detection stage

Abstract

The present disclosure provides a detection stage, which comprises a substrate assembly and a frame component; the substrate assembly has a central axis; the frame component is arranged to be movable relative to the substrate assembly along the direction of the central axis of the substrate assembly; wherein the substrate assembly is provided with a first support assembly and a second support assembly, the first support assembly is used for supporting a first wafer of a first size, and the second support assembly is used for supporting a second wafer of a second size, the first size being greater than the second size.

Description

Technical Field

[0001] This disclosure relates to a testing platform, belonging to the field of automated equipment technology. Background Technology

[0002] In existing technologies, when grinding wafers, the outer edge portion (approximately 3mm) is retained, and only the inner part of the wafer is ground to achieve thinning. This reduces the handling risks of thin wafers and minimizes warpage. However, when inspecting the ground wafer, the design of the inspection stage presents significant challenges because the thickness varies between the edges and the center.

[0003] Furthermore, due to the high complexity of wafer manufacturing, existing technologies require wafer defect detection at multiple stages to ensure the final yield rate. Moreover, this defect detection not only needs to inspect the front side of the wafer but sometimes also the back side. When inspecting the back side after wafer dicing, the front side of the wafer should ideally not come into contact with any objects, which also presents a significant challenge to the stage inspection.

[0004] Furthermore, since the testing stage is not compatible with wafers of different sizes, manual switching is required when changing wafer sizes, which carries the risk of the front side of the wafer being touched. Summary of the Invention

[0005] To address one of the aforementioned technical problems, this disclosure provides a testing platform.

[0006] According to one aspect of this disclosure, a testing stage is provided, comprising: A substrate assembly having a central axis; and A frame component, the frame component being configured to move relative to the substrate assembly along the central axis of the substrate assembly; The substrate assembly is provided with a first support component and a second support component. The first support component is used to support a first wafer of a first size, and the second support component is used to support a second wafer of a second size. The first size is larger than the second size.

[0007] According to at least one embodiment of the present disclosure, the first support assembly includes a plurality of first positioning blocks disposed on the upper surface of the substrate assembly, wherein the first positioning block has a first positioning surface that is capable of contacting and positioning the first wafer with the side surface of the first wafer.

[0008] According to at least one embodiment of the present disclosure, the first support assembly includes a plurality of first suction nozzle assemblies disposed on the substrate assembly, the first suction nozzle assemblies being arranged around the central axis.

[0009] According to at least one embodiment of the present disclosure, each first nozzle assembly includes a plurality of first nozzles that contact the lower surface of the first wafer and adsorb and fix the first wafer.

[0010] According to at least one embodiment of the detection stage of the present disclosure, the second support assembly includes a plurality of second suction nozzle assemblies disposed on the substrate assembly, the second suction nozzle assemblies being arranged around the central axis, wherein, along the central axis direction, the second suction nozzle assemblies are lower than the first suction nozzle assembly.

[0011] According to at least one embodiment of the present disclosure, each second nozzle assembly includes a plurality of second nozzles, the second nozzles contacting the lower surface of the second wafer and adsorbing and fixing the second wafer, wherein the upper end of the second nozzle is lower than the upper end of the first nozzle.

[0012] According to at least one embodiment of the present disclosure, the test stage includes a substrate assembly with a central aperture, and the test stage further includes an air blowing device, wherein at least a portion of the air blowing device passes through the central aperture and is located above the substrate assembly; the air blowing device is used to provide airflow to the center of a first wafer or a second wafer carried by the test stage.

[0013] According to at least one embodiment of the present disclosure, the air blowing device is configured to move relative to the substrate assembly along the central axis direction such that the upper end of the air blowing device is spaced apart by a predetermined distance from the lower surface of the first wafer or the lower surface of the second wafer.

[0014] According to at least one embodiment of the present disclosure, a testing stage is provided with a support cylinder on the lower surface of the substrate assembly, and a guide structure is provided on the support cylinder for guiding the movement of the air blowing device along the central axis.

[0015] The detection platform according to at least one embodiment of the present disclosure further includes: A driving device is provided for driving the air blowing device to move along the central axis.

[0016] The detection platform according to at least one embodiment of the present disclosure further includes: A first ejector pin is fixed to a frame component; the substrate assembly includes a first through hole through which the upper end of the first ejector pin can pass and is located above the upper surface of the substrate assembly; the first ejector pin is used to pick up and pre-fix the first wafer.

[0017] According to at least one embodiment of the present disclosure, the diameter of the first through hole is larger than the diameter of the first ejector pin.

[0018] The detection platform according to at least one embodiment of the present disclosure further includes: The second ejector pin is fixed to the frame component; the substrate assembly includes a second through hole through which the upper end of the second ejector pin can pass and is located above the upper surface of the substrate assembly, and the second ejector pin is used to pick up and pre-position the second wafer.

[0019] According to at least one embodiment of the detection stage of the present disclosure, the diameter of the second through hole is larger than the diameter of the second ejector pin. Attached Figure Description

[0020] The accompanying drawings illustrate exemplary embodiments of the present disclosure and, together with the description thereof, serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0021] Figure 1 This is a schematic diagram of the usage state of a test stage supporting a first wafer according to one embodiment of the present disclosure.

[0022] Figure 2 This is a schematic diagram of the usage state of a test stage supporting a second wafer according to one embodiment of the present disclosure.

[0023] Figure 3 This is a schematic diagram of the structure of a testing stage according to one embodiment of the present disclosure.

[0024] Figure 4 This is a structural schematic diagram of the testing stage from another angle according to one embodiment of the present disclosure.

[0025] Figure 5 This is a schematic diagram of the structure of an air blowing device according to one embodiment of the present disclosure.

[0026] Figure 6 This is a structural schematic diagram of an air blowing device according to one embodiment of the present disclosure from another angle.

[0027] The specific labels in the attached figures are as follows: 100 substrate assembly 110 upper base plate 120 lower base plate 130 support tube 200 Frame Components 300 guide assembly 310 First fastener 320 Second fastener 330 limit component 340 First guide rail 350 First slider 360 Spring 400 First Support Component 410 First positioning block 420 First suction nozzle assembly 500 Second Support Component 520 Second Suction Nozzle Assembly 600 First thimble 700 Second thimble 800 air blowing device 810 Fixed components 830 Limiting component 840 Second Guide Rail 850 Second slider 860 drive unit 870 wedge block 910 First Wafer 920 Second wafer. Detailed Implementation

[0028] The present disclosure will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the disclosure. Furthermore, it should be noted that, for ease of description, only the parts relevant to the present disclosure are shown in the accompanying drawings.

[0029] It should be noted that, where there is no conflict, the embodiments and features described in this disclosure can be combined with each other. The technical solutions of this disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0030] Unless otherwise stated, the exemplary implementations / embodiments shown are to be understood as providing exemplary features of various details that provide ways in which the technical concepts of this disclosure can be implemented in practice. Therefore, unless otherwise stated, the features of various implementations / embodiments may be additionally combined, separated, interchanged and / or rearranged without departing from the technical concepts of this disclosure.

[0031] The use of crosshairs and / or shading in the accompanying drawings is generally used to clarify the boundaries between adjacent components. Thus, unless otherwise stated, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for the specific material, material properties, dimensions, proportions, commonalities between the illustrated components, or any other characteristics, properties, etc., of the components. Furthermore, in the accompanying drawings, the dimensions and relative dimensions of components may be exaggerated for clarity and / or descriptive purposes. When exemplary embodiments can be implemented differently, a specific process sequence may be performed in a different order than that described. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description. Furthermore, the same reference numerals denote the same components.

[0032] When a component is referred to as being "on" or "above" another component, "connected to," or "joined to" another component, the component may be directly on, directly connected to, or directly joined to the other component, or there may be intermediate components. However, when a component is referred to as being "directly on" another component, "directly connected to," or "directly joined to" another component, there are no intermediate components. Therefore, the term "connection" can refer to a physical connection, an electrical connection, etc., and may or may not have intermediate components.

[0033] For descriptive purposes, this disclosure may use spatial relative terms such as “below,” “under,” “below,” “down,” “above,” “above,” “higher,” and “side (e.g., in a “sidewall”)” to describe the relationship between one component and another component as shown in the accompanying drawings. In addition to the orientations depicted in the drawings, the spatial relative terms are also intended to encompass different orientations of the device during use, operation, and / or manufacture. For example, if the device in the drawings is flipped, a component described as “below” or “under” another component or feature would subsequently be positioned “above” said other component or feature. Thus, the exemplary term “below” can encompass both “above” and “below” orientations. Furthermore, the device may be otherwise positioned (e.g., rotated 90 degrees or in other orientations), thus interpreting the spatial relative descriptive terms used herein accordingly.

[0034] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms “a” and “the” are intended to include the plural forms as well. Furthermore, when the terms “comprising” and / or “including” and variations thereof are used in this specification, it indicates the presence of the stated features, integrals, steps, operations, parts, components, and / or groups thereof, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, parts, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximate terms rather than as terms of degree, thus explaining the inherent biases in measurements, calculated values, and / or provided values ​​that would be recognized by one of ordinary skill in the art.

[0035] Figure 1 This is a schematic diagram of the usage state of a test stage supporting a first wafer 910 according to one embodiment of the present disclosure. Figure 2 This is a schematic diagram of the usage state of a test stage supporting a second wafer 920 according to one embodiment of the present disclosure. Figure 3 This is a schematic diagram of the structure of a testing stage according to one embodiment of the present disclosure. Figure 4 This is a structural schematic diagram of the testing stage from another angle according to one embodiment of the present disclosure.

[0036] like Figure 1 and Figure 2 As shown, the testing stage of this disclosure is configured to position and / or support wafers of different sizes. Specifically, as Figure 1 As shown, the testing stage is capable of positioning and supporting a first wafer 910 having a first size, which can be 12 inches. Figure 2 As shown, the testing stage can position and support a second wafer 920 with a second size, which can be 8 inches or 6 inches, etc. That is to say, in this disclosure, the first size can be larger than the second size.

[0037] In addition to 12-inch and 8-inch wafers, other sizes are also available. The number of support components for the inspection stage disclosed herein can be set to two or more, and these support components are arranged concentrically. The structures of the other support components besides the first support component 400 and the second support component 500 can be the same as or similar to the structure of the second support component 500, and will not be described in detail here.

[0038] like Figure 3 and Figure 4 As shown, the testing stage of this disclosure may include structures such as a substrate assembly 100 and a frame component 200.

[0039] The substrate assembly 100 is formed as a circular plate structure, thereby having a central axis. When the detection stage of this disclosure is in use, the substrate assembly 100 is set approximately horizontally, and at this time, the central axis is set approximately vertically.

[0040] The substrate assembly 100 may include an upper substrate 110 and a lower substrate 120; wherein, the lower substrate 120 has a first groove and a second groove, and the first groove and the second groove are independently provided. That is, the first groove and the second groove are not connected to each other.

[0041] The upper substrate 110 is disposed on the lower substrate 120. Accordingly, the upper substrate 110 can cover and close the upward openings of the first groove and the second groove. Thus, the first groove can form a first gas flow path, and the second groove can form a second gas flow path. The first gas flow path and the second gas flow path are also set independently of each other.

[0042] The substrate assembly 100 has a central hole in its middle. Specifically, both the upper substrate 110 and the lower substrate 120 have central holes, thereby forming a hole structure in the middle of the substrate assembly 100.

[0043] The frame member 200 is disposed on the substrate assembly 100, and the frame member 200 is movable relative to the substrate assembly 100 along the central axis of the substrate assembly 100. In other words, when the substrate assembly 100 of this disclosure is fixed to a rotating platform and is disposed substantially horizontally, the frame member 200 is capable of vertical movement relative to the substrate assembly 100.

[0044] At least three guide components 300 may be provided on the frame component 200 of this disclosure. Specifically, such as Figure 4 As shown, there are four guide components 300. These four guide components 300 can be evenly distributed along the circumferential direction of the substrate assembly 100, or they can be disposed at the four corners of a rectangle having the same center as the substrate assembly 100. In other words, the center of the rectangle is located on the central axis of the substrate assembly 100.

[0045] In one specific embodiment, the guide assembly 300 includes components such as a first fixing member 310 and a second fixing member 320. The upper end of the first fixing member 310 can be fixed to the lower surface of the frame component 200, and the lower end of the first fixing member 310 is suspended. The upper end of the second fixing member 320 can be fixed to the lower surface of the substrate assembly 100, the lower end of the second fixing member 320 is suspended, and a limiting member 330 can be provided at the lower end of the second fixing member 320. The limiting member 330 can be a limiting block or a limiting plate, etc.

[0046] The second fixing member 320 is provided with a first guide rail 340, which is generally vertically arranged. In other words, the first guide rail 340 can be arranged parallel to the central axis. The first fixing member 310 can be fixedly connected to the first slider 350, and the first slider 350 is slidably arranged on the first guide rail 340, thereby providing guidance for the movement of the frame member 200 through the guide assembly 300.

[0047] In addition, the first fixing member 310 is provided with a buffer block. When the frame member 200 is at the maximum stroke (i.e., the maximum position) of the downward movement, the buffer block can contact the limiting member 330. Accordingly, by providing the buffer block, the downward movement of the frame member 200 can be buffered.

[0048] Additionally, it should be noted that the guide assembly 300 may also include a spring 360, one end of which is connected to the first fixing member 310 and the other end is connected to the second fixing member 320. Moreover, the spring 360 is in a stretched state, thereby the spring 360 can apply a downward force to the frame member 200 and cause the frame member 200 to be in the maximum downward movement position.

[0049] In other words, when an upward force is applied to the frame component 200, for example, when the frame component 200 is subjected to an upward force by a component such as a cylinder, the frame component 200 can move upward. At this time, the first ejector pin 600 and the second ejector pin 700 described below will be in a receiving state. When the external force applied to the frame component 200 disappears, the frame component 200 can move downward under the action of the restoring force provided by the spring 360, and move to the maximum position in the downward direction. At this position, the upper end of the first ejector pin 600 is lower than the upper end of the first suction nozzle assembly 420, and correspondingly, the upper end of the second ejector pin 700 is lower than the upper end of the second suction nozzle assembly 520.

[0050] In other words, the first ejector pin 600 and the second ejector pin 700 of this disclosure are only used for receiving wafers, and are not used for picking up and fixing wafers.

[0051] In this disclosure, a first support component 400 and a second support component 500 are provided on the substrate assembly 100. The first support component 400 is used to support a first wafer 910 of a first size, and the second support component 500 is used to support a second wafer 920 of a second size. The first size is larger than the second size.

[0052] Specifically, when using the testing stage disclosed herein, the size of the wafer can be preset, and the wafer can be determined to be supported by the first support component 400 or the second support component 500 based on the size of the wafer. Accordingly, the first support component 400 or the second support component 500 can be set to the working state.

[0053] In this disclosure, the first support component 400 includes a plurality of first positioning blocks 410 disposed on the upper surface of the substrate component 100, wherein the first positioning block 410 has a first positioning surface, which can contact and position the first wafer 910 with the side surface of the first wafer 910.

[0054] In addition, the first support component 400 of this disclosure also includes a plurality of first suction nozzle components 420 disposed on the substrate component 100, the first suction nozzle components 420 being disposed around the central axis.

[0055] In one specific embodiment, the first nozzle assembly 420 of this disclosure is configured as six groups, which are equally spaced around a central axis, thereby stably supporting the first wafer 910. In another embodiment, the number of the first nozzle assembly 420 can be other values.

[0056] In this disclosure, each first nozzle assembly 420 includes a plurality of first nozzles, which contact the lower surface of the first wafer 910 and adsorb the first wafer 910. Specifically, as Figure 3 and Figure 4 As shown, the first nozzle assembly 420 of this disclosure may include two first nozzles, which are distributed on a circle whose center may be located on a central axis and whose diameter is smaller than that of the first wafer 910.

[0057] The first suction nozzle of this disclosure is connected to a first gas flow path, so that when a negative pressure is provided to the first gas flow path, the first suction nozzle can pick up and fix the first wafer 910.

[0058] See again Figure 3 and Figure 4 The testing stage of this disclosure may also include a first ejector pin 600, which is fixed to the frame component 200, so that the first ejector pin 600 can move along the central axis direction with the frame component 200, that is, the first ejector pin 600 can generate vertical up and down movement.

[0059] Furthermore, the substrate assembly 100 of this disclosure includes a first through hole, through which the upper end of the first ejector pin 600 can pass and is located above the upper surface of the substrate assembly 100. Moreover, the diameter of the first through hole is larger than the diameter of the first ejector pin 600, thereby allowing the first ejector pin 600 to move up and down within the first through hole without contacting the sidewall of the through hole.

[0060] In the initial state, the upper end of the first ejector pin 600 can be higher than the upper end of the first suction nozzle assembly 420, so that when the larger first wafer 910 is placed on the detection stage of this disclosure, the first ejector pin 600 can first contact the lower surface of the first wafer 910. After the first ejector pin 600 descends, the first wafer 910 contacts the first suction nozzle assembly 420 and is adsorbed and fixed by the first suction nozzle assembly 420.

[0061] In a preferred embodiment, the diameter of the first suction nozzle is less than 3 mm. Thus, when the first suction nozzle picks up the first wafer 910, the contact area between the first suction nozzle and the first wafer 910 is located within 3 mm of the edge of the first wafer 910. Therefore, the first suction nozzle will not affect the middle part of the first wafer 910.

[0062] Similarly, the first ejector pin 600 is also a suction nozzle. In this case, the first ejector pin 600 can be individually provided with negative pressure to adsorb and pre-fix the first wafer 910. In addition, the diameter of the first ejector pin 600 is less than 3 mm, so the contact area between the first ejector pin 600 and the first wafer 910 is also located within 3 mm of the edge of the first wafer 910.

[0063] In other words, when the larger first wafer 910 is placed on the testing platform of this disclosure, the first wafer 910 can be moved to the top of the testing platform by a robotic arm driving a toothed fork. At this time, when the toothed fork moves downward, if the axis of the first wafer 910 coincides with or approximately coincides with the central axis, the first wafer 910 will not contact the first positioning block 410. On the other hand, if the deviation between the axis of the first wafer 910 and the central axis is large, the edge of the first wafer 910 can contact the positioning surface of the first positioning block 410. At this time, the first wafer 910 can be guided to the correct position by the first positioning block 410, so that the axis of the first wafer 910 coincides with or approximately coincides with the central axis.

[0064] Furthermore, when the first wafer 910 of this disclosure is rotating, if the first suction nozzle assembly 420 cannot securely fix the first wafer 910, the first wafer 910 will experience radial displacement. In this case, the first positioning block 410 can restrict the radial movement of the first wafer 910. In other words, in the testing stage of this disclosure, the contact between the first wafer 910 and the first positioning block 410 can prevent the first wafer 910 from detaching from the testing stage, thereby preventing damage to the first wafer 910.

[0065] In this disclosure, the second support assembly 500 includes a plurality of second suction nozzle assemblies 520 disposed on the substrate assembly 100. The second suction nozzle assemblies 520 are disposed around a central axis. In the height direction (i.e. along the central axis), the second suction nozzle assemblies 520 are lower than the first suction nozzle assembly 420. Therefore, when the larger first wafer 910 is placed on the testing stage, the second suction nozzle assembly 520 will not contact the first wafer 910. Accordingly, the second suction nozzle assembly 520 will not have a negative impact on the first wafer 910.

[0066] In addition, when the smaller second wafer 920 is placed on the testing stage, the second wafer 920 is located entirely within the area enclosed by the first nozzle assembly 420, and accordingly, the second wafer 920 will not come into contact with the first nozzle assembly 420.

[0067] In one specific embodiment, the second nozzle assembly 520 of this disclosure is configured as six groups, which are equally spaced around a central axis, thereby stably supporting the second wafer 920. In another embodiment, the number of the second nozzle assembly 520 can be other values.

[0068] In this disclosure, each second nozzle assembly 520 includes a plurality of second nozzles, which contact the lower surface of the second wafer 920 and adsorb the second wafer 920. Specifically, as Figure 3 and Figure 4 As shown, the second nozzle assembly 520 of this disclosure may include two second nozzles, which are distributed on a circle whose center may be located on a central axis and whose diameter is smaller than that of the second wafer 920.

[0069] The second nozzle of this disclosure is connected to the second gas flow path, so that when a negative pressure is provided to the second gas flow path, the second nozzle can pick up and fix the second wafer 920.

[0070] See again Figure 3 and Figure 4The testing stage of this disclosure may also include a second ejector pin 700, which is fixed to the frame component 200, thereby enabling the second ejector pin 700 to move along the central axis direction with the frame component 200, that is, the second ejector pin 700 can generate vertical up-and-down movement.

[0071] Furthermore, the substrate assembly 100 of this disclosure includes a second through-hole, through which the upper end of the second ejector pin 700 can pass, located above the upper surface of the substrate assembly 100. Moreover, the diameter of the second through-hole is larger than the diameter of the second ejector pin 700, thereby allowing the second ejector pin 700 to move up and down within the second through-hole without contacting the sidewall of the through-hole. In a preferred embodiment, multiple first ejector pins 600 can be provided, for example, four first ejector pins 600 can be provided, which can be evenly distributed along the circumference of the substrate assembly 100, or can be provided at the four corners of a rectangle having the same center as the substrate assembly 100. In other words, the center of the rectangle is located on the central axis of the substrate assembly 100.

[0072] Similarly, multiple second ejector pins 700 are also provided. Specifically, the number of second ejector pins 700 is the same as the number of first ejector pins 600, and the first ejector pins 600 and second ejector pins 700 located in the same radial direction can be fixed to the frame member 200 by the same connecting member.

[0073] Similarly, the second ejector pin 700 is also a suction nozzle. In this case, the second ejector pin 700 can be individually provided with negative pressure to adsorb and pre-fix the second wafer 920. In addition, the diameter of the second ejector pin 700 is less than 3 mm, so the contact area between the second ejector pin 700 and the second wafer 920 is also located within 3 mm of the edge of the second wafer 920.

[0074] In the initial state of use, the upper end of the second ejector pin 700 of the inspection stage disclosed herein can be higher than the upper end of the second nozzle assembly 520. Therefore, when a smaller second wafer 920 is placed on the inspection stage, the second ejector pin 700 can first contact the lower surface of the second wafer 920. Only after the second ejector pin 700 descends does the second wafer 920 contact the second nozzle assembly 520, where it is then adsorbed and fixed. Accordingly, the inspection stage of this disclosure, through the arrangement of the first ejector pin 600 and the second ejector pin 700, can receive wafers more stably, effectively preventing wafer damage.

[0075] Figure 5 This is a schematic diagram of the structure of an air blowing device 800 according to one embodiment of the present disclosure. Figure 6This is a structural schematic diagram of an air blowing device 800 according to one embodiment of the present disclosure from another angle.

[0076] like Figure 5 and Figure 6 As shown, the substrate assembly 100 of this disclosure has a central hole, and the inspection stage also includes an air blowing device 800, wherein at least a portion of the air blowing device 800 passes through the central hole and is located above the substrate assembly 100; the air blowing device 800 is used to provide airflow to the center of the first wafer 910 or the second wafer 920 carried by the inspection stage, at which time, the portion of the first wafer 910 or the second wafer 920 corresponding to the air blowing device 800 forms a suspension effect. In addition, since different wafers have different flatness, the airflow size of the air blowing device 800 can be adjusted to ensure the flatness of the wafer, thereby ensuring the effect of AOI inspection (Automatic Optical Inspection).

[0077] In a preferred embodiment, the air blowing device 800 is configured to move along the central axis, such that the upper end of the air blowing device 800 is spaced a predetermined distance from the lower surface of the first wafer 910 or the lower surface of the second wafer 920. This allows for easy control of the airflow magnitude of the air blowing device 800. In other words, the height and airflow magnitude of the air blowing device 800 can be adjusted synchronously, resulting in a better wafer suspension effect.

[0078] See again Figure 5 and Figure 6 The lower surface of the substrate assembly 100 disclosed herein is provided with a support cylinder 130, and a guide structure is provided on the support cylinder 130. The guide structure is used to guide the movement of the air blowing device 800 along the central axis direction.

[0079] Specifically, the guiding structure of this disclosure may include a fixing component 810; the upper end of the fixing component 810 is fixed to the substrate assembly 100, and the lower end of the fixing component 810 is suspended. In a preferred embodiment, a limiting component 830 may be provided at the lower end of the fixing component 810. In addition, a second guide rail 840 is provided on the fixing component 810 of this disclosure, and the second guide rail 840 is arranged substantially vertically.

[0080] The air blowing device 800 is fixed with a second slider 850, which is slidably disposed on the second guide rail 840. Thus, the vertical movement process of the air blowing device 800 of this disclosure can be guided by the guide structure.

[0081] In one embodiment, the detection stage of this disclosure further includes a drive device 860, which drives the air blowing device 800 to move along the central axis. In one embodiment, the drive device 860 can be a cylinder capable of horizontal movement. In this case, the cylinder can be fixed to the wedge block 870, allowing the wedge block 870 to move horizontally. The upper surface of the wedge block 870 is an inclined surface, which can engage with the lower end of the air blowing device 800, causing the air blowing device 800 to move vertically when the wedge block 870 moves horizontally.

[0082] Unlike existing technologies, the structure of the testing stage disclosed herein is compatible with wafers of different sizes while minimizing the risks associated with manual switching operations. Furthermore, the testing stage of this disclosure only contacts the edge area of ​​the wafer, reducing the risk of the wafer surface being touched, thus achieving convenience while saving time and costs.

[0083] Meanwhile, since the first support component 400 and the second support component 500 avoid each other in height, the inspection stage of this disclosure can be compatible with wafers of different sizes, realizing the sharing of a single inspection stage for wafers of different sizes. This avoids the problem of needing to change the inspection stage when the wafer size changes in the prior art, reduces the time of switching work orders, and improves the efficiency of wafers being inspected on the inspection stage.

[0084] In addition, the air blowing device 800 ensures that the central area of ​​the wafer does not sag, thereby enabling accurate AOI inspection of the wafer and improving the inspection effect.

[0085] In the description of this specification, the references to terms such as "one embodiment / mode," "some embodiments / modes," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment / mode or example is included in at least one embodiment / mode or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment / mode or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments / modes or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments / modes or examples described in this specification, as well as the features of different embodiments / modes or examples.

[0086] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0087] Those skilled in the art should understand that the above embodiments are merely for illustrating the present disclosure and are not intended to limit the scope of the disclosure. Those skilled in the art can make other changes or modifications based on the above disclosure, and these changes or modifications still fall within the scope of the present disclosure.

Claims

1. A testing stage, characterized in that, include: A substrate assembly having a central axis; wherein the substrate assembly includes a first gas flow path and a second gas flow path, and A frame component, the frame component being configured to move relative to the substrate assembly along the central axis of the substrate assembly; The substrate assembly is provided with a first support assembly and a second support assembly. The first support assembly is used to support a first wafer of a first size, and the second support assembly is used to support a second wafer of a second size, wherein the first size is larger than the second size. The first support assembly includes a plurality of first suction nozzle assemblies disposed on the substrate assembly, each first suction nozzle assembly including a plurality of first suction nozzles; the second support assembly includes a plurality of second suction nozzle assemblies disposed on the substrate assembly, each second suction nozzle assembly including a plurality of second suction nozzles; the upper end of the second suction nozzle is lower than the upper end of the first suction nozzle; wherein, the first gas flow path is connected to the first suction nozzle, and the second gas flow path is connected to the second suction nozzle; The substrate assembly includes a central hole, and the testing stage further includes an air blowing device and a driving device. At least a portion of the air blowing device passes through the central hole and is located above the substrate assembly. The air blowing device provides airflow to the center of the first or second wafer carried by the testing stage. The air blowing device is configured to move relative to the substrate assembly along the central axis, such that the upper end of the air blowing device is spaced a predetermined distance from the lower surface of the first wafer or the lower surface of the second wafer. The driving device drives the air blowing device to move along the central axis.

2. The testing stage according to claim 1, characterized in that, The first support component includes a plurality of first positioning blocks disposed on the upper surface of the substrate component, wherein the first positioning block has a first positioning surface, the first positioning surface being capable of contacting and positioning the first wafer with the side surface of the first wafer.

3. The testing stage according to claim 1, characterized in that, The first suction nozzle assembly is arranged around the central axis.

4. The testing stage according to claim 3, characterized in that, The first nozzle contacts the lower surface of the first wafer and adsorbs and fixes the first wafer.

5. The testing stage according to claim 4, characterized in that, The second suction nozzle assembly is arranged around the central axis, wherein, along the central axis, the second suction nozzle assembly is lower than the first suction nozzle assembly.

6. The testing stage according to claim 5, characterized in that, The second nozzle contacts the lower surface of the second wafer and adsorbs and fixes the second wafer.

7. The testing stage according to claim 1, characterized in that, A support cylinder is provided on the lower surface of the substrate assembly, and a guide structure is provided on the support cylinder. The guide structure is used to guide the movement of the air blowing device along the central axis.

8. The testing stage according to claim 1, characterized in that, Also includes: A first ejector pin is fixed to a frame component; the substrate assembly includes a first through hole through which the upper end of the first ejector pin can pass and is located above the upper surface of the substrate assembly; the first ejector pin is used to pick up and pre-fix the first wafer.

9. The testing stage according to claim 8, characterized in that, The diameter of the first through hole is larger than the diameter of the first ejector pin.

10. The testing stage according to claim 1, characterized in that, Also includes: The second ejector pin is fixed to the frame component; the substrate assembly includes a second through hole through which the upper end of the second ejector pin can pass and is located above the upper surface of the substrate assembly, and the second ejector pin is used to pick up and pre-position the second wafer.

11. The testing stage according to claim 10, characterized in that, The diameter of the second through hole is larger than the diameter of the second ejector pin.

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