Liquid ejecting head and liquid ejecting apparatus

Abstract

The invention provides a liquid ejecting head and a liquid ejecting apparatus which suppress reduction of reliability. The liquid ejecting head includes: a head module that ejects a liquid in a first direction; a supply flow path member; and a sealing member that is an elastic member and that connects a first flow path opening of the head module and a flow path opening of the supply flow path member in a liquid-tight manner by being sandwiched between the head module and the supply flow path member in the first direction, the head module including a flow path opening forming member and a chip, the first channel opening is formed in the channel opening forming member, and the chip is disposed in the first direction with respect to the channel opening forming member. A sealing region of the sealing member sandwiched between the flow path opening forming member and the supply flow path member does not overlap the chip when viewed in the first direction.

Description

Technical Field

[0001] The present disclosure relates to a liquid ejecting head and a liquid ejecting device. Background Art

[0002] Conventionally, there has been proposed a liquid ejecting apparatus including a liquid ejecting head for ejecting liquid such as ink onto a medium such as printing paper.

[0003] The liquid ejection head described in patent document 1 includes a recording element unit (head module) and a flow path unit (supply flow path component), wherein the recording element unit (head module) includes an element recording substrate having an ejection port for ejecting liquid, and a supporting component for fixing the element recording substrate, and the flow path unit (supply flow path component) has a liquid supply channel for supplying liquid to the recording element unit, and the recording element unit and the flow path unit are connected together in a liquid-tight manner via an elastic component (sealing component).

[0004] In a conventional liquid ejecting head in which a flow path is formed liquid-tightly with an elastic sealing member interposed between a head module and a supply flow path member, the reliability of the head module may be reduced due to the reaction force of the elastic member.

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2015-226988 Summary of the Invention

[0006] The liquid injection head involved in one embodiment of the present invention comprises: a first head module, which sprays liquid in a first direction; a supply flow channel component, which supplies liquid to the first head module; a first sealing component, which is an elastic component and is clamped between the first head module and the supply flow channel component in the first direction, thereby liquid-tightly connecting the first flow channel opening of the first head module and the flow channel opening of the supply flow channel component, the first head module includes a flow channel opening forming component and a chip, the flow channel opening forming component is formed with the first flow channel opening, the chip is arranged in the first direction relative to the flow channel opening forming component, and the sealing area of the first sealing component clamped by the flow channel opening forming component and the supply flow channel component does not overlap with the chip when viewed along the first direction.

[0007] A liquid ejecting apparatus according to one embodiment of the present disclosure includes: a plurality of liquid ejecting heads; and a unit base that fixes the plurality of liquid ejecting heads. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a schematic diagram showing a configuration example of the liquid ejecting apparatus according to the first embodiment.

[0009] Figure 2 To express Figure 1 A plan view of a liquid ejecting head is shown.

[0010] Figure 3 for Figure 2 A cross-sectional perspective view of a liquid ejecting head is shown.

[0011] Figure 4 for Figure 3 The liquid ejecting head shown is a cross-sectional view viewed in the direction along the X-axis.

[0012] Figure 5 For Figure 3 The liquid ejecting head shown is a cross-sectional view viewed in the direction along the Y axis.

[0013] Figure 6 for Figure 3 A bottom view of the liquid ejecting head is shown.

[0014] Figure 7 for Figure 4 A cross-sectional view of a chip included in the head module is shown.

[0015] Figure 8 for Figure 5 A top view of a flow channel opening forming member included in the head module is shown.

[0016] Figure 9 for Figure 5 A bottom view of the supply channel component is shown.

[0017] Figure 10 for Figure 5 A top view of the supply flow channel components is shown.

[0018] Figure 11 for Figure 5 A top view of the sealing component is shown.

[0019] Figure 12 for Figure 5 A top view of the support component is shown.

[0020] Figure 13 for Figure 5 A top view of the upper portion of the stent is shown.

[0021] Figure 14 To express Figure 5 Figure 2 shows the lower portion of the bracket.

[0022] Figure 15 A cross-sectional view of a portion of a liquid ejecting head according to a first modified example.

[0023] Figure 16 A cross-sectional view of a portion of a liquid ejecting head according to a first modified example.

[0024] Figure 17 It is a top view of the liquid ejecting head of the first modification.

[0025] Figure 18 A cross-sectional view of a portion of a liquid ejecting head according to a second modified example.

[0026] Figure 19 A cross-sectional view of a portion of a liquid ejecting head according to a second modified example.

[0027] Figure 20 A cross-sectional view of a portion of a liquid ejecting head according to a third modified example.

[0028] Figure 21 A cross-sectional view of a portion of a liquid ejecting head according to a third modified example.

[0029] Figure 22 A diagram showing a second component included in a bracket according to a third modified example.

[0030] Figure 23 A cross-sectional view of a portion of a liquid ejecting head according to a fifth modification.

[0031] Figure 24 4 is a cross-sectional view showing a sealing member and its vicinity according to a sixth modification.

[0032] Figure 25 A cross-sectional view of a portion of a liquid ejecting head according to a sixth modification.

[0033] Figure 26 4 is a cross-sectional view showing a sealing member and its vicinity according to a seventh modification.

[0034] Figure 27 It is a top view of the support member showing the eighth modification.

[0035] Figure 28 This is a cross-sectional view of the liquid ejecting head according to the second embodiment as viewed in the direction along the Y axis.

[0036] Figure 29 This is a cross-sectional view of the liquid ejecting head according to the second embodiment as viewed in the direction along the X-axis.

[0037] Figure 30 for Figure 28 A bottom view of the liquid ejecting head is shown.

[0038] Figure 31 for Figure 28 A top view of a flow channel opening forming member included in the head module is shown.

[0039] Figure 32 To express Figure 28Bottom view of the bracket and relay substrate shown.

[0040] Figure 33 for Figure 28 Top view of the bracket shown.

[0041] Figure 34 for Figure 28 A top view of the sealing component is shown.

[0042] Figure 35 for Figure 28 A top view of the support component is shown.

[0043] Figure 36 A cross-sectional view of a portion of a liquid ejecting head according to a ninth modification.

[0044] Figure 37 A cross-sectional view of a portion of a liquid ejecting head according to a tenth modification.

[0045] Figure 38 A cross-sectional view of a portion of a liquid ejecting head according to an eleventh modification.

[0046] Figure 39 A cross-sectional view of a portion of a liquid ejecting head according to a twelfth modification.

[0047] Figure 40 A sectional view of a portion of a liquid ejecting head according to a thirteenth modified example.

[0048] Figure 41 A cross-sectional view of a portion of a liquid ejecting head according to a fifteenth modification.

[0049] Figure 42 It is a top view of the liquid ejecting head of the fifteenth modification.

[0050] Figure 43 A sectional view of a portion of a liquid ejecting head according to a sixteenth modification.

[0051] Figure 44 It is a top view of the liquid ejecting head of the sixteenth modification. DETAILED DESCRIPTION

[0052] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In addition, in the accompanying drawings, the dimensions or scales of each part may be appropriately different from the actual situation, and there are also parts that are schematically shown for ease of understanding. In addition, in the following description, as long as there is no record indicating a particular limitation on the present invention, the scope of the present invention is not limited to these embodiments. In addition, "element β on element γ" is not limited to a structure in which element γ and element β are in direct contact, but also includes a structure in which element γ and element β are not in direct contact. "Element γ is equal to element β" only requires that element γ and element β are substantially equal, and may include measurement errors and manufacturing errors, etc. "Element γ is the same as element β" only requires that element γ and element β are substantially the same, and may include measurement errors and manufacturing errors, etc.

[0053] 1. First Implementation

[0054] 1-1. Overall Structure of Liquid Ejecting Device 100

[0055] Figure 1 This is a schematic diagram illustrating the structure of the liquid injection device 100 involved in the first embodiment. In the following, for the convenience of explanation, the X-axis, Y-axis and Z-axis that are orthogonal to each other are appropriately used for explanation. In addition, a direction along the X-axis is marked as the X1 direction, and the direction opposite to the X1 direction is marked as the X2 direction. Similarly, a direction along the Y-axis is marked as the Y1 direction, and the direction opposite to the Y1 direction is marked as the Y2 direction. A direction along the Z-axis is marked as the Z1 direction, and the direction opposite to the Z1 direction is marked as the Z2 direction. In addition, the Z1 direction is equivalent to the "first direction". The Z2 direction is equivalent to the "second direction that is the opposite direction to the first direction". In addition, the Z1 direction relative to a certain location is set as "below", and the Z2 direction from a certain location is set as "above". In addition, observation in the Z1 direction or the Z2 direction is set as "planar observation".

[0056] like Figure 1 As shown, the liquid ejecting apparatus 100 includes a liquid storage portion 9 , a control unit 91 , a transport portion 92 , a head unit 10 , and a moving mechanism 40 .

[0057] The liquid reservoir 9 is a container for storing ink. Specific examples of the liquid reservoir 9 include an ink cartridge that is detachable from the liquid ejecting apparatus 100, a bag-shaped ink pack formed of a flexible film, and an ink tank capable of refilling ink. The type of ink stored in the liquid reservoir 9 is not particularly limited and may be any type.

[0058] The control unit 91 controls the operation of each component of the liquid ejecting device 100. The control unit 91 includes, for example, a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a storage circuit such as a semiconductor memory, to control the operation of each component of the liquid ejecting device 100.

[0059] The transport unit 92 transports the medium 90 in the direction DM based on the control performed by the control unit 91. The direction DM in this embodiment is the Y1 direction. Figure 1 In the example shown, the conveying unit 92 includes a conveying roller that is elongated along the X-axis and a motor that rotates the conveying roller. The conveying unit 92 is not limited to a structure using a conveying roller; for example, a structure using a roller or an endless belt that conveys the medium 90 while the medium 90 is attracted to the outer peripheral surface by static electricity or the like may also be used.

[0060] The moving mechanism 40 includes a conveyor belt that secures the unit base 11 of the head unit 10, and reciprocates the head unit 10 in the X1 and X2 directions based on control by the control unit 91. Based on control by the control unit 91, the head unit 10 ejects ink supplied from the liquid reservoir 9 from a plurality of nozzles N toward the medium 90 in the Z1 direction. By ejecting ink from the head unit 10 in parallel with the movement of the head unit 10 by the moving mechanism 40, an image formed by the ink is formed on the surface of the medium 90.

[0061] The number and arrangement of the plurality of liquid ejecting heads 1 included in the head unit 10 are not limited to Figure 1 Furthermore, when the head unit 10 is configured to circulate ink, the head unit 10 may be connected to the liquid storage portion 9 via a circulation mechanism for circulating ink within the head unit 10 .

[0062] 1-2. Head unit 10

[0063] Figure 2 To express Figure 1 The plan view of the head unit 10 is shown. Figure 2 As shown, the head unit 10 includes a unit base 11 and a plurality of liquid ejecting heads 1. The plurality of liquid ejecting heads 1 are fixed to the unit base 11. The unit base 11 is a component that holds the plurality of liquid ejecting heads 1. In the example shown in the figure, the number of liquid ejecting heads 1 relative to the unit base 11 is not particularly limited, and any number of liquid ejecting heads 1 may be used as long as there is at least one.

[0064] The unit base 11 is, for example, a plate-shaped component having a thickness direction along the Z axis. A recess 111 is provided on the unit base 11. The recess 111 is a depression provided on the unit base 11. A plurality of through holes 11H are provided on the bottom surface of the recess 111. The planar shape of each through hole 11H is, for example, a quadrangular shape. The through hole 11H is provided for each liquid ejecting head 1. A portion of the liquid ejecting head 1 is inserted into each through hole 11H. In addition, Figure 2 In order to show the through-hole 11H, illustration of a plurality of liquid ejecting heads 1 arranged in a part of the unit base 11 is omitted.

[0065] Furthermore, the unit base 11 is provided with four mounting holes 101 and two third positioning portions 102 for each through hole 11H. The four mounting holes 101 and the two third positioning portions 102 are provided outside the through hole 11H when viewed from above. The number and arrangement of the mounting holes 101 and the third positioning portions 102 are not limited to Figure 2 illustrative examples, but any number and configuration.

[0066] The mounting holes 101 are provided near four corners of the through hole 11H in plan view, for example. The mounting holes 101 are used to mount the liquid jet head 1 on the unit base 11. The mounting holes 101 penetrate the unit base 11 in the thickness direction, for example.

[0067] Each third positioning portion 102 is, for example, provided between two mounting holes 101 aligned along the X-axis to isolate them. Each third positioning portion 102 is used to position the unit base 11 during installation of the liquid jet head 1. Each third positioning portion 102 is, for example, a bottomed hole opening on the Z1-direction surface of the unit base 11. Each third positioning portion 102 can also be described as a recessed portion formed on the Z1-direction surface of the unit base 11.

[0068] Furthermore, the mounting holes 101 may not penetrate the unit base 11 in the thickness direction. Similarly, the third positioning portions 102 may penetrate the unit base 11 in the thickness direction. Furthermore, the shape of the unit base 11 is not limited to a plate shape, and may be a box shape, for example.

[0069] As described above, the liquid ejecting device 100 includes a plurality of liquid ejecting heads 1 and a unit base 11 to which the plurality of liquid ejecting heads 1 are fixed. The liquid ejecting device 100 includes the liquid ejecting heads 1 described below. Furthermore, although described below, the plurality of liquid ejecting heads 1 are detachable from the unit base 11 and are configured to improve the alignment accuracy of the plurality of liquid ejecting heads 1 relative to each other. Therefore, according to the liquid ejecting device 100, even if any of the plurality of liquid ejecting heads 1 is replaced, a decrease in printing quality can be suppressed.

[0070] 1-3. Liquid ejecting head 1

[0071] Figure 3 for Figure 2 FIG. 2 is a cross-sectional perspective view of the liquid ejecting head 1 shown in FIG. Figure 4 for Figure 3 The illustrated liquid ejecting head 1 is a cross-sectional view viewed in the direction along the X-axis. Figure 5 For Figure 3 The liquid ejecting head 1 shown in FIG. 1 is a cross-sectional view observed along the Y-axis. Figure 5 As shown in FIG. 1 , in this embodiment, the liquid jet head 1 is a substantially symmetrical structure with respect to the central imaginary plane A10 along the XZ plane. In addition, the liquid jet head 1 may not be a symmetrical structure with respect to the central imaginary plane A10. Figure 3 In the figure, the partition wall portion 63 of the bracket 6 described later is omitted.

[0072] like Figures 3 to 5 As shown in any of the above, the liquid ejecting head 1 includes a plurality of head modules 2, two supply flow path components 3, a sealing component 4, a plurality of support components 5, a bracket 6, a plurality of wiring substrates 7, and a relay substrate 70. In addition, in this embodiment, a support component 5 is provided for each head module 2. Figure 4 As shown, a subunit 15 is formed by the head module 2 and the corresponding support member 5 .

[0073] 1-3A. Head module 2

[0074] exist Figure 4 In the example shown in FIG, the plurality of head modules 2 are six head modules 2. The number of head modules 2 is not limited to six, and may be one or more and five or less, or seven or more. Therefore, the liquid ejecting head 1 may have only one head module 2.

[0075] In this embodiment, a plurality of head modules 2 are arranged along the X axis. Figure 3 as well as Figure 5As shown, each head module 2 is long and narrow along the Y axis. Each head module 2 ejects ink in the Z1 direction. The head module 2 includes a chip 20 and a flow channel opening forming member 25. The chip 20 is arranged in the Z1 direction relative to the flow channel opening forming member 25.

[0076] Figure 6 for Figure 3 The bottom view of the liquid ejecting head 1 is shown. Figure 6 As shown, each head module 2 has a plurality of nozzles N for ejecting ink. The plurality of nozzles N are arranged along the Y-axis. The plurality of nozzles N are divided into a nozzle column La and a nozzle column Lb arranged at intervals along the X-axis. The nozzle column La and the nozzle column Lb are respectively a collection of a plurality of nozzles N arranged in a straight line along the Y-axis. In addition, the surface of the head module 2 on which the openings of the plurality of nozzles N are formed is referred to as a nozzle surface SN. The nozzle surface SN is the surface of the chip 20 of the head module 2 facing the Z1 direction. In addition, for example, the plurality of nozzles N may also be arranged in a direction intersecting the X-axis and the Y-axis when viewed along the Z1 direction.

[0077] 1-3Aa. Chip 20

[0078] Figure 7 for Figure 4 The figure shows a cross-sectional view of the chip 20 included in the head module 2. The chip 20 has a structure in which the elements associated with each nozzle N in nozzle row La and the elements associated with each nozzle N in nozzle row Lb are arranged in a roughly plane-symmetrical manner. The following description focuses on the elements corresponding to nozzle row La, while the description of the elements corresponding to nozzle row Lb is omitted as appropriate. In the following text, when nozzle row La and nozzle row Lb are not distinguished, they are referred to as nozzle row L.

[0079] like Figure 7 As shown, the chip 20 included in each head module 2 includes, for example, a communication plate 202 , a pressure chamber substrate 203 , a vibration plate 204 , a nozzle plate 201 , a cover 206 , a plurality of driving elements E, and a sealing substrate 205 .

[0080] The connecting plate 202, pressure chamber substrate 203, vibration plate 204, nozzle plate 201, and cover 206 are each a narrow, long plate-shaped member extending along the Y axis. The pressure chamber substrate 203 is provided on the surface of the connecting plate 202 in the Z2 direction. The nozzle plate 201 and cover 206 are provided on the surface of the connecting plate 202 in the Z1 direction. These components are fixed to each other using, for example, an adhesive.

[0081] The nozzle plate 201 is a plate-shaped component with multiple nozzles N formed thereon. The nozzle plate 201 is the component of the head module 2 located closest to the Z1 direction. The surface of the nozzle plate 201 facing the Z1 direction is the nozzle surface SN. Each of the multiple nozzles N is a circular through-hole that ejects ink. The nozzle plate 201 is manufactured by processing a single crystal silicon (Si) substrate using semiconductor manufacturing techniques such as photolithography and etching.

[0082] A plurality of choke portions R1, a plurality of connecting flow channels R2, a connecting space Ra and a common flow channel Rb are formed on the connecting plate 202. The choke portion R1 and the connecting flow channel R2 are respectively through-holes extending in the Z1 direction and formed for each nozzle N. The connecting flow channel R2 overlaps with the nozzle N when viewed from a plane. The connecting space Ra is an opening formed as a long strip along the Y axis. The connecting space Ra extends along the Y axis. The common flow channel Rb is connected to the connecting space Ra and overlaps with the connecting space Ra when viewed from a plane. The common flow channel Rb extends along the Y axis. The common flow channel Rb is connected to the plurality of choke portions R1. In addition, the connecting space Ra is connected to the space Rc of the flow channel opening forming component 25.

[0083] The communicating space Ra, the common flow path Rb, and the space Rc form a common space R shared by the multiple nozzles N. The common space R functions as an ink reservoir. Ink stored in the common space R branches into each choke portion R1 and is supplied and filled in parallel to the multiple pressure chambers C.

[0084] Multiple pressure chambers C are formed on the pressure chamber substrate 203. The pressure chamber C is a space located between the connecting plate 202 and the vibration plate 204 and formed by the wall surface of the pressure chamber substrate 203. A pressure chamber C is formed for each nozzle N. The pressure chamber C is a long, strip-shaped space extending in the X1 direction. The multiple pressure chambers C are arranged along the Y axis.

[0085] The communication plate 202 and the pressure chamber substrate 203 are manufactured by processing a semiconductor substrate such as a silicon single crystal substrate, for example.

[0086] At the upper part of the pressure chamber C, there is provided a vibration plate 204 that can deform elastically. The vibration plate 204 is stacked on the upper pressure chamber substrate 203 and is in contact with the surface of the pressure chamber substrate 203 opposite to the connecting plate 202. The vibration plate 204 is a plate-like component in a narrow rectangular shape along the Y-axis when viewed in a plane. The pressure chamber C is connected to the connecting flow channel R2 and the choke portion R1. Therefore, the pressure chamber C is connected to the nozzle N via the connecting flow channel R2, and is connected to the connecting space Ra via the choke portion R1. In addition, a separate flow channel for each nozzle N is formed by the nozzle N, the connecting flow channel R2, the pressure chamber C, and the choke portion R1. In addition, although in Figure 7 Although the pressure chamber substrate 203 and the vibration plate 204 are illustrated as separate substrates for convenience of explanation, they are actually stacked on one silicon substrate.

[0087] A driving element E is formed on the surface of the vibration plate 204 opposite the pressure chambers C, corresponding to each pressure chamber C. The driving element E is a piezoelectric element that is elongated and extends along the X-axis when viewed in plan. The driving element E comprises, for example, a pair of electrodes and a piezoelectric body sandwiched between the electrodes. Alternatively, the driving element E may be a thermoelectric conversion element that generates thermal energy.

[0088] The sealing substrate 205 is a structure that protects the multiple driving elements E. The sealing substrate 205 is fixed to the surface of the vibration plate 204 using, for example, an adhesive. The multiple driving elements E are housed within a recessed portion formed on the surface of the sealing substrate 205 that faces the vibration plate 204. Furthermore, the sealing substrate 205 is provided with through-holes 20H for inserting the wiring substrate 7 (described later).

[0089] The cover 206 is a relatively thin metal plate that forms the wall surface of the common flow channel Rb. The cover 206 has a thickness approximately equal to that of the nozzle plate 201. The planar shape of the cover 206 is, for example, a frame that surrounds the nozzle plate 201. A mold 207 made of resin is provided between the cover 206 and the nozzle plate 201. The surface of the cover 206 facing the Z1 direction constitutes a portion of the nozzle surface SN.

[0090] In the chip 20, when the driving element E contracts due to energization, the vibration plate 204 is bent and flexed in the direction of reducing the volume of the pressure chamber C, causing the pressure in the pressure chamber C to rise, so that the ink droplets are ejected from the nozzle N. At this time, the pressure also propagates from the pressure chamber C toward the choke portion R1, so that the ink also flows through the choke portion R1 to the common flow channel Rb. After the ink is ejected, the driving element E returns to its original position. At this time, the ink in the common flow channel Rb also vibrates from the nozzle N. Moreover, when the curved liquid surface of the nozzle N is restored, the ink is simultaneously supplied from the choke portion R1. Through the above series of actions, the ink is ejected from the nozzle N.

[0091] Although the chip 20 of this embodiment has Figure 3 Although all the elements shown are included, the components of the chip 20 do not need to include all of the elements and may further include additional elements.

[0092] The chip 20, for example, has a monolithic circuit structure and is thinner than the flow channel opening forming member 25, for example, having a thickness of less than 3000 μm. Alternatively, the chip 20 may be a member having a thickness of 1500 μm or less, or 1000 μm or less. Furthermore, the thickness of the chip 20 may be less than 1 / 5 of the length of the short side when viewed along the thickness direction of the chip 20, i.e., the Z-axis. Furthermore, it is sufficient to include at least one of the nozzle plate 201, the pressure chamber substrate 203, the connecting plate 202, or the drive element E and the closing substrate 205. The chip 20 preferably includes at least the nozzle plate 201, more preferably also includes the pressure chamber substrate 203, and particularly preferably also includes the connecting plate 202. Alternatively, at least one of the nozzle plate 201, the pressure chamber substrate 203, the connecting plate 202, or the pressure chamber substrate 203 with the drive element E stacked thereon, or the closing substrate 205 may be considered the chip 20. In addition, the chip 20 is not only a stack of silicon substrates manufactured using a micro-electro-mechanical system (MEMS), but can also be a stack of thin plates such as ceramic sheets or metals, or a stack of thin plate-like components of the materials described above.

[0093] 1-3Ab. Flow channel opening forming member 25

[0094] like Figure 5 as well as Figure 7 As shown, a flow channel opening forming member 25 is disposed in the Z2 direction of the chip 20. The flow channel opening forming member 25 and the chip 20 are fixed to each other, for example, using an adhesive or the like. The flow channel opening forming member 25 and the chip 20 are positioned relative to each other with high precision in advance. Furthermore, the flow channel opening forming member 25 has, for example, a flow channel for supplying ink to the chip 20.

[0095] Furthermore, the flow channel opening forming member 25 is preferably a member having a thickness of, for example, 3000 μm or greater, more preferably 5000 μm or greater, and even more preferably 8000 μm or greater. Furthermore, the flow channel opening forming member 25 may be formed from a single member or a laminate of multiple members. Furthermore, the flow channel opening forming member 25 may contain resin or metal.

[0096] like Figure 5As shown, the length of the flow channel opening forming member 25 along the Z axis, that is, its thickness, is greater than the thickness D2 of the chip 20. The thickness of the flow channel opening forming member 25 here refers to the thickness at the position overlapping with the sealing area 4S described later when viewed along the Z1 direction. In other words, the chip 20 is thinner than the flow channel opening forming member 25. Furthermore, the flow channel opening forming member 25 includes a surface 251 facing the Z1 direction and a surface 252 facing the Z2 direction.

[0097] Figure 8 for Figure 5 The top view of the flow channel opening forming part 25 of the head module 2 shown in FIG. Figure 8 As shown, the planar shape of the flow channel opening forming member 25 is larger than the planar shape of the chip 20. That is, when viewed along the Z1 direction, the chip 20 has a smaller outer shape than the flow channel opening forming member 25. The flow channel opening forming member 25 is arranged so as to overlap with the chip 20 and cover the chip 20 when viewed along the Z1 direction.

[0098] like Figure 5 as well as Figure 8 As shown, the flow channel opening forming member 25 has a flange portion 250 for fixing to the support member 5 described later. The planar shape of the flange portion 250 is a quadrangular frame surrounding the opening 5H of the support member 5 described later. Figure 5 As shown, the surface of the flange 250 facing the Z1 direction serves as a supported surface 2511, supported by the support member 5 described later. Since the flange 250 has a planar shape that forms a quadrangular frame surrounding the opening 5H, the supported surface 2511 also has a planar shape that forms a quadrangular frame surrounding the opening 5H. The supported surface 2511 is located closer to the chip 20 in the Z2 direction. Therefore, the supported surface 2511 is located in the Z2 direction relative to the nozzle plate 201.

[0099] In addition, if Figure 8 As shown in FIG, a through hole 25H is provided on the flow path opening forming member 25. A wiring substrate 7 described later is inserted through the through hole 25H. The through hole 25H is provided at the center of the flow path opening forming member 25 when viewed from above. Figure 7 , the through hole 25H overlaps with the through hole 20H of the sealing substrate 205 when viewed in plan.

[0100] like Figure 5 as well as Figure 7 As shown in FIG. 2 , a flow channel 25R is formed inside the flow channel opening forming member 25. The flow channel 25R is provided to supply ink to the chip 20. Figure 7As shown in FIG. 1 , a space Rc is provided on the chip 20 side, that is, on the downstream side, of the flow channel 25R. The flow channel 25R communicates with the space Rc.

[0101] like Figure 5 As shown, a plurality of flow channel openings 251H are provided on the opposite side of the chip 20, i.e., the upstream side, of the flow channel 25R of the flow channel opening forming component 25. Each flow channel opening 251H is an opening end of the flow channel 25R in the Z2 direction. The flow channel opening 251H is an opening for connecting the flow channel 25R of the flow channel opening forming component 25 of the head module 2 and the flow channel 3R of the supply flow channel component 3 described later. Figure 5 as well as Figure 8 As shown, a plurality of flow channel openings 251H are provided on the flange portion 250 of the flow channel opening forming member 25. The flow channel openings 251H are arranged outside the chip 20 when viewed in the Z1 direction. In this embodiment, two flow channel openings 251H are provided for each nozzle row L.

[0102] 1-3B. Supply channel component 3

[0103] like Figures 3 to 5 As shown in FIG, each supply channel component 3 is arranged in the Z2 direction relative to the plurality of head modules 2. Each supply channel component 3 is common to the plurality of head modules 2. Figure 5 As shown, the supply flow channel component 3 has a flow channel 3R. The flow channel 3R supplies ink to each head module 2 and distributes the ink to each head module 2. The flow channel 3R is a common flow channel common to multiple head modules 2 and has a common portion 3RA extending along the X-axis and a plurality of branch portions 3RB branching from the common portion 3RA and extending in the Z1 direction. Although not shown in the figure, the supply flow channel component 3 is provided with a flow channel joint for connecting to the supply flow channel outside the liquid injection head 1 in order to communicate with the liquid storage portion 9. The unillustrated flow channel joint is exposed to the outside of the liquid injection head 1, for example, via an unillustrated opening formed on the bracket 6.

[0104] The supply flow path member 3 may include a plurality of flow paths 3R communicating with the plurality of head modules 2. In other words, the flow path 3R may have a plurality of flow paths 3R communicating with the plurality of head modules 2, rather than a common portion 3RA communicating with the plurality of head modules 2.

[0105] like Figure 5 As shown, a flow channel opening 31H is provided on the head module 2 side, that is, on the downstream side, of the flow channel 3R. The flow channel opening 31H is the open end of the flow channel 3R in the Z1 direction. The flow channel opening 31H is provided corresponding to the flow channel opening 251H described above.

[0106] Figure 9for Figure 5 A bottom view of the supply channel component 3 is shown. Figure 10 for Figure 5 The top view of the supply channel component 3 is shown. Figure 9 as well as Figure 10 As shown, each supply channel component 3 is a long and narrow component extending in the X-axis direction. Figure 9 As shown, the two supply flow channel components 3 are disposed within a recess 610 of a holder 6, described later. Furthermore, the two supply flow channel components 3 are disposed so as to sandwich a relay substrate 70, described later, when viewed in the Z2 direction. Furthermore, the plurality of flow channel openings 31H of each supply flow channel component 3 are spaced apart from one another and arranged along the X-axis.

[0107] like Figure 10 As shown, each supply flow channel component 3 overlaps with a plurality of head modules 2 when viewed along the Z1 direction. The supply flow channel component 3 is commonly provided for a plurality of head modules 2. Specifically, each supply flow channel component 3 overlaps with the flange portion 250 of the plurality of flow channel opening forming components 25 when viewed along the Z1 direction. The plurality of flow channel openings 31H overlap in a one-to-one manner with the plurality of flow channel openings 251H described above when viewed along the Z1 direction. In addition, each supply flow channel component 3 does not overlap with the plurality of chips 20 when viewed along the Z1 direction, but is arranged at a position different from the chip 20. Furthermore, each supply flow channel component 3 overlaps with several of the plurality of sealing components 4 described later when viewed along the Z1 direction.

[0108] 1-3C. Sealing component 4

[0109] like Figures 3 to 5 As shown, the sealing component 4 is arranged between each head module 2 and the supply flow channel component 3 in the Z1 direction. The sealing component 4 is provided for each head module 2. The sealing component 4 has elasticity. The sealing component 4 is an elastic material such as an elastomer. In this embodiment, the length of the sealing component 4 along the Z axis, that is, the thickness is constant. The thickness of the sealing component 4 is thinner than the thickness of the flow channel opening forming component 25 and the supply flow channel component 3. The sealing component 4 is flattened by the head module 2 and the supply flow channel component 3.

[0110] Figure 11 for Figure 5 The top view of the sealing member 4 is shown. Figure 11In the example shown, two sealing components 4 are provided for each head module 2. The two sealing components 4 are provided at both ends in the longitudinal direction of one head module 2. Each sealing component 4 is quadrangular when viewed along the Z1 direction. Each sealing component 4 overlaps with the flange portion 250 of the flow channel opening forming component 25 of the head module 2 when viewed along the Z1 direction. On the other hand, in this embodiment, the sealing component 4 is provided at a position different from the chip 20 when viewed along the Z1 direction. That is, the sealing component 4 does not overlap with the chip 20 when viewed along the Z1 direction.

[0111] like Figure 5 as well as Figure 11 As shown, each sealing member 4 has two communication ports 4H. Figure 5 As shown, each communication port 4H is provided corresponding to one flow channel opening 251H of the flow channel opening forming member 25 and one flow channel opening 31H of the supply flow channel member 3. Figure 10 As shown, the communication port 4H overlaps with the flow channel opening 31H and the flow channel opening 251H when viewed along the Z1 direction. Figure 5 As shown, the communication port 4H is connected to the flow channel 25R via the flow channel opening 251H. The communication port 4H is connected to the flow channel 3R via the flow channel opening 31H. Therefore, the flow channels 25R and 3R are connected via the communication port 4H. Specifically, the sealing member 4 is compressed between the flow channel opening forming member 25 and the supply flow channel member 3, thereby connecting the flow channels 25R and 3R via the communication port 4H.

[0112] The sealing member 4 having the communication port 4H is a member that fluid-tightly connects the flow channel opening 251H of the head module 2 and the flow channel opening 31H of the supply flow channel member 3. Ink flowing through the flow channel 3R of the supply flow channel member 3 flows through the communication port 4H to the flow channel 25R of the flow channel opening forming member 25, and is then supplied to the individual flow channels of the chip 20 through the common space R.

[0113] like Figure 11As shown, the sealing component 4 has a sealing area 4S. In the present embodiment, the entire area of the sealing component 4 corresponds to the sealing area 4S. The sealing area 4S is in contact with both the flow channel opening forming component 25 and the supply flow channel component 3, and is an area of the sealing component 4 that is clamped by the flow channel opening forming component 25 and the supply flow channel component 3. The sealing area 4S is an area that receives load and is squeezed from the flow channel opening forming component 25 and the supply flow channel component 3 in order to connect the flow channel opening 251H and the flow channel opening 31H to each other in a liquid-tight manner. In other words, even if it is an area of the sealing component 4 that is clamped between the flow channel opening forming component 25 and the supply flow channel component 3, the part that does not receive load from the two components and is squeezed and thus does not substantially contribute to connecting the flow channel opening 251H and the flow channel opening 31H to each other in a liquid-tight manner is not included in the sealing area 4S.

[0114] like Figure 11 As shown, since the sealing member 4 is positioned at a different position from the chip 20 when viewed along the Z1 direction, the sealing area 4S is also positioned at a different position from the chip 20 when viewed along the Z1 direction. That is, the sealing area 4S does not overlap with the chip 20 when viewed along the Z1 direction. By preventing the sealing area 4S from overlapping with the chip 20 when viewed along the Z1 direction, the reaction force of the sealing member 4 is less likely to act on the chip 20 than if it overlapped with the chip 20. Consequently, the reliability of the head module 2 can be improved.

[0115] As described above, the flow channel 25R and the flow channel 3R are connected via the connecting port 4H by squeezing the sealing member 4 between the flow channel opening forming member 25 and the supply flow channel member 3. There is a possibility that the reaction force of the squashed sealing member 4 will cause stress to act on the chip 20, causing the chip 20 to warp. In this way, when the reaction force of the sealing member 4 acts on the chip 20, there is a possibility that the reliability of the head module 2 will be reduced, for example, the nozzle plate 201 may be deformed, causing the position of the nozzle N to deviate, or the pressure chamber substrate 203 or the connecting plate 202 may be deformed, causing the ejection characteristics to change, or when the components constituting the chip 20 include a silicon substrate or a ceramic sheet, the component may be broken.

[0116] In this embodiment, the sealing region 4S of the sealing member 4 does not overlap with the chip 20 when viewed along the Z1 direction. Therefore, it is possible to suppress a reduction in sealing performance caused by the sealing member 4 while also minimizing the effect of the reaction force of the sealing member 4 on the chip 20. Consequently, the reliability of the head module 2 can be improved.

[0117] As described above, the liquid ejecting head 1 includes a plurality of head modules 2. For example, Figure 11 The head module 2 located on the far left in the figure is set as the "first head module 2a". The head module 2 adjacent to the right side of the first head module 2a is set as the "second head module 2b". In this case, the flow channel opening 251H of the first head module 2a is the "first flow channel opening 251Ha", and the flow channel opening 251H of the second head module 2b is the "second flow channel opening 251Hb". The sealing component 4 corresponding to the first head module 2a is the "first sealing component 4a", and the sealing component 4 corresponding to the second head module 2b is the "second sealing component 4b". The first sealing component 4a is clamped between the first head module 2a and the supply flow channel component 3, thereby connecting the first flow channel opening 251Ha of the first head module 2a and the flow channel opening 31H of the supply flow channel component 3 in a liquid-tight manner. Similarly, the second sealing component 4b is clamped between the second head module 2b and the supply flow channel component 3, thereby connecting the second flow channel opening 251Hb of the second head module 2b and the flow channel opening 31H of the supply flow channel component 3 in a liquid-tight manner. The first head module 2 a and the second head module 2 b each eject ink supplied from the supply flow path member 3 .

[0118] The sealing area 4S of the first sealing component 4a does not overlap with the chip 20 of the first head module 2a when viewed along the Z1 direction. Similarly, the sealing area 4S of the second sealing component 4b does not overlap with the chip 20 of the second head module 2b when viewed along the Z1 direction. Furthermore, the sealing components 4 corresponding to the multiple head modules 2 of the liquid ejecting head 1 do not overlap with the chip 20 when viewed along the Z1 direction. Therefore, in the multiple head modules 2, it is possible to suppress the reduction in sealing performance caused by the sealing component 4 while suppressing the influence of the reaction force of the sealing component 4 on the chip 20. Therefore, the reliability of the liquid ejecting head 1 can be improved.

[0119] In addition, if Figure 10 As shown, the communication port 4H, the flow channel opening 251H, and the flow channel opening 31H do not overlap with the chip 20 when viewed along the Z1 direction. The communication port 4H, the flow channel opening 251H, and the flow channel opening 31H are each arranged on the outside of the chip 20 when viewed along the Z1 direction. Specifically, the communication port 4H, the flow channel openings 251H, and 31H are arranged on both sides of the longitudinal direction of the chip 20 when viewed along the Z1 direction. Therefore, as described above, the sealing area 4S of the sealing component 4 that seals the flow channels 25R and 3R in a liquid-tight manner can be arranged on the outside of the chip 20. Therefore, as described above, the reaction force of the sealing component 4 can be suppressed from affecting the chip 20.

[0120] Furthermore, the seal region 4S is positioned in the Y1 or Y2 direction, which is the longitudinal direction of the head module 2, relative to the chip 20 when viewed along the Z1 direction. By positioning the seal region 4S in this longitudinal direction of the chip 20, it is possible to avoid positioning the seal region 4S between adjacent chips 20. This prevents the seal region 4S from increasing the distance between adjacent chips 20, thus minimizing the impact on printing quality.

[0121] Furthermore, the sealing region 4S may be provided in the direction in which the plurality of head modules 2 are arranged, i.e., in the short side direction of the head module 2, relative to the chip 20. The sealing member 4 may also be provided in the direction in which the plurality of head modules 2 are arranged, i.e., in the short side direction of the head module 2, relative to the chip 20.

[0122] 1-3D. Supporting member 5

[0123] Figures 4 to 6 The support component 5 shown is a component that supports the head module 2. The support component 5 is set one-to-one with respect to the head module 2. The support component 5 is a long plate-shaped component along the Y axis with the direction along the Z axis as the thickness direction. The support component 5 is arranged in the Z1 direction relative to the flow channel opening forming component 25. The support component 5 is a component that sandwiches the sealing component 4 and the flow channel opening forming component 25 between the supply flow channel component 3. Figure 5 As shown, the support member 5 includes a surface 511 facing the Z1 direction and a surface 512 facing the Z2 direction. The support member 5 does not have a flow path through which ink flows.

[0124] Each support member 5 and the corresponding head module 2 are secured to each other using adhesive. Furthermore, the subunit 15, including each support member 5, is removably secured to the bracket 6 (described later). Specifically, the support members 5 are not bonded using adhesive or other means. Therefore, each subunit 15 can be replaced. The support member 5 and the head module 2 are secured to each other using adhesive.

[0125] Therefore, for example, when some of the multiple head modules 2 included in the head unit 10 are damaged, the liquid ejecting head 1 can be regenerated by replacing the subunit 15 including the damaged head module 2 with another subunit 15 including a healthy head module 2.

[0126] Furthermore, the head module 2 and the supply flow channel component 3 described above are not connected by adhesive, but rather by a sealing component 4. Therefore, when the head module 2 is replaced, the flow channel connection between the head module 2 and the supply flow channel component 3 can be easily disconnected. Therefore, replacement of the head module 2 is easily performed.

[0127] In addition, each support member 5 and the corresponding head module 2 are preferably fixed with an adhesive, but the head module 2 may be configured so that the adhesive can be decomposed and removed from the support member 5 .

[0128] The support member 5 is made of, for example, metal. The support member 5 is made of, for example, metal such as aluminum or stainless steel. The support member 5 has rigidity for supporting the head module 2 .

[0129] The support member 5 is provided with an opening 5H. The opening 5H is a hole that penetrates the support member 5 in the thickness direction. The opening 5H is provided to expose a portion of the head module 2 to the outside. Specifically, Figure 6 As shown, the chip 20 is exposed from the opening 5H. Therefore, a plurality of nozzles N are exposed from the opening 5H.

[0130] Figure 12 for Figure 5 The top view of the supporting member 5 is shown. Figure 5 as well as Figure 12 As shown, the support member 5 includes a support area 5S. The support area 5S is a portion of the surface 512 of the support member 5 facing the Z2 direction. Figure 12 In order to facilitate understanding, the support area 5S is marked with a mesh shadow. Figure 12 In the example shown in FIG, the support region 5S has a quadrangular frame shape when viewed in the Z1 direction.

[0131] like Figure 5 As shown, the support area 5S is in contact with the flow channel opening forming member 25 and is a region that directly supports the flow channel opening forming member 25. The support area 5S is in contact with the supported surface 2511 of the flow channel opening forming member 25. Figure 12 As shown, the support area 5S includes an area S50 that overlaps with the sealing area 4S when viewed along the Z1 direction. Figure 12 In FIG, points are marked for area S50.

[0132] By including the support region 5S in the region S50 that overlaps with the sealing region 4S when viewed in the Z1 direction, the support member 5 vertically receives the reaction force of the sealing member 4. Therefore, the support member 5 can firmly support the sealing region 4S of the sealing member 4 between the support member 5 and the supply flow path member 3. Therefore, the reaction force of the sealing member 4 can be particularly effectively buffered.

[0133] Furthermore, a portion of the surface 251 of the flow channel opening forming component 25 described above that faces the Z1 direction includes a supported surface 2511. The supported surface 2511 is supported in a manner that surrounds the opening 5H of the support component 5 and contacts the support component 5 when viewed along the Z1 direction. Specifically, as described above, the flange portion 250 of the flow channel opening forming component 25 includes a supported surface 2511, and the supported surface 2511 contacts the support area 5S of the support component 5, thereby holding the head module 2 by the support component 5. By supporting the flow channel opening forming component 25 by the support component 5 in this manner, the load of the sealing component 4 can be dispersed. Therefore, the flow channel opening forming component 25 is less likely to be damaged.

[0134] Furthermore, the contact between the supported surface 2511 and the supporting area 5S includes both direct contact and connection via an adhesive, an elastic bushing, and the like. Therefore, the flow channel opening forming member 25 can be in direct contact with the supporting member 5 or indirectly via an adhesive, a bushing, or other components. Furthermore, the flange portion 250 need not be a square frame when viewed in plan. For example, the flange portion 250 may be a rectangular shape, positioned in the Y1 direction and the Y2 direction relative to the opening 5H when viewed in plan.

[0135] Furthermore, the thickness of the flange portion 250, that is, its length along the Z1 direction, is preferably greater than the thickness of the portion disposed within the opening 5H of the flow path opening forming member 25. Furthermore, the thickness of the flange portion 250 is preferably at least half the maximum thickness of the flow path opening forming member 25. This thickness relationship suppresses any reduction in the strength of the flange portion 250, and ensures greater strength when subjected to the reaction force of the sealing member 4, making it easier to implement.

[0136] In addition, if Figure 5 As shown, the thickness D5 of the support member 5 in the Z1 direction is thicker than the thickness D2 of the chip 20 in the Z1 direction. This can reduce the possibility of deformation of the support member 5 due to the reaction force of the sealing member 4.

[0137] Furthermore, the thickness D5 of the support member 5 is preferably at least twice, and more preferably at least three times, the thickness D2 of the chip 20. This further reduces the possibility of deformation of the support member 5 due to the reaction force of the sealing member 4. Alternatively, the thickness D5 may be less than the thickness D2.

[0138] From a similar perspective, the thickness D5 of the support member 5 is preferably 1 mm or greater, more preferably 2 mm or greater. Furthermore, to further enhance the strength of the support member 5, the thickness D5 may be 3 mm or greater, 5 mm or greater, or 6 mm or greater. Furthermore, to increase the distance between the medium 90 and the nozzle surface SN, i.e., the paper gap, the thickness D5 of the support member 5 is preferably 10 mm or less, more preferably 7 mm or less.

[0139] like Figure 5 As shown, in addition to the chip 20, a portion of the flow channel opening forming member 25 is disposed within the opening 5H of the support member 5. Specifically, a portion of the flow channel opening forming member 25 is inserted into the opening 5H of the support member 5. The presence of the support member 5 can increase the paper gap depending on the thickness D5 of the support member 5. Specifically, if the thickness D5 of the support member 5 is excessively thick, the surface of the chip 20 facing the Z1 direction may be positioned in the Z2 direction relative to the surface of the support member 5 facing the Z1 direction. This increased distance may result in a decrease in the accuracy of the ink landing position on the medium 90.

[0140] In this embodiment, as described above, a portion of the flow path opening forming member 25 is disposed within the opening 5H in addition to the chip 20. Therefore, even if the thickness D5 of the support member 5 is increased to further enhance its strength, the paper gap can be prevented from increasing.

[0141] Furthermore, the nozzle surface SN, the surface facing the Z1 direction of the nozzle plate 201 of the chip 20, and the surface 511 of the support member 5 facing the Z1 direction, are substantially flush with each other. Specifically, the nozzle surface SN and the surface 511 of the support member 5 facing the Z1 direction are positioned at the same Z-axis position. Therefore, compared to a case where the nozzle surface SN is positioned in the Z2 direction relative to the surface 511 of the support member 5 facing the Z1 direction, the increase in the paper gap can be suppressed. Furthermore, the surface 511 of the support member 5 facing the Z1 direction and the nozzle surface SN can be easily wiped simultaneously.

[0142] The nozzle surface SN and the surface 511 of the support member 5 facing the Z1 direction are substantially flush with each other, including cases where these surfaces are completely flush with each other and also cases where there is a level difference due to manufacturing errors.

[0143] Furthermore, the nozzle surface SN and the surface 511 of the support member 5 facing the Z1 direction do not necessarily need to be substantially flush. The nozzle surface SN and the surface 511 of the support member 5 facing the Z1 direction may be positioned differently on the Z axis, or there may be a height difference between these surfaces. In this case, the distance between the nozzle surface SN and the surface 511 of the support member 5 facing the Z1 direction is preferably 100 μm or less, and more preferably 50 μm or less, for ease of wiping.

[0144] Furthermore, the support member 5 is detachably fixed to a bracket 6 (described later). For example, when the support member 5 is removed from the bracket 6, the head module 2 and the wiring substrate 7 (described later) are removed from the bracket 6 together with the support member 5. The liquid ejecting head 1 of this embodiment is configured so that the alignment accuracy of the plurality of head modules 2 does not decrease when each head module 2 is removed and reattached to the bracket 6.

[0145] like Figure 5 as well as Figure 12 As shown, each support member 5 has two first positioning portions 502 and two fixing holes 501. Each first positioning portion 502 is used to position the support member 5 relative to the bracket 6. Each fixing hole 501 is used to fix the support member 5 relative to the bracket 6.

[0146] Each first positioning portion 502 is provided on the surface 512 of the support member 5 facing the Z2 direction. In this embodiment, each first positioning portion 502 is a bottomed hole that opens on the surface 512 of the support member 5 facing the Z2 direction. Each first positioning portion 502 is a recessed portion provided on the surface 512 of the support member 5 facing the Z2 direction, and can also be understood as a depression formed on the surface 512. The two first positioning portions 502 are provided on both sides of the opening 5H in the longitudinal direction of the support member 5. One of the two first positioning portions 502 is located in the Y1 direction relative to the opening 5H, and the other is located in the Y2 direction relative to the opening 5H.

[0147] Each fixing hole 501 is provided on the surface 512 of the support member 5 facing the Z2 direction. Each fixing hole 501 is a bottomed hole provided on the surface 512 of the support member 5 facing the Z2 direction. Furthermore, each fixing hole 501 is a recessed portion provided on the surface 512 of the support member 5 facing the Z2 direction, and can also be understood as a depression formed on the surface 512. The two fixing holes 501 are provided on either side of the opening 5H in the longitudinal direction of the support member 5. One of the two fixing holes 501 is located in the Y1 direction relative to the opening 5H, and the other is located in the Y2 direction relative to the opening 5H.

[0148] Each fixing hole 501 is spaced apart from each first positioning portion 502 and the opening 5H. Furthermore, each fixing hole 501 located in the Y1 direction relative to the opening 5H is closer to the opening 5H than the first positioning portion 502 located in the Y1 direction relative to the opening 5H. Similarly, each fixing hole 501 located in the Y2 direction relative to the opening 5H is closer to the opening 5H than the first positioning portion 502 located in the Y2 direction relative to the opening 5H. Furthermore, the first positioning portion 502, fixing holes 501, and opening 5H are arranged along the longitudinal direction of the support member 5.

[0149] Furthermore, although the shortest distance between the fixing hole 501 and the opening 5H is shorter than the shortest distance between the first positioning portion 502 and the opening 5H, it may be longer than the shortest distance between the first positioning portion 502 and the opening 5H. Furthermore, the first positioning portion 502, the fixing hole 501, and the opening 5H may not be arranged along the longitudinal direction of the support member 5. For example, the first positioning portion 502 may be provided on both sides of the opening 5H on the X-axis.

[0150] 1-3E. Bracket 6

[0151] like Figures 3 to 5 As shown, the bracket 6 is a housing that accommodates multiple head modules 2 and the supply channel component 3. The bracket 6 is box-shaped and has a recessed portion 610 that opens in the Z1 direction. Multiple head modules 2 and the supply channel component 3 are arranged within the storage space within the recessed portion 610 of the bracket 6. Furthermore, it can be understood that the bracket 6 and the multiple support components 5 form a storage space for multiple head modules 2 and the supply channel component 3.

[0152] The relay substrate 70 is disposed on the bottom surface of the recess 610 of the bracket 6. The bottom surface is the surface of the recess 610 of the bracket 6 that faces the Z1 direction. Furthermore, the bracket 6 is made of a metal such as aluminum or stainless steel. Although not shown in detail, the bracket 6 has an opening for inserting wiring components external to the liquid ejecting head 1. The wiring components are used to electrically connect the relay substrate 70 and the control unit 91.

[0153] The bracket 6 includes a flat plate portion 61, a side wall portion 62, a plurality of partition wall portions 63 and two flange portions 64. The flat plate portion 61, the side wall portion 62, the plurality of partition wall portions 63 and the two flange portions 64 are formed in an integrated manner. The flat plate portion 61 is a flat plate portion along the XY plane and is located in the Z2 direction of the supply flow channel component 3. The side wall portion 62 is a portion extending from the outer edge of the flat plate portion 61 in the Z1 direction. The plane shape of the side wall portion 62 is a quadrangular frame. As shown in FIG. Figure 4As shown, a plurality of partition walls 63 are arranged between a plurality of head modules 2. Each partition wall 63 extends along the Y axis. The partition walls 63 and the head modules 2 are alternately arranged along the X axis.

[0154] Figure 13 for Figure 5 A top view of the upper part of the support 6 is shown. Figure 14 To express Figure 5 FIG. 6 is a diagram of the lower portion of the bracket 6 shown. Figure 4 as well as Figure 13 As shown in FIG. 1 , a plurality of partition walls 63 are not provided on the upper portion of the bracket 6. In contrast, as shown in FIG. Figure 4 as well as Figure 14 As shown, a plurality of partition walls 63 are provided at the lower portion of the bracket 6. The portion of the bracket 6 provided with the plurality of partition walls 63 can also be understood as the lower portion of the bracket 6, and the portion not provided with the plurality of partition walls 63 can also be understood as the upper portion of the bracket 6.

[0155] like Figure 4 As shown, multiple partitions 63 are present in the area where multiple head modules 2 are installed. The multiple partitions 63 are located closer to the Z1 direction than the center of the holder 6 on the Z axis. Multiple partitions 63 are not provided in the portion closer to the Z2 direction than the center of the holder 6 on the Z axis to allow for the placement of the supply channel component 3.

[0156] In addition, if Figure 5 as well as Figure 14 As shown, each bracket 6 has two second positioning portions 602 and two first fixing holes 61H relative to each support member 5. As previously described, the support member 5 is attachable to and detachable from the bracket 6. Each second positioning portion 602 is used to position the support member 5 relative to the bracket 6. Each first fixing hole 61H is used to secure the support member 5 relative to the bracket 6.

[0157] Each second positioning portion 602 is provided on the surface 605 of the bracket 6 facing the Z1 direction. In this embodiment, each second positioning portion 602 is a protrusion protruding from the surface 605 of the bracket 6 facing the Z1 direction toward the Z1 direction. Figure 13 As shown, each second positioning portion 602 is positioned in the Y1 direction or the Y2 direction relative to the recess 610 when viewed along the Z1 direction. Furthermore, the two second positioning portions 602 are positioned corresponding to the two first positioning portions 502 described above, and overlap with the two first positioning portions 502 when viewed along the Z1 direction. Thus, the plurality of second positioning portions 602 are positioned in a one-to-one correspondence with the plurality of first positioning portions 502.

[0158] Each first fixing hole 61H is a hole extending through the bracket 6 in the Z1 direction. Each first fixing hole 61H is positioned in the Y1 direction or the Y2 direction relative to the recess 610 when viewed in the Z1 direction. The two first fixing holes 61H are positioned to correspond to the two fixing holes 501 described above and overlap with the two fixing holes 501 when viewed in the Z1 direction.

[0159] Each first fixing hole 61H located in the Y1 direction relative to the recessed portion 610 is closer to the recessed portion 610 than the second positioning portion 602 located in the Y1 direction relative to the recessed portion 610. Similarly, each first fixing hole 61H located in the Y2 direction relative to the recessed portion 610 is closer to the recessed portion 610 than the second positioning portion 602 located in the Y2 direction relative to the recessed portion 610. Furthermore, the first fixing holes 61H and the second positioning portion 602 are spaced apart from each other and arranged along the Y axis.

[0160] In addition, although the shortest distance between the first fixing hole 61H and the recessed portion 610 is shorter than the shortest distance between the second positioning portion 602 and the recessed portion 610, it may be longer than the shortest distance between the second positioning portion 602 and the recessed portion 610. In addition, the second positioning portion 602 and the first fixing hole 61H do not need to be aligned along the longitudinal direction of the support member 5.

[0161] Each second positioning portion 602 is pressed into the first positioning portion 502 described above to position the support member 5 relative to the bracket 6. The first positioning portion 502 and the second positioning portion 602 are provided per support member 5, that is, per head module 2 held by the support member 5.

[0162] The provision of the first positioning portion 502 and the second positioning portion 602 facilitates positioning of the support member 5 when mounted on the bracket 6. Furthermore, by providing the first positioning portion 502 and the second positioning portion 602 for each support member 5, alignment of the plurality of support members 5 relative to the bracket 6 can be performed with high precision.

[0163] As described above, each support member 5 holds the head module 2. Therefore, by providing the first positioning portion 502 and the second positioning portion 602, the head module 2 fixed to the support member 5 can be positioned relative to the bracket 6. Furthermore, by providing the first positioning portion 502 and the second positioning portion 602 for each support member 5, the alignment of the plurality of head modules 2 with respect to the bracket 6 can be performed with high precision. In other words, the alignment of the plurality of head modules 2 with respect to the bracket 6 and the support member 5 can be performed as a unit. Therefore, when only some of the plurality of head modules 2 are replaced, there is no need to re-align all the head modules 2.

[0164] Furthermore, the plurality of head modules 2 can be aligned with each other with high precision by simply pressing the second positioning portion 602 into the first positioning portion 502. Therefore, a desired head module 2 among the plurality of head modules 2 can be easily replaced. Therefore, the liquid ejecting head 1 can be easily regenerated by replacing the head module 2.

[0165] Furthermore, a plurality of second positioning portions 602 are arranged on the surface 605 of the bracket 6 facing the Z1 direction. Furthermore, as previously described, the first positioning portion 502 is arranged on the surface 512 of the support member 5 facing the Z2 direction, which is the opposite direction to the Z1 direction. Furthermore, each head module 2 is supported by the surface 512 of the support member 5 facing the Z2 direction. By arranging the first positioning portions 502, the second positioning portions 602, and the head module 2 in this manner, it is possible to easily remove and detach only the subunit 15 to be replaced, which includes the support member 5 and the head module 2, from below the bracket 6. Therefore, when the subunit 15 to be replaced is replaced with a subunit 15 including a head module 2 that has not failed and then reinstalled on the bracket 6, it is only necessary to connect the flow path of the replacement head module 2 to the supply flow path component 3 and to electrically connect the wiring substrate 7 mounted on the replacement head module 2 to the relay substrate 70. Therefore, it is unnecessary to connect the flow path of the head module 2 other than the replacement target to the supply flow path member 3 and to electrically connect the wiring substrate 7 to the relay substrate 70. Therefore, the assembly and disassembly work during repair of the liquid ejecting head 1 can be simplified.

[0166] Furthermore, the supply flow channel component 3 and the wiring substrate 7 are arranged on the bottom surface of the recess 610 of the bracket 6, and the support component 5 for holding the head module 2 is arranged so as to block the opening of the recess 610. Therefore, it is easy to shorten the distance between the head module 2 and the supply flow channel component 3, and it is easy to shorten the length of the wiring substrate 7.

[0167] Furthermore, in this embodiment, as previously described, the first positioning portion 502 is a hole provided on the surface of the support member 5 facing the Z2 direction, with a bottom surface recessed in the Z1 direction. Therefore, the first positioning portion 502 is not exposed from the outside of the support member 5. The first positioning portion 502 is not provided on the surface of the support member 5 facing the Z1 direction. Therefore, it is possible to prevent mist of ink ejected from the nozzle N from adhering to the first positioning portion 502.

[0168] Furthermore, the supply flow channel component 3 described above is arranged in the Z2 direction relative to the multiple head modules 2 and overlaps the multiple head modules 2 when viewed along the Z1 direction. In this configuration, with multiple head modules 2 arranged below the supply flow channel component 3, the first positioning portion 502 is provided on the surface of the support component 5 facing the Z2 direction. Therefore, it is easier to attach and detach only the subunit 15 to be replaced from below the bracket 6 and the supply flow channel component 3. Consequently, there is no need to disconnect the flow channels of subunits 15 other than the replacement subunits 15 from the supply flow channel component 3, simplifying the detachment and detachment operations.

[0169] In addition, although the holder 6 and the supply flow channel member 3 are separate bodies, they may be integrated. In addition, a part of the supply flow channel member 3 may be a part of the holder 6.

[0170] In addition, a fixing member 151 is inserted into the first fixing hole 61H and the fixing hole 501. The supporting member 5 is fixed to the bracket 6 by the fixing member 151. Figure 3 、 4 as well as Figure 13 As shown in FIG, the fixing member 151 is provided in units of the supporting member 5. In the present embodiment, two fixing members 151 are provided on one supporting member 5.

[0171] The fixing members 151 detachably fix each of the support members 5 to the bracket 6. Therefore, each fixing member 151 can be understood as fixing the head module 2 and the supply flow path member 3 by fixing the support member 5 to the bracket 6.

[0172] The fixing member 151 is inserted through the first fixing hole 61H (a through-hole) and the recessed fixing hole 501 in this order in the Z1 direction. Therefore, while a portion of the fixing member 151 is exposed from the surface 606 of the bracket 6 facing the Z2 direction, the fixing member 151 is not exposed from the surface 511 of the support member 5 facing the Z1 direction. This prevents ink mist from adhering to the fixing member 151 and solidifying. This prevents the fixing member 151 from becoming difficult to remove from the bracket 6 and support member 5 due to the adhered ink.

[0173] The depth D61 of the first fixing hole 61H is deeper than the depth D51 of the fixing hole 501. The first fixing hole 61H and the fixing hole 501 are formed along the Z1 direction. The depths D61 and D51 are respectively the depths along the Z1 direction.

[0174] The subunit 15 is too small for the user to grasp, making it difficult for the user to grasp. By making the depth D61 of the first fixing hole 61H deeper than the depth D51 of the fixing hole 501, that is, making the depth D51 of the fixing hole 501 shallower than the depth D61 of the first fixing hole 61H, even if the subunit 15 is difficult to grasp, the subunit 15 can be easily released from the bracket 6.

[0175] For example, after removing the first fixing hole 61H from the fixing member 151, a long, narrow rod-shaped member is inserted into the first fixing hole 61H, and this member is used to press the support member 5 in the Z1 direction. This allows the support member 5 to be easily released from the bracket 6. In other words, by using the first fixing hole 61H as a hole for releasing the pressure, the support member 5 can be easily released from the bracket 6. In addition, by making the thickness D6 of the bracket 6 thicker than the thickness D5 of the support member 5, it is easier to remove the support member 5 from the bracket 6 than if the thickness D6 were thinner than the thickness D5.

[0176] The distance L51 from the bottom surface of the fixing hole 501 to the surface 511 of the support member 5 facing the Z1 direction is greater than the depth D51 of the fixing hole 501. By making the distance L51 greater than the depth D51, the support member 5 is less likely to deform when the support member 5 is released from the bracket 6, compared to a case where the distance L51 is less than the depth D51.

[0177] Alternatively, the distance L51 may be smaller than the depth D51. In this case, while ensuring the depth D51 required for positioning, the smaller distance L51 facilitates reducing the thickness D5 of the support member 5. Reducing the thickness D5 can suppress the increase in the paper gap.

[0178] In this embodiment, the fixing member 151 is a screw. Therefore, an internal thread is formed on the inner circumferential wall of the fixing hole 501. By using the fixing member 151 as a screw, the support member 5 can be easily released from the bracket 6 by rotating the screw to release the threaded fastening. Using the fixing member 151 as a screw allows the support member 5 to be fixed to the bracket 6 in a removable manner without the use of adhesive.

[0179] In addition, the fixing component 151 can also be a component other than a screw, for example, it can also be a structure that includes a pin that bends the top end in the Z1 direction into a right-angled L or T shape, and an elastic component such as a leaf spring or a coil spring, and uses the elastic force of the elastic component to fix the bracket 6 and the supporting component 5.

[0180] As described above, the fixing member 151 may have any structure as long as it is a member that fixes the bracket 6 and the supporting member 5 to each other.

[0181] In addition, if Figure 5 as well as Figure 13 As shown, for example, two fixing members 151 are provided for each supporting member 5. The fixing members 151 are arranged so as not to overlap with the chip 20 when viewed in the Z1 direction and so as to sandwich the sealing region 4S between the chip 20.

[0182] By ensuring that the fixing member 151 does not overlap with the chip 20 when viewed in the Z1 direction, the load generated by the fixing member 151 is less likely to act on the chip 20 than when it overlaps with the chip 20. Furthermore, by arranging the sealing member 4 between the fixing member 151 and the chip 20 when viewed in the Z1 direction, the distance between the chip 20 and the fixing member 151 can be increased by an amount corresponding to the size of the sealing member 4. Therefore, the load generated by the fixing member 151 is less likely to act on the chip 20.

[0183] In addition, if Figure 13 As shown, the bracket 6 has a plurality of fourth positioning portions 642. The plurality of fourth positioning portions 642 are provided on the flange portion 64. Figure 5 As shown, the fourth positioning portion 642 is a protrusion protruding from the Z2 direction surface of the flange portion 64 toward the Z2 direction. Figure 2 The plurality of third positioning portions 102 included in the illustrated unit base 11 are provided in a one-to-one correspondence.

[0184] The fourth positioning portion 642 is pressed against one of the third positioning portions 102 provided on the unit base 11, thereby positioning the liquid ejecting head 1 relative to the unit base 11. Therefore, the alignment accuracy of the plurality of liquid ejecting heads 1 relative to the unit base 11 can be improved.

[0185] Furthermore, mounting holes 64H are provided in the flange portion 64. The mounting holes 64H correspond to the mounting holes 101 of the unit base 11. Each mounting hole 64H is, for example, a bottomed hole that opens on the surface of the flange portion 64 in the Z2 direction and is, for example, a screw hole for mounting the liquid jet head 1 to the unit base 11 using screws or the like. The flange portion 64 and the unit base 11 are secured by inserting screws or the like (not shown) through the mounting holes 101 and the mounting holes 64H in this order and threading them together. As a result, the liquid jet head 1 is secured to the unit base 11.

[0186] 1-3F. Wiring board 7, relay board 70, and connector 71

[0187] like Figure 4 As shown, the wiring substrate 7 is provided for each head module 2. The wiring substrate 7 is inserted into the through hole 20H of the chip 20 and the through hole 25H of the flow channel opening forming component 25. The wiring substrate 7 is bonded to the vibration plate 204. The wiring substrate 7 protrudes from the vibration plate 204 in the Z2 direction. The wiring substrate 7 is a mounting component formed with a plurality of wirings for electrically connecting the chip 20 and the relay substrate 70. The wiring substrate 7 is, for example, a flexible substrate such as an FPC (Flexible Printed Circuit) and a COF (Chip On Film) or a rigid substrate. A driving signal and a reference voltage for driving the driving element E are supplied from the wiring substrate 7 to each driving element E.

[0188] The relay substrate 70 is fixed to the bottom surface of the recessed portion 610 in the Z1-direction surface 605 of the flat plate portion 61 of the bracket 6. The relay substrate 70 is flat and is fixed to the bracket 6 by adhesive or the like. The relay substrate 70 is electrically connected to the control unit 91. A plurality of connectors 71 are mounted on the relay substrate 70. The plurality of connectors 71 are arranged one-to-one with the plurality of wiring substrates 7. The ends of the wiring substrates 7, which are provided with a plurality of terminals, are inserted into each connector 71 in a detachable manner. In other words, the wiring substrate 7 is preferably a rigid body in order to facilitate insertion and removal of the ends of the wiring substrate 7 relative to the connectors 71. When the wiring substrate 7 is formed using a flexible substrate, it is desirable to attach a rigid body to support the flexible substrate. By inserting the ends of the wiring substrate 7 into the connectors 71, the wiring substrate 7 is electrically connected to the control unit 91 via the relay substrate 70.

[0189] The relay substrate 70 is electrically connected to the multiple head modules 2. The relay substrate 70 is arranged in the Z2 direction, which is opposite to the Z1 direction, relative to the multiple head modules 2, and overlaps the multiple head modules 2 when viewed along the Z1 direction. Furthermore, the first positioning portion 502 is provided on the surface of the support member 5 facing the Z2 direction. Therefore, it is relatively easy to assemble and disassemble only the subunit 15 to be replaced from below the bracket 6 and the relay substrate 70. Consequently, there is no need to disconnect the electrical connections of subunits 15 other than the subunit to be replaced, simplifying the assembly and disassembly process.

[0190] As described above, when only the subunit 15 to be replaced is mounted on the bracket 6 from below, the wiring substrate 7 moves in the Z2 direction from below the connector 71 toward the connector 71. Then, the wiring substrate 7 is inserted into the connector 71. This establishes an electrical connection between the wiring substrate 7 and the relay substrate 70.

[0191] 1-3G. Bushing

[0192] like Figure 4 As shown, bushings 521 are provided between the plurality of support members 5. The bushings 521 are embedded in the gaps formed between the adjacent support members 5. For example, when viewed along the Z1 direction, the bushings 521 are elongated along the Y axis between the adjacent support members 5. Figure 5 As shown, bushings 522 are arranged between the bracket 6 and the support member 5. Specifically, the bushings 522 are arranged between both ends of the support member 5 in the longitudinal direction and the bracket 6. The bushings 521 and 522 are made of, for example, an elastic resin material.

[0193] Providing the bushings 521 and 522 can reduce the possibility that ink mist or the like may intrude from the outside of the liquid ejecting head 1 into the storage space within the recess 610 of the holder 6 .

[0194] 2. Modification

[0195] The first embodiment illustrated above can be modified in various ways. Specific modifications applicable to the first embodiment described above are exemplified below. Two or more methods arbitrarily selected from the following examples can be appropriately combined within a range that does not contradict each other.

[0196] 2-1. First Modification

[0197] Figure 15 as well as Figure 16 Each is a cross-sectional view of a portion of the liquid jet head 1 according to the first modification. Figure 17 1 is a top view of a liquid ejecting head 1 according to a first modification.

[0198] exist Figure 15 In the first modified example shown, a bushing 523 is provided. Although not shown in detail, the bushing 523 has a rectangular frame shape extending along the outer periphery of the support member 5 when viewed in the Z1 direction. This prevents the intrusion of ink mist, etc., into the space within the recess 610 of the bracket 6. Furthermore, multiple bushings 523 may be integrally formed or shared by multiple support members 5.

[0199] like Figure 16 As shown, in the first variant, the support member 5 and the head module 2 are shaped by adhesives 531 and 532. The adhesive 531 shapes the space between the flow channel opening forming member 25 and the support member 5. In addition, the adhesive 531 overlaps with the sealing member 4 when viewed along the Z1 direction. The adhesive 532 shapes the space between the chip 20 and the support member 5. Although not shown in detail, the adhesive 531 is arranged in a quadrilateral frame shape surrounding the opening 5H when viewed along the Z1 direction. The adhesive 532 is arranged along the inner peripheral wall of the opening 5H. In this way, it is possible to prevent the mist of ink and the like from intruding into the space within the recess 610 of the bracket 6.

[0200] The bracket 6 of the liquid jet head 1 of the first modified example includes a first component 691 and a second component 692. The first component 691 and the second component 692 are constructed in a separate manner. The first component 691 corresponds to the upper portion of the bracket 6 of the first embodiment described above. Therefore, the first component 691 is composed of a flat plate portion 61 and a portion of the side wall portion 62. In addition, the second component 692 is equivalent to the lower portion of the bracket 6 of the first embodiment described above. The second component 692 is composed of a portion of the side wall portion 62 and a plurality of partition wall portions 63.

[0201] The first component 691 is provided with a plurality of fixing holes 611H and 612H. The second component 692 is provided with a plurality of fixing holes 613 and a fixing hole 614H. The plurality of fixing holes 613 correspond one-to-one with the plurality of fixing holes 611H and overlap with the plurality of fixing holes 611H when viewed in the Z1 direction. The fixing holes 611H and 612H are holes that penetrate the first component 691 in the thickness direction. The fixing hole 611H does not overlap with the recess 610 when viewed in the Z1 direction. The fixing hole 612H overlaps with the recess 610 when viewed in the Z1 direction. Furthermore, the fixing hole 614H penetrates the second component 692 in the thickness direction. The fixing hole 614H does not overlap with the recess 610 when viewed in the Z1 direction. The fixing hole 614H is provided for each support component 5. The fixing hole 613 is a bottomed hole that opens on the surface of the second component 692 facing the Z2 direction.

[0202] Furthermore, in the first modified example, a fixing hole 321 is provided in the supply channel component 3. The fixing hole 321 is a bottomed hole that opens on the surface of the supply channel component 3 facing the Z2 direction. The fixing hole 321 is provided for each fixing hole 612H and overlaps with the fixing hole 612H when viewed in the Z1 direction.

[0203] Furthermore, in the first modified example, the support member 5 is provided with a fixing hole 504. The fixing hole 504 is a bottomed hole that opens on the surface 512 of the support member 5 facing the Z2 direction. The fixing hole 504 is provided for each fixing hole 614H and overlaps with the fixing hole 614H when viewed in the Z1 direction.

[0204] Furthermore, the liquid ejecting head 1 of the first modified example includes a fixing member group 150 . The fixing member group 150 includes a plurality of fixing members 152 , 153 , and 154 .

[0205] The fixing member 152 is inserted through the fixing hole 611H and the fixing hole 613 in this order. The fixing member 152 secures the first member 691 and the second member 692 to each other. The fixing member 153 is inserted through the fixing hole 612H and the fixing hole 321 in this order. The fixing member 153 secures the first member 691 and the supply flow path member 3 to each other. The fixing member 154 is inserted through the fixing hole 614H and the fixing hole 504 in this order. The fixing member 154 secures the second member 692 and the support member 5 to each other.

[0206] like Figure 17 As shown, multiple fixing members 152 are provided near corners of the bracket 6, which is a quadrangular shape when viewed in the Z1 direction, for example. Multiple fixing members 153 are provided near corners of the bracket 6, which is a quadrangular shape when viewed in the Z1 direction, for example. Fixing members 154 are provided for each support member 5.

[0207] The fixing member assembly 150 secures the support member 5 to the bracket 6, thereby indirectly securing the multiple head modules 2 to the bracket 6. Furthermore, the provision of multiple fixing members 153 ensures that the supply channel member 3 is not bonded to the bracket 6 but is removably secured. This allows replacement of the supply channel member 3 in addition to the subunit 15.

[0208] The fixing members 152 , 153 , and 154 are, for example, screws, but may also be the aforementioned L-shaped pins or T-shaped pins.

[0209] Fixed member 152 is longer than fixed member 154, and preferably has external threads of the same profile and pitch as fixed member 154. First, by removing fixed member 152 from fixing hole 613, first member 691 is removed from second member 692. Next, by removing fixed member 154 from fixing hole 504 and then engaging fixed member 152, which is longer than fixed member 154, with fixing hole 504, support member 5 can be moved relative to second member 692 in the Z1 direction. Therefore, the pressed-in state of first positioning portion 502 and second positioning portion 602 can be easily released.

[0210] 2-2. Second Modification

[0211] Figure 18 as well as Figure 19 Each is a cross-sectional view of a portion of the liquid jet head 1 according to the second modification. Figure 18 as well as Figure 19 The liquid jet head 1 according to the second modified example includes a cover 85 . The cover 85 is fixed to the flange portion 64 of the holder 6 .

[0212] The cover 85 is provided commonly for the multiple support members 5 and covers the portions of the multiple support members 5 except for the openings 5H. The cover 85 is a plate-shaped member, for example, made of metal. The cover 85 is positioned relative to the multiple support members 5 in the Z1 direction and in contact with the multiple support members 5. The cover 85 has multiple openings 85H. The multiple openings 85H are provided in a one-to-one correspondence with the nozzle surfaces SN of the multiple head modules 2, exposing the nozzle surfaces SN.

[0213] Furthermore, the cover 85 covers the side wall surfaces of the plurality of support members 5. Furthermore, a portion of the cover 85 has a flange 851 that contacts the surface of the flange portion 64 facing the Z2 direction. A through hole is formed on the flange 851 for inserting the mounting screw 156. In addition, a screw hole 643 is formed on the flange portion 64 that overlaps with the through hole when viewed from the Z1 direction. The screw hole 643 is a bottomed hole that opens on the surface of the flange portion 64 facing the Z1 direction. The cover 85 is fixed to the flange portion 64 by inserting the mounting screw 156 into the screw hole 643 for threaded fastening while the cover 85 is in contact with the plurality of support members 5.

[0214] By providing the cover 85 , it is possible to suppress the intrusion of the ink mist into the recess 610 of the holder 6 .

[0215] 2-3. Third Modification

[0216] Figure 20 as well as Figure 21 Each of them is a cross-sectional view of a portion of the liquid jet head 1 according to the third modified example. Figure 22 3 is a diagram showing a second member 692 included in a holder 6 according to a third modification. Hereinafter, the parts different from the first modification will be mainly described.

[0217] exist Figure 20 In the third modified example shown, a bushing 524 is provided. Although not shown in detail, the bushing 524 has a rectangular frame shape surrounding the opening 5H of the support member 5 when viewed from the Z1 direction. This prevents ink mist and the like from entering the space within the recess 610 of the holder 6.

[0218] like Figure 21 as well as Figure 22 As shown in FIG. 1 , the flow channel opening forming member 25 of the third modified example has a flange 209. The flange 209 is provided in the Y1 direction and the Y2 direction of the chip 20 when viewed along the Z1 direction. Figure 21 As shown, a fixing hole 211H is provided on the flange 209. Furthermore, a fixing hole 505 corresponding to the fixing hole 211H is provided on the support member 5. The fixing hole 505 is a bottomed hole that opens on the surface of the support member 5 facing the Z2 direction. The fixing hole 505 is provided corresponding to the fixing hole 211H and overlaps with the fixing hole 211H when viewed along the Z1 direction.

[0219] Furthermore, the fixing member assembly 150 of the third modified example includes a plurality of fixing members 155, 152, and 154. Fixing member 155 is inserted through fixing hole 211H and fixing hole 505 in this order. Fixing member 155 secures flow path opening forming member 25 and support member 5 to each other. Fixing member 155 is provided for each support member 5.

[0220] The fixing component group 150 fixes the support component 5 relative to the bracket 6, and fixes the head module 2 to the support component 5, thereby indirectly fixing the multiple head modules 2 to the bracket 6. In addition, by providing a plurality of fixing components 155, the head module 2 is fixed relative to the support component 5 without using adhesives or the like. Therefore, it is relatively easy to assemble and disassemble the head module 2 relative to the support component 5. In particular, by making the fixing components 155 into screws, it is particularly easy to assemble and disassemble the head module 2 relative to the support component 5. In addition, the fixing components 155 may also be, for example, T-shaped or L-shaped pins. In addition, by using the fixing components 155 to fix the head module 2 relative to the support component 5, it is possible to suppress the alignment deviation of the multiple head modules 2 from each other compared to the case where the fixation is performed using adhesives.

[0221] Furthermore, the bushing 524, support member 5, head module 2, and seal member 4 described above overlap when viewed in the Z1 direction. Therefore, the possibility of deformation of the flange 209 due to the reaction force of the seal member 4 is reduced compared to a case where these components do not overlap.

[0222] 2-5. Fifth Modification

[0223] Figure 23 FIG. 1 is a cross-sectional view of a portion of the liquid ejecting head 1 according to the fifth modified example. Figure 23 In the liquid ejecting head 1 of the fifth modified example shown, the first positioning portion 502a is a pin protruding in the Z2 direction from the surface of the support member 5 facing the Z2 direction. The second positioning portion 602a is a bottomed hole open in the Z1 direction of the bracket 6. The second positioning portion 602a is also a recessed portion, or depression, formed in the Z2 direction of the bracket 6. The second positioning portion 602a is pressed into the first positioning portion 502a, thereby positioning the support member 5 relative to the bracket 6.

[0224] Even with the first positioning portion 502a and the second positioning portion 602a, positioning of the support member 5 when mounted on the bracket 6 can be easily performed, as in the first embodiment. Furthermore, alignment of the plurality of support members 5 relative to the bracket 6 can be performed with high precision. Therefore, alignment of the plurality of head modules 2 relative to the bracket 6 can be performed with high precision. Furthermore, when only a few of the plurality of head modules 2 are replaced, there is no need to re-align all of the head modules 2.

[0225] As described in the first embodiment and the fifth modification, the plurality of head modules 2 can be aligned with each other with high precision by a simple method of pressing one of the second positioning portion 602 and the first positioning portion 502 into the other.

[0226] Furthermore, the fourth positioning portion 642a is a bottomed hole that opens in the Z2 direction of the flange portion 64. The fourth positioning portion 642a is also a recessed portion, i.e., a depression, formed in the Z1 direction of the flange portion 64. Although not shown, in this case, the third positioning portion 102 is formed by a protrusion provided on the unit base 11. The fourth positioning portion 642a is pressed into the third positioning portion 102, thereby enabling the liquid ejecting head 1 to be positioned relative to the unit base 11. Therefore, the alignment accuracy of the plurality of liquid ejecting heads 1 relative to each other can be improved with the unit base 11 as a reference.

[0227] 2-6. Sixth Modification

[0228] Figure 24 4 is a cross-sectional view showing a sealing member 4 and its vicinity according to a sixth modification. Figure 25 It is a cross-sectional view of a portion of the liquid jet head 1 according to the sixth modification. Figure 24 The sealing member 4 of the sixth modification shown does not have a constant thickness. The sealing member 4 of the sixth modification includes a thick portion 41 and a thin portion 42. The thick portion 41 is located near the inner wall surface forming the communication port 4H and is thicker than the thin portion 42. The thin portion 42 is located outside the thick portion 41.

[0229] In the sixth modification, the thick portion 41 of the sealing member 4 has a sealing area 4S. The thick portion 41 contacts the flow channel opening forming member 25 and the supply flow channel member 3 and is sandwiched between them.

[0230] like Figure 25 As shown, the fixing member 151 for securing the head module 2 and the supply flow path member 3 is arranged so that it does not overlap with the chip 20 when viewed in the Z1 direction and that the sealing region 4S is sandwiched between the chip 20. Furthermore, the support region 5S includes a region S55 positioned between the sealing region 4S and the chip 20 when viewed in the Z1 direction. Therefore, compared to a case where the support region 5S does not include the region S55, the impact of the reaction force of the sealing member 4 on the chip 20 can be reduced.

[0231] 2-7. Seventh Modification

[0232] Figure 26 4 is a cross-sectional view showing a seal member 4 and its vicinity according to a seventh modification. Figure 26 The sealing member 4 of the seventh modified example shown includes a portion that does not contact both the supply flow channel member 3 and the flow channel opening forming member 25. The vicinity of the communication opening 4H of the sealing member 4 of the seventh modified example constitutes a sealing region 4S. Thus, depending on the shapes of the supply flow channel member 3 and the flow channel opening forming member 25, the sealing member 4 may also include a portion that is not held between the supply flow channel member 3 and the flow channel opening forming member 25 while not in contact with both. The portion of the sealing member 4 held between the supply flow channel member 3 and the flow channel opening forming member 25 corresponds to the sealing region 4S.

[0233] 2-8. Eighth Modification

[0234] Figure 27 FIG. 1 is a top view of a supporting member according to an eighth modification. Figure 27In the eighth modified example shown, one support member 5a is used to hold multiple head modules 2. In this way, one support member 5a may not hold one head module 2. In this case, one support member 5a has multiple openings 5H corresponding to multiple head modules 2. In this case, the reference for positioning the multiple head modules 2 is the support member 5a. In the example shown in the figure, one support member 5a supports three head modules 2. That is, the support member 5a is provided for every three head modules 2. Two first positioning portions 502 are provided for each support member 5a. Therefore, the two first positioning portions 502 are shared by the three head modules 2. The reference for positioning the three head modules 2 is the support member 5a. Two fixing holes 501 are also provided for each support member 5a. Therefore, the two fixing holes 501 are shared by the three head modules 2.

[0235] In the eighth variation, a single support member 5a holds multiple head modules 2. In other words, a single support member 5a holds two or more head modules 2. For example, a single support member 5a can hold two or more head modules 2 that are replaced at the same time. This allows for simultaneous replacement of two or more head modules 2 that are replaced at the same time, making replacement easier.

[0236] In the eighth modification, for example, it is preferred that the support member 5a holds a plurality of head modules 2 that eject the same type of liquid among the plurality of head modules 2. Thus, it is possible to collectively replace head modules 2 with similar lifespans, for example, head modules 2 that eject liquids of a type with a higher ejection frequency (e.g., black ink, white ink, a pre-treatment liquid such as a reaction liquid that agglomerates the pigment contained in the ink, or a post-treatment liquid such as a protective liquid). Therefore, the operability during replacement is improved. In addition, the two or more head modules 2 held by one support member 5a do not have to eject the same type of ink. In addition, one head module 2 can be configured to eject one type of ink or to eject two or more types of ink.

[0237] 3. Second Implementation

[0238] In the following embodiments, elements having the same functions or effects as those of the first embodiment are denoted by the same reference numerals as those used in the first embodiment, and detailed descriptions thereof are omitted as appropriate.

[0239] 3-1. Liquid Ejecting Head 1A

[0240] Figure 28 This is a cross-sectional view of the liquid ejecting head 1A according to the second embodiment as viewed in the direction along the Y axis. Figure 29This is a cross-sectional view of the liquid jet head 1A according to the second embodiment as viewed in the direction along the X-axis.

[0241] like Figure 28 as well as Figure 29 As shown, the liquid ejecting head 1A includes a plurality of head modules 2A, a sealing member 4 , a supporting member 5A, a holder 6A, a plurality of wiring substrates 7 , a relay substrate 70 , and a fixing member group 150A.

[0242] In the second embodiment, the two supply flow path components 3 of the first embodiment are not provided. Instead, the bracket 6A performs the functions of the supply flow path components 3 of the first embodiment, namely, the function of a common flow path component. In other words, the bracket 6A is an example of a "supply flow path component." Furthermore, a single support component 5A holds multiple head modules 2A. Furthermore, in the second embodiment, the head modules 2A and support component 5A are not fixed to the bracket 6A using adhesive, but are freely attachable to and detachable from the bracket 6A.

[0243] 3-1A. Head module 2A

[0244] In the second embodiment, a plurality of head modules 2A are provided similarly to the first embodiment. Each head module 2A of the second embodiment includes a chip 20 and a flow path opening forming member 25A.

[0245] Figure 30 for Figure 28 The bottom view of the liquid ejecting head 1A is shown. Figure 30 As shown, each head module 2A has a plurality of nozzles N for ejecting ink, similarly to the first embodiment. In addition, each nozzle N is exposed from an opening 5H provided in a support member 5A described later.

[0246] Figure 31 for Figure 28 FIG. 2 is a top view of a flow channel opening forming member 25A included in the head module 2A. Figure 31 As shown, in this embodiment, as in the first embodiment, the planar shape of the flow path opening forming member 25A is larger than the planar shape of the chip 20. That is, the chip 20 is smaller than the flow path opening forming member 25A when viewed along the Z1 direction.

[0247] like Figure 29 as well as Figure 31As shown, the flow channel opening forming member 25A of this embodiment has a flange portion 250 for fixing to the support member 5A, similarly to the first embodiment. Moreover, the surface of the flange portion 250 facing the Z1 direction is a supported surface 2511 supported by the support member 5A. The planar shape of the flange portion 250 and the planar shape of the supported surface 2511 are respectively a quadrangular frame shape surrounding the opening 5H. In addition, the flow channel opening forming member 25A of this embodiment has a flow channel 25R inside, similarly to the first embodiment. The open end of the flow channel 25R in the Z1 direction is each flow channel opening 251H.

[0248] like Figure 29 as well as Figure 31 As shown, each flow channel opening forming member 25 is provided with two fixing holes 215 and two first positioning portions 216. The head module 2A, including the flow channel opening forming member 25A, can be freely attached to and detached from the bracket 6A. The first positioning portions 216 are used to position the head module 2A relative to the bracket 6A. The fixing holes 215 are used to secure the head module 2A relative to the bracket 6A.

[0249] Each first positioning portion 216 is provided on the surface 252 of the flow channel opening forming member 25A facing the Z2 direction. This surface 252 is also the surface of the head module 2A facing the Z2 direction. In this embodiment, each first positioning portion 216 is a protrusion that protrudes in the Z2 direction from the surface 252 of the flow channel opening forming member 25A facing the Z2 direction. The two first positioning portions 216 are provided on both sides of the opening 5H of the support member 5A in the longitudinal direction of the flow channel opening forming member 25A. One of the two first positioning portions 216 is located in the Y1 direction relative to the opening 5H, and the other is located in the Y2 direction relative to the opening 5H.

[0250] Each fixing hole 215 is provided on the surface 252 of the flow channel opening forming part 25A facing the Z2 direction. Each fixing hole 215 is a bottomed hole that opens on the surface 252 of the flow channel opening forming part 25A facing the Z2 direction. Each fixing hole 215 is a recessed portion provided on the surface 252 of the flow channel opening forming part 25A facing the Z2 direction, and can also be understood as a depression formed on the surface 252. The two fixing holes 215 are provided on both sides of the through hole 25H in the longitudinal direction of the flow channel opening forming part 25A and on both sides of the opening 5H of the support part 5A. One of the two fixing holes 215 is located in the Y1 direction relative to the opening 5H, and the other is located in the Y2 direction relative to the opening 5H.

[0251] Each fixing hole 215 located in the Y1 direction relative to the opening 5H is closer to the opening 5H than the first positioning portion 216 located in the Y1 direction relative to the opening 5H. Similarly, each fixing hole 215 located in the Y2 direction relative to the opening 5H is closer to the opening 5H than the first positioning portion 216 located in the Y2 direction relative to the opening 5H. The first positioning portion 216 and the fixing hole 215 do not overlap with the opening 5H when viewed along the Z1 direction. Furthermore, the two flow channel openings 251H, the fixing hole 215, and the first positioning portion 216 are located farther away from the opening 5H in this order. Of these components, the two flow channel openings 251H are closest to the opening 5H.

[0252] Furthermore, while the shortest distance between the fixing hole 215 and the opening 5H is shorter than the shortest distance between the first positioning portion 216 and the opening 5H, it can also be longer. Furthermore, while the first positioning portion 216, the fixing hole 215, and the opening 5H are arranged along the length of the support member 5A, they do not necessarily need to be arranged along the length of the support member 5A. For example, the first positioning portion 216 can be provided on both sides of the opening 5H along the X-axis.

[0253] 3-1B. Bracket 6A

[0254] Figure 28 as well as Figure 29 The illustrated holder 6A has a common flow path for holding and housing the plurality of head modules 2A and for supplying and distributing ink to the plurality of head modules 2A. The holder 6A is common to the plurality of head modules 2A.

[0255] like Figure 29 As shown, the bracket 6A has a flow channel 6R. The flow channel 6R supplies ink to each head module 2A and distributes the ink to each head module 2A. The flow channel 6R is a common flow channel common to multiple head modules 2A. Therefore, the bracket 6A has a supply flow channel component having the flow channel 6R as a common flow channel. The flow channel 6R is a common flow channel common to multiple head modules 2, and has a common portion 6RA extending along the X-axis, and a plurality of branch portions 6RB branching from the common portion 6RA and extending in the Z1 direction. Although not shown in the figure, a flow channel joint for connecting to the supply flow channel outside the liquid injection head 1 is provided on the bracket 6A in order to communicate with the liquid storage portion 9. The unshown flow channel joint is exposed to the outside of the liquid injection head 1, for example, via an unshown opening formed on the bracket 6A.

[0256] The holder 6A may include multiple flow channels 6R communicating with multiple head modules 2. In other words, the flow channels 6R may have multiple flow channels 6R communicating with multiple head modules 2, instead of having a common portion 6RA communicating with multiple head modules 2.

[0257] A flow channel opening 650H is provided on the head module 2A side, i.e., downstream, of the flow channel 6R. The flow channel opening 650H is the open end of the flow channel 6R in the Z1 direction. The flow channel opening 650H is provided to correspond to the flow channel opening 251H of the head module 2A. The flow channel opening 650H is used to connect the flow channel 25R of the head module 2A to the flow channel 6R of the bracket 6A.

[0258] Figure 32 To express Figure 28 A bottom view of the bracket 6A and the relay substrate 70 is shown. Figure 33 for Figure 28 A top view of the bracket 6A is shown. Figure 29 as well as Figure 32 As shown, the recess 610A of the bracket 6A includes a first recess 611 and a second recess 612. Figure 29 As shown, a second recess 612 is formed on the bottom surface of the first recess 611. The opening area of the second recess 612 is smaller than that of the first recess 611. Therefore, the recess 610A has a stepped surface. Furthermore, a relay substrate 70 is disposed on the bottom surface of the recess 610A, specifically, the bottom surface of the second recess 612.

[0259] like Figure 29 As shown, the bracket 6A has two fixing holes 651H, two fixing holes 652H, and two second positioning portions 653. Each fixing hole 651H is used to fix the bracket 6A to the head module 2A. Each fixing hole 652H is used to fix the bracket 6A to the support member 5A. Each second positioning portion 653 is used to position the head module 2A relative to the bracket 6A.

[0260] Each fixing hole 651H is a hole that passes through the bracket 6A in the Z1 direction. Two fixing holes 651H are provided for each head module 2A. Each fixing hole 651H is provided in the Y1 direction or the Y2 direction relative to the second recess 612 when viewed along the Z1 direction. The two fixing holes 651H are provided corresponding to the two fixing holes 215 described above, and overlap with the two fixing holes 215 when viewed along the Z1 direction. Each fixing hole 651H does not overlap with the chip 20 when viewed along the Z1 direction, but overlaps with the flow channel opening forming component 25A. The open end of each fixing hole 651H in the Z1 direction opens on the bottom surface of the first recess 611 when viewed along the Z1 direction.

[0261] Each fixing hole 652H is a hole that penetrates the bracket 6A in the Z1 direction. For example, the plurality of fixing holes 652H may be four fixing holes 652H, each of which is located at the four corners of the quadrilateral bracket 6A when viewed in the Z1 direction. Each fixing hole 652H is provided to correspond to the fixing hole 503 of the support member 5A and overlaps with the fixing hole 503 when viewed in the Z1 direction.

[0262] Each second positioning portion 653 is provided on the surface 605 of the bracket 6A facing the Z1 direction. Two second positioning portions 653 are provided for each head module 2A. In this embodiment, each second positioning portion 653 is a bottomed hole that opens upward on the surface 605 of the bracket 6A facing the Z1 direction, specifically, on the bottom surface of the first recess 611. In other words, each second positioning portion 653 is a recess formed on the bottom surface of the first recess 611. Each second positioning portion 653 is provided in the Y1 direction or the Y2 direction relative to the second recess 612 when viewed along the Z1 direction. In addition, the two second positioning portions 653 are provided corresponding to the two first positioning portions 216 described above, and overlap with the two first positioning portions 216 when viewed along the Z1 direction. Therefore, the plurality of second positioning portions 653 are provided in a one-to-one correspondence with the plurality of first positioning portions 216.

[0263] When viewed along the Z1 direction, among the fixing hole 651H, the second positioning portion 653, and the fixing hole 652H, the fixing hole 651H is closest to the opening 5H, and the fixing hole 652H is furthest away from the opening 5H. Furthermore, the distances between the fixing hole 651H, the second positioning portion 653, and the fixing hole 652H and the opening 5H may be the same or different.

[0264] 3-1C. Sealing component 4

[0265] like Figure 28 as well as Figure 29 As shown, the seal member 4 is provided between each head module 2A and the holder 6A in the Z1 direction. The seal member 4 is compressed by the head module 2A and the holder 6A.

[0266] Figure 34 for Figure 28 FIG2 is a top view of the sealing member 4 shown in FIG2 . As in the first embodiment, in this embodiment, two sealing members 4 are provided for each head module 2A. The two sealing members 4 overlap with the flange portion 250 of the flow channel opening forming member 25A. Furthermore, the sealing member 4 is provided at a position different from that of the chip 20 when viewed along the Z1 direction. In other words, the sealing member 4 does not overlap with the chip 20 when viewed along the Z1 direction.

[0267] The communication opening 4H of each sealing member 4 is provided to correspond to a flow channel opening 251H in the flow channel opening forming member 25A and a flow channel opening 650H in the bracket 6A. When viewed along the Z1 direction, the communication opening 4H overlaps with both the flow channel opening 650H and the flow channel opening 251H. By squeezing the sealing member 4 between the flow channel opening forming member 25A and the bracket 6A, the flow channel 25R and the flow channel 6R communicate via the communication opening 4H. The sealing member 4 provides a liquid-tight connection between the flow channel opening 251H of the head module 2A and the flow channel opening 650H of the bracket 6A.

[0268] like Figure 33 As shown, in this embodiment, similar to the first embodiment, the sealing member 4 has a sealing area 4S. The entire area of the sealing member 4 corresponds to the sealing area 4S. The sealing area 4S contacts both the flow channel opening forming member 25A and the bracket 6A and is the area of the sealing member 4 sandwiched between the flow channel opening forming member 25A and the bracket 6A. The sealing area 4S is intended to connect the flow channel opening 251H and the flow channel opening 650H to each other in a liquid-tight manner, thereby receiving load from the flow channel opening forming member 25A and the bracket 6A.

[0269] As in the first embodiment, in this embodiment, the sealing member 4 is provided at a position different from the chip 20 when viewed along the Z1 direction. Therefore, the sealing region 4S is provided at a position different from the chip 20 when viewed along the Z1 direction. That is, the sealing region 4S does not overlap with the chip 20 when viewed along the Z1 direction. This provides the same advantages as in the first embodiment.

[0270] In addition, in this embodiment, for example, Figure 34 The head module 2A located on the far left in the figure is set as the "first head module 2a". The head module 2A on the adjacent right side of the first head module 2a is set as the "second head module 2b". In this case, the sealing component 4 corresponding to the first head module 2a is the "first sealing component 4a", and the sealing component 4 corresponding to the second head module 2b is the "second sealing component 4b". The first sealing component 4a is clamped between the first head module 2a and the bracket 6A, thereby connecting the first flow channel opening 251Ha of the first head module 2a and the corresponding flow channel opening 650H in a liquid-tight manner. Similarly, the second sealing component 4b is clamped between the second head module 2b and the bracket 6A, thereby connecting the second flow channel opening 251Hb of the second head module 2b and the corresponding flow channel opening 650H in a liquid-tight manner. The first head module 2a and the second head module 2b respectively eject ink supplied from the bracket 6A having a supply flow channel component.

[0271] Furthermore, the communication port 4H, the flow channel opening 251H, and the flow channel opening 650H do not overlap with the chip 20 when viewed along the Z1 direction. The communication port 4H, the flow channel opening 251H, and the flow channel opening 650H are each located outside the chip 20 when viewed along the Z1 direction. Therefore, as described above, the sealing region 4S of the sealing member 4 that fluid-tightly seals the flow channels 25R and 6R can be located outside the chip 20. Consequently, the same effects as those of the first embodiment can be achieved.

[0272] Furthermore, when viewed in the Z1 direction, the sealing region 4S is arranged in the Y1 direction or the Y2 direction, which is the longitudinal direction of the head module 2A, relative to the chip 20. Therefore, the same effects as those of the first embodiment can be achieved.

[0273] 3-1D. Supporting member 5

[0274] Figure 28 as well as Figure 29 The support member 5A shown is a member that supports the multiple head modules 2A. The support member 5A is shared by the multiple head modules 2A, but can also be provided separately for each head module 2A. The support member 5A is a long, flat member along the Y axis, with its thickness along the Z axis. The support member 5A is arranged in the Z1 direction relative to the multiple flow channel opening forming members 25A. The support member 5A is a member that does not have a flow channel for the circulation of ink. In addition, the support member 5A is fixed to the bracket 6A in a removable manner.

[0275] Figure 35 for Figure 28 The top view of the support member 5A is shown. Figure 29 as well as Figure 35 As shown, the support member 5A includes a plurality of support areas 5S. Figure 35 In order to facilitate understanding, the support area 5S is marked with a mesh shadow, and the area S50 is marked with a dot. Figure 29 As shown, the support area 5S contacts the supported surface 2511 of the flow channel opening forming member 25A. Figure 35 As shown in FIG. 1 , the support region 5S includes a region S50 that overlaps with the sealing region 4S when viewed in the Z1 direction.

[0276] Furthermore, similar to the first embodiment, the supported surface 2511 of the flow path opening forming member 25A, when viewed along the Z1 direction, surrounds the opening 5H of the support member 5A and is supported by the support member 5A. Specifically, the supported surface 2511 contacts the support region 5S of the support member 5A, thereby holding the head module 2A by the support member 5A. This achieves the same effects as the first embodiment.

[0277] Furthermore, similarly to the first embodiment, in this embodiment, the thickness D5 of the support member 5A in the Z1 direction is also thicker than the thickness D2 of the chip 20 in the Z1 direction. This can provide the same effects as the first embodiment.

[0278] In addition, the relationship between the thickness D5 and the thickness D2 and the specific numerical value of the thickness D5 are the same as those in the first embodiment.

[0279] In addition, similarly to the first embodiment, in this embodiment, Figure 29 As shown, in the opening 5H of the support member 5A, a part of the flow path opening forming member 25A is also arranged in addition to the chip 20. This can produce the same effects as the first embodiment.

[0280] Furthermore, similarly to the first embodiment, in this embodiment, the nozzle surface SN of the chip 20 and the surface 511 of the support member 5A facing the Z1 direction are also substantially flush with each other.

[0281] In addition, if Figure 29 as well as Figure 35 As shown, the support member 5A has a plurality of fixing holes 503. Each fixing hole 503 is used to fix the support member 5A relative to the bracket 6A. Figure 29 As shown, each fixing hole 503 is provided on the surface 512 of the support member 5A facing the Z2 direction. Each fixing hole 503 is a bottomed hole provided on the surface 512 of the support member 5A facing the Z2 direction. Furthermore, each fixing hole 503 is a recessed portion provided on the surface 512 of the support member 5A facing the Z2 direction, and can also be understood as a depression formed on the surface 512.

[0282] The support member 5A, the bracket 6A described above, and the plurality of head modules 2A are detachable from each other. The support member 5A can be removed from the bracket 6A, and each head module 2 can be removed individually from the bracket 6A. In addition, when each head module 2A is removed from the bracket 6A, the wiring substrate 7 mounted on each head module 2A is removed from the connector 71. In this way, each head module 2A can be removed individually from the bracket 6A. Therefore, by replacing each head module 2A, the liquid ejecting head 1 can be regenerated.

[0283] The first positioning portions 216 of the flow path opening forming member 25A described above are pressed into the second positioning portions 653 described above, thereby positioning the head module 2A relative to the holder 6A. Furthermore, the first positioning portions 216 and the second positioning portions 653 are provided per holder 6A, that is, per head module 2A held by the support member 5A.

[0284] The provision of the first positioning portion 216 and the second positioning portion 653 described above facilitates positioning of the head module 2A when mounted on the bracket 6A. Furthermore, by providing a first positioning portion 216 and a second positioning portion 653 for each head module 2A, multiple head modules 2A can be aligned with each other with high precision. Therefore, when replacing only a few of the multiple head modules 2A, it is not necessary to re-align all the head modules 2A.

[0285] Furthermore, the multiple head modules 2A can be aligned with each other with high precision by simply pressing the first positioning portion 216 into the second positioning portion 653. Therefore, a desired head module 2A among the multiple head modules 2A can be easily replaced. Consequently, repair of the liquid ejecting head 1A is relatively easy.

[0286] Furthermore, by providing the positioning portion in the head module 2A, the support member 5A can be formed of a single member common to the plurality of head modules 2A, unlike the first embodiment.

[0287] Furthermore, as described above, the flow channel opening 650H corresponds to the flow channel opening 251H. Specifically, the flow channel opening 650H and the flow channel opening 251H overlap when viewed in the direction in which one of the first positioning portion 216 and the second positioning portion 653 is pressed into the other, that is, in the direction along the Z axis. That is, the direction in which the flow channel opening 650H overlaps with the flow channel opening 251H is the same as the direction in which the second positioning portion 653 is pressed into the first positioning portion 216. Therefore, in the installation of the head module 2A relative to the bracket 6A, the flow channel connection between the flow channel 6R and the flow channel 25R can be easily and accurately implemented. That is, in the positioning of the head module 2A on the bracket 6A, high-precision positioning of the flow channel connection can be simultaneously and easily implemented.

[0288] The second positioning portions 653 are arranged on the surface 605 of the bracket 6A facing the Z1 direction, specifically, on the bottom surface of the first recess 611. The first positioning portion 216 is arranged on the surface 252 of the support member 5A facing the Z2 direction, which is opposite to the Z1 direction.

[0289] By configuring the first positioning portion 216 and the second positioning portion 653 in this manner, it is possible to easily remove and install only the head module 2A to be replaced from below the bracket 6A. Therefore, when the head module 2A to be replaced is replaced and reinstalled on the bracket 6A, only the flow path of the replaced head module 2A needs to be connected to the bracket 6A. Therefore, it is unnecessary to connect the flow paths of head modules 2A other than the replacement head module to the bracket 6A. This simplifies the removal and installation work during repair of the liquid ejecting head 1A.

[0290] Furthermore, the relay substrate 70 is arranged in the Z2 direction relative to the multiple head modules 2A and overlaps the multiple head modules 2A when viewed from the Z1 direction. Furthermore, the first positioning portion 216 is provided on the surface 252 of the flow channel opening forming component 25A facing the Z2 direction. Therefore, it is easier to remove and assemble only the head module 2A to be replaced from below. Consequently, there is no need to disconnect the electrical connections of the head modules 2A other than the one to be replaced, simplifying the assembly and removal process.

[0291] Furthermore, the wiring substrate 7 is placed on the bottom surface of the recess 610A of the bracket 6A. Therefore, compared to placing the wiring substrate 7 on the surface 606 of the bracket 6A facing the Z2 direction, the length of the head module 2A and the wiring substrate 7 can be shortened. Furthermore, in this embodiment, as previously described, the first positioning portion 216 is a protrusion provided on the surface 252. Therefore, the first positioning portion 216 is not exposed on the nozzle surface SN side. This prevents ink mist and the like from adhering to the first positioning portion 216.

[0292] In addition, as mentioned above, the bracket 6A can be understood as having a common flow channel component having one or more flow channels 6R connected to multiple head modules 2A. The bracket 6A including the common flow channel component is arranged in the Z2 direction relative to the multiple head modules 2A, and overlaps with the multiple head modules 2A when viewed along the Z1 direction. In addition, the first positioning portion 216 is provided on the surface 252 of the flow channel opening forming component 25A facing the Z2 direction. Therefore, it is easier to disassemble and assemble the head module 2A of the replacement object from the bottom. Therefore, there is no need to release the flow channel connection between the head module 2A other than the replacement object and the bracket 6A, which simplifies the disassembly and assembly operation.

[0293] Furthermore, as previously described, the first positioning portion 216 is provided on the surface of the flow channel opening forming member 25A opposite the surface on which the chip 20 is provided, that is, on the surface 252 in the Z2 direction. Furthermore, the first positioning portion 216 does not overlap with the chip 20 when viewed in the Z1 direction. This configuration of the first positioning portion 216 prevents the load generated by the press-fitting of the second positioning portion 653 of the bracket 6A into the first positioning portion 216 from acting on the chip 20.

[0294] As previously mentioned, the bracket 6A has a first recessed portion 611, with the surface where the plurality of second positioning portions 653 are located serving as the bottom surface. Furthermore, the bottom surface of the recessed portion 610A includes the bottom surface of the first recessed portion 611 and the bottom surface of the second recessed portion 612. Furthermore, the support member 5A is fixed so as to contact the outer peripheral wall of the recessed portion 610A, that is, the surface 605 of the bracket 6A facing the Z1 direction. Furthermore, as previously mentioned, the support member 5A has a plurality of openings 5H for exposing the plurality of head modules 2A to the outside.

[0295] By providing the support member 5A, the nozzle surface SN serving as the ink ejection surface is exposed by the support member 5A, and at the same time, it is possible to suppress the intrusion of the ink mist into the recess 610A of the holder 6A.

[0296] 3-1E. Fixed component assembly 150A

[0297] like Figure 29 As shown, the fixing member set 150A includes a plurality of fixing members 155 and a plurality of fixing members 157 .

[0298] The fixing member 155 secures the bracket 6A and the support member 5A. The fixing member 155 is inserted through the through-hole fixing hole 652H and the recessed fixing hole 503 in that order. Therefore, the fixing member 155 is not exposed on the nozzle surface SN side. However, a portion of the fixing member 155 is exposed on the surface 606 of the bracket 6A facing the Z2 direction.

[0299] For example, after removing the fixing member 155 from the fixing hole 652H, a narrow, long, rod-shaped member can be inserted into the fixing hole 652H and used to press the support member 5A in the Z1 direction. This can easily release the support member 5A from being pressed against the bracket 6A. In other words, by using the fixing hole 652H as a hole for releasing the press-fit, the support member 5A from being pressed against the bracket 6A can be easily released.

[0300] The fixing component 157 directly fixes the bracket 6A and the head module 2A. The fixing component 157 is inserted through the fixing hole 651H, which is a through hole, and the recessed fixing hole 215, in this order. Therefore, the fixing component 157 is not exposed on the surface of the liquid ejecting head 1A in the Z1 direction, specifically, on the nozzle surface SN side. On the other hand, a portion of the fixing component 157 is exposed on the surface 606 of the bracket 6A facing the Z2 direction. By preventing the fixing component 157 from being exposed on the nozzle surface SN side, it is possible to prevent the ink mist from adhering to the fixing component 157 and solidifying. Therefore, it is possible to prevent the fixing component 157 from becoming difficult to remove from the bracket 6A and the head module 2A due to the adhesion of the mist.

[0301] For example, after removing the fixing member 157 from the fixing hole 651H, a narrow, long, rod-shaped member can be inserted into the fixing hole 651H and used to press the head module 2A in the Z1 direction. This can easily release the head module 2A from being pressed into the bracket 6A. In other words, by using the fixing hole 651H as a hole for releasing the press-fit, the head module 2A can be easily released from being pressed into the bracket 6A.

[0302] Furthermore, the depth D66 of the fixing hole 651H is deeper than the depth D26 of the fixing hole 215. By making the depth D66 deeper than the depth D26, it is easier to remove the flow path opening forming member 25A from the bracket 6A than when making it shallower.

[0303] In addition, if Figure 33 As shown, multiple fixing members 155 are provided near the corners of the bracket 6A, which is, for example, a quadrangular shape when viewed in the Z1 direction. Multiple fixing members 157 are provided for each head module 2A. Specifically, two fixing members 157 are provided for each head module 2A. One of the two fixing members 157 is positioned in the Y1 direction of the head module 2A when viewed in the Z1 direction, and the other is positioned in the Y2 direction of the head module 2A.

[0304] The fixing members 155 and 157 are preferably screws. For example, internal threads are formed on the walls forming the fixing holes 651H, 652H, the fixing holes 215, and the fixing holes 503. By using screws as fixing members 155 and 157, the support member 5A and the multiple head modules 2A can be easily released from the bracket 6A by rotating the screws to release the screw fastening. By using screws as fixing members 155 and 157, the multiple head modules 2A and the support member 5A can be freely attached to and detached from the bracket 6A without the use of adhesive.

[0305] In addition, each of the fixing members 155 and 157 may be a member other than a screw, and may be an L-shaped or T-shaped pin as in the first embodiment.

[0306] Furthermore, each of the fixing members 155 and 157 is arranged so as not to overlap with the chip 20 when viewed in the Z1 direction and so as to sandwich the sealing region 4S between the chip 20 .

[0307] By ensuring that the fixing members 155 and 157 do not overlap with the chip 20 when viewed in the Z1 direction, the load generated by the fixing members 155 and 157 is less likely to act on the chip 20 than when they overlap with the chip 20. Furthermore, by arranging the sealing member 4 between the fixing members 155 and 157 and the chip 20 when viewed in the Z1 direction, the distance between the chip 20 and the fixing members 155 and 157 can be increased by the amount of the sealing member 4. Therefore, the load generated by the fixing members 155 and 157 is less likely to act on the chip 20.

[0308] 3-1F.Bushing

[0309] like Figure 29 As shown, a bushing 526 is disposed between the flow channel opening forming member 25A and the support member 5A. Although not shown in detail, the bushing 526 is disposed in a rectangular frame shape extending along the outside of each flow channel opening forming member 25A when viewed in the Z1 direction. The bushing 526 is, for example, an elastic elastomer. The provision of the bushing 526 reduces the possibility of ink mist, etc., from the outer periphery of the liquid ejecting head 1A entering the storage space within the recessed portion 610A of the holder 6A.

[0310] 4. Modifications

[0311] The second embodiment illustrated above can be modified in various ways. Specific modifications applicable to the second embodiment described above are exemplified below. Two or more methods arbitrarily selected from the following examples can be appropriately combined within a range that does not contradict each other.

[0312] 4-1. Ninth Modification

[0313] Figure 36 It is a cross-sectional view of a portion of a liquid jet head 1A according to a ninth modification. Figure 36 The fixing member 157 of the ninth modification shown secures the support member 5A in addition to the bracket 6A and head module 2A. Furthermore, the fixing member 155 is omitted in the ninth modification. This ninth modification reduces the number of fixing members compared to the second embodiment. Therefore, the ninth modification allows the head module 2A to be attached to and detached from the bracket 6A using fewer fixing members than in the first embodiment.

[0314] 4-2. Tenth Modification

[0315] Figure 37 FIG. 1 is a cross-sectional view of a portion of a liquid ejecting head 1A according to a tenth modification. Figure 37 In the tenth modification shown, the holder 6A does not have the second recess 612. In other words, the holder 6A of the tenth modification has a recess 610A without a stepped surface. The recess 610A serves as a storage space for storing the interconnect substrate 70.

[0316] The support member 5A of the tenth modified example is composed of a bottom plate 51 and side walls 52. The bottom plate 51 is flat and has the same structure as the support member 5A of the second embodiment. The side walls 52 are frame-shaped portions that protrude from the outer edges of the bottom plate 51 in the Z2 direction. The support member 5A has a recess 510. The interior of the recess 510 forms a storage space for accommodating multiple head modules 2A.

[0317] Thus, the shapes of the bracket 6A and the support member 5A are not particularly limited, and may be any shapes. In addition, a space for accommodating the head module 2A is formed by one or both of the bracket 6A and the support member 5A.

[0318] Furthermore, the holder 6A of the tenth modified example is provided with a fourth positioning portion 642. The fourth positioning portion 642 is provided on the surface 606 of the holder 6A facing the Z2 direction.

[0319] Furthermore, in the tenth modified example, for example, the head module 2A is fixed to the support member 5A using adhesive or the like. Therefore, by removing the fixing member 155 and melting the adhesive using heat, the head module 2A can be removed from the bracket 6A. In other words, even if the head module 2A is fixed to the support member 5A using adhesive, if the support member 5A and the head module 2A can be separated by, for example, melting the adhesive using heat, the support member 5A and the head module 2A can be considered to be detachably fixed.

[0320] 4-3. Eleventh Modification

[0321] Figure 38 FIG. 1 is a cross-sectional view of a portion of a liquid ejecting head 1A according to an eleventh modified example. Figure 38 In the eleventh modified example shown, the support member 5A is omitted. According to the eleventh modified example, the number of parts can be reduced compared to the second embodiment. Furthermore, since the support member 5A is omitted, the head module 2A can be attached and detached from the bracket 6A more easily than in the second embodiment.

[0322] The fixing member 157 directly fixes the holder 6A and the head module 2A. The fixing member 157 does not overlap the chip 20 when viewed in the Z1 direction. Thus, even if the liquid ejecting head 1A does not include the support member 5A, the reaction force of the sealing member 4 is less likely to be transmitted to the chip 20.

[0323] 4-4. Twelfth Modification

[0324] Figure 39 It is a cross-sectional view of a portion of a liquid jet head 1A according to a twelfth modification. Figure 39 The liquid jet head 1A of the twelfth modified example shown includes a holder 8. The holder 8 includes a first holder 81 and a second holder 82. The first holder 81 is the same as the holder 6A of the second embodiment except that the flange portion 64 is omitted.

[0325] The second bracket 82 is identical to the support member 5A of the second embodiment, except for the following elements. The second bracket 82 has multiple portions that extend in the Y1 and Y2 directions, respectively, compared to the first bracket 81 when viewed in the Z1 direction. A fourth positioning portion 824 is provided in each of these extended portions. The fourth positioning portion 824 has the same structure as the fourth positioning portion 642 of the second embodiment and is press-fitted into the third positioning portion 102 of the unit base 11.

[0326] In addition, the second bracket 82 has a plurality of fixing holes 821 and a plurality of second positioning portions 822. Two fixing holes 821 are provided for each head module 2A. One of the two fixing holes 821 is located in the Y1 direction relative to the chip 20 when viewed along the Z1 direction, and the other is located in the Y2 direction. The fixing hole 821 is a hole that opens on the surface 512 of the second bracket 82 facing the Z2 direction. The fixing hole 821 can also be said to be a recess formed on the surface 512 of the second bracket 82 facing the Z2 direction. In addition, the head module 2A has a fixing hole 218H corresponding to the fixing hole 821. The fixing hole 218H is a hole that passes through the flow channel opening forming part 25A of the head module 2A.

[0327] Two second positioning portions 822 are provided for each head module 2A. One of the two second positioning portions 822 is located in the Y1 direction relative to the chip 20 when viewed along the Z1 direction, and the other is located in the Y2 direction. The second positioning portion 822 is a hole opening in the surface 512 of the second bracket 82 facing the Z2 direction. The second positioning portion 822 is a recessed portion formed in the surface 512 of the second bracket 82 facing the Z2 direction, or rather, a depression provided in the surface 512.

[0328] The head module 2A also includes a first positioning portion 217 corresponding to the second positioning portion 822. The first positioning portion 217 is a protrusion that projects in the Z1 direction from the surface 251 of the flow path opening forming member 25A that faces the Z1 direction. The first positioning portion 217 is press-fitted into the second positioning portion 822. This ensures that the head module 2A is positioned relative to the bracket 8 including the second bracket 82.

[0329] Furthermore, fixing members 158 are inserted into the fixing holes 218H and the fixing holes 821 in this order. The fixing members 158 are, for example, screws, with internal threads formed on the inner walls of the fixing holes 218H and the fixing holes 821. By inserting the fixing members 158 into the fixing holes 218H and the fixing holes 821 and tightening them with the threads, the head module 2A is fixed to the second bracket 82. Similarly to the support member 5A and bracket 6A of the second embodiment, the first bracket 81 and the second bracket 82 are fixed to each other by the fixing members 155.

[0330] Furthermore, the second bracket 82 of the bracket 8 has multiple openings 5H, similar to the support member 5A. Multiple head modules 2A are exposed to the outside through the multiple openings 5H. Furthermore, a portion of the flow channel opening forming member 25A is inserted into the openings 5H. Therefore, the second bracket 82 having multiple openings 5H can suppress the increase in the paper gap, similar to the support member 5A of the second embodiment. Furthermore, there is no need to reduce the thickness of the second bracket 82 to suppress the increase in the paper gap. Therefore, a reduction in the rigidity of the second bracket 82 can be suppressed.

[0331] 4-6. Thirteenth Modification

[0332] Figure 40 1 is a cross-sectional view of a portion of a liquid ejecting head 1A according to a thirteenth modified example. Figure 40 In the thirteenth modification shown, compared to the twelfth modification, the fixing holes 218H, the fixing holes 821, and the fixing members 158 are omitted. In other words, in the thirteenth modification, the first bracket 81 and the second bracket 82 can also be fixed to each other by the fixing member 155 in a manner that sandwiches the sealing member 4 and the head module 2A.

[0333] Furthermore, the second bracket 82 and each head module 2A may be fixed by an adhesive, etc. When the second bracket 82 and each head module 2A are fixed by an adhesive, if the adhesive can be melted and separated by heat, for example, then the second bracket 82 and each head module 2A can be understood as being fixed in a detachable manner.

[0334] 4-7. Fifteenth Modification

[0335] Figure 41 It is a cross-sectional view of a portion of a liquid jet head 1A according to a fifteenth modification. Figure 42 FIG. 1 is a top view of a liquid ejecting head 1A according to a fifteenth variation. Figure 41 In the fifteenth modified example shown, the positional relationship between the fixing member 157 and the sealing member 4 relative to the chip 20 is different. The shortest distance between the fixing member 157 and the chip 20 is shorter than the shortest distance between the sealing member 4 and the chip 20.

[0336] like Figure 42 As shown, the fixing member 157 does not overlap with the chip 20 when viewed along the Z1 direction and is positioned between the chip 20 and the sealing region 4S. This placement makes it easier for a reaction force to be generated outside the fixing member 157 when viewed from the chip 20. Consequently, the reaction force of the sealing member 4 is less likely to be transmitted to the chip 20.

[0337] 4-8. Sixteenth Modification

[0338] Figure 43 It is a cross-sectional view of a portion of a liquid jet head 1A according to a sixteenth modification. Figure 44 FIG. 1 is a top view of a liquid ejecting head 1A according to a sixteenth modification. Figure 43 as well as Figure 44 In the sixteenth modified example shown, the fixing member 157 overlaps with the chip 20 when viewed along the Z1 direction. Even when the fixing member 157 and the chip 20 overlap when viewed along the Z1 direction, the presence of the support member 5A can suppress the reaction force of the sealing member 4 from affecting the chip 20, compared to a case where the support member 5A is not present.

[0339] 5. Other Modifications

[0340] The embodiments and variations described above may be modified in various ways. Specific variations applicable to the embodiments and variations described above are exemplified below. Two or more arbitrarily selected from the following examples may be combined as appropriate within the scope of non-contradiction.

[0341] In the above description, the sealing member 4 is provided for each head module 2 , but the sealing member 4 may be integrated and shared among a plurality of head modules 2 .

[0342] The “first positioning portion” and the “second positioning portion” are not particularly limited to the structures of the above-described embodiment and modified examples as long as one is pressed into the other.

[0343] In the above-described embodiment, a serial-type liquid ejecting apparatus 100 is exemplified. However, the liquid ejecting apparatus may be a line-type liquid ejecting apparatus in which the plurality of nozzles N provided in the head unit 10 are distributed over the entire width of the medium 90 .

[0344] In addition to devices specifically used for printing, "liquid ejection devices" can also be used in various devices such as fax machines and copiers. The use of liquid ejection devices is not limited to printing. For example, a liquid ejection device that ejects a solution of a color material can be used as a manufacturing device for forming color filters for display devices such as liquid crystal display panels. In addition, a liquid ejection device that ejects a solution of a conductive material can be used as a manufacturing device for forming wiring and electrodes for relay substrates. In addition, a liquid ejection device that ejects a solution of an organic substance related to a living organism can be used as a manufacturing device for manufacturing, for example, a biochip.

[0345] Although the present invention has been described above based on preferred embodiments, the present invention is not limited to the embodiments described above. In addition, the structure of each part of the present invention can be replaced with any structure that has the same function as the embodiment described above, and any structure can be added.

[0346] Explanation of symbols

[0347] 1…Liquid ejecting head; 2…Head module; 3…Supply flow channel member; 3R…Flow channel; 4…Sealing member; 4H…Communication port; 4S…Sealing area; 5…Supporting member; 5S…Supporting area; 6…Bracket; 6R…Flow channel; 7…Wiring board; 10…Head unit; 11…Unit base; 20…Chip; 25…Flow channel opening forming member; 25R…Flow channel; 31H…Flow channel opening; 61H…First fixing hole; 64…Flange; 70…Relay board; 71…Connector; 100…Liquid ejecting device; 102…Third positioning member; 151…Fixing member; 152…Fixing member; 153…Fixing member; 154…Fixing member; 155…Fixing member; 157…Fixing member; 158…Fixing member; 201…Nozzle plate; 211H…fixing hole; 215…fixing hole; 216…first positioning portion; 218H…fixing hole; 251H…flow channel opening; 321…fixing hole; 501…fixing hole; 502…first positioning portion; 503…fixing hole; 504…fixing hole; 505…fixing hole; 510…recess; 602…second positioning portion; 610…recess; 612H…fixing hole; 613…fixing hole; 614H…fixing hole; 642…fourth positioning portion; 650H…flow channel opening; 651H…fixing hole; 652H…fixing hole; 653…second positioning portion; 2511…supported surface; C…pressure chamber; E…driving element; N…nozzle; R…common space; S50…area; S55…area; SN…nozzle surface.

Claims

1. A liquid ejecting head, characterized in that: have: a first head module that sprays liquid in a first direction; a supply flow channel component for supplying liquid to the first head module; a first sealing member, which is an elastic member and is sandwiched between the first head module and the supply flow channel member in the first direction, thereby connecting the first flow channel opening of the first head module and the flow channel opening of the supply flow channel member in a liquid-tight manner; The first head module includes a flow channel opening forming member and a chip. The flow channel opening forming member is formed with the first flow channel opening. The chip is arranged in the first direction relative to the flow channel opening forming member. A sealing region of the first sealing member, which is sandwiched between the flow path opening forming member and the supply flow path member, does not overlap with the chip when viewed along the first direction.

2. The liquid ejecting head according to claim 1, wherein The chip is thinner than the flow channel opening forming member and has a smaller outer shape than the flow channel opening forming member when viewed along the first direction. The first flow channel opening is arranged outside the chip when viewed along the first direction.

3. The liquid ejecting head according to claim 1, wherein A supporting member is provided, the supporting member is arranged in the first direction relative to the flow channel opening forming member, and sandwiches the first sealing member and the flow channel opening forming member between the supporting member and the supply flow channel member, and is made of metal. The support member supports the flow path opening forming member in a support region including a region overlapping with the sealing region when viewed in the first direction.

4. The liquid ejecting head according to claim 3, wherein The thickness of the support member in the first direction is thicker than the thickness of the chip in the first direction.

5. The liquid ejecting head according to claim 3, wherein The supporting member has an opening for exposing the first head module to the outside. A portion of the flow path opening forming member is arranged in the opening of the support member.

6. The liquid ejecting head according to claim 3, wherein A fixing member is provided for fixing the first head module and the supply flow path member. The fixing member is arranged so as not to overlap with the chip when viewed along the first direction and so as to sandwich the sealing area between the fixing member and the chip. The support region includes a region arranged between the sealing region and the chip when viewed along the first direction.

7. The liquid ejecting head according to claim 1, wherein A fixing member is provided for fixing the first head module and the supply flow path member. The fixing member does not overlap with the chip when viewed along the first direction, and is arranged between the chip and the sealing area.

8. The liquid ejecting head according to claim 3, wherein The supporting member has an opening for exposing the first head module to the outside. A portion of the surface of the flow path opening forming member facing the first direction surrounds the opening of the support member when viewed along the first direction and is supported by the support member in contact with the support member.

9. The liquid ejecting head according to claim 3, wherein A fixing member is provided for fixing the first head module and the supply flow path member. The fixing member overlaps with the chip when viewed along the first direction.

10. The liquid ejecting head according to claim 1, wherein A fixing component is provided for directly fixing the first head module and the supply flow channel component in a detachable manner. The fixing member does not overlap with the chip when viewed along the first direction.

11. The liquid ejecting head according to claim 1, wherein The sealing region is arranged in a longitudinal direction of the first head module relative to the chip when viewed along the first direction.

12. The liquid ejecting head according to claim 1, wherein have: a second head module that ejects the liquid supplied from the supply flow path member; a second sealing member, which is an elastic member and is sandwiched between the second head module and the supply flow channel member, thereby connecting the second flow channel opening of the second head module and the flow channel opening of the supply flow channel member in a liquid-tight manner; The second head module includes a flow channel opening forming component and a chip, the flow channel opening forming component is formed with the second flow channel opening, and the chip is arranged in the first direction relative to the flow channel opening forming component of the second head module. A sealed region of the second sealing member, which is sandwiched between the flow path opening forming member and the supply flow path member, does not overlap with the chip of the second head module when viewed in the first direction.

13. A liquid ejecting device, characterized in that: have: The plurality of liquid ejecting heads according to claim 1; A unit base fixes the plurality of liquid ejecting heads.

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