Ultrasonic probe interface suitable for high-temperature working condition

Abstract

The invention provides an ultrasonic probe interface suitable for a high-temperature working condition, and belongs to the field of nuclear engineering. The problems that an ultrasonic probe is poor in pipeline adaptability and low in modularization degree, the cost of a single ultrasonic probe is high, and the penetrating effect of an ultrasonic imaging probe is poor under the high-temperature using condition are solved. The device comprises a pipeline fixing part which is used for being fixed on a pipeline to be matched, one side end face of the pipeline fixing part is used for being detachably connected with an ultrasonic probe fixing part, and the ultrasonic probe fixing part is used for being detachably connected with an ultrasonic imaging probe; and the temperature control device is coupled with the ultrasonic probe fixing part and is used for cooling the ultrasonic probe fixing part. The device is mainly used for monitoring the lead-bismuth alloy operation pipeline.

Description

Technical Field

[0001] The invention belongs to the field of nuclear engineering, and in particular relates to an ultrasonic probe interface suitable for high-temperature working conditions. Background Art

[0002] In the field of nuclear engineering, lead-bismuth reactors have garnered widespread attention in recent years due to their high safety, sustainability, economic performance, and environmental friendliness. However, due to the high operating temperature (473K) of lead-bismuth reactors and the inherent opacity and metal wetting properties of liquid metal, traditional optical and invasive detection methods have difficulty monitoring the flow state of liquid lead-bismuth alloys. Ultrasonic imaging technology, as a non-invasive, high-resolution, real-time monitoring method, can accurately capture flow velocity distribution, cavitation rate, and flow instability within pipelines, making it well-suited for monitoring high-temperature liquid metals such as high-temperature lead-bismuth alloys.

[0003] According to currently available literature and patents, the following problems have been difficult to solve when using ultrasonic imaging technology in high-temperature liquid metal:

[0004] Because ultrasonic waves are significantly attenuated in gaseous media, acoustic impedance matching media is used in industrial measurements to eliminate the air layer between the probe and the detection surface, ensuring efficient sound wave penetration through the interface and improving the signal-to-noise ratio. However, on the outer diameter surface of lead-bismuth alloy pipelines, acoustic impedance matching media are prone to component decomposition or a sudden drop in viscosity at high temperatures, leading to acoustic impedance mismatch, degraded interfacial contact, and reduced ultrasonic penetration efficiency.

[0005] Ultrasonic transducers (such as PZT materials) will experience signal attenuation or failure at high temperatures due to the Curie temperature limit of the piezoelectric material, structural thermal expansion mismatch, and aging of connecting components, making it difficult to apply ultrasonic imaging technology in high-temperature liquid metal monitoring conditions.

[0006] Ultrasonic probes are poorly adaptable to pipes with varying outer diameters, often requiring the design of separate ultrasonic imaging probes for each pipe diameter. This results in long industrial design cycles and high costs, hindering rapid monitoring and testing. Furthermore, cooling improvements are often integrated into the ultrasonic probe, resulting in high costs and limited versatility for individual probes.

[0007] Therefore, it is necessary to design a hardware interface that is variable in diameter, resistant to high temperatures, capable of dissipating the waste heat conducted from the outer wall of the pipeline, and capable of accommodating and protecting the acoustic impedance matching medium and ultrasonic transducer to solve the above technical problems. Summary of the Invention

[0008] In view of this, the present invention aims to propose an ultrasonic probe interface suitable for high-temperature working conditions to solve the problems of poor adaptability of ultrasonic probes to pipelines, low degree of modularity, high cost of single ultrasonic probes, and poor penetration effect of ultrasonic imaging probes under high-temperature conditions.

[0009] To achieve the above-mentioned object, the present invention adopts the following technical solution: an ultrasonic probe interface suitable for high-temperature working conditions, comprising:

[0010] A pipeline fixing portion, which is used to be fixed on the pipeline to be matched, and one end surface of which is used to be detachably connected to the ultrasonic probe fixing portion, wherein the ultrasonic probe fixing portion is used to be detachably connected to the ultrasonic imaging probe;

[0011] The temperature control device is coupled to the ultrasonic probe fixing portion and is used to cool the ultrasonic probe fixing portion.

[0012] Furthermore, a saddle clamp is provided on the pipeline fixing portion, which is used to form a bayonet for engaging with the pipeline to be matched with the pipeline fixing portion.

[0013] Furthermore, the shape of the bayonet is adapted to the pipeline to be matched, and the diameter of the bayonet is adjustable.

[0014] Furthermore, the overall axis of the ultrasonic probe fixing part is perpendicular to the axis of the pipeline to be matched.

[0015] Furthermore, a heat exchange fluid channel is integrally machined in the peripheral wall of the ultrasonic probe fixing portion, and the inlet and outlet ends of the heat exchange fluid channel are respectively connected to the outlet and inlet ends of the cooling medium of the temperature control device.

[0016] Furthermore, the heat exchange fluid channel is a unidirectional single-flow channel with a high surface area heat dissipation optimization structure.

[0017] Furthermore, the ultrasonic probe fixing portion is provided with an opening extending in the axial direction on an end face of one side away from the pipeline to be matched, for engaging the ultrasonic imaging probe.

[0018] Furthermore, a probe containing structure for containing an acoustic impedance matching medium is provided in the opening near the side of the pipeline to be matched.

[0019] Furthermore, a sealing portion for sealingly connecting the ultrasonic imaging probe is provided on a side of the probe containing structure away from the pipeline to be matched.

[0020] Furthermore, the sealing portion is a sealing ring with a double-lip sealing structure, and the inlet diameter is smaller than the outer diameter of the ultrasonic imaging probe.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. This interface can adapt to pipes of different diameters through the pipe fixing part. No matter how the pipe diameter changes, the pipe fixing part can be used to lock the fixed position of the ultrasonic imaging probe, so that the interface can be closely fitted with the pipe to be measured, ensuring the effective transmission of ultrasonic signals. By setting up a separate modular design with the ultrasonic probe fixing part, it can adapt to different pipes and different ultrasonic imaging probes, with high replaceability and modularity.

[0023] 2. This structure cools the ultrasonic imaging probe through the ultrasonic probe fixing part by coupling it with the temperature control device. This setting method can avoid setting a cooling structure on each different ultrasonic imaging probe, saving costs and improving the availability of the interface. At the same time, the simplified structure of the ultrasonic imaging probe is easier to fix and lock the position. It is also suitable for monitoring high-temperature environments such as lead-bismuth alloy operating pipelines, preventing the acoustic impedance matching medium from easily decomposing its components or suddenly dropping its viscosity at high temperatures, resulting in acoustic impedance mismatch, deterioration of interface contact, and weakening of ultrasonic penetration efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings, which constitute part of the present invention, are provided to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are provided to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings:

[0025] Figure 1 This is a schematic structural diagram from a first perspective of an ultrasonic probe interface suitable for high-temperature working conditions according to the present invention;

[0026] Figure 2 This is a schematic structural diagram from a second perspective of an ultrasonic probe interface suitable for high-temperature working conditions according to the present invention;

[0027] Figure 3 Schematic diagram of the distribution position of the heat exchange fluid channels according to the present invention;

[0028] Figure 4 This is a cross-sectional view of an ultrasonic probe interface suitable for high-temperature working conditions according to the present invention;

[0029] Figure 5 This is an adaptation diagram of the pipeline fixing parts and the ultrasonic probe fixing parts of different sizes according to the present invention.

[0030] Pipeline fixing part 1; saddle clamp 1-1; slot 1-2; temperature control device 2; ultrasonic probe fixing part 3; double-lip sealing structure sealing ring 3-1; probe containing structure 3-2; heat exchange fluid channel 3-3; pipeline to be matched 4; ultrasonic imaging probe 5. DETAILED DESCRIPTION

[0031] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely explain the technical solutions in the embodiments of the present invention. It should be noted that the embodiments of the present invention and the features therein can be combined with each other in the absence of conflict, and the embodiments described are only part of the embodiments of the present invention, not all of the embodiments.

[0032] It should be noted that the descriptions of the present invention regarding directions such as "left", "right", "left side", "right side", "upper", "lower", "top", and "bottom" are all defined based on the relationship between the orientations or positions shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the structure described must be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present invention. In the description of the present invention, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0033] In the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediary, or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0034] Referring to the accompanying drawings, this embodiment is described, which is an ultrasonic probe interface suitable for high temperature working conditions, comprising:

[0035] The pipeline fixing part 1 is used to be fixed on the pipeline 4 to be matched, and one side end surface is used for detachably connecting the ultrasonic probe fixing part 3, wherein the ultrasonic probe fixing part 3 is used for detachably connecting the ultrasonic imaging probe 5; through the detachable connection method, a modular connection form is formed, and by reasonably replacing each module, the adaptability and convenience of disassembly and assembly are improved, thereby achieving adaptation to different pipelines and adaptation to different ultrasonic imaging probes 5. At this time, only a limited number of pipeline fixing parts 1 and ultrasonic probe fixing parts 3 need to be replaced to adapt to a large number of pipes to be tested with different diameters and different ultrasonic imaging probes 5. It is not necessary for each ultrasonic imaging probe 5 to have its own cooling structure, and the stable and effective operation of each ultrasonic imaging probe 5 can be guaranteed.

[0036] The temperature control device 2 is coupled to the ultrasonic probe fixture 3 to cool the ultrasonic probe fixture 3. The coupling method can be a heat exchange pipe wrapped around the ultrasonic probe fixture 3, or the ultrasonic probe fixture 3 can be entirely disposed within the heat exchange cavity of the temperature control device 2. The coupling method between the heat exchange structure and the ultrasonic probe fixture 3 can be adjusted accordingly based on the actual configuration of the temperature control device 2.

[0037] In this embodiment, the pipe fixing part 1 is provided with a saddle clamp 1-1, which is used to form a bayonet with the pipe 4 to be matched. The pipe fixing part 1 is specifically a pipe tight fitting saddle. The bayonet formed by the pipe tight fitting saddle and the saddle clamp 1-1 is inscribed with the outer diameter of the pipe 4 to be matched. The vertical surface of the pipe fixing part 1 is provided with a slot 1-2, and the ultrasonic probe fixing part 3 is inserted into the slot 1-2 during installation. Figure 5 As shown, for pipes of varying outer diameters, by replacing pipe-fitting saddles 1-a, 1-b, 1-c, and so on with different sizes, and using the saddle clamp 1-1, a tight fit between the bayonet and the pipe to be measured can be achieved, ensuring effective propagation of the ultrasonic signal. Other modular connection methods can also be selected as needed, all within the spirit of the invention of this interface. The pipe fixing portion 1 is made of a ceramic-polymer composite material. The low thermal conductivity of the polymer resin matrix effectively blocks heat conduction from the high-temperature pipe to the interface. Uniformly distributed ceramic fillers effectively reduce ultrasonic signal attenuation and scattering.

[0038] In this embodiment, the shape of the bayonet is adapted to the pipe 4 to be mated, and the bayonet diameter is adjustable. The bayonet shape is related to the configuration of the saddle clamp 1-1 and the pipe fixing portion 1. Adjustment of the bayonet diameter can be achieved by replacing the pipe fixing portion 1 and the saddle clamp 1-1, or by configuring the saddle clamp 1-1 to have an adjustable diameter. For example, the saddle clamp 1-1 can be configured as two sections with adjustable lengths, using the male and female buckles to secure the sections, to form bayonet diameters of varying sizes. Adjustments can be made based on actual needs.

[0039] In this embodiment, the overall axis of the ultrasonic probe fixing part 3 is perpendicular to the axis of the pipeline 4 to be matched. This is conducive to the effective propagation of ultrasonic signals and the positioning of the installation position of the ultrasonic probe fixing part 3. The ultrasonic probe fixing part 3 is specifically an aluminum alloy ultrasonic probe slot seat, which is anodized with aluminum alloy. A heat exchange fluid channel 3-3 is integrally processed in the peripheral wall of the ultrasonic probe fixing part 3. The inlet and outlet ends of the heat exchange fluid channel 3-3 are respectively connected to the outlet and inlet ends of the cooling medium of the temperature control device 2. By utilizing the high thermal conductivity of the aluminum alloy of the ultrasonic probe fixing part 3, the residual heat in the slot seat is fully exchanged with the heat exchange fluid in the heat exchange fluid channel 3-3. The multi-turn solenoid structure of the heat exchange fluid channel 3-3 increases the heat exchange area between the heat exchange fluid and the ultrasonic probe slot seat 3, ensuring a low-temperature environment for the operation of the acoustic impedance matching medium and the ultrasonic transducer.

[0040] In this embodiment, the heat exchange fluid channel 3-3 is a unidirectional single-flow channel with a high surface area heat dissipation optimization structure. Specifically, the heat exchange fluid channel 3-3 is a spiral flow channel. It can also be a high surface area flow channel structure such as a closed-end leaf vein fractal flow channel. Any unidirectional single-flow channel with a high surface area heat dissipation optimization structure can be used in this application, wherein the high surface area heat dissipation optimization structure refers to a structure with a larger heat exchange area under the same conditions. This setting method can increase the heat exchange area, thereby improving the heat exchange effect. The heat exchange fluid channel 3-3 is specifically formed by directly processing the heat exchange fluid channel 3-3 integrally inside the ultrasonic probe fixing part 3 of the structural support. This can prevent insufficient heat exchange or thermal instability of the support structure due to inconsistent heat transfer coefficients when the structural support body and the heat exchange fluid channel cooperate under traditional heat exchange methods. The temperature control device 2 has a pre-set control program. Heat exchange fluid water or an organic liquid is added to the integrated heat exchange circulation channel formed by the temperature control device 2 and the heat exchange fluid channel 3-3. The heat exchange fluid circulates through the temperature control device 2 to achieve a constant ambient temperature in the ultrasonic transducer working chamber. The temperature control device 2 can specifically adopt a micro-circulation pump with a certain power. The power of the micro-circulation pump can circulate the heat exchange fluid, thereby ensuring the constant ambient temperature in the ultrasonic transducer working chamber. In this way, only the opening size of the ultrasonic probe fixing portion 3 and the matching probe containment structure 3-2 and double-lip sealing structure sealing ring 3-1 need to be preset to adapt to different ultrasonic imaging probes 5, thereby ensuring that the corresponding ultrasonic imaging probe 5 is in a stable operating state. At the same time, if the ultrasonic imaging probe 5 is damaged, the corresponding ultrasonic imaging probe 5 can be replaced. Compared with setting a cooling structure in the ultrasonic imaging probe 5, the effect is better, the cost is lower, and the adaptability is better.

[0041] In this embodiment, the ultrasonic probe fixing portion 3 has an axially extending opening on the end surface facing away from the pipeline 4 to be engaged, for engaging the ultrasonic imaging probe 5. By varying the size of the opening, ultrasonic imaging probes 5 of varying sizes can be accommodated within a certain range by varying the internal probe containment structure 3-2 and the dimensional parameters of the sealing portion.

[0042] In this embodiment, a probe containment structure 3-2 for holding an acoustic impedance matching medium is provided within the opening near the pipe 4 to be mated. A sealing portion for sealingly connecting the ultrasonic imaging probe 5 is provided on the side of the probe containment structure 3-2 away from the pipe 4 to be mated. The sealing portion is specifically a double-lip seal ring 3-1, whose inlet diameter is smaller than the outer diameter of the ultrasonic imaging probe 5. This seal is effectively secured and sealed to the ultrasonic imaging probe 5 through an interference fit. The double-lip seal ring 3-1 employs a double-layer structure with a radius that increases in steps from the inlet end toward the interior. This ensures effective securing and sealing of the ultrasonic imaging probe 5. Furthermore, the insertion resistance at the rear end is reduced, preventing excessive installation resistance throughout the entire process. This structure ensures both sealing and engagement stability while reducing installation resistance and improving convenience. The probe containment structure 3-2 and the double-lip seal ring 3-1, made of fluororubber, can contain the acoustic impedance matching medium and provide structural support for the ultrasonic probe.

[0043] During use, according to the different pipelines 4 to be matched, the corresponding pipeline fixing part 1 is selected to fix the interface to the pipeline 4 to be matched. The ultrasonic probe fixing part 3, which has been installed with the internal probe containing structure 3-2 and the double-lip sealing structure sealing ring 3-1, is inserted into the slot 1-2. Then, the ultrasonic imaging probe 5 is inserted into the probe containing structure 3-2. The temperature control device 2 is operated according to a predetermined program to ensure that the ultrasonic imaging probe 5, the probe containing structure 3-2, and the acoustic impedance matching medium are effectively cooled. This avoids the phenomenon that the acoustic impedance matching medium is prone to component decomposition or a sudden drop in viscosity at high temperature, resulting in acoustic impedance mismatch, interface contact degradation, and weakening of ultrasonic penetration efficiency, thereby ensuring effective and reliable monitoring.

[0044] This interface, through its modular design, can adapt to different pipelines 4 and different ultrasonic imaging probes 5, achieving a high degree of modularity and strong adaptability. By cooling the ultrasonic probe fixing portion 3, the problems of the ultrasonic imaging probe 5's poor adaptability to pipelines and its poor penetration under high-temperature conditions are resolved.

[0045] In the above description, the sensors, controllers and control programs that may be involved are all existing technologies and will not be described in detail.

[0046] The embodiments of the present invention disclosed above are intended only to illustrate the present invention. The embodiments do not describe all details in detail, nor do they limit the present invention to the specific embodiments described. Numerous modifications and variations are possible based on the contents of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention.

Claims

1. An ultrasonic probe interface suitable for high temperature working conditions, characterized in that: include: A pipeline fixing portion (1) is used to be fixed on the pipeline (4) to be matched, and one end surface is used for detachably connecting to an ultrasonic probe fixing portion (3), wherein the ultrasonic probe fixing portion (3) is used for detachably connecting to an ultrasonic imaging probe (5); The temperature control device (2) is coupled to the ultrasonic probe fixing part (3) and is used to cool the ultrasonic probe fixing part (3).

2. The ultrasonic probe interface suitable for high temperature working conditions according to claim 1, characterized in that: The pipeline fixing portion (1) is provided with a saddle clamp (1-1) for forming a bayonet for engaging with the pipeline (4) to be matched with the pipeline fixing portion (1).

3. The ultrasonic probe interface suitable for high temperature working conditions according to claim 2, characterized in that: The shape of the bayonet is adapted to the pipeline (4) to be matched, and the diameter of the bayonet is adjustable.

4. The ultrasonic probe interface suitable for high temperature working conditions according to claim 1, characterized in that: The overall axis of the ultrasonic probe fixing portion (3) is perpendicular to the axis of the pipeline (4) to be matched.

5. The ultrasonic probe interface suitable for high temperature working conditions according to claim 1 or 4, characterized in that: A heat exchange fluid channel (3-3) is integrally machined in the peripheral wall of the ultrasonic probe fixing portion (3), and the inlet and outlet ends of the heat exchange fluid channel (3-3) are respectively connected to the outlet and inlet ends of the cooling medium of the temperature control device (2).

6. The ultrasonic probe interface suitable for high temperature working conditions according to claim 5, characterized in that: The heat exchange fluid channel (3-3) is a unidirectional single-flow channel with a high surface area heat dissipation optimized structure.

7. An ultrasonic probe interface suitable for high temperature working conditions according to claim 1, 2, 3, 4 or 6, characterized in that: The ultrasonic probe fixing portion (3) is provided with an opening extending in the axial direction on the end face of one side away from the pipeline (4) to be matched, and is used for engaging the ultrasonic imaging probe (5).

8. The ultrasonic probe interface suitable for high temperature working conditions according to claim 7, characterized in that: A probe containing structure (3-2) for containing an acoustic impedance matching medium is provided in the opening near the side of the pipeline (4) to be matched.

9. The ultrasonic probe interface suitable for high temperature working conditions according to claim 8, characterized in that: A sealing portion for sealingly connecting the ultrasonic imaging probe (5) is provided on the side of the probe containing structure (3-2) away from the pipeline (4) to be matched.

10. The ultrasonic probe interface suitable for high temperature working conditions according to claim 9, characterized in that: The sealing portion is a double-lip sealing structure sealing ring (3-1), and the inlet diameter is smaller than the outer diameter of the ultrasonic imaging probe (5).

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