PCB, electroplating device and electroplating method thereof

Abstract

The invention discloses a PCB, an electroplating device and an electroplating method thereof, and belongs to the technical field of PCB production, the PCB comprises a PCB body, the PCB body is composed of a PCB substrate and a copper-clad plate, a positioning mounting port is arranged above the PCB substrate, and wave sawtooth resonance layers are arranged on the PCB substrate at two sides of the positioning mounting port; the copper-clad plates are distributed on the two sides of the PCB substrate, and the size of the PCB substrate is larger than that of the copper-clad plates. The PCB is designed according to the current electroplating process, the PCB substrate is assembled with the assembly frame through the positioning mounting opening formed in the PCB substrate, the assembly frame is matched with the combined U-shaped outer frame, the PCB is borne in the electroplating process, the wave sawtooth resonance layer arranged on the PCB substrate is used for generating vibration on the PCB, and therefore the vibration of the PCB in the electroplating process is reduced, and the service life of the PCB is prolonged. Therefore, the attached liquid attached to the PCB body can slide down quickly, it is ensured that the attached liquid can be eliminated quickly, and the air control strip is started automatically, so that the effects of automatically cleaning the residual attached liquid and drying the PCB are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB production, and in particular to a PCB board, an electroplating device and an electroplating method thereof. Background Art

[0002] The PCB copper electroplating process includes four main steps: pretreatment, activation, electroplating, and post-treatment. Using electrochemical principles, a copper layer is deposited in an electrolyte solution, forming a uniform conductive layer that connects various components and circuits. However, when electroplating a PCB, a large amount of residual liquid remains on the surface of the circuit board after it is removed from the plating tank. This liquid automatically flows downward under the influence of gravity, causing uneven plating across the PCB. Some of this liquid can also migrate with the plated board into subsequent plating tanks, affecting the quality of the chemical solution within the tank. Furthermore, after prolonged use, the current electroplating solution inevitably forms an oil film (an adherent film) on its surface. This film adheres to the PCB when it is placed in the plating tank, affecting the plating effect within the tank. Therefore, a PCB, electroplating apparatus, and electroplating method are proposed. Summary of the Invention

[0003] The present invention aims to solve the problem in the prior art that, after long-term use, a layer of adhesion film inevitably forms on the surface of the current electroplating solution. When the PCB board is placed in the plating tank, the adhesion film on the surface will adhere to the PCB board, thereby affecting the electroplating effect of the PCB board in the plating tank. The present invention provides a PCB board, an electroplating device and an electroplating method thereof.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions: A PCB board, an electroplating device, and an electroplating method thereof, comprising a PCB board body, the PCB board body being composed of a PCB substrate and a copper-clad plate, a positioning and mounting opening being provided above the PCB substrate, and a wave sawtooth resonance layer being provided on the PCB substrate on both sides of the positioning and mounting opening; The copper clad plates are distributed on both sides of the PCB substrate, and the PCB substrate is larger than the copper clad plates.

[0005] A PCB electroplating device includes a U-shaped movable frame suspended on a movable frame, wherein both ends of the U-shaped movable frame are connected to a combined U-shaped outer frame via a damping shaft, an assembly port adapted to the PCB substrate is provided on the combined U-shaped outer frame, a wave resistance strip adapted to the wave sawtooth resonance layer is provided on the inner wall of the assembly port, an assembly frame is detachably installed in the assembly port, a magnetic control drive component for controlling the movement of the assembly frame is provided in the combined U-shaped outer frame, an air collecting hood is provided on the combined U-shaped outer frame, an inner wall of the air collecting hood is connected to an air control strip via a self-adjusting connector, and a floating control for controlling the air control strip for adaptive adjustment is provided on the inner wall of the air collecting hood.

[0006] Preferably, the assembly frame is adapted to the assembly opening, and a movable clamping piece for docking with the assembly opening is provided on the assembly frame; The movable clamping piece includes a movable opening opened on the assembly frame, and two inclined surface clamping blocks arranged back to back are slidably provided on the inner wall of the movable opening. The inclined surface clamping blocks are connected to the inner wall of the movable opening through a connecting spring.

[0007] Preferably, the magnetic control drive assembly includes a magnetic control cavity plate arranged on a combined U-shaped outer frame, a linkage control movable plate is arranged inside the magnetic control cavity plate, a magnetic repulsion magnet is arranged at the bottom of the linkage control movable plate, and an electromagnetic seat that repeles the magnetic force of the magnetic repulsion magnet is arranged at the bottom of the magnetic control cavity plate.

[0008] Preferably, the side wall of the joint control movable plate is provided with multiple connecting columns, the ends of the connecting columns pass through the assembly port and are connected to multiple load-bearing carrying parts, the lengths of the multiple load-bearing carrying parts gradually increase from bottom to top, and the assembly frame is provided with multiple load-bearing docking interfaces that are compatible with the load-bearing carrying parts.

[0009] Preferably, the self-adjusting connecting member includes an inner shaft column connected to the wind control strip, an outer shaft seat is provided on the wind collecting cover, an air supply pipe is provided at one end of the outer shaft seat, and the inner shaft column and the outer shaft seat ends are both provided with mutually compatible fan-shaped docking interfaces.

[0010] Preferably, the float control unit includes a rectangular sliding frame that is slidably connected to the inner wall of the wind collecting hood through a vertical sliding block. The rectangular sliding frame is sleeved on the outer wall of the wind control strip. A buoyancy layer is provided at the bottom of the rectangular sliding frame, and a counterweight block is provided at the top of the wind control strip.

[0011] An electroplating method comprises the following steps: S1. Material preparation and loading: Prepare the PCB board body, control the combined U-shaped outer frame to be in a horizontal state, first install the PCB board body and the assembly frame, then install the assembled assembly frame into the assembly opening on the combined U-shaped outer frame, and rotate the combined U-shaped outer frame to a vertical state to complete the loading; S2. PCB board pretreatment: The PCB boards installed on the combined U-shaped external frame are controlled by the mobile rack to enter the cleaning and pickling tanks for pretreatment in sequence; S3. Cleaning and drying process: After the PCB is taken out of the pickling tank, the wind control strips controlled by the floating controls on both sides will automatically adjust their angles to dry the residual liquid on the PCB in the middle. S4, PCB electroplating: The PCB boards installed on the combined U-shaped outer frame are controlled by the mobile rack to enter the tinning and electroplating processes in sequence.

[0012] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention is designed for PCBs in response to current electroplating processes. The PCBs are assembled with an assembly frame through positioning and mounting openings provided on the PCB substrate. The assembly frame cooperates with a modular U-shaped external frame to support the PCB during the electroplating process. Furthermore, the wavy sawtooth resonance layer provided on the PCB substrate vibrates the PCB, thereby facilitating the rapid shedding of liquid attached to the PCB body, ensuring rapid removal of the attached liquid.

[0013] 2. The present invention ensures the drying angle of the PCB board by setting an inward-inclined wind control strip. In addition, when the PCB board is close to the plating liquid surface during electroplating, the wind force generated will blow the attached film on the plating liquid surface, thereby effectively preventing the PCB board from adhering to the attached film. After electroplating, the wind control strip can be automatically opened to automatically clean the residual attached liquid and dry the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic structural diagram of a PCB board proposed by the present invention; Figure 2 This is a schematic diagram of the assembly structure of a PCB electroplating device proposed by the present invention; Figure 3 This is a schematic diagram of the installation structure of a PCB electroplating device proposed by the present invention; Figure 4 This is a schematic diagram of the structure inside the air collecting cover of a PCB electroplating device proposed by the present invention; Figure 5 This is a schematic structural diagram of an assembly frame in a PCB electroplating device proposed by the present invention; Figure 6 This is a schematic structural diagram of a cross-section of a magnetron cavity plate in a PCB electroplating device proposed by the present invention; Figure 7 The figure is a schematic structural diagram of a movable clamping component in a PCB electroplating device proposed by the present invention.

[0015] In the figure: 1. PCB substrate; 2. Copper clad laminate; 3. Positioning and mounting port; 4. Wave sawtooth resonance layer; 5. U-shaped movable frame; 6. Damping shaft; 7. Combined U-shaped outer frame; 8. Assembly port; 9. Wave resistance strip; 10. Assembly frame; 11. Wind collecting cover; 12. Wind control strip; 13. Movable clip; 14. Magnetic control cavity plate; 15. Joint control movable plate; 16. Magnetic repulsion magnet; 17. Electromagnetic seat; 18. Carrying part; 19. Carrying docking port; 20. Inner shaft column; 21. Outer shaft seat; 22. Fan-shaped docking port; 23. Vertical sliding block; 24. Rectangular sliding frame; 25. Buoyancy layer; 26. Counterweight. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0017] In the description of the present invention, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0018] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "mounted / connected," and "connected" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention in specific circumstances.

[0019] Example, see Figures 1 to 7 A PCB board, an electroplating device and an electroplating method thereof include a PCB board body, which is composed of a PCB substrate 1 and a copper-clad laminate 2. A positioning and mounting opening 3 is provided above the PCB substrate 1, and a wavy sawtooth resonance layer 4 is provided on the PCB substrate 1 on both sides of the positioning and mounting opening 3; the copper-clad laminate 2 is distributed on both sides of the PCB substrate 1, and the PCB substrate 1 is larger than the copper-clad laminate 2.

[0020] The positioning and mounting opening 3 and the wavy sawtooth resonance layer 4 are both arranged at positions not covered by the copper-clad plate 2. They are pre-designed during the pressing and manufacturing of the PCB board to ensure the later use effect. After the electroplating is completed, they can be cut by cutting equipment to meet the subsequent processing and use.

[0021] A PCB electroplating device includes a U-shaped movable frame 5 suspended on a movable frame. The movable frame is mounted on an existing movable bracket. This is prior art and will not be described in detail here. The U-shaped movable frame 5 is connected to a combined U-shaped outer frame 7 at both ends via a damping shaft 6. The combined U-shaped outer frame 7 is provided with an assembly port 8 adapted to the PCB substrate 1. The inner wall of the assembly port 8 is provided with a wave-resistant strip 9 adapted to the wave-serrated resonance layer 4. It should be noted that the wave friction strips 9 and the wave sawtooth resonance layer 4 provided on the PCB substrate 1 work together. When the assembly frame 10 is driven up and down by the magnetron drive component, the PCB substrate 1 will vibrate under the action of the wave friction strips 9 and the wave sawtooth resonance layer 4, which is conducive to quickly sliding off the attached liquid attached to the PCB board body, ensuring that the attached liquid can be quickly eliminated.

[0022] An assembly frame 10 is detachably mounted in the assembly opening 8. Furthermore, the assembly frame 10 is adapted to the assembly opening 8. A movable clamping member 13 for docking and positioning the assembly opening 3 is provided on the assembly frame 10. The movable clip 13 includes a movable opening on the assembly frame 10, and two inclined blocks set back to back are slidably provided on the inner wall of the movable opening. The inclined blocks are connected to the inner wall of the movable opening through a connecting spring. The setting of the movable clip 13 can meet the needs of docking with the positioning installation opening 3 to achieve the effect of fixing the PCB board body.

[0023] A magnetic control drive component for controlling the movement of the assembly frame 10 is provided in the combined U-shaped outer frame 7. Furthermore, the magnetic control drive component includes a magnetic control cavity plate 14 arranged on the combined U-shaped outer frame 7, a joint control movable plate 15 is provided in the magnetic control cavity plate 14, a magnetic repulsion magnet 16 is provided at the bottom of the joint control movable plate 15, an electromagnetic seat 17 that magnetically repels the magnetic repulsion magnet 16 is provided at the bottom of the magnetic control cavity plate 14, a plurality of connecting columns are provided on the side wall of the joint control movable plate 15, the ends of the connecting columns pass through the assembly port 8, and are connected to a plurality of load-bearing carrying members 18, the lengths of the plurality of load-bearing carrying members 18 gradually increase from bottom to top, and a plurality of load-bearing docking interfaces 19 that are compatible with the load-bearing carrying members 18 are provided on the assembly frame 10.

[0024] The advantage of adopting the above structure is that when the electromagnetic base 17 is intermittently powered, the repulsive magnet 16, which is magnetically repelled by it, will drive the linked control movable plate 15 to move up and down, thereby causing its carrying member 18 to drive the assembly frame 10 to move. During the movement, the PCB substrate 1 is vibrated under the action of the wave resistance strip 9 and the wave sawtooth resonance layer 4, which is conducive to quickly sliding off the attached liquid attached to the PCB board body, ensuring that the attached liquid can be quickly eliminated.

[0025] A wind collecting hood 11 is provided on the combined U-shaped outer frame 7, and the inner wall of the wind collecting hood 11 is connected to the wind control strip 12 through a self-adjusting connector. Furthermore, the self-adjusting connector includes an inner shaft column 20 connected to the wind control strip 12, and an outer shaft seat 21 is provided on the wind collecting hood 11. An air supply pipe is provided at one end of the outer shaft seat 21, and the air supply pipe is connected to high-pressure gas. The ends of the inner shaft column 20 and the outer shaft seat 21 are both provided with fan-shaped docking interfaces 22 that are compatible with each other.

[0026] It should be noted that the fan-shaped docking port 22 can only transport the gas in the air supply pipe to the wind control strip 12 when it is aligned, so as to realize the clean and dry treatment of the PCB board mainboard. When the fan-shaped docking port 22 is not aligned, no air is discharged. In this solution, when the wind control strip 12 is in a vertical state, the fan-shaped docking port 22 is in a dislocated state and cannot realize air supply. When the wind control strip 12 is tilted downward, it can realize air discharge, thereby ensuring that there is no wind in the plating tank, ensuring the contact between the plating liquid and the PCB board mainboard, and automatically turning on the air discharge after taking it out of the plating tank, so as to realize the cleaning and drying of the attached liquid on the PCB board mainboard.

[0027] Prepare the PCB board body, control the combined U-shaped outer frame 7 to be in a horizontal state, first install the PCB board body with the assembly frame 10, then install the assembled assembly frame 10 into the assembly opening 8 on the combined U-shaped outer frame 7, and rotate the combined U-shaped outer frame 7 to a vertical state to complete the loading; The PCBs mounted on the combined U-shaped outer frame 7 are sequentially moved into the cleaning and pickling tanks for pre-treatment via the mobile rack. After the PCBs are removed from the pickling tank, the air control strips 12 controlled by the floating controls on both sides automatically adjust their angles to air dry any residual liquid on the PCBs in the middle. The PCB boards mounted on the combined U-shaped outer frame 7 are controlled by the mobile frame to enter the tinning and electroplating processes in sequence.

[0028] The inner wall of the wind collecting hood 11 is provided with a floating control unit for controlling the wind control strip 12 for adaptive adjustment. The floating control unit includes a rectangular sliding frame 24 that is slidably connected to the inner wall of the wind collecting hood 11 through a vertical sliding block 23. The rectangular sliding frame 24 is sleeved on the outer wall of the wind control strip 12. A buoyancy layer 25 is provided at the bottom of the rectangular sliding frame 24, and a counterweight block 26 is provided at the top of the wind control strip 12.

[0029] It should be noted that, under the action of the counterweight 26, the wind control strip 12 is not limited by the rectangular sliding frame 24, and is in an inwardly tilted state, thereby ensuring the drying angle of the PCB board main board, and in a downwardly tilted state. When electroplating, when the PCB board is close to the plating liquid surface, the wind force generated will blow the attached film on the surface of the plating liquid, thereby effectively preventing the PCB board from adhering to the attached film. After electroplating, the wind control strip 12 can be automatically opened to automatically clean the residual attached liquid and dry the PCB board.

[0030] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A PCB board, comprising a PCB board body, characterized in that: The PCB board body is composed of a PCB substrate (1) and a copper-clad plate (2); a positioning installation opening (3) is provided above the PCB substrate (1); and wave sawtooth resonance layers (4) are provided on the PCB substrate (1) on both sides of the positioning installation opening (3); The copper-clad plates (2) are distributed on both sides of the PCB substrate (1), and the PCB substrate (1) is larger in size than the copper-clad plates (2).

2. The electroplating device for PCB board according to claim 1, characterized in that: The invention comprises a U-shaped movable frame (5) suspended on a movable frame, wherein both ends of the U-shaped movable frame (5) are connected to a combined U-shaped outer frame (7) via a damping shaft (6), an assembly port (8) adapted to a PCB substrate (1) is provided on the combined U-shaped outer frame (7), a wave resistance strip (9) adapted to a wave sawtooth resonance layer (4) is provided on the inner wall of the assembly port (8), an assembly frame (10) is detachably installed in the assembly port (8), a magnetic control drive component for controlling the assembly frame (10) to move is provided in the combined U-shaped outer frame (7), an air collecting hood (11) is provided on the combined U-shaped outer frame (7), an inner wall of the air collecting hood (11) is connected to an air control strip (12) via a self-adjusting connector, and a floating control unit for controlling the air control strip (12) to perform adaptive adjustment is provided on the inner wall of the air collecting hood (11).

3. The electroplating device according to claim 2, characterized in that: The assembly frame (10) is adapted to the assembly opening (8), and a movable clamping member (13) for docking with the positioning installation opening (3) is provided on the assembly frame (10); The movable clamping member (13) comprises a movable opening provided on the assembly frame (10), the inner wall of the movable opening being slidably provided with two inclined surface clamping blocks arranged back to back, and the inclined surface clamping blocks being connected to the inner wall of the movable opening via a connecting spring.

4. The electroplating device according to claim 3, characterized in that: The magnetic control drive assembly comprises a magnetic control cavity plate (14) arranged on a combined U-shaped outer frame (7), a joint control movable plate (15) is arranged in the magnetic control cavity plate (14), a magnetic repulsion magnet (16) is arranged at the bottom of the joint control movable plate (15), and an electromagnetic seat (17) that magnetically repels the magnetic repulsion magnet (16) is arranged at the bottom of the magnetic control cavity plate (14).

5. The electroplating device according to claim 4, characterized in that: The side wall of the joint control movable plate (15) is provided with a plurality of connecting columns, the ends of the connecting columns pass through the assembly port (8) and are connected to a plurality of load-bearing members (18), the lengths of the plurality of load-bearing members (18) gradually increasing from bottom to top, and the assembly frame (10) is provided with a plurality of load-bearing docking interfaces (19) adapted to the load-bearing members (18).

6. The electroplating device according to claim 5, characterized in that: The self-adjusting connecting member comprises an inner shaft column (20) connected to the wind control strip (12); an outer shaft seat (21) is provided on the wind collecting cover (11); an air supply pipe is provided at one end of the outer shaft seat (21); and fan-shaped docking ports (22) that are adapted to each other are provided at the ends of the inner shaft column (20) and the outer shaft seat (21).

7. The electroplating device according to claim 6, characterized in that: The floating control unit comprises a rectangular sliding frame (24) slidably connected to the inner wall of the wind collecting cover (11) via a vertical sliding block (23); the rectangular sliding frame (24) is sleeved on the outer wall of the wind control strip (12); a buoyancy layer (25) is provided at the bottom of the rectangular sliding frame (24); and a counterweight block (26) is provided at the top of the wind control strip (12).

8. The electroplating method according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1. Material preparation and loading: Prepare the PCB board body, control the combined U-shaped outer frame (7) to be in a horizontal state, first install the PCB board body and the assembly frame (10), then install the assembled assembly frame (10) in the assembly opening (8) on the combined U-shaped outer frame (7), and rotate the combined U-shaped outer frame (7) to a vertical state to complete the loading; S2, PCB board pretreatment: The PCB boards installed on the combined U-shaped outer frame (7) are controlled by the mobile frame to enter the cleaning and pickling tanks for pretreatment in sequence; S3, cleaning and drying treatment: After the PCB board body is taken out from the pickling tank, the wind control strips (12) controlled by the floating controls on both sides will automatically adjust the angle to air dry the residual liquid on the PCB board in the middle; S4, PCB electroplating: The PCB boards mounted on the combined U-shaped outer frame (7) are controlled by the mobile frame to enter the tinning and electroplating processes in sequence.

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