Semiconductor test sorting machine and pressure calibration method and pressure calibration module thereof

Abstract

The invention provides a semiconductor test sorting machine, which comprises a test arm, a test base, a motor, a proportional valve cylinder and a pressure calibration module, and is characterized in that the test arm is provided with a test head; the test base is provided with a pressure sensor; the motor drives the test arm to move to contact or separate the test head and the test base; the proportional valve cylinder drives the test head to apply test pressure to the test base so as to apply corresponding pressure to the chip to be tested, and the pressure is sensed by the pressure sensor; the pressure calibration module comprises a control unit, an acquisition unit, a calculation unit and a calibration unit; the control unit outputs test pressure to the proportional valve cylinder; the acquisition unit acquires the test pressure intensity and the corresponding test pressure; the calculation unit obtains a calibration function according to the test pressure intensity and the test pressure; the calibration unit applies corresponding pressure to the to-be-tested chip according to the pressure required by the to-be-tested chip during testing and the pressure intensity of the calibration function calibration proportional valve cylinder. In addition, the invention further provides a pressure calibration method and a pressure calibration module for the semiconductor test sorting machine.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a semiconductor testing and sorting machine, a pressure calibration method, and a module. Background Art

[0002] During semiconductor testing, sorting machines require pressure calibration of the chips under test to ensure test accuracy. Traditional pressure calibration methods generally estimate pressure indirectly by quantifying the torque of the robotic arm's motor. However, this method requires a high-precision motor to ensure fine-tuning of the torque, which is relatively expensive. Furthermore, the calibration process requires step-by-step measurement in 0.5kg increments (e.g., within a 120kg range), which is time-consuming and complex. Summary of the Invention

[0003] In view of this, it is necessary to provide a semiconductor test and sorting machine, a pressure calibration method thereof, and a pressure calibration module.

[0004] In a first aspect, an embodiment of the present application provides a semiconductor test sorting machine, which includes a test arm, a test base, a motor, a proportional valve cylinder and a pressure calibration module. The test arm is provided with a test head, and the test head is used to absorb the chip to be tested; the test base is provided with a pressure sensor; the motor is used to drive the test arm to move toward or away from the test base to make the test head contact or separate from the test base; the proportional valve cylinder is used to drive the test head to apply multiple test pressures to the test base in turn according to multiple preset test pressures to apply corresponding pressures to the chip to be tested; the multiple The test pressure is sensed by the pressure sensor; the pressure calibration module includes a control unit, an acquisition unit, a calculation unit, and a calibration unit; the control unit is used to output the preset multiple test pressures to the proportional valve cylinder; the acquisition unit is used to obtain the multiple test pressures and the corresponding multiple test pressures; the calculation unit is used to obtain a calibration function between pressure and pressure based on the multiple test pressures and the corresponding multiple test pressures; the calibration unit is used to calibrate the pressure of the proportional valve cylinder according to the pressure required for testing the chip to be tested and the calibration function, so as to apply corresponding pressure to the chip to be tested.

[0005] In a second aspect, an embodiment of the present application provides a pressure calibration method for a semiconductor test and sorting machine, wherein the semiconductor test and sorting machine is provided with a test arm, a test base, a motor and a proportional valve cylinder, wherein the test arm is provided with a test head, and the test head is used to absorb a chip to be tested; the test base is provided with a pressure sensor; the motor is used to drive the test arm to move toward or away from the test base so that the test head and the test base are in contact or separated. The pressure calibration method includes: outputting the preset multiple test pressures to the proportional valve cylinder, so that the proportional valve cylinder drives the test head to apply multiple test pressures to the test base in sequence according to the preset multiple test pressures to apply corresponding pressures to the chip to be tested, and the multiple test pressures are sensed by the pressure sensor; obtaining the multiple test pressures and the corresponding multiple test pressures; obtaining a calibration function between pressure and pressure according to the multiple test pressures and the corresponding multiple test pressures; calibrating the pressure of the proportional valve cylinder according to the pressure required when testing the chip to be tested and the calibration function to apply corresponding pressures to the chip to be tested.

[0006] In the third aspect, an embodiment of the present application provides a pressure calibration module, which is applied to a semiconductor test and sorting machine. The semiconductor test and sorting machine is provided with a test arm, a test base, a motor and a proportional valve cylinder. The test arm is provided with a test head, and the test base is provided with a pressure sensor; the pressure calibration module includes a memory and a processor, the memory is used to store computer instructions; the processor is used to execute the computer instructions so that the pressure calibration module performs the above-mentioned pressure calibration method of the semiconductor test and sorting machine.

[0007] The above-mentioned semiconductor test sorting machine, pressure calibration method and module output multiple test pressures to the proportional valve cylinder, use Taylor series to perform polynomial approximation on the obtained multiple test pressures and the corresponding test pressures to construct a calibration function, thereby reducing the dependence on high-precision motors, simplifying the calibration process through polynomial approximation, and achieving accurate calibration of the proportional valve cylinder pressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0009] Figure 1 A three-dimensional diagram of a semiconductor test and sorting machine provided in an embodiment of the present application.

[0010] Figure 2 This is a structural block diagram of the pressure calibration module provided in an embodiment of the present application.

[0011] Figure 3 This is a first flow chart of the pressure calibration method for a semiconductor test handler provided in an embodiment of the present application.

[0012] Figure 4 A flowchart of the sub-steps of step S101 provided in an embodiment of the present application.

[0013] Figure 5 This is a second flow chart of the pressure calibration method for a semiconductor test and processing machine provided in an embodiment of the present application.

[0014] Figure 6 This is a third flow chart of the pressure calibration method for a semiconductor test handler provided in an embodiment of the present application.

[0015] Figure 7 A flowchart of the sub-steps of step S104 provided in an embodiment of the present application.

[0016] Figure 8 This is a fourth flow chart of the pressure calibration method for a semiconductor test handler provided in an embodiment of the present application.

[0017] Figure 9 This is a fifth flow chart of the pressure calibration method for a semiconductor test handler provided in an embodiment of the present application.

[0018] Figure 10 Schematic diagram of pressure testing of a sorting machine after pressure calibration provided in an embodiment of the present application.

[0019] Figure 11 Schematic diagram of the internal structure of the pressure calibration module provided in an embodiment of the present application.

[0020] Component numbers

[0021] Semiconductor test sorter-1000 Get Unit-52 Test Arm-1 Computational Unit-53 Chip under test-10 Calibration Unit-54 Test Head-11 Setting Unit-55 Test Base-2 Memory-501 Pressure sensor-21 Processor-502 Motor-3 Transmission structure-6 Proportional valve cylinder-4 Default axis-Y Pressure Calibration Module-5 First direction - Y1 Control Unit-51 Second direction - Y2

[0022] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of this application more clear, the present application is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0024] The terms "first," "second," "third," "fourth," and the like (if any) in the specification and claims of this application and in the accompanying drawings are used to distinguish similar program objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate. In other words, the described embodiments are implemented according to an order other than that illustrated or described herein. In addition, the terms "including" and "having," and any variations thereof, may also encompass other content. For example, a process, method, system, product, or apparatus comprising a series of steps or units need not be limited to only those steps or units explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to these processes, methods, products, or apparatus.

[0025] It should be noted that the descriptions of "first", "second", etc. in this application are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include one or more of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0026] Please see Figure 1 , which is a structural block diagram of a semiconductor test sorting machine provided in an embodiment of the present application. The semiconductor test sorting machine 1000 can be a translational test sorting machine, which is used to test semiconductor chips 10 (hereinafter referred to as chips to be tested) and sort chips to be tested 10 with different test results. In the present application, the semiconductor test sorting machine 1000 needs to perform a stress test on the chip to be tested 10 during the test process of the chip to be tested 10, so as to ensure that the chip to be tested 10 maintains precise alignment to ensure the smooth completion of the test. Accordingly, the test results may include a qualified test and a failed test, which may respectively reflect whether the chip to be tested 10 maintains precise alignment or fails to maintain precise alignment.

[0027] The semiconductor test and sorting machine 1000 includes a test arm 1, a test base 2, a motor 3, a proportional valve cylinder 4, and a pressure calibration module 5. The test base 2 is located below the test arm 1, the motor 3 is located above the test arm, and the proportional valve cylinder 4 is located between the test arm 1 and the test base 2.

[0028] A test head 11 is provided at one end of the test arm 1 close to the test base 2. The motor 3 is connected to the end of the test arm 1 away from the test head 11 through the transmission structure 6, so that the test arm 1 can move. The test arm 1 is used to move the chip to be tested 10 to the test base 2 for testing. After the interior of the proportional valve cylinder 4 is adjusted to reach the corresponding pressure, it is used to drive the test head 11 to apply pressure to the test base 2 to apply the corresponding pressure to the chip to be tested 10. The corresponding pressure is the pressure required by the chip to be tested 10 during the test process. The pressure calibration module 5 is used to calibrate the pressure of the proportional valve cylinder 4 so that the pressure applied to the chip to be tested 10 reaches the required pressure.

[0029] In this embodiment, the motor 3 is used to drive the test arm 1 to move toward the test base 2 or away from the test base 2, so that the test head 11 and the test base 2 are in contact or separated. Specifically, the motor 3 drives the test arm 1 to move in different directions through the transmission structure 6. In this application, since the test base 2 is located below the test arm 1, the motor 3 is used to drive the test arm 1 to move back and forth in the vertical direction. The vertical direction includes a first direction Y1 moving toward the test base 2 and a second direction Y2 moving away from the test base 2. It can be understood that when the motor 3 drives the test arm 1 to move along the first direction Y1 or the second direction Y2, the test head 11 and the test base 2 can be brought into contact or separated.

[0030] Test head 11 is equipped with several suction nozzles. These nozzles are used to pick up chip under test 10. Driven by test arm 1, test head 11 applies pressure to chip under test 10, pressing chip under test 10 against test base 2. Test base 2 is equipped with pressure sensor 21, which senses the pressure applied to test base 1, that is, the pressure on chip under test 10.

[0031] In this embodiment, the proportional valve cylinder 4 is connected between the test arm 1 and the test head 11. In some other embodiments, the proportional valve cylinder 4 can also be arranged between the test arm 1 and the test head 11, and only needs to act on the test head 11. The proportional valve cylinder 4 is a cylindrical structure. The proportional valve cylinder 4 is provided with a cylinder body, and components such as a piston and a piston rod located inside the cylinder body (the cylinder body, piston, piston rod and other components are not shown in the figure). The proportional valve cylinder 4 contacts the test head 11 through the piston rod not extending out of the side of the cylinder body, and changes the pressure of the cylinder body by inflating or deflating the cylinder body through an external air supply device, and acts on the piston to act on the test head 11 with the pressure of the palace, that is, the proportional valve cylinder 4 drives the test head 11 with the corresponding pressure by adjusting the pressure inside the cylinder body.

[0032] Please see Figure 2, which is a structural block diagram of the pressure calibration module provided in an embodiment of the present application. The pressure calibration module 5 includes a control unit 51, an acquisition unit 52, a calculation unit 53, a calibration unit 54, and a setting unit 55.

[0033] The control unit 51 is used to output a plurality of preset test pressures to the proportional valve cylinder 4, so that the proportional valve cylinder 4 drives the test head 11 to apply a plurality of test pressures to the test base 2 in turn according to the preset multiple test pressures, thereby applying corresponding pressures to the chip under test 10 and sensing the test pressures by the pressure sensor 21. Accordingly, the setting unit 55 is used to set a plurality of preset test pressures in response to user operations. The user operation can be to input a numerical value of the test pressure. In the present application, the control unit 51 is also used to control the motor 3 to drive the test arm 1 to move. Among them, the preset multiple test pressures are obtained by the user inputting the numerical values of part or all of the pressures that the chip under test 10 can withstand and can be applied to the semiconductor test sorting machine 1000 when the chip under test 10 is subjected to pressure testing, through the setting unit 55. In this application, the control unit 51 is used to output different test pressures to the proportional valve cylinder 4, so that the proportional valve cylinder 4 drives the test head 11 to apply corresponding test pressure to the test base 2, and then presses the chip to be tested 10 on the test base 2 to apply corresponding pressure, and then obtains the pressure of the chip to be tested 10 through the pressure sensor 21 to obtain the test pressure.

[0034] It is understood that the present application only needs to ensure that the proportional valve cylinder 4 can drive the test head 11 to apply the test pressure to the test base 2 through the test pressure. Therefore, the proportional valve cylinder 4 in the semiconductor test and sorting machine 1000 does not need to be arranged between the test arm 1 and the test head 11. It only needs to ensure that the output test pressure can be applied to the test head. Accordingly, the proportional valve cylinder 4 can also apply the pressure converted from the test pressure to the test head 11 through components such as the piston and piston rod, without being connected between the test arm 1 and the test head 11.

[0035] In this embodiment, the control unit 51 outputs any one of the preset multiple test pressures to the proportional valve cylinder 4, so that the proportional valve cylinder 4 drives the test head 11 to apply the corresponding test pressure to the test base 2 according to the test pressure. The control unit 51 then outputs any one of the remaining test pressures to the proportional valve cylinder 4 until all test pressures and corresponding test pressures are acquired by the pressure sensor 21. The preset multiple test pressures may be a test pressure randomly selected and output by the control unit 51, or the control unit 51 may arrange the multiple preset test pressures in a specific order and then select and output the test pressures in sequence. The specific order may be an order based on the different pressures that different chips under test 10 can withstand during normal operation, an order based on the frequency of occurrence of the pressures that different chips under test 10 can withstand during normal operation, or an order based on the test performance of different chips under test 10 at different pressures. The test pressures in the specific order may be arranged linearly or nonlinearly. This application does not limit the specific order, and the above examples are only examples of the specific order.

[0036] Furthermore, in order to make the test pressure output by the control unit 51 to the proportional valve cylinder 4 cover as much as possible the different pressures often applied to the chip 10 to be tested, the multiple test pressures preset in this application can be selected according to the preset pressure interval. For example, the preset pressure interval can be 0.1kg / cm 2 , that is, from the different pressures that the chip 10 to be tested can withstand, the control unit 51 can be adjusted according to 0.1kg / cm 2 A plurality of test pressures not less than the preset pressure interval are selected as the preset test pressures, so as to fully reflect the pressure calibration accuracy of the semiconductor test handler 1000. Preferably, the plurality of different test pressures can be a plurality of pressures arranged in order according to the magnitude of the pressure values.

[0037] In this embodiment, each time a test pressure is output to the proportional valve cylinder 4 through the control unit 51 to enable the pressure sensor 21 to sense a test pressure appearing on the chip to be tested 10, any one of the remaining test pressures is output to the proportional valve cylinder 4 through the control unit 51, until the chip to be tested 10 is sequentially sensed by the pressure sensor 21 at the test pressures corresponding to the test pressures applied in a specific order. The test pressure can be automatically acquired through the pressure sensor 21, avoiding the situation where manual adjustment is time-consuming and prone to introducing pressure data errors, thereby improving the accuracy of subsequent verification of pressure control precision.

[0038] The acquisition unit 52 is communicatively connected to the pressure sensor 21 and is used to acquire a plurality of test pressures and corresponding test pressures, wherein the plurality of different test pressures are arranged in a specific order.

[0039] The calculation unit 53 is used to obtain a calibration function between pressure and pressure based on multiple test pressures and corresponding multiple test pressures. The calibration function between pressure and pressure can be obtained by the calculation unit 53 through polynomial approximation based on Taylor series. Specifically, the calibration function is used to reflect the correlation between the test pressure output by the control unit 51 to the proportional valve cylinder 4 and the test pressure obtained by the chip under test 10 via the pressure sensor 21. The expression of the calibration function is: Among them, A represents the test pressure, B represents the test pressure, and c k Represents the fitting coefficient, and n represents the test pressure and the number of corresponding test pressure groups. The expression for the test pressure is B = S * A + F. Among them, S represents the effective area of the proportional valve cylinder 4 that converts the test pressure into the pressure acting on the test head 11, that is, the area of the proportional valve cylinder 4 where the piston rod does not extend out of the cylinder body, and F represents the friction force; the expression formula for the effective area is S = N * π * R 2 Wherein, N represents the number of proportional valve cylinders 4, and R represents the radius of the proportional valve cylinder 4.

[0040] In this embodiment, the test pressure and the corresponding number of test pressure groups are determined by the calculation accuracy of the calculation unit 53 when performing polynomial approximation through Taylor series. Therefore, by setting different test pressures and the number of test pressure groups n, calibration functions with different calculation accuracies can be obtained to calibrate the pressure of the proportional valve cylinder 4 to different degrees. For example, the corresponding test pressure and the number of test pressure groups in this application can be 3. Accordingly, the calibration function A in this application is A = c0 + c1B + c2B 2 , i.e., the calibration function is a quadratic polynomial equation. In other words, the present application can sequentially output three different test pressures to the proportional valve cylinder 4 via the control unit 51, and the pressure sensor 21 can sense the three test pressures accordingly. Then, a calibration function represented as a quadratic polynomial equation can be obtained by performing a quadratic polynomial approximation on the sample data using the Taylor series.

[0041] It is understood that by outputting different numbers of test pressures to the proportional valve cylinder 4 via the control unit 51, the resulting calibration function will also be different, and the corresponding calibration accuracy will also be different. In addition, the number of test pressures in the preset multiple test pressures should not be less than the number n of corresponding test pressure and test pressure groups. Therefore, based on the three groups of test pressures and test pressures in the above example, the control unit 51 outputs to the proportional valve cylinder 4 at least three different test pressures that can be applied to the chip under test 10 when the semiconductor test handler 1000 performs a pressure test on the chip under test 10.

[0042] The calibration unit 54 is used to calibrate the pressure of the proportional valve cylinder 4 according to the pressure required during testing of the chip under test 10 and the calibration function, thereby applying the corresponding pressure to the chip under test 10. The proportional valve cylinder 4 drives the test head 11 to apply the corresponding test pressure to the test base 2, thereby applying the test pressure to the chip under test 10. The required pressure is one or more of the multiple test pressures corresponding to good test performance of the chip under test 10.

[0043] It is understandable that the test pressure of the chip to be tested 10 should theoretically be fully provided by the test head 11, that is, the required pressure should be equal to the test pressure applied by the proportional valve cylinder 4 to the test base plate 2 by driving the test head 11 through the test pressure. However, in the actual test of the semiconductor test sorting machine 1000, there is loss due to factors such as the dead weight of the proportional valve cylinder 4 and the friction of the test arm 1, so that when the chip to be tested 10 needs to reach the required pressure, the actual pressure output by the control unit 51 to the proportional valve cylinder 4 is greater than the theoretically calculated test pressure. Therefore, the present application can verify the ideal pressure obtained by the calibration function by using the pressure required by the chip to be tested 10, and obtain the actual pressure of the chip to be tested 10 by the pressure sensor 21, and then verify whether the calibration function meets the requirements and can be applied to the proportional valve cylinder 4.

[0044] In this embodiment, the calibration unit 54 obtains an ideal pressure based on the required pressure and the calibration function. The ideal pressure is set via the setting unit 55 and output to the proportional valve cylinder via the control unit 51. At this point, the proportional valve cylinder 4 drives the test head 11 to apply actual pressure to the test base 2 and a corresponding pressure to the chip under test 10 based on the ideal pressure. The actual pressure is then sensed by the pressure sensor 21. When the calibration unit 54 determines that the difference between the actual pressure and the required pressure is less than or equal to a preset pressure difference, it determines that the calibration function meets the requirements. When the calibration unit 54 determines that the difference between the actual pressure and the required pressure is greater than the preset difference, it sets multiple updated test pressures via the setting unit 55 and outputs the updated test pressures to the proportional valve cylinder 4 via the control unit 51. The acquisition unit 52 then reacquires the corresponding updated test pressures via the pressure sensor 21. The calculation unit then regenerates a new calibration function, which the calibration unit 54 uses to recalibrate the pressure of the proportional valve cylinder 4 until the updated calibration function meets the requirements.

[0045] Furthermore, the number of test arms 1 in the semiconductor test sorter 1000 can be multiple. Specifically, the test arms 1 include a first test arm and a second test arm. Accordingly, the semiconductor test sorter 1000 can be provided with test bases 2 corresponding to different test arms 1 to enable more chips 10 to be tested to participate in stress testing in the semiconductor test sorter 1000. Figure 9 The semiconductor test handler 1000 is illustrated using a single test arm 1 as an example. It is understood that the components loaded on the first and second test arms can be identical, i.e., one end of each of the first and second test arms is connected to a motor 3 via a transmission structure 6, and the other end is connected to a test head 11, as well as a proportional valve cylinder 4 disposed between the test arm 1 and the test head 11. Furthermore, a test base 2 is disposed below the corresponding test head 11.

[0046] The traditional pressure calibration method indirectly estimates the pressure by quantifying the torque between the robot arm and the motor. However, this pressure calibration method relies on a high-precision motor to estimate the force at fixed intervals step by step. For example, when the semiconductor test handler 1000 of the present application uses the traditional pressure calibration method to estimate the pressure of 120 kg·m 2 ·s -2 The pressure corresponding to the torque, and the fixed interval is 0.5kg·m 2 ·s -2 , 120 / 0.5*2=120 measurements are required. Therefore, the traditional pressure calibration method is cumbersome and time-consuming, and the fixed-interval force requires an extremely high-precision motor, resulting in high calibration costs. The pressure calibration method provided in this application uses polynomial approximation achieved by Taylor series, which does not require an extremely high-precision motor. While reducing calibration costs, it also avoids the cumbersome and time-consuming step-by-step estimation and achieves fast and accurate pressure calibration.

[0047] Please see Figure 3 , which is a first flow chart of a pressure calibration method for a semiconductor test handler provided in an embodiment of the present application. This application also provides a pressure calibration method for a semiconductor test handler. The pressure calibration method can be performed by a pressure calibration module 5. The pressure calibration method includes steps S101-S104.

[0048] Step S101 , outputting multiple preset test pressures to the proportional valve cylinder, so that the proportional valve cylinder sequentially drives the test head to apply multiple test pressures to the test base according to the preset multiple test pressures, so as to apply corresponding pressures to the chip under test.

[0049] In step S101, the preset multiple test pressures are set by the user operating the setting unit 55 according to the partial or full pressure that the chip under test 10 can withstand and can be applied when the semiconductor test handler 1000 performs a pressure test on the chip under test 10. In this application, the control unit 51 outputs different test pressures to the proportional valve cylinder 4, so that the proportional valve cylinder 4 drives the test head 11 to apply the corresponding test pressure to the test base 2, thereby pressing the chip under test 10 against the test base 2 and applying the corresponding pressure. The pressure of the chip under test 10 is then obtained by the pressure sensor 21 to obtain the test pressure.

[0050] It is understandable that the present application only needs to ensure that the proportional valve cylinder 4 can drive the test head 11 to apply the test pressure to the test base 2 through the test pressure. Therefore, the proportional valve cylinder 4 in the semiconductor test and sorting machine 1000 may not be set between the test arm 1 and the test head 11. It only needs to ensure that the output test pressure can be applied to the test head 11. Correspondingly, the proportional valve cylinder 4 can also apply the pressure converted from the test pressure to the test head 11 through components such as the piston and piston rod, without being connected between the test arm 1 and the test head 11.

[0051] Please refer to Figure 4 , which is a flowchart of step S101 sub-steps provided in an embodiment of the present application. Outputting a plurality of preset test pressures to the proportional valve cylinder includes steps S1011-S1012.

[0052] Step S1011 , outputting any one of a plurality of preset test pressures to the proportional valve cylinder, so that the proportional valve cylinder drives the test head to apply corresponding test pressure to the test base according to any one of the test pressures.

[0053] In step S1011, any one of the preset multiple test pressures can be a test pressure randomly selected by the control unit 51 from the preset multiple test pressures for output, or the control unit 51 can arrange the preset multiple test pressures in a specific order and then select the test pressures in sequence for output. The specific order can be to arrange in order the different pressures that different chips to be tested 10 can withstand when they are working normally, or to arrange in order according to the frequency of the pressures that different chips to be tested 10 withstand when they are working normally, or to arrange in order according to the level of test performance of different chips to be tested 10 under different pressures. The test pressures in a specific order can be arranged linearly or nonlinearly. This application does not limit the specific order, and the above examples are only examples of the specific order.

[0054] Furthermore, in order to make the test pressure output to the proportional valve cylinder 4 cover as much as possible the different pressures often applied to the chip 10 to be tested, the multiple test pressures preset in this application can be selected according to the preset pressure interval. For example, the preset pressure interval can be 0.1kg / cm 2 , that is, the different pressures that the chip 10 to be tested can withstand can be selected according to 0.1kg / cm 2 A plurality of test pressures not less than the preset pressure interval are selected as the preset test pressures, so as to fully reflect the pressure calibration accuracy of the semiconductor test handler 1000. Preferably, the plurality of different test pressures can be a plurality of pressures arranged in order according to the magnitude of the pressure values.

[0055] Step S1012: output any one of the remaining test pressures to the proportional valve cylinder until all the test pressures and all corresponding test pressures are acquired through the pressure sensor.

[0056] In step S1012, each time a test pressure is output to the proportional valve cylinder 4 through the control unit 51 to enable the pressure sensor 21 to sense a test pressure appearing on the chip to be tested 10, any one of the remaining test pressures is output to the proportional valve cylinder 4 through the control unit 51, until the chip to be tested 10 is sequentially sensed by the pressure sensor 21 with the test pressures corresponding to the test pressures applied in a specific order. The test pressure can be automatically acquired through the pressure sensor 21, avoiding the situation where manual adjustment is time-consuming and prone to introduce pressure data errors, thereby improving the accuracy of subsequent verification of pressure control precision.

[0057] Step S102: Acquire multiple test intensities and corresponding multiple test pressures.

[0058] In step S102, the acquisition unit 52 of the present application may acquire the test pressure by controlling the pressure sensor 21. A plurality of different test pressures are arranged in a specific order.

[0059] Step S103: obtaining a calibration function between pressure and pressure according to the multiple test pressures and the corresponding multiple test pressures.

[0060] In step S103, the calibration function between pressure and pressure can be obtained by the calculation unit 53 through polynomial approximation based on Taylor series. Specifically, the calibration function is used to reflect the correlation between the test pressure output by the control unit 51 to the proportional valve cylinder 4 and the test pressure obtained by the chip under test 10 through the pressure sensor 21. The expression of the calibration function is: Among them, A represents the test pressure, B represents the test pressure, and c k Represents the fitting coefficient, and n represents the test pressure and the number of corresponding test pressure groups. The expression for the test pressure is B = S * A + F. Among them, S represents the effective area of the proportional valve cylinder 4 that converts the test pressure into the pressure acting on the test head 11, that is, the area of the proportional valve cylinder 4 where the piston rod does not extend out of the cylinder body, and F represents the friction force; the expression formula for the effective area is S = N * π * R 2 Where N represents the number of proportional valve cylinders 4, and R represents the radius of proportional valve cylinder 4. Using Taylor series polynomial approximation allows fitting with only a small number of test pressures and test pressure groups n to obtain the correlation between the test pressures.

[0061] For example, the number of groups of corresponding test pressure and test pressure in the present application may be 3. Accordingly, the calibration function A=c0+c1B+c2B in the present application2 , i.e., the calibration function is a quadratic polynomial equation. In other words, the present application can sequentially output three different test pressures to the proportional valve cylinder 4 via the control unit 51, and the pressure sensor 21 can sense the three test pressures accordingly. Then, a calibration function represented as a quadratic polynomial equation can be obtained by performing a quadratic polynomial approximation on the sample data using the Taylor series.

[0062] It is understandable that the test pressure and the corresponding number of test pressure groups are determined by the calculation accuracy when the Taylor series is used for polynomial approximation. Therefore, by setting different test pressures and the number of test pressure groups n, calibration functions with different calculation accuracy can be obtained to calibrate the pressure of the proportional valve cylinder 4 to different degrees. That is, by outputting different numbers of test pressures to the proportional valve cylinder 4 through the control unit 51, the calibration functions obtained are also different, and their corresponding calibration accuracy is also different. In addition, the number of test pressures in the preset multiple test pressures should not be less than the corresponding test pressure and the number of test pressure groups n. Therefore, according to the three groups of test pressures and test pressures in the above example, the control unit 51 outputs to the proportional valve cylinder 4 at least three different test pressures that can be applied to the chip 10 to be tested when the semiconductor test sorting machine 1000 performs a pressure test on the chip 10 to be tested.

[0063] Step S104 , calibrating the pressure of the proportional valve cylinder according to the pressure required for testing the chip to be tested and the calibration function, so as to apply corresponding pressure to the chip to be tested.

[0064] In step S104, the proportional valve cylinder 4 drives the test head 11 to apply a corresponding test pressure to the test base and the test pressure is applied to the chip under test 10. The required pressure is one or more test pressures corresponding to the multiple test pressures when the test performance of the chip under test 10 is good.

[0065] It is understandable that the test pressure of the chip to be tested 10 should theoretically be fully provided by the test head 11, that is, the required pressure should be equal to the test pressure applied by the proportional valve cylinder 4 to the test base plate 2 by driving the test head 11 through the test pressure. However, in the actual test of the semiconductor test sorting machine 1000, there is loss due to factors such as the dead weight of the proportional valve cylinder 4 and the friction of the test arm 1, so that when the chip to be tested 10 needs to reach the required pressure, the actual pressure output by the control unit 51 to the proportional valve cylinder 4 is greater than the theoretically calculated test pressure. Therefore, the present application can verify the ideal pressure obtained by the calibration function by using the pressure required by the chip to be tested 10, and obtain the actual pressure of the chip to be tested 10 by the pressure sensor 21, and then verify whether the calibration function obtained in step S103 meets the requirements and can be applied to the proportional valve cylinder 4.

[0066] Please refer to Figure 7, which is a flowchart of step S104 sub-step provided in an embodiment of the present application. Calibrate the pressure of the proportional valve cylinder according to the pressure required for testing the chip under test and the calibration function to apply the corresponding pressure to the chip under test, including steps S1041-S1044.

[0067] Step S1041: Obtain the ideal pressure according to the required pressure and calibration function.

[0068] Step S1042: output ideal pressure to the proportional valve cylinder, so that the proportional valve cylinder drives the test head to apply actual pressure to the test base according to the ideal pressure and applies corresponding pressure to the chip under test, and then the pressure sensor senses the actual pressure.

[0069] Step S1043: When the difference between the actual pressure and the required pressure is less than or equal to the preset pressure difference, it is determined that the calibration function meets the requirements.

[0070] In step S1043, the preset pressure difference between different chips 10 under test can be customized based on the needs of each chip 10 under test. For example, the preset pressure difference can be set to a range of ±5% of the required pressure. When the difference is less than or equal to the preset pressure difference, it is determined that the calibration function obtained in step S103 meets the requirements.

[0071] Step S1044: When the difference between the actual pressure and the required pressure is greater than the preset difference, multiple updated test pressures are output to the proportional valve cylinder until the updated calibration function meets the requirements.

[0072] In step S1044, the updated multiple test pressures differ from the preset multiple test pressures. If the difference is greater than the preset pressure difference, the calibration function obtained in step S103 is not accurate enough to be applied to the proportional valve cylinder 4 to complete pressure calibration. In this case, the setting unit 55 needs to set the updated multiple test pressures, and the control unit 51 needs to output the updated multiple test pressures to the proportional valve cylinder 4 to obtain a new calibration function. Steps S1041-S1043 are then re-executed to verify the updated calibration function.

[0073] Please see Figure 10 , which is a schematic diagram of the pressure test of the semiconductor test sorting machine after pressure calibration provided in an embodiment of the present application. Figure 10The diagram illustrates the different required pressures for the chip under test 10 and the current pressures sensed by the pressure sensors 21 provided on the corresponding test base 2 when the first and second test arms, through their respective test heads 11, press the chip under test 10 against the corresponding test base 2. 10kg, 20kg, etc., respectively, indicate that the required pressures for the chip under test 10 are 10 kilograms force (kgf), 20 kilograms force (kgf), etc. It can be seen that when the preset difference is ±5% of the required pressure, the difference between the current pressure sensed by the corresponding pressure sensors 21 of the first and second test arms and the required pressure does not exceed the preset pressure difference. At this point, it can be assumed that the chip under test 10, to which the pressures applied by the first and second test arms are applied, have all passed the test at the different required pressures. In other words, the calibration function obtained above can be applied to the proportional valve cylinder 4 for pressure calibration of the semiconductor test handler 1000. After determining that the chip to be tested 10 has passed the test, the chip to be tested 10 can be sucked into a partition for accommodating qualified chips with qualified test results through the test head 11, and a new chip to be tested 10 can be sucked into the partition for pressure testing, and then it is determined that the new chip to be tested 10 needs to be sucked into the qualified chip partition, or used to accommodate the unqualified chip partition with unqualified test results, thereby realizing the automation of the pressure test of the chip to be tested 10.

[0074] In the above embodiment, a calibration function is obtained by obtaining multiple sets of test pressures and corresponding test pressures, and the accuracy of the calibration function is verified by the required pressure of the chip to be tested 10, so as to complete the calibration process of the proportional valve cylinder 4, which is convenient for the subsequent semiconductor test sorting machine 1000 to be actually applied to pressure testing of other different chips to be tested 10.

[0075] Please see Figure 5 , which is the second flow chart of the pressure calibration method for a semiconductor test and sorting machine provided in an embodiment of the present application. Motor 3 is provided with an initial torque. In this application, in order for the pressure output by the control unit to the proportional valve cylinder 4 to accurately drive the test head 11 to be applied to the chip under test 10, the proportional valve cylinder 4 needs to be initialized. Specifically, before outputting multiple preset test pressures to the proportional valve cylinder, the pressure calibration method also includes steps S201-S203.

[0076] Step S201: The motor drives the test arm to move away from the test base until the test head reaches an initial position.

[0077] In step S201 , the initial position is the position when the proportional valve cylinder 4 is initialized and the test head 11 does not apply pressure to the test base.

[0078] In step S202, the torque of the motor is adjusted from the initial torque to the preset torque, and the maximum pressure is output to the proportional valve cylinder, so that the test head is driven to move from the initial position to contact with the test base and the proportional valve cylinder is not contracted by the test head, thereby making the test head reach the contact position.

[0079] In step S202, the maximum pressure is the maximum pressure that the control unit 51 can output to the proportional valve cylinder 4. When the test head 11 reaches the contact position, the test base 2 is blocked by the test head 11, that is, the test base 2 has already contacted the test head 11, and the plurality of cylinders 31 have not been squeezed or contracted by the test head 11. Since the test head 11 requires a certain amount of force to overcome its own weight and friction in the initial state, the maximum pressure is set by the user operating the setting unit 55, and the control unit 51 outputs the maximum pressure to the proportional valve cylinder 4. This provides sufficient initial force for the movement of the test head 11, so that the test head 11 can contact the test base 2.

[0080] In step S203, the torque of the motor is adjusted to the initial torque, and any one of the preset multiple test pressures is output to the proportional valve cylinder, so that the test head moves a preset distance from the contact position to the test base until the chip to be tested is pressed against the test base, thereby enabling the test head to apply corresponding test pressure to the chip to be tested.

[0081] In step S203, the motor 3 recovers from the preset torque to the initial torque, so that when the pressure output to the proportional valve cylinder 4 is adjusted from the maximum pressure to any one of a plurality of different test pressures, the test head 11 has not yet contacted the test base 2, and thus it is necessary to drive the test arm 1 to move by the motor 3 so that the test head 11 continues to move a preset distance based on the contact position until the test head 11 just contacts the test base 2, and thus the test head 11 reaches the target position, so that when the subsequent semiconductor test sorting machine 1000 performs a pressure test on the chip to be tested 10 and outputs different test pressures to the proportional valve cylinder 4 through the control unit 51, the position where the test head 11 can contact the test base 2 can be directly found through the target position. Specifically, after the target position is obtained and the pressure sensing of the chip 10 to be tested corresponding to any one of the different test pressures is completed, for the remaining test pressures, the motor 3 can be controlled by the contact position and the target position to drive the test arm 1 to move downward and drive the test head 11 to move to the target position, so as to quickly find the position where the test head 11 can contact the test base 2, thereby improving the convenience of the pressure test of the semiconductor test sorting machine 1000.

[0082] Please see Figure 6 , which is a third flow chart of the pressure calibration method for a semiconductor test handler provided by an embodiment of the present application. After obtaining the calibration function between pressure and pressure, the pressure calibration method further includes steps S301-S302.

[0083] Step S301 : Calculate the theoretical proportional valve cylinder radius according to the sample data and the pressure calibration function, and determine whether the proportional valve cylinder is assembled in compliance according to the theoretical proportional valve cylinder radius and the proportional valve cylinder radius.

[0084] Step S302 : When the difference between the theoretical proportional valve cylinder radius and the proportional valve cylinder radius does not exceed the preset assembly difference, it is determined that the proportional valve cylinder is assembled in compliance with the regulations.

[0085] Verifying the proper assembly of proportional valve cylinder 4 in step S302 can reduce frictional forces on test arm 1 during pressure testing of semiconductor test handler 1000. This friction, particularly when the test arm 1 is improperly assembled with other components within the semiconductor test handler 1000, can affect pressure calibration, thereby improving the accuracy of the calibration function verification. After verifying the proper assembly of proportional valve cylinder 4, step S104 is executed.

[0086] In the above embodiment, by initializing the proportional valve cylinder 4, different test pressures output to the proportional valve cylinder 4 can be accurately driven to apply different test pressures to the test base 2 by quickly positioning the test head 11 to the target position, thereby applying corresponding pressure to the chip to be tested 10. After obtaining the calibration function, the theoretical proportional valve cylinder radius is calculated to verify whether the proportional valve cylinder 4 is assembled in compliance, thereby reducing the influence of the friction of the test arm 1 on the pressure calibration.

[0087] Please see Figure 8 , which is a fourth flow chart of the pressure calibration method for a semiconductor test handler provided by an embodiment of the present application. After determining that the calibration function meets the requirements, the pressure calibration method further includes step S401.

[0088] Step S401 : obtaining mechanical optimization parameters according to a plurality of test pressures, a corresponding plurality of test pressures and a pressure calibration function.

[0089] In step S401, the mechanical optimization parameters include the friction of the test arm 1 and the weight of the cylinders 31. The friction of the test arm 1 and the weight of the cylinders 31 can be calculated by expanding the expression of the calibration function in step S102. Specifically, since the calibration function in this application can be a quadratic polynomial equation A=c0+c1B+c2B 2 Therefore, the friction force of the test arm 1 and the deadweight of the cylinders 31 are quadratic polynomial equations A = c0 + c1B + c2B 2The coefficient of the zeroth-order term in is . After the calibration function is determined to meet the requirements and can be applied to the proportional valve cylinder 4, the semiconductor test handler 1000 is optimized in real time by obtaining mechanical optimization parameters to eliminate pressure error accumulation. Optimizing the semiconductor test handler 1000 includes, but is not limited to, adjusting the assembly of the proportional valve cylinder 4 and applying lubricant to the connections between various components in the semiconductor test handler 1000.

[0090] Please see Figure 9 , which is the fifth flow chart of the pressure calibration method for a semiconductor test handler provided in an embodiment of the present application. In this application, after optimizing the semiconductor test handler 1000 according to the mechanical optimization parameters, pressure tests can be performed on different chips 10 under test. A calibration function with verified accuracy is used to control the movement of the test arm 1 to the contact position and target position, thereby improving the convenience of the semiconductor test handler 1000 in performing pressure tests on different chips 10 under test. Specifically, after calibrating the pressure of the proportional valve cylinder, the pressure calibration method further includes steps S501-S503.

[0091] Step S501 : obtaining a maximum test pressure according to the preset maximum pressure tolerance of different chips to be tested and the calibration function.

[0092] In step S501, the preset maximum pressure is determined based on the number of pins and the maximum pressure tolerance of the pins of different chips under test 10. The multiple preset test pressures include the maximum test pressure. In other words, when calibrating the proportional valve cylinder 4, the corresponding test pressure output to the proportional valve cylinder 4 can be pre-calibrated using a calibration function based on the different chips under test 10, thereby improving the convenience of pressure testing different chips under test 10.

[0093] Step S502 : adjusting the torque of the motor to a preset torque, and outputting a maximum pressure to the proportional valve cylinder to move the test head to the contact position.

[0094] In step S503, the torque of the motor is adjusted to the initial torque, and the maximum test pressure is output to the proportional valve cylinder to move the test head from the contact position to the target position, so that when any of the remaining test pressures is output to the proportional valve cylinder, the test head can be driven to move to the target position.

[0095] In step S503 , for the remaining test pressures, the position where the test head 11 can contact the test base 2 can be quickly found through the contact position and the target position, thereby improving the convenience of the pressure test of the semiconductor test handler 1000 .

[0096] This application also provides a pressure calibration module 5. Pressure calibration module 5 is used in a semiconductor test handler 1000. Semiconductor test handler 1000 includes a test arm 1, a test base 2, a motor 3, and a proportional valve cylinder 4. Test arm 1 includes a test head 11. Test base 2 includes a pressure sensor 21. The specific features of semiconductor test handler 1000 have at least been fully described above.

[0097] Please see Figure 11 , which is a schematic diagram of the internal structure of the pressure calibration module provided in an embodiment of the present application. The pressure calibration module 5 includes a memory 501 and a processor 502. The memory 501 is used to store computer instructions. The processor 502 is used to execute the computer instructions to cause the pressure calibration module to perform the pressure calibration method for a semiconductor test handler.

[0098] The memory 501 includes at least one type of readable storage medium, which includes a flash memory, a hard disk, a multimedia card, a card-type memory (for example, an SD or DX memory, etc.), a magnetic memory, a magnetic disk, an optical disk, etc. In some embodiments, the memory 501 can be an internal storage unit of a computer device, such as a hard disk of the computer device. In other embodiments, the memory 501 can also be a storage device of an external computer device, such as a plug-in hard disk configured in the computer device, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card, etc. Furthermore, the memory 501 can also include both an internal storage unit of the computer device and an external storage device. The memory 501 can not only be used to store application software and various types of data installed in the computer device, such as the code of the pressure calibration method of a semiconductor test and sorting machine, but can also be used to temporarily store data that has been output or is about to be output.

[0099] In the above embodiments, all or part of the embodiments may be implemented by software, hardware, or any combination thereof. When implemented by software, all or part of the embodiments may be implemented in the form of a computer program product.

[0100] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, a process or function according to an embodiment of the present invention is generated in whole or in part. The computer device can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from a website, computer, server or data center to another website, computer, server or data center via a wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) method. The computer-readable storage medium can be any available medium that a computer can store or a data storage device such as a server or data center that includes one or more available media integrations. The available medium can be a magnetic medium (e.g., a floppy disk, a hard disk, a magnetic tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state drive (SSD)).

[0101] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0102] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the unit is only a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interface, device or unit, which can be electrical, mechanical or other forms.

[0103] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units may be selected to achieve the purpose of the solution of this embodiment according to actual needs.

[0104] In addition, the functional units in the various embodiments of the present application may be integrated into one processing unit, or each unit may exist independently, or two or more units may be integrated into one unit. The above-mentioned integrated units may be implemented in the form of hardware or software functional units.

[0105] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only storage medium (ROM, Read-Only Memory), random access storage medium (RAM, Random Access Memory), disk or optical disk, and other media that can store program code.

[0106] In the above embodiment, multiple test pressures are output to the proportional valve cylinder, and the calibration function is constructed by using Taylor series to perform polynomial approximation on the obtained multiple test pressures and the corresponding test pressures, thereby reducing the dependence on high-precision motors. The calibration process is simplified through polynomial approximation, and accurate calibration of the proportional valve cylinder pressure is achieved.

[0107] Obviously, those skilled in the art may make various modifications and variations to this application without departing from the spirit and scope of this application. Thus, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application is intended to include such modifications and variations.

[0108] It should be understood that although the steps in the flowcharts of the accompanying drawings are shown in sequence as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some of the steps in the flowcharts of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

[0109] The above examples are merely preferred embodiments of the present application and are not intended to limit the scope of the present application. Therefore, equivalent changes made according to the claims of the present application are still within the scope of the present application.

Claims

1. A semiconductor test sorting machine, characterized in that: The semiconductor test and sorting machine comprises: The test arm is provided with a test head, and the test head is used to absorb the chip to be tested; A test base equipped with a pressure sensor; a motor, configured to drive the test arm to move toward or away from the test base, so as to bring the test head into contact with or separate from the test base; a proportional valve cylinder, configured to sequentially drive the test head to apply multiple test pressures to the test base according to multiple preset test pressures, so as to apply corresponding pressures to the chip under test; the multiple test pressures are sensed by the pressure sensor; and A pressure calibration module includes a control unit, an acquisition unit, a calculation unit, and a calibration unit; the control unit is used to output the preset multiple test pressures to the proportional valve cylinder; the acquisition unit is used to obtain the multiple test pressures and the corresponding multiple test pressures; the calculation unit is used to obtain a calibration function between pressure and pressure based on the multiple test pressures and the corresponding multiple test pressures; the calibration unit is used to calibrate the pressure of the proportional valve cylinder according to the pressure required for testing the chip to be tested and the calibration function, so as to apply corresponding pressure to the chip to be tested.

2. The semiconductor test and sorting machine according to claim 1, wherein: The pressure calibration module further includes a setting unit, which is used to set the preset multiple test pressures in response to user operations.

3. The semiconductor test and sorting machine according to claim 1, wherein: The control unit is further configured to control the motor to drive the test arm to move.

4. The semiconductor test and sorting machine according to claim 1, wherein: The proportional valve cylinder is arranged between the end of the test arm away from the motor and the test head.

5. A pressure calibration method for a semiconductor test and sorting machine, wherein the semiconductor test and sorting machine is provided with a test arm, a test base, a motor and a proportional valve cylinder, wherein the test arm is provided with a test head for sucking a chip to be tested; the test base is provided with a pressure sensor; the motor is used to drive the test arm to move toward or away from the test base so that the test head and the test base are in contact or separated, characterized in that: The pressure calibration method comprises: Outputting the preset multiple test pressures to the proportional valve cylinder, so that the proportional valve cylinder sequentially drives the test head to apply multiple test pressures to the test base according to the preset multiple test pressures, so as to apply corresponding pressures to the chip under test, wherein the multiple test pressures are sensed by the pressure sensor; Obtaining the plurality of test pressures and the corresponding plurality of test pressures; Obtaining a calibration function between pressure and pressure according to the plurality of test pressures and the corresponding plurality of test pressures; The pressure of the proportional valve cylinder is calibrated according to the pressure required for testing the chip to be tested and the calibration function, so as to apply corresponding pressure to the chip to be tested.

6. The pressure calibration method for a semiconductor test handler according to claim 5, wherein: The motor is provided with an initial torque; before outputting the plurality of preset test pressures to the proportional valve cylinder, the pressure calibration method further comprises: The motor drives the test arm to move away from the test base until the test head reaches an initial position; adjusting the torque of the motor from the initial torque to a preset torque and outputting a maximum pressure to the proportional valve cylinder, so that the test head is driven to move from the initial position to contact with the test base without the proportional valve cylinder being contracted by the test head, thereby causing the test head to reach the contact position, wherein the maximum pressure is the maximum pressure that can be output to the proportional valve cylinder; The torque of the motor is adjusted to the initial torque, and any one of the preset multiple test pressures is output to the proportional valve cylinder, so that the test head moves a preset distance from the contact position to the test base until the chip to be tested is pressed against the test base, thereby enabling the test head to apply corresponding test pressure to the chip to be tested.

7. The pressure calibration method for a semiconductor test handler according to claim 5, wherein: The expression of the calibration function is Among them, A represents the test pressure, B represents the test pressure, and c k represents the fitting coefficient, n represents the test pressure and the number of corresponding test pressure groups; the expression of the test pressure is B = S * A + F, where S represents the effective area of the test head in the proportional valve cylinder that converts the test pressure into pressure, and F represents the friction force; the expression formula of the effective area is S = N * π * R 2 , where N represents the number of the proportional valve cylinders and R represents the radius of the proportional valve cylinders.

8. The pressure calibration method for a semiconductor test handler according to claim 5, wherein: Calibrating the pressure of the proportional valve cylinder according to the pressure required for testing the chip under test and the calibration function to apply corresponding pressure to the chip under test, including: Obtaining an ideal pressure according to the required pressure and the calibration function; Outputting the ideal pressure to the proportional valve cylinder, so that the proportional valve cylinder drives the test head to apply actual pressure to the test base according to the ideal pressure and applies corresponding pressure to the chip under test, and then the actual pressure is sensed by the pressure sensor; When the difference between the actual pressure and the required pressure is less than or equal to the preset pressure difference, it is determined that the calibration function meets the requirements; When the difference between the actual pressure and the required pressure is greater than a preset difference, multiple updated test pressures are output to the proportional valve cylinder until the updated calibration function meets the requirements, and the updated multiple test pressures are different from the preset multiple test pressures.

9. The pressure calibration method for a semiconductor test handler according to claim 6, wherein: After calibrating the pressure of the proportional valve cylinder, the pressure calibration method further includes: Obtaining a maximum test pressure according to preset maximum withstand pressures of different chips to be tested and the calibration function, wherein the preset maximum withstand pressure is obtained by the number of pins of the different chips to be tested and the maximum withstand pressure of the pins, and the preset multiple test pressures include the maximum test pressure; adjusting the torque of the motor to the preset torque and outputting the maximum pressure to the proportional valve cylinder to move the test head to the contact position; The torque of the motor is adjusted to the initial torque, and the maximum test pressure is output to the proportional valve cylinder so that the test head moves from the contact position to the target position, and then when any of the remaining test pressures is output to the proportional valve cylinder, the test head can be driven to move to the target position.

10. A pressure calibration module, characterized in that: The pressure calibration module is applied to a semiconductor test and sorting machine, wherein the semiconductor test and sorting machine is provided with a test arm, a test base, a motor and a proportional valve cylinder, wherein the test arm is provided with a test head, and the test base is provided with a pressure sensor; The pressure calibration module includes: Memory, for storing computer instructions; as well as The processor is used to execute the computer instructions so that the pressure calibration module performs the pressure calibration method of the semiconductor test and sorting machine as described in any one of claims 5 to 9.

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