Wafer-level MEMS scanning mirror testing device

Abstract

The invention discloses a wafer-level MEMS scanning mirror testing device, and the device comprises a detection platform which is used for placing a scanning mirror to be detected; the probe card assembly can be connected with the signal output device and is electrically connected with the scanning mirror to be detected; the first clamping assembly is arranged on the detection table in a position adjustable mode and used for clamping and fixing the light source assembly, and the light source assembly is used for emitting light beams to the scanning mirror to be detected; the second clamping assembly is arranged on the detection table in a position-adjustable manner and is used for clamping and fixing the probe card assembly; the third clamping assembly is arranged on the detection table in a position adjustable mode and used for clamping and fixing a two-dimensional PSD, and the two-dimensional PSD is used for collecting a light beam scanning track formed by the scanning mirror to be detected. Therefore, the electric signal can be transmitted to the to-be-detected scanning mirror through the detection card assembly so as to drive the to-be-detected scanning mirror, the test requirement of a bare chip of a single MEMS scanning mirror which is not packaged after wafer scribing can be met, the test requirement of the MEMS scanning mirror in a whole wafer can also be met, and the test efficiency of the MEMS scanning mirror is improved. Therefore, the wafer-level MEMS scanning mirror testing device has good universality, is high in testing precision, can realize automatic testing, and is favorable for improving the testing efficiency and reducing the testing cost.

Description

Technical Field

[0001] The present application relates to the technical field of micro-electromechanical systems, and in particular to a wafer-level MEMS scanning mirror testing device. Background Art

[0002] Currently, testing of MEMS scanning mirrors requires bonding the mirror to a printed circuit board (PCB) and applying voltage to the PCB to drive the mirror's deflection. Testing of the MEMS scanning mirror must be performed after the mirror is packaged, which increases the packaging requirements and the complexity of packaging and testing the mirror.

[0003] In the related art, the test platform cannot meet the testing requirements of MEMS scanning mirrors and has at least the following defects: low measurement accuracy, not suitable for large-scale testing on the production line, slow measurement speed, low testing efficiency, affecting production efficiency. Summary of the Invention

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the present application is to provide a wafer-level MEMS scanning mirror testing device, which can be used to accurately test MEMS scanning mirrors and help improve the test efficiency and test accuracy of MEMS scanning mirrors.

[0005] According to the wafer-level MEMS scanning mirror testing device of the embodiment of the present application, it includes: a detection table, which is used to place the scanning mirror to be detected; a probe card assembly, which can be connected to a signal output device and electrically connected to the scanning mirror to be detected; a first clamping assembly, which is adjustably arranged on the detection table and is used to clamp and fix a light source assembly, and the light source assembly is used to emit a light beam to the scanning mirror to be detected; a second clamping assembly, which is adjustably arranged on the detection table and is used to clamp and fix the probe card assembly; a third clamping assembly, which is adjustably arranged on the detection table and is used to clamp and fix a two-dimensional PSD, and the two-dimensional PSD is used to collect the light beam scanning trajectory formed by the scanning mirror to be detected.

[0006] According to the wafer-level MEMS scanning mirror testing device of the embodiment of the present application, during the MEMS scanning mirror testing process, the voltage drive at the scanning mirror to be tested is achieved by connecting the probe card assembly with the scanning mirror to be tested, which can improve the versatility of the wafer-level MEMS scanning mirror testing device. A probe card assembly with a corresponding pin structure can be set on the second clamping assembly according to the scanning mirror to be tested, thereby meeting the testing requirements of the bare die of a single MEMS scanning mirror that has not been packaged after wafer dicing, and can also meet the testing requirements of the MEMS scanning mirror in the entire wafer.

[0007] According to some embodiments of the present application, the detection platform includes: a seat body, a tray assembly is provided in the middle area of ​​the seat body, and the tray assembly is used to accommodate the scanning mirror to be detected; a first mounting seat and a second mounting seat, the first mounting seat and the second mounting seat are respectively provided on both sides of the tray assembly in the first direction, the first mounting seat is used to install the first clamping assembly, and the second mounting seat is used to install the second clamping assembly.

[0008] According to some embodiments of the present application, the position of the first clamping assembly relative to the first mounting seat is adjustable in the first direction, the second direction and the third direction; the position of the second clamping assembly relative to the second mounting seat is adjustable in the first direction, the second direction and the third direction; the position of the third clamping assembly relative to the second mounting seat is adjustable in the first direction, the second direction and the third direction; wherein the first direction, the second direction and the third direction are arranged perpendicular to each other.

[0009] According to some embodiments of the present application, the second clamping assembly further includes: a main body portion, which is connected and cooperated with the second mounting seat; a clamping portion, which is used to clamp and cooperate with the probe card assembly and is rotatably installed on the main body portion around a first axis, and the first axis is arranged parallel to the second direction.

[0010] According to some embodiments of the present application, the mounting surface height of the first mounting seat is not lower than the tray assembly setting; and / or the mounting surface height of the second mounting seat is not lower than the tray assembly setting.

[0011] According to some embodiments of the present application, the tray assembly includes: an adjustment seat, the position of which is adjustably arranged on the seat body; a tray, which is arranged on the adjustment seat and moves synchronously with the adjustment seat relative to the seat body, and the tray forms a accommodating space open to the upper side, and the scanning mirror to be detected is arranged in the accommodating space.

[0012] According to some embodiments of the present application, the probe card assembly includes: a probe card body, which is used to be electrically connected to the scanning mirror to be detected and to be clamped and cooperated with the second clamping assembly; and an electrical connector, which is connected to the probe card body and is used to be electrically connected to the signal output device.

[0013] According to some embodiments of the present application, the signal output device includes: a signal source, which is connected to and cooperates with the electrical connector and is used to transmit an electrical signal to one side of the electrical connector; a signal amplifier, which is connected to the signal source and is used to adjust the voltage signal output to one side of the scanning mirror to be detected.

[0014] According to some embodiments of the present application, a microscope is further included, which is arranged above the detection platform and is used to observe the scanning mirror to be detected.

[0015] According to some embodiments of the present application, the wafer-level MEMS scanning mirror testing device also includes: an image acquisition unit, which is arranged on the microscope and is used to acquire image information at the scanning mirror to be tested; an image display unit, which is arranged on the testing platform and is electrically connected to the image acquisition unit and is used to display images.

[0016] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 1 is a schematic structural diagram of a wafer-level MEMS scanning mirror testing device according to one embodiment of the present application;

[0019] Figure 2 1 is a front view of a wafer-level MEMS scanning mirror testing device according to one embodiment of the present application;

[0020] Figure 3 is a structural schematic diagram of a first clamping assembly according to one embodiment of the present application;

[0021] Figure 4 is a structural schematic diagram of a second clamping assembly according to one embodiment of the present application;

[0022] Figure 5 is a schematic structural diagram of a third clamping assembly according to one embodiment of the present application;

[0023] Figure 6 is a schematic diagram of the cooperation between the second clamping assembly and the probe card assembly according to one embodiment of the present application;

[0024] Figure 7 This is a test flow chart of a wafer-level MEMS scanning mirror testing device according to one embodiment of the present application.

[0025] Reference numerals:

[0026] Wafer-level MEMS scanning mirror testing device 100;

[0027] Testing platform 1; seat body 11; first mounting seat 12; second mounting seat 13;

[0028] Probe card assembly 2; probe card body 21; electrical connector 22;

[0029] First clamping assembly 31; second clamping assembly 32; main body 321; clamping portion 322; third clamping assembly 33;

[0030] Two-dimensional PSD 4; light source assembly 5; tray assembly 6; adjustment base 61; tray 62; microscope 71; image display unit 72. DETAILED DESCRIPTION

[0031] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0032] Reference below Figure 1-Figure 7 A wafer-level MEMS (Micro-Electro-Mechanical System) scanning mirror testing device according to an embodiment of the present application is described. The wafer-level MEMS scanning mirror testing device is used to test a MEMS scanning mirror.

[0033] At present, in the testing of MEMS scanning mirrors, it is necessary to bond the MEMS scanning mirror to a PCB (Printed Circuit Board) and drive the MEMS scanning mirror to deflect by applying voltage to the PCB. Among them, the testing process of the MEMS scanning mirror needs to be carried out after the MEMS scanning mirror is packaged, resulting in high packaging requirements for the MEMS scanning mirror, thereby increasing the difficulty of packaging and testing the MEMS scanning mirror. At the same time, the testing platform in the related art cannot meet the testing requirements of the MEMS scanning mirror, and has at least the following defects: low measurement accuracy, not suitable for large-scale testing on the production line, and slow measurement speed, low testing efficiency, affecting production efficiency.

[0034] According to an embodiment of the present application, the wafer-level MEMS scanning mirror testing device 100 includes a detection table 1, a probe card assembly 2, a first clamping assembly 31, a second clamping assembly 32 and a third clamping assembly 33, so as to test the MEMS scanning mirror through the wafer-level MEMS scanning mirror testing device 100. The MEMS scanning mirror is the "scanning mirror to be tested" in this application.

[0035] The inspection platform 1 is used to place the scanning mirror to be inspected, providing space for its placement, thereby enabling testing of the MEMS scanning mirror at a specific workstation. Furthermore, the inspection platform 1 serves as a mounting support for the first, second, and third clamping assemblies 31, 32, and 33, thereby constraining the first, second, and third clamping assemblies 31, 32, and 33 within a certain range.

[0036] Specifically, the first clamping assembly 31 is adjustably arranged on the detection platform 1, and the first clamping assembly 31 is used to clamp and fix the light source assembly 5, and the light source assembly 5 is used to emit a light beam to one side of the scanning mirror to be detected, so that the light can be emitted to the surface of the scanning mirror to be detected (i.e., the MEMS scanning mirror); the second clamping assembly 32 is adjustably arranged on the detection platform 1, and the second clamping assembly 32 is used to clamp and fix the probe card assembly 2, so that the probe card assembly 2 can be adjusted to a position suitable for matching the scanning mirror to be detected through the second clamping assembly 32, thereby facilitating the electrical connection of the probe card assembly 2 to the scanning mirror to be detected; the third clamping assembly 33 is adjustably arranged on the detection platform 1, and the third clamping assembly 33 is used to clamp and fix the two-dimensional PSD4 (Position Sensitive Detector), and the two-dimensional PSD4 is used to collect the light beam scanning trajectory formed by the scanning mirror to be detected.

[0037] It can be understood that the two-dimensional PSD4 is an optical sensor and can be used to detect a moving light spot and can reflect the position of the center of mass of the light spot using a bipolar voltage signal output by a current.

[0038] Among them, the scanning mirror to be tested can reflect the light so that the light can be directed vertically to the two-dimensional PSD4 surface, thereby achieving precise alignment of the light path, helping to improve test accuracy, and being able to detect changes in the light path through the two-dimensional PSD4.

[0039] Furthermore, the probe card assembly 2 can be connected to the signal output device, and the probe card assembly 2 is electrically connected to the scanning mirror to be detected. The signal output device can output an electrical signal to one side of the scanning mirror to be detected through the probe card assembly 2 to realize the driving of the scanning mirror to be detected, thereby driving the mirror deflection of the MEMS scanning mirror, and being able to reflect the input light of the light source assembly 5 with a continuously changing deflection angle.

[0040] In the present application, the first clamping component 31 clamps and fixes the light source component 5, so that the position of the light source component 5 relative to the detection platform 1 can be adjusted by adjusting the first clamping component 31, so that the incident light mask of the light source component 5 can be set at the scanning mirror to be detected; the second clamping component 32 clamps and fixes the probe card component 2, and the layout position of the probe card component 2 can be adjusted by adjusting the second clamping component 32, so that the probe card component 2 can be connected and matched with the scanning mirror to be detected, so that the probe assembly can be aligned with the electrode point on the MEMS scanning mirror; the third clamping component clamps and fixes the two-dimensional PSD4, so that the light beam scanning trajectory of the MEMS scanning mirror during the test process can be recorded by the two-dimensional PSD4, so that the indicators of the MEMS scanning mirror can be obtained by subsequent data processing and calculation based on the upper computer, thereby realizing accurate testing of the MEMS scanning mirror.

[0041] It can be understood that when the MEMS scanning mirror is tested by the wafer-level MEMS scanning mirror testing device 100 of the embodiment of the present application, the position of the device (such as: light source component 5, probe card component 2, two-dimensional PSD4, etc.) relative to the detection platform 1 can be adjusted by the first clamping component 31, the second clamping component 32 and the third clamping component 33, so as to test the MEMS scanning mirror within the test range formed by the detection platform 1, which helps to achieve accurate measurement of the MEMS scanning mirror and can meet the testing requirements of the MEMS scanning mirror's bare chip and the MEMS scanning mirror in the entire wafer.

[0042] The probe card assembly 2 can be clamped and fixed by the second clamping assembly 32, and the second clamping assembly 32 can drive the probe card assembly 2 to adjust its position relative to the detection platform 1, which can better adjust the probe card assembly 2 to a position that matches the scanning mirror to be tested, helping to achieve accurate measurement of the MEMS scanning mirror. At the same time, the probe card assembly 2 can also be adaptively adjusted according to changes in the scanning mirror to be tested, so that the probe card assembly 2 can match the scanning mirror to be tested.

[0043] It should be noted that when it is necessary to test a MEMS scanning mirror of a different structure, the probe card assembly 2 clamped in the second clamping assembly 32 can be replaced to form a probe card assembly 2 with a corresponding probe arrangement that matches the MEMS scanning mirror, so that during the test process, a voltage can be applied to one side of the MEMS scanning mirror through the probe card assembly 2 to achieve wafer-level testing of the MEMS scanning mirror. When the voltage output by the signal output device changes, the MEMS scanning mirror can be driven, thereby driving the MEMS scanning mirror surface to deflect, causing the MEMS scanning mirror to reflect the incident light from the light source assembly 5 at a continuously changing deflection angle.

[0044] At the same time, the wafer-level MEMS scanning mirror testing device 100 of the present application can calculate the MEMS scanning mirror's indicators (such as resonant frequency, scanning angle, etc.) through the data collected by the two-dimensional PSD4 in conjunction with a host computer, and can realize automated testing after cooperating with the host computer. As a result, the wafer-level MEMS scanning mirror testing device 100 of the present application has the advantages of high measurement accuracy, suitable for large-scale testing on production lines, fast measurement speed, and high testing efficiency compared to existing testing equipment.

[0045] In some embodiments of the present application, the light source assembly 5 is configured as a laser, which can emit laser light to meet the light incidence requirements of the MEMS scanning mirror.

[0046] Combine Figure 1 and Figure 2 As shown, in some embodiments of the present application, the test bench 1 includes: a seat body 11, a first mounting seat 12 and a second mounting seat 13, a tray assembly 6 is provided in the middle area of ​​the seat body 11, and the tray assembly 6 is used to accommodate the scanning mirror to be tested, so as to provide an accommodating space for the scanning mirror to be tested through the tray assembly 6, so as to facilitate the constraint and adjustment of the layout position of the MEMS scanning mirror during the test process.

[0047] Reference Figure 2 As shown, the first mounting seat 12 and the second mounting seat 13 are respectively arranged on both sides of the tray assembly 6 in the first direction, so as to facilitate the arrangement of devices during the test and prevent interference between devices.

[0048] Specifically, the first mounting seat 12 is used to mount the first clamping assembly 31, and the second mounting seat 13 is used to mount the second clamping assembly 32. The first clamping assembly 31 is used to clamp the light source assembly 5, so that the light source assembly 5 can emit a light beam from the first side of the tray assembly 6 in the first direction toward the scanning mirror to be detected; the second clamping assembly 32 is used to clamp the probe card assembly 2, so that the probe card assembly 2 can extend from the second side of the tray assembly 6 in the first direction toward the side of the scanning mirror to be detected, and the probe card assembly 2 is matched with the scanning mirror to be detected, thereby effectively preventing the probe card assembly 2 from interfering with the light beam of the light source assembly 5 and ensuring the effect of the light beam being emitted to the MEMS scanning mirror; the third clamping assembly 33 is used to clamp the two-dimensional PSD 4, which is suitable for being arranged on the path of the light beam after the light beam is reflected by the MEMS. Extending the two-dimensional PSD 4 from the second side of the first direction toward the side of the scanning mirror to be detected can avoid interference between the two-dimensional PSD 4 and the light path and facilitate precise alignment of the two-dimensional PSD 4 with the light path. In this way, the detection card assembly and the two-dimensional PSD4 can be arranged in an area suitable for avoiding the incident light emitted by the light source assembly 5, which helps to reduce the position adjustment time required for the clamping assembly during the test process and helps to improve the test efficiency while ensuring the test accuracy.

[0049] Reference Figure 1 As shown, in the second mounting base 13, the second clamping assembly 32 and the third clamping assembly 33 are spaced apart along the second direction, thereby preventing interference between the second clamping assembly 32 and the third clamping assembly 33. The second clamping assembly 32 is arranged corresponding to the first clamping assembly 31 in the first direction, so as to facilitate the alignment of the light source assembly 5 with the two-dimensional PSD 4.

[0050] Combine Figure 1 and Figure 2 As shown, in some embodiments of the present application, the position of the first clamping assembly 31 relative to the first mounting seat 12 is adjustable in the first direction, the second direction, and the third direction; the position of the second clamping assembly 32 relative to the second mounting seat 13 is adjustable in the first direction, the second direction, and the third direction; and the position of the third clamping assembly 33 relative to the second mounting seat 13 is adjustable in the first direction, the second direction, and the third direction.

[0051] As a result, each clamping component (i.e., the first clamping component 31, the second clamping component 32, and the third clamping component 33) can realize position adjustment in three directions (i.e., the first direction, the second direction, and the third direction) relative to the detection table 1. The position adjustment is flexible and can better match the devices, such as: the probe card component 2 is matched with the scanning mirror to be detected to ensure the reliability of the electrical connection between the probe card component 2 and the scanning mirror to be detected; the light source component 5 is matched with the scanning mirror to be detected to ensure the incident effect of the light beam on one side of the scanning mirror to be detected; the two-dimensional PSD4 is matched with the scanning mirror to be detected to ensure the effect of the two-dimensional PSD4 recording the scanning trajectory of the light beam.

[0052] It should be noted that in the field of clamp position adjustment technology, the position adjustment method of the clamp relative to the base (such as the seat body 11 in the embodiment of the present application) is well known to technical personnel in this field, and no specific limitation is made here on the specific structure and installation method of the clamping assembly in this application.

[0053] Among them, the first direction, the second direction and the third direction are arranged perpendicular to each other, so that the position of the clamping assembly relative to the detection platform 1 can be flexibly adjusted to ensure the position adjustment range of the clamping assembly relative to the detection platform 1, thereby facilitating the adjustment of the position of the device fixed on the clamping assembly.

[0054] like Figure 4 As shown, in some embodiments of the present application, the second clamping assembly 32 further includes: a main body portion 321 and a clamping portion 322 .

[0055] Among them, the main body 321 is connected and cooperated with the second mounting seat 13, and the clamping part 322 is used to clamp and cooperate with the probe card assembly 2 to clamp and fix the probe card assembly 2, and the clamping part 322 is rotatably installed on the main body 321 around the first axis, and the first axis is set parallel to the second direction.

[0056] It can be understood that the clamping portion 322 is used to clamp and fix the probe card assembly 2. By rotating and adjusting the clamping portion 322 relative to the main body portion 321, the deflection angle of the probe card assembly 2 relative to the scanning mirror to be detected can be adjusted, so as to adjust the probe card assembly 2 to a position suitable for matching with the scanning mirror to be detected, thereby ensuring the reliability of the connection between the probe card assembly 2 and the scanning mirror to be detected.

[0057] Further integration Figure 1 As shown, the main body 321 in the second clamping assembly 32 is located in the front area of ​​the tray assembly 6 in the second direction, so that the clamping portion 322 can extend from front to back in the second direction to the upper area of ​​the scanning mirror to be detected, and by driving the clamping portion 322 to rotate around the second axis relative to the main body 321, the probe card assembly 2 can be swung, thereby facilitating the adjustment of the probe card to an angular position matching the scanning mirror to be detected.

[0058] It should be noted that the clamping portion 322 is installed on the main body 321, and the position of the main body 321 relative to the second mounting seat 13 is adjustable. That is to say, by adjusting the main body 321, the clamping portion 322 can be driven to move synchronously relative to the second mounting seat 13 to achieve position adjustment of the clamping portion 322 in three directions (i.e., the first direction, the second direction and the third direction mentioned above), so that the probe card assembly 2 has a variety of position adjustment methods, so that the probe card assembly 2 can be more accurately matched with the scanning mirror to be detected, which helps to improve the test accuracy of the scanning mirror to be detected.

[0059] like Figure 2 As shown, in some embodiments of the present application, the mounting surface height of the first mounting seat 12 is not lower than the setting of the tray assembly 6, so that the first clamping assembly 31 can be arranged in the upper area of ​​the tray assembly 6, so that the light source assembly 5 can emit light from the open area above to the scanning mirror to be detected arranged in the tray assembly 6.

[0060] like Figure 2 As shown, in some embodiments of the present application, the mounting surface height of the second mounting seat 13 is not lower than the setting of the tray assembly 6, so that the second clamping assembly 32 and the third clamping assembly 33 are arranged in the upper area of ​​the tray assembly 6, so that the probe card assembly 2 can be adjusted from the upper area of ​​the tray assembly 6 to a position matching the scanning mirror to be detected, and the two-dimensional PSD4 is arranged in the upper area of ​​the tray assembly 6 at a position suitable for receiving the reflected light beam of the scanning mirror to be detected.

[0061] like Figure 2 As shown, in some embodiments of the present application, the tray assembly 6 includes an adjustment base 61 and a tray 62. The adjustment base 61 is adjustably mounted on the base body 11, and the tray 62 is mounted on the adjustment base 61. The tray 62 can move synchronously with the adjustment base 61 relative to the base body 11 to adjust the position of the tray 62. Furthermore, the tray 62 is formed with an upwardly open accommodation space, and the scanning mirror to be inspected can be arranged in the accommodation space.

[0062] It is understood that the tray 62 is a carrier for the scanning mirror to be tested. The scanning mirror to be tested can be placed in the tray 62 for testing. The tray 62 is installed and matched with the adjustment base 61. The adjustment base 61 can drive the tray 62 to move synchronously with the base body 11 to achieve position adjustment of the tray 62. In this way, the test position of the scanning mirror to be tested can be set in the wafer-level MEMS scanning mirror testing device 100, so that the scanning mirror to be tested can be adjusted to a range suitable for matching with the light source assembly 5 and the probe card assembly 2.

[0063] It should be noted that during the test process, the scanning mirror to be tested needs to be arranged in the tray 62 to provide a storage space for the scanning mirror to be tested through the tray 62. The scanning mirror to be tested can be constructed as a bare die of a single MEMS scanning mirror after wafer dicing and not packaged, or it can be constructed as a MEMS scanning mirror in the entire wafer. In other words, there are large differences in the sizes of the scanning mirrors to be tested. By adjusting the position of the tray 62 relative to the seat body 11 through the adjustment seat 61, the area to be tested of the scanning mirror to be tested can be adjusted to a range suitable for matching with the probe card assembly 2, so that the probe card assembly 2 can be further matched with the scanning mirror to be tested by adjusting the position of the probe card assembly 2.

[0064] Furthermore, the adjustment seat 61 can be adjusted relative to the seat body 11 along the first direction, the second direction and the third direction, so that the adjustment seat 61 drives the tray 62 to adjust its position in multiple directions, thereby facilitating the adjustment of the scanning mirror to be detected to the area suitable for matching with the probe card assembly 2.

[0065] like Figure 6As shown, in some embodiments of the present application, the probe card assembly 2 includes: a probe card body 21 and an electrical connector 22. The probe card body 21 is used to electrically connect to the scanning mirror to be inspected, and the probe card body 21 is used to clamp and cooperate with the second clamping assembly 32. The second clamping assembly 32 clamps and fixes the probe card body 21, and the second clamping assembly 32 drives the probe card body 21 to achieve position adjustment. The electrical connector 22 is connected to the probe card body 21 and is used to electrically connect to a signal output device to transmit an electrical signal to the probe card body 21.

[0066] Furthermore, the electrical connection member 22 may be configured as a probe card connection line, so as to realize electrical connection between the signal output device and the probe card body 21 through the probe card connection line. The connection method is simple and easy to operate.

[0067] Among them, the probe card body 21 is used to contact and cooperate with the electrode points of the MEMS scanning mirror, and the electrical signal can be transmitted from the signal output device to the probe card body 21 through the electrical connector 22, so as to further transmit the electrical signal to the MEMS scanning mirror through the probe card body 21 to realize beam scanning.

[0068] Thus, the electrical signal can be transmitted to the scanning mirror to be tested through the probe card assembly 2, and the bare chip of the MEMS scanning mirror can be tested, thereby improving the versatility of the wafer-level MEMS scanning mirror testing device 100. The probe card body 21 with a corresponding needle arrangement can be set according to the arrangement of the electrode points on the MEMS scanning mirror to meet the testing requirements of various types of MEMS scanning mirrors.

[0069] In a further embodiment of the present application, the signal output device includes: a signal source and a signal amplifier.

[0070] The signal source is connected to the electrical connector 22 and is used to transmit an electrical signal to one side of the electrical connector 22. The signal amplifier is connected to the signal source and is used to adjust the voltage signal output to the side of the scanning mirror to be detected.

[0071] Specifically, the signal source can be constructed as a function signal generator, and the signal amplifier can be constructed as a high-voltage amplifier, so that the signal source and the signal amplifier can cooperate to output multiple electrical signals, thereby applying multiple voltages to one side of the MEMS scanning mirror, thereby driving the MEMS scanning mirror to deflect.

[0072] It can be understood that the signal output device in the embodiment of the present application can change the amplification factor of the voltage amplifier so that the output voltage is the driving voltage of the scanning mirror to be detected (i.e., the MEMS scanning mirror), thereby realizing the driving of the scanning mirror to be detected under the driving voltage.

[0073] It should be noted that the specific testing steps and calculation methods for the MEMS scanning mirror based on the two-dimensional PSD4 are well known to those skilled in the art and are not specifically limited here. The present application only needs to realize data collection during the test based on the two-dimensional PSD4.

[0074] like Figure 1 and Figure 2 As shown, in some embodiments of the present application, the wafer-level MEMS scanning mirror testing device 100 also includes a microscope 71, which is arranged in the upper area of ​​the detection platform 1, and the microscope 71 can be used to observe one side of the scanning mirror to be tested, so that the tester can observe the MEMS scanning mirror from top to bottom through the microscope 71, so that the tester can grasp the status of the MEMS scanning mirror (such as: deflection status) in time.

[0075] like Figure 1 and Figure 2 As shown, in some embodiments of the present application, the wafer-level MEMS scanning mirror testing device 100 further includes: an image acquisition unit (not shown) and an image display unit 72, the image acquisition unit is arranged on the microscope 71, and the image acquisition unit is used to acquire image information at the scanning mirror to be inspected, the image display unit 72 is arranged on the inspection platform 1, and the image display unit 72 is electrically connected to the image acquisition unit to display the image through the image display unit 72, so that the tester can intuitively observe the status of one side of the scanning mirror to be inspected through the image display unit 72.

[0076] The image acquisition unit may be configured as a camera to realize the image acquisition function of the image acquisition unit, and the image display unit 72 may be configured as a display screen to realize the image display function of the image display unit 72 .

[0077] Reference Figure 1-Figure 7 The following describes the test process of the wafer-level MEMS scanning mirror test device 100 according to an embodiment of the present application:

[0078] The wafer-level MEMS scanning mirror testing device 100 may be connected to an external device such as a host computer.

[0079] First, the position of the tray assembly 6 can be adjusted by adjusting the adjustment seat 61 to drive the tray 62 to move, and the tray assembly 6 can be used to carry the scanning mirror to be tested so as to arrange the scanning mirror to be tested within an area suitable for testing;

[0080] Next, the devices are clamped on corresponding clamping assemblies, and the positions of the clamping assemblies (i.e., the first clamping assembly 31, the second clamping assembly 32, and the third clamping assembly 33) are further adjusted to position the devices in positions suitable for cooperating with the scanning mirror to be tested. At this point, the probe card body 21 can be aligned with the electrode points of the scanning mirror to be tested.

[0081] Furthermore, an electrical signal is output to the probe card assembly 2 through the signal output device, and the electrical signal can be transmitted to the MEMS scanning mirror through the probe card assembly 2 to apply a driving signal to the MEMS scanning mirror, so as to deflect the MEMS scanning mirror.

[0082] Finally, the beam scanning trajectory of the MEMS scanning mirror is recorded by the two-dimensional PSD4, and is sampled by an external information acquisition module (such as an acquisition card, ADC (analog-to-digital converter), etc.) of the wafer-level MEMS scanning mirror test device 100, and the data is sent to the host computer for data processing.

[0083] Therefore, based on the scanning mirror testing method of the two-dimensional PSD4, it is possible to record the moving distance of the light spot after reflection by the MEMS scanning mirror, the distance between the two-dimensional PSD4 and the MEMS scanning mirror, etc., and further calculate the indicators of the MEMS scanning mirror (such as: the resonant frequency indicator and scanning angle indicator of the MEMS scanning mirror) according to the trigonometric function relationship to realize the testing of the MEMS scanning mirror.

[0084] It should be noted that the wafer-level MEMS scanning mirror testing device 100 according to the embodiment of the present application can implement a resonant frequency test and a deflection angle test on the MEMS scanning mirror.

[0085] In the resonant frequency test, first, the "light path" is adjusted through the wafer-level MEMS scanning mirror testing device in the embodiment of the present application, which specifically includes the following contents: by adjusting the first clamping component, the second clamping component and the detection platform, the light source component 5 emits a laser to the scanning mirror to be detected, and the outgoing light beam of the scanning mirror to be detected is set perpendicular to the two-dimensional PSD (such as: the receiving surface of the two-dimensional PSD), and the distance between the scanning mirror to be detected and the two-dimensional PSD is further recorded.

[0086] Furthermore, during the test process, it is necessary to "determine the scanning frequency", which specifically includes: determining the scanning frequency range of the two-axis drive signal of the scanning mirror to be tested, and further determining the scanning frequency interval of the drive signal, adjusting the drive voltage, and changing the drive signal frequency applied to the MEMS scanning mirror (i.e., the scanning mirror to be tested).

[0087] After the above-mentioned "determine the scanning frequency" step is completed, the host computer can perform data processing, specifically including: recording the two-dimensional PSD output signal, converting the two-dimensional PSD output signal into line segment length, and determining the driving frequency corresponding to the longest length.

[0088] After the "data processing" step is completed, a determination is made as to whether the drive frequency meets the accuracy requirements. If the drive frequency meets the accuracy requirements, the drive frequency is determined as the resonant frequency of the MEMS scanning mirror, completing the test. If the drive frequency does not meet the accuracy requirements, the "scanning frequency determination" step is repeated to reapply the signal to the scanning mirror under test and perform data processing again until a drive frequency that meets the accuracy requirements is obtained. This completes the resonant frequency test of the MEMS scanning mirror.

[0089] During the deflection angle test, first, the initial and final values ​​of the applied voltage are set, as well as the step interval of the applied voltage. The voltage is then applied to the MEMS scanning mirror. The two-dimensional PSD output signal is recorded by the host computer and converted into distance information. At the same time, the distance between the two-dimensional PSD and the scanning mirror is recorded. The deflection angle of the MEMS scanning mirror is calculated by the host computer to realize the deflection angle test of the MEMS scanning mirror.

[0090] In summary, the wafer-level MEMS scanning mirror testing device 100 according to the embodiment of the present application has at least the following advantages compared to the prior art solutions:

[0091] (1) During the test of the MEMS scanning mirror, the voltage drive at the scanning mirror to be tested is realized by connecting the probe card assembly 2 with the scanning mirror to be tested, which can improve the versatility of the wafer-level MEMS scanning mirror testing device 100. The probe card assembly 2 with a corresponding pin arrangement structure can be set on the second clamping assembly 32 according to the scanning mirror to be tested, thereby meeting the test requirements of the bare die of a single MEMS scanning mirror that has not been packaged after wafer dicing, and can also meet the test requirements of the MEMS scanning mirrors in the entire wafer;

[0092] (2) The devices used for testing (such as the light source assembly 5, the probe card assembly 2, and the two-dimensional PSD 4) can be clamped and fixed by the clamping assembly (such as the first clamping assembly 31, the second clamping assembly 32, and the third clamping assembly 33 mentioned above), which is convenient for positioning the devices and helps to improve the test accuracy to obtain accurate data parameters. In addition, after cooperating with the host computer, the resonant frequency and scanning angle of the MEMS scanning mirror can be accurately measured, and automated testing can be achieved, which helps to improve the test efficiency of the MEMS scanning mirror and reduce the test cost;

[0093] (3) The positions of the multiple clamping assemblies and the tray assembly 6 in the present application are adjustable in the detection table 1, and can be adjusted in multiple directions to facilitate the correspondence of the devices in the wafer-level MEMS scanning mirror test device 100. In addition, the layout position of the devices is reasonable, which can effectively avoid problems such as interference between devices.

[0094] At the same time, the wafer-level MEMS scanning mirror test device 100 in this application is integrated with the two-dimensional PSD test platform, which can not only improve the debugging accuracy of the equipment during the test preparation stage, so as to fully match the two-dimensional PSD4 with the scanning mirror to be tested, thereby improving the beam scanning trajectory detection accuracy during the test process, but also the measurement accuracy can reach up to 0.001° or more through the two-dimensional PSD test platform, and can measure indicators such as the scanning angle, resonant frequency, and angular accuracy of the scanning mirror to be tested. Therefore, the wafer-level MEMS scanning mirror test device 100 in this application can fully test and inspect the scanning mirror to be tested.

[0095] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0096] In the description of this application, "first feature" and "second feature" may include one or more of the features.

[0097] In the description of this application, “plurality” means two or more.

[0098] In the description of the present application, a first feature being “on” or “under” a second feature may include the first and second features being in direct contact with each other, or the first and second features being in contact with each other not directly but via another feature therebetween.

[0099] In the description of this application, a first feature “on”, “above” and “above” a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0100] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0101] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and purpose of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A wafer-level MEMS scanning mirror testing device, characterized in that: include: A detection platform (1), wherein the detection platform (1) is used to place a scanning mirror to be detected; A probe card assembly (2), wherein the probe card assembly (2) can be connected to a signal output device and electrically connected to the scanning mirror to be detected; a first clamping assembly (31), the first clamping assembly (31) being adjustably disposed on the detection platform (1) and being used to clamp and fix a light source assembly (5), wherein the light source assembly (5) is used to emit a light beam toward the scanning mirror to be detected; A second clamping assembly (32), the second clamping assembly (32) is adjustably disposed on the detection platform (1) and is used to clamp and fix the probe card assembly (2); A third clamping assembly (33) is adjustably arranged on the detection platform (1) and is used to clamp and fix the two-dimensional PSD (4), and the two-dimensional PSD (4) is used to collect the light beam scanning trajectory formed by the scanning mirror to be detected.

2. The wafer-level MEMS scanning mirror testing device according to claim 1, wherein: The detection platform (1) comprises: A seat body (11), wherein a tray assembly (6) is provided in a central area of ​​the seat body (11), and the tray assembly (6) is used to accommodate the scanning mirror to be detected; A first mounting seat (12) and a second mounting seat (13), wherein the first mounting seat (12) and the second mounting seat (13) are respectively arranged on both sides of the tray assembly (6) in a first direction, the first mounting seat (12) is used to install the first clamping assembly (31), and the second mounting seat (13) is used to install the second clamping assembly (32).

3. The wafer-level MEMS scanning mirror testing device according to claim 2, characterized in that: The position of the first clamping assembly (31) relative to the first mounting seat (12) is adjustable in the first direction, the second direction, and the third direction; The second clamping assembly (32) is positionally adjustable relative to the second mounting seat (13) in the first direction, the second direction, and the third direction; The position of the third clamping assembly (33) is adjustable relative to the second mounting seat (13) in the first direction, the second direction, and the third direction; The first direction, the second direction and the third direction are arranged perpendicular to each other.

4. The wafer-level MEMS scanning mirror testing device according to claim 3, characterized in that: The second clamping assembly (32) further includes: A main body (321), the main body (321) being connected and matched with the second mounting seat (13); A clamping portion (322) is used for clamping and cooperating with the probe card assembly (2) and is rotatably mounted on the main body (321) around a first axis, and the first axis is arranged parallel to the second direction.

5. The wafer-level MEMS scanning mirror testing device according to claim 2, wherein: The mounting surface height of the first mounting seat (12) is not lower than that of the tray assembly (6); And / or, the mounting surface height of the second mounting seat (13) is not lower than the setting of the tray assembly (6).

6. The wafer-level MEMS scanning mirror testing device according to claim 2, characterized in that: The tray assembly (6) comprises: An adjustment seat (61), the adjustment seat (61) being adjustably arranged on the seat body (11); A tray (62) is provided on the adjustment seat (61) and moves synchronously with the adjustment seat (61) relative to the seat body (11); the tray (62) is formed with an accommodating space open upward, and the scanning mirror to be detected is provided in the accommodating space.

7. The wafer-level MEMS scanning mirror testing device according to claim 1, wherein: The probe card assembly (2) comprises: A probe card body (21), the probe card body (21) being used for being electrically connected to the scanning mirror to be detected and for being clamped and matched with the second clamping assembly (32); An electrical connector (22) is connected to the probe card body (21) and is used for electrically connecting to the signal output device.

8. The wafer-level MEMS scanning mirror testing device according to claim 7, characterized in that: The signal output device includes: a signal source, the signal source being connected and matched with the electrical connector (22) and used for transmitting an electrical signal to one side of the electrical connector (22); A signal amplifier is connected to the signal source and is used to adjust the voltage signal output to one side of the scanning mirror to be detected.

9. The wafer-level MEMS scanning mirror testing device according to claim 1, wherein: It also includes a microscope (71), which is arranged above the detection platform (1) and is used to observe one side of the scanning mirror to be detected.

10. The wafer-level MEMS scanning mirror testing device according to claim 9, characterized in that: Also includes: An image acquisition unit, which is provided on the microscope (71) and is used to acquire image information at the scanning mirror to be detected; An image display unit (72) is provided on the detection platform (1), and the image display unit (72) is electrically connected to the image acquisition unit and is used to display images.

Images