Polishing equipment for processing semiconductor glass substrate

Abstract

The invention is applicable to the technical field of semiconductor production equipment, and provides polishing equipment for semiconductor glass substrate processing, which comprises a polishing assembly, and the polishing assembly is rotatably matched with a positioning assembly; the polishing assembly comprises a polishing piece and a supporting piece arranged on the polishing piece in a sliding fit mode, and the positioning assembly comprises a clamping piece arranged on the polishing piece in a rotating fit mode, a rotating piece arranged on the clamping piece in a rotating fit mode and a cam piece located on the rotating piece in an inserted connection mode. The equipment solves the problems that when an existing semiconductor glass substrate is subjected to polishing operation on the upper surface and the lower surface, generally when polishing operation on one end face is completed, the clamping and positioning process of the clamped and positioned semiconductor glass substrate needs to be relieved, then the semiconductor glass substrate is turned over, and finally the semiconductor glass substrate is subjected to clamping and positioning operation after being turned over; the whole polishing process is too tedious, and the polishing efficiency of the upper surface and the lower surface of the same semiconductor glass substrate is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production equipment, and more particularly to a polishing device for processing a semiconductor glass substrate. Background Art

[0002] Semiconductor glass substrates are also called silicon wafers. As the mother material for semiconductor substrates, silicon wafers need to go through rough grinding, chemical etching and polishing during the production and processing of silicon wafers to become semiconductor substrates.

[0003] At present, the polishing equipment for semiconductor glass substrate processing on the market often has the following technical problems when polishing semiconductor glass substrates: When polishing the upper and lower surfaces of existing semiconductor glass substrates, it is usually necessary to release the clamping and positioning process of the semiconductor glass substrate after completing the polishing operation of one end surface, then turn it over, and finally perform the clamping and positioning operation after turning it over. This makes the entire polishing process too cumbersome and reduces the polishing efficiency of the upper and lower surfaces of the same semiconductor glass substrate. Summary of the Invention

[0004] In view of the shortcomings of the existing technology, the purpose of the present invention is to provide a polishing device for semiconductor glass substrate processing that can avoid the need to frequently disassemble the semiconductor glass substrate after clamping and positioning when polishing the upper and lower surfaces of the semiconductor glass substrate in the later stage, and then perform the clamping and positioning operation after turning it over, thereby simplifying the turning process of the semiconductor glass substrate in the entire process and improving the polishing efficiency of the upper and lower surfaces of the same semiconductor glass substrate.

[0005] To achieve the above object, the present invention provides the following technical solutions: A polishing device for processing a semiconductor glass substrate comprises a polishing assembly. A positioning assembly is rotatably fitted on the polishing assembly.

[0006] The polishing assembly includes a polishing piece and a supporting piece that slides on the polishing piece. The positioning assembly includes a clamping piece that rotates on the polishing piece, a rotating piece that rotates on the clamping piece, and a cam piece that is inserted and positioned on the rotating piece.

[0007] The polishing part includes a base plate, a rectangular frame is fixed on the top of the base plate, two symmetrical positioning rods are fixed on an outer side of the rectangular frame, a rectangular groove is penetrated through the outer side of the rectangular frame between the two positioning rods, an I-shaped slider is fitted inside the rectangular groove for reciprocating sliding, a rotating cylinder is fixed on one end of the I-shaped slider, an L-shaped plate is fixed on an adjacent outer side of the rectangular frame, and a rack is fixed on the side of the L-shaped plate between the two positioning rods.

[0008] The clamping member includes a rotating shaft that is rotatably engaged with the inside of the rotating cylinder through a bearing, a cam is fixed to the end of the rotating shaft, and the circumferential side of the cam is provided with a missing tooth that engages with the rack. The circumferential side of the cam opposite to the missing tooth is provided with a U-shaped positioning groove extending downward, and the two positioning rods are respectively slidably engaged with the U-shaped positioning groove.

[0009] The present invention is further configured as follows: a servo motor is fixed to the inner wall of the rectangular frame, a rotating plate is fixed to the output shaft of the servo motor, and a reciprocating lever is fixed to the side surface of the rotating plate.

[0010] The other end face of the I-shaped sliding block is located inside the rectangular frame and a lifting horizontal plate is fixed thereto. A reciprocating groove that is slidably fitted on the reciprocating lever is formed through the side face of the lifting horizontal plate.

[0011] The present invention is further configured as follows: two symmetrical side plates are fixed on the top of the bottom plate, and rectangular sliding grooves are provided on opposite sides of the two side plates, and vertical grooves are provided on the two inner side walls of the rectangular sliding grooves.

[0012] Two symmetrical groups of guide vertical rods are fixed on the top of the bottom plate between the two side plates, and two groups of return springs are fixed on the top of the bottom plate between the two side plates and respectively sleeved and fitted on the two groups of guide vertical rods.

[0013] The present invention is further configured as follows: the support member includes two sliding vertical plates that are respectively slidably fitted on two rectangular sliding grooves, a supporting horizontal plate is fixed on the top of the two sliding vertical plates, vertical rails that are slidably fitted on the vertical grooves are fixed on the opposite sides of the sliding vertical plates, and displacement plates that are respectively slidably fitted on two groups of guide vertical rods are fixed on the bottom of the two sliding vertical plates, and the bottom of the displacement plate is fixedly connected to the end of the reset spring.

[0014] The present invention is further configured as follows: an L-shaped vertical plate is fixed to the side of the bottom plate, an outer side surface of the L-shaped vertical plate is penetrated by a first telescopic cylinder for sliding cooperation, the telescopic end of the first telescopic cylinder is located inside the L-shaped vertical plate and a displacement vertical plate is fixed thereto, and a first rectangular plug rod and a second rectangular plug rod are sequentially arranged on the side of the displacement vertical plate from top to bottom.

[0015] A T-shaped positioning block is fixed on the bottom of the supporting horizontal plate, and a rectangular insertion hole for plugging and matching with the first rectangular insertion rod and the second rectangular insertion rod is opened on the side of the T-shaped positioning block.

[0016] The present invention is further configured as follows: an L-shaped extension plate is fixed on the side of the cam below the U-shaped positioning groove, a positioning ring is fixed on the top outside the L-shaped extension plate, a limiting ring is fixed on the top of the positioning ring, and a plurality of sliding columns are slidingly fitted through the circumferential side of the positioning ring, and sliding balls are fixed on the ends of several sliding columns located outside the positioning ring, and rectangular clamping plates are fixed on the ends of several sliding columns located inside the positioning ring, and an elastic spring that is sleeved on the sliding column is fixed between the rectangular clamping plate and the positioning ring.

[0017] The present invention is further configured as follows: the rotating part includes two semicircular rings connected and fixed to each other, the inner walls of the two semicircular rings are provided with semicircular limiting grooves that rotate and fit on the limiting ring, the inner walls of the two semicircular rings are fixed with positioning semicircular rings above the semicircular limiting grooves, and the tops of the two positioning semicircular rings are fixed with threaded columns.

[0018] The present invention is further configured as follows: the cam member includes a circular cylinder, a circular through-hole is formed through the outer top of the circular cylinder, two symmetrical plug-in holes are formed through the outer top of the circular cylinder, and the two plug-in holes are respectively plugged into and matched with two threaded columns.

[0019] A plurality of convex blocks are fixed on the inner wall of the circular cylinder below the circular through hole, and a concave circular groove extending downward is formed on the outer top of the circular cylinder.

[0020] A second telescopic cylinder is fixed on the side surface of the cam between the U-shaped positioning groove and the L-shaped extension plate, and a positioning rod is fixed on the telescopic end of the second telescopic cylinder.

[0021] The outer peripheral side of the circular cylinder is provided with a plugging circular hole which is plugged and matched with the positioning plug rod.

[0022] The present invention is further configured as follows: an L-shaped support top plate is fixed on the outer top of the rectangular frame, a third telescopic cylinder is fixed on the outer top of the L-shaped support top plate and extends downward through the L-shaped support top plate, the telescopic end of the third telescopic cylinder is located inside the L-shaped support top plate and a motor mounting plate is fixed thereon, a drive motor is fixed on the bottom of the motor mounting plate, and a polishing disk is fixed on the output shaft of the drive motor.

[0023] The advantages of the present invention are: 1. The present invention completes the 180° flipping operation process through the entire positioning assembly and the semiconductor glass substrate clamped and positioned inside the positioning assembly, avoiding the need to frequently disassemble the semiconductor glass substrate after clamping and positioning when polishing the upper and lower surfaces of the semiconductor glass substrate in the later stage, and then perform the clamping and positioning operation after flipping, thereby simplifying the flipping process of the semiconductor glass substrate in the entire process and improving the polishing efficiency of the upper and lower surfaces of the same semiconductor glass substrate.

[0024] 2. The present invention starts the third telescopic cylinder to drive the polishing disc fixed to the output shaft of the driving motor to move downward synchronously, thereby pushing the semiconductor glass substrate that has been clamped and positioned downward until the lower surface of the semiconductor glass substrate is completely in contact with the top of the supporting horizontal plate, thereby performing an upper surface polishing operation on the semiconductor glass substrate that has been clamped and positioned, thereby preventing the semiconductor glass substrate that has been clamped and positioned from shaking during the subsequent polishing of the upper surface of the semiconductor glass substrate, thereby affecting the subsequent polishing effect.

[0025] 3. The present invention starts the third telescopic cylinder again to drive the polishing disc fixed to the output shaft of the driving motor to move downward synchronously, thereby pushing the clamped and positioned semiconductor glass substrate downward until the surface of the turned-over semiconductor glass substrate is completely in contact with the top of the supporting horizontal plate, thereby preventing the semiconductor glass substrate from shaking up and down after being positioned and clamped during the polishing operation on the lower surface of the semiconductor glass substrate, thereby affecting the subsequent polishing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 The figure is a schematic structural diagram of a polishing device for processing a semiconductor glass substrate according to the present invention.

[0027] Figure 2 It is a structural schematic diagram of the polishing assembly of the present invention.

[0028] Figure 3 It is a side view of the polishing assembly of the present invention.

[0029] Figure 4 It is a structural schematic diagram of the positioning component of the present invention.

[0030] Figure 5 It is a structural schematic diagram of the polishing part of the present invention.

[0031] Figure 6 It is a side view of the polishing piece of the present invention.

[0032] Figure 7 Schematic diagram of the structure of the support member of the present invention.

[0033] Figure 8 Schematic diagram of the structure of the clamping member of the present invention.

[0034] Figure 9 It is a structural schematic diagram of the rotating part of the present invention.

[0035] Figure 10 It is a side view of the rotating part of the present invention.

[0036] Figure 11 Schematic diagram of the top view of the cam member of the present invention.

[0037] Figure 12 This is a schematic structural diagram of the cam member of the present invention from a bottom-up perspective.

[0038] Figure 13 The present invention is a schematic diagram of the turning process flow of a polishing device for processing a semiconductor glass substrate.

[0039] In the figure: 1. polishing assembly; 2. positioning assembly; 3. polishing member; 4. supporting member; 5. clamping member; 6. rotating member; 7. cam member; 301. bottom plate; 302. rectangular frame; 303. positioning rod; 304. rectangular groove; 305. I-shaped slider; 306. rotating cylinder; 307. L-shaped plate; 308. rack; 309. servo motor; 310. rotating plate; 311. reciprocating lever; 312. lifting horizontal plate; 313. reciprocating groove; 314. side plate; 315. rectangular slide; 316. vertical groove; 317. guide vertical rod; 318. return spring; 319. L-shaped vertical plate; 320. first telescopic cylinder; 321. displacement vertical plate; 322. first rectangular plug rod; 323. second rectangular plug rod; 324. L-shaped support top plate; 325. third telescopic cylinder; 326. motor Mounting plate; 327, drive motor; 328, polishing disc; 401, sliding vertical plate; 402, supporting horizontal plate; 403, vertical rail; 404, displacement plate; 405, T-shaped positioning block; 406, rectangular socket; 501, rotating shaft; 502, cam; 503, missing teeth; 504, U-shaped positioning groove; 505, L-shaped extension plate; 506, positioning ring; 507, limit ring; 508, Sliding column; 509, sliding ball; 510, rectangular clamping plate; 511, elastic spring; 512, second telescopic cylinder; 513, positioning rod; 601, semicircular ring; 602, semicircular limiting groove; 603, threaded column; 604, positioning semicircular ring; 701, circular cylinder; 702, circular through hole; 703, plug-in hole; 704, convex block; 705, concave circular groove; 706, plug-in circular hole. DETAILED DESCRIPTION

[0040] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0041] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0042] In the present invention, unless otherwise specified, directions such as "up" and "down" are generally used with respect to the directions shown in the drawings, or with respect to the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "left" and "right" are generally used with respect to the left and right shown in the drawings; "inside" and "outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directions are not used to limit the present invention.

[0043] For example 1, please refer to Figure 1-13 , the present invention provides the following technical solutions: A polishing device for processing semiconductor glass substrates, specifically, includes a polishing assembly 1, on which a positioning assembly 2 is rotatably engaged; the polishing assembly 1 includes a polishing piece 3 and a support piece 4 that is slidably engaged with the polishing piece 3, the positioning assembly 2 includes a clamping piece 5 that is rotatably engaged with the polishing piece 3, a rotating piece 6 that is rotatably engaged with the clamping piece 5, and a cam piece 7 that is inserted and positioned on the rotating piece 6; the polishing piece 3 includes a base plate 301, a rectangular frame 302 is fixed on the top of the base plate 301, two symmetrical positioning rods 303 are fixed on one outer side of the rectangular frame 302, a rectangular groove 304 is formed on one outer side of the rectangular frame 302 between the two positioning rods 303, an I-shaped slider 305 is reciprocatingly engaged with the inside of the rectangular groove 304, a rotating cylinder 306 is fixed to one end of the I-shaped slider 305, an L-shaped plate 307 is fixed on an adjacent outer side of the rectangular frame 302, and the L-shaped plate 307 is fixed on the adjacent outer side of the rectangular frame 302. The side of the plate 307 is located between the two positioning rods 303 and a rack 308 is fixed thereto; the clamping part 5 includes a rotating shaft 501 that is rotatably fitted in the rotating cylinder 306 through a bearing, and a cam 502 is fixed to the end of the rotating shaft 501. The circumferential side of the cam 502 is provided with a missing tooth 503 that meshes with the rack 308. The circumferential side of the cam 502 opposite to the missing tooth 503 is provided with a downwardly extending U-shaped positioning groove 504, and the two positioning rods 303 are respectively slidably fitted with the U-shaped positioning groove 504, and a servo motor 309 is fixed to the inner wall of the rectangular frame 302, and a rotating plate 310 is fixed to the output shaft of the servo motor 309, and a reciprocating lever 311 is fixed to the side of the rotating plate 310; the I-shaped slider 305 is located inside the rectangular frame 302 opposite to the other end face and a lifting horizontal plate 312 is fixed thereto, and a reciprocating groove 313 that slides through the side of the lifting horizontal plate 312 and slidably fits on the reciprocating lever 311.

[0044] The specific application of the first embodiment is as follows: after the polishing operation is completed on the upper surface of the semiconductor glass substrate, the servo motor 309 is started, driving the rotating plate 310 fixed to the output shaft of the servo motor 309 to rotate, so that the reciprocating lever 311 fixed to the side of the rotating plate 310 slides back and forth inside the reciprocating groove 313, so that the I-shaped slider 305 fixed to the side of the lifting horizontal plate 312 synchronously performs a reciprocating linear motion up and down inside the rectangular groove 304. During the process of the I-shaped slider 305 synchronously performing a reciprocating linear motion up and down inside the rectangular groove 304,When the cam 502 is in the initial position, the U-shaped positioning groove 504 provided on the side surface of the cam 502 is vertically facing upward, and the inner bottom of the U-shaped positioning groove 504 is in a state of mutual contact with the positioning rod 303 near the upper end of the two positioning rods 303. Later, when the I-shaped slider 305 slides downward, the U-shaped positioning groove 504 moves vertically downward. At this time, the positioning rod 303 near the upper end slides upward relative to the I-shaped slider 305. Until the positioning rod 303 near the upper end is about to slide out of the U-shaped positioning groove 504, the missing teeth 503 provided on the side surface of the cam 502 begin to gradually engage with the rack 308 fixed on the side surface of the L-shaped plate 307 (the arc length of the missing teeth 503 corresponds to a 180° rack engagement stroke). The cam 502 is thereby driven to rotate, causing the U-shaped positioning groove 504 provided on the side surface of the cam 502 to slide out from the side surface of the positioning rod 303 near the top, and then the meshing transmission between the missing tooth 503 and the rack 308 causes the entire cam 502 to swing away from the side surface of the L-shaped plate 307, thereby driving the rotating shaft 501 fixed to the side surface of the cam 502 to rotate circumferentially inside the rotating cylinder 306, causing the entire positioning assembly 2 and the semiconductor glass substrate clamped and positioned inside the positioning assembly 2 to synchronously perform a 180° flip. During the process of the entire positioning assembly 2 and the semiconductor glass substrate clamped and positioned inside the positioning assembly 2 synchronously performing a 180° flip, the positioning assembly 2 The circumferential side surface of the cam 502 simultaneously performs a nearly 180° rotation operation process, thereby providing a downward sliding force to the support member 4 slidably connected to the polishing member 3, and waiting for the entire positioning assembly 2 and the semiconductor glass substrate clamped and positioned inside the positioning assembly 2 to complete the nearly 180° rotation operation, the cam 502 rotates nearly 180° under the meshing transmission action of the rack 308. At this time, the U-shaped positioning groove 504 on the cam 502 is vertically downward, and when the meshing action between the missing tooth 503 and the rack 308 is about to disappear, the U-shaped positioning groove 504 is vertically downward and slides into the circumferential side surface of the positioning rod 303 near the lower one of the two positioning rods 303 until the missing tooth 503 and the rack 308 are engaged. After the meshing effect between the two ends completely disappears, the I-shaped slider 305 continues to move downward inside the rectangular groove 304 until the inner bottom of the U-shaped positioning groove 504 is completely in contact with the peripheral side surface of the positioning rod 303 closer to the bottom of the two positioning rods 303. The entire positioning assembly 2 and the semiconductor glass substrate clamped and positioned inside the positioning assembly 2 have completed a nearly 180° flip operation. This avoids the need to frequently disassemble the semiconductor glass substrate after clamping and positioning, and then perform the flipping clamping and positioning operation when polishing the upper and lower surfaces of the semiconductor glass substrate later. This simplifies the flipping process of the semiconductor glass substrate and improves the polishing effect of the upper and lower surfaces of the same semiconductor glass substrate.

[0045] For example 2, please refer to Figure 1-13, this embodiment 2 makes the following improvements on the basis of embodiment 1. Specifically, symmetrical two side plates 314 are fixed on the top of the bottom plate 301, and rectangular sliding grooves 315 are opened on the opposite side of the two side plates 314, and vertical grooves 316 are opened on the two inner walls of the rectangular sliding grooves 315; two symmetrical groups of guide vertical rods 317 are fixed on the top of the bottom plate 301 between the two side plates 314, and two groups of return springs 318 are respectively sleeved and matched on the two groups of guide vertical rods 317 on the top of the bottom plate 301 between the two side plates 314; the support member 4 includes two sliding vertical plates 401 that are respectively slidably matched on the two rectangular sliding grooves 315, and the tops of the two sliding vertical plates 401 are fixed with supporting horizontal plates 402, and the sliding vertical plates 401 are fixed on the opposite sides There is a vertical rail 403 that slides on the vertical groove 316, and the bottom of the two sliding vertical plates 401 are fixed with displacement plates 404 that slide on the two sets of guide vertical rods 317 respectively. The bottom of the displacement plate 404 is fixedly connected to the end of the return spring 318; an L-shaped vertical plate 319 is fixed to the side of the bottom plate 301, and an outer side surface of the L-shaped vertical plate 319 passes through the first telescopic cylinder 320 that slides and fits. The telescopic end of the first telescopic cylinder 320 is located inside the L-shaped vertical plate 319 and a displacement vertical plate 321 is fixed. The side surfaces of the displacement vertical plate 321 are sequentially provided with a first rectangular plug rod 322 and a second rectangular plug rod 323 from top to bottom; a T-shaped positioning block 405 is fixed to the bottom of the supporting horizontal plate 402, and a T-shaped positioning block 405 is provided on the side with a first rectangular plug rod The rod 322 and the second rectangular plug rod 323 are plugged into the rectangular socket 406; the side of the cam 502 is fixed with an L-shaped extension plate 505 below the U-shaped positioning groove 504, and a positioning ring 506 is fixed on the top of the L-shaped extension plate 505. A limiting ring 507 is fixed on the top of the positioning ring 506. A plurality of sliding columns 508 are slidingly fitted through the side of the positioning ring 506. The ends of the plurality of sliding columns 508 are located outside the positioning ring 506 and are fixed with sliding balls 509. The ends of the plurality of sliding columns 508 are located inside the positioning ring 506 and are fixed with a rectangular clamping plate 510. An elastic spring 511 that is sleeved and fitted on the sliding column 508 is fixed between the rectangular clamping plate 510 and the positioning ring 506; the rotating member 6 includes a plurality of mutually connected The two semicircular rings 601 are connected and fixed, and the inner walls of the two semicircular rings 601 are each provided with a semicircular limiting groove 602 that rotates and fits on the limiting ring 507. The inner walls of the two semicircular rings 601 are each fixed with a positioning semicircular ring 604 above the semicircular limiting groove 602, and the tops of the two positioning semicircular rings 604 are each fixed with a threaded column 603; the cam member 7 includes a circular cylinder 701, the outer top of the circular cylinder 701 is penetrated by a circular through-hole 702, and the outer top of the circular cylinder 701 is penetrated by two symmetrical plug holes 703, and the two plug holes 703 are respectively plugged with the two threaded columns 603; a plurality of convex blocks 704 are fixed on the inner wall of the circular cylinder 701 below the circular through-hole 702, and the outer top of the circular cylinder 701 is provided with a concave circular groove 705 extending downward;A second telescopic cylinder 512 is fixed to the side of the cam 502, between the U-shaped positioning groove 504 and the L-shaped extension plate 505. A positioning rod 513 is fixed to the telescopic end of the second telescopic cylinder 512. A circular insertion hole 706 is provided on the outer side of the circular cylinder 701, which engages with the positioning rod 513. An L-shaped support plate 324 is fixed to the top of the rectangular frame 302. A third telescopic cylinder 325 is fixed to the top of the L-shaped support plate 324, extending downward through the L-shaped support plate 324. A motor mounting plate 326 is fixed to the telescopic end of the third telescopic cylinder 325 within the L-shaped support plate 324. A drive motor 327 is fixed to the bottom of the motor mounting plate 326. A polishing disk 328 is fixed to the output shaft of the drive motor 327.

[0046] The specific application of the second embodiment is as follows: before polishing the surface of the semiconductor glass substrate, the semiconductor glass substrate to be polished is placed between a plurality of rectangular clamping plates 510, and then the circular cylinder 701 is manually rotated, so that the rotating member 6 fixed on the circular cylinder 701 is rotated on the limiting ring 507 (before the circular cylinder 701 is manually rotated, the bolts on the two semicircular rings 601 connected and fixed to each other are removed, and then the semicircular limiting grooves 602 respectively opened on the inner walls of the two semicircular rings 601 are rotated and connected to the limiting ring 507, and then the semicircular limiting grooves 602 respectively opened on the inner walls of the two semicircular rings 601 are rotated and connected to the limiting ring 507, and then the semicircular limiting grooves 602 respectively opened on the inner walls of the semicircular rings 601 are screwed again). The bolt connects and fixes the two split semi-circular rings 601, and then the two plug-in holes 703 respectively opened on the concave circular groove 705 are respectively plugged into the threaded columns 603 respectively fixed on the two semi-circular rings 601, and finally the threaded connection between the external nut and the threaded column 603 is rotated to connect the cam member 7 to the top of the rotating member 6. After the two plug-in holes 703 are respectively plugged into the threaded columns 603 respectively fixed on the two semi-circular rings 601, the overall height of the two threaded columns 603 is lower than the height of the outer top of the circular cylinder 701, so as to prevent the two threaded columns 603 from being turned over after the operation. The height of the circular cylinder 701 is too high, and the outer top of the circular cylinder 701 cannot be completely fitted with the top of the supporting horizontal plate 402), so that the inner wall of the circular cylinder 701 and the plurality of convex blocks 704 fixed to the inner wall of the circular cylinder 701 slide on the surfaces of the plurality of sliding balls 509 in sequence, so that the elastic spring 511 fixedly connected between the rectangular clamping plate 510 and the positioning ring 506 is gradually stretched, thereby driving the rectangular clamping plates 510 respectively fixed at the ends of the plurality of sliding columns 508 to synchronously make radial linear motions inside the positioning ring 506 close to the peripheral side of the semiconductor glass substrate, until After the rectangular clamping plates 510 and the side surfaces of the semiconductor glass substrate are in contact with each other (the contact point of the sliding ball 509 slides to the highest point of the curved surface of the convex block 704), the rotation of the circular cylinder 701 is stopped, and the second telescopic cylinder 512 is synchronously activated, so that the positioning rod 513 fixed to the telescopic end of the second telescopic cylinder 512 is gradually inserted and positioned inside the insertion hole 706, thereby positioning and fixing the rotating circular cylinder 701, and finally completing the positioning, clamping and fixing of the semiconductor glass substrate, thereby preventing the semiconductor glass substrate from shaking during the subsequent polishing operation; After the above-mentioned clamping positioning is completed, the first telescopic cylinder 320 is started to drive the displacement vertical plate 321 fixed to the telescopic end of the first telescopic cylinder 320 and the first rectangular insertion rod 322 and the second rectangular insertion rod 323 set on the side of the displacement vertical plate 321 to synchronously approach one side of the T-shaped positioning block 405 (the length of the first rectangular insertion rod 322 is less than the length of the second rectangular insertion rod 323, so as to avoid the first rectangular insertion rod 322 being too long during the later flipping operation, thereby affecting the later flipping operation), so that the first rectangular insertion rod 322 set on the side of the displacement vertical plate 321 is gradually inserted into the rectangular insertion hole 406 opened on the side of the T-shaped positioning block 405, thereby adjusting the support member 4 that slides between the two rectangular slots 315 After the insertion and fixing is completed, the third telescopic cylinder 325 is started to drive the polishing disc 328 fixed by the output shaft of the drive motor 327 to move downward synchronously, thereby pushing the clamped and positioned semiconductor glass substrate downward until the lower surface of the semiconductor glass substrate is completely in contact with the top of the supporting horizontal plate 402. At the same time, the third telescopic cylinder 325 is closed and the drive motor 327 is started to drive the polishing disc 328 fixed by the output shaft of the drive motor 327 to rotate, thereby performing an upper surface polishing operation on the clamped and positioned semiconductor glass substrate, thereby preventing the clamped and positioned semiconductor glass substrate from shaking during the subsequent polishing of the upper surface of the semiconductor glass substrate, thereby affecting the subsequent polishing effect; After the polishing operation of the upper surface of the semiconductor glass substrate is completed after the positioning and fixation, the third telescopic cylinder 325 is first started to drive the polishing plate 328 fixed to the output shaft of the drive motor 327 to move upward synchronously until the upper surface of the semiconductor glass substrate and the lower surface of the polishing plate 328 are separated from each other, and the distance between the polishing plate 328 and the upper surface of the semiconductor glass substrate is greater than the outer diameter of the circular cylinder 701 in the vertical state. Then, the third telescopic cylinder 325 is closed, and then the second telescopic cylinder 512 is started again, so that the positioning rod 513 fixed to the telescopic end of the second telescopic cylinder 512 is gradually moved out of the insertion hole 701. 06 is pulled out from the inside to release the positioning and fixing operation of the rotating circular cylinder 701. Subsequently, the second telescopic cylinder 512 is turned off and the first telescopic cylinder 320 is started again, so that the displacement vertical plate 321 fixed to the telescopic end of the first telescopic cylinder 320 and the first rectangular insertion rod 322 and the second rectangular insertion rod 323 set on the side of the displacement vertical plate 321 are synchronously moved away from one side of the T-shaped positioning block 405 until the first rectangular insertion rod 322 is completely separated from the rectangular insertion hole 406. The first telescopic cylinder 320 is then turned off to turn over the semiconductor glass substrate after being clamped and positioned. During the turning operation,The circular cylinder 701 rotates circumferentially, and the chamfered structure provided on the side surface of the circular cylinder 701 gradually tends from a horizontal state to a vertical state, and then from a vertical state to a horizontal state, thereby completing the flipping operation. During the flipping operation, as the circular cylinder 701 rotates circumferentially, the return springs 318 connected and fixed between the bottom plate 301 and the displacement plate 404 are gradually compressed, so that the bottom of the displacement plate 404 gradually approaches the top of the bottom plate 301, thereby driving the support member 4 slidingly fitted between the two rectangular slots 315 to move downward synchronously, thereby completing the process of the circular cylinder 701 tending from a horizontal state to a vertical state, and then from a vertical state to a horizontal state. The state tends to be horizontal, and the elastic restoring effect of the several compressed return springs 318 connected and fixed between the bottom plate 301 and the displacement plate 404 is used to push the displacement plate 404 to move upward between the two rectangular slots 315, so that the support member 4 moves upward synchronously before the two rectangular slots 315 (the upward movement distance of the support member 4 is less than the downward movement distance of the support member 4, so after the flipping operation, the compressed return spring 318 is still in a compressed state, so as to facilitate the subsequent plugging and locking between the second rectangular plug rod 323 located below the first rectangular plug rod 322 and the rectangular plug hole 406, thereby avoiding the semiconductor glass substrate after the flipping. 323 is fixed to the side of the T-shaped positioning block 405, and the polishing disc 328 is driven to move to the side of the T-shaped positioning block 405. The third telescopic cylinder 325 is then closed, and the drive motor 327 is activated, which drives the polishing disc 328 fixed to the output shaft of the drive motor 327 to rotate, thereby polishing the surface of the flipped semiconductor glass substrate. This locks the support member 4 in place after the flipping operation, preventing the semiconductor glass substrate from shaking up and down during the polishing operation on the lower surface of the semiconductor glass substrate, which would affect the subsequent polishing process.

[0047] Obviously, the embodiments described above are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0048] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, tasks, devices, components and / or combinations thereof.

[0049] It should be noted that the terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0050] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

[0051] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiment. All technical solutions based on the concept of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, various improvements and modifications that do not depart from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A polishing device for processing a semiconductor glass substrate, comprising a polishing assembly, characterized in that: The polishing assembly is rotatably fitted with a positioning assembly; The polishing assembly includes a polishing piece and a supporting piece that is slidably engaged with the polishing piece, and the positioning assembly includes a clamping piece that is rotatably engaged with the polishing piece, a rotating piece that is rotatably engaged with the clamping piece, and a cam piece that is inserted and positioned on the rotating piece; The polishing member includes a base plate, a rectangular frame is fixed on the top of the base plate, two symmetrical positioning rods are fixed on one outer side of the rectangular frame, a rectangular groove is formed on the outer side of the rectangular frame between the two positioning rods, an I-shaped slider is fitted in the rectangular groove for reciprocating sliding, a rotating cylinder is fixed to one end of the I-shaped slider, an L-shaped plate is fixed on an adjacent outer side of the rectangular frame, and a rack is fixed on the side of the L-shaped plate between the two positioning rods; The clamping member includes a rotating shaft rotatably engaged with the inside of the rotating cylinder through a bearing, a cam is fixed to the end of the rotating shaft, and a missing tooth is provided on the peripheral side of the cam to engage with the rack. A U-shaped positioning groove extending downward is formed on the peripheral side of the cam opposite to the missing tooth, and the two positioning rods are respectively slidably engaged with the U-shaped positioning groove; The top of the base plate is fixed with symmetrical two side plates, and the two side plates are provided with rectangular sliding grooves on opposite sides. The top of the base plate is located between the two side plates and fixed with two symmetrical groups of guide vertical rods. The top of the base plate is located between the two side plates and fixed with two groups of return springs respectively sleeved on the two groups of guide vertical rods. The support member includes two sliding vertical plates that are respectively slidably fitted on two rectangular sliding grooves, a supporting horizontal plate is fixed on the top of the two sliding vertical plates, vertical rails that are slidably fitted on the vertical grooves are fixed on the opposite sides of the sliding vertical plates, and displacement plates that are respectively slidably fitted on two groups of guide vertical rods are fixed on the bottom of the two sliding vertical plates, and the bottom of the displacement plate is fixedly connected to the end of the reset spring.

2. The polishing device for semiconductor glass substrate processing according to claim 1, characterized in that: A servo motor is fixed to the inner wall of the rectangular frame, a rotating plate is fixed to the output shaft of the servo motor, and a reciprocating lever is fixed to the side of the rotating plate; The other end face of the I-shaped sliding block is located inside the rectangular frame and a lifting horizontal plate is fixed thereto. A reciprocating groove that is slidably fitted on the reciprocating lever is formed through the side face of the lifting horizontal plate.

3. The polishing device for processing a semiconductor glass substrate according to claim 2, wherein: The rectangular chute is provided with vertical grooves on both inner side walls thereof.

4. The polishing device for processing a semiconductor glass substrate according to claim 3, wherein: An L-shaped vertical plate is fixed to the side of the bottom plate, and a first telescopic cylinder is slidably fitted through an outer side of the L-shaped vertical plate. The telescopic end of the first telescopic cylinder is located inside the L-shaped vertical plate and a displacement vertical plate is fixed thereto. A first rectangular plug rod and a second rectangular plug rod are sequentially arranged on the side of the displacement vertical plate from top to bottom. A T-shaped positioning block is fixed on the bottom of the supporting horizontal plate, and a rectangular insertion hole for plugging and matching with the first rectangular insertion rod and the second rectangular insertion rod is opened on the side of the T-shaped positioning block.

5. The polishing device for processing a semiconductor glass substrate according to claim 4, wherein: An L-shaped extension plate is fixed to the side of the cam below the U-shaped positioning groove, a positioning ring is fixed to the top of the L-shaped extension plate, a limiting ring is fixed to the top of the positioning ring, and a number of sliding columns are slidingly fitted through the circumferential side of the positioning ring, and sliding balls are fixed to the ends of several sliding columns located outside the positioning ring, and rectangular clamping plates are fixed to the ends of several sliding columns located inside the positioning ring, and an elastic spring that is sleeved on the sliding column is fixed between the rectangular clamping plate and the positioning ring.

6. The polishing device for processing a semiconductor glass substrate according to claim 5, characterized in that: The rotating part includes two semicircular rings connected and fixed to each other. The inner walls of the two semicircular rings are provided with semicircular limiting grooves that rotate and fit on the limiting ring. The inner walls of the two semicircular rings are fixed with positioning semicircular rings above the semicircular limiting grooves, and the tops of the two positioning semicircular rings are fixed with threaded columns.

7. The polishing device for processing a semiconductor glass substrate according to claim 6, wherein: The cam member comprises a circular cylinder, a circular through-hole is formed through the top of the circular cylinder, and two symmetrical plug holes are formed through the top of the circular cylinder, and the two plug holes are respectively plugged into and matched with the two threaded columns; A plurality of convex blocks are fixed on the inner wall of the circular cylinder below the circular perforation, and a concave circular groove extending downward is opened on the top of the outer top of the circular cylinder; A second telescopic cylinder is fixed on the side of the cam between the U-shaped positioning groove and the L-shaped extension plate, and a positioning rod is fixed on the telescopic end of the second telescopic cylinder; The outer peripheral side of the circular cylinder is provided with a plugging circular hole which is plugged and matched with the positioning plug rod.

8. The polishing device for processing a semiconductor glass substrate according to claim 7, wherein: An L-shaped support top plate is fixed on the outer top of the rectangular frame, and a third telescopic cylinder is fixed on the outer top of the L-shaped support top plate, which extends downward through the L-shaped support top plate. The telescopic end of the third telescopic cylinder is located inside the L-shaped support top plate and a motor mounting plate is fixed thereon. A driving motor is fixed to the bottom of the motor mounting plate, and a polishing disk is fixed to the output shaft of the driving motor.

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