Guide mechanism of multilayer circuit board pressing equipment

Abstract

The invention discloses a guide mechanism of multilayer circuit board pressing equipment. The guide mechanism comprises a first guide column and a second guide column which are arranged on a base of the pressing equipment, the number of the first guide columns and the number of the second guide columns are both multiple, and the multiple first guide columns and the multiple second guide columns are both vertically arranged on the base. The first guide column and the second guide column are arranged around a pressing table on the base; the diameters of all axial positions on the first guide column are the same; the diameter of the second guide column is gradually increased in the direction from the top of the second guide column to the bottom of the second guide column, and the diameter of the largest diameter of the second guide column is the same as the diameter of the first guide column. According to the guide mechanism of the multilayer circuit board pressing equipment, the guide columns are divided into the first guide column and the second guide column, due to the variable-diameter design of the second guide column, the pressing plate is separated from the second guide column after rising to a certain distance, and therefore the speed of the pressing plate can be increased, and the machining efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production, in particular to a guide mechanism of a multi-layer circuit board pressing device. Background Art

[0002] During the production process of multi-layer circuit boards, the multi-layer structure needs to be pressed together. Therefore, the accuracy of the pressing equipment determines the yield rate of the final product. The guide mechanism of traditional pressing equipment is to set several guide pillars on the base. For products with high precision requirements, the number of guide pillars is large, and for products with low precision requirements, the number of guide pillars is small. However, for products with high precision requirements, the increase in the number of guide pillars also brings some problems. For example, the more guide pillars there are, the slower the lifting speed of the pressure plate on the guide pillars needs to be. More guide pillars will lead to a decrease in processing efficiency. Summary of the Invention

[0003] In order to address the deficiencies in the prior art, the present invention provides a guiding mechanism for a multi-layer circuit board pressing device. The guiding mechanism of the multi-layer circuit board pressing device is achieved by dividing the guide column into a first guide column and a second guide column. Since the second guide column has a variable diameter design, the pressing plate will detach from the second guide column after rising to a certain distance. Therefore, the pressing plate can increase its speed in the subsequent lifting stroke to improve processing efficiency. The diameter of the bottom of the second guide column ensures sufficient accuracy during the pressing process.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] The present invention provides a guide mechanism for a multilayer circuit board pressing device, comprising a first guide post and a second guide post provided on a base of the pressing device;

[0006] There are multiple first guide posts and second guide posts, and the multiple first guide posts and second guide posts are vertically arranged on the base;

[0007] The first guide column and the second guide column are arranged around the pressing platform on the base;

[0008] The diameters of the first guide column at various axial positions are the same;

[0009] The diameter of the second guide post gradually increases from the top to the bottom of the second guide post, and the diameter of the second guide post at the maximum diameter is the same as the diameter of the first guide post.

[0010] The guide mechanism of the multi-layer circuit board pressing device of the present invention is achieved by dividing the guide column into a first guide column and a second guide column. The second guide column has a variable diameter design, so the pressing plate will separate from the second guide column after rising to a certain distance. Therefore, the pressing plate can increase its speed in the subsequent lifting stroke to improve processing efficiency. The diameter of the bottom of the second guide column ensures sufficient accuracy during the pressing process.

[0011] In a further technical solution, the first guide post and the second guide post are spaced apart.

[0012] The intervals are set to keep the distance between the first guide posts as large as possible to avoid local force changes.

[0013] In a further technical solution, the number of the second guide pillars is greater than the number of the first guide pillars.

[0014] Since the second guide post plays the same role as the first guide post in terms of final precision, the more second guide posts there are, the higher the processing efficiency.

[0015] In a further technical solution, the number of the first guide pillars is at least 3.

[0016] At least three first guide pillars can ensure the stability of the pressing plate throughout the entire ascending process.

[0017] The beneficial effects are:

[0018] 1. The guide mechanism of the multi-layer circuit board pressing device of the present invention is divided into a first guide column and a second guide column. The second guide column has a variable diameter design, so the pressing plate will separate from the second guide column after rising to a certain distance. Therefore, the pressing plate can increase its speed in the subsequent lifting stroke to improve processing efficiency. The diameter of the bottom of the second guide column ensures sufficient accuracy during the pressing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the structure of the guide mechanism of the multilayer circuit board pressing device according to an embodiment of the present invention.

[0020] 10. Base; 20. Pressing platform; 30. First guide column; 40. Second guide column. DETAILED DESCRIPTION

[0021] The present invention will be further described below in conjunction with the accompanying drawings:

[0022] Example:

[0023] A guide mechanism for a multi-layer circuit board pressing device, such as Figure 1 As shown, it includes a first guide post 30 and a second guide post 40 established on the base 10 of the pressing device;

[0024] There are multiple first guide posts 30 and second guide posts 40, and the multiple first guide posts 30 and second guide posts 40 are vertically arranged on the base 10;

[0025] The first guide post 30 and the second guide post 40 are arranged around the press platform 20 on the base 10;

[0026] The diameters of the first guide column 30 at various axial positions are the same;

[0027] The diameter of the second guide post 40 gradually increases from the top to the bottom of the second guide post 40 , and the diameter of the second guide post 40 at its largest point is the same as the diameter of the first guide post 30 .

[0028] The guide mechanism of the multi-layer circuit board pressing device of the present invention is achieved by dividing the guide column into a first guide column 30 and a second guide column 40. The second guide column 40 has a variable diameter design, so the pressing plate will separate from the second guide column 40 after rising to a certain distance. Therefore, the pressing plate can increase its speed in the subsequent lifting stroke to improve processing efficiency. The diameter of the bottom of the second guide column 40 ensures sufficient accuracy during the pressing process.

[0029] In another embodiment, the first guide post 30 and the second guide post 40 are spaced apart from each other.

[0030] The intervals are set to keep the distance between the first guide posts 30 as large as possible to avoid local force changes.

[0031] In another embodiment, the number of the second guide pillars 40 is greater than the number of the first guide pillars 30 .

[0032] Since the second guide posts 40 play the same role as the first guide posts 30 in terms of final precision, more second guide posts 40 lead to higher processing efficiency.

[0033] In another embodiment, the number of the first guide pillars 30 is at least three.

[0034] At least three first guide pillars 30 can ensure the stability of the pressing plate throughout the entire ascending process.

[0035] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and modifications fall within the scope of the invention as claimed.

Claims

1. A guide mechanism for a multi-layer circuit board pressing device, characterized in that: It includes a first guide post and a second guide post set on the base of the pressing device; There are multiple first guide posts and second guide posts, and the multiple first guide posts and second guide posts are vertically arranged on the base; The first guide column and the second guide column are arranged around the pressing platform on the base; The diameters of the first guide column at various axial positions are the same; The diameter of the second guide post gradually increases from the top to the bottom of the second guide post, and the diameter of the second guide post at the maximum diameter is the same as the diameter of the first guide post.

2. The guide mechanism of the multilayer circuit board pressing device according to claim 1, characterized in that: The first guide post and the second guide post are spaced apart.

3. The guide mechanism of the multi-layer circuit board pressing device according to claim 1, characterized in that: The number of the second guide pillars is greater than that of the first guide pillars.

4. The guide mechanism of the multilayer circuit board pressing device according to claim 3, characterized in that: The number of the first guide pillars is at least 3.

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