Microstrip antenna and communication equipment

Abstract

The invention discloses a microstrip antenna and communication equipment. Relates to the technical field of antennas, the microstrip antenna comprises a microstrip patch, a floor and a plurality of pins, the plurality of pins comprise a short circuit grounding pin, a vertical polarization feed pin and a horizontal polarization feed pin, the short circuit grounding pin is used for short circuit connection of the microstrip patch and the floor, and the vertical polarization feed pin is used for short circuit connection of the microstrip patch and the floor. The vertical polarization feed pin is used for signal feeding in a vertical polarization direction, and the horizontal polarization feed pin is used for signal feeding in a horizontal polarization direction; the floor is electrically connected with the microstrip patch through a plurality of pins, and the microstrip patch and the floor jointly form a radiation loop and a current loop of the microstrip antenna and are used for transmitting and receiving signals in the vertical polarization direction and the horizontal polarization direction. According to the invention, the technical problems of low isolation and complex structure of the microstrip antenna in the prior art are solved.

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and in particular to a microstrip antenna and communication equipment. Background Art

[0002] In the field of wireless communications, microstrip antennas are widely popular for their lightweight, easy-to-integrate features, playing a key role in portable electronic devices and smart home network systems. However, conventional microstrip antenna designs face a series of technical bottlenecks when addressing the demands of multi-polarization communications. For example, due to the inherent electromagnetic characteristics of microstrip antennas, especially when the antenna feed points for the two polarizations are too close together, electric field overlap can easily occur, leading to mutual interference between signals and a decrease in isolation. Low isolation means that when using dual-polarization communications, signal crosstalk may occur, affecting data transmission quality and communication stability. Furthermore, to achieve dual-polarization functionality, antenna designs often incorporate additional coupling patches or complex feed networks, which not only increases the size and weight of the antenna but also hinders standardization for large-scale production. The complex structure also means higher production costs and challenges during device assembly. In summary, conventional microstrip antennas face issues such as signal crosstalk caused by low isolation, as well as increased costs and production difficulties due to their complex structure.

[0003] To address the above-mentioned problems, no effective solutions have been proposed so far. Summary of the Invention

[0004] The embodiments of the present invention provide a microstrip antenna and a communication device to at least solve the technical problems of low isolation and complex structure of microstrip antennas in related technologies.

[0005] According to one aspect of an embodiment of the present invention, a microstrip antenna is provided, comprising: a microstrip patch, a ground plane, and a plurality of pins, wherein the plurality of pins include a short-circuit ground pin, a vertically polarized feed pin, and a horizontally polarized feed pin, wherein the short-circuit ground pin is used to short-circuit the microstrip patch and the ground plane, the vertically polarized feed pin is used to feed a signal in a vertical polarization direction, and the horizontally polarized feed pin is used to feed a signal in a horizontal polarization direction; the ground plane is electrically connected to the microstrip patch via the plurality of pins, wherein the microstrip patch and the ground plane together constitute a radiation loop and a current loop of the microstrip antenna, and are used to transmit and receive signals in the vertical and horizontal polarization directions.

[0006] Optionally, the plurality of pins are distributed at different positions on the microstrip patch.

[0007] Optionally, positions of the vertical polarization feeding pin and the horizontal polarization feeding pin on the microstrip patch are orthogonal to each other.

[0008] Optionally, the vertical polarization feed pin and the horizontal polarization feed pin are arranged relative to two adjacent edge sides of the microstrip patch, and the vertical polarization feed pin and the horizontal polarization feed pin are separated from the corresponding edge sides by a predetermined wavelength.

[0009] Optionally, the short-circuit grounding pin is arranged in the central area of the microstrip patch, and / or is arranged at a position on the microstrip patch where the electric field intensity is less than a preset intensity.

[0010] Optionally, the microstrip patch is a metal sheet, or a microstrip patch based on a printed circuit board, or a microstrip patch based on a flexible printed circuit board.

[0011] Optionally, a plurality of pins are integrated with the microstrip patch.

[0012] Optionally, at least one of the multiple pins is configured as a pin-stick form.

[0013] Optionally, some of the multiple pins are set to be in a surface mount form, and the other pins except some of the pins are set to be in a plug form.

[0014] Optionally, some pins are short-circuit ground pins, and other pins are vertical polarization feed pins and horizontal polarization feed pins.

[0015] Optionally, the plurality of pins are connected to the ground plane through a reflow soldering process.

[0016] Optionally, the plurality of pins are configured as at least one of the following structures: a metal sheet, a metal column, a probe, or a spring.

[0017] According to another aspect of an embodiment of the present invention, a communication device is provided, comprising any one of the antennas described above.

[0018] In an embodiment of the present invention, a microstrip antenna is provided including a microstrip patch, a ground plane, and multiple pins, wherein the multiple pins include a short-circuit ground pin, a vertically polarized feed pin, and a horizontally polarized feed pin. The short-circuit ground pin is used to short-circuit the microstrip patch and the ground plane, the vertically polarized feed pin is used to feed signals in the vertical polarization direction, and the horizontally polarized feed pin is used to feed signals in the horizontal polarization direction. The ground plane is electrically connected to the microstrip patch via the multiple pins. The microstrip patch and the ground plane together constitute a radiation loop and a current loop of the microstrip antenna for transmitting and receiving signals in the vertical and horizontal polarization directions. This achieves the purpose of designing a short-circuit ground pin between the microstrip patch and the ground plane. In combination with the arrangement of the vertically polarized and horizontally polarized feed pins, the antenna can transmit and receive signals with high isolation in the vertical and horizontal polarization directions, thereby achieving the technical effect of simplifying the microstrip antenna structure and improving the antenna isolation, thereby solving the technical problems of low isolation and complex structure of microstrip antennas in related technologies. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0020] Figure 1 is a schematic structural diagram of a microstrip antenna according to an embodiment of the present invention;

[0021] Figure 2 is a first schematic diagram of an optional microstrip antenna structure according to an embodiment of the present invention;

[0022] Figure 3 is a second schematic diagram of an optional microstrip antenna structure according to an embodiment of the present invention;

[0023] Figure 4 is a third schematic diagram of an optional microstrip antenna structure according to an embodiment of the present invention;

[0024] Figure 5 is a fourth schematic diagram of an optional microstrip antenna structure according to an embodiment of the present invention;

[0025] Figure 6 1 is a schematic diagram of a comparison of port gains in an optional 0° direction according to an embodiment of the present invention;

[0026] Figure 7 1 is a schematic diagram of a comparison of port gains in an optional 90° direction according to an embodiment of the present invention;

[0027] Figure 8 This is a schematic diagram of an optional comparison of isolation in different operating frequency bands according to an embodiment of the present invention;

[0028] Figure 9 is a flow chart of a signal transmission method based on a microstrip antenna according to an embodiment of the present invention;

[0029] Figure 10 is a flow chart of a signal receiving method based on a microstrip antenna according to an embodiment of the present invention. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0031] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0032] First, to facilitate understanding of the embodiments of the present invention, some of the terms or nouns involved in the present invention are explained below:

[0033] A printed circuit board (PCB) is a basic platform used to connect and support electronic components in electronic devices. It achieves electrical connection between electronic components by printing conductive paths (usually copper foil) on an insulating substrate.

[0034] Flexible Printed Circuit Board (FPC) is a circuit board that can be bent and folded. It usually uses a flexible material as a substrate, such as polyimide or polyester film, and is covered with a conductive layer for connecting electronic components.

[0035] Surface Mount Technology (SMT) is the abbreviation for a series of process flows based on printed circuit boards (PCBs).

[0036] Reflow soldering is a soldering method in surface mount technology (SMT), which is mainly used to fix SMT components (such as resistors, capacitors, integrated circuits, and antenna pins) to pads on PCBs.

[0037] Horizontal polarization refers to the situation where the electric field vector of the electromagnetic wave propagates in the horizontal direction. In practical applications, if the electric field vector direction of an antenna is parallel to the ground, then the antenna is considered to be operating in the horizontal polarization direction.

[0038] Vertical polarization means that the electric field vector of the electromagnetic wave propagates vertically, that is, the electric field vector is perpendicular to the ground. When a vertically polarized antenna receives or transmits a signal, its electric field direction is at right angles to the ground.

[0039] WiFi, short for Wireless Fidelity, is a wireless local area network (WLAN) technology based on the IEEE 802.11 standard. WiFi allows electronic devices to connect to a local area network (LAN) and, in turn, the internet via wireless signals, enabling data transmission and communication. It is currently the most mainstream WLAN technology standard, widely used in personal computers, smartphones, tablets, game consoles, and other devices.

[0040] FR-4 substrate is a composite material widely used in printed circuit board (PCB) manufacturing. The "FR" in its name stands for "Flame Retardant," while the "4" designates a material grade, referring to a specific composite material standard. FR-4 substrate is primarily composed of fiberglass cloth and epoxy resin, cured under high pressure and high temperature.

[0041] The structure of a microstrip antenna generally consists of a dielectric substrate, a radiator, and a ground plane. The thickness of the dielectric substrate is much smaller than the wavelength. The metal thin layer at the bottom of the substrate is connected to the ground plane, and the metal thin layer with a specific shape is made on the front through a photolithography process as a radiator. The shape of the radiator can be varied in many ways according to requirements. In order to achieve the dual-polarization function of the microstrip antenna, the related art proposes an antenna structure including a PCB, a coupling patch, and a radiating patch. The feeding structure is on the coupling patch and is connected to the RF feed line on the PCB through an extended branch. The bending structure is on the radiating patch and only serves as a support without feeding or short-circuit enhancement function. However, this technology adds additional coupling patches or complex feeding networks to the antenna design, which not only increases the volume and weight of the antenna, but is also not conducive to standardization of large-scale production. The complex structure also means higher production costs and challenges in the equipment assembly process. In addition, the method in the related art cannot solve the problem in the related art that due to the electromagnetic characteristics of the microstrip antenna itself, especially when the antenna feeding points in the two polarization directions are too close to each other, electric field overlap is easily generated, which in turn causes mutual interference between signals, that is, the isolation is reduced.

[0042] In view of the above problems, the present invention provides a microstrip antenna, in one embodiment of which, Figure 1 FIG. 1 shows a schematic structural diagram of a microstrip antenna according to an embodiment of the present invention. Figure 1As shown, the microstrip antenna includes: a microstrip patch, a ground plane, and multiple pins, wherein the multiple pins include a short-circuit ground pin, a vertical polarization feed pin, and a horizontal polarization feed pin, wherein the short-circuit ground pin is used to short-circuit the microstrip patch and the ground plane, the vertical polarization feed pin is used to feed signals in the vertical polarization direction, and the horizontal polarization feed pin is used to feed signals in the horizontal polarization direction; the ground plane is electrically connected to the microstrip patch through the multiple pins, wherein the microstrip patch and the ground plane together constitute the radiation loop and current loop of the microstrip antenna, which are used to transmit and receive signals in the vertical polarization direction and the horizontal polarization direction.

[0043] The microstrip patch is a key radiating component in a microstrip antenna. It can be composed of a dielectric substrate and a metal layer covering it, supporting the radiation or reception of electromagnetic wave signals of a specific frequency. The ground plane refers to the ground plane of the microstrip antenna, located below the microstrip patch and providing a portion of the current loop to ensure the antenna's reflection and radiation performance. The short-circuit ground pin is used to electrically short-circuit the microstrip patch and the ground plane. By adding the short-circuit ground pin at the appropriate location on the microstrip patch, the antenna's isolation can be optimized, signal interference between different polarization directions can be reduced, and structural stability and heat dissipation performance can be enhanced. The vertically polarized feed pin is used to feed vertically polarized signals (i.e., signals in the vertical polarization direction), that is, to receive or transmit signals in the vertical direction. This vertically polarized feed pin can be located at a specific point on the microstrip patch to ensure the effective transmission of vertically polarized signals. The horizontally polarized feed pin is used to feed horizontally polarized signals (i.e., signals in the horizontal polarization direction), that is, to receive or transmit signals in the horizontal direction. Similar to the vertically polarized feed pin, the horizontally polarized feed pin is also located at a specific position on the microstrip patch to ensure the correct polarization direction of the signal.

[0044] Optionally, the microstrip patch and ground plane together form the microstrip antenna's radiation loop and current loop. The radiation loop, formed by the space between the microstrip patch and ground plane as well as the shape of the microstrip patch, is responsible for radiating and receiving electromagnetic waves. The current loop involves the path of current flowing between the microstrip patch and ground plane, ensuring that the microstrip antenna can effectively convert current into electromagnetic waves and vice versa.

[0045] It should be noted that the electric field of a microstrip antenna is primarily concentrated at the edges of the microstrip patch corresponding to the polarization (for example, under horizontal polarization, the electric field is primarily on the horizontal left and right edges). The closer to the center, the weaker the electric field. For a dual-polarized common-aperture microstrip antenna, the electric field under horizontal polarization is primarily concentrated on the left and right edges, while under vertical polarization, the isolation of the electric field is primarily concentrated on the top and bottom edges. When the polarization feed port is closer to the center of the patch, the electric field is weaker, and the feed pin of one polarization is less affected by the other polarization, resulting in better isolation. Loading the short-circuited ground pin further weakens the electric field in the center of the patch, making the single-polarization feed port less affected by the electric field of the other polarization, thereby optimizing isolation.

[0046] It should be noted that the connection between the microstrip patch and the ground plane via the short-circuited ground pins forms an optimized radiation loop and current loop. The addition of vertically and horizontally polarized feed pins not only improves the dual-polarization performance of the microstrip antenna but also reduces the cost and space required for the microstrip antenna setup by simplifying the structure. This significantly optimizes signal transmission and reception in both vertical and horizontal polarization directions, enabling the microstrip antenna to achieve high isolation and high gain dual-polarization performance across a wider frequency band.

[0047] Optionally, the microstrip antenna of this embodiment can be applied to various application scenarios in various communication systems such as WiFi and Bluetooth, and the operating frequency band can be in the 2 GHz to 7 GHz band.

[0048] In an optional embodiment, at least one of the plurality of pins is configured as a pin-mounted pin.

[0049] Optional, flat-mount pins are designed with flat or nearly flat pins. These pins serve as support and positioning points, ensuring the microstrip antenna remains stable during installation and prevents displacement due to external forces or vibration, thereby reducing signal interference and performance fluctuations. This flat-mount design also allows the microstrip antenna to be directly integrated into the SMT process, allowing it to be automatically positioned, mounted, and soldered on the production line alongside other electronic components, significantly improving production efficiency while ensuring connection reliability.

[0050] Optionally, multiple pins can be configured as pins. Specifically, the microstrip antenna includes short-circuit ground pins, horizontally polarized pins, and vertically polarized pins. These pins fit snugly against the PCB, serving as both structural support points and electrical connection interfaces. This design leverages the physical properties of the metal sheet to optimize both the mechanical stability and electrical performance of the microstrip antenna.

[0051] In an optional embodiment, some of the multiple pins are configured as surface mount devices, and the other pins except some of the pins are configured as plug pins.

[0052] Optional, patch-type pins are primarily used for support and heat dissipation. Designed as a large-area planar structure with close contact with the PCB or floor, they not only provide a stable mounting base for the microstrip antenna, but also, through the large-area contact between the metal and the floor, effectively enhance the antenna assembly's heat dissipation capabilities, reduce operating temperatures, and improve overall electrical efficiency and device life. Plug-type pins, on the other hand, focus on electrical connections. They can be designed to be slender, inserted into pre-set holes on the motherboard, and secured by soldering, ensuring stable and reliable signal transmission. Especially for feed and signal interfaces, plug-type pins provide more precise electrical contact and lower signal loss.

[0053] In an optional embodiment, some pins are short-circuit grounding pins, and other pins are vertical polarization feeding pins and horizontal polarization feeding pins.

[0054] Optional, Figure 2 This is the first schematic diagram of an optional microstrip antenna structure according to an embodiment of the present invention, in which a top view and a side view of the microstrip antenna are shown. The multiple pins provided in the microstrip antenna are all in the form of pins, that is, the microstrip antenna is provided with a short-circuit grounding pin, a horizontal polarization pin, and a vertical polarization pin, wherein the short-circuit grounding pin mainly plays the role of the patch surface, providing the necessary support and heat dissipation channel; while the horizontal polarization pin and the vertical polarization pin can be designed in the form of pins (such as short pins), which are responsible for the electrical connection of the microstrip antenna and ensure the accurate feeding and output of horizontal and vertical polarization signals. This combination of pin designs can not only meet the positioning and fixing requirements during antenna assembly, but also provide convenience for the SMT patch process. It can realize automatic positioning and mounting through the pins, and can realize accurate electrical connection and welding through the pins, taking into account both process efficiency and electrical performance.

[0055] In an optional embodiment, the plurality of pins are distributed at different positions on the microstrip patch.

[0056] Optionally, by setting multiple pins (i.e., short-circuit ground pin, vertical polarization feed pin and horizontal polarization feed pin) distributed at three different positions on the microstrip patch, a triangular support can be formed to improve the structural stability of the microstrip antenna and prevent the microstrip antenna from deforming in the working environment.

[0057] In an optional embodiment, the positions of the vertical polarization feeding pin and the horizontal polarization feeding pin on the microstrip patch are orthogonal to each other.

[0058] Optionally, in a dual-polarized antenna, vertically polarized and horizontally polarized signals must maintain good isolation to avoid mutual interference between the signals. Figure 2As shown, by setting the positions of the vertical polarization feed pin and the horizontal polarization feed pin (such as the vertical polarization feed pin and the horizontal polarization feed pin) on the microstrip patch to be orthogonal to each other, this isolation can be maximized, ensuring that the antenna can simultaneously perform dual-polarization radiation of vertical polarization and horizontal polarization, and the signal in each polarization direction is transmitted independently and efficiently. In addition, since the radiation of the microstrip antenna mainly occurs at specific corners, that is, the mutually orthogonal positions of the vertical polarization feed pin and the horizontal polarization feed pin, it can be ensured that when the signal propagates in its respective polarization direction, it can avoid the strong electric field area in the other polarization direction, thereby reducing the coupling between the signals and improving the isolation. In addition, through a simple and direct orthogonal layout, better dual-polarization co-aperture radiation performance can be achieved. This layout not only simplifies the design and manufacturing process of the microstrip antenna, but also improves the performance of the microstrip antenna, especially in terms of isolation and gain.

[0059] In an optional embodiment, the vertical polarization feed pin and the horizontal polarization feed pin are arranged relative to two adjacent edge sides of the microstrip patch, and the vertical polarization feed pin and the horizontal polarization feed pin are a predetermined wavelength away from the corresponding edge sides.

[0060] Alternatively, microstrip antennas radiate primarily at their edges, where the electric field distribution depends on the location of the feed point. By placing the vertically and horizontally polarized feed pins near adjacent edges of the microstrip patch, maintaining a certain wavelength-proportional distance, the edge effect can be maximized, promoting efficient radiation. Maintaining a specific distance between the vertically and horizontally polarized feed pins can reduce interference between signals of different polarizations and enhance isolation.

[0061] Optionally, the feed point (i.e., the location of the vertically polarized feed pin and the horizontally polarized feed pin) can be set approximately 1 / 4 or 1 / 8 of the wavelength from the edge of the microstrip patch to optimize the antenna's bandwidth and radiation pattern. By adjusting the wavelength ratio, the microstrip antenna can achieve optimal radiation efficiency and isolation in both vertical and horizontal polarization directions.

[0062] In an optional embodiment, the short-circuit grounding pin is arranged in the central area of the microstrip patch and / or is arranged at a position on the microstrip patch where the electric field strength is less than a preset strength.

[0063] Understandably, the electric field strength in the center of a microstrip antenna is typically weak. Especially in dual-polarization designs, the electric field in the center minimizes interference with vertically and horizontally polarized signals. Therefore, placing the short-circuit ground pin in the center can significantly reduce coupling between signals of different polarizations and optimize the isolation performance of the microstrip antenna. The short-circuit ground pin in the center serves as a support point for the antenna, enhancing structural stability. Its contact with the floor also helps improve heat dissipation, which is particularly important for the overall performance and lifespan of the microstrip antenna under high-speed data transmission or long-term operation. Placing the short-circuit ground pin at a location on the microstrip patch where the electric field strength is less than a preset value (e.g., near the electric field zero point) is designed to reduce signal interference and optimize overall antenna performance. This design strategy ensures that even in non-central areas, the short-circuit ground pin effectively reduces signal interference, thereby improving isolation and signal quality. Positioning the short-circuit ground pin at a location where the electric field strength is less than a preset value provides greater flexibility in antenna design. It allows finding the most suitable location on microstrip patches of different shapes and sizes, rather than just being limited to the center area, making this design more versatile and suitable for a variety of antenna structures and application scenarios.

[0064] In the above method, by clarifying the position selection strategy of the short-circuit ground pin in the microstrip antenna design, that is, preferentially setting it in the central area of the microstrip patch, or at a position where the electric field strength is less than the preset strength, the isolation performance of the antenna is optimized, while also ensuring the stability of the antenna structure and the feasibility of adopting specific processing technology (such as reflow soldering process, etc.).

[0065] Optionally, the short-circuit grounding pin provided in the microstrip antenna may be one or more. For example, when there is only one short-circuit grounding pin, the short-circuit grounding pin may be provided in the central area of the microstrip patch, or may be provided at a position on the microstrip patch where the electric field strength is less than a preset strength (such as a position close to the zero point of the electric field). Figure 2 In the microstrip antenna shown, a short-circuit ground pin (eg, a short-circuit ground patch) is disposed in a central region of a microstrip patch (eg, an antenna metal patch). Figure 3 is a second schematic diagram of an optional microstrip antenna structure according to an embodiment of the present invention, Figure 3 In the microstrip antenna shown, the short-circuit grounding pin is set at a position close to the electric field zero point in the microstrip patch (such as the antenna metal plate). In the case of multiple short-circuit grounding pins, the short-circuit grounding pins can be set simultaneously in the central area of the microstrip patch and at a position on the microstrip patch where the electric field strength is less than a preset strength (such as a position close to the electric field zero point) to improve the isolation of polarized signals. Figure 4 is a third schematic diagram of an optional microstrip antenna structure according to an embodiment of the present invention, Figure 4The microstrip antenna shown in the figure is provided with two short-circuit ground pins, one of which is provided at the center area of the microstrip patch (i.e. Figure 4 The other short-circuit ground pin is set at a position close to the electric field zero point in the microstrip patch (i.e. Figure 4 Short-circuit ground pin 1).

[0066] In an optional embodiment, the microstrip patch is a metal sheet, or a microstrip patch based on a printed circuit board, or a microstrip patch based on a flexible printed circuit board.

[0067] Optionally, the microstrip patch can be a metal sheet. Metal sheets are a preferred material for microstrip antennas due to their high conductivity and mechanical strength. In the case of a metal sheet, the microstrip patch can be made of, but is not limited to, stainless steel, phosphor bronze, or other metal materials with good conductivity, and can be formed into the desired shape through cutting, stamping, or molding. Sheet metal microstrip patches offer excellent heat dissipation and structural stability, are easily mass-produced using SMT processes, are relatively low-cost, and offer reliable performance.

[0068] Optionally, the microstrip patch can be based on a printed circuit board (PCB). This type of microstrip patch can be composed of a dielectric substrate and a metal layer thereon, with specific microstrip circuits designed on the metal layer for signal radiation and reception. PCB-based microstrip patch designs can better integrate antennas with other electronic device components, such as processors and memory, facilitating circuit layout and signal processing. PCBs also offer excellent manufacturing consistency and precision, making them suitable for producing complex multi-layer antenna structures.

[0069] Optional microstrip patches based on flexible printed circuit boards (FPCs) can adapt to various irregular shapes or dynamically deformed applications, such as wearable devices and foldable phones, due to the flexibility of their substrate. While maintaining the performance of microstrip antennas, FPC microstrip patches offer greater design freedom and can adapt to compact spaces or complex geometries while reducing weight and enhancing durability.

[0070] In summary, the structural setting of the microstrip antenna in this embodiment, that is, the microstrip antenna structure setting including a microstrip patch, a ground plane and multiple pins, in which the ground plane establishes an electrical connection with the microstrip patch through multiple pins, is not only applicable to microstrip antennas constructed based on metal sheets, but also to microstrip antennas constructed based on PCBs, FPCs, etc., and has a wide range of applicable scenarios.

[0071] Optionally, in the case where the microstrip patch is a metal sheet, the floor can be an FR-4 substrate, and the hardware motherboard in the electronic device can be directly used, that is, the antenna metal sheet can be directly mounted on the main circuit board of the device without the need for an additional bracket or ground plate. This can not only simplify the internal structure of the electronic device, but also reduce the number of components and assembly complexity, helping to reduce production costs and enhance the reliability and compactness of the device. In the case where the microstrip patch is a PCB-based microstrip patch (i.e., a PCB patch), the floor can be a PCB motherboard. In the case where the microstrip patch is an FPC-based microstrip patch (i.e., an FPC patch), the floor can be an FPC motherboard.

[0072] In an optional embodiment, a plurality of pins are integrated with the microstrip patch.

[0073] Optionally, if the microstrip patch is a metal sheet, multiple pins can be integrated with the microstrip patch. Specifically, the pins are not independent components attached through assembly or welding, but are processed as an integral part of the microstrip patch during the production process. The thickness is 0.5 mm. The integrated design of multiple pins with the microstrip patch can be achieved, but is not limited to, through processes such as stamping, cutting, or forming.

[0074] It should be noted that the integrated design of multiple pins and microstrip patches can simplify the structure and production process of microstrip antennas, avoiding the independent manufacturing and subsequent assembly of multiple components, reducing production costs and potential assembly errors. At the same time, because the pins and microstrip patches are seamlessly integrated in terms of materials and structure, the stability and reliability of the overall structure are improved, reducing signal attenuation or performance degradation caused by loose components or poor contact. Furthermore, the integrated design reduces the thermal resistance and electrical impedance between the pins and microstrip patches, which not only optimizes heat dissipation but also ensures better electrical connection performance, which is particularly important for communication systems that require efficient heat dissipation and low bit error rates.

[0075] Alternatively, the antenna radiator and pin structure can be formed directly on a metal sheet (such as stainless steel or phosphor bronze) through precision stamping and cutting processes, ensuring material consistency and structural integrity between the pins and the antenna body. The combination of an integrated pin design and the microstrip patch enables automated assembly of the microstrip antenna using surface mount technology (SMT). The patching and soldering can be completed alongside other electronic components on the motherboard, significantly improving production efficiency and product assembly consistency.

[0076] In an optional embodiment, the plurality of pins are connected to the ground plane through a reflow soldering process.

[0077] Optionally, reflow soldering is a process applied to surface mount technology (SMT). By adopting the reflow soldering process to connect multiple pins to the ground, it is suitable for connecting various metal pins to the PCB, which can ensure the accuracy of antenna installation and the reliability of electrical connection.

[0078] Optionally, if the microstrip patch is a metal sheet, the antenna metal sheet can be connected to a ground plane (such as a PCB) via vertically and horizontally polarized pins. The short-circuit ground pins also serve as short-circuit connection points between the antenna and the PCB, providing electrical and structural support. The connection between these pins and the ground plane is achieved through a reflow soldering process, ensuring accurate antenna installation and reliable electrical connections.

[0079] Alternatively, a reflow soldering process can be used to connect multiple pins to the baseplate. The specific implementation process is as follows: First, a layer of solder paste is printed on the PCB pads using a stencil. The solder paste contains a solder component that melts upon heating and forms solder joints. Next, a placement machine accurately places the microstrip antenna pins onto the pre-printed solder paste pads. The PCB is then placed in a reflow oven, undergoing preheating, holding, and cooling. During the highest temperature stage, the solder paste melts and flows, forming metal alloy solder joints between the pins and the PCB pads. Finally, the solder joints solidify during cooling, establishing a secure physical and electrical connection between the pins and the PCB. The reflow soldering process creates strong solder joints that can withstand various mechanical stresses during device use, such as vibration and shock, ensuring long-term stability and reliability between the antenna pins and the baseplate. Furthermore, the reflow soldering process is highly automated, significantly improving production efficiency and reducing manual intervention, thereby reducing antenna production costs and enhancing market competitiveness.

[0080] In an optional embodiment, the plurality of pins are configured as at least one of the following structures: a metal sheet, a metal column, a probe, or a spring.

[0081] Optionally, the multiple pins of the microstrip antenna can adopt a variety of structural forms, including but not limited to metal sheets, metal columns, probes, and springs. For example, the short-circuit grounding pins, vertical polarization feed pins, and horizontal polarization feed pins can all be in the form of metal sheets. This design facilitates the direct use of SMT patch technology to process the antenna, achieving low-cost and high-efficiency production. Pins in the form of metal columns can be used to provide more stable mechanical support and electrical connections, especially in situations where the antenna requires additional support strength or needs to form a more secure contact with the floor. Pins in the form of probes can be used in scenarios where precision electrical connections are required, such as test interfaces or high-precision signal transmission. Their cutting-edge design can ensure good contact and signal transmission quality. Figure 5 is a fourth schematic diagram of an optional microstrip antenna structure according to an embodiment of the present invention, Figure 5In the microstrip antenna shown, the microstrip patch is a PCB microstrip patch, and the corresponding pins are all probes. In this microstrip antenna, the PCB microstrip patch and the ground plane / PCB motherboard are electrically connected via a shorting ground probe, a vertically polarized feed probe, and a horizontally polarized feed probe. The spring-type pins, with their elastic properties and contact force, provide a reliable electrical connection for the microstrip antenna. They can also provide structural support in certain designs, particularly in devices that require frequent assembly and disassembly or operate in vibrating environments.

[0082] It's important to note that different pin configurations can adapt to different production processes and installation requirements. For example, metal sheets are suitable for SMT production lines, while metal posts may be more suitable for applications requiring additional mechanical strength. This diverse pin design also considers the electrical performance of the antenna when connected to the floor, such as reducing signal loss, improving isolation, and optimizing heat dissipation. This ensures that the microstrip antenna of this embodiment can perform well in various application scenarios.

[0083] Based on the above embodiments and optional embodiments, the present invention proposes an optional implementation of a microstrip antenna, the structure of which is as follows: Figure 2 As shown, the microstrip antenna consists of two parts: the ground plane and the antenna metal sheet. The ground plane is made of FR-4 substrate and can be directly used with the hardware motherboard. The antenna metal sheet can be made of stainless steel, phosphor copper, or other materials. It is cut from a whole piece of metal sheet and formed by stamping. It has a thickness of 0.5mm and includes three pins: short-circuit grounding pin, horizontal polarization feed pin, and vertical polarization feed pin. The pins cooperate with the motherboard (i.e., the ground plane) and can be directly processed with the chip components using the reflow soldering process. Specifically:

[0084] The microstrip antenna is in microstrip form, with a length and width both approximately equal to 0.5 wavelengths. The short-circuit grounding pin is close to the center of the metal sheet, and the horizontal polarization pin and the vertical polarization pin are orthogonal to each other and are located approximately 1 / 4 wavelength from adjacent sides.

[0085] The SMT patch process requires at least one larger patch surface and several short pins for positioning. The microstrip antenna in this embodiment uses the short-circuit grounding pin as the patch surface, and the horizontal polarization feed pin and the vertical polarization feed pin are designed as short pins, which can be produced by the SMT patch process.

[0086] Structural support generally requires more than three feet and reasonable distribution to provide stability. The three feet in this embodiment are distributed at three different positions of the patch, which can achieve stable structural support.

[0087] In the related art, metal is generally contacted with the high-temperature area to assist heat dissipation. The metal patch of this embodiment has a large area, and the grounding pin has a large area contact with the motherboard ground, which helps to dissipate heat and to some extent replaces the function of the heat sink.

[0088] Figure 6 : is an optional schematic diagram of a comparison of port gains in the 0° direction according to an embodiment of the present invention. Figure 7 This is a schematic diagram of the comparison of port gains in an optional 90° direction according to an embodiment of the present invention. It can be seen that when signal processing is performed on the microstrip antenna based on this embodiment, whether in the direction where the angle (phi) is equal to 0° or in the direction where the angle (phi) is equal to 90°, the gains of the horizontally polarized port and the vertically polarized port of the antenna are both close to 9 decibels of non-directional antenna power ratio (dBi), the beam width is about 70°, and the radiation performance of the microstrip antenna is good. Figure 8 FIG. 1 is a schematic diagram showing a comparison of isolation within different operating frequency bands according to an optional embodiment of the present invention. Figure 8 As shown, curve S11 represents return loss, with the two different S11 curves representing the return loss performance of the vertically polarized port and the horizontally polarized port, respectively. Curve S12 represents isolation, which exceeds 30dB. This shows that the microstrip antenna has good matching between the horizontally and vertically polarized ports, with isolation reaching 30dB within the operating frequency band, demonstrating excellent performance.

[0089] It should be noted that in the microstrip antenna of this embodiment, the short-circuit grounding pin, the horizontally polarized feed pin and the vertically polarized feed pin are designed, so that the microstrip antenna can be reflow-processed, which has great process advantages; the short-circuit grounding pin design, and the position of the horizontally polarized feed pin and the vertically polarized feed pin make the microstrip antenna have a gain increase of 1 decibel (dB) and an isolation increase of 15dB compared with the conventional design, with obvious performance advantages; the tripod support design of the microstrip antenna has a stable structure, does not require auxiliary fixation such as brackets or foam, and is simple to assemble; the short-circuit grounding pin is in large contact with the motherboard ground, and the microstrip antenna is all-metal, which significantly improves the heat dissipation performance of the motherboard; through structural design, the microstrip antenna is formed by cutting and stamping a whole piece of metal sheet, which is simple to process and low in cost.

[0090] Based on the above embodiments and optional embodiments, the present invention proposes another optional implementation method of the microstrip antenna. In this embodiment, the structure of the microstrip antenna is not limited to the metal sheet, and the feed and ground pins do not have to be folds of the metal sheet's own structure. The microstrip antenna can adopt different common microstrip antenna forms such as metal patches, PCB patches, and bracket flexible printed circuit board (Flexible Printed Circuit, FPC) patches; the feed and ground pins can use different forms such as metal sheets, metal columns, probes, and springs. The above different patch materials / forms, and feed and ground pin material / form combinations, as long as they are based on short-circuit grounding loading to optimize isolation and structural support, are all within the protection scope of this embodiment.

[0091] According to an embodiment of the present invention, a communication device is provided, and the communication device includes any one of the above-mentioned antennas.

[0092] Optionally, the communication device may be a network bridge, an access point (AP), etc. In some application scenarios, the communication device may also be a router. For example, the microstrip antenna is used in combination with other antennas in a router, and so on.

[0093] According to an embodiment of the present invention, an embodiment of a method for signal transmission based on a microstrip antenna is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0094] Figure 9 FIG. 1 is a flow chart of a signal transmission method based on a microstrip antenna according to an embodiment of the present invention. Figure 9 As shown, the method is applied to any of the above microstrip antennas, including:

[0095] Step S902: receiving a first current signal through a vertically polarized feed pin and a horizontally polarized feed pin in the microstrip antenna;

[0096] Step S904 : converting the first current signal into a first electromagnetic wave signal through the current loop and the radiation loop formed between the microstrip patch and the floor, and emitting the first electromagnetic wave signal.

[0097] Optionally, the above steps S902 to S904 involve the conversion process between the electrical signal inside the antenna and the electromagnetic wave signal, especially the key role of the vertical polarization feed pin and the horizontal polarization feed pin in receiving the signal, and the short-circuit ground pin in forming the current loop and the radiation loop. Specifically, the first current signal (which can be a radio frequency current signal) is received by the vertical polarization feed pin and the horizontal polarization feed pin of the microstrip antenna. This step is the starting point of the signal conversion. The external signal source (such as a transmitter) transmits the current signal to the antenna through the feed line. With the participation of the short-circuit ground pin, a current loop and a radiation loop are formed inside the microstrip antenna. The current signal is transmitted between the antenna metal sheet and the floor (or PCB motherboard), and is converted into an electromagnetic wave signal through the principles of electromagnetic induction and radiation, and is finally emitted through the antenna. The addition of the short-circuit ground pin not only helps to optimize the signal transmission path, but also improves the isolation between signals of different polarizations, ensuring the purity and efficiency of the signal.

[0098] In the above method, by simultaneously receiving and converting signals through the vertically polarized feed pin and the horizontally polarized feed pin, the microstrip antenna of this embodiment can achieve dual-polarized radiation, enhancing the signal coverage and reception capability, and is particularly suitable for scenarios requiring multi-directional communication, such as home or commercial WiFi devices. Under the action of the short-circuit ground pin, the current loop and radiation loop are optimized, which can significantly improve the isolation of the microstrip antenna under dual-polarization operation, reduce interference between signals of different polarizations, and improve communication quality and stability. In addition to the signal conversion function, the short-circuit ground pin can also provide structural support and heat dissipation effects, ensuring that the microstrip antenna can maintain good performance status under long-term operation and extend the service life of the device.

[0099] According to an embodiment of the present invention, a method embodiment of a signal receiving method based on a microstrip antenna is also provided. Figure 10 is a flow chart of a signal receiving method based on a microstrip antenna according to an embodiment of the present invention. Figure 10 As shown, the method is applied to any of the above microstrip antennas, including:

[0100] Step S1002: receiving a second electromagnetic wave signal through a radiation loop formed in the microstrip antenna;

[0101] Step S1004 , converting the second electromagnetic wave signal into a second current signal through a current loop formed between the microstrip patch in the microstrip antenna and the ground;

[0102] Step S1006: Sending a second current signal through the vertical polarization feeding pin and the horizontal polarization feeding pin in the microstrip antenna.

[0103] Optionally, steps S1002 to S1006 above focus on the process of the antenna receiving an external electromagnetic wave signal and converting it into a current signal for further processing, particularly regarding the key role of the short-circuit ground pin and the vertically polarized feed pin and the horizontally polarized feed pin in the signal reception process. Specifically, the second electromagnetic wave signal is received via a radiating loop formed within the microstrip antenna. The radiating loop is the main channel for the microstrip antenna to receive wireless signals. When the electromagnetic wave signal reaches the microstrip antenna, the current distribution on the microstrip patch (such as the antenna metal patch) changes, capturing and concentrating the signal energy. With the participation of the short-circuit ground pin, a current loop is formed between the microstrip patch of the microstrip antenna and the ground. Under the action of the current loop, the energy of the second electromagnetic wave signal is converted into a second current signal (which can be a radio frequency current signal). This conversion process bridges the signal from the wireless environment to the wired circuit. The second current signal obtained after conversion is emitted through the vertically polarized feed pin and the horizontally polarized feed pin in the microstrip antenna. These two pins transmit the received signal to the back-end signal processing circuit to complete the signal reception and preliminary processing.

[0104] In this method, the antenna achieves dual-polarization reception by simultaneously receiving signals through both vertically and horizontally polarized feed pins. This means it can efficiently capture electromagnetic wave signals from different polarization directions, enhancing the flexibility and reliability of signal reception. The presence of the short-circuit ground pin optimizes the current loop, helping to reduce mutual interference between signals of different polarizations, improving the purity of the received signal and processing efficiency. The short-circuit ground pin provides structural support and facilitates heat exchange between the antenna and the floor, ensuring that the antenna maintains a stable operating state when receiving signals and reducing the performance impact of thermal effects.

[0105] This embodiment also provides a signal transmission device based on a microstrip antenna, which is used to implement the above-mentioned embodiments and preferred embodiments. Details already described will not be repeated here. As used below, the terms "module" and "device" may refer to a combination of software and / or hardware that implements a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, implementation using hardware, or a combination of software and hardware, is also possible and contemplated.

[0106] According to an embodiment of the present invention, there is also provided an embodiment of a device for implementing the above-mentioned signal transmission method based on a microstrip antenna. The above-mentioned signal transmission device based on a microstrip antenna includes: a first signal receiving module and a first signal conversion module, wherein:

[0107] A first signal receiving module is configured to receive a first current signal through a vertically polarized feed pin and a horizontally polarized feed pin in the microstrip antenna;

[0108] The first signal conversion module is used to convert the first current signal into a first electromagnetic wave signal through the current loop and the radiation loop formed between the microstrip patch and the floor, and emit the first electromagnetic wave signal.

[0109] According to an embodiment of the present invention, there is also provided an embodiment of a device for implementing the above-mentioned signal receiving method based on a microstrip antenna. The above-mentioned signal transmitting device based on a microstrip antenna includes: a second signal receiving module, a second signal conversion module, and a signal transmitting module, wherein:

[0110] a second signal receiving module, configured to receive a second electromagnetic wave signal via a radiation loop formed in the microstrip antenna;

[0111] a second signal conversion module, configured to convert the second electromagnetic wave signal into a second current signal through a current loop formed between the microstrip patch in the microstrip antenna and the floor;

[0112] The signal transmitting module is used to transmit a second current signal through a vertical polarization feeding pin and a horizontal polarization feeding pin in the microstrip antenna.

[0113] It should be noted that the above modules can be implemented by software or hardware. For example, for the latter, it can be implemented in the following ways: the above modules can be located in the same processor; or the above modules can be located in different processors in any combination.

[0114] It should be noted that the first signal receiving module and the first signal conversion module correspond to steps S902 to S904 in the embodiment, and the second signal receiving module, the second signal conversion module, and the signal transmitting module correspond to steps S1002 to S1006 in the embodiment. The examples and application scenarios implemented by these modules and the corresponding steps are the same, but are not limited to the contents disclosed in the above embodiment. It should be noted that the above modules, as part of the device, can run in a computer terminal.

[0115] It should be noted that the optional or preferred implementation of this embodiment can be found in the relevant description in the embodiment, which will not be repeated here.

[0116] The above-mentioned device may also include a processor and a memory. The above-mentioned first signal receiving module, first signal conversion module, second signal receiving module, second signal conversion module, signal transmitting module, etc. are all stored in the memory as program modules, and the processor executes the above-mentioned program modules stored in the memory to realize corresponding functions.

[0117] According to an embodiment of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium includes a stored executable program, wherein when the executable program is running, the device where the computer-readable storage medium is located is controlled to execute any one of the above-mentioned signal transmission methods based on microstrip antennas, or execute any one of the above-mentioned signal receiving methods based on microstrip antennas.

[0118] According to an embodiment of the present invention, an electronic device is provided, comprising: a memory storing an executable program; and a processor for running the program, wherein when the program is run, any one of the above-mentioned signal transmission methods based on a microstrip antenna is executed, or any one of the above-mentioned signal reception methods based on a microstrip antenna is executed.

[0119] According to an embodiment of the present invention, a computer program product is provided, comprising a computer program. When the computer program is executed by a processor, the computer program implements the steps of any one of the above-mentioned signal transmission methods based on a microstrip antenna, or implements any one of the above-mentioned signal reception methods based on a microstrip antenna.

[0120] The above sequence of the embodiments of the present invention is for description only and does not represent the superiority or inferiority of the embodiments.

[0121] In the above embodiments of the present invention, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0122] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are only exemplary. For example, the division of the above modules can be a logical function division. In actual implementation, there may be other division methods, such as multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, modules or indirect coupling or communication connection of modules, which can be electrical or other forms.

[0123] The modules described above as separate components may or may not be physically separate, and the components shown as modules may or may not be physical modules, that is, they may be located in one place or distributed across multiple modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0124] In addition, the functional modules in various embodiments of the present invention may be integrated into a single processing module, or each module may exist physically separately, or two or more modules may be integrated into a single module. The aforementioned integrated modules may be implemented in the form of hardware or software functional modules.

[0125] If the above-mentioned integrated module is implemented in the form of a software functional module and sold or used as an independent product, it can be stored in a computer-readable non-volatile storage medium. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a non-volatile storage medium and includes a number of instructions for enabling a computer device (which can be a personal computer, server or network device, etc.) to execute all or part of the steps of the various embodiments of the present invention. The aforementioned non-volatile storage medium includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, magnetic disk or optical disk and other media that can store program code.

[0126] The above are only preferred embodiments of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A microstrip antenna, characterized in that: include: Microstrip patch, floor, multiple pins, where The plurality of pins include a short-circuit ground pin, a vertical polarization feed pin, and a horizontal polarization feed pin, wherein the short-circuit ground pin is used to short-circuit the microstrip patch and the floor, the vertical polarization feed pin is used to feed a signal in a vertical polarization direction, and the horizontal polarization feed pin is used to feed a signal in a horizontal polarization direction; The floor establishes an electrical connection with the microstrip patch through the multiple pins, wherein the microstrip patch and the floor together constitute a radiation loop and a current loop of a microstrip antenna, which are used for transmitting and receiving signals in the vertical polarization direction and the horizontal polarization direction.

2. The microstrip antenna according to claim 1, wherein: The plurality of pins are distributed at different positions on the microstrip patch.

3. The microstrip antenna according to claim 1 or 2, characterized in that: The positions of the vertical polarization feeding pin and the horizontal polarization feeding pin on the microstrip patch are orthogonal to each other.

4. The microstrip antenna according to claim 1 or 2, characterized in that: The vertical polarization feeding pin and the horizontal polarization feeding pin are arranged relative to two adjacent edge sides of the microstrip patch, and the vertical polarization feeding pin and the horizontal polarization feeding pin are separated from the corresponding edge sides by a predetermined wavelength.

5. The microstrip antenna according to claim 1 or 2, characterized in that: The short-circuit grounding pin is arranged in the central area of the microstrip patch and / or is arranged at a position on the microstrip patch where the electric field intensity is less than a preset intensity.

6. The microstrip antenna according to claim 1, wherein: The microstrip patch is a metal sheet, or a microstrip patch based on a printed circuit board, or a microstrip patch based on a flexible printed circuit board.

7. The microstrip antenna according to claim 1 or 2, characterized in that: The plurality of pins are integrally arranged with the microstrip patch.

8. The microstrip antenna according to claim 1, wherein: At least one of the plurality of pins is configured as a pin-mounted pin.

9. The microstrip antenna according to claim 1, wherein: Some of the plurality of pins are arranged in a surface mount form, and the other pins except the some are arranged in a plug form.

10. The microstrip antenna according to claim 9, characterized in that: Some of the pins are the short-circuit grounding pins, and the other pins are the vertical polarization feeding pins and the horizontal polarization feeding pins.

11. The microstrip antenna according to claim 1, wherein: The plurality of pins are connected to the ground plane through a reflow process.

12. The microstrip antenna according to claim 1, wherein: The plurality of pins are configured as at least one of the following structures: a metal sheet, a metal column, a probe, and a spring.

13. A communication device, characterized in that: The communication device comprises the antenna according to any one of claims 1 to 12.

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