Rotatable semiconductor refrigeration device and manufacturing method

Abstract

The invention discloses a rotatable semiconductor refrigeration device and a manufacturing method, relates to the technical field of semiconductor refrigeration, and aims to solve the problem of poor refrigeration effect of a refrigeration sheet used for a rotating part at present. A rotatable semiconductor refrigeration device is connected with an external rotating part and comprises a semiconductor refrigeration sheet and a heat insulation frame fixed to the semiconductor refrigeration sheet, the heat insulation frame is fixed to the external rotating part, and metal guide rails are arranged on the outer side of the heat insulation frame and comprise the positive electrode guide rail and the negative electrode guide rail. The positive guide rail and the negative guide rail are coaxially arranged; a supporting frame is arranged and connected between the metal guide rail and the heat insulation frame. Wires of a traditional refrigeration piece are abandoned, the refrigeration piece and the rotating head rotate together through the heat insulation frame and the metal guide rail, the heat conduction performance is good, and the refrigeration piece can be suitable for application scenes such as cooling of a massage head of a massage instrument and refrigeration of the bottom of a stirring cup.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor refrigeration, and in particular to a rotatable semiconductor refrigeration device and a manufacturing method thereof. Background Art

[0002] Currently, commonly used cooling fins rely on wires to connect to a power source, making them difficult to mount on a rotating component. Furthermore, when the cooling fin is separated from the rotating component, the gap between them reduces the cooling efficiency. Currently, there is no effective solution to enable the cooling fin to rotate.

[0003] For example, although Chinese patent publication number CN214836112U relates to a semiconductor refrigeration device for a rotary guide head, which can solve the problem that the prior art cannot directly cool components of a circuit board in the rotary guide head, its cooling effect is poor. Summary of the Invention

[0004] The present invention solves the problem of poor cooling effect of the refrigeration plate currently used for rotating parts, and proposes a rotatable semiconductor refrigeration device and a manufacturing method. The refrigeration plate is fitted with a rotating head, rotates synchronously, and has good thermal conductivity.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: a rotatable semiconductor refrigeration device, connected to an external rotating component, including a semiconductor refrigeration plate and an insulation frame fixed to the semiconductor refrigeration plate, the insulation frame is fixed to the external rotating component, and a metal guide rail is provided on the outside of the insulation frame, the metal guide rail includes a positive guide rail and a negative guide rail, and the positive guide rail and the negative guide rail are coaxially arranged; a support frame is provided and connected between the metal guide rail and the insulation frame.

[0006] This technical solution mainly includes an insulating frame and a metal guide rail arranged on the outside of the semiconductor refrigeration plate. Through the above-mentioned insulating frame and metal guide rail, the refrigeration plate and the rotating head rotate together. The device of the present invention can be used in application scenarios such as cooling the massage head of a massager and cooling the bottom of a stirring cup.

[0007] The present invention is further configured as follows: the size of the thermal insulation frame is larger than the size of the semiconductor refrigeration plate, the thermal insulation frame includes two parallel first frames and a second frame connecting the two first frames, and the corresponding notches of the second frame can be welded to the electrodes of the semiconductor refrigeration plate.

[0008] In this technical solution, in order to facilitate the placement of the cooling plate, the size of the insulation frame is set to be larger than the overall size of the semiconductor cooling plate; the notch on one side of the insulation frame can facilitate welding with the cooling plate electrode.

[0009] The present invention is further configured as follows: the metal guide rail is a circular double-layer guide rail, the tracks of the positive electrode guide rail and the negative electrode guide rail are directed toward the outside of the metal guide rail, and the track cross-section of the metal guide rail is semicircular.

[0010] In this technical solution, the tracks of the positive electrode guide rail and the negative electrode guide rail of the metal guide rail are both semicircular, which can facilitate the movement of the spherical electrode inside the guide rail.

[0011] The present invention is further configured such that a connector is provided between the positive electrode rail and the negative electrode rail, and the connector is made of an insulating high-strength connecting material.

[0012] In this technical solution, the positive electrode rail and the negative electrode rail are connected by an insulating high-strength connecting material, which can fix the rails.

[0013] The present invention is further configured as follows: a conductive metal tube is welded to the positive and negative poles of the semiconductor refrigeration plate, and the other end of the conductive metal tube is welded to the inner side of the metal guide rail.

[0014] In this technical solution, the circuit between the refrigeration plate and the metal guide rail is conducted through the conductive metal tube.

[0015] The present invention is further configured as follows: the semiconductor refrigeration plate includes a substrate and semiconductor grains, the substrate includes a cold surface substrate and a hot surface substrate, the cold surface substrate is provided with cold surface copper grains, and the hot surface substrate is provided with hot surface copper grains.

[0016] In this technical solution, semiconductor crystal grains are arranged between a cold surface substrate and a hot surface substrate, and heating is performed to combine the substrate and the semiconductor crystal grains to obtain a prototype of a refrigeration plate.

[0017] The present invention is further configured as follows: threaded holes are provided around the thermal insulation frame, and the thermal insulation frame is fixedly connected to an external rotating component through the threaded holes.

[0018] The present invention is further configured as follows: a spherical electrode is further provided in the metal guide rail, the spherical electrode includes a positive conductor and a negative conductor, and the positive conductor and the negative conductor move within the track of the metal guide rail.

[0019] In this technical solution, since the cross section of the track is semicircular, the spherical electrode can be easily moved within the track of the metal guide rail.

[0020] A method for manufacturing a rotatable semiconductor refrigeration device, applicable to the above-mentioned rotatable semiconductor refrigeration device, comprises the following steps: S1, manufacturing a semiconductor cooling chip based on a substrate and semiconductor grains; S2, making a heat-insulating frame according to the size information of the semiconductor refrigeration chip and welding it to the semiconductor refrigeration chip; S3, making a circular metal rail, setting the cross section and orientation of the metal rail, and connecting the positive electrode rail and the negative electrode rail; S4, connecting the metal guide rail and the heat insulation frame using a support frame; connecting the semiconductor cooling plate and the metal guide rail to conduct the circuit; S5, place the spherical electrodes into the metal guide rails respectively, and fix the electrodes on the side.

[0021] In this technical solution, the semiconductor cooler is first fabricated. An insulating frame is then fabricated based on the size of the cooler. A circular metal rail is then fabricated based on the required dimensions. The rail is then connected to the insulating frame and the cooler. Finally, a spherical electrode is placed on the rail, and the rail and cooler are placed in a rotating component to rotate together.

[0022] The present invention is further configured as follows: Step S4 further includes: After the circuit is turned on, fix the semiconductor refrigeration device and the rotating head with bolts.

[0023] The present invention can bring the following beneficial effects: The present invention relates to a rotatable semiconductor refrigeration device, which abandons the wires of traditional refrigeration plates and rotates the refrigeration plates and the rotating head together through an insulating frame and a metal guide rail. It has good thermal conductivity and can be used in application scenarios such as cooling the massage head of a massager and cooling the bottom of a stirring cup. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is an exploded schematic diagram of a rotatable semiconductor refrigeration device of the present application.

[0025] Figure 2 This is a top view of a rotatable semiconductor refrigeration device of the present application with respect to a metal guide rail and a heat insulation frame.

[0026] Figure 3 This is a schematic diagram of a rotatable cold surface substrate of a semiconductor refrigeration device of the present application.

[0027] Reference numerals: 1. Cold surface substrate 2. Cold copper particles 3. Semiconductor grains 4. Hot surface copper particles 5. Hot surface substrate 6. Metal guide rails 7. Support frame 8. Thermal insulation frame 9. Positive conductor 10. Negative conductor. DETAILED DESCRIPTION

[0028] In order to make the objectives, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific implementation method described herein is only an optimal embodiment of the present invention, which is only used to explain the present invention and does not limit the scope of protection of the present invention. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0029] Example 1 This embodiment proposes a rotatable semiconductor refrigeration device, referring to Figure 1 、 Figure 2 as well as Figure 3 The semiconductor refrigeration device is connected to the external rotating component, which mainly includes a semiconductor refrigeration plate, an insulation frame 8 and a metal guide rail 6, wherein the insulation frame 8 is fixedly connected to the semiconductor refrigeration plate, and is fixedly connected to the external rotating component through the above-mentioned insulation frame 8. A corresponding metal guide rail 6 is provided on the outside of the insulation frame 8, wherein the metal guide rail 6 is a double-layer guide rail, mainly including a positive guide rail and a negative guide rail, and the positive guide rail and the negative guide rail are coaxially arranged; in addition, a support frame 7 is provided between the metal guide rail 6 and the insulation frame 8, and the metal guide rail 6 and the insulation frame 8 are fixedly connected through the above-mentioned support frame 7. The present technical solution is a rotatable semiconductor refrigeration device, which mainly includes an insulating frame 8 and a metal guide rail 6 arranged outside the semiconductor refrigeration plate. Through the above-mentioned insulating frame 8 and metal guide rail 6, the refrigeration plate and the rotating head rotate together. The device of the present invention can be used in application scenarios such as cooling the massage head of a massager and cooling the bottom of a stirring cup.

[0030] In this embodiment, the support frame 7 is made of insulating and high-strength heat-insulating material.

[0031] The size of the thermal insulation frame 8 is larger than the overall size of the semiconductor refrigeration chip. More specifically, in this embodiment, the size of the thermal insulation frame 8 is slightly larger than the overall size of the semiconductor refrigeration chip to facilitate the placement of the semiconductor refrigeration chip into the thermal insulation frame 8.

[0032] refer to Figure 2 The thermal insulation frame 8 includes a first frame and a second frame, wherein specifically, it includes two first frames and one first frame, the two first frames are arranged parallel to each other, and the second frame can connect the two first frames. Specifically, the second frame can connect one end of a first frame and one end of another first frame, and the other end of a first frame and the other end of the other first frame generate a notch, which is the notch corresponding to the second frame, which can be welded with the electrode of the semiconductor refrigeration plate.

[0033] In this technical solution, in order to facilitate the placement of the cooling plate, the size of the insulation frame 8 is set to be larger than the overall size of the semiconductor cooling plate; the notch on one side of the insulation frame 8 can facilitate welding with the cooling plate motor.

[0034] In this embodiment, the heat insulating frame 8 is made of heat insulating material, and the heat insulating frame 8 is made of a plastic material with poor thermal conductivity, high strength and non-conductivity.

[0035] The metal guide rail 6 is a double-layered circular guide rail, wherein the positive and negative electrode rails are both oriented toward the outside of the metal guide rail 6 , and the cross section of the metal guide rail 6 is semicircular.

[0036] In this technical solution, the tracks of the positive electrode guide rail and the negative electrode guide rail of the metal guide rail 6 are both semicircular, which can facilitate the movement of the spherical electrode inside the guide rail.

[0037] In this embodiment, the positive electrode rail and the negative electrode rail are both made of copper, which has good electrical conductivity.

[0038] In more detail, a corresponding connector is provided between the positive electrode rail and the negative electrode rail, wherein the connector is specifically an insulating high-strength connecting material, and the positive electrode rail and the negative electrode rail are fixedly connected by the connector.

[0039] In this technical solution, the positive electrode rail and the negative electrode rail are connected by an insulating high-strength connecting material, which can fix the rails.

[0040] The positive and negative poles of the semiconductor refrigeration plate are welded to corresponding conductive metal tubes. Specifically, the semiconductor refrigeration plate is welded to one end of the conductive metal tube, and the other end of the conductive metal tube is welded to the inner side of the metal guide rail.

[0041] In this technical solution, the circuit between the semiconductor refrigeration plate and the metal guide rail 6 is conducted through a conductive metal tube.

[0042] refer to Figure 1 and Figure 3 The semiconductor refrigeration chip mainly includes a substrate and semiconductor crystal grains 3. The substrate mainly includes a cold surface substrate 1 and a hot surface substrate 5. Specifically, the cold surface substrate 1 is a cold surface ceramic substrate, and the hot surface substrate 5 is a hot surface ceramic substrate. The cold surface substrate 1 is provided with corresponding cold surface copper grains 2, and the hot surface substrate 5 is provided with corresponding hot surface copper grains 4.

[0043] In this technical solution, semiconductor crystal grains are arranged between the cold surface substrate 1 and the hot surface substrate 5, and heating is performed to combine the substrate and the semiconductor crystal grains to obtain a prototype of a refrigeration plate.

[0044] In this embodiment, the thickness of the hot surface copper particles 4 needs to be greater than 0.3 mm and they are sintered on the hot surface substrate 5 to ensure good strength.

[0045] Likewise, the thickness of the cold surface copper particles 2 needs to be greater than 0.3 mm and they are sintered on the cold surface substrate 1 to ensure good strength.

[0046] The cold surface substrate 1 and the hot surface substrate 5 are conventional ceramic substrates, which will not be described in detail here.

[0047] Since the semiconductor refrigeration sheet needs to withstand large shear forces during rotation, the number, cross-sectional dimensions and height of the semiconductor grains must be the same, and the height needs to be greater than 1.5 mm, and the particle size needs to be greater than 1.4 mm to ensure the strength of the semiconductor refrigeration sheet.

[0048] The cold side copper particles 1 are sintered on the cold side substrate 1, and the hot side copper particles 4 are sintered on the hot side substrate 5. Solder is laid on the cold side copper particles 1 or the hot side copper particles 4. Then, the semiconductor crystal is placed between the above-mentioned cold side substrate 1 and the hot side substrate 5, and the substrate is heated and combined with the semiconductor crystal to generate a semiconductor refrigeration plate.

[0049] Furthermore, threaded holes are provided around the heat insulating frame 8. The purpose of providing the threaded holes is to fix with external rotating components, that is, the heat insulating frame 8 is fixedly connected with the external rotating components through the threaded holes.

[0050] A spherical electrode is further provided in the metal guide rail 6 , wherein the spherical electrode includes a positive conductor 9 and a negative conductor 10 , and the positive conductor 9 and the negative conductor 10 move within the track of the metal guide rail 6 .

[0051] In this technical solution, since the cross section of the track is semicircular, the spherical electrode can be easily moved within the track of the metal guide rail 6.

[0052] The rotatable semiconductor refrigeration device of this technical solution can be widely used in rotating parts. The cooling plate fits the rotating head and rotates synchronously, with good thermal conductivity. The overall structural strength is high, and it is safer and more reliable.

[0053] In this embodiment, the corresponding semiconductor refrigeration plate can be obtained after the substrate and the semiconductor grains are combined, and the thermal insulation frame 8 can be made according to the structure and size of the refrigeration plate, and the thermal insulation frame 8 can be fixedly connected with the external rotating parts according to the threaded holes provided thereon; metal guide rails are provided on the outside of the thermal insulation frame 8 and are set as positive guide rails and negative guide rails, which are connected by a support frame, and the circuit of the semiconductor refrigeration plate and the metal guide rails is turned on, and finally the spherical electrode is placed in the metal guide rail.

[0054] The following is a preferred embodiment provided by this embodiment: The cold surface substrate 1 and the hot surface substrate 5 are both conventional ceramic substrates, which are common materials.

[0055] The copper particles on the cold surface substrate 1 have a thickness of more than 0.3 mm and need to be sintered on the cold surface substrate 1 .

[0056] The copper particles of the hot surface substrate 5 have a thickness of more than 0.3 mm and need to be sintered on the hot surface substrate 5 .

[0057] The number, height and cross-sectional dimensions of the semiconductor grains are all the same, and the height is greater than 1.5 mm and the particle size is greater than 1.4 μm.

[0058] The heat insulating frame 8 is made of a plastic material with poor thermal conductivity, high strength and no electrical conductivity.

[0059] Both the positive and negative rails are made of copper, which has good conductivity.

[0060] The support frame 7 is made of insulating and high-strength heat-insulating material.

[0061] Example 2 This embodiment proposes a rotatable semiconductor refrigeration device, which is connected to an external rotating component and mainly includes a semiconductor refrigeration plate, an insulation frame 8, and a metal guide rail 6. The insulation frame 8 is fixedly connected to the semiconductor refrigeration plate and fixedly connected to the external rotating component through the insulation frame 8. A corresponding metal guide rail 6 is provided on the outside of the insulation frame 8. The metal guide rail 6 is a double-layer guide rail, mainly including a positive guide rail and a negative guide rail. The positive guide rail and the negative guide rail are coaxially arranged. In addition, a support frame 7 is provided between the metal guide rail 6 and the insulation frame 8. The metal guide rail 6 and the insulation frame 8 are fixedly connected through the support frame 7. The present technical solution is a rotatable semiconductor refrigeration device, which mainly includes an insulating frame 8 and a metal guide rail 6 arranged outside the semiconductor refrigeration plate. Through the above-mentioned insulating frame 8 and metal guide rail 6, the refrigeration plate and the rotating head rotate together. The device of the present invention can be used in application scenarios such as cooling the massage head of a massager and cooling the bottom of a stirring cup.

[0062] In this embodiment, the support frame 7 is made of insulating and high-strength heat-insulating material.

[0063] The size of the thermal insulation frame 8 is larger than the overall size of the semiconductor refrigeration chip. More specifically, in this embodiment, the size of the thermal insulation frame 8 is slightly larger than the overall size of the semiconductor refrigeration chip to facilitate the placement of the semiconductor refrigeration chip into the thermal insulation frame 8.

[0064] refer to Figure 2The thermal insulation frame 8 includes a first frame and a second frame, wherein specifically, it includes two first frames and one first frame, the two first frames are arranged parallel to each other, and the second frame can connect the two first frames. Specifically, the second frame can connect one end of a first frame and one end of another first frame, and the other end of a first frame and the other end of the other first frame generate a notch, which is the notch corresponding to the second frame, which can be welded with the electrode of the semiconductor refrigeration plate.

[0065] In this technical solution, in order to facilitate the placement of the cooling plate, the size of the insulation frame 8 is set to be larger than the overall size of the semiconductor cooling plate; the notch on one side of the insulation frame 8 can facilitate welding with the cooling plate motor.

[0066] In this embodiment, the heat insulating frame 8 is made of heat insulating material, and the heat insulating frame 8 is made of a plastic material with poor thermal conductivity, high strength and non-conductivity.

[0067] The metal guide rail 6 is a double-layered circular guide rail, wherein the positive and negative electrode rails are both oriented toward the outside of the metal guide rail 6 , and the cross section of the metal guide rail 6 is semicircular.

[0068] In this technical solution, the tracks of the positive electrode guide rail and the negative electrode guide rail of the metal guide rail 6 are both semicircular, which can facilitate the movement of the spherical electrode inside the guide rail.

[0069] In this embodiment, the positive electrode rail and the negative electrode rail are both made of copper, which has good electrical conductivity.

[0070] In more detail, a corresponding connector is provided between the positive electrode rail and the negative electrode rail, wherein the connector is specifically an insulating high-strength connecting material, and the positive electrode rail and the negative electrode rail are fixedly connected by the connector.

[0071] In this technical solution, the positive electrode rail and the negative electrode rail are connected by an insulating high-strength connecting material, which can fix the rails.

[0072] The positive and negative poles of the semiconductor refrigeration plate are welded to corresponding conductive metal tubes. Specifically, the semiconductor refrigeration plate is welded to one end of the conductive metal tube, and the other end of the conductive metal tube is welded to the inner side of the metal guide rail.

[0073] In this technical solution, the circuit between the semiconductor refrigeration plate and the metal guide rail 6 is conducted through a conductive metal tube.

[0074] refer to Figure 1 and Figure 3The semiconductor refrigeration chip mainly includes a substrate and semiconductor crystal grains 3. The substrate mainly includes a cold surface substrate 1 and a hot surface substrate 5. Specifically, the cold surface substrate 1 is a cold surface ceramic substrate, and the hot surface substrate 5 is a hot surface ceramic substrate. The cold surface substrate 1 is provided with corresponding cold surface copper grains 2, and the hot surface substrate 5 is provided with corresponding hot surface copper grains 4.

[0075] In this technical solution, semiconductor crystal grains are arranged between the cold surface substrate 1 and the hot surface substrate 5, and heating is performed to combine the substrate and the semiconductor crystal grains to obtain a prototype of a refrigeration plate.

[0076] In this embodiment, the thickness of the hot surface copper particles 4 needs to be greater than 0.3 mm and they are sintered on the hot surface substrate 5 to ensure good strength.

[0077] Likewise, the thickness of the cold surface copper particles 2 needs to be greater than 0.3 mm and they are sintered on the cold surface substrate 1 to ensure good strength.

[0078] The cold surface substrate 1 and the hot surface substrate 5 are conventional ceramic substrates, which will not be described in detail here.

[0079] Since the semiconductor refrigeration sheet needs to withstand large shear forces during rotation, the number, cross-sectional dimensions and height of the semiconductor grains must be the same, and the height needs to be greater than 1.5 mm, and the particle size needs to be greater than 1.4 mm to ensure the strength of the semiconductor refrigeration sheet.

[0080] The cold side copper particles 1 are sintered on the cold side substrate 1, and the hot side copper particles 4 are sintered on the hot side substrate 5. Solder is laid on the cold side copper particles 1 or the hot side copper particles 4. Then, the semiconductor crystal is placed between the above-mentioned cold side substrate 1 and the hot side substrate 5, and the substrate is heated and combined with the semiconductor crystal to generate a semiconductor refrigeration plate.

[0081] Furthermore, threaded holes are provided around the heat insulating frame 8. The purpose of providing the threaded holes is to fix with external rotating components, that is, the heat insulating frame 8 is fixedly connected with the external rotating components through the threaded holes.

[0082] A spherical electrode is further provided in the metal guide rail 6 , wherein the spherical electrode includes a positive conductor 9 and a negative conductor 10 , and the positive conductor 9 and the negative conductor 10 move within the track of the metal guide rail 6 .

[0083] In this technical solution, since the cross section of the track is semicircular, the spherical electrode can be easily moved within the track of the metal guide rail 6.

[0084] The rotatable semiconductor refrigeration device of this technical solution can be widely used in rotating parts. The cooling plate fits the rotating head and rotates synchronously, with good thermal conductivity. The overall structural strength is high, and it is safer and more reliable.

[0085] In this embodiment, the corresponding semiconductor refrigeration plate can be obtained after the substrate and the semiconductor grains are combined, and the thermal insulation frame 8 can be made according to the structure and size of the refrigeration plate, and the thermal insulation frame 8 can be fixedly connected with the external rotating parts according to the threaded holes provided thereon; metal guide rails are provided on the outside of the thermal insulation frame 8 and are set as positive guide rails and negative guide rails, which are connected by a support frame, and the circuit of the semiconductor refrigeration plate and the metal guide rails is turned on, and finally the spherical electrode is placed in the metal guide rail.

[0086] The following is a preferred embodiment provided by this embodiment: The cold surface substrate 1 and the hot surface substrate 5 are both conventional ceramic substrates, which are common materials.

[0087] The copper particles on the cold surface substrate 1 have a thickness of more than 0.3 mm and need to be sintered on the cold surface substrate 1 .

[0088] The copper particles of the hot surface substrate 5 have a thickness of more than 0.3 mm and need to be sintered on the hot surface substrate 5 .

[0089] The number, height and cross-sectional dimensions of the semiconductor grains are all the same, and the height is greater than 1.5 mm and the particle size is greater than 1.4 μm.

[0090] The heat insulating frame 8 is made of a plastic material with poor thermal conductivity, high strength and no electrical conductivity.

[0091] Both the positive and negative rails are made of copper, which has good conductivity.

[0092] The support frame 7 is made of insulating and high-strength heat-insulating material.

[0093] Different from the first embodiment, this embodiment further provides a method for manufacturing a rotatable semiconductor refrigeration device, which includes the following steps.

[0094] Step S1: A semiconductor cooling chip is fabricated based on a substrate and semiconductor crystals. Specifically, cold-side copper particles and hot-side copper particles are sintered onto corresponding substrates. Solder is then applied to the copper particles. The semiconductor crystals are placed between the hot and cold substrates. Heating allows the substrate and semiconductor crystals to bond, resulting in the prototype of the cooling chip.

[0095] In step S2, an insulation frame is fabricated based on the dimensions of the semiconductor refrigeration chip and welded to the refrigeration chip. The insulation frame is slightly larger than the overall dimensions of the refrigeration chip to facilitate placement and securement. One side of the insulation frame is disconnected for welding to the refrigeration chip motor. Threaded holes are provided around the insulation frame to secure the frame to the rotating component.

[0096] In step S3, a circular metal rail is fabricated on the outside of the insulation frame. The rail's cross-section and orientation are determined, and finally, connectors are used to connect the positive and negative rails. The rail is circular, with the track oriented toward the outside and a semicircular cross-section to facilitate movement of the spherical electrode within the rail. The positive and negative rails are coaxially arranged and connected with a high-strength insulating material.

[0097] Step S4, using a support frame to connect the metal guide rail and the heat insulation frame, and using a conductive metal tube to connect the semiconductor refrigeration plate and the metal guide rail; then fixedly connecting the semiconductor refrigeration device to the rotating head.

[0098] In step S5, the spherical electrodes are placed in the metal guide rails, and the electrodes are fixed on the side. The guide rails and the cooling plate are placed in a rotating component and rotated together.

[0099] In this technical solution, the semiconductor cooler is first fabricated. An insulating frame is then fabricated based on the size of the cooler. A circular metal rail is then fabricated based on the required dimensions. The rail is then connected to the insulating frame and the cooler. Finally, a spherical electrode is placed on the rail, and the rail and cooler are placed in a rotating component to rotate together.

[0100] Finally, it should be noted that the above embodiments are intended only to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions to the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention and are intended to be encompassed by the claims of the present invention.

Claims

1. A rotatable semiconductor refrigeration device connected to an external rotating component, characterized in that: The invention comprises a semiconductor refrigeration plate and a heat-insulating frame (8) fixed to the semiconductor refrigeration plate, wherein the heat-insulating frame (8) is fixed to an external rotating component, and a metal guide rail (6) is provided on the outside of the heat-insulating frame (8), wherein the metal guide rail (6) comprises a positive guide rail and a negative guide rail, and the positive guide rail and the negative guide rail are coaxially arranged; and a support frame (7) is provided between and connected to the metal guide rail (6) and the heat-insulating frame (8).

2. A rotatable semiconductor refrigeration device according to claim 1, characterized in that: The size of the thermal insulation frame (8) is larger than that of the semiconductor refrigeration plate. The thermal insulation frame (8) comprises two first frames arranged in parallel and a second frame connecting the two first frames. The notches corresponding to the second frames can be welded to the electrodes of the semiconductor refrigeration plate.

3. The rotatable semiconductor refrigeration device according to claim 1, characterized in that: The metal guide rail (6) is a circular double-layer guide rail, the tracks of the positive electrode guide rail and the negative electrode guide rail are directed toward the outside of the metal guide rail (6), and the track cross-section of the metal guide rail (6) is semicircular.

4. A rotatable semiconductor refrigeration device according to claim 1, 2 or 3, characterized in that: A connector is provided between the positive electrode rail and the negative electrode rail, and the connector is made of an insulating high-strength connecting material.

5. The rotatable semiconductor refrigeration device according to claim 3, characterized in that: Conductive metal tubes are welded to the positive and negative poles of the semiconductor refrigeration plate, and the other end of the conductive metal tube is welded to the inner side of the metal guide rail.

6. A rotatable semiconductor refrigeration device according to claim 1 or 2, characterized in that: The semiconductor refrigeration plate comprises a substrate and semiconductor crystal grains (3), wherein the substrate comprises a cold surface substrate (1) and a hot surface substrate (5), wherein cold surface copper grains (2) are arranged on the cold surface substrate (1), and hot surface copper grains (4) are arranged on the hot surface substrate (5).

7. A rotatable semiconductor refrigeration device according to claim 1 or 2, characterized in that: Threaded holes are provided around the thermal insulation frame (8), and the thermal insulation frame (8) is fixedly connected to an external rotating component through the threaded holes.

8. The rotatable semiconductor refrigeration device according to claim 3, characterized in that: A spherical electrode is also provided in the metal guide rail (6), and the spherical electrode includes a positive conductor (9) and a negative conductor (10). The positive conductor (9) and the negative conductor (10) move within the track of the metal guide rail (6).

9. A method for manufacturing a rotatable semiconductor refrigeration device, applicable to a rotatable semiconductor refrigeration device according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1, manufacturing a semiconductor cooling chip based on a substrate and semiconductor grains; S2, making a heat-insulating frame according to the size information of the semiconductor refrigeration chip and welding it to the semiconductor refrigeration chip; S3, making a circular metal rail, setting the cross section and orientation of the metal rail, and connecting the positive electrode rail and the negative electrode rail; S4, connecting the metal guide rail and the heat insulation frame using a support frame; connecting the semiconductor cooling plate and the metal guide rail to conduct the circuit; S5, place the spherical electrodes into the metal guide rails respectively, and fix the electrodes on the side.

10. The method for manufacturing a rotatable semiconductor refrigeration device according to claim 9, characterized in that: The step S4 further includes: After the circuit is turned on, fix the semiconductor refrigeration device and the rotating head with bolts.

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