Method and device for monitoring output power of SOA chip

Abstract

The invention provides an output power monitoring scheme of the SOA chip, based on the arranged optical detector, the reflected light from the optical fiber end face with the preset inclination angle is directly received, the output optical power of the SOA chip is monitored, and monitoring of the output optical power of the SOA chip is achieved. And meanwhile, the optical focal length does not need to be lengthened to insert a reflector with a certain oblique angle, and no extra requirement is required for packaging alignment, so that the packaging efficiency is effectively improved, and the cost is reduced.

Description

Technical Field

[0001] The present invention relates to the field of optical communications, and in particular to a method and device for monitoring the output power of an SOA chip. Background Art

[0002] Currently, the packaging devices of semiconductor optical amplifiers (SOA chips) do not have the function of optical power monitoring (such as Figure 1 If you want to add the function of optical power monitoring, you basically add a partially reflecting spectroscopic glass with an oblique angle (usually 45°) on the output light path, such as Figure 2 shown.

[0003] However, this design requires a longer optical path because an additional reflector with a certain angle must be added, which increases the size of the device and the difficulty of packaging, making it unsuitable for use in compact optical modules.

[0004] Specifically:

[0005] 1. The focusing lens at the optical output end of the existing SOA design needs to have an increased optical focal length to insert a reflector with a certain angle (usually 45°, but not necessarily 45°). This will increase the length of the overall package device, which is not conducive to the use of compact optical modules.

[0006] 2. After inserting a reflector with a certain angle, the number of packaged devices increases, resulting in more packaging steps and higher requirements for optical alignment, which increases the difficulty and cost of device packaging.

[0007] Therefore, there is an urgent need for an output power monitoring solution for SOA chips to solve the above technical problems. Summary of the Invention

[0008] This specification provides an output power monitoring solution for an SOA chip. Based on a set optical detector, it directly receives reflected light from the end face of an optical fiber with a preset tilt angle to monitor the output optical power of the SOA chip. This solution achieves the following: no need to change the design of the optical path length, no need to lengthen the optical focal length to insert a reflector with a certain tilt angle, and no additional requirements for package alignment, effectively improving packaging efficiency and reducing costs.

[0009] This specification provides a method for monitoring the output power of an SOA chip, including:

[0010] Focusing the light emitted from the semiconductor optical amplifier (SOA) chip through a second focusing lens and transmitting it to the fiber end face of the second optical fiber, wherein the fiber end face of the second optical fiber has a preset tilt angle;

[0011] Based on the provided optical detector, the reflected light from the optical fiber end face of the second optical fiber is received to monitor the output optical power of the SOA chip.

[0012] Optionally, before focusing the light emitted from the semiconductor optical amplifier (SOA) chip by the second focusing lens and transmitting it to the fiber end face of the second optical fiber, the method further includes:

[0013] The optical signal is input into the first focusing lens through the first optical fiber;

[0014] The first focusing lens focuses the light emitted from the optical fiber and inputs it into the entrance section of the waveguide end face of the semiconductor optical amplifier (SOA) chip, wherein the SOA chip has a preset tilt angle;

[0015] The optical signal amplified by the SOA chip is emitted from the exit section of the waveguide end face of the SOA chip and then enters the second focusing lens.

[0016] Optionally, before focusing the light emitted from the semiconductor optical amplifier (SOA) chip by the second focusing lens and transmitting it to the fiber end face of the second optical fiber, the method further includes:

[0017] The optical signal is input into the first focusing lens through the first optical fiber;

[0018] The first focusing lens focuses the light emitted from the optical fiber and inputs it into the entrance section of the waveguide end face of the semiconductor optical amplifier (SOA) chip, wherein the SOA chip has a preset tilt angle;

[0019] The optical signal amplified by the SOA chip is emitted from the exit section of the waveguide end face of the SOA chip and then enters the second focusing lens.

[0020] Optionally, the formula for calculating the reflectivity of the reflected light at the fiber end face of the second optical fiber is: (n2-n1) / (n2+n1); wherein n1 is the refractive index of the incident medium, and n2 is the refractive index of the reflecting medium.

[0021] Optionally, the inclination angle is 6° to 15°.

[0022] Optionally, the arrangement position of the light detector is determined according to the optical path of the reflected light from the fiber end face of the second optical fiber.

[0023] Optionally, one or more third focusing lenses are provided between the light detector and the fiber end face of the second optical fiber;

[0024] The reflected light from the fiber end face of the second optical fiber is output to the optical detector through the one or more third focusing lenses to monitor the output optical power of the SOA chip.

[0025] Optionally, one or more reflective lenses are provided between the light detector and the optical fiber end face of the second optical fiber;

[0026] The reflected light from the fiber end face of the second optical fiber passes through the one or more reflective lenses to determine the optical path of the reflected light and the location of the light detector.

[0027] This specification also provides an output power monitoring device for an SOA chip, comprising: a second focusing lens, an SOA chip, a second optical fiber, and a light detector;

[0028] Focusing the light emitted from the semiconductor optical amplifier (SOA) chip through a second focusing lens and transmitting it to the fiber end face of the second optical fiber, wherein the fiber end face of the second optical fiber has a preset tilt angle;

[0029] Based on the provided optical detector, the reflected light from the optical fiber end face of the second optical fiber is received to monitor the output optical power of the SOA chip.

[0030] This specification also provides an output power monitoring system, including a processor and a memory, wherein the memory stores a program, and when the processor executes the program, it implements the output power monitoring method of the SOA chip described in any one of the technical solutions of the above method.

[0031] This specification also provides a readable storage medium storing a program, which, when executed, implements the method for monitoring the output power of an SOA chip as described in any one of the technical solutions of the above method.

[0032] In this invention, a second focusing lens focuses the light emitted by a semiconductor optical amplifier (SOA) chip and transmits it to the end face of a second optical fiber, which has a preset tilt angle. A photodetector receives the reflected light from the end face of the second optical fiber and monitors the output optical power of the SOA chip. This design eliminates the need to change the optical path length, lengthen the optical focal length to insert a reflector with a predetermined tilt angle, and eliminates additional packaging alignment requirements, effectively improving packaging efficiency and reducing costs.

[0033] Furthermore, the tilt angle is 6° to 15°. By setting the tilt angle of the optical fiber end face, the problem of light reflected from the optical fiber end face returning to the semiconductor optical amplifier and causing serious noise increase is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0035] Figure 1 This is a side view of the SOA device in the existing design;

[0036] Figure 2 This is the top view of the SOA device in the existing design;

[0037] Figure 3 A schematic diagram of an SOA device package combination without optical power monitoring in an existing design;

[0038] Figure 4 A schematic diagram of a SOA device package combination for conventionally monitoring optical output power in existing designs;

[0039] Figure 5 A flow chart of a method for monitoring the output power of an SOA chip provided in an embodiment of this specification;

[0040] Figure 6 A schematic diagram of an output power monitoring device for an SOA chip provided in an embodiment of this specification;

[0041] Figure 7 A schematic diagram of the structure of an electronic device provided in an embodiment of this specification;

[0042] Figure 8 A schematic diagram of a computer-readable medium provided in accordance with an embodiment of this specification. DETAILED DESCRIPTION

[0043] The following description is intended to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are for illustrative purposes only, and those skilled in the art will readily appreciate other obvious variations. The basic principles of the present invention defined in the following description may be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0044] The following is combined with Figure 5-6The exemplary embodiments of the present invention are described more fully. However, the exemplary embodiments can be implemented in various forms, and the present invention should not be construed as being limited to the embodiments set forth herein. On the contrary, providing these exemplary embodiments enables the present invention to be more comprehensive and complete, and more conveniently conveys the inventive concept to those skilled in the art. In the figures, the same reference numerals represent the same or similar elements, components, or parts, and thus their repeated description will be omitted.

[0045] Under the premise of being consistent with the technical concept of the present invention, the features, structures, characteristics or other details described in a specific embodiment do not exclude that they can be combined in one or more other embodiments in a suitable manner.

[0046] In the description of specific embodiments, the features, structures, characteristics, or other details of the present invention are described to enable those skilled in the art to fully understand the embodiments. However, this does not preclude those skilled in the art from practicing the technical solutions of the present invention without one or more of the specific features, structures, characteristics, or other details.

[0047] The flowcharts shown in the accompanying drawings are for illustrative purposes only and do not necessarily include all contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may be decomposed, while others may be combined or partially combined. Therefore, the actual execution order may vary depending on the actual situation.

[0048] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically separate entities. That is, these functional entities may be implemented in software, in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.

[0049] The term "and / or" or "and / or" includes all combinations of any one or more of the associated listed items.

[0050] like Figure 1 、 Figure 2 1 and 2 are side views and top views of an SOA device using a butterfly package or a Mini-TOSA package in an existing design.

[0051] The relevant description is:

[0052] Common SOA device packaging: Most SOA devices have a limited operating temperature range, so a TEC cooling packaging mode is generally used. The optical signal enters the SOA device packaging module through the optical fiber, and then the light output from the optical fiber is focused by a lens and enters the waveguide end face of the SOA chip. The optical signal amplified by the SOA chip is then emitted from the exit section of the SOA chip waveguide end face and then focused by a lens to the optical fiber for outgoing transmission.

[0053] General SOA chips all use an oblique waveguide structure, mainly to reduce the end face reflection of the waveguide, so the light output angle will have a relatively large oblique angle, which is why the SOA chip needs to be rotated at an angle in the assembly structure.

[0054] Ferrule is a sleeve used to fix and protect the optical fiber on the package, and it also has airtight properties. Figure 2 Ignoring the internal wire connections, a wire bonding machine is generally used to connect the internal optoelectronic devices to the electrical pins. The corresponding electrical pin functions (corresponding connecting devices) can be adjusted according to needs.

[0055] Figure 3 A schematic diagram of an SOA device package combination without optical power monitoring in an existing design; Figure 4 A schematic diagram of an SOA device package combination for conventionally monitoring optical output power in existing designs.

[0056] like Figure 4 As shown, the reflected light received by the photodetector comes from a reflector mirror with a certain tilt angle (for example, 45°). The reflector mirror reflects a small amount of the light signal (for example, less than 5%) to the photodetector. The remaining light signal is directly coupled through the reflector mirror into the fiber core. However, a reflector mirror with a certain tilt angle (for example, 45°) still increases output light loss.

[0057] Figure 5 A flow chart of a method for monitoring the output power of an SOA chip provided in an embodiment of this specification includes the following steps:

[0058] Step 501: focusing light emitted from a semiconductor optical amplifier (SOA) chip through a second focusing lens and transmitting the light to an end face of a second optical fiber, wherein the end face of the second optical fiber has a preset tilt angle;

[0059] Optionally, the tilt angle is 6° to 15°. The tilt angle of the optical fiber end face is to prevent the optical signal reflected by the optical fiber end face from returning to the SOA chip along the original path and causing an increase in device noise.

[0060] In this embodiment, before focusing the light emitted from the semiconductor optical amplifier (SOA) chip by the second focusing lens and transmitting it to the fiber end face of the second optical fiber, the method further includes:

[0061] The optical signal is input into the first focusing lens through the first optical fiber;

[0062] The first focusing lens focuses the light emitted from the optical fiber and inputs it into the entrance section of the waveguide end face of the semiconductor optical amplifier (SOA) chip, wherein the SOA chip has a preset tilt angle;

[0063] The optical signal amplified by the SOA chip is emitted from the exit section of the waveguide end face of the SOA chip and then enters the second focusing lens.

[0064] Alternatively, general SOA chips all use an oblique waveguide structure, mainly to reduce the end face reflection of the waveguide, so the light output angle will have a relatively large oblique angle, which is why the SOA chip needs to be rotated at an angle in the assembly structure.

[0065] Step 502: Based on the provided optical detector, receive the reflected light from the optical fiber end face of the second optical fiber and monitor the output optical power of the SOA chip.

[0066] Optionally, the formula for calculating the reflectivity of the reflected light at the fiber end face of the second optical fiber is: (n2-n1) / (n2+n1); wherein n1 is the refractive index of the incident medium, and n2 is the refractive index of the reflecting medium.

[0067] Optionally, the arrangement position of the light detector is determined according to the optical path of the reflected light from the fiber end face of the second optical fiber.

[0068] Optionally, one or more third focusing lenses are positioned between the photodetector and the fiber end face of the second optical fiber. Light reflected from the fiber end face of the second optical fiber passes through the one or more third focusing lenses and is output to the photodetector to monitor the output optical power of the SOA chip. This design improves the light collection efficiency of the photodetector by placing one or more focusing lenses between the photodetector and the fiber end face.

[0069] Optionally, one or more reflective lenses are positioned between the light detector and the end face of the second optical fiber. Light reflected from the end face of the second optical fiber passes through the one or more reflective lenses to determine the optical path of the reflected light and thus the placement of the light detector. The purpose of the above design is generally to place the light detector in a more suitable location within the package.

[0070] The key technical point of this embodiment is to use the reflected light from the optical fiber end face to monitor the output optical power.

[0071] The output optical power of the SOA is monitored using the reflected light signal from the fiber end face. Because the intensity of the reflected light from the fiber end face is in a fixed ratio (determined by the reflectivity) to the output optical power (the optical power entering the fiber), the signal from the photodetector (optical receiver) is directly proportional to the output optical power. Once the SOA device is packaged and the correlation between the optical output power and the induced current of the photodetector is established, the output optical power can be determined from the received current of the photodetector.

[0072] The solution design of this embodiment does not add additional optical devices to the optical path, which can avoid additional optical path loss.

[0073] The design of this embodiment uses relatively few optical devices and does not require precise device alignment, so the packaging difficulty is relatively low and the cost can be reduced.

[0074] Figure 6 A schematic diagram of an output power monitoring device for an SOA chip provided in an embodiment of this specification includes: an optical fiber (first optical fiber) for receiving optical signal input, a focusing lens (first focusing lens) for receiving the first optical fiber input, an SOA chip, a focusing lens (second focusing lens) for receiving the optical signal amplified by the SOA chip, an optical fiber (second optical fiber) for receiving the output light of a semiconductor optical amplifier, i.e., the SOA chip, which is focused by the second focusing lens, and a light detector for monitoring the output optical power of the SOA chip, which receives reflected light from the optical fiber end face of the second optical fiber.

[0075] like Figure 6 The figure shows how to use reflected light from an angled fiber endface to monitor the output optical power of an SOA chip. Typically, a fiber endface has a small tilt angle (e.g., typically in the range of 6°-15°). This tilt prevents light reflected from the fiber endface from returning to the SOA chip and increasing device noise. Here, we can use the reflected signal from the angled fiber endface to monitor the output optical power of the SOA chip. This design has the advantages of a simple structure and low packaging precision requirements. The reflectivity of the optical signal at the fiber endface can be estimated using the formula for near-normal incidence: (n2-n1) / (n2+n1); (n1 is the refractive index of the incident medium, and n2 is the refractive index of the reflecting medium). The effective refractive index of the optical fiber is approximately 1.47, while the refractive index of air is 1.0. Therefore, the reflectivity at the fiber endface is approximately 19%. Generally, the power of the optical signal after amplification by the SOA chip is relatively high. Therefore, the reflected light intensity at this reflectivity is sufficiently high, and there is no need to focus the light to provide sufficient signal strength to the photodetector for light intensity monitoring.

[0076] The specific process of the output power monitoring solution based on the SOA chip is as follows:

[0077] The optical signal is input into the first focusing lens through the first optical fiber;

[0078] The first focusing lens focuses the light emitted from the optical fiber and inputs it into the entrance section of the waveguide end face of the semiconductor optical amplifier (SOA) chip, wherein the SOA chip has a preset tilt angle;

[0079] The optical signal amplified by the SOA chip is emitted from the exit section of the waveguide end face of the SOA chip and then enters the second focusing lens;

[0080] Focusing the light emitted from the semiconductor optical amplifier (SOA) chip through a second focusing lens and transmitting it to the fiber end face of the second optical fiber, wherein the fiber end face of the second optical fiber has a preset tilt angle;

[0081] Based on the provided optical detector, the reflected light from the optical fiber end face of the second optical fiber is received to monitor the output optical power of the SOA chip.

[0082] In this embodiment, a second focusing lens focuses the light emitted from a semiconductor optical amplifier (SOA) chip and transmits it to the end face of a second optical fiber, which has a preset tilt angle. A photodetector receives the reflected light from the end face of the second optical fiber and monitors the output optical power of the SOA chip. This design eliminates the need to change the optical path length, lengthen the optical focal length to insert an angled reflector, and eliminates additional packaging alignment requirements, effectively improving packaging efficiency and reducing costs.

[0083] In this embodiment, since no additional optical device is inserted into the optical path, no additional optical power loss is caused.

[0084] Figure 7 This is a schematic diagram of the structure of an electronic device provided in the embodiment of this specification. Figure 7 The electronic device 300 according to this embodiment of the present invention will be described. Figure 7 The electronic device 300 shown is merely an example and should not limit the functions and scope of use of the embodiments of the present invention.

[0085] like Figure 3 As shown, electronic device 300 is implemented as a general-purpose computing device. Components of electronic device 300 may include, but are not limited to, at least one processing unit 310, at least one storage unit 320, a bus 330 connecting various system components (including storage unit 320 and processing unit 310), a display unit 340, and the like.

[0086] The storage unit stores program codes that can be executed by the processing unit 310, so that the processing unit 310 performs the steps according to various exemplary embodiments of the present invention described in the above processing method section of this specification. For example, the processing unit 310 can perform the following steps: Figure 5 Steps shown.

[0087] The storage unit 320 may include a readable medium in the form of a volatile storage unit, such as a random access memory unit (RAM) 3201 and / or a cache memory unit 3202 , and may further include a read-only memory unit (ROM) 3203 .

[0088] The storage unit 320 may also include a program / utility 3204 having a set (at least one) of program modules 3205, such program modules 3205 including but not limited to: an operating system, one or more application programs, other program modules and program data, each of which or some combination may include an implementation of a network environment.

[0089] Bus 330 may represent one or more of several types of bus structures, including a memory bus or memory controller, a peripheral bus, an accelerated graphics port, a processing unit, or a local bus using any of a variety of bus architectures.

[0090] The electronic device 300 may also communicate with one or more external devices 400 (e.g., keyboards, pointing devices, Bluetooth devices, etc.), one or more devices that enable viewers to interact with the electronic device 300, and / or any device that enables the electronic device 300 to communicate with one or more other computing devices (e.g., routers, modems, etc.). Such communication may be performed through an input / output (I / O) interface 350. Furthermore, the electronic device 300 may also communicate with one or more networks (e.g., a local area network (LAN), a wide area network (WAN), and / or a public network, such as the Internet) through a network adapter 360. The network adapter 360 may communicate with other modules of the electronic device 300 through the bus 330. It should be understood that although Figure 7 Not shown, other hardware and / or software modules may be used in conjunction with the electronic device 300, including but not limited to microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0091] Through the description of the above embodiments, it is easy for those skilled in the art to understand that the exemplary embodiments described in the present invention can be implemented by software, or by combining software with necessary hardware. Therefore, the technical solution according to the embodiment of the present invention can be embodied in the form of a software product, which can be stored in a computer-readable storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, and includes a number of instructions to enable a computing device (which can be a personal computer, a server, or a network device, etc.) to execute the above method according to the present invention. When the computer program is executed by a data processing device, the computer-readable medium is enabled to implement the above method of the present invention, that is: Figure 5 The method shown.

[0092] Figure 8 A schematic diagram of a computer-readable medium provided in accordance with an embodiment of this specification.

[0093] accomplish Figure 5 The computer program of the method shown can be stored on one or more computer-readable media. The computer-readable medium can be a readable signal medium or a readable storage medium. The readable storage medium can be, for example, but not limited to, a system, device or component of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination thereof. More specific examples (non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof.

[0094] The computer-readable storage medium may include a data signal propagated in baseband or as part of a carrier wave, wherein the readable program code is carried. The data signal propagated may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. The readable storage medium may also be any readable medium other than a readable storage medium, which may send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, device, or component. The program code contained on the readable storage medium may be transmitted using any suitable medium, including but not limited to wireless, wired, optical cable, RF, etc., or any suitable combination thereof.

[0095] The program code for performing the operations of the present invention may be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java, C++, and the like, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the viewer computing device, partially on the viewer device, as a stand-alone software package, partially on the viewer computing device and partially on a remote computing device, or entirely on a remote computing device or server. In cases involving a remote computing device, the remote computing device may be connected to the viewer computing device through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computing device (e.g., through the Internet using an Internet service provider).

[0096] In summary, the present invention can be implemented in hardware, or in a software module running on one or more processors, or in a combination thereof. It will be appreciated by those skilled in the art that general data processing equipment such as a microprocessor or a digital signal processor (DSP) can be used in practice to implement some or all of the functions of some or all of the components in the embodiments of the present invention. The present invention can also be implemented as a device or apparatus program (e.g., a computer program and a computer program product) for executing a part or all of the methods described herein. Such a program for implementing the present invention can be stored on a computer-readable medium, or can have the form of one or more signals. Such a signal can be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.

[0097] The specific embodiments described above further illustrate the objectives, technical solutions, and beneficial effects of the present invention. It should be understood that the present invention is not inherently related to any specific computer, virtual device, or electronic device, and various general-purpose devices can also implement the present invention. The above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

[0098] The various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments.

[0099] The foregoing is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.

Claims

1. A method for monitoring the output power of an SOA chip, characterized in that: include: Focusing the light emitted from the semiconductor optical amplifier (SOA) chip through a second focusing lens and transmitting it to the fiber end face of the second optical fiber, wherein the fiber end face of the second optical fiber has a preset tilt angle; Based on the provided optical detector, the reflected light from the optical fiber end face of the second optical fiber is received to monitor the output optical power of the SOA chip.

2. The method according to claim 1, characterized in that Before focusing the light emitted from the semiconductor optical amplifier (SOA) chip through the second focusing lens and transmitting it to the fiber end face of the second optical fiber, the method further includes: The optical signal is input into the first focusing lens through the first optical fiber; The first focusing lens focuses the light emitted from the optical fiber and inputs it into the entrance section of the waveguide end face of the semiconductor optical amplifier (SOA) chip, wherein the SOA chip has a preset tilt angle; The optical signal amplified by the SOA chip is emitted from the exit section of the waveguide end face of the SOA chip and then enters the second focusing lens.

3. The method according to claim 1 or 2, characterized in that The formula for calculating the reflectivity of the reflected light at the fiber end face of the second optical fiber is: (n2-n1) / (n2+n1); wherein n1 is the refractive index of the incident medium, and n2 is the refractive index of the reflecting medium.

4. The method according to claim 1 or 2, characterized in that The inclination angle is 6° to 15°.

5. The method according to claim 1 or 2, characterized in that The location of the light detector is determined according to the optical path of the reflected light from the fiber end face of the second optical fiber.

6. The method according to claim 1 or 2, characterized in that One or more third focusing lenses are arranged between the light detector and the fiber end face of the second optical fiber; The reflected light from the fiber end face of the second optical fiber is output to the optical detector through the one or more third focusing lenses to monitor the output optical power of the SOA chip.

7. The method according to claim 1, characterized in that One or more reflective lenses are arranged between the light detector and the optical fiber end face of the second optical fiber; The reflected light from the fiber end face of the second optical fiber passes through the one or more reflective lenses to determine the optical path of the reflected light and the location of the light detector.

8. An output power monitoring device for a SOA chip, characterized in that: include: a second focusing lens, an SOA chip, a second optical fiber, and a photodetector; Focusing the light emitted from the semiconductor optical amplifier (SOA) chip through a second focusing lens and transmitting it to the fiber end face of the second optical fiber, wherein the fiber end face of the second optical fiber has a preset tilt angle; Based on the provided optical detector, the reflected light from the optical fiber end face of the second optical fiber is received to monitor the output optical power of the SOA chip.

9. An output power monitoring system, comprising a processor and a memory, wherein the memory stores a program, characterized in that: When the processor executes the program, the method according to any one of claims 1 to 7 is implemented.

10. A readable storage medium storing a program, characterized in that: When the program is executed, the method according to any one of claims 1 to 7 is implemented.

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