0012] Furthermore, the heat treatment includes solution treatment and multi-stage aging treatment; The solution treatment is as follows: the rough blank is kept at 1050-1150° C. for 2 hours and then water-spun.
[0013] Furthermore, the multi-stage aging treatment includes: Primary aging treatment: After solution treatment, keep the temperature at 490-510℃ for 1 hour to promote the initial precipitation of iron-nickel-aluminum phase; Secondary aging treatment: After the primary aging treatment, the steel is kept at 345-355°C for 4 hours to drive the precipitation of manganese in the form of nanoclusters.
[0014] Furthermore, the rolling deformation of the cold rolling deformation is 55-62%, and the cold rolling temperature is 190-210°C.
[0015] Furthermore, the present invention also provides a manganese-copper alloy with high conductivity, which is obtained according to the above-mentioned refining and preparation method.
[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention designs a dual-phase structure. Through directional solidification and heat treatment, manganese is segregated into the β phase, reducing the solute concentration in the α phase. The α phase serves as a continuous channel for electron transmission, with an electrical conductivity of ≥90% IACS. An L12-type ordered phase is formed between manganese, iron, nickel, and aluminum in the β phase. Orowan strengthening and coherent strain hinder dislocation motion, resulting in a hardness of ≥900 HV. The β phase is dispersed in the α phase matrix as nanoscale islands (50-200 nm), with a volume fraction of 15-20%. The conductivity of this manganese-copper alloy is 70% higher than that of traditional manganese-copper alloys (typically ≤50% IACS), and the strength is increased by 50%. The process is also compatible with existing copper alloy production lines. 2. The present invention introduces a 1-2 nm thick Cu-rich transition layer at the α / β phase interface through multi-stage aging treatment, reducing interfacial electron scattering. Rare earth Ce is segregated at the interface, adsorbing impurities and inhibiting interfacial oxidation, reducing the interface resistance by 40%. The α phase forms a three-dimensional continuous network, and the β phase is distributed in isolated islands, ensuring efficient electron transmission along the α phase. At the same time, the β phase blocks the long-range motion of dislocations. DETAILED DESCRIPTION
[0017] The technical solutions in the embodiments of the present invention will be described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0018] The present invention provides a technical solution: a composite refining preparation method of a manganese-copper alloy with high conductivity, comprising the following steps: First, copper is placed in a vacuum furnace for refining, and then manganese, iron, and nickel are added to the vacuum furnace in sequence and electromagnetically stirred; Then, aluminum and cerium are added into a vacuum furnace and ultrasonically shaken under a protective gas atmosphere to obtain a mixed material; The mixed material is placed in a directional solidification furnace, and induced separation is performed under the conditions of a temperature gradient of 28-32°C / mm and a pulling rate of 4.8-5.2mm / min to obtain a rough blank; The rough billet is heat treated and then cold rolled.
[0019] It should be noted that the microstructure design principle of the embodiment of the present invention is: Dual-phase structure construction: The conductive phase is the α phase. Through directional solidification and aging treatment, Mn is segregated into the β phase, reducing the solute concentration in the α phase. The Mn content in its composition is less than 1wt.%, and Fe / Ni / Al exist in the form of solid solution atoms (concentration ≤ 0.5wt.%), serving as a continuous channel for electron transmission. The electrical conductivity is ≥90% IACS. The β phase is dispersed in the α phase matrix in the form of nanoscale islands (50-200nm), with a volume fraction of 15-20%. Its composition is Mn-20Fe-15Ni-5Al (at.%), forming a hard L12 type ordered phase. It hinders dislocation movement through Orowan strengthening and coherent strain, and has a hardness of ≥900HV.
[0020] Interface optimization principle: Low-resistance interface design is formed by the diffusion of Cu during the aging process. A 1-2nm thick Cu-rich transition layer is introduced at the α / β phase interface to reduce interface electron scattering. Rare earth Ce is segregated at the interface, adsorbing impurities and inhibiting interface oxidation, reducing interface resistance by 40%; In a topological interpenetrating network, the conductive phase (α) forms a three-dimensional continuous network, and the strengthening phase (β) is distributed in the form of isolated islands, ensuring efficient transmission of electrons along the α phase, while the β phase blocks the long-range motion of dislocations.
[0021] The mechanism for achieving its high conductivity is: low solute α-phase Mn solid solubility <1wt.% (traditional manganese-copper alloy 5-10wt.%), reduced lattice distortion, and increased electron mean free path; interface purification, through Ce adsorption of oxygen / sulfur impurities, reducing grain boundary scattering; continuous conduction, α-phase volume share >80%, and unobstructed electron transmission path.
[0022] The high strength is achieved through the following mechanisms: nano-precipitation strengthening, where FeNi3Al nanoparticles in the β phase hinder dislocations through the Orowan mechanism; coherent strain strengthening, where Mn nanoclusters (2-5nm) are coherent with the α phase matrix, generating an elastic strain field; and grain refinement, where the warm rolling process refines the α phase grains to 1-2μm and increases the grain boundary density.
[0023] In a further embodiment of this embodiment, ingredients are provided, and the ingredients include the following raw materials in parts by weight: 88-92 parts of copper, 7-9 parts of manganese, 2-4 parts of iron, 1-3 parts of nickel, 0.5-2 parts of aluminum and greater than 0 and less than 0.06 parts of cerium.
[0024] In a further embodiment of this embodiment, ingredients are provided, and the ingredients include the following raw materials in parts by weight: 89-91 parts of copper, 7.8-8.1 parts of manganese, 2.9-3.1 parts of iron, 1.9-2.1 parts of nickel, 0.8-1.2 parts of aluminum and greater than 0 and less than 0.06 parts of cerium.
[0025] In a further embodiment of this embodiment, copper is placed in a vacuum furnace at 1600±100°C and a vacuum degree of ≤10 -3 Pure copper is smelted under Pa conditions.
[0026] In a further implementation manner of this embodiment, manganese, iron and nickel are added in sequence after the pure copper is smelted, and electromagnetic stirring is performed at 1450° C. and 50 Hz for 25-35 minutes.
[0027] In a further embodiment of this example, aluminum and cerium were added and ultrasonic vibration was carried out at a power of 5 kW and a frequency of 20 kHz for 10 minutes under argon protection.
[0028] In a further embodiment of this embodiment, the heat treatment includes solution treatment and multi-stage aging treatment; The solution treatment is as follows: the rough blank is kept at 1050-1150° C. for 2 hours and then water-spun.
[0029] In a further embodiment of this embodiment, the multi-stage aging treatment includes: Primary aging treatment: After solution treatment, keep the temperature at 490-510℃ for 1 hour to promote the initial precipitation of iron-nickel-aluminum phase; Secondary aging treatment: After the primary aging treatment, the steel is kept at 345-355°C for 4 hours to drive the precipitation of manganese in the form of nanoclusters.
[0030] In a further embodiment of this embodiment, the cold rolling deformation is 55-62%, and the cold rolling temperature is 190-210°C.
[0031] In a further embodiment of this example, the present invention also provides a manganese-copper alloy with high conductivity, which is obtained according to the above-mentioned refining and preparation method.
[0032] Example 1
[0033] 90 parts of copper are placed in a vacuum furnace at 1600°C and a vacuum degree of ≤10 -3 Pa conditions for high temperature refining, and then 7 parts of manganese, 2 parts of iron and 1 part of nickel were added into a vacuum furnace in sequence, the temperature was controlled at 1450 ° C and electromagnetic stirring was carried out for 30 minutes, and the frequency of electromagnetic stirring was 50 Hz; Then, 0.5 parts of aluminum and 0.05 parts of cerium were added to a vacuum furnace and the temperature was controlled at 1350°C. Ultrasonic oscillation was performed under an argon protective atmosphere to obtain a mixture. The power of the ultrasonic oscillation was 5 kW and the frequency was 20 kHz. The mixed material was placed in a directional solidification furnace and induced separation was performed under the conditions of a temperature gradient of 30°C / mm and a pulling rate of 5.0 mm / min to obtain a rough blank; The rough billet was kept at 1100℃ for 2 hours and then hydrolyzed. It was then kept at 500℃ for 1 hour to promote the initial precipitation of the iron-nickel-aluminum phase. It was then kept at 350℃ for 4 hours to drive the precipitation of manganese in the form of nanoclusters. The billet was slowly cooled at 2℃ / min and then cold rolled. The rolling deformation was 60% at a temperature of 200℃. Combined with dynamic recrystallization to refine the grains, a manganese-copper alloy was obtained.
[0034] Example 2
[0035] The difference from Example 1 is that 90 parts of copper are placed in a vacuum furnace at 1600°C and a vacuum degree of ≤10 -3 Pa conditions for high temperature refining, then 8 parts of manganese, 3 parts of iron and 2 parts of nickel were added into a vacuum furnace in sequence, the temperature was controlled at 1450 ° C and electromagnetic stirring was carried out for 30 minutes, and the frequency of electromagnetic stirring was 50 Hz; Then, 1 part of aluminum and 0.05 parts of cerium were added into a vacuum furnace and the temperature was controlled at 1350° C. Ultrasonic oscillation was performed under an argon protective atmosphere to obtain a mixture. The power of the ultrasonic oscillation was 5 kW and the frequency was 20 kHz.
[0036] Example 3
[0037] The difference from Example 1 is that 90 parts of copper are placed in a vacuum furnace at 1600°C and a vacuum degree of ≤10 -3 Pa conditions for high temperature refining, then 9 parts of manganese, 4 parts of iron and 3 parts of nickel were added into a vacuum furnace in sequence, the temperature was controlled at 1450 ° C and electromagnetic stirring was carried out for 30 minutes, and the frequency of electromagnetic stirring was 50 Hz; Then, 2 parts of aluminum and 0.05 parts of cerium were added into a vacuum furnace and the temperature was controlled at 1350° C. Ultrasonic oscillation was performed under an argon protective atmosphere to obtain a mixture. The power of the ultrasonic oscillation was 5 kW and the frequency was 20 kHz.
[0038] Example 4
[0039] The difference from Example 2 is that the mixed material is placed in a directional solidification furnace, and induced separation is performed under the conditions of a temperature gradient of 30°C / mm and a pulling rate of 4.8 mm / min to obtain a rough blank.
[0040] Example 5
[0041] The difference from Example 2 is that the mixed material is placed in a directional solidification furnace, and induced separation is performed under the conditions of a temperature gradient of 30°C / mm and a pulling rate of 4.9 mm / min to obtain a rough blank.
[0042] Example 6
[0043] The difference from Example 2 is that the mixed material is placed in a directional solidification furnace, and induced separation is performed under the conditions of a temperature gradient of 30°C / mm and a pulling rate of 5.1 mm / min to obtain a rough blank.
[0044] Example 7
[0045] The difference from Example 2 is that the mixed material is placed in a directional solidification furnace, and induced separation is performed under the conditions of a temperature gradient of 30°C / mm and a pulling rate of 5.2 mm / min to obtain a rough blank.
[0046] Example 8
[0047] The difference from Example 2 is that the rolling deformation amount of the cold rolling deformation is 60%, the cold rolling temperature is 190° C., and dynamic recrystallization is combined to refine the grains to obtain a manganese-copper alloy.
[0048] Example 9
[0049] The difference from Example 2 is that the rolling deformation amount of the cold rolling deformation is 60%, the cold rolling temperature is 195° C., and dynamic recrystallization is combined to refine the grains to obtain a manganese-copper alloy.
[0050] Example 10
[0051] The difference from Example 2 is that the rolling deformation amount of the cold rolling deformation is 60%, the cold rolling temperature is 205° C., and dynamic recrystallization is combined to refine the grains to obtain a manganese-copper alloy.
[0052] Example 11
[0053] The difference from Example 2 is that the rolling deformation amount of the cold rolling deformation is 60%, the cold rolling temperature is 210° C., and dynamic recrystallization is combined to refine the grains to obtain a manganese-copper alloy.
[0054] Comparative Example 1 The difference from Example 2 is that the rough billet is kept at 1100°C for 2 hours and then quenched, then kept at 500°C for 1 hour to promote the initial precipitation of the iron-nickel-aluminum phase, and then kept at 350°C for 4 hours to drive the precipitation of manganese in the form of nanoclusters, and then slowly cooled at 3°C / min before cold rolling.
[0055] Comparative Example 2 The difference from Example 2 is that the mixed material is placed in a directional solidification furnace, and induced separation is performed under the conditions of a temperature gradient of 30°C / mm and a pulling rate of 4.5 mm / min to obtain a rough blank.
[0056] Comparative Example 3 The difference from Example 2 is that the mixed material is placed in a directional solidification furnace, and induced separation is performed under the conditions of a temperature gradient of 30°C / mm and a pulling rate of 5.5 mm / min to obtain a rough blank.
[0057] Comparative Example 4 The difference from Example 2 is that the rolling deformation amount of the cold rolling deformation is 60%, the cold rolling temperature is 180° C., and dynamic recrystallization is combined to refine the grains to obtain a manganese-copper alloy.
[0058] Comparative Example 5 The difference from Example 2 is that the rolling deformation amount of the cold rolling deformation is 60%, the cold rolling temperature is 220° C., and dynamic recrystallization is combined to refine the grains to obtain a manganese-copper alloy.
[0059] The conductivity of the manganese-copper alloys obtained in Examples 1 to 11 and Comparative Examples 1 to 5 was tested by a four-probe method; the tensile strength and elongation of the manganese-copper alloys obtained in Examples 1 to 11 and Comparative Examples 1 to 5 were tested by a universal material testing machine; the microhardness of the manganese-copper alloys obtained in Examples 1 to 11 and Comparative Examples 1 to 5 was tested by a nanoindenter; the interface resistivity experiment was performed on the manganese-copper alloys obtained in Examples 1 to 11 and Comparative Examples 1 to 5 by a micro-area four-probe + focused ion beam; the data obtained from the above experiments and tests are shown in Tables 1 to 3 below.
[0060] Table 1
[0061] From Table 1 above, it can be seen that the comprehensive properties of the manganese-copper alloy prepared in Example 2 are the best. By comparison with Comparative Example 1, it can be seen that a cooling rate greater than 2 min before cold rolling will lead to excessive growth of the β phase, resulting in lower conductivity of the manganese-copper alloy.
[0062] Table 2
[0063] As can be seen from Table 2 above, the comprehensive properties of the manganese-copper alloy prepared in Example 2 are the best. The pulling rate in Comparative Example 2 is too low, resulting in: the precipitated phase is excessively coarsened, slow solidification allows full diffusion of elements, the β phase size exceeds 500nm, and even forms a micron-sized block phase, resulting in a decrease in strength. The coarse β phase cannot effectively hinder dislocation movement (Orowan mechanism failure), resulting in a decrease in tensile strength; increased brittleness: the coarse hard phase becomes a crack source, the elongation decreases, and the fracture toughness decreases; the α phase solute concentration increases, the Mn solid solubility increases: Mn is not fully segregated to the β phase, and the Mn content in the α phase increases from the design value of <1wt.% to 3-5wt.%, the lattice distortion is aggravated, resulting in a decrease in conductivity; abnormal grain growth and coarsening of the α phase grains: slow cooling causes the α phase grains to grow from 1-2μm to 5-10μm, the grain refinement strengthening effect disappears, and the hardness (HV) decreases.
[0064] The pulling rate in Comparative Example 3 was too fast, resulting in: two-phase mixing (α phase and β phase were not effectively separated). In terms of microstructure, the rapid pulling shortened the solute diffusion time at the solidification front, resulting in insufficient time for elements such as Mn, Fe, and Ni to fully segregate, forming a mixed structure of α phase (rich in Cu) and β phase (rich in Mn-Fe-Ni-Al), rather than the designed topological interpenetrating network, resulting in decreased conductivity: the continuous conductive channel of the α phase was blocked by the β phase, and the electron transmission path became tortuous, resulting in decreased conductivity and strength; the β phase was distributed in a lamellar or network shape (rather than an isolated island). , dislocations easily slip along phase boundaries, resulting in a decrease in tensile strength; anisotropy disappears: the mixed structure leads to a weakening of the orientation dependence of mechanical properties, and directional solidification cannot be used to optimize the bearing capacity in a specific direction; the size of the nano-precipitates is out of control: β phase coarsening: rapid solidification inhibits the nucleation of the precipitate phase, the size of the β phase increases from the designed 50-200nm to 300-500nm, and the Orowan strengthening effect is weakened; Mn clusters are unevenly distributed: Mn cannot be effectively segregated to the β phase, and some remain in the α phase to form solute atomic clusters, which increase electron scattering and further lead to a decrease in conductivity.
[0065] Table 3
[0066] As shown in Table 3 above, the comprehensive performance of the manganese-copper alloy prepared in Example 2 is the best. The cold rolling temperature of Comparative Example 4 is too low, which leads to: work hardening dominates, dislocation density surges; low temperature inhibits dynamic recrystallization, dislocation proliferation rate accelerates during rolling, and dislocation density can reach 10 15 m -2 (10 under normal process 14 m -2 ), resulting in increased material brittleness and decreased elongation; residual stress concentration: dislocation accumulation forms local stress concentration areas, which are prone to microcracks in subsequent service and reduce fatigue life by more than 50%; banded structure formation: the plastic deformation ability decreases at low temperatures, and the high hardness β phase (900HV) and soft α phase (120-150HV) in the alloy deform uncoordinatedly, forming a microscopic banded structure, leading to anisotropy; lattice distortion intensifies: excessive dislocations and residual stress increase lattice distortion, increase the probability of electron scattering, and reduce conductivity.
[0067] The cold rolling temperature in Comparative Example 5 is too high, resulting in: grain coarsening. The increase in temperature accelerates the dynamic recrystallization process, causing abnormal grain growth (for example, from 1-2μm to 5-10μm), a decrease in the number of grain boundaries, a weakening of the grain refinement strengthening effect, and a decrease in tensile strength; a decrease in dislocation density: dislocations are annihilated during the recrystallization process, the work hardening effect is weakened, and the material hardness (HV) decreases; Mn nanocluster coarsening: if the temperature exceeds the aging treatment window (such as 250°C), the originally designed 2-5nm coherent Mn clusters aggregate into incoherent phases >10nm, causing electron scattering and a decrease in conductivity; and diffusion of the Cu-rich transition layer: high temperature accelerates the diffusion of Cu atoms, resulting in the thickening of the interface transition layer (from 1-2nm to 5nm) and an increase in the interface resistivity.
[0068] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations that come within the meaning and range of equivalents of the claims be embraced therein.
Claims
1. A composite refining method for preparing a manganese-copper alloy with high conductivity, characterized in that: The following steps are involved: First, copper is placed in a vacuum furnace for refining, and then manganese, iron, and nickel are added to the vacuum furnace in sequence and electromagnetically stirred; Then, aluminum and cerium are added into a vacuum furnace and ultrasonically shaken under a protective gas atmosphere to obtain a mixed material; The mixed material is placed in a directional solidification furnace, and induced separation is performed under the conditions of a temperature gradient of 28-32°C / mm and a pulling rate of 4.8-5.2mm / min to obtain a rough blank; The rough billet is subjected to heat treatment and then cold rolling deformation; wherein the heat treatment includes solution treatment and multi-stage aging treatment; The solution treatment is as follows: the rough blank is kept at 1050-1150° C. for 2 hours and then water-spun.
2. The composite refining method for preparing a manganese-copper alloy having high conductivity according to claim 1, characterized in that: The method comprises providing ingredients, wherein the ingredients include the following raw materials in parts by weight: 88-92 parts of copper, 7-9 parts of manganese, 2-4 parts of iron, 1-3 parts of nickel, 0.5-2 parts of aluminum and greater than 0 and less than 0.06 parts of cerium.
3. The composite refining method for preparing a manganese-copper alloy having high conductivity according to claim 1, characterized in that: The method comprises providing ingredients, wherein the ingredients include the following raw materials in parts by weight: 89-91 parts of copper, 7.8-8.1 parts of manganese, 2.9-3.1 parts of iron, 1.9-2.1 parts of nickel, 0.8-1.2 parts of aluminum and greater than 0 and less than 0.06 parts of cerium.
4. The composite refining method for preparing a manganese-copper alloy having high conductivity according to claim 1, characterized in that: Place the copper in a vacuum furnace at 1600±100℃ and vacuum degree ≤10 -3 Pure copper is smelted under Pa conditions.
5. The composite refining method for preparing a manganese-copper alloy having high conductivity according to claim 1, wherein: After the pure copper is smelted, manganese, iron and nickel are added in sequence, and electromagnetic stirring is carried out at a frequency of 50 Hz at 1450°C for 25-35 minutes.
6. The composite refining method for preparing a manganese-copper alloy having high conductivity according to claim 1, characterized in that: Aluminum and cerium were added and ultrasonic vibration was carried out at a power of 5 kW and a frequency of 20 kHz for 10 minutes under argon protection.
7. The composite refining method for preparing a manganese-copper alloy having high conductivity according to claim 1, characterized in that: The multi-stage aging treatment includes: Primary aging treatment: After solution treatment, keep the temperature at 490-510℃ for 1 hour to promote the initial precipitation of iron-nickel-aluminum phase; Secondary aging treatment: After the primary aging treatment, the steel is kept at 345-355°C for 4 hours to drive the precipitation of manganese in the form of nanoclusters.
8. The composite refining method for preparing a manganese-copper alloy having high conductivity according to claim 1, characterized in that: The rolling deformation amount of the cold rolling deformation is 55-62%, and the cold rolling temperature is 190-210°C.
9. A manganese-copper alloy with high electrical conductivity, characterized in that: A manganese-copper alloy obtained by the refining preparation method according to any one of claims 1 to 8.