Stacked die including multi-contact interconnects

Abstract

The invention relates to a stacked die including a multi-contact interconnect. A plurality of dies is within the first resin, and a conductive layer is on the first resin. A conductive layer is coupled between some of the first conductive vias extending into the first resin and respective dies of the plurality of dies. The conductive layer and the first conductive via couple some of the plurality of dies to each other. The second conductive vias extend into the first resin to the contact pads of the substrate, and the conductive layer is coupled to the second conductive vias, coupling some of the plurality of dies to the contact pads of the substrate. The second resin is on the first resin and covers the first resin and the conductive layer on the first resin. In some embodiments, the first resin includes a plurality of steps (e.g., step structures). In some embodiments, the first resin includes a sloped surface (e.g., a ramped surface).

Description

[0001] This application is a divisional application of the invention patent application with the application date of December 22, 2021 (the earliest priority date is December 23, 2020), the Chinese national application number 202111582094.4, and the name "Stacked tube core including multi-contact interconnects". Technical Field

[0002] The present disclosure relates to a package including a plurality of stacked dies coupled together using a multi-contact interconnect. The package includes a first resin on the plurality of dies and a second resin on the first resin. Background Art

[0003] Generally, semiconductor device packages, stacked die packages, and other types of semiconductor packages include a single die or multiple dies on a substrate covered by a resin (e.g., molding compound, encapsulant, or other suitable material). The die on the substrate is generally coupled to electrical components (e.g., electrical traces, contact pads, etc.) in and on the substrate. The electrical components of the substrate can be coupled to the die by wires or electrical traces extending through the resin.

[0004] When the electrical components of the substrate are coupled to the die via wires, the wires may be formed using wire bonding techniques (e.g., wedge bonding, ball bonding, conformal bonding, extrusion techniques, etc.). For example, when ball bonding and extrusion techniques are used, a ball of conductive material is formed on the contact pads of the die, and a wire is extruded from the ball onto the contact pads of the substrate. The wires formed using the ball bonding and extrusion techniques electrically couple the die to the substrate.

[0005] In some other cases, electrical connections between the electrical components of the substrate and the die can be formed by first forming recesses and openings in the resin, the openings exposing the contact pads of the substrate and the die. After the recesses and openings are formed, a conductive material is formed in the recesses by a plating technique that couples the contact pads of the substrate to the contact pads of the die. Summary of the Invention

[0006] Reducing the number of steps in these conventional processes to form semiconductor device packages, such as stacked die packages, would reduce manufacturing costs. Additionally, reducing the amount of material used to form electrical connections in semiconductor device packages would also reduce the manufacturing costs of those semiconductor device packages.

[0007] Embodiments of semiconductor device packages and methods of manufacturing semiconductor device package embodiments disclosed herein or within the scope of the present disclosure address at least the problem of reducing the number of steps and amount of material used to form electrical connections in semiconductor device package embodiments. Embodiments according to the present disclosure relate to at least stacked die packages.

[0008] The present disclosure relates to at least one embodiment of a stacked die package that includes a first resin, a second resin on the first resin, and a conductive layer between the first and second resins. In other words, the conductive layer is located on the first resin, and the second resin covers the first resin and the conductive layer.

[0009] The stacked die may include a first die on a substrate, a second die stacked on the first die, and a first resin on the substrate and encapsulating the first die and the second die. The second die is stacked on the first die so that the second die is offset relative to the first die. In other words, the first die has a first end and the second die has a second end extending beyond the first end. The first resin has a stepped structure (e.g., at least one step or multiple steps) covering the first die and the second die.

[0010] In some embodiments, the stacked die are coupled together with a conductive layer. A first conductive via extends into the first resin to reach the first die, a second conductive via extends into the first resin to reach the second die, and a third conductive via extends into the first resin to reach the substrate. The conductive layer is located on the stepped structure, coupled to the first conductive via, the second conductive via, and the third conductive via and extends between the first conductive via, the second conductive via, and the third conductive via. The conductive layer electrically couples the first conductive via, the second conductive via, and the third conductive via to each other, thereby electrically coupling the first die, the second die, and the substrate to each other. The conductive layer can be formed using a laser direct structuring (LDS) process that uses an LDS-compatible material for the first resin.

[0011] In an alternative embodiment, the first resin has an inclined surface covering the first die and the second die. A first conductive via extends into the inclined surface to reach the first die, a second conductive via extends into the inclined surface to reach the second die, and a third conductive via extends into the first resin to reach the substrate. A conductive layer is located on the inclined surface and electrically couples the first conductive via, the second conductive via, and the third conductive via to each other.

[0012] The stacked die package forming method disclosed herein includes forming a conductive layer on the surface of a first resin and forming conductive vias extending into the first resin using laser direct structuring (LDS) technology or process. The LDS technology involves moving a laser along the surface of the first resin to activate an additive within the first resin, and plating the activated additive at the surface of the first resin with a conductive material, thereby electrically coupling the stacked die within the first resin to each other and to a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] To better understand the embodiments, reference will now be made to the accompanying drawings by way of example. In the accompanying drawings, unless the context indicates otherwise, the same reference numerals identify similar elements or actions. The sizes and relative proportions of the elements in the accompanying drawings are not necessarily drawn to scale. For example, some of these elements may be enlarged and positioned to improve the readability of the drawings.

[0014] Figure 1A It is along Figure 1B A cross-sectional view of an embodiment of a stacked die package taken along line AA in FIG.

[0015] Figure 1B yes Figure 1A a top plan view of the illustrated stacked die package embodiment;

[0016] Figure 2A It is along Figure 2B A cross-sectional view of an alternative embodiment of a stacked die package taken along line BB in FIG.

[0017] Figure 2B yes Figure 2A A top plan view of an alternative embodiment of a stacked die package is shown;

[0018] Figure 3A It is along Figure 3B A cross-sectional view of an alternative embodiment of a stacked die package taken along line CC in FIG.

[0019] Figure 3B is a top plan view of an alternative embodiment of a stacked die package;

[0020] Figure 4A It is along Figure 4B A cross-sectional view of an alternative embodiment of a stacked die package taken along line DD in FIG.

[0021] Figure 4B yes Figure 4A A top plan view of an alternative embodiment of a stacked die package is shown;

[0022] Figure 5 is a cross-sectional view of an alternative embodiment of a stacked die package;

[0023] Figures 6A-6C Yes Figure 1A and Figure 1B An embodiment of a method of manufacturing the stacked die package embodiment shown;

[0024] Figure 7 Yes Figure 3A and Figure 3B an embodiment of a method of manufacturing the stacked die package alternative embodiment shown; and

[0025] Figure 8 Yes Figure 4Aand Figure 4B An embodiment of a method of manufacturing an alternative embodiment of a stacked die package is shown. DETAILED DESCRIPTION

[0026] In the following description, certain specific details are set forth to provide a thorough understanding of the various embodiments of the present disclosure. However, those skilled in the art will appreciate that the present disclosure can be practiced without these specific details. In other cases, well-known structures associated with electronic components, packaging, and semiconductor manufacturing technologies are not described in detail to avoid unnecessarily obscuring the description of the embodiments of the present disclosure.

[0027] Unless the context requires otherwise, throughout this specification and the appended claims, the word "comprise" and variations such as "include" and "comprising" should be construed in an open, inclusive sense, ie, "including, but not limited to."

[0028] The use of ordinal numbers such as first, second, third, etc. does not necessarily imply a sequential ordering sense but may simply distinguish between multiple instances of an action or similar structures or materials.

[0029] References throughout this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic associated with the embodiment is included in at least one embodiment. Therefore, the appearances of "in one embodiment" or "in an embodiment" in multiple places throughout this specification do not necessarily refer to the same embodiment. Furthermore, these particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0030] The terms "vertical," "horizontal," "lower," "upper," "top," "bottom," "left," and "right" are used only for the purpose of discussing component orientations in the following discussion of the drawings of the present disclosure. These terms are not limiting, as possible positions are explicitly disclosed, implicitly disclosed, or inherently disclosed in the present disclosure.

[0031] The term "substantially" is used to clarify that when a package is manufactured in the real world, there may be minor differences, as nothing can be completely identical or identical. In other words, substantially means that there may be some slight variations in actual practice, and alternatively, within acceptable tolerances.

[0032] As used in the specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise.

[0033] As previously discussed, embodiments of the present disclosure are directed to a stacked die package comprising at least one first die on a substrate and a second die stacked on the first die. A first resin encapsulates the first die and the second die. A conductive layer is located on a surface of the first resin and electrically couples some of a plurality of conductive vias extending into the first resin to the first die, the second die, and the substrate, respectively. The conductive vias and the conductive layer electrically couple the first die, the second die, and the substrate to one another. A second resin is located on the first resin and covers the conductive layer to protect the conductive layer from the external environment outside the stacked die package.

[0034] In some embodiments, the first resin has a stepped structure (e.g., one step or multiple steps), and a conductive layer is disposed on the stepped structure. The conductive layer on the stepped structure has a stepped structure that is the same as or similar to that of the first resin. The conductive layer couples some of the plurality of dies to each other.

[0035] Additionally or alternatively, the first resin has an inclined surface, and the conductive layer is located on the inclined surface. The conductive layer on the inclined surface has an inclination that is the same as or similar to the inclined surface of the first resin. The conductive layer couples some of the plurality of dies within the first resin to each other. The conductive layer can be formed using a laser direct structuring (LDS) technique or process, wherein a laser is moved along the surface of the first resin to activate an additive material within the first resin.

[0036] Some embodiments include a first conductive layer and a second conductive layer that are separate and distinct from each other. The first conductive layer and the second conductive layer are both on a first resin and covered by a second resin. Furthermore, the first conductive layer and the second conductive layer are formed using LDS technology or processes. The first conductive layer can be stepped, while the second conductive layer can be inclined.

[0037] Figure 1A It is along Figure 1B FIG. 1 is a cross-sectional view of an embodiment of a stacked die package 100 taken along line AA in FIG. Figure 1B is a top plan view of an embodiment of a stacked die package 100 .

[0038] like Figure 1A As shown, stacked die package 100 includes a substrate 102 having a first surface 104, a second surface 106 opposite first surface 104, and a plurality of sidewalls 105 extending from first surface 104 to second surface 106. Sidewalls 105 are transverse to first surface 104 and second surface 106.

[0039] The substrate 102 also includes a plurality of conductive pads 107 at the first surface 104 of the substrate 102. The conductive pads 107 may be bonding pads, mounting pads, or other suitable pads or connections for coupling the stacked die package 100 to an external electrical component (e.g., a package, a die, a printed circuit board (PCB), etc.), or for mounting the stacked die package 100 within an electronic device (e.g., a computer, a smartphone, a tablet, a television, a calculator, etc.). A plurality of solder balls 109 are coupled to the conductive pads 107, and the plurality of solder balls 109 are used to make electrical connections to the external electrical component or to an electronic device in which the stacked die package is mounted or utilized.

[0040] A plurality of dies 108a, 108b, 108c, and 108d (hereinafter referred to as 108a-108d in this disclosure) are provided on the second surface 106 of the substrate 102. The plurality of dies 108a-108d, which are stacked dies, include a first die 108a, a second die 108b, a third die 108c, and a fourth die 108d in a stacked configuration. The first die 108a is on the second surface 106 and is coupled to the second surface 106 via a first adhesive layer 110a. The second die 108b is on the first die 108a and is coupled to the first die 108a via a second adhesive layer 110b. The third die 108c is on the second die 108b and is coupled to the second die 108b via a third adhesive layer 110c. The fourth die 108d is on the third die 108c and is coupled to the third die 108c by a fourth adhesive layer 110d. The adhesive layers 110a-110d may be die attach film (DAF), glue, or some other adhesive material suitable for coupling the dies 108a-108d to each other and to the substrate 102.

[0041] The first die 108a is coupled to the pad 111 by an adhesive layer 110a, which is a conductive adhesive material that electrically couples the die 108a to the substrate 102. The pad 111 can be electrically coupled by an electrical connection (e.g., an electrical trace, an electrical via, etc.) extending from the pad 111 to at least one of the plurality of pads 107 at the first surface 104 of the substrate 102.

[0042] In some embodiments, adhesive layers 110a-110d may be made of a conductive adhesive material. In some embodiments, adhesive layers 110a-110d may be made of a non-conductive adhesive material. In some embodiments, some of adhesive layers 110a-110d may be conductive adhesive materials, while other adhesive layers 110a-110d may be non-conductive adhesive materials. Alternatively, in some embodiments, adhesive layers 110a, 110b, 110c, 110d may be replaced by multiple layers of die attach tape or multiple die attach films (DAF).

[0043] In other words, based on Figure 1A In the orientation of the stacked die package 100, the fourth die 108d (eg, the upper die) is located on top of the plurality of dies 108a-108d, and the first die 108a (eg, the lower die) is located on the bottom of the plurality of dies 108a-108d. Figure 1A In the orientation of the stacked die package 100 , the second die 108 b is sandwiched between the first die 108 a and the third die 108 c , and the third die 108 c is sandwiched between the second die 108 b and the fourth die 108 d .

[0044] The first die 108a has a first end 112a, the second die has a second end 112b, the third die 108c has a third end 112c, and the fourth die 108d has a fourth end 112d. The second end 112b extends beyond the first end 112a, so that the second end 112b overhangs the first end 112a. The third end 112c extends beyond the second end 112b, so that the third end 112c overhangs the first end 112a and the second end 112b, respectively. The fourth end 112d extends beyond the third end 112c, so that the fourth end 112d overhangs the first end 112a, the second end 112b, and the third end 112c, respectively.

[0045] First die 108a has a fifth end 112e opposite first end 112a. Each die includes an end that is stacked and displaced from fifth end 112e of first die 108a. For example, second die 108b has a sixth end 112f opposite second end 112b, third die 108c has a seventh end 112g opposite third end 112c, and fourth die 108d has an eighth end 112h opposite fourth end 112d. Eighth end 112h of fourth die 108d is above or otherwise displaced inward from end 112g of third die 108c. In other words, seventh end 112g is closer to sidewall 136. Sixth end 112f extends beyond seventh end 112g and is positioned or aligned relative to the surface of first die 112a, i.e., more centrally located than contact pad 116b. The fifth end 112 e of the first die 108 a is further away from the central axis of the package than the sixth end 112 f and is located on the second surface 106 of the substrate 102 .

[0046] Based on the previous discussion regarding the respective ends 112a - 112h of the plurality of dies 108a - 108d , it is readily understood that the plurality of dies 108a - 108d are stacked in an offset manner.

[0047] The first die 108a has a first solder pad 116a adjacent to the fifth end 112e. Although shown as being flush or coplanar with the fifth end 112e, the first solder pad 116a may be spaced apart from the fifth end 112e. The second die 108b has a second solder pad 116b at the sixth end 112f, closer to the sidewall 136 than the seventh end 112g. The third die 108c has a third solder pad 116c at the seventh end 112g, adjacent to the eighth end 112h. The fourth die 108d has a fourth solder pad 116d at the eighth end 112h. The solder pads 116a-116d are exposed and not covered by some of the plurality of die 108a-108d stacked on top of each other. Based on the offset arrangement of the plurality of die 108a-108d stacked, the solder pads 116a-116d remain exposed. The above-mentioned offset manner has been discussed in detail above, and therefore, for the sake of simplicity and brevity of the present disclosure, the offset manner of the stacked plurality of dies 108 a - 108 d will not be repeatedly discussed herein.

[0048] The first resin 117 is on, encapsulates, and surrounds the plurality of tube cores 108a-108d. The first resin 117 can be a laser direct structuring (LDS) compatible resin and can have the following non-limiting list of properties: (1) a coefficient of thermal expansion (CTE) in the range of about ten parts per million (10 ppm) per degree Celsius (°C) to 40 ppm / °C, (2) a flexural modulus at room temperature in the range of 12 gigapascals (GPa) to 30 GPa, and (3) additives within the LDS compatible resin that activate when exposed to a laser. Even though the first resin can have these properties, the first resin 117 can also be another type of resin having different properties but still suitable for the LDS process. Details of the LDS process will be referred to Figures 6A-6C Discuss in more detail.

[0049] The first resin 117 is located on the ends 112a-112h of the plurality of dies 108a-108d and on a surface 119 of the fourth die 108d facing away from the first die 108a, the second die 108b, and the third die 108c. The first resin 117 completely covers the ends 112a-112h of the plurality of dies 108a-108d and completely covers the surface 119 of the fourth die 108d.

[0050] The first resin 117 has a plurality of steps 118, and the plurality of steps 118 may be a step structure or a stepped structure integrally formed with the first resin 117. The plurality of steps 118 include four steps (for example, the upper step is based on Figure 1AThe plurality of steps 118 are oriented at the top of the stacked die package 100, with the upper steps extending upward to the surface 120 of the first resin 117, and the number of the steps 118 is the same as the number of the plurality of dies 108a-108d. The plurality of steps 118 includes a plurality of first surfaces (substantially horizontal in the figure) and a plurality of second surfaces (substantially vertical in the figure). The first surfaces are transverse to the second surfaces. The vertical surfaces can be substantially perpendicular to the horizontal surfaces (i.e., at 90 degrees). In some other embodiments, each vertical surface can be transverse to the corresponding horizontal surface at an angle of substantially 70 degrees, 80 degrees, 90 degrees, 100 degrees, 110 degrees, 120 degrees, etc.

[0051] The horizontal surface may be a tread, a step, or some other suitable surface of the step structure 118. The vertical surface may be a riser, a riser, or some other suitable surface of the step structure 118.

[0052] In some embodiments, the plurality of steps 118 may include two steps, three steps, or any suitable number of steps. For example, if the stacked die package 100 has five stacked dies, the plurality of steps 118 may include five steps; if the stacked die package 100 has six stacked dies, the plurality of steps 118 may include six steps; if the stacked die package 100 has seven stacked dies, the plurality of steps 118 may include seven steps; and so on. While in these discussed options there is a one-to-one relationship with the plurality of dies in the stacked die package, in some other embodiments, the stacked die package 100 may include four stacked dies and the plurality of steps 118 may include two steps, three steps, five steps, etc., or the stacked die package 100 may include three stacked dies and the plurality of steps 118 may include two steps, four steps, five steps, etc.

[0053] In some other embodiments, the plurality of steps 118 may be replaced with only a single step having a generally L-shaped structure. In other words, if there is only a single step, the step includes a first tread (e.g., based on Figure 1A The stacked die package 100 shown faces the lower horizontal surface), the second step (e.g., based on Figure 1A The stacked die package 100 shown faces the upper horizontal surface), and the vertical portion extending from the first step to the second step (eg, based on the example of FIG. Figure 1A The stacked die package 100 is shown oriented with vertical surfaces transverse to horizontal surfaces).

[0054] The first resin 117 includes a central surface 120 and a peripheral surface 122 disposed outwardly from the central surface 120. The peripheral surface 122 is closer to the substrate 102 than the central surface 120. The peripheral surface 122 covers and overlaps the substrate 102 and is outwardly spaced apart from the plurality of tube cores 108a-108d. The central surface 120 covers and overlaps some of the plurality of tube cores 108a-108d. Figure 1A In the orientation of the stacked die package 100, the central surface 120 can be an upper surface, a raised surface, or some other type of surface disposed closer to the top of the stacked die package 100 than the peripheral surface 122. Figure 1A In this orientation of the stacked die package 100 , the peripheral surface 122 may be a lower surface that is closer to the bottom of the stacked die package 100 than the central surface 120 .

[0055] The first resin 117 includes at least a first sidewall 124 and at least a second sidewall 126. Both sidewalls may be Figure 1A 120 . A first sidewall 124 extends from the second surface 106 of the substrate to the outer peripheral surface 122, and a second sidewall 126 extends from the outer peripheral surface 122 to the central surface 120. The first sidewall 124 is spaced outwardly from the second sidewall 126, and the second sidewall 126 is spaced inwardly from the first sidewall 124. The first sidewall 124 can be an outer sidewall, an outer sidewall, or some other type of sidewall. The second sidewall 126 can be an inner sidewall, an inner sidewall, or some other type of sidewall. The first sidewall 124 can be one of a plurality of first sidewalls 124 extending from the second surface 106 of the substrate to the outer peripheral surface 122. The second sidewall 126 can be one of a plurality of second sidewalls 126 extending from the outer peripheral surface 122 to the central surface 120.

[0056] Figure 1A The first side wall 124 on the right side has a first dimension D1 extending from the second surface 106 to the outer peripheral surface 122 . Figure 1A The right second sidewall 126 has a second dimension D2 extending from the outer peripheral surface 122 to the central surface 120. The first dimension D1 is smaller than the second dimension D2.

[0057] In some embodiments, some of the plurality of first sidewalls 124 may have a first dimension D1. In some embodiments, some of the plurality of first sidewalls 124 may have a first dimension D1, and other of the plurality of first sidewalls 124 may have a dimension larger or smaller than the first dimension D1.

[0058] In some embodiments, the first dimension D1 may be substantially equal to the second dimension D2. For example, in at least one other embodiment of the stacked die package 100 comprising only a single die on the substrate 102 covered by the first resin 117, the plurality of steps 118 may be formed by the same means as in the embodiment of FIG. Figure 1A The steps shown are replaced with a single step of the same size so that the first dimension D1 of the first sidewall 124 can be substantially equal to the second dimension D2 of the second sidewall 126. In at least another embodiment of the stacked die package 100, if the stacked die package 100 includes a similar Figure 1A The four dies in the embodiment and the plurality of steps 118 are formed only by Figure 1A If each step in is replaced by two steps of the same size, the first dimension D1 can be substantially equal to the second dimension D2.

[0059] In some embodiments, the first dimension D1 of the first sidewall 124 may be greater than the second dimension D2 of the second sidewall 126. For example, in at least one other embodiment of the stacked die package 100, if the stacked die package 100 includes similar Figure 1A The four dies in the Figure 1A If each step in the embodiment is replaced by a step of the same size, the first dimension D1 can be substantially larger than the second dimension D2.

[0060] A plurality of conductive vias 128a, 128b, 128c, and 128d (hereinafter referred to as 128a-128d in this disclosure) extend into the first resin 117. Some of the plurality of conductive vias 128a-128d extend into some of the plurality of steps 118, reaching some of the plurality of pads 116a-116d of the plurality of dies 108a-108d. The first conductive via 128a extends into the first step of the plurality of steps 118, i.e., the leftmost step of the plurality of steps 118, and reaches the first pad 116a. The second conductive via 128b extends into the second step of the plurality of steps 118, i.e., the step immediately adjacent to the leftmost step of the plurality of steps 118, and reaches the second pad 116b. The third conductive via 128c extends into the third step of the plurality of steps 118, i.e., the step immediately adjacent to the rightmost step of the plurality of steps 118, and reaches the third pad 116c. A fourth conductive via 128d extends into the fourth step of the plurality of steps 118, i.e., the rightmost step of the plurality of steps 118, to reach a fourth solder pad 116d. The fourth conductive via 128d extends into the central surface 120 of the first resin 117. A fifth conductive via 128e, located on the left side of the stacked die package 100, extends into the peripheral surface 122 of the first resin 117 to reach a solder pad 130 on the second surface of the substrate 102. The solder pad 130 can be coupled to at least one of the plurality of solder pads 107 on the first side 104 of the substrate 102 via an electrical connection (e.g., an electrical trace, an electrical via, etc.).

[0061] Based on Figure 1A In the orientation of the stacked die package 100 shown, the plurality of conductive vias 128a-128d are substantially vertical. Figure 1A With the orientation of the stacked die package 100 shown, the plurality of conductive vias 128a-128d may be angled rather than substantially vertical.

[0062] Conductive layer 132 is located on the plurality of steps 118. Conductive layer 132 covers the horizontal and vertical surfaces of the plurality of steps 118. Conductive layer 132 is located on the outer peripheral surface 122 and the central surface 120 of the first resin 117. Conductive layer 132 is located at the ends of the plurality of conductive vias 128a-128d and the end of the fifth conductive via 128e. Conductive layer 132 couples the plurality of conductive vias 128a-128d and the fifth conductive via 128e to each other. Conductive layer 132 is electrically coupled to the plurality of dies 108a-108d through the first, second, third, and fourth conductive vias 128a-128d, respectively. Conductive layer 132 is electrically coupled to pad 130 at the second surface 106 of substrate 102 through fifth conductive via 128e. Because the conductive layer 132 is on the horizontal and vertical surfaces of the plurality of steps 118 , the conductive layer 132 has a step structure or a stair-like structure that is the same as or similar to the plurality of steps 118 .

[0063] The conductive layer 132 and the plurality of conductive vias 128 a-128 d may be a multi-contact interconnect structure that couples the plurality of pads 116 a-116 d of the plurality of dies 110 a-110 d to each other and to the pads 130 of the substrate 102. The multi-contact interconnect structure may be a multi-contact interconnect step structure, a multi-contact interconnect ladder-like structure, a multi-contact step structure, a conductive interconnect structure, a stepped conductive interconnect structure, a multi-contact interconnect, or other suitable structure for coupling the plurality of stacked dies 108 a-108 d to each other and to the substrate 102.

[0064] Second resin 134 is disposed on conductive layer 132 and first resin 117. Second resin 134 covers conductive layer 132. Second resin 134 is disposed on and covers central surface 120, peripheral surface 122, and at least one second sidewall 126 of first resin 117. Second resin 134 may be a molding compound, an epoxy resin, an encapsulant, a non-conductive resin, an insulating resin, a dielectric resin, or some other type of resin material. Second resin 134 includes a plurality of sidewalls 136, including at least one sidewall that is substantially coplanar and flush with at least one first sidewall 124 of the first resin and one of the plurality of sidewalls 105 of substrate 102. Second resin 134 includes a surface 138 that extends transversely to and between some of the plurality of sidewalls 136.

[0065] In some embodiments, the second resin 134 does not cover the central surface 120, but rather exposes the central surface 120, such that the central surface 120 is substantially coplanar and flush with a surface 138 of the second resin 134, and the surface 138 surrounds the central surface 120. However, when the central surface 120 of the first resin 117 is substantially coplanar and flush with a surface 138 of the second resin 134, the conductive layer 132 is not present on the central surface 120, and the fourth via 128d is not present.

[0066] In some embodiments, second resin 134 does not cover conductive layer 132, thereby allowing electrical connection to be formed between conductive layer 132 and external electrical components. For example, solder material may be applied to the surface of conductive layer 132, and an external die may be coupled to the solder material on the surface of conductive layer 132.

[0067] In some embodiments, second resin 134 is not present in stacked die package 100 . In other words, second resin 134 is not present on first resin 117 and conductive layer 132 .

[0068] Figure 2A It is along Figure 2B A cross-sectional view of an alternative embodiment of the stacked die package 200 taken along line BB in FIG. Figure 2B yes Figure 2A A top plan view of an alternative embodiment of a stacked die package 200 is shown. Figures 2A-2B is an alternative embodiment of the stacked die package 200 having the same or similar features as the stacked die package 100. For the sake of simplicity and brevity of this disclosure, only the stacked die package 200 will be discussed in further detail below in this disclosure. Figures 1A-1B Different or additional features of the stacked die package 100 are shown.

[0069] and Figure 1A Unlike the first resin 117 in the stacked die package 100 shown, the first resin 202 of the stacked die package 200 comprises Figure 2A The first inclined surface 204 on the left side and Figure 2A The second inclined surface 206 on the right side. The first inclined surface 204 and the second inclined surface 206 are separated from each other by a central surface 208. The first and second inclined surfaces 204, 206 extend from the outer peripheral surface 210 of the first resin 202 to the central surface 208. The first and second inclined surfaces 204, 206 can be inclined surfaces, angled surfaces, or other suitable surfaces with an inclination. The central surface 208 and the outer peripheral surface 210 are Figure 1A The central surface 120 and the peripheral surface 122 of the illustrated first resin 117 are the same or similar.

[0070] The first inclined surface 204 is at a first angle θ1 relative to the peripheral surface 210, and the second inclined surface 206 is at a second angle θ2 relative to the peripheral surface 210. The first angle θ1 can be 100 degrees, 110 degrees, 120 degrees, 130 degrees, 170 degrees, or other appropriate angles. The second angle θ2 can be 100 degrees, 110 degrees, 120 degrees, 130 degrees, 170 degrees, or other appropriate angles. The first angle θ1 and the second angle θ2 can be selected based on the orientation of the plurality of tube cores 212a, 212b, 212c, 212d within the first resin 202. The plurality of tube cores 212a-212d are the same or similar to the plurality of tube cores 108a-108d. For example, the plurality of tube cores 212a-212d are selected based on the orientation of the plurality of tube cores 212a, 212b, 212c, 212d within the first resin 202. Figures 1A-1B The offset modes discussed are identical or similar offset modes are stacked.

[0071] The plurality of dies 212a-212d are arranged in a Figure 1A On a substrate 215 that is the same or similar to the substrate 102 shown. Figure 1A The plurality of adhesive layers 110a-110d are the same as or similar to the plurality of adhesive layers 213a, 213b, 213c, 213d, which couple the plurality of dies 212a-212d together and stack them. Figure 1ASimilar to the illustrated first resin 117 , the first resin 202 of the stacked die package 200 encapsulates the plurality of dies 212 a - 212 d in the stacked die package 200 .

[0072] and Figures 1A-1B Unlike the plurality of conductive vias 128a-128d shown, the plurality of conductive vias 214a, 214b, 214c, 214d extend at an angle to corresponding pads 216a, 216b, 216c, 216d of the plurality of dies 212a-212d, such that the conductive vias 214a-214d are not only based on Figure 2A The orientation of the stacked die package 200 extends in a vertical direction and is based on Figure 2A The package is shown oriented horizontally. Each of the conductive vias 214a-214d extends into the first resin 202 to a corresponding pad in the plurality of pads 216a-216d. The plurality of conductive vias 214a-214d includes a first conductive via 214a, a second conductive via 214b, a third conductive via 214c, and a fourth conductive via 214d. The plurality of pads 216a-216d includes a first pad 216a of the first die 212a, a second pad 216b of the second die 212b, a third pad 216c of the third die 212c, and a fourth pad 216d of the fourth die 212d. In other words, the first conductive via 214a extends to the first pad 216a, the second conductive via 214b extends to the second pad 216b, the third conductive via 214c extends to the third pad 214c, and the fourth conductive via 214d extends to the fourth pad 214d.

[0073] The fifth conductive via 214e is Figure 2B The left side of the fifth conductive via 214e extends into the outer peripheral surface 210 and reaches the pad 218 of the substrate 215. Figure 1A-1B The fifth conductive via 128e is the same or similar as shown. Figure 1A The pads 130 of the substrate 102 are shown to be the same or similar.

[0074] and Figure 1A-1B Unlike the conductive layer 132 having a step structure, the conductive layer 220 is located between the first inclined surface 204 and the second inclined surface 206. Figure 2B The conductive layer 220 is on the outer peripheral surface 210 on the left side. The conductive layer 220 has an inclined surface of the first inclined surface 204. The conductive layer 220 extends between some of the plurality of conductive vias 214a-214d and the fifth conductive via 214e. Figures 1A-1B The conductive layer 132 is shown coupling the plurality of conductive vias 214 a - 214 d and the fifth conductive via 214 e together in the same or similar manner.

[0075] The second resin 222 covers and is located on the first inclined surface 204, the second inclined surface 206, the central surface 208, and the outer peripheral surface 210. Figures 1A-1B The second resin 134 is the same or similar as shown. In some embodiments, the second resin 222 may not cover the center surface 208, such as Figure 2B As shown, and in contrast, the second resin 222 may be substantially coplanar and flush with the center surface 208 .

[0076] The substrate 215 has Figure 1A-1B The first sidewalls 224 are the same as or similar to the sidewalls 105 of the substrate 102 shown. Figure 1A-1B The second resin 222 has at least one second sidewall 226 that is the same as or similar to the at least one first sidewall 124 of the first resin 117. Figures 1A-1B The second resin 134 is shown with the same or similar third sidewalls 228 as the plurality of sidewalls 136. One of the plurality of first sidewalls 224, at least one second sidewall 226, and one of the plurality of third sidewalls 228 are substantially coplanar and flush with each other. For example, one first sidewall 224, at least one second sidewall 226, and one third sidewall 228 are substantially coplanar and flush with each other. Figure 2A The right sides of the side walls 224 , 226 , and 228 are substantially flush with each other.

[0077] Figure 3A It is along Figure 3B A cross-sectional view of an alternative embodiment of a stacked die package 300 taken along line CC in FIG. Figure 3B yes Figure 3A A top plan view of an alternative embodiment of a stacked die package 300 is shown. Figure 3A-3B is an alternative embodiment of the stacked die package 300 having the same or similar features as the stacked die packages 100 and 200. For simplicity and brevity of this disclosure, only the stacked die package 300 will be discussed in further detail below. Figures 1A-1B and different or additional features of the stacked die packages 100 , 200 shown in FIG. 2A-2B .

[0078] and Figure 1A-1B and Figure 2A-2B Unlike the stacked die packages 100 and 200 shown, the stacked die package 300 includes a first inclined surface 304 and a first resin 306. Figure 3A The first conductive layer 302 is located on the outer peripheral surface 305 of the first resin 306 on the left. The second conductive layer 308 is located on the central surface 310 and the central surface 311 of the first resin 306. Figure 3AOn the second inclined surface 312 of the first resin 306 on the right side. Figure 2A The conductive layer 220 is the same or similar as shown. The first resin 306 is Figure 2A The first resin 222 is the same or similar as shown. The first inclined surface 304 is the same as Figure 2A-2B The outer peripheral surface 305 is the same as or similar to the first inclined surface 204 shown in FIG. Figure 2A-2B The peripheral surface 210 is the same or similar as shown. The central surface 310 is the same as Figure 1A-1B The second inclined surface 312 is the same as or similar to the central surface 208 shown. Figure 2A-2B The second inclined surfaces 206 shown are the same or similar.

[0079] The second conductive layer 308 on the central surface 310 and the second inclined surface 312 of the first resin 306 is coupled to the conductive via 314. Figure 3A The conductive via 314 extends through the first resin 306 and reaches the pad 316 of the substrate 318. The pad 316 can be coupled to one of the plurality of pads 319 on the side of the substrate 318 opposite to the side where the pad 316 exists. One of the plurality of pads 319 coupled to the pad 316 can be grounded.

[0080] The second conductive layer 308 is an electromagnetic interference (EMI) shielding layer for protecting the electrical components within the first resin 306 from external electrical signals. For example, the second conductive layer 308 absorbs external electrical signals from outside the stacked die package 300, transmits the absorbed external electrical signals to the conductive via 314, and then passes the absorbed external electrical signals through one of the plurality of pads 318 coupled to the pad 316, and then the external electrical signals leave the stacked die package 300. The external electrical signals do not reach the plurality of dies 320a, 320b, 320c, 320d in the package 300. The plurality of dies 320a-320d are respectively connected to the plurality of dies 100, 200, and 320d in the package 300. Figure 1A-1B and Figure 2A-2B The plurality of dies 108a-108d, 212a-212d shown in FIG. 3 are the same or similar. For example, the plurality of dies 320a-320d may be the same as Figure 1A-1B and Figure 2A-2B The packages 100 and 200 are stacked in the same or similar offset manner as shown in FIG.

[0081] The second resin 321 covers the first conductive layer 302, the first resin 306, and the second conductive layer 308. Figure 1A-1B and Figure 2A-2B The second resins 134 , 222 shown are the same or similar.

[0082] The first conductive layer 302 is coupled to some of the plurality of dies 320a-320d through a plurality of conductive vias 322a, 322b, 322c, 322d. Figure 2A-2B The plurality of conductive vias 212a-212d are the same or similar as those shown in the package 200. Each of the plurality of conductive vias 322a-322d is coupled to a corresponding die in the plurality of dies 320a-20d. The first conductive layer 302 is coupled to the conductive via 322e, from Figure 3A As can be seen on the left side, the conductive via 322e extends into the first resin 306 and reaches the contact pad 324 of the substrate 318. Figure 1A-1B and Figure 2A-2B The conductive vias 128e, 214e in the illustrated packages 100, 200 are identical or similar. The contact pads 324 and Figure 1A and 2A The contact pads 130 , 218 in the illustrated packages 100 , 200 are the same or similar.

[0083] Figure 4A It is along Figure 4B An alternative embodiment of the stacked die package 400, taken along line DD in FIG. Figure 4B yes Figure 4A A top plan view of an alternative embodiment of package 400 is shown.

[0084] Figures 4A-4B is an alternative embodiment of the stacked die package 400 having the same or similar features as the stacked die packages 100, 200, and 300. For simplicity and brevity of this disclosure, only the stacked die package 300 will be discussed in further detail below with respect to the stacked die package 400. Figure 1A-1B 、 Figure 2A-2B and Figure 3A-3B Different or additional features of the stacked die packages 100 , 200 , 300 are shown.

[0085] and Figure 1A-1B 、 Figure 2A-2B and Figure 3A-3B Unlike the first resins 117, 202, and 306 shown, the first resin 402 has a reservoir 404 located between a first portion 402a of the first resin 402 and a second portion 402b of the first resin 402. The first portion 402a can be a wall portion, a sidewall portion, a border portion, or other type of portion of the first resin 402. The first portion 402a extends away from the substrate 414 on which the first resin 402 is located. The second portion 402b of the first resin 402 surrounds and encapsulates a plurality of dies 406a, 406b, 406c, and 406d. The plurality of dies 406a-406d are respectively connected to the substrate 414 as shown in FIG. Figure 1A-1B 、 Figure 2A-2B and Figure 3A-3B The plurality of dies 108a-108d, 212a-212d, 320a-320d in the illustrated packages 100, 200, and 300 are identical or similar. A third portion 402c of the first resin 402 extends from the first portion 402a to the second portion 402b. The first portion 402a, the second portion 402b, and the third portion 402c are integrally formed with the first resin 402 and with each other. In other words, the first portion 402a, the second portion 402b, and the third portion are formed from a single, continuous material of the first resin 402. The second portion 402b has an inclined surface 407 with a conductive layer 408 disposed thereon. In other words, the conductive layer 408 is on and covers the inclined surface 407 of the first resin 402. The inclined surface 407 and the conductive layer 408 are within the reservoir 404.

[0086] The conductive layer 408 is respectively connected to Figure 2A-2B and Figure 3A-3B The conductive layers 220 and 302 are the same or similar as those shown in the packages 200 and 300 of the present invention. The conductive layer 408 is coupled to some of the plurality of dies 406a-406d through a plurality of conductive vias 410a, 410b, 410c, and 410d, each of which is coupled to a corresponding die in the plurality of dies 406a-406d. The plurality of conductive vias 410a-410d are connected to the plurality of conductive vias 410a-410d. Figure 2A-2B and Figure 3A-3B The conductive vias 212a-212d, 322a-322d in the packages 200, 300 are the same or similar. For example, a plurality of conductive vias 410a-410d extend into the inclined surface 407 of the first resin 402. The conductive layer 408 is coupled to the conductive via 410e, which extends through the third portion 402c of the first resin 402 to the contact pad 412 of the substrate 414. The conductive via 410e is connected to the conductive via 410e. Figure 1A-1B 、 Figure 2A-2B and Figure 3A-3B The conductive vias 128e, 214e, 322e in the illustrated packages 100, 200, 300 are the same or similar. The contact pads 412 are Figure 1A 、 Figure 2A and Figure 3A The contact pads 130, 218, 324 in the illustrated packages 100, 200, 300 are the same or similar. Figure 1A-1B 、 Figure 2A-2B and Figure 3A-3B The substrates 102 , 215 , 318 in the illustrated packages 100 , 200 , 300 are the same or similar.

[0087] Reservoir 404 is filled with second resin 416, which is separated from substrate 414 by third portion 402c of first resin 402. First resin 402 includes first surface 418, and second resin 416 includes second surface 420. First surface 418 and second surface 420 face away from substrate 414. First surface 418 is further away from substrate 414 than second surface 420. Second surface 420 is recessed within first resin 402.

[0088] In some embodiments, first surface 418 and second surface 420 are substantially coplanar and flush with each other. In other words, second surface 420 is not recessed within first resin 402. In some embodiments, second resin 416 covers first surface 418 of first resin 402, and second surface 420 is further away from substrate 414 than first surface 418.

[0089] Figure 5 Along with Figure 1B 、 Figure 2B 、 Figure 3B and Figure 4B A cross-sectional view of the package 500 taken along lines similar to lines AA, BB, CC, and DD in FIG. Figure 1A-1B 、 Figure 2A-2B 、 Figure 3A-3B and Figure 4A-4B For simplicity and brevity of this disclosure, only the stacked die package 500 will be discussed in further detail below with respect to the stacked die package 100, 200, 300, 400. Figure 1A-1B 、 Figure 2A-2B 、 Figure 3A-3B and Figure 4A-4B Different or additional features of the stacked die packages 100 , 200 , 300 , 400 are shown.

[0090] Unlike packages 100, 200, 300, and 400, package 500 includes a package that is closer to the Figure 5 The first set of stacked dies 502 on the left and closer Figure 5 The second group of stacked dies 504 on the right. The first group of stacked dies 502 and the second group of stacked dies 504 are mirror images of each other. In some embodiments, the first group of stacked dies 502 and the second group of stacked dies 504 may not be mirror images of each other. The first group of stacked dies 502 and the second group of stacked dies 504 are separated from each other by openings 506.

[0091] The first resin 508 covers and encapsulates the first group of stacked dies 502 and the second group of stacked dies 504. The first resin 508 fills the opening 506 between the first group of stacked dies 502 and the second group of stacked dies 504. The first conductive layer 512 is located on the first inclined surface 514 of the first resin, and the second conductive layer 516 is located on the second inclined surface 518. The first conductive layer 512 and the first inclined surface 514 are opposite to the second conductive layer 516 and the second inclined surface 518. The first conductive layer 512 and the second conductive layer 516 are opposite to the first conductive layer 512 and the second conductive layer 516. Figure 2A-2B 、 Figure 3A-3B and Figure 4A-4B The conductive layers 220, 302, 408 in the packages 200, 300, 400 are identical or similar. The first inclined surface 514 and the second inclined surface 518 are respectively Figure 2A 、 Figure 3A and Figure 4A The angled surfaces 204 , 304 , 407 in the illustrated packages 200 , 300 , 400 are the same or similar.

[0092] A first plurality of first conductive vias 520a, 520b, 520c, 520d couples the first conductive layer 512 to some of the dies in the first group of stacked dies 502, and a second plurality of second conductive vias 522a, 522b, 522c, 522d couples the second conductive layer 516 to some of the dies in the second group of stacked dies 504. Figure 2A-2B 、 Figure 3A-3B and Figure 4A-4B The conductive vias 214a-214d, 322a-322d, 410a-410d in the illustrated packages 200, 300, 400 are the same or similar.

[0093] The first conductive layer 512 and the second conductive layer 516 are coupled to the substrate 523. The first conductive layer 512 is coupled to a conductive via 520e, which extends into the first resin 508 to reach a first contact pad 524 of the substrate 523, as shown in FIG. Figure 5 The second conductive layer 516 is coupled to the conductive via 522e, which extends into the first resin 508 and reaches the second contact pad 526 of the substrate 523, as shown in FIG. Figure 5 As shown on the right. Conductive vias 520e, 522e and Figure 1A-1B 、 Figure 2A-2B 、 Figure 3A-3B and Figure 4A-4B The conductive vias 128e, 214e, 322e, 410e in the illustrated packages 100, 200, 300, 400 are the same or similar. The contact pads 524, 526 are the same as those in FIG. Figure 1A 、2A The contact pads 130, 218, 324, 412 in the packages 100, 200, 300, 400 shown in FIG3A and FIG4A are the same or similar.

[0094] The second resin 528 is located on the first inclined surface 514 and the second inclined surface 518 of the first resin 508. The second resin 528 is located on the first conductive layer 512 and the second conductive layer 516 and covers the first conductive layer 512 and the second conductive layer 516. Figure 1A-1B 、 Figure 2A-2B 、 Figure 3A-Figure 3B and Figure 4A-4B The second resin 134, 222, 322, 416 in the packages 100, 200, 300, 400 shown are the same or similar. The second resin 528 includes a Figure 5 The first portion 528a on the left and the Figure 5 The second portion 528b on the right side. The first portion 528a is separated from the second portion 528b by the first resin 508.

[0095] The first resin 508 has a first surface 530 facing away from the substrate 523. A first portion 528a of the second resin 528 includes a second surface 532 facing away from the substrate 523. A second portion 528b of the second resin 528 includes a third surface 534 facing away from the substrate 523. The first surface 530, the second surface 532, and the third surface 534 are substantially coplanar and flush with each other, thereby forming a single surface or a single surface. In some embodiments, the second resin 528 can be located on and cover the first surface 530 of the first resin 508.

[0096] In some embodiments, the first portion 528a and the second portion 528b are separate and distinct portions separated from each other by the first resin 508. In some embodiments, when the second resin 528 surrounds the first resin 508, the first portion 528a and the second portion 528b are continuous and integrally formed with each other.

[0097] In some embodiments, the die may be stacked on the first group of stacked die 502 and the second group of stacked die 504. In other words, the die extends from the first group of stacked die 502 to the second group of stacked die 504.

[0098] Figures 6A-6C Yes Figure 1A-1B100 is a cross-sectional view illustrating various steps of an embodiment of a method for manufacturing an embodiment of package 100. For the sake of brevity and simplicity of this disclosure, details previously discussed regarding package 100 will not be repeated herein. Although the following description of the steps of the method for manufacturing package 100 is provided as being completed in a particular order, it will be readily understood that the steps of the method for manufacturing package 100 may be reorganized or rearranged to form package 100 using alternative embodiments of the method for manufacturing package 100.

[0099] like Figure 6A As shown, in an embodiment of a method for manufacturing the stacked die package 100, grouped stacked dies 602 are stacked on a substrate 604, which may be a wafer, a printed circuit board (PCB), a lead frame substrate, or a silicon substrate. The grouped stacked dies 602 may be some of the grouped stacked dies in an array of grouped stacked dies on the substrate 604. The grouped stacked dies 602 include a plurality of stacked dies located on the substrate 604. Figure 6A The first set of stacked dies on the left and the Figure 6A The second set of stacked dies on the right. Figures 6A-6C As shown, each stacked die group 602 has four dies. At least one stacked die group 602 is connected to Figure 1A-1B The plurality of dies 108a-108d shown are identical or similar. In other words, each set of stacked dies 602 corresponds to Figure 1A-1B The plurality of dies 108a-108d in the package 100 are shown. The adhesive layer 606 is used to couple the dies in the group of stacked dies 602 to each other and to couple the group of stacked dies 602 to the substrate 604. The adhesive layer 606 is connected to the substrate 604. Figure 1A-1B The illustrated adhesive layers 110a - 110d are identical or similar. The grouped stacked dies 602 may be stacked and coupled on the substrate 604 by pick and place techniques or other suitable techniques for stacking and coupling the grouped stacked dies 602 on the substrate 604 .

[0100] In some embodiments, each group of stacked dies 602 may have two stacked dies, three stacked dies, five stacked dies, or any number of stacked dies as desired. Figure 6A At each arrangement position of each group of stacked dies 602 shown, the group of stacked dies 602 stacked on the substrate 604 may be replaced by a single die.

[0101] After the stacked dies 602 are stacked and coupled on the substrate 604, a first resin 608 is formed on the stacked dies 602. The first resin 608 is formed to include a group of steps 610, each group of steps 610 being connected to the substrate 604. Figure 1A-1B The plurality of steps 118 in the package 100 shown are identical or similar; and a sidewall 611, the sidewall 611 and the Figure 1A-1BThe second sidewalls 126 of the illustrated packages 100 are identical or similar. The set of steps 610 includes a step closer to the Figure 6A The first plurality of steps 610 on the left side corresponds to the Figure 6A The first set of stacked dies 602 on the left, and closer Figure 6A The second plurality of steps 610 on the right side corresponds to the Figure 6A The second group of stacked dies 602 on the right. In other words, each set of steps 610 corresponds to at least one respective group of stacked dies 602.

[0102] The first resin 608 can be a molding compound, an encapsulant, an epoxy resin, or another non-conductive material. The resin 604 is formed by compression molding, injection molding, or other techniques for forming the resin 604. For example, if injection molding is used, a molding tool having a protrusion with a shape or structure similar to that of the grouped steps 610 and sidewalls 611 is used to form the grouped steps 610. The molding tool is aligned over and aligned with the plurality of stacked dies 602, and then the first resin 608 is injected between the molding tool and the substrate 604. The injected first resin 608 is formed on and covers the grouped stacked dies 602. The first resin 608 is then allowed to cure between the molding tool and the substrate 604. The molding tool is then removed from the first resin 608 after the first resin 608 has cured, forming the grouped steps 610 and sidewalls 611 of the first resin 608.

[0103] In some embodiments, the first resin 608 can be formed on the plurality of stacked dies 602 without the grouped steps 610, and after the first resin 608 is cured, the first resin 608 is patterned by at least an etching technique, a laser technique, or other removal technique or combination of removal techniques suitable for removing a portion of the first resin 608 to form the grouped steps 610.

[0104] like Figure 6B As shown, after forming the group of steps 610 in the first resin 608, a first conductive via 612, a second conductive via 614, and a conductive layer 620 are formed. The first conductive via 612 extends into the step in the group of steps 610 in the first resin 608, contacting the contact pad 613 of the die in the group of stacked dies 602, and the second conductive via 614 extends into the first resin 608, contacting the contact pad 616 of the substrate 604. The contact pad 616 of the substrate 604 is coupled to at least one contact pad of a plurality of contact pads 618 of the substrate 604, and the plurality of contact pads 618 are located on a side of the substrate 604 opposite to the side of the substrate 604 where the contact pad 616 is provided. The first conductive via 612 is connected to the substrate 604. Figure 1A-1BThe conductive vias 128a-128d in the package 100 shown are identical or similar, and the second conductive via 614 is identical or similar to the conductive vias 128a-128d in the package 100 shown. Figure 1A The conductive via 128e in the package 100 shown is the same or similar. The contact pad 616 is Figure 1A The pads 130 shown are the same or similar. The contact pads 618 are Figure 1A The conductive pads 107 shown are the same or similar.

[0105] The first conductive via 612 and the second conductive via 614 are formed by laser drilling holes in the first resin 608 using a laser and then performing an electroplating process. The conductive layer 620 is formed by moving the laser along and across the surface of the set of steps 610 to activate the additive material in the first resin 608 and then performing an electroplating process.

[0106] Drilling holes into first resin 608 forms openings or recesses extending into first resin 608. Each opening or recess corresponds to at least one contact pad 613 of grouped stacked die 602 or at least one contact pad 616 of substrate 604. The openings or recesses expose some of the contact pads 613 and 616 of grouped stacked die 602 and substrate 604, respectively. Laser drilling holes into first resin 608 to form openings and recesses activates the additive material in first resin 608, allowing the additive material to be located on and exposed along the sidewalls of the openings or recesses. The additive material may be a material doped into first resin 608. While in first resin 608, the additive material may be relatively non-conductive compared to after exposure to the laser. When exposed to the laser, the additive material in first resin 608 becomes conductive, allowing the additive material to attract another conductive material during an electroplating process or other suitable plating process.

[0107] In one embodiment, a laser forms a micro-rough surface onto which copper or another metal or metal alloy can be attached during the metallization process. In some examples, the additive material can be antimony, tin, or a combination of antimony and tin. The additive can be encapsulated in a polycarbonate resin.

[0108] Simultaneously or sequentially with drilling the openings or recesses in the first resin 608, the laser is moved along the surface of the set of steps 610, thereby activating and exposing the additive material along the surface of the set of steps 610 of the first resin 608. For example, the laser may drill the openings or recesses corresponding to the first resin 608. Figure 6BThe laser may then be moved along the rightmost set of steps 610 to a second laser-drilled opening or recess corresponding to another first conductive via 612. These simultaneous or sequential movements of the laser activate and expose the additive material within the opening or recess along the surface of the first resin 608. For example, when the opening or recess is drilled, the additive material may cover the sidewalls of the opening or recess extending into the first resin 608, and as the laser moves along the surface of the set of steps 610, the additive material may cover the surface of the set of steps 610.

[0109] The additive material is a material that attracts and adheres to the conductive material during the electroplating process, which forms the conductive material on the additive material along the surface of the group of steps 610 and within the openings or recesses in the first resin 608. The conductive material is formed during this electroplating process, simultaneously forming the first conductive via 612, the second conductive via 614, and the conductive layer 620.

[0110] As the laser moves along the surface of the groups of steps 610 of the first resin 608, the laser may remove layers of the first resin 608. Removing the layers of the first resin 608 will cause the conductive layer 620 to completely or partially protrude outward from the surface of the groups of steps 610 of the resin 608. In other words, in some embodiments, the conductive layer 620 will protrude outward from the surface of the groups of steps 610 of the first resin 608 such that the conductive layer 620 is not completely or entirely recessed within the first resin 608.

[0111] However, in some embodiments, conductive layer 620 may be partially or completely recessed within first resin 608. Whether conductive layer 620 is partially or completely recessed within first resin 608 depends on the selected speed and time that the laser is moved along the surface of set of steps 610. For example, if the laser is moved forward at a first speed, the layer of first resin 608 that is removed may be thicker than if the laser is moved forward at a second speed, which is faster than the first speed.

[0112] After the additive material within the first resin 608 is activated, the first conductive via 612, the second conductive via 614, and the conductive layer 620 are formed through an electroplating process. During the electroplating process, the conductive material is attracted to and adheres to the additive material, which, as previously described, has been activated and exposed by the laser. During the electroplating process, the conductive material fills the openings or recesses forming the first and second conductive vias 612, 614. Simultaneously with the electroplating process, the conductive material is attracted to the activated additive material along the surface of the grouped steps 610. The conductive material adheres to the additive material along the surface of the grouped steps 610, forming the conductive layer 620. In other words, the first conductive via 612, the second conductive via 614, and the conductive layer 620 are formed substantially simultaneously during the electroplating process (which may be a plating bath process).

[0113] In some embodiments of the method for manufacturing the stacked die package 100, a resist material may be formed on the first resin 608, covering the surface of the first resin. For example, the resist material may be formed on the surface of the group of steps 610. The resist material may be doped with an additive material similar to the additive material in the first resin 608. The resist material may be a photoresist material, a solder resist material, or another type of suitable resist material.

[0114] As the laser moves along the resist material on the first resin 608, the laser removes portions of the resist material, allowing the laser to reach the first resin 608 and activate the additive material within the first resin 608 along the surface of the first resin 608. The laser forms a pattern of recesses and openings in the resist material. After the resist material and the first resin 608 are patterned by the laser, the resist material can facilitate the formation of conductive vias 612 and 614 within the first resin 608 and the formation of a conductive layer 620 at selected locations along the surface of the first resin 608. For example, the openings and recesses patterned in the resist material by the laser serve as boundaries, allowing the conductive vias 612 and 614 and the conductive layer 620 to be formed within the openings and recesses of the resist material.

[0115] The openings and recesses in the resist material guide the conductive material to form the conductive vias 612, 614 and the conductive layer 620 during the electroplating process, thereby reducing the possibility of unintended electrical connections being formed within the stacked die package. For example, if the conductive material forming the conductive vias 612, 614 and the conductive layer 620 overflows, an electrical connection may be formed within the stacked die package 100, resulting in a short circuit or crosstalk between the electrical connections within the stacked die package 100.

[0116] In some embodiments of the method for manufacturing the stacked die package 100, the resist material may be removed after forming the conductive vias 612, 614 and the conductive layer 620. In some embodiments of the method for manufacturing the stacked die package 100, the resist material may remain after forming the conductive vias 612, 614 and the conductive layer 620, and then the resist material may be covered by the second resin 622.

[0117] After forming the conductive layer 620 and the conductive vias 612 and 614, a second resin 622 is formed over the first resin 608 and the conductive layer 620. The second resin 622 is formed to cover the set of steps 610, the conductive layer 612, and the sidewalls 611. The second resin 622 can be the same as or similar to the first resin 608 discussed above. The second resin 622 can be formed in the same or similar manner as the first resin 608 discussed above. However, in some embodiments, the second resin 622 can be formed using a different process than the first resin 608. Therefore, for the sake of brevity and simplicity, the formation of the second resin 622 is not discussed in full detail, as it is easy to understand how to form the second resin 622 based on the previous discussion of the formation of the first resin 608.

[0118] However, unlike the first resin 608 formed using a molding tool having protrusions for forming the grouped steps 610 and the side walls 611, the molding tool for forming the second resin 622 does not include protrusions like those in the molding tool for forming the first resin 608 having the grouped steps 610 and the side walls 611.

[0119] After forming second resin 622, a plurality of solder balls 626 are formed on some of contact pads 618. Solder balls 626 may be formed by solder reflow technology or other suitable technology for forming solder balls 626 on contact pads 618.

[0120] After forming the solder balls 626, the grouped stacked die 602, substrate 604, first resin 608, and second resin 622 are singulated along dashed lines 624 to form the stacked die package 100. The singulation step to form the stacked die package 100 may be accomplished by a saw, laser, or other singulation tool.

[0121] In some embodiments, solder balls 626 may not be formed on contact pads 618 before singulation; alternatively, solder balls 626 may be formed on contact pads 618 after singulation.

[0122] Figure 7 Yes Figure 3A-Figure 3B The manufacturing method of the package 300 is a cross-sectional view of the steps of the embodiment of the manufacturing method of the package 300. Figures 6A-6CThe manufacturing method of the package 100 shown is the same or similar. Therefore, for the sake of simplicity and brevity of this disclosure, only the manufacturing method of the package 300 will be discussed in further detail below with respect to the manufacturing method of the package 100. Figures 6A-6C Different or additional steps in the method of manufacturing package 100 are shown.

[0123] Different from the manufacturing method of the package 100, the first resin 702 is formed to have a first inclined surface 704, a second inclined surface 706, and a third surface 707 extending between the first inclined surface 704 and the second inclined surface 706. Figure 3A The first inclined surface 304 of the package 300 is the same or similar. The second inclined surface 706 is the same or similar to the first inclined surface 304 of the package 300. Figure 3A The second inclined surface 312 of the package 300 is the same or similar. Figure 3A The central surface 310 of the package 300 shown is the same or similar. The first inclined surface 704, the second inclined surface 706 and the third surface 707 of the first resin 702 are formed in the same manner as in the embodiment of the present invention. Figures 6A-6C The steps 610 of the first resin 608 shown and discussed are formed in the same or similar manner. Figures 6A-6C The first resin 608 shown and discussed is the same or similar.

[0124] Different from the manufacturing method of the package 100, a conductive via 708 is formed extending into the first resin 702 and reaching the contact pad 710 of the substrate 712. Figure 3A-3B The conductive via 314 of the package 300 is the same or similar to that shown. The conductive via 708 is formed in the same manner as that of the package 300. Figures 6A-6C The first and second conductive vias 612 , 614 shown and discussed are formed in the same or similar manner.

[0125] Different from the manufacturing method of the package 100 , the first conductive layer 714 is formed on the corresponding first inclined surface 704 , and the second conductive layer 716 is formed on the corresponding second inclined surface 706 and the corresponding third surface 707 .

[0126] The first conductive layer 714 is connected to Figures 3A-3B The first conductive layer 302 of the package 300 shown and discussed is the same or similar. The second conductive layer 716 is the same as that of the package 300 shown and discussed. Figure 3A-3B The second conductive layer 716 is the same or similar to the second conductive layer 308 of the package 300 shown and discussed. Figures 6A-6C The conductive layer 620 is formed by the same or similar process as shown and discussed above. Figures 6A-6C The conductive layer 620 is formed by the same or similar process as shown and discussed above. Figure 3A and Figure 3B The conductive vias 322a-322e in the illustrated package 300 are identical or similar.

[0127] In some embodiments, as previously described with respect to Figures 6A-6C The same or similar conductive layer 610 discussed above, the conductive layers 714 , 716 fully or partially protrude outwardly from the first resin 702 .

[0128] After forming the first and second conductive layers 714 and 716, a second resin 718 is formed on the first resin 702, the first conductive layer 714, and the second conductive layer 716. The second resin 718 covers the first resin 702, the first conductive layer 714, and the second conductive layer 716. Figure 3A-3B The second resin 321 of the package 300 shown and discussed is the same or similar.

[0129] It is easy to understand that the manufacturing method of the package 200 is similar to that of the reference Figure 7 The method of manufacturing package 300 is the same or similar as that shown and discussed. However, unlike the method of manufacturing package 300, the method of manufacturing package 200 does not include forming conductive vias 708 and second conductive layer 716.

[0130] Figure 8 Yes Figure 4A-4B The manufacturing method of the package 400 is a cross-sectional view of the steps of the embodiment of the manufacturing method of the package 400. Figures 6A-6C The manufacturing method of the package 100 and 300 shown in FIG7 is the same or similar. Therefore, for the sake of simplicity and brevity of this disclosure, only the manufacturing method of the package 400 will be discussed in further detail below with respect to FIG7. Figures 6A-6C and Figure 7 Different or additional steps in the method of manufacturing the packages 100 , 300 are shown.

[0131] Different from the manufacturing method of the packages 100 and 300, a first resin 802 including a plurality of reservoirs 804 is formed. Figure 4A-4B The reservoirs 404 of the package 400 are the same or similar. The formation process of the plurality of reservoirs 804 is the same as Figure 6C The formation process of the group of steps 610 shown and discussed is the same or similar. Figures 6A-6C The first resin 608 shown and discussed is the same or similar.

[0132] A plurality of reservoirs 804 are filled with Figure 4A-4B The second resin 416 of the package 400 is the same as or similar to the second resin 806. Figure 6C and Figure 7The second resins 622, 718 shown and described are the same or similar. The second resin 806 can be injected, flowed, or formed within the reservoir using other suitable techniques.

[0133] Because the conductive layer within package 100, 200, 300, 400, 500 is formed using an LDS process, the disclosed packages 100, 200, 300, 400, 500 reduce the amount of conductive material used to form the conductive layer within package 100, 200, 300, 400, 500. In other words, a laser in the LDS process penetrates into a first resin and moves along the surface of the first resin, activating an additive material within the first resin that is used to form the conductive layer within package 100, 200, 300, 400, 500. After activating the additive material, an electroplating process is performed to couple the conductive material to the additive material, forming conductive vias extending into the first resin and forming a conductive layer on the first resin within package 100, 200, 300, 400, 500. The combination of the LDS process and the electroplating process reduces the amount of material required compared to wire bonding processes.

[0134] Packages 100, 200, 300, 400, 500 are less expensive to manufacture than conventional packages that utilize wire bonding techniques to electrically couple stacked die within a conventional package. Wire bonding techniques are very expensive because forming wire bonds requires expensive, high-precision machinery that is expensive to maintain and use. Unlike wire bonding techniques, as shown in the present disclosure, forming a conductive layer within packages 100, 200, 300, 400, 500 to couple some of the plurality of stacked die is relatively inexpensive compared to forming wire bond connections because a laser can be drawn along the surface of a first resin doped with an additive material, the additive material being activated by the laser, and then an electroplating process is performed to couple the conductive material to the activated additive material. Therefore, it is not necessary to use high-precision machinery to form wire bonds to electrically couple some of the plurality of stacked die within packages 100, 200, 300, 400, 500.

[0135] Compared to conventional packages that utilize wire bonding technology to electrically couple stacked dies within a conventional package, packages 100, 200, 300, 400, 500 can be manufactured in a shorter time. As previously discussed, wire bonding technology is a high-precision process that requires high-precision machinery. Therefore, the formation of the wire bonds takes a relatively long time compared to other steps in the manufacturing process of conventional packages having wire bonds. This relatively long amount of time reduces the units per hour (UPH) that can be manufactured using wire bonding technology. Alternatively, when packages 100, 200, 300, 400, 500 are formed using the LDS process of the present disclosure, the formation of conductive vias and conductive layers in packages 100, 200, 300, 400, 500 enables the manufacture of packages 100, 200, 300, 400, 500 with a greater UPH than when conventional packages are formed using wire bonding technology.

[0136] Packages 100, 200, 300, 400, 500 are manufactured with higher reliability than conventional packages that include wire bond electrical connections. Wire bond formation is generally very sensitive and is a step where defects are relatively more likely to form. In addition, wire bonds are very fragile, and the resin formed to cover the wire bonds may cause the wire bonds to break or crack. However, unlike wire bonds, the conductive layer directly located on the surface of the resin reduces the possibility of manufacturing defects or the impact of manufacturing defects. For example, if a wire bond breaks, the wire bond will generally break completely and the two parts will break away from each other, causing the wire bond to be inoperative. However, unlike wire bonds, the conductive layer of the present disclosure can be only partially broken, so that the electrical connection formed by the conductive layer still functions in the embodiments of the stacked die packages 100, 200, 300, 400, 500.

[0137] Packages 100, 200, 300, 400, 500 are generally more robust to expansion and contraction due to exposure to temperature changes than conventional packages that utilize wire bonds to form electrical connections within the conventional package. For example, the wire bonds of conventional packages are more likely to crack or break when exposed to temperature changes than the conductive layers of the present disclosure.

[0138] The various embodiments described herein can be combined to provide further embodiments. Aspects of the embodiments can be modified, if necessary, to employ concepts from various patents, applications, and publications to provide further embodiments.

[0139] These and other changes can be made to the embodiments in light of the teachings of the detailed description above. Generally, the terms used in the following claims should not be construed to limit the claims to the specific embodiments disclosed in the specification and claims, but should be construed to encompass all possible embodiments and the full scope of equivalents of the claims. Accordingly, the claims are not limited by this disclosure.

Claims

1. A method comprising: coupling the first die to the substrate; coupling a second die to the first die, the second die being offset relative to the first die; forming a first resin having a laser responsive additive material covering the first die and the second die; forming a first opening to the first die in the first resin by activating the additive material with a laser; forming a second opening to the second die in the first resin by activating the additive material with the laser; as well as activating the additive material along at least one surface of the first resin by moving the laser along at least one surface of the first resin between the first opening and the second opening; forming a first conductive layer in the first opening and in the second opening along the at least one surface of the first resin using an electroplating process; as well as A second resin is formed on the first resin, and the second resin covers the first conductive layer on the first resin. 2 . The method of claim 1 , wherein forming the first conductive layer comprises attracting conductive material to the additive material in the first opening and in the second opening along the at least one surface.

3. The method according to claim 1, wherein: forming the first resin further comprises forming a plurality of steps corresponding to the first die and the second die, the plurality of steps including the at least one surface; and Forming the first conductive layer further includes forming the first conductive layer on one of the plurality of steps of the first resin.

4. The method according to claim 1, wherein: forming the first resin further comprises forming a reservoir in the first resin, the first reservoir being defined by the at least one surface; forming the first conductive layer further comprises forming the first conductive layer in the reservoir of the first resin; and Forming the second resin on the first resin further includes filling the reservoir of the first resin by forming the second resin in the reservoir.

5. The method of claim 1, wherein activating the additive material further comprises activating the additive material to be electrically conductive. 6 . The method of claim 1 , wherein forming the first resin further comprises forming a plurality of steps corresponding to the first die and the second die, the plurality of steps including the at least one surface.

7. A method comprising: coupling the first die to the substrate; coupling a second die to the first die, the second die being offset relative to the first die; coupling a third die to the substrate, the third die being spaced apart from the first die and the second die; coupling a fourth die to the third die, the fourth die being offset relative to the third die; forming a first resin having a laser responsive additive material covering the first die and the second die; forming a first opening to the first die in the first resin with a laser and activating the additive material with the laser; forming a second opening to the second die in the first resin with the laser and activating the additive material with the laser; forming a third opening to the third die in the first resin with the laser and activating the additive material with the laser; forming a fourth opening to the fourth die in the first resin with the laser and activating the additive material with the laser; activating the additive material at and along one or more first regions of the first resin extending between the first opening and the second opening; activating the additive material at and along one or more second regions of the first resin extending between the third opening and the fourth opening; forming a first conductive layer along the one or more first regions of the first resin, in the first opening, and in the second opening, and forming a second conductive layer along the one or more second regions of the first resin, in the third opening, and in the fourth opening using an electroplating process; as well as A second resin is formed to cover the first conductive layer and the second conductive layer. 8 . The method of claim 7 , wherein forming the first resin further comprises forming the first resin to include a first reservoir overlapping the first die and the second die and a second reservoir overlapping the third die and the fourth die.

9. The method according to claim 8, wherein: forming the first conductive layer further comprises forming the first conductive layer in the first reservoir in the first resin; and Forming the second conductive layer further includes forming the second conductive layer in the second reservoir in the first resin spaced apart from the first reservoir.

10. The method according to claim 9, wherein forming the second resin further comprises: forming the second resin covering the first conductive layer in the first reservoir within the first resin; as well as The second resin covering the second conductive layer is formed in the second reservoir within the first resin spaced apart from the first reservoir.

11. The method according to claim 10, wherein: The one or more first regions is at least one first inclined surface that overlaps the first die and the second die and defines the first reservoir; as well as The one or more second regions are at least one second inclined surface overlapping the third die and the fourth die.

12. The method according to claim 7, wherein: The one or more first regions are a plurality of first steps and the one or more second regions are a plurality of second steps; and Forming the first resin further includes forming the first resin to include a plurality of first steps overlapping the first die and the second die and a plurality of second steps overlapping the third die and the fourth die.

13. The method according to claim 12, wherein: forming the first conductive layer further comprises forming the first conductive layer along the plurality of first steps of the first resin; and Forming the second conductive layer further includes forming the second conductive layer along the plurality of second steps. 14 . The method of claim 13 , wherein forming the second resin further comprises forming the second resin to cover the plurality of first steps and the plurality of second steps.

15. The method of claim 12, wherein: forming the first opening further comprises forming the first opening to extend into a first contact pad of the first die in the first resin; forming the second opening further comprises forming the second opening to extend into a second contact pad of the second die in the first resin; forming the third opening further comprises forming the third opening to extend into the first resin to a third contact pad of the third die; as well as Forming the fourth opening further includes forming the fourth opening to extend to a fourth contact pad of the fourth die in the first resin.

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