Heat dissipation assembly and automobile

Abstract

The embodiment of the invention provides a heat dissipation assembly. The heat dissipation assembly comprises a first heat conduction assembly and a first fixing plate; the first fixing plate is fixedly connected with the PCB, a first heating device is arranged on one side of the PCB, and the first fixing plate is located on the side, opposite to the PCB, of the first heating device; the first fixing plate is provided with a first through hole, the first heat conduction assembly penetrates through the first through hole, and one side of the first heat conduction assembly is attached to the first heating device. The computing device can be applied to automatic driving automobiles, intelligent automobiles, connected automobiles and new energy automobiles, the first heating device is attached to the first heat conduction assembly, and the first heat conduction assembly can take away heat on the first heating device. While the heat dissipation performance is ensured, the size of the heat dissipation assembly is reduced.

Description

[0001] This application is a divisional application. The application number of the original application is 202010901492.7, and the original application date is August 31, 2020. The entire content of the original application is incorporated into this application by reference. Technical Field

[0002] The present application relates to the field of hardware structure technology, and in particular to a heat dissipation component and an automobile. Background Art

[0003] Autonomous driving is becoming a new market, and one of its key components is the artificial intelligence (AI) control chip and its printed circuit board (PCB). As computing power demands increase, the power requirements of advanced driver assistance systems (ADAS) and mobile data centers (MDC) are increasing. Air cooling is no longer sufficient to dissipate heat, necessitating the need for liquid cooling technology.

[0004] Existing heat sinks consist of a cold plate with raised bosses, thermally conductive gel, a PCB, and a heating element (such as a chip). The heating element is located on the printed circuit board (PCB), and thermally conductive gel is used to conduct heat between the PCB surface and the cold plate. However, the thick filling of the thermally conductive gel can lead to a significant temperature rise. Summary of the Invention

[0005] In a first aspect, the present application provides a heat dissipation assembly, comprising: a first heat-conducting assembly and a first fixing plate; the first fixing plate is fixedly connected to a PCB, a first heating element is disposed on one side of the PCB, and the first fixing plate is located on the side of the first heating element facing away from the PCB; the first fixing plate has a first through hole, the first heat-conducting assembly passes through the first through hole, and one side of the first heat-conducting assembly is in contact with the first heating element. The first fixing plate can be a plate-shaped metal plate made of a material such as aluminum or an aluminum alloy, and the first fixing plate and the PCB can be fixed at a parallel or nearly parallel angle. The PCB can be a motherboard or a PCB with other functions, and one or more heating elements can be disposed thereon. The heating elements can be devices such as a SOC chip, a local area network switch (LAN SW), or a microcontroller unit (MCU). The first heating element is one of the one or more heating elements disposed on the PCB. The PCB has two surfaces, both of which can be disposed with heating elements. Since the first fixing plate is located on the side of the first heating element facing away from the PCB, the first heating element is disposed on the surface of the PCB facing the first fixing plate. Optionally, a high-power heating device is arranged on one of the two surfaces of the PCB board, and a low-power heating device is arranged on the other surface. The first heating device can be arranged on the surface of the PCB board where the high-power heating device is arranged, and the first heating device can be a high-power heating chip. The first fixing plate is provided with a first through hole, the first heat-conducting component passes through the first through hole, and one side of the first heat-conducting component is bonded to the first heating device. The one side of the first heat-conducting component can be bonded to the first heating device through direct contact, or can be bonded to the first heating device through indirect contact with the first heating device by applying silicone grease.

[0006] In the embodiment of the present application, the first heat-generating device is bonded to the first heat-conducting component, and the first heat-conducting component can remove heat from the first heat-generating device. On the one hand, in terms of the size of the heat-conducting component, since the first heat-conducting component passes through the through-hole of the first fixing member, the size of the first heat-conducting component can be adapted to the size of the through-hole. Compared with the liquid cooling plate of the prior art, the size and weight of the first heat-conducting component in this embodiment are smaller. In terms of thickness, since the first heat-conducting component passes through the through-hole of the first fixing member, the thickness of the heat dissipation component in this embodiment is smaller than that in the case where the fixing plate and the liquid cooling plate are separately arranged.

[0007] In one possible implementation, a second heating device is further provided on one side of the PCB board, and the heat dissipation assembly further includes: a second heat-conducting assembly and a flexible connector; the first heat-conducting assembly and the second heat-conducting assembly are connected through the flexible connector; the first fixing plate is further provided with a second through hole, the second heat-conducting assembly passes through the second through hole, and one side of the second heat-conducting assembly is in contact with the second heating device.

[0008] Among them, the first heat-conducting component and the second heat-conducting component are connected by a flexible connector to form a whole. The flexible pipeline enables the first heat-conducting component and the second heat-conducting component to be displaced up and down a certain distance in a direction perpendicular to the plane of the first fixed plate. In some scenarios, the first heating device and the second heating device are not on the same plane. Since the first heat-conducting component and the second heat-conducting component can be displaced up and down a certain distance in a direction perpendicular to the plane of the first fixed plate, the first heat-conducting component and the second heat-conducting component can be tightly fitted with the corresponding heating device.

[0009] In a possible implementation, the first heat-conducting component is a water-cooling head. The first heat-conducting component may also be other components with heat-conducting capabilities, such as a liquid cooling plate.

[0010] In one possible implementation, the system further includes a heat pipe connected to the first heat-conducting component, and a groove is provided on the side of the first fixing plate facing the PCB, with the heat pipe fitting against the inner wall of the groove. If the power of the device requiring heat dissipation on the PCB is too high to be solved by natural heat dissipation, the heat pipe can fit against the inner wall of the groove on the first fixing plate to transfer heat generated by the device on the PCB to the fixing plate.

[0011] In a possible implementation, the heat conducting pipe is a metal pipe. The heat conducting pipe can also be a rigid pipe such as a plastic pipe with good thermal conductivity.

[0012] In a possible implementation, a third heating device is further provided on one side of the PCB board, a boss is arranged on the side of the first fixing plate facing the PCB board, and the third heating device is attached to the boss on the side facing the first fixing plate.

[0013] In one possible implementation, the first thermally conductive component is floatingly connected to the PCB so that one side of the first thermally conductive component is in contact with the first heating device. The thermally conductive component can be mounted and matched with the first fixing plate, wherein the first thermally conductive component can be directly fixed and locked to the first heating device via a spring screw and a single-board bracket (the single-board bracket can be, but is not limited to, provided on the bottom case) through the first through-hole of the first fixing plate, so that the first thermally conductive component can be floatingly connected to the PCB, thereby allowing the first thermally conductive component to be in contact with the first heating device.

[0014] In a possible implementation, it further includes: a sealing cover; the sealing cover is fixed to the side of the first fixing plate facing away from the PCB board so as to seal the first through hole. In an embodiment of the present application, in order to seal the through hole opened on the first fixing plate, the sealing cover can be fixed to the side of the first fixing plate facing away from the PCB board so as to seal the first through hole. Specifically, a sealing cover can be provided on the first fixing plate, and the sealing cover can be locked in a local area near the heat-conducting component (the first heat-conducting component or the second heat-conducting component), the sealing cover can be locked in a local area near the heat-conducting component (the first heat-conducting component and the second heat-conducting component), and the sealing cover can also be locked on the outer edges of the entire first fixing plate. All joints are fixed by sealing rings and screws to achieve the airtight requirement.

[0015] In a second aspect, the present application provides a method for installing an in-vehicle computing device, comprising:

[0016] One side of the first fixing plate is fixedly connected to the PCB board, a first heating device is provided on one side of the PCB board, the first fixing plate is located on a side of the first heating device facing away from the PCB board, and a first through hole is formed in the first fixing plate;

[0017] Passing a first heat-conducting component through the first through hole, and making one side of the first heat-conducting component fit with the first heating device;

[0018] A sealing cover is fixed to a side of the first fixing plate facing away from the PCB board, so as to seal the first through hole.

[0019] In a third aspect, the present application provides an automobile, characterized in that it includes a vehicle body, and a heat dissipation assembly as described in any one of the first aspects above, arranged in the vehicle body.

[0020] Based on the designs provided in the above aspects, this application can also be further combined to provide more designs.

[0021] An embodiment of the present application provides a heat dissipation assembly, comprising: a first heat-conducting assembly and a first fixing plate; the first fixing plate is fixedly connected to a PCB board, a first heating device is provided on one side of the PCB board, and the first fixing plate is located on the side of the first heating device facing away from the PCB board; the first fixing plate has a first through-hole, the first heat-conducting assembly passes through the first through-hole, and one side of the first heat-conducting assembly is in contact with the first heating device. In the embodiment of the present application, the first heating device is in contact with the first heat-conducting assembly, and the first heat-conducting assembly can remove heat from the first heating device. On the one hand, in terms of the size of the heat-conducting assembly, since the first heat-conducting assembly passes through the through-hole of the first fixing member, the size of the first heat-conducting assembly can be adapted to the size of the through-hole. Compared with the liquid cooling plate of the prior art, the size and weight of the first heat-conducting assembly in this embodiment are smaller. In terms of thickness, since the first heat-conducting assembly passes through the through-hole of the first fixing member, the thickness of the heat dissipation assembly in this embodiment is smaller than that in the case where the fixing plate and the liquid cooling plate are separately provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1a A schematic diagram of the structure of a vehicle is provided for an embodiment of the present application;

[0023] Figure 1b A schematic diagram of the structure of a heat dissipation assembly provided in an embodiment of the present application;

[0024] Figure 2 A schematic diagram of the structure of a heat dissipation assembly provided in an embodiment of the present application;

[0025] Figure 3 A schematic diagram of the structure of a heat dissipation assembly provided in an embodiment of the present application;

[0026] Figure 4 A schematic diagram of the structure of a heat dissipation assembly provided in an embodiment of the present application;

[0027] Figure 5 A schematic diagram of the structure of a heat dissipation assembly provided in an embodiment of the present application;

[0028] Figure 6 A schematic diagram of the structure of a heat dissipation assembly provided in an embodiment of the present application;

[0029] Figure 7 A schematic diagram of the structure of a heat dissipation assembly provided in an embodiment of the present application;

[0030] Figure 8 A schematic diagram of the structure of a heat dissipation assembly provided in an embodiment of the present application;

[0031] Figure 9 A schematic diagram of the structure of a heat dissipation assembly provided in an embodiment of the present application;

[0032] Figure 10 A schematic diagram of the structure of a heat dissipation assembly provided in an embodiment of the present application;

[0033] Figure 11 A schematic diagram of the structure of a heat dissipation assembly provided in an embodiment of the present application. DETAILED DESCRIPTION

[0034] The following describes the embodiments of the present invention in conjunction with the accompanying drawings. The terms used in the embodiments of the present invention are only used to explain the specific embodiments of the present invention, and are not intended to limit the present invention.

[0035] The embodiments of the present application are described below in conjunction with the accompanying drawings. Those skilled in the art will appreciate that, with the development of technology and the emergence of new scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0036] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, and this is merely a way of distinguishing the objects of the same attributes when describing them in the embodiments of the present application. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, so that the process, method, system, product or equipment comprising a series of units need not be limited to those units, but may include other units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0037] First, the application scenario of the heat dissipation component provided by the present application is introduced. The heat dissipation component provided by the present application can be applied to automobiles, for example, it can be applied to an on-board computing device in an automobile, and the on-board computing device is applied to the automated driving of smart cars, wherein smart cars include electric cars or gasoline-powered cars that support unmanned driving, driver assistance / ADAS, intelligent driving, connected driving, intelligent network driving, and carsharing. The on-board computing device is used to control and monitor the driving status of smart cars, including but not limited to an on-board mobile data center (MDC), a hardware monitor (HMI) that realizes the function of a human-computer interaction controller, an in-vehicle infotainment (IVI) controller, a body control module (BCM), and a vehicle control unit (VCU). The on-board computing device may specifically be a chip with computing and processing capabilities, or it may be a collection of multiple devices such as a processor and a memory integrated in a printed circuit board (PCB), wherein the processor includes but is not limited to a central processing unit (CPU), a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, a graphics processing unit (GPU), and an artificial intelligence (AI) chip. The general-purpose processor may be a microprocessor or any conventional processor, etc. As can be seen from the above description, the on-board computing device is provided with a chip with a large amount of computing power, so when it is in use, it has high requirements for heat dissipation. For this reason, the present application provides a heat dissipation component to improve the heat dissipation effect of the chip.

[0038] For example, Figure 1a As shown, the onboard computing device 201 can be installed in a suitable location such as the center console or near the vehicle's liquid cooling pump. It uses various sensors installed on the vehicle body (such as millimeter-wave radar 206, lidar 205, camera 202, etc.) to detect the vehicle's environment. This information is then fed back to the chip built into the onboard computing device 201 for real-time reasoning and calculation. Finally, the onboard computing device 201 issues operation commands to the vehicle control unit (VCU) 204, which controls the motor vehicle (braking, deceleration, etc.) through VCU 204, achieving various levels of autonomous driving functions. The onboard computing device 201 can also upload data to the back-end cloud data center via T-BOX (telematics box) 203. Optionally, the on-board computing device 201 can transmit information to the camera 202 via a multimedia serial link (MSL); transmit information to the lidar 205 via an on-board Ethernet link; transmit information to the VCU 204 via a controller area network (CAN) bus; transmit information to the millimeter wave radar 106 via a CAN bus; and transmit information to the T-BOX 203 via an on-board Ethernet link.

[0039] The vehicle-mounted computing device 201 in the present application may include a heat dissipation component for providing heat dissipation for the heat dissipation device in the vehicle-mounted computing device 201 .

[0040] Reference Figure 1b , Figure 1b A schematic diagram of the structure explosion of a heat dissipation component is provided for the embodiment of the present application, such as Figure 1b As shown, the heat dissipation assembly provided in the embodiment of the present application includes: a first heat conducting assembly 101 and a first fixing plate 102 .

[0041] In the embodiment of the present application, the first fixing plate 102 is fixedly connected to the PCB board 103 , a first heating device 104 is provided on one side of the PCB board 103 , and the first fixing plate 102 is located on the side of the first heating device 104 facing away from the PCB board 103 .

[0042] The first fixing plate 102 may be a plate-shaped metal plate made of aluminum or aluminum alloy, and the first fixing plate 102 and the PCB 103 may be fixed at a parallel or nearly parallel angle. The PCB 103 may be a motherboard or a PCB 103 with other functions, and may be provided with one or more heating devices thereon. The heating devices may be devices such as an SOC chip, a local area network switch LANSW, or a microcontroller unit (MCU). The first heating device 104 is one of the one or more heating devices arranged on the PCB 103. The PCB 103 has two surfaces, both of which may be provided with heating devices. Since the first fixing plate 102 is located on the side of the first heating device 104 facing away from the PCB 103, the first heating device 104 is arranged on the surface of the PCB 103 facing the first fixing plate 102. Optionally, a high-power heating device is arranged on one of the two surfaces of the PCB board 103, and a low-power heating device is arranged on the other surface. The first heating device 104 can be arranged on the surface of the PCB board 103 where the high-power heating device is arranged, and the first heating device 104 can be a high-power heating chip.

[0043] In the embodiment of the present application, the first fixing plate 102 defines a first through hole 105, the first heat-conducting component 101 extends through the first through hole 105, and one side of the first heat-conducting component 101 is bonded to the first heating element 104. The bonding between the first heat-conducting component 101 and the first heating element 104 can be achieved through direct contact or indirect contact by applying silicone grease.

[0044] Reference Figure 2 , Figure 2 This is a structural diagram of a fixing plate in an embodiment of the present application. Figure 2 As shown, the first fixing plate 102 may be provided with a first through hole 105. In the embodiment of the present application, the first fixing plate 102 and the PCB board 103 are arranged relative to each other, and the first fixing plate 102 may be provided with a first through hole 105 at a position opposite to the first heating element 104. The first heat conducting component 101 may pass through the first through hole 105 and be attached to the first heating element 104.

[0045] Specifically, you can Figure 1b As shown, a first through hole 105 can be opened on the first fixing plate 102, and a first heat-conducting component 101 is set in the first through hole 105. During installation, the first fixing plate 102 can be moved toward the PCB board 103, and the first heat-conducting component 101 is made to fit with the first heating device 104.

[0046] In an optional implementation, the first heat-conducting component 101 is a water-cooling head. The water-cooling head may include flow channels and fins. The flow channels may be filled with liquid, which then removes heat through the flow of the liquid. The liquid may be water or another refrigerant. The first heat-conducting component 101 may also be a liquid cooling plate or other component with good heat dissipation performance.

[0047] In an embodiment of the present application, a second heating device 106 may also be provided on one side of the PCB board 103, and the heat dissipation component also includes: a second heat-conducting component 107 and a flexible connector 108; the first heat-conducting component 101 and the second heat-conducting component 107 are connected through the flexible connector 108; the first fixing plate 102 is further provided with a second through hole 111, the second heat-conducting component 107 passes through the second through hole 111, and one side of the second heat-conducting component 107 is in contact with the second heating device 106.

[0048] In the embodiment of the present application, similar to the first heating element 104, a second heating element 106 may be arranged on the same side of the PCB board 103 as the first heating element 104. The second heating element 106 is one of the one or more heating elements arranged on the PCB board 103. The PCB board 103 has two surfaces, both of which may be arranged with a heating element. The first fixing plate 102 is located on the side of the second heating element 106 facing away from the PCB board 103, and the second heating element 106 is arranged on the surface of the PCB board 103 facing the first fixing plate 102. Similar to the first through hole 105, the first fixing plate 102 and the PCB board 103 are arranged opposite each other, and the first fixing plate 102 may have a second through hole 111 at a position opposite the second heating element 106. The second heat-conducting component 107 may pass through the second through hole 111 and be in contact with the second heating element 106.

[0049] Among them, the first heat-conducting component 101 and the second heat-conducting component 107 are connected by a flexible connector 108 to form a whole. The flexible pipeline allows the first heat-conducting component 101 and the second heat-conducting component 107 to be displaced up and down a certain distance in a direction perpendicular to the plane of the first fixed plate 102. In some scenarios, the first heating device 104 and the second heating device 106 are not on the same plane. Since the first heat-conducting component 101 and the second heat-conducting component 107 can be displaced up and down a certain distance in a direction perpendicular to the plane of the first fixed plate 102, the first heat-conducting component 101 and the second heat-conducting component 107 can be tightly fitted with the corresponding heating device. It should be understood that the above-mentioned flexible connector 108 can be a flexible tube, or a combination of a flexible tube and a rigid tube (such as a metal tube).

[0050] For details, please refer to Figure 3 , Figure 3A schematic diagram of the structure of a heat conducting component provided in an embodiment of the present application is shown as follows: Figure 3 As shown, the first heat-conducting component 101 and the second heat-conducting component 107 are connected by a flexible connector 108. The first heat-conducting component 101 and the second heat-conducting component 107 are water-cooled heads. The flexible connector 108 can be set to be hollow, and the empty space in the middle can be used as a flow channel for the liquid. In addition, the heat dissipation component can also include: a heat-conducting pipe 109; the heat-conducting pipe 109 is connected to the first heat-conducting component 101, and the heat-conducting pipe 109 is connected to the second heat-conducting component 107. The heat-conducting pipe 109 can be set to be hollow, and the empty space in the middle can be used as a flow channel for the liquid. Optionally, the heat-conducting pipe 109 can be a metal pipe, a plastic pipe with good thermal conductivity, etc.

[0051] Reference Figure 4 , Figure 4 The structure of the heat dissipation assembly provided in the embodiment of the present application is shown as follows: Figure 4 As shown, along the line of sight toward the PCB board 103 , it can be seen that the first heat conducting component 101 is located in the first through hole 105 , and the second heat conducting component 107 is located in the second through hole 111 .

[0052] In a possible implementation, a third heating device is further provided on one side of the PCB board 103, a boss 112 is arranged on the side of the first fixing plate 102 facing the PCB board 103, and the third heating device is in contact with the boss 112 on the side facing the first fixing plate 102.

[0053] Optionally, a boss 112 may be provided on one side of the first fixing plate 102 facing the PCB board 103, corresponding to the third heating element on the PCB board 103, referring to FIG. Figure 5 , Figure 5 The structure of the fixing plate provided in the embodiment of the present application is shown as follows: Figure 5 As shown, in addition to the first through hole 105 and the second through hole 111, the side of the first fixing plate 102 facing the PCB board 103 can also be provided with multiple bosses 112, each boss 112 corresponding to other heating devices on the PCB board 103 (heating devices other than the first heating device 104 and the second heating device 106).

[0054] In the embodiment of the present application, a groove 113 may be further provided on the side of the first fixing plate 102 facing the PCB board 103, and the heat pipe 109 is fitted with the inner wall of the groove 113. The pipe of the heat pipe 109 may or may not be in contact with the first fixing plate 102, depending on whether the power of the device that needs to dissipate heat on the PCB board 103 is so high that it cannot be solved by natural heat dissipation. If the power of the device that needs to dissipate heat on the PCB board 103 is very high, the heat pipe 109 may be fitted with the inner wall of the groove 113 on the first fixing plate 102, so that the heat generated by the device that needs to dissipate heat on the PCB board 103 can be transferred to the fixing plate. The fitting part may be, but is not limited to, coated with a material having a certain thermal contact, such as epoxy resin. Reference Figure 6 , Figure 6 The structure of the fixing plate provided in the embodiment of the present application is shown as follows: Figure 6 As shown, a groove 113 may be provided on a side of the first fixing plate 102 facing the PCB board 103 .

[0055] In the embodiment of the present application, the first heat-conducting component 101 can be floatingly connected to the PCB board 103 so that one side of the first heat-conducting component 101 is in contact with the first heating device 104 .

[0056] In one implementation, referring to Figure 7 , Figure 7 The structure of the heat dissipation assembly provided in the embodiment of the present application is shown as follows: Figure 7 As shown, the first heat-conducting component 101 can be installed and matched with the first fixing plate 102, wherein the first heat-conducting component 101 can directly pass through the first through hole 105 of the first fixing plate 102, and be fixed and locked with the first heating device 104 by the spring screw and the single board bracket 115 (the single board bracket 115 can be but is not limited to being set on the bottom shell 114), so that the first heat-conducting component 101 can be floatingly connected with the PCB board 103, and then the first heat-conducting component 101 can be fitted with the first heating device 104.

[0057] In the embodiment of the present application, a heating device can be arranged on the surface of the PCB board 103 facing away from the first fixed plate 102, and contacted with it through the long boss 112 on the bottom shell 114, and the contact interface can be filled with a thermal pad or thermal conductive gel; wherein, the bottom shell 114 can be a pure metal plate, or a whole cavity-type water-cooling plate, or a heat dissipation structure similar to the above-mentioned first fixed plate 102 and the heat-conducting component, which is not limited here.

[0058] In the embodiment of the present application, in order to seal the through hole opened on the first fixing plate 102, the sealing cover 110 can be fixed to the side of the first fixing plate 102 facing away from the PCB board 103, so as to seal the first through hole 105. Specifically, the sealing cover 110 can be provided on the first fixing plate 102, such as Figure 8 As shown, the sealing cover 110 can be locked in a local area near the heat-conducting component (the first heat-conducting component 101 or the second heat-conducting component 107), as shown in FIG. Figure 9 As shown, the sealing cover 110 can be locked in a local area near the heat-conducting components (the first heat-conducting component 101 and the second heat-conducting component 107), as shown in FIG. Figure 10 As shown, the sealing cover 110 can also be locked around the outer edge of the entire first fixing plate 102, and all joints are fixed by sealing rings and screws to achieve airtightness requirements. Figure 11 Schematic diagram of the installed vehicle computing device.

[0059] In the embodiment of the present application, the first heat-generating device 104 is attached to the first heat-conducting component 101, and the first heat-conducting component 101 can remove heat from the first heat-generating device 104. On the one hand, in terms of the size of the heat-conducting component, since the first heat-conducting component 101 passes through the through-hole of the first fixing member, the size of the first heat-conducting component 101 can be adapted to the size of the through-hole. Compared with the liquid cooling plate of the prior art, the size and weight of the first heat-conducting component 101 in this embodiment are smaller. In terms of thickness, since the first heat-conducting component 101 passes through the through-hole of the first fixing member, the thickness of the heat dissipation component in this embodiment is smaller than that in a case where the fixing plate and the liquid cooling plate are arranged separately.

[0060] It should also be noted that the device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed across multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment. In addition, in the drawings of the device embodiments provided in this application, the connection relationship between the modules indicates that there is a communication connection between them, which can be specifically implemented as one or more communication buses or signal lines.

[0061] Through the description of the above embodiments, those skilled in the art can clearly understand that the present application can be implemented by means of software plus necessary general hardware, and of course can also be implemented by special hardware including application-specific integrated circuits, special CPUs, special memories, special components, etc. In general, all functions performed by computer programs can be easily implemented with corresponding hardware, and the specific hardware structures used to implement the same function can also be diverse, such as analog circuits, digital circuits or special circuits, etc. However, for the present application, software program implementation is a better implementation method in most cases. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a readable storage medium, such as a computer's floppy disk, USB flash drive, mobile hard disk, ROM, RAM, magnetic disk or optical disk, etc., and includes a number of instructions to enable a computer device (which can be a personal computer, training equipment, or network equipment, etc.) to execute the methods described in each embodiment of the present application.

[0062] In the above embodiments, all or part of the embodiments may be implemented by software, hardware, firmware, or any combination thereof. When implemented by software, all or part of the embodiments may be implemented in the form of a computer program product.

[0063] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from a website, a computer, a training device or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website, a computer, a training device or a data center. The computer-readable storage medium can be any available medium that a computer can store or a data storage device such as a training device, a data center, etc. that includes one or more available media integrations. The available medium can be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state drive (SSD)).

Claims

1. A heat dissipation component, characterized in that: include: A first heat-conducting component (101) and a first fixing plate (102); The first fixing plate (102) is fixedly connected to the PCB board (103); a first heating device (104) is provided on one side of the PCB board (103); and the first fixing plate (102) is located on a side of the first heating device (104) facing away from the PCB board (103); The first fixing plate (102) is provided with a first through hole (105), the first heat-conducting component (101) passes through the first through hole (105), and one side of the first heat-conducting component (101) is in contact with the first heating device (104); the first fixing plate (102) and the PCB board (103) are fixed at a parallel or nearly parallel angle.

2. The heat dissipation assembly according to claim 1, wherein: A second heating element (106) is also provided on one side of the PCB board (103), and the heat dissipation assembly further comprises: a second heat-conducting assembly (107) and a flexible connector (108); The first heat-conducting component (101) and the second heat-conducting component (107) are connected via the flexible connector (108); The first fixing plate (102) is further provided with a second through hole (111), the second heat-conducting component (107) passes through the second through hole (111), and one side of the second heat-conducting component (107) is in contact with the second heating element (106).

3. The heat dissipation assembly according to claim 1 or 2, characterized in that: The first heat-conducting component (101) is a water-cooling head.

4. The heat dissipation assembly according to any one of claims 1 to 3, characterized in that: Also includes: heat conducting pipe (109); The heat conducting pipe (109) is connected to the first heat conducting component (101); a groove 113 is provided on a side of the first fixing plate (102) facing the PCB board (103); and the heat conducting pipe (109) is in contact with an inner wall of the groove 113.

5. The heat dissipation assembly according to claim 4, characterized in that: The heat conducting pipe (109) is a metal pipe.

6. The heat dissipation assembly according to any one of claims 1 to 5, characterized in that: A third heating device is further provided on one side of the PCB board (103); a boss 112 is arranged on the side of the first fixing plate (102) facing the PCB board (103); and the third heating device is fitted with the boss 112 on the side facing the first fixing plate (102).

7. The heat dissipation assembly according to any one of claims 1 to 6, characterized in that: The first heat-conducting component (101) is connected to the PCB board (103) in a floating manner, so that one side of the first heat-conducting component (101) is in contact with the first heating device (104).

8. The heat dissipation assembly according to any one of claims 1 to 7, characterized in that: Also includes: Sealing cover (110); The sealing cover (110) is fixed to a side of the first fixing plate (102) facing away from the PCB board (103) so as to seal the first through hole (105).

9. An automobile, characterized in that: It comprises a vehicle body, and a heat dissipation assembly as claimed in any one of claims 1 to 8 arranged in the vehicle body.

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