Temporary bonding glue as well as preparation method and application thereof

Abstract

The invention provides temporary bonding glue as well as a preparation method and application thereof. The temporary bonding glue comprises the following components: matrix resin, an antioxidant and an organic solvent; the mass ratio of the matrix resin to the antioxidant is (14-20): 1. By designing the specific composition of the temporary bonding adhesive, the temporary bonding adhesive with excellent performance is prepared, and the temporary bonding adhesive has the characteristics of variable-temperature controllable bonding force, chemical liquid corrosion resistance, no cleaning of a tearable film and the like, and can be widely applied to the processes of thin wafer back processing, deep silicon etching, TSV through hole and the like.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer processing materials, and specifically relates to a temporary bonding adhesive and a preparation method and application thereof, and more specifically relates to a temporary bonding adhesive with a tearable film and a preparation method and application thereof. Background Art

[0002] Semiconductor manufacturing is currently trending toward larger sizes, multi-chip stacking, and ultra-thin manufacturing. The quality of wafer surface processing, particularly wafer grinding technology, is crucial to the success of related semiconductor device processes. Sapphire substrates are commonly used in bonding processes, but their high hardness and brittleness make surface processing extremely difficult. Currently, wafer processing requires a series of steps including cutting, grinding, chemical-mechanical polishing, etching, and inspection to ultimately produce qualified substrate wafers.

[0003] Before wafer grinding and chemical mechanical polishing operations, a temporary bonding adhesive is required as an adhesive layer to fix the wafer and substrate together to ensure the flatness of the wafer during processing. However, conventional temporary bonding adhesives currently on the market lack universality in terms of adhesion to the wafer, resulting in adhesion that is too weak or too strong, causing problems such as falling off during grinding or chemical mechanical polishing processes or difficulty in cleaning during the cleaning process. In addition, the cleaning process requires cleaning equipment and the use of large amounts of organic reagents. If the temporary bonding adhesive can be removed by tearing off the film without cleaning, it can save the purchase of cleaning equipment and a large amount of organic reagents, which will have a positive effect on environmental protection and sustainable development.

[0004] Therefore, in order to solve the above problems, it is urgent to develop a temporary bonding adhesive that can be torn off, does not fall off during the wafer grinding and polishing process, and does not require cleaning. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a temporary bonding adhesive and its preparation method and application, and more specifically to a temporary bonding adhesive with a tearable film and its preparation method and application. The present invention designs the specific composition of the temporary bonding adhesive to prepare a temporary bonding adhesive with a tearable film, which does not fall off during the wafer grinding and polishing process and does not require cleaning. The temporary bonding adhesive has the characteristics of temperature-controlled adhesion, resistance to chemical liquid corrosion, and tearable film that does not require cleaning. It can be widely used in processes such as thin wafer backside processing, deep silicon etching, and TSV through-holes.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] In a first aspect, the present invention provides a temporary bonding adhesive, wherein the temporary bonding adhesive comprises the following components:

[0008] Main resin, antioxidant and organic solvent;

[0009] The mass ratio of the main resin to the antioxidant is (14-20):1, for example, it can be 14:1, 14.5:1, 15:1, 15.5:1, 16:1, 16.5:1, 17:1, 17.5:1, 18:1, 18.5:1, 19:1, 19.5:1 or 20:1, etc.

[0010] The present invention designs the specific composition of the temporary bonding adhesive to prepare a temporary bonding adhesive that can be torn off, does not fall off during the wafer grinding and polishing process, and does not require cleaning. The temporary bonding adhesive has the properties of temperature-controlled adhesion, resistance to chemical liquid erosion, and tearable film that does not require cleaning. The adhesion of the temporary bonding adhesive film layer prepared by the temporary bonding adhesive increases with the increase of the baking temperature (working temperature), presenting a gradient change, and will not undergo sudden changes. As the baking temperature changes, the adhesion strength fluctuates less, avoiding the problem that the temporary bonding adhesive changes too much or the adhesion strength remains basically unchanged due to fine-tuning of the working temperature, which ultimately leads to the temporary bonding adhesive being unusable.

[0011] In the present invention, by controlling the mass ratio of the main resin to the antioxidant within a specific range, some antioxidants readily migrate to the interface, forming a weak boundary layer that hinders direct contact between the adhesive film and the substrate. The migrated antioxidants reduce polar interactions, and the baking temperature and baking time determine the amount of antioxidant migration and consumption. This results in a temporary bonding adhesive with temperature-controlled, controllable bonding strength. Excessively high or low mass ratios of the main resin to the antioxidant can lead to sudden changes in the viscosity of the temporary bonding adhesive or problems with constant bonding strength.

[0012] The antioxidant is continuously consumed at different baking temperatures and baking times, and the film may undergo oxidative degradation, resulting in cracks or chemical bond breakage at the interface and a decrease in adhesion.

[0013] Since the temporary bonding glue provided by the present invention has different working temperatures and different bonding strengths, it should be noted that the temporary bonding glue provided by the present invention is free of cleaning, which means that when the bonding strength of the temporary bonding glue is relatively small, the film can be directly torn off without the need for solvent cleaning. If the bonding strength of the temporary bonding glue is relatively large at a specific working temperature, an organic solvent can be used for cleaning, and the temporary bonding glue provided by the present invention is easy to clean without any residual glue.

[0014] The following are preferred technical solutions of the present invention, but are not intended to limit the technical solutions provided by the present invention. Through the following preferred technical solutions, the objectives and beneficial effects of the present invention can be better achieved and realized.

[0015] As a preferred technical solution of the present invention, the 5% thermal weight loss temperature of the main resin is ≥400°C, for example, it can be 400°C, 410°C, 420°C, 430°C, 450°C, 460°C, 480°C, 500°C, 520°C, 550°C or 580°C, etc.

[0016] In this invention, a high-performance temporary bonding adhesive is prepared by selecting a primary resin with a 5% thermal weight loss temperature of 400°C or higher and combining it with an antioxidant. If the primary resin has a 5% thermal weight loss temperature of less than 400°C, the adhesive maintains strong adhesion even at typical baking temperatures, and the adhesion between the film and the substrate is no longer controllable.

[0017] It should be noted that, in the present invention, the "5% thermal weight loss temperature" refers to the temperature at which the mass loss of a material during heating reaches 5%.

[0018] Preferably, the main resin is selected from any one of polystyrene resin, ABS resin, cycloolefin copolymer, and cycloolefin homopolymer, or a combination of at least two thereof.

[0019] Preferably, the main resin is selected from cycloolefin copolymers and / or cycloolefin homopolymers.

[0020] Preferably, the weight average molecular weight of the main resin is 50,000-300,000 (for example, 50,000, 80,000, 100,000, 120,000, 150,000, 180,000, 200,000, 230,000, 250,000, 270,000 or 300,000, etc.), more preferably 80,000-200,000.

[0021] Preferably, taking the mass percentage of the temporary bonding glue as 100%, the mass percentage of the main resin is 20-35%, for example, it can be 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 30%, 31%, 32%, 33%, 34% or 35%, etc.

[0022] As a preferred technical solution of the present invention, the antioxidant includes any one of hindered phenol antioxidants, phosphite antioxidants, and thioether antioxidants, or a combination of at least two of them.

[0023] Preferably, the hindered phenol antioxidant includes antioxidant 1010 or antioxidant 1076.

[0024] Preferably, the phosphite antioxidant includes antioxidant 168.

[0025] Preferably, the thioether antioxidant includes antioxidant PS800.

[0026] As a preferred technical solution of the present invention, the antioxidant is selected from a combination of hindered phenol antioxidants and phosphite antioxidants, or the antioxidant is selected from a combination of hindered phenol antioxidants and thioether antioxidants.

[0027] As a preferred technical solution of the present invention, the organic solvent is selected from any one of benzyl alcohol, benzyl acetate, n-butyl acetate, ethylene glycol butyl ether acetate, propylene glycol monomethyl ether acetate, limonene, p-menthane, dodecane, and decalin, or a combination of at least two thereof.

[0028] Preferably, based on the mass percentage of the temporary bonding glue being 100%, the mass percentage of the organic solvent is 60-80%, for example, it can be 60%, 62%, 64%, 66%, 68%, 70%, 72%, 74%, 76%, 78% or 80%, etc.

[0029] As a preferred technical solution of the present invention, the temporary bonding adhesive also includes a leveling agent.

[0030] Preferably, the leveling agent is a silicone leveling agent.

[0031] Preferably, based on the mass percentage of the temporary bonding adhesive being 100%, the mass percentage of the leveling agent is 0.01-0.50%.

[0032] In a second aspect, the present invention provides a method for preparing the temporary bonding adhesive as described in the first aspect, the preparation method comprising the following steps:

[0033] All components of the temporary bonding adhesive are mixed to obtain the temporary bonding adhesive.

[0034] As a preferred technical solution of the present invention, the preparation method comprises the following steps:

[0035] (1) mixing an antioxidant, an optional leveling agent, and an organic solvent, and cooling to obtain a mixture;

[0036] (2) Mixing the mixture obtained in step (1) with the main resin to obtain the temporary bonding adhesive.

[0037] As a preferred technical solution of the present invention, the cooling temperature in step (1) is 30-35°C, for example, it can be 30°C, 31°C, 32°C, 33°C, 34°C or 35°C.

[0038] Preferably, the cooling method includes cooling using a cooling water circulation system.

[0039] Preferably, the mixing method in step (1) includes stirring, and the stirring speed is 500-800 rpm (for example, it can be 500 rpm, 520 rpm, 550 rpm, 570 rpm, 600 rpm, 630 rpm, 660 rpm, 680 rpm, 700 rpm, 720 rpm, 750 rpm, 80 rpm or 800 rpm, etc.), and the stirring time is 20-25 h (for example, it can be 20 h, 20.5 h, 21 h, 21.5 h, 22 h, 22.5 h, 23 h, 23.5 h, 24 h, 24.5 h or 25 h, etc.).

[0040] Preferably, the mixing method in step (2) includes stirring, and the stirring speed is 500-800 rpm (for example, it can be 500 rpm, 520 rpm, 550 rpm, 570 rpm, 600 rpm, 630 rpm, 660 rpm, 680 rpm, 700 rpm, 720 rpm, 750 rpm, 80 rpm or 800 rpm, etc.), and the stirring time is 20-25 h (for example, it can be 20 h, 21 h, 22 h, 23 h, 24 h or 25 h, etc.).

[0041] Preferably, step (2) further includes a post-processing step after the mixing, and the post-processing method includes filtration.

[0042] Preferably, the filter element used for the filtration may have a precision grade of 10 μm.

[0043] In a third aspect, the present invention provides a use of the temporary bonding adhesive as described in the first aspect, wherein the temporary bonding adhesive is used in a wafer processing process.

[0044] Compared with the prior art, the present invention has the following beneficial effects:

[0045] The present invention designs the specific composition of the temporary bonding adhesive to prepare a temporary bonding adhesive with a tearable film, which does not fall off during the wafer grinding and polishing process and does not require cleaning. The temporary bonding adhesive has the characteristics of temperature-controlled adhesion, resistance to chemical liquid corrosion, and tearable film that does not require cleaning. It can be widely used in thin wafer backside processing, deep silicon etching, TSV through-hole and other processes. DETAILED DESCRIPTION

[0046] For the convenience of understanding the present invention, the present invention is given below with examples. It should be understood by those skilled in the art that the examples are only for the purpose of helping to understand the present invention and should not be regarded as specific limitations of the present invention.

[0047] The sources of some components in the Examples and Comparative Examples are as follows:

[0048] Cyclic olefin copolymer: weight average molecular weight 106253, 5% thermal weight loss temperature 447°C, purchased from TOPAS Advanced Polymers, brand TOPAS 8007;

[0049] Cyclic olefin homopolymer: weight-average molecular weight 100975, 5% thermal weight loss temperature 440°C, purchased from Mitsui Chemicals, Japan, brand APL 6509T;

[0050] Polystyrene resin: weight-average molecular weight 214857, 5% thermal weight loss temperature 401°C, purchased from BASF, brand Styrolux 684D;

[0051] Antioxidant 1010: purchased from BASF, brand name Irganox 1010;

[0052] Antioxidant 1076: purchased from BASF, brand name Irganox 1076;

[0053] Antioxidant 168: purchased from BASF, brand name Irgafos 168;

[0054] Antioxidant PS800: purchased from BASF, brand name Irganox PS800;

[0055] Leveling agent BYK333: purchased from BYK, Germany, brand BYK333;

[0056] Leveling agent BYK330: purchased from BYK, Germany, brand BYK330;

[0057] Leveling agent BYK323: purchased from BYK, Germany, brand BYK323.

[0058] Example 1

[0059] This embodiment provides a temporary bonding adhesive and a preparation method thereof, wherein the temporary bonding adhesive includes the following components:

[0060]

[0061] The preparation method of the temporary bonding adhesive is as follows:

[0062] (1) stirring and mixing an antioxidant, a leveling agent, and an organic solvent at a rotation speed of 600 rpm for 22 hours while cooling with a cooling water circulation system to maintain a temperature of 32° C. to obtain a mixture;

[0063] (2) The mixture obtained in step (1) and the main resin were stirred and mixed at a rotation speed of 600 rpm until clarified, and the material was discharged and filtered using a filter element with an accuracy grade of 10 μm to obtain the temporary bonding adhesive.

[0064] Example 2

[0065] This embodiment provides a temporary bonding adhesive and a preparation method thereof, wherein the temporary bonding adhesive includes the following components:

[0066]

[0067] The preparation method of the temporary bonding adhesive is the same as that in Example 1.

[0068] Example 3

[0069] This embodiment provides a temporary bonding adhesive and a preparation method thereof, wherein the temporary bonding adhesive includes the following components:

[0070]

[0071] The preparation method of the temporary bonding adhesive is the same as that in Example 1.

[0072] Example 4

[0073] This embodiment provides a temporary bonding adhesive and a preparation method thereof, wherein the temporary bonding adhesive includes the following components:

[0074]

[0075] The preparation method of the temporary bonding adhesive is the same as that in Example 1.

[0076] Example 5

[0077] This embodiment provides a temporary bonding adhesive and a preparation method thereof, wherein the temporary bonding adhesive includes the following components:

[0078]

[0079] The preparation method of the temporary bonding adhesive is the same as that in Example 1.

[0080] Example 6

[0081] This embodiment provides a temporary bonding adhesive and a preparation method thereof, wherein the temporary bonding adhesive includes the following components:

[0082]

[0083] The preparation method of the temporary bonding adhesive is the same as that in Example 1.

[0084] Example 7

[0085] This embodiment provides a temporary bonding adhesive and a preparation method thereof, wherein the temporary bonding adhesive includes the following components:

[0086]

[0087] The preparation method of the temporary bonding adhesive is the same as that in Example 1.

[0088] Example 8

[0089] This embodiment provides a temporary bonding adhesive and a preparation method thereof, wherein the temporary bonding adhesive includes the following components:

[0090]

[0091]

[0092] The preparation method of the temporary bonding adhesive is the same as that in Example 1.

[0093] Comparative Example 1

[0094] This comparative example provides a temporary bonding adhesive and a preparation method thereof, wherein the temporary bonding adhesive comprises the following components:

[0095]

[0096] The preparation method of the temporary bonding adhesive is the same as that in Example 1.

[0097] Comparative Example 2

[0098] This comparative example provides a temporary bonding adhesive and a preparation method thereof, wherein the temporary bonding adhesive comprises the following components:

[0099]

[0100] The preparation method of the temporary bonding adhesive is the same as that in Example 1.

[0101] Comparative Example 3

[0102] This comparative example provides a temporary bonding adhesive and a preparation method thereof, wherein the temporary bonding adhesive comprises the following components:

[0103]

[0104] The preparation method of the temporary bonding adhesive is the same as that in Example 1.

[0105] The performance of the temporary bonding adhesives provided in the above embodiments and comparative examples was tested, and the specific testing method is as follows:

[0106] (1) Viscosity at room temperature / (Pa·s): The viscosity at room temperature of the temporary bonding adhesives provided in the above embodiments and comparative examples was tested using a Boleifei lamella viscometer, wherein the rotor was CP-51, the temperature was 25°C, and the rotation speed was 0.3 rpm.

[0107] (2) Film surface TTV / (μm): Temporary bonding adhesive was coated on the silicon wafer substrate, cured at 90°C for 5 minutes, and then cured at 240°C for 10 minutes to form a temporary bonding adhesive film layer with a thickness of 30 μm on one side of the silicon wafer substrate. The film surface TTV test of the bonded silicon wafer substrate and temporary bonding adhesive film layer was performed using an F50 optical film thickness meter with an 8-inch 49-point method.

[0108] (3) Rheological viscosity (200°C) / (Pa·s): The rheological viscosity of the formed temporary bonding film was tested using an Anton Paar rheometer in oscillatory shear mode.

[0109] (4) Adhesion strength / (N): A temporary bonding adhesive was coated on a silicon wafer substrate and baked at different temperatures for different times to obtain a temporary bonding adhesive film layer with a thickness of 30 μm (specific baking temperatures and times are detailed in Tables 1 and 2 below). A micro-peeling machine was used to perform 180° peeling.

[0110] The following test is performed on a bonding pair, wherein the bonding pair is composed of a silicon wafer substrate, a temporary bonding film layer, and a glass sheet stacked in sequence, wherein the temporary bonding film layer is prepared using the temporary bonding adhesive provided in the above-mentioned embodiment or comparative example;

[0111] The preparation method of the bonding pair is as follows: a temporary bonding glue is coated on a silicon wafer substrate, and after curing at 90°C for 5 minutes and then at 240°C for 10 minutes, a glass sheet is placed on the surface and heated and pressed (200°C, 1.25KN, 10 minutes) to obtain the bonding pair.

[0112] (5) Appearance of bonding pair: Observe visually and under a microscope to see whether the bonding pair is uniform and whether there are bubbles between the temporary bonding film layer and the silicon wafer substrate or glass sheet.

[0113] (6) Bond pair warpage / (μm): tested using a thin film stress meter.

[0114] (7) Chemical resistance test of bond pairs: Immerse the bond pairs in a chemical solution (30% ammonium hydroxide by mass concentration) at 60°C for 1 hour, then take them out, rinse them with clean water, dry them, and observe the depth of edge corrosion under a microscope. Randomly select 5 edge positions for testing, and take the average of the 5 test results as the final result;

[0115] (8) Cleaning with para-menthane: After removing the glass sheet on one side of the bonding pair, place the bonded silicon wafer substrate and temporary bonding film layer in a para-menthane immersion tank and soak them at 25°C for 60 minutes for cleaning. Observe the cleaning status of the temporary bonding film layer on the surface of the silicon wafer substrate. If there is no temporary bonding film residue on the surface of the silicon wafer substrate, the evaluation is "○"; if there is temporary bonding film residue on the surface of the silicon wafer substrate, the evaluation is "×".

[0116] The above performance test results are shown in Table 1 and Table 2 below:

[0117] Table 1

[0118]

[0119]

[0120] Table 2

[0121]

[0122] From the above content, it can be seen that the present invention designs the specific composition of the temporary bonding glue to prepare a temporary bonding glue with a tearable film, which does not fall off during the wafer grinding and polishing process and does not require cleaning. The temporary bonding glue has the characteristics of temperature-controlled adhesion, resistance to chemical liquid corrosion, and tearable film that does not require cleaning. It can be widely used in thin wafer back processing, deep silicon etching, TSV through-hole and other processes. The room temperature viscosity of the temporary bonding adhesive is 10.1-10.8 Pa·s, the membrane surface TTV ≤ 1.74 μm, specifically 0.75-1.74 μm, and the rheological viscosity at 200°C is 1840-2467 Pa·s; the bonding strength of the temporary bonding adhesive film layer prepared by the temporary bonding adhesive increases successively with the increase of the baking temperature, presenting a gradient change, and no sudden change occurs; the bonding pair prepared by the temporary bonding adhesive has a uniform appearance and no bubbles, the bonding pair warping ≤ 0.3544 μm, specifically 0.2204-0.3544 μm, and after the bonding pair chemical resistance test, the edge corrosion depth is ≤ 15 μm, specifically 3-15 μm, and the temporary bonding adhesive film layer on the substrate surface can be cleaned and removed using conventional solvents, which is simple and convenient.

[0123] From the comparison between Example 1 and Examples 2-7, it can be seen that the present invention preferably uses cycloolefin copolymers and / or cycloolefin homopolymers as the main resin, which can further improve the comprehensive performance of the temporary bonding adhesive; from the comparison between Example 8 and Examples 2-7, it can be seen that the present invention further improves the comprehensive performance of the temporary bonding adhesive through the use of specific antioxidants. The temporary bonding adhesive prepared in this way has a room temperature viscosity of 10.1-10.8 Pa·s, a membrane surface TTV ≤ 1.74 μm, specifically 0.75-1.74 μm, and a rheological viscosity at 200°C of 1982-2467 Pa·s; the bonding strength of the temporary bonding adhesive film layer prepared by this temporary bonding adhesive increases successively with the increase of baking temperature, presents a gradient change, and will not cause sudden changes. When the baking temperature difference is 10°C, the difference in bonding strength is ≤ 7N; the bonding pair prepared by this temporary bonding adhesive has a uniform appearance and no bubbles, and the bonding pair warping is ≤ 0.3011 μm, specifically 0.2204-0.3011 μm. After the bonding pair chemical resistance test, the edge corrosion depth is ≤ 9 μm, specifically 3-9 μm.

[0124] From the comparison of Examples 2-3, 5-7 and 4, it can be seen that the present invention further improves the comprehensive performance of the temporary bonding adhesive through the cooperation of two specific types of antioxidants. The rheological viscosity of the temporary bonding adhesive prepared in this way at 200°C is 2122-2467Pa·s; the bonding force of the temporary bonding adhesive film layer prepared by this temporary bonding adhesive increases with the increase of the baking temperature, showing a gradient change, and will not cause a sudden change. When the baking temperature difference is 10°C, the difference in bonding force is ≤5N; the bonding pair prepared by this temporary bonding adhesive is subjected to a bonding pair resistance test, and its edge corrosion depth is ≤7μm, specifically 3-7μm. From the contents of Example 3, Example 6-7, Comparative Examples 1-2 and Comparative Example 3, it can be seen that the present invention designs the specific composition of the temporary bonding adhesive and further controls the mass ratio of the main resin and the antioxidant within a specific range to prepare a temporary bonding adhesive with excellent performance.

[0125] In summary, the present invention designs the specific composition of the temporary bonding adhesive to prepare a temporary bonding adhesive with a tearable film, which does not fall off during the wafer grinding and polishing process and does not require cleaning. The temporary bonding adhesive has the characteristics of temperature-controlled adhesion, resistance to chemical liquid corrosion, and tearable film that does not require cleaning. It can be widely used in thin wafer back processing, deep silicon etching, TSV through-hole and other processes.

[0126] The applicant declares that the present invention uses the above-described embodiments to illustrate the detailed process flow of the present invention, but the present invention is not limited to the above-described detailed process flow, that is, it does not mean that the present invention must rely on the above-described detailed process flow to be implemented. Those skilled in the art should understand that any improvements to the present invention, equivalent replacements for various raw materials in the products of the present invention, addition of auxiliary ingredients, and selection of specific methods, etc., are all within the scope of protection and disclosure of the present invention.

Claims

1. A temporary bonding adhesive, characterized in that: The temporary bonding adhesive comprises the following components: Main resin, antioxidant and organic solvent; The mass ratio of the main resin to the antioxidant is (14-20):

1.

2. The temporary bonding adhesive according to claim 1, characterized in that The 5% thermal weight loss temperature of the main resin is ≥400°C; Preferably, the main resin is selected from any one of polystyrene resin, ABS resin, cycloolefin copolymer, and cycloolefin homopolymer, or a combination of at least two thereof; Preferably, the main resin is selected from cycloolefin copolymers and / or cycloolefin homopolymers; Preferably, the weight average molecular weight of the main resin is 50,000-300,000, more preferably 80,000-200,000; Preferably, based on the mass percentage of the temporary bonding adhesive being 100%, the mass percentage of the main resin is 20-35%.

3. The temporary bonding adhesive according to claim 1 or 2, characterized in that: The antioxidant includes any one of hindered phenol antioxidants, phosphite antioxidants, and thioether antioxidants, or a combination of at least two thereof; Preferably, the hindered phenol antioxidant includes antioxidant 1010 or antioxidant 1076; Preferably, the phosphite antioxidant includes antioxidant 168; Preferably, the thioether antioxidant includes antioxidant PS800.

4. The temporary bonding adhesive according to claim 3, characterized in that The antioxidant is selected from a combination of a hindered phenol antioxidant and a phosphite antioxidant, or the antioxidant is selected from a combination of a hindered phenol antioxidant and a thioether antioxidant.

5. The temporary bonding adhesive according to any one of claims 1 to 4, characterized in that: The organic solvent is selected from any one or a combination of at least two of benzyl alcohol, benzyl acetate, n-butyl acetate, ethylene glycol butyl ether acetate, propylene glycol monomethyl ether acetate, limonene, p-menthane, dodecane, and decahydronaphthalene; Preferably, based on the mass percentage of the temporary bonding adhesive being 100%, the mass percentage of the organic solvent is 60-80%.

6. The temporary bonding adhesive according to any one of claims 1 to 5, characterized in that: The temporary bonding adhesive also includes a leveling agent; Preferably, the leveling agent is a silicone leveling agent; Preferably, based on the mass percentage of the temporary bonding adhesive being 100%, the mass percentage of the leveling agent is 0.01-0.50%.

7. A method for preparing a temporary bonding adhesive according to any one of claims 1 to 6, characterized in that: The preparation method comprises the following steps: All components of the temporary bonding adhesive are mixed to obtain the temporary bonding adhesive.

8. The preparation method according to claim 7, characterized in that The preparation method comprises the following steps: (1) mixing an antioxidant, an optional leveling agent, and an organic solvent, and cooling to obtain a mixture; (2) Mixing the mixture obtained in step (1) with the main resin to obtain the temporary bonding adhesive.

9. The preparation method according to claim 8, characterized in that The cooling temperature in step (1) is 30-35° C. Preferably, the cooling method includes cooling using a cooling water circulation system; Preferably, the mixing method in step (1) includes stirring, the stirring speed is 500-800 rpm, and the stirring time is 20-25 hours; Preferably, the mixing method in step (2) includes stirring, the stirring speed is 500-800 rpm, and the stirring time is 20-25 hours; Preferably, step (2) further includes a post-processing step after the mixing, and the post-processing method includes filtration.

10. A use of the temporary bonding adhesive according to any one of claims 1 to 6, characterized in that: The temporary bonding adhesive is used in wafer processing technology.

Images