Efficient GPU chip liquid cooling heat dissipation device

Abstract

The invention relates to an efficient GPU chip liquid cooling heat dissipation device. The device comprises a bottom plate; the GPU mainboard is arranged on the bottom plate; the radiator cover plate is arranged on the GPU main board, and the radiator cover plate and the GPU main board are encircled to form a radiating space; the radiator cold plate and the splitter plate are located in the radiating space, the radiator cold plate is arranged on the GPU mainboard, and the splitter plate is arranged on the radiator cold plate; microstructure rib columns are arranged on the side, away from the GPU mainboard, of the radiator cold plate. The radiator cover plate is provided with a pair of working medium flowing ports located over the splitter plate, and the working medium flowing ports serve as a working medium flowing-in port and a working medium flowing-out port of the radiator respectively. According to the efficient GPU chip liquid cooling heat dissipation device, the radiator cold plate of the device is provided with the microstructure rib columns, and the convective heat transfer coefficient is increased by increasing the heat dissipation area and disturbing the working medium flow field.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to an efficient liquid cooling device for a GPU chip. Background Art

[0002] The rapid evolution of microelectronics technology is driving the continued surge in GPU chip performance. With the continuous miniaturization and high-density integration of devices, heat dissipation is becoming increasingly challenging. The significant increase in GPU core power consumption, coupled with the heat accumulation effect of the three-dimensional stacking structure, has led to an explosive increase in heat flux within the chip. Semiconductor components are extremely sensitive to high temperatures, and overheating can easily lead to performance degradation or even permanent damage. Therefore, efficient thermal management solutions have become crucial to unleashing the full performance potential of GPUs and ensuring their long-term stable operation and reliability.

[0003] Currently, mainstream GPU cooling solutions are mainly based on the principle of heat conduction, including forced air cooling, heat pipe or heat sink conduction, phase change cooling, etc. However, engineering practice has shown that traditional liquid cooling systems have obvious bottlenecks, such as low heat transfer interface efficiency, insufficient working fluid circulation efficiency, and limited heat dissipation capacity. Therefore, the development of new composite cooling systems that integrate multiple enhanced heat transfer mechanisms and break through the existing heat dissipation limits (for example, combining microchannel enhanced convection, high-efficiency phase change and advanced thermal conductive materials) has become an urgent technical breakthrough to solve the cooling challenges of the next generation of high-performance GPUs and ensure their stable performance.

[0004] Patent CN118507439A discloses a CPU / GPU phase-change liquid cooling radiator, comprising an upper cover, a liquid baffle, a lower cover, and a bottom plate. The liquid baffle is pressed between the upper and lower covers. The upper cover is provided with a pair of fluid flow ports, serving as the working fluid inlet and outlet of the radiator, respectively. The upper cover is also provided with a pair of connecting grooves, each connected to the working fluid flow ports. The liquid baffle is provided with a pair of through holes corresponding to the connecting grooves. The lower cover is provided with a through opening in the middle, the liquid baffle is provided at one end of the through opening, and the bottom plate is connected to the other end of the through opening. The inner wall of the bottom plate is provided with a number of raised microstructures, and the outer wall of the bottom plate is configured to fit the heat dissipation surface of the CPU / GPU. The above patent suffers from low heat exchange efficiency and poor heat dissipation effect. Summary of the Invention

[0005] To address at least one of the heat dissipation issues of existing chip heat sinks, namely low heat exchange efficiency, poor heat dissipation, and unstable operation, the present invention provides a highly efficient liquid-cooled heat dissipation device for GPU chips. Compared to existing technologies, the diverter plate design provided by the present invention helps the coolant to more evenly and fully contact the microstructured ribs provided on the bottom surface of the cold plate. It also allows the coolant to flow out of the cold plate cavity through a shorter path, effectively reducing thermal resistance during the heat exchange process and achieving highly efficient heat exchange. Furthermore, a capillary structure formed by sintering copper powder particles on both the bottom surface of the cold plate and the microstructured ribs significantly increases the surface area within the heat sink and enhances liquid supply through the capillary effect, thereby strengthening convective heat transfer.

[0006] The purpose of the present invention can be achieved by the following technical solutions:

[0007] An efficient liquid cooling device for a GPU chip comprises a base plate; a GPU motherboard mounted on the base plate; a radiator cover plate disposed on the GPU motherboard, wherein the radiator cover plate and the GPU motherboard together form a heat dissipation space;

[0008] A radiator cold plate and a diverter plate are located in the heat dissipation space, wherein the radiator cold plate is provided on the GPU mainboard, and the diverter plate is provided on the radiator cold plate;

[0009] Wherein, a microstructured rib is provided on the side of the radiator cold plate facing away from the GPU mainboard;

[0010] The radiator cover plate is provided with a pair of working medium flow ports located directly above the diverter plate, which serve as a working medium flow inlet and a working medium flow outlet of the heat dissipation device respectively.

[0011] Furthermore, the radiator cold plate is covered with a first capillary structure on a side facing away from the GPU mainboard, i.e., on an upper surface of the cold plate; the first capillary structure has one or more layers;

[0012] When the thickness of the first capillary structure is 0, the surface of the heat sink cold plate is a smooth metal surface.

[0013] Furthermore, the microstructured ribs are solid ribs covered with a second capillary structure. When the capillary thickness of the second capillary structure accounts for 0%, the microstructured ribs are completely solid ribs; when the thickness of the second capillary structure accounts for 100%, the microstructured ribs are composed of a completely porous capillary structure.

[0014] Furthermore, the first capillary structure or the second capillary structure is a porous capillary structure;

[0015] The porous capillary structure is formed by sintering metal powder, sintering metal wire or sintering a mixture of metal powder and metal wire. The porosity of the porous capillary structure is 10% to 99%, and the thickness in different positions or areas is adjusted differently according to design requirements.

[0016] Furthermore, the microstructure ribs are arranged on the upper surface of the cold plate, and the shape characteristics of the microstructure ribs are selected from the following shapes according to applicable conditions: a rectangular cross-section column, a cone or a prism, a trapezoidal column, a cone or a prism, a parallelogram column, a cone or a prism, a triangular column, a cone or a prism, a circular column, a cone or a prism, an elliptical column, a cone or a prism, an umbrella shape, etc.;

[0017] The arrangement of the microstructure ribs is in a straight row or staggered row according to the applicable situation.

[0018] Furthermore, when the shape feature of the microstructure rib is an umbrella shape, the umbrella structure is divided into two parts: a head and a root, wherein the head and the root are the same or different and are both selected from one or more of a rectangular cross-section cylinder, a rectangular cross-section cone, a rectangular cross-section pyramid, a trapezoidal cylinder, a trapezoidal cone, a trapezoidal pyramid, a parallelogram cylinder, a parallelogram cone, a parallelogram pyramid, a triangular cylinder, a triangular cone, a triangular pyramid, a circular cylinder, a circular cone, a circular pyramid, an elliptical cylinder, an elliptical cone, and an elliptical pyramid;

[0019] Furthermore, when the shape feature of the microstructure rib is an umbrella shape, the circumscribed circle centers of the horizontal projection contours of the root and the head of the umbrella structure can be coincident or dislocated according to design requirements; the circumscribed circle radius of the horizontal projection contour of the root is recorded as R1, and the circumscribed circle radius of the horizontal projection contour of the head is recorded as R1. When the root and the head are dislocated, the dislocation distance is less than or equal to the sum of R1 and R2. The ratio of the circumscribed circle radius size of the root to the circumscribed circle radius size of the head is 0.1 to 10, and the height ratio of the root to the head can be adjusted to any value according to design requirements.

[0020] Furthermore, a groove is provided on one side of the diverter plate close to the radiator cold plate, the diverter plate abuts against the radiator cold plate, and a space enclosed by the groove and the radiator cold plate constitutes a heat exchange cavity;

[0021] The bottom of the groove is hollow, and a working medium inlet chamber and a working medium outlet chamber are provided at opposite ends of the hollow groove bottom on the other side of the diverter plate. A plurality of partitions connected end to end are further provided on the other side of the diverter plate on the hollow groove bottom. Two adjacent partitions or end to end partitions and the groove walls adjacent thereto form a flow channel. The flow channel opening to the working medium inlet chamber is connected to the working medium inlet chamber, and the flow channel opening to the working medium outlet chamber is connected to the working medium outlet chamber.

[0022] Among them, the working fluid flows into the working fluid inlet chamber from the working fluid inlet, flows into the heat exchange chamber through the flow channel opening to the working fluid inlet chamber, and then flows from the heat exchange chamber into the flow channel opening to the working fluid outflow chamber, converges into the working fluid outflow chamber, and flows out from the working fluid outlet, forming a heat exchange circuit.

[0023] Furthermore, the partition is divided into a multi-segment structure, a sine structure, a cosine structure, a tangent structure or a cotangent structure;

[0024] When the partition is composed of a multi-segment structure, the partition structure is divided into three sections, namely the first partition section, the second partition section and the third partition section, wherein the first partition section is recorded as L1, the second partition section is recorded as L2 and the third partition section is recorded as L3, at least one of L1, L2 and L3 is not 0, and the angles formed by each two sections are recorded as α and β respectively, wherein the distance from the center line of the flow channel to the first partition section L1 is recorded as W1, the distance from the center line of the flow channel to the third partition section L3 is recorded as W2, and the wall thickness of the partition is recorded as D;

[0025] Furthermore, when the sizes of W1 and W2 remain the same, the angles of α and β are both 180 degrees, and the size range of L2 is 0 mm, the flow channel shape is rectangular. The rectangular flow channel shape allows the coolant to more evenly contact the microstructured ribs on the bottom surface of the cold plate during cooling, making the temperature distribution of the cold plate more uniform.

[0026] Furthermore, when the sizes of W1 and W2 are different, and the value of W1 is 0, the value of W2 is greater than 0, the angles of α and β are both 180 degrees, and the size range of L2 is 0 mm, the flow channel shape is triangular. The triangular flow channel can make the flow of the cooling medium into the heat exchange cavity more uniform;

[0027] Furthermore, when the sizes of W1 and W2 are different and both are not 0, and the value of W1 is smaller than the value of W2, and the size of L1 is 0 mm, the size of L3 is 0 mm, and the size of L2 is not 0 mm, the shape of the flow channel is trapezoidal. The trapezoidal flow channel can not only make the flow of the cooling medium into the heat exchange cavity more uniform, but also be more suitable for low flow rate conditions.

[0028] Furthermore, when the sizes of W1 and W2 are different, both sizes are not 0, and the value of W1 is smaller than the value of W2, and the sizes of L1, L2, and L3 are not 0 mm, the shape of the flow channel is quasi-convex. The quasi-convex flow channel can ensure the uniformity of temperature distribution on the bottom surface of the cold plate and adjust the flow uniformity of the cooling medium.

[0029] Furthermore, when the flow channel structure of the diverter plate 3 is a sine or cosine structure, the dimension from the center line of the flow channel to the center line of the wall is recorded as W3, the thickness of the wall is D2, the amplitude of the center line of the wall of the sine or cosine structure is A, its wavelength is λ, the number of waves is N, and the total length of the flow channel is L. In this case, the flow channel shape is wavy. The wavy flow channel can enhance the turbulence effect during heat exchange and improve the local heat exchange capacity.

[0030] Furthermore, when the flow channel structure of the diverter plate 3 is a tangent or cotangent structure, the dimension from the center line of the flow channel to the center line of the wall is W4, the thickness of the wall is D3, the amplitude of the wall center line of the tangent or cotangent structure is B, and the total length of the flow channel is L. At this time, the shape of the flow channel is streamlined. The streamlined flow channel is evolved on the basis of a quasi-convex shape, which not only makes the temperature distribution on the bottom surface of the cold plate more uniform, adjusts the flow uniformity of the cooling medium flowing into the heat exchange cavity, but also enhances the smoothness of the flow transition.

[0031] Furthermore, the radiator cold plate is connected to the diverter plate by welding, and when the diverter plate is connected to the radiator cover plate by welding or integral molding, the connection is preferably by welding.

[0032] Furthermore, when the radiator cold plate, the diverter plate and the radiator cover plate are connected by threaded connection, snap connection or riveting,

[0033] A first sealing gasket is installed between the radiator cold plate and the diverter plate;

[0034] A second sealing gasket is installed between the partition of the diverter plate and the microstructure rib to adjust the assembly gap;

[0035] A first sealing gasket is installed between the diverter plate and the radiator cover plate.

[0036] A second sealing gasket is installed between the radiator cold plate and the radiator cover plate to improve the sealing performance of the entire structure.

[0037] Furthermore, a pair of flow channels are provided in the radiator cover, one end of the pair of flow channels is respectively connected to the pair of working medium flow ports, and the other end is respectively provided on the side of the radiator cover; a radiator joint is provided at one end of the flow channel on the side of the radiator cover, and the radiator joint can be connected to the flow channel by threaded connection or welding.

[0038] Compared with the prior art, the present invention has the following advantages:

[0039] (1) The present invention provides a high-efficiency liquid cooling device for GPU chips. The radiator cold plate of the device is provided with microstructured ribs, which improve the convective heat transfer coefficient by increasing the heat dissipation area and disturbing the working medium flow field.

[0040] (2) The present invention provides a highly efficient liquid cooling device for GPU chips. The surface of the microstructured ribs of the device is covered with a porous capillary structure, which can further promote the distribution of the working fluid and enhance heat conduction through capillary action.

[0041] (3) The present invention provides a highly efficient liquid cooling device for GPU chips. The grooves of the diverter plate of the device and the cold plate form a heat exchange chamber. The internal partitions form diversified flow channels, which can control the flow rate and pressure drop of the working fluid, increase the tortuosity of the flow channel, and improve the uniformity of heat dissipation.

[0042] (4) The present invention provides a highly efficient liquid-cooled heat dissipation device for GPU chips. The bottom capillary structure and rib capillary structure of the device can be prepared by processes such as metal powder sintering and metal wire sintering. The porosity and thickness can be adjusted differently according to heat dissipation requirements (such as increasing the porosity in high heat density areas), taking into account both heat dissipation efficiency and manufacturing cost.

[0043] (5) The present invention provides a high-efficiency liquid-cooling heat dissipation device for GPU chips. When the screw connection is made, the device sets a sealing gasket between the radiator cold plate and the diverter plate, installs a sealing gasket between the top of the microstructure rib of the radiator cold plate and the lower surface of the diverter plate flow channel of the diverter plate, sets a sealing gasket between the radiator cold plate and the radiator cover plate, sets a sealing gasket between the diverter plate and the radiator cover plate, and sets a cover plate working medium inflow hole and a cover plate working medium outflow hole on the cover plate, thereby realizing the rapid positioning and installation of the joint-cover plate, the cover plate-diverter plate, the cover plate-cold plate and the diverter plate-cold plate, respectively, and providing a guarantee for forming a reliable sealing structure, which is very important for a heat dissipation system that needs to prevent the leakage of cooling medium or the entry of air. At the same time, the screw connection can also be conveniently and quickly disassembled and replaced.

[0044] (6) The present invention provides a highly efficient liquid cooling device for GPU chips. The diverter plate design of the device can help the cooling medium to more evenly and fully contact the microstructured ribs arranged on the upper surface of the cold plate. At the same time, it can enable the cooling medium to flow out of the cold plate cavity through a shorter path, which is equivalent to reducing the thermal resistance in the heat exchange process and achieving highly efficient heat exchange.

[0045] (7) The present invention provides a highly efficient liquid-cooled heat dissipation device for GPU chips. The upper surface of the cold plate and the microstructured ribs of the device can be sintered by copper powder particles to form a capillary structure. The capillary structure can significantly increase the surface area inside the radiator and enhance the supply of liquid through the capillary effect, thereby strengthening convective heat transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 This is an expanded view of the overall structure of the radiator of the present invention;

[0047] Figure 2 This is an assembly diagram of the overall structure of the screw-connected radiator of the present invention;

[0048] Figure 3 This is a cross-sectional view of the overall structure of the radiator of the present invention;

[0049] Figure 4 It is a structural schematic diagram of the upper surface of the cold plate of the radiator of the present invention;

[0050] Figure 5 It is a structural schematic diagram of the lower surface of the radiator cold plate of the present invention;

[0051] Figure 6 This is a schematic diagram of the structure of the upper surface of the radiator diverter plate of the present invention;

[0052] Figure 7 It is a structural schematic diagram of the lower surface of the radiator manifold of the present invention;

[0053] Figure 8 It is a structural schematic diagram of a side sectional view of a radiator manifold of the present invention;

[0054] Figure 9 Schematic diagram of the upper surface structure of the radiator cover plate of the present invention;

[0055] Figure 10 Schematic diagram of the structure of the lower surface of the radiator cover plate of the present invention;

[0056] Figure 11 This is a schematic structural diagram of the upper surface of the GPU motherboard of the radiator of the present invention;

[0057] Figure 12 This is a schematic structural diagram of the lower surface of the GPU motherboard of the radiator of the present invention;

[0058] Figure 13 A schematic structural diagram of the upper surface of the radiator base plate of the present invention;

[0059] Figure 14 It is a structural schematic diagram of the lower surface of the radiator base plate of the present invention;

[0060] Figure 15 is a schematic diagram of the structure of the radiator joint of the present invention;

[0061] Figure 16 is a schematic diagram of the structure of the first sealing gasket of the radiator of the present invention;

[0062] Figure 17 is a schematic diagram of the structure of the second sealing gasket of the radiator of the present invention;

[0063] Figure 18 This is a schematic diagram of the design shape of the manifold flow channel of the present invention;

[0064] Figure 19 A schematic structural diagram of the shape characteristics of the microstructure ribs of the present invention;

[0065] Figure 20 This is a schematic structural diagram of a radiator cold plate with straight rectangular ribs according to the present invention;

[0066] Figure 21 This is a schematic structural diagram of a radiator cold plate with straight triangular ribs according to the present invention;

[0067] Figure 22 A schematic diagram of the dimensions of the umbrella-shaped micro-rib structure on the upper surface of the cold plate of the present invention;

[0068] Figure 23 Schematic diagram of the capillary structure of the cold plate of the present invention;

[0069] Numbers in the figure:

[0070] 1- radiator cold plate; 11- cold plate first countersunk hole; 12- cold plate second countersunk hole; 13- cold plate upper surface; 14- microstructure ribs; 15- cold plate bottom surface;

[0071] 3 - Radiator manifold; 31 - First fitting surface on manifold; 32 - Groove on upper surface of manifold; 33 - Counterbore on manifold; 34 - Working fluid inflow cavity; 35 - Working fluid inflow channel; 36 - Working fluid outflow channel; 37 - Working fluid outflow cavity; 38 - Blind hole on manifold; 39 - First fitting surface below manifold; 310 - Groove on lower surface of manifold; 311 - Second fitting surface below manifold; 312 - Lower wall of manifold channel;

[0072] 5 - Radiator cover; 51 - First threaded hole of cover; 52 - Lower groove of cover; 53 - Second lower fitting surface of cover; 54 - Second threaded hole of cover; 55 - Working medium inlet of cover; 56 - Working medium outlet of cover; 57 - First lower fitting surface of cover; 58 - Bottom surface of cover; 59 - Third threaded hole of cover; 510 - Rib; 511 - Top plate of cover; 512 - Ventilation slot; 513 - Side of cover;

[0073] 6- Radiator joint structure; 61- Joint channel; 62- Joint bottom surface; 63- Joint structure.

[0074] 9 - Radiator GPU motherboard structure; 91 - Motherboard through hole; 92 - Motherboard upper surface; 93 - Peripheral module; 94 - GPU core; 95 - Connection structure; 96 - Motherboard lower surface;

[0075] 10- Radiator base plate structure: 101- Upper surface of base plate; 102- Base plate countersunk hole; 103- Lower surface of base plate. DETAILED DESCRIPTION

[0076] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments. This embodiment is implemented based on the technical solution of the present invention, and provides a detailed implementation method and specific operation process, but the protection scope of the present invention is not limited to the following embodiments.

[0077] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0078] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (such as the attached figure). If the specific posture changes, the directional indication will also change accordingly.

[0079] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0080] In the description of the present invention, it should be noted that, unless otherwise specified or limited, the terms "connected" and "connect" should be understood broadly. For example, they can refer to fixed connections, removable connections, or integral connections. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances. Furthermore, when describing pipelines, the terms "connected" and "connected" in the present invention have the meaning of conducting electricity. Their specific meanings should be understood in the context.

[0081] In the embodiments of the present invention, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present invention should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0082] In order to solve at least one of the heat dissipation problems of the existing chip radiator, namely low heat exchange efficiency, poor heat dissipation effect, and unstable operation, the embodiment of the present invention provides an efficient GPU chip liquid cooling device, the specific structure of which is shown in FIG. Figure 1-3, including a base plate 10, a GPU mainboard 9, a radiator cover 5, a radiator cold plate 1 and a diverter plate 3;

[0083] The GPU mainboard 9 is arranged on the bottom plate 10; the radiator cover 5 is arranged on the GPU mainboard 9, and the radiator cover 5 and the GPU mainboard 9 together form a heat dissipation space;

[0084] The radiator cold plate 1 and the diverter plate 3 are located in the heat dissipation space, the radiator cold plate 1 is provided on the GPU mainboard 9, and the diverter plate 3 is provided on the radiator cold plate 1;

[0085] Wherein, a microstructure rib 14 is provided on the side of the radiator cold plate 1 facing away from the GPU mainboard 9;

[0086] The radiator cover plate 5 is provided with a pair of working medium flow ports located directly above the diverter plate 3 , serving as a working medium flow inlet 55 and a working medium flow outlet 56 of the heat dissipation device, respectively.

[0087] In one embodiment of the present invention, a groove is provided on a side of the diverter plate 3 close to the radiator cold plate 1, the diverter plate 3 abuts against the radiator cold plate 1, and the space enclosed by the groove and the radiator cold plate 1 constitutes a heat exchange cavity 16;

[0088] The bottom of the groove is hollow, and a working medium inlet chamber 34 and a working medium outlet chamber 37 are provided at opposite ends of the hollow groove bottom on the other side of the diverter plate 3. A plurality of partitions connected end to end are further provided on the other side of the diverter plate 3 on the hollow groove bottom. Two adjacent partitions or end to end partitions and the groove walls adjacent thereto form a flow channel. The flow channel opening to the working medium inlet chamber 34 is connected to the working medium inlet chamber 34, and the flow channel opening to the working medium outlet chamber 37 is connected to the working medium outlet chamber 37.

[0089] Among them, the working fluid flows into the working fluid inlet chamber 34 from the working fluid inlet, flows into the heat exchange chamber 16 through the flow channel opening to the working fluid inlet chamber 34, and then flows from the heat exchange chamber 16 into the flow channel opening to the working fluid outflow chamber 37, converges into the working fluid outflow chamber 37, and flows out from the working fluid outlet, forming a heat exchange circuit.

[0090] In one embodiment of the present invention, when the radiator cold plate 1, the diverter plate 3 and the radiator cover plate 5 are connected by threaded connection, snap connection or riveting,

[0091] A first sealing gasket 2 is installed between the radiator cold plate 1 and the diverter plate 3;

[0092] A second sealing gasket 7 is installed between the partition of the diverter plate 3 and the microstructure rib 14 to adjust the assembly gap;

[0093] A first sealing gasket 4 is installed between the diverter plate 3 and the radiator cover plate 5.

[0094] A second sealing gasket 8 is installed between the radiator cold plate 1 and the radiator cover plate 5 to improve the sealing performance of the entire structure.

[0095] In one embodiment of the present invention, a pair of flow channels are provided in the radiator cover 5, one end of the pair of flow channels is respectively connected to the pair of working medium flow ports, and the other end is respectively provided on the side of the radiator cover 5; a radiator joint 6 is provided at one end of the flow channel on the side of the radiator cover 5, and the radiator joint 6 can be connected to the flow channel by threaded connection or welding.

[0096] Specifically, the diverter plate 3 is provided with a first fitting surface 39 under the diverter plate, a groove 310 on the lower surface of the diverter plate, and a second fitting surface 311 under the diverter plate on the side close to the radiator cold plate 1; a first sealing gasket 2 is placed in the groove 310 on the lower surface of the diverter plate to ensure the reliability and sealing of the threaded connection, thereby forming a heat exchange cavity 16; at the same time, the diverter plate 3 is also provided with a lower wall surface 312 of the diverter plate flow channel on the side close to the radiator cold plate 1, and a second sealing gasket 7 is provided between it and the microstructure rib column 14 to adjust the assembly gap and seal, and ensure the stability and reliability of the structure.

[0097] The diverter plate 3 is connected to the radiator cover plate 5 by threads. A diverter plate upper surface groove 32 is provided on the side of the diverter plate 3 close to the radiator cover plate 5. A first sealing gasket 4 is placed in the diverter plate upper surface groove 32 to ensure the sealing reliability of the structure during the threaded connection.

[0098] The radiator cover plate 5 is connected to the radiator cold plate 1 by means of a threaded connection. At the same time, a lower cover groove 52 is provided on the radiator cover plate 5 for placing a second sealing gasket 8, thereby ensuring the reliability of the seal between the radiator cover plate 5 and the radiator cold plate 1; the cavity formed by the second lower fitting surface 53 of the radiator cover plate 5 and the inner wall surface of the cover plate is used to place and install the diverter plate 3 and the radiator cold plate 1, so that the bottom surface 58 of the cover plate is in the same plane as the bottom surface 15 of the cold plate of the radiator cold plate 1, and the radiator cover plate 5 is connected to the radiator cold plate 1 and the diverter plate 3 by means of a threaded connection; the cover side surface 513 of the radiator cover plate 5 is provided with a cover working medium flow inlet 55 and a cover working medium flow outlet 56 for connecting to the radiator joint 6;

[0099] The GPU motherboard 9 is fixed between the radiator cover 5 and the base plate 10 by screw connection. The GPU motherboard 9 is provided with a connection structure 95 for inserting into the graphics card slot of the host to obtain specific signals. The GPU core 94 on the top surface 92 of the motherboard is tightly fitted with the bottom surface 15 of the cold plate by applying thermal conductive material. The peripheral modules 93 on the top surface 92 of the motherboard are tightly fitted with the bottom surface 58 of the cover plate by applying thermal conductive material. The GPU core 94 and peripheral modules 93 are changed according to the model of the graphics card motherboard;

[0100] The base plate 10 is provided with a base plate countersunk hole 102 , which is connected to the mainboard through hole 91 on the lower surface 96 of the mainboard by screw connection, and is installed and fixed to the GPU mainboard 9 and the cover plate 5 .

[0101] See also Figure 4-5 In one embodiment of the present invention, a microstructured rib 14 perpendicular to the bottom surface is provided on the upper surface 13 of the cold plate 1 of the radiator. At the same time, a first cold plate countersunk hole 11 and a second cold plate countersunk hole 12 are provided on the upper surface 13 of the cold plate, which are used to connect to the radiator cover plate 5 and the diverter plate 3 respectively.

[0102] See also Figure 6-8 In one embodiment of the present invention, the manifold 3 is provided with a manifold upper surface groove 32 for placing the first sealing gasket 4; a manifold lower surface groove 310 is provided for placing the first sealing gasket 2; a manifold flow channel lower wall 312 is provided for cooperating with the top surface of the microstructure rib 14 of the cold plate 1 to place the second sealing gasket 7; a manifold countersunk hole 33 is provided for cooperating with the second threaded hole 54 of the cover plate of the radiator cover plate 5 for screw connection; a manifold blind hole 38 is provided for cooperating with the first countersunk hole 11 of the cold plate of the radiator cold plate 1 for screw connection.

[0103] See also Figure 9-10 In one embodiment of the present invention, the radiator cover plate 5 is provided with a lower cover plate groove 52 for placing the second sealing gasket 8; the working medium flow inlet 55 and the working medium flow outlet 56 of the cover plate are both connected to the radiator joint 6 by threaded connection; the first threaded hole 51 of the cover plate is connected to the second cold plate countersunk hole 12 of the radiator cold plate 1 by threaded connection; the third threaded hole 59 provided on the cover plate 5 corresponds to the motherboard through hole 91 on the motherboard 9 and the bottom plate through hole 102 of the bottom plate 10, and is connected and fixed by screw connection, and the third threaded hole 59 of the cover plate and the bottom plate through hole 102 are adapted according to the position of the motherboard through hole 91 corresponding to the graphics card motherboard model.

[0104] See also Figure 11-12In one embodiment of the present invention, the GPU motherboard 9 is provided with a motherboard through-hole 91 for screw connection with the base plate 10 and the radiator cover 5. At the same time, a peripheral module 93 and a GPU core 94 are provided on the upper surface 92 of the GPU motherboard. The motherboard 9 is inserted into the graphics card slot through a connecting structure 95, and the lower surface 96 of the motherboard is in contact with the base plate 10.

[0105] See also Figure 13-14 In one embodiment of the present invention, the base plate 10 is provided with a base plate countersunk hole 102, which is fixed to the GPU mainboard 9 and the cover plate 5 by screw connection.

[0106] See also Figure 15 In one embodiment of the present invention, the radiator 6 is provided with a joint channel 61, a joint bottom surface 62 and a joint structure 63. The radiator joint 6 is connected to the cover plate 5 by screws, and the joint channel 61 is connected to the diverter plate working medium inflow cavity 35.

[0107] See also Figure 16-17 In one embodiment of the present invention, the first sealing gasket 4 is used for sealing the connection between the radiator cover 5 and the manifold 3; the second sealing gasket 7 is placed between the lower wall surface 312 of the manifold flow channel of the manifold 3 and the top surface of the microstructure rib 14 of the cold plate 1, both of which are used to ensure the reliability of the seal.

[0108] See also Figure 18 ,In one embodiment of the present invention, the partition is divided into a multi-segment structure, a sine structure, a cosine structure, a tangent structure or a cotangent structure;

[0109] In one embodiment of the present invention, when the partition is composed of a multi-segment structure, the partition structure is divided into three sections, namely a first partition section, a second partition section, and a third partition section, wherein the first partition section is recorded as L1, the second partition section is recorded as L2, and the third partition section is recorded as L3, at least one of L1, L2, and L3 is not 0, and the angles formed by each two sections are recorded as α and β, respectively, wherein the distance from the center line of the flow channel to the first partition section L1 is recorded as W1, the distance from the center line of the flow channel to the third partition section L3 is recorded as W2, and the wall thickness of the partition is recorded as D;

[0110] In one embodiment of the present invention, when the dimensions of W1 and W2 remain the same, the angles α and β are both 180 degrees, and the dimension range of L2 is 0 mm, the flow channel shape is rectangular. The rectangular flow channel shape allows the coolant to more evenly contact the microstructured ribs on the bottom surface of the cold plate during cooling, resulting in a more uniform temperature distribution on the cold plate.

[0111] In one embodiment of the present invention, when W1 and W2 are different in size, and the value of W1 is 0, the value of W2 is greater than 0, the angles α and β are both 180 degrees, and the size range of L2 is 0 mm, the flow channel shape is triangular. The triangular flow channel can make the flow of the cooling medium into the heat exchange cavity more uniform;

[0112] In one embodiment of the present invention, when the sizes of W1 and W2 are different and both are not 0, and the value of W1 is smaller than the value of W2, and at the same time the size of L1 is 0 mm, the size of L3 is 0 mm, and the size of L2 is not 0 mm, the shape of the flow channel is trapezoidal. The trapezoidal flow channel can not only make the flow of the cooling medium into the heat exchange cavity more uniform, but also be more suitable for low flow rate conditions;

[0113] In one embodiment of the present invention, when the sizes of W1 and W2 are different, both sizes are not 0, and the value of W1 is smaller than the value of W2, and the sizes of L1, L2, and L3 are not 0 mm, the shape of the flow channel is quasi-convex. The quasi-convex flow channel can ensure uniform temperature distribution on the bottom surface of the cold plate and adjust the flow uniformity of the cooling medium.

[0114] In one embodiment of the present invention, when the flow channel structure of the diverter plate 3 is a sine or cosine structure, the dimension from the center line of the flow channel to the center line of the wall is recorded as W3, the thickness of the wall is D2, the amplitude of the center line of the wall of the sine or cosine structure is A, its wavelength is λ, the number of waves is N, and the total length of the flow channel is L. In this case, the flow channel shape is wavy. The wavy flow channel can enhance the turbulence effect during heat exchange and improve the local heat exchange capacity;

[0115] In one embodiment of the present invention, when the flow channel structure of the diverter plate 3 is a tangent or cotangent structure, the dimension from the center line of the flow channel to the center line of the wall is W4, the thickness of the wall is D3, the amplitude of the wall center line of the tangent or cotangent structure is B, and the total length of the flow channel is L. At this time, the shape of the flow channel is streamlined. The streamlined flow channel is evolved on the basis of a quasi-convex shape, which not only makes the temperature distribution on the bottom surface of the cold plate more uniform, adjusts the flow uniformity of the cooling medium flowing into the heat exchange cavity, but also enhances the smoothness of the flow transition.

[0116] See also Figure 19-22 In one embodiment of the present invention, the microstructure ribs 14 are provided on the upper surface 13 of the cold plate, and the shape characteristics of the microstructure ribs 14 are selected from a rectangular cross-section cylinder, cone or pyramid, a trapezoidal cylinder, cone or pyramid, a parallelogram cylinder, cone or pyramid, a triangular cylinder, cone or pyramid, a circular cylinder, cone or pyramid, an elliptical cylinder, cone or pyramid, an umbrella shape, etc. according to applicable conditions;

[0117] The microstructure ribs 14 are arranged in a straight row or staggered manner according to applicable conditions.

[0118] In one embodiment of the present invention, when the shape feature of the microstructure rib 14 is an umbrella shape, the umbrella structure is divided into two parts: a head and a root, wherein the head and the root are the same or different and are both selected from one or more of a rectangular cross-section cylinder, a rectangular cross-section cone, a rectangular cross-section pyramid, a trapezoidal cylinder, a trapezoidal cone, a trapezoidal pyramid, a parallelogram cylinder, a parallelogram cone, a parallelogram pyramid, a triangular cylinder, a triangular cone, a triangular pyramid, a circular cylinder, a circular cone, a circular pyramid, an elliptical cylinder, an elliptical cone, and an elliptical pyramid;

[0119] In one embodiment of the present invention, when the shape feature of the microstructure rib 14 is an umbrella shape, the circumscribed circle center of the horizontal projection contour of the root and the head of the umbrella structure can be coincident or offset according to design requirements; the circumscribed circle radius of the horizontal projection contour of the root is recorded as R1, and the circumscribed circle radius of the horizontal projection contour of the head is recorded as R1. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2. The ratio of the circumscribed circle radius size of the root to the circumscribed circle radius size of the head is 0.1 to 10, and the height ratio of the root to the head can be adjusted to any value according to design requirements.

[0120] See also Figure 23 In one embodiment of the present invention, the radiator cold plate 1 is covered with a first capillary structure 131 on the side facing away from the GPU motherboard 9, that is, on the upper surface 13 of the cold plate; the first capillary structure 131 has one or more layers;

[0121] When the thickness of the first capillary structure 131 is 0, the surface of the heat sink cold plate 1 is a smooth metal surface.

[0122] In one embodiment of the present invention, the microstructure rib 14 is a solid rib covered with a second capillary structure 141. When the capillary thickness of the second capillary structure 141 accounts for 0%, the microstructure rib 14 is a completely solid rib; when the thickness of the second capillary structure 141 accounts for 100%, the microstructure rib 14 is composed of a completely porous capillary structure.

[0123] In one embodiment of the present invention, the first capillary structure 131 or the second capillary structure 141 is a porous capillary structure;

[0124] The porous capillary structure is formed by sintering metal powder, sintering metal wire or sintering a mixture of metal powder and metal wire. The porosity of the porous capillary structure is 10% to 99%, and the thickness in different positions or areas is adjusted differently according to design requirements.

[0125] In one embodiment of the present invention, the material of the radiator cold plate 1, the manifold 3, the radiator cover 5, the radiator connector 6, the GPU motherboard 9 and the base plate 10 is selected from one of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic, ceramic or glass.

[0126] In one embodiment of the present invention, the material of the first sealing gasket 2 and the second sealing gasket 8 is selected from one of rubber, silicone, fluororubber or plastic, and the material of the first sealing gasket 4 and the second sealing gasket 7 is selected from one of stainless steel, copper, iron, rubber, silicone, fluororubber or plastic.

[0127] In one embodiment of the present invention, the cooling medium of the heat dissipation device is selected from one or more mixtures of water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oils, transformer oils or fluorinated liquids.

[0128] In one embodiment of the present invention, a heat-conducting medium is filled between the heat sink cold plate 1 and the chip surface. This application does not limit the type of heat-conducting medium. Exemplary examples include thermal grease or liquid metal. When liquid metal is used, a protective design is provided around the chip to prevent liquid metal leakage and damage to the motherboard.

[0129] The basic application principle of the heat dissipation device provided by the present invention is:

[0130] The low-temperature cooling medium flows into the working medium inlet chamber 34 from the working medium inlet, flows into the heat exchange chamber 16 through the working medium inlet channel 35 opening to the working medium inlet chamber 34, and then flows from the heat exchange chamber 16 into the working medium outflow channel 36 opening to the working medium outflow chamber 37, converges into the working medium outflow chamber 37, and flows out from the working medium outflow outlet, forming a heat exchange circuit.

[0131] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any other manner. Any person skilled in the art may utilize the above-disclosed technical content to modify or modify the present invention into equivalent embodiments. However, any simple modifications, equivalent variations, and modifications to the above embodiments that do not depart from the technical content of the present invention and are based on the technical essence of the present invention remain within the scope of protection of the present invention.

Claims

1. An efficient GPU chip liquid cooling device, characterized in that: include: Bottom plate (10); A GPU mainboard (9) mounted on the baseboard (10); A radiator cover plate (5) is provided on the GPU mainboard (9), wherein the radiator cover plate (5) and the GPU mainboard (9) together form a heat dissipation space; A radiator cold plate (1) and a diverter plate (3) are located in the heat dissipation space, wherein the radiator cold plate (1) is arranged on the GPU mainboard (9), and the diverter plate (3) is arranged on the radiator cold plate (1); Wherein, a microstructured rib column (14) is provided on a side of the radiator cold plate (1) facing away from the GPU mainboard (9); The radiator cover plate (5) is provided with a pair of working medium flow ports located directly above the diverter plate (3), serving as a working medium flow inlet (55) and a working medium flow outlet (56) of the heat dissipation device, respectively.

2. The efficient GPU chip liquid cooling device according to claim 1, characterized in that: The radiator cold plate (1) is covered with a first capillary structure (131) on a side facing away from the GPU mainboard (9); the first capillary structure (131) has one or more layers; When the thickness of the first capillary structure (131) is 0, the surface of the heat sink cold plate (1) is a smooth metal surface.

3. The efficient GPU chip liquid cooling device according to claim 1, characterized in that: The microstructured rib (14) is a solid rib covered with a second capillary structure (141). When the capillary thickness of the second capillary structure (141) accounts for 0%, the microstructured rib (14) is a completely solid rib; when the thickness of the second capillary structure (141) accounts for 100%, the microstructured rib (14) is composed of a completely porous capillary structure.

4. An efficient GPU chip liquid cooling device according to claim 2 or 3, characterized in that: The first capillary structure (131) or the second capillary structure (141) is a porous capillary structure; The porous capillary structure is formed by sintering metal powder, sintering metal wire or sintering a mixture of metal powder and metal wire. The porosity of the porous capillary structure is 10% to 99%.

5. The efficient GPU chip liquid cooling device according to claim 1, characterized in that: The microstructure ribs (14) are arranged on the upper surface (13) of the cold plate, and the shape characteristics of the microstructure ribs (14) are selected from a rectangular cross-section cylinder, cone or pyramid, a trapezoidal cylinder, cone or pyramid, a parallelogram cylinder, cone or pyramid, a triangular cylinder, cone or pyramid, a circular cylinder, cone or pyramid, an elliptical cylinder, cone or pyramid, an umbrella shape, etc. The microstructure ribs (14) are arranged in a straight row or staggered manner.

6. The efficient GPU chip liquid cooling device according to claim 5, characterized in that: When the shape feature of the microstructure rib (14) is an umbrella shape, the umbrella structure is divided into two parts: a head and a root, wherein the head and the root are the same or different and are both selected from one or more of a rectangular cross-section cylinder, a rectangular cross-section cone, a rectangular cross-section pyramid, a trapezoidal cylinder, a trapezoidal cone, a trapezoidal pyramid, a parallelogram cylinder, a parallelogram cone, a parallelogram pyramid, a triangular cylinder, a triangular cone, a triangular pyramid, a circular cylinder, a circular cone, a circular pyramid, an elliptical cylinder, an elliptical cone, and an elliptical pyramid; When the shape feature of the microstructure rib (14) is an umbrella shape, the root of the umbrella structure coincides with or is misaligned with the circumscribed circle center of the horizontal projection contour of the head; the circumscribed circle radius of the horizontal projection contour of the root is recorded as R1, and the circumscribed circle radius of the horizontal projection contour of the head is recorded as R2. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2, and the ratio of the circumscribed circle radius size of the root to the circumscribed circle radius size of the head is 0.1 to 10.

7. The efficient GPU chip liquid cooling device according to claim 1, characterized in that: A groove is provided on one side of the diverter plate (3) close to the radiator cold plate (1); the diverter plate (3) abuts against the radiator cold plate (1); and a space enclosed by the groove and the radiator cold plate (1) constitutes a heat exchange cavity (16); The groove bottom is hollow, and the other side of the diverter plate (3) is provided with a working medium inflow chamber (34) and a working medium outflow chamber (37) at two opposite ends of the hollow groove bottom. The other side of the diverter plate (3) is also provided with a plurality of partitions connected end to end on the hollow groove bottom. Two adjacent partitions or end to end partitions and the groove walls adjacent thereto form a flow channel. The flow channel opening to the working medium inflow chamber (34) is a working medium inflow channel (35) and is connected to the working medium inflow chamber (34). The flow channel opening to the working medium outflow chamber (37) is a working medium outflow channel (36) and is connected to the working medium outflow chamber (37). The working fluid flows from the working fluid inlet into the working fluid inlet chamber (34), flows into the heat exchange chamber (16) through the flow channel opening to the working fluid inlet chamber (34), then flows from the heat exchange chamber (16) into the flow channel opening to the working fluid outlet chamber (37), converges into the working fluid outlet chamber (37), and flows out from the working fluid outlet, thereby forming a heat exchange circuit.

8. The efficient GPU chip liquid cooling device according to claim 7, characterized in that: The partition is divided into a multi-segment structure, a sine structure, a cosine structure, a tangent structure or a cotangent structure; When the partition is composed of a multi-segment structure, the partition structure is divided into three sections, namely the first partition section, the second partition section and the third partition section, wherein the first partition section is recorded as L1, the second partition section is recorded as L2 and the third partition section is recorded as L3, at least one of L1, L2 and L3 is not 0, and the angles formed by each two sections are recorded as α and β respectively, wherein the distance from the center line of the flow channel to the first partition section (L1) is recorded as W1, the distance from the center line of the flow channel to the third partition section (L3) is recorded as W2, and the wall thickness of the partition is recorded as D; When the sizes of W1 and W2 remain the same, the angles of α and β are both 180 degrees, and the size range of L2 is 0 mm, the shape of the flow channel is rectangular. When the sizes of W1 and W2 are different, and the value of W1 is 0, the value of W2 is greater than 0, the angles of α and β are both 180 degrees, and the size range of L2 is 0 mm, the flow channel shape is a triangle; When the sizes of W1 and W2 are different and both are not 0, and the value of W1 is smaller than the value of W2, and the size of L1 is 0mm, the size of L3 is 0mm, and the size of L2 is not 0mm, the shape of the flow channel is trapezoidal; When the sizes of W1 and W2 are different, both sizes are not 0, and the value of W1 is smaller than the value of W2, and the sizes of L1, L2, and L3 are not 0 mm, the shape of the flow channel is convex. When the flow channel structure of the diverter plate (3) is a sine or cosine structure, the dimension from the center line of the flow channel to the center line of the wall is recorded as W3, the thickness of the wall is recorded as D2, the amplitude of the center line of the wall of the sine or cosine structure is A, the wavelength is λ, the number of waves is N, the total length of the flow channel is L, and the shape of the flow channel is wavy; When the flow channel structure of the diverter plate (3) is a tangent or cotangent structure, the dimension from the center line of the flow channel to the center line of the wall is W4, the thickness of the wall is recorded as D3, the amplitude of the center line of the wall of the tangent or cotangent structure is B, the total length of the flow channel is L, and the shape of the flow channel is streamlined.

9. The efficient GPU chip liquid cooling device according to claim 1, characterized in that: The radiator cold plate (1) is connected to the diverter plate (3) by welding, and the diverter plate (3) is connected to the radiator cover plate (5) by welding or integral molding; When the radiator cold plate (1), the diverter plate (3) and the radiator cover plate (5) are connected by threaded connection, snap connection or riveting, A first sealing gasket (2) is installed between the radiator cold plate (1) and the diverter plate (3); A second sealing gasket (7) is installed between the partition of the diverter plate (3) and the microstructure rib (14) to adjust the assembly gap; A first sealing gasket (4) is installed between the diverter plate (3) and the radiator cover plate (5). A second sealing gasket (8) is installed between the radiator cold plate (1) and the radiator cover plate (5).

10. The efficient GPU chip liquid cooling device according to claim 1, characterized in that: A pair of flow channels are provided in the radiator cover plate (5), one end of the pair of flow channels being respectively connected to the pair of working medium flow ports, and the other end being respectively provided on the cover plate side surface (513) of the radiator cover plate (5); a radiator joint (6) is provided at one end of the flow channel on the cover plate side surface (513) of the radiator cover plate (5).

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