Display panel and preparation method thereof

Abstract

The invention discloses a display panel and a preparation method of the display panel. The display panel comprises a substrate and a first electrode, a communicating hole is formed in one side of the base plate; the first electrode is arranged on one side of the substrate, the first electrode comprises a first conductive structure and a filling part, the first conductive structure comprises a body part and a groove part which are electrically connected, the groove part is sunken towards the substrate at the communicating hole to form a groove, and at least part of the filling part is located in the groove; in the thickness direction of the display panel, the distance between the surface of the side, away from the substrate, of the filling part and the surface of the side, away from the substrate, of the body part is smaller than or equal to 4000 angstroms. The use performance of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the display panel. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, power saving, thin body, and wide range of applications, becoming the mainstream display device.

[0003] In the traditional display panel manufacturing process, pixel patterning is typically achieved through a fine metal mask (FMM). FMM technology is mature and has extensive mass production experience. However, FMM technology also has issues such as limited precision, high development costs, and long development cycles. Fine metal mask-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance, offering the advantages of high performance, full-area sizing, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe the fine metal mask-free technology for reference.

[0004] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0005] The embodiments of the present application provide a display panel and a method for manufacturing the display panel, aiming to improve the performance of OLED display products.

[0006] A first aspect of the present application provides a display panel, comprising a substrate and a first electrode; a connecting hole is provided on one side of the substrate; the first electrode is disposed on one side of the substrate, the first electrode comprising a first conductive structure and a filling portion, the first conductive structure comprising an electrically connected main body portion and a groove portion, the groove portion being recessed toward the substrate at the connecting hole to form a groove, and the filling portion being at least partially located within the groove; wherein, along the thickness direction of the display panel, a distance between a surface of the filling portion facing away from the substrate and a surface of the main body portion facing away from the substrate is less than or equal to 4000 angstroms.

[0007] According to an embodiment of the first aspect of the present application, a distance between a surface of the filling portion facing away from the substrate and a surface of the main body portion facing away from the substrate is less than or equal to 2000 angstroms.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the distance between the surface of the filling portion facing away from the substrate and the surface of the main body portion facing away from the substrate is less than or equal to 1000 angstroms.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the distance between the surface of the filling portion facing away from the substrate and the surface of the main body portion facing away from the substrate is less than or equal to 500 angstroms.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, a surface of the filling portion facing away from the substrate is located in a first plane, and the first plane is perpendicular to the thickness direction.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the surface of the main body portion facing away from the substrate is located in the second plane, and the second plane is perpendicular to the thickness direction.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the first plane coincides with the second plane.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, along the thickness direction, the maximum distance between the surface of the filling portion facing away from the substrate and the substrate is the first distance, the minimum distance is the second distance, and the difference between the first distance and the second distance is less than or equal to 4000 angstroms.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the difference between the first distance and the second distance is less than or equal to 2000 angstroms.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the difference between the first distance and the second distance is less than or equal to 1000 angstroms.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, the difference between the first distance and the second distance is less than or equal to 500 angstroms.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the first distance is equal to the second distance.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the distance between the side surface of the main body facing away from the substrate and the substrate is the fifth distance, and the first distance is greater than or equal to the fifth distance; or, the first distance is less than the fifth distance.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, the second distance is less than or equal to the fifth distance.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the filling portion on the substrate is located within the orthographic projection of the groove portion on the substrate.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the filling portion on the substrate is located within the orthographic projection of the groove on the substrate.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the main body on the substrate is located outside the orthographic projection of the groove on the substrate.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the first electrode further includes a second conductive structure, the second conductive structure is located on a side of the filling portion facing away from the substrate, and the second conductive structure is connected to the main body portion.

[0024] According to any of the foregoing embodiments of the first aspect of the present application, along the thickness direction of the display panel, the maximum distance between the surface of the second conductive structure facing away from the substrate and the substrate is the third distance, the minimum distance is the fourth distance, and the difference between the third distance and the fourth distance is less than or equal to 4000 angstroms.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the difference between the third distance and the fourth distance is less than or equal to 2000 angstroms.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, the difference between the third distance and the fourth distance is less than or equal to 1000 angstroms.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, the difference between the third distance and the fourth distance is less than or equal to 500 angstroms.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, the third distance is equal to the fourth distance.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the filling portion on the substrate is located within the orthographic projection of the second conductive structure on the substrate.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the second conductive structure on the substrate is located within the orthographic projection of the first conductive structure on the substrate; or, the orthographic projection of the first conductive structure on the substrate is located within the orthographic projection of the second conductive structure on the substrate.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, at least one of the first conductive structure and the second conductive structure includes a reflective conductive material.

[0032] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the second conductive structure is greater than the thickness of the first conductive structure.

[0033] According to any of the aforementioned embodiments of the first aspect of the present application, the second conductive structure includes a silver layer and an indium tin oxide layer stacked in sequence in a direction away from the substrate.

[0034] According to any of the aforementioned embodiments of the first aspect of the present application, the second conductive structure includes an indium tin oxide layer, a silver layer, and an indium tin oxide layer stacked in sequence in a direction away from the substrate.

[0035] According to any of the aforementioned embodiments of the first aspect of the present application, the second conductive structure includes a reflective conductive material, and the first conductive structure is a light-transmitting conductive material.

[0036] According to any of the aforementioned embodiments of the first aspect of the present application, the first conductive structure includes an indium tin oxide layer.

[0037] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the filling part includes an organic material.

[0038] According to any of the aforementioned embodiments of the first aspect of the present application, the substrate includes a substrate, a driving device layer and a first insulating layer; the driving device layer is arranged on one side of the substrate, and the driving device layer includes a plurality of pixel driving circuits; the first insulating layer is arranged on the side of the driving device layer away from the substrate, and the first insulating layer is formed with a connecting hole, and the main body portion is electrically connected to the corresponding pixel driving circuit through the groove portion.

[0039] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes a pixel definition layer and a light-emitting layer, the pixel definition layer includes a pixel defining portion arranged on the side of the first electrode facing away from the substrate, a pixel opening is provided on the pixel defining portion, the light-emitting layer is at least partially located within the pixel opening, and at least part of the surface of the first electrode is exposed from the pixel opening and connected to the light-emitting layer.

[0040] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the connecting hole on the substrate is located within the orthographic projection of the light-emitting layer on the substrate.

[0041] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the connecting hole on the substrate is located within the orthographic projection of the pixel opening on the substrate.

[0042] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes an isolation structure arranged on one side of the substrate, the isolation structure has an isolation opening connected to the pixel opening, and the orthographic projection of the connecting hole on the substrate at least partially overlaps with the orthographic projection of the isolation opening on the substrate.

[0043] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the connecting hole on the substrate is located within the orthographic projection of the isolation opening on the substrate.

[0044] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the first conductive structure on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate.

[0045] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first sublayer and a second sublayer located on the side of the first sublayer facing away from the substrate, and the second sublayer is arranged to protrude from the first sublayer toward the isolation opening.

[0046] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the isolation structure includes a conductive material, and the display panel further includes a second electrode arranged on the side of the light-emitting layer away from the substrate, and the second electrode is electrically connected to the isolation structure.

[0047] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure further includes a third sublayer located on the side of the first sublayer facing the substrate, and the third sublayer is arranged to protrude from the first sublayer toward the isolation opening.

[0048] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the first sub-layer includes a conductive material, and / or the material of the third sub-layer includes a conductive material.

[0049] The first aspect embodiment of the present application also provides a display panel, including a substrate and a first electrode, a connecting hole is opened on one side of the substrate; the first electrode is arranged on one side of the substrate, the first electrode includes a first conductive structure, a filling portion and a second conductive structure, the first conductive structure includes an electrically connected main body portion and a groove portion, the groove portion is recessed toward the substrate at the connecting hole to form a groove, the filling portion is at least partially located in the groove, the second conductive structure is located on the side of the filling portion away from the substrate, and the second conductive structure is connected to the main body portion; wherein, along the thickness direction of the display panel, the maximum distance between the surface of the second conductive structure on the side away from the substrate and the substrate is a third distance, the minimum distance is a fourth distance, and the difference between the third distance and the fourth distance is less than or equal to 4000 angstroms.

[0050] According to an implementation of the first aspect of the present application, the difference between the third distance and the fourth distance is less than or equal to 2000 angstroms.

[0051] According to any of the aforementioned embodiments of the first aspect of the present application, the difference between the third distance and the fourth distance is less than or equal to 1000 angstroms.

[0052] According to any of the aforementioned embodiments of the first aspect of the present application, the difference between the third distance and the fourth distance is less than or equal to 500 angstroms.

[0053] According to any of the aforementioned embodiments of the first aspect of the present application, the third distance is equal to the fourth distance.

[0054] An embodiment of a second aspect of the present application provides a method for manufacturing a display panel, which is used to manufacture the display panel provided by any embodiment of the first aspect, and the manufacturing method includes:

[0055] opening a communication hole on the substrate;

[0056] A first conductive structure is prepared on the substrate, the first conductive structure comprising an electrically connected body portion and a groove portion, wherein the groove portion is recessed toward the substrate at the communicating hole to form a groove;

[0057] Preparing a filling material layer on the substrate, wherein the filling material layer covers the first conductive structure and fills the groove and extends beyond the notch of the groove;

[0058] The filling material layer is patterned using a mask to form a filling portion in the filling material layer, wherein the patterning process for the filling material layer includes half-exposing the filling material located on a side of the filling portion away from the substrate.

[0059] According to an embodiment of the second aspect of the present application, the mask includes a first mask, the first mask includes a first area and a second area connected to each other, the first area is arranged opposite to the connecting hole, and the transmittance of the first area is less than the transmittance of the second area.

[0060] According to any of the aforementioned embodiments of the second aspect of the present application, the step of patterning the filling material layer using a mask includes:

[0061] exposing the filling material layer through a first mask;

[0062] Developing to remove the filling material layer that has undergone photochemical reaction;

[0063] The remaining filling material layer is baked to make it level and form a filling portion.

[0064] According to any of the aforementioned embodiments of the second aspect of the present application, the first mask is a halftone mask; after the step of developing and removing the filling material layer that undergoes a photochemical reaction, the filling material layer forms a first pre-filled portion, and the first pre-filled portion is partially protruded on the surface of the side facing away from the substrate.

[0065] According to any of the aforementioned embodiments of the second aspect of the present application, the first mask is a grayscale mask; after the step of developing and removing the filling material layer that undergoes a photochemical reaction, the filling material layer forms a second pre-filled portion, and the surface of the second pre-filled portion on the side facing away from the substrate is serrated.

[0066] According to any of the aforementioned embodiments of the second aspect of the present application, the step of patterning the filling material layer using a mask to form a filling portion in the filling material layer includes:

[0067] The light-transmitting area of ​​the second mask is arranged opposite to the groove, and the filling material layer is half-exposed through the second mask;

[0068] The light-transmitting area of ​​the third mask is arranged to avoid the groove, and the filling material layer is exposed through the third mask;

[0069] Developing to remove the filling material layer that has undergone photochemical reaction;

[0070] The remaining filling material layer is baked to make it level and form a filling portion.

[0071] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the filling material layer is positive photoresist.

[0072] According to any of the aforementioned embodiments of the second aspect of the present application, after forming the filling portion, the preparation method further includes:

[0073] A second conductive structure is prepared on the substrate, and the second conductive structure is connected to the main body.

[0074] An embodiment of the third aspect of the present application provides a display device, which includes the display panel provided by any embodiment of the first aspect above, or includes the display panel prepared by any embodiment of the second aspect above.

[0075] According to an embodiment of the present application, the display panel includes a substrate and a first electrode. A filling portion fills the groove, thereby improving the flatness of a film layer formed on the first conductive structure. Furthermore, the maximum height difference between the surface of the filling portion facing away from the substrate and the surface of the main portion facing away from the substrate is less than or equal to 2000 angstroms. This further reduces the impact of the first electrode depression caused by the communication hole on the flatness of a film layer subsequently formed thereon, thereby ensuring that the film layer structure subsequently formed on the first conductive structure also has a relatively good flatness. This can effectively improve the structural stability of the display panel, reduce the risk of abnormal display and uneven light emission of the OLED device due to insufficient flatness of the first electrode, and improve the display effect and performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0077] Figure 1 is a structural diagram of a display panel provided in an embodiment of the present application;

[0078] Figure 2This is one of the schematic diagrams of a partial cross-sectional structure of a display panel provided in an embodiment of the present application;

[0079] Figure 3 is a schematic diagram of a partial top view of a display panel provided in an embodiment of the present application;

[0080] Figure 4 This is a second schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application;

[0081] Figure 5 is a schematic diagram of the anode structure of a display panel in the related art;

[0082] Figure 6 This is one of the cross-sectional views of a first electrode in a display panel provided by an embodiment of the present application;

[0083] Figure 7 This is a second cross-sectional view of a first electrode in a display panel provided in an embodiment of the present application;

[0084] Figure 8 This is a third cross-sectional view of a first electrode in a display panel provided in an embodiment of the present application;

[0085] Figure 9 This is a fourth cross-sectional view of a first electrode in a display panel provided in an embodiment of the present application;

[0086] Figure 10 This is a fifth cross-sectional view of a first electrode in a display panel provided in an embodiment of the present application;

[0087] Figure 11 This is a third schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application;

[0088] Figure 12 1 is a flow chart of a method for manufacturing a display panel provided in the first embodiment of the present application;

[0089] Figure 13 1 is a flow chart of a method for manufacturing a display panel provided in a second embodiment of the present application;

[0090] Figure 14 This is a schematic diagram of structural changes in a method for manufacturing a display panel provided in the second embodiment of the present application;

[0091] Figure 15 1 is a flow chart of a method for manufacturing a display panel provided in the third embodiment of the present application;

[0092] Figure 16 This is one of the schematic diagrams of structural changes in a method for manufacturing a display panel provided in the third embodiment of the present application;

[0093] Figure 17 This is the second schematic diagram of structural changes in a method for manufacturing a display panel provided in the third embodiment of the present application.

[0094] Description of reference numerals:

[0095] AA, display area; NA, non-display area;

[0096] 1. Substrate; 10. Connecting hole; 11. Underlay; 12. Driver device layer; 121. Pixel driver circuit; 122. Conductive connection portion; 13. First insulating layer;

[0097] 2. Pixel definition layer; 20. Pixel opening; 21. Pixel defining portion;

[0098] 3. Isolation structure; 30. Isolation opening; 31. First sublayer; 32. Second sublayer; 33. Third sublayer;

[0099] 40. Light-emitting layer; 41. First electrode; 411. First conductive structure; 411a. Body; 411b. Groove; 411c. Groove; 412. Filling portion; 413. Second conductive structure; 42. Second electrode;

[0100] 5. First packaging layer; 50. Packaging part;

[0101] 100, first mask; 101, first region; 102, second region; 200, second mask; 300, third mask;

[0102] 400, filling material layer; 401, first pre-filling portion; 402, second pre-filling portion. DETAILED DESCRIPTION

[0103] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0104] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0105] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or region, it may mean that it is directly on the other layer or region, or that other layers or regions are included between it and the other layer or region. Furthermore, if the component is turned over, the layer or region will be "below" or "beneath" the other layer or region.

[0106] In the related art, the anode needs to be electrically connected to the conductive part of the underlying film layer, and an insulating layer is provided between the anode and the conductive part. Therefore, a through hole needs to be opened in the insulating layer to electrically connect the two. The setting of the through hole will cause the anode to be recessed toward the through hole when preparing the anode, resulting in poor flatness of the side of the anode facing away from the substrate, affecting the subsequent preparation of the light-emitting functional layer electrically connected to the anode and the light-emitting effect, thereby resulting in lower display effect and performance of the display panel.

[0107] Embodiments of the present application provide a display panel and a method for manufacturing the display panel. Detailed description of the embodiments of the display panel and the method for manufacturing the display panel will be given below with reference to the accompanying drawings.

[0108] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.

[0109] Please also refer to Figures 1 to 6In a first aspect, an embodiment of the present application provides a display panel, which includes a substrate 1 and a first electrode 41; a connecting hole 10 is provided on one side of the substrate 1; the first electrode 41 is arranged on one side of the substrate 1, and the first electrode 41 includes a first conductive structure 411 and a filling portion 412, and the first conductive structure 411 includes an electrically connected main body portion 411a and a groove portion 411b, the groove portion 411b is recessed toward the substrate 1 at the connecting hole 10 to form a groove 411c, and the filling portion 412 is at least partially located in the groove 411c; wherein, along the thickness direction of the display panel, the distance between the side surface of the filling portion 412 facing away from the substrate 1 and the side surface of the main body portion 411a facing away from the substrate 1 is less than or equal to 4000 angstroms.

[0110] Optional, such as Figure 1 As shown, the display panel includes a display area AA and a non-display area NA. A plurality of first electrodes 41 are arranged at intervals and are all located in the display area AA. Optionally, the first electrodes 41 are used to electrically connect to a light-emitting layer 40 disposed on a side of the first electrodes 41 facing away from the substrate 1. The light-emitting layer 40 is used to realize light-emitting display of the display panel.

[0111] Optionally, the orthographic projection direction of a structure in this application on the substrate 1 can refer to Figure 2 The Z-axis direction in the figure, at the same time, the direction shown by the Z-axis can also be the thickness direction of the display panel.

[0112] Optionally, the orthographic projection of structures such as "opening", "through hole" or "groove" on the substrate 1 in this application can be understood as: the area enclosed by the orthographic projection boundary of the structure that encloses the "opening", "through hole" or "groove" on the substrate 1.

[0113] In a display panel provided in an embodiment of the present application, the display panel includes a substrate 1 and a first electrode 41. A communication hole 10 is provided on one side of the substrate 1. The first electrode 41 can be electrically connected to a driving circuit in the substrate 1 through the communication hole 10, so that the first electrode 41 can serve as a pixel electrode of the display panel to participate in driving the display panel to emit light.

[0114] Due to the existence of the connecting hole 10 and the thin thickness of the electrode material, the groove portion 411 b of the first conductive structure 411 is recessed toward the substrate 1 at the connecting hole 10 to form a groove 411 c , and the main body portion 411 a can be located outside the connecting hole 10 . The filling portion 412 filled in the groove 411c can improve the flatness of the film layer prepared on the first conductive structure 411, and, in the thickness direction of the display panel, the distance between the side surface of the filling portion 412 facing away from the substrate 1 and the side surface of the main body portion 411a facing away from the substrate 1 is less than or equal to 4000 angstroms, that is, the maximum height difference between the side surface of the filling portion 412 facing away from the substrate 1 and the side surface of the main body portion 411a facing away from the substrate 1 is less than or equal to 4000 angstroms, which can further reduce the impact of the depression of the first electrode 41 caused by the connecting hole 10 on the flatness of the film layer subsequently prepared thereon, so that the film layer structure subsequently prepared on the first conductive structure 411 can also have a good degree of flatness, which can better improve the structural stability of the display panel, reduce the risks of abnormal display and uneven light emission of the OLED device due to insufficient flatness of the first electrode 41, improve the flatness and light-emitting effect of the light-emitting layer 40 subsequently electrically connected to the first electrode 41, and thereby improve the display effect and performance of the display panel.

[0115] Optionally, the first conductive structure 411 is thin and has poor leveling effect, so the morphology of the portion of the first conductive structure 411 covering the connecting hole 10 is similar to the morphology of the connecting hole 10 , thereby forming a groove 411 c recessed toward the substrate 1 .

[0116] Reference Figure 5 In the related art, the anode is flattened by filling holes with an organic film in the groove to improve the light uniformity of the OLED device. However, during the exposure process of the organic film hole filling, the light intensity distribution in the actual exposure area changes in a gradient (not a step change) due to the light diffraction effect at the edge of the mask pattern, resulting in a gradual change in the photochemical reaction intensity at the junction of the exposed area and the non-exposed area in the photoresist, forming a photoresist slope angle; the conventional single exposure and development application in the anode flattening hole filling process will cause the surface of the anode Anode to have a gradient greater than Insufficient anode flatness can cause differences in hole injection efficiency, leading to uneven light emission and brightness differences in OLED devices.

[0117] contrast Figure 6 and Figure 5 The present application proposes a new preparation method, which can effectively reduce the filling step difference of the filling part 412, reduce the risk of abnormal display and uneven light emission of the OLED device due to insufficient flatness of the first electrode 41, and improve the flatness and light-emitting effect of the subsequent light-emitting layer 40 electrically connected to the first electrode 41.

[0118] Compared with the conventional single exposure and development process, in the preparation method of the present application, the material forming the filling portion 412 can be exposed twice in different areas, and the two exposures are diffracted and superimposed to reduce the thickness and step difference of the filling material; a halftone mask (Half Tone Mask) or a grayscale mask (Gray Tone Mask) can also be used to expose the filling material, and a single yellow light process can achieve the effect of two exposures, while reducing the CD error (Critical Dimension) and Overlay error between the two yellow light processes that cause the increase in the step difference of the residual film of the filling material, further improving the flatness of the first electrode 41.

[0119] Reference Figure 4 Optionally, the light-emitting device in the display panel includes a first electrode 41, a light-emitting layer 40, and a second electrode 42, which are stacked in sequence in a direction away from the substrate 1. One of the first electrode 41 and the second electrode 42 can serve as an anode, and the other can serve as a cathode to drive the light-emitting layer 40 to emit light. In the embodiment of the present application, the first electrode 41 is used as the anode of the display panel, and the second electrode 42 is used as the cathode of the display panel.

[0120] Optionally, the light-emitting device may further include one or more of a hole injection layer (HIL), a hole transport layer (HTL), and an electron blocking layer located between the first electrode 41 and the light-emitting layer 40; the light-emitting device may further include one or more of a hole blocking layer, an electron injection layer (EIL), and an electron transport layer (ETL) located between the light-emitting layer 40 and the second electrode 42.

[0121] Optionally, the distance between the surface of the filling portion 412 facing away from the substrate 1 and the surface of the main body portion 411a facing away from the substrate 1 is less than or equal to 2000 angstroms, thereby improving the flatness of the internal film layer of the light-emitting device and reducing the risk of defects in the light-emitting effect of the light-emitting device.

[0122] Optionally, the distance between the surface of the filling portion 412 facing away from the substrate 1 and the surface of the main body portion 411a facing away from the substrate 1 is less than or equal to 1000 angstroms, which can further improve the flatness of the internal film layer of the light-emitting device and reduce the risk of defects in the light-emitting effect of the light-emitting device.

[0123] By improving the preparation method, the step difference of the surface of the second conductive structure 413 facing away from the substrate 1 can be further reduced to less than 500 angstroms, and even the surface of the second conductive structure 413 facing away from the substrate 1 can be located in the same plane, thereby greatly improving the flatness of the internal film layer of the light-emitting device and reducing the risk of defects in the light-emitting device.

[0124] Reference Figure 8 In some optional embodiments, the surface of the filling portion 412 facing away from the substrate 1 is located in a first plane, and the first plane is perpendicular to the thickness direction.

[0125] In these embodiments, the surface of the filling portion 412 facing away from the substrate 1 has no step and is flat, which can improve the overall flatness of the first electrode 41. This is beneficial for further improving the flatness of the film layer inside the light-emitting device, further reducing the possibility of defects in the light-emitting effect of the light-emitting device, and improving the display effect.

[0126] Optionally, the surface of the side of the main body 411a facing away from the substrate 1 is located in the second plane, and the second plane is perpendicular to the thickness direction, which can improve the overall flatness of the first electrode 41, is conducive to further improving the flatness of the internal film layer of the light-emitting device, further reducing the possibility of defects in the light-emitting effect of the light-emitting device, and improving the display effect.

[0127] Optionally, the first plane coincides with the second plane, that is, the surface of the filling portion 412 facing away from the substrate 1 is flush with the surface of the main body portion 411a facing away from the substrate 1, further improving the flatness of the internal film layer of the light-emitting device and reducing the possibility of defects in the light-emitting effect of the light-emitting device.

[0128] Due to process errors, the surface of the filling portion 412 facing away from the substrate 1 may not be completely flat. Figure 6 and Figure 7 In some optional embodiments, along the thickness direction, the maximum distance between the surface of the filling portion 412 facing away from the substrate 1 and the substrate 1 is a first distance, the minimum distance is a second distance, and the difference between the first distance and the second distance is less than or equal to 4000 angstroms. In the embodiment of the present application, by improving the preparation method, the step difference of the surface of the filling portion 412 facing away from the substrate 1 can be reduced to less than 4000 angstroms. Compared with the related art, the problem of insufficient flatness of the first electrode 41 is improved, the risk of abnormal display and uneven light emission of the light-emitting device is reduced, and the flatness of the light-emitting layer 40 subsequently electrically connected to the first electrode 41 is improved, as well as the light-emitting effect of the display panel.

[0129] Optionally, the difference between the first distance and the second distance is less than or equal to 2000 angstroms, which improves the planarization of the film layer inside the light-emitting device and reduces the risk of defects in the light-emitting effect of the light-emitting device.

[0130] Optionally, the difference between the first distance and the second distance is less than or equal to 1000 angstroms, which further improves the planarization of the film layer inside the light-emitting device and reduces the risk of defects in the light-emitting effect of the light-emitting device.

[0131] Optionally, the difference between the first distance and the second distance is less than or equal to 500 angstroms. Optionally, the first distance is equal to the second distance, that is, the surface of the side of the filling portion 412 facing away from the substrate 1 is located in the same plane. In the embodiment of the present application, by improving the preparation method, the step difference of the surface of the side of the filling portion 412 facing away from the substrate 1 can be further reduced to less than 500 angstroms, and even the surface of the side of the filling portion 412 facing away from the substrate 1 is located in the same plane, which greatly improves the flatness of the internal film layer of the light-emitting device and reduces the risk of defects in the light-emitting effect of the light-emitting device.

[0132] Optionally, the distance between the surface of the main body portion 411a facing away from the substrate 1 and the substrate 1 is a fifth distance, and the first distance is greater than or equal to the fifth distance. Figure 6 As shown; or, the first distance is less than the fifth distance, as shown Figure 7 shown.

[0133] In these embodiments, when the first distance is greater than or equal to the fifth distance, the filling portion 412 is at least partially located outside the groove 411c or is flush with the opening of the groove 411c. By reducing the difference between the first distance and the fifth distance, the flatness of the first electrode 41 can be effectively improved, thereby improving the flatness of the film layer subsequently prepared on the first electrode 41 and improving the luminous effect of the light-emitting device.

[0134] Reference Figure 7 When the first distance is less than the fifth distance, the filling portion 412 can be located in the groove 411c and recessed downward relative to the opening of the groove 411c. By reducing the difference between the fifth distance and the first distance, the flatness of the first electrode 41 can be effectively improved, thereby improving the flatness of the film layer subsequently prepared on the first electrode 41 and improving the luminous effect of the light-emitting device.

[0135] Optionally, the second distance is less than or equal to the fifth distance. The second distance can be the same as the first distance, that is, the surface of the filling portion 412 facing away from the substrate 1 is located in the same plane. By reducing the difference between the fifth distance and the second distance, the flatness of the first electrode 41 can be effectively improved, thereby improving the flatness of the film layer subsequently prepared on the first electrode 41, and improving the luminous effect of the light-emitting device.

[0136] In addition, the second distance may also be different from the first distance, and the surface of the filling portion 412 facing away from the substrate 1 may be uneven. By reducing the difference between the fifth distance and the second distance, and the first distance and the fifth distance, the flatness of the first electrode 41 can be effectively improved, thereby improving the flatness of the film layer subsequently prepared on the first electrode 41 and improving the luminous effect of the light-emitting device.

[0137] In some optional embodiments, the orthographic projection of the filling portion 412 on the substrate 1 is located within the orthographic projection of the groove portion 411b on the substrate 1. Alternatively, the orthographic projection of the filling portion 412 on the substrate 1 is located within the orthographic projection of the groove 411c on the substrate 1.

[0138] In these embodiments, the filling material will not overflow the groove 411c and the groove portion 411b to both sides, and the filling material can be better accommodated in the groove 411c, which is beneficial to further reduce the impact of the depression of the first electrode 41 caused by the connecting hole 10 on the flatness of the film layer subsequently prepared thereon, so that the film layer structure subsequently prepared on the first conductive structure 411 can also have a good degree of flatness, reducing the risk of uneven luminescence caused by insufficient flattening of the first electrode 41, and improving the flatness and luminescence effect of the light-emitting layer 40 subsequently electrically connected to the first electrode 41, thereby improving the display effect and performance of the display panel.

[0139] Optionally, the orthographic projection of the main body 411a on the substrate 1 is outside the orthographic projection of the groove 411c on the substrate 1. The main body 411a is located on a relatively flat portion of the substrate 1, so the film layer prepared on the main body 411a can have a better flatness than the groove 411b.

[0140] Reference Figure 9 In some optional embodiments, the first electrode 41 further includes a second conductive structure 413 , the second conductive structure 413 is located on a side of the filling portion 412 facing away from the substrate 1 , and the second conductive structure 413 is connected to the main body portion 411 a .

[0141] The filling portion 412 may be made of an insulating material, and the second conductive structure 413 and the first conductive structure 411 are overlapped at a position not covered by the filling portion 412 to achieve electrical connection between the two.

[0142] The orthographic projection of the filling portion 412 on the substrate 1 is located within the orthographic projection of the first conductive structure 411 on the substrate 1. The orthographic projection area of ​​the first conductive structure 411 on the substrate 1 is larger than the orthographic projection area of ​​the filling portion 412 on the substrate 1. That is, the first conductive structure 411 has a portion not covered by the filling portion 412, and the second conductive structure 413 can overlap the portion of the first conductive structure 411 not covered by the filling portion 412 to achieve electrical connection between the two.

[0143] The first conductive structure 411 is recessed toward the substrate 1 to form a groove 411 c . The filling portion 412 is filled in the groove 411 c , so that the surface of the filling portion 412 facing away from the substrate 1 is relatively flat, which is beneficial to improving the flatness of the second conductive structure 413 .

[0144] Optionally, along the thickness direction of the display panel, the maximum distance between the surface of the second conductive structure 413 facing away from the substrate 1 and the substrate 1 is a third distance, the minimum distance is a fourth distance, and the difference between the third distance and the fourth distance is less than or equal to 4000 angstroms.

[0145] The second conductive structure 413 can directly cover the first conductive structure 411 and the filling portion 412, and has a similar morphology to the surface of the first conductive structure 411 and the filling portion 412 on the side facing away from the substrate 1, so that the difference between the third distance and the fourth distance is less than or equal to 4000 angstroms. That is, the surface of the second conductive structure 413 on the side facing away from the substrate 1 has good flatness, which is beneficial to the preparation of the light-emitting layer 40 thereon, and can improve the flatness and light uniformity of the light-emitting layer 40, thereby improving the display effect and performance of the display panel.

[0146] Optionally, the difference between the third distance and the fourth distance is less than or equal to 2000 angstroms, which improves the flatness of the film layer inside the light-emitting device, reduces the risk of light-emitting defects of the light-emitting device, and improves the light-emitting effect of the light-emitting device.

[0147] Optionally, the difference between the third distance and the fourth distance is less than or equal to 1000 angstroms, which further improves the flatness of the film layer inside the light-emitting device, reduces the risk of light-emitting defects of the light-emitting device, and improves the light-emitting effect of the light-emitting device.

[0148] Reference Figure 9 and Figure 10 Optionally, the difference between the third distance and the fourth distance is less than or equal to 500 angstroms. Optionally, the third distance is equal to the fourth distance, that is, the surface of the second conductive structure 413 facing away from the substrate 1 is located in the same plane, so that the flatness of the second conductive structure 413 can be improved. By improving the preparation method, the step difference of the surface of the second conductive structure 413 facing away from the substrate 1 can be further reduced to less than 500 angstroms, or even the surface of the second conductive structure 413 facing away from the substrate 1 is located in the same plane, which greatly improves the flatness of the film layer inside the light-emitting device, reduces the risk of light-emitting defects of the light-emitting device, and improves the light-emitting effect of the light-emitting device.

[0149] In some optional embodiments, the orthographic projection of the filling portion 412 on the substrate 1 is located within the orthographic projection of the second conductive structure 413 on the substrate 1. The orthographic projection area of ​​the second conductive structure 413 on the substrate 1 is larger than the orthographic projection area of ​​the filling portion 412 on the substrate 1, that is, the second conductive structure 413 has a portion that laterally extends beyond the filling portion 412, so that the second conductive structure 413 and the portion of the first conductive structure 411 not covered by the filling portion 412 can overlap to achieve electrical connection between the two and have good flatness.

[0150] In some optional embodiments, the orthographic projection of the second conductive structure 413 on the substrate 1 is located within the orthographic projection of the first conductive structure 411 on the substrate 1; for example, the orthographic projection area of ​​the second conductive structure 413 on the substrate 1 is smaller than the orthographic projection area of ​​the first conductive structure 411 on the substrate 1.

[0151] Alternatively, the orthographic projection of the first conductive structure 411 on the substrate 1 is located within the orthographic projection of the second conductive structure 413 on the substrate 1. The larger the contact area between the second conductive structure 413 and the first conductive structure 411, the more conducive it is to reducing the impedance of the first electrode 41 and improving the flatness of the first electrode 41.

[0152] In some optional embodiments, at least one of the first conductive structure 411 and the second conductive structure 413 includes a light-reflective conductive material.

[0153] Optionally, the first conductive structure 411 includes a reflective conductive material and can reflect light emitted by the light-emitting layer 40. The second conductive structure 413 includes a reflective conductive material and can reflect light emitted by the light-emitting layer 40, thereby increasing the reflective film layer and reflective area of ​​the first electrode 41, thereby expanding the scope of application. The reflective conductive material can include metal.

[0154] In some optional embodiments, the thickness of the second conductive structure 413 is greater than the thickness of the first conductive structure 411. Optionally, the second conductive structure 413 can be a single layer or a multilayer film. Optionally, the second conductive structure 413 includes a light-transmitting conductive material layer and a light-reflecting conductive material layer stacked along the thickness direction of the substrate 1.

[0155] Optionally, the second conductive structure 413 includes a silver layer (Ag) and an indium tin oxide (ITO) layer stacked in sequence in a direction away from the substrate 1. Indium tin oxide has excellent electrical conductivity and high optical transparency.

[0156] Optionally, the second conductive structure 413 includes an indium tin oxide layer, a silver layer, and an indium tin oxide layer stacked in sequence along the thickness direction of the substrate 1 .

[0157] Ag is a silvery-white metal with excellent electrical and thermal conductivity, along with softness and ductility. In the ITO / Ag / ITO three-layer structure, the Ag layer, acting as the middle layer, significantly improves the overall conductivity, enabling better current transmission in electronic devices.

[0158] Ag is easily oxidized and sulfided in air, resulting in performance degradation. In the ITO / Ag / ITO three-layer structure, the upper and lower ITO layers can serve as protective layers, effectively preventing the Ag layer from oxidation and sulfidation, thereby improving the stability and service life of the entire structure.

[0159] The ITO / Ag / ITO three-layer structure can effectively reduce the resistance of the entire structure, reducing the obstacles encountered by electrons during transmission, thereby improving the performance and efficiency of the device.

[0160] In some optional embodiments, the second conductive structure 413 includes a light-reflective conductive material, and the first conductive structure 411 is a light-transmitting conductive material. Optionally, the first conductive structure 411 is an indium tin oxide layer.

[0161] In some optional embodiments, the material of the filling portion 412 includes an organic material. Organic materials have good fluidity and leveling properties, making the surface of the filling portion 412 facing away from the substrate 1 relatively flat, facilitating the preparation of film layers thereon, such as the second conductive structure 413. For example, the organic material may include a positive organic resin, so that excess portions to be removed can be removed through exposure using a specific mask.

[0162] Reference Figure 2 In some optional embodiments, the substrate 1 includes a substrate 11, a driving device layer 12 and a first insulating layer 13; the driving device layer 12 is arranged on one side of the substrate 11, and the driving device layer 12 includes a plurality of pixel driving circuits 121; the first insulating layer 13 is arranged on the side of the driving device layer 12 away from the substrate 11, and the first insulating layer 13 is formed with a connecting hole 10, and the main body 411a is electrically connected to the corresponding pixel driving circuit 121 through the groove portion 411b.

[0163] Optionally, the pixel driving circuit 121 includes a transistor, which can be electrically connected to the first electrode 41. For example, the transistor can include a gate and a source and drain, one of which is connected to the first conductive structure 411, so that the transistor can provide current to the first electrode 41 through the first conductive structure 411 to drive the light-emitting layer 40 to emit light and display. Optionally, the pixel driving circuit 121 can also include a storage capacitor. Exemplarily, the storage capacitor can include a first plate and a second plate located on the side of the first plate facing away from the substrate 1. The first insulating layer 13 is used to separate the driver device layer 12 from the first electrode 41 to prevent a short circuit between the first electrode 41 and the driver device layer 12.

[0164] Optionally, the driving device layer 12 also includes a plurality of conductive connection parts 122, and the plurality of conductive connection parts 122 are arranged on the side of the plurality of pixel driving circuits 121 away from the substrate 1, and the conductive connection parts 122 are electrically connected to the corresponding pixel driving circuits 121; the first insulating layer 13 covers the plurality of conductive connection parts 122, and the first insulating layer 13 is provided with a plurality of connecting holes 10, and a partial structure of the first conductive structure 411 is electrically connected to the corresponding conductive connection parts 122 at the corresponding connecting holes 10.

[0165] In these embodiments, by adding a first conductive structure 411 to overlap the conductive connecting portion 122 and providing a filling portion 412 between the first conductive structure 411 and the second conductive structure 413, the filling portion 412 can improve the flatness of the second conductive structure 413 prepared on the side of the filling portion 412 facing away from the substrate 1, reduce the impact of the recessed structure of the connecting hole 10 on the flatness of the second conductive structure 413, improve the flatness and luminous effect of the light-emitting layer 40 subsequently electrically connected to the second conductive structure 413, and thereby improve the display effect and performance of the display panel.

[0166] Reference Figure 4 In some optional embodiments, the display panel further includes a pixel definition layer 2, which includes a pixel defining portion 21 disposed on a side of the first electrode 41 facing away from the substrate 1. The pixel defining portion 21 defines a pixel opening 20. The light-emitting layer 40 is at least partially located within the pixel opening 20. At least a portion of the surface of the first electrode 41 is exposed from the pixel opening 20 and connected to the light-emitting layer 40. The pixel definition layer 2 can be used to divide the display panel into sub-pixels. The first electrode 41 and the second electrode 42 can serve as pixel electrodes of the display panel.

[0167] Optionally, there may be a plurality of first electrodes 41 , and the pixel defining portion 21 may be located between adjacent first electrodes 41 to better cover and protect the sidewalls of each first electrode 41 .

[0168] Optionally, the pixel definition layer 2 may be in a mesh shape, and the hollow areas in the mesh-shaped pixel definition layer 2 may form pixel openings 20 , and the light-emitting layer 40 may be driven to emit light in the pixel openings 20 .

[0169] Optionally, the material of the pixel definition layer 2 includes an inorganic insulating material. Inorganic materials have good compactness and water vapor resistance, and can be prepared with a relatively thin thickness. Exemplarily, the material of the pixel definition layer 2 includes an oxygen-silicon compound and / or a nitrogen-silicon compound, such as silicon oxide, silicon nitride, etc.

[0170] In some optional embodiments, the orthographic projection of the communication hole 10 on the substrate 1 is located within the orthographic projection of the light emitting layer 40 on the substrate 1. Alternatively, the orthographic projection of the communication hole 10 on the substrate 1 is located within the orthographic projection of the pixel opening 20 on the substrate 1.

[0171] In these optional embodiments, by setting the orthographic projection of the connecting hole 10 on the substrate 1 to be within the orthographic projection of the light-emitting layer 40 on the substrate 1, some transistors in the pixel driving circuit 121 can be located below or relatively close to the pixel opening 20, which can facilitate the arrangement of the pixel driving circuit 121 in the substrate 1, so that the pixel driving circuit 121 in the substrate 1 can be arranged more densely, which is also beneficial to improving the pixel density (Pixels Per Inch, PPI) of the display panel.

[0172] In some optional embodiments, the display panel also includes an isolation structure 3 arranged on one side of the substrate 1, the isolation structure 3 has an isolation opening 30 connected to the pixel opening 20, and the orthographic projection of the connecting hole 10 on the substrate 1 at least partially overlaps with the orthographic projection of the isolation opening 30 on the substrate 1.

[0173] The isolation structure 3 can be used to divide the sub-pixels of the display panel. Optionally, the isolation structure 3 can also be in a mesh shape, and the hollow areas in the mesh-shaped isolation structure 3 can form isolation openings 30, and the light emitted by the light-emitting layer 40 can be transmitted outward through the isolation openings 30.

[0174] In these embodiments, the isolation structure 3 is arranged on the substrate 1 and encloses a plurality of isolation openings 30. The isolation openings 30 can separate the light-emitting material to form mutually disconnected light-emitting layers 40, thereby reducing the crosstalk of carriers in the light-emitting layer 40 and improving the display effect of the display panel. In addition, there is no need to use a precision mask plate to prepare the light-emitting layer 40, which can reduce the development and use of precision mask plates and reduce the preparation cost.

[0175] Optionally, the orthographic projection of the communication hole 10 on the substrate 1 is located within the orthographic projection of the isolation opening 30 on the substrate 1 .

[0176] By setting the orthographic projection of the connecting hole 10 on the substrate 1 to at least partially overlap with the orthographic projection of the isolation opening 30 on the substrate 1, or further making the orthographic projection of the connecting hole 10 on the substrate 1 located within the orthographic projection of the isolation opening 30 on the substrate 1, it is beneficial to reduce the space occupied by the connecting hole 10 in other areas in the light-emitting area, increase the light-emitting area of ​​the light-emitting device, increase the aperture ratio, and thus improve the display performance of the display panel.

[0177] In some optional embodiments, the orthographic projection of the first conductive structure 411 on the substrate 1 at least partially overlaps with the orthographic projection of the isolation structure 3 on the substrate 1. This allows the edge of the first conductive structure 411 to extend below the isolation structure 3, so that the step between the edge of the first conductive structure 411 and the substrate 1 is less likely to affect the continuity and thickness uniformity of the second electrode 42 above the pixel-defining portion 21, thereby ensuring better connection between the second electrode 42 and the isolation structure 3.

[0178] Optionally, the isolation structure 3 includes a first sublayer 31 and a second sublayer 32 located on a side of the first sublayer 31 facing away from the substrate 1 , and the second sublayer 32 is arranged to protrude from the first sublayer 31 toward the isolation opening 30 .

[0179] In these optional embodiments, the first sublayer 31 and the second sublayer 32 are stacked in sequence to form the isolation structure 3. The side of the first sublayer 31, which is positioned near the substrate 1 and is remote from the substrate 1, has its orthographic projection on the substrate 1 located within the orthographic projection of the second sublayer 32 on the substrate 1. The second sublayer 32 covers the surface of the first sublayer 31 remote from the substrate 1. In this case, the first sublayer 31 is recessed relative to the second sublayer 32 in a direction away from the isolation opening 30. When preparing the light-emitting layer 40, the light-emitting material has a large drop at the edge of the isolation opening 30, and the first sublayer 31 is recessed relative to the second sublayer 32. This makes it difficult for the light-emitting material to connect at the edge of the isolation opening 30, resulting in breakage. The breakage of the light-emitting material forms a disconnected light-emitting layer 40.

[0180] In some optional embodiments, the material of the isolation structure 3 includes a conductive material, and the display panel further includes a second electrode 42 disposed on a side of the light-emitting layer 40 facing away from the substrate 1 , and the second electrode 42 is electrically connected to the isolation structure 3 .

[0181] The isolation structure 3 separates the second electrode 42 layer to form mutually spaced second electrodes 42 . The mutually spaced second electrodes 42 are electrically connected through the isolation structure 3 to form a full-surface electrode, thereby ensuring normal light emission of the light-emitting layer 40 .

[0182] Optionally, the material of the first sublayer 31 may include a conductive material, and the second electrode 42 may be connected to the first sublayer 31 , so that the second electrodes 42 of adjacent sub-pixels can be electrically connected through the first sublayer 31 .

[0183] Optionally, when vapor-depositing the light-emitting layer 40 and the second electrode 42 of the display panel, the second sublayer 32 can block at least part of the material used to prepare the light-emitting layer 40 and the second electrode 42, so as to isolate the light-emitting material and the electrode material between adjacent sub-pixels, and facilitate the formation of multiple light-emitting layers 40 that are spaced apart and located within the isolation opening 30, and facilitate the formation of multiple second electrodes 42 that are spaced apart and located within the isolation opening 30, so that there is no need to set a mask with high precision when vapor-depositing the light-emitting layer 40 and the second electrode 42 of the display panel. For example, there is no need to set a high-precision metal mask (Fine Metal Mask, FMM) when vapor-depositing the light-emitting layer 40 and the second electrode 42, thereby effectively reducing the production and preparation cost of the display panel.

[0184] Reference Figure 11 In some optional embodiments, the isolation structure 3 further includes a third sublayer 33 located on the side of the first sublayer 31 facing the substrate 1. The third sublayer 33 is provided so as to protrude from the first sublayer 31 toward the plurality of isolation openings 30. Optionally, the material of the third sublayer 33 may include a conductive material, and the second electrode 42 may be connected to the third sublayer 33, so that the second electrodes 42 of adjacent sub-pixels can be electrically connected through the third sublayer 33. By providing the third sublayer 33 to protrude from the first sublayer 31 toward the isolation openings 30, the third sublayer 33 can have a larger size to facilitate connection with the second electrode 42. The thickness of the third sublayer 33 may be less than that of the first sublayer 31.

[0185] Optionally, the material of the first sublayer 31 includes a conductive material, and optionally, the material of the third sublayer 33 includes a conductive material. Optionally, the material of the second sublayer 32 is titanium (Ti) or molybdenum (Mo), the material of the first sublayer 31 is aluminum (Al), silver (Ag), or copper (Cu), and the material of the third sublayer 33 is titanium (Ti) or molybdenum (Mo). For example, the isolation structure 3 is a three-layer metal composite material of Ti / Al / Ti (titanium / aluminum / titanium) or Ti / Al / Mo (titanium / aluminum / molybdenum). For example, the cross-section of the isolation structure 3 perpendicular to the substrate 1 is I-shaped.

[0186] The conductive connection portion 122 in the driver device layer 12 connected to the first electrode 41 may include a titanium layer (Ti), an aluminum layer (Al), and a titanium layer (Ti) stacked along the thickness direction of the substrate 1. The multi-layer composite structure of the titanium layer, the aluminum layer, and the titanium layer can improve the self-protection capability of the conductive connection portion 122 and enhance its conductive effect.

[0187] Optionally, the relative positional relationship between the isolation structure 3 and the pixel definition layer 2 can be set in various ways. For example, the isolation structure 3 can be set on the side of the pixel definition layer 2 facing away from the substrate 1, or a clearance opening is provided in the pixel definition layer 2, and the isolation structure 3 can be located within the clearance opening. The present embodiment of the application uses the isolation structure 3 being located on the side of the pixel definition layer 2 facing away from the substrate 1 as an example.

[0188] Optionally, the display panel includes a plurality of light emitting devices with different luminous colors, and the plurality of light emitting devices with different luminous colors are located in different isolation openings 30. Exemplarily, the light emitting devices may have three colors, namely red, green and blue.

[0189] In some optional embodiments, the display panel further includes a first encapsulation layer 5, and the first encapsulation layer 5 includes an encapsulation portion 50 located on the side of the second electrode 42 away from the substrate 1. The multiple encapsulation portions 50 are arranged at intervals, and the number of the light-emitting layers 40 is multiple. The multiple encapsulation portions 50 can be arranged in a one-to-one correspondence with the multiple light-emitting layers 40, and the encapsulation portions 50 corresponding to the light-emitting devices of different light-emitting colors are different. Optionally, the encapsulation portion 50 is located on the side of the second electrode 42 away from the substrate 1. Optionally, the material of the first encapsulation layer 5 may include an inorganic material, which has good density and water vapor resistance, a thin thickness, and also has a good encapsulation effect. The first encapsulation layer 5 can be prepared by a chemical vapor deposition process (CVD). For example, the encapsulation portion 50 extends through the isolation structure 3 toward the side wall of the isolation opening 30 to the side of the isolation structure 3 away from the substrate 1.

[0190] Optionally, the display panel further includes a second encapsulation layer disposed on the side of the first encapsulation layer 5 facing away from the substrate 1. Optionally, the display panel further includes a third encapsulation layer disposed on the side of the second encapsulation layer facing away from the substrate 1. The material of the second encapsulation layer may include an organic material to provide the second encapsulation layer with good fluidity and a relatively flat surface on the side of the second encapsulation layer facing away from the substrate 1. The material of the third encapsulation layer may include an inorganic material to further enhance the encapsulation effect of the display panel. Optionally, the second encapsulation layer may be prepared using inkjet printing (IJP) technology; the third encapsulation layer may be prepared using a chemical vapor deposition process.

[0191] Optionally, the display panel further includes a touch layer, a filter layer, and a cover plate disposed on the third encapsulation layer. The touch layer can be used to implement touch control of the display panel, the filter layer can be used to filter light to enhance the display quality of the display panel, and the cover plate can be used to protect the underlying film layer to enhance the strength of the display panel.

[0192] Please also refer to Figures 1 to 11, the first aspect embodiment of the present application also provides a display panel, including a substrate 1 and a first electrode 41, a connecting hole 10 is opened on one side of the substrate 1; the first electrode 41 is arranged on one side of the substrate 1, the first electrode 41 includes a first conductive structure 411, a filling portion 412 and a second conductive structure 413, the first conductive structure 411 includes an electrically connected main body portion 411a and a groove portion 411b, the groove portion 411b is recessed toward the substrate 1 at the connecting hole 10 to form a groove 411c, the filling portion 412 is at least partially located in the groove 411c, the second conductive structure 413 is located on the side of the filling portion 412 away from the substrate 1, and the second conductive structure 413 is connected to the main body portion 411a; wherein, along the thickness direction of the display panel, the maximum distance between the surface of the side of the second conductive structure 413 away from the substrate 1 and the substrate 1 is the third distance, the minimum distance is the fourth distance, and the difference between the third distance and the fourth distance is less than or equal to 4000 angstroms.

[0193] In a display panel also provided in an embodiment of the present application, the display panel includes a substrate 1 and a first electrode 41. By improving the preparation method, the step difference of the surface of the filling portion 412 itself facing away from the substrate 1 can be reduced to less than 4000 angstroms. Compared with the related art, the problem of insufficient flatness of the first electrode 41 is improved, and the risks of abnormal display and uneven light emission of the light-emitting device are reduced. The flatness of the light-emitting layer 40 subsequently electrically connected to the first electrode 41 and the light-emitting effect of the display panel are improved, so that the film layer structure subsequently prepared on the first conductive structure 411 can also have a good degree of flatness, which can better improve the structural stability of the display panel, reduce the risks of abnormal display and uneven light emission of the OLED device due to insufficient flatness of the first electrode 41, improve the flatness and light-emitting effect of the light-emitting layer 40 subsequently electrically connected to the first electrode 41, and thus improve the display effect and performance of the display panel.

[0194] Exemplarily, the difference between the third distance and the fourth distance is less than or equal to 2000 angstroms, 1000 angstroms, 500 angstroms, or even equal to each other.

[0195] Optionally, the third distance is equal to the fourth distance, that is, the surface of the second conductive structure 413 facing away from the substrate 1 is located in the same plane.

[0196] In these embodiments, the flatness of the second conductive structure 413 can be better. By improving the preparation method, the step difference of the surface of the second conductive structure 413 facing away from the substrate 1 can be further reduced, for example, to below 2000 angstroms, 1000 angstroms, or 500 angstroms, or even the surface of the second conductive structure 413 facing away from the substrate 1 can be located in the same plane, thereby greatly improving the flatness of the internal film layer of the light-emitting device and reducing the risk of defects in the light-emitting device.

[0197] The display panel provided in this embodiment and the display panel in any of the above embodiments can be cross-referenced with each other. For example, the arrangement of structures such as the isolation structure 3, the light-emitting layer 40, the isolation opening 30, the pixel definition layer 2, the first conductive structure 411 and the filling portion 412 can refer to the above. This embodiment can also be combined with some or all of the features in the above embodiments. Therefore, the embodiment of the present application also provides a display panel that can have the beneficial effects of the display panel in any of the above embodiments, and this application will not go into too much detail about it.

[0198] Reference Figures 12 to 17 , and combined with reference Figures 1 to 11 The embodiment of the second aspect of the present application provides a method for preparing a display panel, which is used to prepare the display panel provided by any embodiment of the first aspect. Figure 12 As shown, the preparation method includes:

[0199] S10 , opening a communication hole 10 on the substrate 1 .

[0200] A connecting hole 10 is provided on one side of the substrate 1 , and the first electrode 41 can be electrically connected to the driving circuit in the substrate 1 through the connecting hole 10 , so that the first electrode 41 can serve as a pixel electrode of the display panel to participate in driving the luminous display of the display panel.

[0201] S20 , preparing a first conductive structure 411 on the substrate 1 , the first conductive structure 411 including an electrically connected body portion 411 a and a groove portion 411 b , the groove portion 411 b being recessed toward the substrate 1 at the communicating hole 10 to form a groove 411 c .

[0202] Due to the existence of the connecting hole 10 and the thin thickness of the electrode material, the groove portion 411b of the first conductive structure 411 is recessed toward the substrate 1 at the connecting hole 10 to form a groove 411c, and the main body portion 411a can be located outside the connecting hole 10.

[0203] S30 , preparing a filling material layer 400 on the substrate 1 , wherein the filling material layer 400 covers the first conductive structure 411 , and the filling material layer 400 fills the groove 411 c and extends beyond the notch of the groove 411 c .

[0204] To effectively fill the groove 411c, the thickness of the filling material layer 400 at the groove 411c is greater than the depth of the groove 411c. The filling material comprises an organic material. Organic materials have good fluidity and leveling properties, making the surface of the filling material layer 400 facing away from the substrate 1 relatively flat.

[0205] S40 , patterning the filling material layer 400 using a mask to form a filling portion 412 in the filling material layer 400 , wherein the patterning of the filling material layer 400 includes half-exposing the filling material located on a side of the filling portion 412 facing away from the substrate 1 .

[0206] The filling portion 412 filling the groove 411 c can improve the flatness of the film layer formed on the first conductive structure 411 .

[0207] Among them, the patterning process of the filling material layer 400 includes half-exposure of the filling material located on the side of the multiple filling parts 412 facing away from the substrate 1. The orthographic projection of the half-exposed filling material on the substrate 1 can cover the orthographic projection of the multiple connecting holes 10 on the substrate 1, and can exceed part of it. For example, the orthographic projection area of ​​the half-exposed filling material on the substrate 1 is between 1 and 1.5 times the orthographic projection area of ​​the connecting hole 10 on the substrate 1 and includes the end point value. Optionally, the patterning process of the filling material layer 400 also includes full exposure of the filling material located outside the side of the multiple filling parts 412 facing away from the substrate 1. Exposing the filling material can cause it to undergo a photochemical reaction, and this part of the filling material can be removed by a developer later.

[0208] For example, the present application uses a positive photoresist as the filler material. When exposed to ultraviolet light (or other radiation), the positive photoresist undergoes a photochemical reaction, becoming soluble in a developer. Unexposed areas remain insoluble. Development results in the exposed areas being dissolved and removed, leaving the pattern identical to that of the mask, allowing for the removal of excess areas required by the specific mask exposure.

[0209] In other examples, the filling material may also be other organic materials, such as optical glue, organic glue, etc., and a photoresist is additionally provided on the filling material layer 400 for protection. Through the preparation method of the present application, the structure required for the filling part 412 in the present application can also be achieved during the patterning process.

[0210] In related technologies, such as Figure 5 As shown in the figure, the anode is flattened by filling the groove with an organic film to improve the uniformity of the OLED device's light emission. However, during the exposure process of the organic film hole filling, the light intensity distribution in the actual exposure area changes in a gradient (not a step change) due to the light diffraction effect at the edge of the mask pattern, resulting in a gradual change in the photochemical reaction intensity at the junction of the exposed area and the non-exposed area in the photoresist, forming a photoresist slope angle; the conventional single exposure and development application in the anode flattening hole filling process will cause the surface of the anode Anode to have a gradient greater than Insufficient anode flatness can cause differences in hole injection efficiency, leading to uneven light emission and brightness differences in OLED devices.

[0211] Compared with the conventional single exposure and development process, in the preparation method of the present application, by half-exposing the filling material located on the side of the filling portion 412 away from the substrate 1, the thickness and step difference of the filling material located on the side of the groove 411c away from the substrate 1 can be effectively reduced, thereby further increasing the flatness of the first electrode 41, reducing the risk of abnormal display and uneven light emission of the OLED device due to insufficient flatness of the first electrode 41, and improving the flatness and light-emitting effect of the light-emitting layer 40 subsequently electrically connected to the first electrode 41.

[0212] Reference Figure 13 and Figure 14 In some embodiments, the filling material located on the side of the plurality of filling portions 412 facing away from the substrate 1 may be partially exposed first to cause a photochemical reaction in the portion of the filling material. The filling material located outside the side of the plurality of filling portions 412 facing away from the substrate 1 may then be fully exposed. The exposed filling material is then removed using a developer.

[0213] Step S40 includes:

[0214] S401 , the light-transmitting area of ​​the second mask 200 is positioned opposite to the groove 411 c , and the filling material layer 400 is half-exposed through the second mask 200 .

[0215] The exposure dose in step S401 can be calculated based on the step difference of the residual film of the filling material layer 400 after a single exposure. A low-exposure half-exposure can be performed using the same mask used to open the connecting hole 10 in the substrate 1, so that the portion of the filling material located above the connecting hole 10 undergoes a photochemical reaction. The second mask 200 can be opaque except for the light-transmitting area.

[0216] S402 , the light-transmitting area of ​​the third mask 300 is arranged to avoid the groove 411 c , and the filling material layer 400 is exposed through the third mask 300 .

[0217] The third mask 300 is opaque except for the translucent areas. The translucent areas of the second mask 200 complement the opaque areas of the third mask 300. In step S402, the portion of the filler material layer 400 that underwent a photochemical reaction in step S401 is further exposed, causing the filler material other than the filler material above the groove 411c to undergo a photochemical reaction. The diffraction effect of the two exposures is superimposed. The order of S401 and S402 can be reversed. In this embodiment, S402 is performed after S401.

[0218] S403 , developing and removing the filling material layer 400 that has undergone photochemical reaction.

[0219] The filling material other than the filling material located above the groove 411 c is fully exposed and can be completely developed and removed, while the half-exposed filling material located on the communicating hole 10 is partially developed and removed.

[0220] S404 , baking the remaining filling material layer 400 to make it level and form a filling portion 412 .

[0221] The step S404 further increases the flatness of the remaining filling material after development, thereby forming the desired filling portion 412. Optionally, the baking process may be IUV (Inhibitor UV Bake).

[0222] In these embodiments, by exposing the material forming the filling portion 412 twice in different regions and superimposing the diffraction of the two exposures, the thickness and step difference of the filling material can be effectively reduced, the filling portion 412 of the desired morphology can be obtained, the flatness of the first electrode 41 is increased, and the risks of abnormal display and uneven light emission of the OLED device due to insufficient flatness of the first electrode 41 are reduced, thereby improving the flatness and light-emitting effect of the light-emitting layer 40 that is subsequently electrically connected to the first electrode 41.

[0223] Reference Figures 15 to 17 In some embodiments, only one exposure process may be performed, and one exposure process can achieve the effect of two exposures, while reducing the increase in the step difference of the residual film of the filling material caused by the CD error (Critical Dimension) and Overlay error between the two exposure processes, thereby further improving the flatness of the first electrode 41.

[0224] The single exposure process uses a first mask 100, which includes a first region 101 and a second region 102 connected to each other. The first region 101 is positioned opposite the communication hole 10, and the transmittance of the first region 101 is lower than that of the second region 102. In other words, the filling material layer 400 is partially exposed through the first region 101, while the corresponding filling material is fully exposed through the second region 102.

[0225] Reference Figure 15 Optionally, step S40 includes:

[0226] S41 , exposing the filling material layer 400 through the first mask 100 .

[0227] The diffraction of the full exposure area and the half exposure area of ​​a single exposure is superimposed.

[0228] S42 , developing and removing the filling material layer 400 that has undergone photochemical reaction.

[0229] The filling material that has undergone photochemical reaction is developed away, and the filling material other than the filling material located above the groove 411 c is fully exposed and developed away, while the half-exposed filling material located on the communicating hole 10 is partially developed away.

[0230] S43 , baking the remaining filling material layer 400 to make it level and form a filling portion 412 .

[0231] The planarity of the remaining filling material after development is further increased by step S43, thereby forming the desired filling portion 412. Optionally, the baking process may be IUV.

[0232] In these embodiments, a single exposure process can achieve the effect of double exposures, and can also reduce the risk of increased step difference of the residual film of the filling material caused by the CD error and Overlay error between the two exposure processes, thereby reducing one yellow light process, improving production efficiency, reducing costs, shortening cycles, and reducing step differences while improving process stability, and can further increase the flatness of the first electrode 41.

[0233] The first mask 100 may be a half-tone mask or a gray-tone mask.

[0234] Optional, see Figure 16 , the first mask 100 is a half-tone mask; after the step of developing and removing the filling material layer 400 that undergoes a photochemical reaction, the filling material layer 400 forms a first pre-filled portion 401, and the first pre-filled portion 401 is partially protruded on the surface of the side facing away from the substrate 1. The half-tone mask can deposit a semi-transparent film (such as MoSi or SiN material) on the surface of the mask to achieve light intensity attenuation in a local area. Its transmittance can be 10%-50%. The mask manufacturing process of the half-tone mask is relatively simple, suitable for large-area patterning, and suitable for the preparation of planar microstructures. After patterning with the half-tone mask, the remaining filling material may still have local unevenness, such as protruding or concave settings in some areas. The first pre-filled portion 401 can be further leveled through a baking process to form a filling portion 412 with the desired morphology.

[0235] Optional, see Figure 17 The first mask 100 is a grayscale mask. After developing and removing the photochemically reacted filler material layer 400, the filler material layer 400 forms a second pre-filled portion 402. The surface of the second pre-filled portion 402 facing away from the substrate 1 has a jagged shape. Grayscale masks can directly control light transmittance. By varying the thickness of the mask material (such as a gradient-etched chromium layer) or the refractive index (such as a phase-shifting material), continuous light transmittance variations (e.g., 10%, 50%, 90%) can be achieved.

[0236] Optionally, a slit pattern (Slit) can be set in the area of ​​the grayscale mask opposite the groove 411c. The Slit pattern consists of periodically arranged narrow and long openings (light-transmitting areas) to control the light intensity distribution and diffraction effect during exposure, thereby forming a second pre-filled portion 402 with a serrated morphology. After that, these serrated protrusions can be made to fill the depressions on the surrounding sides through a baking process to form a filling portion 412 with the desired morphology.

[0237] Optionally, after forming the filling portion 412, the preparation method further includes:

[0238] A second conductive structure 413 is formed on the substrate 1 , and the second conductive structure 413 is connected to the main body 411 a .

[0239] In these embodiments, the filling portion 412 is prepared and filled in the groove 411c, so that the surface of the filling portion 412 facing away from the substrate 1 can be relatively flat. The second conductive structure 413 has good flatness after preparation, which is beneficial to the preparation of the light-emitting layer 40 above it, and can improve the flatness and light uniformity of the light-emitting layer 40, thereby improving the display effect and performance of the display panel.

[0240] The third aspect of the present application provides a display device, comprising the display panel provided by any embodiment of the first aspect, or comprising the display panel prepared by any embodiment of the second aspect. Therefore, the display device provided by the third aspect of the present application has the beneficial effects of the display panel provided by any embodiment of the first aspect, or the display panel prepared by any embodiment of the second aspect, and will not be further elaborated here.

[0241] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0242] While the embodiments described above are not exhaustive, they do not limit the invention to the specific embodiments described. Clearly, numerous modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: include: A substrate, wherein a communication hole is formed on one side of the substrate; a first electrode disposed on one side of the substrate, the first electrode comprising a first conductive structure and a filling portion, the first conductive structure comprising an electrically connected body portion and a groove portion, the groove portion being recessed toward the substrate at the communicating hole to form a groove, the filling portion being at least partially located within the groove; Wherein, along the thickness direction of the display panel, a distance between a surface of the filling portion facing away from the substrate and a surface of the main body portion facing away from the substrate is less than or equal to 4000 angstroms.

2. The display panel according to claim 1, wherein: A distance between a surface of the filling portion facing away from the substrate and a surface of the main body portion facing away from the substrate is less than or equal to 2000 angstroms; Preferably, a distance between a surface of the filling portion facing away from the substrate and a surface of the main body portion facing away from the substrate is less than or equal to 1000 angstroms; Preferably, a distance between a surface of the filling portion facing away from the substrate and a surface of the main body portion facing away from the substrate is less than or equal to 500 angstroms; Preferably, a surface of the filling portion facing away from the substrate is located in a first plane, and the first plane is perpendicular to the thickness direction; Preferably, a surface of the main body portion facing away from the substrate is located in a second plane, and the second plane is perpendicular to the thickness direction; Preferably, the first plane coincides with the second plane.

3. The display panel according to claim 1, wherein: Along the thickness direction, a maximum distance between a surface of the filling portion facing away from the substrate and the substrate is a first distance, a minimum distance is a second distance, and a difference between the first distance and the second distance is less than or equal to 4000 angstroms; Preferably, the difference between the first distance and the second distance is less than or equal to 2000 angstroms; Preferably, the difference between the first distance and the second distance is less than or equal to 1000 angstroms; Preferably, the difference between the first distance and the second distance is less than or equal to 500 angstroms; Preferably, the first distance is equal to the second distance.

4. The display panel according to claim 3, wherein: A distance between a surface of the main body facing away from the substrate and the substrate is a fifth distance, and the first distance is greater than or equal to the fifth distance; or The first distance is smaller than the fifth distance; Preferably, the second distance is less than or equal to the fifth distance.

5. The display panel according to claim 1, wherein: The orthographic projection of the filling portion on the substrate is located within the orthographic projection of the groove portion on the substrate; Preferably, the orthographic projection of the filling portion on the substrate is located within the orthographic projection of the groove on the substrate; Preferably, the orthographic projection of the main body on the substrate is outside the orthographic projection of the groove on the substrate.

6. The display panel according to claim 1, wherein: The first electrode further includes a second conductive structure, the second conductive structure is located on a side of the filling portion away from the substrate, and the second conductive structure is connected to the main body portion; Preferably, along the thickness direction of the display panel, a maximum distance between a surface of the second conductive structure facing away from the substrate and the substrate is a third distance, and a minimum distance is a fourth distance, and a difference between the third distance and the fourth distance is less than or equal to 4000 angstroms; Preferably, the difference between the third distance and the fourth distance is less than or equal to 2000 angstroms; Preferably, the difference between the third distance and the fourth distance is less than or equal to 1000 angstroms; Preferably, the difference between the third distance and the fourth distance is less than or equal to 500 angstroms; Preferably, the third distance is equal to the fourth distance; Preferably, the orthographic projection of the filling portion on the substrate is located within the orthographic projection of the second conductive structure on the substrate; Preferably, the orthographic projection of the second conductive structure on the substrate is located within the orthographic projection of the first conductive structure on the substrate; Alternatively, the orthographic projection of the first conductive structure on the substrate is located within the orthographic projection of the second conductive structure on the substrate; Preferably, at least one of the first conductive structure and the second conductive structure comprises a light-reflective conductive material; Preferably, the thickness of the second conductive structure is greater than the thickness of the first conductive structure; Preferably, the second conductive structure comprises a silver layer and an indium tin oxide layer stacked in sequence in a direction away from the substrate; Preferably, the second conductive structure comprises an indium tin oxide layer, a silver layer and an indium tin oxide layer stacked in sequence in a direction away from the substrate; Preferably, the second conductive structure comprises a light-reflective conductive material, and the first conductive structure comprises a light-transmitting conductive material; Preferably, the first conductive structure comprises an indium tin oxide layer; Preferably, the material of the filling part includes organic material.

7. The display panel according to claim 1, wherein: The substrate comprises: substrate; A driving device layer is provided on one side of the substrate, and the driving device layer includes a plurality of pixel driving circuits; The first insulating layer is provided on a side of the driving device layer away from the substrate. The first insulating layer is formed with the connecting hole. The main body is electrically connected to the corresponding pixel driving circuit through the groove.

8. The display panel according to any one of claims 1 to 7, characterized in that: The display panel further includes a pixel definition layer and a light-emitting layer, wherein the pixel definition layer includes a pixel defining portion provided on a side of the first electrode facing away from the substrate, the pixel defining portion having a pixel opening formed therein, the light-emitting layer being at least partially located within the pixel opening, and at least a portion of a surface of the first electrode being exposed from the pixel opening and connected to the light-emitting layer; Preferably, the orthographic projection of the connecting hole on the substrate is located within the orthographic projection of the light-emitting layer on the substrate; Preferably, the orthographic projection of the connecting hole on the substrate is located within the orthographic projection of the pixel opening on the substrate.

9. The display panel according to claim 8, wherein: The display panel further includes an isolation structure disposed on one side of the substrate, the isolation structure having an isolation opening communicating with the pixel opening, wherein an orthographic projection of the communication hole on the substrate at least partially overlaps with an orthographic projection of the isolation opening on the substrate; Preferably, the orthographic projection of the communication hole on the substrate is located within the orthographic projection of the isolation opening on the substrate; Preferably, an orthographic projection of the first conductive structure on the substrate at least partially overlaps with an orthographic projection of the isolation structure on the substrate.

10. The display panel according to claim 9, wherein: The isolation structure includes a first sublayer and a second sublayer located on a side of the first sublayer facing away from the substrate, wherein the second sublayer is arranged to protrude from the first sublayer toward the isolation opening; Preferably, the material of the isolation structure includes a conductive material, and the display panel further includes a second electrode provided on a side of the light-emitting layer away from the substrate, and the second electrode is electrically connected to the isolation structure; Preferably, the isolation structure further comprises a third sublayer located on a side of the first sublayer facing the substrate, and the third sublayer is arranged to protrude from the first sublayer toward the isolation opening; Preferably, the material of the first sub-layer includes a conductive material, and / or the material of the third sub-layer includes a conductive material.

11. A display panel, characterized in that: include: A substrate, wherein a communication hole is formed on one side of the substrate; a first electrode disposed on one side of the substrate, the first electrode comprising a first conductive structure, a filling portion, and a second conductive structure, the first conductive structure comprising a main body portion and a groove portion that are electrically connected, the groove portion being recessed toward the substrate at the communicating hole to form a groove, the filling portion being at least partially located within the groove, the second conductive structure being located on a side of the filling portion facing away from the substrate, and the second conductive structure being connected to the main body portion; Among them, along the thickness direction of the display panel, the maximum distance between the side surface of the second conductive structure facing away from the substrate and the substrate is a third distance, and the minimum distance is a fourth distance. The difference between the third distance and the fourth distance is less than or equal to 4000 angstroms.

12. The display panel according to claim 11, wherein: A difference between the third distance and the fourth distance is less than or equal to 2000 angstroms; Preferably, the difference between the third distance and the fourth distance is less than or equal to 1000 angstroms; Preferably, the difference between the third distance and the fourth distance is less than or equal to 500 angstroms; Preferably, the third distance is equal to the fourth distance.

13. A method for preparing a display panel, characterized in that: The preparation method comprises: opening a communication hole on the substrate; Preparing a first conductive structure on the substrate, the first conductive structure comprising an electrically connected body portion and a groove portion, the groove portion being recessed toward the substrate at the communicating hole to form a groove; preparing a filling material layer on the substrate, wherein the filling material layer covers the first conductive structure and fills the groove and extends beyond the notch of the groove; The filling material layer is patterned using a mask to form a filling portion in the filling material layer, wherein the patterning process for the filling material layer includes half-exposing the filling material located on a side of the filling portion away from the substrate.

14. The preparation method according to claim 13, characterized in that The mask includes a first mask, and the first mask includes a first area and a second area connected to each other. The first area is arranged opposite to the connecting hole, and the transmittance of the first area is lower than the transmittance of the second area.

15. The preparation method according to claim 14, characterized in that The step of patterning the filling material layer using a mask comprises: exposing the filling material layer through a first mask; Developing to remove the filling material layer that has undergone photochemical reaction; The remaining filling material layer is baked to make it level and form a filling portion.

16. The preparation method according to claim 15, characterized in that The first mask is a halftone mask; after the step of developing and removing the filling material layer that undergoes a photochemical reaction, the filling material layer forms a first pre-filling portion, which is protruding from a surface portion on one side of the substrate away from the substrate.

17. The preparation method according to claim 15, characterized in that The first mask is a grayscale mask; after the step of developing and removing the filling material layer that undergoes a photochemical reaction, the filling material layer forms a second pre-filled portion, and a surface of the second pre-filled portion on a side facing away from the substrate is serrated.

18. The preparation method according to claim 13, characterized in that The step of patterning the filling material layer using a mask to form a filling portion on the filling material layer includes: The light-transmitting area of ​​the second mask is arranged opposite to the groove, and the filling material layer is half-exposed through the second mask; The light-transmitting area of ​​the third mask is arranged to avoid the groove, and the filling material layer is exposed through the third mask; Developing to remove the filling material layer that has undergone photochemical reaction; The remaining filling material layer is baked to make it level and form a filling portion.

19. The preparation method according to any one of claims 13 to 18, characterized in that The material of the filling material layer is positive photoresist.

20. The preparation method according to any one of claims 13 to 18, characterized in that After forming the filling portion, the preparation method further includes: A second conductive structure is prepared on the substrate, and the second conductive structure is connected to the main body.

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