Liquid source deposition apparatus and method for passivating a silicon wafer

Abstract

The application discloses a liquid source diffusion device and method before silicon wafer passivation, and belongs to the technical field of silicon wafer processing. The liquid source diffusion device and method before silicon wafer passivation, which comprises a coating mechanism, the coating mechanism comprises a box body, a coating cylinder is fixedly installed on one side of the upper end of the box body, an air slip ring is fixedly installed at the bottom of the inside of the coating cylinder, a first negative pressure suction disc is sleeved on the rotating end of the air slip ring, a raw material barrel is fixedly installed on one side of the coating cylinder, a first servo motor is fixedly installed on the upper end face of the box body and located on one side of the raw material barrel, a first pneumatic telescopic rod is sleeved on the output end of the first servo motor, a connecting rod is fixedly installed on the upper end of the first pneumatic telescopic rod, a supporting rod is installed on the bottom side of the connecting rod through bolts, a clamp is rotatably connected on one side of the supporting rod, a coating rod is inserted into the inside of the clamp, and a conveyor is fixedly installed on one side of the coating cylinder and located on the upper end face of the box body. The application can effectively improve the practicability of the liquid source diffusion device and has high practical value.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer processing technology, specifically to a liquid source diffusion device and method for silicon wafer passivation. Background Technology

[0002] In the current booming semiconductor industry, silicon wafers, as the fundamental material for manufacturing core devices such as integrated circuits and solar cells, directly determine the quality and performance of end products. The liquid source diffusion process before silicon wafer passivation, which converts liquid impurity sources into a gaseous state and allows them to diffuse to the surface of the silicon wafer and penetrate into its interior, thereby altering the electrical properties of the silicon wafer, is one of the key steps in optimizing silicon wafer performance.

[0003] Based on the above, the inventors have discovered the following problems: When liquid source diffusion is carried out on single-crystal silicon wafers, phosphorus source and boron source need to be coated on both sides of the silicon wafer to form a specific semiconductor doping layer. At present, most companies still use manual coating method. Operators need to hold coating tools and apply liquid phosphorus source and boron source evenly to the surface of the silicon wafer one by one. Liquid phosphorus source and boron source are mostly chemical reagents with certain corrosiveness and toxicity. During the manual coating process, operators need to frequently come into contact with these chemical substances. Even if protective measures are taken, there is still a risk of skin contact infection.

[0004] Therefore, in view of this, we have studied and improved the existing structure and its shortcomings, and provided a liquid source diffusion device and method before silicon wafer passivation, in order to achieve a more practical purpose. Summary of the Invention

[0005] The purpose of this invention is to provide a liquid source diffusion device and method before silicon wafer passivation, in order to solve the problem mentioned in the background art that most companies still use manual coating methods. Operators need to hold coating tools and uniformly apply liquid phosphorus source and boron source to the surface of silicon wafers one by one. Liquid phosphorus source and boron source are mostly chemical reagents with certain corrosiveness and toxicity. During the manual coating process, operators need to frequently come into contact with these chemical substances. Even if protective measures are taken, there is still a risk of inhaling harmful gases and skin contact infection.

[0006] In view of the above problems, the technical solution proposed by the present invention is as follows:

[0007] A liquid source diffusion device for silicon wafer passivation includes a coating mechanism. The coating mechanism includes a housing, a coating cylinder fixedly installed on one side of the upper end of the housing, a slip ring fixedly installed at the bottom of the coating cylinder, a first negative pressure suction cup sleeved on the rotating end of the slip ring, a raw material tank fixedly installed on one side of the coating cylinder, a first servo motor fixedly installed on the upper surface of the housing on the side of the raw material tank, a first pneumatic telescopic rod sleeved on the output end of the first servo motor, a connecting rod fixedly installed on the upper end of the first pneumatic telescopic rod, a support rod installed on the bottom side of the connecting rod by bolts, a clamp rotatably connected to one side of the support rod, a coating rod inserted inside the clamp, and a conveyor fixedly installed on the upper surface of the housing on the side of the coating cylinder.

[0008] Furthermore, a second servo motor is fixedly installed at the bottom of the coating cylinder. The output end of the second servo motor is connected to the rotating end of the air slip ring. The output end of the air slip ring is connected to the input end of the first negative pressure suction cup through a pipe. A third servo motor is fixedly installed on one side of the support rod. The output end of the third servo motor is connected to the clamp.

[0009] The beneficial effects of adopting the above-mentioned further solution are that the second servo motor drives the rotating end of the air slip ring to rotate, causing the silicon wafer adsorbed on the first negative pressure suction cup to rotate, which facilitates uniform coating; the air slip ring realizes the air circuit connection and ensures the stability of negative pressure; the third servo motor drives the clamp to rotate, adjusts the angle of the coating rod, and cooperates with the first servo motor to adjust the position of the coating rod to fully coat the surface of the silicon wafer.

[0010] Furthermore, it also includes a drying mechanism, which includes a drying box located on one side of the coating cylinder. Both ends of the drying box are provided with lifting seats, the bottom end of which is connected to the upper end of the box body. Second pneumatic telescopic rods are embedded and installed on both sides of the upper end of the lifting seats, and a connecting plate is fixedly installed between the upper ends of each pair of second pneumatic telescopic rods.

[0011] The beneficial effect of adopting the above-mentioned further solution is that the drying chamber of the drying mechanism dries the coated silicon wafers, and the height of the connecting plate can be adjusted by the lifting seat and the second pneumatic telescopic rod, so that after the silicon wafer is removed from the inside of the drying chamber, a pair of sliding rods can be driven to lift the silicon wafer. With the reciprocating movement of the conveyor plate, it is convenient to continuously transport the silicon wafer.

[0012] Furthermore, each of the connecting plates is fixedly mounted with a connecting seat on its upper end, and a pair of sliding rods are fixedly mounted between a pair of connecting seats. Inside the drying box, a first linear motor is fixedly mounted between a pair of lifting seats. A conveying plate is fixedly mounted on the moving end of the first linear motor. A pair of sliding grooves are opened on the upper end of the conveying plate, and the sliding grooves are slidably connected to the sliding rods.

[0013] The beneficial effect of adopting the above-mentioned further solution is that the first linear motor drives the conveyor plate to move on the slide bar, thereby realizing the conveying of silicon wafers in the drying box, ensuring that the silicon wafers move along the set path in the drying box, and ensuring the uniformity and efficiency of drying.

[0014] Furthermore, it also includes a conveying mechanism, which includes a second linear motor, a third linear motor, a fourth linear motor, and a fifth linear motor. The third linear motor is disposed on one side of the coating cylinder, and a sixth linear motor is installed on the moving end of the third linear motor. A first lifting frame is installed on the moving end of the sixth linear motor. The second linear motor is disposed on one side of the third linear motor, and a fixed rod is installed on the moving end of the second linear motor. A second negative pressure suction cup is installed at the bottom end of the fixed rod.

[0015] The beneficial effects of adopting the above-mentioned further scheme are that the linear motors in the conveying mechanism work together, the second linear motor cooperates with the second negative pressure suction cup to pick up and transport silicon wafers, and the third linear motor, the sixth linear motor and the first lifting frame realize the transfer of silicon wafers between different work stations, which facilitates the transfer of silicon wafers conveyed on the conveyor belt to the first negative pressure suction cup. Since clamping mechanisms are provided on both sides of the bottom end of the first lifting frame, it can transfer silicon wafers into the coating cylinder during the reciprocating movement, and transfer the coated silicon wafers back to the conveyor plate, thereby improving the continuity of processing.

[0016] Furthermore, the fourth linear motor and the fifth linear motor are respectively disposed on both sides of one end of the first linear motor. The moving end of the fourth linear motor is fixedly mounted with a fourth servo motor, and the output end of the fourth servo motor is fitted with a mounting bracket. The moving end of the fifth linear motor is fixedly mounted with a seventh linear motor, and the moving end of the seventh linear motor is mounted with a second lifting frame.

[0017] The beneficial effect of adopting the above-mentioned further solution is that the fourth linear motor and the fifth linear motor cooperate with each other to transfer the silicon wafer after coating and drying. The fourth servo motor drives the mounting frame to rotate, which can rotate the clamped silicon wafer. This allows the clamping mechanism at the bottom of the second lifting frame and the clamping mechanism at the bottom of the mounting frame to work together to transfer the silicon wafer lifted by the sliding rod. During the transfer process, the second lifting frame and the mounting frame move alternately, which can make the coated silicon wafer overlap and place it between several limiting rods to prevent the uncoated side of the silicon wafer from contacting the coated side.

[0018] Furthermore, clamping mechanisms are provided on both sides of the bottom end of the first lifting frame, the bottom end of the mounting frame, and the bottom end of the second lifting frame. The clamping mechanism includes a plurality of parallel pneumatic clamps. Movable blocks are slidably installed on both sides of the bottom end of the plurality of parallel pneumatic clamps. Clamping rods are fixedly installed on both sides of the bottom end of the movable blocks. The two movable ends of the parallel pneumatic clamps are respectively fixedly connected to a pair of the movable blocks.

[0019] The beneficial effect of adopting the above-mentioned further solution is that the parallel pneumatic clamp of the clamping mechanism drives the moving block and the clamping rod to move in opposite directions or away from each other through the moving end, so as to realize the stable clamping and release of the silicon wafer, adapt to silicon wafers of different sizes, and ensure the stability and safety of the silicon wafer during the handling process.

[0020] Furthermore, it also includes a material storage mechanism, which includes a pair of base frames, which are respectively disposed on both sides of the upper end face of the box. Several limiting rods are fixedly installed on the upper end of the base frames, and push plates are slidably inserted between the several limiting rods. A third pneumatic telescopic rod is inserted at the center of each base frame. The bottom end of the third pneumatic telescopic rod extends through the box and into the interior. The top end of the third pneumatic telescopic rod is connected to the bottom end of the push plate.

[0021] The beneficial effects of adopting the above-mentioned further solution are that the base frame and limiting rod of the storage mechanism provide storage space and guidance, the third pneumatic telescopic rod pushes the push plate, which can realize the orderly storage and retrieval of silicon wafers, and the two base frames can be used for loading and unloading silicon wafers.

[0022] Furthermore, a vacuum pump is fixedly installed at the bottom of the box. The output end of the vacuum pump is connected to the input end of the second negative pressure suction cup and the input end of the air slip ring through pipes. A protective frame is provided at the top of the box, and several operating doors are provided on both sides of the protective frame.

[0023] The advantages of adopting the above-mentioned further solutions are that the vacuum pump provides negative pressure for the second negative pressure suction cup and the air slip ring, ensuring that the silicon wafer is firmly adsorbed; the protective frame and operating door can protect the internal structure of the equipment and prevent external interference, while facilitating the operation, maintenance and monitoring of the equipment by the operators.

[0024] On the other hand, the present invention provides a method for using a liquid source diffusion device before silicon wafer passivation, comprising the following steps:

[0025] S1, Silicon Wafer Loading and Coating: The second linear motor drives the fixing rod and the second negative pressure suction cup to move. Using the negative pressure provided by the vacuum pump, the second negative pressure suction cup picks up the silicon wafer in the loading frame. The third and sixth linear motors, together with the clamping mechanism at the bottom of the first lifting frame, transfer the silicon wafer into the coating cylinder. The first negative pressure suction cup adsorbs and fixes the silicon wafer under the negative pressure provided by the air slip ring. The second servo motor drives the rotating end of the air slip ring to rotate, causing the silicon wafer to rotate. The first servo motor and the first pneumatic telescopic rod adjust the position of the coating rod. The third servo motor drives the clamp to adjust the angle of the coating rod. After obtaining the liquid source from the raw material tank, the silicon wafer is coated.

[0026] S2, Silicon Wafer Drying and Transfer: The coated silicon wafers are held by the clamping mechanism at the bottom of the first lifting frame and transferred to the conveyor plate inside the drying chamber. The first linear motor drives the conveyor plate to move along the slide bar, so that the silicon wafers move along the set path in the drying chamber to complete the drying. After drying, the second pneumatic telescopic rod drives the slide bar to lift the silicon wafers. The fourth linear motor drives the clamping mechanism at the bottom of the mounting frame to clamp the silicon wafers. The fourth servo motor drives the mounting frame to flip, and after flipping the silicon wafers, they are placed inside the base frame used for unloading. Then the conveyor plate continues to convey, moving the subsequent silicon wafers to the front end. The slide bar lifts the new silicon wafers again. The fifth and seventh linear motors cooperate with the clamping mechanism at the bottom of the second lifting frame to clamp the silicon wafers and transfer them to the base frame used for unloading. The second lifting frame and the mounting frame move alternately, so that the silicon wafers are grouped in pairs with the coated surfaces touching, and stored inside the base frame used for unloading.

[0027] S3, silicon wafer storage: The transferred silicon wafers are transferred to the base frame for unloading. The third pneumatic telescopic rod pushes the push plate to realize the orderly storage and retrieval of silicon wafers, completing the entire liquid source diffusion process before silicon wafer passivation.

[0028] Compared with the prior art, the beneficial effects of the present invention are as follows: In the liquid source diffusion device and method before silicon wafer passivation, the coating mechanism includes a housing providing the installation base, a coating cylinder for silicon wafer coating operations, an air slip ring cooperating with a first negative pressure suction cup to adsorb and fix the silicon wafer, a raw material tank storing the liquid source, a first servo motor and a first pneumatic telescopic rod driving the coating rod to perform the coating operation, a conveyor assisting in material transport, and all components working together to realize the liquid source coating process of the silicon wafer. A second servo motor drives the rotating end of the air slip ring to rotate, causing the silicon wafer adsorbed on the first negative pressure suction cup to rotate, facilitating uniform coating; the air slip ring realizes air path connection to ensure stable negative pressure; a third servo motor drives the clamp to rotate, adjusting the angle of the coating rod, and cooperating with the first servo motor to adjust the position of the coating rod to comprehensively coat the surface of the silicon wafer; in the conveying mechanism, each linear motor operates in coordination, the second linear motor cooperating with the second negative pressure suction cup to realize the silicon wafer suction and transport, and the third linear motor and the sixth linear motor... Linear motors and the first lifting frame facilitate the transfer of silicon wafers between different workstations, allowing the silicon wafers conveyed on the conveyor belt to be transferred to the first negative pressure suction cup. Since the bottom of the first lifting frame is equipped with clamping mechanisms on both sides, it can transfer the silicon wafers into the coating cylinder during reciprocating movement, and then transfer the coated silicon wafers back to the conveyor plate, improving processing continuity. The fourth and fifth linear motors cooperate to transfer the coated and dried silicon wafers. The fourth servo motor drives the mounting frame to rotate, which flips the clamped silicon wafers. This allows the clamping mechanisms at the bottom of the second lifting frame and the mounting frame to work together to transfer the silicon wafers lifted by the sliding rods. During the transfer, the second lifting frame and the mounting frame move alternately, ensuring that coated silicon wafers overlap and are placed between several limiting rods to prevent the uncoated side of the silicon wafer from contacting the coated side. Attached Figure Description

[0029] Figure 1 This is one of the three-dimensional structural schematic diagrams disclosed in the embodiments of the present invention;

[0030] Figure 2 This is the second three-dimensional structural schematic diagram disclosed in the embodiment of the present invention;

[0031] Figure 3 This is a three-dimensional structural diagram of the coating mechanism disclosed in an embodiment of the present invention;

[0032] Figure 4 This is a three-dimensional structural diagram of the drying mechanism disclosed in an embodiment of the present invention;

[0033] Figure 5 This is a partial three-dimensional structural diagram of the conveying mechanism disclosed in an embodiment of the present invention;

[0034] Figure 6 This is a partial front cross-sectional schematic diagram of the material storage mechanism disclosed in an embodiment of the present invention;

[0035] Figure 7 This is a schematic cross-sectional view of the coating cylinder disclosed in an embodiment of the present invention;

[0036] Figure 8 This is a three-dimensional structural diagram of the clamping mechanism disclosed in an embodiment of the present invention;

[0037] Figure 9 This is a block diagram of a method disclosed in an embodiment of the present invention.

[0038] In the diagram: 1. Protective frame; 2. Coating mechanism; 201. Box; 202. Coating cylinder; 203. Conveyor; 204. First servo motor; 205. First negative pressure suction cup; 206. Raw material barrel; 207. Connecting rod; 208. Support rod; 209. Clamp; 210. Coating rod; 211. Third servo motor; 212. Air slip ring; 213. Second servo motor; 214. First pneumatic telescopic rod; 3. Drying mechanism; 301. Drying box; 302. First linear motor; 303. Lifting seat; 304. Connecting plate; 305. Second pneumatic telescopic rod; 306. Connecting seat; 307. Slide rod; 308. Conveyor plate; 3 09. Slide; 4. Conveying mechanism; 401. Second linear motor; 402. Third linear motor; 403. Fourth linear motor; 404. Fifth linear motor; 405. Clamping mechanism; 40501. Parallel pneumatic clamp; 40502. Moving block; 40503. Clamping rod; 406. Sixth linear motor; 407. First lifting frame; 408. Second lifting frame; 409. Fixed rod; 410. Second negative pressure suction cup; 411. Fourth servo motor; 412. Mounting frame; 413. Seventh linear motor; 7. Material storage mechanism; 701. Base frame; 702. Limiting rod; 703. Push plate; 704. Third pneumatic telescopic rod. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] Please see Figures 1-8This invention provides a technical solution: a liquid source diffusion device for silicon wafer passivation, comprising a coating mechanism 2, the coating mechanism 2 comprising a housing 201, a coating cylinder 202 fixedly installed on one side of the upper end of the housing 201, a slip ring 212 fixedly installed at the bottom of the inner part of the coating cylinder 202, a first negative pressure suction cup 205 sleeved on the rotating end of the slip ring 212, a raw material barrel 206 fixedly installed on one side of the coating cylinder 202, a first servo motor 204 fixedly installed on the upper end face of the housing 201 on the side of the raw material barrel 206, a first pneumatic telescopic rod 214 sleeved on the output end of the first servo motor 204, a connecting rod 207 fixedly installed on the upper end of the first pneumatic telescopic rod 214, a support rod 208 bolted to the bottom side of the connecting rod 207, a clamp 209 rotatably connected to one side of the support rod 208, a coating rod 210 inserted inside the clamp 209, and a conveyor 203 fixedly installed on the upper end face of the housing 201 on the side of the coating cylinder 202.

[0041] In one embodiment of the present invention, a second servo motor 213 is fixedly installed at the bottom of the coating cylinder 202. The output end of the second servo motor 213 is connected to the rotating end of the air slip ring 212. The output end of the air slip ring 212 is connected to the input end of the first negative pressure suction cup 205 through a pipe. A third servo motor 211 is fixedly installed on one side of the support rod 208. The output end of the third servo motor 211 is connected to the clamp 209.

[0042] In one embodiment of the present invention, a drying mechanism 3 is further included. The drying mechanism 3 includes a drying box 301, which is disposed on one side of the coating cylinder 202. Both ends of the drying box 301 are provided with lifting seats 303. The bottom end of the lifting seat 303 is connected to the upper end surface of the box body 201. The upper ends of the lifting seats 303 are both embedded and installed with second pneumatic telescopic rods 305. A connecting plate 304 is fixedly installed between the upper ends of each pair of second pneumatic telescopic rods 305.

[0043] In one embodiment of the present invention, a connecting seat 306 is fixedly installed on the upper end of each connecting plate 304, and a pair of slide rods 307 are fixedly installed between a pair of connecting seats 306. A first linear motor 302 is fixedly installed inside the drying box 301 between a pair of lifting seats 303. A conveying plate 308 is fixedly installed on the moving end of the first linear motor 302. A pair of sliding grooves 309 are opened on the upper end of the conveying plate 308, and the sliding grooves 309 are slidably connected to the slide rods 307.

[0044] In one embodiment of the present invention, a further component is a conveying mechanism 4. The conveying mechanism 4 includes a second linear motor 401, a third linear motor 402, a fourth linear motor 403, and a fifth linear motor 404. The third linear motor 402 is disposed on one side of the coating cylinder 202. A sixth linear motor 406 is mounted on the moving end of the third linear motor 402. A first lifting frame 407 is mounted on the moving end of the sixth linear motor 406. The second linear motor 401 is disposed on one side of the third linear motor 402. A fixing rod 409 is mounted on the moving end of the second linear motor 401. A second negative pressure suction cup 410 is mounted on the bottom end of the fixing rod 409.

[0045] In one embodiment of the present invention, the fourth linear motor 403 and the fifth linear motor 404 are respectively disposed on both sides of one end of the first linear motor 302. The moving end of the fourth linear motor 403 is fixedly mounted with a fourth servo motor 411, and the output end of the fourth servo motor 411 is fitted with a mounting bracket 412. The moving end of the fifth linear motor 404 is fixedly mounted with a seventh linear motor 413, and the moving end of the seventh linear motor 413 is mounted with a second lifting bracket 408.

[0046] In one embodiment of the present invention, clamping mechanisms 405 are provided on both sides of the bottom end of the first lifting frame 407, the bottom end of the mounting frame 412, and the bottom end of the second lifting frame 408. The clamping mechanism 405 includes a plurality of parallel pneumatic clamps 40501. Movable blocks 40502 are slidably installed on both sides of the bottom end of the plurality of parallel pneumatic clamps 40501. Clamping rods 40503 are fixedly installed on both sides of the bottom end of the movable blocks 40502. The two movable ends of the parallel pneumatic clamps 40501 are respectively fixedly connected to a pair of movable blocks 40502.

[0047] In one embodiment of the present invention, the storage mechanism 7 is further included. The storage mechanism 7 includes a pair of base frames 701, which are respectively disposed on both sides of the upper end face of the box 201. A plurality of limiting rods 702 are fixedly installed on the upper end of the base frames 701. A push plate 703 is slidably inserted between the plurality of limiting rods 702. A third pneumatic telescopic rod 704 is inserted at the center of each base frame 701. The bottom end of the third pneumatic telescopic rod 704 extends through the box 201 into the interior. The top end of the third pneumatic telescopic rod 704 is connected to the bottom end of the push plate 703.

[0048] In one embodiment of the present invention, a vacuum pump is fixedly installed at the bottom of the box 201. The output end of the vacuum pump is connected to the input end of the second negative pressure suction cup 410 and the input end of the air slip ring 212 through pipes. A protective frame 1 is provided at the top of the box 201, and several operating doors are provided on both sides of the protective frame 1.

[0049] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0050] Please see Figure 9 The present invention provides a technical solution: a method for using a liquid source diffusion device before silicon wafer passivation, comprising the following steps:

[0051] S1, Silicon Wafer Loading and Coating: The second linear motor 401 drives the fixing rod 409 and the second negative pressure suction cup 410 to move. Using the negative pressure provided by the vacuum pump, the second negative pressure suction cup 410 picks up the silicon wafer in the loading base 701. The third linear motor 402 and the sixth linear motor 406 cooperate with the clamping mechanism 405 at the bottom of the first lifting frame 407 to transfer the silicon wafer into the coating cylinder 202. The first negative pressure suction cup 205 adsorbs and fixes the silicon wafer under the negative pressure provided by the air slip ring 212. The second servo motor 213 drives the rotating end of the air slip ring 212 to rotate, causing the silicon wafer to rotate. The first servo motor 204 and the first pneumatic telescopic rod 214 adjust the position of the coating rod 210. The third servo motor 211 drives the clamp 209 to adjust the angle of the coating rod 210. After obtaining the liquid source from the raw material tank 206, the silicon wafer is coated.

[0052] S2, Silicon Wafer Drying and Transfer: The coated silicon wafer is held by the clamping mechanism 405 at the bottom of the first lifting frame 407 and transferred to the conveyor plate 308 inside the drying chamber 301. The first linear motor 302 drives the conveyor plate 308 to move along the slide bar 307, so that the silicon wafer moves along a set path inside the drying chamber 301 to complete the drying. After drying, the second pneumatic telescopic rod 305 drives the slide bar 307 to lift the silicon wafer. The fourth linear motor 403 drives the clamping mechanism 405 at the bottom of the mounting frame 412 to clamp the silicon wafer. The fourth servo motor 411 drives... The mounting frame 412 flips over, and the silicon wafer is placed inside the base frame 701 for unloading. Then the conveyor plate 308 continues to convey the wafers and moves them to the front. The slide bar 307 lifts the new wafers again. The fifth linear motor 404 and the seventh linear motor 413, together with the clamping mechanism 405 at the bottom of the second lifting frame 408, clamp the wafers and transfer them to the base frame 701 for unloading. The second lifting frame 408 and the mounting frame 412 move alternately, so that the silicon wafers are placed in pairs with their coated surfaces touching, and stored inside the base frame 701 for unloading.

[0053] S3, silicon wafer storage: The transferred silicon wafers are transferred to the base frame 701 for unloading. The third pneumatic telescopic rod 704 pushes the push plate 703 to realize the orderly storage and retrieval of silicon wafers, completing the entire liquid source diffusion process before silicon wafer passivation.

Claims

1. A liquid source diffusion device before silicon wafer passivation, characterized in that, The system includes a coating mechanism (2), a drying mechanism (3), a conveying mechanism (4), and a storage mechanism (7). The coating mechanism (2) includes a housing (201). A coating cylinder (202) is fixedly installed on one side of the upper end of the housing (201). An air slip ring (212) is fixedly installed at the bottom inside the coating cylinder (202). A first negative pressure suction cup (205) is sleeved on the rotating end of the air slip ring (212). A raw material barrel (206) is fixedly installed on one side of the coating cylinder (202). The upper end face of the housing (201) is fixedly installed on one side of the raw material barrel (206). There is a first servo motor (204), and a first pneumatic telescopic rod (214) is fitted on the output end of the first servo motor (204). A connecting rod (207) is fixedly installed on the upper end of the first pneumatic telescopic rod (214). A support rod (208) is installed on the bottom side of the connecting rod (207) by bolts. A clamp (209) is rotatably connected to one side of the support rod (208). A coating rod (210) is inserted inside the clamp (209). A conveyor (203) is fixedly installed on the upper end face of the box (201) on one side of the coating cylinder (202). A second servo motor (213) is fixedly installed at the bottom of the coating cylinder (202). The output end of the second servo motor (213) is connected to the rotating end of the air slip ring (212). The output end of the air slip ring (212) is connected to the input end of the first negative pressure suction cup (205) through a pipe. A third servo motor (211) is fixedly installed on one side of the support rod (208). The output end of the third servo motor (211) is connected to the clamp (209). The drying mechanism (3) includes a drying box (301), which is located on one side of the coating cylinder (202). Both ends of the drying box (301) are provided with lifting seats (303). The bottom end of the lifting seat (303) is connected to the upper end face of the box body (201). The upper ends of the lifting seats (303) are both embedded with second pneumatic telescopic rods (305). A connecting plate (304) is fixedly installed between the upper ends of each pair of second pneumatic telescopic rods (305). The conveying mechanism (4) includes a second linear motor (401), a third linear motor (402), a fourth linear motor (403), and a fifth linear motor (404). The third linear motor (402) is located on one side of the coating cylinder (202). A sixth linear motor (406) is installed at the moving end of the third linear motor (402). A first lifting frame (407) is installed at the moving end of the sixth linear motor (406). The second linear motor (401) is located on one side of the third linear motor (402). A fixing rod (409) is installed at the moving end of the second linear motor (401). A second negative pressure suction cup (410) is installed at the bottom end of the fixing rod (409). The storage mechanism (7) includes a pair of base frames (701), which are respectively disposed on both sides of the upper end face of the box (201). Several limiting rods (702) are fixedly installed on the upper end of the base frame (701), and push plates (703) are slidably inserted between the several limiting rods (702). A third pneumatic telescopic rod (704) is inserted at the center of each base frame (701). The bottom end of the third pneumatic telescopic rod (704) extends through the box (201) into the interior, and the top end of the third pneumatic telescopic rod (704) is connected to the bottom end of the push plate (703).

2. The liquid source diffusion device before silicon wafer passivation according to claim 1, characterized in that, A connecting seat (306) is fixedly installed on the upper end of each connecting plate (304). A pair of slide rods (307) are fixedly installed between a pair of connecting seats (306). A first linear motor (302) is fixedly installed inside the drying box (301) between a pair of lifting seats (303). A conveying plate (308) is fixedly installed on the moving end of the first linear motor (302). A pair of sliding grooves (309) are opened on the upper end of the conveying plate (308). The sliding grooves (309) are slidably connected to the slide rods (307).

3. The liquid source diffusion device before silicon wafer passivation according to claim 2, characterized in that, The fourth linear motor (403) and the fifth linear motor (404) are respectively disposed on one side of the first linear motor (302). The moving end of the fourth linear motor (403) is fixedly mounted with a fourth servo motor (411). The output end of the fourth servo motor (411) is fitted with a mounting bracket (412). The moving end of the fifth linear motor (404) is fixedly mounted with a seventh linear motor (413). The moving end of the seventh linear motor (413) is mounted with a second lifting frame (408).

4. The liquid source diffusion device before silicon wafer passivation according to claim 3, characterized in that, Clamping mechanisms (405) are provided on both sides of the bottom end of the first lifting frame (407), the bottom end of the mounting frame (412), and the bottom end of the second lifting frame (408). The clamping mechanism (405) includes a plurality of parallel pneumatic clamps (40501). Movable blocks (40502) are slidably installed on both sides of the bottom end of the plurality of parallel pneumatic clamps (40501). Clamping rods (40503) are fixedly installed on both sides of the bottom end of the movable blocks (40502). The two movable ends of the parallel pneumatic clamps (40501) are respectively fixedly connected to a pair of movable blocks (40502).

5. The liquid source diffusion device before silicon wafer passivation according to claim 4, characterized in that, A vacuum pump is fixedly installed at the bottom of the box (201). The output end of the vacuum pump is connected to the input end of the second negative pressure suction cup (410) and the input end of the air slip ring (212) through pipes. A protective frame (1) is provided at the top of the box (201). Several operating doors are provided on both sides of the protective frame (1).

6. A method of using a liquid source diffusion device before silicon wafer passivation, characterized in that, The liquid source diffusion device applied to the silicon wafer passivation pre-diffusion apparatus as described in claim 5 includes the following steps: S1, Silicon Wafer Loading and Coating: The second linear motor (401) drives the fixed rod (409) and the second negative pressure suction cup (410) to move. Using the negative pressure provided by the vacuum pump, the second negative pressure suction cup (410) picks up the silicon wafer in the loading base (701). The third linear motor (402) and the sixth linear motor (406), together with the clamping mechanism (405) at the bottom of the first lifting frame (407), transfer the silicon wafer into the coating cylinder (202). The suction cup (205) adsorbs and fixes the silicon wafer under the negative pressure provided by the air slip ring (212). The second servo motor (213) drives the rotating end of the air slip ring (212) to rotate, thereby rotating the silicon wafer. The first servo motor (204) and the first pneumatic telescopic rod (214) adjust the position of the coating rod (210). The third servo motor (211) drives the clamp (209) to adjust the angle of the coating rod (210). After obtaining the liquid source from the raw material tank (206), the silicon wafer is coated. S2, Silicon Wafer Drying and Transfer: The coated silicon wafer is held by the clamping mechanism (405) at the bottom of the first lifting frame (407) and transferred to the conveyor plate (308) in the drying chamber (301). The first linear motor (302) drives the conveyor plate (308) to move along the slide bar (307), so that the silicon wafer moves in the drying chamber (301) according to the set path to complete the drying. After drying, the second pneumatic telescopic rod (305) drives the slide bar (307) to lift the silicon wafer. The fourth linear motor (403) drives the clamping mechanism (405) at the bottom of the mounting frame (412) to clamp the silicon wafer. The fourth servo motor (411) The mounting frame (412) is rotated, and the silicon wafer is placed inside the base frame (701) for unloading. Then the conveyor plate (308) continues to convey the wafers and moves them to the front end. The slide bar (307) lifts the new wafers again. The fifth linear motor (404) and the seventh linear motor (413) work together with the clamping mechanism (405) at the bottom of the second lifting frame (408) to clamp the wafers and transfer them to the base frame (701) for unloading. The second lifting frame (408) and the mounting frame (412) move alternately so that the wafers are placed in pairs with their coated surfaces touching and stored inside the base frame (701) for unloading. S3, silicon wafer storage: The transferred silicon wafer is transferred to the base frame (701) for unloading. The third pneumatic telescopic rod (704) pushes the push plate (703) to realize the orderly storage and retrieval of silicon wafers, and complete the entire liquid source diffusion process before silicon wafer passivation.

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