Intelligent chip heat dissipation structure and method based on aluminum nitride precision ceramic

Abstract

The invention belongs to the technical field of chips, and particularly relates to an intelligent chip heat dissipation structure and method based on aluminum nitride precision ceramics, the bottom of an aluminum nitride ceramic substrate is arranged at the top of a chip, and a plurality of uniformly distributed heat dissipation fins are fixedly mounted at the top of the aluminum nitride ceramic substrate; a driving assembly is arranged on the upper sides of the heat dissipation fins, a carrier plate is connected to the driving assembly, a plurality of evenly-distributed scraping blocks are fixedly connected to the bottom of the carrier plate, and the scraping blocks are inserted into cracks of the heat dissipation fins. A lead screw motor drives a lead screw to rotate, so that a lead screw sliding block is driven to move, a carrier plate can be driven to move, then a scraping block is driven to move, the scraping block can scrape away dust attached to fins, the fins are cleaned, and the service life of the fins is prolonged. Therefore, the situation that the heat dissipation efficiency is affected by dust accumulation is avoided, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The present invention relates to the field of chip technology, and in particular to a smart chip heat dissipation structure and method based on aluminum nitride precision ceramics. Background Art

[0002] Smart chips are the core hardware driving the development of cutting-edge technologies such as artificial intelligence, the Internet of Things, and autonomous driving. Their core value lies in achieving high-performance computing in specific scenarios through architectural innovation and computing power optimization.

[0003] Existing smart devices use chips for control during use. During installation and use, chips generate a large amount of heat, which requires heat dissipation. Currently, heat dissipation is achieved by installing a heat dissipation structure on the chip surface. Most existing chip heat dissipation structures are simple heat conducting plates attached to the chip surface to conduct heat. Fins are also provided on the heat conducting plates to improve the heat dissipation effect. However, during actual use, dust invades and adheres to the surface of the heat dissipation fins, thus affecting its heat dissipation performance. It is also inconvenient to regularly clean the heat dissipation fins with a cleaning assembly. Therefore, a new technical solution is needed to solve this problem. Summary of the Invention

[0004] The purpose of the present invention is to provide a smart chip heat dissipation structure and method based on aluminum nitride precision ceramics, which solves the problem mentioned in the background art that it is inconvenient to regularly clean the heat dissipation fins with the help of a cleaning component.

[0005] To achieve the above objectives, the present invention provides the following technical solutions: a heat dissipation structure for a smart chip based on aluminum nitride precision ceramics, comprising an aluminum nitride ceramic substrate, the bottom of which is disposed on top of the chip, and a plurality of evenly distributed heat dissipation fins fixedly mounted on the top of the aluminum nitride ceramic substrate;

[0006] A driving assembly is provided on the upper side of the heat dissipation fins, a carrier plate is connected to the driving assembly, a plurality of evenly distributed scraping blocks are fixedly connected to the bottom of the carrier plate, and the plurality of scraping blocks are inserted into the gaps between the plurality of heat dissipation fins. The driving assembly is used to drive the carrier plate to move.

[0007] By adopting the above technical solution, when there is a lot of dust between the heat sink fins after long-term use, the starting drive component can drive the carrier plate to move, thereby driving the scraper to move, and thus using the scraper to scrape off the dust on the heat sink fins, which is beneficial to avoid the situation where too much dust adheres and affects the heat dissipation effect, and thus is beneficial to improving the heat dissipation effect of the chip.

[0008] As a preferred embodiment of the present invention, the drive assembly includes a fixed plate, a sliding cavity is opened at the bottom of the fixed plate, a screw is rotatably installed on the inner wall of the sliding cavity, a screw motor is fixedly installed at one end of the fixed plate, a transmission shaft of the screw motor movably passes through the fixed plate and is fixedly connected to one end of the screw, an outer wall of the screw is covered with an adaptive screw slider, and the bottom of the screw slider is fixedly connected to the carrier plate.

[0009] By adopting the above technical solution, the screw motor drives the screw to rotate, thereby driving the screw slider to move, thereby driving the carrier plate to move, and further driving the scraper to move to scrape and clean the heat dissipation fins.

[0010] As a preferred embodiment of the present invention, it also includes a dust collection component, which includes a negative pressure component. The negative pressure component is installed on the top of the fixed plate, and the negative pressure end of the negative pressure component is fixedly connected to a negative pressure pipe. The outer end of the negative pressure pipe is fixedly connected to a first one-way valve, and the outer end of the first one-way valve is fixedly connected to a collection shell. The collection shell is fixed to one end of the aluminum nitride ceramic substrate, and the inner cavity of the collection shell is fixed with a filter mesh plate, and one side wall of the collection shell is fixedly connected to a plurality of evenly distributed collection short tubes.

[0011] By adopting the above technical solution, in the initial state, the scraper block is at one end away from the collection shell, and then the scraper block moves to scrape the dust on the heat sink fins. When it moves close to the collection shell, the negative pressure component can form a negative pressure in the inner cavity of the collection shell, thereby forming a negative pressure in the collection short tube, so that the dust can be collected into the inner cavity of the collection shell, which is beneficial to prevent the dust from flying and falling onto the heat sink fins again, and is beneficial to improving the cleaning effect.

[0012] As a preferred embodiment of the present invention, the negative pressure assembly includes a cylinder, which is fixed to the top of the fixed plate, and the inner cavity of the cylinder is provided with an adaptive piston, and one side wall of the piston is fixedly connected to a push rod, and the outer end of the push rod movably passes through the cylinder and is fixedly connected to a connecting block, and both ends of the connecting block are fixed with connecting plates, and the tail end of the connecting plate is fixed with a cross plate, and the cross plate is connected to the screw slider.

[0013] By adopting the above technical solution, the movement of the screw slider can drive the cross plate to move, thereby driving the push rod to move, thereby driving the piston to move, so that the piston creates negative pressure in the cylinder, thereby creating negative pressure in the collection shell.

[0014] As a preferred embodiment of the present invention, a limiting slot is provided on the inner side wall of the transverse plate, an adapted limiting slider is inserted into the inner cavity of the limiting slot, and the outer wall of the limiting slider is fixedly connected to the screw slider.

[0015] By adopting the above technical solution, when the screw slider moves back, the total length of the screw slider is the sum of the exposed length of the push rod and the sliding track length of the limit slider, thereby ensuring that the screw slider is not obstructed in resetting. Similarly, there is no spatial obstacle when the screw slider moves outward.

[0016] As a preferred embodiment of the present invention, the tail end of the cylinder is fixedly connected to a second one-way valve.

[0017] By adopting the above technical solution, the second one-way valve is set so that when the piston moves back, the second one-way valve is used to release pressure, and the first one-way valve can prevent gas from entering the collection shell along the conduit, thereby preventing gas from entering the collection shell and blowing back dust.

[0018] As a preferred embodiment of the present invention, mounting brackets are fixed on both sides of the two side walls of the aluminum nitride ceramic substrate, and mounting holes are opened on both sides of the surface of the mounting brackets.

[0019] By adopting the above technical solution, mounting holes are provided on both sides of the surface of the mounting frame. The arrangement of the mounting frame makes it convenient to install and fix the entire device.

[0020] As a preferred embodiment of the present invention, a plurality of evenly distributed bumps are fixed to the bottom of the aluminum nitride ceramic substrate, the bottoms of the bumps are attached to the top of the chip, and silicone grease is filled between the aluminum nitride ceramic substrate and the chip.

[0021] By adopting the above technical solution and using silicone grease for heat conduction, it is beneficial to improve the effect of the chip in transferring heat to the aluminum nitride ceramic substrate, thereby improving the heat dissipation effect.

[0022] The present invention also relates to a method for heat dissipation of a smart chip based on aluminum nitride precision ceramics, comprising the following steps:

[0023] Step 1: In the initial state, the scraper moves to one end away from the collection shell. Then, when the heat sink fins need to be cleaned after long-term use, the screw motor drives the screw to rotate, thereby driving the screw slider to move, thereby driving the carrier plate to move, and then driving the scraper to move to scrape and clean the heat sink fins;

[0024] Step 2: The movement of the screw slider can drive the cross plate to move, thereby driving the push rod to move, thereby driving the piston to move, so that the piston creates a negative pressure in the cylinder, which can create a negative pressure in the inner cavity of the collection shell, thereby creating a negative pressure in the collection short tube, so that the dust can be collected into the inner cavity of the collection shell.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] The present invention drives the screw to rotate by a screw motor, thereby driving the screw slider to move, thereby driving the carrier plate to move, and further driving the scraper to move, so that the scraper can scrape off the dust adhered to the fins, thereby cleaning the fins, thereby preventing dust accumulation from affecting the heat dissipation efficiency and improving the heat dissipation effect;

[0027] The dust collecting assembly can be driven to work by the screw slider during its movement, so that the push rod drives the piston to move, thereby forming a negative pressure in the inner cavity of the cylinder, and indirectly forming a negative pressure in the inner cavity of the collection shell. In the process of the scraper pushing the dust to one end, when it is pushed close to the collection short tube, the negative pressure can be used to suck the dust into the inner cavity of the collection shell for collection, which is beneficial to prevent the dust from flying and falling onto the fins again, which is beneficial to improve the cleaning effect.

[0028] The scraper block also includes a movable block, which is pushed against the inner wall of the fin by a spring. When the movable block is worn, the spring can push the movable block to move to achieve an automatic position, thereby ensuring the fit during scraping, which is beneficial to ensuring the scraping effect, and the automatic position is beneficial to extending the service life of the scraper block. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Other features, objects and advantages of the present invention will become more apparent upon reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0030] Figure 1 This is a schematic diagram of the overall structure of a smart chip heat dissipation structure based on aluminum nitride precision ceramics according to the present invention;

[0031] Figure 2 This is a schematic front view of a heat dissipation structure of a smart chip based on aluminum nitride precision ceramics according to the present invention;

[0032] Figure 3 This is a schematic diagram of the structure of a dust collection component of a smart chip heat dissipation structure based on aluminum nitride precision ceramics according to the present invention;

[0033] Figure 4 This is a schematic cross-sectional view of a dust collection component of a smart chip heat dissipation structure based on aluminum nitride precision ceramics according to the present invention;

[0034] Figure 5 This is a schematic diagram of the cleaning component structure of a smart chip heat dissipation structure based on aluminum nitride precision ceramics according to the present invention;

[0035] Figure 6 This is a schematic diagram of the cross-sectional structure of a scraper block of an intelligent chip heat dissipation structure based on aluminum nitride precision ceramics according to the present invention.

[0036] In the picture:

[0037] 1. Aluminum nitride ceramic substrate; 11. Heat sink fins; 12. Mounting frame; 13. Bump; 14. Silicone grease; 15. Chip;

[0038] 2. Fixed plate; 21. Connecting frame; 22. Screw motor; 23. Carrier plate; 24. Scraper; 25. Screw; 26. Screw slider;

[0039] 3. Cylinder; 31. Push rod; 32. Conduit; 33. Collection shell; 34. Collection short tube; 35. Piston; 36. Filter plate;

[0040] 4. Connecting block; 41. Connecting plate; 42. Horizontal plate; 43. Limiting slider. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0042] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0043] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "set" should be understood in a broad sense. For example, they can refer to fixed connection or set, detachable connection or set, or integral connection or set. A person of ordinary skill in the art will understand the specific meanings of the above terms in the present invention in specific circumstances. The models of electrical appliances provided in the present invention are for reference only, and different models of electrical appliances with the same functions can be replaced according to actual usage.

[0044] See also Figure 1-6 The present invention provides a technical solution: a heat dissipation structure for a smart chip based on aluminum nitride precision ceramics, comprising an aluminum nitride ceramic substrate 1, the bottom of which is arranged on the top of a chip 15, and a plurality of evenly distributed heat dissipation fins 11 are fixedly mounted on the top of the aluminum nitride ceramic substrate 1;

[0045] A driving assembly is provided on the upper side of the heat dissipation fins 11, and a carrier plate 23 is connected to the driving assembly. A plurality of evenly distributed scraping blocks 24 are fixedly connected to the bottom of the carrier plate 23. The plurality of scraping blocks 24 are inserted into the gaps between the plurality of heat dissipation fins 11. The driving assembly is used to drive the carrier plate 23 to move.

[0046] It should be understood that in actual use, when there is a lot of dust between the heat sink fins 11 after long-term use, the starting drive component can drive the carrier 23 to move, thereby driving the scraper 24 to move, and thus using the scraper 24 to scrape off the dust on the heat sink fins 11, which is beneficial to avoid the situation where too much dust adheres and affects the heat dissipation effect, and thus is beneficial to improving the heat dissipation effect of the chip 15.

[0047] Furthermore, a plurality of evenly distributed bumps 13 are fixed to the bottom of the aluminum nitride ceramic substrate 1 , the bottoms of the bumps 13 are attached to the tops of the chip 15 , and silicone grease 14 is filled between the aluminum nitride ceramic substrate 1 and the chip 15 .

[0048] It should be understood that the use of the silicone grease 14 for heat conduction is beneficial to improving the effect of the chip 15 transferring heat to the aluminum nitride ceramic substrate 1, thereby improving the heat dissipation effect.

[0049] Furthermore, mounting brackets 12 are fixed on both sides of the two side walls of the aluminum nitride ceramic substrate 1 , and mounting holes are provided on both sides of the surface of the mounting brackets 12 . The arrangement of the mounting brackets 12 facilitates the installation and fixation of the entire device.

[0050] like Figure 1 and 5 As shown; the driving assembly includes a fixed plate 2, a sliding cavity is opened at the bottom of the fixed plate 2, a screw 25 is rotatably installed on the inner wall of the sliding cavity, a screw motor 22 is fixedly installed at one end of the fixed plate 2, the transmission shaft of the screw motor 22 movably passes through the fixed plate 2 and is fixedly connected to one end of the screw 25, the outer wall of the screw 25 is covered with an adaptive screw slider 26, and the bottom of the screw slider 26 is fixedly connected to the carrier plate 23.

[0051] It should be understood that the screw motor 22 drives the screw 25 to rotate, thereby driving the screw slider 26 to move, thereby driving the carrier plate 23 to move, and further driving the scraper 24 to move to scrape and clean the heat dissipation fins 11.

[0052] Furthermore, connecting frames 21 are fixed on both sides of the two side walls of the fixing plate 2 , and the outer ends of the connecting frames 21 are fixedly connected to the mounting frame 12 . The arrangement of the connecting frames 21 ensures the stability of the fixing plate 2 .

[0053] like Figure 1 and 3, 4; also includes a dust collecting component, the dust collecting component includes a negative pressure component, the negative pressure component is installed on the top of the fixed plate 2, the negative pressure end of the negative pressure component is fixedly connected to a negative pressure pipe 32, the outer end of the negative pressure pipe 32 is fixedly connected to a first one-way valve, the outer end of the first one-way valve is fixedly connected to a collecting shell 33, the collecting shell 33 is fixed to one end of the aluminum nitride ceramic substrate 1, the inner cavity of the collecting shell 33 is fixed with a filter screen plate 36, and one side wall of the collecting shell 33 is fixedly connected to a plurality of evenly distributed collecting short tubes 34.

[0054] It should be understood that in actual use, in the initial state, the scraper block 24 is at one end away from the collection shell 33, and then the scraper block 24 moves to scrape the dust on the heat sink fins 11. When it moves close to the collection shell 33, the negative pressure component can form a negative pressure in the inner cavity of the collection shell 33, thereby forming a negative pressure in the collection short tube 34, so that the dust can be collected into the inner cavity of the collection shell 33, which is beneficial to prevent the dust from flying and falling onto the heat sink fins 11 again, which is beneficial to improve the cleaning effect.

[0055] like Figure 1 and 3 , as shown in 4; the negative pressure assembly includes a cylinder 3, the cylinder 3 is fixed to the top of the fixed plate 2, the inner cavity of the cylinder 32 is provided with an adaptive piston 35, and one side wall of the piston 35 is fixedly connected to a push rod 31, the outer end of the push rod 31 movably passes through the cylinder 3 and is fixedly connected to a connecting block 4, both ends of the connecting block 4 are fixed with connecting plates 41, and the tail end of the connecting plate 41 is fixed with a cross plate 42, which is connected to the screw slider 26.

[0056] It should be understood that the movement of the screw slider 26 can drive the cross plate 42 to move, thereby driving the push rod 31 to move, thereby driving the piston 35 to move, so that the piston 35 forms a negative pressure on the cylinder 3, thereby forming a negative pressure on the collection shell 33.

[0057] Furthermore, a limiting slot is provided on the inner side wall of the transverse plate 42 , and an adapted limiting slider 43 is inserted into the inner cavity of the limiting slot. The outer wall of the limiting slider 43 is fixedly connected to the screw slider 26 .

[0058] It should be understood that when the screw slider 26 moves back, the total length of the screw slider 26 is the sum of the exposed length of the push rod 31 and the sliding track length of the limit slider 43, thereby ensuring that the screw slider 26 is not obstructed in resetting. Similarly, there is no spatial obstacle when the screw slider 26 moves outward.

[0059] Furthermore, the tail end of the cylinder 3 is fixedly connected to a second one-way valve. The second one-way valve is set so that when the piston 35 moves back, the second one-way valve is used to release pressure, and the first one-way valve can prevent the gas from entering the collection shell 33 along the conduit 32, thereby preventing the gas from entering the collection shell 33 and blowing back dust.

[0060] A heat dissipation method for smart chips based on aluminum nitride precision ceramics is as follows:

[0061] First, in the initial state, the scraper 24 is moved to one end away from the collection shell 33. Then, when the heat sink fins 11 need to be cleaned after long-term use, the screw motor 22 drives the screw 25 to rotate, thereby driving the screw slider 26 to move, thereby driving the carrier plate 23 to move, and further driving the scraper 24 to move to scrape and clean the heat sink fins 11.

[0062] At the same time, the movement of the screw slider 26 can drive the cross plate 42 to move, thereby driving the push rod 31 to move, thereby driving the piston 35 to move, so that the piston 35 causes the cylinder 3 to form a negative pressure, which can cause the inner cavity of the collection shell 33 to form a negative pressure, thereby causing the collection short tube 34 to form a negative pressure, so that the dust can be collected into the inner cavity of the collection shell 33, which is beneficial to prevent the dust from flying and falling onto the heat dissipation fins 11 again, which is beneficial to improve the cleaning effect.

[0063] In addition, the components included in the intelligent chip heat dissipation structure and method based on aluminum nitride precision ceramics of the present invention are all universal standard parts or components known to technical personnel in this field. Their structures and principles can be known to technical personnel through technical manuals or through conventional experimental methods. In the idle space of this device, all the above-mentioned electrical components, which refer to power elements, electrical components, and adaptive monitoring computers and power supplies, are connected through wires, and the electrical connections are completed in a sequential working order. The detailed connection means are well-known technologies in this field. The following mainly introduces the working principles and processes, and no longer explains the electrical control.

[0064] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0065] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A smart chip heat dissipation structure based on aluminum nitride precision ceramics, comprising an aluminum nitride ceramic substrate (1), characterized in that: The bottom of the aluminum nitride ceramic substrate (1) is arranged on the top of the chip (15), and a plurality of evenly distributed heat dissipation fins (11) are fixedly mounted on the top of the aluminum nitride ceramic substrate (1); A driving assembly is provided on the upper side of the heat dissipation fin (11), a carrier plate (23) is connected to the driving assembly, a plurality of evenly distributed scraping blocks (24) are fixedly connected to the bottom of the carrier plate (23), the plurality of scraping blocks (24) are inserted into the gaps between the plurality of heat dissipation fins (11), and the driving assembly is used to drive the carrier plate (23) to move.

2. The heat dissipation structure of a smart chip based on aluminum nitride precision ceramics according to claim 1, characterized in that: The driving assembly includes a fixed plate (2), a sliding cavity is opened at the bottom of the fixed plate (2), a screw rod (25) is rotatably installed on the inner wall of the sliding cavity, a screw motor (22) is fixedly installed at one end of the fixed plate (2), a transmission shaft of the screw motor (22) movably passes through the fixed plate (2) and is fixedly connected to one end of the screw rod (25), an outer wall of the screw rod (25) is sleeved with an adapted screw slider (26), and the bottom of the screw slider (26) is fixedly connected to the carrier plate (23).

3. The heat dissipation structure of a smart chip based on aluminum nitride precision ceramics according to claim 1, characterized in that: The invention also includes a dust collection component, the dust collection component including a negative pressure component, the negative pressure component being mounted on the top of the fixed plate (2), the negative pressure end of the negative pressure component being fixedly connected to a negative pressure pipe (32), the outer end of the negative pressure pipe (32) being fixedly connected to a first one-way valve, the outer end of the first one-way valve being fixedly connected to a collection shell (33), the collection shell (33) being fixed to one end of the aluminum nitride ceramic substrate (1), the inner cavity of the collection shell (33) being fixed to a filter screen plate (36), and a side wall of the collection shell (33) being fixedly connected to a plurality of evenly distributed collection short pipes (34).

4. The heat dissipation structure of a smart chip based on aluminum nitride precision ceramics according to claim 3, characterized in that: The negative pressure assembly includes a cylinder (3), which is fixed to the top of the fixed plate (2). The inner cavity of the cylinder (32) is provided with an adapted piston (35). A side wall of the piston (35) is fixedly connected to a push rod (31). The outer end of the push rod (31) movably passes through the cylinder (3) and is fixedly connected to a connecting block (4). Both ends of the connecting block (4) are fixed with connecting plates (41). The tail end of the connecting plate (41) is fixed with a transverse plate (42), and the transverse plate (42) is connected to the screw slider (26).

5. The heat dissipation structure of a smart chip based on aluminum nitride precision ceramics according to claim 4, characterized in that: The inner side wall of the transverse plate (42) is provided with a limit sliding groove, the inner cavity of the limit sliding groove is plugged with an adapted limit sliding block (43), and the outer wall of the limit sliding block (43) is fixedly connected to the screw slider (26).

6. The heat dissipation structure of a smart chip based on aluminum nitride precision ceramics according to claim 4, characterized in that: The tail end of the cylinder (3) is fixedly connected to a second one-way valve.

7. The intelligent chip heat dissipation structure based on aluminum nitride precision ceramics according to claim 1, characterized in that: Mounting frames (12) are fixed on both sides of the two side walls of the aluminum nitride ceramic substrate (1), and mounting holes are provided on both sides of the surface of the mounting frame (12).

8. The intelligent chip heat dissipation structure based on aluminum nitride precision ceramics according to claim 1, characterized in that: A plurality of evenly distributed bumps (13) are fixed to the bottom of the aluminum nitride ceramic substrate (1), the bottoms of the bumps (13) are attached to the tops of the chips (15), and silicone grease (14) is filled between the aluminum nitride ceramic substrate (1) and the chip (15).

9. A method for heat dissipation of a smart chip based on aluminum nitride precision ceramics, applicable to the heat dissipation structure of a smart chip based on aluminum nitride precision ceramics according to any one of claims 1 to 8, characterized in that: The method comprises the following steps: Step 1: In the initial state, the scraper (24) moves to one end away from the collection shell (33), and then when the heat dissipation fins (11) need to be cleaned after long-term use, the screw motor (22) drives the screw (25) to rotate, thereby driving the screw slider (26) to move, thereby driving the carrier plate (23) to move, and further driving the scraper (24) to move to scrape and clean the heat dissipation fins (11); Step 2: The movement of the screw slider (26) can drive the horizontal plate (42) to move, thereby driving the push rod (31) to move, thereby driving the piston (35) to move, so that the piston (35) causes the cylinder (3) to form a negative pressure, which can cause the inner cavity of the collection shell (33) to form a negative pressure, thereby causing the collection short tube (34) to form a negative pressure, so that the dust can be collected into the inner cavity of the collection shell (33).

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