Liquid ejecting head and liquid ejecting apparatus

Abstract

The invention provides a liquid ejecting head capable of easily aligning a plurality of head modules with each other, and a liquid ejecting apparatus. The liquid ejecting head includes: a plurality of head modules that eject liquid in a first direction; and a metal holder that detachably fixes the plurality of head modules, each of the plurality of head modules having a flow path opening forming member that demarcates the flow path therein and has a first positioning portion, the metal holder having a plurality of second positioning portions, and the first positioning portion and the second positioning portion being positioned in the flow path opening forming member. The plurality of second positioning parts are respectively pressed or pressed relative to the plurality of first positioning parts, so that the plurality of head modules are respectively positioned relative to the bracket. A flow path opening formed in the holder for flow path connection with the head module and a flow path opening formed in a flow path opening forming member of the head module for flow path connection with the holder overlap when viewed in a direction in which one of the first positioning portion and the second positioning portion is pressed into the other.

Description

Technical Field

[0001] The present disclosure relates to a liquid ejecting head and a liquid ejecting device. Background Art

[0002] Conventionally, there has been proposed a liquid ejecting apparatus including a liquid ejecting head for ejecting liquid such as ink onto a medium such as printing paper.

[0003] The liquid ejecting head described in Patent Document 1 comprises a plurality of head chips (head modules), a fixing plate, and a bracket. The plurality of head chips are housed within a space enclosed by the fixing plate and the bracket. The plurality of head chips are aligned with the fixing plate and fixed to the cover fixing plate with adhesive. Furthermore, the fixing plate is fixed to the bracket with adhesive.

[0004] When a part of the head modules among a plurality of head modules fails, there is a need to repair the liquid ejecting head by removing only the failed head module and replacing it with a new head module. However, in existing literature, when the head module is to be removed from the bracket, the fixing plate needs to be removed from the bracket. Therefore, there is a possibility that the alignment of the plurality of head modules relative to the fixing plate may deviate. Therefore, when performing the operation of replacing a part of the plurality of head modules of a liquid ejecting head in order to repair the liquid ejecting head, it is desired to be able to easily implement the alignment of the plurality of head modules.

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2022-42753 Summary of the Invention

[0006] The liquid jet head involved in one embodiment of the present invention comprises: a plurality of head modules that spray liquid in a first direction; a bracket that fixes the plurality of head modules in a detachable manner and is made of metal, the plurality of head modules respectively having a flow channel opening forming component, the flow channel opening forming component internally defining the flow channel and having a first positioning portion, and being made of metal, the bracket having a plurality of second positioning portions, the plurality of second positioning portions being respectively pressed into or pressed into relative to the plurality of first positioning portions, thereby positioning the plurality of head modules relative to the bracket, the flow channel opening formed on the bracket for connecting the flow channel to the head modules, and the flow channel opening formed on the flow channel opening forming component of the head module for connecting the flow channel to the bracket overlap when viewed in a direction in which one of the first positioning portion and the second positioning portion is pressed into the other.

[0007] A liquid ejecting apparatus according to one embodiment of the present disclosure includes: a plurality of the liquid ejecting heads; and a unit base that holds the plurality of the liquid ejecting heads. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a schematic diagram showing a configuration example of the liquid ejecting apparatus according to the first embodiment.

[0009] Figure 2 To express Figure 1 A plan view of the liquid ejecting unit is shown.

[0010] Figure 3 for Figure 2 The liquid ejecting head shown is a cross-sectional view viewed in the direction along the X-axis.

[0011] Figure 4 For Figure 2 The liquid ejecting head shown is a cross-sectional view viewed in the direction along the Y axis.

[0012] Figure 5 for Figure 3 A bottom view of the liquid ejecting head is shown.

[0013] Figure 6 for Figure 3 A cross-sectional view of a chip included in the head module is shown.

[0014] Figure 7 for Figure 4 A top view of a flow channel opening forming member included in the head module is shown.

[0015] Figure 8 To express Figure 4 Bottom view of the bracket and relay substrate shown.

[0016] Figure 9 for Figure 4 Top view of the bracket shown.

[0017] Figure 10 for Figure 4 A plan view of the lower portion of the bracket is shown.

[0018] Figure 11 for Figure 4 A top view of the sealing component is shown.

[0019] Figure 12 for Figure 4 A top view of the support component is shown.

[0020] Figure 13 A cross-sectional view of a portion of a liquid ejecting head according to a first modified example.

[0021] Figure 14 A cross-sectional view of a portion of a liquid ejecting head according to a second modified example.

[0022] Figure 15 A cross-sectional view of a portion of a liquid ejecting head according to a third modified example.

[0023] Figure 16 A cross-sectional view of a portion of a liquid ejecting head according to a fourth modified example.

[0024] Figure 17 A cross-sectional view of a portion of a liquid ejecting head according to a fifth modification.

[0025] Figure 18 A cross-sectional view of a portion of a liquid ejecting head according to a seventh modification.

[0026] Figure 19 It is a top view of the liquid ejecting head of the seventh modification.

[0027] Figure 20 A cross-sectional view of a portion of a liquid ejecting head according to an eighth modification.

[0028] Figure 21 It is a top view of the liquid ejecting head of the eighth modification.

[0029] Figure 22 A cross-sectional view of a portion of a liquid ejecting head according to a ninth modification.

[0030] Figure 23 4 is a cross-sectional view showing a sealing member and its vicinity according to a tenth modification.

[0031] Figure 24 A cross-sectional view of a portion of a liquid ejecting head according to a tenth modification.

[0032] Figure 25 4 is a cross-sectional view showing a sealing member and its vicinity according to an eleventh modified example. DETAILED DESCRIPTION

[0033] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In addition, in the accompanying drawings, the dimensions or scales of each part may be appropriately different from the actual situation, and there are also parts that are schematically shown for ease of understanding. In addition, in the following description, as long as there is no record indicating a particular limitation on the present invention, the scope of the present invention is not limited to these embodiments. In addition, "element β on element γ" is not limited to a structure in which element γ and element β are in direct contact, but also includes a structure in which element γ and element β are not in direct contact. "Element γ is equal to element β" only requires that element γ and element β are substantially equal, and may include measurement errors and manufacturing errors, etc. "Element γ is the same as element β" only requires that element γ and element β are substantially the same, and may include measurement errors and manufacturing errors, etc.

[0034] 1. First Implementation

[0035] 1-1. Overall Structure of Liquid Ejecting Device 100

[0036] Figure 1 This is a schematic diagram illustrating the structure of the liquid injection device 100 involved in the first embodiment. In the following, for the convenience of explanation, the X-axis, Y-axis and Z-axis that are orthogonal to each other are appropriately used for explanation. In addition, a direction along the X-axis is marked as the X1 direction, and the direction opposite to the X1 direction is marked as the X2 direction. Similarly, a direction along the Y-axis is marked as the Y1 direction, and the direction opposite to the Y1 direction is marked as the Y2 direction. A direction along the Z-axis is marked as the Z1 direction, and the direction opposite to the Z1 direction is marked as the Z2 direction. In addition, the Z1 direction is equivalent to the "first direction". The Z2 direction is equivalent to the "second direction that is the opposite direction to the first direction". In addition, the Z1 direction relative to a certain location is set as "below", and the Z2 direction from a certain location is set as "above". In addition, observation in the Z1 direction or the Z2 direction is set as "planar observation".

[0037] like Figure 1 As shown, the liquid ejecting apparatus 100 includes a liquid storage portion 9 , a control unit 91 , a transport portion 92 , a head unit 10 , and a moving mechanism 40 .

[0038] The liquid reservoir 9 is a container for storing ink. Specific examples of the liquid reservoir 9 include an ink cartridge that is detachable from the liquid ejecting apparatus 100, a bag-shaped ink pack formed of a flexible film, and an ink tank capable of refilling ink. The type of ink stored in the liquid reservoir 9 is not particularly limited and may be any type.

[0039] The control unit 91 controls the operation of each component of the liquid ejecting device 100. The control unit 91 includes, for example, a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a storage circuit such as a semiconductor memory, to control the operation of each component of the liquid ejecting device 100.

[0040] The transport unit 92 transports the medium 90 in the direction DM based on the control performed by the control unit 91. The direction DM in this embodiment is the Y1 direction. Figure 1In the example shown, the conveying unit 92 includes a conveying roller that is elongated along the X-axis and a motor that rotates the conveying roller. The conveying unit 92 is not limited to a structure using a conveying roller; for example, a structure using a roller or an endless belt that conveys the medium 90 while the medium 90 is attracted to the outer peripheral surface by static electricity or the like may also be used.

[0041] The moving mechanism 40 includes a conveyor belt that secures the unit base 11 of the head unit 10, and reciprocates the head unit 10 in the X1 and X2 directions based on control by the control unit 91. Based on control by the control unit 91, the head unit 10 ejects ink supplied from the liquid reservoir 9 from a plurality of nozzles N toward the medium 90 in the Z1 direction. By ejecting ink from the head unit 10 in parallel with the movement of the head unit 10 by the moving mechanism 40, an image formed by the ink is formed on the surface of the medium 90.

[0042] The number and arrangement of the plurality of liquid ejecting heads 1 included in the head unit 10 are not limited to Figure 1 Furthermore, when the head unit 10 is configured to circulate ink, the head unit 10 may be connected to the liquid storage portion 9 via a circulation mechanism for circulating ink within the head unit 10 .

[0043] 1-2. Head unit 10

[0044] Figure 2 To express Figure 1 The plan view of the head unit 10 is shown. Figure 2 As shown, the head unit 10 includes a unit base 11 and a plurality of liquid ejecting heads 1. The plurality of liquid ejecting heads 1 are fixed to the unit base 11. The unit base 11 is a component that holds the plurality of liquid ejecting heads 1. In the example shown in the figure, the number of liquid ejecting heads 1 relative to the unit base 11 is not particularly limited, and any number of liquid ejecting heads 1 may be used as long as there are two or more.

[0045] The unit base 11 is, for example, a plate-shaped component having a thickness direction along the Z axis. A recess 111 is provided on the unit base 11. The recess 111 is a depression provided on the unit base 11. A plurality of through holes 11H are provided on the bottom surface of the recess 111. The planar shape of each through hole 11H is, for example, a quadrangular shape. The through hole 11H is provided for each liquid ejecting head 1. A portion of the liquid ejecting head 1 is inserted into each through hole 11H. In addition, Figure 2 In order to show the through-hole 11H, illustration of a plurality of liquid ejecting heads 1 arranged in a part of the unit base 11 is omitted.

[0046] Furthermore, the unit base 11 is provided with four mounting holes 101 and two third positioning portions 102 for each through hole 11H. The four mounting holes 101 and the two third positioning portions 102 are provided outside the through hole 11H when viewed from above. The number and arrangement of the mounting holes 101 and the third positioning portions 102 are not limited to Figure 2 illustrative examples, but any number and configuration.

[0047] The mounting holes 101 are provided near four corners of the through hole 11H in plan view, for example. The mounting holes 101 are used to mount the liquid jet head 1 on the unit base 11. The mounting holes 101 penetrate the unit base 11 in the thickness direction, for example.

[0048] Each third positioning portion 102 is, for example, provided between two mounting holes 101 aligned along the X-axis to isolate them. Each third positioning portion 102 is used to position the unit base 11 during installation of the liquid jet head 1. Each third positioning portion 102 is, for example, a bottomed hole opening on the Z1-direction surface of the unit base 11. Each third positioning portion 102 can also be described as a recessed portion formed on the Z1-direction surface of the unit base 11.

[0049] Furthermore, the mounting holes 101 may not penetrate the unit base 11 in the thickness direction. Similarly, the third positioning portions 102 may penetrate the unit base 11 in the thickness direction. Furthermore, the shape of the unit base 11 is not limited to a plate shape, and may be a box shape, for example.

[0050] As described above, the liquid ejecting device 100 includes a plurality of liquid ejecting heads 1 and a unit base 11 to which the plurality of liquid ejecting heads 1 are fixed. The liquid ejecting device 100 includes the liquid ejecting heads 1 described below. Although described below, the plurality of liquid ejecting heads 1 are detachable from the unit base 11 and are configured to improve the alignment accuracy of the plurality of liquid ejecting heads 1. Therefore, according to the liquid ejecting device 100, even if any of the plurality of liquid ejecting heads 1 is replaced, a decrease in printing quality can be suppressed.

[0051] 1-3. Liquid ejecting head 1

[0052] Figure 3 for Figure 2 The illustrated liquid ejecting head 1 is a cross-sectional view viewed in the direction along the X-axis. Figure 4 For Figure 2 The liquid ejecting head 1 shown in FIG. 1 is a cross-sectional view observed along the Y-axis. Figure 4As shown, in this embodiment, the liquid jet head 1 has a substantially symmetrical structure with respect to the central imaginary plane A10 along the XZ plane. However, the liquid jet head 1 may not have a symmetrical structure with respect to the central imaginary plane A10.

[0053] like Figure 3 as well as Figure 4 As shown in either of the figures, the liquid ejecting head 1 includes a plurality of head modules 2 , a sealing member 4 , a plurality of covers 5 , a holder 6 , a plurality of wiring substrates 7 , and a relay substrate 70 .

[0054] Furthermore, in the liquid ejecting head 1, the cover 5, the bracket 6, and the plurality of head modules 2 are detachably mounted on each other. After the cover 5 is removed from the bracket 6, each head module 2 can be individually removed from the bracket 6. Since each head module 2 can be individually removed from the bracket 6, each head module 2 can be replaced.

[0055] 1-3A. Head module 2

[0056] exist Figure 3 In the example of FIG, the plurality of head modules 2 are six head modules 2. In addition, the number of the head modules 2 is not limited to six, and may be two or more and five or less, or seven or more.

[0057] In this embodiment, a plurality of head modules 2 are arranged along the X axis. Figure 4 As shown, each head module 2 is long and narrow along the Y axis. Each head module 2 ejects ink in the Z1 direction. The head module 2 includes a chip 20 and a flow channel opening forming member 25. The chip 20 is arranged in the Z1 direction relative to the flow channel opening forming member 25.

[0058] Figure 5 for Figure 3 The bottom view of the liquid ejecting head 1 is shown. Figure 5 As shown, each head module 2 has a plurality of nozzles N for ejecting ink. The plurality of nozzles N are arranged along the Y-axis. The plurality of nozzles N are divided into a nozzle column La and a nozzle column Lb arranged at intervals along the X-axis. The nozzle column La and the nozzle column Lb are respectively a collection of a plurality of nozzles N arranged in a straight line along the Y-axis. In addition, the surface of the head module 2 on which the openings of the plurality of nozzles N are formed is referred to as a nozzle surface SN. The nozzle surface SN is the surface of the chip 20 of the head module 2 facing the Z1 direction. In addition, for example, the plurality of nozzles N may also be arranged in a direction intersecting the X-axis and the Y-axis when viewed along the Z1 direction.

[0059] 1-3Aa. Chip 20

[0060] Figure 6 for Figure 3The figure shows a cross-sectional view of the chip 20 included in the head module 2. The chip 20 has a structure in which the elements associated with each nozzle N in nozzle row La and the elements associated with each nozzle N in nozzle row Lb are arranged in a roughly plane-symmetrical manner. The following description focuses on the elements corresponding to nozzle row La, while the description of the elements corresponding to nozzle row Lb is omitted as appropriate. In the following text, when nozzle row La and nozzle row Lb are not distinguished, they are referred to as nozzle row L.

[0061] like Figure 6 As shown, the chip 20 included in each head module 2 includes, for example, a communication plate 202 , a pressure chamber substrate 203 , a vibration plate 204 , a nozzle plate 201 , a cover 206 , a plurality of driving elements E, and a sealing substrate 205 .

[0062] The connecting plate 202, pressure chamber substrate 203, vibration plate 204, nozzle plate 201, and cover 206 are each a narrow, long plate-shaped member extending along the Y axis. The pressure chamber substrate 203 is provided on the surface of the connecting plate 202 in the Z2 direction. The nozzle plate 201 and cover 206 are provided on the surface of the connecting plate 202 in the Z1 direction. These components are fixed to each other using, for example, an adhesive.

[0063] The nozzle plate 201 is a plate-shaped component with multiple nozzles N formed thereon. The nozzle plate 201 is the component of the head module 2 located closest to the Z1 direction. The surface of the nozzle plate 201 facing the Z1 direction is the nozzle surface SN. Each of the multiple nozzles N is a circular through-hole that ejects ink. The nozzle plate 201 is manufactured by processing a single crystal silicon (Si) substrate using semiconductor manufacturing techniques such as photolithography and etching.

[0064] A plurality of choke portions R1, a plurality of connecting flow channels R2, a connecting space Ra and a common flow channel Rb are formed on the connecting plate 202. The choke portion R1 and the connecting flow channel R2 are respectively through-holes extending in the Z1 direction and formed for each nozzle N. The connecting flow channel R2 overlaps with the nozzle N when viewed from a plane. The connecting space Ra is an opening formed as a long strip along the Y axis. The connecting space Ra extends along the Y axis. The common flow channel Rb is connected to the connecting space Ra and overlaps with the connecting space Ra when viewed from a plane. The common flow channel Rb extends along the Y axis. The common flow channel Rb is connected to the plurality of choke portions R1. In addition, the connecting space Ra is connected to the space Rc of the flow channel opening forming component 25.

[0065] The communicating space Ra, the common flow path Rb, and the space Rc form a common space R shared by the multiple nozzles N. The common space R functions as an ink reservoir. Ink stored in the common space R branches into each choke portion R1 and is supplied and filled in parallel to the multiple pressure chambers C.

[0066] Multiple pressure chambers C are formed on the pressure chamber substrate 203. The pressure chamber C is a space located between the connecting plate 202 and the vibration plate 204 and formed by the wall surface of the pressure chamber substrate 203. A pressure chamber C is formed for each nozzle N. The pressure chamber C is a long, strip-shaped space extending in the X1 direction. The multiple pressure chambers C are arranged along the Y axis.

[0067] The communication plate 202 and the pressure chamber substrate 203 are manufactured by processing a semiconductor substrate such as a silicon single crystal substrate, for example.

[0068] At the upper part of the pressure chamber C, there is provided a vibration plate 204 that can deform elastically. The vibration plate 204 is stacked on the upper pressure chamber substrate 203 and is in contact with the surface of the pressure chamber substrate 203 opposite to the connecting plate 202. The vibration plate 204 is a plate-like component in a narrow rectangular shape along the Y-axis when viewed in a plane. The pressure chamber C is connected to the connecting flow channel R2 and the choke portion R1. Therefore, the pressure chamber C is connected to the nozzle N via the connecting flow channel R2, and is connected to the connecting space Ra via the choke portion R1. In addition, a separate flow channel for each nozzle N is formed by the nozzle N, the connecting flow channel R2, the pressure chamber C, and the choke portion R1. In addition, although in Figure 6 Although the pressure chamber substrate 203 and the vibration plate 204 are illustrated as separate substrates for convenience of explanation, they are actually stacked on one silicon substrate.

[0069] A driving element E is formed on the surface of the vibration plate 204 opposite the pressure chambers C, corresponding to each pressure chamber C. The driving element E is a piezoelectric element that is elongated and extends along the X-axis when viewed in plan. The driving element E comprises, for example, a pair of electrodes and a piezoelectric body sandwiched between the electrodes. Alternatively, the driving element E may be a thermoelectric conversion element that generates thermal energy.

[0070] The sealing substrate 205 is a structure that protects the multiple driving elements E. The sealing substrate 205 is fixed to the surface of the vibration plate 204 using, for example, an adhesive. The multiple driving elements E are housed within a recessed portion formed on the surface of the sealing substrate 205 that faces the vibration plate 204. Furthermore, the sealing substrate 205 is provided with through-holes 20H for inserting the wiring substrate 7 (described later).

[0071] The cover 206 is a relatively thin metal plate that forms the wall surface of the common flow channel Rb. The cover 206 has a thickness approximately equal to that of the nozzle plate 201. The planar shape of the cover 206 is, for example, a frame that surrounds the nozzle plate 201. A mold 207 made of resin is provided between the cover 206 and the nozzle plate 201. The surface of the cover 206 facing the Z1 direction constitutes a portion of the nozzle surface SN.

[0072] In the chip 20, when the driving element E contracts due to energization, the vibration plate 204 is bent and flexed in the direction of reducing the volume of the pressure chamber C, causing the pressure in the pressure chamber C to rise, so that the ink droplets are ejected from the nozzle N. At this time, the pressure also propagates from the pressure chamber C toward the choke portion R1, so that the ink also flows through the choke portion R1 to the common flow channel Rb. After the ink is ejected, the driving element E returns to its original position. At this time, the ink in the common flow channel Rb also vibrates from the nozzle N. Moreover, when the curved liquid surface of the nozzle N is restored, the ink is simultaneously supplied from the choke portion R1. Through the above series of actions, the ink is ejected from the nozzle N.

[0073] Although the chip 20 of this embodiment has Figure 3 Although all the elements shown are included, the components of the chip 20 do not have to include all of the elements, and may further include additional elements.

[0074] The chip 20 is, for example, a monolithic circuit structure and is a thinner component than the flow channel opening forming component 25, for example, a component having a thickness of less than 3000 μm. Alternatively, the chip 20 may be a component having a thickness of less than 1500 μm or less than 1000 μm. Furthermore, the thickness of the chip 20 may be less than 1 / 5 of the length of the short side when viewed along the thickness direction of the chip 20, i.e., the Z-axis. Furthermore, it is sufficient to include at least one of the nozzle plate 201, the pressure chamber substrate 203, the connecting plate 202, or the drive element E and the closed substrate 205. The chip 20 preferably includes at least the nozzle plate 201, more preferably also includes the pressure chamber substrate 203, and particularly preferably also includes the connecting plate 202. Alternatively, at least one of the nozzle plate 201, the pressure chamber substrate 203, the connecting plate 202, or the pressure chamber substrate 203 with the drive element E stacked thereon and the closed substrate 205 may be considered as the chip 20. In addition, the chip 20 can be not only a stack of silicon substrates manufactured using a micro-electro-mechanical system (MEMS), but also a stack of thin plates such as ceramic sheets or metals, or a stack of thin plate-like components of the materials described above.

[0075] 1-3Ab. Flow channel opening forming member 25

[0076] like Figure 4 as well as Figure 6As shown, a flow channel opening forming member 25 is disposed in the Z2 direction of the chip 20. The flow channel opening forming member 25 and the chip 20 are fixed to each other, for example, using an adhesive or the like. The flow channel opening forming member 25 and the chip 20 are positioned relative to each other with high precision in advance. Furthermore, the flow channel opening forming member 25 has, for example, a flow channel for supplying ink to the chip 20.

[0077] In addition, the flow channel opening forming part 25 is preferably a part with a thickness of 3000 μm or more, more preferably a part with a thickness of 5000 μm or more, and further preferably a part with a thickness of 8000 μm or more. In addition, the flow channel opening forming part 25 can be formed by one part or a stack of multiple parts. In addition, although the flow channel opening forming part 25 is made of metal, it can also be a thermosetting resin. By making the flow channel opening forming part 25 consist of a thermosetting resin, low cost can be achieved. In the case where the flow channel opening forming part 25 is made of metal, it is only necessary to use the same metal material as the bracket 6 described later. However, by making the flow channel opening forming part 25 be formed of metal, it is easy to reuse the flow channel opening forming part 25 when the head module 2 is replaced. In addition, compared with the case where the flow channel opening forming part 25 is resin, by making it metal, high-precision positioning of the flow channel opening forming part 25 relative to the bracket 6 can be achieved.

[0078] like Figure 4 As shown, the length of the flow channel opening forming member 25 along the Z axis, that is, its thickness, is greater than the thickness D2 of the chip 20. The thickness of the flow channel opening forming member 25 here refers to the thickness at the position overlapping with the sealing area 4S described later when viewed along the Z1 direction. In other words, the chip 20 is thinner than the flow channel opening forming member 25. Furthermore, the flow channel opening forming member 25 includes a surface 251 facing the Z1 direction and a surface 252 facing the Z2 direction.

[0079] Figure 7 for Figure 4 The top view of the flow channel opening forming part 25 of the head module 2 shown in FIG. Figure 7 As shown, the planar shape of the flow channel opening forming member 25 is larger than the planar shape of the chip 20. That is, when viewed along the Z1 direction, the chip 20 has a smaller outer shape than the flow channel opening forming member 25. The flow channel opening forming member 25 is arranged so as to overlap with the chip 20 and cover the chip 20 when viewed along the Z1 direction.

[0080] like Figure 4 as well as Figure 7As shown, the flow channel opening forming member 25 has a flange portion 250 for fixing to the cover 5 described later. The planar shape of the flange portion 250 is a quadrangular frame surrounding the opening 5H of the cover 5 described later. Figure 4 As shown, the surface of the flange 250 facing the Z1 direction serves as a supported surface 2511, supported by the cover 5 (described later). Since the flange 250 has a planar shape that is a quadrangular frame surrounding the opening 5H, the supported surface 2511 also has a planar shape that is a quadrangular frame surrounding the opening 5H. The supported surface 2511 is located closer to the chip 20 in the Z2 direction. Therefore, the supported surface 2511 is located in the Z2 direction relative to the nozzle plate 201.

[0081] In addition, if Figure 7 As shown in FIG, a through hole 25H is provided on the flow path opening forming member 25. A wiring substrate 7 described later is inserted through the through hole 25H. The through hole 25H is provided at the center of the flow path opening forming member 25 when viewed from above. Figure 6 , the through hole 25H overlaps with the through hole 20H of the sealing substrate 205 when viewed in plan.

[0082] like Figure 4 as well as Figure 6 As shown in FIG. 2 , a flow channel 25R is formed inside the flow channel opening forming member 25. The flow channel 25R is provided to supply ink to the chip 20. Figure 6 As shown in FIG. 1 , a space Rc is provided on the chip 20 side, that is, on the downstream side, of the flow channel 25R. The flow channel 25R communicates with the space Rc.

[0083] like Figure 4 As shown, a plurality of flow channel openings 251H are provided on the opposite side of the chip 20, i.e., on the upstream side, of the flow channel 25R of the flow channel opening forming component 25. Each flow channel opening 251H is an opening end of the flow channel 25R in the Z2 direction. The flow channel opening 251H is an opening for connecting the flow channel 25R of the flow channel opening forming component 25 of the head module 2 and the flow channel 6R of the bracket 6 described later. Figure 4 as well as Figure 7 As shown, a plurality of flow channel openings 251H are provided on the flange portion 250 of the flow channel opening forming member 25. The flow channel openings 251H are arranged outside the chip 20 when viewed in the Z1 direction. In this embodiment, two flow channel openings 251H are provided for each nozzle row L.

[0084] like Figure 4 as well as Figure 7As shown, each flow channel opening forming member 25 is provided with two fixing holes 215 and two first positioning portions 216. The head module 2, including the flow channel opening forming member 25, is freely attachable to and detachable from the bracket 6. The first positioning portions 216 are used to position the head module 2 relative to the bracket 6, etc. The fixing holes 215 are used to secure the head module 2 relative to the bracket 6.

[0085] Each first positioning portion 216 is provided on the surface 252 of the flow channel opening forming component 25 facing the Z2 direction. This surface 252 is also the surface of the head module 2 facing the Z2 direction. In this embodiment, each first positioning portion 216 is a protrusion that protrudes in the Z2 direction from the surface 252 of the flow channel opening forming component 25 facing the Z2 direction. The two first positioning portions 216 are provided on both sides of the opening 5H of the cover 5 in the longitudinal direction of the flow channel opening forming component 25. One of the two first positioning portions 216 is located in the Y1 direction relative to the opening 5H, and the other is located in the Y2 direction relative to the opening 5H.

[0086] Each fixing hole 215 is provided on the surface 252 of the flow channel opening forming component 25 facing the Z2 direction. Each fixing hole 215 is a bottomed hole that opens on the surface 252 of the flow channel opening forming component 25 facing the Z2 direction. Each fixing hole 215 is a recessed portion provided on the surface 252 of the flow channel opening forming component 25 facing the Z2 direction, and can also be understood as a depression formed on the surface 252. The two fixing holes 215 are provided on both sides of the through hole 25H and on both sides of the opening 5H of the cover 5 in the longitudinal direction of the flow channel opening forming component 25. One of the two fixing holes 215 is located in the Y1 direction relative to the opening 5H, and the other is located in the Y2 direction relative to the opening 5H.

[0087] Each fixing hole 215 located in the Y1 direction relative to the opening 5H is closer to the opening 5H than the first positioning portion 216 located in the Y1 direction relative to the opening 5H. Similarly, each fixing hole 215 located in the Y2 direction relative to the opening 5H is closer to the opening 5H than the first positioning portion 216 located in the Y2 direction relative to the opening 5H. The first positioning portion 216 and the fixing hole 215 do not overlap with the opening 5H when viewed along the Z1 direction. Furthermore, the two flow channel openings 251H, the fixing holes 215, and the first positioning portion 216 are located farther away from the opening 5H in this order. Of these components, the two flow channel openings 251H are closest to the opening 5H.

[0088] Furthermore, although the shortest distance between the fixing hole 215 and the opening 5H is shorter than the shortest distance between the first positioning portion 216 and the opening 5H, it may be longer than the shortest distance between the first positioning portion 216 and the opening 5H. Furthermore, although the first positioning portion 216, the fixing hole 215, and the opening 5H are arranged along the longitudinal direction of the cover 5, they do not necessarily need to be arranged along the longitudinal direction of the cover 5. For example, the first positioning portion 216 may be provided on both sides of the opening 5H along the X-axis.

[0089] 1-3B. Bracket 6

[0090] like Figure 3 as well as Figure 4 As shown, a common flow path is provided for holding and accommodating the plurality of head modules 2 and supplying and distributing ink to the plurality of head modules 2. The holder 6 is common to the plurality of head modules 2.

[0091] like Figure 4 As shown, the bracket 6 of this embodiment has a component that forms a flow channel 6R and a plurality of second positioning portions 653. The flow channel 6R supplies ink to each head module 2 and distributes the ink to each head module 2. The bracket 6 has a supply flow channel component having a flow channel 6R as a common flow channel. The flow channel 6R is a common flow channel common to a plurality of head modules 2, and has a common portion 6RA extending along the X-axis, and a plurality of branch portions 6RB branching from the common portion 6RA and extending in the Z1 direction. Although not shown in the figure, a flow channel joint for connecting to the supply flow channel outside the liquid injection head 1 is provided on the bracket 6 in order to communicate with the liquid storage portion 9. The unillustrated flow channel joint is exposed to the outside of the liquid injection head 1, for example, via an unillustrated opening formed on the bracket 6.

[0092] The holder 6 may include a plurality of flow channels 6R communicating with the plurality of head modules 2. In other words, the flow channels 6R may have a plurality of flow channels 6R communicating with the plurality of head modules 2, instead of having a common portion 6RA communicating with the plurality of head modules 2.

[0093] A flow channel opening 650H is provided on the head module 2 side, i.e., on the downstream side, of the flow channel 6R. The flow channel opening 650H is the open end of the flow channel 6R in the Z1 direction. The flow channel opening 650H is provided to correspond to the flow channel opening 251H of the head module 2. The flow channel opening 650H is used to connect the flow channel 25R of the head module 2 and the flow channel 6R of the bracket 6.

[0094] Figure 8 To express Figure 4 The bottom view of the bracket 6 and the relay substrate 70 is shown. Figure 3 、 4As shown in FIG8 , the bracket 6 is box-shaped and has a recessed portion 610 opening in the Z1 direction. Multiple head modules 2 are arranged within the storage space within the recessed portion 610 of the bracket 6. Furthermore, it can be understood that the bracket 6 and the cover 5 (described later) form a storage space for multiple head modules 2. The bracket 6 is made of a metal such as aluminum, titanium, stainless steel, 42 alloy, or Invar.

[0095] like Figure 4 as well as Figure 8 As shown, the recess 610 includes a first recess 611 and a second recess 612 . like Figure 4 As shown, a second recess 612 is formed on the bottom surface of the first recess 611. The first recess 611 is located closer to the Z1 direction than the center of the bracket 6 on the Z axis. The second recess 612 is located closer to the Z2 direction than the center of the bracket 6 on the Z axis. The opening area of the second recess 612 is smaller than that of the first recess 611. Therefore, the recess 610 has a stepped surface.

[0096] The relay substrate 70 is bonded, for example, by an adhesive, to the bottom surface of the recess 610, specifically the bottom surface of the second recess 612. Although not shown in detail, the bracket 6 has an opening for inserting wiring components external to the liquid ejecting head 1 for electrically connecting the relay substrate 70 and the control unit 91.

[0097] like Figure 3 As shown, the bracket 6 includes a flat plate portion 61, a side wall portion 62, and two flange portions 64. The flat plate portion 61, the side wall portion 62, and the two flange portions 64 are formed in an integral manner.

[0098] Figure 9 for Figure 3 A top view of the support 6 is shown. Figure 10 for Figure 3 The plan view of the lower part of the bracket 6 shown. Figure 3 、 4 As shown in FIG. 9 , the flat plate portion 61 is a flat plate-shaped portion extending along the XY plane and located in the Z2 direction of the flow channel 6R. The side wall portion 62 extends from the outer edge of the flat plate portion 61 in the Z1 direction. The side wall portion 62 has a square frame-like plan view. The stepped surface described above is provided on the inner surface of the side wall portion 62.

[0099] Furthermore, a first recess 611 is provided at a lower portion of the bracket 6 , and a second recess 612 is provided at an upper portion of the bracket 6 .

[0100] In addition, if Figure 4As shown, the bracket 6 has a plurality of fixing holes 651H, a plurality of fixing holes 652H, and a plurality of second positioning portions 653. Each fixing hole 651H is used to fix the bracket 6 to the head module 2. Each fixing hole 652H is used to fix the bracket 6 to the cover 5. Each second positioning portion 653 is used to position the head module 2 relative to the bracket 6.

[0101] Each fixing hole 651H is a hole that passes through the bracket 6 in the Z1 direction. Two fixing holes 651H are provided for each head module 2. Each fixing hole 651H is provided in the Y1 direction or the Y2 direction relative to the second recess 612 when viewed along the Z1 direction. The two fixing holes 651H are provided corresponding to the two fixing holes 215 described above, and overlap with the two fixing holes 215 when viewed along the Z1 direction. Each fixing hole 651H does not overlap with the chip 20 when viewed along the Z1 direction, but overlaps with the flow channel opening forming component 25. The open end in the Z1 direction of each fixing hole 651H opens on the bottom surface of the first recess 611 when viewed along the Z1 direction.

[0102] Each fixing hole 652H is a hole that passes through the bracket 6 in the Z1 direction. Figure 10 As shown, the plurality of fixing holes 652H are, for example, four fixing holes 652H, and each fixing hole 652H is provided at the four corners of the quadrangular bracket 6 when viewed along the Z1 direction. Figure 4 As shown, each fixing hole 652H is provided corresponding to the fixing hole 503 of the cover 5. Each fixing hole 652H overlaps with the fixing hole 503 when viewed along the Z1 direction. Each fixing hole 652H does not overlap with the recess 610 when viewed along the Z1 direction.

[0103] Each second positioning portion 653 is provided on the surface 605 of the bracket 6 facing the Z1 direction. Two second positioning portions 653 are provided for each head module 2. In the present embodiment, each second positioning portion 653 is a hole with a bottom that opens on the surface 605 of the bracket 6 facing the Z1 direction, specifically, on the bottom surface of the first recess 611. Each second positioning portion 653 is also a recess formed on the surface 605 of the bracket 6 facing the Z1 direction, specifically, on the bottom surface of the first recess 611. Each second positioning portion 653 is provided in the Y1 direction or the Y2 direction of the second recess 612 when viewed along the Z1 direction. In addition, the two second positioning portions 653 are provided corresponding to the two first positioning portions 216 described above, and overlap with the two first positioning portions 216 when viewed along the Z1 direction. Therefore, the plurality of second positioning portions 653 are provided in a one-to-one correspondence with the plurality of first positioning portions 216.

[0104] Each second positioning portion 653 is pressed into the first positioning portion 216 described above, thereby positioning the cover 5 relative to the holder 6. The first positioning portion 216 and the second positioning portion 653 are provided for each head module 2.

[0105] When viewed along the Z1 direction, among the fixing hole 651H, the second positioning portion 653, and the fixing hole 652H, the fixing hole 651H is closest to the opening 5H, and the fixing hole 652H is furthest away from the opening 5H. Furthermore, the distances between the fixing hole 651H, the second positioning portion 653, and the fixing hole 652H and the opening 5H may be the same or different.

[0106] The first positioning portions 216 of the flow path opening forming member 25 are pressed into the second positioning portions 653 to position the head module 2 relative to the holder 6. The first positioning portions 216 and the second positioning portions 653 are provided for each head module 2.

[0107] The provision of the first positioning portion 216 and the second positioning portion 653 described above facilitates positioning of the head module 2 when mounted on the bracket 6. Furthermore, by providing the first positioning portion 216 and the second positioning portion 653 for each head module 2, multiple head modules 2 can be aligned with each other with high precision. Therefore, when replacing only a few of the multiple head modules 2, it is not necessary to re-align all the head modules 2.

[0108] Furthermore, the plurality of head modules 2 can be aligned with each other with high precision by a simple method of pressing the first positioning portion 216 into the second positioning portion 653. Therefore, a desired head module 2 among the plurality of head modules 2 can be easily replaced. Therefore, it is relatively easy to regenerate the liquid ejecting head 1 by replacing the head module 2.

[0109] In addition, press-in refers to a tight fit or an intermediate fit. The state in which the first positioning portion 216 and the second positioning portion 653 are in contact at least at two points at the time when the first positioning portion 216 is inserted into the second positioning portion 653 is called the press-in state. In addition, before press-in, when viewed in the direction along the Z axis, the length of the longest line segment connecting two points on the outer periphery of the first positioning portion 216 serving as the positioning pin is greater than the diameter of the largest circle inscribed in the second positioning portion 653 serving as the positioning hole. In addition, in the press-in state, the force generated by the press-in allows the head module 2 to be fitted relative to the bracket 6 to a degree that prevents it from falling due to its own weight.

[0110] Furthermore, as previously described, the flow channel opening 650H corresponds to the flow channel opening 251H. Specifically, the flow channel opening 650H and the flow channel opening 251H overlap in the direction in which one of the first positioning portion 216 and the second positioning portion 653 is pressed into the other, that is, when viewed along the Z-axis. In other words, the direction in which the flow channel opening 650H overlaps with the flow channel opening 251H is the same as the direction in which the second positioning portion 653 is pressed into the first positioning portion 216. Therefore, when the head module 2 is mounted on the bracket 6, the flow channel connection between the flow channel 6R and the flow channel 25R can be easily and accurately established.

[0111] Furthermore, a plurality of second positioning portions 653 are arranged on the surface 605 of the bracket 6 facing the Z1 direction, specifically, on the bottom surface of the first recess 611. Furthermore, the first positioning portion 216 is arranged on the surface 252 of the flow path opening forming member 25 facing the Z2 direction, which is opposite to the Z1 direction.

[0112] By configuring the first positioning portion 216 and the second positioning portion 653 in this manner, it is possible to easily remove and install only the head module 2 to be replaced from below the bracket 6. Therefore, when the head module 2 to be replaced is replaced with a subunit 15 including a non-faulty head module 2 and then reinstalled on the bracket 6, only the flow path of the replaced head module 2 needs to be connected to the bracket 6. Therefore, it is unnecessary to connect the flow paths of head modules 2 other than the replacement head module 2 to the bracket 6. As a result, the removal and installation work during repair of the liquid ejecting head 1 can be simplified.

[0113] In addition, as mentioned above, the bracket 6 can be understood as having a common flow channel component having one or more flow channels 6R connected to multiple head modules 2. The bracket 6 including the common flow channel component is arranged in the Z2 direction relative to the multiple head modules 2, and overlaps with the multiple head modules 2 when viewed along the Z1 direction. In addition, the first positioning portion 216 is provided on the surface 252 of the flow channel opening forming component 25 facing the Z2 direction. Therefore, it is easier to disassemble and assemble the head module 2 of the replacement object from the bottom. Therefore, there is no need to release the flow channel connection between the head module 2 other than the replacement object and the bracket 6, which simplifies the disassembly and assembly operation.

[0114] Furthermore, as previously described, the first positioning portion 216 is disposed on the surface of the flow channel opening forming member 25 opposite the surface on which the chip 20 is disposed, that is, on the surface 252 in the Z2 direction. Furthermore, the first positioning portion 216 does not overlap with the chip 20 when viewed in the Z1 direction. This configuration of the first positioning portion 216 prevents the load generated by the press-fitting of the second positioning portion 653 of the bracket 6 into the first positioning portion 216 from acting on the chip 20.

[0115] In addition, as mentioned above, the bracket 6 has a plurality of fourth positioning portions 642. The plurality of fourth positioning portions 642 are provided on the flange portion 64. Figure 4 As shown, the fourth positioning portion 642 is a protrusion protruding from the surface of the flange portion 64 facing the Z2 direction and protruding toward the Z2 direction. Figure 2 The plurality of third positioning portions 102 included in the illustrated unit base 11 are provided in a one-to-one correspondence.

[0116] The fourth positioning portion 642 is pressed against one of the third positioning portions 102 provided on the unit base 11, thereby positioning the liquid ejecting head 1 relative to the unit base 11. Therefore, the alignment accuracy of the plurality of liquid ejecting heads 1 relative to the unit base 11 can be improved.

[0117] In addition, if Figure 9 As shown, mounting holes 64H are provided in the flange portion 64. The mounting holes 64H correspond to the mounting holes 101 of the unit base 11. Each mounting hole 64H is, for example, a bottomed hole that opens on the surface of the flange portion 64 in the Z2 direction, and is, for example, a screw hole for mounting the liquid jet head 1 to the unit base 11 using screws or the like. The flange portion 64 and the unit base 11 are fixed by inserting screws or the like (not shown) through the mounting holes 64H and the mounting holes 101 in this order and threading them together. As a result, the liquid jet head 1 is fixed to the unit base 11.

[0118] 1-3C. Sealing component 4

[0119] like Figure 3 as well as Figure 4 As shown, the sealing member 4 is provided between each head module 2 and the bracket 6 in the Z1 direction. The sealing member 4 is provided for each head module 2. The sealing member 4 has elasticity. The sealing member 4 is made of an elastic material such as an elastomer. In this embodiment, the length of the sealing member 4 along the Z axis, that is, the thickness, is constant. The thickness of the sealing member 4 is thinner than the thickness of the flow channel opening forming member 25 and the bracket 6. The sealing member 4 is flattened by the head module 2 and the bracket 6.

[0120] Figure 11 for Figure 4 The top view of the sealing member 4 is shown. Figure 11In the example shown, two sealing components 4 are provided for each head module 2. The two sealing components 4 are provided at both ends in the longitudinal direction of one head module 2. Each sealing component 4 is quadrangular when viewed along the Z1 direction. Each sealing component 4 overlaps with the flange portion 250 of the flow channel opening forming component 25 of the head module 2 when viewed along the Z1 direction. On the other hand, in this embodiment, the sealing component 4 is provided at a position different from the chip 20 when viewed along the Z1 direction. That is, the sealing component 4 does not overlap with the chip 20 when viewed along the Z1 direction.

[0121] like Figure 4 as well as Figure 11 As shown, each sealing member 4 has two communication ports 4H. Figure 4 As shown, each communication port 4H is provided corresponding to one flow channel opening 251H of the flow channel opening forming member 25 and one flow channel opening 650H of the bracket 6. Figure 11 As shown, the communication port 4H overlaps with the flow channel opening 650H and the flow channel opening 251H when viewed along the Z1 direction. Figure 4 As shown, the communication port 4H is connected to the flow channel 25R via the flow channel opening 251H. The communication port 4H is connected to the flow channel 6R via the flow channel opening 650H. Therefore, the flow channels 25R and 6R are connected via the communication port 4H. Specifically, the sealing member 4 is compressed between the flow channel opening forming member 25 and the bracket 6, thereby connecting the flow channels 25R and 6R via the communication port 4H.

[0122] The sealing member 4 is a member that fluid-tightly connects the flow channel opening 251H of the head module 2 and the flow channel opening 650H of the holder 6. Ink flowing through the flow channel 6R of the holder 6 flows through the communication port 4H to the flow channel 25R of the flow channel opening forming member 25, and is then supplied to the individual flow channels of the chip 20 through the common space R.

[0123] like Figure 11As shown, the sealing component 4 has a sealing area 4S. In the present embodiment, the entire area of the sealing component 4 corresponds to the sealing area 4S. The sealing area 4S is in contact with both the flow channel opening forming component 25 and the bracket 6, and is an area of the sealing component 4 that is clamped by the flow channel opening forming component 25 and the bracket 6. The sealing area 4S is an area that receives load from the flow channel opening forming component 25 and the bracket 6 and is squeezed in order to connect the flow channel opening 251H and the flow channel opening 650H to each other in a liquid-tight manner. In other words, even if it is an area of the sealing component 4 that is clamped between the flow channel opening forming component 25 and the bracket 6, the part that does not receive load from the two components and is squeezed and thus does not substantially contribute to connecting the flow channel opening 251H and the flow channel opening 610H to each other in a liquid-tight manner is not included in the sealing area 4S.

[0124] like Figure 11 As shown, since the sealing member 4 is positioned at a different position from the chip 20 when viewed along the Z1 direction, the sealing region 4S is also positioned at a different position from the chip 20 when viewed along the Z1 direction. That is, the sealing region 4S does not overlap with the chip 20 when viewed along the Z1 direction. By preventing the sealing region 4S from overlapping with the chip 20 when viewed along the Z1 direction, the reaction force of the sealing member 4 is less likely to act on the chip 20 than when the sealing region 4S overlaps with the chip 20. Consequently, the reliability of the head module 2 can be improved.

[0125] As described above, the flow channel 25R and the flow channel 6R are connected via the communication port 4H by squeezing the sealing member 4 between the flow channel opening forming member 25 and the bracket 6. There is a possibility that the reaction force of the squeezing sealing member 4 will cause stress to act on the chip 20, causing the chip 20 to warp. In this way, when the reaction force of the sealing member 4 acts on the chip 20, there is a possibility that the reliability of the head module 2 will be reduced, for example, the nozzle plate 201 may be deformed, causing the position of the nozzle N to deviate, the pressure chamber substrate 203 or the communication plate 202 may be deformed, causing the ejection characteristics to change, or when the components constituting the chip 20 include a silicon substrate or a ceramic sheet, the component may be cracked.

[0126] In this embodiment, the sealing region 4S of the sealing member 4 does not overlap with the chip 20 when viewed along the Z1 direction. Therefore, it is possible to suppress a reduction in sealing performance caused by the sealing member 4 while also minimizing the effect of the reaction force of the sealing member 4 on the chip 20. Consequently, the reliability of the head module 2 can be improved.

[0127] Furthermore, the sealing members 4 corresponding to each of the multiple head modules 2 included in the liquid ejecting head 1 do not overlap with the chip 20 when viewed along the Z1 direction. Therefore, in the multiple head modules 2, it is possible to suppress a decrease in sealing performance caused by the sealing members 4 while also minimizing the effect of the reaction force of the sealing members 4 on the chip 20. Consequently, the reliability of the liquid ejecting head 1 can be improved.

[0128] In addition, if Figure 11 As shown, the communication port 4H, the flow channel opening 251H, and the flow channel opening 650H do not overlap with the chip 20 when viewed along the Z1 direction. The communication port 4H, the flow channel opening 251H, and the flow channel opening 650H are each arranged on the outside of the chip 20 when viewed along the Z1 direction. Specifically, the communication port 4H, the flow channel opening 251H, and the flow channel opening 650H are arranged on both sides of the longitudinal direction of the chip 20 when viewed along the Z1 direction. Therefore, as described above, the sealing area 4S of the sealing component 4 that seals the flow channels 25R and 6R in a liquid-tight manner can be arranged on the outside of the chip 20. Therefore, as described above, the reaction force of the sealing component 4 can be suppressed from affecting the chip 20.

[0129] Furthermore, the seal region 4S is positioned in the Y1 or Y2 direction, which is the longitudinal direction of the head module 2, relative to the chip 20 when viewed along the Z1 direction. By positioning the seal region 4S in this longitudinal direction of the chip 20, it is possible to avoid positioning the seal region 4S between adjacent chips 20. This prevents the seal region 4S from increasing the distance between adjacent chips 20, thus minimizing the impact on printing quality.

[0130] Furthermore, the sealing region 4S may be provided in the direction in which the plurality of head modules 2 are arranged, i.e., in the short side direction of the head module 2, relative to the chip 20. The sealing member 4 may also be provided in the direction in which the plurality of head modules 2 are arranged, i.e., in the short side direction of the head module 2, relative to the chip 20.

[0131] 1-3D.Hood 5

[0132] Figure 3 as well as Figure 4 The cover 5 shown is a supporting component for supporting multiple head modules 2. The cover 5 is common to multiple head modules 2, but can also be set separately for each head module 2. The cover 5 is a long flat plate component along the Y axis with the thickness direction along the Z axis. The cover 5 is arranged in the Z1 direction relative to the multiple flow channel opening forming components 25. The cover 5 is a component that clamps the sealing component 4 and the flow channel opening forming component 25 between the bracket 6. As shown in FIG. Figure 4As shown, the cover 5 includes a surface 511 facing the Z1 direction and a surface 512 facing the Z2 direction. The cover 5 is a member that does not have a flow path for ink to flow.

[0133] Each cover 5 is detachably fixed to a bracket 6 (described later). Specifically, the cover 5 is not attached using adhesive or the like. Furthermore, the cover 5 is detachably fixed to the bracket 6. Therefore, each cover 5 can be removed from the bracket 6. The cover 5 can also be understood as an auxiliary bracket for the bracket 6.

[0134] In addition, in this embodiment, one cover 5 detachably holds the plurality of head modules 2. Therefore, each head module 2 can be removed from the cover 5.

[0135] In addition, the cover 5 and the plurality of head modules 2 are preferably fixed with an adhesive, but each head module 2 may be configured so that the adhesive can be decomposed and removed from the cover 5 .

[0136] The cover 5 is made of metal, for example. The cover 5 is made of metal such as aluminum or stainless steel, for example. The cover 5 has rigidity for supporting the plurality of head modules 2 .

[0137] like Figure 4 as well as Figure 5 As shown, the cover 5 is provided with a plurality of openings 5H. Each opening 5H is a hole that penetrates the cover 5 in the thickness direction. Each opening 5H is provided to expose a portion of the head module 2 to the outside. Specifically, the chip 20 is exposed through the opening 5H. Therefore, the plurality of nozzles N are exposed through the opening 5H.

[0138] Figure 12 for Figure 4 The top view of the cover 5 is shown. Figure 4 as well as Figure 12 As shown, the cover 5 includes a plurality of support areas 5S. The support area 5S is a portion of the surface 512 of the cover 5 facing the Z2 direction. Figure 12 In order to facilitate understanding, the support area 5S is marked with a mesh shadow. Figure 12 In the example shown in FIG, the support region 5S has a quadrangular frame shape when viewed in the Z1 direction.

[0139] like Figure 4 As shown, the support area 5S is in contact with the flow channel opening forming member 25 and is an area that directly supports the flow channel opening forming member 25. The support area 5S is in contact with the supported surface 2511 of the flow channel opening forming member 25. In addition, the support area 5S includes an area S50 that overlaps with the sealing area 4S when viewed along the Z1 direction. Figure 12 In FIG, points are marked for area S50.

[0140] By including the support region 5S in the region S50 that overlaps with the sealing region 4S when viewed in the Z1 direction, the cover 5 vertically receives the reaction force of the sealing member 4. Consequently, the cover 5 can firmly support the sealing region 4S of the sealing member 4 between the cover 5 and the bracket 6. Consequently, the reaction force of the sealing member 4 can be particularly effectively buffered.

[0141] Furthermore, a portion of the surface 251 of the flow channel opening forming member 25 described above, which faces the Z1 direction, includes a supported surface 2511. When viewed along the Z1 direction, the supported surface 2511 surrounds the opening 5H of the cover 5 and is supported in contact with the cover 5. Specifically, the supported surface 2511 contacts the support area 5S of the cover 5, thereby retaining the head module 2 by the cover 5. By supporting the flow channel opening forming member 25 by the cover 5 in this manner, the load on the sealing member 4 can be dispersed. Consequently, the flow channel opening forming member 25 is less susceptible to damage.

[0142] Furthermore, the contact between the supported surface 2511 and the supporting area 5S includes both direct contact and connection via an adhesive, an elastic bushing, and the like. Therefore, the flow channel opening forming member 25 can be in direct contact with the cover 5 or indirectly via an adhesive, a bushing, or other components. Furthermore, the flange 250 need not be a square frame when viewed in plan. For example, the flange 250 may be rectangular, positioned in the Y1 and Y2 directions relative to the opening 5H when viewed in plan.

[0143] Furthermore, the thickness of the flange portion 250, that is, its length along the Z1 direction, is preferably greater than the thickness of the portion disposed within the opening 5H of the flow path opening forming member 25. Furthermore, the thickness of the flange portion 250 is preferably at least half the maximum thickness of the flow path opening forming member 25. This thickness relationship minimizes any reduction in the strength of the flange portion 250, making it easier to ensure strength when subjected to the reaction force of the sealing member 4.

[0144] Furthermore, the thickness D5 of the cover 5 in the Z1 direction is thicker than the thickness D2 of the chip 20 in the Z1 direction. The thickness D5 is thicker than the thickness D2. This reduces the possibility of deformation of the cover 5 due to the reaction force of the sealing member 4.

[0145] Furthermore, the thickness D5 of the cover 5 is preferably at least twice, and more preferably at least three times, the thickness D2 of the chip 20. This further reduces the possibility of deformation of the cover 5 due to the reaction force of the sealing member 4. Alternatively, the thickness D5 may be less than the thickness D2.

[0146] From a similar perspective, the thickness D5 of the cover 5 is preferably 1 mm or greater, more preferably 2 mm or greater. Furthermore, to further enhance the strength of the cover 5, the thickness D5 may be 3 mm or greater, 5 mm or greater, or 6 mm or greater. Furthermore, to increase the distance between the medium 90 and the nozzle surface SN, i.e., the paper gap, the thickness D5 of the cover 5 is preferably 10 mm or less, more preferably 7 mm or less.

[0147] In addition, if Figure 4 As shown, in addition to the chip 20, a portion of the flow channel opening forming member 25 is disposed within the opening 5H of the cover 5. Specifically, a portion of the flow channel opening forming member 25 is inserted into the opening 5H of the cover 5. The presence of the cover 5 can increase the paper gap depending on the thickness D5 of the cover 5. Specifically, if the thickness D5 of the cover 5 is excessively thick, the surface of the chip 20 facing the Z1 direction may be positioned in the Z2 direction relative to the surface of the cover 5 facing the Z1 direction. This increased distance may reduce the accuracy of the ink landing position on the medium 90.

[0148] In this embodiment, as described above, a portion of the flow path opening forming member 25 is disposed in the opening 5H in addition to the chip 20. Therefore, even if the thickness D5 of the cover 5 is increased to further enhance the strength of the cover 5, the increase in the paper gap can be prevented.

[0149] Furthermore, the surface of the nozzle plate 201 of the chip 20 facing the Z1 direction, i.e., the nozzle surface SN, and the surface 511 of the cover 5 facing the Z1 direction are substantially flush with each other. Specifically, the nozzle surface SN and the surface 511 of the cover 5 facing the Z1 direction are positioned at the same Z-axis position. Therefore, compared to a case where the nozzle surface SN is positioned in the Z2 direction relative to the surface of the cover 5 facing the Z1 direction, the increase in the paper gap can be suppressed. Furthermore, the surface 511 of the cover 5 facing the Z1 direction and the nozzle surface SN can be easily wiped simultaneously.

[0150] The case where the nozzle surface SN and the surface 511 of the cover 5 facing the Z1 direction are substantially flush with each other includes not only the case where these surfaces are completely flush with each other but also the case where there is a level difference due to manufacturing errors.

[0151] Furthermore, the nozzle surface SN and the surface 511 of the cover 5 facing the Z1 direction do not necessarily need to be substantially flush. The nozzle surface SN and the surface 511 of the cover 5 facing the Z1 direction may be positioned differently on the Z axis, or there may be a height difference between these surfaces. In this case, the distance between the nozzle surface SN and the surface 511 of the cover 5 facing the Z1 direction is preferably 100 μm or less, and more preferably 50 μm or less, for ease of wiping.

[0152] like Figure 4 As shown, the cover 5 has a plurality of fixing holes 503. Each fixing hole 503 is used to fix the cover 5 relative to the bracket 6. Figure 4 As shown, each fixing hole 503 is provided on the surface 512 of the cover 5 facing the Z2 direction. Each fixing hole 503 is a bottomed hole provided on the surface 512 of the cover 5 facing the Z2 direction. Furthermore, each fixing hole 503 is a recessed portion provided on the surface 512 of the cover 5 facing the Z2 direction, and can also be understood as a depression formed on the surface 512. The plurality of fixing holes 503 correspond one-to-one with the plurality of fixing holes 652H described above, and overlap when viewed along the Z1 direction.

[0153] The cover 5 is secured by contacting the outer peripheral wall of the recess 610, that is, the surface 605 of the bracket 6 facing the Z1 direction. Specifically, the bracket 6 and the cover 5 are secured by inserting the fixing member 157, described later, through the fixing hole 652H and the fixing hole 503. Furthermore, as previously described, the cover 5 has a plurality of openings 5H for exposing the plurality of head modules 2 to the outside.

[0154] By providing the cover 5 , the nozzle surface SN serving as the ink ejection surface is exposed by the cover 5 , and at the same time, it is possible to suppress the intrusion of the ink mist into the recess 610 of the holder 6 .

[0155] Although one cover 5 is provided for each bracket 6 , a plurality of covers 5 may be provided. For example, a cover 5 that holds three of the six head modules 2 and a cover 5 that holds the remaining three head modules 2 may be provided.

[0156] For example, two or more head modules 2 that are replaced at the same timing are held by one cover 5. Thus, the two or more head modules 2 that are replaced at the same timing can be collectively replaced, thereby making the work easier.

[0157] Specifically, for example, it is preferred that the cover 5 holds multiple head modules 2 that eject the same type of liquid. This allows chips with similar lifespans, such as those with colors that eject more frequently, to be replaced collectively. This improves the workability during replacement. Furthermore, the two or more head modules 2 held by a single cover 5 do not necessarily eject the same type of ink. Furthermore, a single head module 2 can be configured to eject either a single ink or two or more inks.

[0158] 1-3E. Fixed component group 150

[0159] like Figure 4As shown, the fixing component set 150 includes a plurality of fixing components 155 and a plurality of fixing components 157 .

[0160] The fixing member 155 secures the bracket 6 and the cover 5. The fixing member 155 is inserted through the through-hole fixing hole 652H and the recessed fixing hole 503 in that order. Therefore, the fixing member 155 is not exposed on the nozzle surface SN side. On the other hand, a portion of the fixing member 155 is exposed on the surface 606 of the bracket 6 facing the Z2 direction.

[0161] For example, after removing the fixing member 155 from the fixing hole 652H, a long, narrow rod-shaped member can be inserted into the fixing hole 652H and used to press the cover 5 in the Z1 direction. This can easily release the cover 5 from being pressed against the bracket 6. In other words, by using the fixing hole 652H as a hole for releasing the press-fit, the cover 5 from being pressed against the bracket 6 can be easily released.

[0162] The fixing component 157 directly fixes the bracket 6 and the head module 2. The fixing component 157 is inserted through the fixing hole 651H, which is a through hole, and the recessed fixing hole 215 in this order. Therefore, the fixing component 157 is not exposed on the surface of the liquid ejecting head 1 in the Z1 direction, specifically, on the nozzle surface SN side. On the other hand, a portion of the fixing component 157 is exposed on the surface 606 of the bracket 6 facing the Z2 direction. By preventing the fixing component 157 from being exposed on the nozzle surface SN side, it is possible to prevent the ink mist from adhering to the fixing component 157 and solidifying. Therefore, it is possible to prevent the fixing component 157 from becoming difficult to remove from the bracket 6 and the head module 2 due to the adhesion of the mist.

[0163] For example, after removing the fixing member 157 from the fixing hole 651H, a long, narrow rod-shaped member can be inserted into the fixing hole 651H and used to press the head module 2 in the Z1 direction. This can easily release the head module 2 from being pressed into the bracket 6. In other words, by using the fixing hole 651H as a hole for releasing the press-fit, the head module 2 can be easily released from being pressed into the bracket 6.

[0164] The fixing member 157 corresponds to the "first fixing member". The fixing hole 651H corresponds to the "first fixing hole". The fixing hole 215 corresponds to the "first fixing hole".

[0165] Furthermore, the depth D66 of the fixing hole 651H is deeper than the depth D26 of the fixing hole 215. By making the depth D66 deeper than the depth D26, it is easier to remove the flow path opening forming member 25 from the holder 6 than when making it shallower than the depth D26.

[0166] In addition, if Figure 9 As shown, multiple fixing members 155 are provided near the corners of the bracket 6, which has a quadrangular shape when viewed in the Z1 direction. Multiple fixing members 157 are provided for each head module 2. Specifically, two fixing members 157 are provided for each head module 2. One of the two fixing members 157 is arranged in the Y1 direction of the head module 2 when viewed in the Z1 direction, and the other is arranged in the Y2 direction of the head module 2.

[0167] The fixing members 155 and 157 are preferably screws. For example, internal threads are formed on the inner circumferential walls of the fixing holes 651H, 652H, the fixing holes 215, and the fixing holes 503. By using screws as the fixing members 155 and 157, the cover 5 and the multiple head modules 2 can be easily released from the bracket 6 by rotating the screws to release the threaded fastening. By using screws as the fixing members 155 and 157, the multiple head modules 2 and the cover 5 can be freely attached to and detached from the bracket 6 without the use of adhesive.

[0168] In addition, the fixing parts 155 and 157 can also be parts other than screws. For example, they can also be a structure that includes an L-shaped or T-shaped pin that bends the top end in the Z1 direction into a right angle, and an elastic part such as a leaf spring or a coil spring, and uses the elastic force of the elastic part to fix the bracket 6 and the cover 5.

[0169] Thus, the fixing member 155 may have any structure as long as it fixes the holder 6 and the cover 5 to each other. The fixing member 157 may have any structure as long as it fixes the holder 6 and the head module 2 to each other.

[0170] Furthermore, each of the fixing members 155 and 157 is arranged so as not to overlap with the chip 20 when viewed in the Z1 direction and so as to sandwich the sealing member 4 between the chip 20 .

[0171] By ensuring that the fixing members 155 and 157 do not overlap with the chip 20 when viewed in the Z1 direction, the load generated by the fixing members 155 and 157 is less likely to act on the chip 20 than when they overlap with the chip 20. Furthermore, by arranging the sealing member 4 between the fixing members 155 and 157 and the chip 20 when viewed in the Z1 direction, the distance of the chip 20 relative to the fixing members 155 and 157 can be increased by the amount of the sealing member 4. Therefore, the load generated by the fixing members 155 and 157 is less likely to act on the chip 20.

[0172] 1-3F. Wiring board 7, relay board 70, and connector 71

[0173] like Figure 3 As shown, the wiring substrate 7 is provided for each head module 2. The wiring substrate 7 is inserted into the through hole 25H of the chip 20 and the through hole 20H of the flow channel opening forming component 25. The wiring substrate 7 is bonded to the vibration plate 204. The wiring substrate 7 protrudes from the vibration plate 204 in the Z2 direction. The wiring substrate 7 is a mounting component formed with a plurality of wirings for electrically connecting the chip 20 and the relay substrate 70. The wiring substrate 7 is, for example, a flexible substrate such as an FPC (Flexible Printed Circuit) and a COF (Chip On Film) or a rigid substrate. A driving signal and a reference voltage for driving the driving element E are supplied from the wiring substrate 7 to each driving element E.

[0174] The relay substrate 70 is fixed to the bottom surface of the recessed portion 610 in the Z1-direction surface 605 of the flat plate portion 61 of the bracket 6. The relay substrate 70 is flat and is fixed to the bracket 6 by adhesive or the like. The relay substrate 70 is electrically connected to the control unit 91. A plurality of connectors 71 are mounted on the relay substrate 70. The plurality of connectors 71 are arranged one-to-one with the plurality of wiring substrates 7. The ends of the wiring substrates 7, which are provided with a plurality of terminals, are inserted into each connector 71 in a detachable manner. In other words, the wiring substrate 7 is preferably a rigid body in order to facilitate insertion and removal of the ends of the wiring substrate 7 relative to the connectors 71. When the wiring substrate 7 is formed using a flexible substrate, it is desirable to attach a rigid body to support the flexible substrate. By inserting the ends of the wiring substrate 7 into the connectors 71, the wiring substrate 7 is electrically connected to the control unit 91 via the relay substrate 70.

[0175] The relay substrate 70 is electrically connected to the multiple head modules 2. The relay substrate 70 is arranged in the Z2 direction, which is opposite to the Z1 direction, relative to the multiple head modules 2, and overlaps with the multiple head modules 2 when viewed along the Z1 direction. In addition, the first positioning portion 216 is provided on the surface of the cover 5 facing the Z2 direction. Therefore, it is relatively easy to remove and assemble only the head module 2 to be replaced from below the bracket 6 and the relay substrate 70. Therefore, there is no need to disconnect the electrical connections of the head modules 2 other than the replacement module, which simplifies the removal and assembly operation.

[0176] Furthermore, as described above, wiring substrate 7 is disposed on the bottom surface of recess 610 of holder 6. Therefore, the lengths of head module 2 and wiring substrate 7 can be shortened more easily than when wiring substrate 7 is disposed on surface 606 of holder 6 facing the Z2 direction.

[0177] As described above, when only the head module 2 to be replaced is mounted on the bracket 6 from below the bracket 6, the wiring substrate 7 moves in the Z2 direction from below the connector 71 toward the connector 7. Furthermore, the wiring substrate 7 is inserted into the connector 71. This establishes an electrical connection between the wiring substrate 7 and the relay substrate 70.

[0178] 1-3G. Bushing

[0179] like Figure 4 As shown, a bushing 526 is arranged between the flow channel opening forming part 25 and the cover 5. Although not shown in detail, for example, the bushing 526 is arranged in the Y1 direction and the Y2 direction of each flow channel opening forming part 25 when viewed along the Z1 direction. In addition, a bushing 522 is arranged between the bracket 6 and the cover 5. Although not shown in detail, for example, the bushing 522 is arranged in a square frame shape along the outer edge of the bracket 6 when viewed along the Z1 direction. The bushings 526 and 522 are made of, for example, elastic resin materials. By providing the bushings 526 and 522, the possibility of ink mist and the like intruding from the outside of the liquid ejecting head 1 into the storage space within the recess 610 of the bracket 6 can be reduced.

[0180] 2. Modification

[0181] The first embodiment illustrated above can be modified in various ways. Specific modifications applicable to the first embodiment described above are exemplified below. Two or more embodiments arbitrarily selected from the following examples can be appropriately combined within a range that does not contradict each other.

[0182] 2-1. First Modification

[0183] Figure 13 It is a cross-sectional view of a portion of the liquid jet head 1 according to the first modified example. Figure 13 The fixing member 157 of the first variant shown secures the hood 5 in addition to the bracket 6 and the head module 2. Furthermore, in the first variant, the fixing member 155 is omitted. According to the first variant, the number of fixing members can be reduced compared to the first embodiment. Therefore, according to the first variant, the head module 2 can be attached to and detached from the bracket 6 using a smaller number of fixing members than in the first embodiment. Furthermore, in the first variant, since the head module 2 is not secured to the hood 5 using adhesive, attachment and detachment of the hood 5 from the head module 2 are relatively easy.

[0184] 2-2. Second Modification

[0185] Figure 14 FIG. 1 is a cross-sectional view of a portion of the liquid ejecting head 1 according to the second modified example. Figure 14In the second modified example shown, the bracket 6 does not have the second recess 612. In other words, the recess 610 of the bracket 6 of the second modified example does not have a stepped surface. The recess 610 is a storage space for storing the interconnect substrate 70.

[0186] The cover 5 of the second modified example is composed of a bottom plate 51 and side walls 52. The bottom plate 51 is flat and has the same structure as the cover 5 of the first embodiment. The side walls 52 are frame-shaped portions that protrude from the outer edges of the bottom plate 51 in the Z2 direction. The cover 5 has a recess 510. The interior of the recess 510 forms a storage space for the multiple head modules 2.

[0187] As described above, the shapes of the holder 6 and the cover 5 are not particularly limited, and may be any shapes. In addition, a space for accommodating the head module 2 is formed by one or both of the holder 6 and the cover 5 .

[0188] The cover 5 of the second modified example also has a flange 54. The flange 54 is similar to the flange 64 of the bracket 6 of the first embodiment. However, the flange 54 is not provided on the bracket 6 but on the cover 5. Furthermore, the flange 54 has a fourth positioning portion 542. The fourth positioning portion 542 has the same structure as the fourth positioning portion 642 of the first embodiment and is press-fitted into the third positioning portion 102 of the unit base 11.

[0189] Furthermore, for example, the head module 2 is fixed to the cover 5 using an adhesive or the like, and the head module 2 can be removed from the bracket 6 by removing the fixing member 155. When the head module 2 is fixed to the cover 5 using an adhesive, if the cover 5 and the head module 2 can be separated by, for example, melting the adhesive using heat, then the cover 5 and the head module 2 can be understood as being fixed in a detachable manner.

[0190] 2-3. Third Modification

[0191] Figure 15 FIG. 1 is a cross-sectional view of a portion of the liquid ejecting head 1 according to the third modified example. Figure 15 In the third modification shown, the cover 5 is omitted. According to the third modification, the number of parts can be reduced compared to the first embodiment. In addition, since the cover 5 is omitted, the head module 2 can be attached to and detached from the bracket 6 more easily than in the first embodiment.

[0192] 2-4. Fourth Modification

[0193] Figure 16 It is a cross-sectional view of a portion of the liquid jet head 1 according to the fourth modified example. Figure 16The liquid jet head 1 of the fourth modified example shown includes a holder 8. The holder 8 includes a first holder 81 and a second holder 82. The first holder 81 is the same as the holder 6 of the first embodiment except that the flange portion 64 is omitted.

[0194] The second bracket 82 is identical to the cover 5 of the first embodiment, except for the following elements. The second bracket 82 has a portion that extends in the Y1 or Y2 direction relative to the first bracket 81 when viewed in the Z1 direction. A fourth positioning portion 824 is provided in this extended portion. The fourth positioning portion 824 has the same structure as the fourth positioning portion 642 of the first embodiment and is press-fitted into the third positioning portion 102 of the unit base 11.

[0195] In addition, the second bracket 82 has a plurality of fixing holes 821 and a plurality of second positioning portions 822. Two fixing holes 821 are provided for each head module 2. One of the two fixing holes 821 is located in the Y1 direction relative to the chip 20 when viewed along the Z1 direction, and the other is located in the Y2 direction. The fixing hole 821 is a hole that opens on the surface 512 of the second bracket 82 facing the Z2 direction. The fixing hole 821 can also be said to be a recess formed on the surface 512 of the second bracket 82 facing the Z2 direction. In addition, the head module 2 has a fixing hole 218H corresponding to the fixing hole 821. The fixing hole 218H is a hole that passes through the flow channel opening forming part 25 of the head module 2.

[0196] Two second positioning portions 822 are provided for each head module 2. Although not illustrated in detail, one of the two second positioning portions 822 is located in the Y1 direction relative to the chip 20 when viewed along the Z1 direction, and the other is located in the Y2 direction. The second positioning portion 822 is a hole opening in the Z2-facing surface 512 of the second bracket 82. The second positioning portion 822 is a recessed portion formed in the Z2-facing surface 512 of the second bracket 82, or rather, a depression provided in the surface 512.

[0197] The head module 2 also has a first positioning portion 217 corresponding to the second positioning portion 822. The first positioning portion 217 is a protrusion that projects in the Z1 direction from the surface 251 of the flow path opening forming member 25 that faces the Z1 direction. The first positioning portion 217 is press-fitted into the second positioning portion 822. This ensures that the head module 2 is positioned relative to the bracket 8 including the second bracket 82.

[0198] Furthermore, the fixing member 158 is inserted into the fixing hole 218H and the fixing hole 821 in this order. The fixing member 158 corresponds to the "first fixing member." The fixing member 158 is, for example, a screw, and has internal threads formed on the inner wall surfaces forming the fixing hole 218H and the fixing hole 821, respectively. By inserting the fixing member 158 into the fixing hole 218H and the fixing hole 821 and tightening them with the threads, the head module 2 is fixed to the second bracket 82. Furthermore, similar to the cover 5 and bracket 6 of the first embodiment, the first bracket 81 and the second bracket 82 are fixed to each other by the fixing member 155.

[0199] Furthermore, the second bracket 82 of the bracket 8 has multiple openings 5H, similar to the cover 5. The multiple head modules 2 are exposed to the outside through the multiple openings 5H. Furthermore, a portion of the flow channel opening forming member 25 is inserted into the openings 5H. Therefore, the second bracket 82 having multiple openings 5H can suppress the increase in the paper gap, similar to the cover 5 of the first embodiment. Furthermore, there is no need to reduce the thickness of the second bracket 82 to suppress the increase in the paper gap. Therefore, a reduction in the rigidity of the second bracket 82 can be suppressed.

[0200] 2-5. Fifth Modification

[0201] Figure 17 FIG. 1 is a cross-sectional view of a portion of the liquid ejecting head 1 according to the fifth modified example. Figure 17 In the fifth modification shown, the fixing holes 218H, the fixing holes 821, and the fixing members 158 are omitted compared to the fourth modification. In the fifth modification, for example, the second bracket 82 and the head modules 2 are fixed together using an adhesive or the like. If the second bracket 82 and the head modules 2 are fixed together using an adhesive, for example, if the adhesive can be melted and separated by heat, then the second bracket 82 and the head modules 2 can be considered to be fixed together in a detachable manner.

[0202] 2-7. Seventh Modification

[0203] Figure 18 It is a cross-sectional view of a portion of the liquid jet head 1 according to the seventh modification. Figure 19 FIG. 1 is a top view of the liquid ejecting head 1 according to the seventh variation. Figure 18 In the seventh modification shown, the positional relationship between the fixing member 157 and the sealing member 4 relative to the chip 20 is different. The shortest distance between the fixing member 157 and the chip 20 is shorter than the shortest distance between the sealing member 4 and the chip 20.

[0204] like Figure 19As shown, the fixing member 157 does not overlap with the chip 20 when viewed along the Z1 direction and is positioned between the chip 20 and the sealing region 4S. This placement makes it easier for a reaction force to be generated outside the fixing member 157 when viewed from the chip 20. Consequently, the reaction force of the sealing member 4 is less likely to be transmitted to the chip 20.

[0205] 2-8. Eighth Modification

[0206] Figure 20 It is a cross-sectional view of a portion of the liquid jet head 1 according to the eighth modification. Figure 21 FIG. 1 is a top view of the liquid ejecting head 1 according to the eighth modification. Figure 20 as well as Figure 21 In the eighth modified example shown, the fixing member 157 overlaps with the chip 20 when viewed along the Z1 direction. Even when the fixing member 157 and the chip 20 overlap when viewed along the Z1 direction, the presence of the cover 5 can suppress the reaction force of the sealing member 4 from affecting the chip 20, compared to a case where the cover 5 is not present.

[0207] 2-9. Ninth Modification

[0208] Figure 22 FIG. 1 is a cross-sectional view of a portion of the liquid ejecting head 1 according to the ninth modification. Figure 22 In the liquid ejecting head 1 of the ninth modified example shown, the first positioning portion 216a is a bottomed hole that opens in the Z2 direction of the head module 2. The first positioning portion 216a is also a recessed portion formed in the Z2 direction of the head module 2. The second positioning portion 653a is a protrusion that projects in the Z1 direction from the surface of the holder 6 facing the Z1 direction. By pressing the second positioning portion 653a into the first positioning portion 216a, the head module 2 is positioned relative to the holder 6.

[0209] Even with the first positioning portion 216a and the second positioning portion 653a, as in the first embodiment, positioning of the head module 2 when mounted on the bracket 6 can be easily performed. Furthermore, alignment of the plurality of head modules 2 relative to the bracket 6 can be performed with high precision. Furthermore, when only a few of the plurality of head modules 2 are replaced, there is no need to re-align all the head modules 2.

[0210] As described in the first embodiment and the ninth modification, the plurality of head modules 2 can be aligned with each other with high precision by a simple method of pressing one of the second positioning portion 653 and the first positioning portion 216 into the other.

[0211] Furthermore, the fourth positioning portion 642a is a bottomed hole that opens in the Z2 direction of the flange portion 64. The fourth positioning portion 642a is also a recessed portion, or depression, formed in the Z1 direction of the flange portion 64. Although not shown, in this case, the third positioning portion 102 is formed by a protruding pin provided on the unit base 11. The fourth positioning portion 642a is pressed into the third positioning portion 102, thereby enabling the liquid ejecting head 1 to be positioned relative to the unit base 11. Therefore, the alignment accuracy of the plurality of liquid ejecting heads 1 relative to the unit base 11 can be improved.

[0212] 2-10. Tenth Modification

[0213] Figure 23 4 is a cross-sectional view showing a sealing member 4 and its vicinity according to a tenth modification. Figure 24 It is a cross-sectional view of a portion of the liquid jet head 1 according to the tenth modification. Figure 23 The sealing member 4 of the tenth modified example shown does not have a constant thickness. The sealing member 4 of the tenth modified example includes a thick portion 41 and a thin portion 42. The thick portion 41 is located near the inner wall surface forming the communication port 4H and is thicker than the thin portion 42. The thin portion 42 is located outside the thick portion 41.

[0214] In the tenth modified example, the thick portion 41 of the sealing member 4 has a sealing region 4S. The thick portion 41 is in contact with the flow path opening forming member 25 and the holder 6 and is sandwiched between the flow path opening forming member 25 and the holder 6.

[0215] like Figure 24 As shown, the support region 5S includes a region S55 disposed between the sealing region 4S and the chip 20 when viewed in the Z1 direction. Therefore, compared to a case where the support region 5S does not include the region S55, the influence of the reaction force of the sealing member 4 on the chip 20 can be reduced.

[0216] In addition, the region S55 may not be provided. The support region 5S and the sealing region 4S may completely coincide with each other in a plan view.

[0217] 2-11. Eleventh Modification

[0218] Figure 25 4 is a cross-sectional view showing a sealing member 4 and its vicinity according to an eleventh modified example. Figure 25The sealing member 4 of the eleventh modified example shown includes a portion that does not contact both the bracket 6 and the flow channel opening forming member 25. The vicinity of the communication opening 4H of the sealing member 4 of the eleventh modified example constitutes a sealing region 4S. Thus, depending on the shapes of the bracket 6 and the flow channel opening forming member 25, the sealing member 4 may also include a portion that is not held between the bracket 6 and the flow channel opening forming member 25 while not in contact with both. The portion of the sealing member 4 held between the bracket 6 and the flow channel opening forming member 25 corresponds to the sealing region 4S.

[0219] 2-12. Other Modifications

[0220] Furthermore, for example, a dedicated through-hole for releasing the press-fitting of the first positioning portion 216 and the second positioning portion 653 may be formed in the bracket 6. For example, the through-hole may penetrate the bracket 6 in the direction of insertion and removal of the second positioning portion 653 relative to the first positioning portion 216 and may have an opening area larger than that of the fixing hole 651H.

[0221] In the above description, the sealing member 4 is provided for each head module 2 , but the sealing member 4 may be integrated and shared among a plurality of head modules 2 .

[0222] The “first positioning portion” and the “second positioning portion” are not particularly limited to the structures of the above-described embodiment and modified examples as long as one is pressed into the other.

[0223] In addition to devices specifically used for printing, "liquid ejection devices" can also be used in various devices such as fax machines and copiers. The use of liquid ejection devices is not limited to printing. For example, a liquid ejection device that ejects a solution of a color material can be used as a manufacturing device for forming color filters for display devices such as liquid crystal display panels. In addition, a liquid ejection device that ejects a solution of a conductive material can be used as a manufacturing device for forming wiring and electrodes for relay substrates. In addition, a liquid ejection device that ejects a solution of an organic substance related to a living organism can be used as a manufacturing device for manufacturing, for example, a biochip.

[0224] Although the present invention has been described above based on preferred embodiments, the present invention is not limited to the embodiments described above. In addition, the structure of each part of the present invention can be replaced with any structure that has the same function as the embodiment described above, and any structure can be added.

[0225] Explanation of symbols

[0226] 1…Liquid ejecting head; 2…Head module; 3…Supply flow channel member; 4…Sealing member; 4H…Communication port; 4S…Sealing area; 5…Cover; 5S…Supporting surface; 6…Bracket; 6R…Flow channel; 7…Wiring substrate; 10…Liquid ejecting head unit; 11…Unit base; 20…Chip; 20H…Through hole; 25…Flow channel opening forming member; 25R…Flow channel; 61…Flat plate portion; 64…Flange portion; 6R…Flow channel; 70…Relay substrate; 71…Connector; 100…Liquid ejecting device; 102…Third positioning portion; 150…Fixer member assembly; 155…Fixer member; 157… Fixing member; 158…fixing member; 201…nozzle plate; 215…fixing hole; 216…first positioning portion; 218H…fixing hole; 250…flange portion; 251H…flow channel opening; 503…fixing hole; 510…recess; 610…recess; 642…fourth positioning portion; 650H…flow channel opening; 651H…fixing hole; 652H…fixing hole; 653…second positioning portion; 821…fixing hole; 2511…supported surface; C…pressure chamber; E…driving element; N…nozzle; S5…support area; S50…area; S55…area; SN…nozzle surface.

Claims

1. A liquid ejecting head, characterized in that: have: a plurality of head modules that spray liquid in a first direction; The bracket is made of metal and fixes the plurality of head modules in a detachable manner. Each of the plurality of head modules includes a flow channel opening forming member, wherein the flow channel opening forming member defines the flow channel inside and has a first positioning portion and is made of metal. The bracket has a plurality of second positioning portions, and the plurality of second positioning portions are pressed into or pressed into the plurality of first positioning portions, thereby positioning the plurality of head modules relative to the bracket. The flow channel opening formed on the bracket for flow channel connection with the head module and the flow channel opening formed on the flow channel opening forming part of the head module for flow channel connection with the bracket overlap when viewed in the direction of pressing one of the first positioning part and the second positioning part toward the other.

2. The liquid ejecting head according to claim 1, wherein The holder includes a member formed with both one or more flow channels communicating with the plurality of head modules and the plurality of second positioning portions.

3. The liquid ejecting head according to claim 1, wherein The plurality of head modules each include a nozzle plate.

4. The liquid ejecting head according to claim 1, wherein The first positioning portion is provided on a surface of the flow channel opening forming member facing a second direction opposite to the first direction. The plurality of second positioning portions are arranged on a surface of the bracket facing the first direction.

5. The liquid ejecting head according to claim 4, wherein The head module includes a chip, and the chip is arranged in the first direction relative to the flow channel opening forming member. The first positioning portion does not overlap with the chip when viewed along the first direction.

6. The liquid ejecting head according to claim 4, wherein The bracket has a recessed portion with the surface on which the plurality of second positioning portions are arranged as a bottom surface, A cover is further provided. The cover is fixed so as to contact an outer peripheral wall of the recessed portion and has a plurality of openings for exposing each of the plurality of head modules to the outside.

7. The liquid ejecting head according to claim 1, wherein The bracket includes a common flow channel component having one or more flow channels communicating with the plurality of head modules. The common flow channel member is arranged in a second direction opposite to the first direction relative to the plurality of head modules, and overlaps with the plurality of head modules when viewed along the first direction. The first positioning portion is provided on a surface of the flow path opening forming member facing the second direction.

8. The liquid ejecting head according to claim 1, wherein A relay substrate is provided, the relay substrate being electrically connected to the plurality of head modules. The relay substrate is arranged in a second direction opposite to the first direction relative to the plurality of head modules, and overlaps with the plurality of head modules when viewed along the first direction. The first positioning portion is provided on a surface of the flow path opening forming member facing the second direction.

9. The liquid ejecting head according to claim 1, wherein The first positioning portion is arranged on a surface of the flow channel opening forming member facing the first direction, The second positioning portion is arranged on a surface of the bracket facing a second direction opposite to the first direction. The bracket has a plurality of openings for respectively exposing the plurality of head modules to the outside. A portion of the flow path opening forming member is inserted into the opening of the holder.

10. The liquid ejecting head according to claim 1, wherein A plurality of first fixing members are provided, and the plurality of first fixing members are used to fix each of the plurality of head modules to the bracket in a detachable manner. The bracket has a first fixing hole, and the first fixing hole penetrates in the first direction. The flow channel opening forming component has a first fixing hole, which is a concave hole with a bottom surface. The plurality of second positioning portions are arranged on a surface of the bracket facing the first direction, The first positioning portion is provided on a surface of the flow channel opening forming member facing a second direction opposite to the first direction. The first fixing member is inserted into the first fixing hole and the first fixing hole in this order in the first direction.

11. The liquid ejecting head according to claim 10, wherein The depth of the first fixing hole is deeper than that of the first fixing hole.

12. The liquid ejecting head according to claim 10, wherein The first fixing component is a screw.

13. The liquid ejecting head according to claim 1, wherein The bracket has a fourth positioning portion that is pressed or pressed relative to one of a plurality of third positioning portions provided on a unit base that holds the plurality of liquid ejecting heads, thereby positioning the liquid ejecting head relative to the unit base.

14. A liquid ejecting device, characterized in that: have: The plurality of liquid ejecting heads according to claim 1; A unit base holds the plurality of liquid ejecting heads.

15. A liquid ejecting device, characterized in that: have: The plurality of liquid ejecting heads according to claim 13; The unit base includes the plurality of third positioning portions and holds the plurality of liquid ejecting heads.

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