LED packaging unit and keyboard

Abstract

The invention discloses an LED packaging unit and a keyboard, and relates to the technical field of keyboard backlight, and the LED packaging unit comprises an LED chip, a control chip, a memory and a port assembly. The control chip is electrically connected with the LED chip and is used for generating an electric signal for controlling the LED chip to emit light; the memory stores brightness parameters of the LED chip; the port assembly comprises a first data port bonding pad electrically connected with the control chip, and the first data port bonding pad is used for receiving a control signal; the control signal comprises light-emitting information corresponding to the LED chip, the light-emitting information comprises light-emitting brightness, and the control chip can carry out normalization processing on the brightness of the LED chip according to the brightness parameter so that the actual light-emitting brightness of the LED chip can be close to the light-emitting brightness contained in the light-emitting information. The actual luminance of the LED chip is closer to the required luminance, when the LED packaging unit is applied to the keyboard, the luminance of each keycap can be closer, and the consistency of backlight luminance can be guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of keyboard backlighting, and in particular to an LED packaging unit and a keyboard. Background Art

[0002] Currently, some keyboards have a backlight function, so that users can clearly see the key symbols even in a dark environment, which facilitates the use of the keyboard and also makes the keyboard more beautiful.

[0003] The keyboard backlight circuit controls the illumination of LED (light-emitting diode) chips. Typically, this circuit consists of an input line, a ground line, and a lighting circuit connected between the two lines. The lighting circuit houses the LED chip. When the input line is high, the LED chip turns on and illuminates. With this method, all LED chips connected to the same input line will illuminate or extinguish simultaneously, making it difficult to create diverse lighting effects.

[0004] The inventors discovered that integrating the LED chip and control chip into an LED package unit facilitates a richer range of lighting effects. Each button has an LED package unit. The control chip receives instructions from the main control board and controls the corresponding LED chip. This allows the LED chip under each button to independently illuminate, resulting in a relatively rich variety of lighting effects. However, some areas for improvement remain.

[0005] For example, the thickness of the LED packaging unit may be relatively thick, which causes the thickness of the keyboard circuit board to become thicker, which is not conducive to the lightweight and thinning of the electronic device.

[0006] For example, if the LED packaging unit can only control the corresponding LED to light up or not according to the control instructions, then its function is relatively simple. Moreover, since the keyboard usually also has a circuit dedicated to key detection, when it is superimposed with the backlight circuit board where the LED packaging unit is located, the overall thickness will be further increased.

[0007] For example, the key detection circuit needs to be able to detect keys and also have an anti-ghosting function. Usually, the anti-ghosting function is achieved by setting a diode in the key detection circuit, which leads to a complex circuit structure and high cost.

[0008] For example, when a certain LED packaging unit fails, the backlight function of the corresponding key will immediately fail, which is not conducive to the reliable implementation of the keyboard backlight function. In addition, the LED packaging unit connected to the failed LED packaging unit may not be able to receive instructions from the main control board, resulting in the backlight function of multiple keys failing at the same time.

[0009] For example, keyboard backlighting requires calibration to ensure consistent brightness across all keys. However, the brightness of LEDs produced varies. The traditional approach is to group LEDs based on their brightness and install them on the same keyboard. However, this results in significant differences in backlight brightness between keyboards, rendering many LEDs unusable. Furthermore, after keycaps are installed, the backlighting can be affected by interference, further compromising backlighting consistency.

[0010] Therefore, it is necessary to improve the prior art to overcome the above defects.

[0011] The above content is only used to help understand the technical solution of this application and does not constitute an admission that the above is prior art. Summary of the Invention

[0012] The object of the present invention is to provide an LED packaging unit and a keyboard to solve at least one technical problem raised in the background technology.

[0013] To achieve the above-mentioned object, in a first aspect, the present invention provides an LED packaging unit, comprising:

[0014] LED chips;

[0015] A control chip, electrically connected to the LED chip, for generating an electrical signal to control the LED chip to emit light;

[0016] a memory storing brightness parameters of the LED chip; and

[0017] A port component, comprising a first data port pad electrically connected to the control chip, wherein the first data port pad is used to receive a control signal;

[0018] The control signal includes luminous information corresponding to the LED chip, and the luminous information includes luminous brightness. The control chip can normalize the brightness of the LED chip according to the brightness parameter so that the actual luminous brightness of the LED chip is close to the luminous brightness contained in the luminous information.

[0019] In a second aspect, the present invention provides a keyboard comprising the above-mentioned LED packaging unit.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] According to at least one embodiment of the present invention, an LED package unit includes an LED chip, a control chip, a memory, and a port assembly. The control chip is electrically connected to the LED chip and is configured to generate an electrical signal for controlling the LED chip's illumination. The memory stores brightness parameters of the LED chip. The control signal includes illumination information corresponding to the LED chip, including illumination brightness. The control chip is capable of normalizing the brightness of the LED chip based on the brightness parameters so that the actual illumination brightness of the LED chip approaches the illumination brightness specified in the illumination information. This allows the actual illumination brightness of the LED chip to more closely match the desired illumination brightness. When the LED package unit is applied to a keyboard, the illumination brightness of each keycap can be more similar, facilitating consistency in backlight brightness. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic cross-sectional views of LED packaging units according to some embodiments of the present invention.

[0023] Figure 2 yes Figure 1 The diagram shows the positions of the port pads, circuits, control chip and LED chip of the LED packaging unit.

[0024] Figure 3 yes Figure 1 The diagram shows an LED packaging unit with an adhesive film layer.

[0025] Figure 4 Schematic cross-sectional views of LED packaging units according to some embodiments of the present invention.

[0026] Figure 5 yes Figure 4 The diagram shows the positions of the circuit, control chip and LED chip of the LED packaging unit.

[0027] Figure 6 Schematic diagram of the positions of port pads in some embodiments of the present invention.

[0028] Figure 7 yes Figure 1 The schematic diagram of the LED package unit shown is provided with an isolation layer.

[0029] Figure 8 yes Figure 4 The schematic diagram of the LED package unit shown is provided with an isolation layer.

[0030] Figure 9 yes Figure 1 The schematic diagram shown is a LED packaging unit with an annular retaining wall.

[0031] Figure 10 yes Figure 4The schematic diagram shown is a LED packaging unit with an annular retaining wall.

[0032] Figure 11 yes Figure 1 The schematic diagram shown is a LED packaging unit having both an isolation layer and an annular retaining wall.

[0033] Figure 12 yes Figure 4 The schematic diagram shown is a LED packaging unit having both an isolation layer and an annular retaining wall.

[0034] Figure 13 Schematic diagram of the positions of the annular retaining wall and the LED chip in a top view in some embodiments of the present invention.

[0035] Figure 14 1 is a schematic structural diagram of an LED packaging unit according to some embodiments of the present invention. In the figure, the top of the LED chip is flush with the packaging body.

[0036] Figure 15 1 is a schematic structural diagram of an LED packaging unit in some embodiments of the present invention, in which the port pad is provided with nickel-palladium-gold.

[0037] Figure 16 Schematic diagram of a film layer provided with a light-transmitting area in some embodiments of the present invention, in which the light-transmitting area is a hole.

[0038] Figure 17 Schematic diagram of a film layer provided with a light-transmitting area in some embodiments of the present invention. In the figure, the light-transmitting area is made of a transparent material.

[0039] Figure 18 Schematic diagram of the positions of the film layer and LED chips in some embodiments of the present invention.

[0040] Figure 19 Schematic diagram of the positions of the film layer and LED chips in some embodiments of the present invention.

[0041] Figure 20 Schematic diagram of the positions of the film layer and LED chips in some embodiments of the present invention.

[0042] Figure 21 1 is a schematic structural diagram of an LED packaging unit in some embodiments of the present invention. In the figure, a control chip has a built-in memory.

[0043] Figure 22 The molding of some embodiments of the present invention Figure 1 Schematic diagram of the process of LED packaging unit shown.

[0044] Figure 23 Schematic diagram of the process of preparing an insulating layer in some embodiments of the present invention.

[0045] Figure 24 Schematic diagram of simultaneously forming an adhesive film layer and an insulating layer in some embodiments of the present invention.

[0046] Figure 25 The molding of some embodiments of the present invention Figure 11 Schematic diagram of the process of LED packaging unit shown.

[0047] Figure 26 The molding of some embodiments of the present invention Figure 4 Schematic diagram of the process of LED packaging unit is shown.

[0048] Figure 27 1 is a process diagram of steps C7 to C9 in some embodiments of the present invention.

[0049] Figure 28 is a schematic diagram of step C10 in some embodiments of the present invention.

[0050] Figure 29 The molding of some embodiments of the present invention Figure 12 Schematic diagram of the process of LED packaging unit is shown.

[0051] Figure 30 Schematic diagram of keyboard backlight circuits according to some embodiments of the present invention. In the figure, each LED package unit group includes one LED package unit.

[0052] Figure 31 Schematic diagram of keyboard backlight circuits according to some embodiments of the present invention. In the figure, each LED package unit group includes three LED package units.

[0053] Figure 32 yes Figure 31 Schematic diagram of the LED packaging unit group.

[0054] Figure 33 Schematic diagram of keyboard backlight circuits according to some embodiments of the present invention.

[0055] Figure 34 This is a schematic diagram of a keyboard backlight circuit in some embodiments of the present invention when no LED packaging unit is installed.

[0056] Figure 35 Schematic diagram of keyboard backlight circuits according to some embodiments of the present invention.

[0057] Figure 36 Schematic diagram of a keyboard backlight circuit disposed on a backlight circuit board in some embodiments of the present invention.

[0058] Figure 37 Schematic cross-sectional views of key circuit boards according to some embodiments of the present invention.

[0059] Figure 38 Schematic cross-sectional views of key circuit boards according to some embodiments of the present invention.

[0060] Figure 39 is a schematic diagram of a first circuit board in some embodiments of the present invention.

[0061] Figure 40 Schematic diagram of the spacer layer in some embodiments of the present invention.

[0062] Figure 41 Schematic diagram of backlight circuit boards according to some embodiments of the present invention.

[0063] Figure 42 Schematic cross-sectional views of key circuit boards in some embodiments. DETAILED DESCRIPTION

[0064] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It will be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some, rather than all, structures related to the present application are shown in the accompanying drawings. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0065] As used herein, the terms "comprise," "comprising," and "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0066] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0067] Some embodiments of the present application disclose an LED packaging unit, such as Figure 1 and Figure 2 As shown, it includes a package body 10 , an LED chip 11 , a control chip 12 and a wiring layer 13 .

[0068] The package body 10 is made of insulating material, such as resin material, and includes a bottom surface 100 and a top surface 101 located at both ends of the thickness direction thereof. The top surface 101 is used for light emission from the LED chip 11 .

[0069] Both the LED chip 11 and the control chip 12 are disposed within the package 10. The control chip 12 is positioned radially to one side of the LED chip 11. The radial direction is perpendicular to the thickness of the package 10. The thickness of the package 10 coincides with the thickness of the LED package unit. The control chip 12 and LED chip 11 are arranged horizontally, spaced apart from each other, to reduce the thickness H of the LED package unit 1.

[0070] The LED chip 11 generally includes two electrodes 110 (positive and negative), and the control chip 12 has multiple pads 121. The electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12 are both arranged toward the bottom surface 100. The control chip 12 and the LED chip 11 are electrically connected to control the LED chip 11 to emit light.

[0071] The wiring layer 13 includes a circuit 132 arranged on the side where the bottom surface 100 of the package body 10 is located and a port component 131 connected to the circuit 132. The port component 131 includes multiple port pads. The circuit 132 is used to realize the electrical connection between the port pads, the LED chip 11 and the control chip 12. For example, it can have a part connected between a pad 121 of the control chip 12 and a port pad to realize the electrical connection between the two. It can have a part connected between a pad 121 of the control chip 12 and an electrode 110 of the LED chip 11 to realize the electrical connection between the two. It can have a part connected between a pad 121 of the control chip 12 and an electrode 110 of the LED chip 11 to realize the electrical connection between the two.

[0072] In the above embodiment, since the LED packaging unit does not include components such as a substrate (or supporting plate) that carries the LED chip 11 or the control chip 12 that a general packaging unit has, the overall thickness H can be effectively reduced. At the same time, the LED chip 11 and the control chip 12 are arranged at intervals along the radial direction, which can further make the overall structure thinner, and the electrode 110 of the LED chip 11 and the solder pad of the control chip 12 face the same side, which is more convenient for wiring and reduces the difficulty of processing.

[0073] In addition, it is understood that in the LED package unit, the control chip 12 can control the LED chip 11 to emit light according to the received control signal. When the LED package unit is applied to the keyboard backlight circuit and is correspondingly arranged under different keycaps, the LED package unit under each keycap can be driven to emit light independently, and does not need to emit light at the same time or not at the same time, which can achieve a richer lighting effect. It is understood that the keycap is at least partially made of transparent material to allow light from the LED package unit to be emitted to achieve the backlight effect.

[0074] In some embodiments, the port assembly includes four port pads, such as Figure 2 As shown, they are respectively a power supply port pad 1310, a first data port pad 1311, a second data port pad 1312 and a ground port pad 1313. The power supply port pad 1310 is used to be connected to the power supply line to provide a high-level driving voltage for the control chip 12 and the LED chip 11. The first data port pad 1311 and the second data port pad 1312 are used for signal transmission, such as input and output signals to receive or send data. The ground port pad 1313 is used to be connected to the ground line. The power supply port pad 1310, the first data port pad 1311, the second data port pad 1312 and the ground port pad 1313 are all connected to the corresponding pads of the control chip 12 through the line 132 to achieve electrical connection with the control chip 12. The LED chip 11 is electrically connected to the power supply port pad 1310 or the ground port pad 1313. In some embodiments, as Figure 2 As shown, the power supply port solder pad 1310 is connected to one electrode 110 (positive pole) of the LED chip 11, and the other electrode 110 (negative pole) of the LED chip 11 is connected to the solder pad 121 of the control chip 12. When the LED packaging unit 1 has multiple LED chips 11, the multiple LED chips 11 are a common anode. In other embodiments, the grounding port solder pad 1313 is connected to one electrode 110 (negative pole) of the LED chip 11, and the other electrode 110 (positive pole) of the LED chip 11 is connected to the solder pad 121 of the control chip 12. When the LED packaging unit 1 has multiple LED chips 11, the multiple LED chips 11 are a common cathode.

[0075] Optionally, the LED package unit includes an insulating layer 130 filling the space between the bottom surface 100 and the port pad and the circuit 132 to improve the insulation performance.

[0076] In some embodiments, as Figure 1 and Figure 2 As shown, the circuit 132 and the port pad are located on the same layer to further reduce the overall thickness. The circuit 132 includes multiple conductive wires, and the conductive wires can be properly arranged to prevent short circuits between the conductive wires due to contact. Figure 2 The circuit 132 includes conductive wires 132a to 132h. The LED package unit includes an insulating layer 130 filling the space between the bottom surface 100 and the terminal pad and the circuit 132. Specifically, the insulating layer 130 separates the conductive wires and the terminal pad that need to be insulated to ensure insulation.

[0077] In some embodiments, as Figures 4 to 6 As shown, Figure 4 shows a schematic cross-sectional view of an LED packaging unit according to some embodiments, Figure 5 Schematic diagram showing the arrangement of the circuit 132 of the LED package unit in some embodiments, Figure 6 A schematic diagram illustrating the positions of solder pads in an LED package unit according to some embodiments shows that all port pads are located on the same layer, with traces 132 and port pads spaced apart along the thickness of the package body 10. The traces 132 and port pads are separated by an insulating layer 130 along the thickness of the package body 10, and are connected to the port pads to be connected via conductive connectors 133 that pass through the insulating layer 130. Figure 5 In the figure, the circuit 132 also includes conductive wires 132a to 132h, wherein the conductive wires 132a, 132c, 132d and 132e are respectively connected to the power supply port pad 1310, the first data port pad 1311, the second data port pad 1312 and the ground port pad 1313 located on the outermost layer through the conductive connector 133.

[0078] It can be understood that although separating the port pad and the circuit 132 by the insulating layer 130 will increase the overall thickness of the LED packaging unit, it can enable the port pad to have a larger area. For example, the projection of the port pad along the thickness direction of the LED packaging unit can directly cover the control chip 12 and / or the LED chip 11 and / or the circuit 132 (that is, the port pad is at least partially arranged opposite the control chip 12 and / or the LED chip 11 and / or the circuit 132) without worrying about causing a short circuit. Moreover, the arrangement position of the port pad can be more diverse and will not be overly affected by the circuit 132. Optionally, the total area of ​​all port solder pads accounts for no less than 22% of the projected area of ​​the LED package unit along its thickness direction, thereby fully utilizing space, increasing the area of ​​the port solder pads, facilitating connection to external circuits, and increasing the structural strength of the LED package unit. Furthermore, optionally, the total area of ​​all port solder pads accounts for no less than 40% of the projected area of ​​the LED package unit along its thickness direction. Even more optionally, the total area of ​​all port solder pads accounts for no less than 70% of the projected area of ​​the LED package unit along its thickness direction. Optionally, the area of ​​each port solder pad is the same.

[0079] In some embodiments, the power port pad 1310 , the first data port pad 1311 , the second data port pad 1312 and the ground port pad 1313 are respectively located at the four corners of the LED package unit to facilitate wiring and connection with external circuits.

[0080] In some embodiments, the LED chip 11 is at least partially located at the center of the bottom surface 100 of the package 10 to ensure uniform light emission and to minimize the length of the conductive wires, thereby facilitating wiring. Alternatively, the control chip 12 is located on one side of the center of the bottom surface 100, while the majority (more than half) of the LED chip 11 is located on the other side of the center of the bottom surface 100 to further enhance the effect.

[0081] Optionally, there is a gap between the LED chip 11 and the top surface 101 of the package body 10 to protect the LED chip 11. Further, optionally, refer to Figure 1 The distance D between the LED chip 11 and the top surface 101 of the package body 10 is 5 μm to 30 μm, for example, 0.01 mm, which is beneficial for protecting the LED chip 11 while reducing the loss of light emitted by the LED chip 11.

[0082] In some embodiments, the LED packaging unit includes only one LED chip 11. In other embodiments, the LED packaging unit includes at least two LED chips 11 that emit light of different colors. Optionally, the LED packaging unit includes three LED chips 11, and the three LED chips 11 emit red, green, and blue light, respectively. By controlling the light emission of LED chips 11 of different colors, a variety of different colors can be mixed to achieve a richer light-emitting effect. In the case where the LED packaging unit includes multiple LED chips 11, the electrodes of each LED chip 11 are connected to different pads of the control chip 12, so that the control chip 12 can independently control the light emission of each LED chip 11. In the embodiments of this specification, "multiple" includes two cases.

[0083] In some embodiments, in addition to the three-color LED chip 11, the LED package unit also includes a white light LED chip to improve the purity of the brightness of the white light emitted by the LED package unit. Optionally, the white light LED chip emits white light through a single-color LED light-emitting diode plus corresponding phosphor.

[0084] Optionally, the LED chips 11 are rectangular parallelepiped-shaped, with three LED chips 11 spaced apart along the width of the rectangular parallelepiped. The control chip 12 is located on one side of the LED chips 11 in the longitudinal direction. Of the three LED chips 11, the middle LED chip 11 is at least partially located at the center of the bottom surface 100 of the package 10 to fully utilize space and facilitate wiring. Optionally, the control chip 12 is located on one side of the center of the bottom surface 100, while the majority (more than half) of the entire assembly formed by the three LED chips 11 is located on the other side of the center of the bottom surface 100 to further ensure the desired effect.

[0085] In some embodiments, package 10 is made of a transparent material to allow light from LED chip 11 to be emitted. It is understood that when LED chip 11 emits light, its light strikes trace 132 and the port pad and is reflected by the copper. When viewed from top surface 101, the color of the copper mixes with the light from LED chip 11, resulting in reflections with different colors.

[0086] In some embodiments, as Figure 7 and Figure 8 As shown, the LED packaging unit includes an isolation layer 17 located between the packaging body 10 and the wiring layer 13. By isolating the LED chip 11 and the wiring layer 13 with the isolation layer 17, it is possible to prevent the formation of reflective color interference and reduce color difference. As a feasible example, the isolation layer 17 is made of a reflective material, such as a dielectric mirror polymer material, which can reflect the light of the LED chip 11 and improve the light efficiency. As another feasible example, the isolation layer 17 is made of a white material, which can effectively reduce the reflective color difference. The white material can be, for example, a white resin. In some embodiments, as Figure 9 and Figure 10 As shown, the LED packaging unit includes an annular retaining wall 16 located in the packaging body 10, and the LED chip 11 is located in the annular retaining wall 16. The annular retaining wall 16 isolates the light emitted laterally from the LED chip 11, thereby preventing the formation of reflective color interference and reducing color difference. At the same time, it can avoid the side color interference caused by the reflection of components around the LED chip 11 (such as the control chip 12), further reducing color difference. In addition, it can also reduce the lateral leakage of light from the LED chip 11 from the LED packaging unit. As a feasible example, the annular retaining wall 16 is made of a reflective material, such as a resin doped with a highly reflective filler or a resin silicone doped with a highly reflective filler, which can reflect the color of the LED chip 11 and improve the light efficiency. As another feasible example, the annular retaining wall 16 is made of a white material, which can effectively reduce the reflective color difference. The white material can be, for example, a white resin. As another feasible embodiment, the annular retaining wall 16 is made of a black material.

[0087] In some embodiments, as Figure 11 and Figure 12 As shown, the LED packaging unit includes both an isolation layer 17 and an annular retaining wall 16 .

[0088] Optional, such as Figure 13 As shown, when the LED packaging unit 1 includes a plurality of LED chips 11 , all the LED chips 11 are located in the same annular retaining wall 16 .

[0089] In some embodiments, as Figure 14 As shown, the package 10 is made of an opaque material, such as a frosted material or white, to reduce color difference. At this time, the LED chip 11 is exposed from the top surface 101 of the package 10 so that the light of the LED chip 11 can be emitted outward. Optionally, the top of the LED chip 11 is flush with the top surface 101.

[0090] In some embodiments, as Figure 3 、 Figure 14 and Figure 15 As shown, the LED package unit further includes a film layer 14 disposed on the top surface 101 to better protect the LED package unit. The film layer 14 may be made of, for example, a resin material. Optionally, the film layer 14 covers the entire top surface 101 .

[0091] In some embodiments, the adhesive layer 14 is made of a transparent material and is transparent as a whole to allow light to escape. When the LED package unit is used, the adhesive layer 14 can be retained or torn off. When the adhesive layer 14 is torn off, light loss can be reduced.

[0092] In other embodiments, Figure 16 and Figure 17 As shown, the film layer 14 includes a light-transmitting area 141 and a light-shielding portion 140 made of an opaque material located outside the light-transmitting area 141. The position of the light-transmitting area 141 corresponds to the position of the LED chip 11 so that the light of the LED chip 11 can be emitted. Since the area of ​​the light-transmitting area 141 is relatively smaller, the light-emitting angle of the LED chip 11 can be limited by the light-transmitting area 141, so that the light emitted by the LED chip 11 from the film layer 14 is confined to a smaller area. When illuminating the light-transmitting area on the keycap (such as characters or indicator lights), the light leaking from the gaps or other positions of the keycap can be reduced, and the backlight effect is better. In addition, through the shielding of the light-shielding portion 140, even if the isolation layer 17 or the annular retaining wall 16 is not provided, the interference of the reflective color and the side color on the light color of the LED chip 11 can be reduced. Optionally, the light-shielding portion 140 is made of black material. Optionally, the light-transmitting area 141 and the light-shielding portion 140 form a whole covering the entire top surface 101.

[0093] As a possible example, Figure 16 As shown, the light-transmitting area 141 is a hole, and light from the LED chip 11 is directly transmitted through the hole, which can reduce light loss. As another feasible example, the light-transmitting area 141 is made of a transparent material to enhance the protection of the LED chip 11. Optionally, when the light-transmitting area 141 is a hole, the top of the LED chip 11 and the top surface 101 are spaced apart to protect the LED chip 11 through the package 10.

[0094] In some embodiments, the LED package unit includes at least two LED chips 11, such as Figure 18 As shown, as a feasible example, each LED chip 11 is provided with a corresponding light-transmitting area 141, and the LED chips 11 emit light outward through their respective light-transmitting areas 141. It can be understood that the size of the light-transmitting area 141 limits the light-emitting area. Optionally, the light-transmitting area 141 is smaller than the length L of the LED chip 11. Further, optionally, the light-transmitting area 141 is smaller than or equal to the width B of the LED chip 11. As another feasible example, three LED chips 11 share one light-transmitting area 141, such as Figure 19 As shown, the projection of the light-transmitting area 141 along the thickness direction of the LED chip packaging unit covers all the LED chips 11. It can completely surround all the LED chips 11, or part of the LED chips 11 can be located outside the light-transmitting area 141. The size of the light-transmitting area 141 can be set as needed. It is understood that the arrangement of the LED chips 11 is not limited to Figure 19 The arrangement shown in the figure can also be arranged in other ways, such as Figure 20 The arrangement shown.

[0095] It is understood that the LED package unit may include only one of the adhesive film layer 14, the annular retaining wall 16, and the isolation layer 17, or may include multiple of them. When the LED package unit includes both the adhesive film layer 14 with the light-shielding portion 140 and the annular retaining wall 16, lateral light leakage from the LED package unit can be effectively reduced, allowing light to be concentrated and emitted from the light-transmitting area 141. Optionally, both the light-shielding portion 140 and the annular retaining wall 16 are made of black material.

[0096] It is understandable that if Figure 21 As shown, the port component 131 is not limited to including only the four pads mentioned above. In some embodiments, the port component 131 further includes a detection port pad 1314 electrically connected to the control chip 12, and the detection port pad 1314 is connected to the control chip 12 via a circuit ( Figure 21The conductive wire 132i in the embodiment is connected to the corresponding pad of the control chip 12. The detection port pad 1314 can be connected to a switch circuit connected in series with a key switch to detect the voltage level of the port pad. When the key is pressed, the key switch is triggered, causing the voltage received by the control chip 12 to change. In this way, the control chip 12 can identify whether the key is pressed and send the key press information to the main control board of the keyboard, thereby realizing the key detection function and making the LED package unit have more diverse functions.

[0097] In some embodiments, as Figure 21 As shown, the LED package unit also includes a memory 120. The memory 120 stores brightness parameters corresponding to the LED chips 11 of the LED package unit to facilitate brightness normalization of the LED chips 11. This will be described below. The memory 120 can be built into the control chip 12 or can be a separate memory 120 electrically connected to the control chip 12. The memory 120 is packaged together with the control chip 12 and the LED chips 11 in the package body 10. In this case, the memory 120 and the control chip 12 can be connected via the aforementioned circuits.

[0098] Some embodiments of the present invention further disclose a method for preparing an LED packaging unit to prepare the LED packaging units of some embodiments described above. For the sake of convenience, this method is hereinafter referred to as the first method for preparing an LED packaging unit.

[0099] like Figure 22 As shown, the preparation method of the first LED packaging unit includes the following steps:

[0100] A1. Providing a substrate 15;

[0101] A2. Secure the LED chip 11 and the control chip 12 to the substrate 15, with the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12 facing the substrate 15. In some embodiments, the substrate 15 is a copper carrier with double-sided tape 150 applied to its surface. The LED chip 11 and the control chip 12 are secured to the substrate 15 by patching.

[0102] A3. Insulating material 151 is disposed on substrate 15 so as to cover LED chip 11 and control chip 12. In some embodiments, insulating material 151 is formed on substrate 15 to cover LED chip 11 and control chip 12 by potting. It is understood that insulating material 151 is subsequently used to form package 10. The surface where insulating material 151 is connected to substrate 15 is the bottom surface 100 of package 10.

[0103] A4. Flatten the surface of the insulating material 151 away from the substrate 15 to form the package 10; the flattened surface makes it easier for light to escape and can reduce the overall thickness. Flattening methods, such as grinding or plasma treatment, can be used.

[0104] A5. Remove the substrate 15 to expose the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12. In some embodiments, the double-sided tape is heated to reduce its viscosity, thereby facilitating the removal of the substrate 15.

[0105] A6. Fabricate circuitry 132 and port pads on the exposed surface of the insulating material. The exposed surface is the surface of the insulating material that exposes the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12. The circuitry 132 and the port pads are located on the same layer. Circuitry 132 and the port pads can be formed, for example, by evaporation or sputtering, or by printing photoresist, exposing, developing, forming a seed layer, and then thickening with electroplating.

[0106] A7. Prepare an insulating layer 130 to fill the space between the exposed surface and the port pad and the circuit 132. The insulating layer 130 can be formed, for example, by printing or lamination. Optionally, the insulating layer 130 is made of insulating resin.

[0107] It is understood that the above steps may form, for example, Figure 1 and Figure 2 In the LED package unit of the embodiment shown, the port pads and the circuit 132 are located on the same layer.

[0108] In some embodiments, the insulating layer 130 formed in step A7 covers the surface of the circuit 132 but not the surface of the port pad, which can improve the insulation performance. Figure 22 As shown, the insulating layer 130 formed in step A7 does not cover the surface of the port pad and the surface of the line 132, so as to further reduce the thickness. In a specific implementation, the insulating layer 130 can be formed on the entire surface of the line 132 and the port pad first, and then part of the insulating layer 130 can be removed as needed to expose the port pad or the line 132. Figure 23 The step A7 includes a step A70 of first forming an entire insulating layer 130 on the surface of the circuit 132 and the port pad, and a step A71 of removing a portion of the insulating layer 130 to expose the port pad and the circuit 132 .

[0109] In some embodiments, the method for preparing the LED package unit further includes the following steps:

[0110] The adhesive film layer 14 is provided on the flattened surface of the insulating material 151. The material of the adhesive film layer 14 can be, for example, a resin material. The adhesive film layer 14 can protect the package 10 and the components therein. Optionally, this step is performed simultaneously with the provision of the insulating layer 130 in step A7. Figure 24 shown.

[0111] In some embodiments, the method for preparing the LED package unit further includes the following steps:

[0112] A8. The port pad is surface treated and plated with nickel-palladium-gold to improve the solderability of the port pad and ensure the reliability and stability of the welding quality.

[0113] Some embodiments of the present invention further provide a method for preparing an LED package unit having an isolation layer 17 and an annular retaining wall 16 , which is hereinafter referred to as a second method for preparing an LED package unit for ease of description.

[0114] like Figure 25 As shown, the second method for preparing an LED packaging unit includes the following steps:

[0115] B1. Providing a substrate 15;

[0116] B2. Fix the LED chip 11 and the control chip 12 to the substrate 15, with the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12 facing the substrate 15. In some embodiments, the substrate 15 is a copper carrier with double-sided tape 150 on its surface. The LED chip 11 and the control chip 12 are fixed to the substrate 15 by patching.

[0117] B3. Prepare an annular retaining wall 16 on the substrate 15, and the annular retaining wall 16 surrounds the outside of the LED chip 11. In some embodiments, the annular retaining wall 16 is formed on the outside of the LED chip 11 by dispensing glue.

[0118] B4. Dispose insulating material 151 on substrate 15 so that insulating material 151 covers LED chip 11, control chip 12, and annular retaining wall 16. In some embodiments, insulating material 151 covering LED chip 11, control chip 12, and annular retaining wall 16 is formed on substrate 15 by potting. It is understood that insulating material 151 is subsequently used to form package 10, and the surface where insulating material 151 connects to substrate 15 is bottom surface 100 of package 10.

[0119] B5. Flatten the surface of the insulating material 151 away from the substrate 15 to form the package 10. The flattened surface makes it easier for light to escape and can reduce the overall thickness. The flattening method can be, for example, grinding or plasma treatment.

[0120] B6. Remove the substrate 15 to expose the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12. In some embodiments, the double-sided tape is heated to reduce its viscosity, thereby facilitating the removal of the substrate 15.

[0121] B7. Prepare an isolation layer 17 on the exposed surface of the insulating material 151, exposing the electrodes 110 of the LED chip 11 and the solder pads 121 of the control chip 12. The exposed surface is the surface of the insulating material 151 where the electrodes 110 of the LED chip 11 and the solder pads 121 of the control chip 12 are exposed. The isolation layer 17 can be formed, for example, by printing or spraying. In step B7, a full layer of isolation layer 17 can be first prepared on the exposed surface of the insulating material 151 by printing or spraying, and then the portions corresponding to the electrodes 110 of the LED chip 11 and the solder pads 121 of the control chip 12 are removed by laser etching, leaving them exposed.

[0122] B8. Circuits 132 and port pads are formed on the surface of isolation layer 17 facing away from insulating material 151. Circuits 132 and port pads are located on the same layer. Circuits 132 and port pads can be formed, for example, by evaporation or sputtering, or by printing photoresist, exposing, developing, forming a seed layer, and then thickening by electroplating.

[0123] B9. Prepare an insulating layer 130 to fill the space between the exposed surface and the port pad and the line 132. The insulating layer 130 can be formed, for example, by lamination. Optionally, the insulating layer 130 is made of resin.

[0124] It is understood that the above steps may form, for example, Figure 11 In the LED package unit of the embodiment shown, the port pads and the circuit 132 are located on the same layer.

[0125] It is understood that when it is necessary to prepare Figure 7 When the LED package unit shown does not have the annular retaining wall 16, step B3 can be omitted, and the insulating material 151 in step B4 does not need to cover the annular retaining wall 16. Figure 9 For the LED package unit shown as not having the isolation layer 17 , step B7 can be omitted, and in step B8 , the circuit 132 and the terminal pad can be prepared on the exposed surface of the insulating material 151 .

[0126] Some embodiments of the present invention further provide a method for preparing an LED package unit in which the port pad and the circuit are not on the same layer. For the sake of convenience, this method is referred to as the third method for preparing an LED package unit.

[0127] like Figure 26 As shown, the third method for preparing an LED packaging unit includes the following steps:

[0128] C1 provides a substrate 15;

[0129] C2. Fix the LED chip 11 and the control chip 12 to the substrate 15, with the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12 facing the substrate 15. In some embodiments, the substrate 15 is a copper carrier with double-sided tape on its surface, and the LED chip 11 and the control chip 12 are fixed to the substrate 15 by patching.

[0130] C3. Dispose insulating material 151 on substrate 15 so that insulating material 151 covers LED chip 11 and control chip 12. In some embodiments, insulating material 151 covering LED chip 11 and control chip 12 is formed on substrate 15 by potting. It is understood that insulating material 151 is subsequently used to form package 10. The surface where insulating material 151 connects to substrate 15 is bottom surface 100 of package 10.

[0131] C4. Flatten the surface of the insulating material 151 facing away from the substrate 15 to form the package 10. The flattened surface makes it easier for light to escape and can reduce the overall thickness. Flattening can be done by, for example, grinding or plasma treatment.

[0132] C5. Remove the substrate 15 to expose the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12. In some embodiments, the double-sided tape is heated to reduce its viscosity, thereby facilitating the removal of the substrate 15.

[0133] C6. Fabricate circuits 132 on the exposed surface of the insulating material. The exposed surface is the surface (i.e., bottom surface 100) of the insulating material that exposes the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12. Circuits 132 can be formed, for example, by evaporation or sputtering, or by printing photoresist, exposing, developing, forming a seed layer, and thickening by electroplating.

[0134] C7. Prepare an insulating layer 130 on the exposed surface, and make the insulating layer 130 cover the surface of the circuit 132. In some embodiments, the insulating layer 130 is formed by lamination, and the material of the insulating layer 130 can be resin, for example.

[0135] C8. Prepare a through hole 1300 communicating with the circuit 132 on the surface of the insulating layer 130 ; for example, the through hole 1300 can be formed by laser.

[0136] C9. Prepare a conductive layer on the surface of insulating layer 130. The portion of the conductive layer located within through-hole 1300 forms conductive connector 133, and the portion located outside insulating layer 130 forms a port pad. The conductive layer can be formed, for example, by sputtering or evaporation, or by printing photoresist, exposing, developing, forming a seed layer, and thickening by electroplating.

[0137] Similar to the first method for forming an LED package unit, in some embodiments, the third method for forming an LED package unit includes the following steps:

[0138] A film layer 14 is provided on the flattened surface. The material of the film layer 14 can be, for example, resin. The film layer 14 can protect the package 10 and the components therein. Optionally, this step is performed simultaneously with the preparation of the insulating layer 130 in step C7. When the film layer 14 is formed in step C7, the schematic diagram of the LED package unit in the subsequent steps is referred to as Figure 27 .

[0139] In some embodiments, as Figure 28 As shown, the third method for preparing the LED packaging unit further includes the following steps:

[0140] C10. Surface treatment is performed on the port pad, and nickel-palladium-gold 134 plating is performed on the port pad to improve the solderability of the port pad and ensure the reliability and stability of the welding quality.

[0141] Some embodiments of the present invention also propose a method for preparing an LED packaging unit, which is provided with an isolation layer 17 and an annular retaining wall 16 and in which the port pad and the circuit are not on the same layer. For the sake of convenience, it is hereinafter referred to as the fourth LED packaging unit preparation method.

[0142] like Figure 29 As shown, the fourth method for preparing an LED packaging unit includes the following steps:

[0143] D1 provides a substrate 15;

[0144] D2. Fix the LED chip 11 and the control chip 12 to the substrate 15, with the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12 facing the substrate 15. In some embodiments, the substrate 15 is a copper carrier with double-sided tape on its surface, and the LED chip 11 and the control chip 12 are fixed to the substrate 15 by patching.

[0145] D3. Prepare an annular retaining wall 16 on the substrate 15, the annular retaining wall 16 surrounding the LED chip 11. In some embodiments, the annular retaining wall 16 can be formed by dispensing glue.

[0146] D4. Dispose insulating material 151 on substrate 15 so that insulating material 151 covers LED chip 11, control chip 12, and annular retaining wall 16. In some embodiments, insulating material 151 covering LED chip 11, control chip 12, and annular retaining wall 16 is formed on substrate 15 by potting. It is understood that insulating material 151 is subsequently used to form package 10, and the surface where insulating material 151 connects to substrate 15 is bottom surface 100 of package 10.

[0147] D5. Flatten the surface of the insulating material 151 facing away from the substrate 15 to form the package 10. The flattened surface makes it easier for light to escape and can reduce the overall thickness. Flattening can be done by, for example, grinding or plasma treatment.

[0148] D6. Remove the substrate 15 to expose the electrodes 110 of the LED chip 11 and the pads of the control chip 12. In some embodiments, the double-sided tape is heated to reduce its viscosity, thereby facilitating the removal of the substrate 15.

[0149] D7. Prepare an isolation layer 17 on the exposed surface of the insulating material 151, exposing the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12. The exposed surface is the surface (i.e., bottom surface 100) of the insulating material 151 that exposes the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12. The isolation layer 17 can be formed, for example, by printing or spraying. In step D7, a full layer of isolation layer 17 can be first prepared on the exposed surface of the insulating material 151 by printing or spraying, and then the portions corresponding to the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12 can be removed by laser etching to expose them.

[0150] D8. Prepare circuit 132 on the surface of isolation layer 17 away from insulating material 151. Circuit 132 can be formed by evaporation or sputtering, or by printing photoresist, exposing, developing, preparing seed layer and thickening by electroplating.

[0151] D9. Dispose an insulating layer 130 on the surface of the isolation layer 17 away from the insulating material 151, and cover the surface of the circuit 132. In some embodiments, the insulating layer 130 is formed by lamination, and the material of the insulating layer 130 can be resin, for example.

[0152] D10. Prepare a through hole 1300 communicating with the circuit 132 on the surface of the insulating layer 130; for example, the through hole 1300 can be formed by laser.

[0153] D11. Prepare a conductive layer on the surface of insulating layer 130. The portion of the conductive layer located within through-hole 1300 forms conductive connector 133, and the portion located outside insulating layer 130 forms a port pad. The conductive layer can be formed, for example, by sputtering or evaporation, or by printing photoresist, exposing, developing, forming a seed layer, and thickening by electroplating.

[0154] It is understood that the above steps may form, for example, Figure 12 In the LED package unit of the embodiment shown, the port pads and the circuit 132 are located on different layers.

[0155] It is understood that when it is necessary to prepare Figure 8 When the LED package unit shown does not have the annular retaining wall 16, step D3 can be omitted, and the insulating material 151 in step D4 does not need to cover the annular retaining wall 16. Figure 10 For the LED package unit shown without the isolation layer 17 , step D7 can be omitted. In step D8 , a circuit 132 is prepared on the exposed surface of the insulating material 151 . In step D9 , an insulating layer 130 is prepared on the exposed surface of the insulating material 151 .

[0156] The LED packaging unit described above can be used in a keyboard backlight circuit to achieve a keyboard backlight effect. Next, this specification will describe the keyboard backlight circuit.

[0157] In some embodiments of the present invention, Figure 30 As shown, the keyboard backlight circuit includes a power supply line 20, a ground line 21, an LED package unit 1 and a main control board 22. For convenience, the LED package unit 1 is shown in the circuit in a simplified schematic diagram.

[0158] The power supply line 20 is used to provide a positive voltage, which supplies power to electronic components such as the LED chip 11 and the control chip 12, so that the keyboard backlight circuit can operate normally.

[0159] The LED package unit 1 may be the LED package unit 1 in the embodiment described above. For a detailed description of the LED package unit 1, please refer to the above text. It should be understood that although this article uses the LED package unit 1 described above as an example to describe the keyboard backlight circuit, the LED package unit 1 in the keyboard backlight circuit may also be other LED package units, such as one that includes a substrate.

[0160] Specifically, the LED package unit 1 includes an LED chip 11, a control chip 12, and a port assembly 131 packaged together. The port assembly 131 includes a power port pad 1310 connected to the power supply line 20, a ground port pad 1313 connected to the ground line 21, and a first data port pad 1311 for signal transmission. The power port pad 1310 is electrically connected to the control chip 12.

[0161] The main control board 22 is electrically connected to the first data port pad 1311 of at least one LED package unit 1. Specifically, the keyboard backlight circuit also includes a signal line 26 connected between the main control board 22 and the first data port pad 1311. The main control board 22 is capable of issuing control signals. The control signals include data information corresponding to driving the LED chip 11 to emit light (hereinafter referred to as "lighting information"), such as one or more of the following: brightness, duration, and color of the light. The main control board 22 transmits the control signals to the control chip 12 via the first data port pad 1311. The control chip 12 controls the LED chip 11 to emit light based on the control signals input from the first data port pad 1311. The control chip 12 generates an electrical signal corresponding to the control signals to control the LED chip 11 to emit light.

[0162] The LED chip 11 of each LED package unit 1 is controlled to emit light by a control signal from the main control board 22 . Each LED package unit 1 can be driven to emit light independently, thereby producing richer lighting effects.

[0163] It can be understood that the keys of the keyboard include keycaps, and each keycap is correspondingly provided with at least one LED packaging unit 1 so that the keycap can be illuminated by the LED packaging unit 1.

[0164] In some embodiments, the main control board 22 is connected to the first data port pad 1311 of each LED package unit 1 to input a corresponding control signal to each LED package unit 1 .

[0165] In some embodiments, as Figure 30As shown, multiple LED package units 1 are connected in series. The main control board 22 is connected to the first data port pad 1311 of the first LED package unit 1 among the multiple LED package units 1 via a signal line 26, sending a control signal to the first data port pad 1311, and transmitting the control signal backward through the chain formed by the LED package units 1. In this embodiment, the LED package units 1 also include second data port pads 1312, which are used to connect to the first data port pads 1311 of other LED package units 1 to transmit control signals received by the LED package unit 1 to the other LED package units 1. Specifically, in the series connection direction (i.e., the direction of control signal transmission), the second data port pad 1312 of the preceding LED package unit 1 is connected to the first data port pad 1311 of the succeeding LED package unit 1 to transmit the control signal received by the preceding LED package unit 1 to the succeeding LED package unit 1. The first data port pad 1311 of the leading LED package unit 1 is connected to the main control board 22. It can be understood that the LED package unit 1 that receives the control signal first is located closer to the front than the LED package unit 1 that receives the control signal later.

[0166] Multiple LED package units 1 connected in series form a chain. After the main control board 22 sends a control signal to the first LED package unit 1, the control signal is transmitted in turn through the control chip 12 of each LED package unit 1 to the subsequent LED package units 1. The control signal includes the address information of the LED chip 11 and the lighting information corresponding to the address information. The LED package unit 1 can identify the lighting information corresponding to the LED chip 11 contained in it based on the address information and control the corresponding LED chip 11 to emit light according to the lighting information. At the same time, the control chip 12 will continue to transmit the control signal backward so that the subsequent LED chip 11 can receive the control signal and emit light according to the lighting information corresponding to its own address in the control signal.

[0167] By connecting multiple LED package units 1 in series, the number of ports on the main control board 22 connected to the first data port pad 1311 can be reduced. In some embodiments, all LED package units 1 on the keyboard are connected in series, forming a single chain. In this case, only one signal port 382 is required to connect to each LED package unit 1. In other embodiments, the multiple LED package units 1 on the keyboard are divided into multiple chains, with the LED package units 1 in each chain connected in series. In this case, only ports corresponding to the number of chains are required.

[0168] In some embodiments, the LED packaging unit 1 includes at least two LED chips 11 with different luminous colors, for example, three LED chips 11 that emit red, green and blue light respectively. The color information in the control signal can also be realized through the address information of the LED chip 11, and the LED chips 11 of different colors are controlled to emit light through the address information.

[0169] In some embodiments, each keycap corresponds to an LED packaging unit 1 , and the backlight of the keycap is realized by an LED packaging unit 1 .

[0170] In other embodiments, each keycap is provided with at least two LED packaging units 1, and the backlight of the keycap is realized by the at least two LED packaging units 1, which is conducive to improving the brightness and uniformity of the backlight. Optionally, the number of LED packaging units 1 corresponding to each keycap is the same.

[0171] The LED package units 1 corresponding to the same keycap belong to the same LED package unit group, such as Figure 31 and Figure 32 As shown, Figure 31 The dotted frame in FIG. 1 shows two groups of LED package units, each of which includes three LED package units 1. Figure 32 Indicated Figure 31 In some embodiments, reference is made to Figure 31 and Figure 32 , the first data port pads 1311 of the LED package units 1 belonging to the same LED package unit group are connected, the second data port pads 1312 of the LED package units 1 belonging to the same LED package unit group are connected, and the first data port pads 1311 of the LED package units 1 of the rear LED package unit group are connected to the second data port pads 1312 of the LED package units 1 of the front LED package unit group, thereby realizing the series connection of each LED package unit group.

[0172] It is understandable that Figure 30 The embodiment shown can be considered as an example when each LED package unit group includes only one LED package unit 1. When each LED package unit group includes only one LED package unit 1, if a certain LED package unit 1 fails, the control signal will not be transmitted backward, making the backlight of the keycap where the failed LED package unit 1 is located and the keycaps behind it ineffective. When each LED package unit group includes two or more LED package units 1, such as Figure 31 and Figure 32As shown, even if a certain LED package unit 1 in the LED package unit group fails, the control signal can be transmitted backward through other LED package units 1 in the LED package unit group, thereby ensuring the reliability of the keyboard backlight.

[0173] In some embodiments, the control chip 12 of the LED package unit 1 can detect the status of itself and / or the LED chips 11 included in the LED package unit 1 and transmit the status to the main control board 22, so that the main control board 22 can understand the operating status of each LED package unit 1 in real time and detect fault information immediately. When the LED package unit groups are connected in series, the fault information of the LED package unit 1 in the subsequent LED package unit group is transmitted to the second data port solder pad 1312 of the LED package unit 1 in the preceding LED package unit group via its first data port solder pad 1311, and the fault information is transmitted forward in this manner until the leading LED package unit group sends the signal to the main control board 22 via the first data port solder pad 1311 of its LED package unit 1.

[0174] Optionally, under normal circumstances (i.e., when the LED packaging unit 1 in the LED packaging unit group does not fail), the light-emitting information corresponding to each LED packaging unit 1 in the same LED packaging unit group contained in the control signal is the same, for example, each LED packaging unit 1 emits light of the same color, and the light-emitting duration and brightness are the same.

[0175] Optionally, when a certain LED package unit 1 fails, the brightness of other LED package units 1 in the same group as that LED package unit 1 is increased. For example, the brightness information corresponding to the LED chip 11 of the other LED package unit 1 in the control signal can be increased to increase the brightness of the other LED package unit 1. Alternatively, the brightness information corresponding to the LED chip 11 of the other LED package unit 1 in the control signal can be kept unchanged, and the control chip 12 of the other LED package unit 1 generates an electrical signal with a higher duty cycle, thereby increasing the brightness of the LED package unit 1. Since an LED package unit 1 cannot emit light normally when it fails, the backlight of the keycap will dim. By increasing the brightness of the other LED package unit 1, the backlight brightness of the keycap can be made more consistent with that of the other keycaps.

[0176] In some embodiments, the power supply line 20, the ground line 21 and all the LED package units 1 are located on the same surface of the backlight circuit board. In this way, a circuit can be formed on the circuit board surface by printing silver paste, and then the corresponding LED package unit 1 can be installed in the corresponding position of the circuit board. The design can also be completed by a single-sided FPC, which is conducive to significantly reducing costs. In addition, the overall thickness of the circuit board is smaller, which is conducive to achieving lightweight and thin electronic equipment. Figure 33As shown, for example, the LED package units 1 are arranged in multiple rows (three rows in the figure), each row includes multiple LED package units 1, and the control signals of the LED package units 1 in the same row are transmitted in the same direction, while the control signals of adjacent rows are transmitted in opposite directions. Figure 33 In the figure, the control signal transmission direction of the LED package units 1 in the bottom row is from left to right, the control signal transmission direction of the LED package units 1 in the middle row is from right to left, and the control signal transmission direction of the top LED package units 1 is from left to right. In this way, among the two adjacent LED package units 1 at the ends of adjacent rows, one of the LED package units 1 at the back (for example Figure 33 1a) and the first data port pad 1311 of another preceding LED package unit 1 (eg Figure 33 The second data port pads 1312 of 1b) are located on the same side and can be conveniently connected through the circuit 24, which is convenient for wiring. The control signal can be transmitted to all LED package units 1 through the input end of the same control signal. Furthermore, a ground wire (sub-ground wire 210) and a power supply wire (sub-power supply wire 200) are respectively provided on both sides of each row of LED package units to facilitate connection with the LED package units 1 in that row. Among the three adjacent rows of LED package units 1, two adjacent rows of LED package units 1 share the same ground wire 21 (sub-ground wire 210) located therebetween, and the other two adjacent rows of LED package units 1 share the same power supply wire 20 (sub-power supply wire 200) located therebetween, so as to make the circuit structure more compact. During preparation, as shown in FIG. Figure 34 As shown, a circuit can be formed on the same side of the circuit board by silver paste printing or other methods, and a soldering pad 25 for connecting to the port pad of each LED package unit 1 is formed on the circuit, and then the corresponding LED package unit 1 is connected to the soldering pad 25 to form a circuit. Figure 33 The circuit shown.

[0177] In some embodiments, as Figure 35As shown, the LED package unit 1 also includes a detection port pad 1314 connected to the switch circuit 23. The switch circuit 23 is provided with a key switch 230. The detection port pad 1314 is used to detect whether the key switch 230 is pressed. When the key switch 230 switches between the open and closed states, the detection port pad 1314 can detect the voltage change, thereby identifying the state of the key switch 230. The control chip 12 can send the state of the key switch 230 to the main control board 22 via the first data port pad 1311, allowing the main control board 22 to identify which key is pressed, thereby realizing the key detection function. In this way, the keyboard backlight circuit can also realize the key detection function, making the keyboard backlight circuit more versatile. There is no need to set up components such as diodes to realize the anti-ghosting function, which is conducive to simplifying the circuit, reducing the thickness of the keyboard circuit board and the overall thickness of the keyboard, and reducing the complexity of the circuit. When the LED package unit groups are connected in series, the key detection information of the LED package unit 1 in the rear LED package unit group is sent to the second data port pad 1312 of the LED package unit 1 in the front LED package unit group through its first data port pad 1311, and so on, until the front LED package unit group sends the signal to the main control board 22 through the first data port pad 1311 of its LED package unit 1.

[0178] One end of the switch circuit 23 is connected to the detection port pad 1314 , and the other end is connected to the power supply line 20 or the ground line 21 .

[0179] Some embodiments of the present invention further provide a key circuit board, which includes the LED packaging unit described above or the keyboard backlight circuit described above.

[0180] In some embodiments, as Figure 36 As shown, the key circuit board includes a backlight circuit board 38 and a keyboard backlight circuit.

[0181] The keyboard backlight circuit is located on the same surface as the backlight circuit board 38. It includes power lines 20, ground lines 21, signal lines 26, and multiple rows of LED package units. Each row of LED package units includes multiple LED package units 1. Signal lines 26 are used to connect to the main control board 22 to input control signals. The relevant structure of the keyboard backlight circuit can be referred to the description above.

[0182] The specific structure of the LED package unit 1 can be found above, and it can also be other LED package units. The LED package unit 1 includes an LED chip 11, a control chip 12, and a port assembly 131, which is electrically connected to the control chip 12. The port assembly 131 includes a power port pad 1310 connected to the power supply line 20, a ground port pad 1313 connected to the ground line 21, and a first data port pad 1311 and a second data port pad 1312 for signal transmission.

[0183] The LED packaging units 1 are connected in series. In the series direction, the front LED packaging unit 1 is connected to the signal line 26 through its first data port pad 1311. Among the two adjacent LED packaging units 1, the second data port pad 1312 of the front LED packaging unit 1 is electrically connected to the first data port pad 1311 of the rear LED packaging unit 1. In this way, the signal can be transmitted to the LED packaging units 1 on the link in sequence.

[0184] Since the LED packaging units 1 are connected in series, the structure of the keyboard backlight circuit can be simplified, so that one signal line 26 can input control signals to all the LED packaging units 1, and the keyboard backlight circuit can be arranged on the same surface of the backlight circuit board 38, so that the overall thickness of the key circuit board is smaller, manufacturing is more convenient, and the cost is lower.

[0185] In some embodiments, the power line 20 includes a plurality of spaced-apart sub-power lines 200, and the ground line 210 includes a plurality of spaced-apart sub-ground lines 21. The sub-power lines 200 and the sub-ground lines 210 are staggered, i.e., a sub-ground line 210 is provided between two adjacent sub-power lines 200, or a sub-power line 200 is provided between two adjacent sub-ground lines 210. A row of LED package units is provided between adjacent sub-power lines 200 and sub-ground lines 210, and the power port pads 1310 and ground port pads 1313 of the LED package units in this row are respectively connected to the adjacent sub-power line 200 and sub-ground line 210. Optionally, the power port pads 1310 are closer to the sub-power line 200 than the ground port pads 1313, thereby shortening the length of the lines connecting the power port pads 1310 and the sub-power line 200, and between the ground port pads 1313 and the sub-ground line 210. Optionally, the power supply port pad 1310 and the ground port pad 1313 are respectively located at opposite corners of the LED packaging unit 1 .

[0186] By setting the sub-power supply line 200 and the sub-ground line 210 on both sides of a row of LED packaging units respectively, two adjacent rows of LED packaging units can share a sub-ground line 210 or a sub-power supply line 200, which can make the circuit on the key circuit board more compact and fully utilize the space thereon.

[0187] In some embodiments, the keyboard backlight circuit further includes a power port 380, a ground port 381, and a signal port 382 on the backlight circuit board 38. The power port 380, ground port 381, and signal port 382 can be connected to the main control board 22. The power line 20 includes a peripheral power line 201 connected between the power port 380 and the sub-power line 200. The ground line 21 includes a peripheral ground line 211 connected between the sub-ground line 210 and the ground port pad 1313. The signal line 26 is connected between the signal port 382 and the first data port pad 1311 of the frontmost LED package unit 1. The peripheral power line 201 and the peripheral ground line 211 are located on either side of the arrangement direction of the LED package units 1 in the same row.

[0188] In some embodiments, the power port 380 , the ground port 381 and the signal port 382 are adjacently arranged, and the signal port 382 is located between the power port 380 and the ground port 381 . The three ports are arranged close to each other for easy wiring.

[0189] The key circuit board also integrates a key detection function to detect which key is pressed during use.

[0190] In some embodiments, as Figure 37 As shown, the key circuit board includes a first circuit board 30 and a second circuit board 31 spaced apart from each other, and a spacer layer 32 connected between the first circuit board 30 and the second circuit board 31 . The first circuit board 30 is located above the second circuit board 31 .

[0191] A key detection circuit is provided on the first circuit board 30 and includes a key switch 230. Key switch 230 comprises a first contact 2300 located on the first circuit board 30 and a second contact 2301 located on the second circuit board 31. The two contacts are spaced apart from each other, and a spacer layer 32 is provided with a cavity 320 through which the first contact 2300 and the second contact 2301 are exposed. The key detection circuit can adopt the structure of a key detection circuit in the prior art. When the two contacts of key switch 230 are in contact and conductive, it can be detected that key switch 230 has been pressed.

[0192] The backlight circuit board 38 is located on the side of the second circuit board 31 facing away from the first circuit board 30. The projections of the LED package unit 1 and the key switch 230 in the thickness direction of the key circuit board are staggered (i.e., their projections do not overlap), and the LED package unit 1 extends at least into the second circuit board 31. This reduces the thickness W of the key circuit board, making the overall structure more compact.

[0193] In this embodiment, the key detection circuit and the keyboard backlight circuit are controlled by two functional modules respectively, and their functions are independent.

[0194] In some embodiments, the LED packaging unit 1 extends into the spacer layer 32 and is covered by the first circuit board 30, which can protect the LED packaging unit 1. At least the portion of the first circuit board 30 opposite to the LED packaging unit 1 is made of transparent material to allow light from the LED packaging unit 1 to be emitted.

[0195] In some embodiments, the LED package unit 1 extends beyond the first circuit board 30 to improve light efficiency and make the backlight brighter.

[0196] Optionally, the key circuit board also includes a metal plate 36 and a solder resist layer 37. The metal plate 36 is connected to the second circuit board 31, specifically, connected to the side of the second circuit board 31 away from the first circuit board 30. The metal plate 36 can improve the overall structural strength, for example, it can be an iron plate. The solder resist layer 37 is connected between the metal plate 36 and the backlight circuit board 38. Optionally, the metal plate 36 is bonded to the second circuit board 31 and the solder resist layer 37 by an adhesive layer 39. The spacer layer 32, the second circuit board 31, the metal plate 36 and the solder resist layer 37 are jointly provided with an avoidance hole 300, and the LED packaging unit 1 is located in the avoidance hole 300. The first circuit board 30 covers the surface of the LED packaging unit 1 and can protect the LED packaging unit 1. At least the area of ​​the first circuit board 30 corresponding to the LED packaging unit 1 is made of transparent material to allow light to pass through.

[0197] The thickness W of the key circuit board of this structure is relatively small, and can be less than 500 μm.

[0198] In other embodiments, Figure 35 As shown, the port component also includes a detection port pad 1314, which is connected to the switch circuit 23 and is used to detect whether the key switch 230 is pressed. It can be understood that the control chip 12 of the LED packaging unit 1 can send the status of the key switch 230 to the main control board 22 through the first data port pad 1311 to realize the key detection function.

[0199] When the port assembly further includes a detection port pad 1314, the key circuit board can adopt the following structure: Figure 38 As shown, the key circuit board includes a first circuit board 30 and a spacer layer 32 connected between the first circuit board 30 and the backlight circuit board 38. The switch circuit 23 includes a key switch 230. The key switch 230 includes a first contact 2300 located on the first circuit board 30 and a second contact 2301 located on the backlight circuit board 38. The first contact 2300 and the second contact 2301 are spaced apart from each other.

[0200] The projections of the LED package unit 1 and the key switch 230 in the thickness direction of the key circuit board are staggered (ie, there is no overlapping portion of the projections of the two), and the LED package unit 1 extends beyond the first circuit board 30, such as Figure 38 As shown, the spacer layer 32 and the first circuit board 30 are provided with a hole 300 for exposing the LED package unit 1. In this way, the thickness W of the key circuit board is smaller, and the light extraction efficiency can be improved, thereby increasing the brightness of the keycap 35. It can be understood that compared to Figure 37 The key circuit board shown in FIG. 1 can be made thinner in thickness.

[0201] In this embodiment, each key can be controlled by the same digital chip in a distributed manner for keyboard backlight and key detection, which is beneficial to reducing costs.

[0202] Since the LED package unit 1 under each key can detect the state of the key switch 230, the structure of the key detection circuit can be simplified, and there is no need to set up anti-ghosting structures such as diodes. Figures 39 to 41 As shown, Figures 39 to 41 Schematic diagrams of the circuits on the first circuit board 30, the spacer layer 32, and the backlight circuit board 38 are shown in sequence. The backlight circuit board 38 includes a third contact 383 electrically connected to the power supply line 20. The first circuit board 30 is provided with a fourth contact 301 corresponding to the position of the third contact 383. The third contact 383 and the fourth contact 301 are electrically connected, for example, by conductive adhesive. The fourth contact 301 is electrically connected to the first contact 2300. In addition to the cavity 320 that accommodates the first contact 2300 and the second contact 2301, the spacer layer 32 is also provided with a hollow hole 321 corresponding to the position of the LED package unit 1 and the third contact 383 and the fourth contact 301.

[0203] It can be understood that the third contact 383 can also be electrically connected to the ground line 20.

[0204] Optional, such as Figure 38 As shown, the key circuit board also includes a metal plate 36 connected to the bottom of the backlight circuit board 38 to enhance the overall structural strength. The metal plate 36 may be, for example, an iron plate. Because the keyboard backlight circuit and the second contact 2301 are located on the same circuit board, the thickness of the key circuit board can be reduced, which facilitates the thinning and lightweight construction of the keyboard and the electronic device in which it is used. The thickness W of the key circuit board with this structure can be less than 400 μm.

[0205] Figure 42This is a schematic diagram of the structure of a keyboard key circuit board known to the inventor, which is provided with an upper layer 40, a middle layer 41, a lower layer 42, a glue layer 43, an iron plate 44, a glue layer 45, a surface layer 46, a Mylar layer 47, a solder mask layer 48 and a bottom layer 49 from top to bottom. The LED 50 is provided on the bottom layer 49. Compared with the key circuit board of Figure 37 and Figure 38 The key circuit board shown has relatively more layers and a more complicated process, resulting in a larger thickness W (about 700 μm) and a higher manufacturing cost.

[0206] like Figure 37 and Figure 38 As shown, a reset member 33 and a keycap 35 are correspondingly provided above the key switch 230. The reset member 33 can be made of an elastic material such as rubber or silicone. When the keycap 35 is pressed, the keycap 35 presses the reset member 33 and the key switch 230, so that the first contact 2300 and the second contact 2301 come into contact, and the switch circuit 23 is turned on. When the keycap 35 is released, the keycap 35 is reset under the elastic force of the reset member 33, and the switch circuit 23 is turned off. At least part of the material of the keycap 35 is made of a transparent material so that the light of the LED package unit 1 can pass through the transparent material to achieve a backlight effect. In some embodiments, a light-transmitting area 350 made of a transparent material is provided on the keycap 35. The light-transmitting area 350 can, for example, be consistent with the symbol (such as a letter or graphic) marked on the keycap 35, so that the light of the LED package unit 1 can illuminate the symbol of the keycap 35, which is more beautiful.

[0207] Optionally, the first circuit board 30, the second circuit board 31 and the backlight circuit board 38 are all thin film circuits, and circuits can be formed by silver paste printing or FPC.

[0208] Some embodiments of the present invention further provide a keyboard, which includes the LED packaging unit described above, or the keyboard backlight circuit described above, or the key circuit board described above.

[0209] It is understandable that when the LED package unit 1 is installed on the keyboard, it is necessary to calibrate its brightness so that the backlight brightness of each keycap is more consistent. Next, the content related to the keyboard backlight brightness calibration is introduced.

[0210] It should be noted that the calibration of the keyboard backlight brightness will be described below using the LED packaging unit 1 described above as an example. However, it is not limited to the LED packaging unit 1 of the embodiment described above, and can also be applied to other LED packaging units 1.

[0211] The LED package unit 1 includes an LED chip 11 , a control chip 12 , a memory 120 and a port assembly 131 .

[0212] The control chip 12 is electrically connected to the LED chip 11 and is used to generate an electrical signal for controlling the LED chip 11 to emit light.

[0213] The memory 120 stores the brightness parameters of the LED chip 11 , which are the actual brightness information of the LED chip 11 when emitting light. When the LED chip 11 is produced, the parameter information of the LED chip 11 itself can be measured by a spectrometer or other equipment.

[0214] The port component 131 includes a first data port pad 1311 electrically connected to the control chip 12, and the first data port pad 1311 is used to receive a control signal. The luminous information in the control signal includes luminous brightness, which is the brightness required to be achieved when the LED chip 11 emits light. The control chip 12 can normalize the brightness of the LED chip 11 according to the brightness parameter, so that the actual luminous brightness of the LED chip 11 is close to the luminous brightness in the luminous information, so that the actual luminous brightness of the LED chip 11 can be closer to the required luminous brightness, or even consistent with the required luminous brightness. In this way, the actual luminous brightness of the LED chip is closer to the required luminous brightness. When the LED packaging unit is applied to the keyboard, the luminous brightness of each keycap can be closer, which is conducive to ensuring the consistency of the backlight brightness.

[0215] It is understood that the brightness parameters of each LED chip 11 are different. For example, under the same driving voltage, the actual brightness of each LED chip 11 will vary. When these different LED chips 11 are used in a keyboard, the consistency of the keyboard backlight brightness will be affected. During normalization, the brightness of each LED chip 11 is controlled based on its own brightness parameters and the required brightness. For example, if the brightness parameters of an LED chip 11 are too high, the brightness of that LED chip 11 can be lowered to approach or match the required brightness.

[0216] In some embodiments, the brightness parameter includes the actual brightness value corresponding to the LED chip 11 under different driving voltages. For example, the brightness parameter is a voltage-brightness curve. Of course, the voltage-brightness curve is stored in the memory 120 in the form of data.

[0217] Optionally, the normalization processing includes adjusting the voltage of the electrical signal. For example, during the normalization processing, the driving voltage corresponding to the luminous brightness is first obtained in the brightness parameter based on the luminous brightness requirement of the luminous information, and the driving voltage is used as the voltage of the electrical signal to drive the LED chip 11 to emit light. By adjusting the voltage, the actual luminous brightness of the LED chip 11 is close to or consistent with the required luminous brightness.

[0218] Optionally, the normalization process includes adjusting the duty cycle of the electrical signal. The electrical signal is a pulse signal. Within a unit time, the greater the duty cycle of the electrical signal, the longer the actual luminescence time of the LED chip 11 and the higher the brightness perceived by the human eye. Conversely, the smaller the duty cycle of the electrical signal, the shorter the actual luminescence time of the LED chip 11 and the lower the brightness perceived by the human eye. By adjusting the duty cycle of the electrical signal, the brightness of the LED chip 11 can be changed. For example, when the LED chip 11 is supplied with a continuous high level (duty cycle of 100%) at a certain voltage, the luminance is N. Then, when it needs to emit a brightness of M% of N, it only needs to adjust the duty cycle of the electrical signal to M%. Optionally, the voltage-brightness curve of the LED chip 11 is the relationship curve between the brightness and voltage when the duty cycle of the driving voltage signal is 100%. The voltage of the power supply line 20 of the keyboard backlight circuit remains unchanged, that is, the voltage of the electrical signal driving the LED chip 11 is always the same, to simplify the circuit. At this time, the luminous brightness contained in the luminous information is generally less than or equal to the actual brightness of the LED chip 11 under the voltage of the power supply line 20, so that the actual brightness can be achieved by reducing the duty cycle. During the normalization process, the actual brightness value of the LED chip 11 is first obtained based on the voltage of the electrical signal, and then the duty cycle of the electrical signal is obtained based on the luminous brightness required by the luminous information and the actual brightness value. When the voltage-brightness curve of the LED chip 11 is a relationship curve between the brightness and voltage of the driving voltage signal when the duty cycle is 100%, the ratio of the calculated luminous brightness to the obtained actual brightness value can be used as the duty cycle of the electrical signal, which can simplify the calculation. For example, the voltage of the power supply line that supplies power to the LED chip 11 is 3V (the voltage of the power supply line is the voltage of the electrical signal), the actual brightness value corresponding to the brightness parameter and the driving voltage of 3V is 100, and the luminous brightness required by the luminous information is 90, then the duty cycle of the electrical signal is 90%.

[0219] In other embodiments, the voltage-brightness curve of the LED chip 11 can also be a curve showing the relationship between the brightness and voltage when the duty cycle of the driving voltage signal is less than 100%; at this time, the luminous brightness contained in the luminous information can be less than, equal to or greater than the actual brightness of the LED chip 11 under the voltage of the power supply line 20, and the brightness requirements can be met by increasing or decreasing the duty cycle.

[0220] In some embodiments, the brightness parameter includes the lighting duration of the LED chip 11 and corresponding brightness data, such as an LED aging curve. It will be appreciated that the aging curve is also stored in the memory 120 as data. During use, the brightness of the LED chip 11 gradually decreases as the lighting duration increases. This can result in differences in the brightness of different LED chips 11, thereby affecting the consistency of the backlight brightness. By storing the lighting duration and corresponding brightness data of the LED chip 11 in the memory 120, the current theoretical actual brightness of the LED chip 11 can be determined based on the usage time of the LED chip 11. The actual brightness can then be adjusted to a value closer to the desired brightness by adjusting the duty cycle. Specifically, during the normalization process, the actual brightness value of the LED chip 11 is first obtained based on the actual lighting duration of the LED chip 11 and the voltage of the electrical signal. The duty cycle of the electrical signal of the LED chip 11 is then determined based on the actual brightness value and the desired brightness. It will be appreciated that the actual lighting duration of the LED chip 11 is recorded in real time during the lighting process and stored in the memory 120.

[0221] In some embodiments, the brightness parameter includes a curve of three dimensions: voltage, aging, and brightness. Control chip 12 normalizes the brightness based on this curve, enabling the actual brightness of LED chip 11 to more closely approximate the brightness required by the lighting information. During normalization, control chip 12 derives the actual brightness value based on the voltage of the electrical signal and the actual lighting duration of LED chip 11. Then, based on the actual brightness value and the required brightness, control chip 12 determines the duty cycle of the electrical signal for LED chip 11.

[0222] When performing normalization processing, the voltage or duty cycle of the electrical signal may be adjusted individually, or both may be adjusted simultaneously.

[0223] In some embodiments, the LED packaging unit 1 includes at least two LED chips 11 with different luminous colors, for example, three LED chips 11 that emit red, green and blue light respectively. The memory 120 stores brightness parameters corresponding to each LED chip 11. When controlling the corresponding LED chip 11 to emit light, the corresponding brightness parameters are called for normalization processing.

[0224] In some embodiments, the memory 120 is built into the control chip 12, which can reduce the occupation of the pads of the control chip 12. In other embodiments, the memory 120 is an independent memory 120 electrically connected to the control chip 12, which is packaged in the package 10 together with the control chip 12 and the LED chip 11.

[0225] When the keyboard is equipped with an LED packaging unit 1 provided with a memory 120, each LED packaging unit 1 can normalize the brightness according to the brightness parameters of its own LED chip 11, so that the brightness emitted by each LED packaging unit 1 is more consistent with the brightness required in the control signal. When the keyboard maintains a constantly bright backlight effect, the brightness of the characters on each keycap is more consistent, which makes it easier to accurately identify the characters on the keys and is more beautiful.

[0226] The keyboard includes multiple keycaps and LED packaging units 1 corresponding to the keycaps. The keycaps are provided with symbols for illumination. Due to the different symbols on the keycaps and the different positions of the LED chips 11 relative to the symbols, even if the brightness of the light emitted by the LED chips 11 under two keycaps is exactly the same, the brightness of the symbols on the keycaps may vary. For example, some keycaps have larger symbol areas, correspondingly larger light-transmitting areas, and higher brightness. Some keycaps have symbols directly above the LED chips 11, resulting in brighter symbols. However, when the symbols on the keycaps are to the side of the LED chips 11, the brightness of the symbols is relatively reduced. Therefore, the problem of inconsistent backlight brightness of the keycaps on the keyboard may still exist.

[0227] To address the above issues, some embodiments of the present invention provide a keyboard backlight brightness calibration method, which is performed after the keyboard keycaps are installed. Each keycap is provided with at least one LED packaging unit 1, which includes an LED chip 11 and a control chip 12. The control chip 12 is used to generate an electrical signal to drive the LED chip 11 to emit light based on a received control signal. The keyboard backlight brightness calibration method includes the following steps:

[0228] S1. Receive a control signal through the control chip 12 and identify the luminous information corresponding to the LED chip 11, where the luminous information includes luminous brightness.

[0229] S2. The control chip 12 generates a compensated electrical signal according to the luminous brightness corresponding to the LED chip 11 and the compensation coefficient, and controls the LED chip 11 to emit light through the compensated electrical signal.

[0230] In step S2, the compensated electrical signal is generated by the luminous brightness of the LED chip 11 and the compensation coefficient, which can adjust the brightness of each keycap so that the brightness of each keycap is more consistent when the backlight is always on, which is conducive to clearer identification of the key symbols and improved aesthetics.

[0231] In step S1 , the control signal includes address information and light-emitting information corresponding to the LED chip 11 . The control chip 12 identifies the light-emitting information corresponding to each LED chip 11 according to the address information, so that the LED chip 11 emits light according to the control signal.

[0232] In some embodiments, the compensation coefficient is obtained through simulation, theoretical calculation, or empirical estimation based on the area of ​​the characters on each keycap and the relative position of the characters and the LED chip 11.

[0233] In some embodiments, the compensation coefficient is obtained by the following steps:

[0234] E1. A control signal is input to all LED packaging units 1 to make the required LED chips 11 emit light. The control signal contains light emission information for different LED chips 11 with the same light emission brightness.

[0235] E2. Check the brightness of all keycaps.

[0236] E3. Set a target brightness value, and divide the target brightness value by the brightness value of each keycap to obtain a compensation coefficient corresponding to the keycap. That is, the compensation coefficient is the ratio of the target brightness value to the brightness value of each keycap.

[0237] For example, if the brightness value of the keycap is detected to be 100 and the target brightness value is 90, then the compensation coefficient is 0.9. By compensating the electrical signal, the brightness of the light emitted by the LED chip 11 is 0.9 times the original, so that the actual brightness of the keycap can be close to the target brightness value. When all the keycaps are compensated to make the luminous brightness close to the target brightness value, the backlight brightness of the keyboard will be more consistent.

[0238] In step E1, the LED chips 11 that need to emit light are controlled by control signals to emit light of the same brightness, so as to accurately obtain the compensation coefficient corresponding to each keycap, so that more consistent backlight brightness can be achieved during subsequent actual backlight use.

[0239] In step E2, the brightness of each keycap can be measured, for example, using an imaging luminance meter. It is understood that since only the symbol on a keycap emits light, the brightness of the keycap can be understood as the brightness of the symbol. The brightness of different parts of the symbol may not be exactly the same. Alternatively, the brightness of the keycap refers to the average brightness of the symbol, which can also be obtained using an imaging luminance meter.

[0240] In some embodiments, in step S2, the step of the control chip 12 generating a compensated electrical signal according to the luminance corresponding to the LED chip 11 and the compensation coefficient includes:

[0241] S21 generates an initial electrical signal according to the luminous brightness;

[0242] S22. Multiply the duty cycle of the initial electrical signal by the compensation coefficient to obtain a compensated electrical signal.

[0243] In step S21 , an initial electrical signal is generated according to the luminous brightness required by the control signal, which can be generated in a traditional manner, or by using the voltage-luminance curve or the aging curve as described above, or a combination of the two.

[0244] In step S22, the duty cycle of the initial electrical signal is multiplied by the compensation coefficient to adjust the duty cycle of the electrical signal, thereby adjusting the brightness of the LED chip 11 so that the brightness of each keycap is close. For example, if the duty cycle of the initial electrical signal generated by the control chip 12 based on the luminous brightness is 90%, and the compensation coefficient is 0.9, then the duty cycle of the compensated electrical signal is 90% * 0.9 = 0.81, and the brightness of the keycap will be further reduced.

[0245] It is understandable that, since the keycap blocks light, the brightness of the keycap is usually lower than the brightness of the LED chip 11 . Therefore, the brightness of the keycap is usually lower than the luminous brightness in the luminous information.

[0246] In some embodiments, the target brightness value is less than or equal to the average brightness value of all keycaps, so that the brightness of most keycaps can be compensated to a value close to the target brightness value. It is understandable that when the duty cycle of the electrical signal of the LED chip 11 is adjusted to 100%, it will not be possible to continue to increase the brightness by increasing the duty cycle. Therefore, if the target brightness value is too high, it may cause more keycaps to have a large gap with the target brightness value even if the brightness of their LED chips 11 is adjusted to the highest. By setting the target brightness value to be less than or equal to the average brightness value of all keycaps, the brightness of all or most keycaps can be close to the target brightness value, which is conducive to ensuring the consistency of the keyboard backlight brightness and having better overall brightness. The average brightness value of all keycaps is the ratio of the sum of the brightness of all keycaps to the number of keycaps.

[0247] In some embodiments, the target brightness value is less than or equal to the brightness value of the keycap with the lowest brightness among all the keycaps. In this way, the LED chips 11 of all the keycaps can reduce the luminous brightness by reducing the duty cycle, so that the backlight brightness of each keycap is close to the same.

[0248] In some embodiments, the LED packaging unit 1 includes only one LED chip 11, and the luminous color of the LED chip 11 of each LED packaging unit 1 is the same. In step D1, when the required LED chip 11 is illuminated, all LED chips 11 are illuminated to check the brightness of all keycaps.

[0249] In other embodiments, the LED package unit 1 includes at least two LED chips 11 of different luminous colors. When the required LED chip 11 is illuminated, the LED chips 11 of the same color in all LED package units 1 are illuminated. For example, when the LED package unit 1 includes three colors of LED chips 11: red, green, and blue, the red LED chips in all LED package units 1 can be illuminated first, and steps E1 to E3 can be executed. Then, the green LED chips in all LED package units 1 can be illuminated, and steps E1 to E3 can be executed. Finally, the blue LED chips in all LED package units 1 can be illuminated, and steps E1 to E3 can be executed. By obtaining the compensation coefficients for the different colors of LED chips 11 in batches, the brightness of all keycaps can be made more consistent, and when the light is subsequently mixed, each keycap can also have a similar brightness performance.

[0250] In some embodiments, the LED packaging unit 1 includes a memory 120 , and the compensation coefficient is stored in the memory 120 . The control chip 12 obtains the compensation coefficient corresponding to the LED chip 11 by calling the stored coefficient in the memory 120 , which is more intelligent.

[0251] It can be understood that the keyboard proposed in the present invention can execute the keyboard backlight brightness calibration method described above.

[0252] The present invention further provides an electronic device, which includes the LED packaging unit 1 described above, or includes the keyboard backlight circuit described above, or includes the keyboard described above.

[0253] The electronic device may be, for example, a mobile phone with buttons, a laptop computer, a desktop computer, a game console, or other devices with buttons.

[0254] It should be noted that, in the absence of conflict, the various embodiments in this document can be combined with each other to obtain more implementation plans.

[0255] The above is only a specific embodiment of the present invention, and any other improvements made based on the concept of the present invention are considered to be within the protection scope of the present invention.

Claims

1. An LED packaging unit, characterized in that: include: LED chip (11); a control chip (12), electrically connected to the LED chip (11), and configured to generate an electrical signal for controlling the LED chip (11) to emit light; a memory (120) storing brightness parameters of the LED chip (11); and A port component (131) comprising a first data port pad (1311) electrically connected to the control chip (12), wherein the first data port pad (1311) is used to receive a control signal; The control signal includes luminous information corresponding to the LED chip (11), the luminous information including luminous brightness, and the control chip (12) can normalize the brightness of the LED chip (11) according to the brightness parameter so that the actual luminous brightness of the LED chip (11) approaches the luminous brightness contained in the luminous information.

2. The LED packaging unit according to claim 1, wherein: The brightness parameter includes actual brightness values ​​corresponding to the LED chip (11) under different driving voltages, and the normalization process includes adjusting the voltage of the electrical signal.

3. The LED packaging unit according to claim 2, wherein: During the normalization process, a corresponding driving voltage is first obtained according to the luminous brightness, and the driving voltage is used as the voltage of the electrical signal for driving the LED chip (11) to emit light.

4. The LED packaging unit according to claim 1, wherein: The brightness parameter includes the actual brightness value corresponding to the LED chip (11) under different driving voltages, and the normalization process includes adjusting the duty cycle of the electrical signal.

5. The LED packaging unit according to claim 4, wherein: During normalization processing, the actual brightness value of the LED chip (11) is first obtained based on the voltage of the electrical signal; and then the duty cycle of the electrical signal is obtained based on the luminous brightness and the actual brightness value.

6. The LED packaging unit according to claim 2 or 4, characterized in that: The duty cycle of the driving voltage is 100%.

7. The LED packaging unit according to claim 4, wherein: The brightness parameter includes the luminous duration of the LED chip (11) and corresponding brightness data. During normalization processing, the actual brightness value of the LED chip (11) is obtained based on the actual luminous duration of the LED chip (11) and the voltage of the electrical signal, and the duty cycle of the electrical signal of the LED chip (11) is obtained based on the actual brightness value and the luminous brightness.

8. The LED packaging unit according to claim 1, wherein: The memory (120) is built into the control chip (12), or the memory (120) is an independent memory (120) electrically connected to the control chip (12).

9. The LED packaging unit according to claim 1, wherein: The LED packaging unit comprises three LED chips (11), and the three LED chips (11) are used to emit red, green and blue light respectively.

10. The LED packaging unit according to claim 9, wherein: The control signal also includes the color and time of the light emission.

11. A keyboard, characterized in that: include: Main control board (22); a plurality of keycaps (35); as well as, The LED packaging unit (1) according to any one of claims 1 to 10 is arranged corresponding to the keycap (35), wherein the keycap (35) is at least partially made of a transparent material to allow light from the LED packaging unit (1) to be emitted.

12. The keyboard according to claim 11, wherein The LED packaging unit (1) comprises a second data port solder pad (1312) electrically connected to the control chip (12); a plurality of the LED packaging units (1) are connected in series; the second data port solder pad (1312) of the preceding LED packaging unit (1) is connected to the first data port solder pad (1311) of the succeeding LED packaging unit (1); and the first data port solder pad (1311) of the leading LED packaging unit (1) is electrically connected to the main control board (22).

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