Contact thermal resistance testing method and thermal resistance testing device

Abstract

The invention relates to the technical field of testing, in particular to a contact thermal resistance testing method and a thermal resistance testing device.The contact thermal resistance testing method comprises the following steps that S1, a heating piece with the preset temperature T2 DEG C is attached to the upper portion of a to-be-tested element, and a detection piece for measuring the contact temperature T1 DEG C and the heat flux Q is attached to the lower portion of the to-be-tested element; s2, measuring the numerical value of the interface thermal resistance Rimp by using a Fourier formula Rimp = (T1-T2) / Q; s3, inputting the heat conductivity coefficient lambda of the to-be-detected element, the macroscopic contact area S between the to-be-detected element and the detection piece and the thickness L of the to-be-detected element into a computer together, and calculating by using a formula Rimpp = 1 / lambda S * L + Rcon; s4, testing the interface thermal resistance Rimp under different thicknesses through a three-point method, and further obtaining the contact thermal resistance Rcon when L is equal to 0 through a linear regression method; 5, the slope of linear regression in the step 4 is 1 / lambda S, and the numerical value of the heat conductivity coefficient lambda of the material is obtained through inverse deduction.

Description

Technical Field

[0001] The present invention relates to the field of testing technology, and in particular to a contact thermal resistance testing method and a thermal resistance testing device. Background Art

[0002] With the development of microelectronics technology, electronic chips continue to tend towards miniaturization and integration. Heat is generally considered to be a limiting factor in the advancement of electronic systems. In the field of thermal design of electronic equipment, heat accumulation and excessive temperature rise will have a very adverse effect on the life and reliability of the device.

[0003] In various power electronic devices, the heat generated by the electronic devices needs to be transferred from the inside to the outside through several layers of contact surfaces. When different materials come into contact with each other, an interface is generated, which hinders the heat flow. This is where the concept of interfacial thermal resistance is applied.

[0004] When users test semiconductor devices, they need to use a semiconductor device steady-state thermal resistance test device. In the prior art, if there are gaps or unevenness in the contact interface between the semiconductor device and the test device, interface thermal resistance will be generated. This will make the overall measured contact thermal resistance larger than the actual contact thermal resistance, resulting in an inaccurate reflection of the device's true thermal performance. In addition, the interface thermal resistance may fluctuate due to slight differences in each device installation, affecting the test results. Therefore, before testing, people will manually apply thermal grease to the opposite sides of the test piece and the component to be tested to fill the microscopic uneven grooves and form a thermal conductive layer. For example, the invention patent with publication number CN119644090A proposes a device for applying it and then testing.

[0005] Thermal grease is actually a semi-solid substance, neither a pure solid nor a liquid. At room temperature, thermal grease can maintain a certain shape and does not flow freely, which gives it certain solid properties. However, when subjected to external forces, such as smearing or compression, thermal grease can exhibit a certain degree of fluidity, allowing it to better fill the tiny gaps between contact surfaces and improve heat transfer.

[0006] The existing technology uses simulation modeling to analyze the heat source distribution under different working conditions and derive the thermal contact resistance coefficient based on the modeling analysis. However, it is difficult to quickly test different semiconductor devices provided by customers. Therefore, we propose a method for testing contact thermal resistance.

[0007] The above information disclosed in this Background section is only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art. Summary of the Invention

[0008] The purpose of the present invention is to design a method for testing contact thermal resistance that is different from simulation modeling analysis to solve the above-mentioned shortcomings in the technology.

[0009] In order to achieve the above object, the present invention provides the following technical solution: a contact thermal resistance testing method, comprising the following steps:

[0010] S1. A heating element having a predetermined temperature of T2°C is attached above the element to be tested, and a detection element for measuring the contact temperature T1°C and the heat flux Q is attached below the element to be tested;

[0011] S2. Measure the interfacial thermal resistance Rimp using the Fourier equation Rimp = (T1 - T2) / Q.

[0012] S3. The thermal conductivity of the test element λ, the macro contact area S between the test element and the test piece, and the thickness L of the test element are input into the computer and calculated using the formula Rimp = 1 / λS * L + Rcon;

[0013] S4. Measure the interface thermal resistance Rimp at different thicknesses using the three-point method, and then calculate the contact thermal resistance Rcon at L = 0 using linear regression.

[0014] The slope of the linear regression in S5.S4 is 1 / λS, which can be used to infer the value of the material's thermal conductivity λ.

[0015] In a second aspect, the present invention further provides a thermal resistance testing device for testing the contact thermal resistance testing method, comprising a frame, a heating element mounted on the frame for vertical lifting, and a detection element mounted on the frame, wherein the frame is mounted with a placement table for placing the component to be tested, a clamping member is slidably mounted in the placement table, and when the clamping member is in contact with the detection element on all sides, an injection cavity is formed between the clamping member, the detection element, and the component to be tested, wherein one of the clamping members has an injection hole connected to the injection cavity, a toggle member is mounted on the bottom of the clamping member, and an elastic component is mounted between the toggle member and the clamping member;

[0016] After injecting heat dissipating silicone grease into the injection molding chamber through the injection hole, the toggle member is driven to pull the clamping member downward synchronously to scrape the heat dissipating silicone grease on the side wall onto the detection member, and then the elastic member pulls each clamping member away from the detection member.

[0017] Preferably, the clamping member includes a clamping plate and a guide rod slidably connected to the placement table, a connecting shaft fixedly connected on both sides of the clamping plate, and two guide plates fixedly installed on the guide rod, the two guide plates are respectively fitted with the top and bottom of the toggle member, the guide rod is fixedly installed at the bottom of the clamping plate, and the placement table is provided with an L-shaped groove that cooperates with the end of the connecting shaft.

[0018] Preferably, the toggle member includes a lifting plate slidably connected to the guide rod, a guide column passing through and slidably installed in the lifting plate, and a positioning piece fixedly installed on the lifting plate and cooperating with the elastic component, the top of the guide column is fixedly connected to the bottom of the placement table, and the two guide pieces are respectively located at the top and bottom of the lifting plate.

[0019] Preferably, the elastic component includes a first spring sleeved outside the guide column, and a second spring fixedly installed between the positioning plate and the guide plate, and the lifting plate and the placement platform are both fixedly connected to both ends of the first spring.

[0020] Preferably, a guide plate is fixedly mounted on the bottom of the lifting plate, and a reset plate is slidably mounted between the guide plate and the lifting plate, and the reset plate cooperates with the guide plate.

[0021] Preferably, the placement table consists of a first frame and a second frame, the bottom of the first frame and the second frame are both slidably installed with guide rails, the first frame and the second frame are respectively installed with a first rack and a second rack, and a gear rotatably installed with the frame is engaged between the first rack and the second rack, and the lifting plate consists of a first plate and a second plate, and the first plate and the second plate are slidably connected.

[0022] Preferably, a baffle is fixedly mounted on the frame, a push rod is fixedly mounted on the baffle, and a first through hole for the push rod to pass through is opened on the second frame.

[0023] Preferably, an injection pipe connected to the injection hole is fixedly mounted on the clamping plate, and a second through hole for the injection pipe to pass through is opened on the first frame.

[0024] Preferably, a matching plate is detachably mounted on the placement table, and a matching hole having a shape matching that of the component to be tested is provided in the matching plate.

[0025] In the above technical solution, the technical effects and advantages provided by the present invention are:

[0026] 1. The present invention detects the thickness, material coefficient and macroscopic contact area of the component to be tested, and uses the known temperature of the heating element and the temperature detected by the detection element in the existing machine to detect the contact thermal resistance using Rimp=(T1-T2) / Q and Rimp=1 / λS*L+Rcon;

[0027] 2. The present invention moves the DUT directly above the test piece, and aligns four clamping plates with the test piece and the DUT to form an injection cavity, into which heat dissipating silicone grease is injected. The four clamping plates are then controlled to first descend vertically and then move away from the test piece, thereby forming a rectangular heat dissipation layer between the test piece and the DUT bracket. Compared with the manual application method in the prior art, this method improves efficiency, avoids accidental application of large areas of grease onto the sides of the test piece, and improves application uniformity.

[0028] 3. At the same time, the present invention can adjust different supporting plates according to different components to be tested. With the clamping plate that only clamps the test piece, it can be applied to a variety of components to be tested with flat bottoms.

[0029] 4. After the heat dissipation layer is injected into the present invention, the clamping plate can be lowered and moved away from the detection part by only pressing the lifting plate downward. The operation is simple. When resetting the clamping plate, it is only necessary to push the reset plate and pull the placement table. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0031] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0032] Figure 2 This is a schematic diagram of the connection between the guide rail and the placement table of the present invention;

[0033] Figure 3 This is a schematic diagram of the connection between the placement table and the supporting plate of the present invention;

[0034] Figure 4 This is a schematic diagram of the bottom structure of the placement table of the present invention;

[0035] Figure 5 A side view of a placement table according to the present invention;

[0036] Figure 6 This is a schematic diagram of the disassembly of the first frame and the second frame of the present invention;

[0037] Figure 7 This is a schematic diagram of the disassembly of the placement table and the lifting plate of the present invention;

[0038] Figure 8 This is a schematic diagram of the connection between the second frame and the second plate of the present invention.

[0039] Description of reference numerals:

[0040] 1. Component to be tested; 2. Heating element; 3. Testing element; 4. Rack; 5. Placement table; 5a. First rack; 5b. Second rack; 6. Clamping element; 6a. Clamping plate; 6b. Guide rod; 6c. Connecting shaft; 6d. Guide piece; 6e. L-shaped slide; 7. Injection chamber; 8. Injection hole; 9. Toggle member; 9a. Lifting plate; 9a1. First plate; 9a2. Second plate; 9b. Guide column; 9c. Positioning piece; 10. Elastic component; 10a. First spring; 10b. Second spring; 11. Guide rail; 12. First rack; 13. Second rack; 14. Gear; 15. Baffle; 16. Push rod; 17. First through hole; 18. Injection pipe; 19. Second through hole; 20. Matching plate; 21. Matching hole; 22. Guide plate; 23. Reset plate. DETAILED DESCRIPTION

[0041] In order to help those skilled in the art better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of this application.

[0042] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0043] The present invention provides Figure 1-8 The figure shows a contact thermal resistance test method. Accurately measuring interface thermal resistance is also an important factor in selecting thermal interface materials during integrated circuit design. When heat flows through the contact interface, a discontinuous temperature difference ∆T is generated. According to Fourier's law, the interface thermal resistance Rimp can be expressed as: Rimp = (T1-T2) / Q.

[0044] Wherein, Rimp is the interface thermal resistance, T2 is the interface temperature of the heating element 2, T1 is the interface temperature of the detection element 3, and Q is the heat flux through the contact interface.

[0045] In the process of heat transfer from the chip to the heat sink, it needs to pass through multiple solid-solid interfaces. When contact heat transfer occurs between two components, due to the microscopic roughness of the solid surface, the components actually conduct contact heat transfer through discrete contact points. Studies have shown that the actual contact area between them is less than 3% of the corresponding surface area of the components, resulting in a very high interface thermal resistance. When the interface is filled with thermal grease, the actual contact area is increased and the value of the interface thermal resistance is reduced accordingly.

[0046] The standard commonly used in the industry for thermal resistance testing is ASTM D5470. Based on the Fourier equation Rimp = (T1-T2) / Q mentioned above, the temperature of the upper and lower interfaces and the heat flux flowing through them can be measured directly or indirectly, thereby obtaining the apparent interfacial thermal resistance of the material. From this interfacial thermal resistance, the contact thermal resistance and thermal conductivity can be further derived: Rimp = 1 / λS*L + Rcon.

[0047] Among them, Rimp is the interface thermal resistance of the material, λ is the thermal conductivity of the material, S is the macroscopic contact area between the components, L is the thickness of the interface material, and Rcon is the contact thermal resistance of the material.

[0048] In the specific test process, we can use the three-point method to test the interface thermal resistance at different thicknesses, and then use the linear regression method to obtain the thermal resistance when L=0. This thermal resistance is the contact thermal resistance Rcon, and the slope of the linear regression is 1 / λS, which gives the specific value of the thermal conductivity of the material.

[0049] In combination with a contact thermal resistance test method, the present invention also provides a detection method for testing a contact thermal resistance test method, comprising a rack 4, on which is mounted an existing heating element 2 that can be vertically lifted and lowered, and a detection element 3 fixedly mounted on the rack 4. The prior art uses a manual method to apply a certain thickness of heat dissipation silicone grease on the raised portion of the top surface of the detection element 3 with a small brush, and at the same time, a certain thickness of heat dissipation silicone grease is also applied to the component to be tested 1. After the heating element 2 is lifted and lowered, the component to be tested 1 is pressed toward the detection element 3, so that the heat dissipation silicone grease is filled between the detection element 3 and the component to be tested 1, filling the microscopic uneven grooves, and reducing the value of the interface thermal resistance. There are three main problems: first, the manual application efficiency is low; second, it is necessary to ensure that the heat dissipation silicone grease is only located on the top surface of the detection element during application, and manual application will inevitably cause mistakes and apply it to the side of the detection element; third, the thickness of the application is uneven, and the purpose of a complete thermal conductive layer cannot be achieved;

[0050] We have set up a placing table 5 on the frame 4, and the component to be tested 1 is placed on the placing table 5. We have slidably installed four clamping parts 6 on the placing table 5. The clamping part 6 is integrated with a clamping plate 6a, a guide rod 6b, two guide pieces 6d and two connecting shafts 6c. An L-shaped slide 6e for the connecting shaft 6c to slide is provided on the placing table 5. When the connecting shaft 6c is located at the top of the L-shaped slide 6e, the four clamping plates 6a are all fitted with the four side walls of the protruding part of the detection part 3 that needs to be coated with heat dissipation silicone grease. An injection cavity 7 is formed between the clamping plates 6a, the detection part 3 and the component to be tested 1. An injection hole 8 is penetrated in one of the clamping plates 6a, and an injection pipe 18 connected to the injection hole 8 is fixed on this clamping plate 6a. A second through hole 19 for the injection pipe 18 to penetrate is provided on the placing table 5. Injecting heat dissipation silicone grease into the injection pipe 18 can fill the injection cavity 7 with heat dissipation silicone grease to form a rectangular heat conductive layer.

[0051] In order to prevent the heat dissipation silicone grease from transferring heat to the clamping plate 6a, we have installed a toggle member 9 on the four guide rods 6b. The toggle member 9 includes a lifting plate 9a slidably connected to the guide rod 6b, a guide column 9b that passes through and slidably installed in the lifting plate 9a, and a positioning piece 9c fixedly installed on the lifting plate 9a. The top of the guide column 9b is fixedly connected to the bottom of the placement table 5. Two guide pieces 6d are respectively located at the top and bottom of the lifting plate 9a. When the lifting plate 9a is pressed away from the placement table 5, the lifting plate 9a will drive the guide column 9b to descend through the guide piece 6d, and the guide column 9b will drive the clamping plate 6a to descend. Since the edge of the clamping plate 6a is in contact with the raised edge of the detection part 3, the heat dissipation silicone grease attached to the clamping plate 6a will be scraped and left on the top of the detection part 3;

[0052] In order to prevent the clamping plate 6a from contacting the side of the detection part 3, an elastic component 10 is provided on the lifting plate 9a. The elastic component 10 includes a first spring 10a sleeved outside the guide column 9b, and a second spring 10b fixedly installed between the positioning piece 9c and the guide piece 6d. The lifting plate 9a and the placement table 5 are fixedly connected to both ends of the first spring 10a. When the lifting plate 9a descends, the first spring 10a is stretched. When the connecting shaft 6c moves down from the top of the L-shaped slide 6e, the second spring 10b will pull the connecting shaft 6c to the side away from the detection part 3 to the end of the L-shaped slide 6e under the action of the elastic force, thereby separating the clamping plate 6a from the detection part 3;

[0053] In order to facilitate the staff in placing the component to be tested 1 on the placement table 5, we set the placement table 5 to consist of a first frame 5a and a second frame 5b, and the first frame 5a and the second frame 5b are slidably installed with a guide rail 11 at the bottom, and the first frame 5a and the second frame 5b are respectively installed with a first rack 12 and a second rack 13, and the first rack 12 and the second rack 13 are meshed with a gear 14 rotatably mounted with the frame 4, and the lifting plate 9a consists of a first plate 9a1 and a second plate 9a2, and the first plate 9a1 and the second plate 9a2 are slidably connected, and a baffle 15 is fixedly installed on the frame 4. In this way, after the staff puts the component to be tested 1 on the placement table 5, they push the placement table 5 to slide on the guide rail 11 to just below the heating element 2, and when the first rack 12 is meshed with the gear 14, it will drive the second rack 13 to move, and the second rack 13 will drive the second frame 5b to move, thereby making the second plate 9a2 and the second plate 9a2 drive the clamping plate 6a to fit the raised side of the top of the detection component 3;

[0054] In order to ensure that the clamping plate 6a can automatically reset, we have fixedly installed a guide plate 22 at the bottom of the lifting plate 9a, and a reset plate 23 is slidably installed between the guide plate 22 and the lifting plate 9a. The reset plate 23 cooperates with the guide piece 6d. After the reset plate 23 contacts the three guide pieces 6d, it will squeeze the guide piece 6d to move toward the detection part 3. The guide piece 6d drives the clamping plate 6a, and the clamping plate 6a drives the connecting shaft 6c to move to one end of the L-shaped slide groove 6e close to the detection part 3. At this time, the clamping plate 6a is in contact with the raised side of the detection part 3. Since the elastic force of the second spring 10b is offset by the reset plate 23, the first spring 10a will push the first plate 9a1 up, and the second spring 10b will push the first plate 9a1 up. A plate 9a1 drives the guide column 9b to rise through the guide piece 6d, and the guide column 9b drives the clamping plate 6a to rise, and the clamping plate 6a drives the connecting shaft 6c to move to the top of the L-shaped slide 6e and get stuck. As for the second plate 9a2 installed on the second frame 5b, we have a push rod 16 fixedly installed on the baffle 15, and a first through hole 17 for the push rod 16 to pass through is opened on the second frame 5b. At this time, when the second frame 5b is driven by the second rack 13 away from the detection part 3 until it is in contact with the baffle 15, the push rod 16 will pass through the first through hole 17 to push the clamping plate 6a toward the detection part 3, thereby allowing the connecting shaft 6c on this clamping plate 6a to move to the top of the L-shaped slide 6e;

[0055] Finally, to ensure that this device is suitable for testing components of different shapes, we have detachably mounted a matching plate 20 on the placement table 5. The matching plate 20 has matching holes 21 that match the shape of the component 1 to be tested. It is only necessary to replace the matching plate 20 according to the different shapes of the component 1 to be tested.

[0056] The complete working process of this device is as follows: the operator places the component to be tested 1 into the matching hole 21, so that the bottom surface of the component to be tested 1 fits with the three clamping plates 6a and is supported by the placement table 5, and then pushes the placement table 5 to move to the bottom of the heating element 2. The second frame 5b will drive the fourth clamping plate 6a to contact the top side of the detection component 3 under the cooperation of the gear 14 and the second rack 13. At the same time, the second plate 9a2 will cooperate with the first plate 9a1, and then drive the heating element 2 down to press the component to be tested 1 onto the placement table 5 as in the prior art. Then, the heat dissipating silicone grease is injected into the injection chamber 7 through the injection tube 18 through an existing product such as an injection tube. When pressure is generated and the injection stops, the injection is stopped, and then the lifting plate 9a is pressed downward. The lifting plate 9a will drive the clamping plate 6a to move vertically downward, and then the second spring 10b will scrape the heat dissipation on the clamping plate 6a. After the silicone grease is on the top of the detection part 3, the clamping plate 6a is pulled away from the detection part 3. At this time, the detection can be carried out according to the existing operating method. After the detection is completed, the heating element 2 is controlled to rise and no longer press the detection element. Then the placement table 5 is pulled from the bottom of the heating element 2 to the end of the guide rail 11. At this time, the second frame 5b will move to fit the baffle 15, and the push rod 16 will pass through the first through hole 17 to push the clamping plate 6a. This clamping plate 6a will drive the connecting shaft 6c to move to the corner of the L-shaped slide groove 6e, and be pushed up and positioned by the first spring 10a. Then the component to be tested 1 is taken out of the matching hole 21, and the reset plate 23 is pushed toward the side of the detection part 3, so that the reset plate 23 pushes the guide piece 6d, and the guide piece 6d drives the guide rod 6b, thereby pushing the upper clamping plates 6a to reset, and finally the heat dissipating silicone grease on the raised part of the detection part 3 can be scraped off and recycled.

[0057] It is important to note that the construction and arrangement of the present application shown in a number of different exemplary embodiments are illustrative only. Although only a few embodiments are described in detail in this disclosure, those who refer to this disclosure should readily understand that many modifications are possible without materially departing from the novel teachings and advantages of the subject matter described in this application (e.g., the size, scale, structure, shape and proportion of various components, as well as parameter values (e.g., temperature, pressure, etc.), mounting arrangements, use of materials, colors, orientation changes, etc.).

Claims

1. A contact thermal resistance testing method, characterized in that: The following steps are involved: S1. A heating element (2) having a predetermined temperature T2°C is attached above the element to be tested (1), and a detection element (3) for measuring the contact temperature T1°C and the heat flux Q is attached below the element to be tested (1); S2. Measure the interfacial thermal resistance Rimp using the Fourier equation Rimp = (T1 - T2) / Q. S3. The thermal conductivity λ of the test element (1), the macroscopic contact area S between the test element (1) and the test piece (3), and the thickness L of the test element (1) are input into the computer and calculated using the formula Rimp=1 / λS*L+Rcon; S4. Measure the interface thermal resistance Rimp at different thicknesses using the three-point method, and then calculate the contact thermal resistance Rcon at L = 0 using linear regression. The slope of the linear regression in S5.S4 is 1 / λS, which can be used to infer the value of the material's thermal conductivity λ.

2. A thermal resistance testing device for testing a contact thermal resistance testing method according to claim 1, comprising a frame (4), a heating element (2) mounted on the frame (4) and capable of vertically lifting, and a detection element (3) mounted on the frame (4), characterized in that: A placement table (5) for placing the component to be tested (1) is installed on the frame (4), and a clamping member (6) is slidably installed in the placement table (5). When the clamping member (6) is in contact with the detection member (3) on all sides, an injection cavity (7) is formed between the clamping member (6), the detection member (3) and the component to be tested (1), and one of the clamping members (6) has an injection hole (8) connected to the injection cavity (7). A toggle member (9) is installed at the bottom of the clamping member (6), and an elastic component (10) is installed between the toggle member (9) and the clamping member (6); After injecting heat dissipating silicone grease into the injection molding chamber (7) through the injection hole (8), the toggle member (9) is driven to pull the clamping member (6) downward synchronously to scrape the heat dissipating silicone grease on the side wall onto the detection member (3), and then the elastic member pulls each clamping member (6) away from the detection member (3).

3. A contact thermal resistance testing method according to claim 2, characterized in that: The clamping member (6) includes a clamping plate (6a) and a guide rod (6b) slidably connected to the placement table (5), a connecting shaft (6c) fixedly connected to both sides of the clamping plate (6a), and two guide pieces (6d) fixedly installed on the guide rod (6b), the two guide pieces (6d) respectively fitting with the top and bottom of the toggle member (9), the guide rod (6b) being fixedly installed at the bottom of the clamping plate (6a), and an L-shaped sliding groove (6e) cooperating with the end of the connecting shaft (6c) being provided on the placement table (5).

4. A contact thermal resistance testing method according to claim 3, characterized in that: The toggle member (9) includes a lifting plate (9a) slidably connected to the guide rod (6b), a guide column (9b) penetrating and slidably installed in the lifting plate (9a), and a positioning piece (9c) fixedly installed on the lifting plate (9a) and cooperating with the elastic component (10), the top end of the guide column (9b) is fixedly connected to the bottom of the placement table (5), and the two guide pieces (6d) are respectively located at the top and bottom of the lifting plate (9a).

5. A contact thermal resistance testing method according to claim 4, characterized in that: The elastic component (10) includes a first spring (10a) sleeved outside the guide column (9b), and a second spring (10b) fixedly installed between the positioning plate (9c) and the guide plate (6d), and the lifting plate (9a) and the placement platform (5) are both fixedly connected to both ends of the first spring (10a).

6. A contact thermal resistance testing method according to claim 4, characterized in that: A guide plate (22) is fixedly mounted on the bottom of the lifting plate (9a), and a reset plate (23) is slidably mounted between the guide plate (22) and the lifting plate (9a), and the reset plate (23) cooperates with the guide plate (6d).

7. A contact thermal resistance testing method according to claim 4, characterized in that: The placing table (5) is composed of a first frame (5a) and a second frame (5b), and the bottom of the first frame (5a) and the second frame (5b) are both slidably mounted with guide rails (11). The first frame (5a) and the second frame (5b) are respectively mounted with a first rack (12) and a second rack (13). A gear (14) rotatably mounted with the frame (4) is engaged between the first rack (12) and the second rack (13). The lifting plate (9a) is composed of a first plate (9a1) and a second plate (9a2), and the first plate (9a1) and the second plate (9a2) are slidably connected.

8. A contact thermal resistance testing method according to claim 7, characterized in that: A baffle (15) is fixedly mounted on the frame (4), a push rod (16) is fixedly mounted on the baffle (15), and a first through hole (17) for the push rod (16) to pass through is provided on the second frame (5b).

9. The contact thermal resistance testing method according to claim 7, wherein: An injection pipe (18) communicating with the injection hole (8) is fixedly mounted on the clamping plate (6a), and a second through hole (19) for the injection pipe (18) to pass through is provided on the first frame (5a).

10. The contact thermal resistance testing method according to claim 1, wherein: A matching plate (20) is detachably mounted on the placement table (5), and a matching hole (21) having a shape matching that of the component to be tested (1) is provided in the matching plate (20).

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