Concrete MiC modular connection analysis system and deformation monitoring method

Abstract

The invention discloses a concrete MiC modular connection analysis system and a deformation monitoring method, relates to the field of constructional engineering, and solves the problem that an existing concrete MiC modular structure system is poor in monitoring effect. The data analysis module is used for setting a plurality of temperature test scenes, carrying out connection point deformation monitoring on a target integrated building model in each temperature test scene, and carrying out installation coordinate deviation analysis on each module connection area so as to obtain connection point initial monitoring data, and the data analysis module is used for setting a plurality of temperature test scenes and carrying out connection point deformation monitoring on the target integrated building model in each temperature test scene; the connection evaluation module is used for carrying out connection stability evaluation on the concrete MiC corresponding to the target integrated building model according to the connection point deformation monitoring data, and the comprehensiveness and accuracy of concrete MiC connection point deformation monitoring can be improved.

Description

Technical Field

[0001] The present invention belongs to the field of construction engineering and relates to MiC technology, specifically a concrete MiC modular connection analysis system and a deformation monitoring method. Background Art

[0002] The existing concrete MiC modular structure system has the following specific defects when monitoring the module connection quality:

[0003] 1. The existing concrete MiC modular structure system is unable to perform three-dimensional modeling of the concrete MiC, nor can it create a spatial coordinate system to monitor the installation position deviation of each connection point, resulting in a lack of comprehensiveness in the connection point stability monitoring results;

[0004] 2. The existing concrete MiC cannot set up several temperature test scenarios for the three-dimensional modeling of concrete MiC, and cannot monitor the connection point deformation of the target integrated building model in each temperature test scenario. Therefore, it is difficult to monitor the deformation deviation of concrete MiC under different temperature environments, resulting in a lack of accuracy in the connection point stability monitoring results.

[0005] To this end, we propose a concrete MiC modular connection analysis system and deformation monitoring method. Summary of the Invention

[0006] In view of the shortcomings of the existing technology, the purpose of the present invention is to provide a concrete MiC modular connection analysis system and deformation monitoring method, which aims to improve the comprehensiveness and accuracy of concrete MiC connection point deformation monitoring.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a concrete MiC modular connection analysis system, the specific working process of each module is as follows:

[0008] Data acquisition module: used to obtain the target integrated building model and acquire the connection area of each module in the target integrated building model, create an integrated building space coordinate system, perform installation coordinate deviation analysis on each module connection area, and obtain preliminary monitoring data of the connection point based on the analysis results;

[0009] Data analysis module: used to set up several temperature test scenarios for the target integrated building model, monitor the deformation of the connection points of the target integrated building model in each temperature test scenario based on the preliminary monitoring data of the connection points, and obtain the connection point deformation monitoring data based on the monitoring results;

[0010] Connection evaluation module: used to evaluate the connection stability of the concrete MiC corresponding to the target integrated building model based on the connection point deformation monitoring data.

[0011] Furthermore, preliminary monitoring data of the connection points are obtained, as follows:

[0012] The concrete MiC is modeled to obtain a modular integrated building model, which is named the target integrated building model.

[0013] Create a spatial coordinate system in the target integrated building model to obtain the integrated building spatial coordinate system;

[0014] Acquire multiple module connection areas existing in the target integrated building model, and arbitrarily select a sample module connection area from the acquired multiple module connection areas;

[0015] Perform installation error analysis on the building connection points in the sample module connection area, and obtain connection point coordinate deviation data corresponding to the sample module connection area based on the analysis results;

[0016] The coordinate deviation data of the connection points corresponding to each module connection area is obtained to obtain preliminary monitoring data of the connection points.

[0017] Furthermore, the integrated building space coordinate system is created as follows:

[0018] A feature point is randomly selected on the ground of the target integrated building model as the coordinate origin, and the plane where the ground of the target integrated building model is located is marked as the first building plane. In the first building plane, an arbitrary straight line is drawn through the coordinate origin to obtain the first building line, and a straight line perpendicular to the first building line is drawn through the coordinate origin to obtain the second building line;

[0019] Draw a plane perpendicular to the first building plane through the first building line to obtain a second building plane. In the second building plane, draw a line perpendicular to the first building line through the coordinate origin to obtain a third building line. Label the first building line as the coordinate x-axis, the second building line as the coordinate y-axis, and the third building line as the coordinate z-axis.

[0020] The spatial coordinate system determined by the coordinate origin, the coordinate x-axis, the coordinate y-axis and the coordinate z-axis is marked as the integrated building spatial coordinate system.

[0021] Furthermore, the connection point coordinate deviation data is obtained as follows:

[0022] Randomly select several building connection points in the sample module connection area, and mark the obtained building connection points as L1 building connection point to La building connection point respectively;

[0023] When the target integrated building model is in a reference temperature environment, the three-dimensional coordinate values of the L1 building connection point to the La building connection point in the integrated building space coordinate system are obtained respectively, and the actual coordinates of the L1 connection point and the La connection point are obtained;

[0024] Obtaining a building BIM model corresponding to the target integrated building model, creating a spatial coordinate system in the building BIM model that has the same relative position as the integrated building spatial coordinate system, and obtaining a BIM spatial coordinate system;

[0025] According to the building BIM model, the coordinate values of the L1 building connection point to the La building connection point in the BIM space coordinate system are obtained respectively, and the preset coordinates of the L1 connection point to the La connection point are obtained;

[0026] Calculate the actual coordinates of the L1 connection point and the preset coordinates of the L1 connection point to obtain the L1 installation coordinate deviation;

[0027] Obtain the installation coordinate deviations corresponding to the L2 building connection point and the La building connection point respectively, and obtain the L2 installation coordinate deviation and the La installation coordinate deviation;

[0028] The L1 installation coordinate deviation to the La installation coordinate deviation is defined as the connection point coordinate deviation data corresponding to the sample module connection area.

[0029] Furthermore, the L1 installation coordinate deviation is obtained as follows:

[0030] The actual coordinates of the L1 connection point and the preset coordinates of the L1 connection point are calculated to obtain the installation coordinate deviation corresponding to the L1 building connection point, and the deviation is named L1 installation coordinate deviation;

[0031] Calculate the L1 installation coordinate deviation.

[0032] Furthermore, the deformation monitoring data of the connection points is obtained as follows:

[0033] During the test of the target integrated building model, several temperature monitoring periods of the same length are marked, and the marked periods are marked as D1 temperature monitoring period to Db temperature monitoring period in chronological order;

[0034] When the target integrated building model is in the D1 temperature monitoring period, the ambient temperature of the target integrated building model is adjusted to the T1 characteristic temperature, and the end interpretation time value corresponding to the D1 temperature monitoring period is marked as the D1 characteristic time point;

[0035] When the target integrated building model is in the D2 temperature monitoring period, the ambient temperature of the target integrated building model is adjusted to the T2 characteristic temperature, and the end interpretation time value corresponding to the D2 temperature monitoring period is marked as the D2 characteristic time point;

[0036] Similarly, when the target integrated building model is in the Db temperature monitoring period, the ambient temperature of the target integrated building model is adjusted to the Tb characteristic temperature, and the end interpretation time value corresponding to the Db temperature monitoring period is marked as the Db characteristic time point;

[0037] Obtaining preliminary monitoring data of the connection points, and obtaining connection point coordinate deviation data corresponding to the connection area of the sample module based on the preliminary monitoring data of the connection points;

[0038] The connection point deformation of the sample module connection area is monitored according to the connection point coordinate deviation data to obtain the deformation monitoring coefficient corresponding to the sample module connection area;

[0039] Repeat the process of obtaining the deformation monitoring coefficient corresponding to the connection area of the sample module, obtain the deformation monitoring coefficient corresponding to each module connection area respectively, and obtain the connection point deformation monitoring data.

[0040] Furthermore, the deformation monitoring coefficient is obtained as follows:

[0041] The deformation of the connection area of the sample module during the D1 temperature monitoring period is monitored to obtain the deformation deviation at the D1 moment;

[0042] Obtain the deformation deviation of the sample module connection area at the time corresponding to the feature time point D2 to the feature time point Db, and obtain the deformation deviation from the time D2 to the time Db;

[0043] Acquire the ambient temperature value corresponding to the reference temperature environment to obtain the ambient reference temperature value;

[0044] Obtain the difference between the characteristic temperature T1 and the characteristic temperature Tb and the ambient reference temperature value respectively, and take the absolute value of the obtained multiple temperature differences to obtain the characteristic temperature deviation T1 to the characteristic temperature deviation Tb;

[0045] The deformation monitoring coefficient corresponding to the connection area of the sample module is obtained by calculating the deformation deviation at time D1 to the deformation deviation at time Db and the characteristic temperature deviation at T1 to the characteristic temperature deviation at Tb;

[0046] Calculate the deformation monitoring coefficient corresponding to the connection area of the sample module;

[0047] Repeat the process of obtaining the deformation monitoring coefficient corresponding to the connection area of the sample module, obtain the deformation monitoring coefficient corresponding to each module connection area respectively, and obtain the connection point deformation monitoring data.

[0048] Furthermore, the deformation deviation at time D1 is obtained as follows:

[0049] According to the connection point coordinate deviation data, the installation coordinate deviations corresponding to the L1 building connection point and the La building connection point are obtained respectively, and the L1 installation coordinate deviation and the La installation coordinate deviation are obtained;

[0050] Obtain the installation coordinate deviation corresponding to the L1 building connection point to the La building connection point at the D1 feature time point, and obtain the L1 monitoring coordinate deviation to the La monitoring coordinate deviation;

[0051] Obtain the L1 installation coordinate deviation to the La installation coordinate deviation, calculate the difference between the L1 monitoring coordinate deviation and the L1 installation coordinate deviation, and take the absolute value of the difference to obtain the L1 deformation deviation, calculate the difference between the L2 monitoring coordinate deviation and the L2 installation coordinate deviation, and take the absolute value of the difference to obtain the L2 deformation deviation, and so on, calculate the difference between the La monitoring coordinate deviation and the La installation coordinate deviation, and take the absolute value of the difference to obtain the La deformation deviation;

[0052] The deformation deviation at time D1 is obtained by averaging the deformation deviations from L1 to La.

[0053] Furthermore, the connection stability of the concrete MiC corresponding to the target integrated building model is evaluated as follows:

[0054] Obtaining connection point deformation monitoring data, obtaining the deformation monitoring coefficient corresponding to each module connection area based on the connection point deformation monitoring data, and averaging the obtained multiple deformation monitoring coefficients to obtain the average deformation monitoring coefficient corresponding to the target integrated building model;

[0055] Obtain the preset qualified interval of the deformation monitoring coefficient. If the average value of the deformation monitoring coefficient is within the preset qualified interval of the deformation monitoring coefficient, then the concrete MiC connection stability corresponding to the target integrated building model is judged to be qualified. If the average value of the deformation monitoring coefficient is not within the preset qualified interval of the deformation monitoring coefficient, then the concrete MiC connection stability corresponding to the target integrated building model is judged to be unqualified.

[0056] A method for monitoring deformation of a concrete MiC module, comprising:

[0057] Step S1: Obtain the target integrated building model, and obtain each module connection area in the target integrated building model, create an integrated building space coordinate system, perform installation coordinate deviation analysis on each module connection area, and obtain preliminary monitoring data of the connection points based on the analysis results;

[0058] Step S2: setting a number of temperature test scenarios for the target integrated building model, performing connection point deformation monitoring on the target integrated building model in each temperature test scenario based on the preliminary connection point monitoring data, and obtaining connection point deformation monitoring data based on the monitoring results;

[0059] Step S3: Evaluate the connection stability of the concrete MiC corresponding to the target integrated building model based on the connection point deformation monitoring data.

[0060] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0061] 1. The present invention can improve the stability of connection points by performing three-dimensional modeling on concrete MiC and creating a spatial coordinate system to monitor the installation position deviation of each connection point, which is not comprehensive enough.

[0062] 2. The present invention sets up several temperature test scenarios for the three-dimensional modeling of concrete MiC, and monitors the connection point deformation of the target integrated building model in each temperature test scenario. This can effectively monitor the deformation deviation of concrete MiC under different temperature environments and improve the accuracy of the connection point stability monitoring results. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] To facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0064] Figure 1 is a block diagram of the overall system of the present invention;

[0065] Figure 2 It is a diagram of the implementation steps of the present invention;

[0066] Figure 3 Schematic diagram of the integrated building space coordinate system in the present invention. DETAILED DESCRIPTION

[0067] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0068] Example 1

[0069] See also Figure 1 The present invention provides a technical solution: a concrete MiC modular connection analysis system, comprising a data acquisition module, a data analysis module, a connection evaluation module and a server, wherein the data acquisition module, the strength data module and the connection evaluation module are respectively connected to the server, and the server controls the data acquisition module, the strength data module and the connection evaluation module respectively;

[0070] The data acquisition module obtains the target integrated building model and acquires the connection area of each module in the target integrated building model, creates an integrated building space coordinate system, performs installation coordinate deviation analysis on each module connection area, and obtains preliminary monitoring data of the connection points based on the analysis results;

[0071] The concrete MiC is modeled to obtain a modular integrated building model, which is named the target integrated building model.

[0072] It should be noted here that:

[0073] The concrete MiC involved here refers specifically to concrete modular integrated buildings;

[0074] The target integrated building model involved herein is specifically a scaled-down building model of a concrete modular integrated building for connection point error monitoring in this application;

[0075] See also Figure 3 , randomly select a feature point on the ground of the target integrated building model as the coordinate origin, and mark the plane where the ground of the target integrated building model is located as the first building plane. In the first building plane, draw an arbitrary straight line through the coordinate origin to obtain the first building line, and draw a straight line perpendicular to the first building line through the coordinate origin to obtain the second building line;

[0076] Draw a plane perpendicular to the first building plane through the first building line to obtain a second building plane. In the second building plane, draw a line perpendicular to the first building line through the coordinate origin to obtain a third building line. Label the first building line as the coordinate x-axis, the second building line as the coordinate y-axis, and the third building line as the coordinate z-axis.

[0077] The spatial coordinate system determined by the coordinate origin, the coordinate x-axis, the coordinate y-axis and the coordinate z-axis is marked as the integrated building spatial coordinate system;

[0078] Acquire multiple module connection areas existing in the target integrated building model, and arbitrarily select a sample module connection area from the acquired multiple module connection areas;

[0079] Perform installation error analysis on the building connection points in the sample module connection area, and obtain connection point coordinate deviation data corresponding to the sample module connection area based on the analysis results;

[0080] The details are as follows:

[0081] Randomly select several building connection points in the sample module connection area, and mark the obtained building connection points as L1 building connection point to La building connection point respectively;

[0082] It should be noted here that:

[0083] In the present application, L referred to herein is the sign symbol corresponding to the building connection point, a referred to herein is the quantity value corresponding to the building connection point, and a is an integer greater than 0.

[0084] When the target integrated building model is in a reference temperature environment, the three-dimensional coordinate values of the L1 building connection point to the La building connection point in the integrated building space coordinate system are obtained respectively, and the actual coordinates of the L1 connection point and the La connection point are obtained;

[0085] It should be noted here that:

[0086] In this application, the reference temperature environment referred to herein is specifically the standard temperature condition used in the design and analysis of the prototype building corresponding to the target integrated building model. The reference temperature environment provides a unified reference benchmark for the performance evaluation of structures, materials, and building systems.

[0087] Obtaining a building BIM model corresponding to the target integrated building model, creating a spatial coordinate system in the building BIM model that has the same relative position as the integrated building spatial coordinate system, and obtaining a BIM spatial coordinate system;

[0088] It should be noted here that:

[0089] In this application, the spatial ratio of the building BIM model involved here and the target integrated building model is 1:1;

[0090] In this application, the building BIM model involved here is the spatial modeling of the prototype building corresponding to the target integrated building model. The building BIM model integrates the preset installation positions of different components of the prototype building.

[0091] According to the building BIM model, the coordinate values of the L1 building connection point to the La building connection point in the BIM space coordinate system are obtained respectively, and the preset coordinates of the L1 connection point to the La connection point are obtained;

[0092] The actual coordinates of the L1 connection point and the preset coordinates of the L1 connection point are calculated to obtain the installation coordinate deviation corresponding to the L1 building connection point, and the deviation is named L1 installation coordinate deviation;

[0093] Calculate the L1 installation coordinate deviation. The specific formula is as follows:

[0094]

[0095] Among them, Lpy1 is the L1 installation coordinate deviation, (x s1 ,y s1 ,z s1 ) is the actual coordinate of the L1 connection point, (x y1 ,y y1 ,z y1 ) is the actual coordinate of the L1 connection point;

[0096] It should be noted here that:

[0097] In the specific implementation, there are the following experimental data:

[0098] The actual coordinates of the L1 connection point are (34, 56, 65), and the actual coordinates of the L1 connection point are (35, 58, 65). It can be calculated that the L1 installation coordinate deviation is 2.24cm;

[0099] The actual coordinates of the L2 connection point are (38, 66, 65), and the actual coordinates of the L2 connection point are (35, 67, 65). The calculated deviation of the L2 installation coordinates is 3.16 cm;

[0100] The actual coordinates of the L3 connection point are (77, 66, 65), and the actual coordinates of the L2 connection point are (75, 64, 69). It can be calculated that the L2 installation coordinate deviation is 4.90 cm.

[0101] Repeat the process of obtaining the installation coordinate deviation corresponding to the L1 building connection point, and obtain the installation coordinate deviation corresponding to the L2 building connection point to the La building connection point, and obtain the L2 installation coordinate deviation to the La installation coordinate deviation;

[0102] The L1 installation coordinate deviation to the La installation coordinate deviation is defined as the connection point coordinate deviation data corresponding to the sample module connection area;

[0103] Repeat the process of obtaining the connection point coordinate deviation data corresponding to the sample module connection area, and obtain the connection point coordinate deviation data corresponding to each module connection area respectively to obtain the preliminary monitoring data of the connection point;

[0104] The data acquisition module acquires preliminary monitoring data of the connection points and transmits it to the data analysis module;

[0105] The data analysis module sets up several temperature test scenarios for the target integrated building model, monitors the deformation of the connection points of the target integrated building model in each temperature test scenario based on the preliminary monitoring data of the connection points, and obtains the connection point deformation monitoring data based on the monitoring results;

[0106] The details are as follows:

[0107] During the test of the target integrated building model, several temperature monitoring periods of the same length are marked, and the marked periods are marked as D1 temperature monitoring period to Db temperature monitoring period in chronological order;

[0108] It should be noted here that:

[0109] In this application, D is the symbol corresponding to the temperature monitoring period, b is the number value corresponding to the temperature monitoring period, and b is an integer greater than 0;

[0110] When the target integrated building model is in the D1 temperature monitoring period, the ambient temperature of the target integrated building model is adjusted to the T1 characteristic temperature, and the end interpretation time value corresponding to the D1 temperature monitoring period is marked as the D1 characteristic time point;

[0111] It should be noted here that:

[0112] In this application, the T1 characteristic temperature involved here needs to be set at the start time point of the D1 temperature monitoring period.

[0113] When the target integrated building model is in the D2 temperature monitoring period, the ambient temperature of the target integrated building model is adjusted to the T2 characteristic temperature, and the end interpretation time value corresponding to the D2 temperature monitoring period is marked as the D2 characteristic time point;

[0114] Similarly, when the target integrated building model is in the Db temperature monitoring period, the ambient temperature of the target integrated building model is adjusted to the Tb characteristic temperature, and the end interpretation time value corresponding to the Db temperature monitoring period is marked as the Db characteristic time point;

[0115] Obtaining preliminary monitoring data of the connection points, and obtaining connection point coordinate deviation data corresponding to the connection area of the sample module based on the preliminary monitoring data of the connection points;

[0116] The connection point deformation of the sample module connection area is monitored according to the connection point coordinate deviation data to obtain the deformation monitoring coefficient corresponding to the sample module connection area;

[0117] The details are as follows:

[0118] According to the connection point coordinate deviation data, the installation coordinate deviations corresponding to the L1 building connection point and the La building connection point are obtained respectively, and the L1 installation coordinate deviation and the La installation coordinate deviation are obtained;

[0119] Obtain the installation coordinate deviation corresponding to the L1 building connection point to the La building connection point at the D1 feature time point, and obtain the L1 monitoring coordinate deviation to the La monitoring coordinate deviation;

[0120] Obtain the L1 installation coordinate deviation to the La installation coordinate deviation, calculate the difference between the L1 monitoring coordinate deviation and the L1 installation coordinate deviation, and take the absolute value of the difference to obtain the L1 deformation deviation, calculate the difference between the L2 monitoring coordinate deviation and the L2 installation coordinate deviation, and take the absolute value of the difference to obtain the L2 deformation deviation, and so on, calculate the difference between the La monitoring coordinate deviation and the La installation coordinate deviation, and take the absolute value of the difference to obtain the La deformation deviation;

[0121] The deformation deviation at time D1 is obtained by averaging the deformation deviations from L1 to La.

[0122] Repeat the process of obtaining the deformation deviation at time D1, and obtain the deformation deviation of the sample module connection area at the time corresponding to the feature time point D2 to the feature time point Db, and obtain the deformation deviation from the time D2 to the time Db;

[0123] Acquire the ambient temperature value corresponding to the reference temperature environment to obtain the ambient reference temperature value;

[0124] Obtain the difference between the characteristic temperature T1 and the characteristic temperature Tb and the ambient reference temperature value respectively, and take the absolute value of the obtained multiple temperature differences to obtain the characteristic temperature deviation T1 to the characteristic temperature deviation Tb;

[0125] The deformation monitoring coefficient corresponding to the connection area of the sample module is obtained by calculating the deformation deviation at time D1 to the deformation deviation at time Db and the characteristic temperature deviation at T1 to the characteristic temperature deviation at Tb;

[0126] The deformation monitoring coefficient corresponding to the connection area of the sample module is calculated. The specific formula is as follows:

[0127]

[0128] Among them, Xbx is the deformation monitoring coefficient corresponding to the connection area of the sample module, Pxi is the deformation deviation at time Di, Tei is the characteristic temperature deviation Ti, and b is the quantity value corresponding to the temperature monitoring period;

[0129] It should be noted here that:

[0130] In this application, there are the following experimental data:

[0131] If Px1 is 21 mm, Px2 is 24 mm, Px3 is 31 mm, Te1 is 25°C, Te2 is 15°C, and Te3 is 5°C, then Xbx can be calculated to be 0.15;

[0132] It should be noted here that:

[0133] In this application, the deformation monitoring coefficient involved here is specifically an index value that characterizes the change of the building connection points involved in the sample module connection area as the ambient temperature changes, reflecting the rate of change of deformation deviation with temperature change, and can further reflect the stability of the connection structure of the sample module connection area.

[0134] Repeat the process of obtaining the deformation monitoring coefficient corresponding to the connection area of the sample module, obtain the deformation monitoring coefficient corresponding to each module connection area respectively, and obtain the connection point deformation monitoring data;

[0135] The connection assessment module evaluates the connection stability of the concrete MiC corresponding to the target integrated building model based on the deformation monitoring data of the connection points;

[0136] The details are as follows:

[0137] Obtaining connection point deformation monitoring data, obtaining the deformation monitoring coefficient corresponding to each module connection area based on the connection point deformation monitoring data, and averaging the obtained multiple deformation monitoring coefficients to obtain the average deformation monitoring coefficient corresponding to the target integrated building model;

[0138] Obtaining a preset qualified interval for the deformation monitoring coefficient; if the average value of the deformation monitoring coefficient is within the preset qualified interval for the deformation monitoring coefficient, then determining that the concrete MiC connection stability corresponding to the target integrated building model is qualified; if the average value of the deformation monitoring coefficient is not within the preset qualified interval for the deformation monitoring coefficient, then determining that the concrete MiC connection stability corresponding to the target integrated building model is unqualified;

[0139] It should be noted here that:

[0140] In this application, the connection stability qualification mentioned herein includes the interval boundary corresponding to the preset qualified interval of the deformation monitoring coefficient;

[0141] In this application, the lower limit of the preset qualified interval of the deformation monitoring coefficient involved here is 0, that is, the target integrated building model has no deformation;

[0142] In this application, the seismic resistance of concrete MiC with qualified connection stability is higher than that of concrete MiC with unqualified connection stability.

[0143] The upper limit of the preset qualified range of the deformation monitoring coefficient is obtained as follows:

[0144] Obtain several concrete MiCs with qualified connection stability, obtain the average value of the deformation monitoring coefficient corresponding to each concrete MiC, and average the obtained multiple deformation monitoring coefficient average values to obtain the upper limit of the preset qualified range of the deformation monitoring coefficient.

[0145] In this application, if a corresponding calculation formula appears, the above calculation formula is dimensionless and its numerical calculation is performed. The weight coefficient, proportional coefficient and other coefficients in the formula are set to a result value obtained by quantifying each parameter. Regarding the size of the weight coefficient and the proportional coefficient, as long as it does not affect the proportional relationship between the parameter and the result value, it is acceptable.

[0146] Example 2

[0147] See also Figure 2 Based on another concept of the same invention, a method for monitoring deformation of a concrete MiC module is proposed, which is applied to a concrete MiC modular connection analysis system. The deformation monitoring method includes the following steps:

[0148] Step S1: Obtain the target integrated building model, and obtain each module connection area in the target integrated building model, create an integrated building space coordinate system, perform installation coordinate deviation analysis on each module connection area, and obtain preliminary monitoring data of the connection points based on the analysis results;

[0149] The step S1 further includes the following specific steps:

[0150] Step S11: Create a model for the concrete MiC to obtain a modular integrated building model, and name it the target integrated building model;

[0151] Step S11: creating a spatial coordinate system in the target integrated building model to obtain the integrated building spatial coordinate system;

[0152] The step S11 further includes the following specific steps:

[0153] A feature point is randomly selected on the ground of the target integrated building model as the coordinate origin, and the plane where the ground of the target integrated building model is located is marked as the first building plane. In the first building plane, an arbitrary straight line is drawn through the coordinate origin to obtain the first building line, and a straight line perpendicular to the first building line is drawn through the coordinate origin to obtain the second building line;

[0154] Draw a plane perpendicular to the first building plane through the first building line to obtain a second building plane. In the second building plane, draw a line perpendicular to the first building line through the coordinate origin to obtain a third building line. Label the first building line as the coordinate x-axis, the second building line as the coordinate y-axis, and the third building line as the coordinate z-axis.

[0155] The spatial coordinate system determined by the coordinate origin, the coordinate x-axis, the coordinate y-axis and the coordinate z-axis is marked as the integrated building spatial coordinate system;

[0156] Step S13: acquiring multiple module connection areas existing in the target integrated building model, and arbitrarily selecting a sample module connection area from the acquired multiple module connection areas;

[0157] Step S14: performing installation error analysis on the building connection points existing in the sample module connection area, and obtaining connection point coordinate deviation data corresponding to the sample module connection area based on the analysis results;

[0158] The step S14 further includes the following specific steps:

[0159] Randomly select several building connection points in the sample module connection area, and mark the obtained building connection points as L1 building connection point to La building connection point respectively;

[0160] When the target integrated building model is in a reference temperature environment, the three-dimensional coordinate values of the L1 building connection point to the La building connection point in the integrated building space coordinate system are obtained respectively, and the actual coordinates of the L1 connection point and the La connection point are obtained;

[0161] Obtaining a building BIM model corresponding to the target integrated building model, creating a spatial coordinate system in the building BIM model that has the same relative position as the integrated building spatial coordinate system, and obtaining a BIM spatial coordinate system;

[0162] According to the building BIM model, the coordinate values of the L1 building connection point to the La building connection point in the BIM space coordinate system are obtained respectively, and the preset coordinates of the L1 connection point to the La connection point are obtained;

[0163] Calculate the actual coordinates of the L1 connection point and the preset coordinates of the L1 connection point to obtain the L1 installation coordinate deviation;

[0164] The actual coordinates of the L1 connection point and the preset coordinates of the L1 connection point are calculated to obtain the installation coordinate deviation corresponding to the L1 building connection point, and the deviation is named L1 installation coordinate deviation;

[0165] Calculate the L1 installation coordinate deviation. The specific formula is as follows:

[0166]

[0167] Among them, Lpy1 is the L1 installation coordinate deviation, (x s1 ,y s1 ,z s1 ) is the actual coordinate of the L1 connection point, (x y1 ,y y1 ,z y1 ) is the actual coordinate of the L1 connection point;

[0168] Obtain the installation coordinate deviations corresponding to the L2 building connection point and the La building connection point respectively, and obtain the L2 installation coordinate deviation and the La installation coordinate deviation;

[0169] The L1 installation coordinate deviation to the La installation coordinate deviation is defined as the connection point coordinate deviation data corresponding to the sample module connection area;

[0170] Step S15: acquiring the connection point coordinate deviation data corresponding to each module connection area to obtain preliminary monitoring data of the connection points;

[0171] Step S2: setting a number of temperature test scenarios for the target integrated building model, performing connection point deformation monitoring on the target integrated building model in each temperature test scenario based on the preliminary connection point monitoring data, and obtaining connection point deformation monitoring data based on the monitoring results;

[0172] The step S2 further includes the following specific steps:

[0173] Step S21: During the test of the target integrated building model, a number of temperature monitoring periods of the same length are marked, and the marked periods are marked as temperature monitoring period D1 to temperature monitoring period Db in chronological order;

[0174] Step S22: When the target integrated building model is in the D1 temperature monitoring period, the ambient temperature of the target integrated building model is adjusted to the T1 characteristic temperature, and the end interpretation time value corresponding to the D1 temperature monitoring period is marked as the D1 characteristic time point;

[0175] Step S23: When the target integrated building model is in the D2 temperature monitoring period, the ambient temperature of the target integrated building model is adjusted to the T2 characteristic temperature, and the end interpretation time value corresponding to the D2 temperature monitoring period is marked as the D2 characteristic time point;

[0176] Step S24: Similarly, when the target integrated building model is in the Db temperature monitoring period, the ambient temperature of the target integrated building model is adjusted to the Tb characteristic temperature, and the end interpretation time value corresponding to the Db temperature monitoring period is marked as the Db characteristic time point;

[0177] Step S25: obtaining preliminary monitoring data of the connection points, and obtaining connection point coordinate deviation data corresponding to the connection area of the sample module according to the preliminary monitoring data of the connection points;

[0178] Step S26: performing connection point deformation monitoring on the connection area of the sample module according to the connection point coordinate deviation data to obtain a deformation monitoring coefficient corresponding to the connection area of the sample module;

[0179] The step S26 further includes the following specific steps:

[0180] According to the connection point coordinate deviation data, the installation coordinate deviations corresponding to the L1 building connection point and the La building connection point are obtained respectively, and the L1 installation coordinate deviation and the La installation coordinate deviation are obtained;

[0181] Obtain the installation coordinate deviation corresponding to the L1 building connection point to the La building connection point at the D1 feature time point, and obtain the L1 monitoring coordinate deviation to the La monitoring coordinate deviation;

[0182] Obtain the L1 installation coordinate deviation to the La installation coordinate deviation, calculate the difference between the L1 monitoring coordinate deviation and the L1 installation coordinate deviation, and take the absolute value of the difference to obtain the L1 deformation deviation, calculate the difference between the L2 monitoring coordinate deviation and the L2 installation coordinate deviation, and take the absolute value of the difference to obtain the L2 deformation deviation, and so on, calculate the difference between the La monitoring coordinate deviation and the La installation coordinate deviation, and take the absolute value of the difference to obtain the La deformation deviation;

[0183] The deformation deviation at time D1 is obtained by averaging the deformation deviations from L1 to La.

[0184] Obtain the deformation deviation of the sample module connection area at the time corresponding to the feature time point D2 to the feature time point Db, and obtain the deformation deviation from the time D2 to the time Db;

[0185] Acquire the ambient temperature value corresponding to the reference temperature environment to obtain the ambient reference temperature value;

[0186] Obtain the difference between the characteristic temperature T1 and the characteristic temperature Tb and the ambient reference temperature value respectively, and take the absolute value of the obtained multiple temperature differences to obtain the characteristic temperature deviation T1 to the characteristic temperature deviation Tb;

[0187] The deformation monitoring coefficient corresponding to the connection area of the sample module is obtained by calculating the deformation deviation at time D1 to the deformation deviation at time Db and the characteristic temperature deviation at T1 to the characteristic temperature deviation at Tb;

[0188] The deformation monitoring coefficient corresponding to the connection area of the sample module is calculated. The specific formula is as follows:

[0189]

[0190] Among them, Xbx is the deformation monitoring coefficient corresponding to the connection area of the sample module, Pxi is the deformation deviation at time Di, Tei is the characteristic temperature deviation Ti, and b is the quantity value corresponding to the temperature monitoring period;

[0191] Step S27: Obtain the deformation monitoring coefficient corresponding to each module connection area to obtain connection point deformation monitoring data;

[0192] Step S3: evaluating the connection stability of the concrete MiC corresponding to the target integrated building model based on the connection point deformation monitoring data;

[0193] The step S3 further includes the following specific steps:

[0194] Step S31: Obtaining connection point deformation monitoring data, obtaining the deformation monitoring coefficient corresponding to each module connection area based on the connection point deformation monitoring data, and averaging the obtained multiple deformation monitoring coefficients to obtain the average deformation monitoring coefficient corresponding to the target integrated building model;

[0195] Step S32: Obtain the preset qualified interval of the deformation monitoring coefficient. If the average value of the deformation monitoring coefficient is within the preset qualified interval of the deformation monitoring coefficient, then the concrete MiC connection stability corresponding to the target integrated building model is judged to be qualified. If the average value of the deformation monitoring coefficient is not within the preset qualified interval of the deformation monitoring coefficient, then the concrete MiC connection stability corresponding to the target integrated building model is judged to be unqualified.

[0196] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to specific embodiments. Obviously, many modifications and variations are possible based on the contents of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A concrete MiC modular connection analysis system, characterized in that: include: Data acquisition module: obtains the target integrated building model and acquires the connection area of each module in the target integrated building model, creates an integrated building space coordinate system, performs installation coordinate deviation analysis on each module connection area, and obtains preliminary monitoring data of the connection points based on the analysis results; Data analysis module: Set up several temperature test scenarios for the target integrated building model, monitor the deformation of the connection points of the target integrated building model in each temperature test scenario based on the preliminary monitoring data of the connection points, and obtain the connection point deformation monitoring data based on the monitoring results; Connection evaluation module: The connection stability of the concrete MiC corresponding to the target integrated building model is evaluated based on the deformation monitoring data of the connection points.

2. A concrete MiC modular connection analysis system according to claim 1, characterized in that: The preliminary monitoring data of the connection points are obtained as follows: Create a model for the concrete MiC to obtain the target integrated building model; Create a spatial coordinate system in the target integrated building model to obtain the integrated building spatial coordinate system; Acquire multiple module connection areas existing in the target integrated building model, and arbitrarily select a sample module connection area from the acquired multiple module connection areas; Perform installation error analysis on the building connection points in the sample module connection area, and obtain connection point coordinate deviation data based on the analysis results; The coordinate deviation data of the connection points corresponding to each module connection area is obtained to obtain preliminary monitoring data of the connection points.

3. A concrete MiC modular connection analysis system according to claim 2, characterized in that: Create the integrated building space coordinate system as follows: A feature point is randomly selected on the ground of the target integrated building model as the coordinate origin, and the ground of the target integrated building model is marked as the first building plane. In the first building plane, an arbitrary straight line is drawn through the coordinate origin to obtain the first building line. A straight line perpendicular to the first building line is drawn through the coordinate origin to obtain the second building line. Draw a plane perpendicular to the first building plane through the first building line to obtain a second building plane. In the second building plane, draw a line perpendicular to the first building line through the coordinate origin to obtain a third building line. Label the first building line as the coordinate x-axis, the second building line as the coordinate y-axis, and the third building line as the coordinate z-axis. The spatial coordinate system determined by the coordinate origin, the coordinate x-axis, the coordinate y-axis and the coordinate z-axis is marked as the integrated building spatial coordinate system.

4. A concrete MiC modular connection analysis system according to claim 2, characterized in that: The connection point coordinate deviation data is obtained as follows: Randomly select several building connection points in the sample module connection area, and mark the obtained building connection points as L1 building connection point to La building connection point respectively; When the target integrated building model is in a reference temperature environment, the three-dimensional coordinate values of the L1 building connection point to the La building connection point in the integrated building space coordinate system are obtained respectively, and the actual coordinates of the L1 connection point and the La connection point are obtained; Obtaining a building BIM model corresponding to the target integrated building model, creating a spatial coordinate system in the building BIM model that has the same relative position as the integrated building spatial coordinate system, and obtaining a BIM spatial coordinate system; According to the building BIM model, the coordinate values of the L1 building connection point to the La building connection point in the BIM space coordinate system are obtained respectively, and the preset coordinates of the L1 connection point to the La connection point are obtained; Obtain the installation coordinate deviations corresponding to the L1 building connection point and the La building connection point respectively, and obtain the L1 installation coordinate deviation and the La installation coordinate deviation; The L1 installation coordinate deviation to the La installation coordinate deviation is defined as the connection point coordinate deviation data corresponding to the sample module connection area.

5. The concrete MiC modular connection analysis system according to claim 4 is characterized in that: Obtain the L1 installation coordinate deviation as follows: The actual coordinates of the L1 connection point and the preset coordinates of the L1 connection point are calculated to obtain the installation coordinate deviation corresponding to the L1 building connection point, and the deviation is named L1 installation coordinate deviation; Calculate the L1 installation coordinate deviation.

6. The concrete MiC modular connection analysis system according to claim 1 is characterized in that: The deformation monitoring data of the connection points is obtained as follows: During the test of the target integrated building model, the temperature monitoring period D1 to the temperature monitoring period Db are marked; When the target integrated building model is in the D1 temperature monitoring period, the ambient temperature of the target integrated building model is adjusted to the T1 characteristic temperature, and the end interpretation time value corresponding to the D1 temperature monitoring period is marked as the D1 characteristic time point; When the target integrated building model is in the Db temperature monitoring period, the ambient temperature of the target integrated building model is adjusted to the Tb characteristic temperature, and the end interpretation time value corresponding to the Db temperature monitoring period is marked as the Db characteristic time point; Obtaining preliminary monitoring data of the connection points, and obtaining connection point coordinate deviation data corresponding to the connection area of the sample module based on the preliminary monitoring data of the connection points; The connection point deformation of the sample module connection area is monitored based on the connection point coordinate deviation data to obtain the deformation monitoring coefficient; The deformation monitoring coefficient corresponding to each module connection area is obtained respectively to obtain the connection point deformation monitoring data.

7. The concrete MiC modular connection analysis system according to claim 6, characterized in that: The deformation monitoring coefficient is obtained as follows: The deformation of the sample module connection area during the D1 temperature monitoring period is monitored to obtain the deformation deviation at the D1 moment; Obtain the deformation deviation of the sample module connection area at the time corresponding to the feature time point D2 to the feature time point Db, and obtain the deformation deviation from the time D2 to the time Db; Acquire the ambient temperature value corresponding to the reference temperature environment to obtain the ambient reference temperature value; Obtain the difference between the characteristic temperature T1 and the characteristic temperature Tb and the ambient reference temperature value respectively, and take the absolute value of the obtained multiple temperature differences to obtain the characteristic temperature deviation T1 to the characteristic temperature deviation Tb; The deformation monitoring coefficient corresponding to the connection area of the sample module is obtained by calculating the deformation deviation at time D1 to the deformation deviation at time Db and the characteristic temperature deviation at T1 to the characteristic temperature deviation at Tb; Calculate the deformation monitoring coefficient corresponding to the connection area of the sample module; The deformation monitoring coefficient corresponding to each module connection area is obtained respectively to obtain the connection point deformation monitoring data.

8. The concrete MiC modular connection analysis system according to claim 7 is characterized in that: The deformation deviation at time D1 is obtained as follows: According to the connection point coordinate deviation data, the installation coordinate deviations corresponding to the L1 building connection point and the La building connection point are obtained respectively, and the L1 installation coordinate deviation and the La installation coordinate deviation are obtained; Obtain the installation coordinate deviation corresponding to the L1 building connection point to the La building connection point at the D1 feature time point, and obtain the L1 monitoring coordinate deviation to the La monitoring coordinate deviation; Obtain the L1 installation coordinate deviation to the La installation coordinate deviation, calculate the difference between the L1 monitoring coordinate deviation and the L1 installation coordinate deviation, and take the absolute value of the difference to obtain the L1 deformation deviation. Similarly, calculate the difference between the La monitoring coordinate deviation and the La installation coordinate deviation, and take the absolute value of the difference to obtain the La deformation deviation; The deformation deviation at time D1 is obtained by averaging the deformation deviations from L1 to La.

9. The concrete MiC modular connection analysis system according to claim 1, characterized in that: The connection stability of the concrete MiC corresponding to the target integrated building model is evaluated as follows: Obtaining connection point deformation monitoring data, obtaining the deformation monitoring coefficient corresponding to each module connection area based on the connection point deformation monitoring data, and averaging the obtained multiple deformation monitoring coefficients to obtain the average deformation monitoring coefficient corresponding to the target integrated building model; Obtain the preset qualified interval of the deformation monitoring coefficient. If the average value of the deformation monitoring coefficient is within the preset qualified interval of the deformation monitoring coefficient, then the concrete MiC connection stability corresponding to the target integrated building model is judged to be qualified. If the average value of the deformation monitoring coefficient is not within the preset qualified interval of the deformation monitoring coefficient, then the concrete MiC connection stability corresponding to the target integrated building model is judged to be unqualified.

10. A method for monitoring deformation of a concrete MiC module, applicable to a concrete MiC modular connection analysis system according to any one of claims 1 to 9, characterized in that: The monitoring method comprises: Step S1: Obtain the target integrated building model, and obtain each module connection area in the target integrated building model, create an integrated building space coordinate system, perform installation coordinate deviation analysis on each module connection area, and obtain preliminary monitoring data of the connection points based on the analysis results; Step S2: setting a number of temperature test scenarios for the target integrated building model, performing connection point deformation monitoring on the target integrated building model in each temperature test scenario based on the preliminary connection point monitoring data, and obtaining connection point deformation monitoring data based on the monitoring results; Step S3: Evaluate the connection stability of the concrete MiC corresponding to the target integrated building model based on the connection point deformation monitoring data.

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