Automatic implementation method and device for PDN simulation process

Abstract

The invention discloses an automatic implementation method and device for a PDN simulation process, and the method comprises the steps: analyzing a standard lamination information table in a preset format, and generating an XML netlist file containing a lamination structure and material attributes; a PDN simulation software API interface is called, an XML netlist and a PCB design file are loaded, lamination attributes and port settings are automatically configured, simulation is executed based on an input frequency range, and a data file is generated; impedance parameters in the simulation data are extracted and compared with an impedance range specification file of a pre-stored protocol standard, and a simulation curve graph and a passing / failure judgment result are generated; and matching a simulation report template according to a protocol type, inserting the curve graph and a judgment result into the template, and outputting a standardized simulation report.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic circuit design and simulation, and in particular to a method and device for automating a PDN simulation process. Background Art

[0002] As component clock frequencies continue to increase and more functions are integrated into chips, chip power consumption is increasing. Simultaneously, advances in chip manufacturing processes are reducing chip supply voltages. Furthermore, increased chip integration requires more power supply types within a single chip, and these multiple power domains complicate power system design. Furthermore, the chip's inherent sensitivity to power supply fluctuations is increasing, directly reducing the design margins within the power system. Power integrity design, which ensures system power performance, has become a focus of industry attention, alongside signal integrity and electromagnetic compatibility design. Power integrity design methodologies have evolved from qualitative design methods based on product designers' experience and rules to the use of various simulation techniques, becoming a key technology in the PCB design stage. Simulation avoids the repetitive analysis-correction-reanalysis cycle often associated with post-verification methods, thereby reducing revisions and improving development efficiency.

[0003] The existing PDN simulation method involves identifying the power planes to be simulated based on actual simulation requirements, selecting appropriate board-level circuit simulation software, importing the PCB file, setting the stackup, assigning the corresponding lumped device S-parameter models, configuring the ports, and then setting the solution frequency based on the simulation requirements. The spec file is then imported into the simulation results for comparison and evaluation of the current design. This manual PDN simulation method is time-consuming and labor-intensive, prone to setup errors, and requires manual reconfiguration when simulating a large number of power supplies, which can slow down project development.

[0004] Therefore, a fast and accurate PDN simulation method is needed to improve the efficiency and accuracy of simulation and thus improve development efficiency. Summary of the Invention

[0005] The present invention provides a method and device for automatically implementing a PDN simulation process, so as to overcome at least one technical problem existing in the prior art.

[0006] According to a first aspect of an embodiment of the present invention, a method for automating a PDN simulation process is provided, including:

[0007] Parsing the imported stacking information table to generate an XML netlist file containing stacking structure information and material property information; wherein the stacking information table is a standardized file pre-written in a preset format based on target requirements;

[0008] Calling an API interface of the PDN simulation software to drive the PDN simulation software to load the XML netlist file and the PCB design file required for simulation, so that the PDN simulation software performs stacking property configuration required for PDN simulation based on the XML netlist, and performs simulation port setting required for PDN simulation based on the PCB design file; the PDN simulation software performs PDN simulation according to the input frequency range and generates a simulation data file;

[0009] Reading the simulation data file, extracting impedance parameters and comparing them with a specification file storing a preset protocol standard impedance range, generating a simulation curve graph and a determination result of whether the protocol standard is met; wherein the specification file includes the qualified criterion range of the impedance parameters at different frequencies;

[0010] A corresponding simulation report template is selected according to the protocol type, and the simulation curve graph and the determination result are inserted into the simulation report template to generate a standardized simulation report.

[0011] In an optional embodiment, the preset format of the stacking information table specifically includes:

[0012] The column indexes of the stacking information table are "Layer", "Name", "Type", "Thickness", "Df", "Dk" and "material" in sequence; wherein the "Layer" column is used to indicate the number of layers of the PCB board, the "Name" column is used to indicate the name of each layer, the "Type" column is used to indicate the type of each layer, the "Thickness" column is used to indicate the thickness of each layer, the "Df" column is used to indicate the loss tangent of each layer of board material, the "Dk" column is used to indicate the dielectric constant of the board material, and the "material" column is used to indicate the name of the material filled in each layer;

[0013] The area between the preset number of rows of the stacking information table is a structured data area, which contains all the parameters required to generate the XML netlist and is prohibited from having any content other than that represented by the column index.

[0014] In an optional embodiment, the unit of the "Thickness" column is limited to mil or mm and cannot be left blank.

[0015] In an optional embodiment, the parsing of the stack information table to generate an XML netlist file containing stack structure information and material property information specifically includes:

[0016] Define a stack management data structure, which includes layer number Layer, layer name Name, layer type Type, thickness Thickness, material name Material, dielectric constant Dk, and loss tangent Df attributes;

[0017] Read the stack information table, get the total number of rows n, and initialize the row index variable i, 0≤i <n;

[0018] Traverse each row of data and define the layer type attribute parameters according to the parity of the row index i; if i is an even number, define the layer type as conductor and fill in conductor-related attributes; if i is an odd number, define the layer type as medium and fill in medium-related attributes;

[0019] Calculate the cumulative thickness layer by layer and generate the total thickness parameter Evaluation;

[0020] Map the layer number, layer name, layer type, thickness and total thickness parameters of each layer to XML nodes;

[0021] Defining a material property module based on the values ​​of the dielectric constant Dk and the loss tangent Df;

[0022] An XML netlist file including stacked structure information and material parameters is generated according to the XML nodes and material attribute module.

[0023] In an optional implementation, the port setting is based on the power network label and the main chip number in the PCB design file.

[0024] In an optional embodiment, before reading the simulation data file, extracting the impedance parameters and comparing them with a specification file storing a preset protocol standard impedance range, the method includes:

[0025] Constructing a spec protocol standard library, including: manually writing specification files that meet the protocol requirements and integrating them into the standard library. The naming format of the specification files is "protocol name_protocol specified frequency range_curve name.tab";

[0026] Constructing a simulation report template library includes: creating a corresponding simulation report template for each protocol, wherein the naming format of the simulation report template is "protocol name_Z parameter.docx", and a position for inserting a simulation curve is reserved in the simulation report template.

[0027] In an optional embodiment, the x-axis in the simulation curve graph represents frequency, the y-axis represents impedance of the simulation network, and the curve name is consistent with the curve name in the spec file.

[0028] According to a second aspect of an embodiment of the present invention, there is provided an apparatus for automating a PDN simulation process, including:

[0029] A stacking information table parsing module is used to parse the imported stacking information table and generate an XML netlist file containing stacking structure information and material property information; wherein the stacking information table is a standardized file pre-written in a preset format according to target requirements;

[0030] A simulation driver module is configured to call an API interface of the PDN simulation software to drive the PDN simulation software to load the XML netlist file and the PCB design file required for simulation, so that the PDN simulation software configures the stacking properties required for PDN simulation based on the XML netlist, and configures the simulation ports required for PDN simulation based on the PCB design file; the PDN simulation software performs PDN simulation according to the input frequency range and generates a simulation data file;

[0031] a data processing module configured to read the simulation data file, extract impedance parameters, and compare the extracted impedance parameters with a specification file storing a preset protocol standard impedance range, thereby generating a simulation curve graph and a determination result of whether the simulation meets the protocol standard; wherein the specification file includes a qualified criterion range for the impedance parameters at different frequencies;

[0032] The report generation module is used to select a corresponding simulation report template according to the protocol type, insert the simulation curve graph and the determination result into the simulation report template, and generate a standardized simulation report.

[0033] The embodiments of this specification can achieve at least the following beneficial effects:

[0034] 1. The technical solution of the present invention uses a script program to realize fully automatic simulation of PDN. Compared with the manual simulation method, the use of automated simulation can significantly improve the simulation efficiency and accuracy and can perform multiple groups of simulations. When performing the same type of simulation, it is only necessary to modify the stacking information table, port name and solution frequency, without manual reset, which simplifies the simulation process and reduces the corresponding workload.

[0035] 2. This invention restricts the stackup information table format. By parsing the stackup information table to generate a netlist, it can effectively reduce stackup setting errors and improve simulation standardization. In addition, the generated .xml file can be used to import stackups in other scenarios.

[0036] 3. The present invention performs post-processing on the simulation data, generates simulation curves based on the simulation data files generated by the software and the spec files of each standard, and inserts them into the document to automatically generate simulation reports, thereby reducing the workload of simulation personnel.

[0037] 4. The method proposed in the present invention can be reused in similar projects and is not limited to a certain simulation software. The simulation rules and algorithms are applicable to various PDN simulation software. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0039] Figure 1 A flowchart of a method for automating a PDN simulation process provided in an embodiment of this specification;

[0040] Figure 2 A schematic diagram of a process for parsing a stacking information table to generate files required for PDN simulation in an automated implementation method of a PDN simulation process provided in an embodiment of this specification;

[0041] Figure 3 This is a flowchart of simulation data post-processing and report generation in the automated implementation method of the PDN simulation process provided in the embodiments of this specification;

[0042] Figure 4 A schematic diagram of a stacking information table required for PDN simulation in an actual scenario;

[0043] Figure 5 A schematic diagram of the XML netlist required for PDN simulation in a real scenario;

[0044] Figure 6 The embodiments of this specification provide corresponding Figure 1 A structural diagram of a device for automating a PDN simulation process. DETAILED DESCRIPTION

[0045] To make the purpose, technical solutions, and advantages of one or more embodiments of this specification more clear, the technical solutions of one or more embodiments of this specification will be clearly and completely described below in conjunction with the specific embodiments of this specification and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of one or more embodiments of this specification.

[0046] It should be understood that although the terms first, second, third, etc. may be used in this application document to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other.

[0047] Figure 1 This is a flow chart of a method for automating a PDN simulation process provided by an embodiment of this specification. From a program perspective, the execution body of the process can be a script program written in a scripting language (such as Python).

[0048] like Figure 1 As shown, the process may include the following steps.

[0049] Step 102: Parse the imported stacking information table to generate an XML netlist file containing stacking structure information and material property information; wherein the stacking information table is a standardized file pre-written in a preset format based on target requirements.

[0050] In this step, the stacking information table can refer to an Excel file filled out by the user in a preset format, which contains the physical parameters and material property information of the PCB stacking. An XML netlist is a file that uses XML format to record and represent information related to electronic circuit design. It organizes various key information of the circuit, such as components, connection relationships, physical structure, electrical characteristics, etc., in the form of tags and elements to construct a structured data document. In PDN simulation, the XML netlist contains stacking structure information and material property information. In the technical solution of this embodiment, a script program is used to parse the imported stacking information table to generate an XML netlist file. Through the XML netlist, the PDN simulation software in subsequent steps can obtain detailed information about the circuit, and then build an accurate simulation model to simulate the behavior of the power supply on the circuit board and evaluate the performance of the power distribution network, such as impedance and voltage drop.

[0051] Target requirements can refer to the specific requirements that users put forward for the PCB stackup structure and material properties in order to achieve specific PDN simulation goals, such as the PCB physical structure requirements, electrical performance requirements, and manufacturing process constraints of a specific simulation project. In this embodiment, these requirements are converted into structured data through standardized tables, and the program can automatically generate the XML netlist required for subsequent PDN simulation.

[0052] Step 104: Call the API interface of the PDN simulation software to drive the PDN simulation software to load the XML netlist file and the PCB design file required for simulation, so that the PDN simulation software configures the stacking properties required for PDN simulation based on the XML netlist, and enables the PDN simulation software to set the simulation ports required for PDN simulation based on the PCB design file; the PDN simulation software performs PDN simulation according to the input frequency range and generates a simulation data file.

[0053] In this step, the PDN (Power Distribution Network) is responsible for providing stable and reliable power to all chips and components in electronic systems. Advances in chip technology are driving higher demands on PDN design and analysis. PCB design files can be .brd project files, a common file format in printed circuit board (PCB) design that contains extensive PCB design information.

[0054] In this step, the API of the simulation software is called through a script program to implement operations including file loading, stack configuration, port creation and simulation control. Among them, in the file loading link, the PCB design file and the stack netlist file are loaded. Then, in the stack configuration environment, the properties of each layer are set according to the XML netlist. In the port creation link, the simulation port is created based on the power network and main chip bit number of the PCB file. In the simulation control link, the solution frequency range is set to trigger the simulation execution. For example, the solution frequency range can be set through the interface set_frequency_range(start,end), and the simulation execution can be triggered through the interface run_simulation().

[0055] In existing technologies, manual operations such as configuring stack parameters, creating ports, and setting simulation parameters are time-consuming and error-prone. This solution uses a script to call the simulation software interface, automatically completing file loading, parameter configuration, and simulation execution, significantly reducing simulation time compared to existing technologies. Given that the API supports asynchronous calls, the solution in this step can also simultaneously launch multiple simulation tasks (such as those for different power networks and frequency ranges). This allows for rapid verification of performance differences between different design solutions by adjusting stack thicknesses, changing materials, and so on.

[0056] Step 106: Read the simulation data file, extract the impedance parameters and compare them with the specification file that stores the preset protocol standard impedance range, generate a simulation curve graph and a judgment result on whether it meets the protocol standard; wherein the specification file includes the qualified criterion range of the impedance parameters at different frequencies.

[0057] In this step, the specification file refers to a file in the spec protocol standard library. This pre-established file collection contains PDN simulation-related standards and rules. It is used throughout the simulation process to evaluate the compliance of simulation results. It defines acceptable ranges for various electrical performance indicators and parameters, providing clear criteria for determining whether the power distribution network's performance meets design requirements. The specification file can specify specific numerical ranges for key electrical performance indicators such as power supply noise, voltage drop, and impedance. For example, it can stipulate that the peak power supply noise must not exceed a certain value, or that voltage drop must be controlled within a certain percentage. The specification file can set performance standards for different operating frequencies. Because PDN performance may vary at different frequencies, precise performance evaluation within the frequency range is necessary. After the PDN simulation is complete, the system reads the simulation data file and compares each performance indicator against the standards in the specification file. This automatically determines whether the simulation results meet requirements, for example, whether the power supply noise is within the allowable range or whether the impedance meets design requirements. The contents of the specification file can be incorporated into the final simulation report. When generating a report, simulation results are displayed alongside the standards in the specification document, visually demonstrating whether the PDN's performance meets the standards. Specification documents can adhere to specific protocol standards and be named accordingly when they are created to ensure consistency and repeatability across different projects and simulation processes. This facilitates communication and collaboration among different personnel and promotes standardized management of the entire simulation process.

[0058] In this step, you need to pre-establish a standard library of spec protocols. This library contains spec files for all common protocols, typically with the suffix .tab. You can obtain spec files from the protocol's official website, chip manufacturer documentation, or industry standards organizations (such as IEEE). To better match simulation results, you need to restrict the naming to the following format: "Protocol name_Protocol specified frequency range_Curve name+File suffix," for example, MIPI-D-PHY_0-2.5GHz_Z11.tab.

[0059] Step 108: Select a corresponding simulation report template according to the protocol type, insert the simulation curve graph and the determination result into the simulation report template, and generate a standardized simulation report.

[0060] A report template library is established that corresponds one-to-one to common protocols (such as MIPI-D-PHY, USB3.2, DDR5, etc.). Each template uses the .docx format and the naming convention is "protocol name_Z parameters.docx" (such as MIPI-D-PHY_Z parameters.docx). The template structure can include an overview of the protocol standard, a description of the simulation conditions (frequency range, port settings), a curve chart placeholder (preset size 400x300 pixels), a judgment result text box, and a compliance summary paragraph. The user selects the target protocol type through the interface (such as selecting "MIPI-D-PHY" through the drop-down menu). The system automatically locates the corresponding template file in the template library (such as MIPI-D-PHY_Z parameters.docx) based on the protocol name. Combined with the frequency range of the simulation settings (such as 1MHz to 1GHz), the matching specification file (such as MIPI-D-PHY_1MHz-1GHz_Z11.tab) is retrieved from the spec standard library. This implementation method achieves seamless conversion from simulation data to professional reports through predefined template structures and automated graphic and text insertion technology.

[0061] Figure 1 The method in this paper uses a script program to achieve fully automated PDN simulation. Compared with manual simulation methods, automated simulation can significantly improve simulation efficiency and accuracy and can perform multiple simulations. When performing the same type of simulation, only the stacking information table, port names, and solution frequencies need to be modified, without manual resetting. This simplifies the simulation process and reduces the corresponding workload. Furthermore, the method proposed in this paper can be reused in similar projects and is not limited to a specific simulation software. The simulation rules and algorithms are applicable to various PDN simulation software.

[0062] based on Figure 1 The present specification also provides some specific implementation plans of the method, which are described below.

[0063] In an optional embodiment, the preset format of the stacking information table may specifically include: the column indexes of the stacking information table are "Layer", "Name", "Type", "Thickness", "Df", "Dk" and "material" in sequence; wherein the "Layer" column is used to indicate the number of layers of the PCB board, the "Name" column is used to indicate the name of each layer, the "Type" column is used to indicate the type of each layer, the "Thickness" column is used to indicate the thickness of each layer, the "Df" column is used to indicate the loss tangent of each layer of the board, the "Dk" column is used to indicate the dielectric constant of the board, and the "material" column is used to indicate the name of the material filled in each layer;

[0064] The area between the preset number of rows of the stack information table is a structured data area, which contains all the parameters required to generate the XML netlist and is prohibited from having any content other than that represented by the column index;

[0065] The odd-numbered rows in the preset number of rows store stacking information of dielectric layers, and the even-numbered rows store stacking information of conductor layers.

[0066] In the technical solution of this embodiment, the format of the stacking information table in step 102 is limited, and the column index is arranged as Layer→Name→Type→Thickness→Df→Dk→material, so as to ensure that the script program reads the data directly through the column position and avoids errors caused by relying on column name parsing. Among them, the data type of the column index "Layer" is an integer (non-negative), which is used to indicate the layer number of the PCB board, starting from 1 and increasing. The data type of the column index "Name" is a string, which is used to indicate the name of the layer (such as TOP, GND1, SIG2). The data type of the column index "Type" is an enumerated layer type:, which is used to indicate the layer type (conductor layer or dielectric layer). The data type of the column index "Thickness" is a floating point number, which is used to indicate the thickness of a single layer. The data type of the column index "Df" is a floating point number, which is used to indicate the loss tangent of the dielectric material (only valid for the dielectric layer). The data type of the column index "Dk" is a floating point number, which is used to indicate the dielectric constant of the dielectric material (only valid for the dielectric layer). The data type of the column index "material" is a string, which is used to describe the material name (such as copper, FR-4).

[0067] The term structured data area can refer to the core data part of the stacking information table that is arranged in a fixed format and automatically read by the program. It contains all the parameters required to generate the XML netlist (such as the number of layers, thickness, material properties, etc.). The content of this area (that is, the content specifically corresponding to the column index of the stacking information table) is stored between the preset number of rows of the stacking information table in step 102 (the specific number of rows can be dynamically adjusted according to the number of PCB layers). According to the PCB stacking structure convention, the conductor layer (such as the power layer, the ground layer) and the dielectric layer (such as FR4) are arranged alternately. In this embodiment, the odd-numbered layers are defined as dielectric layers and the even-numbered layers are defined as conductor layers to ensure the reasonable distribution of signal layers and power layers. At the same time, considering that mainstream PDN simulation tools require layer types to be defined in odd-even order, this rule is compatible with its internal algorithm. In this way, the script program directly determines the layer type by the parity of the row number, without the need for additional logical processing, which can improve parsing efficiency. The structured data area is prohibited from having any content other than that represented by the column index, that is, the area is prohibited from having data corresponding to non-column indexes (such as filling in text in the Thickness column), formulas, special symbols or comments; or it is prohibited from having blank lines or invalid data (such as a blank Thickness column), or it is prohibited from containing text, comments, formulas or other unstructured content, so as to facilitate the subsequent script program to automatically parse the stacking information table to generate an XML netlist. The XML netlist file can provide stacking parameters for the PDN simulation software, and can automatically configure the physical model in the simulation in combination with the .brd file.

[0068] In this embodiment, the stackup information table's pre-set format, designed with fixed column indexes, even-odd layer rules, and structured data constraints, facilitates scripts to directly parse the stackup information table and generate an XML netlist, eliminating the need for manual intervention. This approach also complies with PCB design specifications and simulation software's layer type definition rules. Furthermore, because the stackup information table's format is restricted, parsing the table to generate a netlist effectively reduces stackup setup errors and improves simulation compliance. Furthermore, the generated .xml file can be used for stackup import in other scenarios.

[0069] In an optional embodiment, the unit of the "Thickness" column is limited to mil or mm and cannot be left blank.

[0070] Considering that mil and mm are standard units in PCB design, limiting these two units in this embodiment's technical solution can avoid parsing errors caused by mixed unit usage (such as misusing cm and μm). Furthermore, PDN simulation software typically requires thickness in mil or mm. Unifying these units ensures direct compatibility between XML netlists and software interfaces, eliminating the need for additional conversion.

[0071] In this embodiment, it is considered that the thickness value is the core parameter of the laminated structure. A blank value will cause the XML netlist generation to fail or the simulation model to be distorted. Therefore, it is required that the value of the "Thickness" column cannot be blank. If it is detected that the thickness of a layer is empty, the script program can trigger a format verification error prompt, forcing the user to complete the data to ensure the validity of the input.

[0072] In an optional embodiment, as Figure 2 As shown, Figure 2 A flowchart illustrating parsing a stacking information table to generate files required for PDN simulation in an automated implementation method of a PDN simulation process provided in an embodiment of this specification. Parsing the stacking information table to generate an XML netlist file containing stacking structure information and material property information may specifically include:

[0073] Define a stack management data structure, which includes layer number Layer, layer name Name, layer type Type, thickness Thickness, material name Material, dielectric constant Dk, and loss tangent Df attributes;

[0074] Read the stack information table, get the total number of rows n, and initialize the row index variable i, 0≤i <n;

[0075] Traverse each row of data and define the layer type attribute parameters according to the parity of the row index i; if i is an even number, define the layer type as conductor and fill in conductor-related attributes; if i is an odd number, define the layer type as medium and fill in medium-related attributes;

[0076] Calculate the cumulative thickness layer by layer and generate the total thickness parameter Evaluation;

[0077] Map the layer number, layer name, layer type, thickness and total thickness parameters of each layer to XML nodes;

[0078] Defining a material property module based on the values ​​of the dielectric constant Dk and the loss tangent Df;

[0079] An XML netlist file including stacked structure information and material parameters is generated according to the XML nodes and material attribute module.

[0080] This embodiment provides a script to process a stackup information table to generate the XML netlist required for PDN simulation. The mapping between the structured data area in the stackup information table and the XML netlist is as follows: Layer → LayerID in the XML; Type → LayerType in the XML netlist (0 for dielectric layer, 2 for conductor layer); Thickness → Thickness attribute in the XML netlist; Dk, Df, and material → Material module in the XML netlist.

[0081] Specifically, the process realizes the automatic extraction and standardized output of stacking parameters by defining data structure, determining layer type by odd and even rows, and calculating cumulative thickness. First, define the stacking management data structure (which can be a class or a structure), and encapsulate each row of data in the stacking information table into a structured object for subsequent processing. Then read the table and initialize the parameters. During this process, the script program reads the structured data area of ​​the stacking information table, obtains the total number of rows n, and initializes the row index i (starting from 0). Then, the layer type is determined based on the odd and even rows. For even rows (i is an even number), it is defined as a conductor layer, and Dk and Df are filled with 0 or left blank. For odd rows (i is an odd number), it is defined as a dielectric layer, and Dk, Df, and material need to be filled in.

[0082] Considering that the electrical characteristics of a PCB (such as impedance, capacitance, and inductance) depend not only on the thickness of a single layer but are also closely related to the overall laminate structure, the total thickness (Evaluation) can help the PDN simulation software calculate the equivalent dielectric constant and signal propagation path of the interlayer dielectric, ensuring the accuracy of the electromagnetic field distribution. Therefore, the technical solution of this embodiment also performs cumulative thickness calculation, that is, the cumulative thickness of the i-th layer is equal to the cumulative thickness of the i-1th layer plus the thickness of the i-th layer itself. Define the material property module. For the material properties of the dielectric layer, extract Dk, Df, and material from the dielectric layer (odd rows) to generate the corresponding XML module. For the material properties of the conductor layer, extract the conductor layer material properties from the even rows. Finally, generate the XML netlist required for PDN simulation.

[0083] In this embodiment, the technical path of data structure definition → odd-even row judgment → cumulative thickness calculation → XML mapping is used to achieve automatic parsing and standardized output of stacking information. The stacking information table is automatically generated into the XML netlist required for PDN simulation based on the script program. In this process, the layer type is automatically identified based on the row index without manual intervention.

[0084] In an optional embodiment, the port setting is based on the power network label and the main chip number in the PCB design file.

[0085] In PCB design files, power network labels are artificial identifiers assigned to power transmission paths (such as "VDD_3V3" and "VCC_1V8"). They are used to distinguish power networks of different voltage levels and clarify current transmission paths. The main chip bit number is a unique number assigned to the core chip in the PCB design (such as "U1" and "IC2"). It is used to accurately locate the main chip's physical position and pin definition on the circuit board. The main chip serves as the core load of the power distribution network (PDN). Its bit number is a key index for identifying the chip's power pins and determining power requirements. The bit number can be used to associate the main chip's power input network and determine which power networks require port settings for simulation analysis.

[0086] Based on the above basic concepts, the technical solution of this embodiment first parses the PCB design file, that is, reads the PCB design file (such as the .brd format mentioned above) based on a script program, parses the network list and component information therein, and extracts all power network labels and main chip position numbers. For example, the routing range of the power network "VDD_5V" and the pin definition of the main chip position number "U101" are obtained from the file. Then, the main chip is associated with the power network, that is, according to the main chip position number, the power network to which its power pin is connected is located. For example, if the 8th pin of the main chip "U101" is connected to the power network "VDD_3V3", it is determined that "VDD_3V3" is the target network for which a port needs to be set. Finally, a port is created and bound, that is, a port is created for the associated power network in the PDN simulation software. The port location is usually set at the connection point between the power network and the main chip pin, or at a key transmission node of the power network (such as at both ends of the filter capacitor). By binding the power network label, it can be ensured that the port corresponds to the actual power transmission path one by one, so that the simulation software can accurately inject the power signal and analyze the impedance, noise and other characteristics of the network.

[0087] In an optional embodiment, before reading the simulation data file, extracting the impedance parameters, and comparing them with a specification file storing a preset protocol standard impedance range, the following steps may be included:

[0088] Constructing a spec protocol standard library, including: manually writing specification files that meet the protocol requirements and integrating them into the standard library. The naming format of the specification files is "protocol name_protocol specified frequency range_curve name.tab";

[0089] Constructing a simulation report template library includes: creating a corresponding simulation report template for each protocol, wherein the naming format of the simulation report template is "protocol name_Z parameter.docx", and a position for inserting a simulation curve is reserved in the simulation report template.

[0090] In the technical solution of this embodiment, to ensure that PDN simulation results can be efficiently and accurately compared with industry protocol standards and generate simulation reports in a unified format, a pre-built spec protocol standard library and simulation report template library are constructed. The spec protocol standard library is implemented by integrating specification files (.tab format) for various common protocols (such as MIPI, DDR, PCIe, etc.). These specification files are manually compiled according to protocol requirements and strictly follow the naming convention "Protocol Name_Protocol Specified Frequency Range_Curve Name.tab", for example, 'MIPI-D-PHY_0-2.5GHz_Z11.tab'. The "Protocol Name" in the file name identifies the protocol type (such as MIPI-D-PHY), the "Protocol Specified Frequency Range" defines the frequency band to be covered by the simulation (such as 0-2.5GHz), and the "Curve Name" corresponds to the simulation parameters (such as impedance Z11). This ensures that each file is unique and can be directly mapped to a specific simulation scenario. By pre-storing these files, the standard library provides benchmark data for automated comparison of simulation results. Users only need to select the protocol name and frequency range in the interface, and the system will automatically locate the corresponding specification file, avoiding manual search errors.

[0091] The simulation report template library corresponds one-to-one with the protocol standard library. Each protocol is associated with a dedicated template (which can be in .docx format), and the naming convention is "protocol name_Z parameters.docx", for example, 'DDR4_Z parameters.docx'. The template presets placeholders for simulation curves (such as picture frames) and standardized report structures (such as titles and conclusion paragraphs) to ensure that the report formats generated by different protocols are unified. In the user interface, by setting the "Simulation Type" interface, after the user selects the protocol name, the system automatically calls the corresponding template and further matches the frequency segment in the spec file based on the frequency range entered during simulation (such as 1MHz–1GHz), achieving accurate association between simulation data and protocol standards. For example, when the user selects the "TDA4" protocol and sets the frequency range to 10MHz–700MHz, the system will call the 'TDA4_Z parameters.docx' template and locate the 'TDA4_10MHz-700MHz_Z11.tab' specification file for result comparison. This design not only simplifies user operations but also significantly reduces the risk of manual configuration errors through strict naming conventions and an automated matching mechanism. It also supports flexible expansion across multiple protocols and frequency bands. Finally, the simulation curve graph and judgment result ("pass" or "fail") are automatically inserted into the specified location of the template, generating a standardized report such as 'test_TDA4PDN simulation report.docx' and storing it in a pre-set directory for quick access and archiving by engineers.

[0092] In an optional embodiment, the x-axis in the simulation curve graph represents the frequency, the y-axis represents the impedance of the simulation network, and the curve name is consistent with the curve name in the spec file.

[0093] In electronic circuits, signals often contain components at different frequencies. For power distribution networks (PDNs), their impedance characteristics vary with frequency, typically ranging from DC (0 Hz) to high frequencies (e.g., GHz). By plotting frequency on the x-axis, we can visually visualize the power distribution network's performance at different frequencies. Furthermore, considering that impedance is a physical quantity that measures the resistance to current flow in a circuit, it combines the effects of resistance, inductance, and capacitance. In a PDN, impedance directly impacts power supply stability and signal quality. Lower impedance means the power supply can more efficiently deliver current to the load, reducing voltage fluctuations and noise interference. To ensure that the power distribution network's impedance remains within a reasonable range across the entire operating frequency range during PCB design, the impedance value on the y-axis can be used to determine whether the power distribution network design meets requirements.

[0094] Keeping the curve names of the simulation graph consistent with those in the spec file makes it easy to compare simulation results with design specifications. When the curve names are the same, users can quickly find the corresponding standard requirements and determine whether the simulation curve is within the specified range, thereby evaluating the feasibility and effectiveness of the design.

[0095] The following is an example of a practical scenario to illustrate the technical solution of this application, including the following steps:

[0096] Step 1: Fill in the stacking information form according to the format restrictions of the stacking information form and the current stacking requirements. The template for this example is as follows: Figure 4 As shown, the stackup information table must include column information such as "Layer", "Name", "Type", "Thickness", "Df", "Dk" and "material". The number of rows in the table must be the same as the number of layers of the current PCB, and must be checked correctly.

[0097] Step 2: Import and parse the written table test.xlsx, generate a new netlist test.xml and import it into the simulation project.

[0098] Step 3: Import test.brd, select MIPI_D-PHY, identify chip number U700 and simulation network VCC3V3, create a port VRM for the simulated power network, set the solution to a frequency range of 1 MHz to 1 GHz, and use the linear step method. Perform PDN simulation and obtain the simulation data file.

[0099] Step 4: Read the obtained simulation data file and the corresponding TDA4_10MHz~700MHz.tab spec file to generate a picture with the x-axis as frequency and the y-axis as Z11. The simulation result is passed and the generated picture is stored in the simulation project path.

[0100] According to step 5: Output the test_TDA4PDN simulation report.docx simulation report.

[0101] Based on the same idea, the embodiments of this specification also provide a device corresponding to the above method. Figure 6 The embodiments of this specification provide corresponding Figure 1 A schematic diagram of the structure of a device for automating the PDN simulation process. Figure 6 As shown, the device may include:

[0102] A stack information table parsing module 602 is configured to parse an imported stack information table to generate an XML netlist file containing stack structure information and material property information; wherein the stack information table is a standardized file pre-written in a preset format based on target requirements;

[0103] The simulation driver module 604 is configured to call an API interface of the PDN simulation software to drive the PDN simulation software to load the XML netlist file and the PCB design file required for the simulation, so that the PDN simulation software configures the stacking properties required for the PDN simulation based on the XML netlist, and configures the simulation ports required for the PDN simulation based on the PCB design file; the PDN simulation software performs the PDN simulation according to the input frequency range and generates a simulation data file;

[0104] A data processing module 606 is configured to read the simulation data file, extract impedance parameters, and compare the extracted impedance parameters with a specification file storing a preset protocol standard impedance range, thereby generating a simulation curve graph and a determination result of whether the simulation meets the protocol standard; wherein the specification file includes the qualified range of the impedance parameters at different frequencies;

[0105] The report generating module 608 is configured to select a corresponding simulation report template according to the protocol type, insert the simulation curve graph and the determination result into the simulation report template, and generate a standardized simulation report.

[0106] It is understood that the above modules refer to computer programs or program segments for performing one or more specific functions. In addition, the distinction between the above modules does not mean that the actual program codes must also be separated.

[0107] Those skilled in the art will appreciate that the accompanying drawings are merely schematic diagrams of an embodiment, and the modules or processes in the accompanying drawings are not necessarily required to implement the present invention.

[0108] Those skilled in the art will appreciate that the modules in the apparatuses of the embodiments may be distributed in the apparatuses of the embodiments as described in the embodiments, or may be located in one or more apparatuses different from the embodiments with corresponding changes. The modules in the above embodiments may be combined into one module or further divided into multiple sub-modules.

[0109] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for automating a PDN simulation process, characterized in that: The method is executed by a script program written in a scripting language and includes the following steps: Parsing the imported stacking information table to generate an XML netlist file containing stacking structure information and material property information; wherein the stacking information table is a standardized file pre-written in a preset format based on target requirements; Calling an API interface of the PDN simulation software to drive the PDN simulation software to load the XML netlist file and the PCB design file required for simulation, so that the PDN simulation software performs the stacking property configuration required for the PDN simulation based on the XML netlist, and performs the simulation port setting required for the PDN simulation based on the PCB design file; the PDN simulation software performs the PDN simulation according to the input frequency range and generates a simulation data file; Reading the simulation data file, extracting impedance parameters and comparing them with a specification file storing a preset protocol standard impedance range, generating a simulation curve graph and a determination result of whether the protocol standard is met; wherein the specification file includes the qualified criterion range of the impedance parameters at different frequencies; A corresponding simulation report template is selected according to the protocol type, and the simulation curve graph and the determination result are inserted into the simulation report template to generate a standardized simulation report.

2. The method for automating the PDN simulation process according to claim 1, wherein: The preset format of the stacking information table specifically includes: The column indexes of the stacking information table are "Layer", "Name", "Type", "Thickness", "Df", "Dk" and "material" in order; wherein the "Layer" column is used to indicate the number of layers of the PCB board, the "Name" column is used to indicate the name of each layer, the "Type" column is used to indicate the type of each layer, the "Thickness" column is used to indicate the thickness of each layer, the "Df" column is used to indicate the loss tangent of each layer, the "Dk" column is used to indicate the dielectric constant of the board, and the "material" column is used to indicate the name of the material filled in each layer; The area between the preset number of rows of the stack information table is a structured data area, which contains all the parameters required to generate the XML netlist and is prohibited from having any content other than that represented by the column index; The odd-numbered rows in the preset number of rows store stacking information of dielectric layers, and the even-numbered rows store stacking information of conductor layers.

3. The method for automating the PDN simulation process according to claim 2, wherein: The unit of the "Thickness" column is limited to mil or mm and cannot be left blank.

4. The method for automating the PDN simulation process according to claim 2, wherein: The parsing of the stack information table to generate an XML netlist file containing stack structure information and material property information specifically includes: Define a stack management data structure, which includes layer number Layer, layer name Name, layer type Type, thickness Thickness, material name Material, dielectric constant Dk, and loss tangent Df attributes; Read the stack information table, get the total number of rows n, and initialize the row index variable i, 0≤i <n; Traverse each row of data and define the layer type attribute parameters according to the parity of the row index i; if i is an even number, define the layer type as conductor and fill in conductor-related attributes; if i is an odd number, define the layer type as medium and fill in medium-related attributes; Calculate the cumulative thickness layer by layer and generate the total thickness parameter Evaluation; Map the layer number, layer name, layer type, thickness and total thickness parameters of each layer to XML nodes; Defining a material property module based on the values ​​of the dielectric constant Dk and the loss tangent Df; An XML netlist file including stacked structure information and material parameters is generated according to the XML nodes and material attribute module.

5. The method for automating the PDN simulation process according to claim 2, wherein: The port settings are based on the power network label and main chip number in the PCB design file.

6. The method for automating the PDN simulation process according to claim 1, wherein: Before reading the simulation data file, extracting the impedance parameters and comparing them with the specification file storing the preset protocol standard impedance range, the method includes: Constructing a spec protocol standard library, including: manually writing specification files that meet the protocol requirements and integrating them into the standard library. The specification files are named in the format of "protocol name_protocol specified frequency range_curve name.tab"; Constructing a simulation report template library includes: creating a corresponding simulation report template for each protocol, the naming format of the simulation report template is "protocol name_Z parameter.docx", and the simulation report template reserves a position for inserting simulation curves.

7. The method for automating the PDN simulation process according to claim 1, wherein: In the simulation curve graph, the x-axis represents the frequency, the y-axis represents the impedance of the simulation network, and the curve name is consistent with the curve name in the spec file.

8. A device for automating a PDN simulation process, characterized in that: The device comprises: A stacking information table parsing module is used to parse the imported stacking information table and generate an XML netlist file containing stacking structure information and material property information; wherein the stacking information table is a standardized file pre-written in a preset format according to target requirements; A simulation driver module is configured to call an API interface of the PDN simulation software to drive the PDN simulation software to load the XML netlist file and the PCB design file required for simulation, so that the PDN simulation software configures the stacking properties required for PDN simulation based on the XML netlist, and configures the simulation ports required for PDN simulation based on the PCB design file; the PDN simulation software performs PDN simulation according to the input frequency range and generates a simulation data file; a data processing module configured to read the simulation data file, extract impedance parameters, and compare the extracted impedance parameters with a specification file storing a preset protocol standard impedance range, thereby generating a simulation curve graph and a determination result of whether the simulation meets the protocol standard; wherein the specification file includes a qualified criterion range for the impedance parameters at different frequencies; The report generation module is used to select a corresponding simulation report template according to the protocol type, insert the simulation curve graph and the determination result into the simulation report template, and generate a standardized simulation report.

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