Automatic tin soldering test assembly line for electronic components

Abstract

The invention relates to the technical field of automation, in particular to an electronic component automatic tin soldering test assembly line which comprises a tin soldering unit, a test unit, an assembly unit and a glue pouring unit which are connected in sequence, the tin soldering unit is used for conducting tin soldering on an electronic component, and a tin soldering transfer mechanism is arranged between the tin soldering unit and the test unit; the tin soldering unit is used for transferring the tin-soldered electronic component to the testing unit, the testing unit is used for carrying out function testing on the tin-soldered electronic component, the testing unit delivers the tested non-defective electronic component to the assembling unit, and the assembling unit is used for assembling a shell of the electronic component. And the assembled electronic component with the shell is placed on the glue pouring unit, and the glue pouring unit is used for pouring glue into the shell of the electronic component. By implementing a series of automation on the electric reactor, full-automatic production is realized from tin soldering, detection, shell mounting, plate placing and final glue pouring, manpower and material resources are saved, and the production efficiency is high.

Description

Technical Field

[0001] The present invention relates to the field of automation technology, in particular to an automatic soldering test assembly line for electronic components. Background Art

[0002] In the existing reactor production process, the soldering process is mainly used to achieve electrical connections between the various components inside the reactor. It usually relies on manual operation of soldering equipment to complete. Not only is the efficiency low, but the quality of the solder joints is easily affected by the operator's skill level and working status. The testing phase is to test the various performance indicators of the reactor that has been soldered, such as inductance value, resistance value, etc., and it is also often done manually by placing the reactors one by one on the test equipment for testing. The process is cumbersome and prone to missed tests. The shell assembly process is designed to provide physical protection and installation support for the reactor. Currently, it also relies on manual assembly of the shell components and the reactor body, which makes it difficult to ensure the consistency and accuracy of the assembly. The glue filling process is to further protect the internal components of the reactor from interference from external environmental factors.

[0003] Because these processes are performed independently and lack effective automated linkage mechanisms, the entire production process involves significant manual handling and waiting time, significantly limiting productivity gains. This also increases production costs and product quality instability, making it difficult to meet modern industry's demand for efficient, stable, and large-scale production of reactors. Therefore, improvements to existing reactor production automation are needed. Summary of the Invention

[0004] To solve the above problems, the present invention implements a series of automation on the reactor, from soldering, testing to shell installation, plate placement and final glue filling, to achieve fully automated production, save manpower and material resources, improve automation effects, and realize an automatic soldering test assembly line for electronic components with high production efficiency.

[0005] The technical solution adopted by the present invention is: an automatic soldering test assembly line for electronic components, including a soldering unit, a testing unit, an assembly unit and a glue filling unit connected in sequence, the soldering unit is used to solder electronic components, and a solder transfer mechanism is provided between the soldering unit and the testing unit for transferring the electronic components after soldering toward the testing unit, the testing unit is used to perform functional testing on the electronic components after soldering, the testing unit delivers the tested good electronic components to the assembly unit, the assembly unit is used to assemble the electronic components into a shell, and place the assembled electronic components in the shell on the glue filling unit, and the glue filling unit is used to fill the shell of the electronic component with glue.

[0006] A further improvement to the above scheme is that the soldering unit includes a loading mechanism, a solder picking mechanism, a fluxing mechanism and a soldering mechanism. The loading mechanism is provided with a loading carrier for fixing electronic components and transferring them to a designated position. The solder picking mechanism is used to grab electronic components on the loading carrier and transfer them between the fluxing mechanism, the soldering mechanism and the solder transfer mechanism. The fluxing mechanism is used to replenish flux to the parts of the electronic components that require solder. The soldering mechanism is used to solder the electronic components. After soldering is completed, the solder picking mechanism places the electronic components on the solder transfer mechanism for transfer and collection. The solder transfer mechanism, the fluxing mechanism and the soldering mechanism are arranged in sequence along the first direction of the rack. The solder picking mechanism places the grabbed electronic components into the solder transfer mechanism after passing them through the fluxing mechanism and the soldering mechanism.

[0007] A further improvement to the above scheme is that the loading mechanism includes a loading transmission module, the loading carrier is arranged on the loading transmission module, the loading transmission module is used to drive the loading carrier to reciprocate between the loading station and the picking station, and the solder picking mechanism is used to grab the electronic components on the loading carrier at the picking station; the loading carrier is provided with multiple discharge troughs to place multiple electronic components at the same time.

[0008] A further improvement to the above scheme is that the solder picking mechanism includes a transmission gantry, a picking and transferring module, a picking and lifting module and a grabbing module. The transmission gantry is located on both sides of the soldering mechanism, the soldering mechanism and the solder transfer mechanism. The picking and transferring module is arranged on the transmission gantry and is used to drive the picking and lifting module and the grabbing module to be transmitted between the feeding mechanism, the soldering mechanism, the soldering mechanism and the solder transfer mechanism. The grabbing module is arranged on the picking and lifting module. The grabbing module is provided with multiple groups , corresponding to grabbing multiple electronic components at the same time; the material picking and transplanting module is a transmission module combining belt drive and guide rail drive, and the material picking and lifting module is a transmission module combining a lead screw and a guide rod; the grabbing module includes a grabbing cylinder and a clamping claw, and the grabbing cylinder is used to drive the clamping claw to grab the electronic components; a flip module is provided on the material picking and lifting module, and the flip module is used to drive the grabbing module to flip, and a protective cover is provided on the outside of the grabbing module and the flip module to cope with the high temperature of the soldering mechanism.

[0009] A further improvement to the above scheme is that the fluxing mechanism includes a fluxing bracket and a fluxing tank arranged on the fluxing bracket, the flux tank is used to contain flux so as to immerse the soldering position of the electronic component in the flux; the soldering mechanism includes a soldering base, a soldering tank, a tin scraping module and a tin slag tank, the soldering tank is arranged on the soldering base, a plurality of heating elements are arranged in the soldering tank for heating the tin material in the soldering tank, the tin slag tank is located on one side of the soldering tank, and the tin scraping module is used to scrape the tin slag in the soldering tank toward the tin slag tank; the tin scraping module includes a tin scraping bracket, a tin scraping lifting cylinder, a tin scraping driving cylinder and a tin scraping plate, the tin scraping bracket is arranged on one side of the frame, the tin scraping lifting cylinder is arranged on the tin scraping bracket, the tin scraping driving cylinder is arranged on the tin scraping lifting cylinder, and the tin scraping plate is arranged on the tin scraping driving cylinder to realize lifting and unidirectional reciprocating transmission of tin scraping.

[0010] A further improvement to the above scheme is that it also includes a tin slag brushing mechanism, which includes a tin slag holding chamber, a tin slag brush roller and a tin slag driving motor. The tin slag driving motor is used to drive the tin slag brush roller to rotate in the tin slag holding chamber, and the solder material picking mechanism is used to grab the electronic components after soldering and put them onto the tin slag brush roller to brush the tin slag to remove the tin slag in the solder part.

[0011] A further improvement to the above scheme is that the testing unit includes a voltage resistance testing mechanism, a test transfer mechanism, an interlayer testing mechanism and a comprehensive testing mechanism. The voltage resistance testing mechanism is used to grab the electronic components from the solder transfer mechanism and position them to perform a voltage resistance test on the electronic components. After completion, the electronic components are transferred to the interlayer testing mechanism and the comprehensive testing mechanism in sequence through the test transfer mechanism for testing.

[0012] A further improvement to the above scheme is that the pressure test mechanism includes a pressure test material picking module, a pressure test module and a pressure defect sorting module, the pressure test material picking module is used to grab electronic components on the solder transfer mechanism and transfer them to the pressure test module; the pressure test module includes a pressure test bracket, a pressure test lifting cylinder relatively arranged on both sides of the pressure test bracket, a pressure test probe, a pressure clamping line driving cylinder and a pressure clamping plate, the pressure test lifting cylinder is arranged on the pressure test bracket, the pressure test probe is arranged at the driving end of the pressure test lifting cylinder, the pressure test bracket is provided with a pressure test slot above the pressure test probe, the pressure test material picking module grabs the electronic components and places them on the pressure test slot, the pressure test probe is used to contact the solder part of the electronic components and conduct a conductive pressure test; during the test, the pressure clamping line driving cylinder is used to drive the pressure clamping plate to clamp and fix the connecting wires of the electronic components to prevent the connecting wires from shaking.

[0013] A further improvement to the above scheme is that the pressure-resistant test material picking module includes a pressure-resistant material picking transmission module, a pressure-resistant material picking lifting cylinder and a pressure-resistant grabbing cylinder. The pressure-resistant material picking lifting cylinder is arranged on the pressure-resistant material picking transmission module, and the pressure-resistant grabbing cylinder is arranged on the pressure-resistant material picking lifting cylinder for grabbing electronic components; the pressure-resistant defective sorting module is a conveying module and is located on one side of the pressure-resistant test module.

[0014] A further improvement to the above scheme is that the test transfer mechanism includes a test transfer transmission module and a test transfer material picking module, the test transfer transmission module is used to receive electronic components after being tested by the pressure test mechanism, and transfer the electronic components toward the interlayer test mechanism; the test transfer material picking module includes a transfer transverse movement module and three groups of transfer grabbing cylinders, the transfer transverse movement module is used to drive the three groups of transfer grabbing cylinders to alternately transmit between the test transfer transmission module, the interlayer test mechanism and the comprehensive test mechanism.

[0015] A further improvement to the above scheme is that the interlayer testing mechanism includes an interlayer testing module and an interlayer defective sorting module, the interlayer testing module includes an interlayer testing bracket, an interlayer testing lifting cylinder relatively arranged on both sides of the interlayer testing bracket, an interlayer testing probe, an interlayer clamping line driving cylinder and an interlayer clamping plate, the interlayer testing lifting cylinder is arranged on the interlayer testing bracket, the interlayer testing probe is arranged at the driving end of the interlayer testing lifting cylinder, the interlayer testing bracket is provided with an interlayer testing slot above the interlayer testing probe, the test transfer mechanism grabs the electronic components and places them on the interlayer testing slot, the interlayer testing probe is used to contact the solder part of the electronic components and conduct interlayer testing; during the test, the interlayer clamping line driving cylinder is used to drive the interlayer clamping plate to clamp and fix the connecting wires of the electronic components to prevent the connecting wires from shaking; the interlayer defective sorting module is a conveying module, and is located on one side of the interlayer testing module.

[0016] A further improvement to the above scheme is that the comprehensive testing mechanism includes a comprehensive testing module and a comprehensive defective sorting module, the comprehensive testing module includes a comprehensive testing bracket, a comprehensive testing lifting cylinder relatively arranged on both sides of the comprehensive testing bracket, a comprehensive testing probe, a comprehensive wire clamping driving cylinder and a comprehensive clamping plate, the comprehensive testing lifting cylinder is arranged on the comprehensive testing bracket, the comprehensive testing probe is arranged at the driving end of the comprehensive testing lifting cylinder, the comprehensive testing bracket is provided with a comprehensive testing slot above the comprehensive testing probe, the test transfer mechanism grabs the electronic components and places them on the comprehensive testing slot, the integrated testing probe is used to contact the solder part of the electronic components and conduct a comprehensive conductive test; during the test process, the comprehensive wire clamping driving cylinder is used to drive the comprehensive clamping plate to clamp and fix the connecting wires of the electronic components to prevent the connecting wires from shaking; the comprehensive defective sorting module is a conveying module and is located on one side of the comprehensive testing module.

[0017] A further improvement to the above scheme is that the assembly unit includes a feeding mechanism, a shell feeding mechanism, a coding mechanism, a pre-assembly mechanism, a transfer mechanism, a pressing mechanism and a swing plate mechanism, the pre-assembly mechanism includes a pre-assembly rotating module, a rotating base plate and two groups of pre-assembly clamping modules, the rotating base plate is arranged on the pre-assembly rotating module, and the two groups of pre-assembly clamping modules are relatively arranged on both sides of the rotating base plate, the shell feeding mechanism is used to feed the shell toward the pre-assembly clamping module, the pre-assembly rotating module is used to drive the rotating base plate to drive the pre-assembly clamping module to rotate, the feeding mechanism is used to receive and transfer electronic components from the test unit to the shell on the pre-assembly clamping module; the coding mechanism is used to code and mark the shell of the shell feeding mechanism; the transfer mechanism is used to grab the shell after the electronic components are assembled and transfer it to the pre-assembly clamping module, the pressing mechanism and the swing plate mechanism in sequence, the pressing mechanism is used to press and fix the electronic components in the shell, and the swing plate mechanism is used to swing the shell with the electronic components; the glue filling unit is used to glue the electronic components after the swing plate.

[0018] A further improvement to the above solution is that the shell feeding mechanism includes a direct vibration feeding track, a shell feeding grabbing module, and a coding positioning module; the direct vibration feeding track is used for direct vibration feeding of shells, the shell feeding grabbing module is used to grab shells from the shell direct vibration feeding track and move them sequentially to the coding positioning module and the pre-assembly clamping module, and the coding mechanism includes a laser coding machine for laser coding the shells on the coding positioning module;

[0019] A further improvement to the above scheme is that a shell positioning seat is provided at the front end of the straight vibration feeding track for positioning the shell at the front end, and the shell feeding grabbing module includes a shell grabbing transmission module, a shell grabbing lifting module and a shell grabbing module. The shell grabbing modules are provided with two groups and are arranged on the shell grabbing lifting module. The shell grabbing lifting module is arranged on the shell grabbing transmission module. The shell grabbing module is used to grab the shell from the shell positioning seat and place it alternately on the coding positioning module and the pre-assembly clamping module.

[0020] The beneficial effects of the present invention are:

[0021] Compared with the existing reactor production, the present invention implements a series of automation on the reactor, from soldering, testing to shell installation, plate placement and final glue filling, to achieve fully automated production, save manpower and material resources, improve automation effects and high production efficiency.

[0022] By establishing independent soldering and testing units, connected by a solder transfer mechanism, efficient coordination between the soldering and testing processes is achieved. This ensures that components can be quickly and accurately transported to the testing stage after soldering is completed, avoiding potential component damage and inefficiencies associated with manual handling. The withstand voltage test mechanism can directly grasp the reactor from the solder transfer mechanism for positioning testing. Its precise grasping and positioning capabilities effectively ensure the accuracy of the test points, resulting in reliable withstand voltage test results. This is crucial for assessing the reactor's ability to withstand voltage in actual operation and helps to identify products that do not meet withstand voltage standards in advance. The test transfer mechanism sequentially transfers the reactor to the interlayer test and comprehensive test mechanisms. The interlayer test meticulously examines the electrical performance of each layer within the reactor, while the comprehensive test comprehensively assesses its overall performance indicators. This step-by-step and comprehensive testing process significantly improves the accuracy and completeness of the reactor's solder quality and electrical performance testing, effectively ensuring the quality of the reactors shipped, reducing the risk of subsequent failures due to soldering or performance defects, and enhancing the reliability and stability of the entire production process.

[0023] The soldering unit utilizes key technologies such as efficient loading, precise material removal, reliable fluxing, stable soldering, and automated material collection to fully automate reactor soldering operations. This significantly improves production efficiency, welding quality, and product reliability, providing strong technical support and assurance for the reactor manufacturing industry. A modular layout integrates loading, fluxing, soldering, and material collection into a single work unit. The linear process flow effectively reduces material transfer distances, enabling automated and continuous operation of the reactor soldering process. The loading mechanism precisely secures and transports the reactor, while the material removal mechanism quickly and accurately transfers materials between various mechanisms, significantly reducing manual operation time and significantly improving production efficiency compared to traditional manual soldering methods. The fluxing mechanism evenly applies flux to the reactor sections requiring soldering, ensuring optimal wettability during the soldering process. Combined with the precise soldering operation of the soldering mechanism, the soldering joints are plump, firm, and smooth, effectively preventing quality issues such as cold and leaky solder joints. This significantly improves the quality and stability of the reactor soldering, ensuring reliable electrical performance. The entire soldering process is highly automated, reducing reliance on large amounts of manual labor. Only a small number of personnel are required to monitor the equipment and perform simple maintenance, significantly reducing labor costs and the risk of quality fluctuations caused by factors such as manual operator fatigue. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a three-dimensional schematic diagram of an automatic welding test assembly line for electronic components according to the present invention;

[0025] Figure 2 for Figure 1 A top view of the automatic soldering, testing, and assembly line for electronic components;

[0026] Figure 3 It is a three-dimensional schematic diagram of the soldering unit and the testing unit of the present invention;

[0027] Figure 4 for Figure 1 Schematic diagram of top view of soldering unit and test unit;

[0028] Figure 5 is a three-dimensional schematic diagram of the solder unit of the present invention;

[0029] Figure 6 for Figure 5 Schematic diagram of part of the structure of the solder unit;

[0030] Figure 7 for Figure 5 A three-dimensional schematic diagram of the material taking mechanism of the middle solder unit;

[0031] Figure 8 for Figure 5 A three-dimensional schematic diagram of the material removal mechanism of the middle solder unit from another perspective;

[0032] Figure 9 is a three-dimensional schematic diagram of a test unit of the present invention;

[0033] Figure 10 for Figure 9 Schematic diagram of the test unit structure;

[0034] Figure 11 for Figure 10 A is an enlarged schematic diagram;

[0035] Figure 12 for Figure 10 An enlarged schematic diagram of point B in FIG.

[0036] Figure 13 for Figure 10 The enlarged schematic diagram of point C in FIG.

[0037] Figure 14 is a three-dimensional schematic diagram of an assembly unit of the present invention;

[0038] Figure 15 It is a three-dimensional schematic diagram of the partial structure of the assembly unit of the present invention;

[0039] Figure 16 It is a three-dimensional schematic diagram of the partial structure of the assembly unit of the present invention;.

[0040] Description of reference numerals: soldering unit 10, testing unit 20, assembly unit 30, glue filling unit 40, solder transfer mechanism 50;

[0041] Feeding mechanism 1, feeding carrier 11, feeding transmission module 12, retrieving mechanism 2, transmission gantry 21, retrieving and transplanting module 22, retrieving and lifting module 23, grabbing module 24, grabbing cylinder 241, clamping claw 242, flipping module 25, soldering mechanism 3, soldering bracket 31, soldering tank 32, soldering mechanism 4, soldering base 41, solder tank 42, heating element 421, tin scraping module 43, tin scraping bracket 431, tin scraping lifting cylinder 432, tin scraping drive cylinder 433, tin scraping plate 434, tin slag tank 44, tin slag brushing mechanism 5, tin slag accommodating chamber 51, tin slag brush roller 52, tin slag drive motor 53;

[0042] Pressure test mechanism 6, pressure test material taking module 61, pressure material taking transmission module 611, pressure material taking lifting cylinder 612, pressure grabbing cylinder 613, pressure test module 62, pressure test bracket 621, pressure test tank 6211, pressure test lifting cylinder 622, pressure test probe 623, pressure clamping line drive cylinder 624, pressure clamping plate 625, pressure defective sorting module 63, test transfer mechanism 7, test transfer transmission module 71, test transfer material taking module 72, transfer transverse movement module 721, three sets of transfer grabbing cylinder 7 22. Interlayer testing mechanism 8, interlayer testing module 81, interlayer testing bracket 811, interlayer testing slot 8111, interlayer testing lifting cylinder 812, interlayer testing probe 813, interlayer clamping line drive cylinder 814, interlayer clamping plate 815, interlayer defective sorting module 82, integrated testing mechanism 9, integrated testing module 91, integrated testing bracket 911, integrated testing slot 9111, integrated testing lifting cylinder 912, integrated testing probe 913, integrated clamping line drive cylinder 914, integrated clamping plate 915, integrated defective sorting module 92;

[0043] Feeding mechanism 301, shell feeding mechanism 302, direct vibration feeding track 3021, shell feeding grabbing module 3022, coding positioning module 3023, shell positioning seat 3024, shell grabbing transmission module 3025, shell grabbing lifting module 3026, shell grabbing module 3027, pre-assembly mechanism 303, pre-assembly rotating module 3031, rotating base plate 3032, pre-assembly clamping module 3033, transfer mechanism 304, pressing mechanism 305, swinging plate mechanism 306, coding mechanism 307. DETAILED DESCRIPTION

[0044] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the accompanying drawings. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0045] It should be noted that when an element is referred to as being “fixed to” another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or there may be an intermediate element.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0047] like Figures 1 to 16 As shown, one embodiment of the present invention relates to an automatic soldering test assembly line for electronic components, comprising a soldering unit 10, a testing unit 20, an assembly unit 30, and a glue potting unit 40 connected in sequence. The soldering unit 10 is used to solder electronic components. A solder transfer mechanism 50 is provided between the soldering unit 10 and the testing unit 20 for transferring the soldered electronic components toward the testing unit 20. The testing unit 20 is used to perform functional testing on the soldered electronic components. The testing unit 20 delivers the tested, good electronic components to the assembly unit 30. The assembly unit 30 is used to assemble the electronic components into housings and place the assembled electronic components on a plate on the glue potting unit 40. The glue potting unit 40 is used to pot the housings of the electronic components. This embodiment implements a series of automation on the reactor, from soldering, testing, housing installation, plate placement, and finally glue potting, to achieve fully automated production, saving manpower and material resources, improving automation effects, and achieving high production efficiency. The system integrates four core process units: soldering, testing, assembly, and potting. It utilizes a serial assembly line layout and a multi-axis transfer mechanism to achieve seamless process integration. A dedicated transfer mechanism is installed between soldering unit 10 and testing unit 20 to effectively prevent solder joint damage caused by manual intervention. Testing unit 20 uses an automated sorting mechanism to accurately sort good products, ensuring a high pass rate for subsequent assembly steps.

[0048] See Figures 5 to 8As shown, the soldering unit 10 includes a loading mechanism 1, a picking mechanism 2, a fluxing mechanism 3 and a soldering mechanism 4. The loading mechanism 1 is provided with a loading carrier 11 for fixing electronic components and transferring them to a designated position. The picking mechanism 2 is used to grab electronic components on the loading carrier 11 and transfer them between the fluxing mechanism 3, the soldering mechanism 4 and the solder transfer mechanism 30. The fluxing mechanism 3 is used to replenish flux for parts of the electronic components that require solder. The soldering mechanism 4 is used to solder the electronic components. After soldering is completed, the picking mechanism 2 places the electronic components into the solder transfer mechanism 30 for transfer and collection. The solder transfer mechanism 30, the fluxing mechanism 3 and the soldering mechanism 4 are arranged in sequence along the first direction of the frame. The picking mechanism 2 places the grabbed electronic components into the solder transfer mechanism 30 after passing through the fluxing mechanism 3 and the soldering mechanism 4 in sequence. In this embodiment, the soldering unit 10 realizes the full automation of the reactor soldering operation through key technologies such as efficient loading, precise material removal, reliable soldering, stable soldering and automatic material collection, significantly improving production efficiency, welding quality and product reliability, and providing strong technical support and guarantee for the reactor manufacturing industry. Through a modular layout, the loading, soldering, soldering, and material collection processes are integrated into the same work unit, and a linear process flow design is adopted to effectively shorten the material transfer distance. The automated and continuous operation of the reactor soldering process is realized. The loading carrier 11 can accurately fix and transport the reactor, and the material collection mechanism 2 transfers it quickly and accurately between the various mechanisms, greatly reducing the time consumption of manual operation links. Compared with the traditional manual soldering method, the production efficiency can be significantly improved. Fluxing mechanism 3 evenly applies flux to the reactor's soldering areas, ensuring good wettability during the soldering process. Combined with the precise soldering operation of soldering mechanism 4, this ensures full, firm, and smooth solder joints, effectively preventing quality issues such as cold and leaky solder joints. This significantly improves the reactor's solder quality and ensures reliable electrical performance. The entire soldering process is highly automated, reducing reliance on manual labor. Only a small number of personnel are required for equipment monitoring and simple maintenance, significantly reducing labor costs and minimizing the risk of quality fluctuations due to factors such as operator fatigue.

[0049] The loading mechanism 1 includes a loading transmission module 12, on which the loading carrier 11 is arranged. The loading transmission module 12 is used to drive the loading carrier 11 to reciprocate between the loading station and the picking station. The picking mechanism 2 is used to grab the electronic components on the loading carrier 11 at the picking station; the loading carrier 11 is provided with multiple discharge troughs to place multiple electronic components at the same time. In this embodiment, the loading transmission module 12 drives the loading carrier 11 provided with multiple discharge troughs to reciprocate between a specific loading station and the picking station, thereby achieving an efficient and stable loading process. Multiple discharge troughs can simultaneously place multiple electronic components, greatly increasing the number of components that can be loaded at a time, effectively reducing the time consumed by frequent loading operations, and improving overall production efficiency. The picking mechanism 2 accurately grabs the electronic components on the loading carrier 11 at the picking station, and cooperates closely, further ensuring that the subsequent soldering process can be carried out in an orderly and uninterrupted manner. This makes the reactor soldering process smoother and helps improve the stability of soldering quality, reducing the chance of soldering defects caused by factors such as untimely loading or inaccurate material removal.

[0050] See Figures 7 and 8As shown, the material picking mechanism 2 includes a transmission gantry 21, a material picking and transferring module 22, a material picking and lifting module 23 and a grabbing module 24. The transmission gantry 21 is located on both sides of the soldering mechanism 3, the soldering mechanism 4 and the solder transfer mechanism 30. The material picking and transferring module 22 is arranged on the transmission gantry 21 and is used to drive the material picking and lifting module 23 and the grabbing module 24 to be transmitted between the feeding mechanism 1, the soldering mechanism 3, the soldering mechanism 4 and the solder transfer mechanism 30. The grabbing module 24 is arranged on the material picking and lifting module 23. The grabbing module 24 is arranged There are multiple groups, corresponding to the simultaneous grasping of multiple electronic components; the material picking and transferring module 22 is a transmission module that combines belt drive and guide rail drive, and the material picking and lifting module 23 is a transmission module that combines a lead screw and a guide rod; the grabbing module 24 includes a grabbing cylinder 241 and a clamping claw 242, and the grabbing cylinder 241 is used to drive the clamping claw 242 to grab the electronic components; in this embodiment, the design of the transmission gantry 21 and the material picking and transferring module 22 enables the material picking and lifting module 23 and the grabbing module 24 to accurately and efficiently transmit between different mechanisms. The material picking and transferring module 22 that combines belt drive and guide rail drive not only ensures the smoothness of the transmission, but also realizes fast and accurate position transfer, effectively reducing the shaking and deviation during the transmission process, ensuring that the electronic components required for the reactor can accurately reach each work station, such as soldering, soldering, etc., thereby improving overall production efficiency. The grabbing module 24 drives the clamping claw 242 to perform the grabbing action through the grabbing cylinder 241. Multiple groups of grabbing modules 24 can grab multiple electronic components at the same time. This is extremely beneficial for the situation where batch processing of electronic components is often required in the production of reactor solder. It greatly shortens the grabbing time and ensures the stability of the grabbing, avoiding the electronic components from falling or shifting during the transfer process.

[0051] A flip module 25 is provided on the material picking and lifting module 23, and the flip module 25 is used to drive the grabbing module 24 to flip. The grabbing module 24 and the flip module 25 are provided with a protective cover on the outside to cope with the high temperature of the soldering mechanism 4. In this embodiment, the soldering mechanism 4 will generate high temperature when working, and the protective cover effectively blocks the influence of this high temperature on the internal module and the grabbed electronic components. On the one hand, it avoids the problem of decreased accuracy of the grabbing module 24 caused by high temperature, ensures the accuracy of the position of the reactor component each time it is grabbed and placed, and guarantees the accuracy of the soldering point. On the other hand, it also prevents high temperature from damaging the mechanical structure and electrical components of the flip module 25, maintains its stable and reliable operating performance, thereby greatly reducing the defective rate of reactor soldering caused by equipment failure or precision inaccuracy, and improving the overall production efficiency and product quality.

[0052] The soldering mechanism 3 includes a soldering bracket 31 and a soldering tank 32 provided on the soldering bracket 31, wherein the soldering tank 32 is used to contain soldering flux so as to immerse the soldering position of the electronic component in the soldering flux; the soldering mechanism 4 includes a soldering base 41, a soldering tank 42, a tin scraping module 43 and a tin slag tank 44, wherein the soldering tank 42 is provided on the soldering base 41, and a plurality of heating elements 421 are provided in the soldering tank 42 for heating the tin material in the soldering tank 42, and the tin slag tank 44 is located on one side of the soldering tank 42. The scraper module 43 is used to scrape the tin slag in the solder bath 42 toward the slag bath 44. The scraper module 43 includes a scraper bracket 431, a scraper lifting cylinder 432, a scraper drive cylinder 433, and a scraper plate 434. The scraper bracket 431 is disposed on one side of the frame, the scraper lifting cylinder 432 is disposed on the scraper bracket 431, the scraper drive cylinder 433 is disposed on the scraper lifting cylinder 432, and the scraper plate 434 is disposed on the scraper drive cylinder 433 to achieve lifting and unidirectional reciprocating scraping. In this embodiment, the flux bracket 31 provides a stable support for the flux bath 32, ensuring that it maintains its accurate position during soldering operations. The flux contained in the flux bath 32 can effectively remove impurities such as oxides from the soldering area when the electronic components of the reactor are immersed in the flux, greatly improving the wettability and solderability of the solder. This allows the solder to adhere more evenly and firmly to the corresponding welding points of the reactor, ensuring the stability and reliability of the welding quality. The multiple heating elements 421521 set in the solder tank 4252 can accurately and efficiently heat the tin material, ensuring that the tin material is always at an appropriate welding temperature. This is crucial for the formation of high-quality solder joints required for reactor welding and can effectively avoid problems such as cold solder joints caused by uneven or insufficient temperature. The tin scraping module 4353, through the coordinated cooperation of the tin scraping bracket 431, the tin scraping lifting cylinder 432, the tin scraping drive cylinder 433 and the tin scraping plate 434, can timely and accurately scrape out the tin slag in the solder tank 42 and guide it to the tin slag tank 44. During the reactor soldering operation, the purity of the tin material in the solder tank 42 can be maintained at all times, so that the quality of the tin material used for each welding is uniform, thereby ensuring the consistency and stability of each solder joint, greatly improving the overall quality and production efficiency of the reactor soldering.

[0053] It also includes a tin slag brushing mechanism 5, which includes a tin slag holding chamber 51, a tin slag brush roller 52 and a tin slag driving motor 53. The tin slag driving motor 53 is used to drive the tin slag brush roller 52 to rotate in the tin slag holding chamber 51, and the material picking mechanism 2 is used to grab the electronic components after soldering onto the tin slag brush roller 52 to brush the tin slag, so as to remove the tin slag existing in the soldering part. In this embodiment, by providing a special tin slag holding chamber 51, the tin slag cleaned up during the tin slag brushing process can be effectively collected to prevent it from being scattered in the equipment or on the workbench, thereby maintaining a clean working environment and preventing the tin slag from interfering with or damaging other components. The tin slag brush roller 52 rotates stably in the tin slag holding chamber 51 under the drive of the tin slag driving motor 53, and cooperates with the material picking mechanism 2 to accurately grab the electronic components after soldering onto the tin brush roller for tin slag brushing operation, which can efficiently and accurately remove the tin slag existing in the soldering part of the reactor. It ensures the quality of the reactor's solder connection, improves the stability and reliability of the electrical connection, and reduces the potential electrical faults such as short circuits caused by residual tin slag.

[0054] The test unit 20 includes a withstand voltage test mechanism 6, a test transfer mechanism 7, an interlayer test mechanism 8, and a comprehensive test mechanism 9. The withstand voltage test mechanism 6 is used to grab the electronic components from the solder transfer mechanism 30 and position them to perform withstand voltage testing on the electronic components. After completion, they are transferred to the interlayer test mechanism and the comprehensive test mechanism 9 in sequence through the test transfer mechanism 7 for testing. This embodiment achieves efficient coordination between the soldering process and each test process by setting up an independent soldering unit 10 and a test unit 20, and connecting them with the solder transfer mechanism 30. It ensures that after soldering is completed, it can be quickly and accurately transported to the test link, avoiding the damage to components and low efficiency problems that may be caused by manual transportation. The withstand voltage test mechanism 6 can directly grab the inductor from the solder transfer mechanism 30 for positioning testing. Its precise grabbing and positioning capabilities can effectively ensure the accuracy of the test points, thereby obtaining reliable withstand voltage test results. This is crucial for evaluating the ability of the inductor to withstand voltage in actual operation, and helps to screen out products that do not meet the withstand voltage performance standards in advance. The test transfer mechanism 7 sequentially transfers the reactors to the interlayer testing mechanism 8 and the comprehensive testing mechanism 9. The interlayer testing meticulously examines the electrical performance of each layer within the reactor, while the comprehensive testing comprehensively assesses its overall performance. This step-by-step and comprehensive testing process significantly improves the accuracy and completeness of the reactor's solder quality and electrical performance testing, effectively ensuring the quality of the reactors leaving the factory, reducing the risk of subsequent failures due to welding or performance defects, and enhancing the reliability and stability of the entire production process.

[0055] See Figures 9 to 13As shown, the pressure test mechanism 6 includes a pressure test material collection module 61, a pressure test module 62 and a pressure defect sorting module 63, wherein the pressure test material collection module 61 is used to grab electronic components on the solder transfer mechanism 30 and transfer them to the pressure test module 62; the pressure test module 62 includes a pressure test bracket 621, a pressure test lifting cylinder 622 relatively arranged on both sides of the pressure test bracket 621, a pressure test probe 623, a pressure clamping line driving cylinder 624 and a pressure clamping plate 625, the pressure test lifting cylinder 622 is arranged on the pressure test bracket 621, the pressure test probe 623 is arranged at the driving end of the pressure test lifting cylinder 622, and the pressure test bracket 621 is located at the pressure test probe 623. A withstand voltage test slot 6211 is provided above the withstand voltage test slot 6211. The withstand voltage test material taking module 61 grabs the electronic components and places them on the withstand voltage test slot 6211. The withstand voltage test probe 623 is used to contact the solder part of the electronic components and conduct a conductive withstand voltage test. During the test, the withstand voltage clamping line driving cylinder 624 is used to drive the withstand voltage clamping plate 625 to clamp and fix the connecting wires of the electronic components to prevent the connecting wires from shaking. In this embodiment, the withstand voltage test material taking module 61 can accurately and efficiently grab the electronic components required for the inductor from the solder transfer mechanism 30 and accurately transfer them to the withstand voltage test module 62, ensuring the continuity and accuracy of the test process, greatly improving the overall efficiency of the test link, and reducing the errors and delays that may be caused by manual operation. The withstand voltage test module 62 can stably push the withstand voltage test probe 623 through the withstand voltage test lifting cylinder 622, so that it accurately contacts the solder part of the electronic component, realizes a reliable conductive withstand voltage test, and can effectively detect possible defects in the withstand voltage of the solder part. The upper pressure test slot 6211 provides a suitable placement for electronic components, further ensuring test stability. During testing, the pressure-resistant wire clamp drive cylinder 624 drives the pressure-resistant clamping plate 625 to clamp the electronic component's connecting wires, preventing the connecting wires from shaking. This avoids inaccurate test data and misjudgments caused by shaking, making the test results more reliable and accurate.

[0056] The pressure test material picking module 61 includes a pressure test material picking transmission module 611, a pressure test material picking lifting cylinder 612 and a pressure test grabbing cylinder 613. The pressure test material picking lifting cylinder 612 is arranged on the pressure test material picking transmission module 611, and the pressure test grabbing cylinder 613 is arranged on the pressure test material picking lifting cylinder 612 for grabbing electronic components. The pressure test defective sorting module 63 is a conveying module and is located on one side of the pressure test module 62. In this embodiment, the pressure test material picking module 61 realizes accurate and efficient material picking operation through its reasonable structural design. The pressure test material picking transmission module 611 provides a stable and reliable horizontal displacement transmission foundation for the overall material picking action, ensuring that the position of the electronic components to be grabbed can be accurately reached. The pressure test material picking lifting cylinder 612 can flexibly control the grabbing height and accurately locate the electronic components placed at different levels. It cooperates with the pressure test material picking transmission module 611 to realize accurate material picking action in three-dimensional space. The pressure-resistant gripping cylinder 613, with its stable gripping force, securely grasps the reactor's associated electronic components, preventing them from accidentally falling during subsequent testing and transport, thereby improving the consistency and accuracy of the entire testing process. The pressure-resistant defective sorting module 63, located alongside the pressure-resistant test module 62, acts as a conveyor module. After completing the pressure-resistant test, it quickly and orderly separates and transports electronic components with defective test results from the main testing process, preventing them from entering subsequent processes.

[0057] See Figure 11 As shown, the test transfer mechanism 7 includes a test transfer transmission module 71 and a test transfer material collection module 72. The test transfer transmission module 71 is used to receive electronic components tested by the withstand voltage test mechanism 6 and transfer the electronic components toward the interlayer test mechanism 8. The test transfer material collection module 72 includes a transfer transverse movement module 721 and three groups of transfer grabbing cylinders 722. The transfer transverse movement module 721 is used to drive the three groups of transfer grabbing cylinders 722 to alternately transmit between the test transfer transmission module 71, the interlayer test mechanism 8, and the comprehensive test mechanism 9. In this embodiment, the test transfer transmission module 71 can accurately and efficiently receive electronic components tested by the withstand voltage test mechanism 6, ensure the continuity of component flow, effectively avoid the mistakes and delays that may be caused by manual transportation, and provide a stable supply of components for subsequent testing links. The transfer and transverse movement module 721 within the test transfer and reclaiming module 72 drives three sets of transfer and gripping cylinders 722 to alternately transmit power between the test transfer transmission module 71, the interlayer testing mechanism 8, and the integrated testing mechanism 9, enabling rapid and accurate switching of electronic components between different testing stages. This significantly improves testing efficiency, reduces the overall testing cycle, and ensures that each electronic component completes all tests in an orderly manner according to the established process.

[0058] See Figure 12As shown, the interlayer testing mechanism 8 includes an interlayer testing module 81 and an interlayer defect sorting module 82. The interlayer testing module 81 includes an interlayer testing bracket 811, an interlayer testing lifting cylinder 812 relatively arranged on both sides of the interlayer testing bracket 811, an interlayer testing probe 813, an interlayer clamping line driving cylinder 814 and an interlayer clamping plate 815. The interlayer testing lifting cylinder 812 is arranged on the interlayer testing bracket 811, and the interlayer testing probe 813 is arranged at the driving end of the interlayer testing lifting cylinder 812. 11 is located above the interlayer test probe 813 and is provided with an interlayer test slot 8111. The test transfer mechanism 7 grabs and places the electronic components onto the interlayer test slot 8111. The interlayer test probe 813 is used to contact the solder portion of the electronic components and conduct the conductive interlayer test. During the test, the interlayer clamping drive cylinder 814 is used to drive the interlayer clamping plate 815 to clamp and fix the connecting wires of the electronic components to prevent the connecting wires from shaking. Specifically, the interlayer defective sorting module 82 is a conveying module and is located on one side of the interlayer test module 81. In this embodiment, the interlayer test module 81 accurately drives the interlayer test probe 813 through the interlayer test lifting cylinder 812, which can accurately contact the solder portion of the reactor electronic components, achieve stable and reliable conductive interlayer testing, and effectively ensure the accuracy of the test data. The interlayer test slot 8111 provided therein provides a suitable placement location for the electronic components, facilitating the standardized conduction of the test operation. The interlayer wire clamping drive cylinder 814 drives the interlayer clamping plate 815 to clamp and secure the electronic component wires, greatly reducing interference caused by wire shaking during testing, ensuring a stable testing environment, and further enhancing the credibility of the test results. The interlayer defective sorting module 82, located on one side, acts as a conveying module. After completing the interlayer testing, it can quickly and efficiently sort and transport detected defective reactor electronic components, achieving a seamless connection between the testing and sorting processes.

[0059] See Figure 13As shown, the comprehensive testing mechanism 9 includes a comprehensive testing module 91 and a comprehensive defect sorting module 92, the comprehensive testing module 91 includes a comprehensive testing bracket 911, a comprehensive testing lifting cylinder 912 relatively arranged on both sides of the comprehensive testing bracket 911, a comprehensive testing probe 913, a comprehensive clamping line driving cylinder 914 and a comprehensive clamping plate 915, the comprehensive testing lifting cylinder 912 is arranged on the comprehensive testing bracket 911, the comprehensive testing probe 913 is arranged at the driving end of the comprehensive testing lifting cylinder 912, the comprehensive testing bracket 9 11 is provided with a comprehensive test slot 9111 above the comprehensive test probe 913. The test transfer mechanism 7 grabs and places the electronic component on the comprehensive test slot 9111. The comprehensive test probe 913 is used to contact the solder part of the electronic component and conduct a comprehensive conductive test. During the test, the comprehensive clamping wire drive cylinder 914 is used to drive the comprehensive clamping plate 915 to clamp and fix the connecting wires of the electronic component to prevent the connecting wires from shaking. Specifically, the comprehensive defective sorting module 92 is a conveying module and is located on one side of the comprehensive test module 91. In this embodiment, the comprehensive test module 91 realizes an efficient and accurate testing process by rationally arranging various components. The comprehensive test lifting cylinder 912 can stably push the comprehensive test probe 913 to accurately contact the solder part of the reactor, ensuring the reliability of the comprehensive conductive test and providing a basis for accurately judging the quality of the solder. The setting of the comprehensive test slot 9111 cooperates with the test transfer mechanism 7 to enable the orderly grabbing and placement of electronic components, thereby improving the overall testing efficiency. The comprehensive defective sorting module 92 can timely and conveniently transport and divert the reactors that are judged to be defective after testing, thereby achieving rapid separation of defective products from qualified products.

[0060] See Figures 14 to 16As shown, the assembly unit 30 includes a feeding mechanism 301, a shell feeding mechanism 302, a coding mechanism 307, a pre-assembly mechanism 303, a transfer mechanism 304, a pressing mechanism 305 and a swing plate mechanism 306. The pre-assembly mechanism 303 includes a pre-assembly rotating module 3031, a rotating base plate 3032 and two groups of pre-assembly clamping modules 3033. The rotating base plate 3032 is arranged on the pre-assembly rotating module 3031. The two groups of pre-assembly clamping modules 3033 are relatively arranged on both sides of the rotating base plate 3032. The shell feeding mechanism 302 is used to feed the shell toward the pre-assembly clamping module 3033. The pre-assembly rotating module 3031 is used to drive the rotating base plate 3032 to drive the pre-assembly clamping module 3033 to rotate. The feeding mechanism 301 is used to load the electronic components from the test Unit 20 receives and transfers the assembled electronic components to the housing on pre-assembly clamping module 3033. The coding mechanism 307 is used to code and mark the housing on the housing feeding mechanism 302. The transfer mechanism 304 is used to sequentially transfer the assembled electronic components to the pre-assembly clamping module 3033, the pressing mechanism 305, and the swinging mechanism 306. The pressing mechanism 305 is used to press and secure the electronic components within the housing, and the swinging mechanism 306 is used to swing the housing with the electronic components. The glue potting unit 40 is used to pot the electronic components after swinging. In this embodiment, in the production of the reactor, the coordinated operation of the pre-assembly rotating module 3031, the rotating base plate 3032, and the two sets of pre-assembly clamping modules 3033 enables precise initial assembly of the electronic components and the housing. The housing feeding mechanism 302 provides stable material supply, and the feeding mechanism 301 accurately delivers the electronic components into the housing. This precise coordination greatly improves assembly accuracy and reduces assembly errors that may be caused by manual operation. Coding mechanism 307 codes and marks the housing, greatly facilitating quality control and subsequent traceability of the reactor. During the production process, each housing is uniquely identified, allowing for quick and accurate identification of the specific product during subsequent testing, use, and troubleshooting of potential quality issues. This enables precise quality control and accountability, ensuring the stability and reliability of the reactor's product quality.

[0061] The shell feeding mechanism 302 includes a direct vibration feeding track 3021, a shell feeding grabbing module 3022 and a coding positioning module 3023; the direct vibration feeding track 3021 is used for direct vibration feeding of the shell, and the shell feeding grabbing module 3022 is used to grab the shell from the shell direct vibration feeding track 3021 and move it in sequence to the coding positioning module 3023 and the pre-assembly clamping module 3033, and the coding mechanism 307 includes a laser coding machine for laser coding the shell on the coding positioning module 3023; in this embodiment, the direct vibration feeding track 3021 can ensure stable and orderly direct vibration feeding of the shell, ensure the continuity and accuracy of feeding, and effectively avoid production interruption caused by poor feeding. The housing feeding and grabbing module 3022 precisely grabs the housing and moves it to the coding and positioning module 3023 and pre-assembly clamping module 3033, greatly improving the accuracy and efficiency of material transfer and reducing errors that may be caused by manual operation. The laser coding machine is used to code the housing on the coding and positioning module 3023. This provides clear and long-lasting coding, accurately leaving high-quality identification information at the designated location on the housing. The high coding speed meets the needs of efficient production and also facilitates the subsequent traceability and management of electronic component housings.

[0062] A housing positioning seat 3024 is provided at the front end of the direct vibration feeding track 3021 for positioning the housing at the front end. The housing feeding and grabbing module 3022 includes a housing grabbing and transmission module 3025, a housing grabbing and lifting module 3026, and a housing grabbing module 3027. Two housing grabbing modules 3027 are provided and are mounted on the housing grabbing and lifting module 3026. The housing grabbing and lifting module 3026 is mounted on the housing grabbing and transmission module 3025. The housing grabbing modules 3027 are used to grab housings from the housing positioning seat 3024 and alternately place them on the coding and positioning module 3023 and the pre-assembly clamping module 3033. In this embodiment, the housing grabbing and transmission module 3025, the housing grabbing and lifting module 3026, and the two housing grabbing modules 3027 included in the housing feeding and grabbing module 3022 work in coordination, making the grabbing action efficient and stable. The housing grabbing and lifting module 3026 can flexibly adjust the grabbing height to suit different situations, while the two housing grabbing modules 3027 mounted above it can operate alternately. In practical applications, this ensures that housings are accurately grabbed from the housing positioning seat 3024 and sequentially and sequentially placed on the coding positioning module 3023 and the pre-assembly clamping module 3033.

[0063] The above embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An automatic soldering test assembly line for electronic components, characterized by: It includes a soldering unit, a testing unit, an assembly unit and a glue pouring unit connected in sequence. The soldering unit is used to solder electronic components. A solder transfer mechanism is provided between the soldering unit and the testing unit to transfer the electronic components after soldering toward the testing unit. The testing unit is used to perform functional testing on the electronic components after soldering. The testing unit delivers the tested good electronic components to the assembly unit. The assembly unit is used to assemble the electronic components into a shell and place the assembled electronic components in the shell on the glue pouring unit. The glue pouring unit is used to pour glue into the shell of the electronic component.

2. The electronic component automatic soldering test assembly line according to claim 1, characterized in that: The soldering unit includes a loading mechanism, a solder picking mechanism, a fluxing mechanism and a soldering mechanism. The loading mechanism is provided with a loading carrier for fixing electronic components and transferring them to a designated position. The solder picking mechanism is used to grab electronic components on the loading carrier and transfer them between the fluxing mechanism, the soldering mechanism and the soldering transfer mechanism. The fluxing mechanism is used to replenish flux to the parts of the electronic components that require solder. The soldering mechanism is used to solder the electronic components. After soldering is completed, the solder picking mechanism places the electronic components on the solder transfer mechanism for transfer and collection. The solder transfer mechanism, the fluxing mechanism and the soldering mechanism are arranged in sequence along the first direction of the rack. The solder picking mechanism places the grabbed electronic components into the solder transfer mechanism after passing them through the fluxing mechanism and the soldering mechanism.

3. The electronic component automatic soldering test assembly line according to claim 2, characterized in that: The loading mechanism includes a loading transmission module, the loading carrier is arranged on the loading transmission module, the loading transmission module is used to drive the loading carrier to reciprocate between the loading station and the picking station, and the solder picking mechanism is used to grab the electronic components on the loading carrier at the picking station; the loading carrier is provided with multiple discharge troughs to place multiple electronic components at the same time.

4. The electronic component automatic soldering test assembly line according to claim 2, characterized in that: The solder picking mechanism includes a transmission gantry, a material picking and transferring module, a material picking and lifting module and a grabbing module. The transmission gantry is located on both sides of the fluxing mechanism, the soldering mechanism and the solder transfer mechanism. The material picking and transferring module is arranged on the transmission gantry and is used to drive the material picking and lifting module and the grabbing module to transmit between the feeding mechanism, the fluxing mechanism, the soldering mechanism and the solder transfer mechanism. The grabbing module is arranged on the material picking and lifting module. There are multiple groups of grabbing modules, corresponding to grabbing multiple electronic components at the same time; the material picking and transferring module is a combined transmission module of belt drive and guide rail drive, and the material picking and lifting module is a transmission module combined with a lead screw and a guide rod; the grabbing module includes a grabbing cylinder and a clamping claw, and the clamping cylinder is used to drive the clamping claw to grab the electronic components; a flipping module is provided on the material picking and lifting module, and the flipping module is used to drive the grabbing module to flip. A protective cover is provided on the outside of the grabbing module and the flipping module to cope with the high temperature of the soldering mechanism.

5. The electronic component automatic soldering test assembly line according to claim 2, characterized in that: The soldering mechanism includes a soldering bracket and a soldering tank arranged on the soldering bracket, the soldering tank is used to contain flux so as to immerse the soldering position of the electronic component in the flux; the soldering mechanism includes a solder base, a solder tank, a tin scraping module and a tin slag tank, the solder tank is arranged on the solder base, a plurality of heating elements are arranged in the solder tank for heating the tin material in the solder tank, the tin slag tank is located on one side of the solder tank, and the tin scraping module is used to scrape the tin slag in the solder tank toward the tin slag tank; the tin scraping module includes a tin scraping bracket, a tin scraping lifting cylinder, a tin scraping driving cylinder and a tin scraping plate, the tin scraping bracket is arranged on one side of the frame, the tin scraping lifting cylinder is arranged on the tin scraping bracket, the tin scraping driving cylinder is arranged on the tin scraping lifting cylinder, and the tin scraping plate is arranged on the tin scraping driving cylinder to realize lifting and unidirectional reciprocating transmission of tin scraping.

6. The electronic component automatic soldering test assembly line according to any one of claims 2 to 5, characterized in that: It also includes a tin slag brushing mechanism, which includes a tin slag holding chamber, a tin slag brush roller and a tin slag driving motor. The tin slag driving motor is used to drive the tin slag brush roller to rotate in the tin slag holding chamber. The solder material picking mechanism is used to grab the electronic components after soldering and put them onto the tin slag brush roller to brush the tin slag to remove the tin slag in the solder part.

7. The electronic component automatic soldering test assembly line according to claim 1, characterized in that: The testing unit includes a withstand voltage testing mechanism, a test transfer mechanism, an interlayer testing mechanism and a comprehensive testing mechanism. The withstand voltage testing mechanism is used to grab the electronic components from the solder transfer mechanism and position them to perform a withstand voltage test on the electronic components. After completion, the electronic components are transferred to the interlayer testing mechanism and the comprehensive testing mechanism in sequence through the test transfer mechanism for testing.

8. The electronic component automatic soldering test assembly line according to claim 7, characterized in that: The pressure test mechanism includes a pressure test material picking module, a pressure test module and a pressure defect sorting module, the pressure test material picking module is used to grab electronic components on the solder transfer mechanism and transfer them to the pressure test module; the pressure test module includes a pressure test bracket, a pressure test lifting cylinder relatively arranged on both sides of the pressure test bracket, a pressure test probe, a pressure clamping line driving cylinder and a pressure clamping plate, the pressure test lifting cylinder is arranged on the pressure test bracket, the pressure test probe is arranged at the driving end of the pressure test lifting cylinder, the pressure test bracket is provided with a pressure test slot above the pressure test probe, the pressure test material picking module grabs the electronic components and places them on the pressure test slot, the pressure test probe is used to contact the solder part of the electronic components and conduct a conductive pressure test; during the test, the pressure clamping line driving cylinder is used to drive the pressure clamping plate to clamp and fix the connecting wires of the electronic components to prevent the connecting wires from shaking; The pressure-resistant test material picking module includes a pressure-resistant material picking transmission module, a pressure-resistant material picking lifting cylinder and a pressure-resistant grabbing cylinder. The pressure-resistant material picking lifting cylinder is arranged on the pressure-resistant material picking transmission module, and the pressure-resistant grabbing cylinder is arranged on the pressure-resistant material picking lifting cylinder for grabbing electronic components; the pressure-resistant defective sorting module is a conveying module and is located on one side of the pressure-resistant test module.

9. The electronic component automatic soldering test assembly line according to claim 7, characterized in that: The test transfer mechanism includes a test transfer transmission module and a test transfer material taking module. The test transfer transmission module is used to receive the electronic components tested by the withstand voltage test mechanism and transfer the electronic components to the interlayer test mechanism. The test transfer and material collection module includes a transfer transverse movement module and three groups of transfer grabbing cylinders. The transfer transverse movement module is used to drive the three groups of transfer grabbing cylinders to alternately transmit between the test transfer transmission module, the inter-layer test mechanism and the comprehensive test mechanism. The interlayer testing mechanism includes an interlayer testing module and an interlayer defective sorting module, the interlayer testing module includes an interlayer testing bracket, an interlayer testing lifting cylinder relatively arranged on both sides of the interlayer testing bracket, an interlayer testing probe, an interlayer clamping line driving cylinder and an interlayer clamping plate, the interlayer testing lifting cylinder is arranged on the interlayer testing bracket, the interlayer testing probe is arranged on the driving end of the interlayer testing lifting cylinder, the interlayer testing bracket is provided with an interlayer testing slot above the interlayer testing probe, the test transfer mechanism grabs the electronic component and places it on the interlayer testing slot, the interlayer testing probe is used to contact the solder part of the electronic component and conduct the interlayer test; during the test process, the interlayer clamping line driving cylinder is used to drive the interlayer clamping plate to clamp and fix the connecting wires of the electronic component to prevent the connecting wires from shaking; The inter-layer defective sorting module is a conveying module and is located on one side of the inter-layer testing module; The comprehensive testing mechanism includes a comprehensive testing module and a comprehensive defective sorting module. The comprehensive testing module includes a comprehensive testing bracket, a comprehensive testing lifting cylinder relatively arranged on both sides of the comprehensive testing bracket, a comprehensive testing probe, a comprehensive clamping wire driving cylinder and a comprehensive clamping plate. The comprehensive testing lifting cylinder is arranged on the comprehensive testing bracket, the comprehensive testing probe is arranged on the driving end of the comprehensive testing lifting cylinder, the comprehensive testing bracket is provided with a comprehensive testing slot above the comprehensive testing probe, the test transfer mechanism grabs the electronic component and places it on the comprehensive testing slot, the comprehensive testing probe is used to contact the solder part of the electronic component and conduct a comprehensive conductive test; during the test process, the comprehensive clamping wire driving cylinder is used to drive the comprehensive clamping plate to clamp and fix the connecting wires of the electronic component to prevent the connecting wires from shaking; The comprehensive defective sorting module is a conveying module and is located on one side of the comprehensive testing module.

10. The electronic component automatic soldering test assembly line according to claim 1, characterized in that: The assembly unit includes a feeding mechanism, a shell feeding mechanism, a coding mechanism, a pre-assembly mechanism, a transfer mechanism, a pressing mechanism and a swing plate mechanism, the pre-assembly mechanism includes a pre-assembly rotating module, a rotating base plate and two groups of pre-assembly clamping modules, the rotating base plate is arranged on the pre-assembly rotating module, and the two groups of pre-assembly clamping modules are relatively arranged on both sides of the rotating base plate, the shell feeding mechanism is used to feed the shell toward the pre-assembly clamping module, the pre-assembly rotating module is used to drive the rotating base plate to drive the pre-assembly clamping module to rotate, the feeding mechanism is used to receive and transfer the electronic components from the test unit to the shell on the pre-assembly clamping module; the coding mechanism is used to code and mark the shell of the shell feeding mechanism; the transfer mechanism is used to grab the shell after assembling the electronic components and transfer it to the pre-assembly clamping module, the pressing mechanism and the swing plate mechanism in sequence, the pressing mechanism is used to press and fix the electronic components in the shell, and the swing plate mechanism is used to swing the shell with the electronic components; the glue filling unit is used to glue the electronic components after swinging; The shell feeding mechanism includes a direct vibration feeding track, a shell feeding grabbing module and a coding positioning module; the direct vibration feeding track is used for direct vibration feeding of the shell, the shell feeding grabbing module is used to grab the shell from the shell direct vibration feeding track and move it to the coding positioning module and the pre-assembly clamping module in sequence, and the coding mechanism includes a laser coding machine for laser coding the shell on the coding positioning module; The front end of the straight vibration feeding track is provided with a shell positioning seat for positioning the shell at the front end. The shell feeding grabbing module includes a shell grabbing transmission module, a shell grabbing lifting module and a shell grabbing module. The shell grabbing module is provided with two groups and is arranged on the shell grabbing lifting module. The shell grabbing lifting module is arranged on the shell grabbing transmission module. The shell grabbing module is used to grab the shell from the shell positioning seat and place it alternately on the coding positioning module and the pre-assembly clamping module.

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