A spray etching equipment for circuit board production

Abstract

This invention discloses a spray etching device for circuit board production, relating to the field of etching equipment technology. It includes a transport unit comprising a feeding component mounted on one side of a protective shell for feeding circuit boards, a conveying component mounted on the feeding component for conveying the circuit boards, a fixing component mounted on the conveying component for fixing the circuit boards, and a discharging component mounted on the other end of the protective shell for discharging. The discharging component and the fixing component cooperate to automatically unload the etched circuit boards. The feeding component precisely pushes the circuit boards into the protective shell, and the fixing component's squeezing mechanism secures the circuit boards, improving their stability during the etching process. Simultaneously, the rotational movement of the conveying component, combined with the flipping action of the fixing component, allows the circuit boards to automatically flip to a vertical position for etching without manual intervention, thus improving production efficiency.

Description

Technical Field

[0001] This invention relates to the field of etching equipment technology, and more particularly to a spray etching device for circuit board production. Background Technology

[0002] Printed circuit boards (PCBs) are one of the most important electronic components in modern times, carrying a large number of electronic components. The processing of PCBs generally includes more than 20 steps such as pretreatment, printing film baking, exposure and development, and acid etching. Among them, etching is the outer layer circuit pattern manufacturing process, and the uniformity of spraying during the etching process directly determines the etching standard.

[0003] In existing technologies, the circuit board is placed flat in the etching equipment during etching. The top surface of the circuit board is then rinsed or sprayed with etching solution before being removed from the etching chamber. Workers then flip the board for a second etching, which consumes a lot of time. At the same time, the etching equipment sprays etching solution at a fixed angle, which can easily cause uneven spraying of the etching solution, requiring re-etching. After etching is completed, the sprayed etching solution is directly discharged, which can easily lead to etching solution contamination and make it impossible to recycle and reuse, resulting in resource waste. Summary of the Invention

[0004] In view of the problems existing in the spray etching equipment used in the production of printed circuit boards, the present invention is proposed.

[0005] Therefore, the present invention provides a spray etching device for circuit board production, the purpose of which is to solve the problems of wasting time by repeatedly etching circuit boards, uneven etching due to the inability to adjust the spray angle during etching, and the inability to recycle and reuse the etching solution after etching.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a support unit, including a protective shell and a flexible baffle disposed at the top of the inside of the protective shell;

[0007] The transport unit includes a loading component disposed on one side of the protective shell for loading circuit boards, a conveying component disposed on the loading component for conveying circuit boards, a fixing component disposed on the conveying component for fixing circuit boards, and a unloading component disposed on the other end of the protective shell for unloading. The unloading component and the fixing component cooperate to automatically unload the etched circuit boards.

[0008] The spraying unit includes a spraying component disposed on the top of the protective housing for storing and spraying etching solution, and the spraying component cooperates with the fixing component to automatically spray and etch the circuit board and unload it after etching is completed.

[0009] As a preferred embodiment of the spray etching equipment for circuit board production described in this invention, the feeding assembly includes a transport component disposed on one side of the protective shell, an electric push rod disposed on the transport component, a push component disposed at the output end of the electric push rod, and an arc-shaped limiting plate disposed inside the transport component, wherein the arc-shaped limiting plate is slidably connected to the push component.

[0010] As a preferred embodiment of the spray etching equipment for circuit board production described in this invention, the conveying assembly includes a motor disposed at the rear end of the protective shell, a drive wheel disposed at the output end of the motor, a rotating rod disposed on the drive wheel, a driven wheel disposed at the other end of the rotating rod, and a conveyor belt disposed on the outer diameter of the driven wheel, wherein the conveyor belt is rotatably connected to the drive wheel.

[0011] In a preferred embodiment of the spray etching equipment for circuit board production described in this invention, one end of the rotating rod passes through the drive wheel and is provided with a rotating shaft, the outer diameter of the rotating shaft is provided with a belt, and the belt is connected to the feeding assembly.

[0012] As a preferred embodiment of the spray etching equipment for circuit board production according to the present invention, the fixing component includes a rotating shaft disposed on a conveyor belt, a fixing member rotatably disposed on the rotating shaft, an arched member slidably disposed inside the fixing member, a rotating connecting rod rotatably disposed inside the arched member, and an extrusion block rotatably disposed at the other end of the rotating connecting rod, wherein the rotating connecting rod is fixedly connected to the fixing member, and the extrusion block is slidably connected to the fixing member.

[0013] As a preferred embodiment of the spray etching equipment for circuit board production described in this invention, a second reset spring is provided at one end of the extrusion block, and the other end of the second reset spring is connected to the arched part. A connecting plate is provided on the arched part, a first reset spring is provided at the bottom of the connecting plate, and the other end of the first reset spring is connected to the fixing part. The connecting plate and the fixing part are slidably connected.

[0014] As a preferred embodiment of the spray etching equipment for circuit board production described in this invention, the unloading assembly includes an unloading component disposed on the other side of the protective shell, a driven component disposed inside the unloading component, and a friction wheel disposed on the outer diameter of the driven component, wherein the driven component is connected to a belt.

[0015] In a preferred embodiment of the spray etching equipment for circuit board production described in this invention, a fixing plate is provided on the top of the unloading part, a reset spring three is provided inside the fixing plate, and an unloading block is provided at the other end of the reset spring three, and the unloading block is slidably connected to the fixing plate.

[0016] As a preferred embodiment of the spray etching equipment for circuit board production according to the present invention, the spraying assembly includes a storage unit disposed on the top of the protective shell, a conveying pipe disposed on the bottom of the storage unit, a spraying pipe disposed on the conveying pipe, a nozzle slidably disposed inside the spraying pipe, and an inclined spraying pipe disposed on the outer diameter of the nozzle.

[0017] As a preferred embodiment of the spray etching equipment for circuit board production described in this invention, the protective shell is provided with a collection component inside, the collection component has a hole inside, a flexible baffle is provided on the top of the collection component, a submersible pump is provided at the bottom of the collection component, and the submersible pump is connected to the storage component.

[0018] The beneficial effects of this invention are as follows: The feeding component accurately pushes the circuit board into the protective shell, and the pressing mechanism of the fixing component secures the circuit board, improving its stability during the etching process. Simultaneously, the rotation of the conveying component, combined with the flipping action of the fixing component, allows the circuit board to automatically flip to a vertical position for etching without manual intervention, thus improving production efficiency. The spraying component evenly sprays the circuit board during etching and also has an etching solution recycling function, which not only improves the utilization rate of the etching solution and reduces production costs but also reduces environmental pollution caused by direct discharge of etching solution. Furthermore, the automatic unloading and collection function of the unloading component enables automatic collection of the etched circuit board, improving the automation level of the entire production process and effectively solving the problems of long etching time, uneven etching solution spraying, and resource waste caused by the inability to recycle and reuse etching solution. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of the spray etching equipment used in the production of circuit boards according to the present invention.

[0021] Figure 2 This is a side view of the spray etching equipment used in the production of circuit boards according to the present invention.

[0022] Figure 3 This is a schematic diagram of the internal structure of the spray etching equipment used in the production of circuit boards according to the present invention.

[0023] Figure 4 This is a cross-sectional schematic diagram of the spray etching equipment used in the production of circuit boards according to the present invention.

[0024] Figure 5 This invention relates to a spray etching device for circuit board production. Figure 4 A magnified structural diagram at point A.

[0025] Figure 6 This is a schematic diagram of the feeding component structure of the spray etching equipment used in the production of circuit boards according to the present invention.

[0026] Figure 7 This is a schematic diagram of the conveying component structure of the spray etching equipment used in the production of circuit boards according to the present invention.

[0027] Figure 8 This is a schematic diagram of the fixed component structure of the spray etching equipment used in the production of circuit boards according to the present invention.

[0028] Figure 9 This is a schematic cross-sectional view of the fixed component of the spray etching equipment used in the production of circuit boards according to the present invention.

[0029] Figure 10 This is a schematic diagram of the unloading component structure of the spray etching equipment used in the production of circuit boards according to the present invention.

[0030] Figure 11 This is a schematic diagram of the spraying component structure of the spraying etching equipment used in the production of circuit boards according to the present invention.

[0031] Figure 12 This invention relates to a spray etching device for circuit board production. Figure 11 A magnified structural diagram at point B.

[0032] Explanation of reference numerals in the attached drawings: 100, Support unit; 101, Protective shell; 102, Flexible baffle one; 200, Transport unit; 201, Feeding assembly; 2011, Transport component; 2012, Electric push rod; 2013, Pushing component; 2014, Arc-shaped limiting plate; 202, Conveying assembly; 2021, Motor; 2022, Drive wheel; 2023, Rotating rod; 2024, Driven wheel; 2025, Conveyor belt; 2026, Rotating shaft; 2027, Belt; 203, Fixing assembly; 2031, Rotating shaft; 2032, Fixing component; 2033, Arched component; 2034, Rotating link. 2035, Rod; 2036, Extrusion Block; 2037, Connecting Plate; 2038, Return Spring 1; 2039, Return Spring 2; 204, Feeding Assembly; 2041, Feeding Component; 2042, Driven Component; 2043, Friction Wheel; 2044, Fixing Plate; 2045, Return Spring 3; 2046, Feeding Block; 300, Spraying Unit; 301, Spraying Assembly; 3011, Storage Component; 3012, Conveying Pipe; 3013, Spraying Pipe; 3014, Nozzle; 3015, Angled Spray Pipe; 3016, Collection Component; 3017, Gap; 3018, Flexible Baffle 2; 3019, Submersible Pump. Detailed Implementation

[0033] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0034] Example 1, referring to Figures 1-4 The first embodiment of the present invention provides a spray etching device for circuit board production. The device includes a support unit 100, a transport unit 200, and a spraying unit 300.

[0035] The support unit 100 includes a protective shell 101 and a flexible baffle 102 disposed at the top of the inside of the protective shell 101.

[0036] The transport unit 200 includes a loading component 201 disposed on one side of the protective shell 101 for loading circuit boards, a conveying component 202 disposed on the loading component 201 for conveying circuit boards, a fixing component 203 disposed on the conveying component 202 for fixing circuit boards, and a unloading component 204 disposed on the other end of the protective shell 101 for unloading. The unloading component 204 cooperates with the fixing component 203 to automatically unload the etched circuit boards.

[0037] The spraying unit 300 includes a spraying assembly 301 disposed on the top of the protective housing 101 for storing and spraying etching solution. The spraying assembly 301 cooperates with the fixing assembly 203 for automatically spraying and etching circuit boards and unloading them after etching. During the etching process, the finished circuit boards are conveyed to the loading assembly 201, which pushes the circuit boards into the protective housing 101. Simultaneously, the loading assembly 201 feeds the circuit boards, pushing them into the fixing assembly 203. As the circuit boards press against the fixing assembly 203, the fixing assembly 203 gradually generates pressure and reverses the pressure to fix the circuit boards. After the fixing assembly 203 has fixed the circuit boards, the conveying assembly 202 drives the fixing assembly 203 and the circuit boards on it downwards. During the downward movement of the fixing assembly 203, the circuit boards touch the loading assembly 201, causing the fixing assembly 203 to rotate on the conveying assembly 202, thereby causing the fixing assembly 203 to rotate. The circuit board 03 becomes perpendicular to the protective housing 101 and is conveyed into the housing. Subsequent circuit boards are continuously pushed by the feeding component 201 into the fixing component 203 for automatic feeding. After feeding, the conveying component 202, carrying the fixing component 203 and the circuit board, moves into the protective housing 101. Then, the spraying component 301 begins spraying etching solution onto the circuit board, initiating etching. Because the circuit board is rotated to a perpendicular position by the fixing component 203, the etching solution is sprayed more evenly. Excess etching solution drips from the circuit board and falls back into the spraying component 301, allowing for recycling and reuse. The etched circuit board, driven by the conveying component 202, moves to the other side of the protective housing 101 and contacts the unloading component 204. Through the squeezing of the fixing component 203 by the unloading component 204 and the cooperation of the conveying component 202, the fixing component 203 contacts and fixes the etched circuit board, thus completing automatic unloading.

[0038] During use, when etching the circuit board, the completed circuit board is conveyed to the feeding component 201. The feeding component 201 pushes the circuit board into the protective shell 101. At the same time, the feeding component 201 feeds the circuit board and pushes it into the fixing component 203. As the circuit board is pressing the fixing component 203, the fixing component 203 gradually generates pressure and performs reverse pressing to fix the circuit board. After the fixing component 203 has fixed the circuit board, the conveying component 202 is driven to move the fixing component 203 and the circuit board on the fixing component 203 downward. During the downward movement of the fixing component 203, the circuit board touches the feeding component 201, causing the fixing component 203 to rotate on the conveying component 202. This makes the fixing component 203 and the circuit board vertical and conveys them into the protective shell 101.

[0039] The circuit board is continuously pushed by the feeding component 201 into the fixed component 203 to complete automatic feeding. After feeding is completed, the conveying component 202 moves the fixed component 203 and the circuit board into the protective shell 101. Then, the spraying component 301 starts working, spraying etching solution onto the circuit board to begin etching. Because the circuit board is rotated into a vertical position by the fixed component 203, the etching solution is sprayed more evenly. At the same time, excess etching solution drips off the circuit board and falls back into the spraying component 301, thus making the spraying component 301 more efficient. 01 allows for the recycling and reuse of excess etching solution. The etched circuit board is driven by the conveying component 202 to move to the other side of the protective shell 101 and contact the unloading component 204. Through the squeezing of the fixing component 203 by the unloading component 204 and the cooperation of the conveying component 202, the fixing component 203 contacts and fixes the etched circuit board while unloading it, thus completing the automatic unloading. This improves the automation level of the entire production process and effectively solves the problems of long etching time, uneven spraying of etching solution, and waste of resources caused by the inability to recycle and reuse etching solution.

[0040] Example 2, refer to Figures 1-9This is the second embodiment of the present invention, which differs from the first embodiment in that: the feeding assembly 201 includes a transport component 2011 disposed on one side of the protective shell 101, an electric push rod 2012 disposed on the transport component 2011, a pusher component 2013 disposed at the output end of the electric push rod 2012, and an arc-shaped limiting plate 2014 disposed inside the transport component 2011, wherein the arc-shaped limiting plate 2014 is slidably connected to the pusher component 2013. When etching the circuit board, the circuit board is transported into the interior of the transport component 2011 and then to the top of the pusher component 2013. The electric push rod 2012 then pushes the circuit board on the top of the pusher component 2013, thereby pushing the circuit board into the interior of the protective shell 101. At the same time, during the pushing process, the arc-shaped limiting plate 2014 limits and guides the circuit board, ensuring that the circuit board completes the fixed-point automatic feeding during the pushing process.

[0041] Compared to Embodiment 1, the conveying assembly 202 further includes a motor 2021 disposed at the rear end of the protective shell 101, a drive wheel 2022 disposed at the output end of the motor 2021, a rotating rod 2023 disposed on the drive wheel 2022, a driven wheel 2024 disposed at the other end of the rotating rod 2023, and a conveyor belt 2025 disposed on the outer diameter of the driven wheel 2024. The conveyor belt 2025 is rotatably connected to the drive wheel 2022. One end of the rotating rod 2023 passes through the drive wheel 2022 and is provided with a rotating shaft 2026. A belt 2027 is disposed on the outer diameter of the rotating shaft 2026 and is connected to the unloading assembly 204. The fixing assembly 203 includes a rotating shaft 2031 disposed on the conveyor belt 2025. A fixing member 2032 is mounted on the rotating shaft 2031; an arched member 2033 is slidably mounted inside the fixing member 2032; a rotating connecting rod 2034 is rotatably mounted inside the arched member 2033; and a pressing block 2035 is rotatably mounted at the other end of the rotating connecting rod 2034. The rotating connecting rod 2034 is fixedly connected to the fixing member 2032, and the pressing block 2035 is slidably connected to the fixing member 2032. One end of the pressing block 2035 is provided with a second return spring 2038, and the other end of the second return spring 2038 is connected to the arched member 2033. A connecting plate 2036 is provided on the arched member 2033, and a first return spring 2037 is provided at the bottom of the connecting plate 2036. The other end of the first return spring 2037 is connected to the fixing member 2032. The connecting plate 2036 is slidably connected to the fixing member 2032. After the electric push rod 2012 pushes the circuit board into the protective shell 101, the circuit board is directly inserted into the fixing member 2032. During the insertion process, the pressing block 2035 is pressed, causing it to slide inside the fixing member 2032 and press the second reset spring 2038. At the same time, the arched member 2033 at the other end of the second reset spring 2038 also begins to pull the connecting plate 2036 and the first reset spring 2037, thereby forcibly pulling the first reset spring 2037 on both sides apart. This causes the first reset spring 2037 to exert a force in the opposite direction, causing the arched member 2033 to press the second reset spring 2038 and the pressing block 2035, thus... The pressure block 2035 begins to exert reverse compressive force on the circuit board, thereby compressing and fixing the circuit board inside the fixing member 2032, firmly securing the circuit board inside the fixing member 2032. After the circuit board is fixed, the motor 2021 begins to drive, causing the drive wheel 2022 and driven wheel 2024 to rotate the conveyor belt 2025 under the transmission of the rotating rod 2023. This causes the rotating shaft 2031 on the conveyor belt 2025 to also begin to rotate with the conveyor belt 2025. During the downward rotation of the rotating shaft 2031, the circuit board touches the transport member 2011, causing the circuit board and the fixing member 2032 to rotate together with the rotating shaft 2031, making the fixing member 2032 and the circuit board a perpendicular state.Driven by motor 2021, it moves into the interior of protective housing 101, ready to begin etching.

[0042] During use, when etching the circuit board, the circuit board is transported into the inside of the transport component 2011 and then to the top of the pusher component 2013. The electric push rod 2012 then pushes the circuit board on the top of the pusher component 2013, pushing the circuit board into the protective shell 101. At the same time, during the pushing process, the arc-shaped limiting plate 2014 limits and guides the circuit board, ensuring that the circuit board completes the fixed-point automatic feeding during the pushing process.

[0043] After the electric push rod 2012 pushes the circuit board into the protective shell 101, the circuit board is directly inserted into the fixing member 2032. During the insertion process, the pressing block 2035 is pressed, causing it to slide inside the fixing member 2032 and press the second reset spring 2038. Simultaneously, the arched member 2033 at the other end of the second reset spring 2038 pulls the connecting plate 2036 and the first reset spring 2037, forcibly pulling the first reset spring 2037 apart. This causes the first reset spring 2037 to exert a force in the opposite direction, causing the arched member 2033 to press the second reset spring 2038 and the pressing block 2035. This causes the pressing block 2035 to exert a reverse pressing force on the circuit board, thus pressing and fixing the circuit board inside the fixing member 2032. After the circuit board is fixed, the motor 2021 starts. The drive begins, causing the driving wheel 2022 and driven wheel 2024 to rotate along the conveyor belt 2025 under the transmission of the rotating rod 2023. This causes the rotating shaft 2031 on the conveyor belt 2025 to rotate as well. As the rotating shaft 2031 rotates downward, the circuit board touches the transport component 2011, causing the circuit board and the fixing component 2032 to rotate together with the rotating shaft 2031. This makes the fixing component 2032 and the circuit board perpendicular to each other, and they move into the protective shell 101 under the drive of the motor 2021, ready to begin etching. This fixes the circuit board and improves its stability during the etching process. At the same time, the rotation and movement of the transport component 202, combined with the flipping action of the fixing component 203, allows the circuit board to automatically flip to a vertical position for etching, increasing the contact area with the etching solution and making the etching more uniform.

[0044] The remaining structure is the same as that in Example 1.

[0045] Example 3, referring to Figures 1-12This is the third embodiment of the present invention. This embodiment differs from the second embodiment in that: a fixing plate 2044 is provided on the top of the feeding component 2041; a return spring 2045 is provided inside the fixing plate 2044; a feeding block 2046 is provided at the other end of the return spring 2045; and the feeding block 2046 is slidably connected to the fixing plate 2044. The spraying assembly 301 includes a storage component 3011 disposed on the top of the protective shell 101, a conveying pipe 3012 disposed at the bottom of the storage component 3011, a spraying pipe 3013 disposed on the conveying pipe 3012, a nozzle 3014 slidably disposed inside the spraying pipe 3013, and an inclined spray pipe 3015 disposed on the outer diameter of the nozzle 3014. The interior of the protective shell 101 is provided with... A collection component 3016 is provided, with an internal opening 3017. A flexible baffle 3018 is provided on the top of the collection component 3016, and a submersible pump 3019 is provided at the bottom of the collection component 3016. The submersible pump 3019 is connected to the storage component 3011. After the fixing component 203 fixes the circuit board and completes the vertical flip, it is transported by the conveying component 202 into the protective shell 101. The etching solution inside the storage component 3011 is then transported to the nozzle 3014 through the conveying pipe 3012 and the spraying pipe 3013. Under the impact of the etching solution, the angled spray pipe 3015 also begins to spray the etching solution. Since the angled spray pipe 3015 is set at an angle, it generates [something] during spraying. The rotating impact force causes the nozzle 3014 to rotate inside the spray pipe 3013, uniformly spraying a large area of ​​the circuit board fixed by the fixing component 203, ensuring the contact area between the circuit board and the etching solution. Because the circuit board is rotated to a vertical position by the fixing component 203, all excess etching solution generated during the spraying of the nozzle 3014 and any dripping etching solution from the circuit board are collected inside the collection component 3016 at the bottom of the protective shell 101. The etching solution is then collected through the upper perforation 3017, allowing for recycling and reuse, avoiding waste. The submersible pump 3019 then transports the etching solution back to the storage component 3011. After the circuit board etching is complete, the transport component 202 continues... The circuit board continues to be conveyed. During the conveying process, the circuit board is squeezed against the flexible baffle 3018, causing the circuit board and the fixing component 203 to rotate again. This causes the circuit board to return to a horizontal position and move upward. When it reaches the bottom of the fixing plate 2044, the feeding block 2046 inside the fixing plate 2044 squeezes the arched component 2033, causing the arched component 2033 to squeeze the reset spring 2038 again. This causes the rotating connecting rod 2034 to rotate and adjust, thereby causing the squeezing block 2035 to detach from the surface of the circuit board, making the circuit board contact and fix it. At the same time, the motor 2021 drives the rotating shaft 2026 and the belt 2027 to rotate the driven component 2042. The friction wheel 2043 on the outer diameter of the driven component 2042 rubs against the circuit board.The circuit board is extracted from the fixing component 203, completing the automatic unloading of the circuit board. After unloading, the fixing component 203 is pressed back into a vertical state by the unloading block 2046. When it is conveyed to the other end of the conveying component 202, it is blocked again by the flexible baffle 102, changing from a vertical state to a horizontal state. Then, it cooperates with the loading component 201 to load and fix the circuit board, thus completing the entire process of automatic loading, etching, and unloading.

[0046] During use, after the fixing component 203 fixes the circuit board and completes its vertical flip, it is conveyed by the conveying component 202 into the protective housing 101. The etching solution inside the storage component 3011 is then conveyed to the nozzle 3014 through the conveying pipe 3012 and the spraying pipe 3013. Under the impact of the etching solution, the angled spray pipe 3015 also begins to spray the etching solution. Because the angled spray pipe 3015 is angled, it generates a rotational impact force during spraying, causing the nozzle 3014 to rotate inside the spraying pipe 3013, thus beginning to impact the fixing component. The circuit board fixed by component 203 is sprayed evenly over a large area to ensure the contact area between the circuit board and the etching solution. Since the circuit board is rotated into a vertical state by the fixing component 203, the excess etching solution generated when the nozzle 3014 sprays the circuit board and the etching solution dripping from the circuit board are all collected in the collection component 3016 at the bottom of the protective shell 101. The etching solution is collected through the hole 3017 on the collection component 3016, so that the etching solution can be recycled and reused to avoid waste. The etching solution is then sent back to the storage component 3011 by the submersible pump 3019.

[0047] After the circuit board etching is completed, the conveying assembly 202 continues to convey the circuit board. During the conveying process, the circuit board is squeezed against the flexible baffle 3018, causing the circuit board and the fixing assembly 203 to rotate again, making the circuit board return to a horizontal position and move upward. When it reaches the bottom of the fixing plate 2044, the feeding block 2046 inside the fixing plate 2044 squeezes the arched part 2033, causing the arched part 2033 to squeeze the reset spring 2038 again, causing the rotating connecting rod 2034 to rotate and adjust, thereby causing the squeezing block 2035 to detach from the surface of the circuit board, making the circuit board contact and fix it. At the same time, the motor 2 021 drives the rotating shaft 2026 and belt 2027 to rotate the driven member 2042. The friction wheel 2043 on the outer diameter of the driven member 2042 rubs against the circuit board, pulling the circuit board out from the inside of the fixing component 203, completing the automatic unloading of the circuit board. After unloading is completed, the fixing component 203 is squeezed by the unloading block 2046 and becomes vertical again. When it is transported to the other end of the conveying component 202, it is blocked again by the soft baffle 102 and becomes horizontal again. It then cooperates with the loading component 201 to load and fix the circuit board, thus completing the entire process of automatic loading, etching and unloading.

[0048] The remaining structure is the same as that in Example 2.

[0049] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A spray etching device for circuit board production, characterized in that: include: The support unit (100) includes a protective shell (101) and a flexible baffle (102) disposed at the top inside the protective shell (101). The transport unit (200) includes a loading assembly (201) disposed on one side of the protective shell (101) for loading circuit boards, a conveying assembly (202) disposed on the loading assembly (201) for conveying circuit boards, a fixing assembly (203) disposed on the conveying assembly (202) for fixing circuit boards, and a unloading assembly (204) disposed on the other end of the protective shell (101) for unloading. The unloading assembly (204) cooperates with the fixing assembly (203) to automatically unload the etched circuit boards. The spraying unit (300) includes a spraying assembly (301) disposed on the top of the protective shell (101) for storing and spraying etching solution, and the spraying assembly (301) cooperates with the fixing assembly (203) for automatically spraying and etching the circuit board and unloading the board after etching is completed. The feeding assembly (201) includes a transport component (2011) disposed on one side of the protective shell (101), an electric push rod (2012) disposed on the transport component (2011), a pusher (2013) disposed at the output end of the electric push rod (2012), and an arc-shaped limiting plate (2014) disposed inside the transport component (2011), wherein the arc-shaped limiting plate (2014) is slidably connected to the pusher (2013); The conveying assembly (202) includes a motor (2021) disposed at the rear end of the protective shell (101), a drive wheel (2022) disposed at the output end of the motor (2021), a rotating rod (2023) disposed on the drive wheel (2022), a driven wheel (2024) disposed at the other end of the rotating rod (2023), and a conveyor belt (2025) disposed on the outer diameter of the driven wheel (2024), and the conveyor belt (2025) is rotatably connected to the drive wheel (2022); The fixing component (203) includes a rotating shaft (2031) disposed on the conveyor belt (2025), a fixing member (2032) rotatably disposed on the rotating shaft (2031), an arched member (2033) slidably disposed inside the fixing member (2032), a rotating connecting rod (2034) rotatably disposed inside the arched member (2033), and an extrusion block (2035) rotatably disposed at the other end of the rotating connecting rod (2034). The rotating connecting rod (2034) is fixedly connected to the fixing member (2032), and the extrusion block (2035) is slidably connected to the fixing member (2032).

2. The spray etching equipment for circuit board production according to claim 1, characterized in that: One end of the rotating rod (2023) passes through the drive wheel (2022) and is provided with a rotating shaft (2026). A belt (2027) is provided on the outer diameter of the rotating shaft (2026), and the belt (2027) is connected to the feeding assembly (204).

3. The spray etching equipment for circuit board production according to claim 1, characterized in that: One end of the extrusion block (2035) is provided with a second return spring (2038), and the other end of the second return spring (2038) is connected to the arched part (2033). A connecting plate (2036) is provided on the arched part (2033), and a first return spring (2037) is provided at the bottom of the connecting plate (2036). The other end of the first return spring (2037) is connected to the fixing part (2032), and the connecting plate (2036) and the fixing part (2032) are slidably connected.

4. The spray etching equipment for circuit board production according to claim 3, characterized in that: The feeding assembly (204) includes a feeding component (2041) disposed on the other side of the protective shell (101), a driven component (2042) disposed inside the feeding component (2041), and a friction wheel (2043) disposed on the outer diameter of the driven component (2042), and the driven component (2042) is connected to the belt (2027).

5. The spray etching equipment for circuit board production according to claim 4, characterized in that: The top of the unloading part (2041) is provided with a fixing plate (2044), and the inside of the fixing plate (2044) is provided with a reset spring three (2045). The other end of the reset spring three (2045) is provided with an unloading block (2046), and the unloading block (2046) is slidably connected to the fixing plate (2044).

6. The spray etching equipment for circuit board production according to claim 5, characterized in that: The spraying assembly (301) includes a storage unit (3011) disposed on the top of the protective housing (101), a delivery pipe (3012) disposed on the bottom of the storage unit (3011), a spraying pipe (3013) disposed on the delivery pipe (3012), a nozzle (3014) slidably disposed inside the spraying pipe (3013), and an inclined spraying pipe (3015) disposed on the outer diameter of the nozzle (3014).

7. The spray etching equipment for circuit board production according to claim 6, characterized in that: The protective shell (101) has a collection component (3016) inside, the collection component (3016) has a hole (3017) inside, the top of the collection component (3016) has a soft baffle (3018), the bottom of the collection component (3016) has a submersible pump (3019), and the submersible pump (3019) is connected to the storage component (3011).

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