High-speed electronic switch semiconductor device

Abstract

The invention relates to the technical field of semiconductor devices, and discloses a high-speed electronic switch semiconductor device, which comprises a semiconductor, the outer wall of the semiconductor is provided with a sliding chute I, the outer wall of the sliding chute I is fixedly connected with a right-angle plate, the high-speed electronic switch semiconductor device also comprises a connecting mechanism, and the connecting mechanism comprises a connecting plate movably connected to the inner wall of the sliding chute I, the inner wall of the top of the connecting plate is fixedly connected with an embedded plate, the outer wall of the embedded plate is movably connected with the right-angle plate, and the inner wall of the embedded plate is fixedly connected with a first tin plate. By arranging the connecting mechanism, welding flux is arranged in a connecting interface in advance, external welding flux does not need to be additionally supplemented in the welding process, and the welding efficiency is improved. According to the structure, the soldering tin can be uniformly distributed on a connection interface between the shell and the circuit board, the mechanical strength and the electrical conduction performance of a connection part are effectively enhanced, the common quality defects such as pseudo soldering and false soldering in a traditional welding mode are reduced, and therefore the connection reliability and the long-term operation stability of equipment are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and in particular to a high-speed electronic switch semiconductor device. Background Art

[0002] High-speed electronic switching semiconductor devices are semiconductor components that can quickly control the on and off of circuits. They are widely used in modern electronic technology. Common high-speed electronic switching semiconductor devices include high-speed switching diodes, MOSFETs, and IGBTs.

[0003] The patent application with application number CN201720256249.8 discloses a high-speed power switching device, including a control signal input terminal, a first switch connection terminal, a second switch connection terminal and a high electron mobility transistor, the high electron mobility transistor including a substrate; a semiconductor layer located on the substrate, wherein the semiconductor layer includes a heterostructure, the heterojunction forms a two-dimensional electron gas, a groove is formed on the semiconductor layer in the gate region, and the thickness of the semiconductor layer below the groove is greater than the thickness that meets the conditions of an enhancement-mode transistor; a source and a drain located at both ends of the semiconductor layer, the source being electrically connected to the first switch connection terminal, and the drain being electrically connected to the second switch connection terminal; a first dielectric layer located in the groove; a floating gate located on the first dielectric layer; a second dielectric layer covering the floating gate and the first dielectric layer; a control gate located on the second dielectric layer, the control gate being electrically connected to the control signal input terminal.

[0004] During the soldering and installation process of existing high-speed electronic switching semiconductor devices on circuit boards, external solder connections are generally used. This traditional installation mode can easily lead to uneven solder distribution, resulting in welding stress concentration, insufficient interface bonding strength, and a high probability of cold solder joints in the finished welding product, which in turn affects the electrical connection reliability of the circuit board and may eventually cause operational failure of the entire circuit system. Summary of the Invention

[0005] In view of the deficiencies of the prior art, the present invention provides a high-speed electronic switch semiconductor device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a high-speed electronic switch semiconductor device, comprising a semiconductor, wherein the outer wall of the semiconductor is provided with a first slide groove, the outer wall of the first slide groove being fixedly connected to a right-angle plate, and further comprising: The connecting mechanism comprises a connecting plate movably connected to the inner wall of a slide groove, the inner wall of the top of the connecting plate is fixedly connected to an embedded plate, the outer wall of the embedded plate is movably connected to the right-angle plate, the inner wall of the embedded plate is fixedly connected to a tin plate one, the bottom of the connecting plate is fixedly connected to the shell, the bottom of the shell is provided with a cross groove, the top of the shell is provided with a slide groove two, the inner wall of the shell is movably connected to a movable component, the cross groove opens up the bottom of the shell to facilitate the passage of tin, thereby enhancing the fixing effect, and by setting the connecting mechanism, the solder is pre-placed inside the connection interface, and no additional external solder is required during the welding process. This structure enables the solder to be evenly distributed on the connection interface between the shell and the circuit board, effectively enhancing the mechanical strength and electrical conductivity of the connection part, reducing the quality defects such as cold soldering and false soldering common in traditional welding methods, thereby improving the connection reliability and long-term operation stability of the equipment.

[0007] According to the above technical solution, a U-shaped groove 1 is provided on the top of the shell, a U-shaped groove 2 is provided on the outer wall of the shell, a right-angle groove is provided on the outer wall of the shell, and a heat-conducting component is fixedly connected to the inner wall of the right-angle groove. The multiple notches of the shell allow the heat-conducting component to be embedded in the shell, thereby controlling the direction of heat transfer.

[0008] According to the above technical solution, the bottom of the shell is fixedly connected with a raised ring, and the outer wall of the raised ring is fixedly connected with a soldering rod. After heating, the soldering rod will flow to the bottom of the shell, thereby enhancing the soldering effect of the bottom.

[0009] According to the above technical solution, the side of the right-angle plate away from the slide groove is fixedly connected to the heat conducting plate 1, and the outer wall of the slide groove is fixedly connected to the serrated plate. The heat conducting plate 1 is used to transfer temperature and melt the tin plate 1. By setting a connecting mechanism, when the semiconductor is damaged, there is no need to replace the entire equipment, and only the semiconductor needs to be disassembled separately. This reduces the difficulty and technical requirements of the welding operation, shortens the equipment maintenance time, and improves the maintenance efficiency.

[0010] The U-shaped slot is fixedly connected to the bottom of the heat-conducting right-angle rod, and the outer wall of the heat-conducting right-angle rod is fixedly connected to the U-shaped slot. The top of the heat-conducting right-angle rod is fixedly connected to the U-shaped rod. The outer wall of the heat-conducting U-shaped rod is fixedly connected to the U-shaped slot. The U-shaped rod transfers the temperature to the U-shaped rod, melting the soldering rod. By setting the heat-conducting component, when the top of the connecting mechanism is heated, the heat is transferred to the periphery of the shell through the heat-conducting component, causing the soldering rod to melt due to the heat. Under the action of gravity, the molten flux automatically fills the connection gap between the shell and the circuit board to form a sealing layer, effectively isolating the air and preventing oxidation of the welding part. The uniform distribution of the flux ensures the integrity of the welding interface and improves the connection reliability.

[0011] According to the above technical solution, the movable assembly includes a movable plate, the outer wall of which is movably connected to the outer shell. The bottom of the movable plate is fixedly connected to a second tin plate. After being melted by high temperature, the second tin plate is used to fill the gap between the outer shell and the circuit board. By setting up the movable assembly, during the soldering process, the pre-installed second tin plate is heated and melted. However, due to the surface tension of the tin itself, it is difficult to completely fill the right-angle gap between the outer shell and the circuit board by gravity alone. To this end, a controllable vertical downward force can be applied to the molten tin to ensure that the molten tin fully fills the connection gap, improving the integrity and connection strength of the soldering interface, thereby ensuring the reliability and stability of the soldering quality.

[0012] According to the above technical solution, a ramp plate is fixedly connected to the top of the movable plate, a through groove is provided on the outer wall of the movable plate, and a strip groove is provided on the top of the ramp plate. The strip groove passes through the ramp plate and extends to the inner wall of the through groove. When the ramp plate is subjected to pressure, it will move downward, thereby flattening the tin material.

[0013] According to the above technical solution, the inner wall of the ramp plate is fixedly connected to the heat-conducting strip 2, the bottom of the heat-conducting strip 2 is fixedly connected to the heat-conducting strip 1, the outer wall of the heat-conducting strip 1 is fixedly connected to the strip groove, the bottom of the heat-conducting strip 1 is fixedly connected to the heat-conducting plate 3, the outer wall of the heat-conducting plate 3 is fixedly connected to the heat-conducting plate 2, and the outer wall of the heat-conducting plate 2 is fixedly connected to the through groove. The heat-conducting strip 1 is used to transfer heat, thereby accelerating the melting speed of the tin plate 2.

[0014] Compared with the prior art, the present invention provides a high-speed electronic switch semiconductor device with the following beneficial effects: 1. The present invention pre-places solder inside the connection interface by providing a connection mechanism, eliminating the need for additional external solder during the welding process. This structure allows the solder to be evenly distributed at the connection interface between the housing and the circuit board, effectively enhancing the mechanical strength and electrical conductivity of the connection, and reducing quality defects such as cold solder joints and false solder joints that are common in traditional welding methods, thereby improving the connection reliability and long-term operational stability of the equipment.

[0015] 2. The present invention provides a heat-conducting component. When the top of the connecting mechanism is heated, the heat is conducted to the periphery of the shell through the heat-conducting component, causing the soldering rod to melt. Under the action of gravity, the molten soldering flux automatically fills the connection gap between the shell and the circuit board to form a sealing layer, effectively isolating the air and preventing oxidation of the welding part. In addition, the uniform distribution of the soldering flux ensures the integrity of the welding interface and improves the connection reliability.

[0016] 3. This invention incorporates a movable assembly. During the soldering process, the pre-placed tin plate 2 melts due to heat. However, due to the surface tension of the tin itself, gravity alone cannot completely fill the right-angle gap between the housing and the circuit board. Therefore, a controllable vertical downward force is applied to the molten tin, ensuring that the molten tin fully fills the connection gap, improving the integrity and strength of the soldering interface, thereby ensuring the reliability and stability of the soldering quality.

[0017] 4. By setting up a connecting mechanism, the present invention does not need to replace the entire device when the semiconductor is damaged. It only needs to disassemble the semiconductor separately, which reduces the difficulty and technical requirements of the welding operation, shortens the equipment maintenance time, and improves the maintenance efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 The overall structure of the present invention is shown in FIG. Figure 1 ; Figure 2 The overall structure of the present invention is shown in FIG. Figure 2 ; Figure 3 For the present invention Figure 2 A magnified view of middle A; Figure 4 Schematic diagram of the connection mechanism of the present invention; Figure 5 is a cross-sectional view of the connecting mechanism of the present invention; Figure 6 is a schematic diagram of a heat conducting component of the present invention; Figure 7 Schematic diagram of the active components of the present invention Figure 1 ; Figure 8 is a cross-sectional view of the movable component of the present invention; Figure 9 Schematic diagram of the active components of the present invention Figure 2 .

[0019] In the figure: 1. semiconductor; 101. chute 1; 102. right-angle plate; 103. heat-conducting plate 1; 104. serrated plate; 2. connecting mechanism; 201. connecting plate; 202. embedded plate; 203. tin plate 1; 204. housing; 205. chute 2; 206. U-shaped groove 1; 207. right-angle groove; 208. U-shaped groove 2; 209. soldering rod; 2010. cross groove; 2 011. Raised ring; 21. Thermal conductive component; 211. Thermal conductive U-shaped rod 1; 212. Thermal conductive right-angle rod; 213. Thermal conductive U-shaped rod 2; 22. Movable component; 221. Movable plate; 222. Slope plate; 223. Tin plate 2; 224. Through groove; 225. Strip groove; 226. Thermal conductive plate 2; 227. Thermal conductive plate 3; 228. Thermal conductive strip 1; 229. Thermal conductive strip 2. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but are not to be construed as limiting the present invention.

[0022] In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0023] Example 1: See Figure 1-Figure 5The present invention provides a technical solution: a high-speed electronic switch semiconductor device, comprising a semiconductor 1, a chute 101 is provided on the outer wall of the semiconductor 1, a right-angle plate 102 is fixedly connected to the outer wall of the chute 101, a heat conducting plate 103 is fixedly connected to the side of the right-angle plate 102 away from the chute 101, and a serrated plate 104 is fixedly connected to the outer wall of the chute 101. The heat conducting plate 103 is used to transfer temperature and play the role of melting the tin plate 203. In this device, the semiconductor 1 needs to be fixed to the outer wall of the chute 101. When replacing, first heat the heat conducting plate 103 to melt the internal tin plate 203, then pull the semiconductor 1 out of the connecting plate 201 and the embedded plate 202, clean the original tin plate 203 at this time, install a new tin plate 203 after cleaning, and then install the new semiconductor 1 on the connecting plate 201, and then heat the heat conducting plate 103 again to melt the new tin plate 203 and connect the embedded plate 202 and the serrated plate 104.

[0024] The connecting mechanism 2 includes a connecting plate 201 movably connected to the inner wall of the slide 101, the inner wall of the top of the connecting plate 201 is fixedly connected to the embedded plate 202, the outer wall of the embedded plate 202 is movably connected to the right-angle plate 102, the inner wall of the embedded plate 202 is fixedly connected to the tin plate 1 203, the bottom of the connecting plate 201 is fixedly connected to the shell 204, the bottom of the shell 204 is provided with a cross groove 2010, the top of the shell 204 is provided with a slide 205, the inner wall of the shell 204 is movably connected to the movable component 22, the cross groove 2010 opens the bottom of the shell 204 to facilitate the passage of tin, thereby enhancing the fixing effect, the top of the shell 204 is provided with a U-shaped groove 1 206, the outer wall of the shell 204 is provided with a U-shaped groove 208, the outer wall of the shell 204 is provided with a right-angle groove 207, the inner wall of the right-angle groove 207 is fixedly connected to the heat-conducting component 21, the shell 204 The multiple notches allow the heat-conducting component 21 to be embedded in the shell 204, which plays a role in controlling the direction of heat transfer. The bottom of the shell 204 is fixedly connected to a raised ring 2011, and the outer wall of the raised ring 2011 is fixedly connected to a soldering rod 209. The soldering rod 209 will flow to the bottom of the shell 204 after heating, which plays a role in enhancing the soldering effect of the bottom. When the device needs to be installed on the circuit board, after the device is placed at the corresponding position on the circuit board, the top of the shell 204 is heated with an electric soldering iron. At this time, the tin on the movable component 22 melts and flows to the bottom of the shell 204 through the cross groove 2010, and fills the gaps between the circuit board, the shell 204, and the raised ring 2011. After melting, the outer soldering rod 209 fills the gap between the raised ring 2011 and the circuit board. Then the soldering rod 209 and the tin are cooled to complete the installation of the device.

[0025] Example 2: Please refer to Figure 6-Figure 9On the basis of the first embodiment, the present invention provides a technical solution: the heat-conducting assembly 21 includes a heat-conducting right-angle rod 212, the outer wall of the heat-conducting right-angle rod 212 is connected to the right-angle groove 207, the bottom of the heat-conducting right-angle rod 212 is fixedly connected to the heat-conducting U-shaped rod 1 211, the outer wall of the heat-conducting U-shaped rod 1 211 is fixedly connected to the U-shaped groove 208, the top of the heat-conducting right-angle rod 212 is fixedly connected to the heat-conducting U-shaped rod 213, the outer wall of the heat-conducting U-shaped rod 213 is fixedly connected to the U-shaped groove 1 206 is fixedly connected. When the equipment is installed, the heat of the top soldering iron will be transferred to the second heat-conducting U-shaped rod 213, and the heat of the second heat-conducting U-shaped rod 213 will be transported to the first heat-conducting U-shaped rod 211 through the right-angle heat-conducting rod 212. At this time, the heat in the first heat-conducting U-shaped rod 211 will melt the soldering rod 209. The melted soldering rod 209 moves downward under its own weight to fill the gap between the raised ring 2011 and the circuit board.

[0026] The movable assembly 22 includes a movable plate 221, the outer wall of the movable plate 221 is movably connected to the housing 204, the bottom of the movable plate 221 is fixedly connected to a tin plate 223, the tin plate 223 is melted at high temperature and is used to fill the gap between the housing 204 and the circuit board, the top of the movable plate 221 is fixedly connected to a ramp plate 222, the outer wall of the movable plate 221 is provided with a through groove 224, the top of the ramp plate 222 is provided with a strip groove 225, the strip groove 225 passes through the ramp plate 222 and extends to the inner wall of the through groove 224. When the ramp plate 222 is under pressure, it moves downward to flatten the tin material. The inner wall of the ramp plate 222 is fixedly connected to the second heat conducting strip 229. The bottom of the second heat conducting strip 229 is fixedly connected to the first heat conducting strip 228. The outer wall of the first heat conducting strip 228 is fixedly connected to the strip groove 225. The bottom of the first heat conducting strip 228 is fixedly connected to the third heat conducting plate 227. The outer wall of the third heat conducting plate 227 is fixedly connected to the strip groove 225. The wall is fixedly connected to a second heat conducting plate 226, and the outer wall of the second heat conducting plate 226 is fixedly connected to the through groove 224. The first heat conducting strip 228 is used to transfer heat and accelerate the melting speed of the second tin plate 223. When installing the equipment, the movement of the top soldering iron will squeeze the ramp plate 222, and the squeezed ramp plate 222 will move downward. The downward moving ramp plate 222 will drive the second tin plate 223 to move downward through the movable plate 221. At this time, the heat generated by the soldering iron will be transmitted to the third heat conducting plate 227 through the first heat conducting strip 228 and the second heat conducting strip 229. The third heat conducting plate 227 will transmit the heat to the tin plate at the bottom through the second heat conducting plate 226, so that the second tin plate 223 will melt when heated. The melted tin plate 223 will fill the gap between the circuit board, the shell 204, and the raised ring 2011 under the squeezing of the movable plate 221, completing the installation between the equipment and the circuit board.

[0027] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0028] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A high-speed electronic switch semiconductor device, comprising a semiconductor (1), wherein the outer wall of the semiconductor (1) is provided with a slide groove (101), and the outer wall of the slide groove (101) is fixedly connected with a right-angle plate (102), characterized in that: Also includes: A connecting mechanism (2) includes a connecting plate (201) movably connected to the inner wall of a first slide groove (101), the inner wall of the top of the connecting plate (201) is fixedly connected to an embedded plate (202), the outer wall of the embedded plate (202) is movably connected to the right-angle plate (102), the inner wall of the embedded plate (202) is fixedly connected to a first tin plate (203), the bottom of the connecting plate (201) is fixedly connected to a shell (204), the bottom of the shell (204) is provided with a cross groove (2010), the top of the shell (204) is provided with a second slide groove (205), the inner wall of the shell (204) is movably connected to a movable component (22), the cross groove (2010) opens the bottom of the shell (204), facilitates the passage of tin, and plays a role in enhancing the fixing effect.

2. The high-speed electronic switch semiconductor device according to claim 1, characterized in that: A U-shaped groove (206) is provided on the top of the shell (204), a U-shaped groove (208) is provided on the outer wall of the shell (204), a right-angle groove (207) is provided on the outer wall of the shell (204), and a heat-conducting component (21) is fixedly connected to the inner wall of the right-angle groove (207). The multiple notches of the shell (204) allow the heat-conducting component (21) to be embedded in the shell (204), thereby controlling the direction of heat transfer.

3. The high-speed electronic switch semiconductor device according to claim 2, characterized in that: The bottom of the shell (204) is fixedly connected to a raised ring (2011), and the outer wall of the raised ring (2011) is fixedly connected to a soldering rod (209). After being heated, the soldering rod (209) flows toward the bottom of the shell (204), thereby enhancing the soldering effect of the bottom.

4. The high-speed electronic switch semiconductor device according to claim 3, characterized in that: The right-angle plate (102) is fixedly connected to a heat-conducting plate (103) on a side away from the slide groove (101), and the outer wall of the slide groove (101) is fixedly connected to a serrated plate (104). The heat-conducting plate (103) is used to transfer temperature and plays a role in melting the tin plate (203).

5. The high-speed electronic switch semiconductor device according to claim 4, characterized in that: The heat-conducting assembly (21) includes a heat-conducting right-angle rod (212), the outer wall of the heat-conducting right-angle rod (212) is connected to the right-angle groove (207), the bottom of the heat-conducting right-angle rod (212) is fixedly connected to a heat-conducting U-shaped rod (211), the outer wall of the heat-conducting U-shaped rod (211) is fixedly connected to the U-shaped groove (208), the top of the heat-conducting right-angle rod (212) is fixedly connected to a heat-conducting U-shaped rod (213), the outer wall of the heat-conducting U-shaped rod (213) is fixedly connected to the U-shaped groove (206), and the heat-conducting U-shaped rod (213) transfers temperature to the heat-conducting U-shaped rod (211), thereby melting the soldering rod (209).

6. The high-speed electronic switch semiconductor device according to claim 5, characterized in that: The movable assembly (22) includes a movable plate (221), the outer wall of the movable plate (221) is movably connected to the outer shell (204), and the bottom of the movable plate (221) is fixedly connected to a second tin plate (223), which is used to fill the gap between the outer shell (204) and the circuit board after being melted at high temperature.

7. The high-speed electronic switch semiconductor device according to claim 6, characterized in that: The top of the movable plate (221) is fixedly connected to a ramp plate (222), the outer wall of the movable plate (221) is provided with a through groove (224), the top of the ramp plate (222) is provided with a strip groove (225), the strip groove (225) penetrates the ramp plate (222) and extends to the inner wall of the through groove (224), and the ramp plate (222) moves downward when subjected to pressure, thereby flattening the tin material.

8. The high-speed electronic switch semiconductor device according to claim 7, characterized in that: The inner wall of the ramp plate (222) is fixedly connected to the second heat-conducting strip (229), the bottom of the second heat-conducting strip (229) is fixedly connected to the first heat-conducting strip (228), the outer wall of the first heat-conducting strip (228) is fixedly connected to the strip groove (225), the bottom of the first heat-conducting strip (228) is fixedly connected to the third heat-conducting plate (227), the outer wall of the third heat-conducting plate (227) is fixedly connected to the second heat-conducting plate (226), the outer wall of the second heat-conducting plate (226) is fixedly connected to the through groove (224), and the first heat-conducting strip (228) is used to transfer heat, thereby accelerating the melting speed of the second tin plate (223).

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