Processing method and device for dust falling in equipment, electronic equipment and storage medium
By calculating the dust loss index of the device and automatically triggering the cleaning mechanism, the problems of reducing heat dissipation efficiency and dust accumulation in high-performance thin-weight design of electronic devices such as portable computers are solved, and the stability and reliability of equipment performance are improved.
Patent Information
- Application Number
- CN202510472436.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-15
- Publication Date
- 2025-08-26
AI Technical Summary
In the process of pursuing high-performance and lightweight design, electronic devices such as portable computers have reduced heat dissipation efficiency and severe dust accumulation, which affects the performance and reliability of the equipment.
By obtaining the experimental running parameters of the equipment and real-time running parameters, calculating the dust drop index within the equipment, triggering the corresponding cleaning mechanism, such as automatic cleaning procedures or alarms, to reduce dust accumulation.
It effectively improves equipment maintenance efficiency, reduces performance degradation and failure risks caused by dust accumulation, and extends the service life of the equipment.
Smart Images

Figure CN120540929A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of data processing technology, and in particular to a method, device, electronic device, and storage medium for processing dust inside a device. Background Art
[0002] As the design of electronic devices such as portable computers continues to trend towards higher performance and thinner dimensions, their heat dissipation modules face the following challenges: On the one hand, the pursuit of extremely thin and light designs significantly reduces the surface area for heat dissipation, affecting heat dissipation efficiency. On the other hand, the use of high-performance components leads to a continuous increase in thermal design power consumption. Furthermore, the shrinking internal space of devices exacerbates dust accumulation, further impacting heat dissipation efficiency. Therefore, a technical solution to address heat dissipation and dust removal in electronic devices is urgently needed. Summary of the Invention
[0003] The present disclosure provides a method, device, electronic device and storage medium for processing dust falling inside a device, so as to at least solve the above technical problems existing in the prior art.
[0004] According to a first aspect of the present disclosure, a method for treating dust in a device is provided, the method comprising:
[0005] Obtain experimental operating parameters and real-time operating parameters of the equipment;
[0006] Determining a dust fall index inside the device according to the experimental operating parameters and / or the real-time operating parameters, wherein the dust fall index is used to characterize a degree of dust accumulation inside the device;
[0007] Based on the dust falling index, a cleaning mechanism corresponding to the dust falling index is triggered.
[0008] In one embodiment, the experimental operating parameters include the time required for the device to reach a stable heat dissipation state under different environmental conditions and the maximum speed of a fan in the device, and the real-time operating parameters include the operating time and average speed of the fan;
[0009] Determining a dust fall index inside the device according to the experimental operating parameters and the real-time operating parameters includes:
[0010] Obtain environmental characteristic parameters;
[0011] Based on the environmental characteristic parameters, determining the current environmental state of the device;
[0012] The dust index inside the device is determined based on the time required for the device to reach a stable heat dissipation state under the current environmental state, the operating time, the maximum rotation speed, and the average rotation speed of the fan.
[0013] In one embodiment, the real-time operating parameters include the operating temperatures of the central processing unit and the graphics processing unit, the total operating power consumption of the device, and the duty cycle of the fan;
[0014] Determining a dust index inside the device according to the real-time operating parameters includes:
[0015] Determine a CPU temperature change rate, a GPU temperature change rate, a device total power consumption change rate, and a fan duty cycle change rate based on the CPU's initial operating temperature and stable operating temperature, the GPU's initial operating temperature and stable operating temperature, the device's initial operating total power consumption and stable operating total power consumption, and the fan's initial operating duty cycle and stable operating duty cycle;
[0016] The dust falling index inside the device is determined according to the temperature change rate of the central processing unit, the temperature change rate of the graphics processing unit, the total power consumption change rate of the device, and the fan duty cycle change rate.
[0017] In one embodiment, determining the dust index inside the device according to the experimental operating parameters and the real-time operating parameters includes:
[0018] According to the experimental operating parameters, a dust fall index calculation model is constructed;
[0019] The real-time operating parameters are input into the dust falling index calculation model to obtain the dust falling index inside the device.
[0020] In one embodiment, the dust fall index calculation model is as shown in the following formula:
[0021]
[0022] Among them, DI represents the dust falling index, A, B, C, and D respectively represent the impact of total power consumption, GPU temperature, CPU temperature, and fan duty cycle on the dust falling index, P0, Pf, and Pz respectively represent the total power consumption in the initial state, stable total power consumption, and total power consumption in a specific environment; Tg0, Tgf, and Tgz respectively represent the GPU temperature in the initial state, stable temperature, and temperature in a specific environment; Tc0, Tcf, and Tcz respectively represent the CPU temperature in the initial state, stable temperature, and temperature in a specific environment; Duty0, Dutyf, and Dutyz respectively represent the fan duty cycle in the initial state, real-time duty cycle, and duty cycle in a specific environment.
[0023] In one embodiment, triggering a cleaning mechanism corresponding to the dust falling index based on the dust falling index includes:
[0024] If the dust falling index meets a first preset range, a cleaning procedure is triggered;
[0025] If the dust falling index meets the second preset range, a cleaning alarm indication is generated and sent to the client.
[0026] In one embodiment, the dust index inside the device is determined by the following formula based on the CPU temperature change rate, the GPU temperature change rate, the device total power consumption change rate, and the fan duty cycle change rate:
[0027]
[0028] Among them, DI represents the dust index, ΔT c Characterizes the CPU temperature change rate, ΔT g Indicates the temperature change rate of the graphics processor, ΔP indicates the total power consumption change rate of the device, and ΔD indicates the fan duty cycle change rate.
[0029] According to a second aspect of the present disclosure, a device for processing dust falling inside a device is provided, the device comprising:
[0030] Data acquisition module, used to obtain experimental operating parameters and real-time operating parameters of the equipment;
[0031] a calculation module, configured to determine a dust falling index inside the device based on the experimental operating parameters and / or the real-time operating parameters, wherein the dust falling index is used to characterize the degree of dust accumulation inside the device;
[0032] An execution module is used to trigger a cleaning mechanism corresponding to the dust falling index based on the dust falling index.
[0033] According to a third aspect of the present disclosure, there is provided an electronic device, including:
[0034] at least one processor; and
[0035] a memory communicatively connected to the at least one processor; wherein,
[0036] The memory stores instructions that can be executed by the at least one processor. The instructions are executed by the at least one processor to enable the at least one processor to perform the method described in the present disclosure.
[0037] According to a fourth aspect of the present disclosure, a non-transitory computer-readable storage medium storing computer instructions is provided, wherein the computer instructions are used to cause the computer to execute the method described in the present disclosure.
[0038] The disclosed method, device, equipment, and storage medium for handling dust accumulation within equipment determine the dust index within the equipment based on experimental and real-time operating parameters, thereby accurately assessing the degree of dust accumulation and automatically triggering the corresponding cleaning mechanism. This effectively improves equipment maintenance efficiency and significantly reduces the risk of performance degradation and failure caused by dust accumulation.
[0039] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0040] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings, in which several embodiments of the present disclosure are shown by way of example and not limitation, wherein:
[0041] In the drawings, the same or corresponding reference numerals denote the same or corresponding parts.
[0042] Figure 1 The schematic diagram shows the implementation process of the method for treating dust in the equipment according to the embodiment of the present disclosure. Figure 1 ;
[0043] Figure 2 The schematic diagram shows the implementation process of the method for treating dust in the equipment according to the embodiment of the present disclosure. Figure 2 ;
[0044] Figure 3 The schematic diagram shows the implementation process of the method for treating dust in the equipment according to the embodiment of the present disclosure. Figure 3 ;
[0045] Figure 4 A schematic diagram of the structure of a device for processing dust falling inside equipment according to an embodiment of the present disclosure is shown;
[0046] Figure 5 A schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION
[0047] To make the purposes, features, and advantages of the present disclosure more apparent and understandable, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present disclosure without creative work shall fall within the scope of protection of the present disclosure.
[0048] According to a first aspect of the embodiment of the present disclosure, a method for processing dust falling inside a device is provided, such as Figure 1 As shown, the method includes the following steps:
[0049] Step 101: Acquire experimental operating parameters and real-time operating parameters of the device.
[0050] Experimental operating parameters are obtained through a series of pre-set, controlled environment tests designed to simulate device performance under varying dust accumulation conditions. These parameters include, but are not limited to, total power consumption, temperature, and fan duty cycle. Real-time operating parameters are data collected in real time during actual device use, reflecting the device's current operating status, such as current CPU temperature, GPU temperature, total power consumption, and fan duty cycle.
[0051] Step 102: Determine a dust accumulation index inside the device according to the experimental operating parameters and / or the real-time operating parameters, where the dust accumulation index is used to characterize the degree of dust accumulation inside the device.
[0052] The dust index inside the device is determined using pre-collected experimental operating parameters and real-time operating parameters. The dust index is a quantitative indicator used to characterize the degree of dust accumulation inside the device. The current dust index can be accurately calculated using real-time operating parameters, or real-time operating parameters and experimental operating parameters.
[0053] Step 103: Based on the dust falling index, trigger a cleaning mechanism corresponding to the dust falling index.
[0054] This step triggers the appropriate cleaning mechanism based on the dust index. This cleaning mechanism can include reminding the user to perform manual cleaning, automatically starting built-in cleaning programs (such as fan acceleration and reverse blowing), or sending cleaning alerts to the user. The system will determine whether the dust index has reached a level that requires triggering the cleaning mechanism based on preset thresholds or rules. Once these thresholds are reached, the system will automatically trigger the corresponding cleaning mechanism to ensure the normal operation of the device and extend its service life.
[0055] According to another embodiment of the present disclosure, based on the dust falling index, a cleaning mechanism corresponding to the dust falling index is triggered, which can be specifically achieved through the following steps: if the dust falling index meets the first preset range, the cleaning program is triggered; if the dust falling index meets the second preset range, a cleaning alarm indication is generated and sent to the client.
[0056] If the dust index meets the first preset range, it indicates that the degree of dust accumulation inside the device has reached a level that requires cleaning measures, but has not yet seriously affected the normal operation of the device. At this time, the system will automatically trigger the cleaning program, such as increasing the fan speed, starting the reverse blowing function, etc. to remove some dust. If the dust index meets the second preset range, it indicates that the degree of dust accumulation inside the device is already serious, which may affect the performance, heat dissipation effect and even service life of the device. At this time, the system will generate a cleaning alarm indication and send it to the client. The cleaning alarm indication may include the current value of the dust index, recommended cleaning measures, possible maintenance needs, etc.
[0057] The specific values of the first preset range and the second preset range are related to actual needs and the method for determining the dust index, and are not specifically limited here.
[0058] According to another embodiment of the present disclosure, the experimental operating parameters in step 101 include the time required for the device to reach a stable heat dissipation state under different environmental conditions and the maximum speed of the fan in the device, and the real-time operating parameters include the operating time and average speed of the fan; based on the experimental operating parameters and the real-time operating parameters, the dust falling index inside the device is determined, which can be specifically achieved through the following steps: first, the environmental characteristic parameters are obtained; then, based on the environmental characteristic parameters, the current environmental state of the device is judged; and then, based on the time required for the device to reach a stable heat dissipation state under the current environmental state, the operating time, the maximum speed and the average speed of the fan, the dust falling index inside the device is determined.
[0059] A stable heat dissipation state refers to a state in which, after a period of operation in a specific working environment, the heat dissipation system (such as a fan) of the device can effectively dissipate the heat generated inside the device to the external environment, so that the temperature of the device remains within a relatively stable range and no longer changes significantly over time. First, in order to obtain the time required for the device to reach a stable heat dissipation state under different environmental conditions, experiments are conducted to simulate typical environmental conditions in real life. For example, an ordinary living environment, a pet home environment, an ordinary working environment, etc. A heat dissipation performance experiment is conducted in each simulated environment, and the time required for the device to reach a thermal equilibrium state from startup and the maximum speed of the fan are recorded.
[0060] Specifically, different environmental conditions can be simulated by configuring different ratios of dust and fiber. For example, to simulate a normal living environment, the ambient temperature is set at 25°C and the humidity range is between 50% and 80%. In this environment, the dust-to-fiber ratio is set at 40:60, with fine test dust accounting for 40% of the dust and fibers comprising 12mm nylon fiber (10%), 3mm polypropylene fiber (15%), 2mm nylon fiber (15%), and cotton fiber (20%).
[0061] Simulate an environment with pets at home: the ambient temperature is also set to 25°C, the humidity range is maintained at 50% to 80%, and the ratio of dust to fiber is adjusted to adapt to a high-fiber environment. In this scenario, the ratio is set to 20:80, of which the dust portion uses fine test dust accounting for 20%, and the fiber portion includes nylon fiber 12mm (accounting for 10%), polypropylene fiber 3mm (accounting for 15%), nylon fiber 2mm (accounting for 15%), cotton fiber (accounting for 20%), and long wool (length over 20mm, accounting for 20%). It is intended to more realistically reflect the higher proportion of fiber substances that may exist in a pet home environment.
[0062] In the above simulated environment, the device heat dissipation performance test was carried out respectively, and the time required for the device to reach a stable heat dissipation state from startup in each environmental state and the maximum speed reached by the fan under the experimental conditions were recorded.
[0063] In this embodiment, environmental characteristic parameters can be collected from data sources such as third-party devices (such as air detection equipment), environmental information associated with the IP address of the device, and weather forecasts. Based on the obtained environmental characteristic parameters, the current environmental state of the device is determined, such as whether it is an ordinary office environment, an ordinary living environment, or a high-fiber environment (such as having pets at home). After determining the current environmental state of the device, the stabilization time and maximum speed corresponding to the current environmental state are found from the time required for the device to reach a stable heat dissipation state under different environmental states obtained in advance through experiments. The average speed and running time of the fan during this operation of the device are also obtained. Finally, the dust index inside the device is determined by the following formula (1):
[0064]
[0065] Where DIx is the dust index inside the device; τx is the fan operating time during this operation; τT is the stabilization time corresponding to the device's current environmental state; Rmax is the maximum speed corresponding to the device's current environmental state; and Rx is the average fan speed during this operation.
[0066] In one embodiment, if the device has been used before and the corresponding dust falling index has been determined, such as DI1, DI2, DI3, etc., then the final dust falling index should be the cumulative amount DI of the current dust falling index plus the historical dust falling index.
[0067] When the dust index is determined using the method of this embodiment, based on the dust index, the first preset range in the cleaning mechanism corresponding to the dust index can be set to 0.5 to 0.9, and the second preset range can be set to greater than 0.9. That is, if the dust index is less than 0.5, it indicates that the device is in a normal state and no intervention is required. If the dust index falls within the range of 0.5 to 0.9, it indicates that there may be mild dust accumulation on the device, and the cleaning program can be automatically triggered, such as automatically increasing the fan speed to enhance the cleaning effect. If the dust index is greater than 0.9, it indicates that there may be moderate to heavy dust accumulation on the device, and a cleaning alarm indication is generated and sent to the client to remind the user to clean the device in time.
[0068] This embodiment simulates multiple environmental conditions to obtain key parameters such as the device's heat dissipation stabilization time and the maximum fan speed, and combines external conditions such as real-time operating parameters and environmental characteristic parameters to determine the device's internal dust index. This embodiment can comprehensively consider the impact of environmental differences on device heat dissipation and internal dust accumulation, and provide a more accurate and real-time assessment of the dust situation within the device.
[0069] According to another embodiment of the present disclosure, the real-time operating parameters include the operating temperatures of the central processing unit (CPU) and the graphics processing unit (GPU), the total operating power consumption of the device, and the operating duty cycle of the fan; based on the real-time operating parameters, the dust falling index inside the device is determined, which can be specifically achieved through the following steps: based on the initial operating temperature value and stable operating temperature value of the CPU, the initial operating temperature value and stable operating temperature value of the GPU, the initial operating total power consumption and stable operating total power consumption of the device, and the initial operating duty cycle and stable operating duty cycle of the fan, determine the CPU temperature change rate, GPU temperature change rate, device total power consumption change rate, and fan duty cycle change rate; based on the CPU temperature change rate, GPU temperature change rate, device total power consumption change rate, and fan duty cycle change rate, determine the dust falling index inside the device.
[0070] During the operation of the device, the operating temperatures of the CPU and GPU, the operating power consumption of the device, and the duty cycle of the fan are obtained respectively. Specifically, taking the CPU operating temperature as an example, after the device is running, the initial operating temperature of the CPU is obtained. Then, when the device performs a heavy-load task, its internal temperature will gradually rise. After a period of operation, the cooling system (fan) will control the temperature within a certain range, and the temperature at this time, that is, the temperature after the heavy-load operation is stable, is obtained as the stable operating temperature. The time interval from obtaining the initial operating temperature to obtaining the stable operating temperature is recorded. The CPU temperature change rate can be obtained by dividing the temperature change between the stable operating temperature and the initial operating temperature by the time interval. Specifically, the CPU temperature change rate can be determined by the following formula (2):
[0071]
[0072] Where, ΔT c is the CPU temperature change rate, T c0 is the initial operating temperature of the CPU, T cf is the stable operating temperature of the CPU, τ c is the time interval.
[0073] Similarly, the initial operating temperature and stable operating temperature of the GPU, the initial operating power consumption and stable operating power consumption of the device, and the initial operating duty cycle and stable operating duty cycle of the fan are obtained, and the GPU temperature change rate, power consumption change rate, and fan duty cycle change rate are determined by the following formulas (3), (4), and (5), respectively:
[0074]
[0075] Where, ΔT g is the GPU temperature change rate, T g0 is the initial operating temperature of the GPU, T gf is the stable operating temperature of the GPU, τ g is the time interval.
[0076]
[0077] Among them, ΔP is the power consumption change rate, P0 is the initial operation power consumption, P f To stabilize the power consumption, τ p is the time interval.
[0078]
[0079] Among them, ΔD is the fan duty cycle change rate, D0 is the fan's initial duty cycle, D f Stable operating duty cycle, τ d is the time interval.
[0080] In one embodiment, the dust index inside the device is determined by the following formula (6) based on the CPU temperature change rate, the GPU temperature change rate, the device power consumption change rate, and the fan duty cycle change rate:
[0081]
[0082] Among them, DI represents the dust index, ΔT c Characterizes the CPU temperature change rate, ΔT g Indicates the GPU temperature change rate, ΔP indicates the device power consumption change rate, and ΔD indicates the fan duty cycle change rate.
[0083] This example combines the temperature change rate, power consumption change rate, and fan duty cycle change rate to assess the impact of dust on the cooling system. Dust accumulation reduces cooling efficiency, causing the CPU and GPU temperatures to rise faster at the same power consumption, and requiring a higher fan duty cycle to maintain temperatures. Therefore, a high dust index (DI) indicates a high level of dust accumulation.
[0084] When the dust index is determined using the method of this embodiment, based on the dust index, the first preset range in the cleaning mechanism corresponding to the dust index can be set to 1 to 2, and the second preset range can be set to greater than 2. That is, if the dust index is less than 1, it indicates that the device is in a normal state and no intervention is required. If the dust index falls between 1 and 2, it indicates that there may be mild dust accumulation on the device, and the cleaning program can be automatically triggered, such as automatically increasing the fan speed to enhance the cleaning effect. If the dust index is greater than 2, it indicates that there may be moderate to heavy dust accumulation on the device, and a cleaning alarm indication is generated and sent to the client to remind the user to clean the device in time.
[0085] According to another embodiment of the present disclosure, the dust falling index inside the equipment is determined based on the experimental operating parameters and the real-time operating parameters, which can be specifically achieved through the following steps: constructing a dust falling index calculation model based on the experimental operating parameters; substituting the real-time operating parameters into the dust falling index calculation model to obtain the dust falling index inside the equipment.
[0086] In one embodiment, the dust index calculation model is shown in the following formula (7):
[0087]
[0088] Among them, DI represents the dust falling index, A, B, C, and D respectively represent the impact of total power consumption, GPU temperature, CPU temperature, and fan duty cycle on the dust falling index, P0, Pf, and Pz respectively represent the total power consumption in the initial state, stable total power consumption, and total power consumption in a specific environment; Tg0, Tgf, and Tgz respectively represent the GPU temperature in the initial state, stable temperature, and temperature in a specific environment; Tc0, Tcf, and Tcz respectively represent the CPU temperature in the initial state, stable temperature, and temperature in a specific environment; Duty0, Dutyf, and Dutyz respectively represent the fan duty cycle in the initial state, real-time duty cycle, and duty cycle in a specific environment.
[0089] First, a dust fall index calculation model is constructed based on the experimental operating parameters:
[0090] The experimental operating parameters are obtained through a series of experimental tests. These parameters reflect the performance of the equipment in different environments and conditions, providing basic data and reference for building the dust index calculation model. Specifically, the process of obtaining the experimental operating parameters and building the model is as follows:
[0091] like Figure 2 As shown, before the dustproof test, a new machine is tested under a baking condition, and various parameters in the initial state of the device are recorded, including the CPU temperature value Tc0, the GPU temperature value Tg0, the ambient temperature value Ta0, the total power consumption P0, and the fan duty cycle Duty0. Then, after using a meltblown non-woven fabric (such as 0.2mm thick) to seal the fan's upper air inlet and fin outlet, various parameters in the specific environment are recorded, including the CPU temperature value Tcz, the GPU temperature value Tgz, the ambient temperature value Taz, the total power consumption Pz, and the fan duty cycle Dutyz.
[0092] Perform dustproof tests on devices in simulated environments (such as normal environments and high-fiber environments). Run the device until heat dissipation stabilizes. Record a series of stable parameters, including the CPU temperature Tcf, GPU temperature Tgf, ambient temperature Taf, total power consumption Pf, fan duty cycle Duty, and the time τ to reach stable parameters.
[0093] Initial testing was completed using a standard environment. The initial dust index (DI) was set to 0, indicating no dust accumulation inside the device. After blocking with non-woven fabric, the DI reached 1, indicating extreme blockage. After the standard environment curve stabilized, the DI reached 0.9, indicating a stable state under certain dust accumulation conditions. DI values corresponding to different preset time points (e.g., 0.25τ, 0.5τ, 0.75τ, and 1τ) were set to 0.3, 0.5, 0.8, and 0.9, respectively.
[0094] The above formula (7) is used as the dust index calculation model, where the ambient temperature correction is to remove the difference between the ambient temperature and the standard test temperature of 25°C.
[0095] Substituting the DI values corresponding to the preset time points (the parameters obtained during the test) into the above formula, a system of four quartic equations is obtained, which can be solved to obtain the four dimensionless coefficients A, B, C, and D. At this point, all parameters and coefficients in the model have been determined, thus completing the construction of the dust index calculation model.
[0096] Obtain the real-time operating parameters of the device during operation and substitute them into the dust index calculation model to obtain the device's dust index. Real-time operating parameters are parameters collected in real time during the device's actual operation and reflect the device's current operating status. Substituting these real-time parameters into the established dust index calculation model can calculate the current dust index inside the device. The specific process is as follows:
[0097] After using the device for a period of time, in a high-power consumption scenario (similar to a dual-baking scenario), the system will record corresponding parameters, such as the current CPU temperature, GPU temperature, total power consumption, and fan duty cycle. These parameters are real-time operating parameters.
[0098] Substitute the collected real-time operating parameters into the established dust index calculation model to obtain the current dust index DI inside the equipment.
[0099] Through the above two steps, the dust index calculation model is constructed using the experimental operating parameters. Then, the real-time operating parameters are substituted into the model to accurately determine the dust index inside the equipment, thereby providing a basis for judging the dust accumulation situation of the equipment and taking corresponding cleaning measures.
[0100] When the dust index is determined using the method of this embodiment, Figure 3 As shown, when the total power consumption P is less than Pz, or the CPU temperature Tc is greater than Tcz, or the GPU temperature Tg is greater than Tgz, the user is immediately reminded to check the amount of dust. Based on the dust index, the first preset range in the cleaning mechanism corresponding to the dust index can be set to 0.5 to 0.8, and the second preset range can be set to greater than 0.8. That is, if the dust index is less than 0.5, it indicates that the device is in a normal state and no intervention is required. If the dust index falls within 0.5 to 0.8, it indicates that there may be mild dust accumulation on the device, and the cleaning program can be automatically triggered, such as automatically increasing the fan speed to enhance the cleaning effect. If the dust index is greater than 0.8, it indicates that there may be moderate to heavy dust accumulation on the device, and a cleaning alarm indication is generated and sent to the client to remind the user to clean the device in time.
[0101] According to another aspect of the present disclosure, a device for processing dust falling inside a device is provided. Figure 4 As shown, the device includes:
[0102] Data acquisition module 401, used to obtain experimental operating parameters and real-time operating parameters of the equipment;
[0103] A calculation module 402 is configured to determine a dust accumulation index inside the device based on the experimental operating parameters and / or the real-time operating parameters, wherein the dust accumulation index is used to represent a degree of dust accumulation inside the device;
[0104] The execution module 403 is configured to trigger a cleaning mechanism corresponding to the dust falling index based on the dust falling index.
[0105] According to another embodiment of the present disclosure, the experimental operating parameters include the time required for the device to reach a stable heat dissipation state under different environmental conditions and the maximum speed of the fan in the device, and the real-time operating parameters include the operating time and average speed of the fan; the calculation module 402 is also used to obtain environmental characteristic parameters; based on the environmental characteristic parameters, the current environmental state of the device is judged; according to the time required for the device to reach a stable heat dissipation state under the current environmental state, the operating time, maximum speed and average speed of the fan, the dust falling index inside the device is determined.
[0106] According to another embodiment of the present disclosure, the real-time operating parameters include the operating temperatures of the central processing unit and the graphics processing unit, the total operating power consumption of the device, and the operating duty cycle of the fan; the calculation module 402 is also used to determine the central processing unit temperature change rate, the graphics processing unit temperature change rate, the device total power consumption change rate, and the fan duty cycle change rate based on the initial operating temperature and stable operating temperature of the central processing unit, the initial operating temperature and stable operating temperature of the graphics processing unit, the initial operating total power consumption and stable operating total power consumption of the device, and the initial operating duty cycle and stable operating duty cycle of the fan; determine the dust falling index inside the device based on the central processing unit temperature change rate, the graphics processing unit temperature change rate, the device total power consumption change rate, and the fan duty cycle change rate.
[0107] According to another embodiment of the present disclosure, the calculation module 402 is further used to construct a dust falling index calculation model based on the experimental operating parameters; input the real-time operating parameters into the dust falling index calculation model to obtain the dust falling index inside the device.
[0108] According to another embodiment of the present disclosure, the execution module 403 is further configured to trigger a cleaning program if the dust falling index meets a first preset range; and generate a cleaning alarm indication and send it to the client if the dust falling index meets a second preset range.
[0109] According to an embodiment of the present disclosure, the present disclosure also provides an electronic device and a readable storage medium.
[0110] Figure 5A schematic block diagram of an example electronic device 800 that can be used to implement embodiments of the present disclosure is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital assistants, cellular phones, smartphones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are provided as examples only and are not intended to limit the implementation of the present disclosure described and / or claimed herein.
[0111] like Figure 5 As shown, the device 800 includes a computing unit 801, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 802 or a computer program loaded from a storage unit 808 into a random access memory (RAM) 803. Various programs and data required for the operation of the device 800 can also be stored in the RAM 803. The computing unit 801, the ROM 802, and the RAM 803 are connected to each other via a bus 804. An input / output (I / O) interface 805 is also connected to the bus 804.
[0112] Various components in device 800 are connected to I / O interface 805, including an input unit 806, such as a keyboard, mouse, etc.; an output unit 807, such as various types of displays, speakers, etc.; a storage unit 808, such as a magnetic disk, optical disk, etc.; and a communication unit 809, such as a network card, modem, wireless communication transceiver, etc. The communication unit 809 allows device 800 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.
[0113] The computing unit 801 can be various general-purpose and / or specialized processing components with processing and computing capabilities. Some examples of the computing unit 801 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units that run machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The computing unit 801 performs the various methods and processes described above, such as a method for processing dust falling within the device. For example, in some embodiments, the method for processing dust falling within the device can be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as a storage unit 808. In some embodiments, part or all of the computer program can be loaded and / or installed on the device 800 via the ROM 802 and / or the communication unit 809. When the computer program is loaded into the RAM 803 and executed by the computing unit 801, one or more steps of the method for processing dust falling within the device described above can be performed. Alternatively, in other embodiments, the computing unit 801 may be configured to execute a method for processing dust falling into the device in any other appropriate manner (for example, by means of firmware).
[0114] Various embodiments of the systems and techniques described above can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on a chip (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.
[0115] The program code for implementing the method of the present disclosure can be written in any combination of one or more programming languages. These program codes can be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device so that when the program code is executed by the processor or controller, the functions / operations specified in the flow chart and / or block diagram are implemented. The program code can be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.
[0116] In the context of the present disclosure, a machine-readable medium can be a tangible medium that can contain or store a program for use by or in conjunction with an instruction execution system, device or equipment. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium can include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
[0117] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).
[0118] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer having a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include a local area network (LAN), a wide area network (WAN), and the Internet.
[0119] A computer system may include a client and a server. The client and server are generally remote from each other and typically interact through a communication network. The client-server relationship arises through computer programs running on the respective computers and having a client-server relationship with each other. The server may be a cloud server, a server in a distributed system, or a server integrated with a blockchain.
[0120] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this disclosure can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved. This is not limited herein.
[0121] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout the present disclosure, "plurality" means two or more, unless otherwise specifically defined.
[0122] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.
Claims
1. A method for treating dust in equipment, characterized in that: The method comprises: Obtain experimental operating parameters and real-time operating parameters of the equipment; Determining a dust fall index inside the device according to the experimental operating parameters and / or the real-time operating parameters, wherein the dust fall index is used to characterize a degree of dust accumulation inside the device; Based on the dust falling index, a cleaning mechanism corresponding to the dust falling index is triggered.
2. The method according to claim 1, characterized in that The experimental operating parameters include the time required for the device to reach a stable heat dissipation state under different environmental conditions and the maximum speed of the fan in the device. The real-time operating parameters include the operating time and average speed of the fan; Determining a dust fall index inside the device according to the experimental operating parameters and the real-time operating parameters includes: Obtain environmental characteristic parameters; Based on the environmental characteristic parameters, determining the current environmental state of the device; The dust index inside the device is determined based on the time required for the device to reach a stable heat dissipation state under the current environmental state, the operating time, the maximum rotation speed, and the average rotation speed of the fan.
3. The method according to claim 1, characterized in that The real-time operating parameters include the operating temperatures of the central processing unit and the graphics processing unit, the total operating power consumption of the device, and the duty cycle of the fan; Determining a dust index inside the device according to the real-time operating parameters includes: Determine a CPU temperature change rate, a GPU temperature change rate, a device total power consumption change rate, and a fan duty cycle change rate based on the CPU's initial operating temperature and stable operating temperature, the GPU's initial operating temperature and stable operating temperature, the device's initial operating total power consumption and stable operating total power consumption, and the fan's initial operating duty cycle and stable operating duty cycle; The dust falling index inside the device is determined according to the temperature change rate of the central processing unit, the temperature change rate of the graphics processing unit, the total power consumption change rate of the device, and the fan duty cycle change rate.
4. The method according to claim 1, wherein Determining a dust fall index inside the device according to the experimental operating parameters and the real-time operating parameters includes: According to the experimental operating parameters, a dust fall index calculation model is constructed; The real-time operating parameters are input into the dust falling index calculation model to obtain the dust falling index inside the device.
5. The method according to claim 4, characterized in that The dust index calculation model is shown in the following formula: Among them, DI represents the dust falling index, A, B, C, and D respectively represent the impact of total power consumption, GPU temperature, CPU temperature, and fan duty cycle on the dust falling index, P0, Pf, and Pz respectively represent the total power consumption in the initial state, stable total power consumption, and total power consumption in a specific environment; Tg0, Tgf, and Tgz respectively represent the GPU temperature in the initial state, stable temperature, and temperature in a specific environment; Tc0, Tcf, and Tcz respectively represent the CPU temperature in the initial state, stable temperature, and temperature in a specific environment; Duty0, Dutyf, and Dutyz respectively represent the fan duty cycle in the initial state, real-time duty cycle, and duty cycle in a specific environment.
6. The method according to claim 1, characterized in that The triggering of a cleaning mechanism corresponding to the dust falling index based on the dust falling index includes: If the dust falling index meets a first preset range, a cleaning procedure is triggered; If the dust falling index meets the second preset range, a cleaning alarm indication is generated and sent to the client.
7. The method according to claim 3, characterized in that The dust index inside the device is determined by the following formula based on the CPU temperature change rate, the GPU temperature change rate, the device total power consumption change rate, and the fan duty cycle change rate: Among them, DI represents the dust index, ΔT c Characterizes the CPU temperature change rate, ΔT g Indicates the temperature change rate of the graphics processor, ΔP indicates the total power consumption change rate of the device, and ΔD indicates the fan duty cycle change rate.
8. A device for processing dust falling inside equipment, characterized in that: The device comprises: Data acquisition module, used to obtain experimental operating parameters and real-time operating parameters of the equipment; a calculation module, configured to determine a dust falling index inside the device based on the experimental operating parameters and / or the real-time operating parameters, wherein the dust falling index is used to characterize the degree of dust accumulation inside the device; An execution module is used to trigger a cleaning mechanism corresponding to the dust falling index based on the dust falling index.
9. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 7.
10. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to enable a computer to execute the method according to any one of claims 1 to 7.